Effluent management inline cleaner

Abstract

To provide a cleaning apparatus, a method of removing contaminants from effluent within the cleaning apparatus, and an effluent management and filtration system.SOLUTION: A cleaning apparatus for cleaning electronic substrates includes a rinse module having a rinse station configured to perform a rinse of electronic substrates and a rinse tank in fluid communication with the rinse station and configured to receive effluent from the rinse station. The cleaning apparatus further includes an effluent management and filtration system in fluid communication with the rinse tank. The effluent management and filtration system includes a pump in fluid communication with the rinse tank, the pump being configured to pump effluent from the rinse tank, a first filter in fluid communication with the pump, the first filter being configured to remove larger particles from the effluent, and a second filter in fluid communication with the first filter and the rinse tank, and the second filter being configured to break down organics matter from the effluent.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] This application relates generally to apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, and more particularly to a system and method for filtering and cleaning contaminated water, sometimes referred to as effluent, within the cleaning apparatus. [Background technology]

[0002] Various types of liquid cleaning devices, sometimes called cleaners and cleaning machines, are used to clean electronic boards and remove contaminants such as flux residue, resins, etc. Typically, these contaminants may remain on electronic boards from the soldering process.

[0003] Soldering processes have advanced in two major directions in recent years: the transition from tin-lead solders to lead-free materials, and the miniaturization of electronic boards and the resulting increased density of small, low-profile components. These new soldering materials require higher soldering temperatures and are typically formulated with higher flux content by weight. The combination of lead-free processes and new electronic board designs requires more time and effort to meet industry cleanliness standards.

[0004] Cleaners are used to clean unwanted materials left on electronic boards by the soldering process. Such cleaners include one or more cleaning modules for cleaning electronic boards, including a washing station and a rinsing station. As the cleaning device's conveyor passes through the washing station, it captures unwanted chemicals and contaminants. These unwanted contaminants are typically removed in a chemical separation section in the rinse bath of the rinsing station. The contaminants are too diluted to be returned to the washing station and too contaminated to go to the rinsing station. Contaminated water is removed from the cleaning device through a drain in the rinsing bath, which may not be desirable. Summary of the Invention

[0005] One aspect of the present disclosure relates to a cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies. In one embodiment, the cleaning apparatus includes a rinse module including a rinse station configured to rinse the electronic substrate and a rinse bath in fluid communication with the rinse station and configured to receive waste liquid from the rinse station. The cleaning apparatus further includes a waste liquid management and filtration system in fluid communication with the rinse bath. The waste liquid management and filtration system includes a pump in fluid communication with the rinse bath and configured to pump the waste liquid from the rinse bath, a first filter in fluid communication with the pump and configured to remove larger particles from the waste liquid, and a second filter in fluid communication with the first filter and the rinse bath and configured to break down organic matter from the waste liquid.

[0006] Embodiments of the cleaning apparatus may further include configuring the rinse bath to include a chemical separation return in fluid communication with the pump. The rinse module may further include a chemical separation station in fluid communication with the rinse station and the chemical separation return of the rinse bath. The rinse module may further include a final rinse station in fluid communication with the rinse bath, the final rinse station configured to perform a final rinse of the electronic substrate. The waste management and filtration system may further include a first valve configured to control the flow of waste to the first filter and a second valve configured to control the flow of waste from the first filter to the second filter. The cleaning apparatus may further include a cleaning module including a cleaning station configured to clean the electronic substrate and a cleaning bath in fluid communication with the cleaning station. The cleaning bath may be configured to receive waste from the cleaning station. The waste management and filtration system may further include a third valve configured to control the flow of waste from the first filter to the cleaning bath. The third valve may be further configured to control the flow of waste to the chemical separation return of the rinse bath. The cleaning apparatus may further include a controller coupled to the pump, the first valve, and the second valve to control the flow of the waste liquid through the waste liquid management and filtration system. The cleaning apparatus may further include a deionized water supply configured to deliver deionized water to the final rinse station. The deionized water supply may be further configured to deliver deionized water to at least one of the first filter and the second filter to perform a backflow cleaning operation. The first filter may be a ceramic water filter, and the organic filter may be configured to apply an advanced oxidation process using ultraviolet (UV) light to decompose organic matter remaining in the waste liquid.

[0007] Another aspect of the present disclosure relates to a method for removing contaminants from waste liquid in a cleaning apparatus including a rinse module having a rinse station configured to rinse electronic substrates and a rinse bath in fluid communication with the rinse station to receive the waste liquid from the rinse station. In one embodiment, the method includes transporting the electronic substrates through the rinse module with a conveyor system, pumping the waste liquid from the rinse bath to a first filter with a pump, filtering the waste liquid with the first filter, delivering the waste liquid from the first filter to a second filter, filtering the waste liquid with the second filter, and returning the filtered waste liquid to the rinse bath.

[0008] An embodiment of the method may further include controlling the flow of waste liquid from the pump to the first filter using a first valve. The method may further include controlling the flow of waste liquid from the first filter to a second filter using a second valve. The method may further include controlling the flow of waste liquid from the first filter to a cleaning bath of a cleaning module having a cleaning station configured to clean electronic substrates. The method may further include controlling the flow of waste liquid from the first filter to a chemical separation return of a rinse bath. The method may further include delivering deionized water to a final rinse station of the rinse module. The method may further include delivering deionized water to the second filter to perform a backflow cleaning operation of the second filter.

[0009] Yet another aspect of the present disclosure relates to a waste fluid management and filtration system for a cleaning apparatus configured to clean electronic substrates, including printed circuit boards and semiconductor product assemblies. In one embodiment, the waste fluid management and filtration system includes a pump in fluid communication with a rinse bath of a rinse module and configured to pump waste fluid from the rinse bath, a first filter in fluid communication with the pump and configured to remove larger particles from the waste fluid, and a second filter in fluid communication with the first filter and the rinse bath and configured to break down organic matter from the waste fluid.

[0010] An embodiment of the waste management and filtration system may further include configuring the rinse bath to include a chemical separation return in fluid communication with the pump. The rinse module may further include a chemical separation station in fluid communication with the rinse station and the chemical separation return of the rinse bath. The rinse module may further include a final rinse station in fluid communication with the rinse bath, the final rinse station configured to perform a final rinse of the electronic substrate. The waste management and filtration system may further include a first valve configured to control the flow of waste to the first filter and a second valve configured to control the flow of waste from the first filter to the second filter. The waste management and filtration system may further include a third valve configured to control the flow of waste from the first filter to the cleaning bath of the cleaning module. The third valve may further be configured to control the flow of waste to the chemical separation return of the rinse bath. The waste management and filtration system may further include a controller coupled to the pump, the first valve, and the second valve to control the flow of the waste liquid through the waste management and filtration system. The deionized water supply may be configured to deliver deionized water to the final rinse station. The deionized water supply may be further configured to deliver deionized water to at least one of the first filter and the second filter to perform a backflow cleaning operation. The first filter may be a ceramic water filter, and the organic filter may be configured to apply an advanced oxidation process using ultraviolet (UV) light to decompose organic matter remaining in the waste liquid.

[0011] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in various figures is represented by a like reference numeral. For clarity, not every component may be labeled in every drawing. [Brief explanation of the drawings]

[0012] [Figure 1]FIG. 2 is a perspective view of the electronic substrate cleaning device. [Figure 2] FIG. 2 is a schematic view of a portion of a cleaning device. DETAILED DESCRIPTION OF THE INVENTION

[0013] Solder paste is routinely used in the assembly of electronic substrates, including printed circuit boards and semiconductor product assemblies, to join electronic components to the substrate. Solder paste contains a solder for joint formation and a flux for preparing the metal surface for solder attachment. Solder paste can be deposited onto metal surfaces (e.g., electronic pads) on electronic substrates using any number of application methods. In one example, a stencil printer may use a squeegee to extrude the solder paste through a metal stencil laid on the exposed surface of the electronic substrate. In another example, a dispenser may dispense the solder paste material onto specific areas of the electronic substrate. The leads of the electronic component are aligned and pressed into the solder deposit to form the assembly. In the reflow soldering process, the solder is heated to a temperature sufficient to melt and then cooled to permanently bond the electronic component to the electronic substrate electrically and mechanically. Solder typically comprises an alloy with a melting temperature lower than that of the metal surfaces being joined. The temperature must also be low enough to avoid damaging the electronic component. In certain embodiments, the solder may be a tin-lead alloy. However, solders using lead-free materials may also be used. Another process for attaching components to electronic boards is the wave soldering process.

[0014] For soldering, flux typically contains a vehicle, solvent, activator, and other additives. The vehicle is a solid or nonvolatile liquid that coats the surfaces to be soldered and can include rosin, resin, glycol, polyglycol, polyglycol surfactant, and glycerin. The solvent, which evaporates during the preheating and soldering process, dissolves the vehicle activator and other additives. Typical examples of solvents include alcohol, glycol, glycol ester and / or glycol ether, and water. The activator promotes the removal of metal oxides from the surfaces to be soldered. Common activators include amine hydrochlorides, dicarboxylic acids such as adipic acid and succinic acid, and organic acids such as citric acid, malic acid, or abietic acid. Other flux additives include surfactants, viscosity modifiers, and additives to provide low slump or good tack to hold components in place before reflow.

[0015] As described above, the soldering process described herein leaves unwanted contaminants on electronic boards that must be cleaned before use. Disclosed herein is an in-line cleaning process for removing unwanted contaminants from waste fluids used in manufacturing processes. Specifically, a cleaning device is used to clean the unwanted material left behind by the soldering process from the electronic boards. Embodiments of the present disclosure relate to a cleaning device that can automatically adjust the height of the cleaning device's spray nozzle to adjust the distance between the spray nozzle and the electronic board being cleaned.

[0016] It should be understood that the system and device embodiments discussed herein are not limited in application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The systems and devices may be implemented in other embodiments and may be practiced or carried out in various ways. Examples of specific implementations are provided herein for purposes of illustration only and are not intended to be limiting. Additionally, the phraseology and terminology used herein are for purposes of description and should not be considered limiting. The use of "including," "comprising," "having," "containing," "accompanying," and variations thereof herein is intended to encompass the preceding listed items and equivalents thereof, as well as additional items. Terms described with "or" may be construed as inclusive, such that they may refer to a singular term, more than one term, and all of the described terms. References to front, back, left, right, top, bottom, above and below, and vertical and horizontal are for convenience of description and do not limit the present systems and methods or components thereof to any single positional or spatial orientation.

[0017] Referring now to the drawings, and more particularly to FIG. 1 , an electronic substrate cleaning apparatus is generally designated 10. As shown, the cleaning apparatus 10 is an elongated structure including several modules, each designated 12, for cleaning and processing electronic substrates. In one exemplary embodiment, the cleaning apparatus 10 includes one or more of the following modules: a pre-clean module, a cleaning module, a pre-rinse module, a rinse module, and a drying module. Electronic substrates traveling through the cleaning apparatus 10 are cleaned in the pre-clean and cleaning modules, rinsed in the pre-rinse and rinse modules, and dried in the drying module. A control module having a user interface, together designated 14, provides an operator with the ability to program and monitor the cleaning apparatus 10. In one specific embodiment, the cleaning apparatus 10 includes an Aquastorm™ series cleaner platform offered by the Electrovert Cleaners division of ITW Electronic Assembly Equipment, Inc., Camdenton, Missouri.

[0018] The cleaning apparatus 10 further includes an elongated conveyor 16 configured to transport electronic boards, such as electronic board 18, through the modules 12 of the cleaning apparatus. The conveyor 16 is designed to securely hold the electronic boards during the sometimes vigorous cleaning process. Trays may be used to support items transported by the conveyor 16 through the cleaning apparatus 10 for cleaning. Embodiments of the present disclosure relate to cleaning the wastewater resulting from this cleaning process, thereby reducing the need to discharge the wastewater through a drain. In one embodiment, the cleaning apparatus 10 is configured to clean the used water through a filtration process, allowing the water to be reused within the cleaning apparatus.

[0019] Referring to FIG. 2 , the cleaning module is generally indicated at 20 and the rinsing module is generally indicated at 22. As shown, the cleaning module 20 includes a washing station 24 and a washing basin 26 in fluid communication with the washing station. Objects, such as electronic substrates 18, cleaned in the cleaning module 20 proceed to the rinsing module 22 for rinsing. The washing station 24 of the cleaning module 20 is provided to wash or otherwise clean the electronic substrates and remove contaminants therefrom. Water used to wash the electronic substrates in the washing station 24 is routed to the washing basin 26, where the used or contaminated water or waste liquid can be treated as described below.

[0020] As shown in FIG. 2 , the rinse module 22 includes a rinse station 28, a final rinse station 30, and a rinse bath 32. As their names suggest, the rinse station 28 and the final rinse station 30 are provided to rinse off contaminants and other unwanted materials remaining on the electronic substrates after the cleaning station 24 of the cleaning module 20. The rinse station 28 and the final rinse station 30 are in fluid communication with the rinse bath 32. Specifically, used or contaminated water (waste water) generated by the rinse station 28 and the final rinse station 30 is discharged into the rinse bath 32. Used water is discharged from the rinse station 28 and the final rinse station 30 to the rinse bath 32. The rinse module 22 further includes a deionized (DI) water supply 34 configured to deliver deionized water to the final rinse station 30. As shown, the DI water supply 34 is in fluid communication with the final rinse station 30 to supply deionized water to the final rinse station 30. Additionally, a DI water supply 34 may supply deionized water to the cleaning station 24 of the cleaning module 20. Although deionized water is specified, any type of purified water suitable for removing contaminants from electronic substrates may be utilized.

[0021] The water delivered to the rinse bath 32 by the rinse station 28 and the final rinse station 30 can be recycled within the cleaning apparatus 10. Specifically, the rinse module 22 further includes a pump 36 configured to pump water from the rinse bath 32 back to the rinse station 28 to perform a rinse function prior to the final rinse function at the final rinse station 30. As contaminants build up in the rinse station 28, the water is delivered to a chemical separation station 38 to separate the contaminated water. This contaminated water is delivered from the chemical separation station 38 to a chemical separation return 40 coupled to the rinse bath. In one embodiment, the chemical separation return 40 is part of the rinse bath 32. As discussed above, this contaminated water is typically discharged from the rinse bath 32 via a drain.

[0022] An embodiment of the present disclosure relates to a liquid waste management and filtration system, generally designated 50 in FIG. 2. As known, filtration is a physical separation process designed to separate solid matter and particles from a fluid, typically by a filter or filter media having a structure that allows only the fluid to pass through. Solid particles that are unable to pass through the filter can be identified as filtrate. As shown, the liquid waste management and filtration system 50 includes a multi-stage system, namely, a solids filter 52 and an organics filter 54. As used herein, the solids filter 52 may be referred to as a first filter, and the organics filter 54 may be referred to as a second filter.

[0023] The waste management and filtration system 50 further includes a pump 56 configured to pump the contaminated water from the chemical separation return 40 of the rinse vessel 32 to a solids filter 52. As described in more detail below, the solids filter 52 is configured to remove larger particles from the waste water. Once filtered by the solids filter, the water is directed to an organics filter 54. Specifically, the pressurized waste water flows from the solids filter 52 to the organics filter 54. As described in more detail below, the organics filter 54 is configured to break down organic matter from the waste water. Upon completion of the multi-stage filtration process, the treated water is returned to the rinse vessel 32.

[0024] The waste management and filtration system 50 further includes a solids filter 52, an organic filter 54, and several valves for controlling the flow of waste to the cleaning tank 26 coupled to the cleaning module 20. In one embodiment, a valve 58 is provided between the pump 56 and the solids filter 52 to control the flow of waste from the chemical separation return 40 of the rinse tank 32 to the solids filter. As used herein, the valve 58 may also be referred to as a first valve. Another valve 60 is provided between the solids filter 52 and the organic filter 54 to control the flow of waste treated by the solids filter to the organic filter. As used herein, the valve 60 may also be referred to as a second valve.

[0025] An additional valve 62 is provided between the solids filter 52 and the wash tank 26 of the washing module 20 to divert flow to the wash tank during a backflush operation. Specifically, the valve 62 is opened during a backflush operation when untreated water containing contaminants is pumped back to the wash tank 26. During normal operation, the valve 62 is configured to allow the flow of waste liquid through the solids filter 52 and back to the chemical separation return 40 of the rinse tank 32.

[0026] In one embodiment, a controller, such as the control module 14 of the cleaning apparatus 10, is coupled to the pump 56 and valves 58, 60, and 62 to control the flow of waste liquid through the waste management and filtration system 50. During a "normal" cycle, the valve 58 is open to allow the pump 56 to pump contaminated waste liquid from the chemical separation return 40 to the solids filter 52. The valve 60 is also open to allow the waste liquid, under pressure, treated by the solids filter 52 to flow to the organics filter 54. The fully treated water, under pressure, flows back to the rinse tank 32. In the rinse tank 32, the treated water can be used to perform a rinsing function at the rinse station 28, and the pump 36 controls the flow of treated water to the rinse station. The controller is further configured to control the pump 36.

[0027] To clean solids filter 52, valve 58 is closed and DI water supply 34, not shown, is configured to deliver deionized water to the solids filter for cleaning. When cleaning solids filter 52, valve 62 is opened to allow backflush solids to flow to wash tank 26.

[0028] To clean the organic filter 54, the DI water supply 34 is configured to deliver deionized water to the organic filter. Another valve 64 is provided between the DI water supply 34 and the valve 60 to control the flow of deionized water to the organic filter 54. The deionized water delivered to the organic filter 54 is provided to perform a backflow cleaning operation of the organic filter. As shown, the valves 64 and 60 control the flow of deionized water to the organic filter 54. Like the valves 58, 60, and 62, the valve 64 is coupled to a controller to control the flow of deionized water. Once the deionized water has passed through the organic filter 54, it is returned to the rinse tank 32.

[0029] In one embodiment, solid filter 52 is a ceramic water filter having small pores made of ceramic material for filtering particulate matter from water. As is known, ceramic water filters are used to capture particulates in water.

[0030] In one embodiment, the organic filter 54 is a water filter specifically designed to break down organic matter from the effluent. In certain embodiments, the organic filter 54 is configured to apply an advanced oxidation process using ultraviolet (UV) light to break down any remaining organic matter in the effluent. This process can utilize a titanium dioxide tube with UV light. Other types of organic filters, such as carbon filters, can be used in addition to or instead of the titanium dioxide tube.

[0031] It should be noted that the waste management and filtration system 50 provides a closed-loop system for removing contaminants from the waste liquid. In some embodiments, substantially all of the water used in the rinse module 22 can be recycled and reused.

[0032] A process for removing contaminant materials from the effluent is also provided. Such a process can include three stages or steps. In one embodiment, stage 1 involves recovering the contaminant materials from the effluent in the chemical separation return 40. Stage 2 then involves operating a pump 56 to drive the movement of the contaminant materials to a solids filter 52 for removal of larger contaminants. Stage 3 then involves sending the filtered effluent from the solids filter 52 to an organics filter 54, e.g., a titanium dioxide tube, which provides an advanced oxidation process using UV light to decompose any organics remaining in the filtered effluent. Once processed by the solids filter 52 and organics filter 54, the treated water is sent to the rinse tank 32 and ultimately to the DI generation system for recycling.

[0033] The process further includes cleaning the filters, including cleaning the solids filter 52 and the organics filter 54 as described above. Specifically, the solids filter 52 can be cleaned offline by automatically backflushing the solids filter, which opens the pores of the solids filter.

[0034] It should be understood that the above description is intended only as an illustration and example, and is not intended to be limiting, and that variations and modifications are possible. For example, the cleaning apparatus 10 described above may be any type of cleaning machine used to clean electronic substrates. Accordingly, other embodiments are contemplated, and modifications and variations may be made without departing from the scope of the present application.

[0035] In one embodiment, the control module 14 of the cleaning apparatus 10 is configured with an operating system, such as a Windows®-based operating system, that provides familiar pull-down menus and has data logging and barcode capabilities. The operating system is easily networked for recipe downloads and remote access to operating data. The user interface provides quick and easy visibility into system pressure, water level, pump and blower operation, temperature, and fill / drain operation. Additionally, the user interface can be configured to control the operation of the height-adjustable spray system, particularly the actuator.

[0036] Various controllers, such as control module 14, can perform the various operations described above. Using data stored in associated memory and / or storage devices, control module 14 can also execute one or more instructions stored on one or more non-transitory computer-readable media that control module 14 may include and / or be coupled to, resulting in manipulated data. In some examples, control module 14 may include one or more processors or other types of controllers. In one example, control module 14 is or includes at least one processor. In other examples, control module 14 performs at least some of the operations described above using application-specific integrated circuits tailored to perform specific operations in addition to or instead of a general-purpose processor. As illustrated by these examples, examples according to the present disclosure can perform the operations described herein using many specific combinations of hardware and software, and the present disclosure is not limited to any particular combination of hardware and software components. Examples of the present disclosure may include computer program products configured to perform the methods, processes, and / or operations described above. The computer program product may be or include one or more controllers and / or processors configured to execute instructions for performing the methods, processes, and / or actions described above.

[0037] Many process parameters can be set through a computerized operator interface provided on the cleaning apparatus 10. System pressure, water level, and temperature are easily accessible. Data logging and bar coding capabilities are features that enhance and streamline the production process.

[0038] In some embodiments, the cleaning apparatus 10 can include one or more rear panels that can be easily removed for maintenance. A front door can also be provided to provide quick access to the electrical panel, computer, heater, float, thermocouple, and waste management and filtration system components. The cleaning apparatus 10 can include a hinged tempered glass window to provide optimal visibility and access.

[0039] Having thus described several aspects of at least one embodiment of this disclosure, it should be understood that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the spirit and scope of this disclosure. Accordingly, the foregoing description and drawings are by way of example only.

Claims

1. 1. A cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, comprising: a rinse module including a rinse station configured to rinse the electronic substrate and a rinse tank in fluid communication with the rinse station, the rinse tank configured to receive waste liquid from the rinse station; a waste management and filtration system in fluid communication with the rinse bath, a pump in fluid communication with the rinse bath, the pump configured to pump waste liquid from the rinse bath; a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the effluent; a second filter in fluid communication with the first filter and the rinse bath, the second filter configured to decompose organic matter from the effluent; a waste liquid management and filtration system including: A cleaning device comprising:

2. The cleaning apparatus of claim 1 , wherein the rinse bath includes a chemical separation return in fluid communication with the pump.

3. The cleaning apparatus of claim 2 , wherein the rinse module further comprises a chemical separation station in fluid communication with the rinse station and the chemical separation return of the rinse bath.

4. The cleaning apparatus of claim 1 , wherein the rinse module further comprises a final rinse station in fluid communication with the rinse bath, the final rinse station configured to provide a final rinse of the electronic substrate.

5. 10. The cleaning device of claim 1, wherein the waste liquid management and filtration system further comprises: a first valve configured to control the flow of the waste liquid to the first filter; and a second valve configured to control the flow of the waste liquid from the first filter to the second filter.

6. a cleaning module including a cleaning station configured to clean the electronic substrate and a cleaning basin in fluid communication with the cleaning station, the cleaning basin configured to receive waste fluid from the cleaning station; the waste management and filtration system further includes a third valve configured to control the flow of the waste liquid from the first filter to the wash tank. The cleaning device according to claim 5 .

7. 7. The cleaning apparatus of claim 6, wherein the third valve is further configured to control the flow of the waste liquid to a chemical separation return of the rinse bath.

8. 6. The cleaning apparatus of claim 5, further comprising a controller coupled to the pump, the first valve, and the second valve for controlling the flow of the waste liquid through the waste liquid management and filtration system.

9. The cleaning apparatus of claim 1 , further comprising a deionized water supply configured to deliver deionized water to the final rinse station.

10. 10. The cleaning apparatus of claim 9, wherein the deionized water supply is further configured to deliver deionized water to at least one of the first filter and the second filter for performing a backflow cleaning operation.

11. 2. The cleaning device of claim 1, wherein the first filter is a ceramic water filter, and the organic matter filter is configured to apply an advanced oxidation process using ultraviolet (UV) light to decompose organic matter remaining in the waste liquid.

12. 1. A method for removing contaminants from waste liquid in a cleaning apparatus, the cleaning apparatus including a rinse module having a rinse station configured to rinse electronic substrates and a rinse bath in fluid communication with the rinse station, the rinse bath configured to receive waste liquid from the rinse station, the method comprising: conveying electronic substrates through the rinse module by the conveyor system; pumping the waste liquid from the rinse tank to a first filter using a pump; performing a filtering operation of the waste liquid using the first filter; Passing the effluent from the first filter to a second filter; filtering the waste liquid using the second filter; Returning the filtered waste liquid to the rinse tank; A method comprising:

13. 13. The method of claim 12, further comprising controlling the flow of waste liquid from the pump to the first filter with a first valve.

14. 14. The method of claim 13, further comprising controlling the flow of effluent from the first filter to the second filter with a second valve.

15. 15. The method of claim 14, further comprising controlling a flow of waste liquid from the first filter to a cleaning bath of a cleaning module, the cleaning module having a cleaning station configured to clean electronic substrates.

16. 16. The method of claim 15, further comprising controlling the flow of waste liquid from the first filter to a chemical separation return of the rinse tank.

17. The method of claim 12 further comprising delivering deionized water to a final rinse station of the rinse module.

18. 18. The method of claim 17, further comprising directing deionized water through at least one of the first filter and the second filter to perform a backflow cleaning operation.

19. 1. A liquid waste management and filtration system for a cleaning apparatus configured to clean electronic substrates, including printed circuit boards and semiconductor product assemblies, comprising: a pump in fluid communication with the rinse reservoir of the rinse module, the pump configured to pump waste liquid from the rinse reservoir; a first filter in fluid communication with the pump, the first filter configured to remove larger particles from the effluent; a second filter in fluid communication with the first filter and the rinse bath, the second filter configured to decompose organic matter from the effluent; 1. A liquid waste management and filtration system comprising:

20. 20. The waste liquid management and filtration system of claim 19, further comprising: a first valve configured to control the flow of the waste liquid to the first filter; and a second valve configured to control the flow of the waste liquid from the first filter to the second filter.

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