Heat conduction member, heat radiation unit, electronic apparatus, and assembly method for heat conduction member

Abstract

To provide a heat conduction member that is easy to manufacture, heat radiation unit, electronic apparatus, and assembly method for a heat conduction member.SOLUTION: The heat conduction member includes a first heat transfer member, a second heat transfer member disposed apart from the first heat transfer member, a membrane-like member formed of a flexible material, with one end joined to the first heat transfer member and the other end joined to the second heat transfer member, forming a sealed space between the first heat transfer member and the second heat transfer member, and a filler filled into the sealed space within the membrane-like member. The filler includes a first filler made of liquid metal, and a second filler in a liquid form made of a material different from the first filler and separated from the first filler.SELECTED DRAWING: Figure 29

Description

[Technical Field]

[0001] The present disclosure relates to a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member. [Background technology]

[0002] It is known to dissipate heat generated by electronic components to the outside via heat dissipation components such as heat sinks, heat dissipation fins, heat pipes, etc. In such cases, a thermally conductive material called a TIM (Thermal Interface Material) is sometimes placed between the electronic component and the heat dissipation component to improve thermal conductivity between them.

[0003] For example, Patent Document 1 discloses a configuration in which a thermally conductive gel pack is disposed between an electronic component and a heat dissipation member. In this configuration, the thermally conductive gel pack is encapsulated in a package having a first layer including a polymer film or thermal tape and a second layer including a polymer film. The thermally conductive polymer gel contains conductive fillers of precious and non-precious metals such as nickel, copper, tin, aluminum, and nickel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Utility Model Registration No. 3191158 Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration described in Patent Document 1, the conductive filler used in the heat conducting member, such as a heat conducting polymer gel, is expensive, so it may be difficult to manufacture the heat conducting member.

[0006] An object of the present disclosure is to provide a heat conduction member, a heat dissipation unit, an electronic device, and a method for assembling a heat conduction member that solves the above-mentioned problems. [Means for solving the problem]

[0007] A thermal conduction member according to one aspect of the present disclosure comprises a first heat transfer member, a second heat transfer member spaced apart from the first heat transfer member, a film-like member formed from a flexible film-like material, one first end joined to the first heat transfer member and the other second end joined to the second heat transfer member, and forming an enclosed space between the first heat transfer member and the second heat transfer member, and a filler material filled in the enclosed space within the film-like member, wherein the filler material includes a first filler material made of liquid metal and a second filler material made of a material different from the first filler material and in a liquid state separated from the first filler material.

[0008] A method for assembling a heat conduction member according to one aspect of the present disclosure includes the steps of joining a first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining the other second end to a second heat transfer member spaced apart from the first heat transfer member to form an enclosed space within the film-like member between the first heat transfer member and the second heat transfer member, and filling the enclosed space with a filler including a first filler made of a liquid metal and a second filler made of a material different from the first filler and in a liquid state separated from the first filler, wherein the step of filling the enclosed space with the filler includes the steps of: evacuating the enclosed space, and then filling the enclosed space with the second filler; and filling the enclosed space with the first filler.

[0009] A method for assembling a heat conduction member according to one aspect of the present disclosure includes the steps of: cooling a first filler made of liquid metal to a temperature below the solidus temperature of the first filler to solidify the first filler; placing the first filler in the solid state on one heat transfer member, and then placing another heat transfer member on the first filler; joining a first end of one film-like member formed from a flexible film-like material to one of the heat transfer members and a second end of the other film-like member to the other heat transfer member to form an enclosed space within the film-like member between the one heat transfer member and the other heat transfer member; evacuating the enclosed space, and then filling the enclosed space with a liquid second filler made of a material different from the first filler and separate from the first filler; and liquefying the first filler in a temperature environment higher than the solidus temperature of the first filler. [Effects of the Invention]

[0010] According to the above aspect, the thermal conduction member can be easily manufactured. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view illustrating an example of an electronic device including a thermally conductive member according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view illustrating an example of a heat conduction member according to the present disclosure. [Figure 3] FIG. 2 is a view of the heat conduction member of the present disclosure as viewed from the first heat transfer member side. [Figure 4] 1 is a cross-sectional view showing a state in which a heat dissipation member is close to a heat-generating member in a heat conduction member according to the present disclosure. [Figure 5] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. [Figure 6] 10 is a cross-sectional view showing a state in which a sealed space is formed in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 7] 10 is a cross-sectional view showing a state in which a vacuum is drawn in the sealed space in the method for assembling a heat conduction member according to the present disclosure. FIG. [Figure 8] 10 is a cross-sectional view showing a state in which a second filler material is filled into a sealed space in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 9] 10 is a cross-sectional view showing a state in which a first filler material is filled into a sealed space in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 10] 10A to 10C are diagrams illustrating the flow of an assembly method of a heat conduction member according to a modified example of an embodiment of the present disclosure. [Figure 11] 10 is a cross-sectional view showing a state in which a first filler in a solid state is placed on a second heat transfer member in the method of assembling a heat conduction member of the present disclosure. FIG. [Figure 12] 10 is a cross-sectional view showing a state in which a first heat transfer member and a second heat transfer member are connected via a film-like member in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 13] 10 is a cross-sectional view showing a state in which a vacuum is drawn in the sealed space in the method for assembling a heat conduction member according to the present disclosure. FIG. [Figure 14] 10 is a cross-sectional view showing a state in which a second filler material is filled into a sealed space in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 15] 10 is a cross-sectional view showing a state in which the first filler in the sealed space is in a liquid state in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 16] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 17] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 18] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 19] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 20] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 21] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 22] 10 is a cross-sectional view showing a state in which a sealed space is formed in the method of assembling a heat conduction member according to the present disclosure. FIG. [Figure 23] 10 is a cross-sectional view showing a state in which a vacuum is drawn in the sealed space in the method for assembling a heat conduction member according to the present disclosure. FIG. [Figure 24] 10 is a cross-sectional view showing a state in which a second filler material is filled into a sealed space in the method of assembling a thermal conduction member according to the present disclosure. FIG. [Figure 25] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 26] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 27] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 28] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 29] FIG. 2 is a cross-sectional view showing a heat conduction member of the present disclosure. [Figure 30] FIG. 2 is a cross-sectional view showing a heat dissipation unit of the present disclosure. [Figure 31] FIG. 1 is a cross-sectional view showing an electronic device according to the present disclosure. [Figure 32] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. [Figure 33] 1A to 1C are diagrams showing the flow of an assembly method for a heat conduction member according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Each embodiment will be described below with reference to the drawings. In all drawings, the same or corresponding components are designated by the same reference numerals, and common descriptions will be omitted. It should be noted that in this disclosure, the drawings may relate to one or more embodiments.

[0013] First Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of an electronic device 200 including a heat conducting member 100A according to the present disclosure. As shown in FIG. 1, an electronic device 200 according to the present disclosure includes a substrate 220 on which a heat-generating component 210 is mounted, and a heat dissipation unit 300. The heat-generating component 210 generates heat during operation. Examples of the heat-generating component 210 include an IC (Integrated Circuit) and an inverter. The heat-generating component 210 is mounted on a substrate 220 having a circuit section with a predetermined pattern. One surface of the heat-generating component 210 faces the substrate 220.

[0014] The heat dissipation unit 300 dissipates heat generated by the heat-generating component 210 to the outside. The heat dissipation unit 300 includes a heat dissipation member 310 and a heat conduction member 100A. Heat dissipation member 310 dissipates the heat transmitted from heat-generating component 210 via heat conduction member 100A to the outside. The heat dissipation member 310 dissipates heat from the heat-generating component 210 into the surrounding atmosphere. The heat dissipation member 310 is made of, for example, metal. However, materials other than metal may also be used for the heat dissipation member 310. The heat dissipation member 310 may be made of, for example, graphite or CFRP (Carbon Fiber Reinforced Plastic). The heat dissipation member 310 may be, for example, a heat sink, a heat dissipation fin, a heat pipe, or the like. The heat dissipation member 310 may be, for example, a heat sink having a plurality of heat dissipation fins 311 .

[0015] 2 is a cross-sectional view showing an example of a heat transfer member 100A according to the present disclosure. As shown in FIGS. 1 and 2, the heat transfer member 100A includes a first heat transfer member 10, a second heat transfer member 20, a film member 30A, and a filler 40.

[0016] The first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. Each of the first heat transfer member 10 and the second heat transfer member 20 has a flat plate shape extending along a plane intersecting the direction in which the first heat transfer member 10 and the second heat transfer member 20 are spaced apart from each other. 1, one surface 10f of the first heat transfer member 10 is in contact with the bottom surface of the heat dissipation member 310. The bottom surface of the heat dissipation member 310 is, for example, flat. One surface 10f of the first heat transfer member 10 and the bottom surface of the heat dissipation member 310 are in surface contact. Note that, for example, if the bottom surface of the heat dissipation member 310 is not flat but has a step, the first heat transfer member 10 may have a shape that engages with the bottom surface of the heat dissipation member 310 rather than being flat.

[0017] One surface 20g of the second heat transfer member 20 is in contact with the upper surface of the heat generating component 210. The upper surface of the heat generating component 210 is, for example, flat. One surface 20g of the second heat transfer member 20 and the upper surface of the heat generating component 210 are in surface contact. Note that, for example, if the upper surface of the heat generating component 210 is not flat but has a step, the second heat transfer member 20 may have a shape that engages with the upper surface of the heat generating component 210 instead of being flat.

[0018] FIG. 3 is a view of a heat conduction member 100A of the present disclosure as viewed from the first heat transfer member 10 side. 2 and 3, the outer diameter D1 of the first heat transfer member 10 of the present disclosure is larger than, for example, the outer diameter D2 of the second heat transfer member 20. Note that the outer diameter D1 of the first heat transfer member 10 may be smaller than, for example, the outer diameter D2 of the second heat transfer member 20. Furthermore, the outer diameter D1 of the first heat transfer member 10 and the outer diameter D2 of the second heat transfer member 20 may be the same.

[0019] Examples of materials for forming the first heat transfer member 10 and the second heat transfer member 20 include metals with high thermal conductivity such as gold, silver, copper, magnesium, zinc, and iron, alloys containing gold, silver, copper, magnesium, zinc, and the like (e.g., brass, phosphor bronze, zinc die-cast, etc.), and ceramics such as aluminum nitride and silicon carbide.

[0020] As shown in FIG. 3, the film member 30A is formed from a flexible film-like material. When viewed from the direction in which the first heat-transfer member 10 and the second heat-transfer member 20 are separated, the film member 30A has a rectangular shape and an opening 30h in its center. As shown in FIGS. 1 to 3, a first end portion 30p located on the outer periphery of the film member 30A is bonded to the first heat-transfer member 10. The first end portion 30p of the film member 30A of the present disclosure is bonded to the outer periphery of the other surface 10g of the first heat-transfer member 10, for example, by adhesive. The other second end portion 30q forming the inner periphery of the opening 30h of the film member 30A is bonded to the second heat-transfer member 20. The other second end portion 30q of the film member 30A of the present disclosure is bonded to the outer periphery of one surface 20g of the second heat-transfer member 20, for example, by adhesive.

[0021] The film-like member 30A is formed from a flexible, stretchable, film-like or sheet-like elastic material. The film-like member 30A of the present disclosure is formed from a material containing rubber, such as film-like silicone rubber, or a stretchable resin. As shown in FIGS. 1 and 2, such a film-like member 30A forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20. A filler 40, which will be described later, is filled in the enclosed space S. The film-like member 30A is stretchable when the first heat-transfer member 10 and the second heat-transfer member 20 are displaced relative to each other in directions toward or away from each other.

[0022] The filler 40 is filled into the sealed space S inside the membrane member 30A. The filler 40 includes a first filler 41 and a second filler 42.

[0023] The first filler 41 is made of a liquid metal. The first filler 41 of the present disclosure is made of a liquid metal that is in a liquid state at room temperature. An example of the liquid metal used for the first filler 41 is one containing at least one of gallium (Ga) and indium (In). Furthermore, the liquid metal used for the first filler 41 may contain tin (Sn), bismuth (Bi), or zinc (Zn). A metal filler having a higher thermal conductivity than the liquid metal may be mixed into the liquid metal. Alternatively, a metal powder or a conductive paste may be used as the first filler 41.

[0024] The second filler 42 is liquid and made of a different material from the first filler 41. The second filler 42 of the present disclosure is made of a material other than liquid metal. The second filler 42 is made of a material that does not mix with the first filler 41 and is separate from it. Examples of liquids that can be used for the second filler 42 of the present disclosure include those containing at least one of silicone oil, silicone grease, a gel-like substance, and an elastomer.

[0025] The first filler 41 and the second filler 42 exist in a separated state in the sealed space S. The first filler 41 and the second filler 42 do not mix with each other and remain separated due to differences in their intermolecular forces. In the present disclosure, the first filler 41 is located in the inner periphery (center) of the sealed space S. The first filler 41, which is made of liquid metal, is in contact with the first heat transfer member 10 and the second heat transfer member 20, which are made of metal. The second filler 42 is located around the first filler 41.

[0026] In order to fill the sealed space S with the filler 40, the heat conducting member 100A has a first filling port 15 and a second filling port .

[0027] The first filling port 15 is formed in at least one of the first heat transfer member 10 and the second heat transfer member 20. The first filling port 15 of the present disclosure is formed, for example, in the center of the first heat transfer member 10. The first filling port 15 penetrates the first heat transfer member 10 in the thickness direction. The first filling port 15 is used to fill the first filler material 41 in a liquid state into the membrane member 30A.

[0028] 3, the second filling port 35 is formed in at least one of the first heat transfer member 10, the second heat transfer member 20, and the membrane member 30A. The second filling port 35 of the present disclosure is formed in, for example, the membrane member 30A. The second filling port 35 penetrates the membrane member 30A in its thickness direction. The second filling port 35 is used to fill the membrane member 30A with a second filler material 42 in a liquid state.

[0029] In such a heat dissipation unit 300, the heat generated in the heat-generating component 210 is efficiently transferred to the heat dissipation member 310 via the second heat-transfer member 20, the first filler 41, and the first heat-transfer member 10. Therefore, the heat-generating component 210 is efficiently cooled.

[0030] FIG. 4 is a cross-sectional view showing a state in which heat dissipation member 310 approaches heat-generating component 210 in heat conduction member 100A of the present disclosure. 4, due to the load of the heat dissipation member 310, the heat dissipation member 310 is closer to the heat-generating component 210 than in the state shown in FIG. 1. In this state, the distance between the first heat transfer member 10 and the second heat transfer member 20 is reduced. As a result, the filler material present between the first heat transfer member 10 and the second heat transfer member 20 spreads in a direction intersecting the direction in which the first heat transfer member 10 and the second heat transfer member 20 are separated from each other. This causes the film member 30A to stretch, and the thickness of the heat conduction member 100A to become thinner.

[0031] Next, a method for assembling the above-described heat conducting member 100A will be described. FIG. 5 is a diagram showing the flow of a method for assembling a heat conduction member 100A according to the present disclosure. As shown in FIG. 5, the assembly method of the heat conduction member 100A of the present disclosure includes a step S11 of forming an enclosed space S, a step S12 of filling the enclosed space S with a second filler 42, and a step S13 of filling the enclosed space S with a first filler 41.

[0032] FIG. 6 is a cross-sectional view showing a state in which a sealed space S is formed in the method of assembling a heat conduction member 100A of the present disclosure. 6, in step S11 of forming the sealed space S, the first heat-transfer member 10 and the second heat-transfer member 20 are connected via the film-shaped member 30A. As a result, the sealed space S is formed between the first heat-transfer member 10 and the second heat-transfer member 20 inside the film-shaped member 30A.

[0033] Fig. 7 is a cross-sectional view showing a state in which the sealed space S has been evacuated in the method for assembling the heat conduction member 100A of the present disclosure. Fig. 8 is a cross-sectional view showing a state in which the sealed space S has been filled with the second filler 42 in the method for assembling the heat conduction member 100A of the present disclosure. As shown in Fig. 7, in step S12 of filling the sealed space S with the second filler 42, the sealed space S is evacuated through the first filling port 15. This brings the first heat transfer member 10 and the second heat transfer member 20 into close contact. Thereafter, as shown in Fig. 8, the second filler 42 is filled into the sealed space S on the outer periphery side of the first heat transfer member 10 and the second heat transfer member 20 through the second filling port 35 (see Fig. 3). After filling the second filler 42, the second filling port 35 is sealed.

[0034] 9 is a cross-sectional view showing a state in which the sealed space S is filled with the first filler 41 in the method of assembling the heat conduction member 100A of the present disclosure. As shown in FIG. 9, in step S13 of filling the sealed space S with the first filler 41, the first filler 41 is filled into the sealed space S through the first filling port 15. Thereafter, the first filling port 15 is sealed. In this manner, the assembly of the heat conduction member 100A as shown in FIG. 2 is completed.

[0035] In the heat conduction member 100A of this embodiment, the filler 40 filled in the sealed space S in the film member 30A includes a first filler 41 made of liquid metal and a second filler 42 made of a different material from the first filler 41 and in a liquid state separated from the first filler 41. This makes it possible to reduce the amount of liquid metal used while efficiently transferring heat between the first heat transfer member 10 and the second heat transfer member 20. As a result, the heat conduction member 100A can be manufactured more easily.

[0036] In the heat conduction member 100A of this embodiment, the first heat transfer member 10 and the second heat transfer member 20 are flat plate-shaped, so that the first heat transfer member 10 and the second heat transfer member 20 can stably support the heat dissipation member 310 and the heat-generating component 210 that are in contact with them.

[0037] In the heat conduction member 100A of the present embodiment, the first filler 41 is in contact with the first heat transfer member 10 and the second heat transfer member 20, and the second filler 42 is disposed around the first filler 41. Therefore, heat can be efficiently transferred between the first heat transfer member 10 and the second heat transfer member 20 via the first filler 41 made of liquid metal.

[0038] In the heat conduction member 100A of this embodiment, the first filler 41 contains at least one of gallium (Ga) and indium (In). This liquid metal has high thermal conductivity and is in a liquid state at room temperature. Therefore, when the distance between the first heat transfer member 10 and the second heat transfer member 20 changes due to a load or the like acting on the heat conduction member 100A, the filler 40 easily moves within the sealed space S accordingly.

[0039] In the heat conduction member 100A of this embodiment, the second filler 42 contains at least one of silicone oil, silicone grease, a gel-like substance, and an elastomer. Therefore, the second filler 42 remains separate from the first filler 41 without mixing with the first filler 41 within the sealed space S, and follows changes in the gap between the first heat transfer member 10 and the second heat transfer member 20 due to loads and the like acting on the heat conduction member 100A, preventing the first filler 41 from being hindered from moving within the sealed space S.

[0040] The heat dissipation unit 300 of this embodiment includes a heat conducting member 100 A. Therefore, it is possible to provide a heat dissipation unit 300 including a heat conducting member 100 A that is easy to manufacture.

[0041] The electronic device 200 of this embodiment includes the heat conducting member 100 A. Therefore, it is possible to provide the electronic device 200 including the heat conducting member 100 A that is easy to manufacture.

[0042] The method for assembling the heat conducting member 100A of this embodiment can assemble and provide the heat conducting member 100A that is easy to manufacture.

[0043] (Modification of the first embodiment) FIG. 10 is a diagram showing the flow of an assembly method for a heat conduction member 100A according to an embodiment of the present disclosure. As shown in FIG. 10, the assembly method of the heat conduction member 100A of the present disclosure includes a step S21 of solidifying the first filler 41, a step S22 of connecting the first heat transfer member 10 and the second heat transfer member 20 via a membrane member 30A, a step S23 of filling the sealed space S with the second filler 42, a step S23 of filling the sealed space S with the second filler 42, and a step S24 of liquidizing the first filler 41.

[0044] In step S21 of solidifying the first filler 41, the first filler 41 is cooled to a temperature equal to or lower than the solidus temperature of the first filler 41 to be solidified.

[0045] Fig. 11 is a cross-sectional view showing a state in which a first filler 41 in a solid state is placed on a second heat transfer member 20 in the method for assembling a heat transfer member 100A of the present disclosure. Fig. 12 is a cross-sectional view showing a state in which the first heat transfer member 10 and the second heat transfer member 20 are connected via a film member 30A in the method for assembling a heat transfer member 100A of the present disclosure. In step S22 of connecting the first heat-transfer member 10 and the second heat-transfer member 20 via the film-shaped member 30A, a solid first filler 41S is placed on the second heat-transfer member 20, as shown in Fig. 11. Then, as shown in Fig. 12, the first heat-transfer member 10 is placed on the solid first filler 41S, and the first heat-transfer member 10 and the second heat-transfer member 20 are connected via the film-shaped member 30A. As a result, an enclosed space S is formed between the first heat-transfer member 10 and the second heat-transfer member 20 within the film-shaped member 30A.

[0046] Fig. 13 is a cross-sectional view showing a state in which the sealed space S has been evacuated in the method of assembling the heat conduction member 100A of the present disclosure. Fig. 14 is a cross-sectional view showing a state in which the sealed space S has been filled with the second filler 42 in the method of assembling the heat conduction member 100A of the present disclosure. 13, in a step S23 of filling the sealed space S with the second filler 42, the sealed space S is evacuated through the second filling port 35 (see FIG. 3). As a result, the film member 30A is brought into close contact with the solid first filler 41S between the first heat-transfer member 10 and the second heat-transfer member 20. 14, the second filler 42 is filled into the sealed space S on the outer circumferential side of the first filler 41S through the second filling port 35 (see FIG. 3). After the second filler 42 is filled, the second filling port 35 is sealed.

[0047] FIG. 15 is a cross-sectional view showing a state in which first filler 41 in sealed space S is in a liquid state in the method of assembling heat conduction member 100A of the present disclosure. 15, in step S24 of liquefying first filler 41, first filler 41 is changed from a solid state to a liquid state in a temperature environment higher than the solidus temperature of first filler 41. This procedure can also be used to assemble heat conduction member 100A as shown in Fig. 2. In this case, first filling port 15 may be omitted.

[0048] (Another modification of the first embodiment) In the first embodiment described above, the first end 30p of the film-like member 30A is joined to the outer periphery of the other surface 10g of the first heat transfer member 10, and the second end 30q is joined to one surface 20g of the second heat transfer member 20, but this is not limited to this. FIG. 16 is a cross-sectional view showing one embodiment of the present disclosure. 16 , in a film member 30B of a heat conduction member 100B according to the modification of the present disclosure, a first end portion 30p is joined to the outer periphery of the other surface 10g of the first heat transfer member 10. In addition, a second end portion 30q of the film member 30B is joined to the outer periphery of the other surface 20f of the second heat transfer member 20.

[0049] FIG. 17 is a cross-sectional view showing one embodiment of the present disclosure. 17, in a film member 30C of a heat conduction member 100C according to a modification of the present disclosure, a first end portion 30p is joined to the outer periphery of one surface 10f of the first heat transfer member 10. In addition, a second end portion 30q of the film member 30C is joined to the outer periphery of the other surface 20f of the second heat transfer member 20.

[0050] FIG. 18 is a cross-sectional view showing one embodiment of the present disclosure. 18 , in a film member 30D of a heat conduction member 100D according to the modification of the present disclosure, a first end portion 30p is joined to the outer periphery of one surface 10f of the first heat transfer member 10. In addition, a second end portion 30q of the film member 30D is joined to the outer periphery of one surface 20g of the second heat transfer member 20.

[0051] FIG. 19 is a cross-sectional view showing one embodiment of the present disclosure. 19, in a film member 30E of a heat conduction member 100E according to a modification of the present disclosure, a first end portion 30p is joined to the outer periphery of the other surface 10g of the first heat transfer member 10. A second end portion 30q of the film member 30E is joined to the outer periphery of one surface 20g of the second heat transfer member 20. The film member 30E has a cylindrical wall portion 30w between the first end portion 30p and the second end portion 30q, which extends in a direction separating the first heat transfer member 10 and the second heat transfer member 20.

[0052] FIG. 20 is a cross-sectional view showing one embodiment of the present disclosure. 20 , in a film member 30F of a heat conduction member 100F according to a modified example of the present disclosure, a first end portion 30p is joined to the outer periphery of the other surface 10g of the first heat transfer member 10. A second end portion 30q of the film member 30F is joined to the outer periphery of one surface 20g of the second heat transfer member 20. The film member 30F has a semi-cylindrical wall portion 30w on one side of the center of the first heat transfer member 10, extending in a direction separating the first heat transfer member 10 and the second heat transfer member 20. The film member 30F extends from the first end portion 30p to the second end portion 30q on the other side of the center of the first heat transfer member 10, gradually sloping toward the center of the first filler 41, from the first heat transfer member 10 side toward the second heat transfer member 20 side.

[0053] Second Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. FIG. 21 is a cross-sectional view showing a heat conduction member 100G of the present disclosure. As shown in FIG. 21, a heat conduction member 100G of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30G, and a filler 40.

[0054] The film member 30G is formed from a flexible film-like material. The film member 30G has a first film material 31 and a second film material 32. One end of the first film material 31 is joined to the outer periphery of the first heat transfer member 10 as a first end portion 30p of the film member 30G. One end on the inner periphery of the first film material 31 of the present disclosure is joined to the other surface 10g of the first heat transfer member 10. One end of the second film material 32 is joined to the outer periphery of the second heat transfer member 20 as a second end portion 30q of the film member 30G. One end on the inner periphery of the second film material 32 of the present disclosure is joined to the other surface 20f of the second heat transfer member 20. The other end on the outer periphery of the first film material 31 and the other end on the outer periphery of the second film material 32 are joined to each other. In this way, the film member 30G is configured to be elastically deformable in the direction in which the first heat transfer member 10 and the second heat transfer member 20 move toward and away from each other.

[0055] The sealed space S within such a membrane member 30G is filled with a filler 40 including a first filler 41 and a second filler 42.

[0056] Assembling the heat conduction member 100G as described above includes, similarly to the heat conduction member 100A shown in the second embodiment, a step S11 of forming an enclosed space S (see FIG. 5), a step S12 of filling the enclosed space S with a second filler 42, and a step S13 of filling the enclosed space S with a first filler 41.

[0057] FIG. 22 is a cross-sectional view showing a state in which a sealed space S is formed in the method of assembling a heat conduction member 100G according to the present disclosure. 22 , in step S11 of forming the sealed space S, the first heat transfer member 10 and the second heat transfer member 20 are connected via a film member 30G having a first film material 31 and a second film material 32. As a result, a sealed space S is formed between the first heat transfer member 10 and the second heat transfer member 20 within the film member 30G.

[0058] Fig. 23 is a cross-sectional view showing a state in which the sealed space S has been evacuated in the method of assembling the heat conduction member 100G of the present disclosure. Fig. 24 is a cross-sectional view showing a state in which the sealed space S has been filled with the second filler 42 in the method of assembling the heat conduction member 100G of the present disclosure. 23 , in step S12 of filling the sealed space S with the second filler material 42, first, a vacuum is drawn inside the sealed space S through the first filling port 15. This causes the second end portion 30q of the film member 30G to be sandwiched between the first heat transfer member 10 and the second heat transfer member 20. As a result, the sealed space S is partitioned into a first sealed space S1 surrounded by the second end portion 30q between the first heat transfer member 10 and the second heat transfer member 20, and a second sealed space S2 surrounded by the first film material 31 and the second film material 32 outside the second end portion 30q. 24, the second sealed space S2 is filled with the second filler 42 through the second filling port 35 (see FIG. 3) on the outer periphery of the first heat transfer member 10 and the second heat transfer member 20. As the second filler 42 is filled, the first membrane material 31 and the second membrane material 32 expand, increasing the volume of the second sealed space S2. After a predetermined amount of the second filler 42 has been filled, the second filling port 35 is sealed.

[0059] In step S13 of filling the sealed space S with the first filler 41, the first filler 41 is filled into the sealed space S through the first filling port 15, as shown in Fig. 25. Thereafter, the first filling port 15 is sealed. In this manner, the assembly of the heat conduction member 100G is completed.

[0060] In the heat conduction member 100G of this embodiment, as in the second embodiment, the filler 40 filled in the sealed space S in the film member 30G includes a first filler 41 made of liquid metal and a second filler 42 made of a different material from the first filler 41 and in a liquid state separated from the first filler 41. This makes it possible to reduce the amount of liquid metal used while efficiently transferring heat between the first heat transfer member 10 and the second heat transfer member 20. As a result, the heat conduction member 100G can be manufactured more easily.

[0061] (Another modification of the second embodiment) In the second embodiment described above, the first end 30p of the film-like member 30G is joined to the outer periphery of the other surface 10g of the first heat transfer member 10, and the second end 30q is joined to one surface 20g of the second heat transfer member 20, but this is not limited to this. FIG. 25 is a cross-sectional view showing one embodiment of the present disclosure. 25, in a film member 30H of a heat conduction member 100H according to a modification of the present disclosure, a first end portion 30p (one end of the first film material 31) is joined to the outer periphery of one surface 10f of the first heat transfer member 10. In addition, a second end portion 30q (one end of the second film material 32) of the film member 30H is joined to the outer periphery of the other surface 20f of the second heat transfer member 20.

[0062] FIG. 26 is a cross-sectional view showing one embodiment of the present disclosure. 26 , in a film member 30I of a heat conduction member 100I according to a modification of the present disclosure, a first end portion 30p (one end of the first film material 31) is joined to the outer periphery of one surface 10f of the first heat transfer member 10. In addition, a second end portion 30q (one end of the second film material 32) of the film member 30I is joined to the outer periphery of one surface 20g of the second heat transfer member 20.

[0063] FIG. 27 is a cross-sectional view showing one embodiment of the present disclosure. 27, in a film member 30J of a heat conduction member 100J according to a modification of the present disclosure, a first end portion 30p (one end of the first film material 31) is joined to the outer periphery of the other surface 10g of the first heat transfer member 10. Also, a second end portion 30q (one end of the second film material 32) of the film member 30J is joined to the outer periphery of one surface 20g of the second heat transfer member 20.

[0064] (Still another modification of the first and second embodiments) In the first and second embodiments, the center of the first heat transfer member 10 and the center of the second heat transfer member 20 are arranged coaxially, but the present invention is not limited to this. FIG. 28 is a cross-sectional view showing one embodiment of the present disclosure. 28 , in a heat conduction member 100K according to a modification of the present disclosure, the outer diameter D3 of the first heat transfer member 10K is larger than the outer diameter D2 of the second heat transfer member 20. The first heat transfer member 10K may be disposed offset with respect to the second heat transfer member 20 in a direction intersecting with the direction in which the first heat transfer member 10 and the second heat transfer member 20 are spaced apart. In other words, the center portion 10c of the first heat transfer member 10K may be offset with respect to the center portion 20c of the second heat transfer member 20 in a direction intersecting with the direction in which the first heat transfer member 10 and the second heat transfer member 20 are spaced apart.

[0065] A first end 30p of the film member 30K of the heat conduction member 100K is joined to the outer periphery of the first heat transfer member 10. A second end 30q of the film member 30K is joined to the outer periphery of the second heat transfer member 20. Furthermore, the first filler 41 of the filler 40 filled in the sealed space S is located between the first heat transfer member 10 and the second heat transfer member 20, at a position offset from the center 10c of the first heat transfer member 10K.

[0066] The configuration of such a modified example can be similarly applied to the second embodiment having the first membrane material 31 and the second membrane material 32, and to each of the modified examples thereof.

[0067] Third Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 29, a heat conduction member 100L of the present disclosure includes a first heat transfer member 10, a second heat transfer member 20, a film member 30L, and a filler 40. The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 . The film-shaped member 30L is formed from a flexible film-shaped material. One first end 30p of the film-shaped member 30L is joined to the first heat-transfer member 10. The other second end 30q of the film-shaped member 30L is joined to the second heat-transfer member 20. The film-shaped member 30L forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20.

[0068] The filler 40 fills the sealed space S inside the membrane member 30L. The filler 40 includes a first filler 41 and a second filler 42. The first filler 41 is made of a liquid metal. The second filler 42 is made of a different material from the first filler 41. The second filler 42 is liquid and separate from the first filler 41.

[0069] The filler 40 of the heat conduction member 100L of this embodiment includes a first filler 41 made of liquid metal and a second filler 42 in a liquid state separated from the first filler 41. This makes it possible to reduce the amount of liquid metal used while efficiently transferring heat between the first heat transfer member 10 and the second heat transfer member 20. As a result, the heat conduction member 100L can be easily manufactured.

[0070] <Fourth embodiment> Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 30, a heat dissipation unit 300M of the present disclosure includes a heat conduction member 100M and a heat dissipation member 310. The heat conduction member 100M includes a first heat transfer member 10, a second heat transfer member 20, a film-like member 30M, and a filler .

[0071] The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 . The film-shaped member 30M is formed from a flexible film-shaped material. One first end portion 30p of the film-shaped member 30M is joined to the first heat-transfer member 10. The other second end portion 30q of the film-shaped member 30M is joined to the second heat-transfer member 20. The film-shaped member 30M forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20.

[0072] The filler 40 fills the sealed space S inside the membrane member 30M. The filler 40 includes a first filler 41 and a second filler 42. The first filler 41 is made of a liquid metal. The second filler 42 is made of a different material from the first filler 41. The second filler 42 is liquid and separate from the first filler 41.

[0073] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100M to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 has heat-generating properties.

[0074] The heat dissipation unit 300M of this embodiment includes a heat conduction member 100M. The filler 40 of the heat conduction member 100M includes a first filler 41 made of liquid metal and a second filler 42 in a liquid state separated from the first filler 41. This makes it possible to efficiently transfer heat between the first heat transfer member 10 and the second heat transfer member 20 while reducing the amount of liquid metal used. As a result, the heat conduction member 100L can be manufactured more easily.

[0075] Fifth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 31, the electronic device 200N of the present disclosure includes a heat dissipation unit 300N and a substrate 220. The heat dissipation unit 300N includes a heat conduction member 100N and a heat dissipation member 310. The heat conduction member 100N includes a first heat transfer member 10, a second heat transfer member 20, a film-like member 30N, and a filler 40.

[0076] The second heat transfer member 20 is provided spaced apart from the first heat transfer member 10 . The film-shaped member 30N is formed from a flexible film-shaped material. One first end portion 30p of the film-shaped member 30N is joined to the first heat-transfer member 10. The other second end portion 30q of the film-shaped member 30N is joined to the second heat-transfer member 20. The film-shaped member 30N forms an enclosed space S between the first heat-transfer member 10 and the second heat-transfer member 20.

[0077] The filler 40 fills the sealed space S inside the membrane member 30N. The filler 40 includes a first filler 41 and a second filler 42. The first filler 41 is made of a liquid metal. The second filler 42 is made of a different material from the first filler 41. The second filler 42 is liquid and separate from the first filler 41.

[0078] The heat dissipation member 310 is provided so as to be in contact with one of the first heat transfer member 10 and the second heat transfer member 20. The heat dissipation member 310 of the present disclosure is provided so as to be in contact with the first heat transfer member 10. The heat dissipation member 310 dissipates heat transferred from the heat-generating component 210 via the heat conduction member 100N to the outside. The heat-generating component 210 is provided so as to be in contact with the other of the first heat transfer member 10 and the second heat transfer member 20. The heat-generating component 210 has heat-generating properties. The substrate 220 is provided with a heat generating component 210 .

[0079] An electronic device 200N of this embodiment includes a heat-conducting member 100N. The filler 40 of the heat-conducting member 100N includes a first filler 41 made of liquid metal and a second filler 42 in a liquid state separated from the first filler 41. This allows for efficient heat transfer between the first heat-transfer member 10 and the second heat-transfer member 20 while reducing the amount of liquid metal used. As a result, the heat-conducting member 100N can be manufactured more easily.

[0080] Sixth Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 32, the method for assembling a heat conduction member according to the present disclosure includes a step S31 of forming an enclosed space, and a step S32 of filling the enclosed space with a filler.

[0081] In step S31 of forming the sealed space, a first end of a film-like member made of a flexible film-like material is joined to a first heat transfer member. A second end of the film-like member is joined to a second heat transfer member spaced apart from the first heat transfer member. This forms a sealed space within the film-like member between the first and second heat transfer members.

[0082] In step S32 of filling the sealed space with a filler, the sealed space is filled with a filler including a first filler and a second filler. The first filler is made of a liquid metal. The second filler is made of a material different from the first filler. The second filler is in a liquid state separate from the first filler. Step S32 of filling the sealed space with a filler includes step S33 of filling the sealed space with a second filler and step S34 of filling the sealed space with a first filler. In step S33 of filling the sealed space with the second filler, the sealed space is evacuated, and then the second filler is filled into the sealed space.

[0083] The method for assembling a heat conduction member according to this embodiment can assemble and provide a heat conduction member that is easy to manufacture.

[0084] Seventh Embodiment Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. As shown in FIG. 33, the method for assembling a thermal conduction member of the present disclosure includes step S41 of solidifying a first filler, step S42 of forming an enclosed space, step S43 of filling the enclosed space with a second filler, and step S44 of liquidizing the first filler.

[0085] In step S41 of solidifying the first filler, the first filler made of liquid metal is cooled to a temperature equal to or lower than the solidus temperature of the first filler, thereby solidifying the first filler.

[0086] In step S42 of forming the sealed space, a first filler in a solid state is placed on one heat transfer member, and then another heat transfer member is placed on the first filler. In step S42 of forming the sealed space, a first end of one of the film-like members formed from a flexible film-like material is joined to the one heat transfer member, and a second end of the other of the film-like members is joined to the other heat transfer member. In the step S42 of forming an enclosed space, an enclosed space is formed in the film member between one heat transfer member and another heat transfer member.

[0087] In step S43 of filling the sealed space with a second filler, the sealed space is evacuated and then filled with a liquid second filler. The second filler is made of a different material from the first filler and is separate from the first filler.

[0088] In step S44 of liquefying the first filler, the first filler is liquefied in a temperature environment higher than the solidus temperature of the first filler.

[0089] The method for assembling a heat conduction member according to this embodiment can assemble and provide a heat conduction member that is easy to manufacture.

[0090] Although the present disclosure has been described above with reference to the embodiments, the present disclosure is not limited to the above-described embodiments. Various modifications that can be understood by those skilled in the art can be made to the configuration and details of the present disclosure within the scope of the present disclosure. Furthermore, each embodiment can be combined with other embodiments as appropriate. For example, in the above embodiment, a heat dissipation member is connected to the first heat transfer member and a heat-generating component is connected to the second heat transfer member, but it is also possible to connect a heat-generating component to the first heat transfer member and a heat dissipation member to the second heat transfer member.

[0091] Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes.

[0092] (Appendix 1) a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible film-like material, having a first end joined to the first heat transfer member and a second end joined to the second heat transfer member, and forming an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member, The filler includes a first filler made of a liquid metal, and a second filler made of a material different from the first filler and in a liquid state separated from the first filler. Heat conducting material.

[0093] (Appendix 2) At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. 2. The thermally conductive member of claim 1.

[0094] (Appendix 3) The outer diameter of the first heat transfer member is larger than the outer diameter of the second heat transfer member. 3. The thermal conductive member according to claim 1 or 2.

[0095] (Appendix 4) the first filler is in contact with the first heat transfer member and the second heat transfer member; The second filler is disposed around the first filler. 4. The thermal conduction member according to any one of claims 1 to 3.

[0096] (Appendix 5) The first filling material contains at least one of gallium and indium. 5. A thermally conductive member according to any one of claims 1 to 4.

[0097] (Appendix 6) The second filler includes at least one of silicone oil, silicone grease, a gel-like substance, and an elastomer. 6. A thermally conductive member according to any one of claims 1 to 5.

[0098] (Appendix 7) The film-like member is a first film material having one end joined to the outer periphery of the first heat transfer member; a second film material having one end joined to the outer periphery of the second heat transfer member and the other end joined to the other end of the first film material, The first heat transfer member and the second heat transfer member are elastically deformable in a direction toward and away from each other. 7. A thermally conductive member according to any one of claims 1 to 6.

[0099] (Appendix 8) The film member is made of a material containing silicone rubber. 8. A thermally conductive member according to any one of claims 1 to 7.

[0100] (Appendix 9) a first filling port formed in at least one of the first heat transfer member and the second heat transfer member, through which the first filler in a liquid state is filled into the film member; 9. A thermally conductive member according to any one of claims 1 to 8.

[0101] (Appendix 10) a second filling port formed in at least one of the first heat transfer member, the second heat transfer member, and the film-like member, for filling the second filler material into the film-like member; 10. The thermal conduction member according to any one of claims 1 to 9.

[0102] (Appendix 11) A thermally conductive member according to any one of appendices 1 to 10; a heat dissipation member that is provided in contact with one of the first heat transfer member and the second heat transfer member and that dissipates heat transferred via the heat conduction member from a heat-generating component that is provided in contact with the other of the first heat transfer member and the second heat transfer member to the outside. Heat dissipation unit.

[0103] (Appendix 12) a heat dissipation unit according to appendix 1; a substrate on which the heat-generating component is provided; electronic equipment.

[0104] (Appendix 13) a step of joining a first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining a second end of the film-like member to a second heat transfer member provided apart from the first heat transfer member, thereby forming an enclosed space within the film-like member between the first heat transfer member and the second heat transfer member; and filling the sealed space with a filler including a first filler made of a liquid metal and a second filler made of a material different from the first filler and in a liquid state separated from the first filler, The step of filling the sealed space with the filler includes: a step of filling the sealed space with the second filler after evacuating the sealed space; and filling the first filler material into the sealed space. A method for assembling a thermally conductive member.

[0105] (Appendix 14) In the step of forming the sealed space, at least one of the first end portion and the second end portion of the film member is sandwiched between the first heat transfer member and the second heat transfer member, In the step of filling the second filler, the second filler is filled into a part of the sealed space on the outside of at least one of the first end and the second end of the film member sandwiched between the first heat transfer member and the second heat transfer member, In the step of filling the first filler, the first filler is filled into another part of the sealed space on the inner side of at least one of the first end and the second end of the film member sandwiched between the first heat transfer member and the second heat transfer member. A method for assembling the thermal conduction member described in Appendix 13.

[0106] (Appendix 15) cooling the first filler material made of liquid metal to a temperature below the solidus temperature of the first filler material, thereby solidifying the first filler material; a step of placing the first filler in a solid state on one heat transfer member, placing another heat transfer member on the first filler, joining one first end of a film-like member made of a flexible film-like material to the one heat transfer member, and joining the other second end to the other heat transfer member, thereby forming an enclosed space within the film-like member between the one heat transfer member and the other heat transfer member; a step of filling the sealed space with a liquid second filler that is made of a material different from the first filler and is separate from the first filler, after evacuating the sealed space; and bringing the first filler into a liquid state in a temperature environment higher than the solidus temperature of the first filler. A method for assembling a thermally conductive member.

[0107] Furthermore, some or all of the configurations described in Supplementary Notes 2 to 10, which are dependent on Supplementary Note 1, may also be dependent on Supplementary Notes 13 and 15 in the same dependent relationship as Supplementary Notes 2 to 10. Furthermore, not limited to Supplementary Notes 1, 13, and 15, some or all of the configurations described as Supplements may also be dependent on various heat conduction members or methods of assembling heat conduction members, as long as they do not deviate from the respective embodiments described above. [Explanation of symbols]

[0108] 10, 10K First heat transfer member 20 Second heat transfer member 30A~30N Membrane material 30p first end 30q second end 31 First membrane material 32 Second membrane material 40 Filler 41, 41S First filling material 42 Second filler 100A~100N Thermal Conductive Material 200, 200N electronic equipment 210 Heat-generating parts 220 board 300, 300M, 300N heat dissipation unit 310 Heat dissipation material S closed space

Claims

1. a first heat transfer member; a second heat transfer member provided at a distance from the first heat transfer member; a film-like member formed from a flexible film-like material, having a first end joined to the first heat transfer member and a second end joined to the second heat transfer member, and forming an enclosed space between the first heat transfer member and the second heat transfer member; a filler material filled in the sealed space within the membrane member, The filler includes a first filler made of a liquid metal, and a second filler made of a material different from the first filler and in a liquid state separated from the first filler. Heat conducting material.

2. At least one of the first heat transfer member and the second heat transfer member has a flat plate shape extending along a plane intersecting a direction in which the first heat transfer member and the second heat transfer member are spaced apart from each other. The heat transfer member according to claim 1 .

3. the first filler is in contact with the first heat transfer member and the second heat transfer member; The second filler is disposed around the first filler. The heat conducting member according to claim 1 or 2.

4. The first filling material contains at least one of gallium and indium. The heat conducting member according to claim 1 or 2.

5. The second filler includes at least one of silicone oil, silicone grease, a gel-like substance, and an elastomer. The heat conducting member according to claim 1 or 2.

6. The film-like member is a first film material having one end joined to the outer periphery of the first heat transfer member; a second film material having one end joined to the outer periphery of the second heat transfer member and the other end joined to the other end of the first film material, The first heat transfer member and the second heat transfer member are elastically deformable in a direction toward and away from each other. The heat conducting member according to claim 1 or 2.

7. The heat conduction member according to claim 1 or 2; a heat dissipation member that is provided in contact with one of the first heat transfer member and the second heat transfer member and that dissipates heat transferred via the heat conduction member from a heat-generating component that is provided in contact with the other of the first heat transfer member and the second heat transfer member to the outside. Heat dissipation unit.

8. The heat dissipation unit according to claim 7; a substrate on which the heat-generating component is provided; electronic equipment.

9. a step of joining a first end of a film-like member formed from a flexible film-like material to a first heat transfer member and joining a second end of the film-like member to a second heat transfer member provided apart from the first heat transfer member, thereby forming an enclosed space within the film-like member between the first heat transfer member and the second heat transfer member; and filling the sealed space with a filler including a first filler made of a liquid metal and a second filler made of a material different from the first filler and in a liquid state separated from the first filler, The step of filling the sealed space with the filler includes: a step of filling the sealed space with the second filler after evacuating the sealed space; and filling the first filler material into the sealed space. A method for assembling a thermally conductive member.

10. cooling the first filler material made of liquid metal to a temperature below the solidus temperature of the first filler material, thereby solidifying the first filler material; a step of placing the first filler in a solid state on one heat transfer member, placing another heat transfer member on the first filler, joining one first end of a film-like member made of a flexible film-like material to the one heat transfer member, and joining the other second end to the other heat transfer member, thereby forming an enclosed space within the film-like member between the one heat transfer member and the other heat transfer member; a step of filling the sealed space with a liquid second filler that is made of a material different from the first filler and is separate from the first filler, after evacuating the sealed space; and bringing the first filler into a liquid state in a temperature environment higher than the solidus temperature of the first filler. A method for assembling a thermally conductive member.

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