Processing liquid filling method and processing liquid supply device

Abstract

To enable a processing liquid supply device to supply clean processing liquid in a short time.SOLUTION: In a method for filling a processing liquid supply device that supplies processing liquid to a discharge portion with processing liquid, the processing liquid supply device includes a tank, a supply pipeline connecting the tank and the discharge portion, a pump that pressure-feeds the processing liquid to the discharge portion, a filter interposed between the tank and the pump and filtering the processing liquid, a trap interposed between the pump and the filter and separating gas from the processing liquid, and a bypass pipeline branching off between the tank and the filter and connected to the trap, and the method includes, after the supply pipeline is cleaned with a cleaning liquid different from the processing liquid, a step of flowing the cleaning liquid from the tank through the filter while a flow path leading to the pump is blocked such that the cleaning liquid does not flow to the pump, thereby cleaning the filter, and a step of subsequently flowing the processing liquid from the tank through the filter in both forward and reverse directions while a flow path leading to the pump is blocked such that the processing liquid does not flow to the pump, thereby cleaning the filter.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a treatment liquid filling method and a treatment liquid supply device. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus including a nozzle for discharging a processing liquid, a processing liquid supply unit for supplying the processing liquid to the nozzle, and a controller. The processing liquid supply unit in this substrate processing apparatus includes a tank for storing the processing liquid, a first conduit for conducting the processing liquid from the tank to the nozzle, a pump provided in the first conduit, and a filter provided in the first conduit between the tank and the pump, the filter including a first space on the tank side, a second space on the pump side, and a filter for separating the first space from the second space. The controller in the substrate processing apparatus is configured to execute a first control for controlling the processing liquid supply unit so that the pump causes the processing liquid to flow from the first space side to the second space side through the filter, and a second control for controlling the processing liquid supply unit so that the pump causes the processing liquid to flow from the second space side to the first space side through the filter, after the first control. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-32688 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure enables the supply of clean processing liquid from the processing liquid supply device in a short time. [Means for solving the problem]

[0005] One aspect of the present disclosure is a method for filling a processing liquid supply device with a processing liquid, the processing liquid supply device supplying the processing liquid to a discharge portion that discharges the processing liquid onto a substrate, the processing liquid supply device including: a tank that stores the processing liquid; a supply line connecting the tank and the discharge portion; a pump that is disposed in the supply line and pressure-feeds the processing liquid to the discharge portion; a filter that is disposed in the supply line between the tank and the pump and filters the processing liquid; a trap that is disposed in the supply line between the pump and the filter and separates gas from the processing liquid; and a bypass line connected to a pump, and the method includes the steps of: after the supply line has been cleaned with a cleaning liquid, which is a chemical liquid different from the processing liquid, flowing the cleaning liquid from the tank through the filter interposed in the supply line with a flow path leading to the pump, including the supply line, blocked so that the cleaning liquid does not flow to the pump, and cleaning the filter; and thereafter, flowing the processing liquid from the tank through the filter interposed in the supply line in both forward and reverse directions with a flow path leading to the pump, including the supply line, blocked so that the processing liquid does not flow to the pump, and cleaning the filter. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to supply clean processing liquid from the processing liquid supply device in a short time. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is an explanatory diagram illustrating an outline of the configuration of a processing liquid supply device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0008] The configuration of the treatment liquid supply device according to this embodiment will be described below with reference to the drawings. In this specification, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted.

[0009] <Coating and developing equipment> FIG. 1 is an explanatory diagram showing an outline of the configuration of a processing liquid supplying device according to this embodiment. 1 is for a semiconductor manufacturing apparatus, and supplies a processing liquid to a discharge nozzle 1 as a discharge unit. The processing liquid supply device 100 may supply a processing liquid to a plurality of discharge nozzles.

[0010] The discharge nozzle 1 discharges a processing liquid onto a semiconductor wafer (hereinafter referred to as a "wafer") W serving as a substrate, for processing the wafer W. Specifically, the discharge nozzle 1 discharges the processing liquid onto the wafer W held by a spin chuck 2, which is a holding part. In this embodiment, the processing liquid supplied by the processing liquid supply device 100 and discharged by the discharge nozzle 1 is a resist liquid, but may be of another type.

[0011] The processing liquid supply device 100 includes a tank 101 and a supply pipe 150 .

[0012] The tank 101 contains a resist liquid. When the processing liquid supplying apparatus 100 is cleaned with a cleaning liquid, which is a chemical liquid different from the resist liquid, as will be described later, the tank 101 may also contain the cleaning liquid. The tank 101 is connected to a liquid supply mechanism M1 and a pressurizing mechanism M2.

[0013] The liquid supply mechanism M1 supplies a resist liquid or a cleaning liquid. For example, a replaceable resist bottle for storing the resist liquid is attached to the liquid supply mechanism M1, and a cleaning liquid supply source is connected to the liquid supply mechanism M1. The liquid supply mechanism M1 has a switching valve for switching on / off the supply of the liquid to the tank 101.

[0014] The pressurizing mechanism M2 applies pressure to the inside of the tank 101, thereby causing, for example, the resist solution or the cleaning solution in the tank 101 to be sent to the supply pipe 150. The pressurizing mechanism M2 is connected to a supply source of an inert gas such as nitrogen gas, and has a switching valve or the like that switches between supplying and stopping the inert gas to the tank 101.

[0015] The tank 101 is provided with a liquid level sensor (not shown) that detects the amount of liquid remaining in the tank 101, and based on the detection results from this liquid level sensor, the liquid supply mechanism M1 is controlled to start / stop refilling the tank 101 with resist liquid or cleaning liquid.

[0016] The supply pipe 150 connects the tank 101 and the discharge nozzle 1. A filter 102, a trap 103, and a pump 104 are disposed in the supply pipe 150 in this order from the upstream side, i.e., from the tank 101 side. That is, the filter 102 is disposed in the supply pipe 150 between the tank 101 and the pump 104, and the trap 103 is disposed in the supply pipe 150 between the filter 102 and the pump 104. Hereinafter, in the supply pipe 150, the portion between the tank 101 and the filter 102 is referred to as a first pipe L1, the portion between the filter 102 and the trap 103 is referred to as a second pipe L2, the portion between the trap 103 and the pump 104 is referred to as a third pipe L3, and the portion between the pump 104 and the discharge nozzle 1 is referred to as a fourth pipe L4.

[0017] An on-off valve V1 is provided in the first pipeline L1, and a supply control valve V2 is provided in the fourth pipeline L4.

[0018] The filter 102 filters the resist liquid to remove particles, i.e., foreign matter. The filter 102 includes a first space K1 on the tank 40 side (i.e., the primary side), a second space K2 on the pump 104 side (i.e., the secondary side), and a filter medium F1 that separates the first space K1 from the second space K2. The first space K1 is connected to a first line L1 of the supply pipe 150, and the second space K2 is connected to a second line L2 of the supply pipe 150. A drain pipe 151 is also connected to the first space K1 to discharge the resist liquid from the first space K1 to the outside of the filter 102 without passing through the filter medium F1 and the second space K2. An on-off valve V3 is provided in the drain pipe 151.

[0019] The trap 103 separates gas from the resist liquid. The trap 103 is connected to the second pipe L2 and the third pipe L3, as well as to a drain pipe 152 for discharging the resist liquid therein to the outside. The drain pipe 152 is provided with an on-off valve V4. The drain pipe 151 and the drain pipe 152 may be joined together. Furthermore, the trap 103 is connected to a bypass line 153 that branches off from the supply line 150 between the tank 101 and the filter 102. Specifically, the bypass line 153 branches off from the first line L1 of the supply line 150 between the tank 101 and the on-off valve V1. The bypass line 153 is provided with an on-off valve V5. Furthermore, the trap 103 is further connected to a liquid delivery pipe 154, which will be described later.

[0020] The pump 104 pumps the resist liquid to the discharge nozzle 1. The pump 104 is, for example, a diaphragm pump, and is partitioned by a diaphragm into a pump chamber and an operating chamber. The pump chamber is connected to a third line L3 of the supply line 150 via an on-off valve V11 and receives the resist liquid from the third line L3. The pump chamber is also connected to a fourth line L4 of the supply line 150 via an on-off valve V12 and delivers the resist liquid to the fourth line L4. The pump chamber is also connected to a liquid delivery line 154 via an on-off valve V13 and delivers, for example, the resist liquid to the liquid delivery line 154. The end of the liquid delivery line 154 opposite to the pump 104 side is connected to the trap 103. That is, the liquid delivery line 154 connects the pump chamber of the pump 104 and the trap 103.

[0021] The working chamber of the pump 104 is connected to a driving means for controlling the pressure reduction and pressure increase in the working chamber.

[0022] The processing liquid supplying apparatus 100 described above includes at least one controller M. The controller M processes computer-executable instructions that cause the processing liquid supplying apparatus 100 to perform the various processes described herein. The controller M may be configured to control each element of the processing liquid supplying apparatus 100 to perform the various processes described herein. In one embodiment, part or all of the controller M may be included in the processing liquid supplying apparatus 100. The controller M may include a processor, a storage unit, and a communication interface. The controller M may be implemented, for example, by a computer. The processor may be configured to read from the storage unit a program that provides logic or routines that enable the various control operations and execute the read program to perform the various control operations. The program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processor for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processor may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a random access memory (RAM), a read only memory (ROM), a hard disk drive (HDD), a solid state drive (SSD), or a combination thereof. The communication interface may communicate with the processing liquid supply apparatus 100 via a communication line such as a local area network (LAN).

[0023] Each valve provided in the processing liquid supplying apparatus 100 is an electromagnetic valve or an air-operated valve that can be controlled by a control unit M, and each valve is electrically connected to the control unit M. The control unit M is also electrically connected to the pump 104. With this configuration, a series of processes in the processing liquid supplying apparatus 100 can be performed automatically under the control of the control unit M.

[0024] <Method of Filling Resist Liquid into Processing Liquid Supply Apparatus 100> Next, a method for filling the processing liquid supply apparatus 100 with a resist liquid will be described. Note that some or all of the following steps included in this filling method can be automatically executed by the processing liquid supply apparatus 100 under the control of the control unit M. Also, this filling method is performed when starting up the processing liquid supply apparatus 100 or when changing the type of resist liquid, etc.

[0025] (First step: cleaning step of supply pipe line 150 with cleaning liquid) The filling method includes the step of rinsing the supply line 150 with a cleaning solution from the tank 101 .

[0026] Specifically, in this step, an organic solvent as a cleaning liquid from the liquid supply mechanism M1 is caused to flow through the entire supply pipe 150, the bypass pipe 153, and the liquid transfer pipe 154, to which a dummy filter is attached instead of the filter 102, via the tank 101, to clean the above three pipes. Note that before this step, the liquid supply source of the liquid supply mechanism M1 is switched, etc., so that the cleaning liquid is supplied from the liquid supply mechanism M1. The cleaning liquid (specifically, organic solvent) supplied in this step is discharged via the discharge nozzle 1, for example. Thereafter, filter 102 is attached to supply line 150 in place of the dummy filter.

[0027] (Second step: Passing cleaning liquid through filter 102) In addition, this filling method includes, after the first step, a step of flowing the cleaning liquid from the tank 101 through the filter 102 interposed in the supply pipe 150 while blocking the flow path leading to the pump 104, including the supply pipe 150, to clean the filter 102.

[0028] Specifically, this step includes, for example, the following steps (a) and (b).

[0029] Step (a) is a step of blocking the liquid sending pipeline 154 and the third pipeline L3 so that the cleaning liquid does not flow to the pump 104 through these pipelines.

[0030] In the step (b), after the step (a), an organic solvent as a cleaning liquid from the liquid supply mechanism M1 is passed through the tank 101 to the filter 102 installed in the supply pipe line 150 so as to be filtered by the filter 102, thereby cleaning the filter 102.

[0031] Thereafter, the liquid supply source of the liquid supply mechanism M1 is switched so that the resist liquid is supplied from the liquid supply mechanism M1.

[0032] (Third step: Step of passing resist liquid through filter 102) Furthermore, in this filling method, after the second step, the flow path leading to the pump 104, including the supply pipe 150, is blocked to prevent the resist liquid from flowing to the pump 104, and the resist liquid from the tank 101 is flowed through the filter 102 interposed in the supply pipe 150 in both the forward and reverse directions of the filter 102, thereby cleaning the filter 102.

[0033] This step starts in a state where the supply pipe 150 has been filled with the cleaning liquid in the second step. Specifically, this step includes, for example, the following steps (c) to (e).

[0034] Step (c) is a step of blocking the liquid supply line 154 and the third line L3 so that the cleaning liquid and the resist liquid do not flow through these lines to the pump 104. Note that this step may be a step of maintaining the liquid supply line 154 and the third line L3 blocked following step (a) of the second step.

[0035] In step (d), with the liquid supply line 154 and the third line L3 blocked, the resist liquid from the liquid supply mechanism M1 is flowed in the forward direction through the tank 101 to the filter 102 interposed in the supply line 150, thereby cleaning the filter 102. The "forward direction" in the filter 102 is the direction from the first space K1 through the filter medium F1 toward the second space K2. Specifically, in this step (d), with the liquid supply line 154 and the third line L3 blocked, the resist liquid replenished sequentially from the liquid supply mechanism M1 to the tank 101 is caused to flow as follows to clean the filter 102. That is, the resist liquid is caused to flow through the tank 101, the first space K1 of the filter 102, the filter medium F1, the second space K2, and the trap 103 in that order, and is then discharged via the drainage line 152, thereby cleaning the filter 102.

[0036] In step (e), with the liquid supply line 154 and the third line L3 blocked, the resist liquid from the liquid supply mechanism M1 is flowed in the reverse direction through the tank 101 to the filter 102 interposed in the supply line 150, thereby cleaning the filter 102. The "reverse direction" in the filter 102 is the direction from the second space K2 through the filter medium F1 toward the first space K1. Specifically, in this step (e), with the liquid supply line 154 and the third line L3 blocked, the resist liquid replenished in the tank 101 from the liquid supply mechanism M1 is caused to flow in the following manner to clean the filter 102. That is, the filter 102 is cleaned by flowing the resist liquid through the tank 101, the bypass line 153, the trap 103, the second line L2 of the supply line 150, the second space K2 of the filter 102, the filter medium F1, and the first space K1 in this order, before being discharged via the drain line 151.

[0037] Step (e) may be carried out before step (d).

[0038] (Fourth step: Step of passing resist liquid through filter 102) Furthermore, this filling method includes, after the third step, a step of causing the resist solution from the tank 101 to flow so that it is discharged from the discharge nozzle 1 via the bypass pipe 153 without passing through the filter 102. The fourth step may be a step of discharging the resist solution from the tank 101 through the filter 102 without passing through the bypass pipe 153 after the third step. In addition, this fourth step may include both a step of flowing the resist liquid from the tank 101 so that it is discharged from the discharge nozzle 1 through the bypass pipeline 153 without passing through the filter 102, and a step of flowing the resist liquid from the tank 101 so that it is discharged from the discharge nozzle 1 through the filter 102 without passing through the bypass pipeline 153.

[0039] By this process, at least the entire supply pipe line 150 is filled with the resist liquid.

[0040] <Modification of filling method> In the second step, as in the third step, the flow path leading to the pump 104, including the supply pipe 150, may be blocked to prevent the cleaning liquid from flowing to the pump 104, and the cleaning liquid from the tank 101 may be caused to flow in both the forward and reverse directions through the filter 102 interposed in the supply pipe 150 to clean the filter 102. Furthermore, in the resist liquid filling method according to the present disclosure, the combination of the above-described consecutive steps (for example, the combination of steps (d) and (e) in the third step) may be repeated multiple times. Furthermore, the resist liquid filling method according to the present disclosure may include a step of passing a cleaning liquid or a resist liquid through a path different from the path of the liquid in the steps described above between the consecutive steps described above (for example, between steps (d) and (e) of the third step). Furthermore, the resist liquid filling method according to the present disclosure may include a step of passing a cleaning liquid or a resist liquid through a path different from the path of the liquid in the steps described above, at least either before the first step or after the fourth step.

[0041] <Main effects> According to the resist liquid filling method of the present disclosure, the above-described steps enable the supply of clean resist liquid from the processing liquid supply apparatus 100 in a short time. That is, the above-described steps of the resist liquid filling method of the present disclosure contribute to enabling the supply of clean resist liquid from the processing liquid supply apparatus 100 in a short time.

[0042] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0043] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that would be apparent to a person skilled in the art from the description of this specification, in addition to or in place of the above-described effects. [Explanation of symbols]

[0044] 1 Discharge nozzle 100 Processing liquid supply device 101 Tank 102 filters 103 Trap 104 Pump 150 Supply pipeline 153 Bypass Pipe M control section W wafer

Claims

1. 1. A method for filling a processing liquid into a processing liquid supply device that supplies a processing liquid to a discharge part that discharges the processing liquid onto a substrate, the method comprising: The processing liquid supply device a tank for containing the treatment liquid; a supply pipe connecting the tank and the discharge portion; a pump disposed in the supply line for pressure-feeding the treatment liquid to the discharge portion; a filter disposed in the supply line between the tank and the pump, for filtering the treatment liquid; a trap disposed in the supply line between the pump and the filter, for separating gas from the treatment liquid; a bypass line branching off from the supply line between the tank and the filter and connected to the trap; a step of cleaning the filter by causing the cleaning liquid from the tank to flow through the filter disposed in the supply pipe line while a flow path leading to the pump, including the supply pipe line, is blocked so that the cleaning liquid does not flow to the pump, after the supply pipe line has been cleaned with a cleaning liquid which is a chemical liquid different from the processing liquid; thereafter, while a flow path leading to the pump, including the supply pipe, is blocked so that the processing liquid does not flow to the pump, the processing liquid from the tank is caused to flow in both forward and reverse directions through the filter interposed in the supply pipe, thereby cleaning the filter.

2. A processing liquid supply device that supplies a processing liquid to a discharge part that discharges the processing liquid onto a substrate, a tank for containing the treatment liquid; a supply pipe connecting the tank and the discharge portion; a pump disposed in the supply line for pressure-feeding the treatment liquid to the discharge portion; a filter disposed in the supply line between the tank and the pump, for filtering the treatment liquid; a trap disposed in the supply line between the pump and the filter, for separating gas from the treatment liquid; a bypass line branching off from the supply line between the tank and the filter and connected to the trap; a control unit, The control unit a step of cleaning the filter by causing the cleaning liquid from the tank to flow through the filter disposed in the supply pipe line while a flow path leading to the pump, including the supply pipe line, is blocked so that the cleaning liquid does not flow to the pump, after the supply pipe line has been cleaned with a cleaning liquid which is a chemical liquid different from the processing liquid; thereafter, in a state in which a flow path leading to the pump, including the supply pipe line, is blocked so that the treatment liquid does not flow to the pump, the treatment liquid from the tank is caused to flow in both a forward direction and a backward direction through the filter interposed in the supply pipe line, thereby cleaning the filter; The processing liquid supply device controls the processing liquid supply so that the above is performed.

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