Reflection device, method for manufacturing reflection device, phase shifter, and phased array antenna

Abstract

To provide a reflective device capable of improving responsiveness of a liquid crystal layer.SOLUTION: A reflection device 100 includes: a first conductor layer substrate 10 including a first surface 101 and a first back surface 102 located on an opposite side of the first surface 101; a second conductor layer substrate 20 including a second surface 201 facing the first surface 101 and a second back surface 202 located on an opposite side of the second surface; a plurality of wall parts 42 protruding from the second surface 201 along a normal direction of the second surface 201 and extending in a y direction; a sealing part located on the second surface 201 at least at both ends of the plurality of wall parts; and a liquid crystal layer 30 located between the first surface 101 of the first conductor layer substrate 10 and the second surface 201 of the second conductor layer substrate 20.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] TECHNICAL FIELD The present disclosure relates to a reflector, a method for manufacturing a reflector, a phase shifter, and a phased array antenna. [Background technology]

[0002] In wireless communications, reflectors that reflect radio waves are used. In recent years, development of reflectors that can change the reflection direction of radio waves to any direction has been progressing. In this application, such reflectors are also referred to as reflection devices. The reflection device includes a liquid crystal layer containing a liquid crystal material. When a bias voltage is applied to the liquid crystal layer, the molecular orientation in the liquid crystal layer changes. The reflection direction of radio waves changes depending on the molecular orientation in the liquid crystal layer. The reflection direction of radio waves can be controlled by controlling the bias voltage applied to the liquid crystal layer.

[0003] In wireless communications, a phase shifter that modulates the phase of a signal using a liquid crystal material is also known. Such a phase shifter is used, for example, in a phased array antenna. Patent Document 1 discloses a phase shifter that includes a microstrip line, a ground conductor layer, and a liquid crystal layer. Patent Document 1 also discloses a phased array antenna that includes the phase shifter. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-101511 Summary of the Invention [Problem to be solved by the invention]

[0005] The thickness of the liquid crystal layer used to control radio waves is greater than that of the liquid crystal layer used in displays, etc. The greater the thickness, the slower the response of the liquid crystal layer.

[0006] An object of the embodiments of the present disclosure is to provide a reflecting device and a method for manufacturing a reflecting device that can effectively solve such problems. [Means for solving the problem]

[0007] The embodiments of the present disclosure relate to the following [1] to

[30] . [1] A reflecting device, a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located on the opposite side of the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, A reflection device, wherein the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion.

[0008] [2] In the reflecting device according to [1], The second conductor may be arranged continuously in a region of the second surface where the wall portion is located.

[0009] [3] In the reflecting device according to [1], The second conductor may be arranged as a plurality of discontinuous pattern conductors in the region of the second surface where the wall portion is located.

[0010] [4] In the reflecting device according to [1], The wall portion may include a plurality of 1y wall portions extending in the y direction in a plan view, and a 1y opening portion located between two of the 1y wall portions adjacent to each other in the y direction.

[0011] [5] In the reflecting device according to [2], The plurality of 1y openings aligned in the x direction may be positioned to line up on a straight line in the x direction.

[0012] [6] In the reflecting device according to [2], The plurality of 1y openings aligned in the x direction may be positioned so as not to be aligned on a straight line in the x direction.

[0013] [7] In the reflecting device according to [1], The first y opening may have a width in the y direction of 1.0 μm or more.

[0014] [8] The reflecting device according to [1], A first alignment film may be provided on the surface of the wall portion.

[0015] [9] In the reflecting device according to [1], The liquid crystal display device may further include a third alignment film located on the first surface of the first conductor layer substrate.

[0016]

[10] In the reflecting device according to [2], The second surface of the second conductor layer substrate may include a second alignment film located on a surface of the second conductor.

[0017]

[11] The reflector according to

[10] , On the second surface of the second conductor layer substrate, a portion of the second alignment film may be located between a surface of the second conductor and the plurality of wall portions.

[0018]

[12] In the reflecting device according to [3], The second surface of the second conductor layer substrate may include a second alignment film positioned on the surfaces of the plurality of pattern conductors constituting the second conductor and between adjacent pattern conductors.

[0019]

[13] The reflector according to [1], The first conductor and the second conductor may function as a patch pattern of an antenna used for wireless communication.

[0020]

[14] The reflector according to

[12] , On the second surface of the second conductor layer substrate, a portion of the second alignment film may be located between a surface of the second conductor and the plurality of wall portions.

[0021]

[15] A method for manufacturing a reflection device including a first conductor layer substrate, a second conductor layer substrate, and a liquid crystal layer located between the first conductor layer substrate and the second conductor layer substrate, a forming step of forming a cell structure; a filling step of filling the cell structure with a liquid crystal material, The cell structure comprises: the second conductor layer substrate including a second front surface and a second back surface located opposite the second front surface; a wall portion protruding from the second surface along a normal direction of the second surface and extending in the y direction; and a sealing portion located on the second surface at least at both ends of the plurality of wall portions, the second conductor layer substrate includes a second conductor located on the second surface and a second substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, A method for manufacturing a reflection device, wherein in the filling process, the liquid crystal material is filled into the spaces constituting the multiple cells of the cell structure partitioned by the multiple wall portions, the 1x sealing portion, and the 2x sealing portion.

[0022]

[16] In the method for manufacturing a reflector device according to

[15] , In the filling step, a lid portion is disposed so as to cover the cell and face the second surface of the second conductor layer substrate of the cell structure via the wall portion; The liquid crystal material may be filled into spaces that form a plurality of cells of the cell structure from the y direction.

[0023]

[17] In the method for manufacturing a reflector device according to

[15] , The second conductor may be arranged continuously in a region of the second surface where the wall portion is located.

[0024]

[18] In the method for manufacturing a reflector device according to

[15] , The second conductor may be arranged as a plurality of discontinuous pattern conductors in the region of the second surface where the wall portion is located.

[0025]

[19] In the method for manufacturing a reflector device according to

[15] , The wall portion may include a plurality of 1y wall portions extending in the y direction in a plan view, and a 1y opening portion located between two of the 1y wall portions adjacent to each other in the y direction.

[0026]

[20] In the method for manufacturing a reflector device according to

[15] , The lid portion may be the first conductor layer substrate including the first front surface and a first back surface located opposite the first front surface.

[0027]

[21] In the method for manufacturing a reflector device according to

[15] , In the filling step, the liquid crystal material may be filled into spaces that form a plurality of cells of the cell structure from a direction normal to the second surface of the second conductor layer substrate.

[0028]

[22] In the method for manufacturing a reflector device according to

[15] , The method may further include a degassing step for removing voids between the liquid crystal material filled in the cell structure and the wall portion.

[0029]

[23] In the method for manufacturing a reflector device according to

[15] , The method may further include a step of forming a first alignment film on the surface of the wall portion of the cell structure.

[0030]

[24] In the method for manufacturing a reflector device according to

[15] , The method may further include a step of forming a second alignment film located on the surface of the second conductor on the second surface of the second conductor layer substrate.

[0031]

[25] In the method for manufacturing a reflector device according to

[24] , On the second surface of the second conductor layer substrate, a portion of the second alignment film may be located between a surface of the second conductor and the plurality of wall portions.

[0032]

[26] A method for manufacturing a reflector device according to

[15] , The method may include a step of forming a second alignment film on the second surface of the second conductor layer substrate, the second alignment film being positioned on the surfaces of the plurality of pattern conductors constituting the second conductor and between adjacent pattern conductors.

[0033]

[27] In the method for manufacturing a reflector device according to

[26] , On the second surface of the second conductor layer substrate, a portion of the second alignment film may be located between a surface of the second conductor and the plurality of wall portions.

[0034]

[28] A phase shifter for use in wireless communication, comprising: The phase shifter a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located on the opposite side of the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion; Phase shifter.

[0035]

[29] The phase shifter according to

[28] , The first conductor and the second conductor may function as a patch pattern of an antenna.

[0036]

[30] A phased array antenna for use in wireless communications, the phased array antenna has a phase shifter; The phase shifter a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located on the opposite side of the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion; Phased array antenna. [Effects of the Invention]

[0037] According to an embodiment of the present disclosure, the response of the liquid crystal layer can be improved. [Brief explanation of the drawings]

[0038] [Figure 1] FIG. 2 is a vertical cross-sectional view showing an example of a reflecting device. [Figure 2] FIG. 1 is a perspective view showing an example of a wall structure. [Figure 3] FIG. 10 is a perspective view showing an example of a wall structure arranged on a second conductor layer substrate. [Figure 4] FIG. 2 is a perspective view illustrating a cell structure, focusing on a wall portion and a sealing portion. [Figure 5] FIG. 2 is a perspective view showing an example of a cell structure. [Figure 6] FIG. 2 is a top view showing an example of a cell structure. [Figure 7] 10A and 10B are diagrams showing an assembly step of assembling a first conductor layer substrate to a cell structure. [Figure 8] FIG. 10 is a top view showing an example of a configuration focusing on cells in a wall portion of a wall structure. [Figure 9A] FIG. 2 is a vertical cross-sectional view showing an example of a wall portion. [Figure 9B] FIG. 2 is a vertical cross-sectional view showing an example of a wall portion. [Figure 9C] FIG. 2 is a vertical cross-sectional view showing an example of a wall portion. [Figure 10] FIG. 10 is a diagram illustrating a method for measuring the dimensions of a wall portion. [Figure 11] FIG. 4 is a vertical cross-sectional view showing a step of forming a first resin layer. [Figure 12] FIG. 4 is a vertical cross-sectional view showing a step of forming a second resin layer. [Figure 13] FIG. 10 is a vertical cross-sectional view showing a step of exposing a resin layer to light. [Figure 14] FIG. 10 is a longitudinal cross-sectional view showing an example of a wall portion of a manufactured cell structure. [Figure 15] FIG. 10 is a vertical cross-sectional view showing another example of a manufactured cell structure. [Figure 16] 10A to 10C are vertical cross-sectional views showing a step of forming an alignment film. [Figure 17] 10A to 10C are longitudinal cross-sectional views showing a step of filling a liquid crystal material into a cell structure. [Figure 18] 10A to 10C are longitudinal cross-sectional views showing a step of filling a liquid crystal material into a cell structure. [Figure 19] FIG. 10 is a perspective view showing an example of a wall structure according to a first modified example. [Figure 20] FIG. 10 is a top view showing an example of a configuration focusing on cells in a wall portion of a wall structure according to a first modified example. [Figure 21] FIG. 10 is a vertical cross-sectional view showing a step of forming a first resin layer in a second modified example. [Figure 22] FIG. 10 is a vertical cross-sectional view showing a step of forming a second resin layer in a second modified example. [Figure 23]10A to 10C are vertical cross-sectional views showing an example of a manufacturing process for a cell structure according to a third modified example. [Figure 24] 10A to 10C are vertical cross-sectional views showing an example of a manufacturing process for a cell structure according to a third modified example. [Figure 25] 10A and 10B are vertical cross-sectional views showing another example of the manufacturing process of the cell structure according to the third modified example. [Figure 26] FIG. 10 is a vertical cross-sectional view showing an example of the configuration of a first conductor layer substrate according to a fourth modified example. [Figure 27] FIG. 13 is a top view showing an example of the configuration of a wall portion of a wall structure according to a sixth modified example. [Figure 28] FIG. 13 is a longitudinal sectional view showing an example of the configuration of a phase shifter according to a seventh modified example. [Figure 29] FIG. 13 is a schematic diagram showing an example of a schematic configuration of a phased array antenna according to an eighth modified example. DETAILED DESCRIPTION OF THE INVENTION

[0039] In this specification and drawings, unless otherwise specified, terms that refer to a material that forms the basis of a certain configuration, such as "substrate," "base material," "plate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

[0040] In this specification and drawings, unless otherwise specified, terms that specify shapes, geometric conditions, and their degrees, such as "parallel" and "orthogonal," and values ​​of lengths and angles, are not bound by strict meanings, but are interpreted to include a range within which similar functions can be expected.

[0041] In this specification and drawings, unless otherwise specified, when a certain component, such as a certain region, is referred to as "above" or "below," "upper" or "lower," or "upward" or "below" another component, such as another region, this includes cases where the component is in direct contact with the other component. It also includes cases where another component is contained between the component and the other component, i.e., cases where the components are in indirect contact. Furthermore, unless otherwise specified, the terms "above," "upper side," or "upper," or "under," "lower side," or "lower" may be used in the up-down direction.

[0042] In this specification and drawings, unless otherwise specified, the same or similar symbols are used to designate the same parts or parts having similar functions, and repeated explanations may be omitted. Furthermore, for the sake of convenience, the dimensional ratios of the drawings may differ from the actual ratios, and some components may be omitted from the drawings.

[0043] Unless otherwise specified in this specification and drawings, the present invention may be combined with other embodiments and modifications as long as no contradictions arise. Furthermore, other embodiments may be combined with each other, or other embodiments may be combined with modifications as long as no contradictions arise. Furthermore, modifications may be combined with each other as long as no contradictions arise.

[0044] Unless otherwise specified, in this specification and drawings, when a plurality of steps are disclosed in a method such as a manufacturing method, other steps that are not disclosed may be performed between the disclosed steps. In addition, the order of the disclosed steps is arbitrary within the range that does not cause contradictions.

[0045] In this specification, when multiple upper limit candidates and multiple lower limit candidate values ​​are listed for a certain parameter, the numerical range of the parameter may be constructed by combining any one upper limit candidate with any one lower limit candidate. For example, consider a description that reads, "Parameter B is, for example, A1 or more, or may be A2 or more, or may be A3 or more. Parameter B is, for example, A4 or less, or may be A5 or less, or may be A6 or less." In this case, the numerical range of parameter B may be A1 or more and A4 or less, A1 or more and A5 or less, A1 or more and A6 or less, A2 or more and A4 or less, A2 or more and A5 or less, A2 or more and A6 or less, A3 or more and A4 or less, A3 or more and A5 or less, or A3 or more and A6 or less.

[0046] An embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is an example of an embodiment of the present disclosure, and the present disclosure should not be interpreted as being limited to only these embodiments.

[0047] In recent years, high-frequency radio waves such as microwaves, millimeter waves, and submillimeter waves have begun to be used in a variety of fields. Microwaves are radio waves in the frequency band of approximately 0.3 GHz to 30 GHz. Millimeter waves are radio waves in the frequency band of approximately 30 GHz to 300 GHz. Submillimeter waves are radio waves in the frequency band of approximately 300 GHz to 3 THz. Examples of fields in which they are used include 5th generation mobile communication systems, mobile and automotive communication systems, radar for collision prevention systems, and medical biosensing.

[0048] The higher the frequency of radio waves, the more directional they tend to travel. Therefore, the higher the frequency of radio waves, the greater the area where radio waves from base stations cannot reach directly. One way to solve this problem is to increase the number of base stations or relay stations. However, this raises issues regarding installation costs and securing installation locations.

[0049] By using a reflector, it is possible to make the radio waves reflected by the reflector reach areas where the radio waves from the base station cannot reach directly. In particular, a reflecting device equipped with a liquid crystal layer can control the direction in which the radio waves are reflected. By using a reflecting device, it is possible to flexibly change the area in which the radio waves reach. Such a reflecting device is also called an IRS (Intelligent Reflecting Surface).

[0050] 1 is a longitudinal cross-sectional view showing an example of a reflection device 100. The reflection device 100 includes a first conductor layer substrate 10, a second conductor layer substrate 20, and a liquid crystal layer 30. Reference symbol E1 represents a radio wave that has reached the first conductor layer substrate 10. Reference symbol E2 represents a radio wave that has been reflected by the first conductor layer substrate 10.

[0051] The first conductor layer substrate 10 includes a first front surface 101 and a first back surface 102, a plurality of first conductors 12 located on the first surface 101, and a first support substrate 11 that supports the plurality of first conductors 12. The first back surface 102 is located on the opposite side of the first front surface 101. The first back surface 102 may be formed by the first support substrate 11.

[0052] The second conductor layer substrate 20 includes a second front surface 201 and a second rear surface 202, second conductors 22 located on the second surface 201, and a second support substrate 21 that supports the second conductors 22. The second surface 201 faces the first surface 101 of the first conductor layer substrate 10 in the z direction Dz. The z direction Dz is the thickness direction of the reflection device 100. The second rear surface 202 is located on the opposite side of the second front surface 201. The second rear surface 202 may be formed by the second support substrate 21.

[0053] The liquid crystal layer 30 is located between the first surface 101 of the first conductor layer substrate 10 and the second surface 201 of the second conductor layer substrate 20. The first conductors 12 of the first conductor layer substrate 10 and the second conductors 22 of the second conductor layer substrate 20 face each other in the z direction Dz, sandwiching the liquid crystal layer 30 therebetween. One second conductor 22 may face multiple first conductors 12. The second conductor 22 may be a common electrode. A common voltage is applied to the common electrode, and the potential of the common electrode is fixed. The common voltage is, for example, 0 V.

[0054] When the voltage applied to the first conductor 12 changes, the orientation of the liquid crystal material contained in the liquid crystal layer 30 changes. When the orientation of the liquid crystal material changes, the dielectric constant of the liquid crystal layer changes. As a result, the effective dielectric constant of the portion near the first conductor 12 changes.

[0055] The voltages of the multiple first conductors 12 can be controlled independently. By controlling the voltages of the multiple first conductors 12, the phase of the reflected radio waves E2 can be controlled according to the position in the surface direction of the first conductor layer substrate 10. By changing the phase of the radio waves E2 according to the position in the surface direction of the first conductor layer substrate 10, the radiation pattern of the radio waves E2 reflected by the reflecting device 100 can be controlled. This makes it possible to control the direction of the radio waves E2.

[0056] The first support substrate 11 and the second support substrate 21 are made of an insulating material. The first support substrate 11 and the second support substrate 21 may be transparent or opaque to visible light. The first support substrate 11 and the second support substrate 21 include, for example, glass or alkali-free glass. The first support substrate 11 and the second support substrate 21 may be flexible. For example, the first support substrate 11 and the second support substrate 21 may include a resin film. Examples of materials for the resin film include polyethylene terephthalate (PET), polycarbonate, fluororesin, liquid crystal polymer (LCP), polyimide (PI), and cycloolefin polymer (COP).

[0057] The first conductors 12 and the second conductors 22 are made of a conductive material. The first conductors 12 and the second conductors 22 may contain a metal. The metal is, for example, copper, gold, silver, aluminum, titanium, nickel, chromium, or an alloy thereof. The first conductors 12 and the second conductors 22 may contain a conductive oxide. The conductive oxide is, for example, ITO (indium tin oxide), IZO (indium zinc oxide), or the like.

[0058] The first conductor 12 and the second conductor 22 function as conductors for applying a predetermined voltage. However, as will be described later, the first conductor 12 and the second conductor 22 may act on radio waves and function as a patch pattern of an antenna used in wireless communication.

[0059] The liquid crystal layer 30 is disposed in a space partitioned by a wall portion 42 between the first conductor layer substrate 10 and the second conductor layer substrate 20. The liquid crystal layer 30 contains a liquid crystal material. The liquid crystal material is, for example, a nematic liquid crystal. Examples of the nematic liquid crystal include a cyano-based liquid crystal, a fluorine-based liquid crystal, a biphenyl-based liquid crystal, a terphenyl-based liquid crystal, and a tolan-based liquid crystal. The liquid crystal material may be a liquid crystal with positive dielectric anisotropy, so-called Np liquid crystal.

[0060] The thickness T1 of the liquid crystal layer 30 is, for example, 10 μm or more, and may be 20 μm or more, 30 μm or more, or 50 μm or more. Increasing the thickness T1 of the liquid crystal layer 30 can improve the phase modulation function of the liquid crystal layer 30. The thickness T1 of the liquid crystal layer 30 is, for example, 500 μm or less, and may be 200 μm or less, or 100 μm or less.

[0061] The reflection device 100 may include an alignment film 90. The alignment film 90 has a regulating force for aligning the liquid crystal material of the liquid crystal layer 30 in a certain direction. The alignment film 90 may be located on the surface of the wall portion 42, as shown in FIG. 1 . For example, the alignment film 90 may be located on the wall surface 41. For example, the alignment film 90 may be located on the surface of the wall portion 42 facing the first surface 101. The alignment film 90 may be in contact with the liquid crystal layer 30.

[0062] The alignment film 90 may be a polymer film that has been subjected to a rubbing treatment. The polymer film is, for example, a polyimide film. The alignment film 90 may be a photo-alignment film. The photo-alignment film is obtained by aligning the molecules of a polymer surface by irradiating it with ultraviolet light. The alignment film 90 may also be an obliquely evaporated film. The obliquely evaporated film is, for example, SiO x The thickness T2 of the alignment film 90 is, for example, 0.02 μm or more, or may be 0.05 μm or more, or may be 0.08 μm or more. The thickness T2 of the alignment film 90 is, for example, 1.00 μm or less, or may be 0.50 μm or less, or may be 0.20 μm or less.

[0063] The greater the thickness T1 of the liquid crystal layer 30, the smaller the influence of the regulating force from the alignment film 90 on the liquid crystal layer 30. Therefore, the greater the thickness T1 of the liquid crystal layer 30, the slower the responsiveness of the alignment of the liquid crystal material. This decrease in responsiveness is particularly noticeable when the bias voltage applied to the liquid crystal layer 30 is stopped. This is because the speed at which the alignment of the liquid crystal material changes when the bias voltage is stopped depends on elastic relaxation. For example, a conventional reflector requires between 1 and 30 seconds for the alignment to change when the bias voltage is stopped.

[0064] In consideration of this problem, this embodiment proposes that the reflecting device 100 includes a wall structure 40, as shown in Fig. 1. The wall structure 40 is located between the first surface 101 of the first conductor layer substrate 10 and the second surface 201 of the second conductor layer substrate 20. The wall structure 40 divides the liquid crystal layer 30 in a plan view. The plan view means that an object is viewed along the normal direction of the first surface 101 of the first conductor layer substrate 10.

[0065] 1, the wall structure 40 includes a plurality of wall portions 42 aligned along the plane direction of the first surface 101. The wall portions 42 include wall surfaces 41 facing the liquid crystal material of the liquid crystal layer 30. The wall surfaces 41 generate an alignment control force, which makes it easier to determine the alignment direction of the liquid crystal material. Therefore, even if the thickness T1 of the liquid crystal layer 30 is large, the responsiveness of the liquid crystal layer 30 can be ensured.

[0066] FIG. 2 is a perspective view showing an example of a wall structure 40. FIG. 3 is a perspective view showing an example of a wall structure arranged on a second conductor layer substrate. Note that the number of the wall portions 46 shown in FIGS. 2 and 3 is different from the number of the wall portions 46 shown in FIG. 1, but the configuration of the wall portions 46 shown in FIGS. 2 and 3 is simply shown for convenience, and is not intended to be a different concept. Also, the liquid crystal layer 30 is not shown in FIGS. 2 and 3. As shown in FIGS. 2 and 3 , the multiple walls 42 include multiple walls 46 extending in the y-direction Dy and aligned in the x-direction Dx. Both the x-direction Dx and the y-direction Dy are parallel to the plane direction of the first surface 101. The y-direction Dy is a direction intersecting the x-direction Dx. The angle formed between the x-direction Dx and the y-direction Dy is, for example, 60° or more, or may be 70° or more, or may be 80° or more. The angle formed between the x-direction Dx and the y-direction Dy is, for example, 120° or less, or may be 110° or less, or may be 100° or less. The angle formed between the x-direction Dx and the y-direction Dy may be 90°. That is, the y-direction Dy may be a direction perpendicular to the x-direction Dx.

[0067] Here, Fig. 4 is a perspective view of the cell structure, focusing on the wall portion and the sealing portion. Fig. 5 is a perspective view showing an example of the cell structure. Fig. 6 is a top view showing an example of the cell structure. Note that the liquid crystal layer 30 is not shown in Figs. 4 to 6. 4 to 6, the reflecting device 100 includes a sealing portion F. The sealing portion F is located at least on both ends 46y1, 46y2 of the multiple wall portions 46 on the second surface 201 of the second conductor layer substrate 20, as shown in FIGS.

[0068] As shown in FIGS. 4 to 6, the sealing portion F includes a 1x-th sealing portion Fx1, a 2x-th sealing portion Fx2, a 1y-th sealing portion Fy1, and a 2y-th sealing portion Fy2. The 1x sealing portion Fx1 extends in the x direction Dx in plan view and abuts against first ends 46y1 in the y direction Dy of the multiple wall portions 46. The 2x sealing portion Fx2 extends in the x direction Dx in plan view and abuts against second ends 46y2 in the y direction of the multiple wall portions 46. The 1y sealing portion Fy1 is located between one end of the 1x sealing portion Fx1 and one end of the 2x sealing portion Fx2. The 2y sealing portion Fy2 is located between the other end of the 1x sealing portion Fx1 and the other end of the 2x sealing portion Fx2.

[0069] The liquid crystal layer 30 as shown in FIG. 1 is located in a space formed by a plurality of cells 43 partitioned by the plurality of wall portions 46, the 1x sealing portion Fx1, and the 2x sealing portion Fx2.

[0070] 1, the second conductors 22 of the second conductor layer substrate 20, which are not shown in FIGS. 5 and 6, are continuously arranged in the region where the plurality of wall portions 46 are located on the second surface 201 of the second conductor layer substrate 20. However, the second conductors 22 may be arranged as a plurality of discontinuous pattern conductors in the region where the plurality of wall portions 46 are located on the second surface 201 of the second conductor layer substrate 20.

[0071] 4 and 5, for example, a wall portion 42 including a plurality of wall portions 46, a first x sealing portion Fx1, and a second x sealing portion Fx2 define a plurality of spaces. The spaces defined by the wall portions 42 are also referred to as cells 43. The plurality of cells 43 are aligned in the x-direction Dx. The liquid crystal material of the liquid crystal layer 30 is located in each of the plurality of cells 43. The liquid crystal layer 30 located in the cell 43 is also referred to as an individual liquid crystal layer. By dividing the liquid crystal layer 30 into a plurality of individual liquid crystal layers by the wall structure 40, the responsiveness of the liquid crystal material is improved.

[0072] By employing the wall structure 40 shown in FIG. 2, it is possible to inject liquid crystal material, for example, through an opening (not shown) in the first sealing portion Fx1 in a cell structure K including multiple cells 43 shown in FIGS. 4 to 6, as described below. In the cell structure K, the liquid crystal material can move in the y direction Dy along each wall portion 46 from the position of the first sealing portion Fx1 to the position of the second sealing portion Fx2, making it possible to employ a method of filling the liquid crystal material using capillary action. Note that in the cell structure K shown in FIGS. 4 to 6, the liquid crystal material may be dripped onto the cell structure K from above to fill each cell 43 with the liquid crystal material. After the liquid crystal material is filled into each cell 43 in this manner, a degassing process is performed.

[0073] As described above, in this embodiment, it is proposed to configure a wall structure 40 located on the second conductor layer substrate 20, which is filled with liquid crystal material and allows the liquid crystal material to move between two adjacent cells 43. Note that the structure including the second conductor layer substrate 20 and the wall portion 42 located on the second conductor layer substrate 20 is also referred to as a cell structure.

[0074] Here, the cell structure K will be described.

[0075] 4 to 6 , the cell structure K includes a second conductor layer substrate 20 and a wall portion 42 protruding from the second surface 201 of the second conductor layer substrate 20 in a direction normal to the second surface 201. The wall portion 42 may or may not overlap the second conductor 22 of the second conductor layer substrate 20. The wall portion 42 may include a portion that overlaps the second conductor 22 and a portion that does not overlap the second conductor 22. In this case, the surface of the wall portion 42 facing the second surface 201 may include a step due to the thickness of the second conductor 22.

[0076] The wall 46 has a height H2y and a width W2y. The height H2y is the distance in the z-direction Dz from the second surface 201 to the tip of the wall 46. The width W2y is the dimension of the wall 46 in the x-direction Dx.

[0077] 7 is a diagram showing a process of combining the first conductor layer substrate 10 with the cell structure K. In the combining process, before filling the liquid crystal material in the filling process, the first conductor layer substrate 10 is positioned so as to face the second surface 201 of the second conductor layer substrate 20 of the cell structure K via the wall portion 42 and cover the cell 43.

[0078] 8 is a top view showing an example of a configuration focusing on a cell 43 of a wall portion 42 of the wall structure 40. The liquid crystal layer 30 is omitted from FIG. 8. In a plan view, the multiple wall portions 46 may be aligned in the x-direction Dx at an interval Sx. In a plan view, one cell 43 is surrounded by a first x-sealing portion Fx1 and a second x-sealing portion Fx2 that face each other in the y-direction Dy, and two wall portions 46 that are adjacent to each other in the x-direction Dx.

[0079] The liquid crystal layer 30 shown in FIG. 1 is located in a space formed by the plurality of cells 43 partitioned by the first x sealing portion Fx1, the second x sealing portion Fx2, and the plurality of wall portions .

[0080] The aforementioned interval Sx is, for example, 20 μm or more, may be 50 μm or more, or may be 100 μm or more. The interval Sx is, for example, 1000 μm or less, may be 500 μm or less, or may be 250 μm or less.

[0081] Here, the width W2y of the wall portion 46 described above is measured at the position where the width of the wall portion 46 is greatest. Examples of the shape of the wall portion 46 in Fig. 8 will be described with reference to Figs. 9A to 9C.

[0082] 9A is a longitudinal cross-sectional view showing an example of the shape of wall portion 46 when viewed along line AA in the x direction Dx in FIG. 8. As shown in FIG. 9A, wall portion 46 may include a portion whose width decreases from second surface 201 toward tip 2. Wall portion 46 may have a maximum width at second surface 201. In this case, the width of wall portion 46 at second surface 201 is measured as width W2y.

[0083] 9B is a longitudinal cross-sectional view showing an example of the shape of wall portion 46 when viewed along line AA in the x direction Dx in FIG. 8. As shown in FIG. 9B, wall portion 46 may include a portion whose width increases from second surface 201 toward tip 2. Wall portion 46 may have a maximum width at tip 2. In this case, the width of wall portion 46 at tip 2 is measured as width W2y.

[0084] 9C is a longitudinal cross-sectional view showing an example of the shape of wall portion 46 when viewed along line AA in the x direction Dx in FIG. 9. As shown in FIG. 9C, wall portion 46 may include a portion whose width increases from second surface 201 toward tip 2 and a portion whose width decreases from second surface 201 toward second tip 2. In this case, wall portion 46 has a maximum width at a position different from second surface 201 and different from tip 2. For example, the maximum width is at a position where distance Hw from second surface 201 in z direction Dz is equal to or greater than 0.4×H2y and equal to or less than 0.6×H2y. In this case, the maximum width is measured as width W2y.

[0085] The measurement position of the height H1y is determined based on the measurement position of the width W2y. Specifically, the height H2y is measured at the center in the width direction at the measurement position of the width W2y.

[0086] The width W2y is, for example, 1.0 μm or more, and may be 3.0 μm or more, or 5.0 μm or more. The width W2y is, for example, 100 μm or less, and may be 50 μm or less, or 25 μm or less.

[0087] As will be described later, the liquid crystal material is filled into the cell structure K. During the filling process, the wall portions 46 are subjected to pressure from the flowing liquid crystal material. The wall portions 46 are also subjected to force from the alignment film 90. The larger the width W2y, the more the wall portions 46 are prevented from being deformed by these forces. On the other hand, the smaller the width W2y, the more the amount of liquid crystal material filled into the cell structure K increases. By adjusting the width W2y, the amount of liquid crystal material in the liquid crystal layer 30 provided in the reflection device 100 can be maintained at an appropriate level.

[0088] The wall portion 46 has a predetermined aspect ratio. This aspect ratio is the ratio of the height H2y of the wall portion 46 to the width W2y of the wall portion 46. The aspect ratio is, for example, 1.0 or more, or may be 2.0 or more, or 3.0 or more. The second aspect ratio is, for example, 10.0 or less, or may be 8.0 or less, or 5.0 or less.

[0089] The calculation method for values ​​such as width W2y and height H2y will be described below. These values ​​are calculated by averaging the measured values ​​in nine areas, as shown in FIG. 10. For example, width W2y is calculated by averaging the measured values ​​of width W2y in the first area A1 to the ninth area A9. The first area A1 to the ninth area A9 are obtained by virtually dividing the wall structure 40 into thirds in the x-direction Dx and the y-direction Dy. Measurements in each area are taken at the portion closest to the center point C of each area. For example, in the first area A1, width W2y is taken at the portion of the wall portion 46 closest to the center point C.

[0090] Measurements of width W2y, height H2y, etc. are performed based on cross-sectional images obtained by an electron microscope.

[0091] As shown in FIGS. 9A to 9C, the reflecting device 100 may include an alignment film 90 located on the surface of the wall portion 46 of the cell structure K. The alignment film 90 may be located on the side surface of the wall portion 46. The alignment film 90 may be located at the tip 2 of the wall portion 46. The alignment film 90 may be a vertical alignment film.

[0092] Next, we will explain one example of a method for manufacturing the reflection device 100. The method for manufacturing the reflection device 100 includes at least a step of preparing a cell structure K including the second conductor layer substrate 20, and a filling step of filling the cell structure K with a liquid crystal material.

[0093] Here, an example of a manufacturing method for the cell structure K will be described. The cell structure K is obtained by forming wall portions 42 on the second surface 201 of the second conductor layer substrate 20 including the second support substrate 21 and the second conductors 22. Figures 11 to 15 are diagrams for explaining an example of a wall portion forming step for forming the wall portions 42.

[0094] 11 , in the wall portion forming step, a first resin layer 71 may be formed on the second surface 201. The first resin layer 71 may be transferred from a first dry film 70 to the second surface 201, for example. The first dry film 70 includes the first resin layer 71 and a first cover 72 and a first support 73 positioned to sandwich the first resin layer 71. The step of transferring the first resin layer 71 to the second surface 201 includes, for example, a step of peeling the first cover 72 from the first resin layer 71, a step of attaching the first resin layer 71 to the first surface 101, and a step of peeling the first support 73 from the first resin layer 71. 11 , in the bonding step, the first resin layer 71 and the first support 73 may be pressed toward the first surface 101 with a first pressure P1. This prevents a gap from being generated between the first resin layer 71 and the first surface 101.

[0095] 12 , a second resin layer 76 may be formed on the first resin layer 71. The second resin layer 76 may be transferred onto the first resin layer 71 from a second dry film 75, for example. The second dry film 75 includes the second resin layer 76 and a second cover 77 and a second support 78 positioned to sandwich the second resin layer 76. The step of transferring the second resin layer 76 to the first resin layer 71 includes, for example, a step of peeling the second cover 77 from the second resin layer 76, a step of attaching the second resin layer 76 to the first resin layer 71, and a step of peeling the second support 78 from the second resin layer 76. 12, in the bonding step, the second resin layer 76 and the second support 78 may be pressed toward the first resin layer 71 with a second pressure P2. This prevents a gap from being formed between the second resin layer 76 and the first resin layer 71. The second pressure P2 may be greater than the first pressure P1.

[0096] The first resin layer 71 and the second resin layer 76 may contain a photosensitive resin such as a photocurable resin. For example, the first resin layer 71 and the second resin layer 76 may contain an acrylic resin.

[0097] When the first resin layer 71 and the second resin layer 76 contain photosensitive resin, an exposure step is carried out in which the first resin layer 71 and the second resin layer 76 are exposed to light using an exposure mask 80, as shown in FIG. 13 . The exposure mask 80 includes a base material 81 and a light-shielding layer 82. The light-shielding layer 82 is made of a material that does not transmit light. For example, the light-shielding layer 82 includes a metal. Gaps in the light-shielding layer 82 form transmission regions 83. Light that has passed through the transmission regions 83 is irradiated onto the second resin layer 76 and the first resin layer 71.

[0098] After the exposure step, a development step is performed to develop the first resin layer 71 and the second resin layer 76. After the development step, a baking step may be performed to heat the first resin layer 71 and the second resin layer 76. FIG. 14 is a vertical cross-sectional view showing an example of a wall portion 46 of a manufactured cell structure K. The wall portion 46 of the wall portion 42 includes a first resin layer 71 located on the second surface 201 and a second resin layer 76 located on the first resin layer 71. The wall portion 46 includes two resin layers, thereby increasing the aspect ratio of the wall portion 46. Although not shown, the wall portion 46 may include three or more resin layers.

[0099] FIG. 15 is a longitudinal cross-sectional view showing another example of a manufactured cell structure K. Note that the example of FIG. 15 shows a cross-section of wall portion 46 of wall portion 42. As shown in FIG. 15, cell structure K may include a water-repellent layer 92 located on second surface 201. Water-repellent layer 92 is a layer configured to repel a solution containing a solvent and the material that constitutes alignment film 90. Water-repellent layer 92 may be formed on second surface 201 before wall portion 42 is formed on second surface 201. Water-repellent layer 92 is formed, for example, by performing a water-repellent treatment on second surface 201.

[0100] After the wall portions 42 are formed, a step of forming the alignment film 90 may be carried out. For example, a solution containing a material and a solvent that constitutes the alignment film 90 is applied to the surfaces of the plurality of wall portions 46 of the wall portions 42. Then, the wall portions 46 to which the solution has been applied are heated. As a result, the alignment film 90 is formed on the surfaces of the plurality of wall portions 46.

[0101] Fig. 16 is a longitudinal cross-sectional view showing another example of a manufactured cell structure K. Note that the example in Fig. 16 shows a cross-section of wall portion 46 of wall portion 42. Although not shown in Fig. 16, the above-mentioned water-repellent layer 92 may be formed on second surface 201. Water-repellent layer 92 can suppress the formation of alignment film 90 on second surface 201.

[0102] 16 exerts a regulating force on the liquid crystal layer 30. The force from the alignment film 90 also acts on the multiple wall portions 46. By increasing the width W2y of the wall portions 46, it is possible to prevent the multiple wall portions 46 from being deformed by the force from the alignment film 90.

[0103] 17 and 18 are longitudinal cross-sectional views showing a filling step of filling a cell structure K with a liquid crystal material 31. In the filling step, as shown in FIG. 17 , a lid portion G is placed opposite the second surface 201 of the second conductor layer substrate 20 of the cell structure K, which is partitioned by a plurality of wall portions 46, a 1x sealing portion Fx1, and a 2x sealing portion Fx2, via the wall portions 42, so as to cover the cell 43. In the example of FIG. 17 , the lid portion G is the first conductor layer substrate 10 including a first surface 101 and a first back surface 102 located on the opposite side of the first surface 101. However, the lid portion G may be a film different from the first conductor layer substrate 10. In this case, since the first conductor layer substrate 10 is combined after the film is placed, a film (not shown) may be placed between the cell structure K and the first conductor layer substrate 10.

[0104] 5 and 6, each cell 43 of the cell structure K surrounded by the wall portion 42, the 1x sealing portion Fx1, and the 2x sealing portion Fx2 is covered with the lid portion G, and then the air around the cell structure K arranged in the sealed space is discharged to the outside. Subsequently, as shown in FIG. 18, a liquid crystal material 31 is supplied onto the second surface 201 of the cell structure K.

[0105] 5 and 6, the multiple cells 43 of the cell structure K extend in the y direction Dy along each wall portion 46 from the position of the first x sealing portion Fx1 to the position of the second x sealing portion Fx2. Therefore, in the filling step, the liquid crystal material may be filled from the y direction Dy into the spaces constituting the multiple cells 43 of the cell structure K partitioned by the wall portions 42, the first x sealing portion Fx1, and the second x sealing portion Fx2 shown in FIGS. 5 and 6. In this case, the liquid crystal material 31 moves in the y direction Dy along the second surface 201 so as to fill each cell 43. In this manner, in the filling step, the liquid crystal material 31 is filled into the spaces that constitute the plurality of cells 43 of the cell structure K, which are partitioned by the plurality of wall portions 46.

[0106] In the filling step, the liquid crystal material 31 is filled into the cell structure K using the capillary phenomenon described above, but the present invention is not limited to this. For example, in the filling step, the liquid crystal material 31 may be filled into spaces constituting the plurality of cells 43 of the cell structure K, which are partitioned by the plurality of wall portions 46, from the normal direction of the second surface 201 of the second conductor layer substrate 20. In this case, after the filling step, an assembling step may be provided in which the first conductor layer substrate 10 is assembled with the cell structure K filled with the liquid crystal material 31 so as to face the second surface 201 of the second conductor layer substrate 20 via the wall portions 42 and cover the plurality of cells 43.

[0107] After the filling step, a degassing step may be performed. In the degassing step, the gap between the liquid crystal material 31 filled in the cell structure K and the wall portion 42 is removed. The gas forming the gap is discharged along each wall portion 46, for example, from the position of the 1x sealing portion Fx1 to the position of the 2x sealing portion Fx2. Therefore, the time required for the degassing step is reduced compared to when the degassing step is performed on a liquid crystal material in a conventional cell surrounded on all four sides.

[0108] By carrying out the above steps, the reflector 100 having the wall structure 40 shown in FIG. 1 is obtained.

[0109] According to this embodiment, as described above, the wall structure 40 extends in the y direction Dy along each wall portion 46 from the position of the first x sealing portion Fx1 to the position of the second x sealing portion Fx2, which reduces the time required for the filling step and the degassing step for each cell 43. This allows the productivity of the reflection device 100 to be improved.

[0110] The above-described embodiment can be modified in various ways. Hereinafter, other embodiments will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, parts that can be configured similarly to the above-described embodiment will be designated by the same reference numerals as those used for the corresponding parts in the above-described embodiment. Duplicate descriptions will be omitted. Furthermore, if it is clear that the effects obtained in the above-described embodiment can also be obtained in other embodiments, the descriptions may be omitted.

[0111] (First Modification) Fig. 19 is a perspective view showing an example of wall structure 40 according to the first modified example. Fig. 20 is a top view showing an example of a configuration focusing on cells 43 of wall portions 42 of wall structure 40 according to the first modified example. In Figs. 19 and 20, the liquid crystal layer 30 is omitted. As shown in Figures 19 and 20, the multiple wall portions 46 may include multiple 1y wall portions 462 extending in the y direction Dy in a planar view, and a 1y opening 461 located between two adjacent 1y wall portions 462 in the y direction Dy.

[0112] The 1y opening 461 may be formed so as to extend from the second surface 201 of the second conductor layer substrate 20 to the first surface 101 of the first conductor layer substrate 10.

[0113] The aforementioned interval Sx is, for example, 20 μm or more, may be 50 μm or more, or may be 100 μm or more. The interval Sx is, for example, 1000 μm or less, may be 500 μm or less, or may be 250 μm or less.

[0114] The width Sy of the first y opening 461 in the y direction Dy is, for example, 1.0 μm or more, may be 3.0 μm or more, or may be 5.0 μm or more.

[0115] 19 and 20 , in the first modified example, in a plan view, at least a portion of a 1y opening 461 located between two 1y wall portions 462 adjacent in the y direction Dy is positioned to overlap with another 1y opening 461 adjacent to this 1y opening 461 in the x direction Dx. As a result, the multiple cells 43 adjacent in the x direction Dx of the cell structure K are communicated with each other via the multiple 1y openings 461.

[0116] In particular, in the first modified example, the liquid crystal material can move between two cells 43 adjacent to each other in the x direction Dx through the 1y openings 461. That is, the liquid crystal material can move between adjacent cells 43 through the 1y openings 461. This makes it possible to prevent differences in the volume or pressure of the liquid crystal material in each cell 43.

[0117] 19, the plurality of cells 43 communicate with each other via the plurality of 1y openings 461. This allows the liquid crystal material to move between two adjacent cells 43 via the 1y openings 461, making it possible to employ a method of filling the liquid crystal material utilizing capillary action. Note that in the wall structure 40 shown in FIG. 19, the liquid crystal material may be filled into each cell 43 by dripping the liquid crystal material from above onto the wall structure 40. After the liquid crystal material has been filled into each cell 43 in this manner, a degassing process is carried out.

[0118] The other configurations and functions of the reflecting device according to the first modified example are the same as those of the above-described embodiment, and therefore will not be described here.

[0119] (Second Modification) In the above embodiment, an example has been shown in which the exposure step and development step for the first resin layer 71 and the second resin layer 76 are carried out simultaneously, but the timing of the exposure step and development step is not limited.

[0120] For example, after the first resin layer 71 is provided on the second surface 201 of the second conductor layer substrate 20, a step of exposing and developing the first resin layer 71 may be performed. As a result, the first resin layer 71 having a pattern corresponding to the wall portion 42 is formed on the first surface 101, as shown in FIG.

[0121] 22, a second resin layer 76 is formed on the exposed and developed first resin layer 71. There are no limitations on the method for forming the second resin layer 76. For example, the second resin layer 76 having a pattern corresponding to the wall portion 42 may be attached to the first resin layer 71.

[0122] Although not shown, the shape of the first resin layer 71 may be different from the shape of the second resin layer 76. According to the method of the second modified example, the first resin layer 71 can have a shape different from the shape of the second resin layer 76.

[0123] (Third Modification) 23 is a vertical cross-sectional view showing an example of a manufacturing process for a cell structure K according to the third modified example. As shown in Fig. 23, the cell structure K may include an alignment film 95 located on the second surface 201. The alignment film 95 may be formed on the second surface 201 before the wall portion 42 is formed on the second surface 201. A rubbing treatment may be performed on the alignment film 95. It is preferable that the direction of the rubbing treatment on alignment film 95 is perpendicular to the direction in which multiple wall portions 46 extend. For example, in the example shown in Fig. 23, multiple wall portions 46 extend in the y direction, and therefore the direction of rubbing formed on second surface 201 is the x direction.

[0124] After the wall portions 42 are formed on the second surface 201, a step of forming an alignment film 90 may be performed, as shown in Fig. 24. For example, a solution containing a material and a solvent for forming the alignment film 90 is applied to the surfaces of the wall portions 42, such as the plurality of wall portions 46. The alignment film 90 may be formed on the alignment film 95. Thereafter, a step of forming a liquid crystal layer 30 is performed.

[0125] The alignment film 95 may have a regulating force different from that of the alignment film 90. For example, when the alignment film 90 is a vertical alignment film, the alignment film 95 may be a horizontal alignment film. In the example shown in FIG. 24 , the regulating force of the alignment film 95, which is a horizontal alignment film, is stronger than the regulating force of the alignment film 90, which is a vertical alignment film. Therefore, the regulating force of the alignment film 95 can extend to the liquid crystal layer 30 that overlaps the alignment film 95 and the alignment film 90 in the z direction Dz.

[0126] Although not shown, the alignment film 90 is formed on the surface of the wall portion 42 but does not necessarily have to be formed on the alignment film 95 .

[0127] Although not shown, the cell structure K may include only one of a horizontal alignment film and a vertical alignment film. For example, the cell structure K may include a horizontal alignment film located on the second surface 201 but may not include a vertical alignment film located on the surface of the wall portion 42. For example, the cell structure K may include a vertical alignment film located on the surface of the wall portion 42 but may not include a horizontal alignment film located on the second surface 201.

[0128] Although not shown, the arrangement of the vertical alignment film and the horizontal alignment film may be changed depending on the type of liquid crystal material. For example, the cell structure K may include a vertical alignment film located on the second surface 201 and a horizontal alignment film located on the surface of the wall portion 42.

[0129] 25 is a longitudinal cross-sectional view showing another example of a manufacturing process for a cell structure according to the third modified example. As shown in FIG. 25, the second conductors 22 may be arranged as a plurality of pattern conductors intermittently in a region where the plurality of wall portions 46 are located on the second surface 201 of the second conductor layer substrate 20. On the second surface 201 of the second conductor layer substrate 20, a portion of the alignment film 95 is located between the surface of the second conductor 22 and the plurality of wall portions. On the second surface 201 of the second conductor layer substrate 20, a portion of the alignment film 95 is located between the surface of the second conductor 22 and the bottoms of the plurality of wall portions 46.

[0130] As described above, the method may include a step of forming an alignment film 95 located on the surface of the second conductor 22 on the second surface 201 of the second conductor layer substrate 20. In particular, the method may include a step of forming an alignment film 95 located on the surface of the plurality of pattern conductors constituting the second conductor 22 and between adjacent pattern conductors on the second surface 201 of the second conductor layer substrate 20.

[0131] (Fourth Modification) In the above-described embodiment, for example, as shown in Fig. 1, no alignment film is disposed on the first surface 101 of the first conductor layer substrate 10, but an alignment film may be provided on this first surface 101. Here, Fig. 26 is a vertical cross-sectional view showing an example of the configuration of a first conductor layer substrate according to a fourth modified example. 26, an alignment film 99 may be provided on the first surface 101 of the first conductor layer substrate 10. The alignment film 99 may be in contact with the liquid crystal layer 30. It is preferable that the direction of the rubbing treatment on the alignment film 99 is perpendicular to the direction in which the multiple wall portions 46 extend. For example, in the example shown in Fig. 26, the multiple wall portions 46 (not shown) extend in the y direction, and therefore the rubbing direction on the alignment film 99 formed on the first surface 101 is the x direction. Thus, in this modification, as in the third modification, it is preferable that the rubbing treatment on the alignment film 99 on the first surface 101 of the first conductor layer substrate 10 is performed in the x direction.

[0132] The alignment film 99 has a regulating force for aligning the liquid crystal material of the liquid crystal layer 30 in a certain direction, similar to the alignment films 90 and 95 provided on the second conductor layer substrate 20 in the modified example described above.

[0133] (Fifth Modification) In the above-described embodiment, an example has been described in which the wall portion 42 is formed by exposing and developing a resin layer containing a photosensitive resin, but the method for forming the wall portion 42 is not limited thereto. For example, the wall portion 42 may be formed by a 3D printer. For example, the wall portion 42 may be formed by an imprint method.

[0134] (Sixth Modification) 19 and 20, in the above-described first modification, the wall portion 46 includes a plurality of first y wall portions 462 extending in the y direction Dy in a plan view, and a first y opening portion 461 located between two adjacent first y wall portions 462 in the y direction Dy. The plurality of first y wall portions 462 are aligned in the x direction Dx and the y direction Dy. The plurality of first y opening portions 461 aligned in the x direction Dx are positioned so as to be aligned on a straight line in the x direction Dx.

[0135] However, the plurality of first y openings 461 aligned in the x direction Dx are not limited to being positioned so as to be aligned on a straight line in the x direction Dx. 27 is a top view showing an example of the configuration of the wall portion of the wall structure according to the sixth modified example. For example, as shown in FIG. 27, the multiple 1y openings 461 aligned in the x direction may be positioned so as not to be aligned on a straight line in the y direction Dy. Note that, similar to the first modified example described above, the 1y openings 461 may be formed so as to extend from the second surface 201 of the second conductor layer substrate 20 to the first surface 101 of the first conductor layer substrate 10.

[0136] (Seventh Modification) Fig. 28 is a longitudinal cross-sectional view showing an example of the configuration of a phase shifter according to the seventh modification. The phase shifter 200 shown in Fig. 28 has a first conductor layer substrate 10, a second conductor layer substrate 20, and a liquid crystal layer 30 arranged between the first conductor layer substrate 10 and the second conductor layer substrate 20. The first conductor layer substrate 10 has a first support substrate 11 and a first conductor 12 arranged on the surface of the first support substrate 11 facing the liquid crystal layer 30. The second conductor layer substrate 20 has a second support substrate 21 and a second conductor 22 arranged on the surface of the second support substrate 21 facing the liquid crystal layer 30. The first conductor 12 and the second conductor 22 are arranged to face each other with the liquid crystal layer 30 interposed therebetween. The phase shifter 200 has a wall structure 40 that partitions the liquid crystal layer 30. For convenience, the configuration of the phase shifter 200 shown in Fig. 28 does not show the sealing portion F as shown in Figs. 4 to 6.

[0137] According to the present disclosure, by providing a predetermined wall structure, the phase shifter 200 has good liquid crystal orientation response. In the phase shifter 200, the molecular orientation in the liquid crystal layer is changed (the dielectric constant is changed) by a bias voltage applied to the first conductor 12. This shifts the phase of the signal propagating through the first conductor 12.

[0138] The phase shifter 200 of the present disclosure is used for wireless communication and has a cell structure K as shown in FIGS. 4 to 6 , which includes a first conductor layer substrate 10, a second conductor layer substrate 20, a liquid crystal layer 30, and a wall structure 40. Details and definitions of these elements are similar to those of the reflection device 100 of the previously described embodiment, and therefore will not be described here. The shape of the first conductor 12 in a planar view is not particularly limited, but examples include a stripe shape and a meander shape. The phase shifter 200 of the present disclosure is not particularly limited, but is preferably used in an antenna, for example. In this case, the first conductor 12 and the second conductor 22 act on radio waves and function as a patch pattern of an antenna used in wireless communication.

[0139] (Eighth Modification) A phased array antenna used for wireless communication in the present disclosure includes the above-described phase shifter, and typically further includes antenna elements.

[0140] According to the present disclosure, by using the above-described phase shifter, a phased array antenna with good liquid crystal orientation response is obtained. The configuration of phase shifter 200 is the same as the configuration of the phase shifter in the seventh modification example. Furthermore, other components (e.g., antenna elements) used in the phased array antenna can be known components.

[0141] 29 is a schematic diagram showing an example of a schematic configuration of a phased array antenna (transmitting antenna) according to the eighth modified example, in which the second support substrate is omitted for the sake of convenience. 29 includes a phase shifter 200 and an antenna element 51. The plurality of antenna elements 51 form an antenna element array. A plurality of phase shifters 200 are provided corresponding to the plurality of antenna elements 51, respectively. The phased array antenna 300 has a terminal portion 52 connected to the first conductor 12 of the phase shifter 200. The terminal portion 52 is connected to a divider 53, and the divider 53 is connected to an oscillator 54. A signal (high-frequency signal) output from the oscillator 54 is distributed to each phase shifter 200 by the divider 53.

[0142] The radio waves radiated from each of the multiple antenna elements 51 have coherence. Therefore, the radio waves radiated from each of the multiple antenna elements 51 form a wavefront with a uniform phase. The phase of the radio waves radiated from the antenna elements 51 is adjusted by the phase shifter 200. The phase shifter 200 controls the phase of the signal using a phase control circuit (not shown).

[0143] This allows the radiation directivity of radio waves to be controlled while the orientation of the phased array antenna is fixed in one direction. The phased array antenna in the present disclosure may be a transmitting antenna, a receiving antenna, or a transmitting and receiving antenna.

[0144] Although several modifications to the above-described embodiment have been described, it is of course possible to combine a plurality of modifications as appropriate and apply them to the above-described embodiment. [Explanation of symbols]

[0145] 10...First conductor layer substrate 101...1st surface 102...1st back side 11...First support board 12...First conductor 20...Second conductor layer substrate 201…Second surface 202...Second back 21...Second support board 22...Second conductor 30...Liquid crystal layer 31...Liquid crystal materials 40…Wall structure 43...Cell 46...Wall part 462…1st y wall part 461...1st y opening 90...Alignment film 92...Water-repellent layer 95...Alignment film 99...Alignment film

Claims

1. A reflecting device, comprising: a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located opposite to the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, A reflection device, wherein the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion.

2. The reflecting device according to claim 1 , wherein the second conductor is disposed continuously in a region of the second surface where the wall portion is located.

3. 2. The reflector according to claim 1, wherein the second conductors are arranged as a plurality of discontinuous pattern conductors in the region of the second surface where the wall portion is located.

4. The reflection device according to claim 1 , wherein the wall portion includes a plurality of first y wall portions extending in the y direction in a planar view, and a first y opening located between two of the first y wall portions adjacent to each other in the y direction.

5. The reflecting device according to claim 4 , wherein the first y-openings arranged in the x-direction are positioned so as to be aligned on a straight line in the x-direction.

6. The reflecting device according to claim 5 , wherein the first y-openings arranged in the x-direction are positioned so as not to be aligned on a straight line in the x-direction.

7. The reflecting device according to claim 5 , wherein the width of the first y opening in the y direction is 1.0 μm or more.

8. The reflector according to claim 1 , further comprising a first alignment film located on a surface of the wall portion.

9. The reflector according to claim 1 , further comprising a third alignment film located on the first surface of the first conductor layer substrate.

10. The reflector according to claim 2 , further comprising a second alignment film located on the second surface of the second conductor layer substrate, the second alignment film being located on the surface of the second conductor.

11. The reflecting device according to claim 10 , wherein a portion of the second alignment film is located on the second surface of the second conductor layer substrate between a surface of the second conductor and the plurality of wall portions.

12. The reflector according to claim 3 , further comprising a second alignment film located on the second surface of the second conductor layer substrate, the second alignment film being located on the surface of the pattern conductor constituting the second conductor and between adjacent pattern conductors.

13. The reflector according to claim 1 , wherein the first conductor and the second conductor function as a patch pattern of an antenna used in wireless communication.

14. The reflecting device according to claim 12 , wherein a portion of the second alignment film is located on the second surface of the second conductor layer substrate between a surface of the second conductor and the plurality of wall portions.

15. 1. A method for manufacturing a reflection device including a first conductor layer substrate, a second conductor layer substrate, and a liquid crystal layer located between the first conductor layer substrate and the second conductor layer substrate, the method comprising: a forming step of forming a cell structure; a filling step of filling the cell structure with a liquid crystal material, The cell structure is the second conductor layer substrate including a second surface and a second back surface located opposite the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions, the second conductor layer substrate includes a second conductor located on the second surface and a second substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, A method for manufacturing a reflection device, wherein in the filling process, the liquid crystal material is filled into the spaces that constitute the multiple cells of the cell structure partitioned by the multiple wall portions, the first x sealing portion, and the second x sealing portion.

16. In the filling step, a lid portion is disposed so as to cover the cell and face the second surface of the second conductor layer substrate of the cell structure via the wall portion; The method for manufacturing a reflection device according to claim 15 , wherein the liquid crystal material is filled into spaces that form a plurality of cells of the cell structure from the y direction.

17. The method for manufacturing a reflector device according to claim 15 , wherein the second conductor is disposed continuously in a region of the second surface where the wall portion is located.

18. The method for manufacturing a reflector device according to claim 15 , wherein the second conductors are arranged as a plurality of discontinuous pattern conductors in the region of the second surface where the wall portion is located.

19. The method for manufacturing a reflection device described in claim 15, wherein the wall portion includes a plurality of first y wall portions extending in the y direction in a planar view, and a first y opening located between two of the first y wall portions adjacent to each other in the y direction.

20. The method for manufacturing a reflecting device according to claim 16 , wherein the lid portion is the first conductor layer substrate including a first surface and a first back surface located opposite to the first surface.

21. 16. The method for manufacturing a reflection device according to claim 15, wherein in the filling step, the liquid crystal material is filled into spaces constituting a plurality of cells of the cell structure from a direction normal to the second surface of the second conductor layer substrate.

22. The method for manufacturing a reflector device according to claim 15, further comprising a degassing step for removing voids between the liquid crystal material filled in the cell structure and the wall portion.

23. The method for manufacturing a reflector device according to claim 15 , further comprising forming a first alignment film on a surface of the wall portion of the cell structure.

24. The method for manufacturing a reflector according to claim 15 , further comprising the step of forming a second alignment film located on the surface of the second conductor on the second surface of the second conductor layer substrate.

25. 25. The method for manufacturing a reflection device according to claim 24, wherein a part of the second alignment film is located on the second surface of the second conductor layer substrate between a surface of the second conductor and the plurality of wall portions.

26. 16. The method for manufacturing a reflection device according to claim 15, further comprising a step of forming a second alignment film on the second surface of the second conductor layer substrate, the second alignment film being positioned on the surfaces of the plurality of pattern conductors constituting the second conductor and between adjacent pattern conductors.

27. 27. The method for manufacturing a reflection device according to claim 26, wherein a part of the second alignment film is located on the second surface of the second conductor layer substrate between a surface of the second conductor and the plurality of wall portions.

28. A phase shifter for use in wireless communication, comprising: The phase shifter a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located opposite to the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, a phase shifter in which the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion;

29. 30. The phase shifter of claim 28, wherein the first conductor and the second conductor function as a patch pattern of an antenna.

30. A phased array antenna used in wireless communication, the phased array antenna has a phase shifter; The phase shifter a first conductor layer substrate including a first surface and a first back surface located opposite the first surface; a second conductor layer substrate including a second surface opposite to the first surface and a second back surface located opposite to the second surface; a plurality of wall portions protruding from the second surface along a normal direction of the second surface and extending in the y direction; a sealing portion located on the second surface at least at both ends of the plurality of wall portions; a liquid crystal layer located between the first surface of the first conductor layer substrate and the second surface of the second conductor layer substrate; the first conductor layer substrate includes a first conductor located on the first surface and a first support substrate supporting the first conductor; the second conductor layer substrate includes a second conductor located on the second surface and a second support substrate supporting the second conductor; the sealing portion includes a first x-sealing portion that extends in the x-direction in plan view and abuts against first ends of the wall portions in the y-direction, and a second x-sealing portion that extends in the x-direction in plan view and abuts against second ends of the wall portions in the y-direction, the liquid crystal layer is located in a space formed by a plurality of cells partitioned by the wall portions, the first x sealing portion, and the second x sealing portion; Phased array antenna.

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