Component mounting apparatus and component mounting method

Abstract

To provide a component mounting apparatus and a component mounting method capable of appropriately setting a mounting load and a mounting holding time used in an operation of mounting a component on a liquid agent applied to a substrate.SOLUTION: Under a condition that at least one of a mounting load for mounting a component and a mounting holding time for applying the mounting load to the component is different from the previous condition, the component is mounted on a liquid agent attached to a substrate (ST5 and ST6), a protruding amount of the liquid agent from the mounted component is detected (ST7), and the mounting load and the mounting holding time in which the detected protruding amount is within a specified range (Yes in ST7) are set as the mounting load and the mounting holding time used in a component mounting operation for mounting the component on the substrate (ST13).SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method for mounting components on a liquid agent attached to a substrate. [Background technology]

[0002] Surface-mounted components with terminals on their surfaces, such as LED components, are mounted on an adhesive (liquid agent) that has been applied (attached) to a substrate. A known device has a dispensing head that applies such adhesive to a substrate (see, for example, Patent Document 1). The component mounting device places a component held by the head on the adhesive applied to the substrate, and applies a predetermined mounting load from the head to the component for a predetermined mounting and holding time, pressing down on the component and spreading the highly viscous adhesive while mounting it on the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-302174 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional technologies including Patent Document 1, it is possible to mount components on adhesive applied to a board. However, the component mounting device cannot automatically set an appropriate mounting load and mounting hold time, so the operator must remove the board with the mounted components from the component mounting device and observe it manually to set the conditions. For this reason, there is room for further improvement in order to automatically set the conditions and maintain stable bonding quality.

[0005] Therefore, the present disclosure aims to provide a component mounting device and a component mounting method that can appropriately set the mounting load and mounting hold time used in the operation of mounting components on a liquid agent applied to a substrate. [Means for solving the problem]

[0006] The component mounting apparatus of the present disclosure comprises a mounting head that mounts components on a liquid agent attached to a board; an overflow amount detection means that detects the amount of the liquid agent that overflows from the component mounted on the board; and a control unit that controls the mounting head and the overflow amount detection means and sets a mounting load for mounting the component and a mounting hold time for applying the mounting load to the component, wherein the control unit causes the mounting head to mount the component so that at least one of the mounting load and the mounting hold time is different from a previous condition, causes the control unit to detect the overflow amount of the mounted component, and sets the mounting load and the mounting hold time that bring the detected overflow amount within a specified range as the mounting load and the mounting hold time to be used by the mounting head in mounting the component on the board.

[0007] The component mounting method disclosed herein is a component mounting method using a component mounting device that mounts a component on a liquid agent adhered to a board, and involves mounting the component on the liquid agent adhered to the board under conditions where at least one of the mounting load for mounting the component and the mounting hold time for applying the mounting load to the component is different from before, detecting the amount of liquid agent spilling out from the mounted component, and setting the mounting load and mounting hold time for which the detected amount of spillage is within a specified range as the mounting load and mounting hold time to be used in the operation of mounting the component on the board. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to appropriately set the placement load and placement holding time used in the operation of placing components on a liquid agent applied to a substrate. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a configuration of a main part of a component mounting apparatus according to an embodiment of the present disclosure; [Figure 2] FIG. 1 is an explanatory diagram illustrating a configuration of a suction unit of a head provided in a component mounting apparatus according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present disclosure. [Figure 4] FIG. 10 is an explanatory diagram of an example of component data used in a component mounting device according to an embodiment of the present disclosure. [Figure 5] 1A and 1B are a front view and a plan view, respectively, of an example of a component mounted on a board by a component mounting apparatus according to an embodiment of the present disclosure; [Figure 6] 1A and 1B are a front view and a plan view illustrating a liquid agent application process in a component mounting apparatus according to an embodiment of the present disclosure; [Figure 7] 1A and 1B are front and plan views illustrating a pressing process in a component mounting apparatus according to an embodiment of the present disclosure; [Figure 8] 1A and 1B are front and plan views illustrating a pressing process in a component mounting apparatus according to an embodiment of the present disclosure; [Figure 9] FIG. 10 is an explanatory diagram of a method for changing pressing conditions in a component mounting device according to an embodiment of the present disclosure. [Figure 10] 1 is a flow diagram of a component mounting method according to an embodiment of the present disclosure; [Figure 11] FIG. 10 is an explanatory diagram of another example of a method for changing pressing conditions in a component mounting device according to an embodiment of the present disclosure. [Figure 12] FIG. 10 is a flow diagram of another example of the component mounting method according to the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting device, etc. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, the X-axis (left-right direction in FIG. 1) in the substrate transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the substrate transport direction are shown as two axes that are perpendicular to each other in a horizontal plane. In FIG. 1 and in some parts described below, the Z-axis (up-down direction in FIG. 5) is shown as the height direction that is perpendicular to the horizontal plane.

[0011] Next, the configuration of the component mounting apparatus 1 will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the configuration of a main part of a component mounting apparatus according to an embodiment of the present disclosure. FIG. 2 is an explanatory diagram showing the configuration of a suction unit of a head provided in the component mounting apparatus according to an embodiment of the present disclosure. The component mounting apparatus 1 has a function of performing a component mounting operation by applying a liquid agent to a substrate B and mounting components D supplied from a component supply unit onto the liquid agent attached to the substrate B. A substrate transport mechanism 3 is arranged along the X-axis in the center of the base 2. The substrate transport mechanism 3 transports the substrate B transported from upstream to a mounting operation position, positions it, and holds it. The substrate transport mechanism 3 also transports the substrate B downstream after the component mounting operation has been completed. A component supply unit 4 is provided on one side (the front side in the Y-axis direction) of the substrate transport mechanism 3.

[0012] A plurality of tape feeders 5 and tray feeders 6 are mounted in parallel along the X-axis in the component supply unit 4. The tape feeder 5 pitch-feeds a component tape formed with pockets for storing components D in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 3, thereby supplying components D to a component supply position from which the components D are picked up by a mounting head, which will be described below. The tray feeder 6 moves a pallet 7, which carries trays 8 that store a plurality of components D in an array, to the component supply position, and supplies the components D from the trays 8.

[0013] In FIG. 1, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the upper surface of the base 2. A front beam 10A and a rear beam 10B, each equipped with a linear drive mechanism, are connected to the Y-axis table 9 so as to be movable along the Y-axis. The front beam 10A and the rear beam 10B are arranged along the X-axis. A front plate 10Aa is attached to the front beam 10A so as to be movable along the X-axis. A mounting head 11 is attached to the front plate 10Aa.

[0014] 1 and 2, the mounting head 11 is equipped with a plurality of (four in this example) suction units 12. Each suction unit 12 has a shaft with a nozzle holder 12a at the lower end thereof to which a nozzle 13 is attached. The nozzle 13 holds the component D by vacuum suction onto the suction surface 13a at the lower end. The suction unit 12 is also equipped with a nozzle driver 12b and a load measuring unit 12c.

[0015] Nozzle driver 12b has a motor and functions to raise and lower the shaft in the vertical direction (Z-axis direction) and rotate it θ around the Z-axis, thereby raising and lowering nozzle 13 attached to nozzle holder 12a and rotating it θ. Load measurement unit 12c has a load sensor such as a load cell and functions to measure the load applied to the shaft. While measuring the load applied to the shaft with load measurement unit 12c, suction unit 12 lowers nozzle 13 in the Z-axis direction with nozzle driver 12b, and places component D held by nozzle 13 at a placement position P on board B with a preset placement load.

[0016] 1, a rear plate 10Ba is attached to the rear beam 10B so as to be movable along the X axis. A coating head 14 is attached to the rear plate 10Ba. The coating head 14 is equipped with a dispenser 15 that applies a liquid material C, such as an adhesive, flux, or paste, to the upper surface of the substrate B according to preset coating conditions (see FIG. 6).

[0017] 1, the Y-axis table 9 and the front beam 10A constitute a mounting head moving mechanism 16A that moves the mounting head 11 in the X-axis and Y-axis directions. The mounting head moving mechanism 16A and the mounting head 11 perform a mounting turn in which they pick up a component D from a tape feeder 5 or a tray feeder 6 arranged in the component supply unit 4 by using a nozzle 13, and mount it at a mounting position P on a board B positioned by the board transport mechanism 3.

[0018] The Y-axis table 9 and rear beam 10B constitute a coating head moving mechanism 16B that moves the coating head 14 in the X-axis and Y-axis directions. The coating head moving mechanism 16B and the coating head 14 perform a liquid agent coating operation of applying the liquid agent C to the mounting position P or the vicinity of the mounting position P of the substrate B positioned by the substrate transport mechanism 3.

[0019] In FIG. 1, a head camera 17 is attached to the front plate 10Aa to which the mounting head 11 is attached. The head camera 17 moves integrally with the mounting head 11. As the mounting head 11 moves, the head camera 17 moves above the board B positioned by the board transport mechanism 3 and captures an image of a board mark (not shown) provided on the board B. From the image capture results, the position of the board B is recognized. The head camera 17 also captures an image of the component D mounted on the board B and the liquid agent C spilling out from the component D. From the image capture results, the amount of liquid agent spilling out from the component D is detected.

[0020] A component recognition camera 18 is disposed between the component supply unit 4 and the board transport mechanism 3. When the mounting head 11, which has picked up a component D from the component supply unit 4, moves above the component recognition camera 18, the component recognition camera 18 captures an image of the component D held by the mounting head 11. From the captured image, the holding posture of the component D is recognized. When the mounting head 11 mounts a component on the board B, the mounting position is corrected taking into account the recognition result of the component D by the component recognition camera 18 and the recognition result of the board position by the head camera 17.

[0021] 1, a touch panel 19 operated by the worker is installed at the position where the worker works on the component mounting device 1. The touch panel 19 displays various information such as error information on its display unit, and the worker inputs data and operates the component mounting device 1 using operation buttons and the like displayed on the display unit.

[0022] Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. 3. FIG. 3 is a block diagram showing the configuration of the control system of a component mounting apparatus according to an embodiment of the present disclosure. The following description will focus on the function of setting parameters related to the mounting load and mounting hold time applied to component D by nozzle 13 in a component mounting operation in which component D is mounted on liquid agent C applied (adhered) to substrate B. The component mounting apparatus 1 includes a control device 20, a substrate conveying mechanism 3, a tape feeder 5, a tray feeder 6, a mounting head 11, a mounting head moving mechanism 16A, a dispensing head 14, a dispensing head moving mechanism 16B, a head camera 17, a component recognition camera 18, and a touch panel 19. The mounting head 11 includes a plurality of suction units 12 each including a nozzle driving unit 12b and a load measuring unit 12c.

[0023] The control device 20 includes a memory unit 21, a mounting control unit 22, a parameter setting processing unit 23, and an overhang amount detection processing unit 24. The memory unit 21 is a storage device that stores mounting data 25, component data 26, specified range data 27, overhang amount data 28, and the like. The mounting data 25 stores, for each type of mounting board, information identifying a component D to be mounted on a board B (component number), a mounting position P (XY coordinates) of the component D on the board B, and other information. The component data 26 stores, for each type of component D, information regarding the size of the component D, control parameters for the component mounting operation, and other information. Furthermore, the component data 26 for a component D to be mounted on a liquid agent C stores information such as the amount of liquid agent C to be applied to the board B.

[0024] An example of the component data 26 will now be described with reference to FIG. 4. FIG. 4 is an explanatory diagram of an example of component data used in a component mounting device according to an embodiment of the present disclosure. The component data 26 includes, for each component number 30, a component shape 31, a component size (length 32, width 33, height 34), a placement load parameter 35, and a placement hold time parameter 36. The component shape 31 is information that identifies the shape of a component D, such as a chip component (chip), an LED component (LED), a BGA, or a QFP. The placement load parameter 35 specifies a parameter related to a placement load F applied to place the component D on the board B. The placement hold time parameter 36 specifies a parameter related to a placement hold time T for applying the placement load F to the component D.

[0025] 3, based on mounting data 25 and component data 26, mounting control unit 22 causes mounting head moving mechanism 16A to move mounting head 11, raises and lowers nozzle 13 attached to suction unit 12 of mounting head 11 to pick up components D supplied by tape feeder 5 or tray feeder 6 of component supply unit 4, and performs a component mounting operation to mount components D at mounting position P (see FIGS. 6 and 7) on board B. Mounting control unit 22 also causes application head moving mechanism 16B to move application head 14, and performs a liquid agent application operation to apply liquid agent C to mounting position P or a predetermined position near mounting position P.

[0026] Here, with reference to Figures 5 to 8, we will explain the liquid application work in which the mounting control unit 22 applies a highly viscous liquid C (adhesive) to the substrate B based on the mounting data 25 and the component data 26, and the component mounting work in which the component D is attached onto the applied (attached) liquid C.

[0027] FIG. 5 shows an example of a component D mounted on a substrate B in a component mounting apparatus 1 according to an embodiment of the present disclosure. FIG. 5(a) is a front view, and FIG. 5(b) is a plan view. The component D is an LED component, and an LED portion Db and multiple electrodes Dc are formed on the upper surface of a main body portion Da. An LED chip is mounted on the LED portion Db. The multiple electrodes Dc are connected to the LED chip inside the LED portion Db. The LED portion Db emits light when a predetermined voltage and current are supplied from the multiple electrodes Dc. The upper surface of the LED portion Db is the highest position within the component D, and is defined as the upper surface De of the component D. Furthermore, the lower surface of the main body portion Da is the lowest position within the component D, and is defined as the lower surface Dd of the component D.

[0028] First, the mounting control unit 22 controls the dispensing head moving mechanism 16B to move the dispensing head 14, causing the dispenser 15 to apply the liquid agent C to the mounting position P on the upper surface Ba of the board B (FIG. 6). FIG. 6 is a diagram illustrating the liquid agent application process in the component mounting apparatus 1 according to an embodiment of the present disclosure, with FIG. 6(a) being a front view and FIG. 6(b) being a plan view. Next, the mounting control unit 22 controls the mounting head moving mechanism 16A to move the mounting head 11, causing the nozzle 13 to hold the upper surface De of the component D supplied by the component supply unit 4. Next, the mounting control unit 22 controls the mounting head moving mechanism 16A to move the mounting head 11, causing the component D held by the nozzle 13 to be moved above the mounting position P on the board B.

[0029] Next, the mounting control unit 22 controls the mounting head 11 to lower the nozzle 13, causing the component D to land on the liquid agent C. Furthermore, the mounting control unit 22 controls the mounting head 11 to cause the nozzle 13 to press the component D with a predetermined mounting load F ( FIG. 7 ). FIG. 7 illustrates a pressing process performed by the component mounting apparatus 1 according to an embodiment of the present disclosure. FIG. 7( a ) is a front view, and FIG. 7( b ) is a plan view. By pressing the component D with the mounting load F, the highly viscous liquid agent C gradually spreads and protrudes outward from between the board B and the component D ( FIG. 8 ). FIG. 8 illustrates a pressing process performed by the component mounting apparatus 1 according to an embodiment of the present disclosure. FIG. 8( a ) is a front view, and FIG. 8( b ) is a plan view. Then, by pressing the component D with the mounting load F for a predetermined mounting retention time T, the liquid agent thickness G between the upper surface Ba of the board B and the lower surface Dd of the component D mounted on the board B falls within a specified range. In this way, the component D (LED component) is fixed to the substrate B by the liquid agent C (adhesive) formed between the component D and the substrate B with a liquid agent thickness G within a specified range.

[0030] 3, the overflow amount detection processing unit 24 recognizes and processes an image captured by the head camera 17 of a component D mounted on the liquid agent C applied (adhered) to the substrate B and the area around the component D, and detects (calculates) the amount E of the liquid agent C overflowing from the component D mounted on the substrate B. For example, the overflow amount detection processing unit 24 calculates the amount E of the liquid agent C from the area of ​​the liquid agent C overflowing from the component D. The overflow amount detection processing unit 24 also calculates the amount E of the liquid agent C from the maximum amounts (Ex1, Ex2) in the X-axis direction and the maximum amounts (Ey1, Ey2) in the Y-axis direction overflowing from the component D (see FIG. 8(b)).

[0031] In this way, head camera 17 and overflow amount detection processing unit 24 constitute overflow amount detection means 29 that detects the overflow amount E of liquid C from component D mounted on board B. Information related to the detected overflow amount E is stored in memory unit 21 as overflow amount data 28. Specified range data 27 stores data related to the specified range of the overflow amount E of liquid C from component D mounted on board B during component mounting work for each type of component D (component number 30).

[0032] In Figure 3, a parameter setting processing unit 23 provided in the control device 20 (control unit) controls the application head 14, application head moving mechanism 16B, mounting head 11, mounting head moving mechanism 16A, and overflow amount detection means 29, determines parameters (mounting load parameter 35, mounting holding time parameter 36) related to the mounting load F and mounting holding time T for mounting a component D on the liquid C applied (adhered) to a substrate B, and executes a parameter setting process to change (set) the component data 26 of the corresponding component D.

[0033] Specifically, the parameter setting processing unit 23 applies a predetermined amount of liquid agent C to the board B, causes the nozzle 13 of the mounting head 11 to hold the component D, lowers the nozzle 13 to land the component D on the liquid agent C, and applies a predetermined placement load F from the nozzle 13 for a predetermined placement hold time T. Then, the parameter setting processing unit 23 causes the overflow amount detection means 29 to detect the overflow amount, and sets in the component data 26 the placement load F and placement hold time T that will bring the detected overflow amount E into a specified range included in the specified range data 27.

[0034] The parameter setting processor 23 places components D under a plurality of pressing conditions that vary the placement load F and placement hold time T, and sets the placement load F and placement hold time T. Hereinafter, a combination of the placement load F and placement hold time T will be referred to as a press condition (F, T). That is, the parameter setting processor 23 has the mounting head 11 place components D so that at least one of the placement load F and placement hold time T is different from the previous press condition (F, T), has the overhang amount detector 29 detect the overhang amount E of the placed component D, and sets the placement load F and placement hold time T that bring the detected overhang amount E within a specified range as the placement load F and placement hold time T to be used by the mounting head 11 in the operation of placing the component D on the board B.

[0035] Here, referring to FIG. 9, an example of a method for changing the pressing conditions (F, T) when the parameter setting processing unit 23 sets the mounting load F and the mounting holding time T will be described. FIG. 9 is an explanatory diagram of a method for changing the pressing conditions in the component mounting apparatus 1 according to an embodiment of the present disclosure. When setting the pressing conditions (F, T), after the parameter setting processing unit 23 mounts the component D under a predetermined pressing condition (F, T), it determines whether or not the protrusion amount E is within the range of the specified range included in the specified range data 27, and searches for the pressing conditions (F, T) in which the protrusion amount E is within the specified range.

[0036] In the example of FIG. 9, first, after the parameter setting processing unit 23 mounts the component D under the pressing condition (F1, T1) where the mounting load F is minimum and the mounting holding time T is shortest, it causes the protrusion amount detecting means 29 to detect the protrusion amount E, and determines whether or not the protrusion amount E is within the specified range. When the protrusion amount E under the pressing condition (F1, T1) is smaller than the lower limit of the specified range, that is, when the pressing is insufficient, the parameter setting processing unit 23 mounts the component D under the pressing condition (F1, T2) where the mounting load F1 is unchanged and the mounting holding time T is increased (T1 < T2), and determines whether or not the detected protrusion amount E is within the specified range.

[0037] When the protrusion amount E under the pressing condition (F1, T2) is smaller than the lower limit of the specified range, the parameter setting processing unit 23 similarly mounts the component D in order under the pressing conditions (F1, T3), (F1, T4), and (F1, T5) where the mounting load F1 is unchanged and the mounting holding time T is increased (T2 < T3 < T4 < T5), and determines whether or not the detected protrusion amount E is within the specified range.

[0038] In FIG. 9, when the protrusion amount E under the pressing condition (F1, T5) is smaller than the lower limit of the specified range, the parameter setting processing unit 23 increases the mounting load F by one step (F1 → F2), and sets the pressing conditions (F2, T1), (F2, T2), ···, (F2, T5) with a longer mounting holding time T, and mounts the component D in order under these pressing conditions (F1 < F2), and determines whether the detected protrusion amount E is within the specified range. Then, when the protrusion amount E is smaller than the lower limit of the specified range, the parameter setting processing unit 23 further increases the mounting load F step by step (F2 → F3 → F4), and mounts the component D under the condition that the mounting holding time T is gradually lengthened (T1 → T2 → T3 → T4 → T5), and determines whether the detected protrusion amount E is within the specified range.

[0039] When the protrusion amount E is within the specified range, the parameter setting processing unit 23 sets the mounting load F and the mounting holding time T of the pressing condition (F, T) as the mounting load F and the mounting holding time T used in the component mounting operation where the mounting head 11 mounts the component D on the substrate B. For example, when the protrusion amount E is within the specified range under the pressing condition (F3, T2), the parameter setting processing unit 23 sets the mounting load F3 and the mounting holding time T2 as the pressing conditions used in the component mounting operation.

[0040] In FIG. 9, when the protrusion amount exceeds the upper limit of the specified range, the parameter setting processing unit 23 sets the mounting load F and the mounting holding time T between the pressing condition and the previous pressing condition as the mounting load F and the mounting holding time T used in the component mounting operation. For example, when the protrusion amount E exceeds the upper limit of the specified range under the pressing condition (F2, T2), the parameter setting processing unit 23 sets the mounting load F2 and the mounting holding time T1~T2 between the pressing condition (F2, T2) and the previous pressing condition (F2, T1) as the pressing conditions used in the component mounting operation. Also, when the protrusion amount E exceeds the upper limit of the specified range under the pressing condition (F2, T1), the parameter setting processing unit 23 sets the mounting load F1~F2 and the mounting holding time T1~T5 between the pressing condition (F2, T1) and the previous pressing condition (F1, T5) as the pressing conditions used in the component mounting operation.

[0041] 9, if the protrusion amount E is smaller than the lower limit of the specified range even under the pressing conditions (F4, T5) that combine the maximum placement load F4 and the longest placement hold time T5, parameter setting processing unit 23 causes touch panel 19 to notify the same and waits for action by a person in charge. In other words, touch panel 19 is a notifying unit that notifies when the protrusion amount E of component D placed with the maximum load (placement load F4) and the longest time (placement hold time T5) is smaller than the lower limit of the specified range.

[0042] Furthermore, if the protrusion amount E is greater than the upper limit of the specified range despite the pressing condition (F1, T1) being the combination of the minimum placement load F1 and the shortest placement hold time T1, parameter setting processing unit 23 causes touch panel 19 to notify the same and waits for action by the person in charge. In other words, touch panel 19 is a notifying unit that notifies when the protrusion amount E of component D placed with the minimum load (placement load F1) and the shortest time (placement hold time T1) is greater than the upper limit of the specified range.

[0043] Next, a component mounting method using the component mounting apparatus 1 will be described with reference to the drawings and in accordance with the flow of Fig. 10. Fig. 10 is a flow diagram of a component mounting method according to an embodiment of the present disclosure. Here, an example will be described in which the pressing conditions (F, T) are changed in the order shown in Fig. 9, and the LDE component shown in Fig. 5 is mounted on the board B.

[0044] First, the parameter setting processing unit 23 sets the placement load F to the minimum (F1) (ST1: minimum placement load setting step). Next, the parameter setting processing unit 23 sets the placement hold time T to the shortest (T1) (ST2: shortest placement hold time setting step). Next, the parameter setting processing unit 23 causes the dispenser 15 to apply the liquid agent C to the board B (ST3: liquid agent application step) (FIG. 6). Next, the parameter setting processing unit 23 causes the nozzle 13 of the mounting head 11 to pick up the component D supplied by the component supply unit 4 (ST4: component pick-up step).

[0045] 10, the parameter setting processor 23 then lowers the nozzle 13 to land the component D on the liquid agent C applied (adhered) to the substrate B (ST5: component landing step). The parameter setting processor 23 further lowers the nozzle 13 to press the component D with the nozzle 13 under pressing conditions (F1, T1) (ST6: pressing step). By pressing the component D, the highly viscous liquid agent C (adhesive) is gradually crushed and spreads (FIG. 7), and overflows outside the component D (FIG. 8). Next, the parameter setting processor 23 causes the overflow amount detection means 29 to detect the overflow amount E of the liquid agent C from the component D, and determines whether the overflow amount E is within a specified range (ST7: overflow amount determination step).

[0046] If the protrusion amount E is not within the specified range (No in ST7) and is not greater than the upper limit of the specified range (No in ST8), the parameter setting processing unit 23 determines whether the attachment load F is maximum (F4) and the attachment retention time T is longest (T5) (ST9: upper limit determination step).If the attachment load F is not maximum (F4) and the attachment retention time T is not longest (T5) (No in ST9), the parameter setting processing unit 23 determines whether the attachment retention time T is longest (T5) (ST10: longest time determination step).

[0047] 10, if the placement hold time T is not the longest (T5) (No in ST10), the parameter setting processor 23 increases the placement hold time T by one step (T1 → T2) (ST11: time increase setting step). Then, the process returns to the pressing step (ST6), where component D is pressed under pressing conditions (F1, T2). Specifically, the parameter setting processor 23 causes the nozzle 13 to press component D with the placement load F1 for the time (T2 - T1) that is the difference between the placement hold time T2 and the placement hold time T1. Note that instead of pressing the next component D that has landed on the liquid C for the time difference, the next component D may be pressed under pressing conditions (F1, T2).

[0048] If the placement hold time T is the longest (T5) (Yes in ST10), the parameter setting processor 23 sets the placement load F to increase by one level (F1 → F2) (ST12: load increase setting step). Next, the shortest placement hold time setting step (ST2) is followed by the protrusion amount determination step (ST7), and using the next component D, it is determined whether the protrusion amount E under the pressing conditions (F2, T1) is within a specified range (ST7).

[0049] In FIG. 10, if the protrusion amount E is within the specified range (Yes in ST7), the parameter setting processing unit 23 sets the set pressing conditions (F, T) as the mounting load F and mounting hold time T to be used in the component mounting operation in which the mounting head 11 mounts the component D on the board B (ST13: within-range condition setting process).

[0050] If the protrusion amount is not within the specified range (No in ST7) and is greater than the upper limit of the specified range (Yes in ST8), the parameter setting processor 23 determines whether the placement load F is the minimum (F1) and the placement hold time T is the shortest (T1) (ST14: lower limit determination step). If the placement load F is not the minimum (F1) and the placement hold time T is not the shortest (T1) (No in ST14), the parameter setting processor 23 sets the pressing condition (F, T) between the currently set pressing condition (F, T) and the immediately previous pressing condition (F, T) as the placement load F and the placement hold time T to be used in the component mounting operation (ST15: estimated condition setting step).

[0051] If it is determined in the lower limit determination step (ST14) that the attachment load F is the minimum (F1) and the attachment retention time T is the shortest (T1) (Yes in ST14), the parameter setting processing unit 23 causes the touch panel 19 (notification unit) to notify that fact (ST16: notifying step). Also, if it is determined in the upper limit determination step (ST9) that the attachment load F is the maximum (F4) and the attachment retention time T is the longest (T5) (Yes in ST9), the notifying step (ST16) is executed.

[0052] In this way, the parameter setting processing unit 23 causes the mounting head 11 to mount the component D with a first load (mounting load F1) and a first time (mounting hold time T1) (ST5, ST6), and if it determines that the detected overhang amount E is smaller than the lower limit of the specified range (No in ST7, No in ST8, No in ST9), it causes the mounting head 11 to press the same component D with the first load and a second time (T2-T1) (ST6), and detects the overhang amount E of the component D pressed down at the second time (ST7).If it determines that the detected overhang amount E is within the specified range (Yes in ST7), it sets the first load as the mounting load F1 to be used in the work, and sets the sum (T2) of the first time (T1) and the second time (T2-T1) as the mounting hold time T2 to be used in the work (ST13).

[0053] Furthermore, the parameter setting processing unit 23 causes the mounting head 11 to place a component D with a first load (placement load F1) and a first time (placement hold time T5) (ST5, ST6), and if it determines that the detected overhang amount E is smaller than the lower limit of the specified range (No in ST7, No in ST8, No in ST9), it causes the mounting head 11 to place the next component D with a second load (placement load F2) that is greater than the first load and a second time (placement hold time T1) that is shorter than the first time (ST3 to ST6), and detects the overhang amount E of the next placed component D (ST7).

[0054] In addition, the parameter setting processing unit 23 may have the mounting head 11 place a component D with a first load (mounting load F1) and a first time (mounting hold time T1) (ST5, ST6), and if it determines that the detected overhang amount E is smaller than the lower limit of the specified range (No in ST7, No in ST8, No in ST9), it may have the mounting head 11 place the next component D with the first load and a second time (mounting hold time T2) longer than the first time (ST3 to ST6), and detect the overhang amount E of the next component D that has been placed (ST7).

[0055] Thus, in the component mounting method of this embodiment, at least one of the mounting load F for mounting the component D and the mounting holding time T for applying the mounting load F to the component D is under a pressing condition (F, T) different from the previous one. The component D is mounted on the liquid agent C adhered to the substrate B (ST5, ST6), the amount of protrusion E of the liquid agent C from the mounted component D is detected (ST7), and when the detected amount of protrusion E is within the specified range (Yes in ST7), the mounting load F and the mounting holding time T are set as the mounting load F and the mounting holding time T used in the component mounting operation for mounting the component D on the substrate B (ST13). Thereby, the mounting load F and the mounting holding time T used in the operation of mounting the component D on the liquid agent C applied to the substrate B can be appropriately set.

[0056] Next, referring to FIG. 11, another example of a method for changing the pressing condition (F, T) when the parameter setting processing unit 23 sets the mounting load F and the mounting holding time T will be described. FIG. 11 is an explanatory diagram of another example of a method for changing the pressing condition in the component mounting apparatus 1 according to an embodiment of the present disclosure. The other example shown in FIG. 11 is different from the example of FIG. 9 in that it searches for a pressing condition (F, T) in which the amount of protrusion E is within the specified range while decreasing the mounting load F or the mounting holding time T, rather than searching for a pressing condition (F, T) in which the amount of protrusion E is within the specified range while increasing the mounting load F or the mounting holding time T.

[0057] In the example of FIG. 11, first, the parameter setting processing unit 23 mounts the component D under the pressing condition (F4, T5) where the mounting load F is the maximum and the mounting holding time T is the longest, and then determines whether the amount of protrusion E is within the specified range. After that, the parameter setting processing unit 23 mounts the component D in order under the pressing conditions (F4, T4), (F4, T3), (F4, T2), (F4, T1) where the mounting load F4 is unchanged and the mounting holding time T is shortened (T1 < T2 < T3 < T4 < T5), and determines whether the amount of protrusion E is within the specified range.

[0058] If the protrusion amount E under pressing condition (F4, T1) is greater than the upper limit of the specified range, parameter setting processor 23 reduces the placement load F by one step (F4 → F3) and places component D under pressing conditions (F3, T5), (F3, T4), ..., (F3, T1) in order (F4>F3) with shorter placement hold time T, and determines whether the protrusion amount E is within the specified range. If the protrusion amount E is greater than the upper limit of the specified range, parameter setting processor 23 further reduces the placement load F in stages (F3 → F2 → F1) and places component D under conditions with gradually shorter placement hold time T, and determines whether the protrusion amount E is within the specified range.

[0059] Next, another example of the component mounting method by the component mounting apparatus 1 will be described with reference to the drawings and in accordance with the flow of Fig. 12. Fig. 12 is a flow diagram of another example of the component mounting method according to an embodiment of the present disclosure. The other example of Fig. 12 differs from the component mounting method shown in Fig. 10 in that the pressing conditions (F, T) are changed in the order shown in Fig. 11. Hereinafter, the same steps as those in the component mounting method shown in Fig. 10 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0060] First, the parameter setting processor 23 sets the placement load F to the maximum (F4) (ST21: maximum placement load setting process). Next, the parameter setting processor 23 sets the placement hold time T to the longest (T5) (ST22: longest placement hold time setting process). Next, the liquid agent application process (ST3) and the component suction process (ST4) are executed. Next, the component landing process ST5 is executed, and the pressing process (ST6) is executed under the set pressing conditions (F4, T5). Next, the overhang amount determination process (ST7) is executed, and if the overhang amount E is within the specified range (Yes in ST7), the range condition setting process (ST13) is executed.

[0061] 12, if the protrusion amount E is not within the specified range (No in ST7) and is smaller than the lower limit of the specified range (Yes in ST23), an upper limit determination step (ST9) is executed. Then, if the attachment load F is maximum (F4) and the attachment retention time T is longest (T5) (Yes in ST9), a notification step (ST16) is executed. Also, if the attachment load F is not maximum (F4) and the attachment retention time T is not longest (T5) (No in ST9), an estimation condition setting step (ST15) is executed.

[0062] If the protrusion amount E is not within the specified range (No in ST7) and the protrusion amount is not smaller than the lower limit of the specified range (No in ST23), a lower limit determination step (ST14) is executed. Then, if the attachment load F is the minimum (F1) and the attachment retention time T is the shortest (T1) (Yes in ST14), a notification step (ST16) is executed. Also, if the attachment load F is not the minimum (F1) and the attachment retention time T is not the shortest (T1) (No in ST14), the parameter setting processing unit 23 determines whether the attachment retention time T is the shortest (T1) (ST24: time shortest determination step).

[0063] 12, if the mounting holding time T is not the shortest (T1) (No in ST24), the parameter setting processing unit 23 sets the mounting holding time T to be decreased by one stage (T5 → T4) (ST25: time decrease setting step). Next, the liquid agent application step (ST3) to the overflow amount determination step (ST7) are executed, and using the next part D, it is determined whether the overflow amount E under the pressing condition (F4, T4) is within a specified range (ST7).

[0064] If the placement hold time T is the shortest (T1) (Yes in ST24), the parameter setting processor 23 sets the placement load F to be reduced by one level (F4 → F3) (ST26: load reduction setting step). Next, the maximum placement hold time setting step (ST22) is followed by the overhang amount determination step (ST7), in which the next component D is used to determine whether the overhang amount E under the pressing conditions (F3, T5) is within a specified range (ST7). This allows the placement load F and placement hold time T to be appropriately set in the operation of placing component D on liquid material C applied to substrate B.

[0065] In this way, the parameter setting processing unit 23 causes the mounting head 11 to mount the component D using a first load (mounting load F4) and a first time (mounting hold time T5) (ST5, ST6), and if it determines that the detected amount of overhang is greater than the upper limit of the specified range (No in ST7, No in ST23), it causes the mounting head 11 to mount the next component D using the first load and a second time (mounting hold time T4) that is shorter than the first time (ST3 to ST6), and detects the amount of overhang E of the next mounted component D (ST7).

[0066] In addition, the parameter setting processing unit 23 causes the mounting head 11 to place a component D with a first load (placement load F4) and a first time (placement hold time T1) (ST5, ST6), and if it determines that the detected amount of overhang is greater than the upper limit of the specified range (No in ST7, No in ST23), it causes the mounting head 11 to place the next component D with a second load (placement load F3) that is smaller than the first load and a second time (placement hold time T5) that is longer than the first time (ST3 to ST6), and detects the amount of overhang E of the next component D that has been placed (ST7).

[0067] As described above, component mounting apparatus 1 of this embodiment includes mounting head 11 that places component D on liquid C attached to board B, overflow amount detection means 29 that detects the amount of overflow E of liquid C from component D placed on board B, and a control unit (control device) that controls mounting head 11 and overflow amount detection means 29 to set a placement load F for placing component D and a placement hold time T for applying the placement load F to component D. The control unit then causes mounting head 11 to place component D so that at least one of the placement load F and the placement hold time T differs from the previous pressing conditions (F, T), detects the overflow amount E of the placed component D, and sets the placement load F and placement hold time T that bring the detected overflow amount E within a specified range as the placement load F and placement hold time T to be used by mounting head 11 in the component mounting operation in which component D is placed on board B.

[0068] This allows the placement load F and placement hold time T used in the task of placing component D on liquid agent C applied to substrate B to be appropriately set.

[0069] Note that, although the above description has been given of an example in which the component mounting apparatus 1 has the function of applying the liquid agent C to the substrate B, the present disclosure is not limited to this form. For example, a liquid agent application device that applies the liquid agent C to the substrate B, or a printing device that prints the liquid agent C on the substrate B, may be disposed upstream of the component mounting apparatus 1, and the component mounting apparatus 1 may receive the substrate B with the liquid agent C applied thereto from the upstream side and mount the component D on the liquid agent C applied to the substrate B. [Industrial Applicability]

[0070] The component mounting device and component mounting method disclosed herein have the effect of being able to appropriately set the mounting load and mounting hold time used in the process of mounting components onto a liquid agent applied to a substrate, and are useful in the field of mounting components onto substrates. [Explanation of symbols]

[0071] 1. Component mounting equipment 11 Mounting head 19 Touch panel (alarm unit) 29 Protrusion amount detection means B board C liquid D parts E Protrusion amount F, F1~F4 Mounting load T, T1~T5 Attachment retention time

Claims

1. a mounting head that places components on the liquid agent attached to the board; an overflow amount detection means for detecting an overflow amount of the liquid agent from the component mounted on the board; a control unit that controls the mounting head and the overhang amount detection means, and sets a placement load for placing the component and a placement hold time for applying the placement load to the component, The control unit The mounting head is caused to mount the components such that at least one of the mounting load and the mounting holding time is different from the previous condition; detecting the protrusion amount of the mounted component; the placement load and placement holding time for which the detected protrusion amount is within a specified range are set as the placement load and placement holding time to be used by the mounting head when placing the component on the board; Component mounting equipment.

2. The control unit Mounting the component on the mounting head at a first load and for a first time; If it is determined that the detected protrusion amount is smaller than the lower limit of the specified range, the mounting head mounts the next component with the first load and for a second time period longer than the first time period; detecting the protrusion amount of the next component that has been placed; The component mounting device according to claim 1 .

3. The control unit Mounting the component on the mounting head at a first load and for a first time; If it is determined that the detected protrusion amount is smaller than the lower limit of the specified range, the mounting head is caused to press down the same component with the first load and for a second time; detecting the protrusion amount of the component pressed during the second period of time; When it is determined that the detected protrusion amount is within the specified range, the first load is set as an attachment load to be used in the work, and the sum of the first time and the second time is set as an attachment holding time to be used in the work. The component mounting device according to claim 1 .

4. The control unit Mounting the component on the mounting head at a first load and for a first time; If it is determined that the detected protrusion amount is greater than the upper limit of the specified range, the mounting head mounts the next component with the first load and for a second time period that is shorter than the first time period; detecting the protrusion amount of the next component that has been placed; The component mounting device according to claim 1 .

5. The control unit Mounting the component on the mounting head at a first load and for a first time; If it is determined that the detected protrusion amount is smaller than the lower limit of the specified range, the mounting head mounts the next component with a second load that is larger than the first load; detecting the protrusion amount of the next component that has been placed; The component mounting device according to claim 1 .

6. The control unit causing the mounting head to mount the next component at the second load for a second time period shorter than the first time period; The component mounting device according to claim 5 .

7. The control unit Mounting the component on the mounting head at a first load and for a first time; If it is determined that the detected protrusion amount is greater than the upper limit of the specified range, the mounting head mounts the next component with a second load that is smaller than the first load; detecting the protrusion amount of the next component that has been placed; The component mounting device according to claim 1 .

8. The control unit causing the mounting head to mount the next component at the second load for a second time period longer than the first time period; The component mounting device according to claim 7 .

9. The apparatus further includes a notification unit that issues a notification when the protrusion amount of the component placed with the minimum load and in the shortest time is greater than the upper limit of the specified range. The component mounting device according to claim 1 .

10. The apparatus further includes a notification unit that issues a notification when the protrusion amount of the component placed with the maximum load and the longest time is smaller than the lower limit of the specified range. The component mounting device according to claim 1 .

11. A component mounting method using a component mounting apparatus that mounts components on a liquid agent attached to a substrate, comprising: placing the component on the liquid agent attached to the substrate under conditions where at least one of a placement load for placing the component and a placement holding time for applying the placement load to the component is different from a previous condition; Detecting the amount of the liquid agent spilling out from the attached component; the placement load and placement hold time for which the detected protrusion amount is within a specified range are set as the placement load and placement hold time to be used in the operation of placing the component on the board; Component mounting method.

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