Resin composition

Abstract

To provide a resin composition which enables provision of a cured product that is low in a dielectric loss tangent and is excellent in adhesive strength to a conductor layer, can suppress an increase in lowest melt viscosity, can extend a usable life under use environment, and exhibits good storage stability; a method for producing the resin composition; a cured product of the resin composition; a resin sheet containing the resin composition; a circuit board containing a cured product of the resin composition; and a semiconductor device including the circuit board.SOLUTION: A resin composition contains (A) a silane compound having a maleimide group, (B) a compound having a radical-polymerizable group (except for the component (A)), and (C) an inorganic filler, wherein the component (A) has a structure represented by the following formula (A1) (in the formula (A1), each symbol is as defined in the specifications).SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, a method for producing the resin composition, a cured product, a resin sheet, a circuit board, and a semiconductor device. [Background technology]

[0002] Circuit boards such as printed wiring boards are widely used in various electronic devices. A known method for manufacturing circuit boards is a build-up method in which insulating layers and conductor layers are alternately stacked on an inner layer substrate. The insulating layer is formed, for example, from a cured product of a resin composition (Patent Documents 1 to 3). Specific examples include forming a resin composition layer containing a resin composition and curing the resin composition layer to form an insulating layer containing a cured product of the resin composition. Moreover, the technology described in Patent Document 4 is publicly known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2022 / 102759 [Patent Document 2] Japanese Patent Publication No. 2022-077908 [Patent Document 3] International Publication No. 2022 / 145377 [Patent Document 4] Japanese Patent Application Publication No. 05-295219 Summary of the Invention [Problem to be solved by the invention]

[0004] In order to reduce transmission loss during operation in a high-frequency environment, the insulating layer is required to have a low dielectric loss tangent. Therefore, the present inventors investigated a resin composition containing a compound having a radical polymerizable group and an inorganic filler. However, they found that the adhesive strength between the cured resin composition containing a compound having a radical polymerizable group and an inorganic filler and the conductor layer underlying the insulating layer tends to deteriorate when the amount of inorganic filler is increased.

[0005] Furthermore, in resin compositions containing inorganic fillers, the inorganic fillers may be surface-treated with a surface treatment agent. The present inventors have studied resin compositions containing conventional surface treatment agents and found that such resin compositions have an increased minimum melt viscosity, a shortened usable life of the resin composition under a usage environment, and poor storage stability.

[0006] The present invention has been made in view of the above, and has an object to provide a resin composition that can provide a cured product having a low dielectric tangent and excellent adhesion strength to a conductor layer, while suppressing an increase in the minimum melt viscosity, extending the usable life under a usage environment, and exhibiting good storage stability; a method for producing the resin composition; a cured product of the resin composition; a resin sheet including the resin composition; a circuit board including the cured product of the resin composition; and a semiconductor device including the circuit board. [Means for solving the problem]

[0007] The present inventors have conducted extensive research to solve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by using a resin composition containing (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group, and (C) an inorganic filler, wherein the component (A) has a specific structure, and have thus completed the present invention. That is, the present invention includes the following.

[0008] <1> A resin composition comprising: (A) a silane compound having a maleimide group; (B) a compound having a radical polymerizable group (excluding component (A)); and (C) an inorganic filler, A resin composition, wherein component (A) has a structure represented by the following formula (A1): [ka] (In formula (A1), R 1 represents a single bond, an optionally substituted divalent hydrocarbon group, or an optionally substituted divalent heteroatom-containing hydrocarbon group; L 1 represents a single bond or a divalent linking group; R 2 represents an optionally substituted divalent hydrocarbon group or an optionally substituted divalent heteroatom-containing hydrocarbon group; R 3 each independently represent an optionally substituted monovalent hydrocarbon group, an optionally substituted alkoxy group, an optionally substituted alkenyloxy group, an optionally substituted aryloxy group, or an optionally substituted aralkyloxy group; R of at least 1 3 is an alkoxy group which may have a substituent. <2> The average particle size of component (C) is 10 μm or less. <1> The resin composition according to claim 1. <3> The content of the (A) component is 0.10% by mass or more and 5.00% by mass or less, based on 100% by mass of the non-volatile components of the resin composition. <1> or <2> The resin composition according to claim 1. <4> The content of the (C) component is 50% by mass or more relative to 100% by mass of the non-volatile components of the resin composition. <1> ~ <3> The resin composition according to any one of the above. <5> The component (B) contains one or more compounds selected from the group consisting of maleimide-based radical polymerizable compounds, (meth)acrylic-based radical polymerizable compounds, styrene-based radical polymerizable compounds, and allyl-based radical polymerizable compounds. <1> ~ <4> The resin composition according to any one of the above. <6> The component (C) contains (C-1) an inorganic filler that has been surface-treated with the component (A). <1> ~ <5> The resin composition according to any one of the above. <7> the amount of the surface treatment of the component (C-1) with the component (A) is 0.1% by mass or more and 3.0% by mass or less; <6> The resin composition according to claim 1. <8> In formula (A1), R 1 is a single bond, a divalent arylene group which may have a substituent, or a divalent alkylene group which may have a substituent, <1> ~ <7> The resin composition according to any one of the above. <9> In formula (A1), L 1 is a single bond or -N(R 0 )-(where R 0 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms; -O-, -C(=O)-, or a divalent group consisting of a combination of two or more of these groups; <1> ~ <8> The resin composition according to any one of the above. <10> In formula (A1), L 1 is a single bond, -N(R 0 )-C(=O)-, -C(=O)-N(R 0 )-, -O-, -C(=O)-O-, -OC(=O)-, -OC(=O)-N(R 0 )-, -N(R 0 )-C(=O)-O-, -OC(=O)-O-, or -N(R 0 )-C(=O)-N(R 0 )-is, <9> The resin composition according to claim 1. <11> In formula (A1), R 2is an arylene group which may have a substituent, or an alkylene group which may have a substituent, <1> ~ <10> The resin composition according to any one of the above. <12> In formula (A1), two or more R 3 is an alkoxy group which may have a substituent; <1> ~ <11> The resin composition according to any one of the above. <13> In formula (A1), three R 3 is an alkoxy group which may have a substituent; <12> The resin composition according to claim 1. <14> In formula (A1), three R 3 are all methoxy groups, <1> ~ <13> The resin composition according to any one of the above. <15> For forming insulating layers on circuit boards. <1> ~ <14> The resin composition according to any one of the above. <16> <1> ~ <5> A method for producing the resin composition according to any one of the above items: A method for producing a resin composition, comprising the step of mixing (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group (excluding component (A)), and (C) an inorganic filler. <17> <6> or <7> A method for producing the resin composition according to the present invention; (A) a silane compound having a maleimide group and (C') an inorganic filler before surface treatment are mixed to obtain (C-1) an inorganic filler surface-treated with component (A); a step of mixing component (C-1) and a compound (B) having a radical polymerizable group (excluding component (A)); A method for producing a resin composition, comprising: <18> <1> ~ <15> A cured product of the resin composition according to any one of claims 1 to 11. <19> A support and a resin composition layer formed on the support, The resin composition layer is <1> ~ <15> A resin sheet comprising the resin composition according to any one of claims 1 to 11. <20> <1> ~ <15> A circuit board comprising a cured product of the resin composition according to any one of claims 1 to 4. <21> <20> A semiconductor device comprising the circuit board according to claim 1. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a resin composition that can produce a cured product having a low dielectric tangent and excellent adhesion strength to a conductor layer, while suppressing an increase in the minimum melt viscosity, extending the usable life under a usage environment, and exhibiting good storage stability; a method for producing the resin composition; a cured product of the resin composition; a resin sheet including the resin composition; a circuit board including the cured product of the resin composition; and a semiconductor device including the circuit board. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Terminology] As used herein, the term "optionally substituted" in reference to a compound or group means both a case where the hydrogen atoms of the compound or group are not substituted with substituents, and a case where some or all of the hydrogen atoms of the compound or group are substituted with substituents.

[0011] In this specification, unless otherwise specified, the term "substituent" means a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, a cycloalkyloxy group, an aryl group, an aryloxy group, an arylalkyl group, an arylalkoxy group, a monovalent heterocyclic group, an alkylidene group, an amino group, a silyl group, a carboxy group, a sulfo group, a cyano group, a nitro group, a hydroxy group, a mercapto group, or an oxo group.

[0012] Examples of halogen atoms used as substituents include fluorine, chlorine, bromine, and iodine atoms. The alkyl group used as a substituent may be either linear or branched. The alkyl group preferably has 1 to 12 carbon atoms, more preferably 1 to 6, and even more preferably 1 to 3. The alkenyl group used as a substituent may be either linear or branched. The alkenyl group preferably has 2 to 12 carbon atoms, more preferably 2 to 6, and even more preferably 2 or 3. The cycloalkyl group used as a substituent preferably has 3 to 12 carbon atoms, more preferably 3 to 6. The alkoxy group used as a substituent may be either linear or branched. The alkoxy group preferably has 1 to 12 carbon atoms, more preferably 1 to 6. The cycloalkyloxy group used as a substituent preferably has 3 to 12 carbon atoms, more preferably 3 to 6. The aryl group used as a substituent is a group in which one hydrogen atom on the aromatic ring has been removed from an aromatic hydrocarbon. The aryl group used as a substituent preferably has 6 to 14 carbon atoms, more preferably 6 to 10. The aryloxy group used as a substituent preferably has 6 to 14 carbon atoms, more preferably 6 to 10. The arylalkyl group used as a substituent preferably has 7 to 15 carbon atoms, more preferably 7 to 11. The arylalkoxy group used as a substituent preferably has 7 to 15 carbon atoms, more preferably 7 to 11. The monovalent heterocyclic group used as a substituent refers to a group obtained by removing one hydrogen atom from the heterocycle of a heterocyclic compound. The monovalent heterocyclic group preferably has 3 to 15 carbon atoms, more preferably 3 to 9 carbon atoms. The aralkyl group used as a substituent refers to an alkyl group substituted with one or more aryl groups. The alkylidene group used as a substituent refers to a group obtained by removing two hydrogen atoms from the same carbon atom of an alkane. The alkylidene group preferably has 1 to 12 carbon atoms, more preferably 1 to 6, and even more preferably 1 to 3 carbon atoms. The above-mentioned substituents may further have a substituent (hereinafter sometimes referred to as a "secondary substituent"). Unless otherwise specified, the secondary substituent may be the same as the above-mentioned substituent.

[0013] In this specification, the term "organic group" refers to a group containing at least carbon atoms as skeletal atoms, and may be linear, branched, or cyclic. In this specification, unless otherwise specified, the number of skeletal atoms of an organic group is preferably 1 to 50, more preferably 1 to 30, and even more preferably 1 to 20 or 1 to 10. The number of skeletal atoms does not include the number of skeletal atoms of an epoxy group. Examples of organic groups include groups containing one or more skeletal atoms (including at least a carbon atom) selected from carbon atoms, oxygen atoms, nitrogen atoms, and sulfur atoms.

[0014] As used herein, the term "hydrocarbon group" refers to a group obtained by removing one or more hydrogen atoms from a hydrocarbon compound. Specifically, a monovalent hydrocarbon group refers to a group obtained by removing one hydrogen atom from a hydrocarbon compound, and a divalent hydrocarbon group refers to a group obtained by removing two hydrogen atoms from a hydrocarbon compound. Here, the hydrocarbon group may be either a saturated or unsaturated hydrocarbon group and may have a cyclic structure. Examples of the hydrocarbon group include aromatic groups and aliphatic groups described below that contain only carbon atoms and hydrogen atoms. As used herein, unless otherwise specified, the number of carbon atoms in a hydrocarbon group is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, 4 or more, 5 or more, or 6 or more, and is preferably 50 or less, more preferably 40 or less, even more preferably 30 or less, 20 or less, 18 or less, 16 or less, 14 or less, or 12 or less. This number of carbon atoms does not include the number of carbon atoms of substituents.

[0015] As used herein, the term "aromatic group" refers to a group in which one or more hydrogen atoms have been removed from the aromatic ring of an aromatic compound. Specifically, a monovalent aromatic group refers to a group in which one hydrogen atom has been removed from the aromatic ring of an aromatic compound, and a divalent aromatic group refers to a group in which two hydrogen atoms have been removed from the aromatic ring of an aromatic compound. The term "aromatic ring" refers to a ring conforming to the Hückel rule, in which the number of electrons in the π-electron system of the ring is 4n+2 (n is a natural number), and includes monocyclic aromatic rings and fused aromatic rings in which two or more monocyclic aromatic rings are fused together. The aromatic ring may be an aromatic carbocycle having only carbon atoms as ring-constituting atoms, or an aromatic heterocycle having, in addition to carbon atoms, heteroatoms such as oxygen, nitrogen, and sulfur atoms as ring-constituting atoms. As used herein, the term "heteroatom" refers to an atom other than carbon and hydrogen atoms, such as oxygen, nitrogen, sulfur, and silicon atoms.

[0016] As used herein, the term "aliphatic group" refers to a group obtained by removing one or more hydrogen atoms bonded to an aliphatic carbon of an aliphatic compound. Specifically, a monovalent aliphatic group refers to a group obtained by removing one hydrogen atom bonded to an aliphatic carbon of an aliphatic compound, and a divalent aliphatic group refers to a group obtained by removing two hydrogen atoms bonded to an aliphatic carbon of an aliphatic compound. Here, the aliphatic compound may be a heteroatom-free aliphatic compound composed only of carbon atoms and hydrogen atoms, or a heteroatom-containing aliphatic compound composed of carbon atoms, hydrogen atoms, and heteroatoms. The aliphatic compound may have a cyclic structure. In this specification, a group having a cyclic structure other than an aromatic ring may be referred to as a "non-aromatic cyclic group."

[0017] As used herein, the term "heteroatom-containing hydrocarbon group" refers to a group obtained by removing one or more hydrogen atoms from a hydrocarbon compound containing a heteroatom. Specifically, a monovalent heteroatom-containing hydrocarbon group refers to a group obtained by removing one hydrogen atom from a hydrocarbon compound containing a heteroatom, and a divalent heteroatom-containing hydrocarbon group refers to a group obtained by removing two hydrogen atoms from a hydrocarbon compound containing a heteroatom. In the "heteroatom-containing hydrocarbon group" used herein, the heteroatom may be bonded to any of the carbon atoms constituting the group. For example, the heteroatom may be (i) interposed between carbon-carbon bonds or (ii) bonded to a terminal carbon. Furthermore, in the "heteroatom-containing hydrocarbon group" used herein, the bond may extend from either a carbon atom or a heteroatom. The heteroatom-containing hydrocarbon group may be either saturated or unsaturated and may have a cyclic structure. Examples of divalent heteroatom-containing hydrocarbon groups include optionally substituted heteroalkylene groups, optionally substituted heteroalkenylene groups, optionally substituted heteroalkynylene groups, optionally substituted heteroalkapolyenylene groups, and optionally substituted divalent heterocyclic groups. Examples of divalent heteroatom-containing hydrocarbon groups also include divalent groups formed by bonding a divalent group selected from the group consisting of -O-, -S-, -C(=O)-, -S(=O)-, -S(=O)2-, -N(R')-, -Si(R')2-, and combinations thereof to one or more bonds of a divalent aromatic group or a divalent non-aromatic ring group (wherein R' represents a hydrogen atom or the aforementioned substituent; the same applies hereinafter). In this specification, unless otherwise specified, the number of heteroatoms in the heteroatom-containing hydrocarbon group is preferably 1 or more, 2 or more, or 3 or more, and preferably 10 or less, 8 or less, or 6 or less; and the number of carbon atoms in the heteroatom-containing hydrocarbon group is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, 4 or more, 5 or more, or 6 or more, and preferably 50 or less, more preferably 40 or less, even more preferably 30 or less, 20 or less, 18 or less, 16 or less, 14 or less, or 12 or less, unless otherwise specified.The number of heteroatoms and carbon atoms in a heteroatom-containing hydrocarbon group does not include the number of heteroatoms and carbon atoms in any substituents.

[0018] As used herein, the term "heteroalkylene group" refers to a divalent saturated hydrocarbon group containing a heteroatom, and may be either linear or branched. The number of heteroatoms and carbon atoms of the heteroalkylene group are as described for the "heteroatom-containing hydrocarbon group." The number of heteroatoms is preferably 1 to 6, more preferably 1 to 4, or 1 or 2, and the number of carbon atoms is preferably 1 to 12, more preferably 1 to 10, even more preferably 1 to 8, or 1 to 6.

[0019] As used herein, the term "heteroalkenylene group" refers to a divalent unsaturated hydrocarbon group containing a heteroatom and one carbon-carbon double bond, and may be either linear or branched. The number of heteroatoms and carbon atoms of the heteroalkenylene group are as described for the "heteroatom-containing hydrocarbon group." The number of heteroatoms is preferably 1 to 6, more preferably 1 to 4, or 1 or 2, and the number of carbon atoms is preferably 2 to 12, more preferably 2 to 10, even more preferably 2 to 8, or 2 to 6.

[0020] As used herein, the term "heteroalkynylene group" refers to a divalent unsaturated hydrocarbon group containing a heteroatom and one carbon-carbon triple bond, and may be either linear or branched. The number of heteroatoms and carbon atoms of the heteroalkynylene group are as described for the "heteroatom-containing hydrocarbon group." The number of heteroatoms is preferably 1 to 6, more preferably 1 to 4, or 1 or 2, and the number of carbon atoms is preferably 2 to 12, more preferably 2 to 10, even more preferably 2 to 8, or 2 to 6.

[0021] As used herein, the term "heteroalkapolyenylene group" refers to a divalent unsaturated hydrocarbon group containing a heteroatom and having two or more carbon-carbon double bonds, and may be either linear or branched. The number of heteroatoms and carbon atoms of the heteroalkapolyenylene group are as described for the "heteroatom-containing hydrocarbon group." The number of heteroatoms is preferably 1 to 6, more preferably 1 to 4, or 1 or 2, and the number of carbon atoms is preferably 3 to 12, more preferably 3 to 10, even more preferably 3 to 8, or 3 to 6.

[0022] As used herein, the term "alkoxy group" refers to a monovalent group formed by bonding an alkyl group to an oxygen atom (i.e., R A1 -O-(R A1 means a group represented by an alkyl group). Unless otherwise specified, the alkoxy group is preferably an alkoxy group having 1 to 10 carbon atoms, more preferably an alkoxy group having 1 to 6 carbon atoms, and even more preferably an alkoxy group having 1 to 3 carbon atoms. Examples of the alkoxy group include a methoxy group, an ethoxy group, a propyloxy group, an isopropyloxy group, a butyloxy group, an isobutyloxy group, a sec-butyloxy group, and a tert-butyloxy group.

[0023] As used herein, the term "alkenyloxy group" refers to a monovalent group in which an alkenyl group is bonded to an oxygen atom (i.e., R A2 -O-(R A2 means a group represented by an alkenyl group). Unless otherwise specified, the alkenyloxy group is preferably an alkenyloxy group having 2 to 18 carbon atoms, more preferably an alkenyloxy group having 2 to 10 carbon atoms, and even more preferably an alkenyloxy group having 2 to 6 carbon atoms. Examples of the alkenyloxy group include a vinyloxy group and a propenyloxy group (allyloxy group, 1-propenyloxy group, isopropenyloxy group).

[0024] As used herein, the term "aryloxy group" refers to a monovalent group in which an aryl group is bonded to an oxygen atom (i.e., RA3 -O-(R A3 means a group represented by an aryl group). Unless otherwise specified, the aryloxy group is preferably an aryloxy group having 6 to 18 carbon atoms, and more preferably an aryloxy group having 6 to 10 carbon atoms. Examples of the aryloxy group include a phenoxy group, a 1-naphthoxy group, and a 2-naphthoxy group.

[0025] As used herein, the term "aralkyloxy group" refers to a monovalent group in which an aralkyl group is bonded to an oxygen atom (i.e., R A4 -O-(R A4 means an aralkyl group). Unless otherwise specified, the aralkyloxy group is preferably an aralkyloxy group having 7 to 19 carbon atoms, and more preferably an aralkyloxy group having 7 to 11 carbon atoms. Examples of the aralkyloxy group include a benzyloxy group and an α-methylbenzyloxy group.

[0026] As used herein, the term "(meth)acryloyl group" encompasses acryloyl groups, methacryloyl groups, and combinations thereof. The term "(meth)acrylate" encompasses acrylates and methacrylates, and combinations thereof. The term "(meth)acrylic acid" encompasses acrylic acid, methacrylic acid, and combinations thereof.

[0027] The present invention will be described in detail below with reference to embodiments and examples. However, the present invention is not limited to the following embodiments and examples, and can be implemented with any modifications within the scope of the claims of the present invention and their equivalents.

[0028] [Resin composition] The resin composition of the present invention is characterized by comprising (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group, and (C) an inorganic filler, wherein component (A) has a structure represented by formula (A1).

[0029] In the resin composition of the present invention, (A) a silane compound having a maleimide group and (B) a compound having a radical polymerizable group can react to form a bond. The reaction can include a reaction between components (A) themselves, a reaction between components (B) themselves, and a reaction between components (A) and (B). This resin composition can produce a cured product with a low dielectric loss tangent and excellent adhesion strength to a conductor layer. Furthermore, this resin composition can suppress an increase in the minimum melt viscosity of the resin composition, extend its usable life under the usage environment, and achieve good storage stability.

[0030] The present inventors speculate that the mechanism by which the resin composition of the present invention can exhibit the above-described excellent effects is as follows, although the present invention is not limited to the mechanism described below.

[0031] In the past, silane compounds (e.g., silane coupling agents) have been added to resin compositions to improve the dispersibility of inorganic particles in the resin composition or to enhance adhesion between the cured resin composition and a conductor. However, conventional silane compounds often contain polar groups such as amino groups, and therefore have low compatibility with compounds having radically polymerizable groups. Therefore, when conventional silane compounds are used as surface treatment agents for inorganic particles, the compatibility between the inorganic particles and a resin component containing a compound having radically polymerizable groups is poor, and the cured product is prone to fracture originating from the interface between the two. Furthermore, when a conventional silane compound is mixed with a resin component containing a compound having radically polymerizable groups, the poor compatibility between the two components results in the formation of a phase interface, which in turn leads to fracture of the cured product originating from the phase interface. Furthermore, due to this tendency for fracture of the cured product to occur, delamination due to fracture of the cured product has traditionally been prone to occur, significantly reducing the adhesion between the cured product and the conductor layer.

[0032] Furthermore, when a conventional silane compound is used as a surface treatment agent for inorganic particles, the inorganic particles are incompatible with a resin component containing a compound having a radical polymerizable group, which can result in differences in fluidity between the components, such that some components in the resin composition are easily mobile and other components are less easily mobile. When differences in fluidity between the components occur, the resistance in the resin composition increases, the minimum melt viscosity of the resin composition increases over time, the usable life in a usage environment is shortened, and the resin composition tends to have poor storage stability.

[0033] In contrast, the (A) silane compound having a maleimide group used in the resin composition of the present invention can enhance the affinity between organic components such as (B) compounds having a radical polymerizable group and inorganic components such as (C) inorganic fillers, thereby improving the compatibility between the organic and inorganic components. Therefore, the compatibility between the organic and inorganic components can be improved, thereby suppressing the formation of phase interfaces in the resin composition. Therefore, destruction of the cured product originating from the phase interface can be suppressed, thereby improving the adhesion strength between the cured product and the conductor layer.

[0034] Furthermore, as described above, the resin composition of the present invention can enhance the compatibility between the organic component and the inorganic component. Therefore, the resin composition of the present invention, which contains (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group, and (C) an inorganic filler, is less likely to cause a difference in the fluidity of each component, can suppress an increase in the minimum melt viscosity of the resin composition, can extend the usable time under the usage environment, and can achieve good storage stability.

[0035] Furthermore, in the resin composition of the present invention, (A) a silane compound having a maleimide group and (B) a compound having a radical polymerizable group can react to form a bond. This reaction can eliminate or minimize the generation of polar groups such as hydroxyl groups. Therefore, the cured product obtained by curing the resin composition of the present invention can have low polarity. Therefore, the cured product has a low dielectric loss tangent.

[0036] Each component contained in the resin composition will be described below.

[0037] <(A) Silane Compound Having a Maleimide Group> The resin composition of the present invention contains (A) a silane compound having a maleimide group as component (A). (A) The silane compound having a maleimide group has a structure represented by the following formula (A1).

[0038] [ka]

[0039] (In formula (A1), R 1 represents a single bond, an optionally substituted divalent hydrocarbon group, or an optionally substituted divalent heteroatom-containing hydrocarbon group; L 1 represents a single bond or a divalent linking group; R 2 represents an optionally substituted divalent hydrocarbon group or an optionally substituted divalent heteroatom-containing hydrocarbon group; R 3 each independently represent an optionally substituted monovalent hydrocarbon group, an optionally substituted alkoxy group, an optionally substituted alkenyloxy group, an optionally substituted aryloxy group, or an optionally substituted aralkyloxy group; R of at least 1 3 is an alkoxy group which may have a substituent.

[0040] In formula (A1), R 1 represents a single bond, a divalent hydrocarbon group which may have a substituent, or a divalent hydrocarbon group which may have a hetero atom. 1The divalent hydrocarbon group represented by the formula (I) is a divalent aromatic group, a divalent aliphatic group, or a divalent group consisting of a combination thereof. The divalent aromatic group and the divalent aliphatic group are as described above. The divalent heteroatom-containing hydrocarbon group is as described above. Among them, R 1 is preferably a single bond, a divalent aromatic group which may have a substituent, a divalent aliphatic group which may have a substituent, or a divalent group consisting of a combination thereof.

[0041] R 1 The divalent aromatic group represented by R is preferably an arylene group. 1 The number of carbon atoms in the arylene group in the formula is preferably 6 to 18, more preferably 6 to 14, and even more preferably 6 to 10. The number of carbon atoms does not include the number of carbon atoms of the substituent. In a preferred embodiment, R 1 The divalent aromatic group represented by the formula (I) is a phenylene group or a biphenylene group (-C6H4-C6H4-), and more preferably a phenylene group.

[0042] R 1 The divalent aliphatic group represented by R is preferably an alkylene group or an alkenylene group. 1 The alkylene group in may be either linear or branched, and preferably has 1 to 10 carbon atoms, more preferably 1 to 6, and even more preferably 1 to 4 carbon atoms. The number of carbon atoms does not include the number of carbon atoms of the substituent. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, and a hexylene group. R 1 The alkenylene group in may be either linear or branched, and preferably has 2 to 10 carbon atoms, more preferably 2 to 6, and even more preferably 2 to 4 carbon atoms. The number of carbon atoms does not include the number of carbon atoms of the substituent. Examples of the alkenylene group include an ethenylene group, a propenylene group, a butenylene group, a pentenylene group, and a hexenylene group. Among these, R 1 The divalent aliphatic group represented by the following formula is more preferably an alkylene group.

[0043] R 1 The substituents that may be possessed are not particularly limited. For example, a halogen atom, -OH, -O-C 1-6 alkyl group, -NR2 (where R is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms), an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 30 carbon atoms, an alkynyl group having 2 to 30 carbon atoms, an aryl group having 6 to 10 carbon atoms, -CN, -C(=O)-O-C 1-10 alkyl group, -COOH, -C(=O)-H, -NO2, etc. are exemplified. Here, the term "C p-q "(p and q are positive integers and satisfy p < q) represents that the number of carbon atoms of the organic group described immediately after this term is p to q. For example, the expression "C 1-10 alkyl group" indicates an alkyl group having 1 to 10 carbon atoms. These substituents may be bonded to each other to form a ring, and the ring structure includes a spiro ring and a condensed ring.

[0044] In formula (A1), L 1 represents a single bond or a divalent linking group. As the divalent linking group represented by L 1 , a divalent organic group composed of one or more (for example, 1 to 3000, 1 to 1000, 1 to 100, 1 to 50) skeleton atoms selected from a carbon atom, an oxygen atom, a nitrogen atom, and a sulfur atom is exemplified. Among them, L 1 is preferably a single bond or -N(R 0 )-(where R 0 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms), -O-, -C(=O)-, or a divalent group composed of a combination of two or more of these groups, and more preferably a single bond, -N(R 0 )-C(=O)-, -C(=O)-N(R 0 )-, -O-, -C(=O)-O-, -O-C(=O)-, -O-C(=O)-N(R 0 )-, -N(R 0 )-C(=O)-O-, -O-C(=O)-O-, or -N(R 0 )-C(=O)-N(R 0 ). [[ID=**38**]]

[0045] L 1 In the divalent group represented by 0 is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms. 0 is preferably a hydrogen atom, a methyl group, or an ethyl group, more preferably a hydrogen atom or a methyl group, and even more preferably a hydrogen atom.

[0046] In formula (A1), R 2 represents a divalent hydrocarbon group which may have a substituent, or a divalent heteroatom-containing hydrocarbon group which may have a substituent. The divalent hydrocarbon group and the divalent heteroatom-containing hydrocarbon group are as described above. In particular, R 2 is preferably a divalent aromatic group which may have a substituent, a divalent aliphatic group which may have a substituent, or a divalent group consisting of a combination thereof, and more preferably a divalent aliphatic group which may have a substituent.

[0047] R 2 The divalent aromatic group represented by R is preferably an arylene group. 2 The number of carbon atoms in the arylene group in the formula is preferably 6 to 18, more preferably 6 to 14, and even more preferably 6 to 10. The number of carbon atoms does not include the number of carbon atoms of the substituent. In a preferred embodiment, R 2 The divalent aromatic group represented by the formula (I) is a phenylene group or a biphenylene group, and more preferably a phenylene group.

[0048] R 2 The divalent aliphatic group represented by R is preferably an alkylene group or an alkenylene group. 2 The alkylene group in may be either linear or branched, and preferably has 1 to 10 carbon atoms, more preferably 1 to 6, and even more preferably 1 to 4 carbon atoms. The number of carbon atoms does not include the number of carbon atoms of the substituent. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, and a hexylene group. R 2The alkenylene group in may be either linear or branched, and preferably has 2 to 10 carbon atoms, more preferably 2 to 6, and even more preferably 2 to 4 carbon atoms. The number of carbon atoms does not include the number of carbon atoms of the substituent. Examples of the alkenylene group include an ethenylene group, a propenylene group, a butenylene group, a pentenylene group, and a hexenylene group. Among these, R 2 The divalent aliphatic group represented by the following formula is more preferably an alkylene group.

[0049] R 2 An example of a "divalent group formed by a combination thereof" represented by the following formula (1) is an aralkylene group. The aralkylene group may be either linear or branched, and preferably has 7 to 30, more preferably 7 to 20, and even more preferably 7 to 15 carbon atoms.

[0050] R 2 The substituents that may be present on R 1 The substituents are the same as those that may be possessed by the group.

[0051] In formula (A1), R 3 each independently represents a monovalent hydrocarbon group which may have a substituent, an alkoxy group which may have a substituent, an alkenyloxy group which may have a substituent, an aryloxy group which may have a substituent, or an aralkyloxy group which may have a substituent. 3 is an alkoxy group which may have a substituent. 3 is preferably an alkoxy group which may have a substituent, and three R 3 In a preferred embodiment, three R 3 are all methoxy groups.

[0052] R 3 The monovalent hydrocarbon group represented by the formula (I) is preferably a monovalent aromatic group, a monovalent aliphatic group, or a monovalent group consisting of a combination thereof, and more preferably a monovalent aliphatic group.

[0053] R 3 The monovalent aromatic group represented by the formula (I) is preferably an aryl group, more preferably a phenyl group, a naphthyl group (1-naphthyl group, 2-naphthyl group), or a biphenyl group (C6H4-C6H5), and most preferably a phenyl group.

[0054] R 3 The monovalent aliphatic group represented by the formula (I) is preferably an alkyl group, more preferably a methyl group, an ethyl group, a propyl group, or an isopropyl group, even more preferably a methyl group or an ethyl group, and even more preferably a methyl group.

[0055] R 3 Examples of the "monovalent group formed by a combination thereof" include an aralkyl group. Examples of the aralkyl group include a benzyl group, a phenethyl group, and an α-methylbenzyl group.

[0056] R 3 The alkoxy group represented by the formula (I) is preferably a methoxy group or an ethoxy group, and more preferably a methoxy group.

[0057] R 3 The alkenyloxy group represented by the formula (I) is preferably a vinyloxy group.

[0058] R 3 The aryloxy group represented by the following formula is preferably a phenoxy group.

[0059] R 3 The aralkyloxy group represented by the following formula is preferably a benzyloxy group.

[0060] R 3 The substituents that may be present on R 1 The substituents are the same as those that may be possessed by the group.

[0061] Specific examples of (A) the silane compound having a maleimide group include compounds represented by the following formulas (a1) to (a35): In formulas (a1) to (a35), Me represents a methyl group, and Et represents an ethyl group.

[0062] [ka]

[0063] [ka]

[0064] [ka]

[0065] [ka]

[0066] [ka]

[0067] [ka]

[0068] [ka]

[0069] There is no limitation on the method for producing (A) the silane compound having a maleimide group, and (A) the silane compound having a maleimide group may be purchased from the market.

[0070] There are no limitations on the state of the (A) silane compound having a maleimide group in the resin composition. Therefore, the (A) silane compound having a maleimide group may be in a free state within the resin component of the resin composition. The (A) silane compound having a maleimide group may also be in a state adsorbed onto the surface of the (C) inorganic filler. In this specification, unless otherwise specified, the "resin component" of a resin composition refers to the non-volatile components of the resin composition excluding the (A) silane compound having a maleimide group and the (C) inorganic filler. Furthermore, unless otherwise specified, the "non-volatile components" of a resin composition refers to the components other than the solvent contained in the resin composition.

[0071] In particular, from the viewpoint of significantly achieving the effects of the present invention, it is preferable that the (A) silane compound having a maleimide group is adsorbed onto the surface of the (C) inorganic filler. For example, by subjecting the (C) inorganic filler before treatment with the (A) silane compound having a maleimide group to surface treatment with the (A) silane compound having a maleimide group, the (A) silane compound having a maleimide group is adsorbed onto the surface of the (C) inorganic filler. Therefore, by mixing the (C) inorganic filler thus surface-treated with other components, a resin composition containing the (A) silane compound having a maleimide group adsorbed onto the surface of the (C) inorganic filler can be obtained.

[0072] In the resin composition of the present invention, the component (A) may be used alone or in combination of two or more.

[0073] The content of component (A) in the resin composition is preferably 0.10% by mass or more, more preferably 0.15% by mass or more, and even more preferably 0.20% by mass or more, relative to 100% by mass of the nonvolatile components in components (A) to (C). It is preferably 5.00% by mass or less, more preferably 3.00% by mass or less, and even more preferably 2.50% by mass or less. In this specification, the content of component (A) refers to the sum of the content of the (A) silane compound having a maleimide group contained in the (C) inorganic filler as a surface treatment agent and the content of the (A) silane compound having a maleimide group that is not adsorbed to the (C) inorganic filler and is free in the resin component. When the content of component (A) is within the above range, the cured product of the resin composition can have good dielectric loss tangent and adhesion strength to a conductor layer. Furthermore, when the content of component (A) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0074] When the resin composition contains components other than components (A) to (C), the content of component (A) in the resin composition is preferably 0.10% by mass or more, more preferably 0.15% by mass or more, and even more preferably 0.20% by mass or more, relative to 100% by mass of the nonvolatile components of the resin composition, and is preferably 5.00% by mass or less, more preferably 3.00% by mass or less, and even more preferably 2.00% by mass or less. When the content of component (A) is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (A) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0075] <(B) Compound Having a Radically Polymerizable Group> The resin composition of the present invention contains, as component (B), a compound having a radical polymerizable group (B). Unless otherwise specified, the compound having a radical polymerizable group (B) does not include compounds corresponding to the above-mentioned component (A). In the resin composition of the present invention, the component (B) may be used alone or in combination of two or more.

[0076] The type of component (B) is not particularly limited as long as it has one or more (preferably two or more) radical polymerizable groups in one molecule. Examples of component (B) include compounds having one or more radical polymerizable groups selected from vinyl groups, allyl groups, vinylphenyl groups, (meth)acryloyl groups, and maleimide groups. When component (B) contains two or more radical polymerizable groups, these two or more radical polymerizable groups may be the same or different.

[0077] (B) The compound having a radical polymerizable group preferably includes one or more compounds selected from the group consisting of maleimide-based radical polymerizable compounds, (meth)acrylic-based radical polymerizable compounds, styrene-based radical polymerizable compounds, and allyl-based radical polymerizable compounds.

[0078] The maleimide radical polymerizable compound is, for example, a compound having one or more, preferably two or more, maleimide groups. The maleimide radical polymerizable compound may be an aliphatic maleimide compound containing an aliphatic amine skeleton, or an aromatic maleimide compound containing an aromatic amine skeleton. Commercially available maleimide radical polymerizable compounds include, for example, "SLK-2600" and "SLK-6895-T90" manufactured by Shin-Etsu Chemical Co., Ltd.; "BMI-1500," "BMI-1700," "BMI-3000J," "BMI-689," and "BMI-2500" (dimer diamine structure-containing maleimide compounds) manufactured by Designer Molecules Inc.; "BMI-6100" (aromatic maleimide compound) manufactured by Designer Molecules Inc.; "MIR-5000-60T" and "MIR-3000-70MT" (biphenylaralkyl maleimide compounds) manufactured by Nippon Kayaku Co., Ltd.; "BMI-70" and "BMI-80" manufactured by K.I. Chemical Industry Co., Ltd.; and "BMI-2300" and "BMI-TMH" manufactured by Daiwa Chemical Industry Co., Ltd. Furthermore, as the maleimide-based radical polymerizable compound, a maleimide resin (maleimide compound containing an indane ring skeleton) disclosed in Technical Disclosure No. 2020-500211 of the Japan Institute of Invention and Innovation may be used.

[0079] The (meth)acrylic radical polymerizable compound is, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of the (meth)acrylic radical polymerizable compound include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, and the like. Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Examples of commercially available (meth)acrylic radically polymerizable compounds include "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC.

[0080] The styrene radical polymerizable compound is, for example, a compound having one or more, preferably two or more, vinyl groups directly bonded to an aromatic carbon atom. Examples of the styrene radical polymerizable compound include low molecular weight (molecular weight less than 1000) styrene compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high molecular weight (molecular weight 1000 or more) styrene compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Commercially available styrene-based radically polymerizable compounds include, for example, "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "OPE-2St", "OPE-2St 1200", and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Co., Inc.

[0081] The allyl radical polymerizable compound is, for example, a compound having one or more, preferably two or more, allyl groups. Examples of allyl radical polymerizable compounds include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; allyl silane compounds such as diallyldiphenylsilane; and resins containing multiple benzene rings and multiple allyl groups. Commercially available allyl radical polymerizable compounds include, for example, "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Co., Ltd.; "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd.; "TRIAM-705" (triallyl trimellitate) manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.; "DAND" (diallyl 2,3-naphthalenecarboxylate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd.; "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane) manufactured by Nippon Kayaku Co., Ltd.; "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemicals Corporation; and "NE-V-1100-70T" (a resin containing multiple benzene rings and multiple allyl groups) manufactured by DIC Corporation.

[0082] The radical polymerizable group equivalent of (B) the compound having a radical polymerizable group is preferably 20 g / eq. to 3000 g / eq., more preferably 50 g / eq. to 2500 g / eq., even more preferably 70 g / eq. to 2000 g / eq., and still more preferably 90 g / eq. to 1500 g / eq. The radical polymerizable group equivalent represents the mass of (B) the compound having a radical polymerizable group per equivalent of the radical polymerizable group.

[0083] The weight-average molecular weight (Mw) of the (B) compound having a radical polymerizable group is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but may be, for example, 150 or more. The weight-average molecular weight of the (B) compound having a radical polymerizable group can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0084] The content of component (B) in the resin composition is preferably 10% by mass or more, more preferably 13% by mass or more, and even more preferably 16% by mass or more, relative to 100% by mass of the nonvolatile components in components (A) to (C). It is also preferably 40% by mass or less, more preferably 35% by mass or less, and even more preferably 31% by mass or less. When the content of component (B) is within this range, the cured product of the resin composition can have a good dielectric loss tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (B) is within this range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0085] When the resin composition contains components other than components (A) to (C), the content of component (B) in the resin composition is preferably 10% by mass or more, more preferably 13% by mass or more, and even more preferably 15% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 35% by mass or less, more preferably 30% by mass or less, and even more preferably 27% by mass or less. When the content of component (B) is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (B) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0086] When the resin composition contains components other than components (A) to (C), the content of component (B) in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, and even more preferably 55% by mass or more, relative to 100% by mass of the resin components of the resin composition, and is preferably 95% by mass or less, more preferably 93% by mass or less, and even more preferably 91% by mass or less. When the content of component (B) is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (B) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0087] <(C) Inorganic filler> The resin composition of the present invention contains an inorganic filler (C) as component (C). The inorganic filler (C) is contained in the resin composition in the form of particles, and is contained in the cured product while maintaining the particulate form. In the resin composition of the present invention, the component (C) may be used alone or in combination of two or more.

[0088] (C) Inorganic filler materials may include inorganic compounds. Examples of (C) inorganic filler materials include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica and alumina are preferred, with silica being particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Furthermore, spherical silica is preferred. The (C) inorganic filler may be used alone or in combination of two or more.

[0089] (C) Examples of commercially available inorganic fillers include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C," "YA050C," "YA050C-MJE," "YA010C," "SC2500SQ," "SO-C4," "SO-C2," and "SO-C1" manufactured by Admatechs Co., Ltd.; "UFP-30," "DAW-03," and "FB-105FD" manufactured by Denka Co., Ltd.; "Silfil NSS-3N," "Silfil NSS-4N," and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "CellSpheres" and "MGH-005" manufactured by Taiheiyo Cement Corporation; "Sferique" and "BA-1" manufactured by JGC Catalysts and Chemicals Co., Ltd.; and "Hipressica FH" manufactured by Ube Exsymo Co., Ltd.

[0090] The (C) inorganic filler is preferably surface-treated with a surface treatment agent. In this case, it is preferable to use a (A) silane compound having a maleimide group as the surface treatment agent. Therefore, the (C) inorganic filler preferably includes (C-1) an inorganic filler surface-treated with (A) a silane compound having a maleimide group. Hereinafter, "(C-1) an inorganic filler surface-treated with (A) a silane compound having a maleimide group" may be referred to as "(C-1) specially treated inorganic filler." The (C-1) specially treated inorganic filler as the (C-1) component includes particles of the above-described inorganic compound and (A) a silane compound having a maleimide group adsorbed to the surface of the particles. In the (C-1) specially treated inorganic filler, the (A) silane compound having a maleimide group may be used alone or in combination of two or more. Furthermore, the (C-1) specially treated inorganic filler may be used alone or in combination of two or more.

[0091] The surface treatment amount of the (C-1) specially treated inorganic filler with the (A) silane compound having a maleimide group is preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, and preferably 3.0% by mass or less, more preferably 2.5% by mass or less, even more preferably 2.3% by mass or less, 2.2% by mass or less, or 2.1% by mass or less. The surface treatment amount is expressed as the ratio of the (A) silane compound having a maleimide group used to treat the particles to 100% by mass of the particles of the inorganic compound before surface treatment. Therefore, this surface treatment amount represents the ratio of the (A) silane compound having a maleimide group adsorbed to the particles to 100% by mass of the particles of the inorganic compound contained in the (C-1) specially treated inorganic filler. When the surface treatment amount of the (A) silane compound having a maleimide group is within the above range, the dielectric loss tangent and adhesion strength to the conductor layer can be improved in the cured product of the resin composition. Furthermore, when the amount of surface treatment with (A) the silane compound having a maleimide group is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable time under the usage environment can be extended, and good storage stability can be achieved.

[0092] The (C-1) specially treated inorganic filler may be surface-treated with an arbitrary surface treatment agent other than the (A) silane compound having a maleimide group in combination with the (A) silane compound having a maleimide group. In this case, the (C-1) specially treated inorganic filler may be surface-treated in the order of the (A) silane compound having a maleimide group and the arbitrary surface treatment agent. Alternatively, the (C-1) specially treated inorganic filler may be surface-treated in the order of the arbitrary surface treatment agent and the (A) silane compound having a maleimide group. Furthermore, the (C-1) specially treated inorganic filler may be surface-treated simultaneously with the (A) silane compound having a maleimide group and the arbitrary surface treatment agent.

[0093] Examples of the optional surface treatment agent include a fluorine-containing silane coupling agent, an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, an alkoxysilane, an organosilazane compound, and a titanate coupling agent. Commercially available surface treatment agents include, for example, Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane). Any surface treatment agent may be used alone or in any combination of two or more.

[0094] The surface treatment amount of the (C-1) specially treated inorganic filler with any surface treatment agent may be 0% by mass or greater than 0% by mass, preferably 0.1% by mass or greater, more preferably 0.2% by mass or greater, even more preferably 0.3% by mass or greater, and preferably 3.0% by mass or less, more preferably 2.5% by mass or less, and even more preferably 2.0% by mass or less. The surface treatment amount is expressed as the ratio of the surface treatment agent used to treat the particles to 100% by mass of the particles of the inorganic compound before surface treatment. Therefore, this surface treatment amount represents the ratio of the surface treatment agent adsorbed to the particles to 100% by mass of the particles of the inorganic compound contained in the (C-1) specially treated inorganic filler.

[0095] The content of component (C-1) in the resin composition is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 65% ​​by mass or more, relative to 100% by mass of the nonvolatile components in components (A) to (C). It is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 83% by mass or less. Unless otherwise specified, the amount of the (C-1) specially treated inorganic filler includes the amount of the (A) maleimide group-containing silane compound and any surface treatment agent adsorbed to the particles of the (C-1) specially treated inorganic filler by surface treatment.

[0096] When the resin composition contains components other than the components (A) to (C), the content of the component (C-1) in the resin composition is preferably 50% by mass or more, more preferably 53% by mass or more, and even more preferably 56% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less.

[0097] The content of the (C-1) component in the resin composition is preferably 30% by mass or more, more preferably 40% by mass or more, and even more preferably 50% by mass or more, relative to 100% by mass of the total amount of the (C) components, and is, for example, 100% by mass or less.

[0098] The resin composition of the present invention may contain (C-2)(A) an inorganic filler that has not been surface-treated with a silane compound having a maleimide group. Hereinafter, the "(C-2)(A) inorganic filler that has not been surface-treated with a silane compound having a maleimide group" may be referred to as the "(C-2) optional inorganic filler." The (C-2) optional inorganic filler as the (C-2) component may be an inorganic filler that has not been surface-treated with a surface treatment agent, or may be an inorganic filler that has been surface-treated with an optional surface treatment agent other than the (A) silane compound having a maleimide group.

[0099] The surface treatment amount of the optional inorganic filler (C-2) with the optional surface treatment agent may be 0% by mass or more than 0% by mass, preferably 0.1% by mass or more, more preferably 0.2% by mass or more, even more preferably 0.3% by mass or more, and preferably 5.0% by mass or less, more preferably 3.0% by mass or less, and even more preferably 2.0% by mass or less. The surface treatment amount is expressed as the ratio of the optional surface treatment agent used to surface treat the particles to 100% by mass of the particles of the inorganic compound before surface treatment. Therefore, this surface treatment amount represents the ratio of the optional surface treatment agent adsorbed to the particles to 100% by mass of the particles of the inorganic compound contained in the optional inorganic filler (D-2).

[0100] The content of component (C-2) in the resin composition may be 0% by mass or more, and is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, 60% by mass or more, 70% by mass or more, or 80% by mass or more, and is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 83% by mass or less, relative to 100% by mass of the nonvolatile components in components (A) to (C). Unless otherwise specified, the content of component (C-2) herein includes the amount of (A) maleimide group-containing silane compound and optional surface treatment agent, etc., adsorbed to particles of optional inorganic filler (C-2) by surface treatment.

[0101] When the resin composition contains components other than the components (A) to (C), the content of the component (C-2) in the resin composition may be 0% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 10% by mass or more, more preferably 30% by mass or more, even more preferably 50% by mass or more, 60% by mass or more, or 70% by mass or more, and is preferably 90% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less.

[0102] The average particle size of the (C) inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less.

[0103] The average particle size of the (C) inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, a volumetric particle size distribution of the (C) inorganic filler is prepared using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture ultrasonically for 10 minutes. The volumetric particle size distribution of the (C) inorganic filler is measured using a laser diffraction particle size distribution analyzer with blue and red wavelength light sources using a flow cell system, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. Examples of laser diffraction particle size distribution analyzers include the LA-960 manufactured by Horiba, Ltd.

[0104] (C) The specific surface area of ​​the inorganic filler is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, particularly preferably 3m 2 / g or more, preferably 100m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 (C) The specific surface area of ​​the inorganic filler can be measured in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and calculating the specific surface area using the BET multipoint method.

[0105] The content of component (C) in the resin composition is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 65% ​​by mass or more, relative to 100% by mass of the nonvolatile components in components (A) to (C). It is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 83% by mass or less. Unless otherwise specified, the content of component (C) in this specification includes the amount of surface treatment agent adsorbed to the inorganic filler (C) particles by surface treatment. When the content of component (C) is within the above range, the cured product of the resin composition can have good dielectric loss tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (C) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0106] When the resin composition contains components other than components (A) to (C), the content of component (C) in the resin composition is preferably 50% by mass or more, more preferably 53% by mass or more, and even more preferably 56% by mass or more, relative to 100% by mass of the nonvolatile components of the resin composition, and is preferably 85% by mass or less, more preferably 80% by mass or less, and even more preferably 75% by mass or less. When the content of component (C) is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to the conductor layer. Furthermore, when the content of component (C) is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under the usage environment can be extended, and good storage stability can be achieved.

[0107] The amount of inorganic compound particles contained in the (C) inorganic filler relative to 100% by mass of the nonvolatile components of the resin composition (i.e., the amount of the (C) inorganic filler excluding the surface treatment agent) may be the same as the above-mentioned range for the content of the (C) inorganic filler relative to 100% by mass of the nonvolatile components of the (A) to (C) components, or the above-mentioned range for the content of the (C) inorganic filler relative to 100% by mass of the nonvolatile components of the resin composition. When the amount of inorganic compound particles contained in the (C) inorganic filler is within the above-mentioned range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to the conductor layer. Furthermore, when the amount of inorganic compound particles contained in the (C) inorganic filler is within the above-mentioned range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable life under usage conditions can be extended, and good storage stability can be achieved.

[0108] The total content of components (A) and (C) in the resin composition is preferably 50% by mass or more, more preferably 60% by mass or more, and even more preferably 65% ​​by mass or more, relative to 100% by mass of the nonvolatile components in components (A) to (C). It is preferably 90% by mass or less, more preferably 85% by mass or less, and even more preferably 83% by mass or less. In this specification, the total content of components (A) and (C) represents the sum of the content of inorganic filler (C) (including silane compound (A) having a maleimide group contained in inorganic filler (C) as a surface treatment agent) and the content of silane compound (A) having a maleimide group that is not adsorbed to inorganic filler (C) and remains free in the resin component. When the total content of components (A) and (C) is within the above range, the cured product of the resin composition can have a good dielectric loss tangent and adhesion strength to a conductor layer. Furthermore, when the total content of the (A) component and the (C) component is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable time under the usage environment can be extended, and good storage stability can be achieved.

[0109] When the resin composition contains components other than the (A) to (C) components, the total content of the (A) and (C) components in the resin composition is preferably at least 50% by mass, more preferably at least 53% by mass, and even more preferably at least 56% by mass, relative to 100% by mass of the nonvolatile components of the resin composition, and is preferably at most 85% by mass, more preferably at most 80% by mass, and even more preferably at most 75% by mass. In this specification, the total content of the (A) and (C) components represents the sum of the content of the (C) inorganic filler (including the (A) silane compound having a maleimide group contained in the (C) inorganic filler as a surface treatment agent) and the content of the (A) silane compound having a maleimide group that is not adsorbed to the (C) inorganic filler and is free in the resin component. When the total content of the (A) and (C) components is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to a conductor layer. Furthermore, when the total content of the (A) component and the (C) component is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable time under the usage environment can be extended, and good storage stability can be achieved.

[0110] When the resin composition contains components other than the (A) to (C) components, the total content of the (A), (B), and (C) components in the resin composition is preferably 70% by mass or more, more preferably 75% by mass or more, and even more preferably 80% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. The upper limit of this content is, for example, 100% by mass or less, and may be 99% by mass or less. In this specification, the total content of the (A), (B), and (C) components represents the sum of the content of the (A) silane compound having a maleimide group that is not adsorbed to the (C) inorganic filler and is free in the resin component, the content of the (B) compound having a radical polymerizable group, and the content of the (C) inorganic filler (including the (A) silane compound having a maleimide group contained in the (C) inorganic filler as a surface treatment agent). When the total content of the (A), (B), and (C) components is within the above range, the cured product of the resin composition can have good dielectric tangent and adhesion strength to a conductor layer. Furthermore, when the total content of the (A), (B), and (C) components is within the above range, an increase in the minimum melt viscosity of the resin composition can be effectively suppressed, the usable time under the usage environment can be extended, and good storage stability can be achieved.

[0111] <(D) Thermosetting resin> The resin composition of the present invention may contain a (D) thermosetting resin as an optional component. Unless otherwise specified, the (D) thermosetting resin as component (D) does not include components (A) to (C) described above. The (D) thermosetting resin can form bonds by inducing a reaction other than a radical reaction when exposed to heat. Therefore, the resin composition can be thermally cured to form a cured product not only by the reaction of the (B) compound having a radically polymerizable group but also by the reaction of the (D) thermosetting resin. When the resin composition contains component (D), the (D) component may be used alone or in combination of two or more types.

[0112] Examples of the (D) thermosetting resin include epoxy resins, phenolic resins, benzoxazine resins, active ester resins, cyanate ester resins, carbodiimide resins, acid anhydride resins, amine resins, etc. Among these, it is preferable to contain one or more thermosetting resins selected from the group consisting of epoxy resins, phenolic resins, active ester resins, and benzoxazine resins, and it is more preferable to contain a benzoxazine resin.

[0113] As the epoxy resin, a curable resin having an epoxy group can be used. Examples of epoxy resins include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, phenol aralkyl-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexane dimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, and phenolphthalimidine-type epoxy resins.

[0114] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition may contain only a liquid epoxy resin as the epoxy resin, only a solid epoxy resin, or a combination of a liquid epoxy resin and a solid epoxy resin.

[0115] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule, such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AF epoxy resin, naphthalene epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, phenol novolac epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane epoxy resin, cyclohexanedimethanol epoxy resin, or epoxy resin having a butadiene structure.

[0116] Specific examples of liquid epoxy resins include "HP-4032", "HP-4032-D", and "HP-4032-SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycirol type epoxy resin) manufactured by ADEKA Corporation; and "EP-3950L" and "EP-3980" manufactured by ADEKA Corporation. Examples of epoxy resins include "EP-4088S" (glycidylamine type epoxy resin) manufactured by ADEKA Corporation, "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd., "ZX1059" (a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd., "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX Corporation, "Celloxide 2021P" (alicyclic epoxy resin having an ester skeleton) manufactured by Daicel Corporation, "PB-3600" manufactured by Daicel Corporation, "JP-100" and "JP-200" (epoxy resins having a butadiene structure) manufactured by Nippon Soda Co., Ltd., and "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd. These may be used alone or in combination of two or more.

[0117] The solid epoxy resin is preferably a solid epoxy resin having three or more epoxy groups per molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups per molecule.The solid epoxy resin is preferably a bixylenol type epoxy resin, a naphthalene type epoxy resin, a naphthalene type tetrafunctional epoxy resin, a naphthol novolac type epoxy resin, a cresol novolac type epoxy resin, a dicyclopentadiene type epoxy resin, a trisphenol type epoxy resin, a naphthol type epoxy resin, a biphenyl type epoxy resin, a naphthylene ether type epoxy resin, an anthracene type epoxy resin, a bisphenol A type epoxy resin, a bisphenol AF type epoxy resin, a phenol aralkyl type epoxy resin, a tetraphenylethane type epoxy resin, or a phenolphthalimidine type epoxy resin.

[0118] Specific examples of solid epoxy resins include DIC Corporation's "HP4032H" (naphthalene-type epoxy resin); DIC Corporation's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC Corporation's "N-690" (cresol novolac-type epoxy resin); DIC Corporation's "N-695" (cresol novolac-type epoxy resin); DIC Corporation's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene-type epoxy resins); and DIC Corporation's "EXA-7311." "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V", "ESN4" manufactured by Nippon Steel Chemical & Material Co., Ltd. 100V" (naphthalene-type epoxy resin); "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "Y" manufactured by Mitsubishi Chemical Corporation Examples include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YX7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0119] As the phenolic resin, a resin having one or more, preferably two or more, hydroxyl groups (phenolic hydroxyl groups) bonded to an aromatic ring such as a benzene ring or a naphthalene ring per molecule can be used. From the viewpoint of heat resistance and water resistance, phenolic resins having a novolac structure are preferred. From the viewpoint of adhesion, nitrogen-containing phenolic resins are preferred, and triazine skeleton-containing phenolic resins are more preferred. Among these, triazine skeleton-containing phenolic novolac resins are preferred from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion.

[0120] Specific examples of phenolic resins include "MEH-7700", "MEH-7810", "MEH-7851", and "MEH-8000H" manufactured by Meiwa Kasei Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; and "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-495V", and "SN- 375" and "SN-395" manufactured by DIC Corporation; "TD-2090", "TD-2090-60M", "LA-7052", "LA-7054", "LA-1356", "LA-3018", "LA-3018-50P", "LA-1356", "TD2090", and "TD-2090-60M" manufactured by DIC Corporation; and "GDP-6115L", "GDP-6115H", and "ELPC75" manufactured by Gun-ei Chemical Co., Ltd.

[0121] The benzoxazine resin may be a resin having one or more, preferably two or more, benzoxazine rings in one molecule. Specific examples of the benzoxazine resin include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd", "Fa", and "ALP-d" manufactured by Shikoku Chemicals Corporation. The benzoxazine resin may be used alone or in combination of two or more.

[0122] The active ester resin may be a resin having one or more active ester groups in one molecule. Among them, preferred active ester resins are compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds.

[0123] The active ester resin is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. From the viewpoint of improving heat resistance in particular, an active ester resin obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester resin obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalene, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0124] Specifically, the active ester resin is preferably a dicyclopentadiene-type active ester resin, a naphthalene-type active ester resin containing a naphthalene structure, an active ester resin containing an acetylated product of phenol novolac, or an active ester resin containing a benzoylated product of phenol novolac, and among these, a naphthalene-type active ester resin is more preferred. The dicyclopentadiene-type active ester resin is preferably an active ester resin containing a dicyclopentadiene-type diphenol structure.

[0125] Commercially available active ester resins include, for example, "EXB9451", "EXB9460", "EXB9460S", "EXB-8000L", "EXB-8000L-65M", "EXB-8000L-65TM", "HPC-8000L-65TM", "HPC-8000", "HPC-8000-65T", "HPC-8000H", and "HPC-8000H-65TM" (manufactured by DIC Corporation) as active ester resins containing a dicyclopentadiene-type diphenol structure; and "HP-B-8151-62T", "EXB-8100L-65T", "EXB-8150-60T", and "EXB-8150-62" as active ester resins containing a naphthalene structure. Examples of such active ester resins include "EXB9401" (manufactured by DIC Corporation), "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T", and "HPC-8151-62T" (manufactured by DIC Corporation), a phosphorus-containing active ester resin, "EXB9401" (manufactured by DIC Corporation), "DC808" (manufactured by Mitsubishi Chemical Corporation), an active ester resin which is an acetylated product of phenol novolac, "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation), and an active ester resin containing a styryl group and a naphthalene structure, "PC1300-02-65MA" (manufactured by Air Water Inc.).

[0126] As the cyanate ester resin, a resin having one or more, preferably two or more, cyanate groups in one molecule can be used. Examples of cyanate ester resins include bifunctional cyanate ester resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; multifunctional cyanate ester resins derived from phenol novolac, cresol novolac, and the like; and prepolymers in which these cyanate ester resins are partially triazine converted. Specific examples of cyanate ester resins include "PT30" and "PT60" (phenol novolac type multifunctional cyanate ester resins) manufactured by Arxada, "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been triazine converted to a trimer).

[0127] As the carbodiimide resin, a resin having one or more, preferably two or more, carbodiimide structures in one molecule can be used. Specific examples of the carbodiimide resin include aliphatic biscarbodiimides such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexanebis(methylene-t-butylcarbodiimide); aromatic biscarbodiimides such as phenylene-bis(xylylcarbodiimide); aliphatic polycarbodiimides such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide); poly(phenylenecarbodiimide), poly(naphthalenecarbodiimide); Examples of polycarbodiimides include aromatic polycarbodiimides such as poly(methylenediphenylenecarbodiimide), poly(tolylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide]. Commercially available carbodiimide resins include, for example, "Carbodilite V-02B," "Carbodilite V-03," "Carbodilite V-04K," "Carbodilite V-05," "Carbodilite V-07," and "Carbodilite V-09" manufactured by Nisshinbo Chemical Inc.; and "Stavaxol P," "Stavaxol P400," and "Hykasil 510" manufactured by Lanxess AG.

[0128] As the acid anhydride resin, a resin having one or more, preferably two or more, acid anhydride groups in one molecule can be used. Specific examples of the acid anhydride resin include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of suitable anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric anhydrides such as styrene-maleic acid resins, which are copolymers of styrene and maleic acid. Commercially available acid anhydride resins include, for example, "HNA-100," "MH-700," "MTA-15," "DDSA," and "OSA" manufactured by New Japan Chemical Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Corporation; "HN-2200" and "HN-5500" manufactured by Resonac Corporation; and "EF-30," "EF-40," "EF-60," and "EF-80" manufactured by Cray Valley Chemical Industries, Ltd.

[0129] The amine resin may be a resin having one or more, preferably two or more, amino groups in one molecule. Examples of the amine resin include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines, with aromatic amines being preferred. The amine resin is preferably a primary amine or secondary amine, with primary amines being more preferred. Specific examples of the amine resin include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)propanol. Examples of suitable bis(4-aminophenoxy)benzene include bis(4-aminophenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, and bis(4-(3-aminophenoxy)phenyl)sulfone. Commercially available amine-based resins include, for example, "SEIKACURE-S" manufactured by Seika Corporation; "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd.; "Epicure W" manufactured by Mitsubishi Chemical Corporation; and "DTDA" manufactured by Sumitomo Seika Chemicals Co., Ltd.

[0130] In one example, the active group equivalent of the (D) thermosetting resin is preferably 50 g / eq to 3,000 g / eq, more preferably 100 g / eq to 1,000 g / eq, even more preferably 100 g / eq to 500 g / eq, and still more preferably 100 g / eq to 300 g / eq. The active group equivalent represents the mass of the (D) thermosetting resin per equivalent of the active group.

[0131] In one example, the weight average molecular weight (Mw) of the (D) thermosetting resin is preferably in the range of 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight of the (D) thermosetting resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0132] When the resin composition contains a (D) thermosetting resin, the content of the (D) component in the resin composition is preferably 0.1% by mass or more, more preferably 0.4% by mass or more, even more preferably 0.8% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 10.0% by mass or less, more preferably 7.0% by mass or less, even more preferably 5.0% by mass or less.

[0133] When the resin composition contains a (D) thermosetting resin, the content of the (D) component in the resin composition is preferably 1.0 mass% or more, more preferably 2.0 mass% or more, even more preferably 3.0 mass% or more, relative to 100 mass% of the resin components of the resin composition, and is preferably 25.0 mass% or less, more preferably 20.0 mass% or less, even more preferably 17.0 mass% or less.

[0134] <(E) Polymer resin> The resin composition of the present invention may contain a polymer resin (E) as an optional component. Unless otherwise specified, the polymer resin (E) as component (E) does not include those corresponding to the above-mentioned components (A) to (D). The polymer resin (E) may be contained in the resin composition in a state where it is compatible with resin components other than the polymer resin (E). When the resin composition contains component (E), the component (E) may be used alone or in combination of two or more types.

[0135] The weight-average molecular weight (Mw) of the (E) polymer resin is, for example, greater than 5,000, preferably at least 8,000, more preferably at least 10,000, even more preferably at least 20,000, and is preferably at most 100,000, more preferably at most 70,000, even more preferably at most 60,000. The weight-average molecular weight of the (E) polymer resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0136] Examples of the (E) polymer resin include oxazoline group-containing resins, phenoxy resins, polybutadiene resins, polyimide resins, polyvinyl acetal resins, polyolefin resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polycarbonate resins, polyetheretherketone resins, polyester resins, etc. Among these, oxazoline group-containing resins, phenoxy resins, polybutadiene resins, and polyimide resins are preferred.

[0137] The oxazoline group-containing resin can be obtained by polymerizing an addition-polymerizable oxazoline compound (vinyloxazoline skeleton-containing monomer) such as 2-isopropenyl-2-oxazoline, 5-methyl-2-isopropenyl-2-oxazoline, 4,4-dimethyl-2-isopropenyl-2-oxazoline, 4-methyl-2-isopropenyl-2-oxazoline, 4,4,5-trimethyl-2-isopropenyl-2-oxazoline, 2-vinyl-2-oxazoline, 5-methyl-2-vinyl-2-oxazoline, 4,4-dimethyl-2-vinyl-2-oxazoline, 4-methyl-2-vinyl-2-oxazoline, or 4,4,5-trimethyl-2-vinyl-2-oxazoline. Furthermore, the oxazoline group-containing resin may be copolymerized with any monomer, such as a styrene-based monomer such as styrene, α-methylstyrene, 4-methylstyrene, 3-methylstyrene, 2-methylstyrene, 4-ethylstyrene, 4-tert-butylstyrene, p-divinylbenzene, m-divinylbenzene, etc. A specific example of the oxazoline group-containing resin is "PX-3-RP-61" manufactured by Nippon Shokubai Co., Ltd.

[0138] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenolacetophenone, novolac, biphenyl, fluorene, dicyclopentadiene, norbornene, naphthalene, anthracene, adamantane, terpene, and trimethylcyclohexane. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "YX7200B35," "YL7500BH30," "YX6954BH30," "YX7553BH30," "YL7769BH30," "YL6794," "YL7213," "YL7290," and "YL7482" manufactured by Mitsubishi Chemical Corporation.

[0139] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxy group-containing polybutadiene resins, phenolic hydroxy group-containing polybutadiene resins, carboxy group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, epoxy group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, polyphenylene ether-polybutadiene resins, etc. Polybutadiene resins whose molecular ends are blocked with phenol resins may also be used.

[0140] The polyimide resin may be a resin having an imide structure (preferably a cyclic imide structure), such as an imide compound of an acid anhydride and a diamine compound; an imide compound of an acid anhydride and a diisocyanate compound; etc. Among these, an imide compound of an acid anhydride and a diamine compound is preferred. The polyimide resin may also contain an indane skeleton such as a trimethylindane skeleton, for example, a structural unit formed by polymerization of a diamine compound may contain an indane skeleton.

[0141] As the acid anhydride for producing the polyimide resin, tetracarboxylic acid anhydrides are preferred. Examples of tetracarboxylic acid anhydrides include aromatic tetracarboxylic acid dianhydrides and aliphatic tetracarboxylic acid dianhydrides, with aromatic tetracarboxylic acid dianhydrides being preferred. Examples of aromatic tetracarboxylic acid dianhydrides include benzenetetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, anthracenetetracarboxylic acid dianhydride, and diphthalic acid dianhydride, with diphthalic acid dianhydride being preferred. Examples of diphthalic acid dianhydrides include 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, 3,3',4,4'-diphenylethertetracarboxylic acid dianhydride, 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride, 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, 2,2',3,3'-biphenyltetracarboxylic acid dianhydride, and 2,3,3',4'-biphenyltetracarboxylic acid dianhydride. carboxylic dianhydride, 2,3,3',4'-benzophenonetetracarboxylic dianhydride, 2,3,3',4'-diphenylethertetracarboxylic dianhydride, 2,3,3',4'-diphenylsulfonetetracarboxylic dianhydride, 2,2'-bis(3,4-dicarboxyphenoxyphenyl)sulfone dianhydride, 4,4'-oxydiphthalic anhydride, methylene-4,4'-diphthalic dianhydride, 1,1-ethynylidene-4 ,4'-Diphthalic dianhydride, 2,2-propylidene-4,4'-diphthalic dianhydride, 1,2-ethylene-4,4'-diphthalic dianhydride, 1,3-trimethylene-4,4'-diphthalic dianhydride, 1,4-tetramethylene-4,4'-diphthalic dianhydride, 1,5-pentamethylene-4,4'-diphthalic dianhydride, 1,3-bis(3,4-dicarboxyphenyl)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenyl)benzene dianhydride Examples of the dianhydride include 1,3-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 1,4-bis(3,4-dicarboxyphenoxy)benzene dianhydride, 2,2-bis(2,3-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, and 4,4'-(4,4'-isopropylidenediphenoxy)bisphthalic dianhydride.

[0142] Examples of diamine compounds for producing polyimide resins include aliphatic diamine compounds and aromatic diamine compounds, with aromatic diamine compounds being preferred. Examples of the dianiline compound include 4,4'-diamino-2,2'-ditrifluoromethyl-1,1'-biphenyl, 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfide, 4-aminophenyl 4-aminobenzoate, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2-bis(4-aminophenyl)propane, 4,4'-(hexafluoroisopropylidene)dianiline, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, [4-(4-aminophenoxy)phenyl]hexafluoropropane, α,α-bis[4-(4-aminophenoxy)phenyl]-1,3-diisopropylbenzene, α,α-bis[4-(4-aminophenoxy)phenyl]-1,4-diisopropylbenzene, 4,4'-(9-fluorenylidene)dianiline, 2,2-bis(3-methyl-4-aminophenyl)propane, 2,2-bis(3-methyl-4-aminophenyl)benzene, 4,4'-diamino-3,3'-dimethyl-1,1'-biphenyl, 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl, 9,9'-bis(3-methyl-4-aminophenyl)fluorene, 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane, and the like.

[0143] Commercially available examples of polyimide resins include "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd. Other examples of polyimide resins include linear polyimides obtained by reacting bifunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (as described in JP-A No. 2006-37083), and modified polyimides such as polysiloxane skeleton-containing polyimides (as described in JP-A Nos. 2002-12667 and 2000-319386).

[0144] The (E) polymer resin may contain an elastomer. The elastomer is a flexible resin, preferably a resin with rubber elasticity or a resin that exhibits rubber elasticity by polymerizing with another component. Examples of rubber elasticity include resins that exhibit a modulus of elasticity of 1 GPa or less when subjected to a tensile test in accordance with Japanese Industrial Standards (JIS K7161) at a temperature of 25°C and a humidity of 40% RH. The range of the modulus of elasticity of the elastomer is, in detail, for example, 1 GPa or less, preferably 0.9 GPa or less, more preferably 0.8 GPa or less, and even more preferably 0.7 GPa or less, and preferably 0.01 GPa or more, more preferably 0.03 GPa or more, even more preferably 0.05 GPa or more, and even more preferably 0.1 GPa or more.

[0145] The elastomer is preferably one or more types selected from resins having a glass transition temperature (Tg) of 25°C or less and resins that are liquid at 25°C or less. The glass transition temperature of resins having a glass transition temperature (Tg) of 25°C or less is preferably 20°C or less, more preferably 15°C or less. The lower limit of the glass transition temperature is not particularly limited, but may be, for example, -15°C or more. Furthermore, resins that are liquid at 25°C are preferably resins that are liquid at 20°C or less, more preferably resins that are liquid at 15°C or less. The glass transition temperature can be measured by DSC (differential scanning calorimetry).

[0146] The (E) polymer resin may be included in the thermosetting resin composition in a state compatible with resin components other than the (E) polymer resin. Such a compatible (E) polymer resin may be included in the cured product in a state compatible with resin components other than the (E) polymer resin. Alternatively, the (E) polymer resin may be included in the thermosetting resin composition in a particulate state without being compatible with resin components other than the (E) polymer resin. Such particulate (E) polymer resin may be included in the cured product in a particulate state without being compatible with resin components other than the (E) polymer resin. Furthermore, a particulate (E) polymer resin compatible with resin components other than the (E) polymer resin may be used in combination with a particulate (E) polymer resin.

[0147] Examples of particulate (E) polymer resins include rubber particles, polyamide microparticles, silicone particles, and core-shell particles. Among these, rubber particles and core-shell particles are preferred, with core-shell particles being more preferred. Core-shell particles are particulate polymer resins comprising a core particle and one or more shell layers covering the core particle. Core-shell particles are preferably core-shell graft copolymer particles comprising a core particle containing a resin and a shell portion formed by graft copolymerizing a copolymerizable monomer component with the resin contained in the core particle. Here, the term "core-shell" does not necessarily refer only to particles in which the core particle and the shell portion are clearly distinguishable, but also encompasses particles in which the boundary between the core particle and the shell portion is unclear. Furthermore, the core particle does not necessarily have to be completely covered by the shell portion.

[0148] Commercially available core-shell graft copolymer particles include, for example, "CHT" manufactured by Samsung SDI; "B602" manufactured by Techno UMG; "Paraloid EXL2602," "Paraloid EXL2603," "Paraloid EXL2655," "Paraloid EXL2311," "Paraloid EXL2313," "Paraloid EXL2315," "Paraloid KM330," "Paraloid KM336P," and "Paraloid KCZ201" manufactured by Dow Chemical Japan; "Metablen C-223A," "Metablen E-901," "Metablen S-2001," "Metablen W-450A," and "Metablen SRK-200" manufactured by Mitsubishi Rayon; and "Kane Ace M-511," "Kane Ace M-600," "Kane Ace M-400," "Kane Ace M-580," and "Kane Ace MR-01" manufactured by Kaneka Corporation.

[0149] When the resin composition contains a polymer resin (E), the content of the component (E) in the resin composition is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 25.0% by mass or less, more preferably 20.0% by mass or less, even more preferably 17.0% by mass or less.

[0150] When the resin composition contains a polymer resin (E), the content of the component (E) in the resin composition is preferably 1.0 mass% or more, more preferably 1.5 mass% or more, and even more preferably 2.0 mass% or more, relative to 100 mass% of the resin components of the resin composition, and is preferably 50.0 mass% or less, more preferably 45.0 mass% or less, and even more preferably 40.0 mass% or less.

[0151] <(F) Polymerization initiator> The resin composition of the present invention may contain a polymerization initiator (F) as an optional component. The polymerization initiator (F) as component (F) does not include those corresponding to the above-mentioned components (A) to (E), unless otherwise specified. The polymerization initiator (F) can promote the reaction between the silane compound (A) having a maleimide group and the compound (B) having a radical polymerizable group, thereby promoting the curing of the resin composition. When the resin composition contains the polymerization initiator (F), one type of component (F) may be used alone, or two or more types may be used in combination.

[0152] As the (F) polymerization initiator, for example, a compound capable of generating free radicals upon heating is used. Examples of the (F) polymerization initiator include peroxide-based radical polymerization initiators and azo-based radical polymerization initiators, and among these, peroxide-based radical polymerization initiators are preferred.

[0153] Examples of the peroxide radical polymerization initiator include hydroperoxide compounds such as 1,1,3,3-tetramethylbutyl hydroperoxide; dialkyl peroxide compounds such as tert-butylcumyl peroxide, di-tert-butyl peroxide, di-tert-hexyl peroxide, dicumyl peroxide, 1,4-bis(1-tert-butylperoxy-1-methylethyl)benzene, and 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane; and diacyl peroxide compounds such as dilauroyl peroxide, didecanoyl peroxide, dicyclohexyl peroxydicarbonate, and bis(4-tert-butylcyclohexyl)peroxydicarbonate. peroxyester compounds such as tert-butyl peroxyacetate, tert-butyl peroxybenzoate, tert-butylperoxyisopropyl monocarbonate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxyneodecanoate, tert-hexylperoxyisopropyl monocarbonate, tert-butyl peroxylaurate, (1,1-dimethylpropyl) 2-ethylperhexanoate, tert-butyl 2-ethylperhexanoate, tert-butyl 3,5,5-trimethylperhexanoate, tert-butylperoxy-2-ethylhexyl monocarbonate, and tert-butylperoxymaleic acid; and the like.

[0154] Examples of the azo radical polymerization initiator include azonitrile compounds such as 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 1-[(1-cyano-1-methylethyl)azo]formamide, and 2-phenylazo-4-methoxy-2,4-dimethyl-valeronitrile; 2,2'-azobis[2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide], and 2,2'-azobis[2-methyl-N-[1,1-bis(hydroxymethyl)-2-hydroxyethyl]propionamide]. azoamide compounds such as 2,2'-azobis[2-methyl-N-[2-(1-hydroxybutyl)]-propionamide], 2,2'-azobis[2-methyl-N-(2-hydroxyethyl)-propionamide], 2,2'-azobis(2-methylpropionamide) dihydrate, 2,2'-azobis[N-(2-propenyl)-2-methylpropionamide], 2,2'-azobis(N-butyl-2-methylpropionamide), and 2,2'-azobis(N-cyclohexyl-2-methylpropionamide); alkyl azo compounds such as 2,2'-azobis(2,4,4-trimethylpentane) and 2,2'-azobis(2-methylpropane); and the like.

[0155] (F) Examples of commercially available polymerization initiators include "Perbutyl C," "Perbutyl A," "Perbutyl P," "Perbutyl L," "Perbutyl O," "Perbutyl ND," "Perbutyl Z," "Perbutyl I," "Percumyl P," "Percumyl D," "Perhexyl D," "Perhexyl A," "Perhexyl I," "Perhexyl Z," "Perhexyl ND," "Perhexyl O," and "Perhexyl PV," all manufactured by NOF Corporation.

[0156] When the resin composition contains a (F) polymerization initiator, the content of the (F) component in the resin composition is preferably 0.10% by mass or more, more preferably 0.15% by mass or more, even more preferably 0.20% by mass or more, relative to 100% by mass of the non-volatile components of the resin composition, and is preferably 1.00% by mass or less, more preferably 0.70% by mass or less, even more preferably 0.40% by mass or less.

[0157] When the resin composition contains a (F) polymerization initiator, the content of the (F) component in the resin composition is preferably 0.1 mass% or more, more preferably 0.4 mass% or more, even more preferably 0.7 mass% or more, relative to 100 mass% of the resin components of the resin composition, and is preferably 5.0 mass% or less, more preferably 3.0 mass% or less, even more preferably 2.0 mass% or less.

[0158] <(G) Curing accelerator> The resin composition of the present invention may contain a (G) curing accelerator as an optional component. Unless otherwise specified, the (G) curing accelerator as component (G) does not include those corresponding to the above-mentioned components (A) to (F). The (G) curing accelerator acts as a catalyst for the reaction of the (D) thermosetting resin, thereby accelerating the curing of the resin composition. When the resin composition contains a (G) curing accelerator, one type of component (G) may be used alone, or two or more types may be used in combination.

[0159] Examples of the (G) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators.

[0160] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium tetra-p-tolylborate. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine aromatic phosphines such as benzene, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether;

[0161] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. aromatic dimethylureas such as toluene bis(dimethylurea), 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluene bisdimethylurea].

[0162] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0163] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 1-benzyl-2-methylimidazole. Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct Examples of imidazole compounds include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins. Commercially available imidazole curing accelerators include "1B2PZ," "2E4MZ," "2MZA-PW," "2MZ-OK," "2MA-OK," "2MA-OK-PW," "2PHZ," "2PHZ-PW," "Cl1Z," "Cl1Z-CN," "Cl1Z-CNS," and "C11Z-A" manufactured by Shikoku Chemicals Corporation; and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0164] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0165] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. Commercially available amine curing accelerators may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Inc.

[0166] When the resin composition contains a (G) curing accelerator, the content of the (G) component in the resin composition is, relative to 100% by mass of the non-volatile components of the resin composition, for example, 0.01% by mass or more, preferably 0.03% by mass or more, more preferably 0.05% by mass or more, and even more preferably 0.07% by mass or more, and for example, 1.00% by mass or less, preferably 0.50% by mass or less, more preferably 0.30% by mass or less, and even more preferably 0.10% by mass or less.

[0167] When the resin composition contains a (G) curing accelerator, the content of the (G) component in the resin composition is, relative to 100% by mass of the resin components of the resin composition, for example, 0.01% by mass or more, preferably 0.10% by mass or more, more preferably 0.20% by mass or more, and even more preferably 0.30% by mass or more, and for example, 1.00% by mass or less, preferably 0.80% by mass or less, more preferably 0.60% by mass or less, and even more preferably 0.40% by mass or less.

[0168] <(H) Optional Additives> The resin composition of the present invention may further contain (H) an optional additive as an optional component. The optional additive (H) as component (H) does not include those corresponding to the above-mentioned components (A) to (G). Examples of the optional additive (H) include organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; antifoaming agents such as silicone-based antifoaming agents, acrylic-based antifoaming agents, fluorine-based antifoaming agents, and vinyl resin-based antifoaming agents; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; and adhesion promoters such as triazole-based adhesion promoters, tetrazole-based adhesion promoters, and triazine-based adhesion promoters. Examples of additives include antioxidants such as hindered phenol antioxidants, fluorescent brighteners such as stilbene derivatives, surfactants such as fluorine-based surfactants and silicone-based surfactants, flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, and red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide), dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants, and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (H) Optional additives may be used alone or in combination of two or more.

[0169] <(I) Solvent> The resin composition may further contain (I) a solvent as an optional volatile component in addition to the nonvolatile components (A) to (H) described above. Examples of the (I) solvent include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of suitable solvents include ether ester solvents such as ethyl acetate; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) The solvents may be used singly or in combination of two or more.

[0170] The content of (I) solvent in the resin composition may be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, or 10% by mass or less, relative to 100% by mass of all components of the resin composition. The content of (I) solvent in the resin composition may also be 0% by mass.

[0171] [Method of producing resin composition] The resin composition can be produced, for example, by mixing components that can be contained in the resin composition. Thus, the resin composition can be produced by a production method including a step of mixing (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group, and (C) an inorganic filler. This production method may also include a step of mixing optional components such as components (D) to (I). Components (A) to (I) may be mixed in part or all at the same time, or they may be mixed sequentially.

[0172] In particular, the resin composition containing the (C-1) specially treated inorganic filler is preferably produced by a production method including the steps of: mixing (A) a silane compound having a maleimide group with (C') an inorganic filler before surface treatment to obtain the (C-1) specially treated inorganic filler; and mixing the (C-1) specially treated inorganic filler with (B) a compound having a radical polymerizable group.

[0173] (C') Pre-surface-treatment inorganic filler refers to an inorganic filler before being subjected to surface treatment with (A) a silane compound having a maleimide group. "(C') Pre-surface-treatment inorganic filler" may be hereinafter referred to as "(C') Pre-treatment filler." (C') Pre-treatment filler may be particles that have not been surface-treated with any surface treatment agent. Alternatively, (C') Pre-treatment filler may be particles that have been surface-treated with any surface treatment agent.

[0174] The surface treatment of the (C') pre-treatment filler can be carried out by contacting the (C') pre-treatment filler with the (A) silane compound having a maleimide group. For example, the (C') pre-treatment filler can be stirred while the (A) silane compound having a maleimide group is supplied to the (C') pre-treatment filler, thereby contacting the (D') pre-treatment filler with the (A) silane compound having a maleimide group, thereby carrying out the surface treatment. From the viewpoint of carrying out a uniform surface treatment, the (A) silane compound having a maleimide group is preferably supplied by spraying.

[0175] After the (C') pre-treatment filler is surface-treated with (A) a silane compound having a maleimide group to obtain (C-1) a specifically treated inorganic filler, the (C-1) specifically treated inorganic filler may be further surface-treated with an optional surface treatment agent. The surface treatment with the optional surface treatment agent may be carried out, for example, by the same method as the surface treatment with (A) a silane compound having a maleimide group. Alternatively, the surface treatment with (A) a silane compound having a maleimide group and the surface treatment with the optional surface treatment agent may be carried out simultaneously.

[0176] After obtaining the (C-1) specially treated inorganic filler, the (C) inorganic filler containing the (C-1) specially treated inorganic filler, the (B) compound having a radical polymerizable group, and optional components, if necessary, can be mixed to obtain a resin composition. These components may be mixed in part or in whole simultaneously, or sequentially. Furthermore, as described above, the temperature may be appropriately set during the process of mixing the components, and thus heating and / or cooling may be performed temporarily or throughout the process. Furthermore, stirring or shaking may be performed during the process of mixing the components.

[0177] [Characteristics of resin composition] The resin composition of the present invention contains a combination of the (A) component, the (B) component, and the (C) component (and, as necessary, the (D) component, the (E) component, the (F) component, the (G) component, and the (I) component), and therefore can provide a cured product with a low dielectric tangent and excellent adhesion strength to a conductor layer, while also being able to suppress an increase in the minimum melt viscosity, extend the usable time under usage conditions, and achieve good storage stability.

[0178] The cured product of the resin composition of the present invention is characterized by a low dielectric loss tangent. Therefore, the cured product provides an insulating layer with a low dielectric loss tangent. For example, when measured at 5.8 GHz and 23°C as described in the section "Test Example 1: Measurement of Dielectric Loss Tangent" below, the dielectric loss tangent of the cured product obtained by thermally curing the resin composition layer at 190°C for 90 minutes is preferably 0.0035 or less, more preferably 0.0030 or less, and even more preferably 0.0027 or less. The lower limit of the dielectric loss tangent may be 0.0001 or more.

[0179] An insulating layer made of a cured resin composition exhibits excellent adhesive strength (peel strength) between the insulating layer and the conductor layer. The adhesive strength is preferably 0.40 kgf / cm or more, more preferably 0.45 kgf / cm or more, and even more preferably 0.50 kgf / cm or more. There is no particular upper limit to the peel strength, and it can be, for example, 1.00 kgf / cm or less. The peel strength can be measured according to the method described in the section "Test Example 2: Evaluation test of adhesive strength with conductor layer" below.

[0180] The resin composition of the present invention can suppress an increase in the minimum melt viscosity, extend the usable time under the usage environment, and achieve good storage stability. Furthermore, according to the present invention, a resin composition exhibiting good embeddability can be provided due to its excellent stability of the minimum melt viscosity. For example, when the minimum melt viscosity of the resin composition is MV D The minimum melt viscosity of the resin composition after standing for 3 days in an environment with a temperature of 21 to 25°C and a relative humidity of 40 to 60% is defined as MV E (poise), the ratio of these (MV E / MV DThe ratio of the minimum melt viscosities (MV E / MV D ) is preferably 1.40 or less, more preferably 1.30 or less, and even more preferably 1.25 or less or 1.24 or less. The storage stability of the resin composition can be measured according to the method described in the section [Test Example 3: Evaluation test for storage stability] below.

[0181] [Uses of resin composition] As described above, the resin composition of the present invention can produce a cured product having a low dielectric loss tangent and excellent adhesion strength to a conductor layer. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (a resin composition for an insulating layer of a printed wiring board), and more suitably used as a resin composition for forming an interlayer insulating layer of a printed wiring board (a resin composition for an interlayer insulating layer of a printed wiring board). Because the resin composition of the present invention has excellent stability in the minimum melt viscosity, it can produce an insulating layer that is favorable for component embedding, and can be suitably used even when the printed wiring board is a circuit board with built-in components. The resin composition of the present invention can also be suitably used as a resin composition for forming an insulating layer of a rewiring substrate for a semiconductor package (a resin composition for an insulating layer of a rewiring substrate). In the present invention, printed wiring boards and rewiring substrates are collectively referred to as "circuit boards," and therefore the resin composition of the present invention can be suitably used for the insulating layer of a circuit board.

[0182] The resin composition of the present invention can further be used in a wide range of applications requiring a resin composition, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, hole filling resins, sealing resins, and component embedding resins.

[0183] [Sheet-type laminated materials (resin sheets, prepregs)] The resin composition of the present invention can be used as it is, but may also be used in the form of a sheet-like laminate material containing the resin composition.

[0184] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0185] In one embodiment, the resin sheet includes a support and a layer of a resin composition (hereinafter simply referred to as a "resin composition layer") provided on the support, and is characterized in that the resin composition layer is formed from the resin composition of the present invention.

[0186] The thickness of the resin composition layer varies depending on the application, and may be appropriately determined depending on the application. For example, from the viewpoint of thinning printed wiring boards and semiconductor packages, the thickness of the resin composition layer is preferably 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may usually be 1 μm or more, 5 μm or more, etc.

[0187] Examples of the support include a thermoplastic resin film, a metal foil, and a release paper, and a thermoplastic resin film and a metal foil are preferred. Therefore, in a preferred embodiment, the support is a thermoplastic resin film or a metal foil.

[0188] When a thermoplastic resin film is used as the support, examples of the thermoplastic resin include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), acrylics such as polycarbonate (PC) and polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0189] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0190] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment. Alternatively, the support may be a support with a release layer, which has a release layer on the surface to be bonded to the resin composition layer. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available release agents include alkyd resin-based release agents such as "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation. Commercially available release layer-containing supports include PET films having a release layer primarily composed of an alkyd resin-based release agent, such as "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation; "Lumirror T60" manufactured by Toray Industries, Inc.; "Purex" manufactured by Teijin Limited; and "Uni-Peel" manufactured by Unitika Limited.

[0191] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0192] When a metal foil is used as the support, a metal foil with a support substrate may be used, which is a thin metal foil with a peelable support substrate attached thereto. In one embodiment, the metal foil with a support substrate includes a support substrate, a release layer provided on the support substrate, and a metal foil provided on the release layer. When a metal foil with a support substrate is used as the support, the resin composition layer is provided on the metal foil.

[0193] In the metal foil with a supporting substrate, the material of the supporting substrate is not particularly limited, but examples thereof include copper foil, aluminum foil, stainless steel foil, titanium foil, copper alloy foil, etc. When copper foil is used as the supporting substrate, it may be electrolytic copper foil or rolled copper foil. Furthermore, the release layer is not particularly limited as long as it allows the metal foil to be released from the supporting substrate, and examples thereof include an alloy layer of an element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, and P; an organic coating, etc.

[0194] In the metal foil with a supporting substrate, the material of the metal foil is preferably, for example, copper foil or copper alloy foil.

[0195] In the metal foil with a supporting substrate, the thickness of the supporting substrate is not particularly limited, but is preferably in the range of 10 μm to 150 μm, more preferably in the range of 10 μm to 100 μm. The thickness of the metal foil may be, for example, in the range of 0.1 μm to 10 μm.

[0196] In one embodiment, the resin sheet may further include an optional layer, if necessary. Examples of such optional layers include a protective film provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

[0197] The resin sheet can be produced, for example, by preparing a liquid resin composition as is or a resin varnish by dissolving the resin composition in an organic solvent, applying this onto a support using a die coater or the like, and then drying to form a resin composition layer.

[0198] The organic solvent may be the same as the organic solvent described as a component of the resin composition. The organic solvent may be used alone or in combination of two or more.

[0199] Drying may be carried out by known methods such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is carried out so that the content of organic solvent in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the organic solvent in the resin composition or resin varnish, for example, when a resin composition or resin varnish containing 30% by mass to 60% by mass of organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0200] The resin sheet can be stored in a rolled state. The resin sheet may not be used immediately after production. In such cases, it is preferable to store the resin sheet in a frozen and / or refrigerated state after production to prevent loss of its properties. It is particularly preferable to store the resin sheet in a frozen state after production. The temperature conditions for storing the resin sheet in a frozen or refrigerated state are, for example, 8°C or lower, preferably 0°C or lower, and more preferably -18°C or lower. The lower limit of such a temperature is not particularly limited and may be, for example, -40°C or higher. When the resin sheet is stored in a frozen or refrigerated state, it is desirable to thaw and adjust the temperature by leaving the resin sheet in the usage environment (temperature 15 to 28°C, relative humidity 40 to 60% RH). It is preferable, but not limited to, to use the resin sheet after the resin composition layer contained in the resin sheet reaches the same temperature as the usage environment. If the resin sheet has a protective film, it can be used by peeling off the protective film.

[0201] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0202] The sheet-like fiber substrate used for the prepreg is not particularly limited, and commonly used prepreg substrates such as glass cloth, aramid nonwoven fabric, and liquid crystal polymer nonwoven fabric can be used. From the viewpoint of thinning printed wiring boards and semiconductor chip packages, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. There is no particular lower limit to the thickness of the sheet-like fiber substrate. It is usually 10 μm or more.

[0203] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0204] The thickness of the prepreg may be in the same range as that of the resin composition layer in the resin sheet described above.

[0205] The sheet-like laminate material of the present invention can be suitably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board). The sheet-like laminate material of the present invention can also be suitably used to form an insulating layer of a rewiring board of a semiconductor package (for an insulating layer of a rewiring board). That is, the sheet-like laminate material of the present invention can be suitably used as an insulating layer of a circuit board.

[0206] [Circuit board] The resin composition of the present invention can be used to form an insulating layer for a circuit board. The present invention also provides such a circuit board, i.e., a circuit board comprising an insulating layer made of a cured product of the resin composition of the present invention.

[0207] <Printed wiring board> In one embodiment, the circuit board of the present invention is a printed wiring board.

[0208] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., thermally curing) the resin composition layer to form an insulating layer.

[0209] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be referred to as an "inner layer circuit board." Furthermore, the "inner layer substrate" of the present invention also includes intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0210] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). The thermocompression bonding member may be pressed directly onto the resin sheet, or may be pressed via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0211] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination may be carried out under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0212] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0213] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0214] The support may be removed between step (I) and step (II), or after step (II). When a metal foil is used as the support, the conductor layer may be formed using the metal foil without peeling off the support. When a metal foil with a supporting substrate is used as the support, the supporting substrate (and the release layer) may be peeled off. Then, the conductor layer can be formed using the metal foil.

[0215] In step (II), the resin composition layer is cured (for example, by heat curing) to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions typically employed for forming insulating layers for printed wiring boards may be used.

[0216] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 140° C. to 250° C., more preferably 150° C. to 240° C., and even more preferably 160° C. to 230° C. The curing time is preferably 5 minutes to 240 minutes, more preferably 10 minutes to 150 minutes, and even more preferably 15 minutes to 120 minutes.

[0217] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 140°C, preferably 60°C to 135°C, more preferably 70°C to 130°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0218] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0219] In another embodiment, the printed wiring board of the present invention can be produced using the above-mentioned prepreg. The production method is basically the same as when a resin sheet is used.

[0220] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0221] Step (IV) is a step of roughening the insulating layer. Usually, in this step (IV), smear removal (desmear) is also performed. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0222] The swelling liquid used in the roughening treatment is not particularly limited, but examples thereof include alkaline solutions and surfactant solutions, and is preferably an alkaline solution, with sodium hydroxide solution and potassium hydroxide solution being more preferred. Commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. The swelling treatment using a swelling liquid is not particularly limited, but can be carried out by, for example, immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0223] The oxidizing agent used in the roughening treatment is not particularly limited, but examples include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP," "Concentrate Compact P," and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0224] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and examples of commercially available products include "Reduction Solution Securigant P" manufactured by Atotech Japan.

[0225] Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the standpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0226] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0227] The conductor layer may have a single layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0228] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0229] In one embodiment, the conductor layer may be formed by plating. From the viewpoint of facilitating the formation of fine wiring, it is preferable to form the conductor layer by a semi-additive method. An example of forming the conductor layer by a semi-additive method will be described below.

[0230] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0231] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be performed by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventional known technique such as a modified semi-additive method.

[0232] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Smelting Co., Ltd., and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0233] Alternatively, when a metal foil or a metal foil with a supporting substrate is used as the support for the resin sheet, the conductor layer may be formed using the metal foil, as described above.

[0234] <Rewiring substrate for semiconductor packages> In one embodiment, the circuit board of the present invention is a rewiring substrate (rewiring layer) of a semiconductor package. Hereinafter, a method for manufacturing a semiconductor package will be described.

[0235] The semiconductor package includes an insulating layer made of a cured product of the resin composition of the present invention as an insulating layer of a rewiring substrate. The semiconductor package may also include a sealing layer made of a cured product of the resin composition of the present invention.

[0236] A semiconductor package can be produced, for example, by a method including the following steps (1) to (6) using the resin composition and resin sheet of the present invention. The resin composition and resin sheet of the present invention can be used to form a rewiring formation layer (insulating layer for forming a rewiring substrate) in step (5) or a sealing layer in step (3). An example of forming a rewiring formation layer or a sealing layer using a resin composition or a resin sheet will be shown below. However, techniques for forming a rewiring formation layer or a sealing layer for a semiconductor package are known, and a person skilled in the art can produce a semiconductor package using the resin composition and resin sheet of the present invention according to known techniques. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0237] -Process (1)- The material used for the substrate is not particularly limited. Examples of the substrate include semiconductor wafers such as silicon wafers, glass wafers, glass substrates, metal substrates such as copper, titanium, stainless steel, and cold-rolled steel sheets (SPCC), substrates in which glass fibers are impregnated with epoxy resin or the like and then thermoset (e.g., FR-4 substrates), and substrates made of bismaleimide triazine resin (BT resin).

[0238] The material of the temporary fixing film is not particularly limited as long as it can be peeled off from the semiconductor chip in step (4) and can temporarily fix the semiconductor chip. Commercially available products can be used as the temporary fixing film. Examples of commercially available products include Riva Alpha manufactured by Nitto Denko Corporation.

[0239] -Process (2)- The semiconductor chips can be temporarily fixed using known devices such as a flip chip bonder, a die bonder, etc. The layout and number of semiconductor chips to be arranged can be appropriately set depending on the shape and size of the temporary fixing film, the number of semiconductor packages to be produced, etc., and for example, the semiconductor chips can be temporarily fixed by arranging them in a matrix of multiple rows and multiple columns.

[0240] -Process (3)- The resin composition layer of the resin sheet of the present invention is laminated on a semiconductor chip, or the resin composition of the present invention is applied to a semiconductor chip and cured (for example, thermally cured) to form a sealing layer.

[0241] For example, lamination of a semiconductor chip and a resin sheet can be performed by removing the protective film from the resin sheet and then thermocompressing the resin sheet to the semiconductor chip from the support side. Examples of a member for thermocompressing the resin sheet to the semiconductor chip (hereinafter also referred to as a "thermocompression member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber, so that the resin sheet can adequately conform to the surface irregularities of the semiconductor chip. The semiconductor chip and resin sheet can also be laminated by a vacuum lamination method, and the lamination conditions and preferred ranges are the same as those described in relation to the method for manufacturing a printed wiring board.

[0242] After lamination, the resin composition is thermally cured to form the sealing layer under the same conditions as those described in relation to the method for producing a printed wiring board.

[0243] The support of the resin sheet may be peeled off after the resin sheet is laminated on the semiconductor chip and thermally cured, or the support may be peeled off before the resin sheet is laminated on the semiconductor chip.

[0244] When forming a sealing layer by applying the resin composition of the present invention, the application conditions are the same as the application conditions when forming the resin composition layer described in relation to the resin sheet of the present invention, and the preferred ranges are also the same.

[0245] -Process (4)- The method for peeling off the substrate and the temporary fixing film can be changed as appropriate depending on the material of the temporary fixing film, etc., and examples include a method in which the temporary fixing film is heated and foamed (or expanded) to peel it off, and a method in which ultraviolet light is irradiated from the substrate side to reduce the adhesive strength of the temporary fixing film and peel it off.

[0246] In the method of heating and foaming (or expanding) the temporary fixing film to peel it off, the heating conditions are usually 100 to 250°C for 1 to 90 seconds or 5 to 15 minutes. In the method of irradiating ultraviolet light from the substrate side to reduce the adhesive strength of the temporary fixing film to peel it off, the irradiation dose of ultraviolet light is usually 10 mJ / cm. 2 ~1000mJ / cm 2 is.

[0247] -Process (5)- The resin composition and resin sheet of the present invention are used to form a rewiring formation layer (insulating layer of a rewiring substrate).

[0248] After forming the redistribution layer, via holes may be formed in the redistribution layer to connect the semiconductor chip to a conductor layer (described later). The via holes may be formed by a known method depending on the material of the redistribution layer.

[0249] -Process (6)- The formation of the conductor layer on the rewiring formation layer may be carried out in the same manner as in step (V) described in relation to the method for producing a printed wiring board. Note that steps (5) and (6) may be repeated to alternately stack (build up) the conductor layer (rewiring layer) and the rewiring formation layer (insulating layer).

[0250] The manufacturing of the semiconductor package may further include steps of (7) forming a solder resist layer on the conductor layer (rewiring layer), (8) forming bumps, and (9) dicing the multiple semiconductor packages into individual semiconductor packages. These steps may be performed according to various methods known to those skilled in the art that are used in the manufacturing of semiconductor packages.

[0251] By forming a rewiring formation layer (insulating layer) using the resin composition or resin sheet of the present invention, which can provide a cured product with a low dielectric tangent and excellent adhesion strength to a conductor layer, a semiconductor package with extremely low transmission loss can be realized, regardless of whether the semiconductor package is a fan-in package or a fan-out package. In one embodiment, the semiconductor package of the present invention is a fan-out package. The resin composition or resin sheet of the present invention can be applied to both a fan-out panel level package (FOPLP) and a fan-out wafer level package (FOWLP). In one embodiment, the semiconductor package of the present invention is a fan-out panel level package (FOPLP) or a fan-out wafer level package (FOWLP).

[0252] [Semiconductor Devices] The semiconductor device of the present invention includes a layer made of a cured product of the resin composition of the present invention. The semiconductor device of the present invention can be produced using the circuit board of the present invention.

[0253] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0254] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Furthermore, unless otherwise specified, the temperature and pressure conditions were room temperature (23°C) and atmospheric pressure (1 atm). Furthermore, the structure of the synthesized silane compound was determined by proton nuclear magnetic resonance (NMR) analysis using a nuclear magnetic resonance apparatus (Bruker "AVANCE400" (400 MHz)). 1 The compounds were identified by H-NMR spectroscopy. Chemical shifts (δ) are in ppm.

[0255] <Synthesis Example 1: Synthesis of Silane Compound 1> To a methyl ethyl ketone solution of 2.2 g of (3-isocyanatopropyl)trimethoxysilane, 2.0 g of 1-(4-hydroxyphenyl)-1H-pyrrole-2,5-dione and 10 μL of diazabicycloundecene were added, and the mixture was stirred at 65°C for 24 hours under an argon atmosphere. After cooling to 25°C, insoluble materials were filtered off, and the mixture was concentrated under reduced pressure to obtain 4.5 g of silane compound 1 as a purple oil. The structure of silane compound 1 is represented by the following formula (1).

[0256] [ka]

[0257] [Silane Compound 1 1 H-NMR spectrum] 1H-NMR(400MHz,DMSO-d6) δ :7.84(t,J=5.7Hz,1H),7.36-7.27(m,2H),7.27-7.14(m,4H),3.48(br-s,9H),3.05(q,J=6.8Hz,2H),1.60-1.45(m,2H),0.68-0.54(m,2H).

[0258] <Synthesis Example 2: Synthesis of Silane Compound 2> To a methyl ethyl ketone solution of 2.2 g of (3-isocyanatopropyl)trimethoxysilane, 2.0 g of 1-(4-aminophenyl)-1H-pyrrole-2,5-dione and 10 μL of diazabicycloundecene were added, and the mixture was stirred at 75°C for 24 hours under an argon atmosphere. After cooling to 25°C, insoluble materials were filtered off, and the mixture was concentrated under reduced pressure to obtain 4.3 g of silane compound 2 as a purple oil. The structure of silane compound 2 is represented by the following formula (2).

[0259] [ka]

[0260] [Silane Compound 2 1 H-NMR spectrum] 1 H-NMR(400MHz,DMSO-d6) δ :9.15(t,J=5.6Hz,1H),7.83-7.79(m,2H),7.52-7.49(m,2H),7.27(s,2H),3 .49(br-s,9H),3.12(q,J=6.8Hz,2H),1.58-1.43(m,2H),0.68-0.56(m,2H).

[0261] <Synthesis Example 3: Synthesis of Silane Compound 3> To a solution of 4.1 g of 3-(trimethoxysilyl)propan-1-amine in acetonitrile, 5.0 g of 4-(2,5-dioxo-2,5-dihydro-1H-pyrrol-1-yl)benzoic acid, 4.4 g of WSC hydrochloride, and 4.0 mL of N,N-diisopropylethylamine were added and stirred at 40°C for 24 hours under an argon atmosphere. After cooling to 25°C, the solvent was distilled off, the mixture was diluted with ethyl acetate, and washed three times with water. The organic layer was dried over sodium sulfate, the desiccant was filtered off, and the mixture was concentrated under reduced pressure to obtain 5.1 g of silane compound 3 as a purple oil. The structure of silane compound 3 is represented by the following formula (3):

[0262] [ka]

[0263] [Silane Compound 3 1 H-NMR spectrum] 1 H-NMR(400MHz,DMSO-d6) δ :8.28-8.22(m,2H),7.70-7.56(m,2H),7.5(t,J=5.7Hz,1H),7.18(br-s,1H), 3.48(br-s,9H),3.21(q,J=6.5Hz,2H),1.46-1.38(m,2H),0.55-0.49(m,2H).

[0264] <Synthesis Example 4: Synthesis of Silane Compound 4> To a methyl ethyl ketone solution of 4.4 g of (3-isocyanatopropyl)trimethoxysilane, 3.3 g of 1-(2-hydroxyethyl)-1H-pyrrole-2,5-dione and 10 μL of diazabicycloundecene were added, and the mixture was stirred at 75°C for 24 hours under an argon atmosphere. After cooling to 25°C, insoluble materials were filtered off, and the mixture was concentrated under reduced pressure to obtain 5.2 g of silane compound 4 as a purple oil. The structure of silane compound 4 is represented by the following formula (4).

[0265] [ka]

[0266] [Silane Compound 4 1 H-NMR spectrum] 1 H-NMR(400MHz,DMSO-d6) δ :7.12(s,2H),5.19(t,J=5.7Hz,1H),4.23(t,J=5.6Hz,2H),3.82(t,J=5.7Hz,2H ),3.49(br-s,9H),3.03(q,J=6.8Hz,2H),1.45-1.39(m,2H),0.68-0.61(m,2H).

[0267] <Synthesis Example 5: Synthesis of Silane Compound 5> To a methyl ethyl ketone solution of 3.0 g of (3-isocyanatopropyl)trimethoxysilane, 2.0 g of 1-(2-aminoethyl)-1H-pyrrole-2,5-dione and 10 μL of diazabicycloundecene were added, and the mixture was stirred at 65°C for 24 hours under an argon atmosphere. After cooling to 25°C, insoluble materials were filtered off, and the mixture was concentrated under reduced pressure to obtain 4.5 g of silane compound 5 as a purple oil. The structure of silane compound 5 is represented by the following formula (5).

[0268] [ka]

[0269] [Silane Compound 5 1 H-NMR spectrum] 1 H-NMR(400MHz,DMSO-d6) δ :7.14(s,2H),5.21(t,J=5.6Hz,1H),5.17(t,J=5.7Hz,1H),3.79(t,J=5.6,2H),3.48(br- s,9H),3.41(t,J=5.7Hz,2H),3.03(q,J=6.8Hz,2H),1.48-1.38(m,2H),0.66-0.59(m,2H).

[0270] <Synthesis Example 6: Synthesis of Silane Compound 6> To a solution of 2.1 g of 3-(trimethoxysilyl)propan-1-amine in acetonitrile, 2.0 g of 3-(2,5-dioxo-2,5-dihydro-1H-pyrrol-1-yl)propionic acid, 2.3 g of WSC hydrochloride, and 2.1 mL of N,N-diisopropylethylamine were added and stirred at 40°C for 24 hours under an argon atmosphere. After cooling to 25°C, the solvent was evaporated, the mixture was diluted with ethyl acetate, and washed three times with water. The organic layer was dried over sodium sulfate, the desiccant was filtered off, and the mixture was concentrated under reduced pressure to obtain 3.1 g of silane compound 6 as a purple oil. The structure of silane compound 6 is represented by the following formula (6):

[0271] [ka]

[0272] [Silane Compound 6 1 H-NMR spectrum] 1 H-NMR(400MHz,DMSO-d6) δ :7.22(t,J=5.6Hz,1H),7.10(s,2H),3.80(t,J=5.6Hz,2H),3.47(br-s,9H),3.09(q,J=6.8Hz,2H),1.50-1.39(m,2H),0.68-0.61(m,2H).

[0273] <Synthesis Example 7: Synthesis of Silane Compound 7> A 300 mL four-neck flask equipped with a stirrer, temperature sensor, Dean-Stark trap, dropping funnel, and condenser was charged with 75 g of cyclohexanone and 50 g of xylene. The mixture was heated to 150 °C under a nitrogen flow while stirring. The temperature was controlled so that the temperature at the top of the Dean-Stark trap did not exceed 100 °C, and the azeotropic product of water and xylene in the system was collected in the Dean-Stark trap. Next, while maintaining the reaction mixture temperature at 150 °C, 100 g of 3-(trimethoxysilyl)propan-1-amine was added through the dropping funnel over 1 h. During this time, water and xylene were azeotropically collected in the Dean-Stark trap. After the dropwise addition, stirring was continued at 150 °C for 6 h until the azeotropic reaction ceased. The flask was then maintained at the same temperature and the pressure was reduced to 3.0 kPa while stirring, and the volatiles were collected.

[0274] Next, 20 mL of cyclohexanone was added to a 100 mL four-neck flask equipped with a stirrer, temperature sensor, Dean-Stark trap, dropping funnel, and condenser. The mixture was subjected to dry distillation at 150 °C while stirring, and the water was collected in the Dean-Stark trap. The mixture was then cooled to 25 °C to dissolve 8.2 g of maleic anhydride. While maintaining the flask at below 40 °C, 23.8 g of the volatile components obtained earlier were added via the dropping funnel over 1 h. After the addition of the volatile components, the flask was maintained at below 40 °C and stirring continued for 3 h, yielding 22 g of a cyclohexanone solution of silane compound 7 (46% nonvolatiles by mass). The structure of silane compound 7 is represented by the following formula (7):

[0275] [ka]

[0276] [Silane Compound 7 1 H-NMR spectrum] 1H-NMR(400MHz,DMSO-d6) δ :6.82(s,2H),3.76(t,J=5.6Hz,2H),3.49(br-s,9H),3.09(q,J=6.8Hz,2H),1.58-1.46(m,2H),0.68-0.61(m,2H).

[0277] <Synthesis Example 8: Synthesis of maleimide-based radical polymerizable compound B1> An MEK solution (62% by mass of non-volatile components) of maleimide resin B1 (Mw / Mn=1.81, t"=1.47 (mainly 1, 2, or 3)) synthesized by the method described in Synthesis Example A of the Japan Institute of Invention and Innovation's Technical Journal, Publication No. 2020-500211 was prepared. This maleimide-based radically polymerizable compound B1 has a structure represented by the following formula (M):

[0278] [ka]

[0279] <Synthesis Example 9: Synthesis of styrene-based radical polymerizable compound B2> According to Example 1 of WO 2017 / 115813, 3.0 moles (390.6 g) of divinylbenzene, 1.8 moles (229.4 g) of ethylvinylbenzene, 10.2 moles (1066.3 g) of styrene, and 15.0 moles (1532.0 g) of n-propyl acetate were charged into a 5.0 L reactor, and 600 mmol of boron trifluoride diethyl ether complex was added at 70 °C. The reaction was allowed to proceed for 4 hours. The polymerization solution was terminated with aqueous sodium bicarbonate solution, and the oil layer was washed three times with pure water. The polymer was then devolatilized under reduced pressure at 60 °C and recovered. The resulting product was weighed, confirming that 896.7 g of styrene-based radical polymerizable compound B2 was obtained. The weight-average molecular weight (Mw) of the styrene-based radical polymerizable compound B2 was 41,300.

[0280] <Synthesis Example 10: Synthesis of Polyimide Resin E> A 500 mL separable flask was prepared, equipped with a water content receiver connected to a reflux condenser, a nitrogen inlet tube, and a stirrer. 20.3 g of 4,4'-oxydiphthalic anhydride (ODPA), 200 g of γ-butyrolactone, 20 g of toluene, and 29.6 g of 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindane were added to the flask and stirred at 45°C for 2 hours under a nitrogen stream. The reaction solution was then heated and maintained at approximately 160°C, while the condensed water was azeotropically removed with toluene under a nitrogen stream. It was confirmed that the specified amount of water had accumulated in the water content receiver and that no water was leaking out. After confirmation, the reaction solution was further heated and stirred at 200°C for 1 hour. The mixture was then cooled to obtain a polyimide solution (non-volatile content 20% by mass) containing polyimide resin E having a 1,1,3-trimethylindane skeleton. The obtained polyimide resin E had a repeating unit represented by the following formula (X1) and a repeating unit represented by the following formula (X2). The weight-average molecular weight (Mw) of polyimide resin E was 12,000.

[0281] [ka]

[0282] <Production Example 1: Production of Inorganic Filler 1 Surface-Treated with Silane Compound 1> Spherical silica (Admatechs "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m 2 100 parts by mass of silica (100 parts by mass / g) was charged into a Henschel mixer. The spherical silica was stirred for 10 minutes while spraying 0.6 parts by mass of silane compound 1 obtained in Synthesis Example 1, to obtain inorganic filler 1 surface-treated with silane compound 1. The amount of silane compound 1 surface-treated on inorganic filler 1 was 0.6% by mass.

[0283] <Production Example 2: Production of Inorganic Filler 2 Surface-Treated with Silane Compound 2> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 2 obtained in Synthesis Example 2. Except for the above, an inorganic filler 2 surface-treated with silane compound 2 was obtained in the same manner as in Production Example 1. The amount of silane compound 2 used in surface treatment of inorganic filler 2 was 0.6% by mass.

[0284] <Production Example 3: Production of Inorganic Filler 3 Surface-Treated with Silane Compound 3> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 3 obtained in Synthesis Example 3. Except for the above, the same procedure as in Production Example 1 was repeated to obtain inorganic filler 3 surface-treated with silane compound 3. The amount of silane compound 3 used in surface treatment of inorganic filler 3 was 0.6% by mass.

[0285] <Production Example 4: Production of Inorganic Filler 4 Surface-Treated with Silane Compound 4> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 4 obtained in Synthesis Example 4. Except for the above, an inorganic filler 4 surface-treated with silane compound 4 was obtained in the same manner as in Production Example 1. The amount of silane compound 4 used in surface treatment of inorganic filler 4 was 0.6% by mass.

[0286] <Production Example 5: Production of Inorganic Filler 5 Surface-Treated with Silane Compound 5> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 5 obtained in Synthesis Example 5. Except for the above, the same procedure as in Production Example 1 was repeated to obtain inorganic filler 5 surface-treated with silane compound 5. The amount of silane compound 5 used in surface treatment of inorganic filler 5 was 0.6% by mass.

[0287] <Production Example 6: Production of Inorganic Filler 6 Surface-Treated with Silane Compound 6> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 6 obtained in Synthesis Example 6. Except for the above, an inorganic filler 6 surface-treated with silane compound 6 was obtained in the same manner as in Production Example 1. The amount of silane compound 6 used in surface treatment of inorganic filler 6 was 0.6% by mass.

[0288] <Production Example 7: Production of Inorganic Filler 7 Surface-Treated with Silane Compound 7> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of silane compound 7 obtained in Synthesis Example 7. Except for the above, the same procedure as in Production Example 1 was repeated to obtain inorganic filler 7 surface-treated with silane compound 7. The amount of silane compound 7 used in surface treatment of inorganic filler 7 was 0.6% by mass.

[0289] <Production Example 8: Production of inorganic filler 8 surface-treated with silane compound 1> In Production Example 1, the amount of silane compound 1 in Synthesis Example 1 was changed from 0.6 parts by mass to 0.3 parts by mass. Except for the above, an inorganic filler 8 surface-treated with silane compound 1 was obtained in the same manner as in Production Example 1. The amount of silane compound 1 used in surface treatment of inorganic filler 8 was 0.3% by mass.

[0290] <Production Example 9: Production of Inorganic Filler 9 Surface-Treated with Silane Compound 1> In Production Example 1, the amount of silane compound 1 in Synthesis Example 1 was changed from 0.6 parts by mass to 1.2 parts by mass. Except for the above, an inorganic filler 9 surface-treated with silane compound 1 was obtained in the same manner as in Production Example 1. The amount of silane compound 1 used in surface treatment of inorganic filler 9 was 1.2% by mass.

[0291] <Production Example 10: Production of Inorganic Filler 10 Surface-Treated with Silane Compound 1 and Amine-Based Alkoxysilane Compound> Spherical silica (Admatechs "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m 2100 parts by mass of silica (100g / g) was placed in a Henschel-type mixer. While spraying 0.4 parts by mass of silane compound 1 obtained in Synthesis Example 1, the spherical silica was stirred for 10 minutes, and the spherical silica was surface-treated with silane compound 1. Thereafter, while spraying 0.3 parts by mass of an amine-based alkoxysilane compound ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.), the spherical silica was stirred for 10 minutes, and the spherical silica was further surface-treated with the amine-based alkoxysilane compound. Through the above procedure, an inorganic filler 10 surface-treated with silane compound 1 and the amine-based alkoxysilane compound was obtained. The amount of inorganic filler 10 surface-treated with silane compound 1 was 0.4% by mass, and the amount of inorganic filler 10 surface-treated with the amine-based alkoxysilane compound was 0.3% by mass.

[0292] <Production Example 11: Production of Inorganic Filler 11 Surface-Treated with Amine-Based Alkoxysilane Compound and Silane Compound 1> Spherical silica (Admatechs "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m 2 100 parts by mass of silica (100g / g) was placed in a Henschel-type mixer. While spraying 0.3 parts by mass of an amine-based alkoxysilane compound ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.), the spherical silica was stirred for 10 minutes, and the spherical silica was surface-treated with the amine-based alkoxysilane compound. Thereafter, while spraying 0.4 parts by mass of silane compound 1 obtained in Synthesis Example 1, the spherical silica was stirred for 10 minutes, and the spherical silica was further surface-treated with silane compound 1. Through the above procedure, inorganic filler 11 surface-treated with the amine-based alkoxysilane compound and silane compound 1 was obtained. The amount of inorganic filler 11 surface-treated with the amine-based alkoxysilane compound was 0.3% by mass, and the amount of inorganic filler 11 surface-treated with silane compound 1 was 0.4% by mass.

[0293] <Production Example 12: Production of hollow inorganic filler 12 surface-treated with silane compound 1> In Production Example 1, 1) 100 parts by mass of spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd.) was replaced with 100 parts by mass of hollow silica ("Hipressica FH" manufactured by Ube Exsymo Co., Ltd., average particle size 0.5 μm, porosity 30 to 50 vol%). 2) The amount of silane compound 1 in Synthesis Example 1 was changed from 0.6 parts by mass to 1.2 parts by mass. Except for the above, the same procedure as in Production Example 1 was repeated to obtain hollow inorganic filler 12 surface-treated with silane compound 1. The amount of silane compound 1 surface-treated on inorganic filler 12 was 1.2 mass %.

[0294] <Production Example 13: Production of Inorganic Filler 13 Surface-Treated with Silane Compound 1> In Production Example 1, 1) 100 parts by mass of spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd.) was mixed with another spherical silica ("UFP-30" manufactured by Denka Co., Ltd., average particle size 0.3 μm, specific surface area 30.7 m 2 / g) 100 parts by mass, 2) The amount of silane compound 1 in Synthesis Example 1 was changed from 0.6 parts by mass to 2.0 parts by mass. Except for the above, the procedure was the same as in Production Example 1 to obtain an inorganic filler 13 surface-treated with silane compound 1. The amount of silane compound 1 surface-treated on inorganic filler 13 was 2.0 mass %.

[0295] <Production Example 14: Production of Inorganic Filler 14 Surface-Treated with Amine-Based Alkoxysilane Compound> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of an amine-based alkoxysilane compound ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.). Except for the above, the same procedure as in Production Example 1 was repeated to obtain an inorganic filler 14 surface-treated with an amine-based alkoxysilane compound. The amount of the amine-based alkoxysilane compound used in surface treatment of inorganic filler 14 was 0.6% by mass.

[0296] <Production Example 15: Production of Inorganic Filler 15 Surface-Treated with Methacrylic Alkoxysilane Compound> In Production Example 1, 0.6 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 0.6 parts by mass of a methacrylic alkoxysilane compound ("KBM-503" manufactured by Shin-Etsu Chemical Co., Ltd.). Except for the above, the same procedure as in Production Example 1 was repeated to obtain an inorganic filler 15 surface-treated with a methacrylic alkoxysilane compound. The amount of the methacrylic alkoxysilane compound surface-treated on inorganic filler 15 was 0.6% by mass.

[0297] <Production Example 16: Production of Inorganic Filler 16 Surface-Treated with Amine-Based Alkoxysilane Compound> In Production Example 13, 2.0 parts by mass of silane compound 1 in Synthesis Example 1 was changed to 2.0 parts by mass of an amine-based alkoxysilane compound ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.). Except for the above, the same procedure as in Production Example 13 was repeated to obtain an inorganic filler 16 surface-treated with an amine-based alkoxysilane compound. The amount of the amine-based alkoxysilane compound used in surface treatment of inorganic filler 16 was 2.0% by mass.

[0298] <Examples 1 to 19 and Comparative Examples 1 to 3: Production of Resin Varnish> Each component was weighed and mixed in the amount (parts by mass) shown in Tables 1 to 4 below, and then 10 parts by mass of methyl ethyl ketone and 10 parts by mass of cyclohexanone were added and uniformly dispersed using a high-speed rotary mixer to obtain a resin varnish. Details of each component shown in Tables 1 to 4 below are as follows.

[0299] (A) Silane compound having a maleimide group "Silane compound 1": Silane compound 1 obtained in Synthesis Example 1

[0300] (B) Compound having a radical polymerizable group "MIR-3000-70T": Maleimide radical polymerizable compound (manufactured by Nippon Kayaku Co., Ltd., toluene solution with 70% non-volatile components) "Maleimide B1": Maleimide-based radical polymerizable compound B1 obtained in Synthesis Example 8 "SLK-6895-T90": Maleimide radical polymerizable compound (Shin-Etsu Chemical Co., Ltd., toluene solution with 90% non-volatile components) "BMI-2300": Maleimide radical polymerizable compound (manufactured by Daiwa Chemical Industry Co., Ltd.) "OPE-2St": styrene-based radical polymerizable compound (vinylbenzyl-modified polyphenylene ether, manufactured by Mitsubishi Gas Chemical Co., Ltd., toluene solution with 65% non-volatile components) NE-V-1100-70T: Allyl radical polymerizable compound (DIC Corporation, toluene solution with 70% non-volatile components) "Vinyl resin B2": styrene-based radical polymerizable compound B2 obtained in Synthesis Example 2 (solution containing 50% non-volatile components) "A-DOG": (meth)acrylic radical polymerizable compound (multifunctional acrylate; dioxane glycol diacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.) "DAD": Allyl radical polymerizable compound (diallyl diphenate, manufactured by Nisshoku Techno Fine Chemical Co., Ltd.)

[0301] (C-1) Specially treated inorganic filler ((A) Inorganic filler surface-treated with a silane compound having a maleimide group) "Inorganic filler 1": Inorganic filler 1 produced in Production Example 1 (amount of surface treatment with silane compound 1: 0.6% by mass) "Inorganic filler 2": Inorganic filler 2 produced in Production Example 2 (amount of surface treatment with silane compound 2: 0.6% by mass) "Inorganic filler 3": Inorganic filler 3 produced in Production Example 3 (amount of surface treatment with silane compound 3: 0.6% by mass) "Inorganic filler 4": Inorganic filler 4 produced in Production Example 4 (amount of surface treatment with silane compound 4: 0.6% by mass) "Inorganic filler 5": Inorganic filler 5 produced in Production Example 5 (amount of surface treatment with silane compound 5: 0.6% by mass) "Inorganic filler 6": Inorganic filler 6 produced in Production Example 6 (amount of surface treatment with silane compound 6: 0.6% by mass) "Inorganic filler 7": Inorganic filler 7 produced in Production Example 7 (amount of surface treatment with silane compound 7: 0.6% by mass) "Inorganic filler 8": Inorganic filler 8 produced in Production Example 8 (amount of surface treatment with silane compound 1: 0.3% by mass) "Inorganic filler 9": Inorganic filler 9 produced in Production Example 9 (amount of surface treatment with silane compound 1: 1.2% by mass) "Inorganic filler 10": Inorganic filler 10 produced in Production Example 10 (amount of surface treatment with silane compound 1: 0.4 mass%, amount of surface treatment with amine-based alkoxysilane compound: 0.3 mass%) "Inorganic filler 11": Inorganic filler 11 produced in Production Example 11 (amount of surface treatment with amine-based alkoxysilane compound: 0.3 mass%, amount of surface treatment with silane compound 1: 0.4 mass%) "Inorganic filler 12": hollow inorganic filler 12 produced in Production Example 12 (amount of surface treatment with silane compound 1: 1.2% by mass) "Inorganic filler 13": Inorganic filler 13 produced in Production Example 13 (amount of surface treatment with silane compound 1: 2.0% by mass)

[0302] (C-2) Optional inorganic filler ((A) inorganic filler not surface-treated with a silane compound having a maleimide group) "Inorganic filler 14": Inorganic filler 14 produced in Production Example 14 (amount of surface treatment with amine-based alkoxysilane compound: 0.6% by mass) "Inorganic filler 15": Inorganic filler 15 produced in Production Example 15 (amount of surface treatment with methacrylic alkoxysilane compound: 0.6% by mass) "Inorganic filler 16": Inorganic filler 16 produced in Production Example 16 (amount of surface treatment with amine-based alkoxysilane compound: 2.0% by mass)

[0303] (D) Thermosetting resin "ZX-1059": Epoxy resin (a 1:1 mixture of bisphenol A epoxy resin and bisphenol F epoxy resin, manufactured by Nippon Steel Chemical & Material Co., Ltd., epoxy equivalent weight 169g / eq.) LA-3018-50P: Phenolic resin (DIC Corporation, 1-methoxy-2-propanol solution containing 50% non-volatile components by weight, active group equivalent weight 151g / eq.) · “ALP-d”: Benzoxazine resin (manufactured by Shikoku Kasei Kogyo Co., Ltd., active group equivalent: 257 g / eq.) HPC-8150-62T: Activated ester resin with a naphthalene structure (DIC Corporation, solution with 62% non-volatile content, active group equivalent weight of approximately 229 g / eq.)

[0304] (E) Polymer resin "PX-3-RP-61": Polystyrene resin with oxazoline groups (manufactured by Nippon Shokubai Co., Ltd.) "YX7553BH30": Phenoxy resin (Mitsubishi Chemical Corporation, solution containing 30% non-volatile components) "Polyimide resin E": Polyimide resin E obtained in Synthesis Example 10 (solution containing 20% ​​by mass of non-volatile components) "EXL2655": Core-shell type graft copolymer rubber particles (manufactured by The Dow Chemical Company)

[0305] (F) Polymerization initiator "Perhexyl D": Peroxide radical polymerization initiator, di-tert-hexyl peroxide (NOF Corporation)

[0306] (G) Curing accelerator 1B2PZ: 1-benzyl-2-phenylimidazole (manufactured by Shikoku Chemicals Corporation)

[0307] <Production of Resin Sheet A> A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The resin varnishes obtained in the Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. The applied resin varnish was then dried at 80°C to 100°C (average 90°C) for 2 minutes to obtain a resin sheet A including a support and a resin composition layer.

[0308] [Test Example 1: Dielectric loss tangent measurement test] (1) Preparation of hardened product: Resin sheet A was heated in an oven at 190° C. for 90 minutes to cure the resin composition layer. Resin sheet A was taken out of the oven and the support was peeled off to obtain a cured resin composition layer.

[0309] (2) Measurement of dielectric loss tangent: The cured resin composition layer was cut into a piece of 80 mm long and 2 mm wide to obtain a test piece. Using a measuring device (Agilent Technologies' "HP8362B"), the dielectric loss tangent (Df value) of the test piece was measured by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on two test pieces, and the average was calculated.

[0310] [Test Example 2: Evaluation test of adhesion strength with conductor layer] The adhesive strength to the conductor layer was evaluated by measuring the copper foil peel strength according to the following procedure. (1) Copper foil surface preparation: The shiny side of an electrolytic copper foil (Mitsui Mining & Smelting Co., Ltd., "3EC-III," 35 μm thick) was etched to a depth of 1 μm with a microetching agent (Mec Co., Ltd., "CZ8101") to roughen the copper surface, followed by a rust-proofing treatment (CL8300). The copper foil whose surface had been etched with this microetching agent is hereinafter sometimes referred to as "CZ copper foil." Furthermore, this copper foil was heat-treated in an oven at 130°C for 30 minutes to obtain copper foil I having a roughened treated surface.

[0311] (2) Preparation of inner layer board: A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") with copper foil on the surface and inner layer circuitry was prepared. Both sides of this glass cloth-based epoxy resin double-sided copper-clad laminate were etched to a depth of 1 μm using a microetching agent (MEC "CZ8101") to roughen the copper foil surface. This resulted in an inner layer substrate with a treated CZ copper foil on its surface.

[0312] (3) Lamination of resin composition layer: The resin sheet A prepared in each of the examples and comparative examples was laminated on both sides of an inner layer substrate. This lamination was performed using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700") so that the resin composition layer was in contact with the inner layer substrate. This lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 120°C and a pressure of 0.74 MPa for 30 seconds. The laminated resin sheet was then heat-pressed at 100°C and a pressure of 0.5 MPa for 60 seconds to prepare evaluation substrate A. The support was then peeled off to expose the resin composition layer.

[0313] (4) Lamination of copper foil and curing of resin composition layer: The treated surface of copper foil I was laminated onto the exposed resin composition layer under the same conditions as in "(3) Lamination of Resin Composition Layer" above. The resin composition layer was then cured at 200°C for 90 minutes to form an insulating layer containing a cured resin composition. This procedure yielded evaluation substrate C, in which CZ copper foil was laminated on both sides of the insulating layer. This evaluation substrate C had a layer structure of copper foil I / insulating layer / inner layer substrate / insulating layer / copper foil I.

[0314] (5) Copper foil peel strength measurement: Evaluation board C was cut into small pieces measuring 150 mm x 30 mm. A cutter was used to cut a small piece of copper foil I, enclosing a rectangular area 10 mm wide and 100 mm long. One end of this rectangular area was peeled off and gripped with the gripper of a tensile tester (TSE Autocom Universal Tester AC-50C-SL). The copper foil was pulled vertically at a rate of 50 mm / min at 25°C, and the load [kgf / cm] required to peel off 35 mm was measured as the copper foil peel strength. Higher copper foil peel strength indicates better adhesion strength to the conductor layer. Measurements were performed in accordance with Japanese Industrial Standard JIS C6481.

[0315] [Test Example 3: Evaluation test of storage stability] (1) Measurement of minimum melt viscosity A portion of the resin composition layer was peeled off from resin sheet A to obtain sample resin composition D. The melt viscosity of sample resin composition D was measured using a dynamic viscoelasticity measuring device (Rheosol-G3000 manufactured by UBM). Specifically, 1 g of sample resin composition D was heated from an initial temperature of 60°C to 200°C at a heating rate of 5°C / min using parallel plates with a diameter of 18 mm, and the dynamic viscoelasticity was measured under the measurement conditions of a measurement interval temperature of 2.5°C, a frequency of 1 Hz, and a strain of 5°C. The minimum melt viscosity MV D (poise) was calculated.

[0316] (2) Measurement of minimum melt viscosity after 3 days A portion of the resin composition layer was peeled off from resin sheet A to obtain sample resin composition E. Sample resin composition E was left to stand for 3 days in an environment with a temperature of 21 to 25°C and a relative humidity of 40 to 60%RH. The melt viscosity of sample resin composition E that had been left to stand for 3 days was measured under the same conditions as in "(1) Measurement of minimum melt viscosity" above, and the minimum melt viscosity MV E (poise) was calculated.

[0317] (3) Evaluation of storage stability MV obtained from the above measurement D and MV E The storage stability was evaluated based on the values ​​of 1.0 and 2.0 according to the following criteria. ○:MV E / MV D ≦1.50. ×:MV E / MV D >1.50.

[0318] [Table 1]

[0319] [Table 2]

[0320] [Table 3]

[0321]

Table 4

Claims

1. A resin composition comprising: (A) a silane compound having a maleimide group; (B) a compound having a radical polymerizable group (excluding component (A)); and (C) an inorganic filler, A resin composition, wherein the component (A) has a structure represented by the following formula (A1): 【Chemical 1】 (In formula (A1), R １ represents a single bond, an optionally substituted divalent hydrocarbon group, or an optionally substituted divalent heteroatom-containing hydrocarbon group; L １ represents a single bond or a divalent linking group; R ２ represents a divalent hydrocarbon group which may have a substituent, or a divalent hydrocarbon group which may have a hetero atom; R ３ each independently represent an optionally substituted monovalent hydrocarbon group, an optionally substituted alkoxy group, an optionally substituted alkenyloxy group, an optionally substituted aryloxy group, or an optionally substituted aralkyloxy group; At least 1 R ３ is an alkoxy group which may have a substituent.

2. 2. The resin composition according to claim 1, wherein the average particle size of component (C) is 10 μm or less.

3. The resin composition according to claim 1, wherein the content of the component (A) is 0.10% by mass or more and 5.00% by mass or less, based on 100% by mass of the nonvolatile components of the resin composition.

4. The resin composition according to claim 1, wherein the content of the component (C) is 50% by mass or more relative to 100% by mass of the nonvolatile components of the resin composition.

5. 2. The resin composition according to claim 1, wherein the component (B) comprises one or more compounds selected from the group consisting of maleimide-based radical polymerizable compounds, (meth)acrylic-based radical polymerizable compounds, styrene-based radical polymerizable compounds, and allyl-based radical polymerizable compounds.

6. The resin composition according to claim 1, wherein the component (C) comprises (C-1) an inorganic filler that has been surface-treated with the component (A).

7. The resin composition according to claim 6, wherein the amount of the surface treatment of the component (C-1) with the component (A) is 0.1% by mass or more and 3.0% by mass or less.

8. In formula (A1), R １ The resin composition according to claim 1, wherein the group represented by the following formula (I) is a single bond, a divalent arylene group which may have a substituent, or a divalent alkylene group which may have a substituent.

9. In formula (A1), L １ is a single bond or -N(R ０ ) - (where R ０ is a hydrogen atom or an alkyl group having 1 to 3 carbon atoms.), -O-, -C(=O)-, or a divalent group consisting of a combination of two or more of these groups.

10. In formula (A1), L １ is a single bond, —N(R ０ )-C(=O)-, -C(=O)-N(R ０ )-, -O-, -C(=O)-O-, -OC(=O)-, -O-C(=O)-N(R ０ ) -, -N(R ０ )-C(=O)-O-, -OC(=O)-O-, or -N(R ０ )-C(=O)-N(R ０ 10. The resin composition according to claim 9, wherein

11. In formula (A1), R ２ The resin composition according to claim 1, wherein the group represented by the following formula (I) is an arylene group which may have a substituent, or an alkylene group which may have a substituent.

12. In formula (A1), two or more R ３ The resin composition according to claim 1 , wherein is an alkoxy group which may have a substituent.

13. In formula (A1), three R ３ The resin composition according to claim 12, wherein is an alkoxy group which may have a substituent.

14. In formula (A1), three R ３ The resin composition according to claim 1 , wherein all of are methoxy groups.

15. The resin composition according to claim 1, which is used to form an insulating layer of a circuit board.

16. A method for producing the resin composition according to claim 1, comprising: A method for producing a resin composition, comprising: mixing (A) a silane compound having a maleimide group, (B) a compound having a radical polymerizable group (excluding component (A)), and (C) an inorganic filler.

17. A method for producing the resin composition according to claim 6, comprising: (A) a silane compound having a maleimide group and (C') an inorganic filler before surface treatment are mixed to obtain (C-1) an inorganic filler surface-treated with the component (A); a step of mixing component (C-1) and a compound (B) having a radical polymerizable group (excluding component (A)); A method for producing a resin composition, comprising:

18. A cured product of the resin composition according to any one of claims 1 to 15.

19. A support and a resin composition layer formed on the support, A resin sheet, wherein the resin composition layer comprises the resin composition according to any one of claims 1 to 15.

20. A circuit board comprising a cured product of the resin composition according to any one of claims 1 to 15.

21. A semiconductor device comprising the circuit board according to claim 20.

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