Multilayer substrate and electronic apparatus

Abstract

To provide a multilayer substrate and an electronic apparatus including the same, in which cracks or chipping is less likely to occur at locations where the number of laminated insulator layers differs.SOLUTION: A multilayer substrate 101 includes a first substrate part 1, a second substrate part 2, and a built-up part 3. The first substrate part 1 is formed of a first material. The second substrate part 2 is formed of a second material and joined to the first substrate part 1, having a protruding part EX that protrudes from the first substrate part 1. The built-up part 3 is formed of the first material, joined to the base of the protruding part EX of the second substrate part 2, and rising near the base of the protruding part EX to cover part of its side.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a multilayer substrate and an electronic device including the same. [Background technology]

[0002] Patent Document 1 discloses a multilayer substrate having a plurality of insulating layers, and also discloses a multilayer substrate in which regions with different thicknesses in the stacking direction are formed by varying the number of stacked insulating layers. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-236873 Summary of the Invention [Problem to be solved by the invention]

[0004] If the structure has regions with different thicknesses in the stacking direction due to differences in the number of stacked insulator layers with conductor layers attached, the thicker regions can have the desired electronic component-like functions. However, if stress concentrates at the locations where the number of stacked insulator layers differs, cracks and chips are likely to occur.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a multilayer substrate that is less susceptible to cracking or chipping at locations where the number of stacked insulating layers differs, and to provide an electronic device equipped with this multilayer substrate. [Means for solving the problem]

[0006] (1) An example of a multilayer substrate according to the present disclosure includes: a first substrate portion formed by laminating resin layers of a first material; a second substrate portion formed by laminating resin layers of a second material, the second substrate portion being bonded to the first substrate portion and having a protruding portion protruding from the first substrate portion; a protruding portion made of the first material, which is bonded to the base of the protruding portion of the second substrate portion and protrudes near the base of the protruding portion to cover a part of a side of the protruding portion; Equipped with A bottom portion of the second substrate portion, which is a part of the joining surface of the second substrate portion to the first substrate portion, is located below the upper surface of the first substrate portion.

[0007] (2) An electronic device as an example of the present disclosure includes a multilayer substrate and electronic components mounted on the multilayer substrate. [Effects of the Invention]

[0008] According to the present invention, a multilayer substrate is obtained that is less likely to crack or chip at locations where the number of laminated insulating layers differs, and further, an electronic device equipped with this multilayer substrate is obtained. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view of a multilayer substrate 101 according to the first preferred embodiment. [Figure 2] FIG. 2 is a diagram particularly showing the shape of the raised portion 3. [Figure 3] FIG. 3 is a diagram showing the positional relationship between the first substrate unit 1 and the second substrate unit 2. As shown in FIG. [Figure 4] FIG. 4 is a diagram showing the shape of the joint between the base of the second substrate unit 2 and the first substrate unit 1. As shown in FIG. [Figure 5] FIG. 5 is a cross-sectional view of the multilayer substrate 101 at an intermediate stage in the manufacturing process. [Figure 6] FIG. 6 is a cross-sectional view of another multilayer substrate 101A according to the first preferred embodiment. [Figure 7] FIG. 7 is a cross-sectional view of a multilayer substrate 102 according to the second embodiment. [Figure 8] FIG. 8 is a plan view of the multilayer substrate 102. [Figure 9] FIG. 9 is a cross-sectional view of a multilayer substrate 103 according to the third preferred embodiment. [Figure 10] FIG. 10 is a cross-sectional view of an electronic device 301 according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several specific examples will be given with reference to the drawings to illustrate several embodiments for carrying out the present invention. The same reference numerals are used for the same parts in each drawing. For the sake of convenience, the embodiments are shown divided into several embodiments, taking into account ease of explanation and understanding of the main points. However, partial omission, substitution, or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, descriptions of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects resulting from similar configurations will not be mentioned in each embodiment.

[0011] First Embodiment In the first embodiment, a multilayer substrate including a first substrate portion, a second substrate portion, and a raised portion will be exemplified.

[0012] FIG. 1 is a cross-sectional view of a multilayer substrate 101 according to a first embodiment. The upper part of FIG. 1 is a partial cross-sectional view of the multilayer substrate 101, and the lower part of FIG. 1 is an enlarged view of the VP region in the upper part. Note that in the cross-sectional view, lines that appear in the cross section (appearing due to cutting) are drawn, and lines that exist behind the cross section are not shown. This also applies to each embodiment described later.

[0013] 1, multilayer substrate 101 includes a first substrate portion 1 and a second substrate portion 2 having a protrusion EX protruding from first substrate portion 1. When expressed as a surface along the XY plane, the portion where second substrate portion 2 exists is a rigid portion RP that has high rigidity due to the large number of resin layers that constitute the multilayer substrate through lamination, and the portion where second substrate portion 2 does not exist is a flexible portion FP.

[0014] The fact that the second substrate portion 2 is joined to the first substrate portion 1 and has a protrusion EX that protrudes from the first substrate portion 1 can also be expressed as the protrusion EX being formed by the second substrate portion 2.

[0015] Predetermined conductor layers are laminated together with resin layers as required on the first substrate portion 1 and the second substrate portion 2. In Fig. 1, a conductor layer 4 formed by patterning Cu foil is shown.

[0016] The first substrate portion 1 is made of a first material, and the second substrate portion 2 is made of a second material. In Fig. 1, the first substrate portion 1 and the second substrate portion 2 are shown with different hatching.

[0017] The first material has a lower Young's modulus than the second material, which allows the flexible part FP to bend while suppressing deformation of the rigid part RP.

[0018] Young's modulus can be determined by conducting a nanoindenter test in accordance with the standards of JIS Z 2255 and ISO 14577. For example, it can be determined from load-displacement data using a KLA Micro Nanoindenter device.

[0019] The first material and the second material are, for example, the same material. In this way, when the first material and the second material are the same material, connection reliability can be improved. For example, both are liquid crystal polymer resin (LCP). By using a resin material with low water absorption such as this liquid crystal polymer resin (LCP), a multilayer substrate with high electrical properties and various reliability can be obtained.

[0020] Whether or not the resin materials are the same can be confirmed using a Fourier transform infrared spectrophotometer (FT-IR). That is, a spectrum is obtained using a Fourier transform infrared spectrophotometer (FT-IR), and if the peaks of the spectrum are the same for the second substrate portion 2 and the first substrate portion 1, it can be confirmed that the resin materials are the same.

[0021] In the case of thermoplastic resins, the difference in melting points between resin materials of the same type is small. Whether the resin portion of the first substrate portion 1 and the resin portion of the second substrate portion 2 are made of the same type of resin can be confirmed by the endothermic peak of differential scanning calorimetry (DSC). Specifically, using a Rigaku DSC8230, the resins are heated at a rate of 10°C / min, melted, cooled, and then heated again at 10°C / min. If the difference in melting points between the two resins is within 5°C, they can be considered to be the same type of resin.

[0022] The first substrate portion 1 shown in the upper part of Fig. 1 includes resin layers 1a and 1b shown in the lower part of Fig. 1. The second substrate portion 2 includes resin layers 2a and 2b.

[0023] In the diagram shown at the bottom of FIG. 1, the first substrate unit 1 and the second substrate unit 2 are joined at the boundary surface between the different hatched portions (the boundary line in the cross section of FIG. 1).

[0024] 1, the multilayer substrate 101 has a raised portion 3. This raised portion 3 is joined to a part of the base portion 2B of the second substrate portion 2 and rises near this base portion to cover a part of the side portion 2S of the second substrate portion 2.

[0025] In this way, the first material of the first substrate portion 1 rises and joins to a portion of the base 2B of the second substrate portion 2, and also rises near the base of the second substrate portion 2 to cover a portion of the side portion 2S of the second substrate portion 2, so that the base portion of the second substrate portion 2 is pressed down against the main body of the first substrate portion 1 by the raised portion 3.

[0026] Generally, when an external force that tends to bend a multilayer substrate is applied, stress tends to concentrate at the boundary between the rigid portion RP and the flexible portion FP (the portion where the number of laminated resin layers changes significantly). In the multilayer substrate 101 of this embodiment, the bonding strength between the first substrate portion 1 and the second substrate portion 2 is high, preventing cracks and chips at the interface between the first substrate portion 1 and the second substrate portion 2. In addition, the rigidity of the second substrate portion 2 relative to the first substrate portion 1 is high, preventing deformation such as tilting of the second substrate portion 2.

[0027] Figure 2 is a diagram showing the shape of the raised portion 3 in particular. Similar to the lower portion of Figure 1, Figure 2 is an enlarged view of the VP region in the upper portion of Figure 1. The outer surface of the raised portion 3 is curved, forming a gently continuous surface from the upper surface of the first substrate portion 1 to the side surface of the second substrate portion 2. The arrow R in Figure 2 indicates this gently curved surface.

[0028] As mentioned above, when a multilayer substrate is subjected to an external force that tends to bend it, stress tends to concentrate in areas where the number of laminated resin layers is large. In the multilayer substrate 101 of this embodiment, the periphery of the bonding surface between the first substrate portion 1 and the second substrate portion 2 is a gently curved, continuous surface, which alleviates the stress applied to areas where the number of laminated resin layers is large. This prevents cracking and chipping at the interface between the first substrate portion 1 and the second substrate portion 2, and the high rigidity of the second substrate portion 2 relative to the first substrate portion 1 prevents deformation, such as tilting, of the second substrate portion 2.

[0029] Fig. 3 is a diagram showing the positional relationship between the first substrate unit 1 and the second substrate unit 2. In Fig. 3, the bottom of the second substrate unit, which is part of the bonding surface of the second substrate unit 2 to the first substrate unit 1, is represented by S12, and the top surface of the first substrate unit 1 is represented by S1. Both are represented by a plane parallel to the XY plane in the figure.

[0030] 3, the bottom portion S12 of the second substrate portion 2 is located below the top surface S1 of the first substrate portion 1 along the Z axis. This structure makes it easier for the first material of the first substrate portion 1 to bulge near the base of the second substrate portion 2, resulting in a large bulge 3. This makes it easy to increase the bonding strength between the first substrate portion 1 and the second substrate portion 2.

[0031] Figure 4 is a diagram showing the shape of the joint between the base of the second substrate portion 2 and the first substrate portion 1. The boundary between the side of the second substrate portion 2 and the raised portion 3 has an inclined portion SS where the width of the side of the second substrate portion 2 increases downward from the top of the raised portion 3. The two-dot chain line shown in Figure 4 indicates the inclination angle of the inclined portion SS.

[0032] In this way, the inclination angle of the inclined portion SS is inclined from the Z-axis direction in the direction in which the width of the side of the second substrate portion 2 increases downward from the top of the raised portion 3. This structure makes it easier to increase the amount of the first material of the first substrate portion 1 covering the area near the base of the second substrate portion 2. This easily increases the bonding strength between the first substrate portion 1 and the second substrate portion 2.

[0033] As mentioned above, when a multilayer substrate is about to bend, stress is generally likely to concentrate in areas where the number of laminated resin layers is large. In multilayer substrate 101 of this embodiment, the first material has a strong holding force that holds second substrate portion 2 toward the main body of first substrate portion 1, preventing cracks and chips at the interface between first substrate portion 1 and second substrate portion 2.

[0034] Figure 5 is a cross-sectional view of a multilayer substrate 101 at an intermediate stage in its manufacture. The upper part of Figure 5 shows the state in which the second substrate portion 2 is stacked on the first substrate portion 1 and thermocompression bonded by, for example, isostatic pressing during the manufacture of the multilayer substrate 101. At this stage, the first substrate portion 1 is a laminated substrate having multiple resin layers and conductor layers, and is provided with a recessed portion CP at a predetermined position on the top. The second substrate portion 2 is a separate laminated substrate having multiple resin layers and conductor layers.

[0035] The recessed portion CP of the first substrate portion 1 is a mounting area for the second substrate portion 2. When viewed in the Z-axis direction, the area of ​​the recessed portion CP of the first substrate portion 1 is slightly larger than the area of ​​the joint between the first substrate portion 1 and the second substrate portion 2.

[0036] 5. When the first substrate portion 1 is made of a thermoplastic resin, thermocompression bonding causes the first material to flow into the recessed portion CP of the first substrate portion 1 where the second substrate portion 2 is to be mounted, and the second substrate portion 2 becomes embedded in the first substrate portion 1.

[0037] In the lower part of Figure 5, the arrows represent the resin flow of the first material in the first substrate portion 1. The resin layer of the first substrate portion 1 rises relative to the second substrate portion 2, and the upper part of the first substrate portion 1 is pressed against the side of the second substrate portion 2 in a direction along the XY plane. This forms the structure of the first substrate portion 1, the second substrate portion 2, and the raised portion 3 shown in Figures 1 to 4.

[0038] Fig. 6 is a cross-sectional view of another multilayer substrate 101A according to the first preferred embodiment, in which the upper part is a partial cross-sectional view of the multilayer substrate 101A, and the lower part is an enlarged view of the VP region of the upper part.

[0039] 1 to 5, the first material constituting the first substrate portion 1 and the second material constituting the second substrate portion 2 are both, for example, liquid crystal polymer resin (LCP), but they are not of the same composition. In contrast, in the multilayer substrate 101A shown in Fig. 6, the first material constituting the first substrate portion and the second material constituting the second substrate portion 2 are the same material. For example, both are liquid crystal polymer resin (LCP) of the same composition.

[0040] In addition to liquid crystal polymer resin (LCP), polyimide used in flexible substrates may also be used. For example, the first material constituting the first substrate unit 1 may be a highly flexible liquid crystal polymer resin (LCP), and the second material constituting the second substrate unit 2 may be a highly rigid material such as an epoxy substrate containing a glass base material used in printed circuit boards.

[0041] If the second material of the second substrate portion 2 is the same as the first material of the first substrate portion, a strong adhesive force can be obtained between the first substrate portion 1 and the second substrate portion 2.

[0042] Second Embodiment In the second embodiment, a multilayer substrate 102 showing the internal and surface configurations will be illustrated.

[0043] Fig. 7 is a cross-sectional view of a multilayer substrate 102 according to a second embodiment. Fig. 8 is a plan view of the multilayer substrate 102. In this example, a first substrate portion 1 having a rectangular planar shape is formed with a recessed portion CA having a rectangular planar shape, and a second substrate portion 2 is formed within this recessed portion CA.

[0044] The first substrate portion 1 includes a plurality of resin layers 11, 12, 13, 14, 15, and 16, Cu foil attached to one side of these resin layers 11, 12, 13, 14, 15, and 16, and interlayer connection conductors formed inside the resin layers 11, 12, 13, 15, and 16. These interlayer connection conductors are made of Cu or Ag, and are each formed by plating, for example.

[0045] In this example, the resin layers 11, 12, 13, 14, 15, and 16 are made of a thermoplastic resin such as a liquid crystal polymer resin (LCP), and are laminated by bonding adjacent resin layers together in the lamination direction and bonding adjacent resin layers to Cu foils in the lamination direction.

[0046] Inside the first substrate portion 1, a signal line pattern is formed on a conductor layer 4S made of Cu foil, and a ground conductor layer is formed on a conductor layer 4G made of Cu foil. These conductor layers 4S and 4G and the resin layers 11, 12, and 13 between them form a microstrip transmission line. By forming the transmission line in the first substrate portion 1 in this way, a rigid-flexible board can be formed in which the circuit connected to the second substrate portion 2 and the above-mentioned transmission line are integrated, thereby saving space overall.

[0047] The resin layer 16 has an opening, and this opening forms a cavity CA in part of the surface of the laminate formed by laminating the resin layers 11, 12, 13, 14, 15, 16 and the Cu foil.

[0048] At the interface between the bottom surface of the recessed portion (cavity) CA and the bottom surface of the second substrate portion 2, a raised portion 3 is formed around the bottom surface of the second substrate portion 2. The height of this raised portion 3 in the Z direction is smaller than the depth of the recessed portion CA.

[0049] The recessed portion CP shown in the upper part of Figure 5 is the mounting area for the second substrate portion 2, and is a recess formed in the first substrate portion 1 that is slightly wider than the outer shape of the second substrate portion 2, while the recessed portion (cavity) CA shown in Figure 7 is a recess formed in the first substrate portion 1 that is wider than the outer shape of the second substrate portion 2.

[0050] In this way, by stacking the second substrate portion 2 within the recessed portion CA of the first substrate portion 1, the height of the raised portion 3 is contained within the depth of the recessed portion CA. This prevents the rise of the raised portion 3 from adversely affecting other components. For example, even if another component is located on the top surface of the first substrate portion 1, that component will not come into contact with the raised portion 3, allowing the overall size to be kept small.

[0051] As shown in Figure 8, a radiating electrode 7 is formed on the upper surface of the second substrate portion 2, and acts as a patch antenna with the ground conductor layer formed near the lower surface of the second substrate portion 2 or the Cu foil of the first substrate portion 1 as the ground conductor layer.

[0052] The second material of the second substrate portion 2 has a higher dielectric constant than the first material of the first substrate portion. This allows the high dielectric constant of the second substrate portion to be effectively utilized. For example, this embodiment allows for the miniaturization of the patch antenna. Furthermore, the proportion of rigid portions in the multilayer substrate can be reduced.

[0053] According to this embodiment, the second substrate portion 2 has high rigidity relative to the first substrate portion 1, which reduces deformation such as tilting of the second substrate portion 2. This reduces deviation in the radiation direction (directivity) of the antenna.

[0054] Third Embodiment In the third embodiment, a multilayer substrate having a bent portion in a first substrate portion will be exemplified.

[0055] Fig. 9 is a cross-sectional view of a multilayer substrate 103 according to the third embodiment. This multilayer substrate 103 has the same configuration as the multilayer substrate 102 shown in Fig. 7. The first substrate portion 1 is flexible, and can be bent at any desired location.

[0056] 9, the first substrate portion 1 is bent at a predetermined bending angle 90° at the bending portion BP. In this way, even when the first substrate portion 1 is bent, the presence of the raised portion 3 reduces stress acting around the interface between the first substrate portion 1 and the second substrate portion 2.

[0057] Furthermore, since deformation of the rigid part RP is suppressed even when the flexible part FP is bent, the characteristics of the electronic component function configured in the rigid part RP can be stably maintained.

[0058] Fourth Embodiment In the fourth embodiment, an electronic device according to the present invention will be illustrated.

[0059] 10 is a cross-sectional view of an electronic device 301 according to a fourth embodiment. The electronic device according to the present invention includes a multilayer substrate according to the present invention and electronic components mounted on the multilayer substrate.

[0060] 10, electronic components 8 are mounted on the first substrate unit 1. The electronic components 8 are, for example, chip capacitors for matching the impedance of the signal transmission line connected to the radiating electrode 7, a power amplifier IC for outputting a transmission signal to the radiating electrode 7, a signal amplifier IC for amplifying a signal received by the radiating electrode 7, etc.

[0061] Various embodiments of the present invention have been presented so far, but these are all examples and are not intended to limit the scope of the present invention. Various omissions, substitutions, and modifications can be made to the embodiments of the present invention without departing from the spirit of the invention. Embodiments with such omissions, substitutions, and modifications are included within the scope and spirit of the present invention, and are also included in the scope of the invention and its equivalents as set forth in the claims of this application.

[0062] For example, in the second and fourth embodiments, an example was shown in which a patch antenna was formed on the second substrate portion 2, but the present invention can also be applied to a multilayer substrate in which other circuits are formed on the second substrate portion 2.

[0063] The multilayer substrate and electronic device of the present invention may be provided in the following aspects.

[0064] <1> a first substrate portion formed by laminating resin layers of a first material; a second substrate portion formed by laminating resin layers of a second material, the second substrate portion being bonded to the first substrate portion and having a protruding portion protruding from the first substrate portion; a protruding portion made of the first material, which is bonded to the base of the protruding portion of the second substrate portion and protrudes near the base of the protruding portion to cover a part of a side of the protruding portion; Equipped with a bottom portion of the second substrate portion, which is a part of the bonding surface of the second substrate portion relative to the first substrate portion, is located below an upper surface of the first substrate portion; Multilayer board.

[0065] <2> The boundary between the side of the second substrate portion and the raised portion has an inclined portion in which the width of the side of the second substrate portion increases downward from the top of the raised portion. <1> The multilayer substrate according to claim 1.

[0066] The multilayer substrate according to claim 1.

[0067] <3> The first material and the second material are the same material. <1> or <2> The multilayer substrate according to claim 1.

[0068] The multilayer substrate according to claim 1.

[0069] <4> The second material has a higher dielectric constant than the first material. <1> from <3> 10. The multilayer substrate according to claim 9, wherein

[0070] The multilayer substrate according to claim 1.

[0071] <5> the first material and the second material are thermoplastic resins; <1> from <4> 10. The multilayer substrate according to claim 9, wherein

[0072] <6> The thermoplastic resin is a liquid crystal polymer resin. <5> The multilayer substrate according to claim 1.

[0073] <7> The first material has a lower Young's modulus than the second material. <1> from <6> 10. The multilayer substrate according to claim 9, wherein

[0074] The multilayer substrate according to claim 1.

[0075] <8> The first substrate portion has a recess recessed from the upper surface of the first substrate portion, the second substrate portion is joined to the bottom of the recess of the first substrate portion, the raised portion is located within the recess, and a part of the second substrate portion protrudes from the upper surface of the first substrate portion. <1> from <7> 10. The multilayer substrate according to claim 9, wherein

[0076] <9> An antenna is formed on the second substrate portion. <1> from <8> 10. The multilayer substrate according to claim 9, wherein

[0077] <10> a transmission line is formed on the first substrate portion; <1> from <9> 10. The multilayer substrate according to claim 9, wherein

[0078] <11> the first substrate portion has a bent portion; <1> from <10> 10. The multilayer substrate according to claim 9, wherein

[0079] <12> <1> from <11> 10. An electronic device comprising the multilayer substrate according to any one of claims 1 to 9, and an electronic component mounted on the multilayer substrate. [Explanation of symbols]

[0080] BP...Bending part CA…Recessed portion CP: Concave part EX…Protrusion FP: Flexible part RP...Rigid section S1: Top surface of the first substrate S12: Bottom of the second board SS…Slope part 1...First board section 1a, 1b...resin layer of first substrate portion 2...Second board section 2a, 2b...resin layer of second substrate portion 2B...Base of protrusion 2S...Side of protrusion 3...Rising part 4,4S,4G…conductor layer 7...Radiation electrode 8...Electronic components 11, 12, 13, 14, 15, 16...Resin layers 101,101A,102,103…Multilayer board 301...Electronic equipment

Claims

1. a first substrate portion formed by laminating resin layers of a first material; a second substrate portion formed by laminating resin layers of a second material, the second substrate portion being bonded to the first substrate portion and having a protruding portion protruding from the first substrate portion; a protruding portion made of the first material, which is bonded to a base of the protruding portion of the second substrate portion and protrudes near the base of the protruding portion to cover a part of a side of the protruding portion; Equipped with a bottom portion of the second substrate portion, which is a part of a joining surface of the second substrate portion to the first substrate portion, is located below an upper surface of the first substrate portion; Multilayer board.

2. a boundary between the side of the second substrate portion and the raised portion has an inclined portion in which the width of the side of the second substrate portion increases downward from the top of the raised portion; The multilayer substrate according to claim 1 .

3. The first material and the second material are the same material. The multilayer substrate according to claim 1 or 2.

4. The second material has a higher dielectric constant than the first material. The multilayer substrate according to claim 1 or 2.

5. the first material and the second material are thermoplastic resins; The multilayer substrate according to claim 1 or 2.

6. The thermoplastic resin is a liquid crystal polymer resin. The multilayer substrate according to claim 5 .

7. The first material has a lower Young's modulus than the second material. The multilayer substrate according to claim 1 or 2.

8. the first substrate portion has a recess recessed from the upper surface of the first substrate portion, the second substrate portion is joined to the bottom of the recess of the first substrate portion, the raised portion is located within the recess, and a part of the second substrate portion protrudes from the upper surface of the first substrate portion; The multilayer substrate according to claim 1 or 2.

9. an antenna is formed on the second substrate portion; The multilayer substrate according to claim 1 or 2.

10. a transmission line is formed on the first substrate portion; The multilayer substrate according to claim 1 or 2.

11. the first substrate portion has a bent portion; The multilayer substrate according to claim 1 or 2.

12. 3. An electronic device comprising the multilayer substrate according to claim 1 or 2 and an electronic component mounted on the multilayer substrate.

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