Temperature sensor
The temperature sensor with a polyimide resin sealing part addresses peeling and adhesion issues by forming a film shape with flat surfaces, ensuring secure attachment and protection at high temperatures, and enabling flexible fitting to objects.
Patent Information
- Application Number
- JP2024033588
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-06
- Publication Date
- 2025-09-19
AI Technical Summary
Conventional temperature sensors face issues with the coverlay film peeling off at high temperatures and forming convex portions that hinder tight fit on objects, leading to gaps and poor adhesion.
A temperature sensor with a resin sealing part formed into a film shape with flat upper and lower surfaces, using polyimide resin, which can be bent to fit the object's shape and seal the thermal element, eliminating the need for a protective film and allowing tight adhesion without gaps on both surfaces.
The solution prevents peeling at high temperatures and ensures secure adhesion to objects without gaps, while protecting the thermal element and wiring, and allows for a thinner design with various film shapes, including strip, L, and Y shapes, capable of withstanding up to 250°C.
Smart Images
Figure 2025135695000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a temperature sensor that can achieve high adhesion to an object to be measured. [Background technology]
[0002] Conventionally, a temperature sensor has been known in which a thermistor element (heat-sensitive element) such as a chip thermistor or flake thermistor and a pair of wirings are provided on an insulating film made of polyimide resin, and a polyimide coverlay film is bonded to the insulating film as a protective film, covering the pair of wirings (for example, Patent Document 1). This temperature sensor uses a flexible insulating film and coverlay film, allowing it to be flexibly installed on the curved surface of an object to be measured. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-36177 Summary of the Invention [Problem to be solved by the invention]
[0004] The above conventional techniques still have the following problems. The conventional temperature sensor described above has the disadvantage that the coverlay film attached to the top surface of the insulating film is easily peeled off at high temperatures. In addition, because the thermal element is installed on the top surface of the insulating film, a convex portion is formed on the top surface of the temperature sensor. When the top side of the temperature sensor is installed on the object to be measured, a gap is created, making it difficult to make a tight fit.
[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a temperature sensor that is less likely to peel off even at high temperatures and can be adhered to the object to be measured on both the bottom and top surfaces. [Means for solving the problem]
[0006] The present invention employs the following configuration to solve the above problems: That is, a temperature sensor according to a first invention includes a heat-sensitive element, a pair of wires each having one end connected to the heat-sensitive element, and an insulating resin sealing part that seals the heat-sensitive element and at least one end of the pair of wires while leaving the other ends of the pair of wires exposed, and the resin sealing part is formed into a film shape with flat upper and lower surfaces.
[0007] In this temperature sensor, the resin sealing part that seals the thermal element is formed into a film with flat upper and lower surfaces, so that the flexible resin sealing part can be bent to fit the shape of the object to be measured while the thermal element is sealed inside, allowing it to come into surface contact with the object to be measured. Therefore, because no protective film such as a coverlay film is attached, there is no risk of the protective film peeling off at high temperatures as in conventional products, and the flat upper and lower surfaces allow it to be tightly attached to the object to be measured on both the upper and lower surfaces without any gaps. Furthermore, it is possible to protect the heat-sensitive element and wiring with the resin sealing portion, while also achieving a thinner design compared to the prior art. Furthermore, by solidifying the resin liquid in a mold to form the resin-sealed portion, it is possible to easily obtain a variety of film shapes, such as strip-shaped, L-shaped, or Y-shaped, depending on the mold.
[0008] A temperature sensor according to a second invention is the temperature sensor according to the first invention, characterized in that the resin sealing portion is formed in a strip shape. That is, in this temperature sensor, the resin sealing portion is formed in a strip shape, so that it can be wrapped around the curved surface of the object to be measured.
[0009] A temperature sensor according to a third invention is the temperature sensor according to the first or second invention, characterized in that the resin sealing portion is molded from polyimide resin. In other words, in this temperature sensor, the resin sealing portion is molded from polyimide resin, so it can withstand high temperatures up to 250°C, and can be easily molded and manufactured by embedding the heat-sensitive element portion in polyimide liquid and solidifying it. [Effects of the Invention]
[0010] According to the present invention, the following effects are achieved. In other words, according to the temperature sensor of the present invention, the resin sealing portion that seals the thermal element portion is formed into a film shape with flat upper and lower surfaces, so that the protective film does not peel off at high temperatures as in the past, and the flat upper and lower surfaces make it possible to adhere the sensor to the object to be measured without any gaps on both the lower and upper surfaces. [Brief explanation of the drawings]
[0011] [Figure 1] 1 is a perspective view showing an embodiment of a temperature sensor according to the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0012] An embodiment of a temperature sensor according to the present invention will be described below with reference to Fig. 1. In the drawings used in the following description, the scale has been appropriately changed so that each component is recognizable or easily recognizable.
[0013] As shown in Figure 1, the temperature sensor 1 of this embodiment comprises a heat-sensitive element portion 2, a pair of wires 3 one end of which is connected to the heat-sensitive element portion 2, and an insulating resin sealing portion 4 that seals the heat-sensitive element portion 2 and at least one end of the pair of wires 3 while leaving the other ends of the pair of wires 3 exposed. The resin sealing portion 4 is formed into a film shape with flat upper and lower surfaces.
[0014] Moreover, the resin sealing portion 4 is formed in a strip shape. That is, the temperature sensor 1 is in the form of a film and a strip with flat upper and lower surfaces as a whole. The resin sealing portion 4 is made of polyimide resin. For example, the resin sealing portion 4 may be made of the SPIXAREA NA series manufactured by Somar, which has heat resistance up to 250°C. The thickness of the resin sealing portion 4 is, for example, 1 mm.
[0015] The heat-sensitive element 2 is a chip thermistor or the like, and includes a thermistor body 2a and a pair of electrodes 2b formed on both ends of the thermistor body 2a. The pair of wires 3 are connected at their ends to the pair of electrodes 2b with solder. The wiring 3 is a lead wire having a core wire connected to the pair of electrodes 2b with a solder material and a resin coating covering the core wire. That is, the thermosensitive element part 2 connected to the pair of wires 3 is a so-called pine needle-shaped element. The other end 3b of the pair of wirings 3 protrudes from the resin sealing portion 4 and is exposed to the outside. The heat-sensitive element portion 2 may be a glass-molded chip thermistor connected to a core wire.
[0016] In the method for manufacturing the temperature sensor 1 of this embodiment, first, the heat-sensitive element portion 2 to which the pair of wires 3 are connected is placed in a mold, and the mold is filled with a polyimide liquid. Next, the polyimide liquid in the mold is solidified with the thermal element part 2 and the pair of wires 3 embedded, except for the other end 3b of the pair of wires 3, thereby sealing the thermal element part 2 and the pair of wires 3 and producing the temperature sensor 1.
[0017] In this way, in the temperature sensor 1 of this embodiment, the resin sealing portion 4 that seals the thermal element portion 2 is formed into a film shape with flat upper and lower surfaces, so that with the thermal element portion 2 sealed inside, the flexible resin sealing portion 4 can be bent to conform to the shape of the object to be measured and can be brought into surface contact with the object to be measured.
[0018] Therefore, since no protective film such as a coverlay film is attached, the protective film does not peel off at high temperatures as in the past, and the flat upper and lower surfaces make it possible to adhere closely to the object to be measured without any gaps on both the lower and upper surfaces. Moreover, it is possible to protect the heat-sensitive element section 2 and the wiring 3 with the resin sealing section 4, while achieving a thinner design compared to the prior art.
[0019] Furthermore, by forming the resin sealing portion 4 by solidifying a resin liquid such as a polyimide liquid in a mold, it is possible to easily obtain a variety of film shapes such as a strip shape, an L-shape, or a Y-shape depending on the mold. In particular, by forming the resin sealing portion 4 in a strip shape, it becomes possible to wrap it around the curved surface of the object to be measured. Furthermore, by molding the resin sealing portion 4 from polyimide resin, it is possible to withstand high temperatures up to, for example, 250°C, and it can be easily molded and produced by embedding the heat-sensitive element portion in polyimide liquid and solidifying it.
[0020] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. [Explanation of symbols]
[0021] 1...Temperature sensor, 2...Thermal element portion, 3...Wiring, 4...Resin sealing portion
Claims
1. a heat-sensitive element portion; a pair of wires each having one end connected to the heat-sensitive element; an insulating resin sealing portion that seals the heat-sensitive element portion and at least one end of the pair of wirings in a state where the other end of the pair of wirings is exposed; A temperature sensor characterized in that the resin sealing portion is formed into a film shape with flat upper and lower surfaces.
2. 2. The temperature sensor according to claim 1, The temperature sensor is characterized in that the resin sealing portion is formed in a strip shape.
3. 3. The temperature sensor according to claim 1, The temperature sensor is characterized in that the resin sealing portion is molded from polyimide resin.
Citation Information
Patent Citations
Temperature sensor
JP2023036177A