Method for manufacturing circuit board and molded component used therein

Abstract

To relate to a method for manufacturing a circuit board and a molded component used in this method, which simplifies the manufacturing of the circuit board and saves on insulating material, thereby also reducing the height of the circuit board and improving heat management.SOLUTION: A method according to the invention for manufacturing a circuit board includes the steps of A) providing a conductive molded component 1 having at least two segments 2a to 2g connected together only by a web M of material, B) embedding the segments 2a to 2g in an insulating material to form at least one circuit board substrate, C) applying conductor structures 4a, 4b to the circuit board substrate to form the circuit board, and D) releasing the integral connection of the segments 2a to 2g by breaking the web M of material.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a circuit board and a molded part for use in the method. [Background technology]

[0002] In circuit board manufacturing, current-carrying components are often insulated as conductors or conductive elements, especially for high current applications. It is embedded in the edging material and connected to a conductor structure that connects electronic components to a circuit board. Such a circuit board and a manufacturing method are known from Patent Documents 1 and 2.

[0003] Known manufacturing methods include placing conductors or conductor elements on copper foil, welding them, and then covering them with insulating material. After this, a conductor structure with strip conductors and connection points is fabricated from the copper foil. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] European Patent No. 1842402 [Patent Document 2] German Patent Application Publication No. 102011102484 Summary of the Invention [Problem to be solved by the invention]

[0005] Based on the above prior art, the problem underlying the present invention is to solve the problem of the circuit board, especially the multi-segment This simplifies the manufacture of circuit boards with casings, saves on insulating material, and thereby reduces the height of the circuit board. This reduces the thermal load and significantly improves the efficiency of heat management, especially on circuit boards. [Means for solving the problem]

[0006] The object of the present invention is to provide a method as claimed in claim 1 and a composition as claimed in claim 6. This is solved by using shaped parts.

[0007] The method for manufacturing a circuit board according to the present invention includes the following steps. Step A: The webs of material are joined together (joints) along), providing a conductive molded part having at least two segments. Step B: forming at least one insulating material to form a circuit board substrate. Embed the segment inside. Step C: Applying the conductor structure to a circuit board substrate to form a circuit board. do. Step D: Release the integral connection of the segments by cutting the web of material. do.

[0008] To form segments and different circuit board sections as needed, e.g. Perforations, e.g., slot-shaped perforations, are introduced into the formed part along the perforation lines. For example, the conductor according to patent document 1 and / or the molded part according to patent document 2 correspond to these. The contents of the patent application are incorporated herein by reference. Essentially, the increased segmentation Adding more data may require more processing time, so while forming the segments, It is intended that a small amount of material be removed. The segmentation of the molded part involves the use of a circuit board. In the final state, the insulating material is preferably completely filled in the joint. However, only after the conductor structure is installed can the individual segments isolating them from each other significantly simplifies the positioning of the conductor structures relative to the segments, It has been found to be advantageous to do so. The joints between the segments are The area must be at least large enough to prevent electrical breakdown through the joints of the insulating material used. From this point of view, a minimum width of approximately 200 μm has been found to be advantageous. However, when the molded part is embedded in the insulating material, the removed material is filled with insulating material. The joint must not be too wide. It is preferable to apply it in layers (prepreg = resin-impregnated fiber mat), etc., so bonding In the case of small joints, the corresponding insulating material is insufficient. If the joint is larger, perhaps a groove along the joint on the surface of the circuit board can be added. This can lead to the formation of pits and delamination, which must be avoided as much as possible. A maximum width of about 2000 μm for a perforation line or joint seems reasonable. After embedding the molded part in the insulating material, the intermediate product is not considered to be a circuit board substrate within the scope of the present invention. Next, the conductor structures for connecting electronic components are placed on this circuit board. To this end, the circuit board substrate is made of, for example, copper foil. and subsequently stripped from this copper foil using, for example, an etching process. The trip conductors and connection points are fabricated. However, prefabricated conductors and connections are not The pad may also be attached to a circuit board substrate as a conductive structure. According to the The integral connection is released. This release allows the conductor structure to be specifically connected to the embedded segment. By embedding it in insulating material, the web of material can be cut. Even after cutting, the segments remain fixed in position and aligned relative to each other. The plural "webs of materials" may include the singular "web of materials." It is also intended.

[0009] As a result, the present invention is also useful in minimizing the amount of insulating material used in manufacturing circuit boards. Minimizing the amount of insulating material provides several benefits at once. On the one hand, material costs are saved, and on the other hand, the thickness of the circuit board, i.e. the overall height, is reduced. The less insulating material used, the thinner the circuit board. The thinner the joints, the lower the Less insulating material (or resin) is required to fill the joints. Not only is it electrically insulating, but it is also thermally insulating, so the amount of insulating material Less mass also benefits the thermal management of the circuit board.

[0010] Steps A through D are preferably, but not necessarily, performed in the sequence shown. It is within the scope of the present invention to provide a method for the production of a medicament comprising the steps and sub-steps of the method as set forth below. The steps may also be performed, at least in part, in a modified order.

[0011] Further preferred embodiments of the invention are the subject of the dependent claims.

[0012] It may be reasonable for step A to include at least one of the following substeps: The sub-steps are preferably, but not necessarily, performed in the order shown. It's nice. A-1: Preferably copper, having a thickness in the range of 200 μm to 1000 μm It is particularly preferred that the conductive moldings are made of metal, preferably as flat surface elements. Provide products. A-2: Attach or form at least one fiducial mark on the molded part. The reference mark may be, for example, a letter, a symbol, a cross or an opening in the molded part. It is important that the fiducial marks are clearly defined. Coordinates on the molded part so that the mark can be used to clearly determine the position of the molded part This serves to determine the system, which positions subsequent conductor structures relative to the segments, It is also particularly preferred for subsequent cutting of the web of material. Once embedded, the joints or webs of material are usually covered with insulating material and hidden from view. Thus, the location of the web of material can be cut in a desired manner through the web. The fiducial marks allow you to measure the conductors on the circuit board. Structures can be defined or formed with positional accuracy and therefore suitable for subsequent cutting. The web of material, which must be accessible to the appropriate tool, is bounded by the conductor structure. are not covered by or in any other way accessible The fiducial marks are preferably machine readable or can be optically read using an optical device. Preferably, it is biologically recognizable. A-3: Use at least one reference mark on the molded part to identify the molded part (e.g., This aligns the molded part to the molded assembly in subsequent processing steps. Simplify the processing of A-4: Preferably as a function of at least one reference mark of the molded part, at least Preferably, at least one circuit board section is formed having at least two segments. Preferably, at least one drilling line includes at least one of the following substeps: The molded part is perforated along the groove. A-4-1: The circuit board section within the drilling line is located on the outer periphery of the drilling line. The circuit board sections are connected together only through isolated webs of material in the area forming a self-contained perforation line around the Preferably, the circuit board sections are self-contained punched laminations, preferably after the circuit board is completed. The polygonal shape separates easily from the surrounding material along the line. Facilitates separation of circuit board sections. A-4-2: At least one opening for dividing the circuit board section into segments Form a perforation line (i.e., not closed) or a closed perforation line, and this open perforation line or Preferably, the open or closed perforation line begins and / or ends at the edge of the circuit board section. Preferably, the circuit board section begins and / or ends at a perforation line surrounding the circuit board section. These perforation lines allow any segment to be connected to a circuit board section. Self-contained perforation lines allow for interconnection between different circuit board segments. It is also possible to form the circuit board segments in a A-4-3: Preferably has a uniform width, the width ranges from 200 μm to 2000 μm At least one perforation line is preferably formed, and the perforation line is Preferably, the slot-shaped perforations are spaced apart by the web of material. Preferably, the perforation lines form subsequent joints between the segments, the joints being In the completed state of the circuit board, it is ideally completely filled with insulating material. A-4-4: Preferably more than 90%, 95% or 99% of the material of the molded part is perforated The material is removed, preferably by laser radiation or etching, so that it is removed along the line. The resulting puncture perforates the molded part, leaving the remaining material as a web of material. In an embodiment, the width of the web of material measured along the perforation line is, for example, about 500 μm. The distance between the two webs of material along the perforation line is e.g. Approximately 50 mm, i.e. 100 times the width of the web of material. In this example, the material of the molded part Approximately 99% of the material is removed along the perforation line. A-4-5: Preferably, the circuit board section is arranged in a matrix across the entire molded part. It consists of multiple identical or different circuit board sections distributed in rows and columns. By doing so, the area of ​​the molded part is optimally utilized. , the maximum possible number of circuit board sections can be formed. A-5: Within the molded part, preferably within a self-contained partition line, preferably at least one At least one opening is formed in the area of ​​the circuit board segment. This allows for the formation of non-conductive or insulating segments. A-6: Preferably, the surface of the insulating material is flush with the surface of the molded part. At least one opening of the insulating material is filled with the insulating material. This makes it easier to press molded parts. A-7: The molded part is roughened, preferably by chemical or mechanical treatment. This allows for an improved subsequent connection between the insulating material and the molded part. This is disclosed in German Patent Application Publication No. 102012216926, the contents of which are as follows: It is incorporated herein by reference.

[0013] Step B may usefully include at least one of the following substeps: The sub-steps are preferably, but not necessarily, performed in the order shown. It's nice. B-1: Preferably as a flexible surface element, preferably a prepreg (resin-impregnated fiber mat) It is particularly preferable that the insulating material be molded to match the size of the molded part. The insulating mat may have a corresponding reference marking, which This is applied, for example, to match the reference marks on the shaped part. This allows the nozzle to be optimally positioned relative to the molded part. B-2: Preferably, insulating materials are laminated on each surface of the molded part, preferably The insulating material is applied to one or both sides of the molded part to ensure a uniform layer thickness. This technique allows molding parts to be embedded in insulating material in a particularly simple way. . B-3: Preferably, the space between the (webs of material and / or) segments is insulated. The edge material is arranged in such a way that it partially or completely fills the molded part, particularly preferably on both sides. The insulating material layers are connected together by the insulating material, preferably by Introduce insulating material between segments of a molded part by pressing it onto the molded part. This already ensures extensive electrical insulation of the segments along the joints, while minimizing the risk of electrical breakdown and avoiding air pockets in the joint. B-4: All sides of the segment except for the web of material are completely covered by insulating material The individual segments are embedded in insulating material so that they are surrounded by , the position and orientation of the segments relative to each other are defined, thereby This makes it particularly easy to accurately attach the conductor structure. Ideally, the circuit board excluding the web of material Each circuit board section must be completely surrounded by insulating material on all sides. The sections are also embedded in the insulating material. The positions and orientations of the circuit board sections are defined, thereby forming the multiple circuit board sections from the molded part. This facilitates subsequent processing to manufacture the circuit board. B-5: A sub-step of curing the insulating material. This method ensures that all circuit boards The sections and segments are permanently fixed in their predetermined positions and orientations relative to one another. These relative positions and orientations of the segments determine when the web of material is cut and This is maintained even after the circuit board is released from the circuit board substrate.

[0014] Step C may advantageously include at least one of the following sub-steps: The substeps may, but are not required to, be performed in the order shown. preferable. C-1: Conductive surface elements, preferably metal, preferably copper, in particular Preferably provided as a foil, very particularly preferably in a size that corresponds to the molded part. For example, copper foil has a thickness ranging from 15 μm to 110 μm. C-2: Preferably, the conductive surface elements are laminated to the circuit board substrate. The conductive surface elements are applied to the circuit board sub-surface so as to coat the surface of the circuit board sub-surface with a preferably uniform layer thickness. Apply to one or both sides of the straight. This substep can be performed, for example, during step C3. This can be performed in advance in connection with step C. C-3: Preferably, the conductor structure projects into the extension plane of the molded part, and the weave of the material The strip conductor and At least one reference part forming a conductor structure preferably having a connection point The mark is placed on the circuit board substrate as a function of the mark. the phrases "trip conductor" and / or "connection point" and / or "web of material" is also intended to include a single strip conductor, a connection point, or a web of material. The strip conductors and connection points do not necessarily need to be etched away from the copper foil. Strip conductors and connection points from previously fabricated components onto a circuit board substrate. These components can be easily identified by reference marks. It can be positioned at. C-4: preferably by removing material, preferably by etching, Preferably with strip conductors and / or connection points for electronic components Conductor structures are fabricated from conductive surface elements. Again, strip conductors and / or connections The position of the point is preferably defined relative to a reference mark. C-5: Preferably by contact, preferably by through connection, the conductor structure is At least one circuit board segment is connected to the conductor structure. The connection to the circuit board segments can also be ensured without the need for a separate connection.

[0015] Step D may advantageously include at least one of the following sub-steps: The sub-steps are preferably, but not necessarily, performed in the order shown. I wish. D-1: Provide a tool for cutting the web of material. D-2: Cutting the web of material as a function of at least one reference mark on the molded part. A cutting tool is aligned with the circuit board, for example, when the web of material is covered by insulating material. When a web of material is attached, its position is not visible to the naked eye and must be determined by other means. The position of the web of material must be accurately determined by the reference marks. By reading the fiducial mark and passing that information to the tool controller, The material to be cut in order to release the integral connections between the segments in a targeted manner. This allows the tool to be accurately guided to the web position. D-3: Drilling, preferably perpendicular to the plane of extension of the molded part Cutting a web of material by removing material with cutting or milling Ideally, the entire web of material is removed during cutting, thereby removing the preceding material. The risk of electrical breakdown at the location of the web of material is minimized. Two perforations in the form of slots already separated by a web (filled with insulating material) ) are similarly connected to form a continuous joint. D-4: Preferably, the joints between the segments are completely filled with insulating material. Then, fill the separation points of the webs of material with insulating material. This creates a segmented joint across the entire joint. The risk of electrical breakdown between the members is minimized.

[0016] This method also allows the production of circuit boards consisting of several planes. Two or more molded parts may also be present in such a circuit board; or Two or more circuit boards are connected by molded parts to form, in particular, three-dimensional circuit board structures. The molded parts can be arranged parallel to each other. The conductor structure can be It can also be extended over the plane of

[0017] Another aspect of the invention is a method for manufacturing a semiconductor device comprising two cells connected together only through an isolated web of material. A circuit board is manufactured by the method of one of the preceding embodiments, which comprises a plurality of segments. This relates to a molded part for manufacturing a mass-produced component. It can be manufactured in advance and also for producing multiple circuit boards in series production can be provided.

[0018] The molded part may have slot-shaped perforations along the perforation line. These are useful because they are blocked by a web of material.

[0019] Another aspect of the present invention is a method for manufacturing at least two circuits according to one of the two preceding embodiments. The present invention relates to a circuit board structure comprising a circuit board and at least one molded component, Each segment is connected to at least two circuit boards, and the segments of the molded part are electrically isolated from each other by cutting the web of material. This allows for clear, angled, and even conductive connections between circuit boards. These segments can be generated in a particularly simple manner.

[0020] Other preferred embodiments of the present invention are set forth in the detailed description, claims and drawings. It may be obtained by any combination of the features shown.

[0021] [Terms and definitions] <Molded parts> In the context of the present invention, the term "molded part" refers to a solid conductive material such as a metal, in particular copper. A molded part is understood to mean a layered, plate-like part made of a material that has irregularities in its contour. That is, it is preferable that there be no interruptions.

[0022] <Drilling> During drilling, segments can be easily cut into the molded part along the perforation line. A slot or hole is produced.

[0023] <Conductor structure> The term "conductor structure" refers to a conductive connection through an insulating material to at least one segment. The conductor structure is understood to mean everything that can perform a strip connection. A small number of elements are selected from the group consisting of top conductor, connection point, pad, conductor, contact, via, and through contact. It is preferable that the conductor structure has at least one of these elements. Preferably, the structure comprises several different elements, possibly several of these elements. stomach.

[0024] <Electronic Components> In the context of the present invention, electronic components include, for example, processors, memories, transistors, resistors, Resistors, generators, diodes, and other current-generating or current-consuming components, especially LEDs Components understood as being connected to or coupled with them, such as optical components, e.g. lenses, etc. However, it can also be understood as a connecting component such as a plug, terminal, etc. It is understood.

[0025] Unless otherwise indicated, plural references are used in the context of this invention. However, this is to avoid the more linguistically complex distinction according to singular and plural expressions. This is for practical reasons. "web of materials") is used in both singular ("one web of materials") and plural ("a web of materials"). It is within the scope of the present invention to include both a plurality of webs ("several webs"). [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a schematic diagram showing the top view of a first embodiment of a molded part for use in the method of the present invention, the molded part having a circuit board section with two segments connected together along a perforation line only via an isolated web of material. [Figure 2] 1 is a schematic exploded view of the components of a circuit board substrate for manufacturing a circuit board according to the method of the present invention, in which an electrically insulating layer is first arranged on both the upper and lower surfaces of the molded part according to FIG. 1 and then an electrically conductive layer is arranged in each case to form the circuit board substrate with a layer composite. [Figure 3] 3 is a schematic side view of a circuit board substrate formed from the components shown in FIG. 2, with a top conductive layer and a bottom conductive layer. [Figure 4] 4 is a schematic side view of a circuit board formed from the circuit board substrate according to FIG. 3 after forming top-side and bottom-side conductor structures and connecting them to segments. [Figure 5]Schematic top view of a molded part according to a second embodiment, in which a total of four virtually identical circuit board sections, each having a polygonal outline and a plurality of segments, are arranged in a matrix of two rows and two columns distributed throughout the molded part, with each segment connected together along perforation lines only via isolated webs of material, with subsequent conductor structures indicated by dashed lines. [Figure 6] 6 is a schematic top view of a circuit board according to the present invention, manufactured using a molded part according to FIG. 5, in which a conductor structure is formed on the circuit board and the integral connection of the segments is released after cutting the web of material. [Figure 7] (a) is a schematic top view of a blank for a molded part according to a third embodiment, and (b) is a top view of a molded part produced from the molded part according to the third embodiment, with several segments connected together via isolated webs of material. [Figure 8] 8 is a schematic top view of a structure in which several circuit board substrates are connected via molded parts according to FIG. 7. [Figure 9] 9 is a schematic top view of the structure shown in FIG. 8, in which the circuit board substrate is provided with a conductor structure. [Figure 10] FIG. 10 is a schematic top view of the structure shown in FIG. 9, where the webs of material between the segments have been cut to electrically isolate the segments. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0028] [First embodiment (FIGS. 1 to 4)] In a first embodiment of the present invention described below with reference to FIGS. 1 to 4, the circuit board LP For example, a conductive material in the form of a rectangular copper plate having a thickness in the range of 200 μm to 1000 μm. It is manufactured in a layered structure starting from the shaped part 1.

[0029] In step A of the method according to the invention, a molded part 1 is provided for further processing. In this process, the corresponding perforation lines P are introduced into the molded part 1, thereby forming a circuit board Two segments 2a, 2b of section 2 are formed. In this embodiment, the circuit board Section 2 is formed in a self-contained perforation line P of a polygon having eight corners. During drilling, appropriate material removal allows for a depth of preferably about 200 μm to 2000 μm. An opening in the form of a long slot having a certain width in the range of 1000 to 15000 is formed in the molded part 1 along the perforation line P. and thus the segments 2a, 2b are only connected to the isolated web M of material. The entire circuit board section 2 is a self-contained perforated lamination. The molded part 1 is connected to the peripheral edge area of ​​the molded part 1 via the pin P, and this edge area is provided with a reference mark R The reference mark R is used to determine the position on the surface of the molded part 1. The reference mark R is, for example, an opening, and the molded part 1 is placed on the pin using this opening. Several reference marks R can be provided on the molded part 1.

[0030] After the segments 2a, 2b have been formed, in step B of the method according to the invention, insulating The molded part 1 is embedded in at least a section of the material 3. The intermediate product is called the circuit board substrate LS. Ideally, it has a shape that matches the molded part 1. Two resin-impregnated fiber mats (prepregs) 3 of the same size are attached to the upper and lower surfaces of the molded part 1. These resin-impregnated fiber mats 3 are applied to the surface. the forming part in a manner that penetrates into the perforations and completely penetrates the spaces between the webs M of material. In this step, the pressing simultaneously bonds the insulating material. It is also possible to connect the conductive surface elements 4 together, and in step C a conductor structure is created from these conductive surface elements 4. In this process, for example, as shown in FIG. 3, a molded part 1, two insulating mats The sandwich-like layer composite consisting of the insulating layer 3 and two copper foils 4 is pressed together. By hardening the material 3, the position and orientation of the segments 2a, 2b relative to each other are fixed, so that they retain their position relative to one another even after the web of material M is cut. and maintain orientation.

[0031] In step C of the method according to the invention, the conductor structures 4a, 4b are connected to the circuit board substrate LS This step may be performed as a sub-step by attaching at least one conductive surface element to the substrate. Another copper foil 4 is added to the circuit board substrate LS, e.g., This involves adding one copper foil 4 to both the top and bottom surfaces of S. Preferably, this has already been done in step B, whereby the copper foil 4 is attached to the molded part 1 and In either case, the copper foil 4 is pressed with the insulating material 3 disposed between the molded part 1. In step D, a layer or material composite is then formed, for example by an etching process. A conductor structure having strip conductors 4a and connection points 4b is formed from this copper foil 4 using a laser. At the connection point 4b, the strip conductor 4a is connected to a contact 5 (e.g., a via or a laser). connected to segments 2a, 2b via vias (left) or feedthrough contacts (right) can be.

[0032] Once the conductor structures 4a, 4b are formed on the circuit board substrate LS, material is removed. This cuts the web of material M connecting the segments 2a, 2b together. This can be achieved by, for example, drilling a hole guided by a reference mark R to a corresponding position on the web M of material. When cutting the web of material M, the All material in the web of material M is drawn over a length corresponding to the width of the perforation line P. If necessary, the separation points are filled with insulating material 3, thereby The risk of electrical breakdown between segments 2a and 2b, especially at the point of the web M of preceding material, Whether the separation point is filled with insulating material 3 or not depends mainly on the circuit board or the insulating It can be determined as a function of the dielectric strength of the material.

[0033] Next, the completed circuit board LP is attached to the circuit board section 2 and segments 2a, 2b. The area is separated from the surrounding area along a self-contained perforation line P surrounding the area.

[0034] [Second embodiment (FIGS. 5 and 6)] A second embodiment of the invention, described below with reference to Figures 5 and 6, is substantially the same as the first embodiment. The same features are designated by the same reference numerals and the following embodiments are based on the same embodiment. The relevant differences are explained below.

[0035] In the second embodiment, the molded part 1, which is configured as a rectangular copper plate, has a total of four The molded part 1 has almost identical circuit board sections 2 that are arranged over the entire surface of the molded part 1. They are arranged in a matrix of two columns and two rows, vertically distributed.

[0036] An octagonal self-contained perforation line P surrounds each of the four circuit board sections 2. The individual circuit board sections 2 within the circumferential perforation line P are integral with the peripheral edge region of the molded part 1. in this edge region various fiducial marks R are provided by a web of material M isolated therefrom. In each circuit board section 2, a plurality of segments 2a to 2i are arranged. For illustrative purposes, the connection point 4b and the strip conductor are formed by the hole line P. Subsequent conductor structures 4a, 4b having bodies 4a are inserted into the individual circuit board sections 2. The connection point 4b and the strip conductor 4a are connected by a conductor structure 4a, 4b. b. Here, when projecting into the expansion plane of the molded part 1, the conductor structure 4 It can be seen that 4a and 4b do not cover the web of material M. Therefore, the web of material M is not covered by the subsequent processing. Accessible for analysis.

[0037] Segments 2a-i and perforation line P are the two circuit board sections in the left half of Figure 5. As shown in Figure 2, each circuit board section 2 is completely filled in the surface direction. However, it is preferable that the circuit board section 2 or at least one circuit board section Segments 2a-i are shown in the two circuit board sections 2 in the right half of Figure 5. It is also possible to have at least one opening 2j, 2k in each of the first and second electrodes 2a, 2b.

[0038] Even if you deviate from the two circuit board sections 2 on the left half of Figure 5, the two on the right half of Figure 5 Circuit board section 2 of the circuit board segment 2a instead of segments 2h and 2i. Therefore, the area of ​​the openings 2j and 2k corresponds to the area of ​​the openings 2j and 2k. The material of the molded part 1 is in each case cut along the self-contained dividing line T in step B. Completely separated and removed from the molded part 1. In step C or before, Ideally, the openings 2j, 2k are completely filled, and later the non-conductive circuit board segments are also filled. A hardened insulating material 3 is introduced into each opening 2j, 2k to form a hole. It is preferred that the molded part 1 is subsequently coated with insulating material in the form of a resin-impregnated fiber mat (prepreg). When pressed with the fee, it is available to a limited extent, i.e. liquid. Only the free resin of the insulating material 3 is present, and the free resin of the insulating material 3 is present along the perforation line P. Since it is mainly used to fill the perforations, the hardened insulating material 3 is applied to the openings 2j, 2k. It is useful to fill the openings 2j, 2k. The height of the insulating material plates introduced into the openings 2j, 2k is , preferably approximately equal to the height of the molded part 1, so that the upper surface of the insulating material 3 and The height of the upper and lower surfaces of the molded part 1 is the same as the height of the upper and lower surfaces of the molded part 1.

[0039] As in the first embodiment, this molded part 1 (a conductor structure drawn for illustrative purposes only) The conductive structure (which is also absent) is embedded in an insulating material 3 and then the corresponding conductive structure 4 5. Once the conductor structures 4a, 4b are formed, The web of material M is cut along the perforation line P to form the necessary Finally, the individual circuit boards LP are assembled into circuit board sections 2. is separated from the material composite along an outer perforation line P surrounding the

[0040] The number and shape of PCB sections 2 and segments 2a-i and fiducial marks R are You can change it as needed.

[0041] [Third embodiment (Figs. 7 to 10)] A third embodiment of the present invention, which will be described below with reference to Figures 7 to 10, is substantially similar to the first embodiment. The first and second embodiments are based on the same reference numerals. The relevant differences are explained below.

[0042] Here, the molded part 1 is used to manufacture a three-dimensional circuit board structure, specifically, Used to form clear or angled connections between two or more circuit boards LP Deviating from the previous embodiment, each segment 2a, 2b, 2c is divided into two sections. are connected to the circuit board substrate LS or the circuit board LP, and therefore The segments 2a, 2b, 2c are arranged between two or more circuit boards LP or on the circuit board substrate. Forming clear or angled connections between rate LSs.

[0043] The formed part is here a flat rectangular copper plate (FIG. 7( The element is roughly shaped like a conductor and is processed from the wire. The sections correspond to segments 2a, 2b, and 2c. The vertically extending section connecting c corresponds to the web of material M .

[0044] In step B, a molded portion is formed in the insulating material 3 to form the circuit board substrate LS. In this process, the individual segments 2a, 2b are embedded in the Half of the length is extended into the first circuit board substrate LS, and approximately half of the length is extended into the second circuit board substrate LS. 2 is deployed in the circuit board substrate LS.

[0045] In step C, conductor structures are applied to these circuit board substrates to form circuit boards LP. For this purpose, the German patent application No. 1020 As is known from the specification of 18203715, the molded part 1 is formed of a conductive surface element such as copper foil. or through a connecting means section. , a strip conductor 4a for contacting the segments 2a, 2b, and 2c, and A connection point 4b is created from this conductive surface element.

[0046] In step D the web of material M is cut, thus forming parallel segments 2a, 2b, 2c The integral connection between them is released. [Explanation of symbols]

[0047] 1 Molded parts 2 Circuit Board Section Segments 2a-i 2j~k opening 3. Insulating materials 4 Conductive surface element (copper foil) 4a Strip conductor 4b Connection point LS Circuit Board Substrate LP circuit board M Material Web P1, P2 drilling lines R fiducial mark T-divider line

Claims

1. A method for manufacturing a circuit board (LP), comprising: At least two segments (2a-i) connected together by a web of material (M). Step A: providing an electrically conductive molded part (1) having a The segments (2a-i) are embedded in an insulating material (3) to form at least one circuit board. Step B of forming a plate substrate (LS); The conductor structure (4a, 4b) is applied to the circuit board substrate (LS) to form a circuit board ( Step C of forming a LP; The web of material (M) is cut to form the segments (2a-i) in one piece. Step D of releasing the connection; A method for providing

2. Step A Preferably copper, with a thickness in the range of 200 μm to 1000 μm The conductive molded part (1) is preferably made of a metal, which is particularly preferred, as a flat surface element. a sub-step A-1 of providing Attaching or forming at least one reference mark (R) on said molded part (1) Sub-step A-2: A subassembly for aligning the molded part (1) using at least one reference mark (R) Step A-3, Preferably, as a function of at least one reference mark (R) of said molded part (1), At least one circuit board section having at least two segments (2a-i) The molded part (2) is then cut along at least one perforation line (P) to form the molded part (2). Sub-step A-4 of drilling 1), preferably The circuit board section (2) within the drilling line (P) is outside the drilling line (P). in the peripheral edge region of the A sub-step forming a self-contained perforation line (P) around said circuit board section (2) Preferably, the self-contained perforation line (P) has a polygonal shape. Step A-4-1, A small number of pieces for dividing the circuit board section (2) into the segments (2a-i) At least one sub-slot preferably forming an open perforation line (P) or a closed perforation line (P) The open perforation line (P) or the closed perforation line (P) is Preferably, the circuit board section (2) starts and / or ends at the edge of the circuit board section (2). It may start and / or end at a perforation line (P) surrounding the section (2). Particularly preferred is sub-step A-4-2, having a uniform width, preferably in the range of 200 μm to 2000 μm A sub-step of forming at least one perforation line (P), Perforations in the form of slots along the web (P) of material (M) are spaced apart from one another. It is preferable to form it as follows: Sub-step A-4-3; Preferably, more than 90%, 95% or 99% of the material of said molded part (1) is contained in said perforations. The hole is removed along the hole line (P), preferably by laser radiation or etching. a sub-step of perforating said molded part (1) by removing material through the remaining The remaining material is left as a web of material (M), substep A-4-4; Preferably, the circuit board sections (2) are arranged in a matrix across the molded part (1). Multiple identical or different circuit board sections are vertically distributed in rows and columns. Sub-step A-4-5 of forming a molded part (2) in the molded part (1); Sub-step A-4 including at least one of: Within said molded part (1), preferably within a self-contained dividing line (T), preferably within said segment At least one opening (2k, 2j) is provided in at least one region of the member (2a). Sub-step A-5 of forming Preferably, the surface of the insulating material (3) and the surface of the molded part (1) are at the same height. In the method, an insulating material (3) is inserted into the at least one opening (2k, 2j) of the molded part (1). Sub-step A-6 of filling Preferably, the molded part (1) is roughened by chemical or mechanical treatment. Top A-7, 2. The method of claim 1, comprising at least one of:

3. Step B Preferably as flexible surface elements, preferably as resin-impregnated fiber mats (prepregs) The insulating material (3) is particularly preferably of the same size as the molded part (1). Sub-step B-1, providing in a formable state; Preferably, the insulating material (3) is laminated to each surface of the molded part (1). Preferably, the insulating material (3) is applied to the molded part (1) so as to coat it with a uniform layer thickness. Sub-step B-2 of adding to one or both sides of Preferably, the insulating material (3) partially fills the spaces between the segments (2a), or in a completely filling manner, particularly preferably by means of insulating layers arranged on both sides of the molded part (1). The layers of the edge material (3) are connected together by the insulating material (3), preferably The insulating material (3) is pressed onto the molded part (1) to form the segment ( Sub-step B-3 of introducing the insulating material (3) between the layers 2a); All surfaces of the circuit board segment (2) except for the web (M) of material are made of insulating material The individual circuit board segments (2) are completely surrounded by insulating material ( Sub-step B-4) embedding the Sub-step B-5 of curing the insulating material (3); 3. The method according to claim 1, further comprising at least one of:

4. Step C Conductive surface elements (4) are particularly preferred, preferably made of metal, preferably copper. or foil, very particularly preferably in a size that corresponds to said molded part (1). Sub-step C-1: Preferably, the conductive surface element (4) is laminated to the circuit board substrate (LS ) so as to coat each surface of the conductive surface element (4) with a preferably uniform layer thickness. ) to one or both sides of the circuit board substrate (LS), sub-step C-2 、 Preferably, the conductor structures (4a, 4b) project into the extension plane of the molded part (1). In this case, the web of material (M) is offset from the web of material (M). The strip conductor (4a) and / or the connection point (4b) are provided so as not to cover the Preferably, said conductor structures (4a, 4b) are attached to at least one group of said molded part (1). A substrate (LS) is placed on the circuit board substrate (LS) as a function of the quasi-mark (R). Step C-3, Preferably by removing material, preferably by etching, the electronic components Preferably, the device has a strip conductor (4a) and / or a connection point (4b) for the element. a sub-step of creating the desired conductor structures (4a, 4b) from the conductive surface elements (4). C-4, Preferably by contacts (5), preferably by through-connections, said conductor structure (4 a, 4b) to at least one circuit board segment (2a, 2b) PuC-5, 4. The method according to claim 1, further comprising at least one of: How to do it.

5. Step D Substep D-1, providing a tool for cutting said web of material (M); of said material as a function of at least one reference mark (R) on said molded part (1). Substep D- aligning said tool for cutting the web (M) with said circuit board; ２、 Preferably drilled perpendicular to the plane of extension of the molded part (1). or cutting the web (M) of material by removing material by milling Sub-step D-3, Preferably, the joint between the segments (2a, 2b) is completely filled with insulating material (3). a sub-step of filling the separation points of said web of material (M) with insulating material (3) so that P-D-4, 5. The method according to claim 1, further comprising at least one of: How to do it.

6. At least two segments (2a-i) connected together via a web of material (M). ), preferably by the method according to any one of claims 1 to 5. Molded part (1) for manufacturing a LP.

7. The molded part (1) has slot-shaped perforations along a perforation line (P), 7. A molded part (1) according to claim 6, wherein the web (M) of material interrupts the flow of the particles.

8. At least two circuit boards (LP) and at least one A circuit board structure comprising a molded part (1) and each segment of the molded part (1). (2a-i) are connected to the at least two circuit boards (LP), and the molded part (1 ) are connected to each other by cutting the web of material (M). A circuit board structure that is electrically isolated from the

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