Uniform and efficient curved surface abrasive flow polishing method based on piezoelectric oscillation energy

Abstract

To provide a uniform and efficient curved surface abrasive flow polishing method based on piezoelectric oscillation energy.SOLUTION: A uniform and efficient curved surface abrasive flow polishing method based on piezoelectric oscillation energy comprises steps of: manufacturing a casing and a case assembly; assembling a polishing device, placing a workpiece in the casing, and forming polishing flow channels with the consistent distance between the lower surface of a flexible flow channel wall and a to-be-machined curved surface of the workpiece; starting the polishing device, making the polishing liquid enter the polishing flow channel for polishing, applying alternating voltage to the piezoelectric ceramic through an alternating voltage source, making the piezoelectric ceramic drive the corresponding part of the wall of the flexible flow channel to vibrate, accordingly, making the abrasive particles at the corresponding positions in the polishing flow channel obtain vibration energy, and increasing the impact force of the abrasive particles on the curved surface of the workpiece; closing the polishing device and taking out the workpiece after polishing is completed. The rotating speed of the abrasive particles and the impact force on the workpiece are improved through the vibration energy of the piezoelectric ceramics, and then the overall grinding efficiency of the surface of the artificial knee joint is improved.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to the field of ultra-precision machining, and specifically to a polishing method based on piezoelectric vibration energy for uniform and efficient flow of abrasive particles on curved surfaces. [Background technology]

[0002] Using 3D printing technology to print titanium alloy artificial joints tailored to individual needs, and then using plasma oxidation to obtain surface properties that meet the requirements of the human body, not only can better meet the needs of personalized treatment, but it can also provide excellent mechanical and biological properties.

[0003] Polishing is essential to ensure the smooth surface of 3D-printed prostheses, which reduces friction and wear after implantation and contributes to improving the success rate of prosthetic joint replacement and the patient's quality of life. Currently, polishing methods for prosthetic knee joints mainly include manual polishing and automated mechanical polishing. Manual polishing is time-consuming, labor-intensive, and inefficient. In contrast, automated mechanical polishing uses soft media, such as non-Newtonian fluids or soft abrasive discs, to ultra-precisely polish the surface of prosthetic knee joints. While this method significantly improves processing efficiency, it still has problems, namely, poor processing uniformity, making it difficult to achieve a good finish, especially in the areas of the prosthetic knee joint with large curvatures. Summary of the Invention [Problem to be solved by the invention]

[0004] SUMMARY OF THE INVENTION An object of the present invention is to solve the problems presented in the background art by providing a method for polishing a curved surface with a uniform and efficient flow of abrasive particles based on piezoelectric vibration energy. [Means for solving the problem]

[0005] To achieve the above object, the present invention provides the following technical solutions.

[0006] A method for polishing a curved surface by uniform and efficient flow of abrasive grains based on piezoelectric vibration energy, comprising: Step 1: manufacturing a casing and case assembly, the casing having a flexible flow path wall on the upper side, the shape of the lower surface of the flexible flow path wall conforming to the curved surface to be machined of the workpiece; Step 2: Assembling the polishing device, placing the workpiece in the casing, and forming polishing channels with the same spacing between the lower surface of the flexible channel wall and the curved surface of the workpiece to be machined; Step 3: operate the polishing device, so that the polishing liquid enters the polishing channel to polish, and apply an AC voltage to the piezoelectric ceramic by the AC voltage source, so that the piezoelectric ceramic drives the corresponding part of the flexible channel wall to vibrate, thereby making the abrasive grains at the corresponding positions in the polishing channel acquire vibration energy, and increasing the impact force of the abrasive grains on the curved surface of the workpiece; and step 4, when polishing is completed, closing the polishing device and removing the workpiece.

[0007] Furthermore, in step 3, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece, and the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic are also adjusted.

[0008] Furthermore, in step 3, the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic at a location of large curvature on the curved surface of the workpiece are increased.

[0009] The polishing apparatus further comprises a casing, a case assembly, a number of piezoelectric ceramics, and a polishing liquid supply mechanism. The casing accommodates the workpiece and has a flexible flow path wall on its upper side. The flexible flow path wall is located at the upper end of the workpiece, and the shape of its lower surface matches the curved surface of the workpiece to be machined, forming polishing paths with equal spacing between the lower surface and the curved surface of the workpiece. The case assembly supports the casing and includes a constraining upper cover. The constraining upper cover is covered by the casing. The piezoelectric ceramics are each electrically connected to an AC voltage source and a voltage amplifier. The number of piezoelectric ceramics are installed in an array along the polishing path between the upper inner wall of the constraining upper cover and the upper surface of the flexible flow path wall, and their length can be changed after electricity is applied to change the spacing of corresponding positions in the polishing path. The polishing liquid supply mechanism supplies polishing liquid to the polishing path.

[0010] Furthermore, the casing is a sleeve-like structure having an internal cavity for accommodating a workpiece, and the flexible channel wall is an upper shell wall of the casing.

[0011] Furthermore, a liquid supply passage and a liquid drain passage are provided at both ends of the casing, and the liquid supply passage and the liquid drain passage are connected to both ends of the polishing flow path, respectively.

[0012] Furthermore, the flexible flow path wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the restricting upper cover matches the shape of the curved surface to be machined of the workpiece and the shape of the upper surface of the flexible flow path wall.

[0013] Furthermore, the case assembly further includes a base, the constraining top cover is mounted on the base, and together they form an internal cavity for accommodating the casing, the casing is supported on the base, and the constraining top cover and the base sandwich the casing, the piezoelectric ceramic, and the workpiece therebetween.

[0014] Furthermore, the polishing liquid supply mechanism includes a polishing liquid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressure-feeds the polishing liquid in the polishing liquid pool to the polishing flow path through the liquid supply pipe.

[0015] Furthermore, the polishing liquid supply mechanism further includes a drain pipe, and the drain pipe delivers the polishing liquid flowing out from the outlet of the polishing flow path to the polishing liquid pool. [Effects of the Invention]

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] First, the present invention utilizes the vibration energy of piezoelectric ceramics to increase the rotation speed of the abrasive grains and the impact force on the workpiece, thereby improving the grinding efficiency of the entire surface of the artificial knee joint. Second, the present invention adaptively adjusts the vibration amplitude and frequency of each piezoelectric ceramic based on the convex and concave curvatures of the artificial knee joint, and further increases the grinding amount of the concave area, so that the grinding amount of each area on the surface of the artificial knee joint is the same, thereby completing the uniform polishing of the surface of the artificial knee joint. Third, the present invention uses a voltage amplifier to adjust the driving voltage of the piezoelectric ceramic, and has a relatively large voltage adjustment range, thereby realizing a relatively wide vibration amplitude and frequency adjustment range, and further realizing a relatively wide grinding amount adjustment range; Fourth, the present invention can realize mass automatic processing, improve the grinding and polishing efficiency, Fifth, the object to which the present invention is applicable is not limited to an artificial knee joint; any complex curved surface processed part can be polished uniformly over the entire surface using the polishing method of the present invention. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a flow chart of the present invention. [Figure 2] FIG. 2 is a structural schematic diagram of a polishing apparatus according to the present invention. [Figure 3] FIG. 3 is a schematic vertical cross-sectional view of the polishing apparatus according to the present invention. [Figure 4] FIG. 4 is an enlarged view of a portion A in FIG. [Figure 5] FIG. 5 is a first schematic diagram of the polishing principle of the present invention. [Figure 6] FIG. 6 is a second schematic diagram of the polishing principle of the present invention. [Figure 7] FIG. 7 is a structural schematic diagram of a casing according to the present invention. [Figure 8] FIG. 8 is a schematic diagram of the vertical cross-sectional structure of a casing according to the present invention. [Figure 9] FIG. 9 is a diagram showing the circuit relationship of the polishing apparatus according to the present invention. [Figure 10] FIG. 10 is a schematic diagram of the structure of the workpiece according to the present invention. [Figure 11] FIG. 11 is a schematic diagram showing a partial cross-sectional structure of another embodiment of a polishing apparatus according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, the technical solutions of the embodiments of the present invention will be clearly and completely described with reference to the drawings of the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Any other embodiments that a person skilled in the art can obtain based on the embodiments of the present invention without any inventive efforts fall within the protection scope of the present invention.

[0020] Referring to FIG. 1, a polishing method for uniformly and efficiently flowing abrasive grains on a curved surface based on piezoelectric vibration energy is realized using a polishing apparatus, and includes the following steps 1 to 4.

[0021] Step 1: The casing 12 and case assembly are manufactured, the upper side of the casing 12 has a flexible flow path wall 2, and the shape of the lower surface of the flexible flow path wall 2 matches the curved surface of the workpiece 8 to be machined.

[0022] The casing 12 is made of a rubber material and is three-dimensionally modeled and then 3D printed according to the shape and size of the workpiece 9. The constraint retainer cover 7 in the case assembly is similarly three-dimensionally modeled and then 3D printed. The casing 12 and the constraint retainer cover 7 may also be manufactured using a mold instead of 3D printing.

[0023] Step 2: Assemble the polishing device, place the workpiece 8 in the casing 12, and form polishing channels 13 with the same spacing between the lower surface of the flexible channel wall 2 and the curved surface of the workpiece 8 to be machined.

[0024] Step 3: The polishing device is operated, the polishing liquid 6 enters the polishing channel 13 to polish, and an AC voltage is applied to the piezoelectric ceramic 1 by the AC voltage source 15, causing the piezoelectric ceramic 1 to drive the corresponding part of the flexible channel wall 2 to vibrate, thereby causing the abrasive grains 3 at the corresponding positions in the polishing channel 13 to acquire vibration energy and increasing the impact force of the abrasive grains 2 on the curved surface of the workpiece.

[0025] Furthermore, during the polishing process, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece 8, and the amplitude and frequency of the AC voltage applied to the piezoelectric ceramic 1 are also adjusted.

[0026] Furthermore, for a portion of the curved surface of the workpiece 8 with a large curvature, the amplitude and frequency of the alternating current voltage applied to the piezoelectric ceramic 1 at that portion are increased.

[0027] Step 4: Once polishing is complete, close the polishing device and remove the workpiece.

[0028] The polishing principle of the above method is that when the rubber flow path wall 2 is subjected to the vibration action of the piezoelectric ceramic 1, the wall surface vibrates accordingly, with the vibration amplitude A' and frequency f' changing accordingly. The abrasive grains 3 acquire vibration energy in the vibrating area of ​​the rubber flow path wall 2, increasing the rotational speed ω and the impact force F of the abrasive grains 3 on the workpiece surface. As the rotational speed and impact force of the abrasive grains 3 increase, the grinding efficiency of the abrasive grains 3 in this area improves. The amount of artificial knee joint 8 ground in this area increases, improving the polishing quality.

[0029] 2 to 11, the polishing apparatus includes a casing 12, a case assembly, some piezoelectric ceramics 1, and a polishing liquid supply mechanism. The casing 12 accommodates the workpiece 8 and has a flexible flow path wall 2 on its upper side. The flexible flow path wall 2 is located at the upper end of the workpiece 8, and the shape of its lower surface matches the curved surface of the workpiece 8 to be machined. Polishing flow paths 13 are formed at equal intervals between the lower surface, the inner walls on both the left and right sides of the casing 12, and the curved surface of the workpiece 8 to be machined. The case assembly supports the casing and includes a constraining upper cover 7. The constraining upper cover 7 is a rigid structure and located at the upper end of the flexible flow path wall 2. A number of piezoelectric ceramics 1 are arranged in an array along the polishing channel 13 between the constraining upper cover 7 and the flexible channel wall 2, where the array may include an independent row, and the piezoelectric ceramics 1 change length after being energized, i.e., the length of the piezoelectric ceramics 1 in the normal direction to the upper surface of the flexible channel wall 2 changes. Because the flexible channel wall 2 is a flexible member while the constraining upper cover 7 has a rigid structure, the change in length of the piezoelectric ceramics 1 deforms the flexible channel wall 2, thereby changing the spacing of the corresponding positions in the polishing channel 13. A polishing liquid supply mechanism supplies polishing liquid to the polishing channel 13.

[0030] The workpiece 8 in the polishing apparatus according to the present invention is specifically an artificial knee joint, the shape of which is shown in FIG. 9, and the upper surface is the curved surface to be processed.

[0031] 7 and 8, the casing 12 has a sleeve-like structure and an internal cavity for accommodating the workpiece 8. The bottom is open and the opening is slightly smaller than the workpiece 8. The workpiece 8 can be inserted into the internal cavity of the casing 12 through the opening by deformation. The flexible flow path wall 2 is the upper shell wall of the casing. A liquid supply passage 1200 and a liquid drainage passage 1201 are respectively provided at both ends of the casing 12. The liquid supply passage 1200 is connected to the inlet of the polishing flow path 13, and the liquid drainage passage 1201 is connected to the outlet of the polishing flow path 13.

[0032] 4, the flexible flow path wall 2 has a constant thickness, and the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the constraining top cover 7 matches the shape of the curved surface to be machined of the workpiece 8 and the shape of the upper surface of the flexible flow path wall 2. The constraining top cover 7 can also be manufactured by 3D printing or a mold.

[0033] 2 to 4, the case assembly further includes a base 4, a constraining upper cover 7 is installed on the base 4, and both are connected by fasteners, forming an internal cavity between the two for accommodating a casing 12, the casing 12 is supported by the base 4, and the constraining upper cover 7 and the base 4 sandwich the piezoelectric ceramic 1, the casing 12, and the workpiece 8 to provide support pressure.

[0034] Referring to Figure 3, the polishing liquid supply mechanism includes a polishing liquid pool 5, a liquid pump 10, a liquid supply pipe 11 and a liquid drain pipe 9. The polishing liquid pool 5 stores polishing liquid 6, which contains abrasive grains 3. The liquid supply pipe 11 has one end connected to a liquid supply passage 1200 and the other end connected to the liquid pump 10. The liquid drain pipe 9 has one end connected to a liquid drain passage 1201 and the other end extending into the polishing liquid pool 5. The liquid pump 10 pumps the polishing liquid in the polishing liquid pool 5 through the liquid supply pipe 11 to the polishing flow path 13. The polishing liquid in the polishing flow path 13 flows back to the polishing liquid pool 5 through the liquid drain pipe 9 due to the action of its power and the thrust of the subsequent polishing liquid. The liquid pump 10 gives the polishing liquid an initial velocity, giving the polishing liquid the power to polish the workpiece 8.

[0035] Referring to FIG. 9, each piezoelectric ceramic 1 is electrically connected to an AC voltage source 15 and a voltage amplifier 14, the AC voltage source 15 is electrically connected to the voltage amplifier 14, the AC voltage source 15 supplies power to the piezoelectric ceramic 1, a single neuron pid is integrated into the voltage amplifier 14, the voltage amplifier 14 can change the amplitude, frequency and on / off of the AC voltage of each piezoelectric ceramic 1, and can control each piezoelectric ceramic 1 independently.

[0036] As shown in FIG. 11, in another embodiment of the polishing apparatus according to the present invention, a number of insertion grooves 701 for inserting and engaging the piezoelectric ceramic 1 are provided at intervals on the upper inner wall of the restricting upper cover 7, and the end of the piezoelectric ceramic 1 facing away from the insertion groove 701 is adhesively fixed to the flexible flow path wall 2.

[0037] The piezoelectric ceramic 1 is driven by the voltage of the AC voltage source 15 to periodically vibrate at a constant vibration amplitude A and frequency f, and transmits vibration energy to the flexible flow path wall 2. There are a plurality of piezoelectric ceramics 1, and the vibration amplitude A of each piezoelectric ceramic 1 is n and frequency f n The shape of the flexible flow path wall 2 is customized according to the unevenness distribution on the surface of the workpiece 8.

[0038] The vibration energy of the piezoelectric ceramic 1 is transmitted to the flexible channel wall 2, causing the flexible channel wall 2 to vibrate at a corresponding amplitude A' and frequency f'. The vibration energy is then transmitted to the polishing liquid 6 in the polishing channel 13, causing a turbulent flow in the polishing liquid 6. The turbulent kinetic energy of the polishing liquid 6 is then transmitted to the abrasive grains 3 in the polishing liquid 6, further increasing the rotational angular velocity ω of the abrasive grains 3 in the polishing liquid 6 and increasing the impact force F of the abrasive grains 3 on the workpiece 8. Ultimately, the grinding efficiency p of the abrasive grains 3 on the artificial knee joint 8 per unit time is improved. As can be seen from the formula of grinding volume δ = kpv, the grinding volume of the workpiece 8 in this region also increases correspondingly, where k is a grinding volume constant ranging from 0 to 1, and v is the flow velocity of the abrasive grains 3.

[0039] Furthermore, the present invention is based on the convex curvature ρ 凸 and concave curvature ρ 凹 Based on this, the voltage amplifier 14 controls the vibration amplitude A of each piezoelectric ceramic 1. n and frequency f n , and further adjust the vibration amplitude A' and frequency f' of the flexible flow path wall 2 in the corresponding region, and further adjust the grinding and polishing amount of the workpiece 8 in the corresponding region, so that a similar grinding amount can be obtained even in the region with a low material removal rate, thereby realizing a uniform polishing effect of the workpiece 8.

[0040] While embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is limited only by the appended claims and their equivalents.

[0041] (Addendum) (Appendix 1) A method for polishing a curved surface by uniform and efficient flow of abrasive grains based on piezoelectric vibration energy, comprising: Step 1: manufacturing a casing and case assembly, the casing having a flexible flow path wall on the upper side, the shape of the lower surface of the flexible flow path wall conforming to the curved surface to be machined of the workpiece; Step 2: Assembling the polishing device, placing the workpiece in the casing, and forming polishing channels with the same spacing between the lower surface of the flexible channel wall and the curved surface of the workpiece to be machined; Step 3: operate the polishing device, so that the polishing liquid enters the polishing channel to polish, and apply an AC voltage to the piezoelectric ceramic by the AC voltage source, so that the piezoelectric ceramic drives the corresponding part of the flexible channel wall to vibrate, thereby making the abrasive grains at the corresponding positions in the polishing channel acquire vibration energy, and increasing the impact force of the abrasive grains on the curved surface of the workpiece; and step 4, when polishing is completed, closing the polishing apparatus and removing the workpiece.

[0042] (Appendix 2) A polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 1, characterized in that in step 3, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece, and the amplitude and change frequency of the AC voltage applied to the piezoelectric ceramic are further adjusted.

[0043] (Appendix 3) A polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 2, characterized in that in step 3, the AC voltage amplitude and change frequency applied to the piezoelectric ceramic at areas of large curvature on the curved surface of the workpiece are increased.

[0044] (Appendix 4) The polishing apparatus comprises a casing, a case assembly, a number of piezoelectric ceramics, and a polishing liquid supply mechanism, the casing accommodates a workpiece and has a flexible flow path wall on its upper side, the flexible flow path wall is located at the upper end of the workpiece, the shape of its lower surface matches the curved surface to be machined of the workpiece, and polishing paths of equal spacing are formed between the lower surface and the curved surface of the workpiece to be machined of the workpiece, the case assembly supports the casing and includes a constraining upper cover, the constraining upper cover is covered by the casing, the piezoelectric ceramics are each electrically connected to an AC voltage source and a voltage amplifier, a number of the piezoelectric ceramics are installed in an array along the polishing paths between the upper inner wall of the constraining upper cover and the upper surface of the flexible flow path wall, and the spacing between corresponding positions of the polishing paths can be changed by changing the length after electricity is applied, and the polishing liquid supply mechanism supplies the polishing liquid to the polishing paths.

[0045] (Appendix 5) A polishing method for uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 4, characterized in that the casing has a sleeve-like structure and an internal cavity for accommodating a workpiece, and the flexible flow path wall is the upper shell wall of the casing.

[0046] (Appendix 6) A polishing method using a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 5, characterized in that a liquid supply passage and a liquid drainage passage are installed at both ends of the casing, and the liquid supply passage and the liquid drainage passage are connected to both ends of the polishing flow path, respectively.

[0047] (Appendix 7) A polishing method using a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 4, characterized in that the flexible flow path wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the constraining upper cover matches the shape of the curved surface to be machined of the workpiece and the upper surface of the flexible flow path wall.

[0048] (Appendix 8) A method for polishing a curved surface with a uniform and efficient flow of abrasive grains based on piezoelectric vibration energy, as described in Appendix 4, characterized in that the case assembly further includes a base, the constraining upper cover is mounted on the base, and both form an internal cavity for accommodating the casing, the casing is supported on the base, and the constraining upper cover and the base sandwich the casing, the piezoelectric ceramic, and the workpiece therebetween.

[0049] (Appendix 9) The polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 4, is characterized in that the polishing liquid supply mechanism includes a polishing liquid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressure-feeds the polishing liquid in the polishing liquid pool to the polishing flow path via the liquid supply pipe.

[0050] (Appendix 10) The polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in Appendix 9, is characterized in that the polishing liquid supply mechanism further includes a drainage pipe, and the drainage pipe sends the polishing liquid flowing out from the outlet of the polishing flow path to the polishing liquid pool. [Explanation of symbols]

[0051] 1. Piezoelectric ceramic 2 Flexible channel wall 3 Abrasive grains 4 Pedestal 5 Polishing fluid pool 6 Polishing liquid 7 Restriction top cover 701 Insertion groove 8 Work 9 Drainage tube 10 Liquid Pump 11 Liquid supply pipe 12 Casing 1200 Liquid supply passage 1201 Drainage passage 13 Polished flow path 14 Voltage Amplifier 15 AC voltage source

Claims

1. A method for polishing a curved surface by uniform and efficient flow of abrasive grains based on piezoelectric vibration energy, comprising: Step 1: manufacturing a casing and case assembly, the casing having a flexible flow path wall on the upper side, the shape of the lower surface of the flexible flow path wall conforming to the curved surface to be machined of the workpiece; Step 2: Assembling the polishing device, placing the workpiece in the casing, and forming polishing channels with the same intervals between the lower surface of the flexible channel wall and the curved surface of the workpiece to be machined; Step 3: operate the polishing device, so that the polishing liquid enters the polishing channel to polish, and apply an AC voltage to the piezoelectric ceramic by the AC voltage source, so that the piezoelectric ceramic drives the corresponding part of the flexible channel wall to vibrate, thereby making the abrasive grains at the corresponding positions in the polishing channel acquire vibration energy, and increasing the impact force of the abrasive grains on the curved surface of the workpiece; and step 4, when polishing is completed, closing the polishing apparatus and removing the workpiece.

2. 2. A method for polishing a curved surface by uniformly and efficiently flowing abrasive grains based on piezoelectric vibration energy, as described in claim 1, characterized in that in step 3, the voltage amplifier is adjusted based on the convex and concave curvatures of the workpiece, and the amplitude and change frequency of the AC voltage applied to the piezoelectric ceramic are further adjusted.

3. A method for polishing a curved surface by uniformly and efficiently flowing abrasive grains based on piezoelectric vibration energy, as described in claim 2, characterized in that in step 3, for areas of large curvature on the curved surface of the workpiece, the AC voltage amplitude and change frequency applied to the piezoelectric ceramic at those areas are increased.

4. 4. The method for polishing a curved surface using piezoelectric vibration energy for uniform and efficient polishing, characterized in that the polishing apparatus comprises a casing, a case assembly, a number of piezoelectric ceramics, and a polishing liquid supply mechanism, the casing accommodates a workpiece and has a flexible flow path wall on its upper side, the flexible flow path wall is located at the top end of the workpiece, the shape of the lower surface of the flexible flow path wall matches the curved surface to be machined of the workpiece, and polishing paths are formed at equal intervals between the lower surface and the curved surface of the workpiece to be machined, the case assembly supports the casing and includes a constraining upper cover, the constraining upper cover is covered by the casing, and the piezoelectric ceramics are each electrically connected to an AC voltage source and a voltage amplifier, the number of piezoelectric ceramics are installed in an array along the polishing paths between the upper inner wall of the constraining upper cover and the upper surface of the flexible flow path wall, and the length of the piezoelectric ceramics can be changed after electricity is applied to change the intervals between the corresponding positions of the polishing paths, and the polishing liquid supply mechanism supplies the polishing liquid to the polishing paths.

5. 5. A polishing method for uniformly and efficiently flowing abrasive grains on a curved surface based on piezoelectric vibration energy, as described in claim 4, wherein the casing is a sleeve-like structure and has an internal cavity for accommodating a workpiece, and the flexible flow path wall is the upper shell wall of the casing.

6. A polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in claim 5, characterized in that a liquid supply passage and a liquid drainage passage are installed at both ends of the casing, and the liquid supply passage and the liquid drainage passage are connected to both ends of the polishing flow path, respectively.

7. 5. A polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in claim 4, characterized in that the flexible flow path wall has a constant thickness, the shape of its upper surface matches the shape of its lower surface, and the shape of the upper inner wall of the constraining upper cover matches the shape of the curved surface to be machined of the workpiece and the upper surface of the flexible flow path wall.

8. 5. A method for polishing a curved surface with a uniform and efficient flow of abrasive grains based on piezoelectric vibration energy, as described in claim 4, characterized in that the case assembly further includes a base, the constraining upper cover is mounted on the base, and both form an internal cavity for accommodating the casing, the casing is supported on the base, and the constraining upper cover and the base sandwich the casing, the piezoelectric ceramic, and the workpiece therebetween.

9. A polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in claim 4, characterized in that the polishing liquid supply mechanism includes a polishing liquid pool, a liquid pump, and a liquid supply pipe, and the liquid pump pressure-feeds the polishing liquid in the polishing liquid pool to the polishing flow path through the liquid supply pipe.

10. The polishing method for a uniform and efficient flow of abrasive grains on a curved surface based on piezoelectric vibration energy, as described in claim 9, characterized in that the polishing liquid supply mechanism further includes a drainage pipe, which sends the polishing liquid flowing out from the outlet of the polishing flow path to a polishing liquid pool.

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