Electronics tester with current amplification

Abstract

To provide a tester apparatus so that current conducts between an electrical tester and an integrated circuit to test the integrated circuit.SOLUTION: A tester apparatus comprises an electrical tester for connection through contacts to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having the terminals connected to the integrated circuit. The electric tester includes a power supply circuit connected to the contacts, so that power is provided through the power supply circuit connected to the contacts. There are n+1 power supply circuits connected to one another in parallel such that power is provided to the integrated circuit by the n+1 power supply circuits, and, even if one of the power supplies fails, power is still provided to the integrated circuit by the n circuits. The tester apparatus includes a current-sharing circuit that detects a reduction in power of one of the n+1 power supply circuits and switches off a connection from the one of the n+1 power supply circuits so that current is shared by the n power supply circuits.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to an apparatus used for full wafer testing and / or burn-in testing and / or burn-in self-testing.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS: This application claims priority to U.S. Provisional Patent Application No. 60 / 910,433, filed April 5, 2007, which is incorporated herein by reference in its entirety. [Background technology]

[0003] Microelectronic circuits are typically fabricated in and on semiconductor wafers. Such wafers are then "singulated" or "diced" into individual die. Such die are typically mounted to a support substrate for robustness and to facilitate electronic communication with the die's integrated circuit or microelectronic circuitry. Final packaging involves encapsulating the die so that the finished package can be shipped to the customer.

[0004] The die or package needs to be tested before it is shipped to the customer. Ideally, the die should be tested at an early stage to identify defects that occur during the early manufacturing stages. Summary of the Invention [Problem to be solved by the invention]

[0005] The earliest that dies can be tested is after wafer-level microelectronic circuit fabrication is complete and before the wafer is singulated. Full wafer testing presents numerous challenges. One challenge in full wafer testing is the large number of contacts on the wafer, and therefore the large number of power, ground, and signal connections that must be made. Another challenge is that burn-in testing requires a thermal management system that can keep the wafer stable at relatively high temperatures, while providing a system that is simple to operate and relatively inexpensive. [Means for solving the problem]

[0006] A portable pack is provided that includes a portable support structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; and a first interface on the portable support structure connected to the contact portions, the first interface being adapted to connect to a second interface on the fixed structure when the portable support structure is removably held by the fixed structure.

[0007] The portable support structure includes first and second components for holding the substrate therebetween, the contact portions are disposed on the second component, and the components are movable relative to one another to ensure proper contact between the contact portions and the terminals.

[0008] The second component includes a signal distribution board and a contactor, and a CTE ratio between a CTE of the signal distribution board and a CTE of the contactor is not 1. The contactor heats from a first contactor temperature to a second contactor temperature during testing of the microelectronic circuit, and the signal distribution board heats from the first signal distribution board temperature to a second signal distribution board temperature, and a temperature change ratio between a difference between the second signal distribution board temperature and the first signal distribution board temperature and a difference between the second contactor temperature and the first contactor temperature multiplied by the CTE ratio is closer to 1 than the CTE ratio.

[0009] The ratio of the thermal expansion coefficients multiplied by the temperature change ratio is 0.8 to 1.2.

[0010] The first component is a substrate chuck having a surface that supports the substrate.

[0011] The portable pack further includes a pressure differential cavity seal between the first and second components, the pressure differential cavity seal forming an enclosed pressure differential cavity with surfaces of the first and second components, and a vacuum passage within the pressure differential cavity through which air can be removed from the pressure differential cavity to cause relative movement of the first and second components toward each other.

[0012] A pressure differential cavity seal surrounds the contact portion and the terminal.

[0013] The pressure differential cavity seal is secured to the first component when the first and second components are separated.

[0014] The pressure differential cavity seal is a lip seal.

[0015] A pressure reduction passage is formed through one of the components, the pressure reduction passage having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity, and the component having the pressure reduction passage has a first valve that, when opened, allows air to leave the pressure differential cavity and, when closed, prevents air from entering the pressure differential cavity.

[0016] The first valve is a check valve, and a vacuum release passage is formed through the component having the check valve, and the vacuum release passage has an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity, and the component having the vacuum release passage is provided with a second vacuum release valve, which, when opened, allows air to enter the pressure differential cavity and, when closed, prevents air from escaping from the pressure differential cavity.

[0017] The portable pack further includes a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

[0018] The contact portion can be resiliently pressed by the terminal, and the portable pack further comprises a standoff on the second component, the standoff having a surface for limiting the pressing of the at least one contact portion.

[0019] A plurality of separated standoffs are disposed between the contact portions.

[0020] The portable pack further includes a layer having a first surface that is adhesive and that is attached to the second component, and a second opposing surface that is adhesive, with the standoff attached to the second surface.

[0021] The first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed against the lands, and is movable relative to the fixed structure.

[0022] The lands and terminals lie in parallel planes.

[0023] The substrate is a wafer containing a plurality of microelectronic circuits.

[0024] The contact portions are pins, each having a spring against which the spring force is pressed when the contact portion is pressed by a respective terminal.

[0025] The present invention also relates to a tester apparatus of this type, comprising: a portable support structure for holding a substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; a first interface on the portable support structure connected to the contact portions; a stationary structure capable of receiving the portable support structure to be held by the stationary structure and capable of being removed from the stationary structure; a second interface on the stationary structure that connects to the first interface when the portable support structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and an electrical tester connected to the terminals through the second interface, the first interface, and the contact portions, for transmitting signals between the electrical tester and the microelectronic circuit to test the microelectronic circuit.

[0026] The portable support structure includes first and second components for holding the substrate therebetween, the contact portions are disposed on the second component, and the components are movable relative to one another to ensure proper contact between the contact portions and the terminals.

[0027] The second component includes a signal distribution board and a contactor, and a CTE ratio between a CTE of the signal distribution board and a CTE of the contactor is not 1. The contactor heats from a first contactor temperature to a second contactor temperature during testing of the microelectronic circuit, and the signal distribution board heats from the first signal distribution board temperature to a second signal distribution board temperature, and a temperature change ratio between a difference between the second signal distribution board temperature and the first signal distribution board temperature and a difference between the second contactor temperature and the first contactor temperature multiplied by the CTE ratio is closer to 1 than the CTE ratio.

[0028] The ratio of the thermal expansion coefficients multiplied by the temperature change ratio is 0.8 to 1.2.

[0029] The first component is a substrate chuck having a surface that supports the substrate.

[0030] The tester device further includes a pressure differential cavity seal between the first component and the second component, the pressure differential cavity seal defining an enclosed pressure differential cavity with surfaces of the first and second components, and a vacuum passage within the pressure differential cavity through which air can be removed from the pressure differential cavity to move the first and second components relative to one another.

[0031] A pressure differential cavity seal surrounds the contact portion and the terminal.

[0032] The pressure differential cavity seal is secured to the first component when the first and second components are separated.

[0033] The pressure differential cavity seal is a lip seal.

[0034] A pressure reduction passage is formed through one of the components, and the pressure reduction passage has an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity. The component having the pressure reduction passage has a first valve, which, when opened, allows air to leave the pressure differential cavity and, when closed, prevents air from entering the pressure differential cavity.

[0035] The first valve is a check valve, and a vacuum release passage is formed through the component having the check valve, and the vacuum release passage has an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity, and the component having the vacuum release passage is provided with a second vacuum release valve, which, when opened, allows air to enter the pressure differential cavity and, when closed, prevents air from escaping from the pressure differential cavity.

[0036] The tester apparatus may further include a substrate suction passage in the first component through which air may be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

[0037] The contact portion can be resiliently pressed by the terminal and further comprises a standoff on the second component, the standoff having a surface for limiting the pressing of the at least one contact portion.

[0038] A plurality of separated standoffs are disposed between the contact portions.

[0039] The tester device further includes a layer having a first surface that is adhesive and that is attached to the second component, and a second opposing surface that is adhesive, with the standoff attached to the second surface.

[0040] The first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed by the lands, and is movable relative to the fixed structure.

[0041] The lands and terminals lie in parallel planes.

[0042] The stationary structure includes a thermal chuck, and the portable support structure contacts the thermal chuck to allow heat transfer between the portable support structure and the thermal chuck.

[0043] A thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

[0044] The tester apparatus further includes a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

[0045] The tester apparatus further includes a thermal chuck on the stationary structure, the thermal chuck having a thermal control passageway with an inlet and an outlet, with at least one section between the inlet and outlet for allowing fluid to flow from the inlet to the outlet, and heat is transferred through the thermal chuck between the substrate and the fluid in the thermal control passageway.

[0046] The thermal control passage has first, second and third sections in series behind one another along the fluid path, with the third section positioned between the first and second sections in cross-sectional plan view.

[0047] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the second and third sections.

[0048] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the first and second sections.

[0049] The first, second and third segments are segments of the first spiral.

[0050] The first and second segments are segments of a first spiral, and the third segment is a segment of a second spiral positioned on the first spiral.

[0051] The tester device further includes a heater for transferring heat to the fluid when the fluid is outside the thermal control passage.

[0052] The heater is an electric heater.

[0053] Heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

[0054] Heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

[0055] The temperature of the fluid is greater than 100°C when it enters the fluid inlet.

[0056] The fluid is recirculated.

[0057] The tester device further includes at least one interface actuator having first and second actuator segments actuable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

[0058] The first and second pieces are a cylinder and a piston, respectively, with the piston sliding along the inner surface of the cylinder.

[0059] The test performed on the microelectronic circuit by the tester is a burn-in test.

[0060] The substrate is a wafer containing a plurality of microelectronic circuits.

[0061] The contact portions are pins, each having a spring against which the spring force is pressed when the contact portion is pressed by a respective terminal.

[0062] The present invention also relates to a method of testing a microelectronic circuit carried by a substrate, comprising the steps of: holding the substrate on a portable support structure having contact portions for terminals of the substrate connected to the microelectronic circuit; receiving the portable support structure by the fixed structure such that a first interface of the portable support structure connects to a second interface of the fixed structure; and transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contact portions, and first and second interfaces to test the microelectronic circuit.

[0063] The substrate is held between a first component and a second component of a portable support structure, the contact portion is on the second component, and the method further includes moving the first and second components relatively toward each other to ensure proper contact between the contact portion and the terminal.

[0064] The portable support structure includes a substrate as well as first and second elements, wherein a CTE ratio between the CTE of the first element and the CTE of the second element is not equal to one.

[0065] The CTE ratio multiplied by the temperature change ratio is preferably between 0.8 and 1.2.

[0066] The first and second elements are a signal distribution board and a contactor on the same side of the substrate.

[0067] One of the elements is the substrate.

[0068] The first component is a substrate chuck having a surface for supporting a substrate.

[0069] The method further includes disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by the surfaces of the first and second components and the pressure differential cavity seal, and reducing the pressure within the cavity of the pressure differential cavity seal to move the first and second components relative to one another.

[0070] A pressure differential cavity seal surrounds the contact portion and the terminal.

[0071] The pressure differential cavity seal is secured to the first component when the first and second components are separated.

[0072] The substrate cavity seal is formed by a lip seal.

[0073] A pressure reduction passage is formed through one of the components, the pressure reduction passage having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity, a first valve in the component having the pressure reduction passage, the first valve being capable of being opened to allow air to leave the pressure differential cavity and being closed to prevent air from entering the pressure differential cavity.

[0074] The first valve is a check valve, and a vacuum release passage is formed through the component having the check valve, and the vacuum release passage has an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity, and the component having the vacuum release passage is provided with a second vacuum release valve, which can be opened to allow air to enter the pressure differential cavity and closed to prevent air from escaping from the pressure differential cavity.

[0075] Pressure within the pressure differential cavity is created before the portable support structure is received by the fixed structure.

[0076] The method further includes pumping air through a substrate suction passage in the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

[0077] The contact portions can be resiliently pressed by the terminal, and further includes limiting the pressing of the at least one contact portion with a surface of a standoff of the second component.

[0078] A plurality of separated standoffs are disposed between the contact portions.

[0079] The method further includes a layer having a first surface that is adhesive and attached to the second component and a second opposing surface that is adhesive, with the standoff attached to the second surface.

[0080] The method further includes positioning lands of a first interface of the portable support structure against a plurality of matching members of a second interface of the stationary structure and resiliently pressing the members against the lands.

[0081] The method further includes positioning a surface of the portable support structure against a surface of the thermal chuck of the stationary structure to transfer heat through the surfaces.

[0082] The method further includes reducing the air pressure in a thermal interface cavity defined between the surface of the portable support structure and the thermal chuck.

[0083] A thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

[0084] The method further includes disposing a thermal interface cavity seal between the portable support structure and the thermal chuck, the thermal interface cavity seal, the portable support structure, and the thermal chuck defining a thermal interface cavity.

[0085] The method further includes passing a fluid through at least one segment of a thermal control passage in a thermal chuck on a stationary structure from a fluid inlet to a fluid outlet, and transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate.

[0086] The thermal control passage has first, second and third sections in series behind one another along the fluid path, with the third section positioned between the first and second sections in cross-sectional plan view.

[0087] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the second and third sections.

[0088] The temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

[0089] The temperature difference between the first and fourth sections of fluid is greater than the temperature difference between the second and third sections of fluid.

[0090] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the first and second sections.

[0091] The first, second and third segments are segments of the first spiral.

[0092] The first and second segments are segments of a first spiral, and the third segment is a segment of a second spiral that is not located on the first spiral.

[0093] The temperature of the fluid is greater than 100°C when it enters the fluid inlet.

[0094] Heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

[0095] After the fluid enters the fluid inlet above 100° C., heat is first transferred from the fluid to the substrate.

[0096] The fluid is recirculated.

[0097] A test performed on microelectronic circuits is a burn-in test.

[0098] The substrate is a wafer containing a plurality of microelectronic circuits.

[0099] The contact portions are pins, each having a spring against which the spring force is pressed when the contact portion is pressed by a respective terminal.

[0100] The present invention further provides a thermal control device comprising a thermal chuck having a thermal control passageway with an inlet, an outlet, and at least first, second, and third sections serially arranged one behind the other along a fluid path from the fluid inlet to the fluid outlet, with the third section disposed between the first and second sections in a cross-sectional plan view.

[0101] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the second and third sections.

[0102] The thermal control passage has a fourth section in series following the third section along the fluid path, the fourth section being located between the first and second sections.

[0103] The first, second and third segments are segments of the first spiral.

[0104] The first and second segments are segments of a first spiral, and the third segment is a segment of a second spiral that is not located on the first spiral.

[0105] The present invention further relates to an electrical aspect of a tester apparatus that includes an electrical tester connected through contact portions to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having terminals connected to the integrated circuit, and that tests the integrated circuit by conducting current between the electrical tester and the integrated circuit.

[0106] The tester device further includes a power supply circuit connected to the contact portion, and power is supplied through this power supply circuit connected to the contact portion.

[0107] A number of n+1 power supply circuits are connected in parallel to each other, and power is supplied to the integrated circuit by these n+1 power supply circuits, so that even if one of the power supplies fails, power is still supplied to the integrated circuit by the n circuits.

[0108] The tester device further includes a current sharing circuit that (i) detects a drop in power of at least one of the n+1 power supply circuits, and (ii) switches off a connection from one of the n+1 power supply circuits to remove current from one of the n+1 power supply circuits and allow the current to be shared by the n power supply circuits.

[0109] The current sharing circuit includes a plurality of fault detection circuits, each of which detects power loss from each of the power supply circuits.

[0110] The tester device further includes a power supply control circuit energized by at least one of the plurality of power supply circuits, which switches the power supply circuit between a test mode in which power is supplied by a first number of the plurality of power supply circuits and a power saving mode in which power is supplied by a second number of power supply circuits that is smaller than the first number.

[0111] The tester device further includes a current configuration circuit that can be configured to switch the current between a first configuration in which individual currents of different magnitudes are supplied to the individual channels and a second configuration in which the currents to the individual channels follow a common reference.

[0112] The current configuration circuit includes a plurality of current amplifiers, each having an output current according to a respective standard when the current configuration circuit is in a first configuration.

[0113] The tester device further includes current amplifiers that amplify the current to the individual channels.

[0114] The tester device further includes a signal electronic device for providing signals to the integrated circuit.

[0115] The tester device further includes a support structure for holding at least one substrate and a plurality of contact portions that mate with the terminals for contacting the terminals, and the electrical tester is connected to the terminals through the contact portions, and current is conducted between the electrical tester and the integrated circuit to test the integrated circuit.

[0116] The present invention also relates to an electrical aspect of a method for testing at least one circuit carried by at least one substrate, the method comprising placing contact portions against terminals of the substrate connected to an integrated circuit and conducting current between an electrical tester and the integrated circuit through the terminals and contact portions to test the integrated circuit.

[0117] Power is supplied through a power supply circuit connected to the contact portion.

[0118] A plurality of n+1 power supply circuits are connected in parallel with each other, and power is supplied to an integrated circuit on at least one board by these n+1 power supply circuits, so that even if one of the power supply circuits fails, power is still supplied to the integrated circuit by the n circuits.

[0119] The method further includes detecting a drop in power of at least one of the n+1 power supply circuits, and switching off a connection from one of the n+1 power supply circuits to remove current from one of the n+1 power supply circuits and share the current by the n power supply circuits.

[0120] The method further includes detecting the loss of power from each of the power supply circuits with a respective fault detection circuit.

[0121] The method further includes supplying power from at least one of the plurality of power supply circuits to a power supply control circuit and using the power supply control circuit to switch between a test mode in which power is supplied by a first number of the plurality of power supply circuits and a power save mode in which power is supplied by a second number of power supply circuits that is less than the first number.

[0122] The method further includes switching between a first configuration in which individual currents of different magnitudes are supplied to the individual channels and a second configuration in which the currents to the individual channels follow a common reference.

[0123] The current configuration circuit includes a plurality of current amplifiers, each having an output current according to a respective standard when the current configuration circuit is in a first configuration.

[0124] The method further includes amplifying the current to the individual channels.

[0125] The method further includes providing a signal to the integrated circuit.

[0126] The invention will now be described in detail, by way of example, with reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0127] [Figure 1] FIG. 2 is a perspective view of a wafer chuck assembly. [Figure 2] 2 is a cross-sectional side view taken along line 2-2 of FIG. 1 showing a portion of a wafer chuck assembly and a portion of a wafer substrate, the vertical dimension of the wafer substrate being exaggerated for illustrative purposes. [Figure 3] FIG. 1 is a perspective view of a portable pack according to an embodiment of the present invention including a wafer chuck assembly and a distribution board assembly. [Figure 4] FIG. 1 is a perspective view of the portable pack as seen from below. [Figure 5] FIG. 5 is similar to FIG. 4, but shows the portable pack after it has been assembled. [Figure 6] 6 is a cross-sectional side view of the portable pack taken along line 6-6 of FIG. 5. [Figure 7] FIG. 1 is a cross-sectional side view of the portable pack and components of the fixed structure including the signal distribution board, contactors and thermal chuck, showing the main electrical details. [Figure 8]FIG. 1 is a cross-sectional side view of the components of the fixed structure and the portable pack, showing the main structural details. [Figure 9] FIG. 1 is a perspective view of a thermal chuck and a component attached to the thermal chuck. [Figure 10] FIG. 2 illustrates components of a tester device according to one embodiment of the present invention. [Figure 11] FIG. 11 is a plan view of one electrical tester shown in FIG. 10. [Figure 12] FIG. 12 is a block diagram of a configurable power supply board of the electrical tester of FIG. 11. [Figure 13A] FIG. 13 is a circuit diagram of the power supply circuitry and power sharing circuitry of the configurable power supply board of FIG. [Figure 13B] FIG. 13 is a circuit diagram of the voltage master DACS and MUXES circuitry of the configurable power supply board of FIG. 12. [Figure 13C] FIG. 13 is a circuit diagram of the "primary" group of high current slaves of the configurable power board of FIG. 12. [Figure 14] FIG. 13D is a circuit diagram illustrating one of the six current amplifiers of the primary group of FIG. 13C. [Figure 15] FIG. 13 is a circuit diagram of the voltage and current amplifiers of one high voltage slave of the configurable power supply board of FIG. 12. DETAILED DESCRIPTION OF THE INVENTION

[0128] 1 of the accompanying drawings is a perspective view of wafer chuck assembly 10, and FIG. 2 is a cross-sectional side view of a portion of wafer chuck assembly 10. Wafer chuck assembly 10 includes a wafer chuck component 12, a pressure differential substrate cavity seal 14, an offset ring 16, and a substrate suction passage valve 18.

[0129] The wafer chuck component 12 is made of aluminum or another metal having a relatively high thermal conductivity and a predetermined, relatively low coefficient of thermal expansion. The wafer chuck component 12 has a circular outer surface 20 and upper and lower surfaces 22, 24. The diameter of the outer surface 20 is typically 350 to 450 mm, and more typically about 400 mm. The upper surface 22 has a number of grooves formed therein that extend to the outer surface 20. The lower surface 24 is also formed as a single plane that extends to the outer surface 20. The planes of the upper surface 22 and the lower surface 24 are parallel to each other. The lower surface 24 has the same surface area as the upper surface 22.

[0130] The offset ring 16 has an upper surface 26 and a lower surface 28. The lower surface 28 of the offset ring 16 is positioned above the upper surface 22 of the wafer chuck component 12, and the offset ring 16 is secured to the wafer chuck component 12 with a fastener 30. Thus, the upper surface 26 of the offset ring 16 lies in a plane that is vertically spaced from the plane of the upper surface 22 of the wafer chuck component 12.

[0131] The offset ring 16 also has an inner surface 32 and an outer surface 34. The inner surface 32, together with a central portion of the top surface 22 of the wafer chuck component 12, defines a circular recess 36 for receiving a wafer having a circular outer edge. In the example shown, the wafer is approximately 200 mm in diameter. Larger wafers can be accommodated by removing the offset ring 16.

[0132] The substrate cavity seal 14 is formed into a closed circular loop that completely surrounds the offset ring 16 and the recess 36 for the wafer. The substrate cavity seal 14 is a lip seal having a lower anchor portion 40 and an upper lip 42. The lower anchor portion 40 is fixed in a groove formed in an outer region of the top surface 22 of the wafer chuck component 12. The lower anchor portion 40 is secured in the groove by the thermoelastic properties of the substrate cavity seal 14. The lip 42 has an upper surface 46 in a plane that is vertically spaced from the plane of the top surface 26 of the offset ring 16. The upper surface 46 of the lip 42 is resiliently compressible in a direction toward the wafer chuck component 12. Pressure applied to the upper surface 46 bends the lip 42 so that the upper surface 46 moves downward, and when the pressure is removed, the resiliency of the lip 42 causes the upper surface 46 to move upward.

[0133] A substrate suction passage 50 is formed within the wafer chuck component 12. The substrate suction passage 50 includes first, second, and third portions 52, 54, and 56. The first portion 52 is drilled from the outer surface toward the center of the wafer chuck component 12. The second portion 54 has a length that is approximately 1 / 3 the diameter of the outer surface 20 of the wafer chuck component 12. The first portion 52 is drilled from the top surface 22 of the wafer chuck component 12, and the first portion 52 forms an air inlet opening 60 in the top surface 22 of the wafer chuck component 12. The third portion 56 is drilled from the bottom surface 24 of the wafer chuck component 12 around the periphery of the bottom surface 24 to the second portion 54. The third portion 56 forms an air outlet opening 62 in the bottom surface 24.

[0134] Three circular grooves 64, 66, and 68 and a slot 70 are formed in the top surface 22 of the wafer chuck component 12. The circular grooves 64, 66, and 68 are concentric with a center point that coincides with the center point of the outer surface 20 of the wafer chuck component 12. The slot 70 is formed to the same depth as the circular grooves 64, 66, and 68 and connects the circular grooves 64, 66, and 68 to one another. Air inlet opening 60 is located within slot 70 between circular grooves 66 and 68 .

[0135] The substrate suction passage valve 18 is a shuttle valve that is inserted from the outer surface 20 of the wafer chuck component 12 into the second portion 54 of the substrate suction passage 50, which is then closed with a plug 72. The substrate suction passage valve 18 has a seat 74 and a ball valve component 76. When the pressure at the air outlet opening 62 is lower than the pressure at the air inlet opening 60, the ball valve component 76 lifts off the seat 74, allowing air to flow from the air inlet opening 60 to the air outlet opening 62. When the pressure at the air inlet opening 60 is lower than the air outlet opening 62, the ball valve component 76 rests on the seat 74, thereby preventing air from flowing from the air outlet opening 62 to the air inlet opening 60.

[0136] A pressure relief opening 80 is formed in the underside 24 of the wafer chuck component 12 and is connected to the second portion 54 of the substrate suction passage 50 on the side of the substrate suction passage valve 18 opposite the air inlet opening 60. In a situation where the pressure at the air inlet opening 60 is lower than the air outlet opening 62 and the ball valve component 76 is resting on the seat 74, the pressure at the relief opening 80 can be reduced below the pressure at the tip of the air inlet opening 60, causing the ball valve component 76 to lift off the seat 74. When the ball valve component 76 lifts off the seat 74, air flows from the air inlet opening 60, through the ball valve component 76, to the air outlet opening 62.

[0137] FIG. 2 also shows the wafer substrate 82 before it is inserted into the wafer chuck assembly 10. The vertical dimension of the wafer substrate 82 has been exaggerated for illustrative purposes. The wafer substrate 82 has an upper surface 84, a parallel lower surface 86, and a circular edge 88. The wafer substrate 82 also has a plurality of integrated microelectronic circuits 90 formed below the upper surface 84 and spaced apart from the lower surface 86. Each integrated microelectronic circuit 90 includes a plurality of electronic components, such as capacitors, diodes, and / or transistors, which are interconnected with each other using metal lines, plugs, and vias. The wafer substrate 82 also has a plurality of metal terminals 92 on the upper surface 84. In the illustrated embodiment, the terminals 92 have their upper surfaces forming a plane slightly above the upper surface 84. Therefore, in the illustrated embodiment, the total thickness of the wafer substrate 82 is measured from the lower surface 86 to the upper surface of one of the terminals 92. Each of the integrated microelectronic circuits 90 is connected to a plurality of terminals 92.

[0138] In use, the air inlet opening 60 and the relief opening 80 are held at ambient pressure. A wafer substrate 82 is then placed within the recess 36. The lower surface 86 of the wafer substrate 82 is positioned above the upper surface 22 of the wafer chuck component 12. The edge 88 of the wafer substrate 82 fits within the inner surface 32 of the offset ring 16.

[0139] A small enclosed space is defined between the slot 70 and the lower surface 86. Referring to Figures 1 and 2, the enclosed space extends to the circular grooves 64, 66, and 68, which are closed from above by the lower surface 86 of the wafer substrate 82. A pump is connected to the air outlet opening 62 and is used to reduce the pressure at the air outlet opening 62 below ambient pressure. Therefore, the pressure at the air outlet opening 62 is lower than the pressure at the air inlet opening 60, and therefore the ball valve component 76 lifts off the seat 74. A small amount of air is pumped from the enclosed cavity defined by the circular grooves 64, 66, and 68 and the slot 70 through the substrate suction passage 50, through the substrate suction passage valve 18, and out of the air outlet opening 62. Therefore, the enclosed opening defined by the circular grooves 64, 66, 68 and the slot 70 is at a pressure lower than ambient pressure. The upper surface 84 of the wafer substrate 82 is at ambient pressure. The pressure on the lower surface 86 of the wafer substrate 82, which is lower than the upper surface 84, holds the lower surface 86 of the wafer substrate 82 against the upper surface 22 of the wafer chuck component 12. The alignment of the wafer substrate 82, and in particular the terminals 92, with respect to the wafer chuck assembly 10 is maintained by holding the wafer substrate 82 against the upper surface 22 of the wafer chuck component 12.

[0140] The air outlet opening 62 can then be brought back to ambient pressure. Because the air inlet opening 60 is still below ambient pressure, the ball valve component 76 remains in the seat 74 even after the air outlet opening 62 returns to ambient pressure. If at any time it becomes necessary to remove the wafer substrate 82 from the wafer chuck assembly 10, the release opening 80 can be brought to a pressure lower than that of the air inlet opening 60. Thus, the air inlet opening 60 will be at a higher pressure than the release opening 80, causing the ball valve component 76 to lift off the seat 74. The air inlet opening 60 is then connected to the air outlet opening, and a small amount of air flows from the air outlet opening into the air inlet opening 60 and into the circular grooves 64, 66, 68 and slot 70. This brings the lower surface 86 of the wafer substrate 82 to ambient pressure, and therefore to the same pressure as the upper surface 84 of the wafer substrate 82. The wafer substrate 82 can now be removed from the wafer chuck assembly 10.

[0141] 3 and 4 show a portable puck 108 for holding a wafer substrate 82, the portable puck 108 including a wafer chuck assembly 100 and a distribution board assembly 110. Figures 3 and 4 do not show in detail the electrical paths, including the contacts, interfaces, and vias, of the distribution board assembly 110. Therefore, only the structural components of the distribution board assembly 110 are shown. The structural components include a metal backing plate 114, a signal distribution board 116, and a contactor backing member 118.

[0142] The metal backing plate 114 is substantially rectangular. A circular opening 120 is formed in the metal backing plate 114. Two opposite edges 122 of the metal backing plate 114 are machined so that the remainder of the metal backing plate 114 is slightly thicker than the opposite edges 122, each edge defining a respective flange.

[0143] The signal distribution board 116 includes a substantially rectangular substrate 124 that is slightly smaller than the metal backing plate 114. The signal distribution board 116 is positioned between flanges defined by opposing edges 122, and fasteners 126 are used to secure the substrate 124 to the metal backing plate 114.

[0144] The contactor backing member 118 is circular and is positioned in the center of the substrate 124 facing the signal distribution board 116. A clamp ring 128 is positioned over the edge of the backing member 118. Fasteners 130 are used to secure the clamp ring to the substrate 124 of the signal distribution board 116. The clamp ring 128 has an outer edge that is larger than the contactor backing member 118 and an inner edge that is slightly smaller than the contactor backing member 118. Due to the dimensions of the clamp ring 128, the clamp ring 128 secures the contactor backing member 118 to the substrate 124 of the signal distribution board 116. The clamp ring 128 has an outer diameter that is slightly smaller than the diameter of the inner surface 32 of the offset ring 16 of the wafer chuck assembly 10.

[0145] The signal distribution board 116 further includes a gold metal seat 134 on the substrate 124. The gold metal seat 134 is in the form of a ring whose inner and outer diameters are slightly smaller and slightly larger, respectively, than the diameter of the top surface 46 of the substrate cavity seal 14.

[0146] The components of the distribution board assembly 110 all have similar, relatively high coefficients of thermal expansion.

[0147] 5 shows the portable puck 108 after the distribution board assembly 110 has been placed on top of the wafer chuck assembly 10. A gold metal seat 134 is located on the bottom of the distribution board assembly 110 and rests on top of the substrate cavity seal 14 on top of the wafer chuck assembly 10.

[0148] 6 , the substrate cavity seal 14 is disposed between the wafer chuck component 12 at the bottom and the substrate 124 of the signal distribution board 116 at the top. The wafer chuck component 12, substrate cavity seal 14, and substrate 124 of the signal distribution board 116 together define an enclosed pressure differential cavity 140. This pressure differential cavity 140 extends into the space between the wafer substrate 82 and the contactor backing member 118. Before the lip 42 of the substrate cavity seal 14 is deflected, the pressure differential cavity 140 extends into the space between the offset ring 16 of the wafer chuck assembly 10 and the substrate 124 of the signal distribution board 116. The pressure differential cavity 140 also extends into a circular groove 142 formed in the top surface 22 of the wafer chuck component 12, and a raised portion of the clamp ring 128 is positioned within the groove 142. A small space is provided between the lower surface of the clamp ring 128 and the upper surface of the groove 142 to allow communication between the inner and outer volumes of the pressure differential cavity 140 inside and outside the clamp ring 128.

[0149] A vacuum passage 144 is formed in the wafer chuck component 12, and a vacuum passage check valve 146 is disposed in the vacuum passage 144. The vacuum passage 144 includes first, second, and third portions 148, 150, and 152. The first portion 148 is drilled from the top surface 22 of the wafer chuck component 12 and defines an inlet opening 154 therein. The third portion 152 is drilled from the bottom surface 24 of the wafer chuck component 12 and defines an outlet opening 156 therein. The second portion 150 is drilled from the outer surface 20 of the wafer chuck component 12 and connects the first and second portions 148 and 150 to each other. The vacuum passage check valve 146 is inserted from the outer surface 20 of the wafer chuck component 12 into the second portion 150, and a plug 158 is used to close the inlet of the second portion 150 at the outer surface 20.

[0150] The pressure reducing passage check valve includes a valve component 162 and a seat 164. The valve component 162 lifts off the seat 164 when air flows from the inlet opening 154 to the outlet opening 156. The valve component 162 rests against the seat 164, preventing air from flowing from the outlet opening 156 to the inlet opening 154.

[0151] The offset ring 16 has a plurality of slots 168 formed in its underside. One of the slots 168 is shown in cross section in Figure 6 and connects the inlet opening 154 of the pressure reduction passage 144 to the pressure differential cavity 140. Another slot 168 extends radially toward the center of the offset ring 16 and is connected to the inlet opening 154 of the pressure reduction passage 144 with the circular groove 142 in the underside of the offset ring 16.

[0152] In use, the pressure differential cavity 140 is initially at ambient pressure, and the outlet opening 156 is connected to a pump so that it is below ambient pressure. A pressure differential is therefore created between the air inlet opening 154 and the outlet opening 156, forcing air from the pressure differential cavity 140 through the vacuum passage check valve 146 in the vacuum passage 144. The pressure within the pressure differential cavity 140 drops below ambient pressure. The pressure outside the portable pack 108 is maintained at ambient pressure, thus creating a pressure differential within the pressure differential cavity 140 that is lower than the pressure above the substrate 124 of the signal distribution board 116 and the pressure below the underside 24 of the wafer chuck component 12. This pressure differential causes the lip 42 of the substrate cavity seal 14 to deflect, reducing the vertical height of the pressure differential cavity 140.

[0153] The vertical height of the pressure differential cavity 140 continues to decrease until the lower surface of the substrate 124 of the signal distribution board 116 comes into contact with the upper surface of the offset ring 16. Thus, the offset ring 16 limits the relative movement of the substrate 124 of the signal distribution board 116 and the wafer chuck component 12 toward each other.

[0154] The outlet opening 156 can then be brought back to ambient pressure and disconnected from the pump. The valve component 162 rests on the seat 164, preventing air from entering the pressure differential cavity 140 through the reduced pressure passage 144. This causes the pressure differential cavity 140 to maintain its reduced size, with the substrate 124 of the signal distribution board 116 contacting the offset ring. The portable puck 108 can then be removed from the device used to connect the pump to the outlet opening 156 and reduce the pressure in the pressure differential cavity 140, and transported to a subsystem tester.

[0155] As shown in FIG. 7, the backing member 118 forms a portion of a contactor 170 , which further includes a plurality of pins 172 , standoffs 174 , and an adhesive 176 .

[0156] Each pin 172 has first and second components 178 and 179 and a respective spring 182. The first component 178 has a cavity within which the spring 182 is disposed. A portion of the second component 179 is also disposed within the cavity, which retains the spring 182. The first and second components 178 and 179 are attached to one another and can move relative to one another. Relative movement of the terminal of the second component 179 toward the terminal of the first component 178 compresses the spring 182. Therefore, a force is required to overcome the spring force of the spring 182 for the terminals of the first and second components 178 and 179 to move toward one another. This force ensures proper contact between the pin 172 and the terminal 92 of the wafer substrate 82. When this force is removed, the terminals of the first and second components 178 and 179 move away from one another due to the spring force of the spring 182. In other embodiments, the spring force can be generated by a component other than a coil spring, such as a separate spring or membrane.

[0157] The backing member 118 is formed in two halves, each half having a respective set of apertures formed therein. One terminal of one pin 172 is inserted through one aperture in one half of the backing member 118, and the other terminal of the pin 172 is inserted through one aperture in the other half of the backing member 118. The terminals of each pin 172 are inserted through a respective pair of apertures in the two halves of the backing member 118. The pins 172 are retained within the backing member 118 when the halves of the backing member 118 are secured together. The terminals of the pins 172 form a respective array of contact portions 184 on the bottom of the contactor 170 and a corresponding array of contact portions 186 on the top of the contactor 170.

[0158] In addition to the substrate 124, the signal distribution board 116 includes a plurality of contact portions 188, a plurality of lands 193, and a plurality of metal wires 191. The contact portions 188 and the lands 193 are disposed on the same side of the substrate 124. The contact portions 188 are within the substrate cavity seal 14 shown in FIG. 4, and the lands 193 are outside the substrate cavity seal 14. Each of the metal wires 191 connects each of the contact portions 188 to each of the lands 193. Thus, each of the contact portions 188, each of the metal wires 191, and each of the lands 193 of the signal distribution board 116 forms a respective conductor. When the backing member 118 of the contactor 170 is secured to the substrate 124 of the signal distribution board 116, each of the contact portions 186 of the contactor 170 contacts each of the contact portions 188 of the signal distribution board 116.

[0159] The standoffs 174 are thin layers of material attached to the underside of the backing member 118 of the contactor 170. The adhesive 176 is a layer having upper and lower adhesive surfaces. The lower adhesive surface of the adhesive 176 is attached to the upper surface of one standoff 174. The upper adhesive surface of the adhesive 176 is attached to the underside of the backing member 118 of the contactor 170, thereby attaching the standoffs 174 to the backing member 118 of the contactor 170.

[0160] 6 is reduced, the standoffs 174 move closer to the wafer substrate 82. This movement of the standoffs 174 toward the wafer substrate 82 causes the terminals 92 of the wafer substrate 82 to resiliently press against the contact portions 184 of the contactor 170. The lower surfaces of the standoffs 174 then come into contact with the upper surface 84 of the wafer substrate 82. The lower surfaces of the standoffs 174 thereby limit the pressing of the contact portions 184 against the backing member 118 of the contactor 170. A plurality of separated standoffs 174 are disposed between the contact portions 184.

[0161] A plurality of conductive paths are formed, each including a respective one of the terminals 92 of the wafer substrate 82, a respective pin 172 of the contactor 170, and a respective contact portion 188, metal wire 191, and land 193 of the signal distribution board 116. The lands 193 and contact portions 188 of the signal distribution board 116 lie in a plane parallel to the plane of the terminals 92 of the wafer substrate 82. Referring again to FIG. 1 , the wafer chuck component 12 at the bottom and the structural components of the distribution board assembly 110 at the top cooperate to provide a portable support structure, with the wafer substrate 82 positioned between the wafer chuck component 12 and the structural components of the distribution board assembly 110. Referring again to FIG. 7 , electrical contact to the terminals 92 of the wafer substrate 82 is provided by the contact portions 184 of the contactor 170, and the distribution board assembly 110 has an interface formed by the lands 193 for connection to another device. 4-7 is now transported to a test system which makes contact to the interface formed by lands 193 and applies test signals, power, and ground to the wafer substrate 82. The contact portions 184 of the contactor 170 and the terminals 92 of the wafer substrate 82 are completely enclosed by the substrate cavity seal 14 and are therefore kept free of contaminants and moisture.

[0162] As shown in FIG. 8 , the portable puck 108 is received by a fixed structure 180. The fixed structure 180 has a frame 181 positioned at a fixed location (not shown) in the system. The components of the fixed structure 180 can move relative to one another. In addition to the frame 181, the fixed structure 180 includes a holding structure 185 for receiving the portable puck 108, four actuators 187 (only one is shown), an interface assembly 189, a thermal chuck 190, and a mounting arrangement 192 for the thermal chuck 190. The actuator 187 includes a cylinder 194, a piston 196 within the cylinder 194, and a connecting piece 198 connected to the piston 196. The piston 196 can slide vertically up and down within the cylinder 194, and pressure can be increased and decreased behind and in front of the piston 196 to move the piston vertically up and down. Connecting piece 198 is attached at its lower end to piston 196 and at its upper end to retaining structure 185. Thus, retaining structure 185 moves up and down together with piston 196.

[0163] The interface assembly 189 includes an interface assembly substrate 200 and a plurality of pins 202. The pins 202 are held within the interface assembly substrate 202. The interface assembly substrate 200 is secured to the upper surface of the frame 181. The interface assembly substrate 200 and the frame 181 define a circular opening 204 that is slightly larger than the diameter of the outer surface 20 of the wafer chuck component 12.

[0164] A horizontal slot 205 is formed inside the retaining structure 185. A similar slot (not shown) is formed in another portion of the retaining structure 185. A flange on the edge 122 of the metal backing plate 114 of the distribution board assembly 110 is inserted into the slot 205 in the direction into the paper. The opposite edge (see FIG. 3 ) is simultaneously inserted into the other slot of the retaining structure 185. The portable puck 108 is then suspended by the opposite portion of the retaining structure 185. The slot 205 retains the flange formed on the edge 122 and prevents vertical movement of the portable puck 108 upward or downward relative to the retaining structure 185. As the piston 196 moves downward within the cylinder 194, the retaining structure 185 also moves downward, and the portable puck 108 moves downward into contact with the interface assembly 189 of the fixed structure 180.

[0165] Referring again to FIG. 7, components of the stationary structure 180 in FIG. 8 are shown, including the interface assembly 189 and the signal and power board 206. Each of the pistons 202 includes first and second components 208 and 210 and a spring 212. A portion of the second component 210 is disposed within a portion of the first component 208. The spring 212 is also disposed within a portion of the first component 208. The pin 202 has two opposing contact portions on the first and second components 208 and 210, respectively. A force compressing the spring 212 against the spring force is required for the contact portions to move toward each other. The contact portions move away from each other when the force compressing the spring 212 is removed.

[0166] The interface assembly substrate 200 has two halves, each with a plurality of openings formed therein. A pin portion of the first component 208 and a pin portion of the second component 210 are inserted into opposing openings in the two halves. Thus, each pin 202 has a contact portion on the top of the interface assembly 189 and a contact portion on the bottom.

[0167] The signal and power board 206 includes a substrate 214, a plurality of contact portions 216, and a plurality of metal leads 218 in the form of traces, metal lines, and / or vias. The contact portions 216 are formed on the top surface of the substrate 214. The metal leads 218 are connected to the contact portions 216.

[0168] The interface assembly substrate 200 is mounted to the substrate 214 of the signal and power board 206. The contact portions of each first component 208 of each pin 202 make contact with each contact portion 216 of the signal and power board 206. The interface assembly 189 shown in FIG. 7 is mounted to the frame 181 shown in FIG. 8 through the signal and power board 206. When the portable puck 108 moves downward into contact with the interface assembly 189, each of the lands 193 of the signal distribution board 116 makes contact with each contact portion of each second component 210 of each pin 202 of the interface assembly 189. The lands 193 press against the contact portions on the top of the pins 202 as the portable puck 108 moves further downward. The force generated by the actuator 187 shown in FIG. 8 ensures proper contact between the lands 193 and the pins 202.

[0169] The terminals of the wafer substrate 82 are then connected to the contact portions 216 and metal leads 218 of the signal / power board 206 via the pins 172 of the contactor 170, the contact portions 188, metal wires 191 and lands 193 of the signal distribution board 116, and the pins 202 of the interface assembly 189.

[0170] 8, the mounting arrangement 192 includes a plurality of mounting segments 220 (only one is shown) and a spring arrangement 224. The thermal chuck 190 is mounted to the frame 181 through each of the mounting segments 220 and each of the spring arrangements 224. As the portable puck 108 moves downward, the lower surface 24 of the wafer chuck component 12 comes into contact with the upper surface of the thermal chuck 190. Any slight differences in flatness between the lower surface 24 of the wafer chuck component 12 and the upper surface of the thermal chuck 190 are accommodated by the spring arrangements 224.

[0171] FIG. 9 shows the thermal chuck 190, the mounting piece 220, the thermal interface cavity seal 226, and two adapters 228, 230.

[0172] The thermal interface cavity seal 222 is an O-ring seal formed in a circular groove 242 in the top surface 232 of the thermal chuck 190. The thermal interface cavity seal 226 forms a closed loop around the center point of the thermal chuck 190. Approximately two-thirds of the thermal interface cavity seal 226 is inserted into the groove in the top surface 232 of the thermal chuck 190, and approximately one-third of the thermal interface cavity seal 226 remains above the top surface 232. The groove for the thermal interface cavity seal 226 is approximately rectangular in cross section and can accommodate the entire thermal interface cavity seal 226. When the one-third of the thermal interface cavity seal 226 above the top surface 232 is compressed into the groove, the top surface of the thermal interface cavity seal 226 becomes flush with the top surface 232.

[0173] A thermal interface vacuum passage 234 is formed from the upper surface 232 to the lower surface 236 of the thermal chuck 190. A plurality of vacuum grooves 240 are formed in the upper surface 232 of the thermal chuck 190 in the area within the thermal interface cavity seal 226. The thermal interface vacuum passage 234 has an entrance opening within one of the vacuum grooves 240. One of the vacuum grooves 240 is a slot extending radially from the center point of the upper surface 232 of the thermal chuck 190. The four vacuum grooves 240 are concentric rings centered at the center point of the upper surface 232 of the thermal chuck 190. The vacuum grooves 240 are connected to each other, thus forming a single interconnected cavity below the upper surface of the thermal chuck 190.

[0174] A vacuum port 242 is formed from the upper surface 232 to the lower surface 236 in an area of ​​the upper surface 232 outside the thermal interface cavity seal 226. A vacuum port seal 244 is formed in a groove surrounding the vacuum port 242. The vacuum port 242 is aligned with and connects to the outlet opening 156 of the reduced pressure passage 144 in the wafer chuck component 12 shown in FIG.

[0175] In use, the underside 24 of the wafer chuck component 12 of FIG. 6 contacts the thermal interface cavity seal 226 and vacuum port seal 244 shown in FIG. 9. The thermal interface cavity is defined at its bottom by the upper surface 232 of the thermal chuck 190, at its top by the lower surface 24 of the wafer chuck component 12, and at its side by the thermal interface cavity seal 226, which connects the upper surface 232 of the thermal chuck 190 to the lower surface 24 of the wafer chuck component 12. The thermal interface vacuum passage 234 is permanently connected to a pump through a valve (not shown), and air is pumped from the thermal interface cavity through the thermal interface vacuum passage, thereby reducing the pressure within the thermal interface cavity. Thus, the pressure within the thermal interface cavity is less than the ambient pressure above the portable puck 108 and the ambient pressure below the thermal chuck 190. The thermal interface cavity decreases in size until the bottom surface 24 of the wafer chuck component 12 contacts the top surface 232 of the thermal chuck 190 and the thermal interface cavity seal 226 is compressed into its groove. Thus, the only remaining portion of the thermal interface cavity is defined by the vacuum groove 240, which maintains a reduced pressure within the vacuum groove 240, holding the surfaces 24 and 232 together. Because the surfaces 24 and 232 are held together, heat can be transferred in both directions between the thermal chuck 190 and the wafer chuck component 12.

[0176] A vacuum port seal 244 seals with the underside 24 of the wafer chuck component 12 around the exit opening 156 of the vacuum passage 144. The pump maintains the vacuum port 242 at a low pressure, and therefore the exit opening 156, in the event of a leak in the vacuum passage check valve 146.

[0177] Thermal chuck 190 is made of an upper piece 252 and a lower piece 254 that are brazed together. A thermal control passage 256 is machined into the underside of upper piece 252. As particularly shown in Figure 9, thermal control passage 256 has an inlet 258 and an outlet 260 formed through lower piece 254. Fluid flows from inlet 258, through successive sections of the thermal control passage, and out outlet 260. The first half of the thermal control passage 256 forms a first spiral 268 that advances clockwise toward the center of the thermal chuck 190 in a plan view. The second half of the thermal control passage 256 forms a second spiral 270 that advances counterclockwise away from the center of the thermal chuck 190. Two sections of the first spiral 268 have one section of the second spiral 270 between them. Two sections of the second spiral 270 have one section of the first spiral 268 between them. Thus, the thermal control passage 256 may have, for example, first, second, and third sections in series, one behind the other, with the third section positioned between the first and second sections in a cross-sectional plan view. The thermal control passage 256 may also have a fourth section in series after the third section. Depending on where the fourth section is selected, the fourth section may be between the second and third sections or between the first and second sections. In any event, the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not disposed on the first spiral.

[0178] For example, there is a 10° C. temperature difference between the fluid flowing through the inlet 258 and the fluid exiting the outlet 260. Thus, adjacent sections of the thermal control passage 256 in the outer region of the thermal chuck 190 will be at a 10° C. difference in temperature. However, the temperature between the two sections in the outer region of the thermal chuck 190 will be the average of the temperatures at the inlet 258 and the outlet 260, i.e., 5° C. above and below the temperatures at the inlet 258 and the outlet 260. Because heat is conducted from the fluid as it flows toward the center of the thermal chuck 190, the temperature of the fluid between adjacent sections of the thermal control passage 256 near the center of the thermal chuck 190 may only be 4° C. However, the temperature difference between adjacent sections of the thermal control passage 256 near the center of the thermal chuck 190 is still the same as the average of the inlet 258 and the outlet 260. Thus, the thermal chuck 190 is the same in the outer region and near its center.

[0179] Adapters 228 and 230 are attached to thermal chuck 190 and connected to inlet 258 and outlet 260 .

[0180] 10 shows a tester apparatus 300 that includes multiple components shown in FIG. 8, namely multiple portable pucks 108, multiple thermal chucks 190, and multiple interface assemblies 189. Each portable puck 108 is connected to a respective thermal chuck 190, and each portable puck 108 has a respective interface of lands that contact a respective interface of pins regardless of interface assembly 189. Tester apparatus 300 also includes multiple electrical testers 302 and a thermal control system 304.

[0181] One or two electrical testers 302 are connected to each portable puck 108. Each electrical tester 302 is configured to perform a burn-in test based on a pre-programmed set of instructions. These instructions are used to communicate electrical signals through respective interface assemblies 189 to and from the microelectronic circuitry of a wafer substrate (not shown) held in the portable puck 108. The thermal control system includes inlet and outlet pipes 306 and 308, inlet and outlet manifolds 310 and 312, a cooling heat exchanger 314, a recirculation pump 316, and a heater assembly 318. Each inlet pipe 306 is disconnected from a respective adapter, such as adapter 228 in FIG. 9, and each outlet pipe 308 is connected to a respective adapter, such as adapter 230 in FIG. 9. A closed loop valve is formed by the thermal control passage 256 in one thermal chuck 190, one outlet pipe 308, outlet manifold 312, the path through heat exchanger 314, pump 316, the path through heater assembly 318, inlet manifold 310, and one inlet pipe 306. The thermal control passage 256 in the thermal chuck 190 is connected in parallel to the manifolds 310 and 312.

[0182] The heat exchanger 314 also has passages connected to a water source and a drain. Room temperature water can be passed through the heat exchanger 314, transferring heat to the water.

[0183] The heater element 318 includes an electrical coil connected to a power source that generates heat when the power source is switched on, and can transfer heat from the heating coil when an electrical current flows through it.

[0184] In use, the components defining the recirculation path are initially filled with oil. The pump 316 is turned on, recirculating the oil through the heater assembly 318, inlet manifold 310, inlet pipe 306, thermal chuck 190, outlet pipe 308, outlet manifold 312, and heat exchanger 314 back to the pump 316. When the power supply is turned on, the electric coil in the heater assembly 318 heats up, and heat is transferred from the electric coil to the oil. The oil is heated from a room temperature of 21°C to a temperature of approximately 100°C, typically approximately 170°C. The 170°C oil enters the thermal chuck 190 and gradually heats it. As heat is transferred to the thermal chuck 190, the oil exiting the thermal chuck 190 through the outlet pipe 308 is at a lower temperature, for example, 150°C. Once the thermal chuck 190 is heated to a temperature high enough to test the integrated microelectronic circuit 90 of FIG. 2, an electrical tester tests the integrated microelectronic circuit 90. Burn-in testing is typically performed on integrated microelectronic circuits 90.

[0185] As the integrated microelectronic circuits are tested, they gradually heat up and require cooling to maintain a temperature suitable for burn-in testing. The current to the electric coil of the heater assembly 318 is switched off. The water from the water source is switched on. Heat is transferred from the oil to the water in the water source, cooling the oil. The oil entering the thermal chuck 190 is now at, for example, 160°C, and the oil leaving the thermal chuck 190 is at 170°C. The heat exchanger 314 cools the oil from 170°C to 160°C. Note that the oil typically does not need to be cooled below 150°C. Testing has shown that it is not necessary to reduce the oil temperature, for example, below 100°C or to room temperature. Rather, a high flow rate of oil, typically 3 to 5 liters / minute, is sufficient to prevent the thermal chuck 190 from overheating and maintain a temperature of 170°C.

[0186] Tester apparatus 300 uses localized heating. In contrast, a conventional burn-in tester includes a burn-in oven and a burn-in port on which integrated microelectronic circuit packages are inserted into the burn-in oven. Heat is transferred from the air in the burn-in oven to the integrated microelectronic circuit packages and the burn-in board. Thus, in a typical heating configuration, heated air surrounds the burn-in board on which the integrated microelectronic circuit packages are placed. In the localized heating configuration of the tester apparatus of FIG. 10, the air surrounding portable puck 108 is at approximately room temperature, typically 21° C., and a localized area of ​​portable puck 108 is heated (or cooled) by thermal chuck 190.

[0187] Localized heating presents its own unique set of challenges. Referring again to Figures 3 and 4, the signal distribution board assembly 116 does not heat above room temperature as much as the backing member 118 of the contactor 170, which in turn does not heat above room temperature as much as the wafer substrate 82. The backing member 118 of the contactor 170 is heated, for example, from 21°C to 171°C, and the signal distribution board assembly 116 is simultaneously heated from 21°C to 121°C. The thermal expansion coefficients of the backing member 118 of the contactor 170 and the signal distribution board assembly 116 are designed so that the backing member 118 of the contactor 170 and the signal distribution board assembly 116 expand and contract at similar rates. In a given embodiment, the coefficient of thermal expansion (CTE) of the signal distribution board assembly 116 is 10 parts per million (ppm), and the CTE of the backing member 118 of the contactor 170 is 4.5, while the CTE of the wafer substrate 82 is 3.2. In another embodiment, the CTE of the signal distribution board assembly 116 may be 5 to 6, or even lower than the CTE of the backing member 118 of the contactor 170 under a different set of thermal conditions.

[0188] In the given embodiment, the CTE ratio of the CTE of the signal distribution board assembly 116 to the CTE of the backing member 118 of the contactor 170 is 2.22. The CTE ratio can be defined as follows: JPEG2025138640000002.jpg1253

[0189] The signal distribution board 116 is heated from a low signal distribution board temperature to a high signal distribution board temperature, and the backing member 118 of the contactor 170 is heated from a low contactor temperature to a high contactor temperature and the temperature increase ratio can be defined as: JPEG2025138640000003.jpg12106

[0190] The CTE ratio multiplied by the temperature increase ratio is defined as: CTE ratio x temperature increase ratio = χ

[0191] Ideally, χ should be as close to 1 as possible. In preferred embodiments, χ should be closer to 1 than the CTE ratio. The CTE ratio is typically 0.2 to 5, more preferably 0.9 to 1.1, and χ is preferably 0.8 to 1.2.

[0192] Referring again to Figure 8, once burn-in testing of integrated microelectronic circuit 90 is complete, holding structure 185 is raised, thereby disconnecting the land interface of portable puck 108 from interface assembly 189. Portable puck 108 is then removed from holding structure 185 by sliding portable puck 108 out of the plane of the paper.

[0193] Referring again to FIG. 6 , a vacuum release passage 272 is formed through the wafer chuck component 12, and a vacuum release valve 274 is disposed within the vacuum release passage 272. The vacuum release passage 272 has first, second, and third portions 276, 278, and 280. The first and second portions 276 and 278 are drilled from the bottom surface 24 and top surface 22 of the wafer chuck component 12, respectively. The second portion 336 is drilled from the outer surface 20 and connects the first and second portions 276 and 278 to one another. The first portion 276 has an air inlet opening 282, and the second portion 336 has an air outlet opening 284 within the pressure differential cavity 140.

[0194] The vacuum relief valve is a shuttle valve that forms a relief valve opening 286 in the underside 24 of the wafer chuck component 12 on the side of the vacuum relief valve 274 opposite the air outlet opening 284 of the vacuum relief passage 272. The air inlet opening 282 is normally maintained at ambient pressure. The low pressure in the pressure differential cavity 140 holds the ball valve component 288 of the vacuum relief valve 274 in its seat 290. To open the portable puck 108, the pressure at the relief valve opening 286 is reduced below the pressure in the pressure differential cavity 140. The pressure differential between the pressure differential cavity 140 and the relief valve opening 286 moves the ball valve component 288 away from the seat 290. The air inlet opening 282 is then placed in communication with the air outlet opening 284, forcing air into the pressure differential cavity 140 through the vacuum relief passage 272. The pressure differential cavity 140 returns to ambient pressure. Because the pressure differential cavity 140 is at the same pressure as the air outside the portable pack 108, the distribution board assembly 110 can be lifted off the wafer substrate 82 and wafer chuck assembly 10. The wafer substrate 82 can then be removed from the wafer chuck assembly 10.

[0195] FIG. 11 shows two of the boards 214 shown in FIGS. 7 and 8 forming a single interface, as well as one of the electrical testers 302 of FIG.

[0196] Electrical tester 302 includes a backplane 322, a configurable power board (CPB) 324, a pin electronic board (PEB) 326, a test electronic board (TEB) 328, a die power board (DPB) 330, and a plurality of power buses 333. Configurable power board 324 and pin electronic board 326 are structurally connected to die power board 330 through backplane 322. Configurable power board 324 and pin electronic board 326 are also electrically connected to their respective power buses 333. Test electronic board 328 is mounted on top of and electrically connected to pin electronic board 326.

[0197] The electrical tester 302 is thermally and mechanically disconnected from the substrate 214. A die power board 330 is connected to the substrate 214 using multiple flexible attachments (not shown). A plurality of connectors 332 are disposed on substrate 214 and connect via conductors 218 to contacts 216 of FIG. 7. Another set of connectors 334 is disposed on die power board 330. Each flexible attachment has two connectors on each end. One connector of the flexible attachment connects to one of connectors 332, and the opposite connector of the flexible attachment connects to one of connectors 334.

[0198] Power, signals, and grounds can be supplied to integrated circuit 92 of Figure 2 by configurable power board 324, pin and test electronic boards 326 and 328, through backplane 322, die power board 330, and flexible attachment connector 335. Boards 324, 326, 328, and 330 each have a respective substrate and respective circuit(s) on the respective substrate through which power, ground, or signals can be supplied to or from circuit 92.

[0199] As shown in Figure 12, the configurable power supply board 324 includes four power supply circuits 340 (IBC 48V to 12V @ 500W). The power supply circuits 340 are connected in parallel with each other. Even if one of the power supply circuits 340 fails, power is still supplied by the remaining power supply circuits 340. Therefore, there are four power supply circuits 340, that is, n+1, where n is 3. Even if one of the power supply circuits 340 fails, power is still supplied by the n power supply circuits 340.

[0200] A current sharing circuit connects the power supply circuits 340 to a power bus 341. The current sharing circuit detects when the power from one of the power supply circuits 340 drops below zero. When a loss of power in one of the n+1 power supply circuits 340 is detected, the current sharing circuit switches off the connections from the failed one of the n+1 power supply circuits 340, removing the current from the failed one of the n+1 power supply circuits 340. The current is then shared by the n power supply circuits 340 that did not fail.

[0201] FIG. 13A shows that each of the power supply circuits 340 is connected to a respective fault detection circuit 342 . The fault detection circuits 342 together make up the current sharing circuit of FIG. 12. Each of the fault detection circuits 342 detects a loss of power from each of the power supply circuits 340 and disconnects each power supply circuit 340 from the power bus 341. In the fault detection circuits 342, the voltage in (VIN) must be more positive than the voltage out (VOUT) in order for the power supply circuit 340 to be connected to the power bus 341. If VIN is not more positive than VOUT, the GATE is disabled and a fault signal is applied to the fault line (IBCFAULTIN). In FIG. 12, the fault signal is applied to a power supply control circuit 344 connected to a control line (IBC_INHIBIT_N). The power supply control circuit 344 can be used to switch on or off the power supplied by the power supply circuits 340. All of the power supply circuits 340 are under the control of the power supply control circuit 344.

[0202] Also, power supply control circuit 344 is energized by power supply circuits 340 through power bus 341. Power supply control circuit 344 is programmed to control which of power supply circuits 340 are switched on and which are switched off. One of power supply circuits 340 is always on, always supplying power to power supply control circuit 344. Thus, loss of power to power supply control circuit 344 is avoided, eliminating the need for restarting or reprogramming. Power supply control circuit 344 is therefore used to switch between a test mode in which power is supplied by all four power supply circuits 340, and a power save mode in which power is supplied by only one power supply circuit 340. A current sharing circuit detects loss of power by all but one of power supply circuits 340 and disconnects all but one power supply circuit 340 from power bus 341.

[0203] The circuit shown in FIG. 13A provides 12V power to power bus 341. FIG. 12 shows voltage master DACs and MUXES circuit 346, also shown in FIG. 13B. The circuit of FIG. 13B establishes four master voltage levels (HIC_VMASTER0 through HIC_VMASTER4). The master voltages are adjusted by individual digital-to-analog converters (12BITDAC). Thus, the circuit of FIG. 13B can simultaneously provide four different voltages, each of which is at five different levels switched by multiplexer (DG408). The circuit of FIG. 13B is under the control of power supply control circuit 344 of FIG. 12.

[0204] 12, voltage master DACS and MUXES circuit 346 is connected to high-current slave 348, high-voltage slave 350, and additional slave 352. Each high-current slave 348 is arranged in a "primary" group of six high-current modules. Eight "primary" groups of high-current slaves 348 are arranged in "super" groups of 48 high-current modules. Four high-voltage slaves 350 are arranged in a "primary" group of high-voltage slaves 350, and four "primary" groups of high-voltage slaves 350 are arranged in one "super" group of 16 high-voltage modules. The four voltages provided by voltage master DACS and MUXES circuit 346 are supplied to each "primary" group of high-current slaves 348 and each "primary" group of high-voltage slaves 350 via four separate lines.

[0205] Figure 13C shows one of the "primary" groups of high current slaves 348 of Figure 12. Six current amplifiers 356 are provided. The voltage adjustment lines (VADJ) of the current amplifiers 356 are connected to a common line 358. Line 358 is connected to four voltage lines (VMASTER) on the right side of the circuit of Figure 13B via a switch 360, two amplifiers 362 and 364, and a voltage selector 366. Voltage selector 366 is used to select each of the four voltages applied to the current amplifiers 356.

[0206] Figure 14 shows one of the current amplifiers 356 of Figure 13C. The current amplifier 356 includes a current amplification module 370, an amplifier 372, a switch 374, and first and second input lines 376 and 378 to the amplifier 372.

[0207] Current amplifier module 370 has a voltage reference (VOADJ) and is connected to a 12V power supply via power bus 341 in FIG. 13A to provide current to the output (VOUT).

[0208] The voltage reference line (VOADJ) is connected to the common line 358 of Figure 13C via an amplifier 372 and a first input line 376. The current amplifier module 370 drives the output (VOUT) to the same voltage as the voltage reference line (VOADJ). When the switch 374 is in the first configuration and the second input line 378 is disconnected from the sense line (VSENSE), the voltage on the second input line 378 follows VOUT, thereby keeping VOUT locally locked to VADJ.

[0209] When switch 374 is in the second configuration and the sense line (VSENSE) is connected to the second input line 378 of amplifier 372, the reference (VOAJD) of amplifier module 370 follows the remote voltage on the sense line (VSENSE). The voltage at the output (VOUT) is under the control of the sense line (VSENSE). It should be understood that both the output (VOUT) and the input (VSENSE) are ultimately connected to terminal 92 of substrate 82 in FIG. 2.

[0210] 13C, each of the current amplifiers 356 has a separate output (VOUT) and a separate sense line (VSENSE). Separate voltages can be sensed on each sense line, resulting in different currents into each output line when the current configuration circuitry shown in FIGS. 13C and 14 is in the second configuration.

[0211] 13C and 14. In the second configuration, switch 360 connects common line 358 to amplifier 362. In the first configuration, switch 360 connects common line 358 to the output of amplifier 384. Amplifier 384 has first and second input lines 386 and 388. First input line 386 is connected to the output from amplifier 362. Second output line 388 is connected to the sense line (VSENSE0) of only one current amplifier 356. Thus, the voltage on common line 358 follows the voltage on the sense line (VSENSE0) when the current configuration circuits of FIGS.

[0212] Referring again to FIG. 12, each "primary" group of high-voltage slaves 350 includes circuitry that is the same as the current configuration circuit of FIG. 13C, except that each of the current amplifiers 356 is used as a current and voltage amplifier. Each of the current and voltage amplifiers has the respective circuitry shown in FIG. 15. The voltage and current amplifiers of FIG. 15 are the same as the current amplifiers of FIG. 14, except that four voltage-dividing resistors R1, R2, R3, and R4 are provided, and the current amplifier module 370 of FIG. 14 acts as the current and voltage amplifier module. The sense line (HIV_VSENSE) is connected to a switch 374 via a resistor R1. The sense line (HIV_VSENSE) is also connected to resistors R1 and R2 to ground. Thus, resistors R1 and R2 act as a voltage divider for the voltage of the sense line (HIV_VSENSE) to the switch 374.

[0213] Similarly, a switch 374 is connected to the voltage sense line (VSENSE) through a resistor R4 and to the output (VOUT) of the voltage and current amplifier module 370, the same terminal of the switch 374 also being connected to ground through a resistor R3. The voltage and current amplifier module 370 amplifies a voltage based on the voltage on the VTRIM line.

[0214] 13 and 14, it will be apparent that an operator can switch between a first and a second configuration. In the first configuration, for example, 60 A of current can be provided and shared among six slave module outputs. In the second configuration, approximately 10 A can be provided by each of six different module outputs, and the currents can float independently of each other.

[0215] While several embodiments have been shown and described, it should be understood that they are merely exemplary and not limiting of the invention, and that the invention is not limited to the specific constructions and configurations shown and described, as various modifications will be apparent to those skilled in the art. [Explanation of symbols]

[0216] 10: Wafer chuck assembly 12: Wafer chuck component 14: Pressure differential substrate cavity seal 16: Offset ring 18: Substrate absorption passage valve 36:Circular recess 40: Lower anchor part 50: Board suction passage 52: Part 1 54:Second part 56: 3rd part 62: Air outlet opening 64, 66, 68: Circular grooves 70: Slot 74: Seat part 76: Ball valve components 80: Pressure relief opening 82: Wafer substrate 92: Metal terminal 108: Portable Pack 114: Backing plate 116: Signal distribution board 118: Backing material 120:Aperture 122: Relationship 124: Circuit board 128: Clamp ring 134: Metal seat 140: Pressure difference cavity 142: Groove 144: Decompression passage 154: Entrance opening 168: Slot 170:Contactor 172: Pin 174: Standoff 176: Adhesive 178: First component 179: Second component 180: Fixed structure 181: Frame 182: Spring 185: Holding structure 187: Actuator 188: Contact section 189: Interface assembly 190: Heat chuck 191: Metal wire 192: Wearing structure 193: Land 194: Cylinder 196: Piston 198: Connection fragment 200: Substrate 202: Piston 206: Signal and power board 208: First component 210: Second component 212: Spring 214: Substrate 216: Contact section 218: Metal wire 220:Attachment fragment 226: Thermal interface cavity seal 230: Adapter 240: Vacuum groove 242: Vacuum port 244: Vacuum port seal 268: First Spiral 270: The Second Spiral 302: Electrical tester

Claims

1. a portable support structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; a plurality of lands on the portable support structure for forming a first interface connected to the contact portions, the lands being adapted to be connected to a plurality of members forming a second interface of a stationary structure when the portable support structure is removably held by the stationary structure; wherein the member has a contact surface that conforms to and can be resiliently pressed by the land, and is movable relative to a structural part of the fixed structure.

2. 2. The portable pack of claim 1, wherein the portable support structure includes first and second components for holding a substrate therebetween, the contact portions being disposed on the second component, and the components being movable relative to one another to ensure proper contact between the contact portions and terminals.

3. 3. The portable pack of claim 2, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

4. 4. The portable pack of claim 3, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

5. 4. The portable pack of claim 3, wherein the ratio of the coefficients of thermal expansion multiplied by the temperature change ratio is between 0.85 and 1.

15.

6. The portable puck of claim 3 , wherein the first component is a substrate chuck having a surface for supporting a substrate.

7. forming a seal between the first and second components to define an enclosed cavity between the surfaces of the first and second components and the seal; reducing the pressure within the enclosed cavity to cause the first and second components to move relative to one another; 3. The portable pack of claim 2, comprising:

8. 8. The portable pack of claim 7, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

9. 8. The portable pack of claim 7, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

10. 8. The portable pack of claim 7, wherein the pressure differential cavity seal is a lip seal.

11. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 8. The portable pack of claim 7, wherein the component having the reduced pressure passage includes a first valve that, when opened, allows air to escape from the pressure differential cavity and that, when closed, prevents air from entering the pressure differential cavity.

12. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 12. The portable pack of claim 11, wherein the component having the vacuum release passage includes a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

13. 3. The portable pack of claim 2, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

14. The contact portion can be elastically pressed by the terminal, and further 3. The portable pack of claim 2, further comprising a standoff on the second component, the standoff having a surface that limits the pressure on the at least one contact portion.

15. The portable pack of claim 14 , wherein a plurality of separated standoffs are disposed between the contact portions.

16. 15. The portable pack of claim 14, further comprising a layer having a first surface that is adhesive and that is attached to the second component, and a second, opposing surface that is adhesive, and the standoff is attached to the second surface.

17. 2. The portable pack of claim 1, wherein the lands and terminals lie in parallel planes.

18. 10. The portable pack of claim 1, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

19. 2. The portable pack of claim 1, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when the contact portion is biased by a respective terminal.

20. a portable support structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; a plurality of lands on the portable support structure forming a first interface connected to the contact portions; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a plurality of members forming a second interface with the stationary structure, the members having contact surfaces that conform to and can be resiliently pressed by the lands, the members being movable relative to a structure of the stationary structure, the second interface being connected to the first interface when the portable structure is held by the stationary structure, and being disconnected from the first interface when the portable support structure is removed from the stationary structure; an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, the electrical tester transmitting signals between the electrical tester and a microelectronic circuit to test the microelectronic circuit; A tester device comprising:

21. 21. The tester apparatus of claim 20, wherein the portable support structure includes first and second components for holding a substrate therebetween, the contact portions being disposed on the second component, and the components being movable relative to one another to ensure proper contact between the contact portions and terminals.

22. 22. The tester apparatus of claim 21, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

23. 23. The tester apparatus of claim 22, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

24. 23. The tester device of claim 22, wherein the ratio of the coefficients of thermal expansion multiplied by the temperature change ratio is between 0.85 and 1.

15.

25. 23. The tester apparatus of claim 22, wherein the first component is a substrate chuck having a surface for supporting a substrate.

26. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow relative movement of the first and second components toward one another; 22. The tester apparatus of claim 21 further comprising:

27. 27. The tester apparatus of claim 26, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

28. 27. The tester apparatus of claim 26, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

29. 27. The tester apparatus of claim 26, wherein the pressure differential cavity seal is a lip seal.

30. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 27. The tester apparatus of claim 26, wherein the component having the reduced pressure passage includes a first valve that can be opened to allow air to leave the pressure differential cavity and that can be closed to prevent air from entering the pressure differential cavity.

31. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 31. The tester apparatus of claim 30, wherein the component having the vacuum release passage includes a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

32. 22. The tester apparatus of claim 21, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

33. The contact portion can be elastically pressed by the terminal, and further 22. The tester apparatus of claim 21, further comprising a standoff on the second component, the standoff having a surface for limiting the pressure on the at least one contact portion.

34. 34. The tester apparatus of claim 33, wherein a plurality of separated standoffs are disposed between the contact portions.

35. 34. The tester apparatus of claim 33, further comprising a layer having a first surface that is adhesive and that is attached to the second component, and a second, opposing surface that is adhesive, the standoff being attached to the second surface.

36. 21. The tester apparatus of claim 20, wherein the lands and terminals lie in parallel planes.

37. 21. The tester apparatus of claim 20, wherein the stationary structure comprises a thermal chuck, and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

38. 38. The tester apparatus of claim 37, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

39. 40. The tester apparatus of claim 38, further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

40. 21. The tester apparatus of claim 20, further comprising a thermal chuck on the stationary structure, the thermal chuck having a thermal control passageway with an inlet and an outlet, with at least one segment between the inlet and outlet for allowing fluid to flow from the inlet to the outlet, wherein heat is transferred through the thermal chuck between the substrate and the fluid in the thermal control passageway.

41. 41. The tester apparatus of claim 40, wherein the thermal control passage has first, second, and third sections in series, one behind the other, along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

42. 42. The tester apparatus of claim 41, wherein the thermal control passage has a fourth section in series with the third section along the fluid path, the fourth section being located between the second and third sections.

43. 43. The tester apparatus of claim 42, wherein the thermal control passage has a fourth section in series with the third section along the fluid path, the fourth section being located between the first and second sections.

44. 42. The tester apparatus of claim 41, wherein the first, second and third sections are sections of a first spiral.

45. 42. The tester apparatus of claim 41, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

46. 41. The tester apparatus of claim 40, further comprising a heater, the heater transferring heat to the fluid when the fluid is outside the thermal control passage.

47. 47. The tester apparatus of claim 46, wherein the heater is an electric heater.

48. 47. The tester apparatus of claim 46, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

49. 49. The tester apparatus of claim 48, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

50. 47. The tester apparatus of claim 46, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

51. 47. The tester apparatus of claim 46, wherein the fluid is recirculated.

52. 21. The tester apparatus of claim 20, further comprising at least one interface actuator having first and second actuator segments actuatable relative to one another to move the portable support structure relative to the fixed structure to engage the first interface with the second interface.

53. 53. The tester apparatus of claim 52, wherein the first and second sections are a cylinder and a piston, respectively, the piston sliding along an inner surface of the cylinder.

54. 21. The tester apparatus of claim 20, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

55. 21. The tester apparatus of claim 20, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

56. 21. The tester apparatus of claim 20, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when the contact portion is biased by a respective terminal.

57. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: holding the substrate on a portable support structure having contacts for terminals of the substrate connected to the microelectronic circuit; receiving the portable support structure with a fixed structure; positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; transmitting signals between an electrical tester and the microelectronic circuit through the terminals, the contact portions, and the first and second interfaces to test the microelectronic circuit; A method comprising:

58. the substrate is held between the first and second components of the portable support structure, the contact portion being on the second component; and Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and terminals; 58. The method of claim 57, comprising:

59. 59. The method of claim 58, wherein the second component comprises a distribution board, the ratio of the thermal expansion coefficient of the distribution board to the thermal expansion coefficient of the first component being at least 1.

5.

60. 60. The method of claim 59, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

61. 60. The method of claim 59, wherein the ratio of the coefficients of thermal expansion multiplied by the ratio of the temperature change is between 0.85 and 1.

15.

62. 60. The method of claim 59, wherein the first component is a substrate chuck having a surface for supporting a substrate.

63. disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by surfaces of the first and second components and the pressure differential cavity seal; reducing the pressure within the cavity of the pressure differential cavity seal to cause relative movement of the first and second components toward one another; 59. The method of claim 58, further comprising:

64. 64. The method of claim 63, wherein the pressure differential cavity seal surrounds the contact portion and terminal.

65. 64. The method of claim 63, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

66. 64. The method of claim 63, wherein the substrate cavity seal is formed with a lip seal.

67. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; The component having the pressure reducing passage includes a first valve, and further includes: opening the first valve to allow air to leave the pressure differential cavity; closing the first valve to prevent air from entering the pressure differential cavity; 64. The method of claim 63, comprising:

68. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve is provided in the component having the vacuum relief passage; the vacuum relief valve can be opened to admit air into the pressure differential cavity; closing the valve to prevent air from escaping from the pressure differential cavity; 68. The method of claim 67, comprising:

69. 68. The method of claim 67, wherein the pressure in the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

70. 60. The method of claim 58, further comprising pumping air through substrate suction passages in the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

71. The contact portion can be elastically pressed by the terminal, and further 60. The method of claim 58, including limiting compression of at least one contact portion with a surface of a standoff of the second component.

72. 72. The method of claim 71, wherein a plurality of separated standoffs are disposed between the contact portions.

73. 72. The method of claim 71, comprising a layer having a first surface that is adhesive and attached to the second component and a second opposing surface that is adhesive, the standoff being attached to the second surface.

74. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; 58. The method of claim 57, further comprising:

75. 75. The method of claim 74, further comprising reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

76. 76. The method of claim 75, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

77. 77. The method of claim 76, further comprising disposing a thermal interface cavity seal between the portable support structure and the thermal chuck, the thermal interface cavity seal, the portable support structure and the thermal chuck defining a thermal interface cavity.

78. passing a fluid through at least one segment of a thermal control passage in a thermal chuck on the stationary structure from a fluid inlet to a fluid outlet; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; 58. The method of claim 57, further comprising:

79. 79. The method of claim 78, wherein the thermal control passage has first, second, and third sections in series, one behind the other, along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

80. 80. The method of claim 79, wherein the thermal control passage has a fourth section in series along the fluid path after the third section, the fourth section being located between the second and third sections.

81. 81. The method of claim 80, wherein a temperature of the thermal chuck between the second and third sections is from a temperature of the fluid in the first section to a temperature of the fluid in the second section, and a temperature of the thermal chuck between the first and fourth sections is from a temperature of the fluid in the first section to a temperature of the fluid in the second section.

82. 82. The method of claim 81, wherein the temperature difference between the first and fourth division fluids is greater than the temperature difference between the second and third division fluids.

83. 81. The method of claim 80, wherein the thermal control passage has a fourth section in series along the fluid path after the third section, the fourth section being located between the first and second sections.

84. 80. The method of claim 79, wherein the first, second, and third sections are sections of a first spiral.

85. 80. The method of claim 79, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

86. 79. The method of claim 78, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

87. 87. The method of claim 86, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

88. 88. The method of claim 87, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

89. 87. The method of claim 86, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

90. 87. The method of claim 86, wherein the fluid is recirculated.

91. 58. The method of claim 57, wherein the test performed on the microelectronic circuit is a burn-in test.

92. 58. The method of claim 57, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

93. 58. The method of claim 57, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when each contact portion is biased by a respective terminal.

94. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit, the second component including a signal distribution board and a contactor, wherein a CTE ratio of the signal distribution board CTE to the contactor CTE is not equal to 1; a plurality of contact portions on the second component that mate with the terminals to make contact therewith, the components being movable relative to one another to ensure proper contact between the contact portions and the terminals; a first interface on the portable support structure connected to the contact portion, the first interface connecting to a second interface on a fixed structure when the portable support structure is removed and held by the fixed structure; Portable pack with

95. 95. The portable pack of claim 94, wherein the contactor heats from a first contactor temperature to a second contactor temperature during testing of a microelectronic circuit, the signal distribution board heats from a first signal distribution board temperature to a second signal distribution board temperature, and a temperature change ratio between the difference between the second signal distribution board temperature and the first signal distribution board temperature and the difference between the second contactor temperature and the first contactor temperature multiplied by a CTE ratio is closer to 1 than the CTE ratio.

96. 95. The portable pack of claim 94, wherein the CTE ratio multiplied by the temperature change ratio is between 0.85 and 1.

15.

97. 95. The portable puck of claim 94, wherein the first component is a substrate chuck having a surface for supporting a substrate.

98. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow relative movement of the first and second components toward one another; 95. The portable pack of claim 94, further comprising:

99. 99. A portable pack as defined in claim 98, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

100. 99. A portable pack according to claim 98, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

101. 99. A portable pack as claimed in claim 98, wherein the pressure differential cavity seal is a lip seal.

102. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 99. A portable pack as described in claim 98, wherein the component having the reduced pressure passage has a first valve that can be opened to allow air to leave the pressure differential cavity and can be closed to prevent air from entering the pressure differential cavity.

103. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 103. The portable pack of claim 102, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

104. 95. A portable pack as described in claim 94, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

105. The contact portion can be elastically pressed by the terminal, and further 95. A portable puck as claimed in claim 94, comprising a standoff on the second component, the standoff having a surface that limits compression of the at least one contact portion.

106. 106. The portable puck of claim 105, wherein a plurality of separated standoffs are disposed between the contact portions.

107. 106. A portable pack as described in claim 105, further comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

108. 95. A portable pack as described in claim 94, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

109. 109. The portable pack of claim 108, wherein the lands and the terminals lie in parallel planes.

110. 95. The portable puck of claim 94, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

111. 95. A portable pack as claimed in claim 94, wherein the contact portions are pins, each pin having a spring against which the spring force is biased when each contact portion is biased by a respective terminal.

112. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit, the second component including a signal distribution board and a contactor, wherein a CTE ratio of the signal distribution board CTE to the contactor CTE is not equal to 1; a plurality of contact portions on the second component that mate with the terminals to make contact therewith, the components being movable relative to one another to ensure proper contact between the contact portions and the terminals; a first interface on the portable support structure and connected to the contact portion; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a second interface on the stationary structure that connects to the first interface when the portable structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, for testing the microelectronic circuit by transmitting signals between the electrical tester and the microelectronic circuit; A tester device comprising:

113. 113. The tester apparatus of claim 112, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

114. 113. The tester apparatus of claim 112, wherein the ratio of the coefficients of thermal expansion multiplied by the ratio of the temperature change is between 0.85 and 1.

15.

115. 113. The tester apparatus of claim 112, wherein the first component is a substrate chuck having a surface for supporting a substrate.

116. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow relative movement of the first and second components toward one another; 113. The tester apparatus of claim 112, further comprising:

117. 117. The tester apparatus of claim 116, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

118. 117. The tester apparatus of claim 116, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

119. 117. The tester apparatus of claim 116, wherein the pressure differential cavity seal is a lip seal.

120. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 117. The tester apparatus of claim 116, wherein the component having the reduced pressure passage includes a first valve that can be opened to allow air to leave the pressure differential cavity and that can be closed to prevent air from entering the pressure differential cavity.

121. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 121. The tester apparatus of claim 120, wherein the component having the vacuum release passage includes a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

122. 113. A tester apparatus as described in claim 112, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

123. The contact portion can be elastically pressed by the terminal, and further 113. The tester apparatus of claim 112, further comprising a standoff on the second component, the standoff having a surface that limits the pressure on the at least one contact portion.

124. 124. The tester apparatus of claim 123, wherein a plurality of separated standoffs are disposed between the contact portions.

125. 124. The tester apparatus of claim 123, further comprising a layer having a first surface that is adhesive and that is attached to the second component, and a second opposing surface that is adhesive, the standoff being attached to the second surface.

126. 113. The tester apparatus of claim 112, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

127. 127. The tester apparatus of claim 126, wherein the lands and terminals lie in parallel planes.

128. 127. The tester apparatus of claim 126, wherein the stationary structure comprises a thermal chuck, and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

129. 129. The tester apparatus of claim 128, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

130. 130. The tester apparatus of claim 129, further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

131. 113. The tester apparatus of claim 112, further comprising a thermal chuck on the fixed structure, the thermal chuck having a thermal control passage with an inlet and an outlet, with at least one section between the inlet and outlet for allowing a fluid to flow from the inlet to the outlet, and heat being transferred through the thermal chuck between the substrate and the fluid in the thermal control passage.

132. 132. The tester apparatus of claim 131, wherein the thermal control passage has first, second, and third sections in series, one behind the other, along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

133. 133. The tester apparatus of claim 132, wherein the thermal control passage has a fourth section in series along the fluid path after the third section, the fourth section being located between the second and third sections.

134. 134. The tester apparatus of claim 133, wherein the thermal control passage has a fourth section in series along the fluid path after the third section, the fourth section being located between the first and second sections.

135. 133. A tester apparatus as described in claim 132, wherein the first, second and third sections are sections of a first spiral.

136. 133. The tester apparatus of claim 132, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

137. 132. The tester apparatus of claim 131, further comprising a heater, the heater transferring heat to the fluid when the fluid is outside the thermal control passage.

138. 138. The tester apparatus of claim 137, wherein the heater is an electric heater.

139. 138. The tester apparatus of claim 137, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

140. 140. The tester apparatus of claim 139, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

141. 138. The tester apparatus of claim 137, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

142. 138. The tester apparatus of claim 137, wherein the fluid is recirculated.

143. 113. The tester apparatus of claim 112, further comprising at least one interface actuator having first and second actuator segments actuatable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

144. 144. The tester apparatus of claim 143, wherein the first and second sections are a cylinder and a piston, respectively, and the piston slides along an inner surface of the cylinder.

145. 113. The tester apparatus of claim 112, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

146. 113. The tester apparatus of claim 112, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

147. 113. A tester apparatus as claimed in claim 112, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when the contact portion is biased by a respective terminal.

148. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: supporting a substrate between first and second components of a portable support structure, the second component having contacts for terminals of the substrate connected to the microelectronic circuitry; Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and the terminals, wherein the portable support structure includes first and second elements together with a substrate, and a CTE ratio between the CTE of the first element and the CTE of the second element is not equal to 1; receiving the portable support structure by a stationary structure such that a first interface of the portable support structure connects to a second interface of the stationary structure; transmitting signals between an electrical tester and a microelectronic circuit through the terminals, contacts, and first and second interfaces to test the microelectronic circuit, wherein a substrate is supported between a first component and a second component of the portable support structure and the contacts are on the second component; and Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and the terminals; A method comprising:

149. 149. The method of claim 148, wherein the second element heats from a lower second element temperature to a second substrate temperature during testing of a microelectronic circuit, the first element heats from a lower first element temperature to a higher first element temperature, and the temperature change ratio between the difference between the higher second element temperature and the lower second element temperature and the difference between the higher first element temperature and the lower first element temperature multiplied by the CTE ratio is closer to 1 than the CTE ratio.

150. 149. The method of claim 148, wherein the CTE ratio multiplied by the temperature change ratio is between 0.8 and 1.

2.

151. 149. The method of claim 148, wherein the first and second elements are a signal distribution board and a contactor on the same side of the substrate.

152. 149. The method of claim 148, wherein one of the elements is a substrate.

153. disposing a pressure differential cavity seal between the first and second components to form an enclosed cavity with the surfaces of the first and second components and the pressure differential cavity seal; reducing the pressure within the cavity of the pressure differential cavity seal to cause relative movement of the first and second components toward one another; 149. The method of claim 148, further comprising:

154. 154. The method of claim 153, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

155. 154. The method of claim 153, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

156. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; The component having the pressure reducing passage includes a first valve; Opening the first valve allows air to escape from the pressure differential cavity; 153. The method of claim 152, wherein closing the first valve prevents air from entering the pressure differential cavity.

157. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve in the component having the vacuum relief passage; Opening the vacuum release valve allows air to enter the pressure differential cavity; 157. The method of claim 156, wherein closing the valve prevents air from escaping from the pressure differential cavity.

158. 157. The method of claim 156, wherein the pressure in the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

159. 149. The method of claim 148, further comprising pumping air through a substrate suction passage of the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

160. The contact portion can be elastically pressed by the terminal, and further 149. The method of claim 148, comprising limiting pressure of at least one contact portion with a surface of a standoff of the second component.

161. 161. The method of claim 160, wherein a plurality of separated standoffs are disposed between the contact portions.

162. 161. The method of claim 160, further comprising a layer having a first surface that is adhesive and attached to the second component and a second opposing surface that is adhesive, the standoff being attached to the second surface.

163. positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; 149. The method of claim 148, further comprising:

164. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; 164. The method of claim 163, further comprising:

165. 165. The method of claim 164, further comprising reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

166. 166. The method of claim 165, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

167. 167. The method of claim 166, further comprising the step of: disposing a thermal interface cavity seal between the portable support structure and the thermal chuck, and defining a thermal interface cavity between the thermal interface cavity seal, the portable support structure, and the thermal chuck.

168. passing a fluid through at least one segment of a thermal control passage in a thermal chuck on the stationary structure from a fluid inlet to a fluid outlet; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; 149. The method of claim 148, further comprising:

169. 169. The method of claim 168, wherein the thermal control passage has first, second, and third sections in series, one behind the other, along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

170. 170. The method of claim 169, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the second section and the third section.

171. 171. The method of claim 170, wherein the temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

172. 172. The method of claim 171, wherein the temperature difference between the first and fourth division fluids is greater than the temperature difference between the second and third division fluids.

173. 171. The method of claim 170, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the first section and the second section.

174. 170. The method of claim 169, wherein the first, second, and third sections are sections of a first spiral.

175. 170. The method of claim 169, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

176. 169. The method of claim 168, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

177. 177. The method of claim 176, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

178. 178. The method of claim 177, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

179. 177. The method of claim 176, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

180. 177. The method of claim 176, wherein the fluid is recirculated.

181. 149. The method of claim 148, wherein the test performed on the microelectronic circuit is a burn-in test.

182. 149. The method of claim 148, wherein the substrate is a wafer having a plurality of microelectronic circuits.

183. 149. The method of claim 148, wherein the contact portions are pins, each pin having a spring that is biased against its spring force when each contact portion is biased by a respective terminal.

184. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the second component that mate with the terminals to make contact with the terminals, the plurality of contact portions having a pressure differential cavity seal between the first and second components, the pressure differential cavity seal forming an enclosed pressure differential cavity with surfaces of the first and second components; a pressure reduction passage formed through one of said components, the pressure reduction passage having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; a first valve provided in the component having the pressure reduction passage, the first valve being capable of venting air from the pressure differential cavity and moving the first and second components toward each other to ensure proper contact between the contact portion and the terminal when opened, and capable of preventing air from entering the pressure differential cavity when closed; a first interface on the portable support structure connected to the contact portion, the first interface connecting to a second interface on a fixed structure when the portable support structure is removed and held by the fixed structure; Portable pack with

185. 185. A portable pack as described in claim 184, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

186. 186. The portable pack of claim 185, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

187. 186. A portable pack as described in claim 185, wherein the ratio of the coefficients of thermal expansion multiplied by the temperature change ratio is between 0.85 and 1.

15.

188. 186. The portable puck of claim 185, wherein the first component is a substrate chuck having a surface for supporting a substrate.

189. 185. A portable pack as described in claim 184, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

190. 185. A portable pack as described in claim 184, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

191. 185. A portable pack as described in claim 184, wherein the pressure differential cavity seal is a lip seal.

192. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 185. A portable pack as described in claim 184, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and, when closed, prevents air from escaping from the pressure differential cavity.

193. 185. A portable pack as described in claim 184, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

194. The contact portion can be elastically pressed by the terminal, and further 185. A portable puck as described in claim 184, comprising a standoff on the second component, the standoff having a surface that limits the pressure on at least one contact portion.

195. 195. The portable pack of claim 194, wherein a plurality of separated standoffs are disposed between the contact portions.

196. 195. A portable pack as described in claim 194, further comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

197. 185. A portable pack as described in claim 184, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed by the lands to move relative to a structural portion of the fixed structure.

198. 198. A portable pack as described in claim 197, wherein the lands and the terminals lie in parallel planes.

199. 185. The portable pack of claim 184, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

200. 185. A portable pack as described in claim 184, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when each contact portion is biased by a respective terminal.

201. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the second component that mate with the terminals for making contact with the terminals; a pressure differential cavity seal between the first component and the second component, the pressure differential cavity being enclosed by surfaces of the first and second components; a pressure reduction passage formed through one of said components, the pressure reduction passage having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; a first valve provided in the component having the pressure reduction passage, the first valve being capable of venting air from the pressure differential cavity and moving the first and second components toward each other to ensure proper contact between the contact portion and the terminal when opened, and capable of preventing air from entering the pressure differential cavity when closed; a first interface on the portable support structure and connected to the contact portion; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a second interface on the stationary structure that connects to the first interface when the portable structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, for testing the microelectronic circuit by transmitting signals between the electrical tester and the microelectronic circuit; A tester device comprising:

202. 202. The tester apparatus of claim 201, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

203. 203. The tester apparatus of claim 202, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of the microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

204. 203. The tester apparatus of claim 202, wherein the ratio of the coefficients of thermal expansion multiplied by the temperature change ratio is between 0.85 and 1.

15.

205. 203. The tester apparatus of claim 202, wherein the first component is a substrate chuck having a surface for supporting a substrate.

206. 202. The tester apparatus of claim 201, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

207. 202. The tester apparatus of claim 201, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

208. 202. The tester apparatus of claim 201, wherein the pressure differential cavity seal is a lip seal.

209. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 202. The tester apparatus of claim 201, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

210. 202. A tester apparatus as described in claim 201, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

211. The contact portion can be elastically pressed by the terminal, and further 202. A tester apparatus as described in claim 201, further comprising a standoff on the second component, the standoff having a surface that limits the pressure on the at least one contact portion.

212. 212. The tester apparatus of claim 211, wherein a plurality of separated standoffs are disposed between the contact portions.

213. 212. The tester apparatus of claim 211, further comprising a layer having a first surface that is adhesive and that is attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

214. 202. The tester apparatus of claim 201, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to and can be resiliently pressed by the lands to move against or relative to a structural portion of the fixed structure.

215. 215. The tester apparatus of claim 214, wherein the lands and terminals lie in parallel planes.

216. 215. The tester apparatus of claim 214, wherein the fixed structure comprises a thermal chuck and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

217. 217. The tester apparatus of claim 216, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

218. 218. The tester apparatus of claim 217, further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

219. 202. The tester apparatus of claim 201, further comprising a thermal chuck on the fixed structure, the thermal chuck having a thermal control passage with an inlet and an outlet, with at least one section between the inlet and outlet for allowing a fluid to flow from the inlet to the outlet, and heat being transferred through the thermal chuck between the substrate and the fluid in the thermal control passage.

220. 220. The tester apparatus of claim 219, wherein the thermal control passage has first, second and third sections in series, back and forth with one another along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

221. 221. The tester apparatus of claim 220, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the second and third sections.

222. 222. The tester apparatus of claim 221, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the first and second sections.

223. 221. A tester apparatus as described in claim 220, wherein the first, second and third sections are sections of a first spiral.

224. 221. The tester apparatus of claim 220, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

225. 220. The tester apparatus of claim 219, further comprising a heater, the heater transferring heat to the fluid when the fluid is outside the thermal control passage.

226. 226. The tester apparatus of claim 225, wherein the heater is an electric heater.

227. 226. The tester apparatus of claim 225, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

228. 228. The tester apparatus of claim 227, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

229. 226. The tester apparatus of claim 225, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

230. 226. The tester apparatus of claim 225, wherein the fluid is recirculated.

231. 202. The tester apparatus of claim 201, further comprising at least one interface actuator having first and second actuator segments operable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

232. 232. The tester apparatus of claim 231, wherein the first and second sections are a cylinder and a piston, respectively, and the piston slides along the inner surface of the cylinder.

233. 202. The tester apparatus of claim 201, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

234. 202. The tester apparatus of claim 201, wherein the substrate is a wafer having a plurality of microelectronic circuits.

235. 202. A tester apparatus as defined in claim 201, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when the contact portion is biased by a respective terminal.

236. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: holding a substrate between a first component and a second component of a portable support structure, the second component having contacts for terminals of the substrate connected to the microelectronic circuitry, a reduced pressure passageway formed through one of said components, the reduced pressure passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity, the component having the reduced pressure passageway having a first valve; disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by surfaces of the first and second components and the pressure differential cavity seal; opening the first valve to allow air to escape from the pressure differential cavity, reducing the pressure within the pressure differential cavity seal cavity and causing the first and second components to move relative to one another to ensure proper contact between the contact portion and the terminal; closing the first valve to prevent air from entering the pressure differential cavity; receiving the portable support structure by a stationary structure such that a first interface of the portable support structure connects to a second interface of the stationary structure; transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contact portions, and first and second interfaces to test the microelectronic circuit; and disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by surfaces of the first and second components and the pressure differential cavity seal; reducing the pressure within the cavity of the pressure differential cavity seal to cause relative movement of the first and second components toward one another; A method comprising:

237. 237. The method of claim 236, wherein the second component comprises a distribution board, the ratio of the thermal expansion coefficient of the distribution board to the thermal expansion coefficient of the first component being at least 1.

5.

238. 238. The method of claim 237, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of the microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

239. 238. The method of claim 237, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

240. 238. The method of claim 237, wherein the first component is a substrate chuck having a surface that supports a substrate.

241. 237. The method of claim 236, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

242. 237. The method of claim 236, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

243. 237. The method of claim 236, wherein the pressure differential cavity seal is a lip seal.

244. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve in the component having the vacuum relief passage; said vacuum relief valve being opened to admit air into the pressure differential cavity; and Closing the valve prevents air from escaping from the pressure differential cavity. The method of claim 236.

245. 237. The method of claim 236, wherein pressure within the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

246. 237. The method of claim 236, further comprising pumping air through a substrate suction passage of the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

247. The contact portion can be elastically pressed by the terminal, and further 237. The method of claim 236, further comprising limiting the pressure of at least one contact portion on a surface of the standoff of the second component.

248. 248. The method of claim 247, wherein a plurality of separated standoffs are disposed between the contact portions.

249. 248. The method of claim 247, comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

250. positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; 237. The method of claim 236, further comprising:

251. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; 251. The method of claim 250, further comprising:

252. 252. The method of claim 251, further comprising the step of reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

253. 253. The method of claim 252, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

254. 254. The method of claim 253, further comprising the step of: disposing a thermal interface cavity seal between the portable support structure and the thermal chuck, and defining a thermal interface cavity between the thermal interface cavity seal, the portable support structure and the thermal chuck.

255. passing a fluid through at least one segment of a thermal control passage in a thermal chuck on the stationary structure from a fluid inlet to a fluid outlet; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; 237. The method of claim 236, further comprising:

256. 256. The method of claim 255, wherein the thermal control passage has first, second and third sections in series, back and forth with each other along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

257. 257. The method of claim 256, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the second section and the third section.

258. 258. The method of claim 257, wherein the temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

259. 259. The method of claim 258, wherein the temperature difference between the first and fourth division fluids is greater than between the second and third division fluids.

260. 258. The method of claim 257, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the first section and the second section.

261. 257. The method of claim 256, wherein the first, second, and third sections are sections of a first spiral.

262. 257. The method of claim 256, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

263. 256. The method of claim 255, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

264. 264. The method of claim 263, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

265. 265. The method of claim 264, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

266. 264. The method of claim 263, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

267. 264. The method of claim 263, wherein the fluid is recirculated.

268. 237. The method of claim 236, wherein the test performed on the microelectronic circuit is a burn-in test.

269. 237. The method of claim 236, wherein the substrate is a wafer having a plurality of microelectronic circuits.

270. 237. The method of claim 236, wherein the contact portions are pins, each pin having a spring that is pressed against its spring force when each contact portion is pressed by a respective terminal.

271. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the second component conforming to the terminals for making contact therewith, the contact portions being movable relative to one another so that the contact portions can be resiliently pressed by the terminals to ensure proper contact between the contact portions and the terminals; a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive; a standoff attached to the second surface, the standoff having a surface that limits pressure on at least one of the contact portions; a first interface on the portable support structure connected to the contact portion, the first interface connecting to a second interface on a fixed structure when the portable support structure is removed and held by the fixed structure; Portable pack with

272. 272. A portable pack as described in claim 271, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

273. 273. The portable pack of claim 272, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

274. 273. A portable pack as described in claim 272, wherein the ratio of the coefficients of thermal expansion multiplied by the temperature change ratio is between 0.85 and 1.

15.

275. 273. The portable puck of claim 272, wherein the first component is a substrate chuck having a surface for supporting a substrate.

276. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow the first and second components to move toward each other; 272. The portable pack of claim 271, further comprising:

277. 277. A portable pack as described in claim 276, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

278. 277. A portable pack as described in claim 276, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

279. 277. A portable pack as described in claim 276, wherein the pressure differential cavity seal is a lip seal.

280. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; A portable pack as described in claim 276, wherein the component having the reduced pressure passage has a first valve that, when opened, allows air to escape from the pressure differential cavity and that, when closed, prevents air from entering the pressure differential cavity.

281. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; A portable pack as described in claim 280, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and, when closed, prevents air from escaping from the pressure differential cavity.

282. 272. A portable pack as described in claim 271, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

283. 272. The portable pack of claim 271, wherein a plurality of separated standoffs are disposed between the contact portions.

284. 272. A portable pack as described in claim 271, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to the lands and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

285. 285. A portable pack as described in claim 284, wherein the lands and the terminals lie in parallel planes.

286. 272. The portable pack of claim 271, wherein the substrate is a wafer having a plurality of microelectronic circuits thereon.

287. 272. A portable pack as described in claim 271, wherein the contact portions are pins, each pin having a spring that is pressed against the spring force when each contact portion is pressed by a respective terminal.

288. a portable support structure including first and second components for holding a substrate therebetween, the substrate having a microelectronic circuit thereon and a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the second component conforming to the terminals for making contact therewith, the components being movable relative to one another so that the contact portions can be resiliently pressed by the terminals to ensure proper contact between the contact portions and the terminals; a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive; a standoff attached to the second surface, the standoff having a surface that limits pressure on at least one of the contact portions; a first interface on the portable support structure and connected to the contact portion; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a second interface on the stationary structure that connects to the first interface when the portable structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, for testing the microelectronic circuit by transmitting signals between the electrical tester and the microelectronic circuit; A tester device comprising:

289. 289. The tester apparatus of claim 288, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

290. 290. The tester apparatus of claim 289, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

291. 290. The tester apparatus of claim 289, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

292. 290. The tester apparatus of claim 289, wherein the first component is a substrate chuck having a surface for supporting a substrate.

293. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow the first and second components to move toward each other; 289. The tester apparatus of claim 288, further comprising:

294. 294. The tester apparatus of claim 293, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

295. 300. The tester apparatus of claim 293, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

296. 294. The tester apparatus of claim 293, wherein the pressure differential cavity seal is a lip seal.

297. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 294. A tester apparatus as described in claim 293, wherein the component having the pressure reduction passage has a first valve that, when opened, allows air to escape from the pressure differential cavity and that, when closed, prevents air from entering the pressure differential cavity.

298. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 298. A tester apparatus as described in claim 297, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

299. 289. A tester apparatus as described in claim 288, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

300. 289. The tester apparatus of claim 288, wherein a plurality of separated standoffs are disposed between the contact portions.

301. 289. The tester apparatus of claim 288, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to the lands and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

302. 302. The tester apparatus of claim 301, wherein the lands and terminals lie in parallel planes.

303. 302. The tester apparatus of claim 301, wherein the fixed structure comprises a thermal chuck and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

304. 304. The tester apparatus of claim 303, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

305. 305. The tester apparatus of claim 304, further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

306. 289. A tester apparatus as described in claim 288, further comprising a thermal chuck on the fixed structure, the thermal chuck having a thermal control passage with an inlet and an outlet, with at least one section between the inlet and outlet for allowing fluid to flow from the inlet to the outlet, and heat being transferred through the thermal chuck between the substrate and the fluid in the thermal control passage.

307. 307. The tester apparatus of claim 306, wherein the thermal control passage has first, second, and third sections in series, one behind the other, along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

308. 308. The tester apparatus of claim 307, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the second and third sections.

309. 309. The tester apparatus of claim 308, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the first section and the second section.

310. 308. A tester apparatus as described in claim 307, wherein the first, second and third sections are sections of a first spiral.

311. 308. The tester apparatus of claim 307, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

312. 307. The tester apparatus of claim 306, further comprising a heater, wherein the heater transfers heat to the fluid when the fluid is outside the thermal control passage.

313. 313. The tester apparatus of claim 312, wherein the heater is an electric heater.

314. 313. The tester apparatus of claim 312, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

315. 315. The tester apparatus of claim 314, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

316. 313. The tester apparatus of claim 312, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

317. 313. The tester apparatus of claim 312, wherein the fluid is recirculated.

318. 289. A tester apparatus as described in claim 288, further comprising at least one interface actuator having first and second actuator segments operable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

319. 319. A tester apparatus as described in claim 318, wherein the first and second pieces are a cylinder and a piston, respectively, and the piston slides along the inner surface of the cylinder.

320. 289. The tester apparatus of claim 288, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

321. 289. The tester apparatus of claim 288, wherein the substrate is a wafer having a plurality of microelectronic circuits.

322. 289. A tester apparatus as described in claim 288, wherein the contact portions are pins, each pin having a spring that is pressed against the spring force when each contact portion is pressed by a respective terminal.

323. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: holding the substrate between a first component and a second component of a portable support structure, the second component having contacts for terminals of the substrate connected to the microelectronic circuitry; moving the first and second components relative to one another to resiliently press the contact portions against the terminals to ensure proper contact between the contact portions and the terminals; limiting the pressure of at least one contact portion with a surface of a standoff on the second component, the standoff being attached to the first component with a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, the standoff being attached to the second surface; receiving the portable support structure by a stationary structure such that a first interface of the portable support structure connects to a second interface of the stationary structure; testing the microelectronic circuit by transmitting signals between the electrical tester and the microelectronic circuit through the terminals, the contacts, and the first and second interfaces, with the substrate held between the first and second components of the portable support structure and the contacts on the second component; and Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and terminals; A method comprising:

324. 324. The method of claim 323, wherein the second component comprises a distribution board, the ratio of the thermal expansion coefficient of the distribution board to the thermal expansion coefficient of the first component being at least 1.

5.

325. 325. The method of claim 324, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of the microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

326. 325. The method of claim 324, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

327. 325. The method of claim 324, wherein the first component is a substrate chuck having a surface that supports a substrate.

328. disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by surfaces of the first and second components and the pressure differential cavity seal; reducing the pressure within the cavity of the pressure differential cavity seal to cause relative movement of the first and second components toward one another; 324. The method of claim 323, further comprising:

329. 329. The method of claim 328, wherein the pressure differential cavity seal surrounds the contact portion and terminal.

330. 329. The method of claim 328, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

331. 329. The method of claim 328, wherein the substrate cavity seal is formed with a lip seal.

332. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; The component having the pressure reducing passage includes a first valve, and further includes: opening the first valve to allow air to leave the pressure differential cavity; closing the first valve to prevent air from entering the pressure differential cavity; 329. The method of claim 328, comprising:

333. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve is provided in the component having the vacuum relief passage; the vacuum relief valve can be opened to admit air into the pressure differential cavity; closing the valve to prevent air from escaping from the pressure differential cavity; The method of claim 332.

334. 333. The method of claim 332, wherein pressure within the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

335. 324. The method of claim 323, further comprising pumping air through a substrate suction passage of the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

336. 324. The method of claim 323, wherein a plurality of separated standoffs are disposed between the contact portions.

337. positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; 324. The method of claim 323, further comprising:

338. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; The method of claim 337, further comprising:

339. 339. The method of claim 338, further comprising the step of reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

340. 340. The method of claim 339, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

341. 341. The method of claim 340, further comprising the step of: disposing a thermal interface cavity seal between the portable support structure and the thermal chuck; and defining a thermal interface cavity between the thermal interface cavity seal, the portable support structure, and the thermal chuck.

342. passing a fluid through at least one segment of a thermal control passage in a thermal chuck on the stationary structure from a fluid inlet to a fluid outlet; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; 324. The method of claim 323, further comprising:

343. 343. The method of claim 342, wherein the thermal control passage has first, second, and third sections in series, back and forth with one another along a fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

344. 344. The method of claim 343, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the second section and the third section.

345. 345. The method of claim 344, wherein the temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

346. 346. The method of claim 345, wherein the temperature difference between the first and fourth division fluids is greater than the temperature difference between the second and third division fluids.

347. 345. The method of claim 344, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the first section and the second section.

348. 344. The method of claim 343, wherein the first, second, and third sections are sections of a first spiral.

349. 344. The method of claim 343, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

350. 343. The method of claim 342, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

351. 351. The method of claim 350, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

352. 352. The method of claim 351, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

353. The method of claim 350, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

354. The method of claim 350, wherein the fluid is recirculated.

355. 324. The method of claim 323, wherein the test performed on the microelectronic circuit is a burn-in test.

356. 324. The method of claim 323, wherein the substrate is a wafer having a plurality of microelectronic circuits.

357. 324. The method of claim 323, wherein the contact portions are pins, each pin having a spring that is biased against its spring force when each contact portion is biased by a respective terminal.

358. 1. A thermal control device comprising: a thermal chuck having a thermal control passageway with an inlet and an outlet, the thermal control passageway having at least first, second, and third sections arranged in series one behind the other along a fluid path from the fluid inlet to the fluid outlet, the third section being positioned between the first and second sections in a cross-sectional plan view.

359. 359. The thermal control device of claim 358, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the second section and the third section.

360. 360. The thermal control device of claim 359, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the first section and the second section.

361. 359. The thermal control device of claim 358, wherein the first, second, and third sections are sections of a first spiral.

362. 359. The thermal control device of claim 358, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

363. a portable support structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; a first interface on the portable support structure and connected to the contact portion; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a second interface on the stationary structure that connects to the first interface when the portable structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and a thermal chuck on the stationary structure, the thermal chuck having an inlet, an outlet, and a thermal control passageway having at least first, second, and third sections arranged in series one behind the other along a fluid path from the fluid inlet to the fluid outlet, the third section being located between the first and second sections in a cross-sectional plan view, and heat being transferred through the thermal chuck between the substrate and the fluid in the thermal control passageway; an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, for testing the microelectronic circuit by transmitting signals between the electrical tester and the microelectronic circuit; A tester device comprising:

364. 364. The tester apparatus of claim 363, wherein the portable support structure includes first and second components for holding a substrate therebetween, the contact portions being positioned on the second component, and the components being movable relative to one another to ensure proper contact between the contact portions and terminals.

365. 365. The tester apparatus of claim 364, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

366. 366. The tester apparatus of claim 365, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

367. 366. The tester apparatus of claim 365, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

368. 366. The tester apparatus of claim 365, wherein the first component is a substrate chuck having a surface for supporting a substrate.

369. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow relative movement of the first and second components toward one another; 365. The tester apparatus of claim 364, further comprising:

370. 370. The tester apparatus of claim 369, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

371. 370. The tester apparatus of claim 369, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

372. 370. The tester apparatus of claim 369, wherein the pressure differential cavity seal is a lip seal.

373. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 370. A tester apparatus as described in claim 369, wherein the component having the pressure reduction passage has a first valve that, when opened, allows air to escape from the pressure differential cavity and, when closed, prevents air from entering the pressure differential cavity.

374. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 374. A tester apparatus as described in claim 373, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

375. 365. A tester apparatus as described in claim 364, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

376. The contact portion can be elastically pressed by the terminal, and further 365. A tester apparatus as described in claim 364, further comprising a standoff on the second component, the standoff having a surface that limits compression of the at least one contact portion.

377. 377. The tester apparatus of claim 376, wherein a plurality of separated standoffs are disposed between the contact portions.

378. 377. A tester apparatus as described in claim 376, further comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, the standoff being attached to the second surface.

379. 364. The tester apparatus of claim 363, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to the lands and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

380. 380. A tester apparatus as described in claim 379, wherein the lands and terminals lie in parallel planes.

381. 380. The tester apparatus of claim 379, wherein the fixed structure comprises a thermal chuck and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

382. 382. The tester apparatus of claim 381, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

383. 383. The tester apparatus of claim 382, ​​further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

384. 364. The tester apparatus of claim 363, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the second and third sections.

385. 385. A tester apparatus as described in claim 384, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the first section and the second section.

386. 364. A tester apparatus as described in claim 363, wherein the first, second and third sections are sections of a first spiral.

387. 364. The tester apparatus of claim 363, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

388. 364. The tester apparatus of claim 363, further comprising a heater, wherein the heater transfers heat to the fluid when the fluid is outside the thermal control passage.

389. 389. The tester apparatus of claim 388, wherein the heater is an electric heater.

390. 389. The tester apparatus of claim 388, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

391. 391. The tester apparatus of claim 390, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet at above 21°C.

392. 389. The tester apparatus of claim 388, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

393. 389. The tester apparatus of claim 388, wherein the fluid is recirculated.

394. 364. The tester apparatus of claim 363, further comprising at least one interface actuator having first and second actuator segments operable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

395. 395. A tester apparatus as described in claim 394, wherein the first and second pieces are a cylinder and a piston, respectively, and the piston slides along the inner surface of the cylinder.

396. 364. The tester apparatus of claim 363, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

397. 364. The tester apparatus of claim 363, wherein the substrate is a wafer having a plurality of microelectronic circuits.

398. 364. A tester apparatus as described in claim 363, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when each contact portion is biased by a respective terminal.

399. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: holding the substrate on a portable support structure having contacts for terminals of the substrate connected to the microelectronic circuit; receiving the portable support structure by a stationary structure such that a first interface of the portable support structure connects to a second interface of the stationary structure; passing a fluid through a thermal control passage in a thermal chuck of the stationary structure from a fluid inlet to a fluid outlet, the thermal control passage comprising at least first, second and third sections in series behind one another along a fluid path, the third section being located between the first and second sections in a cross-sectional plan view; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contact portions, and first and second interfaces to test the microelectronic circuit; A method comprising:

400. the substrate is held between a first component and a second component of the portable support structure, and the contact portion is on the second component; and Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and terminals; 399. The method of claim 399, comprising:

401. 401. The method of claim 400, wherein the second component comprises a distribution board, the ratio of the thermal expansion coefficient of the distribution board to the thermal expansion coefficient of the first component being at least 1.

5.

402. 402. The method of claim 401, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of the microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

403. 402. The method of claim 401, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

404. 402. The method of claim 401, wherein the first component is a substrate chuck having a surface that supports a substrate.

405. disposing a pressure differential cavity seal between the first and second components to form a cavity enclosed by surfaces of the first and second components and the pressure differential cavity seal; reducing the pressure within the cavity of the pressure differential cavity seal to cause relative movement of the first and second components toward one another; 401. The method of claim 400, further comprising:

406. 406. The method of claim 405, wherein the pressure differential cavity seal surrounds the contact portion and terminal.

407. 406. The method of claim 405, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

408. 406. The method of claim 405, wherein the substrate cavity seal is formed with a lip seal.

409. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; The component having the pressure reducing passage includes a first valve, and further includes: opening the first valve to allow air to leave the pressure differential cavity; closing the first valve to prevent air from entering the pressure differential cavity; The method of claim 405, comprising:

410. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve is provided in the component having the vacuum relief passage; the vacuum relief valve can be opened to admit air into the pressure differential cavity; closing the valve to prevent air from escaping from the pressure differential cavity; 410. The method of claim 409, comprising:

411. 410. The method of claim 409, wherein pressure within the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

412. 401. The method of claim 400, further comprising pumping air through a substrate suction passage of the first component to reduce pressure on a side of the substrate facing the first component and hold the substrate against the first component.

413. The contact portion can be elastically pressed by the terminal, and further 401. The method of claim 400, comprising limiting pressure of at least one contact portion with a surface of the standoff of the second component.

414. 414. The method of claim 413, wherein a plurality of separated standoffs are disposed between the contact portions.

415. 414. The method of claim 413, comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

416. positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; 399. The method of claim 399, further comprising:

417. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; 417. The method of claim 416, further comprising:

418. 418. The method of claim 417, further comprising the step of reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

419. 419. The method of claim 418, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

420. 420. The method of claim 419, further comprising the step of: disposing a thermal interface cavity seal between the portable support structure and the thermal chuck, and defining a thermal interface cavity between the thermal interface cavity seal, the portable support structure and the thermal chuck.

421. 399. The method of claim 399, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the second section and the third section.

422. 422. The method of claim 421, wherein the temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

423. 423. The method of claim 422, wherein the temperature difference between the first and fourth division fluids is greater than the temperature difference between the second and third division fluids.

424. 422. The method of claim 421, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the first and second sections.

425. 399. The method of claim 399, wherein the first, second, and third sections are sections of a first spiral.

426. 399. The method of claim 399, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

427. 399. The method of claim 399, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

428. 428. The method of claim 427, wherein heat is transferred from the substrate to a fluid entering the fluid inlet above 21°C.

429. 429. The method of claim 428, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

430. The method of claim 427, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

431. The method of claim 427, wherein the fluid is recirculated.

432. 400. The method of claim 399, wherein the test performed on the microelectronic circuit is a burn-in test.

433. 399. The method of claim 399, wherein the substrate is a wafer having a plurality of microelectronic circuits.

434. 400. Method according to claim 399, wherein the contact portions are pins, each pin having a spring that is pressed against the spring force when each contact portion is pressed by a respective terminal.

435. a portable support structure for holding a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contact portions on the portable support structure that mate with the terminals for making contact with the terminals; a first interface on the portable support structure and connected to the contact portion; a fixed structure, the portable support structure being receivable for retention by the fixed structure and removable therefrom; a second interface on the stationary structure that connects to the first interface when the portable structure is held by the stationary structure and that disconnects from the first interface when the portable support structure is removed from the stationary structure; and a heater that transfers heat to the fluid when the fluid is outside the thermal control passage; a thermal chuck on the stationary structure having a thermal control passageway with an inlet, an outlet, and at least one segment between the inlet and the outlet for flowing a fluid from the inlet to the outlet, the thermal chuck transferring heat between the substrate and the fluid in the thermal control passageway through the thermal chuck; an electrical tester connected to the terminal through the second interface, the first interface, and the contact portion, the electrical tester transmitting signals between the electrical tester and a microelectronic circuit to test the microelectronic circuit; A tester device comprising:

436. 436. A tester apparatus as described in claim 435, wherein the portable support structure includes first and second components for holding a substrate therebetween, the contact portions being positioned on the second component, and the components being movable relative to one another to ensure proper contact between the contact portions and terminals.

437. 437. The tester apparatus of claim 436, wherein the second component comprises a distribution board, the ratio of the coefficient of thermal expansion of the distribution board to the coefficient of thermal expansion of the first component being at least 1.

5.

438. 438. The tester apparatus of claim 437, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of a microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

439. 438. The tester apparatus of claim 437, wherein the ratio of the thermal expansion coefficients multiplied by the temperature change ratio is between 0.85 and 1.

15.

440. 438. The tester apparatus of claim 437, wherein the first component is a substrate chuck having a surface for supporting a substrate.

441. a pressure differential cavity seal between the first and second components, forming a pressure differential cavity enclosed by surfaces of the first and second components; a vacuum passage within the pressure differential cavity for removing air from the pressure differential cavity to allow relative movement of the first and second components toward one another; 437. The tester apparatus of claim 436, further comprising:

442. 442. The tester apparatus of claim 441, wherein the pressure differential cavity seal surrounds the contact portion and the terminal.

443. 442. The tester apparatus of claim 441, wherein the pressure differential cavity seal is secured to the first component when the first and second components are separated.

444. 442. The tester apparatus of claim 441, wherein the pressure differential cavity seal is a lip seal.

445. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; A tester apparatus as described in claim 441, wherein the component having the pressure reduction passage has a first valve that, when opened, allows air to escape from the pressure differential cavity and, when closed, prevents air from entering the pressure differential cavity.

446. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; 446. A tester apparatus as described in claim 445, wherein the component having the vacuum release passage has a second vacuum release valve that, when opened, allows air to enter the pressure differential cavity and that, when closed, prevents air from escaping from the pressure differential cavity.

447. 437. A tester apparatus as described in claim 436, further comprising a substrate suction passage in the first component through which air can be pumped to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

448. The contact portion can be elastically pressed by the terminal, and further 437. A tester apparatus as described in claim 436, further comprising a standoff on the second component, the standoff having a surface that limits the pressure on the at least one contact portion.

449. 449. The tester apparatus of claim 448, wherein a plurality of separated standoffs are disposed between the contact portions.

450. 449. A tester apparatus as described in claim 448, further comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

451. 436. A tester apparatus as described in claim 435, wherein the first interface includes a plurality of lands, and the second interface includes a plurality of members having contact surfaces that conform to the lands and can be resiliently pressed by the lands so as to be movable relative to a structural portion of the fixed structure.

452. 452. A tester apparatus as described in claim 451, wherein the lands and terminals lie in parallel planes.

453. 452. The tester apparatus of claim 451, wherein the fixed structure comprises a thermal chuck and the portable support structure contacts the thermal chuck to enable heat transfer between the portable support structure and the thermal chuck.

454. 454. The tester apparatus of claim 453, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to a thermal interface vacuum.

455. 455. The tester apparatus of claim 454, further comprising a thermal interface cavity seal in contact with both the portable support structure and the thermal chuck, the thermal interface cavity seal defining a thermal interface cavity with the portable support structure and the thermal chuck.

456. 436. A tester apparatus as described in claim 435, wherein the thermal control passage has first, second and third sections in series, back and forth with one another along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

457. 457. A tester apparatus as described in claim 456, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the second and third sections.

458. 458. A tester apparatus as described in claim 457, wherein the thermal control passage has a fourth section in series following a third section along the fluid path, the fourth section being located between the first section and the second section.

459. 457. A tester apparatus as described in claim 456, wherein the first, second and third sections are sections of a first spiral.

460. 457. A tester apparatus as described in claim 456, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

461. 436. The tester apparatus of claim 435, further comprising a heater, wherein the heater transfers heat to the fluid when the fluid is outside the thermal control passage.

462. 462. The tester apparatus of claim 461, wherein the heater is an electric heater.

463. 462. The tester apparatus of claim 461, wherein heat is transferred from the substrate to the fluid entering the fluid inlet above 21°C.

464. 464. The tester apparatus of claim 463, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

465. 462. The tester device of claim 461, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

466. 462. The tester apparatus of claim 461, wherein the fluid is recirculated.

467. 436. A tester apparatus as described in claim 435, further comprising at least one interface actuator having first and second actuator segments operable relative to one another to move the portable support structure relative to the fixed structure and engage the first interface with the second interface.

468. 468. A tester apparatus as described in claim 467, wherein the first and second pieces are a cylinder and a piston, respectively, and the piston slides along the inner surface of the cylinder.

469. 436. The tester apparatus of claim 435, wherein the test performed on the microelectronic circuit by the tester is a burn-in test.

470. 436. The tester apparatus of claim 435, wherein the substrate is a wafer having a plurality of microelectronic circuits.

471. 436. A tester apparatus as described in claim 435, wherein the contact portions are pins, each pin having a spring that is biased against the spring force when each contact portion is biased by a respective terminal.

472. 1. A method of testing a microelectronic circuit carried by a substrate, comprising: holding the substrate on a portable support structure having contacts for terminals of the substrate connected to the microelectronic circuit; receiving the portable support structure by a stationary structure such that a first interface of the portable support structure connects to a second interface of the stationary structure; passing a fluid through at least one segment of a thermal control passage in a thermal chuck of the stationary structure from a fluid inlet to a fluid outlet, the temperature of the fluid being greater than 21° C. when the fluid enters the fluid inlet; transferring heat between the fluid in the thermal control passage and the substrate to control the temperature of the substrate; transmitting signals between an electrical tester and the microelectronic circuit through the terminals, contact portions, and first and second interfaces to test the microelectronic circuit; A method comprising:

473. the substrate is held between a first component and a second component of the portable support structure, the contact portion being on the second component; and Relatively moving the first and second components toward each other to ensure proper contact between the contact portions and terminals; The method of claim 472, comprising:

474. 474. The method of claim 473, wherein the second component comprises a distribution board, the ratio of the thermal expansion coefficient of the distribution board to the thermal expansion coefficient of the first component being at least 1.

5.

475. 475. The method of claim 474, wherein the substrate heats from a first substrate temperature to a second substrate temperature during testing of the microelectronic circuit, the distribution board heats from a first distribution board temperature to a second distribution board temperature, and a temperature change ratio between the difference between the second distribution board temperature and the first distribution board temperature and the difference between the second substrate temperature and the first substrate temperature is at least 1.

5.

476. The method of claim 474, wherein the thermal expansion coefficient ratio multiplied by the temperature change ratio is between 0.85 and 1.

15.

477. 475. The method of claim 474, wherein the first component is a substrate chuck having a surface that supports a substrate.

478. forming a seal between the first and second components to form a cavity enclosed by the surfaces of the first and second components and the seal; reducing the pressure within the enclosed cavity to cause relative movement of the first and second components toward one another; The method of claim 473, further comprising:

479. 479. The method of claim 478, wherein the pressure differential cavity seal surrounds the contact portion and terminal.

480. 479. The method of claim 478, wherein the pressure differential cavity seal is fixed to the first component when the first and second components are separated.

481. 479. The method of claim 478, wherein the substrate cavity seal is formed with a lip seal.

482. a pressure reduction passageway formed through one of the components, the pressure reduction passageway having an inlet opening in the pressure differential cavity and an outlet opening outside the pressure differential cavity; The component having the pressure reducing passage includes a first valve, and further includes: opening the first valve to allow air to leave the pressure differential cavity; closing the first valve to prevent air from entering the pressure differential cavity; The method of claim 478, comprising:

483. the first valve is a check valve, and a vacuum relief passage is formed through the component having the check valve, the vacuum relief passage having an inlet opening into the pressure differential cavity and an outlet opening outside the pressure differential cavity; a second vacuum relief valve is provided in the component having the vacuum relief passage; the vacuum relief valve can be opened to admit air into the pressure differential cavity; closing the valve to prevent air from escaping from the pressure differential cavity; The method of claim 482, comprising:

484. 483. The method of claim 482, wherein pressure within the pressure differential cavity is generated before the portable support structure is received by the fixed structure.

485. 474. The method of claim 473, further comprising pumping air through a substrate suction passage of the first component to reduce pressure on the side of the substrate facing the first component and hold the substrate against the first component.

486. The contact portion can be elastically pressed by the terminal, and further 474. The method of claim 473, comprising limiting the pressure of at least one contact portion with a surface of the standoff of the second component.

487. 487. The method of claim 486, wherein a plurality of separated standoffs are disposed between the contact portions.

488. 487. The method of claim 486, comprising a layer having a first surface that is adhesive and attached to the second component, and a second opposing surface that is adhesive, and the standoff is attached to the second surface.

489. positioning lands of a first interface of the portable support structure against a plurality of corresponding members of a second interface of the stationary structure; elastically pressing the member with the land; The method of claim 472, further comprising:

490. placing a surface of the portable support structure against a surface of a thermal chuck of the stationary structure; transferring heat through the surfaces; The method of claim 489, further comprising:

491. 491. The method of claim 490, further comprising the step of reducing air pressure in a thermal interface cavity defined between a surface of the portable support structure and the thermal chuck.

492. 492. The method of claim 491, wherein a thermal interface cavity is defined between the portable support structure and the thermal chuck, and a thermal interface vacuum passage is formed through the thermal chuck to the thermal interface vacuum.

493. 493. The method of claim 492, further comprising the step of: disposing a thermal interface cavity seal between the portable support structure and the thermal chuck; and defining a thermal interface cavity between the thermal interface cavity seal, the portable support structure, and the thermal chuck.

494. 473. The method of claim 472, wherein the thermal control passage has first, second, and third sections in series, back and forth with each other along the fluid path, with the third section positioned between the first and second sections in a cross-sectional plan view.

495. 495. The method of claim 494, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the second and third sections.

496. 496. The method of claim 495, wherein the temperature of the thermal chuck between the second and third sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section, and the temperature of the thermal chuck between the first and fourth sections is from the temperature of the fluid in the first section to the temperature of the fluid in the second section.

497. 497. The method of claim 496, wherein the temperature difference between the first and fourth division fluids is greater than the temperature difference between the second and third division fluids.

498. 496. The method of claim 495, wherein the thermal control passage has a fourth section in series after the third section along the fluid path, the fourth section being positioned between the first and second sections.

499. 495. The method of claim 494, wherein the first, second, and third sections are sections of a first spiral.

500. 495. The method of claim 494, wherein the first and second sections are sections of a first spiral, and the third section is a section of a second spiral that is not located on the first spiral.

501. The method of claim 472, wherein the temperature of the fluid is greater than 21°C when the fluid enters the fluid inlet.

502. 502. The method of claim 501, wherein heat is transferred from the substrate to a fluid entering the fluid inlet above 21°C.

503. 503. The method of claim 502, wherein heat is initially transferred from the fluid to the substrate after the fluid enters the fluid inlet above 21°C.

504. 502. The method of claim 501, wherein the temperature of the fluid is greater than 100°C when the fluid enters the fluid inlet.

505. The method of claim 501, wherein the fluid is recirculated.

506. 473. The method of claim 472, wherein the test performed on the microelectronic circuit is a burn-in test.

507. 473. The method of claim 472, wherein the substrate is a wafer having a plurality of microelectronic circuits.

508. 473. The method of claim 472, wherein the contact portions are pins, each pin having a spring that is pressed against its spring force when each contact portion is pressed by a respective terminal.

509. A tester apparatus comprising: an electrical tester connected through contact portions to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having terminals connected to the integrated circuit; current being conducted between the electrical tester and the integrated circuit to test the integrated circuit; the electrical tester including a plurality of n+1 power supply circuits connected in parallel with each other, wherein power is supplied to the integrated circuit by these n+1 power supply circuits, and wherein even if one of the power supply circuits fails, power is still supplied to the integrated circuit by the n power supply circuits.

510. Further comprising a current sharing circuit, (i) detecting a decrease in power of at least one power supply circuit among the n+1 power supply circuits; (ii) switching off a connection from one of the n+1 power supply circuits to eliminate current from one of the n+1 power supply circuits, so that the current is shared by the n power supply circuits; 510. The tester device of claim 509.

511. 511. The tester apparatus of claim 510, wherein the current sharing circuitry comprises a plurality of fault detection circuits, each for detecting power loss from a respective one of the power supply circuits.

512. 510. A tester apparatus as described in claim 509, further comprising a power supply control circuit powered by at least one of the plurality of power supply circuits, the power supply control circuit switching the power supply circuit between a test mode powered by a first number of the plurality of power supply circuits and a power saving mode powered by a second number of power supply circuits less than the first number.

513. 510. The tester apparatus of claim 509, further comprising a signal electronic device for providing a signal to the integrated circuit.

514. a support structure for holding at least one substrate; a plurality of contact portions conforming to the terminals for contacting the terminals; 510. The tester apparatus of claim 509, comprising: an electrical tester connected to the terminal through the contact portion, and current is conducted between the electrical tester and the integrated circuit to test the integrated circuit.

515. 1. A method of testing at least one circuit carried by at least one substrate, comprising: placing contact portions against terminals of the substrate connected to the integrated circuit; testing the integrated circuit by conducting current between the electrical tester and the integrated circuit through the terminals and contacts, supplying power through a plurality of n+1 power supply circuits connected in parallel with each other, such that power is supplied to the integrated circuits of at least one board by the n+1 power supply circuits, and even if one of the power supply circuits fails, current is still supplied to the integrated circuits by the n power supply circuits; A method comprising:

516. detecting a decrease in power of at least one of the n+1 power supplies; switching off a connection from one of the n+1 power supplies to eliminate current from one of the n+1 power supplies, causing the current to be shared by the n power supply circuits; The method of claim 515, further comprising:

517. 516. The method of claim 515, further comprising detecting power loss from each of the power supply circuits with a separate fault detection circuit.

518. supplying power from at least one of the plurality of power supply circuits to a power supply control circuit; using the power supply control circuit to switch between a test mode in which power is supplied by a first number of the plurality of power supply circuits and a power save mode in which power is supplied by a second number of power supply circuits, the second number being less than the first number; The method of claim 515, further comprising:

519. 516. The method of claim 515, further comprising the step of providing a signal to the integrated circuit.

520. an electrical tester connected through contact portions to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having terminals connected to the integrated circuit, wherein current is conducted between the electrical tester and the integrated circuit to test the integrated circuit, and further wherein the electrical tester includes a plurality of power supply circuits connected to the contact portions and supplies power through the plurality of power supply circuits connected to the contact portions; a power supply control circuit energized by at least one of the plurality of power supply circuits, the power supply control circuit switching the power supply circuit between a test mode in which power is supplied by a first number of the plurality of power supply circuits and a power saving mode in which power is supplied by a second number of power supply circuits that is smaller than the first number; A tester device comprising:

521. 521. A tester apparatus as described in claim 520, wherein there are a plurality of n+1 power supply circuits connected in parallel with each other, the n+1 power supply circuits supplying power to the integrated circuit, and even if one of the power supply circuits fails, the n power supply circuits still supply power to the integrated circuit.

522. Further comprising a current sharing circuit, (i) detecting a decrease in power of at least one power supply circuit among the n+1 power supply circuits; (ii) switching off a connection from one of the n+1 power supply circuits to eliminate current from one of the n+1 power supply circuits, so that the current is shared by the n power supply circuits; 522. The tester device of claim 521.

523. 523. The tester apparatus of claim 522, wherein the current sharing circuitry comprises a plurality of fault detection circuits, each for detecting power loss from a respective one of the power supply circuits.

524. 521. The tester apparatus of claim 520, further comprising a signal electronic device for providing a signal to the integrated circuit.

525. a support structure for holding at least one substrate; a plurality of contact portions conforming to the terminals for contacting the terminals; 521. The tester apparatus of claim 520, comprising: an electrical tester connected to the terminals through the contact portions to conduct current between the electrical tester and an integrated circuit for testing the integrated circuit.

526. 1. A method of testing at least one circuit carried by at least one substrate, comprising: placing contact portions against terminals of the substrate connected to the integrated circuit; testing the integrated circuit by conducting current between the electrical tester and the integrated circuit through the terminals and contact portions, the electrical tester supplying power through a power supply circuit connected to the contact portions; switching the power supply circuits between a test mode in which power is supplied by a first number of the plurality of power supply circuits and a power save mode in which power is supplied by a second number of power supply circuits, the second number being less than the first number; A method comprising:

527. 527. The method of claim 526, wherein there are a plurality of n+1 power supply circuits connected in parallel with each other, the n+1 power supply circuits supplying power to integrated circuits on at least one substrate, and wherein if one of the power supply circuits fails, the n power supply circuits still supply current to the integrated circuits.

528. detecting a decrease in power of at least one of the n+1 power supplies; switching off a connection from one of the n+1 power supplies to eliminate current from one of the n+1 power supplies, causing the current to be shared by the n power supply circuits; 528. The method of claim 527, further comprising:

529. 529. The method of claim 528, further comprising detecting power loss from each of the power supply circuits with a separate fault detection circuit.

530. 527. The method of claim 526, further comprising the step of providing a signal to the integrated circuit.

531. A tester apparatus comprising: an electrical tester connected through contact portions to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having terminals connected to the integrated circuit, wherein current is conducted between the electrical tester and the integrated circuit to test the integrated circuit; the electrical tester further includes a power supply circuit connected to the contact portions, and power is supplied through the power supply circuit connected to the contact portions, the power supply circuit having a current configuration circuit configurable to perform current switching between a first configuration in which individual currents of different magnitudes are supplied to individual channels, and a second configuration in which the currents to the individual channels follow a common reference.

532. The current configuration circuit includes a plurality of output currents, each of which has an output current according to a respective standard when the current configuration circuit is in the first configuration.

532. The tester apparatus of claim 531, comprising a current amplifier.

533. 532. The tester apparatus of claim 531, further comprising a current amplifier for amplifying current to each individual channel.

534. 532. The tester apparatus of claim 531, further comprising a signal electronic device for providing a signal to the integrated circuit.

535. a support structure for holding at least one substrate; a plurality of contact portions conforming to the terminals for contacting the terminals; 532. The tester apparatus of claim 531, comprising: an electrical tester connected to the terminals through the contact portions, such that current flows between the electrical tester and the integrated circuit to test the integrated circuit.

536. 1. A method of testing at least one circuit carried by at least one substrate, comprising: placing contact portions against terminals of the substrate connected to the integrated circuit; conducting an electrical current between an electrical tester and the integrated circuit through the terminals and contact portions to test the integrated circuit; switching between a first configuration in which individual currents of different magnitudes are supplied to the individual channels and a second configuration in which the currents to the individual channels follow a common reference; A method comprising:

537. 537. The method of claim 536, wherein the current configuration circuit comprises a plurality of current amplifiers, each having an output current according to a respective standard when the current configuration circuit is in the first configuration.

538. 537. The method of claim 536, further comprising the step of amplifying the current to the individual channels.

539. 537. The method of claim 536, further comprising the step of providing a signal to the integrated circuit.

540. A tester apparatus comprising: an electrical tester connected through contact portions to a plurality of terminals of at least one substrate carrying at least one integrated circuit and having terminals connected to the integrated circuit; current being conducted between the electrical tester and the integrated circuit to test the integrated circuit; the electrical tester further comprising a power supply circuit connected to the contact portions, and power is supplied through the power supply circuit connected to the contact portions, the power supply circuit having a current amplifier for amplifying current to each channel.

541. 541. The tester apparatus of claim 540, further comprising a current configuration circuit configurable to perform current switching between a first configuration in which individual currents of different magnitudes are supplied to individual channels and a second configuration in which the currents to the individual channels follow a common reference.

542. 542. The tester apparatus of claim 541, wherein the current configuration circuitry includes a plurality of current amplifiers, each having an output current according to a respective standard when the current configuration circuitry is in the first configuration.

543. 541. The method of claim 540, further comprising a signal electronic device for providing a signal to the integrated circuit. The tester device described herein.

544. a support structure for holding at least one substrate; a plurality of contact portions conforming to the terminals for contacting the terminals; 541. The tester apparatus of claim 540, comprising: an electrical tester connected to the terminal through the contact portion, such that current flows between the electrical tester and the integrated circuit to test the integrated circuit.

545. 1. A method of testing at least one circuit carried by at least one substrate, comprising: placing contact portions against terminals of the substrate connected to the integrated circuit; amplifying the current to the individual channels; conducting an electrical current between an electrical tester and the integrated circuit through the terminals and contact portions to test the integrated circuit; A method comprising:

546. 546. The method of claim 545, further comprising the step of switching with a current configuration circuit between a first configuration in which individual currents of different magnitudes are supplied to individual channels and a second configuration in which the currents to the individual channels follow a common reference.

547. 547. The method of claim 546, wherein the current configuration circuit comprises a plurality of current amplifiers, each having an output current according to a respective standard when the current configuration circuit is in the first configuration.

548. 546. The method of claim 545, further comprising the step of providing a signal to the integrated circuit.

Images