Foreign substance inspection device, exposure device, article manufacturing method, exposure system, and foreign substance inspection method

Abstract

To provide a foreign substance inspection device that can improve throughput.SOLUTION: A foreign substance inspection device according to the present invention inspects a foreign substance on an object that is the original plate or a substrate used for an exposure device that projects an image of a pattern of the original plate to the substrate to expose the substrate, and the foreign substance inspection device performs a storage step of storing foreign substance detection information related to a foreign substance detected when the object is conveyed for each path on which the object is conveyed, and a first determination step of determining whether to execute inspection on the basis of the foreign substance detection information stored in the storage step.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a foreign matter inspection apparatus, an exposure apparatus, an article manufacturing method, an exposure system, and a foreign matter inspection method. [Background technology]

[0002] 2. Description of the Related Art In a conventional foreign matter inspection apparatus that inspects an object, such as an original or a substrate, for foreign matters when the object is transported to a stage in an exposure apparatus, there is a demand for improved detection accuracy for foreign matters on the object. Patent Document 1 discloses a foreign matter inspection device that improves the accuracy of detecting foreign matters on an object by switching the foreign matter inspection mode for the object based on foreign matter detection information acquired during foreign matter inspection of the object by another foreign matter inspection device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-134412 Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, in such foreign particle inspection apparatuses, there is also a demand for improved throughput in order to shorten the time required to transport an object onto the stage of the exposure apparatus. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a foreign matter inspection apparatus that can improve throughput. [Means for solving the problem]

[0005] The foreign matter inspection device of the present invention is a foreign matter inspection device that inspects for foreign matters on an object which is an original or a substrate used in an exposure device that projects an image of the original pattern onto a substrate and exposes the substrate, and is characterized by performing a storage step of storing foreign matter detection information regarding foreign matters detected when the object is transported for each path along which the object is transported, and a first decision step of deciding whether to carry out an inspection based on the foreign matter detection information stored in the storage step. [Effects of the Invention]

[0006] According to the present invention, it is possible to provide a foreign matter inspection apparatus that can improve throughput. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a block diagram of an exposure apparatus equipped with a foreign substance inspection apparatus according to a first embodiment. [Figure 2] FIG. 1 is a schematic perspective view of a foreign matter inspection device. [Figure 3] FIG. 10 is a diagram showing an example of particle size distribution of foreign matter adhering to a mask. [Figure 4] FIG. 10 is a diagram schematically showing the relationship between the driving speed and the accumulation time in the foreign substance inspection device. [Figure 5] 10 is a flowchart showing a mask transport process in an exposure apparatus equipped with a foreign particle inspection apparatus according to the first embodiment. [Figure 6] 10 is a flowchart showing a foreign substance inspection execution decision process in the foreign substance inspection apparatus according to the first embodiment. [Figure 7] FIG. 2 is a partially enlarged schematic cross-sectional view of the foreign matter inspection device. [Figure 8] FIG. 10 is a block diagram of an exposure system including a foreign substance inspection apparatus according to a third embodiment. [Figure 9] FIG. 1 is a schematic cross-sectional view of an exposure apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0008] The foreign matter inspection device according to this embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings may be drawn at a scale different from the actual scale in order to facilitate understanding of this embodiment. Furthermore, the following embodiments do not limit the scope of the present invention as defined by the claims.

[0009] [First embodiment] This embodiment relates to a foreign matter inspection apparatus that inspects for foreign matter adhering to a mask or substrate in an exposure apparatus used in manufacturing semiconductor elements, liquid crystal display elements, image pickup elements, and other devices.

[0010] 2. Description of the Related Art Semiconductor elements and liquid crystal display elements are manufactured by a lithography process in which a fine pattern formed on an original such as a mask or reticle is transferred onto a substrate such as a glass substrate. In the exposure apparatus used in the lithography process, if foreign matter such as dust or dirt adheres to the mask, the exposure performance may be reduced, which may result in poor resolution. Therefore, an exposure apparatus equipped with a foreign matter inspection device for inspecting such foreign matter is used.

[0011] For example, there is known a foreign matter inspection device that can detect foreign matter adhering to the device while moving within the device, thereby identifying the position within the device where the foreign matter has adhered. In addition, a foreign matter inspection device is known that can improve the accuracy of detecting foreign matters on an object by switching the foreign matter inspection mode for the object based on foreign matter adhesion information obtained during foreign matter inspection of the object using another foreign matter inspection device.

[0012] Furthermore, in recent years, there has been a trend toward higher definition patterns formed on masks in exposure apparatuses, which has resulted in an increase in the number of patterns that can be transferred onto a substrate. Therefore, the number of layers transferred onto the substrate is also increasing in order to increase the functionality of devices manufactured using the substrate. To form such a large number of layers on a substrate, the same number of masks as the number of layers are required, and therefore the number of times the mask placed on the mask stage in the exposure apparatus needs to be replaced increases.

[0013] Usually, a foreign substance inspection is performed on the mask before the mask is mounted on the mask stage. In this case, while an exposure process is being performed to transfer a predetermined layer onto a substrate, a foreign substance inspection process can be performed in parallel on a mask for transferring the next layer onto the substrate, thereby increasing throughput.

[0014] However, even if the exposure process for transferring a predetermined layer onto a substrate is completed, if the foreign particle inspection process for the mask for transferring the next layer onto the substrate has not been completed, the exposure process must be put on hold until the foreign particle inspection process is completed, which results in a decrease in the throughput, i.e., productivity, of the exposure apparatus. Therefore, an object of this embodiment is to provide a foreign matter inspection apparatus that can improve the throughput of foreign matter inspection of objects.

[0015] FIG. 1 shows a block diagram of an exposure apparatus 1 equipped with a foreign substance inspection apparatus according to the first embodiment.

[0016] The exposure device 1 is configured to sequentially perform an exposure process in which the mask 7 (master, object) is exposed to light so as to transfer the pattern of a liquid crystal display element formed on the mask 7 (master, object) onto the substrate surface of the substrate, which is a rectangular glass plate, while exchanging the mask 7. The exposure apparatus 1 may also be a projection exposure apparatus (stepper) that employs a step-and-repeat method in which a pattern formed on a mask 7 is sequentially transferred to each of a plurality of shot areas on a substrate via a projection optical system. The exposure apparatus 1 may also be a projection scanning exposure apparatus (scanning stepper) that employs a step-and-scan method in which a pattern formed on a mask 7 is sequentially transferred to each of multiple shot areas on a substrate via a projection optical system.

[0017] As shown in FIG. 1, the exposure apparatus 1 includes a personal computer (hereinafter referred to as PC) 20 (controller), a transport device 30 (transporter), a foreign substance inspection device 40, and a communication system 50. The PC 20 is, for example, an industrial PC such as a workstation operated by an operator.

[0018] Specifically, the PC 20 includes a computer 22 having an operating system, and can freely set the transport sequence of the mask 7 by the transport device 30 in an order designated by the operator. Furthermore, the PC 20 can communicate with the transport device 30 and the foreign substance inspection device 40 via a communication system 50, and the transport device 30 carries out the transport process of the mask 7 according to the transport sequence set by the PC 20.

[0019] The PC 20 also includes a storage unit 21, which stores (memorizes) foreign matter inspection result information 211 acquired by the foreign matter inspection device 40, sorting the information by the transport route to the foreign matter inspection device 40 and the type of mask 7. The foreign matter inspection result information 211 here includes, for example, information about foreign matter detected by the foreign matter inspection device 40 when the mask 7 is transported. The PC 20 also includes a calculation unit 23, which calculates foreign matter adhesion information (foreign matter detection information) including the particle diameter (size), number, position, etc. of foreign matters adhering to the mask 7 based on the foreign matter inspection result information 211 stored in the memory unit 21.

[0020] The foreign matter adhesion information may include only information that affects the exposure performance of the exposure apparatus 1. With the above configuration, when a foreign particle adheres to the mask 7, the transport route to the foreign particle inspection device 40 can be identified. The transfer device 30 includes a transfer control unit 31 and a transfer robot 32, and the transfer control unit 31 controls the transfer robot 32 to transfer the mask 7.

[0021] The foreign matter inspection device 40 has a function of inspecting foreign matters on the mask 7, and includes a control unit 41 such as a microcontroller (MCU). The control unit 41 determines whether to perform a foreign substance inspection on the mask 7 using the foreign substance inspection device 40 based on the foreign substance adhesion information calculated by the calculation unit 23 of the PC 20, or whether to switch the foreign substance inspection mode when performing the foreign substance inspection. The foreign matter inspection device 40 also includes a processing unit 42 such as a digital signal processor (DSP), and the processing unit 42 detects foreign matters adhering to the mask 7 using a foreign matter inspection mode set by the control unit 41.

[0022] The communication system 50 is, for example, an industrial communication system that employs an Ethernet communication format. The above-described PC 20, foreign matter inspection device 40, and communication system 50 can form a foreign matter inspection device according to this embodiment, and the foreign matter inspection device according to this embodiment can include a transport device 30.

[0023] FIG. 2 is a schematic perspective view of the foreign matter inspection device 40. As shown in FIG. The foreign matter inspection device 40 includes a light receiving unit 4a, an illumination unit 4b, and a driving unit 4c, and is configured to detect foreign matter adhering to the mask 7 by a processing unit .

[0024] The light receiving unit 4a and the illumination unit 4b are each positioned to face the surface to be inspected of the mask 7, and the illumination light (detection light) emitted from the illumination unit 4b illuminates the surface to be inspected by being incident on the surface along an oblique direction relative to the normal to the surface to be inspected. Light reflected or scattered by foreign matter or scratches present on the surface of the mask 7 to be inspected, or fluorescent light generated therefrom, is incident on the light receiving section 4a and is received.

[0025] It is preferable to use, as the illumination unit 4b, an LED array in which a plurality of LEDs are arranged to emit illumination light having the same wavelength as the exposure light. It is preferable to use an imaging element such as a line sensor as the light receiving section 4a. Furthermore, the light sources of the illumination unit 4b and the image pickup elements of the light receiving unit 4a do not need to be the same number. For example, one light source may be provided in the illumination unit 4b, while multiple image pickup elements may be provided in the light receiving unit 4a.

[0026] The driving unit 4c is configured to move the light receiving unit 4a and the illumination unit 4b in the Y direction at a constant scanning speed, and any driving method can be used, such as driving using a motor or slide driving using a fluid. Furthermore, the driving unit 4c may move the mask 7 in the Y direction at a constant speed for scanning while the light receiving unit 4a and the illumination unit 4b are fixed.

[0027] The light received by the light receiving unit 4a is converted into a voltage value by an imaging element provided within the light receiving unit 4a and output, and the output voltage value is converted into foreign matter information by signal processing by the processing unit 42. For example, when the illumination unit 4b and the light receiving unit 4a are each positioned at a good focal position, it can be determined that the smaller the voltage value input to the processing unit 42, the smaller the particle diameter of the foreign matter, and that the larger the voltage value, the larger the particle diameter.

[0028] The processing unit 42 can then obtain the particle size distribution of the foreign matter from the particle size of each foreign matter determined based on the voltage value output from the light receiving unit 4a. FIG. 3( a ) schematically shows an example of the particle size distribution of foreign matter adhering to the mask 7 , which is acquired by the foreign matter inspection device 40 . Specifically, FIG. 3(a) schematically shows the number of voltage values ​​output from the light receiving unit 4a during foreign matter inspection of the mask 7.

[0029] The processing unit 42 can also generate a particle size distribution of foreign matter adhering to the mask 7 as shown in FIG. 3(b). Specifically, FIG. 3(b) shows the number of voltage values ​​within a predetermined range output at each position on the surface of the mask 7 to be inspected by using different shading.

[0030] That is, FIG. 3(b) shows the inspection result of foreign matter, which is two-dimensionally mapped and obtained by arranging the voltage values ​​output from the light receiving unit 4a corresponding to the particle diameter of the foreign matter in the scanning direction and then dividing the voltage values ​​into predetermined ranges. The inspection results can be classified by shading or the like according to the number of foreign objects detected in each frame in the map. The test results shown in FIG. 3(b) can be displayed on an external display device such as a liquid crystal display provided on the PC 20, for example.

[0031] The control unit 41 also sets the gain when the processing unit 42 converts the voltage value output from the light receiving unit 4a into foreign substance information, the sensitivity of the light receiving unit 4a, the illuminance of the lighting unit 4b, and the drive speed of the drive unit 4c. Here, the gain of the processing unit 42 is a predetermined range of voltage values ​​that is set when slicing the particle size distribution of foreign matter.

[0032] In addition, the light intensity of each LED can be adjusted to reduce unevenness in the light intensity between the multiple LEDs included in the illumination unit 4b, and the sensitivity of each imaging element can be adjusted to reduce unevenness in the sensitivity between the multiple imaging elements included in the light receiving unit 4a. In addition, the illuminance of the illumination unit 4b and the sensitivity of the light receiving unit 4a can be adjusted to set the voltage value output from the light receiving unit 4a to a predetermined value corresponding to the particle diameter of the foreign matter to be detected.

[0033] FIG. 4 shows a schematic diagram of the relationship between the driving speed of the scanning movement of the light receiving unit 4a and the illumination unit 4b by the driving unit 4c in the foreign substance inspection device 40 and the accumulation time (light receiving time) when light is received by the light receiving unit 4a. As shown in FIG. 4, when the resolution in the Y direction for foreign matter detection by the foreign matter inspection device 40 is set to a predetermined value, the drive speed of the drive unit 4c and the accumulation time of the light receiving unit 4a are inversely proportional to each other. The accumulation time of the light receiving section 4a can be reduced by increasing the illuminance of the illuminating section 4b, while it can be increased by decreasing the illuminance of the illuminating section 4b.

[0034] That is, the illuminance of the illumination unit 4b may be determined based on the voltage value output from the light receiving unit 4a that corresponds to the particle diameter of the foreign matter to be detected. Furthermore, it is preferable to determine the resolution in the Y direction for foreign matter detection according to the particle diameter of foreign matter that affects the exposure performance of the exposure apparatus 1, and thereby set the drive speed of the drive unit 4c and the accumulation time of the light receiving unit 4a.

[0035] FIG. 5 is a flowchart showing the transport process of the mask 7 in the exposure apparatus 1. Specifically, FIG. 5 shows a flowchart of a process in which the mask 7 stored in the storage unit in the exposure apparatus 1 is transferred to the mask stage (original stage).

[0036] When the transport process starts, first, the PC 20 controls the transport device 30 to take out the mask 7 stored in a storage unit (not shown) (step S101). The number of storage units may be one or more. Next, the PC 20 performs a foreign substance inspection execution decision process to decide whether to perform a foreign substance inspection on the removed mask 7 (step S102).

[0037] Then, based on the foreign substance inspection decision process performed in step S102, it is determined whether or not to inspect the mask 7 for foreign substances (step S103). If the foreign substance inspection is not performed on the mask 7, in other words, if the foreign substance inspection is omitted (No in step S103), the PC 20 controls the transport device 30 to load the mask 7 onto the mask stage (step S107). Before mounting the mask 7 on the mask stage in step S107, the mask 7 may be placed on one of a plurality of buffer stages to make the mask 7 wait.

[0038] On the other hand, if the mask 7 is to be inspected for foreign matter (Yes in step S103), the PC 20 controls the transport device 30 to transport the mask 7 to the foreign matter inspection device 40. Then, the foreign substance inspection for the mask 7 is carried out in the foreign substance inspection device 40 based on the inspection mode determined in the foreign substance inspection execution determination process in step S102 (step S104). Before the foreign substance inspection is carried out in step S104, the mask 7 may be cleaned using a cleaning device (not shown).

[0039] Next, the PC 20 acquires the foreign substance inspection result information 211 acquired in the foreign substance inspection of the mask 7 in step S104, and stores (memorizes) it in the storage unit 21 (step S105, storage step). Specifically, in step S105, information about the mask 7 on which the foreign substance inspection was performed in step S104, information about the transport route from the storage unit to the foreign substance inspection device 40, and foreign substance inspection result information 211 are accumulated in the cumulative data stored in the memory unit 21.

[0040] Then, the PC 20 determines whether or not to perform cleaning processing on the mask 7 based on the foreign substance inspection result information 211 acquired in step S105 (step S106). Specifically, in step S106, if one or more foreign particles having a particle diameter equal to or larger than a predetermined particle diameter that affects the exposure performance of the exposure tool 1 are detected on the mask 7, it is determined that a cleaning process should be performed on the mask 7.

[0041] If the cleaning process is not to be performed on the mask 7 (No in step S106), the PC 20 controls the transport device 30 to load the mask 7 onto the mask stage (step S107), and the process ends. On the other hand, if cleaning processing is to be performed on the mask 7 (Yes in step S106), the PC 20 controls the transport device 30 to transport the mask 7 to a cleaning device (not shown). Then, the mask 7 is subjected to a cleaning process (step S108), and the process returns to step S104, where the mask 7 is inspected for foreign matter again. By carrying out the transport process of the mask 7 as described above, information on the mask 7 in each transport process, information on the transport route, and foreign substance inspection result information 211 are accumulated in the storage unit 21 of the PC 20.

[0042] 6 shows a sub-flowchart of the foreign substance inspection implementation decision process in step S102 in the mask 7 transport process in the exposure apparatus 1. The foreign substance inspection implementation decision process is executed by the control unit 41 provided in the foreign substance inspection apparatus 40. When the foreign substance inspection implementation decision process starts in step S102, first, the number of times the mask 7 has been transported is obtained from the cumulative data stored in the memory unit 21 of the PC 20, and it is determined whether the obtained number of times of transport is one or more (step S201, first determination step).

[0043] Specifically, in step S201, foreign matter adhesion information (first foreign matter detection information) in a transport process previously performed along the same transport path (predetermined path) as the transport path of the mask 7 in the current transport process is acquired from the cumulative data. Then, the number of times the transport process has been performed in the past on the same transport path is acquired as the number of transports from the acquired foreign matter adhesion information. In other words, in step S201, it is determined whether a transport process has been performed in the past along the same transport path as the transport path of the mask 7 in the transport process.

[0044] If the transport process has not been performed on the same transport route in the past (No in step S201), it is determined that the foreign matter inspection result information 211 on the transport route has not been sufficiently acquired. Therefore, it is decided to carry out foreign substance inspection on the mask 7 in the normal inspection mode (first mode) (step S202), and the foreign substance inspection execution decision process is ended.

[0045] On the other hand, if a transport process has been performed on the same transport route in the past (Yes in step S201), foreign substance inspection result information 211 for each transport process previously performed on the same transport route is obtained from the cumulative data. Then, it is determined from the acquired foreign substance inspection result information 211 whether foreign substance inspection in high-speed inspection mode was performed N times (N is a predetermined number) or more in the transport processes previously performed on the same transport route, or whether omission of foreign substance inspection was selected one or more times (step S203, second determination step).

[0046] If foreign substance inspection in high-speed inspection mode (second mode) has been performed N or more times in the transport processes previously performed on the same transport route, or if omission of foreign substance inspection has been selected one or more times (Yes in step S203), the process proceeds to step S204. In this case, it is determined that there is a sufficiently low risk that foreign matter that affects the exposure performance of the exposure apparatus 1 will adhere to the mask 7 during the transport process. Then, in step S204, it is decided to omit the foreign substance inspection for the mask 7 in the transport process, and the foreign substance inspection execution decision process is terminated.

[0047] On the other hand, if the number of times that foreign substance inspection in high-speed inspection mode was selected in the transport processes previously performed on the same transport route is less than N times, and the number of times that skipping foreign substance inspection was selected is 0 times (No in step S203), proceed to step S205. In other words, in this case, it is determined that in the transport processes previously performed on the same transport route, only foreign substance inspection was performed in normal inspection mode, or that foreign substance inspection in high-speed inspection mode was not performed a sufficient number of times.

[0048] Then, in step S205, it is determined whether or not a foreign particle attached to the mask 7 has been detected on the same transport route from the foreign particle inspection result information 211 for each transport process previously performed on the same transport route (third determination step). The foreign matter judged here is, for example, foreign matter having a particle diameter equal to or larger than a predetermined particle diameter that affects the exposure performance of the exposure apparatus 1.

[0049] If a foreign substance attached to the mask 7 has been detected on the same transport route (Yes in step S205), it is decided to perform a foreign substance inspection on the mask 7 in the normal inspection mode (step S202), and the foreign substance inspection decision process is terminated. On the other hand, if no foreign matter attached to the mask 7 has been detected on the same transport path (No in step S205), it is decided to perform foreign matter inspection on the mask 7 in high-speed inspection mode (step S206), and the foreign matter inspection decision process is terminated.

[0050] As described above, in the foreign substance inspection decision process (first decision step) in step S102, it is decided whether to perform foreign substance inspection on the mask 7 based on foreign substance adhesion information classified according to the route along which the mask 7 is transported. In other words, when the mask 7 is transported along a predetermined transport path, it is determined whether to omit the foreign matter inspection, to perform the foreign matter inspection in the normal inspection mode, or to perform the foreign matter inspection in the high-speed inspection mode based on the foreign matter adhesion information classified for that predetermined transport path (second determination process).

[0051] The normal inspection mode is a mode in which a precise foreign matter inspection (first inspection process) is performed, for example, to detect foreign matters over the entire surface (inspection area) of the mask 7 to be inspected, and to measure the particle diameter and position of the detected foreign matters. On the other hand, the high-speed inspection mode is a mode in which a foreign matter inspection (second inspection step) is performed on the mask 7 using a configuration that allows foreign matter adhering to the mask 7 to be easily detected.

[0052] FIG. 7 is a partially enlarged schematic cross-sectional view showing an example of the configuration of the foreign substance inspection device 40 in the high-speed inspection mode.

[0053] Specifically, consider the case where the amount of foreign matter adhering to the mask 7 that affects the exposure performance of the exposure tool 1 is small. In this case, the control unit 41 sets the accumulation time of the light receiving unit 4a and the illuminance of the illumination unit 4b so that only foreign matter having a particle diameter equal to or larger than a predetermined particle diameter that is required to be detected in the high-speed inspection mode is detected.

[0054] For example, in Figure 7, foreign matter having a predetermined particle size is represented by a black circle of medium size. In other words, in this case, foreign matter represented by the black circle of medium size and foreign matter represented by the large black circle are detected, while foreign matter represented by the small black circle is not detected. This allows the time required for the discrimination process to be reduced by omitting the discrimination process for foreign matter having a particle size smaller than the predetermined particle size, such as the small black dots. In other words, by omitting the determination of the particle diameter of the detected foreign matter, the time required to determine the particle diameter, that is, the time required for the calculation processing by the processing unit 42, can be reduced.

[0055] Furthermore, the foreign matter inspection can be terminated when at least one foreign matter having a particle diameter equal to or larger than a predetermined particle diameter that is required to be detected in the high-speed inspection mode is detected. That is, as shown in FIG. 7, a foreign substance inspection is performed while scanning the inspection surface of the mask 7 downstream in the Y direction, and a foreign substance having a predetermined particle diameter, for example, as shown by a medium-sized black circle, is detected. At this time, the time required for the foreign substance inspection may be reduced by omitting the foreign substance inspection in the uninspected area indicated by the dashed line downstream in the Y direction from the position where the foreign substance was detected.

[0056] Therefore, for masks 7 transported along a transport path with a small amount of foreign matter adhering thereto that affects the exposure performance of the exposure apparatus 1, foreign matter inspection can be performed in high-speed inspection mode, thereby shortening the time required for the foreign matter inspection. By carrying out a foreign substance inspection on the mask 7 in the high-speed inspection mode, the time required for the transport process of transporting the mask 7 to the mask stage can be shortened.

[0057] As described above, in the foreign matter inspection device according to this embodiment, the foreign matter inspection result information 211 acquired in a transport process executed in the past is classified according to the transport route of the transport process, and it is determined whether to perform foreign matter inspection based on the foreign matter adhesion information on the mask 7 on the classified transport route. This allows a decision to be made as to whether to perform foreign substance inspection in high-speed inspection mode on the mask 7 being transported along a specified transport path, or to omit foreign substance inspection, thereby improving the throughput of the transport process in which the mask 7 is transported to the mask stage in the exposure apparatus 1. In other words, the foreign matter inspection device according to this embodiment has a function for calculating and storing foreign matter adhesion information for each transport path of the mask 7, a function for determining whether to switch the foreign matter inspection mode based on the calculated foreign matter adhesion information for each transport path, and a means for performing the switching.

[0058] In the foreign particle inspection apparatus according to this embodiment, when the foreign particle inspection decision process is performed in step S102 during the transport process of the mask 7 in the exposure apparatus 1, the accumulated data of the transport process previously performed in the same exposure apparatus 1 is referenced, but this is not limited to this. That is, in the foreign matter inspection apparatus according to this embodiment, the foreign matter inspection decision process in step S102 may be performed by referring to the accumulated data of transport processes previously performed in another exposure apparatus having the same configuration as the exposure apparatus 1.

[0059] [Second embodiment] Next, a foreign matter inspection device according to a second embodiment will be described. The foreign matter inspection device according to this embodiment has the same configuration as the foreign matter inspection device according to the first embodiment, except for the classification method of the foreign matter inspection result information 211. Therefore, the same components are given the same reference numerals and their descriptions are omitted.

[0060] Specifically, in the foreign matter inspection apparatus according to the first embodiment, the foreign matter inspection result information 211 is classified according to the type of mask 7 and the transport route of the mask 7 from the storage unit to the foreign matter inspection apparatus 40. On the other hand, in the foreign matter inspection device according to this embodiment, the foreign matter inspection result information 211 is classified not only according to the type of mask 7 and the transport route, but also according to the type of storage unit in which the mask 7 was stored and the storage time of the mask 7 in that storage unit.

[0061] Table 1 shows an example of cumulative data of foreign matter inspection result information 211 classified according to the type of storage unit in which the mask 7 stored in the memory unit 21 was stored and the storage time of the mask 7 in that storage unit.

[0062] [Table 1]

[0063] In the foreign matter inspection device according to this embodiment, foreign matter adhesion information including the particle diameter, number, and position of the adhered foreign matter is calculated based on the cumulative data shown in Table 1, depending on the type of mask 7, the transport route to the foreign matter inspection device 40, the type of storage unit, and the storage time in the storage unit. Then, based on the result of the calculation, the transport process of the mask 7 shown in FIGS. 5 and 6 is executed in the same manner as in the foreign matter inspection apparatus according to the first embodiment. That is, for example, in the foreign substance inspection execution determination process in step S102, foreign substance inspection result information 211 of a transport process previously performed using the same transport route, the same storage unit, and the same storage time is extracted from the cumulative data.

[0064] The foreign matter inspection device according to the first embodiment does not identify the amount of foreign matter accumulated by airflow in a predetermined area such as the storage area for the mask 7, or information on the particle diameter of the accumulated foreign matter. On the other hand, in the foreign matter inspection device according to this embodiment, as described above, the foreign matter inspection result information 211 for the mask 7 is classified not only according to the type of mask 7 and the transport route of the mask 7 from the storage unit to the foreign matter inspection device 40, but also according to the type of storage unit and the storage time therein.

[0065] As described above, in the foreign matter inspection device according to this embodiment, the foreign matter inspection result information 211 acquired in a transport process executed in the past is classified according to the transport route of the transport process, the type of storage unit, and the storage time in the storage unit. Then, it is determined whether or not to perform a foreign matter inspection based on the foreign matter adhesion information on the mask 7 during the classified transport route, the type of storage unit, and the storage time in the storage unit.

[0066] This allows a decision to perform foreign matter inspection in high-speed inspection mode or to omit foreign matter inspection for the mask 7 being transported from a specified storage section along a specified transport route, thereby improving the throughput of the transport process for transporting the mask 7 in the exposure apparatus 1. In addition, by calculating foreign matter adhesion information including the particle size, number, and location of foreign matter depending on the type of storage unit and the storage time in the storage unit, it is possible to identify the amount of foreign matter accumulated by airflow in a specified area such as a storage unit, and information on the particle size of the accumulated foreign matter.

[0067] Third Embodiment FIG. 8 shows a block diagram of an exposure system 100 equipped with a foreign substance inspection apparatus according to the third embodiment. Note that this embodiment differs particularly in that in the exposure system 100, the foreign matter inspection apparatus 40' is provided outside the multiple exposure apparatuses 1. The same components as those in the foreign matter inspection apparatus according to the first embodiment are given the same reference numerals, and descriptions thereof will be omitted.

[0068] Specifically, in an exposure system 100 equipped with a foreign matter inspection apparatus according to this embodiment, as shown in FIG. 8, multiple exposure apparatuses 1 are connected to a foreign matter inspection apparatus 40', and the foreign matter inspection apparatus 40' is connected to a storage facility 60 that stores masks 7. It should be noted that a plurality of storage cabinets 60 may be provided outside a plurality of exposure apparatuses 1. The PC 20 provided in each exposure apparatus 1 is configured to communicate with the foreign substance inspection apparatus 40' via a communication system 50 as shown by the dashed line in FIG.

[0069] The foreign substance inspection apparatus 40' is configured to perform foreign substance inspection on the mask 7 that is transported along the transport path shown by the solid line in Figure 8 between the storage facility 60 and the foreign substance inspection apparatus 40' during the transport process of the mask 7 to a specified exposure apparatus 1. The foreign matter inspection result information 211 obtained by the foreign matter inspection by the foreign matter inspection device 40' is transmitted to the PC 20 provided in the specified exposure tool 1 via the communication system 50 and stored in the memory unit 21 within the PC 20.

[0070] Furthermore, the foreign matter inspection device 40 in the specified exposure device 1 performs foreign matter inspection on the mask 7 that is transported along the transport path indicated by the solid line in Figure 8 between the foreign matter inspection device 40' and the foreign matter inspection device 40 during the transport process of the mask 7 to the specified exposure device 1. Foreign matter inspection result information 211 obtained by the foreign matter inspection by foreign matter inspection device 40 is transmitted to PC 20 provided in the predetermined exposure tool 1 and stored in storage unit 21 within PC 20 .

[0071] In this way, the storage unit 21 in the PC 20 provided in the predetermined exposure tool 1 stores foreign matter inspection result information 211 acquired by the foreign matter inspection tool 40′ and the foreign matter inspection tool 40, respectively. In the foreign matter inspection device according to this embodiment, the foreign matter inspection result information 211 acquired by the foreign matter inspection device 40' and the foreign matter inspection device 40 can be compared with each other.

[0072] For example, the difference between the particle size distributions of the foreign matter adhering to the mask 7 shown in Figures 3(a) and (b) is obtained from the foreign matter inspection result information 211 obtained by the foreign matter inspection device 40' and the foreign matter inspection device 40, respectively. Based on the acquired difference, it can be determined whether each foreign particle adhered to the mask 7 on the transport path between the storage facility 60 and the foreign particle inspection device 40', or whether it adhered to the mask 7 on the transport path between the foreign particle inspection device 40' and the foreign particle inspection device 40.

[0073] As described above, in the foreign matter inspection device according to this embodiment, the foreign matter inspection result information 211 acquired in a transport process executed in the past is classified according to the transport route of the transport process, and it is determined whether to perform foreign matter inspection based on the foreign matter adhesion information on the mask 7 on the classified transport route. This allows a decision to be made as to whether to perform foreign substance inspection in high-speed inspection mode on the mask 7 being transported along a specified transport path, or to omit foreign substance inspection, thereby improving the throughput of the transport process in which the mask 7 is transported to the mask stage in the exposure apparatus 1.

[0074] In this embodiment, the exposure system 100 further includes a foreign matter inspection apparatus 40 ′ between the plurality of exposure apparatuses 1 and a storage cabinet 60 that stores the masks 7 . This makes it possible to determine whether each foreign particle adhered to the mask 7 on the transport path between the storage facility 60 and the foreign particle inspection device 40', or on the transport path between the foreign particle inspection device 40' and the foreign particle inspection device 40.

[0075] Although the preferred embodiments have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist thereof.

[0076] [Exposure equipment] FIG. 9 shows a schematic cross-sectional view of the optical configuration used in the exposure process of the exposure apparatus 1.

[0077] The exposure apparatus 1 includes a lamp lighting device 401 (light source), an illumination optical system 402 , a slit 403 , an imaging optical system 404 , a mask stage 405 , a projection optical system 406 , and a substrate stage 407 .

[0078] The lamp lighting device 401 is a light source that emits ultraviolet light, such as a high-pressure mercury lamp. The illumination optical system 402 includes a first bending mirror 501 , a first condenser lens 502 , a fly's-eye lens 503 , a second condenser lens 504 , and a second bending mirror 505 . The mask stage 405 is a mask stage that holds the mask 7 and can be driven in the Y direction shown in FIG.

[0079] The projection optical system 406 is configured to project and transfer a pattern drawn on the mask 7 onto a substrate W coated with a photosensitive agent. The exposure apparatus 1 uses a projection optical system 406 that is an Offner type optical system.

[0080] In the case of an Offner optical system, the mask 7 is illuminated in an arc shape to ensure a good image area. The illumination shape of the exposure light that reaches the substrate W also has an arc shape. The light transmitted through the mask 7 is reflected in this order by the trapezoidal mirror 601, the concave mirror 602, the convex mirror 603, the concave mirror 602, and the trapezoidal mirror 601, and then reaches the substrate W, whereby the pattern on the mask 7 is transferred onto the substrate W.

[0081] The substrate stage 407 is a wafer stage that holds the substrate W, and is driven in the Y direction in synchronization with the mask stage 405 to expose the substrate W. The substrate stage 407 can be driven in the X direction as well as the Y direction, and when exposing a plurality of panels on the substrate W, the substrate stage 407 is driven in both the X and Y directions to perform exposure.

[0082] The exposure light emitted from the lamp lighting device 401 passes through an illumination optical system 402 , a slit 403 and an imaging optical system 404 , and then irradiates the mask 7 placed on a mask stage 405 . The exposure light transmitted through the mask 7 passes through a projection optical system 406 and irradiates a substrate W placed on a substrate stage 407, and an exposure area on the substrate W is exposed. In this way, the image of the pattern of the mask 7 is projected onto the substrate W, and the substrate W is exposed.

[0083] [Production method] Next, a method for manufacturing an article using the exposure apparatus 1 will be described.

[0084] The products manufactured here include semiconductor devices, display devices, color filters, optical components, and MEMS (Micro Electro Mechanical Systems). For example, a semiconductor device is manufactured through a pre-process for creating a circuit pattern on a substrate W, and a post-process including a processing step for completing the circuit chip created in the pre-process as a product.

[0085] The pre-processing includes an exposure process in which the substrate W coated with a photosensitive agent is exposed using the exposure apparatus 1, and a development process in which the photosensitive agent exposed in the exposure process is developed. Then, a circuit pattern is formed on the substrate W by performing an etching process, an ion implantation process, or the like using the developed photosensitive agent pattern as a mask.

[0086] By repeating these steps of exposure, development, etching, etc., a circuit pattern consisting of multiple layers is formed on the substrate W. In the post-process, the substrate W on which the circuit pattern is formed is diced, and chip mounting, bonding and inspection processes are carried out.

[0087] A display device is manufactured through a process of forming a transparent electrode. The process of forming a transparent electrode includes the steps of applying a photosensitive agent to a glass substrate W on which a transparent conductive film has been vapor-deposited, and exposing the substrate W on which the photosensitive agent has been applied using an exposure device 1. The step of forming the transparent electrode also includes a step of developing the exposed photosensitive agent.

[0088] The method for manufacturing an article according to this embodiment is more advantageous than conventional methods in at least one of the performance, quality, productivity, and production costs of the article.

[0089] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) A foreign matter inspection device that inspects foreign matters on an object that is a master or substrate used in an exposure device that projects an image of a master pattern onto a substrate and exposes the substrate, characterized in that the foreign matter inspection device performs a storage step that stores foreign matter detection information regarding foreign matters detected when the object is transported for each path along which the object is transported, and a first decision step that determines whether to carry out an inspection based on the foreign matter detection information stored in the storage step. (Configuration 2) The foreign body inspection device according to Configuration 1, wherein the first decision step includes a second decision step of deciding whether to omit inspection, to perform inspection in the first mode, or to perform inspection in the second mode based on first foreign body detection information classified for the specified route when the object is transported along the specified route, and wherein the second mode has a shorter inspection time than the first mode. (Configuration 3) The foreign matter inspection device according to Configuration 2, wherein the second determination step includes a first determination step of determining whether an object has been transported along a predetermined route in the first foreign matter detection information. (Configuration 4) A foreign body inspection device according to Configuration 3, characterized in that the second determination step includes a step of determining to carry out inspection in the first mode when it is determined in the first judgment step that an object has not been transported along the specified route. (Configuration 5) A foreign body inspection device according to configuration 3 or 4, characterized in that the second determination step includes a second judgment step of, when it is determined in the first judgment step that an object has been transported along a predetermined route, determining whether inspection has been performed in the second mode a predetermined number of times or more in the first foreign body detection information, or whether inspection has been omitted. (Configuration 6) A foreign body inspection device according to Configuration 5, characterized in that the second decision process includes a process of deciding to omit inspection when it is determined in the second judgment process that inspection has been performed in the second mode a predetermined number of times or more, or that inspection has been omitted. (Configuration 7) A foreign matter inspection device according to configuration 5 or 6, characterized in that the second decision step includes a third judgment step of judging whether a specified foreign matter has been detected in the first foreign matter detection information when it is determined in the second judgment step that inspection has not been performed in the second mode a predetermined number of times or more and that inspection has never been omitted. (Configuration 8) The foreign matter inspection device according to Configuration 7, wherein the predetermined foreign matter is a foreign matter larger than a predetermined size. (Configuration 9) A foreign matter inspection device according to configuration 7 or 8, characterized in that the second decision step includes a step of deciding to carry out inspection in the first mode when it is determined in the third judgment step that a specified foreign matter has been detected. (Configuration 10) A foreign matter inspection device according to any one of configurations 7 to 9, characterized in that the second decision step includes a step of deciding to carry out inspection in the second mode when it is determined in the third judgment step that a specified foreign matter has not been detected. (Configuration 11) A foreign matter inspection device according to any one of configurations 2 to 10, characterized in that when it is decided to carry out inspection in the first mode, the foreign matter inspection device performs a first inspection process of detecting foreign matters in the inspection area of ​​the object and measuring the size and position of the detected foreign matters. (Configuration 12) A foreign matter inspection device according to any one of configurations 2 to 11, characterized in that when it is decided to carry out inspection in the second mode, the foreign matter inspection device carries out a second inspection process to detect foreign matters larger than a predetermined size in the inspection area of ​​the object. (Configuration 13) A foreign matter inspection device according to Configuration 12, characterized in that the second inspection process includes a process of scanning the inspection area while inspecting, and omitting inspection of the uninspected area when a foreign matter larger than a predetermined size is detected. (Configuration 14) The foreign matter inspection device according to any one of configurations 1 to 13, wherein the foreign matter detection information is classified according to the type of object. (Configuration 15) A foreign object inspection device according to any one of configurations 1 to 14, characterized in that the object is transported from one of a plurality of storage sections, and the foreign object detection information is classified according to the type of storage section and the storage time of the object in the storage section. (Configuration 16) A foreign body inspection device according to any one of configurations 1 to 15, comprising an illumination unit that illuminates an object with detection light, a light receiving unit that receives light from the object, and a drive unit that moves the illumination unit and the light receiving unit in a scanning motion, wherein the foreign body inspection device performs a step of setting the speed of the scanning motion by the drive unit and the time for which the light receiving unit receives light when performing an inspection. (Configuration 17) An exposure apparatus that projects an image of a pattern on an original onto a substrate and exposes the substrate, comprising: a foreign matter inspection apparatus described in any one of Configurations 1 to 16; an original stage on which the original is placed; at least one storage unit in which the original is stored; a transport unit that transports the original; and a control unit that controls the transport unit. (Configuration 18) An exposure apparatus according to Configuration 17, wherein the foreign matter inspection device performs a step of classifying foreign matter detection information according to the route along which the original is transported between each storage unit and the foreign matter inspection device. (Configuration 19) An exposure apparatus according to Configuration 17 or 18, further comprising a cleaning device for cleaning the original, wherein the control unit, when a foreign substance is detected on the original during inspection by the foreign substance inspection device, causes the transport unit to transport the original to the cleaning device, and performs a process of cleaning the original using the cleaning device. (Method 1) A method for manufacturing an article, comprising the steps of exposing a substrate using the exposure apparatus described in any one of Structures 17 to 19 and developing the exposed substrate, wherein the article is manufactured from the developed substrate. (Configuration 20) An exposure system comprising an exposure apparatus according to any one of configurations 17 to 19, at least one storage facility in which originals are stored, and a foreign matter inspection device arranged on a transport path for the originals between the at least one storage facility and the plurality of exposure apparatuses, wherein the foreign matter inspection device performs a process of classifying foreign matter detection information according to the route on which the originals are transported from the storage facility. (Method 2) A foreign matter inspection method for inspecting foreign matters on an object that is a master or substrate used in an exposure apparatus that projects an image of a master pattern onto a substrate and exposes the substrate, the foreign matter inspection method comprising: a storage step for storing foreign matter detection information regarding foreign matters detected when the object is transported for each path along which the object is transported; and a first determination step for determining whether to carry out an inspection based on the foreign matter detection information stored in the storage step. [Explanation of symbols]

[0090] 1. Exposure equipment 7 Mask (original) 40 Foreign body inspection equipment W substrate

Claims

1. 1. A foreign matter inspection apparatus for inspecting foreign matters on an object, which is an original or a substrate, used in an exposure apparatus that projects an image of a pattern of an original onto a substrate and exposes the substrate, comprising: a storage step of storing foreign object detection information regarding the foreign object detected while the object is being transported for each route along which the object is transported; a first determination step of determining whether to perform the inspection based on the foreign matter detection information stored in the storage step; A foreign matter inspection device characterized by performing the above.

2. the first determination step includes a second determination step of determining, when the object is transported along a predetermined route, whether to omit the inspection, to perform the inspection in a first mode, or to perform the inspection in a second mode, based on first foreign object detection information classified into the predetermined route; 2. The foreign matter inspection apparatus according to claim 1, wherein the second mode has a shorter inspection time than the first mode.

3. 3. The foreign matter inspection device according to claim 2, wherein the second determination step includes a first determination step of determining whether the object has been transported along the predetermined route in the first foreign matter detection information.

4. 4. The foreign body inspection device according to claim 3, wherein the second determination step includes a step of determining to perform the inspection in the first mode when it is determined in the first determination step that the object has not been transported along the predetermined path.

5. 4. The foreign matter inspection device according to claim 3, wherein the second determination step includes a second determination step of determining, when it is determined in the first determination step that the object has been transported along the predetermined route, whether the inspection has been performed in the second mode a predetermined number of times or more in the first foreign matter detection information, or whether the inspection has been omitted.

6. 6. The foreign body inspection device according to claim 5, wherein the second determination step includes a step of determining to omit the inspection when it is determined in the second judgment step that the inspection has been performed in the second mode a predetermined number of times or more, or that the inspection has been omitted.

7. 6. The foreign matter inspection device according to claim 5, wherein the second determination step includes a third determination step of determining whether a specified foreign matter has been detected in the first foreign matter detection information when it is determined in the second determination step that the inspection has not been performed in the second mode a specified number of times or more and that the inspection has never been omitted.

8. 8. The foreign matter inspection apparatus according to claim 7, wherein the predetermined foreign matter is a foreign matter having a size larger than a predetermined size.

9. 8. The foreign matter inspection apparatus according to claim 7, wherein the second determination step includes a step of determining to perform the inspection in the first mode when it is determined in the third determination step that the predetermined foreign matter has been detected.

10. 8. The foreign matter inspection apparatus according to claim 7, wherein the second determination step includes a step of determining to perform the inspection in the second mode when it is determined in the third determination step that the predetermined foreign matter has not been detected.

11. 3. The foreign matter inspection apparatus according to claim 2, wherein, when it is determined that the inspection is to be performed in the first mode, the foreign matter inspection apparatus performs a first inspection process of detecting the foreign matter in the inspection area of ​​the object and measuring the size and position of the detected foreign matter.

12. The foreign matter inspection device according to claim 2, characterized in that, when it is decided to perform the inspection in the second mode, the foreign matter inspection device performs a second inspection process to detect foreign matters larger than a predetermined size in the inspection area of ​​the object.

13. 13. The foreign matter inspection device according to claim 12, wherein the second inspection step includes a step of performing the inspection while scanning the inspection area, and omitting the inspection of an uninspected area when a foreign matter larger than the predetermined size is detected.

14. 2. The foreign matter inspection apparatus according to claim 1, wherein the foreign matter detection information is classified according to the type of the object.

15. the object is being transferred from one of a plurality of storage units; 2. The foreign matter inspection device according to claim 1, wherein the foreign matter detection information is classified according to the type of the storage unit and the storage time of the object in the storage unit.

16. an illumination unit that illuminates the object with detection light; a light receiving unit that receives light from the object; a driving unit that moves the illumination unit and the light receiving unit in a scanning manner; Equipped with 2. The foreign matter inspection apparatus according to claim 1, wherein the foreign matter inspection apparatus performs a step of setting a speed of the scanning movement by the driving unit and a time period for receiving the light by the light receiving unit when performing the inspection.

17. An exposure apparatus that projects an image of a pattern of an original onto a substrate and exposes the substrate, The foreign matter inspection device according to any one of claims 1 to 16, an original stage on which the original is placed; at least one storage unit in which the master is stored; a conveying unit that conveys the master; a control unit that controls the transport unit; An exposure apparatus comprising:

18. 18. The exposure apparatus according to claim 17, wherein the foreign matter inspection device performs a step of classifying the foreign matter detection information according to a route along which the original is transported between each storage unit and the foreign matter inspection device.

19. a cleaning device for cleaning the master; Equipped with 18. The exposure apparatus according to claim 17, wherein, when the foreign matter is detected on the original during the inspection by the foreign matter inspection device, the control unit causes the transport unit to transport the original to the cleaning device, and performs a step of causing the cleaning device to clean the original.

20. exposing a substrate by the exposure apparatus according to claim 17; developing the exposed substrate; Including, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

21. a plurality of exposure apparatuses according to claim 17; at least one repository in which the masters are stored; the foreign substance inspection device disposed on a transport path of the original between the at least one storage cabinet and the plurality of exposure devices; Equipped with an exposure system, wherein the foreign matter inspection device performs a step of classifying the foreign matter detection information according to a route along which the original is transported from the storage facility;

22. 1. A foreign matter inspection method for inspecting foreign matters on an object, which is an original or a substrate used in an exposure apparatus that projects an image of a pattern of an original onto a substrate and exposes the substrate, comprising: a storage step of storing foreign object detection information regarding the foreign object detected while the object is being transported for each route along which the object is transported; a first determination step of determining whether to perform the inspection based on the foreign matter detection information stored in the storage step; 1. A foreign body inspection method comprising:

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