Plasma treatment apparatus for humidifier

Abstract

To provide a plasma treatment apparatus for a humidifier by which it is possible to inhibit occurrence of mold in an interior of the humidifier.SOLUTION: A plasma treatment apparatus for a humidifier includes: a plasma generation part 10 that generates plasma and includes at least a dielectric layer and a pair of electrode layers disposed on both sides of the dielectric layer; a power supply part 30 that applies an AC voltage to the pair of electrode layers; and a gas flow part 20 that supplies gas to the plasma generation part 10 in order to treat gas with plasma, and supplies the gas treated with plasma into the humidifier 200.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a plasma treatment apparatus for a humidifier. [Background technology]

[0002] In recent years, a technique called dielectric barrier discharge (DBD) has been developed in plasma processing technology, making it possible to generate low-temperature plasma at atmospheric pressure. As a result, the range of applications of plasma processing has expanded, and it is increasingly being used in a variety of applications. The purposes of plasma processing include sterilization, deodorization, surface modification, and decomposition of chemical substances. Furthermore, the substances that can be subjected to plasma processing can be solid, liquid, or gaseous.

[0003] Various plasma processing apparatuses have been developed to perform continuous plasma processing while flowing air. For example, Patent Document 1 discloses a plasma generating apparatus in which plasma generating units, each having a flat plate-shaped first electrode and a second electrode facing each other across a gap, are stacked in two or more layers. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2022-190472 Summary of the Invention [Problem to be solved by the invention]

[0005] For example, humidifiers are prone to mold growth because they use water. Furthermore, using a humidifier that has mold in it can spray mold spores into the space, potentially inducing mold growth on items and food in the room. Therefore, it is desirable to be able to suppress mold growth inside humidifiers.

[0006] In view of the above background, an object of the present invention is to provide a plasma treatment apparatus for a humidifier that can suppress the growth of mold inside the humidifier. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems, the present invention is characterized by comprising a plasma generation unit that generates plasma and that has at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer, a power supply unit that applies an AC voltage to the pair of electrode layers, and a gas flow unit that flows a gas through the plasma generation unit to treat the gas with plasma and supplies the gas treated by plasma into a humidifier.

[0008] According to the present invention, a gas treated with plasma (also called a plasma gas) can be generated and supplied to the humidifier, thereby making it possible to suppress the growth of mold in the humidifier.

[0009] It is also preferable to have a sensor that detects plasma in the humidifier, and a control unit that receives the detection result of the sensor and sends a signal to apply an AC voltage to the power supply unit based on the detection result.

[0010] According to the present invention, the generation state of the gas treated with plasma in the humidifier is detected by the sensor, so that the gas treated with plasma can be efficiently supplied.

[0011] It is also preferable that the power supply unit has a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer unit that measures time.

[0012] According to the present invention, by controlling the timing of generating plasma according to the time, it is possible to efficiently supply gas that has been treated with plasma.

[0013] It is also preferable that the plasma generating device has a wireless interface that provides information to a terminal device and a control unit that transmits a signal to apply an AC voltage to the power supply unit, and that the control unit transmits information regarding plasma generation to the outside via the wireless interface.

[0014] According to the present invention, for example, a user can obtain information regarding plasma generation.

[0015] It is also preferable that the plasma generating unit has a housing that covers the plasma generating unit and is divided into multiple spaces by the dielectric layer, and that the housing has an inlet section through which gas flows into each space and an outlet section through which gas flows out, and that the housing is configured so that gases of different pressures flow into each space.

[0016] According to the present invention, gas treated with a plurality of plasmas at different pressures can be supplied from a single plasma generating unit, i.e., gas treated with plasmas at different pressures can be supplied according to the load of the supply destination.

[0017] The gas flow section preferably has a blower disposed within the humidifier.

[0018] According to the present invention, since the gas can be circulated to the plasma generating section using the air blower provided in the humidifier, the gas treated by the plasma can be efficiently supplied, and the plasma treatment device for the humidifier can be made smaller. [Effects of the Invention]

[0019] The plasma treatment device for a humidifier of the present invention can suppress the growth of mold inside the humidifier. It can also reduce bacteria and viruses inside the humidifier. Furthermore, gas treated with the leaked plasma can reduce bacteria, viruses, or mold in the surrounding environment. In addition, odorous components and chemical substances emitted from the humidifier can be taken into the plasma generation unit and converted into other substances that have no effect. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 2] FIG. 2 is a perspective view for explaining a plasma generating unit. [Figure 3] FIG. 2 is a cross-sectional view illustrating a plasma generating unit. [Figure 4] FIG. 10 is a perspective view for explaining a plasma generating unit according to a first modified example. [Figure 5] FIG. 10 is a perspective view for explaining a plasma generating unit according to a second modified example. [Figure 6] FIG. 10 is a perspective view for explaining a plasma generating unit according to a third modified example. [Figure 7] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fourth modified example. [Figure 8] FIG. 10 is a cross-sectional view illustrating a plasma generating unit according to a fifth modified example. [Figure 9] FIG. 13 is a cross-sectional view illustrating a plasma generating unit according to a sixth modified example. [Figure 10] 1 is a cross-sectional view showing a humidifier equipped with a plasma treatment apparatus for a humidifier according to a first embodiment of the present invention. [Figure 11] 1 is a block diagram showing a plasma processing apparatus for a humidifier according to a first embodiment; [Figure 12] 1 is an enlarged side view showing a plasma processing apparatus for a humidifier according to a first embodiment. [Figure 13] FIG. 10 is a cross-sectional view showing a humidifier equipped with a plasma treatment apparatus for a humidifier according to a second embodiment of the present invention. [Figure 14] FIG. 10 is an enlarged side view showing a plasma processing apparatus for a humidifier according to a second embodiment. [Figure 15] FIG. 10 is a cross-sectional view showing a humidifier including a plasma treatment apparatus for a humidifier according to a third embodiment of the present invention. [Figure 16] FIG. 10 is an enlarged side view showing a plasma processing apparatus for a humidifier according to a third embodiment. [Figure 17]FIG. 10 is a cross-sectional view showing a humidifier including a plasma treatment device for a humidifier according to a fourth embodiment of the present invention. [Figure 18] FIG. 10 is a cross-sectional view showing a humidifier including a plasma treatment apparatus for a humidifier according to a fifth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, embodiments of the present invention will be described in detail, but the embodiments of the present invention are not limited to the embodiments described below. Each embodiment and modified example can be applied in appropriate combination. Furthermore, directions such as "upper" and "lower" in the description are used for convenience of explanation and do not limit the directions of the present invention.

[0022] The plasma treatment apparatus for a humidifier of this embodiment has a multilayered plasma generation unit having a dielectric layer, an electrode layer, and a mask layer (optional) for continuous plasma treatment of gas, a power supply unit capable of applying an AC voltage between the pair of electrode layers, and a gas flow unit capable of flowing gas through the plasma generation unit. In dielectric barrier discharge, a dielectric layer is provided between two electrode layers, and by applying an AC voltage between the two electrode layers, plasma can be generated within the dielectric layer sandwiched between the two electrode layers. First, the plasma generation unit will be described.

[0023] <Basic structure of the plasma generation unit> As shown in Figures 1 and 2, the plasma generating unit 10 includes a dielectric layer 11, an upper electrode 12, a lower electrode 13, an upper mask layer 14, and a lower mask layer 15. The plasma generating unit 10 is a flexible thin-film member. For convenience, the dielectric layer 11 is expressed as a single dielectric, but it may also be a laminate of one or more dielectrics containing air. The mask layer is provided to protect the electrodes and improve the assembly and performance of the electrodes, and may be omitted. Furthermore, by appropriately selecting the thickness and position of the mask layer, excessive electric field concentration on the electrodes can be prevented, thereby extending the life of the electrodes.

[0024] As shown in Figures 1 to 3, the dielectric layer 11 is a layered member disposed between the upper electrode 12 and the lower electrode 13. The material of the dielectric layer 11 is an insulating material with a large breakdown voltage so as to prevent discharge between the upper electrode 12 and the lower electrode 13. Furthermore, since the material of the dielectric layer 11 is exposed to the generated plasma, it is preferable that the material be durable against the active substances generated in the plasma. The material of the dielectric layer 11 is preferably a material selected from the group consisting of glass, ceramics, and synthetic resins. "Mainly" means that the component composition is 50% by mass or more (the same applies hereinafter). For convenience, the dielectric layer 11 is shown as a single dielectric, but it may also be a layered structure of multiple dielectrics including air.

[0025] Examples of glass include soda-lime glass (soda glass), borosilicate glass, quartz glass, lead glass, and oxide glass. Synthetic resins include thermoplastic resins and thermosetting resins. Examples of thermoplastic resins include general-purpose resins such as polyolefin, polystyrene, polyvinyl acetate, polyurethane, polylactic acid, ABS resin, AS resin, acrylic resin, polyvinyl chloride, and polyvinylidene chloride; engineering plastics such as polyamide, polyacetal, polycarbonate, modified polyphenylene ether, polyester, and cyclic polyolefin; polyphenylene sulfide, polysulfone, polyethersulfone, polyarylate, liquid crystal polymer, polyetheretherketone, polyimide, polyamideimide, polyetherimide, fluorine-based resin, unsaturated polyester resin, and polyurethane resin. Among these synthetic resins, silicone-based resins, polyimide-based resins, and Teflon-based resins, which have excellent durability, are particularly preferred. The thickness of the dielectric layer 11 is not particularly limited, but is preferably 0.01 mm to 5.0 mm, more preferably 0.1 mm to 3.0 mm, and even more preferably 0.1 mm to 1.0 mm, in order to achieve lightweight and compactness.

[0026] As shown in FIGS. 2 and 3, the upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are layer members disposed on the front and back of the dielectric layer 11. The upper electrode 12 and the lower electrode 13 are each provided with a through-hole 16 penetrating in the thickness direction. In this embodiment, the through-holes 16 are oval in shape, and five through-holes 16 are formed, but the shape and number are not limited. The through-holes 16 may be omitted, but the presence of the through-holes 16 in this embodiment makes it easier to generate plasma and facilitates the creation of a power supply circuit. Furthermore, contact with gas at the through-holes 16 enables plasma processing of the gas.

[0027] The upper electrode (electrode layer) 12 and the lower electrode (electrode layer) 13 are formed of a conductive material, and may be a metal plate (including metal foil), a conductive paint, a conductive polymer, a conductive film, etc. The thickness of the upper electrode 12 and the lower electrode 13 is not particularly limited, but is preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm, respectively, in order to provide a flexible, lightweight, and compact processing device.

[0028] The dielectric layer 11, the upper electrode 12, and the lower electrode 13 may be laminated without using an adhesive, or may be bonded with an adhesive. The adhesive is preferably a material that is durable against active substances generated in plasma. Examples of adhesives include epoxy, acrylic, urethane, phenol, urea, silicone, cyanoacrylate, rubber, and vinyl acetate adhesives. Among these, silicone adhesives and UV-curable epoxy adhesives are preferred from the viewpoint of durability, with polyamide adhesives, polyimide adhesives, and silicone adhesives being more preferred. The thickness of the adhesive is preferably 0.01 to 0.2 mm, and more preferably 0.01 to 0.1 mm.

[0029] As shown in FIG. 3 , the upper mask layer (mask layer) 14 and the lower mask layer (mask layer) 15 are members respectively disposed on the outer sides of the upper electrode 12 and the lower electrode 13. More specifically, the upper mask layer 14 is disposed on the upper surface of the upper electrode 12. The lower mask layer 15 is disposed on the lower surface of the lower electrode 13. The upper mask layer 14 and the lower mask layer 15 are each provided with through holes 17. In this embodiment, the through holes 17 are oval and five of them are formed, but the shape and number are not limited thereto. The through holes 17 may be omitted, but for ease of manufacture, it is preferable that the through holes 17 are the same as the through holes 16, although this is not limited thereto.

[0030] 2 and 3, through-hole 17 has the same shape as through-hole 16 and is connected to each other. Through-holes 16 and 17, dielectric layer 11 is exposed to the outside. In other words, the surface of dielectric layer 11 is exposed to the outside at multiple locations where through-holes 16 and 17 are formed. Hole walls (cross-sectional portions) 16a and 17a of through-holes 16 and 17 are also exposed to the outside.

[0031] The upper mask layer 14 and the lower mask layer 15 are formed of an insulating material. The hardness of the upper mask layer 14 and the lower mask layer 15 is preferably equal to or less than that of the upper electrode 12 and the lower electrode 13. Although the plasma generation unit 10 can be difficult to handle if it is manufactured using a thin material, providing the upper mask layer 14 and the lower mask layer 15 improves ease of handling. Furthermore, the upper mask layer 14 and the lower mask layer 15 protect the thin conductor from mechanical and physical shocks during manufacturing and use, as well as deterioration caused by the surrounding environment. They also provide mechanical protection from scratches that may occur during manufacturing. Considering that the plasma generation unit 10 will be installed on an object to be attached, the upper mask layer 14 and the lower mask layer 15 preferably have a hardness that allows for easy installation along the object and also improves ease of handling. Furthermore, dividing the dielectric layer 11 into two allows the upper and lower structures of the plasma generation unit 10 to be symmetrical. It can be easily manufactured by assembling the upper and lower layers and bonding them together in the center. In this case, the dielectric layer 11 is divided into three layers: the upper layer, the lower layer, and the adhesive layer, but can be considered electrically as a single dielectric. The thicknesses of the upper mask layer 14 and the lower mask layer 15 are not particularly limited, but in order to provide a flexible, lightweight, and compact processing device, they are preferably 5 μm to 1.0 mm, more preferably 5 μm to 0.2 mm, and even more preferably 5 μm to 0.1 mm. The thicknesses of the upper mask layer 14 and the lower mask layer 15 may be set as appropriate, but in this embodiment they are formed to be larger than the thicknesses of the upper-layer electrode 12 and the lower-layer electrode 13.

[0032] The plasma generating unit 10 is very thin and flexible, which can make it difficult to handle during assembly. Furthermore, the upper electrode 12 and the lower electrode 13 are formed of conductive materials, such as conductive metals or conductive dielectrics. Metals, for example, can be corroded by liquids or gases. For example, the upper electrode 12 and the lower electrode 13 are oxidized by highly oxidizing gases and corroded by sulfuric acid or hydrochloric acid. Furthermore, if the upper electrode 12 and the lower electrode 13 are made of a resin-based conductive material, they may be deteriorated by humidity or acid. Furthermore, the plasma generating unit 10 is designed to be installed according to the shape of the object to which it is to be attached. However, if only the upper electrode 12 and the lower electrode 13 are used without the upper mask layer 14 and the lower mask layer 15, problems can arise, such as wrinkles in the metal constituting the electrodes or gaps between the electrodes and the dielectric layer 11, if the electrodes are made of thin metal. If gaps are formed between the upper layer electrode 12 and the lower layer electrode 13 and the dielectric layer 11, this can cause abnormal discharge or partial discharge. In this regard, according to this embodiment, the upper mask layer 14 and the lower mask layer 15 can protect the upper electrode 12 and the lower electrode 13, and the plasma generating unit 10 can be easily handled, improving workability and assembly. Furthermore, the provision of the upper mask layer 14 and the lower mask layer 15 allows installation on an object without forming wrinkles or gaps. Furthermore, when multiple pairs of electrodes are provided to form a multi-stage structure, the upper mask layer 14 and the lower mask layer 15 also serve as part of the dielectric that constitutes the barrier discharge, making it less likely that abnormal discharge will occur even if gaps are formed during installation. Depending on the situation, the same effect can be achieved with either the upper or lower mask layer.

[0033] The outer edges of upper-layer electrode 12 and lower-layer electrode 13 may be sealed with an insulator (not shown) to prevent deterioration over time due to exposure to the outside world and to prevent discharge from occurring via the outer edges other than through-hole 16. When a resin or the like is used as the mask layer, this effect is achieved because the resin thinly spreads over not only upper-layer electrode 12 and lower-layer electrode 13 but also the upper and lower surfaces of dielectric layer 11. Similarly, the outer edges of the upper mask layer 14 and the lower mask layer 15 may be sealed with an insulator (not shown) to prevent their outer edges from being exposed to the outside world and reacting with external substances to deteriorate over time, and to prevent discharge from occurring through the outer edges other than the through holes 17.

[0034] When the longitudinal direction of the through holes 16, 17 is parallel to the gas flow direction, the resistance to the gas flow is small and the gas flows smoothly. On the other hand, when the longitudinal direction of the through holes 16, 17 is perpendicular to the gas flow direction, the resistance to the gas flow is large, the gas flow is disturbed, and the gas is agitated.

[0035] The shape, number, and orientation of the through-holes 16 and 17 relative to the gas flow can be selected appropriately depending on the purpose of the plasma processing, the effect of the plasma processing, and other factors. The through-holes may have different shapes on the front and back sides of the plasma generating unit 10. Alternatively, through-holes may be provided on the front side of the plasma generating unit 10, while no through-holes are provided on the back side. In this example, the through-holes are shown as rectangles with rounded corners, but this shape is not required. Round, oval, square, or triangular shapes are also acceptable. However, shapes with sharp corners tend to concentrate the electric field, so rounded corners are more appropriate. A similar effect can also be achieved with a structure with larger holes, such as a mesh-like shape. While five holes are shown in the figure, there is no limit to the number. Multiple holes may be arranged vertically or horizontally. Furthermore, holes with company logos or initials, etc., can be provided to expose the plasma generated through the holes, allowing for use as a display. Dividing the electrode into multiple sections, each with a differently shaped hole, and continuously switching between electrodes can function as a dynamic display.

[0036] <First Modification of Plasma Generation Unit> 4 is a perspective view for explaining a plasma generating unit according to a first modified example. The plasma generating unit 10A according to the first modified example differs from the basic structure described above in that it does not have an upper mask layer 14. As in the plasma generating unit according to the first modified example, the mask layer may be provided only on one side of the plasma generating unit 10A.

[0037] <Second Modification of Plasma Generation Unit> FIG. 5 is a perspective view illustrating a plasma generating unit according to a second modified example. The plasma generating unit 10B according to the second modified example differs from the basic structure described above in that it does not include the upper mask layer 14 and the lower mask layer 15. As in the plasma generating unit 10B according to the second modified example, the upper mask layer 14 and the lower mask layer 15 may be omitted. In other words, by configuring the plasma generating unit 10B with only the dielectric layer 11, the upper-layer electrode 12, and the lower-layer electrode 13, it is possible to further reduce the size and the number of parts. Furthermore, when using this plasma generating unit in a process for manufacturing printed circuit boards, semiconductors, etc., process steps can be omitted, thereby reducing product costs.

[0038] Furthermore, as in the first and second modified examples, by omitting either or both of the upper mask layer 14 and the lower mask layer 15, the overall thickness can be reduced and flexibility can be increased, which is convenient when creating an ultra-compact plasma generation device.

[0039] <Third Modification of Plasma Generation Unit> FIG. 6 is a perspective view illustrating a plasma generation unit according to a third modified example. The plasma generation unit 10C according to the third modified example differs from the basic structure described above in that an air layer 18 is provided below the dielectric layer 11C. However, if air is considered a dielectric with a relative dielectric constant of 1 and the combined air and dielectric layer 11C are considered a single dielectric, the plasma generation unit 10C can be considered the same as the basic structure shown in FIG. 2. The composite relative dielectric constant (or dielectric constant) can be calculated from the respective relative dielectric constants (or dielectric constants) and thicknesses. The plasma generation unit 10C according to the third modified example includes a dielectric layer 11C, an upper electrode 12, a lower electrode 13, an upper mask layer 14, a lower mask layer 15, and an air layer 18. The air layer 18 is provided between the dielectric layer 11C and the lower electrode 13. In the third modified example, three surfaces can come into contact with gas: the air layer 18 between the upper electrode 12 and the lower electrode 13, the back surface of the lower electrode 13, and the back surface of the upper electrode 12. The back surface here refers to the surface opposite to the air layer 18. This improves the plasma utilization efficiency compared to when only the air layer 18 is used, and allows for plasma processing of a larger amount of gas.

[0040] <Fourth Modification of Plasma Generation Unit> FIG. 7 is a cross-sectional view illustrating a plasma generation unit according to a fourth modification. The plasma generation unit 10D according to the fourth modification differs from the third modification in that it does not include an upper mask layer 14. In this case, too, a dielectric with a relative permittivity of 1 is considered. Furthermore, if the dielectric layer 11C and the dielectric layer 11C are considered as a single dielectric, the composite dielectric portion in this structure can be considered to be the same as the dielectric shown in FIG. 2 for the basic structure. The composite relative permittivity (or dielectric constant) can be calculated from the thickness and dielectric constant of the dielectric layer 11C and the thickness and dielectric constant of the air layer 18 (or the dielectric constant of air if air is permeable). The plasma generation unit 10D includes the dielectric layer 11C, the upper electrode 12, the lower electrode 13, the lower mask layer 15, and the air layer 18. As in the fourth modification, the upper mask layer may be omitted while providing the air layer 18 between the dielectric layer 11C and the lower electrode 13. This configuration can achieve substantially the same effects as the third modification while reducing the number of components. Furthermore, when the plasma generating unit is produced using the processes for printed circuit boards or semiconductor ICs, the process steps can be omitted, thereby reducing costs.

[0041] <Fifth Modification of Plasma Generation Unit> FIG. 8 is a cross-sectional view illustrating a plasma generating unit according to a fifth modification. The plasma generating unit 10E according to the fifth modification differs from the third modification in that it does not include the upper mask layer 14 and the lower mask layer 15. The plasma generating unit 10E also includes a dielectric layer 11Cb on the lower surface of the lower electrode 13. The plasma generating unit 10E includes dielectric layers 11Ca and 11Cb, an upper electrode 12, and a lower electrode 13. The dielectric layer 11Cb on the lower surface of the lower electrode 13 is used to support the lower electrode 13. As in the fifth modification, the upper and lower mask layers may be omitted while providing an air layer 18 between the dielectric layer 11Ca and the lower electrode 13. This configuration achieves substantially the same effects as the third modification while reducing the number of components. This reduces the thickness of the electrodes. Furthermore, when fabricating this plasma generating unit using a printed circuit board or semiconductor IC process, it eliminates process steps, thereby reducing costs. Furthermore, the reduced material thickness improves flexibility.

[0042] The upper dielectric layer 11Ca and the air layer 18 function as a single dielectric. This dielectric constant can be calculated from the relative permittivity (or dielectric constant) and thickness of the upper dielectric layer 11Ca, and, if air is used as the gas, the relative permittivity (or dielectric constant) of the air and the thickness of the air layer 18. The lower dielectric layer 11Cb plays almost no role in plasma generation. However, this structure allows the same material to be used for the upper electrode 12 and the lower electrode 13. This reduces manufacturing costs.

[0043] <Sixth Modification of Plasma Generation Unit> 9 is a cross-sectional view for explaining a plasma generating unit according to the sixth modified example. The plasma generating unit 10F according to the sixth modified example includes, from top to bottom, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, a dielectric layer 11Cb, an air layer 18, an upper electrode 12, a dielectric layer 11Ca, an air layer 18, a lower electrode 13, and a dielectric layer 11Cb. In other words, it is configured by stacking two plasma generating units 10E according to the fifth modified example in the height direction. The ends of the dielectric layers 11Ca and 11Cb are supported by a box-shaped housing 21F.

[0044] Inside the housing 21F, basic units in which an upper-layer electrode 12 is laminated only on one side (top surface) of a dielectric layer 11Ca and basic units in which a lower-layer electrode 13 is laminated only on one side (top surface) of a dielectric layer 11Cb are alternately arranged with an air layer (gas inlet layer) 18 between them. As a result, electrodes of opposite polarity are alternately laminated, but if a space in which plasma is not generated is desired, the electrodes do not need to be alternately arranged. By designing a space in which plasma is not generated in this way, it is possible to place a sensor, wiring, or other circuits between them. An air layer 18 is formed between each of the electrode layers adjacent in the vertical direction.

[0045] According to this modification, the plasma generating section 10F can be easily formed simply by stacking basic units each consisting of a dielectric layer and an electrode layer (upper electrode 12 or lower electrode 13) at intervals. Furthermore, since plasma can be generated in multiple air layers 18, plasma can be generated efficiently in a small space. Furthermore, since no separate components such as spacers are required to space the basic units, multi-stage construction is easily possible, reducing manufacturing costs and shortening development time. In this way, the number of stacked electrodes can be freely changed, which has the advantage of allowing the amount of contact between plasma and gas to be controlled and devices with different capacities to be easily constructed.

[0046] The functions achieved by treating gas with plasma include sterilization, virus inactivation, deodorization, surface modification, and decomposition of chemical substances.The mechanism by which these functions are achieved is thought to be that plasma treatment generates active species in the gas, such as singlet oxygen, hydrogen peroxide, OH radicals, peroxide radicals, and ozone, which kill target microorganisms and decompose and modify chemical substances through oxidation reactions.Microorganisms include various bacteria, viruses, and mold.

[0047] The plasma-treated gas is sterilized and deodorized by killing microorganisms present in the gas and decomposing chemical substances due to the activated species generated by the plasma. Furthermore, active species remain in the plasma-treated gas, so by spraying the plasma-treated gas generated by the plasma treatment apparatus of this embodiment onto an object, microorganisms present in the object are killed and chemical substances are decomposed, thereby sterilizing and deodorizing the object.

[0048] First Embodiment Next, a plasma processing apparatus for a humidifier according to a first embodiment of the present invention will be described. As shown in Figures 10 and 11, the plasma processing apparatus for a humidifier 100 according to this embodiment is provided in a humidifier 200. The humidifier 200 includes a water tank 201, an ultrasonic vibrator 202, a dust filter 203, and a blower 24. In this embodiment, the humidifier 200 is an ultrasonic humidifier.

[0049] The water tank 201 is a container that stores water 205 for the humidifier 200 and supplies the water 205 to the humidifier 200. The water tank 201 is detachably mounted, and a valve (not shown) closes the outlet for the water 205 when the water tank 201 is removed from the humidifier 200. The ultrasonic vibrator 202 generates ultrasonic vibration energy when a high-frequency AC voltage is applied, and this vibration energy atomizes the water 205. The ultrasonic vibrator 202 is disposed at the bottom of the portion of the atomization chamber 210 that ejects mist. The dust filter 203 captures dust, debris, bacteria, etc. in the air that flows into the humidifier 200, preventing them from entering the interior of the humidifier 200. The dust filter 203 is disposed in the air inlet chamber 220 of the humidifier 200. The blower 24 will be described later.

[0050] As shown in Figures 10 and 11, the plasma processing apparatus 100 for a humidifier includes a plasma generating unit 10, a gas flow unit 20, a power supply unit 30, a sensor 40, a wireless interface 50, and a control unit 60. The plasma generating unit 10 of this embodiment has the same basic structure as the plasma generating unit described above, but various modified examples of the plasma generating unit may also be used. One or more plasma generating units 10 may be installed.

[0051] The gas flow unit 20 is a part that flows gas into the plasma generating unit 10 to treat the gas with plasma, and supplies the plasma-treated gas into the humidifier 200. As also shown in Fig. 12, the gas flow unit 20 includes a housing 21 and a blower 24. The housing 21 is a box-shaped body that covers the plasma generating unit 10.

[0052] Housing 21 is detachably attached to dust filter 203 (on the surface from which air flows out) of humidifier 200. Housing 21 has an inlet (inlet portion) 21a through which gas (air) flows in, and an outlet (outlet portion) 21b through which gas (air) flows out.

[0053] The blower 24 is a device that supplies air to the plasma generation unit 10 and also supplies gas treated with plasma to the atomization chamber 210 of the humidifier 200, and can be appropriately selected from known devices. As a driving device for moving the gas, known devices such as a centrifugal blower (such as a sirocco fan, radial fan, or turbo fan), an axial flow blower (such as a propeller fan), a mixed flow blower (such as a line fan), a cross flow blower, a blower, a compressor, or an air pump can be appropriately used. The blower 24 operates or stops, or controls the airflow rate or gas discharge pressure, based on a control signal from the control unit 60.

[0054] The air blower 24 is disposed within the humidifier 200 above the dust filter 203 and at the air inlet 211 of the atomization chamber 210. In this embodiment, for example, a fan provided in the humidifier 200 is also used as the air blower 24 of the plasma processing apparatus 100 for a humidifier. The air blower 24 may be included in the plasma processing apparatus 100 for a humidifier, or may be a separate component from the plasma processing apparatus 100 for a humidifier.

[0055] The power supply unit 30 applies an AC voltage between the upper electrode 12 and the lower electrode 13, which face each other with the dielectric layer 11 sandwiched therebetween. The power supply unit 30 is connected to, for example, a power connector 31. There are no particular limitations on the power supply unit 30 as long as it can apply an AC voltage of a predetermined voltage at a predetermined frequency to each electrode of the plasma generation unit 10, and any known power supply device can be used. The frequency of the AC voltage is preferably 50 Hz to 30 MHz, and more preferably 50 Hz to 100 kHz. The AC voltage is preferably 0.1 to 50 kV, and more preferably 0.2 to 10 kV.

[0056] The sensor 40 is a sensor that detects the generation state of gas treated with plasma in the humidifier 200, and is a sensor module that includes sensors for temperature, humidity, light, infrared rays, ozone, PM2.5, CO2, etc. The measurement results are sent to the control unit 60. The sensor 40 is installed inside the humidifier 200. In this embodiment, the sensor 40 is installed inside the atomization chamber 210, but it may also be installed in another location, such as above the dust filter 203 in the air inlet chamber 220. The amount of plasma generated, etc., is determined according to pre-programmed requirements through these sensors, and the plasma output and air volume are controlled. The sensor 40 estimates the amount of activated species by referencing the value of the ozone sensor, acquiring temperature, humidity, the power and voltage supplied to the plasma generating unit 10, the plasma emission intensity, and the like. The ozone sensor measures the amount of ozone in the humidifier 200. For example, when plasma-treating air, the oxygen concentration in the air remains almost constant, and ozone is generated as a by-product of the plasma-treating oxygen. The amount of activated species resulting from the plasma-treating can be estimated by using the ozone sensor and information such as humidity, temperature, and plasma intensity. The measurement results (detection results) are transmitted to the control unit 60. The plasma intensity can be estimated from the power supplied to the plasma generating unit 10, or, if the shape of the plasma generating unit 10 is constant, from the voltage, etc. Alternatively, the plasma intensity can be measured directly using a photosensor. If the oxygen concentration varies significantly, an oxygen sensor can be added.

[0057] The wireless interface 50 is a component that wirelessly provides information to a mobile terminal device, a terminal device, etc. The control unit 60 transmits information related to plasma generation to the wireless interface 50. The information related to plasma generation includes, for example, the number of plasma occurrences, the amount of plasma generated (plasma density), the plasma strength, the voltage, current, or amount of power, the operating time, the temperature of the power supply unit, the controller, the plasma generation unit, humidity, information related to the fan and pump, the water temperature, error information, etc. The information transmitted to the mobile terminal device, etc. may also include, for example, the amount of water. The wireless interface 50 may use, for example, Bluetooth (registered trademark), Wi-Fi, NFC (Near Field Communication), an induction coil, an optical sensor, etc. The mobile terminal device may use, for example, a smartphone, a mobile phone, etc. The terminal device may use, for example, a personal computer or a tablet.

[0058] The control unit 60 is a unit that controls each part of the humidifier plasma processing device 100 by sending control signals to them. The control unit 60 is installed in the housing 21. The control unit 60 includes at least a calculation unit (central processing unit) and a memory unit. The control unit 60 is connected to the power connector 31 via a control unit power supply 61. The control unit power supply 61 is a unit that generates and supplies the power required for the operation of the control unit 60. The control unit 60 sends a control signal to the power supply unit 30 via a high-voltage control unit (not shown) provided within the control unit 60 to apply an AC voltage to each electrode layer (upper electrode 12 and lower electrode 13). In addition, the control unit 60 sends a control signal to the air blower 24 in accordance with the application of the AC voltage to circulate air through the plasma generation unit 10.

[0059] In this embodiment, the control unit 60 sends a control signal to the blower 24 to operate the blower 24, but the control unit 60 may not be configured to send a control signal to the blower 24, but may be configured to operate the blower 24 separately when the humidifier 200 is operating. Also, in this embodiment, the plasma processing apparatus 100 for a humidifier may be operated by turning on the power of the humidifier 200, or the operation of the humidifier 200 and the operation of the plasma processing apparatus 100 for a humidifier may be controlled separately.

[0060] The control unit 60 may be provided with a timer unit (not shown) that measures the date and time. The timing at which the control unit 60 applies the AC voltage can be set as appropriate. For example, the control unit 60 may be provided with a timer unit that measures the time, and plasma may be generated during a desired time period, or may be operated by a predetermined operation, or may be operated continuously.

[0061] Next, the effects of this embodiment will be described. The control unit 60 sends a control signal to the power supply unit 30 to apply an AC voltage, and also operates the air blower 24 or controls the airflow rate. As a result, gas flows into the housing 21, and the gas is treated with plasma in the plasma generation unit 10, and the gas treated with plasma is supplied into the humidifier 200. This allows the inside of the humidifier 200 to be efficiently sterilized, reducing various types of bacteria, viruses, mold, etc.

[0062] Humidifiers are prone to mold growth because they handle water and maintain high humidity. In particular, ultrasonic humidifiers, which do not heat water, are prone to mold growth in areas where air and water come into contact, such as the dust filter that takes in air, the atomization chamber, and the chamber where the water tank is installed. In this embodiment, air flows into the air inlet chamber 220 and passes through the dust filter 203. This generates gas treated with plasma for humidifiers, which has a bactericidal (sterilizing) effect, and the plasma-treated gas can be supplied to the atomization chamber 210 via the air blower 24. Without the plasma treatment device 100 for humidifiers, mold is likely to grow around areas where water and air (gas) come into contact. However, supplying gas treated with plasma as in this embodiment reduces the activity of the mold and suppresses mold growth. That is, by supplying plasma-treated gas to the atomization chamber 210 using the plasma processing device 100 for a humidifier, a portion of the plasma-treated gas dissolves in the water 205, generating plasma water with a bactericidal (sterilizing) effect. This allows the plasma water to reach areas where the water 205 comes into contact with the air (gas) in the atomization chamber 210 and the installation chamber 230 of the water tank 201, thereby reducing mold and inhibiting its growth. Furthermore, the buildup of limescale inside the plasma processing device 100 for a humidifier can be suppressed. Furthermore, reducing mold and inhibiting its growth can reduce the generation of mycotoxins, which are believed to be a cause of Alzheimer's disease, and indirectly reduce the number of Alzheimer's patients.

[0063] Furthermore, the sensor 40 can be used to detect the temperature, humidity, ozone concentration, and the like inside the humidifier 200. Furthermore, when generating gas treated with plasma as in this embodiment, ozone is generated as a by-product of oxygen treatment with plasma. The amount of activated species resulting from plasma treatment can be estimated from the concentration of ozone, which is a by-product, as well as humidity, plasma power, temperature, and the like. Furthermore, the plasma treatment capacity can be controlled, and operation can be started or stopped based on these measurement results. Furthermore, if the measurement results of the sensor 40 show that the calculated active ingredient continues to decrease, the calculated active ingredient remains decreased, or abnormal fluctuations in the calculated active ingredient are detected, it can detect that there is some kind of malfunction and send an error signal, or it can send error information to the user's mobile terminal device, etc. via the wireless interface 50.

[0064] Furthermore, since the system is equipped with a wireless interface 50, information regarding plasma generation can be transmitted to, for example, the user's mobile terminal device. This allows the user to understand the status of plasma generation. Furthermore, the control unit 60 can calculate the electricity charge from the amount of electricity, and this information can also be provided to the user.

[0065] Second Embodiment Next, a plasma processing apparatus for a humidifier according to a second embodiment of the present invention will be described.

[0066] As shown in FIG. 13, in the plasma processing apparatus 100A for a humidifier, a housing 21A is detachably attached to the side of a humidifier 200A. As shown in FIGS. 13 and 14, the plasma processing apparatus 100A for a humidifier differs from the first embodiment in that a plurality of spaces are provided within the housing 21A, allowing gases of different pressures to be extracted. Also, in the plasma processing apparatus 100A for a humidifier, the gas flow unit 20A differs from the first embodiment in that it includes the housing 21A, inlet tubes (inlet sections) 22A, 22B, and 22C, outlet tubes (outlet sections) 23A, 23B, and 23C, and blowers 25A, 25B, and 25C. This embodiment will be described focusing on the differences from the first embodiment.

[0067] Inflow tubes 22A, 22B, 22C are flexible cylindrical bodies that connect blowers 25A, 25B, 25C to housing 21A. Outflow tube 23A is a flexible cylindrical body that extends to the outside of humidifier 200A. Outflow tubes 23B, 23C are flexible cylindrical bodies that connect housing 21A to humidifier 200A. Each inflow tube 22A, 22B, 22C is connected to each blower 25A, 25B, 25C. The tip of outflow tube 23A is located outside humidifier 200A, near the periphery of humidifier 200A. The tip of outflow tube 23B is located in installation chamber 230 of water tank 201 (near the water outlet). The tip of outflow tube 23C is located above dust filter 203 in air inflow chamber 220. The inlet tubes 22A, 22B, and 22C may have other configurations as long as they function as inlet portions capable of supplying gas to the plasma generating unit 10. The outlet tubes 23A, 23B, and 23C may have other configurations as long as they function as outlet portions for discharging the gas treated by plasma in the plasma generating unit 10. Each of the blowers 25A, 25B, and 25C can deliver gas at different wind speeds (wind pressures). Instead of the blowers 25A, 25B, and 25C, the inlet tubes 22A, 22B, and 22C may be connected to the outlets of pressurized air hoses, for example, to deliver the gas. In this case, the blowers 25A, 25B, and 25C are unnecessary.

[0068] The housing 21A includes a dielectric layer 11Aa and a dielectric layer 11Ab, which divide the housing 21A into three spaces: a first space 71, a second space 72, and a third space 73. An upper electrode 12 is provided on the upper surface of the dielectric layer 11Aa, and a lower electrode 13 is provided on the lower surface of the dielectric layer 11Ab. The upper electrode 12 and the lower electrode 13 are electrically connected to a power supply unit 30. The upper electrode 12, the lower electrode 13, the dielectric layer 11Aa, the dielectric layer 11Ab, and the second space 72 (air layer) constitute a "plasma generation unit." By applying an AC voltage to the upper electrode 12 and the lower electrode 13, gas flowing through the first space 71, the second space 72, and the third space 73 can be treated with plasma. The upper electrode 12 and the lower electrode 13 may have holes or a structure with larger holes (e.g., a mesh-like structure) as needed. Furthermore, a mask layer may be provided on the upper layer electrode 12 and the lower layer electrode 13 to protect the electrodes.

[0069] In the first space 71, gas flows in through inlet tube (inlet portion) 22A, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23A. In the second space 72, gas flows in through inlet tube (inlet portion) 22B, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23B. In the third space 73, gas flows in through inlet tube (inlet portion) 22C, and the gas treated with plasma is taken out through outlet tube (outlet portion) 23C.

[0070] The plasma-treated gas extracted from each space has a different pressure (air pressure), so the supply destination of the plasma-treated gas can be selected depending on the air pressure. For example, since a high pressure is required to send air to a large space within the humidifier 200A, the gas treated with the plasma at the highest pressure is supplied to the air inlet chamber 220 connected to the atomization chamber 210, above the dust filter 203. Alternatively, the gas treated with the plasma at the next highest pressure may be supplied to the installation chamber 230 of the water tank 201 (near the water outlet), and the gas treated with the plasma at the lowest pressure may be supplied to the periphery of the humidifier 200A. However, the location to which the gas treated with the plasma at each pressure is supplied may be appropriately adjusted depending on the specifications of the humidifier 200A. The plasma-treated gas may be supplied to the installation chamber 230 of the water tank 201 (near the water outlet) or into the water 205 discharged from the water tank 201.

[0071] Next, the effects of this embodiment will be described, focusing on the differences from the first embodiment.

[0072] According to this embodiment, the gas flow unit 20A can extract gas treated with plasma at multiple different pressures (atmospheric pressures) from one plasma generation unit. This allows efficient supply of plasma-treated gas even when the pressure loads of the supply destinations are different, such as above the dust filter 203 in the air inlet chamber 220, the installation chamber 230 of the water tank 201 (near the water outlet), and the periphery of the humidifier 200A. Furthermore, by supplying plasma-treated gas to the installation chamber 230 of the water tank 201 of the humidifier 200A (near the water outlet) in addition to the atomization chamber 210, mold growth due to the humidifier 200A can be more effectively suppressed. Furthermore, by supplying plasma-treated gas to the periphery of the humidifier 200A, the gas around the humidifier 200A can be sterilized, thereby further enhancing the sterilization effect. Although three spaces are provided in this embodiment, two or four or more spaces may be provided.

[0073] The gas load varies depending on the conditions of the supply destination. For example, when sending gas to a large space inside the humidifier 200A, a higher pressure is required than when sending gas to the atmosphere. In such a case, if plasma generation units are provided for different air pressures, each unit would require a high-voltage power supply, pump, and blower, which would increase costs and require more installation space. According to this embodiment, the pressure can be changed for each space, so a single plasma generation unit can distribute gas evenly to multiple different pressure loads.

[0074] Furthermore, according to this embodiment, each space is provided with an inlet tube (inlet section) and an outlet tube (outlet section), and the three spaces are independent of each other. Therefore, even if there is a malfunction in one space, the device can maintain its function as long as the path through the other spaces is still valid. If the device were to operate with only one plasma space, a problem in that space would cause the entire device to lose function. In contrast, this embodiment can improve the reliability of the device.

[0075] Furthermore, for example, in order to more effectively suppress the growth of mold in the humidifier 200A, it is also possible to circulate the water 205 in the water tank 201 inside the plasma treatment device. However, in this embodiment, a portion of the gas treated by the plasma generated in the plasma treatment device for a humidifier 100A dissolves in the water 205, thereby sterilizing the water 205 in the humidifier 200A, eliminating the need for complex processing on the humidifier 200A side, which is advantageous in terms of cost.

[0076] In addition, as in this embodiment, the plasma generating unit may be configured such that a pair of electrode layers are provided on the upper and lower surfaces of a dielectric layer as in the basic structure described above, or such that an air layer (space) is provided between the pair of electrode layers via a dielectric layer as in this embodiment. Even in the latter case, plasma can be generated. Furthermore, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space need only be different from that of the other spaces in at least one location, and does not have to be different everywhere. Alternatively, the pressure (atmospheric pressure) of the gas treated by the plasma sent to each space may all be the same.

[0077] Third Embodiment Next, a plasma processing apparatus for a humidifier according to a third embodiment of the present invention will be described.

[0078] 15, the plasma processing apparatus 100B for a humidifier differs from the second embodiment in that the air inlet chamber 220 is partitioned by a partition member 204 and a blower 24 is disposed in a first air inlet chamber 221 between the dust filter 203 and the partition member 204. The plasma processing apparatus 100B for a humidifier also differs from the second embodiment in that the gas flow section 20B includes a housing 21B, inlet tubes (inlet sections) 22Aa, 22Ba, and 22Ca, outlet tubes (outlet sections) 23A, 23B, and 23C, an inlet tube (inlet section) 26, an inlet tube (inlet section) 27, and a blower 24. The present embodiment will be described mainly focusing on the differences from the second embodiment.

[0079] The inflow tubes 22Aa, 22Ba, and 22Ca have their respective ends connected to the inflow tube 26 on the side opposite the housing 21B, and the inflow tube 26 is connected to the inflow tube 27. The inflow tube 26 is a flexible cylindrical body that connects the inflow tubes 22Aa, 22Ba, and 22Ca to the inflow tube 27. The inflow tube 27 is a flexible cylindrical body that connects the inflow tube 26 to the blower 24. The end of the inflow tube 27 is connected to the blower 24. The inflow tubes 26 and 27 may have other shapes as long as they function as inflow sections that can supply gas to the inflow tubes 22Aa, 22Ba, and 22Ca. The inflow tube 22Ba is thinner (has a smaller diameter) than the inflow tube 22Ca, and the inflow tube 22Aa is thinner (has a smaller diameter) than the inflow tube 22Ba. However, the relationship between the thicknesses (diameters) of inflow tubes 22Aa, 22Ba, 22Ca may be adjusted as appropriate depending on the specifications of humidifier 200B, etc. Furthermore, aside from blower 24 in humidifier 200B, a blower connected to inflow tube 27 may be used to send gas to inflow tubes 22Aa, 22Ba, 22Ca.

[0080] The partition member 204 is a member that separates the air inlet chamber 220 into a first air inlet chamber 221 and a second air inlet chamber 222. The first air inlet chamber 221 is a space between the dust filter 203 and the partition member 204, in which the blower 24 is disposed. The second air inlet chamber 222 is a space between the partition member 204 and the ceiling of the air inlet chamber 220, in which plasma-treated gas is supplied and in which the air inlet 211 of the atomization chamber 210 is disposed. The material of the partition member 204 is not particularly limited, and examples thereof include glass, ceramics, synthetic resin, and metal. The partition member 204 may have an adjustment hole for adjusting the pressure of the plasma processing device for humidifier 100B and the atomization chamber 210 of the humidifier 200B.

[0081] Next, the effects of this embodiment will be described, focusing on the differences from the second embodiment.

[0082] According to this embodiment, by changing the diameter (diameter) of each inlet tube 22Aa, 22Ba, 22Ca, the flow rate of gas flowing into the first space 71, the second space 72, and the third space 73 can be adjusted, and gas treated by plasma with a pressure difference can be supplied. This eliminates the need to connect a separate air blower to each inlet tube 22Aa, 22Ba, 22Ca. A single air blower can be used to create different pressures (air pressures) in the first space 71, the second space 72, and the third space 73. This reduces the number of air blowers required, thereby lowering equipment costs. Furthermore, the air blower 24 of the humidifier 200B can be used as the air blower for the plasma treatment device for a humidifier 100B, thereby reducing costs and downsizing the plasma treatment device for a humidifier.

[0083] Furthermore, the plasma processing apparatus 100B for a humidifier is provided with the partition member 204, which prevents air that has flowed into the first air inlet chamber 221 from directly flowing into the second air inlet chamber 222. This prevents the gas that has been treated with plasma and supplied to the second air inlet chamber 222 from mixing with the air that has flowed into the first air inlet chamber 221 and not been plasma-treated. This allows the gas that has been treated with plasma generated in the plasma processing apparatus 100B for a humidifier to be supplied to the atomization chamber 210 more efficiently.

[0084] <Fourth embodiment> Next, a plasma processing apparatus for a humidifier according to a fourth embodiment of the present invention will be described. As shown in FIG. 17, the plasma processing apparatus for a humidifier 100 according to this embodiment is provided in a humidifier 200C. The humidifier 200C includes a water tank 201, an evaporator 206, a dust filter 203, and a blower 24. In this embodiment, the humidifier 200C is an evaporative humidifier. In this embodiment, the differences from the first embodiment will be mainly described.

[0085] Vaporizer 206 absorbs and vaporizes water 205 in humidifier 200C. Water 205 absorbed in vaporizer 206 is vaporized by air blown from blower 24 and is released to the outside of humidifier 200C. Vaporizer 206 may be made of, for example, cloth, paper, or resin such as a sponge.

[0086] The plasma processing apparatus 100 for a humidifier is disposed in the air inlet chamber 220 of the humidifier 200C above the dust filter 203 (on the surface from which air flows out) and between the dust filter 203 and the blower 24. In this embodiment, gas treated with plasma generated in the plasma processing apparatus 100 for a humidifier is sent by the blower 24 to the vaporizer 206 side. As a result, the air containing the gas treated with plasma hits the vaporizer 206.

[0087] As in this embodiment, humidifier 200C may be an evaporative humidifier. Even with an evaporative humidifier, substantially the same effects as those of the first embodiment can be obtained. Furthermore, evaporative humidifiers are prone to mold growth in the vaporizer, which absorbs and evaporates water. Furthermore, because the humidity in the space in which the vaporizer is placed is maintained at a high level, mold is also prone to grow inside the space in which the vaporizer is placed. However, in this embodiment, by bringing plasma-treated gas into contact with the vaporizer, mold growth in the vaporizer can be suppressed and unpleasant odors caused by mold and bacteria can be prevented. Furthermore, by spraying plasma-treated gas into the space in which the vaporizer is placed, mold growth can be suppressed and viruses and bacteria can be reduced. Furthermore, unpleasant odors caused by the growth of mold and bacteria in the vaporizer can be reduced.

[0088] Fifth Embodiment Next, a plasma processing apparatus for a humidifier according to a fifth embodiment of the present invention will be described. In this embodiment, differences from the fourth embodiment will be mainly described.

[0089] 18, in the plasma processing apparatus 100C for a humidifier, a housing 21C is detachably attached to the side of a humidifier 200D. In addition, the plasma processing apparatus 100C for a humidifier differs from the fourth embodiment in that a gas flow unit 20C includes a housing 21C, an inlet tube (inlet portion) 22, an outlet tube (outlet portion) 23, and a blower 25. In this embodiment, the differences from the fourth embodiment will be mainly described.

[0090] The inlet tube 22 is a flexible cylindrical body that connects the blower 25 and the housing 21C. The outlet tube 23 is a flexible cylindrical body that connects the housing 21C and the humidifier 200D. The tip of the outlet tube 23 is located in the water 205 inside the humidifier 200D. The inlet tube 22 may have any other form as long as it functions as an inlet portion that can supply gas to the plasma generating unit 10. The outlet tube 23 may have any other form as long as it functions as an outlet portion that discharges the gas that has been treated with plasma in the plasma generating unit 10.

[0091] This embodiment can also achieve substantially the same effects as the first embodiment. Furthermore, in evaporative humidifiers, mold is prone to growing in the vaporizer, which absorbs and evaporates water. However, in this embodiment, plasma water is generated by supplying gas treated with plasma to the water in the humidifier. This allows the plasma water, which has a bactericidal (sterilizing) effect, to be absorbed into the vaporizer. Therefore, the humidifier can suppress mold growth in the vaporizer and prevent unpleasant odors caused by mold and bacteria.

[0092] Although the embodiments of the present invention have been described above, appropriate design changes are possible within the scope of the present invention. For example, the control unit 60 may be provided with an input unit (such as a touch panel) and a display unit (monitor). For example, plasma may be generated based on instructions input from the input unit. Furthermore, information related to plasma generation, the amount of electricity, etc. may be displayed on the display unit. In the second embodiment, air blowers with different air speeds (air pressures) are provided for the first space 71, the second space 72, and the third space 73, respectively, so that the pressure (air pressure) in each space is different, but for example, a single air blower may be used, and valves may be provided in the air flow paths through which the pressure in each space may be adjusted by the valves. This reduces the number of installed air blowers, thereby lowering equipment costs.

[0093] Furthermore, although the air blower is arranged outside the housing of the plasma processing apparatus for a humidifier, it may be arranged inside the housing. Furthermore, for example, the plasma treatment device for a humidifier may be provided with, in addition to the ozone sensor, a sensor for detecting the particle concentration in the humidifier, a sensor for detecting temperature, humidity, etc. Furthermore, if other devices are present in the humidifier, their control terminals can be connected to the control unit of the plasma treatment device for a humidifier to enable them to operate in coordination with each other. Furthermore, while the humidifier uses water in the above example, a device that sprays other liquids, such as hypochlorous acid water, or a mixture of other liquids and water, may also be used. Furthermore, the humidifier is not limited to ultrasonic or vaporization humidifiers, but may also be, for example, a heating type or a heat vaporization type (hybrid type) humidifier. Furthermore, the plasma treatment device for a humidifier may be located anywhere in the humidifier as long as it can efficiently supply plasma-treated gas to the desired position within the humidifier. Furthermore, the plasma treatment device for a humidifier can be operated continuously or intermittently depending on environmental conditions, etc. [Explanation of symbols]

[0094] 10 Plasma generation unit 11 Dielectric layer 12 Upper layer electrode (electrode layer) 13 Lower electrode (electrode layer) 14 Upper mask layer (mask layer) 15 Lower mask layer (mask layer) 20 Gas flow section 21. Cabinet 22 Inlet tube (inlet section) 23 Outlet tube (outlet section) 26 Inlet tube (inlet section) 27 Inlet tube (inlet section) 30 Power supply section 40 sensors 50 Wireless Interface 60 Control Unit 100 Plasma treatment device for humidifier 200 Humidifier

Claims

1. a plasma generating unit that generates plasma and includes at least a dielectric layer and a pair of electrode layers provided on both sides of the dielectric layer; a power supply unit that applies an AC voltage to the pair of electrode layers; a gas flow unit that flows a gas through the plasma generating unit to treat the gas with plasma, and supplies the gas treated with plasma into the humidifier.

2. a sensor for detecting plasma in the humidifier; 2. The plasma processing apparatus for a humidifier according to claim 1, further comprising: a control unit that receives a detection result from the sensor and transmits a signal to apply an AC voltage to the power supply unit based on the detection result.

3. 2. The plasma processing apparatus for a humidifier according to claim 1, further comprising a control unit that transmits a signal to apply an AC voltage to the power supply unit based on a timer that measures time.

4. a wireless interface for providing information to a terminal device; a control unit that transmits a signal to apply an AC voltage to the power supply unit, The plasma processing apparatus for a humidifier according to claim 1 , wherein the control unit transmits information about plasma generation to an external device via the wireless interface.

5. a housing that covers the plasma generating unit and is divided into a plurality of spaces by the dielectric layer; 2. The plasma processing apparatus for a humidifier according to claim 1, wherein the housing is provided with an inlet portion through which gas flows into each of the spaces and an outlet portion through which gas flows out, and is configured so that gases of different pressures flow into each of the spaces.

6. 2. The plasma processing apparatus for a humidifier according to claim 1, wherein the gas flow unit has a blower disposed within the humidifier.

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