Electric power conversion equipment

Abstract

To provide electric power conversion equipment that enables miniaturization while accommodating a plurality of electronic components of varying heights on a cooling plate.SOLUTION: Electric power conversion equipment B comprises a substrate 14 on which a plurality of electronic components 41, 42 of varying heights are mounted, and a cooling plate 12 through which a cooling fluid circulates internally to cool the plurality of electronic components 41, 42, the plurality of electronic components 41, 42 include a first electronic component 41 and a second electronic component 42, which is lower in height than the first electronic component 41, and the cooling plate 12 has a through portion 51 with an inner diameter larger than the outer diameter of the first electronic component 41, and the first electronic component 41 is positioned in a state where it is inserted into the through portion 51.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a power conversion device. [Background technology]

[0002] In recent years, automobiles equipped with motors as a driving source (such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs)) have become widespread. These electric vehicles are equipped with a vehicle drive unit that drives the motor and other components, and this vehicle drive unit is equipped with a power conversion device having a plurality of electronic components.

[0003] Patent Document 1, the source of which is shown below, describes a switching power supply that can be used in such a power conversion device. This switching power supply includes a substrate (electronic circuit board) on which multiple electronic components are mounted, a base plate, and a cooling plate (cooler). The electronic components include low-profile components and high-profile components. In this switching power supply, the low-profile components are disposed between the cooling plate and the substrate, and the high-profile components are disposed between the base plate and the substrate, thereby achieving a reduction in the size of the switching power supply. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-210002 Summary of the Invention [Problem to be solved by the invention]

[0005] 2. Description of the Related Art In electric vehicles that are configured to run on electric power, improvements in vehicle performance have created a demand for compact, high-performance power conversion systems.

[0006] In vehicles configured to run on electric power, many electronic components are mounted on a circuit board, and it is desirable to reduce the height and size of the entire power conversion device. In the switching power supply device of Patent Document 1, low-profile components are arranged opposite a thick cooling plate with a refrigerant flow path, and high-profile components are arranged opposite a thin base plate without a refrigerant flow path, thereby achieving size reduction. However, because the base plate does not have a refrigerant flow path but is itself thick, there is room for improvement in reducing the size of the power conversion device.

[0007] Therefore, there is a demand for a power conversion device that can be miniaturized while arranging a plurality of electronic components of different heights on a cooling plate. [Means for solving the problem]

[0008] One embodiment of the power conversion device according to the present invention comprises a substrate on which a plurality of electronic components of different heights are mounted, and a cooling plate through which a cooling fluid flows to cool the plurality of electronic components, the plurality of electronic components including a first electronic component and a second electronic component that is shorter in height than the first electronic component, the cooling plate having a through portion with an inner diameter larger than the outer diameter of the first electronic component, and the first electronic component being arranged in a state where it is inserted into the through portion.

[0009] According to this embodiment, in the power converter, a first electronic component that is taller than a second electronic component is inserted into a through-hole in the cooling plate. This reduces the height of the first electronic component protruding from the cooling plate, allowing the board on which the first electronic component is mounted to be closer to the cooling plate. As a result, the overall height of the power converter is reduced, allowing for miniaturization. In this way, the power converter can be miniaturized while arranging multiple electronic components of different heights on the cooling plate. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a vertical cross-sectional view of a vehicle drive device that houses a power conversion device. [Figure 2] FIG. 2 is a cooling circuit diagram showing a cooling fluid flow path and a refrigerant flow path. [Figure 3] FIG. 2 is a partial cross-sectional view of the power conversion device. [Figure 4] FIG. 2 is a partial plan view of the power conversion device. [Figure 5] FIG. 10 is a partial cross-sectional view of a power conversion device of a comparative example. [Figure 6] FIG. 6 is a partial cross-sectional view of a power converter according to a second embodiment. [Figure 7] FIG. 10 is a partial cross-sectional view of a power conversion device according to a third embodiment. [Figure 8] FIG. 10 is a partial cross-sectional view of a power conversion device according to another embodiment. [Figure 9] FIG. 10 is a partial plan view of a power conversion device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] An embodiment of a power conversion device B according to the present invention will be described below with reference to the drawings. In this embodiment, the power conversion device B is configured by stacking a plurality of conversion modules vertically, but the number of conversion modules and the specific arrangement of electronic components constituting the conversion modules are not limited to the following embodiment, and various modifications are possible within the scope of the gist thereof.

[0012] [First embodiment] [Basic configuration] Fig. 1 shows a vehicle drive device A that transmits the driving force of a traction motor M to the drive wheels (not shown) of a vehicle. This vehicle drive device A accommodates the traction motor M, a gear mechanism Ge that reduces the driving force of the traction motor M and transmits it to the drive wheels, a power conversion device B, and an inverter C in a housing AH. Hereinafter, a vehicle equipped with a traction motor M as a driving source will also be referred to as an electric vehicle. Examples of the electric vehicle 100 include a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), a battery electric vehicle (BEV), and a fuel cell electric vehicle (FCEV).

[0013] The vehicle drive device A is provided in the electric vehicle 100 in the vertical relationship shown in Fig. 1, and therefore in this embodiment, the vertical relationship will be described in accordance with the vertical direction shown in Fig. 1. Also, Fig. 1 shows a vertical cross section of the vehicle drive device A as seen in the front-rear direction, and the left-right direction in Fig. 1 corresponds to the width direction of the vehicle body.

[0014] Power conversion device B converts AC power from an AC power source (basically a commercial power source) supplied from outside electric vehicle 100 into high-voltage DC power. The converted high-voltage DC power is charged into a main battery (not shown) arranged outside vehicle drive device A. Power conversion device B also converts DC power from the main battery to generate AC power similar to that of the commercial power source and supplies it to the outside of electric vehicle 100.

[0015] The inverter C converts DC power from the main battery into three-phase AC power, controls the frequency, and supplies it to the traction motor M. This drives the drive wheels of the electric vehicle 100, causing the electric vehicle 100 to travel.

[0016] 1, the power conversion device B is configured with multiple layers in which multiple conversion modules (first conversion module Ba, second conversion module Bb, and third conversion module Bc) are arranged in an overlapping manner in the vertical direction. The inverter C is provided above the power conversion device B.

[0017] [Vehicle drive device] 1, the vehicle drive device A accommodates a driving motor M and a gear mechanism Ge in a lower space LS of a housing AH. In the vehicle drive device A, the outer side of the driving motor M in the lower space LS is closed by a motor cover 1, and the outer side of the gear mechanism Ge in the lower space LS is closed by a gear cover 2.

[0018] The vehicle drive device A accommodates a power conversion device B and an inverter C in an upper space HS of a housing AH. This upper space HS is closed by an upper cover 3. The lower space LS and the upper space HS are independent spaces that do not communicate with each other.

[0019] As shown in Figure 1, the power conversion device B has multiple layers in which multiple conversion modules (a first conversion module Ba, a second conversion module Bb, and a third conversion module Bc) are arranged in a stacked state, and an inverter C is provided on the upper surface of the power conversion device B.

[0020] In this embodiment, as described above, the power conversion device B and the inverter C are housed in an integrated state inside the housing AH of the vehicle drive device A, but the power conversion device B may be separated from the inverter C. Furthermore, the vehicle drive device A is configured to house both the power conversion device B and the inverter C inside, but at least one of the power conversion device B and the inverter C may be disposed on the outer wall surface of the housing AH of the vehicle drive device A or outside.

[0021] [Layer structure of power conversion device] 1, the power conversion device B has a first conversion module Ba, a second conversion module Bb, and a third conversion module Bc arranged in this order from top to bottom. The power conversion device B has a first cooling plate 11 arranged on the upper level, and a second cooling plate 12 arranged below it at a set distance, and these are connected via a spacer or the like to maintain the set distance between the first cooling plate 11 and the second cooling plate 12.

[0022] Specifically, the power conversion device B has a first conversion module Ba and a second conversion module Bb arranged below the first cooling plate 11 and above the second cooling plate 12, and a third conversion module Bc arranged below the second cooling plate 12. Furthermore, the inverter C is arranged above the first cooling plate 11.

[0023] The first conversion module Ba is composed of a plurality of switching elements 15 (an example of electronic components) mounted on the upper surface of a plate-shaped upper substrate 14. The upper substrate 14 is supported by the second cooling plate 12 while being spaced above the upper surface of the second cooling plate 12. The plurality of switching elements 15 constitute a part of an OBC (On Board Charger) unit (not shown).

[0024] 1, a plurality of switching elements 15 are shown as one block. These switching elements 15 are arranged in contact with or in close proximity to the lower surface of the first cooling plate 11.

[0025] 1, the second conversion module Bb is composed of a transformer T (an example of an electronic component) mounted on the lower surface of an upper substrate 14, a plurality of bulk capacitors 16 (an example of an electronic component), and a frame member 18. The frame member 18 functions as a spacer by protruding downward from the lower surface of the upper substrate 14 while surrounding at least a portion of the outer periphery of the transformer T.

[0026] As shown in FIG. 1, the third conversion module Bc includes a plurality of coil modules 21 (an example of an electronic component) and a plurality of AC filters 22 (an example of an electronic component) on the upper surface of a lower substrate 20 that is arranged separately below the lower surface of the second cooling plate 12.

[0027] The upper surfaces of the plurality of coil modules 21 and the upper surfaces of the plurality of AC filters 22 are arranged in contact with or in close proximity to the lower surface of the second cooling plate 12.

[0028] [Cooling circuit] 2, the vehicle drive device A includes a cooling circuit including a coolant flow path L1 for circulating a coolant as a cooling fluid, a refrigerant flow path L2 for circulating a refrigerant, and a lubricant flow path L3 for circulating a lubricant. The cooling fluid in this embodiment is composed of a coolant such as insulating oil or a long-life coolant (LLC) containing ethylene glycol or propylene glycol.

[0029] The coolant flow path L1 is driven by the coolant pump 33 to circulate the coolant through the first cooling plate 11 and second cooling plate 12 of the power converter B, the oil cooler 32, the water-cooled condenser 31, and the radiator in this order.

[0030] The refrigerant flow path L2 is configured to supply an externally cooled refrigerant to the water-cooled condenser 31. In this refrigerant flow path L2, a hydrofluorocarbon (HFC), a hydrofluoroolefin (HFO), or the like is used as the refrigerant.

[0031] The lubricating oil passage L3 supplies low-temperature lubricating oil (oil) to the inside of the traveling motor M and the gear mechanism Ge when driven by the hydraulic pump 35.

[0032] In this cooling circuit, the coolant cooled by the radiator 34 flows through the flow path R of the first cooling plate 11 and the flow path R of the second cooling plate 12 of the power conversion device B. As a result, the coolant absorbs heat generated in the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc, and cools the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc. As a result, the temperature of the coolant rises.

[0033] The oil cooler 32 is disposed downstream of the power converter B in the coolant flow path L1 and exchanges heat between the oil and the coolant circulating through the coolant flow path L1. This further increases the temperature of the coolant and decreases the temperature of the oil. The oil with the decreased temperature is then circulated through the lubricant flow path L3. This suppresses the temperature increase of the drive motor M and gear mechanism Ge in the lower space LS of the housing AH and lubricates the drive motor M and gear mechanism Ge. The coolant whose temperature has increased in the oil cooler 32 absorbs heat from the refrigerant in the water-cooled condenser 31, then its temperature is reduced by heat dissipation in the radiator 34 and is then supplied to the power converter B again.

[0034] [Cooling mechanism] The power conversion device B is cooled by a coolant flowing through the first cooling plate 11 and the second cooling plate 12. As shown in Fig. 1, the first cooling plate 11 and the second cooling plate 12 are configured such that a flow path R is continuous between the first cooling plate 11 and the second cooling plate 12 by a communication path 13 extending in the vertical direction.

[0035] The coolant that has been cooled by the radiator 34 or the like and reaches the power conversion device B flows into the flow path R of the second cooling plate 12 from an inlet (not shown) of the second cooling plate 12. An end of the second cooling plate 12 is connected to an end of the communication path 13.

[0036] The coolant that has flowed through the flow path formed in the communication passage 13 reaches the first cooling plate 11. An outlet (not shown) is formed at the downstream end of the first cooling plate 11, and the coolant flows out to the outside of the power conversion device B.

[0037] The arrangement of the electronic components relative to the second cooling plate 12 will be described below.

[0038] 3 and 4, the power conversion device B includes substrates 14 and 20 and a second cooling plate 12. A plurality of electronic components 41 to 44 of different heights are mounted on the substrates 14 and 20. The second cooling plate 12 cools the plurality of electronic components 41 and 42 by circulating a cooling fluid therethrough.

[0039] The plurality of electronic components arranged on the substrate 14 include electronic components 41a and 41b (an example of the first electronic component 41) and an electronic component 42a (a second electronic component 42) that is shorter than the electronic components 41a and 41b. The tall electronic components 41a and 41b are, for example, aluminum capacitors (bulk capacitors). The low-profile electronic component 42a is, for example, a switching element. In the example shown in FIG. 1, a through-hole 51 (described later) is not shown on the second cooling plate 12, and the switching element 15 and the second cooling plate 12 are shown spaced apart. However, in this embodiment, as shown in FIG. 3, the plurality of electronic components 41a and 41b, each formed of a bulk capacitor 16, and the electronic component 42a, each formed of a switching element 15, are mounted on the underside of the substrate 14, and the plurality of electronic components 41a and 41b are arranged in a state where they are inserted into the through-hole 51. Furthermore, tall electronic components 43a and 43b and short electronic components 44a and 44b are mounted on the upper surface of the substrate 20. The tall electronic components 43a and 43b are, for example, coils for noise elimination, and the short electronic components 44a and 44b are, for example, X capacitors and Y capacitors for noise elimination.

[0040] The electronic component 42a mounted on the substrate 14 is in contact with the surface of the second cooling plate 12 via the heat dissipation material 55. The electronic components 43a and 43b mounted on the substrate 20 are in contact with the surface of the second cooling plate 12 via the heat dissipation material 55.

[0041] The second cooling plate 12 is formed with a through portion 51 having an inner diameter larger than the outer diameter of the electronic components 41a and 41b, and the electronic components 41a and 41b are arranged in a state of being inserted into the through portion 51.

[0042] The electronic components 41a and 41b are arranged such that the side surface portions 45 facing the through-hole portions 51 are in contact with the second cooling plate 12. The second cooling plate 12 and the electronic components 41a and 41b are in contact with each other via a heat dissipation material 55. Here, the heat dissipation material 55 may be, for example, an adhesive made of a viscous heat dissipation paste material.

[0043] If the heat dissipation material 55 is a viscous adhesive, the viscosity of the heat dissipation material 55 may cause a portion of the heat dissipation material 55 to flow downward from the gap between the side surface portions 45 of the electronic components 41a, 41b and the inner surface of the through-hole portion 51 of the cooling plate 12. This may result in a case where the electronic components 41a, 41b are not properly adhered to the cooling plate 12 via the heat dissipation material 55. Therefore, the second cooling plate 12 is configured so that the portion of the through-hole portion 51 facing the side surface portions 45 of the electronic components 41a, 41b (first electronic components 41) has a step portion 52 in which the opening area in the thickness direction is reduced.

[0044] An electronic component 44a (an example of a third electronic component 44) that generates less heat than the first electronic component 41 and the second electronic component 42 is arranged at a position opposite to the electronic components 41a and 41b, which are the first electronic component 41, in the thickness direction of the second cooling plate 12.

[0045] 5 is a diagram illustrating an outline of a power converter B1 of a comparative example. In the power converter B1, tall electronic components 41a and 41b are in contact with the surface of the cooling plate 12 via a heat dissipation material 55. In addition, the low-profile electronic component 42a is connected to the cooling plate 12 in such a manner that the heat dissipation material 55 and the heat transfer member 56 are stacked in this order on the cooling plate 12 side. Therefore, in the power converter B1, the width W2 from the cooling plate 12 to the upper substrate 14 needs to be equal to the height of the tall electronic components 41a and 41b, which increases the overall size of the device.

[0046] On the other hand, in this embodiment, as shown in Figure 3, a portion of the tall electronic components 41a, 41b is placed in the through-hole portion 51, so the width W1 from the cooling plate 12 to the upper substrate 14 can be made significantly shorter than the width W2 in the power conversion device B1 of the comparative example (Figure 5).

[0047] Second Embodiment 6, in the power converter B of the second embodiment, the second cooling plate 12 is configured so that the portion of the through portion 51 facing the side surface portion 45 of the electronic components 41a, 41b (first electronic components 41) has an inclined portion 53 that is inclined in the thickness direction. Therefore, in the power converter B of this embodiment, the electronic components 41a, 41b are in contact with each other via the heat dissipation material 55 provided on the inclined portion 53.

[0048] Third Embodiment 7, in the power converter B of the third embodiment, the second cooling plate 12 is configured so that the portion of the through portion 51 facing the side portion 45 of the electronic components 41a, 41b (first electronic component 41) has a recess 57 that can be filled with heat dissipation material 55. Therefore, in the power converter B of the present embodiment, the electronic components 41a, 41b are in contact with the second cooling plate 12 via the heat dissipation material 55 that is filled and held in the recess 57.

[0049] [Another embodiment] The present invention may be configured as follows in addition to the above-described embodiment (common numbers and symbols as in the embodiment are used to designate components having the same functions as in the embodiment).

[0050] (a) In the above embodiment, an example was shown in which the power conversion device B has a step portion 52, an inclined portion 53, or a recessed portion 57 as a retention area for the heat dissipation material 55 at the portion of the through portion 51 facing the side portion 45 of the electronic components 41a, 41b (first electronic component 41). If the heat dissipation material 55 has high viscosity, as shown in Fig. 8, the second cooling plate 12 may have a configuration in which the portion of the through portion 51 facing the side portion 45 of the first electronic component 41 is formed linearly in the vertical direction.

[0051] (b) In the above embodiment, an example was shown in which the second cooling plate 12 has the through portion 51 near the center. Alternatively, as shown in Fig. 9, the second cooling plate 12 may have a shape in which the through portion 58 includes part of the periphery of the second cooling plate 12.

[0052] (c) In the above embodiment, an example is shown in which through-holes 51, 58 are formed in the second cooling plate 12, but a configuration is also possible in which through-holes are provided in the first cooling plate 11 and tall electronic components are inserted and arranged in the through-holes.

[0053] (d) In the above embodiment, an example was shown in which multiple tall electronic components 41a, 41b were inserted and arranged in the through-holes 51, 58 of the second cooling plate 12. However, a single electronic component may be arranged in the through-holes 51, 58 of the second cooling plate 12.

[0054] Furthermore, the configurations disclosed in the above embodiments (including other embodiments, the same applies below) can be applied in combination with configurations disclosed in other embodiments, as long as no contradictions arise. Furthermore, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited to these, and can be modified as appropriate within the scope that does not deviate from the purpose of the present invention.

[0055] In the above-described embodiment, the following configurations are envisioned. <1> One aspect of the power conversion device (B) comprises a substrate (14) on which a plurality of electronic components (41, 42) of different heights are mounted, and cooling plates (11, 12) through which a cooling fluid flows to cool the plurality of electronic components (41, 42), the plurality of electronic components (41, 42) including a first electronic component (41) and a second electronic component (42) that is shorter in height than the first electronic component (41), the cooling plate (12) having a through portion (51) with an inner diameter larger than the outer diameter of the first electronic component (41), and the first electronic component (41) is arranged in a state where it is inserted into the through portion (51).

[0056] According to this embodiment, in the power converter (B), the first electronic component (41), which is taller than the second electronic component (42), is arranged in a state where it is inserted into the through-hole (51) of the cooling plate (12). This makes it possible to reduce the height of the first electronic component (41) protruding from the cooling plate (12) in the power converter (B), and to bring the board (14) on which the first electronic component (41) is mounted closer to the cooling plate (12). As a result, the overall height of the cooling plate (12) and the electronic components (41, 42) is reduced in the power converter (B), thereby reliably achieving miniaturization.

[0057] <2> In the power converter (B), it is preferable that the first electronic component (41) is arranged such that a side surface portion (45) facing the through portion (51) is in contact with the cooling plate (12).

[0058] According to this embodiment, the first electronic component 41 is not in surface contact with the cooling plate 12. However, the side surface 45 of the first electronic component 41, which faces the through-portion 51 of the cooling plate 12, is in contact with the cooling plate 12. This ensures that the first electronic component 41 is cooled by the cooling fluid flowing through the cooling plate 12.

[0059] <3> In the power conversion device (B), the cooling plate (12) is configured such that the portion of the through portion (51) facing the side portion (45) of the first electronic component (41) has a step portion (52) in which the opening area becomes smaller in the thickness direction, or an inclined portion (53) inclined in the thickness direction, and is in contact with the side portion (45) via a heat dissipation material (55) provided in the step portion (52) or the inclined portion (53).

[0060] In the power conversion device (B), the first electronic component (41) is placed in the through-hole (41) of the cooling plate (1). When the side surface (45) of the first electronic component (41) is brought into contact with the cooling plate (12), for example, the side surface (45) of the first electronic component (41) is attached to the through-hole (51) of the cooling plate (12) with a heat dissipation material (55) interposed between the side surface (45) of the first electronic component (41) and the through-hole (51) of the cooling plate (12). In this case, for example, a viscous adhesive material is used as the heat dissipation material (55). When such a heat dissipation material (55) is used, the viscosity of the heat dissipation material (55) may cause a portion of the heat dissipation material (55) to flow downward from the gap between the side surface (45) of the first electronic component (41) and the inner surface of the through-hole (51) of the cooling plate (12). Therefore, the first electronic component (41) may not be properly adhered to the cooling plate (12) via the heat dissipation material (55).

[0061] Therefore, in this embodiment, the cooling plate (12) is configured such that the portion of the through-hole (51) facing the side surface (45) of the first electronic component (41) has a step (52) that reduces the opening area in the thickness direction or an inclined portion (53) that slopes in the thickness direction, and the cooling plate (12) is in contact with the side surface (45) of the first electronic component (41) via the heat dissipation material (55) provided in the step (52) or inclined portion (53). As a result, the step (52) or inclined portion (53) can prevent the heat dissipation material (55) from flowing downward. Therefore, the heat dissipation material (55) can be properly held in the portion of the through-hole (51) facing the side surface (45) of the first electronic component (41). This allows the first electronic component (41) to be stably attached to the through-hole (51) of the cooling plate (12).

[0062] <4> In the power converter (B), it is preferable that a third electronic component (44) that generates less heat than the first electronic component (41) and the second electronic component (42) is arranged at a position facing the first electronic component (41) in the thickness direction of the cooling plate (12).

[0063] According to this embodiment, in the power conversion device (B), it is possible to effectively avoid a problem in which the first component (41) arranged in the through portion (51) of the cooling plate (12) becomes hot due to heat generated by the third electronic component (44), which is another electronic component. [Industrial Applicability]

[0064] The present invention can be used in a power conversion device. [Explanation of symbols]

[0065] 11: first cooling plate (cooling plate), 12: second cooling plate (cooling plate), 14: upper board (board), 20: lower board (board), 41: first electronic component, 42: second electronic component, 44: third electronic component, 45: side portion, 51, 58: through portion, 52: step portion, 53: inclined portion, 55: heat dissipation material, B: power conversion device

Claims

1. A substrate on which multiple electronic components of different heights are mounted, a cooling plate through which a cooling fluid for cooling the plurality of electronic components flows, the plurality of electronic components include a first electronic component and a second electronic component that is shorter in height than the first electronic component; the cooling plate has a through-portion having an inner diameter larger than an outer diameter of the first electronic component, The first electronic component is disposed in a state inserted into the through-portion of the power conversion device.

2. The power conversion device according to claim 1 , wherein the first electronic component is disposed with a side surface portion thereof facing the through portion in contact with the cooling plate.

3. the cooling plate is configured such that a portion of the through-hole that faces the side surface of the first electronic component has a step portion that reduces an opening area in a thickness direction or an inclined portion that is inclined in the thickness direction, The power conversion device according to claim 2 , wherein the contact state is achieved via a heat dissipation material provided at the step portion or the inclined portion.

4. 4. The power conversion device according to claim 1, wherein a third electronic component that generates less heat than the first electronic component and the second electronic component is arranged at a position opposite the first electronic component in the thickness direction of the cooling plate.

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