Method for applying conductive adhesive

By applying conductive adhesive only to contact areas using a quartz plate or magnetic array, the method addresses waste and cost issues in joining non-flat objects, achieving efficient conductivity at reduced expense.

JP2025128498APending Publication Date: 2025-09-03TOYOTA JIDOSHA KK
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Patent Information

Application Number
JP2024025187
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-02-22
Publication Date
2025-09-03

AI Technical Summary

Technical Problem

Conductive adhesives are costly due to expensive materials like nickel, and applying them to non-conductive areas leads to waste when joining non-flat objects.

Method used

Applying conductive adhesive by pressing a quartz plate against the battery module under load, ensuring application only to contact areas during assembly, or using a magnetic array to guide conductive filler to these areas.

Benefits of technology

Reduces adhesive usage to conductive areas only, achieving equivalent conductivity at lower cost.

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Abstract

To provide a method for applying a conductive adhesive capable of applying a conductive adhesive only to portions contributing to electrical conduction.SOLUTION: The method for applying a conductive adhesive includes the steps of: pressing a quartz flat plate 12 against a battery module 11, by a load used to press the battery module 11 against a cooler when the battery module 11 is used; determining a contact region that comes into contact when the battery module 11 is pressed against the flat plate 12, while pressing the flat plate 12 against the battery module 11; applying a conductive adhesive to at least one of the regions of the battery module 11 and the cooler; and joining the battery module 11 and the cooler together after the application.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] The present invention relates to a method for applying a conductive adhesive. [Background technology]

[0002] Patent Document 1 describes a configuration in which a conductive adhesive is applied to the entire surfaces to be joined. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-65366 Summary of the Invention [Problem to be solved by the invention]

[0004] Conductive adhesives are expensive because they contain expensive materials such as nickel, so it is desirable to apply them efficiently. However, if the objects to be joined are not flat, there is a problem in that the conductive adhesive is applied to areas that do not contribute to electrical conduction, resulting in waste. [Means for solving the problem]

[0005] In one embodiment, the conductive adhesive is applied by pressing a quartz plate against the battery module with the load that presses the battery module against the cooler when the battery module is in use, and applying the conductive adhesive to the area that comes into contact when the battery module is pressed against the plate. [Effects of the Invention]

[0006] According to the method for applying a conductive adhesive of the present disclosure, the conductive adhesive can be applied only to areas that contribute to electrical conduction. [Brief explanation of the drawings]

[0007] [Figure 1]1A and 1B are cross-sectional and perspective views for explaining a method for applying a conductive adhesive according to an embodiment of the present invention; [Figure 2] 1A and 1B are cross-sectional and perspective views for explaining a method for applying a conductive adhesive according to an embodiment of the present invention; [Figure 3] 10A and 10B are cross-sectional views for explaining a method for applying a conductive adhesive according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] This embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Figures 1 and 2 are a cross-sectional view and a perspective view for explaining a method for applying a conductive adhesive according to this embodiment. Measurement of an area to which the conductive adhesive is applied will be described using Figure 1.

[0009] First, as shown in Fig. 1(a), a battery module 11 is prepared. The surface of the battery module 11 has projections and recesses.

[0010] Next, as shown in FIG. 1(b), a quartz plate 12 is placed on the battery module 11.

[0011] 1(c), the quartz plate 12 is pressed against the battery module 11 with the same load that presses the battery module and the cooler when the battery module is in use. Then, in this pressed state, the area 13 where the battery module 11 and the quartz plate 12 are in contact is measured.

[0012] Then, a conductive adhesive 21 is applied to the region 13 of the battery module 11 as shown in FIGS. 2(a) and 2(b).

[0013] Then, the cooler 22 is pressed against the surface of the battery module 11 on which the conductive adhesive 21 has been applied. In this way, the battery module 11 and the cooler 22 are joined together.

[0014] According to the conductive adhesive application method of this embodiment, the conductive adhesive can be applied only to the areas between the battery module and the cooler that contribute to electrical conduction, which means that the same level of conductivity can be achieved at a lower cost than when the conductive adhesive is applied to the entire surface of the battery module.

[0015] The present invention is not limited to the above-described embodiment, and modifications can be made as appropriate without departing from the spirit of the present invention. For example, a conductive filler made of a magnetic material may be guided to the contact area using magnetic force. Figure 3 is a cross-sectional view for explaining a method for applying a conductive adhesive according to another embodiment. In Figure 3, the same components as those in Figure 1 are assigned the same numbers, and their explanations will be omitted.

[0016] As shown in FIG. 3(a), a battery module 11 coated with a conductive adhesive 21 is prepared. Next, as shown in FIG. 3(b), an electromagnet array 31 is placed above the battery module 11. In the electromagnet array 31, an electromagnet at a position corresponding to the region 13 measured in FIG. 1(c) is energized. As a result, the conductive filler 32 in the conductive adhesive 21 is condensed in the region 13. Then, as shown in FIG. 3(c), a cooler 22 is pressed against the battery module 11. [Explanation of symbols]

[0017] 11 Battery module 12 flat plate 21 Conductive adhesive 22 Cooler 31 Electromagnet Array 32 Conductive filler

Claims

[Claim 1] When the battery module is in use, the load that presses the battery module and cooler presses a quartz plate against the battery module, In the pressed state, a contact area is determined when the battery module is pressed against the flat plate; applying an electrically conductive adhesive to the area of ​​at least one of the battery module and the cooler; The conductive adhesive application method further comprises joining the battery module and the cooler after application of the conductive adhesive.

Citation Information

Patent Citations

  • Conducting adhesive, solar battery module, and method for manufacturing the same

    JP2015065366A