Brush unit and substrate processing device

Abstract

To provide a brush unit which can inhibit damage of a substrate and occurrence of particles caused by variations in hardness of a sponge member, and to provide a substrate processing device including the brush unit.SOLUTION: A brush unit 100 includes: a brush 200; and a brush holder 500 for holding the brush 200. The brush 200 includes: a sponge-like cleaning part 210 which contacts with a substrate when the substrate is cleaned; and a cleaning support part 220 which has a hardness higher than that of the cleaning part 210 and is provided so as to contact with the cleaning part 210 to support the cleaning part 210. The brush holder 500 may hold the cleaning support part 220 and press the cleaning part 210 to the substrate through the cleaning support part 220.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a brush unit used for cleaning a substrate and a substrate processing apparatus. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells. Substrate cleaning apparatuses are used to clean substrates.

[0003] In a substrate cleaning apparatus, for example, one side or the other side of a substrate is cleaned using a brush. Patent Document 1 describes an example of a brush for cleaning a substrate. The brush for cleaning a substrate is formed, for example, from a sponge-like porous material (hereinafter referred to as a sponge-like member). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 9-94543 Summary of the Invention [Problem to be solved by the invention]

[0005] The cleaning brush described in Patent Document 1 has a configuration in which a brush body is held by a brush holder. When the brush body is held by the brush holder, the lower end surface of the brush body is located below the lower end surface of the brush holder. When cleaning a substrate using the cleaning brush, for example, the lower end surface of the brush body held by the brush holder is pressed against one surface of the substrate rotating in a horizontal position. The cleaning brush also scans over the surface of the rotating substrate, thereby cleaning the one surface of the substrate.

[0006] The sponge-like material that forms the brush body tends to vary in hardness between products. Therefore, when a relatively low-hardness sponge-like material (brush body) is pressed directly against a substrate by a brush holder, the sponge-like material may be excessively deformed depending on the pressure acting on the sponge-like material. Furthermore, when the pressure applied to the cleaning brush is changed, excessive pressure may cause the sponge-like material to be excessively deformed. In these cases, the brush holder may come into contact with the substrate during cleaning. Alternatively, the brush holder may come into contact with surrounding components, such as the chuck pins that hold the substrate during cleaning. If the brush holder comes into contact with the substrate, the substrate will be damaged. If the brush holder comes into contact with surrounding components around the substrate, particles will be generated.

[0007] The object of the present invention is to provide a brush unit and a substrate processing apparatus equipped with the same that can suppress damage to substrates and generation of particles caused by variations in hardness of sponge-like members and differences in the pressing force applied to cleaning brushes. [Means for solving the problem]

[0008] A brush unit according to one aspect of the present invention comprises a brush and a brush holder that holds the brush, wherein the brush includes a sponge-like cleaning portion that contacts the substrate when cleaning the substrate, and a cleaning support portion that has a higher hardness than the cleaning portion and is arranged to contact the cleaning portion and support the cleaning portion, and the brush holder is configured to hold the cleaning support portion and to be able to press the cleaning portion against the substrate via the cleaning support portion.

[0009] A substrate processing apparatus according to another aspect of the present invention includes a substrate holding section that holds a substrate, and the above-described brush unit that is provided to clean one surface of the substrate held by the substrate holding section. [Effects of the Invention]

[0010] According to the present invention, it is possible to suppress damage to the substrate and generation of particles caused by variations in hardness of the sponge-like member and differences in the pressing force applied to the cleaning brush. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is an exploded perspective view of the brush unit according to the first embodiment. [Figure 2] FIG. 2 is an external perspective view showing the brush unit of FIG. 1 in an assembled state. [Figure 3] 1A and 1B are a side view and a vertical cross-sectional view of a brush unit according to a first embodiment of the present invention; [Figure 4] 10A and 10B are a side view and a vertical cross-sectional view of a brush unit according to a second embodiment of the present invention; [Figure 5] 10A and 10B are a side view and a vertical cross-sectional view of a brush unit according to a third embodiment of the present invention; [Figure 6] 10A and 10B are a side view and a vertical cross-sectional view of a brush unit according to a fourth embodiment of the present invention; [Figure 7] FIG. 11 is a schematic plan view of a substrate processing apparatus according to a fifth embodiment. [Figure 8] 8 is a diagram for explaining a basic operation during a cleaning process of a substrate in the substrate processing apparatus of FIG. 7. FIG. [Figure 9] FIG. 8 is a block diagram showing the configuration of a control system of the substrate processing apparatus of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] A brush unit and a substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[0013] The brush unit is used to clean one surface (top or bottom) of a substrate held in a horizontal or nearly horizontal position by a holding device, and is mainly composed of a brush and a brush holder. The brush is held by the brush holder. The brush is pressed against the surface of the substrate from above or below and slid against the surface to clean the surface.

[0014] 1. First embodiment <1> Brush unit configuration Fig. 1 is an exploded perspective view of a brush unit according to a first embodiment. Fig. 2 is an external perspective view showing the assembled state of the brush unit 100 of Fig. 1. As shown in Fig. 1, the brush unit 100 includes a brush 200, a lower holder member 300, and an upper holder member 400. The lower holder member 300 and the upper holder member 400 are assembled to form a brush holder 500 (Fig. 2).

[0015] The brush 200 according to this embodiment is formed of a single sponge-like member made of a relatively soft resin material such as PVA (polyvinyl alcohol) or PTFE (polytetrafluoroethylene). As shown in FIG. 1 , the brush 200 includes a cleaning section 210 and a cleaning support section 220. The cleaning section 210 and the cleaning support section 220 have flat cylindrical shapes of different sizes. The outer diameter of the cleaning section 210 is smaller than the outer diameter of the cleaning support section 220. The cleaning section 210 and the cleaning support section 220 are arranged so that their central axes are aligned on a common line and the cleaning section 210 is positioned below the cleaning support section 220. The cleaning section 210 is a section that comes into contact with one surface of the substrate during cleaning, and the cleaning support section 220 is a section that supports the cleaning section 210.

[0016] The lower holder member 300 is formed from a resin material having higher rigidity than the brush 200, and has a tubular member 310. The inner diameter of the tubular member 310 in this embodiment is larger than the outer diameter of the cleaning part 210 but smaller than the outer diameter of the cleaning support part 220. An annular fixing plate 320 is provided on the inner circumferential surface of the lower holder member 300, slightly above the lower end, so as to extend a certain distance from the entire circumference of the inner circumferential surface toward the center of the tubular member 310. A circular opening 321 is formed inside the annular fixing plate 320. The inner diameter of the opening 321 is slightly larger than the outer diameter of the cleaning part 210 of the brush 200 but smaller than the outer diameter of the cleaning support part 220 of the brush 200.

[0017] At a position slightly below the upper end of the inner peripheral surface of the tubular member 310, two portions facing each other across the central axis of the tubular member 310 are formed with a pair of recesses 330 corresponding to a pair of protrusions 429 of the upper holder member 400 described later.

[0018] The upper holder member 400 is attached to the upper end of the lower holder member 300, thereby forming a storage space (described later) for holding a part of the brush 200 (cleaning support portion 220) within the brush holder 500 (FIG. 2).

[0019] Upper holder member 400 is formed from a resin material having higher rigidity than brush 200, and has lid portion 410, insertion portion 420, and connected portion 430. Connected portion 430, lid portion 410, and insertion portion 420 each have a flattened cylindrical shape, and are arranged so that their central axes are aligned on a common straight line and lined up in this order from top to bottom.

[0020] The outer diameter of the cover portion 410 is larger than the outer diameters of the insertion portion 420 and the connected portion 430, and is equal to the outer diameter of the tubular member 310 of the lower holder member 300. The outer diameter of the insertion portion 420 is slightly smaller than the inner diameter of the tubular member 310 of the lower holder member 300. Protrusions 429 corresponding to the pair of recesses 330 of the lower holder member 300 are formed on two portions of the outer circumferential surface of the insertion portion 420 that are positioned on either side of the central axis of the insertion portion 420.

[0021] When assembling the brush unit 100, the brush 200 is pushed into the tubular member 310 of the lower holder member 300, as indicated by the thick dashed-dotted arrow a1 in FIG. 1. At this time, the cleaning portion 210 is aligned so as to overlap with the opening 321 of the lower holder member 300. As a result, the cleaning portion 210 of the brush 200 extends through the opening 321 to a position below the tubular member 310. In other words, the tip of the cleaning portion 210 is exposed below the lower holder member 300. The tip of the cleaning portion 210 functions as the cleaning surface 211 ( FIG. 3 ) that contacts the substrate. Meanwhile, the annular stepped portion of the brush 200 between the cleaning portion 210 and the cleaning support portion 220 abuts on and is fixed to the annular fixing plate 320.

[0022] Next, as indicated by the thick dashed-dotted arrow a2 in FIG. 1 , the upper holder member 400 is pushed from above the cleaning support portion 220 toward the upper end of the lower holder member 300. Here, in this embodiment, the outer diameter of the cleaning support portion 220 of the brush 200 is larger than the inner diameter of the tubular member 310. Furthermore, the vertical length (height) of the cleaning support portion 220 is larger than the length (height) from the annular fixing plate 320 to the upper end of the lower holder member 300. As a result, when the upper holder member 400 is pushed in, the cleaning support portion 220 is compressed, and the insertion portion 420 of the upper holder member 400 is inserted into the upper end opening of the tubular member 310. In this state, the pair of protrusions 429 of the upper holder member 400 are fitted into the pair of recesses 330 of the lower holder member 300. As a result, the upper holder member 400 is fixed on the lower holder member 300, and the brush unit 100 is completed.

[0023] The connected portion 430 of the upper holder member 400 is provided for attaching the brush unit 100 to a brush holding portion 42 (FIG. 7) of a substrate processing apparatus 1 (FIG. 7) described later. A shaft insertion hole 431 is formed in the center of the upper end of the connected portion 430, into which a shaft member for connection provided in the brush holding portion 42 (FIG. 7) is inserted. In addition, the outer periphery of the connected portion 430 is threaded.

[0024] 3 is a side view of brush 200 and a vertical cross-sectional view of brush unit 100 according to the first embodiment. In Fig. 3, the upper part shows a side view of brush 200, and the lower part shows a vertical cross-sectional view of brush unit 100. The vertical cross-sectional view in the lower part of Fig. 3 corresponds to a cross-sectional view of brush unit 100 in Fig. 2 taken along imaginary plane VS.

[0025] 3, as the brush unit 100 is assembled, an accommodation space SS for the brush 200, with a portion (opening 321 of the annular fixing plate 320) being open, is formed inside the brush holder 500. Specifically, the accommodation space SS is a space formed by the lower end surface of the insertion portion 420 of the upper holder member 400, the inner circumferential surface of the tubular member 310, and the upper surface of the annular fixing plate 320.

[0026] As can be seen by comparing the upper brush 200 with the lower storage space SS, the size of the cleaning support portion 220 of the brush 200 is larger than the size of the storage space SS in the brush holder 500. Therefore, the cleaning support portion 220 of the brush 200 is maintained in a compressed state by the lower end surface of the insertion portion 420 of the upper holder member 400, the inner circumferential surface of the tubular member 310, and the upper surface of the annular fixing plate 320.

[0027] <2> effect (a) When cleaning a substrate using the brush unit 100 described above, the upper holder member 400 of the brush holder 500 presses the cleaning portion 210 of the brush 200 against the substrate via the cleaning support portion 220. In this case, the cleaning portion 210 and the cleaning support portion 220 are arranged so as to overlap between the upper holder member 400 and the substrate.

[0028] Here, the cleaning support part 220 has a higher hardness than the cleaning part 210 because it is compressed within the accommodation space SS of the brush holder 500. As a result, the allowable deformation amount of the brush 200 as a whole is limited to a certain amount or less compared to when the brush 200 is pressed directly against the substrate by the upper holder member 400 without being compressed in its entirety in advance. Specifically, the allowable deformation amount of the brush 200 as a whole, including the cleaning part 210 and the cleaning support part 220, is limited to a certain amount or less in the vertical direction.

[0029] As a result, damage to the substrate and generation of particles caused by variations in hardness of the sponge-like material that constitutes the brush 200 can be suppressed.

[0030] (b) In the brush unit 100 according to the present embodiment, the brush holder 500 has higher rigidity than the brush 200. As a result, the brush holder 500 is less likely to deform than the brush 200. Therefore, a high load can be accurately applied to the cleaning portion 210 when cleaning a substrate.

[0031] (c) In the brush 200 described above, the cleaning part 210 and the cleaning support part 220, which is used to reduce variations in hardness, are made of a single sponge-like member. This eliminates the need to handle the cleaning part 210 and the cleaning support part 220 separately, improving the ease of handling of the brush 200. Here, ease of handling refers to the ease of assembling the brush unit 100. Because the cleaning part 210 and the cleaning support part 220 are made of a single sponge, the number of components required to assemble the brush unit 100 is reduced. Furthermore, the brush unit 100 can be assembled easily.

[0032] (d) The cleaning surface 211 of the brush 200 has a diameter of, for example, about 20 mm. Assume that a load of 800 mN to 2500 mN is applied to the brush 200 from the upper holder member 400 when cleaning a substrate. In this case, the cleaning support member 220 is preferably compressed so that its volume is reduced by about 60% from the uncompressed state to the compressed state, and more preferably so that its volume is reduced by about 50%. The above configuration enables the substrate to be cleaned appropriately.

[0033] 2. Second embodiment The brush unit according to the second embodiment will be described with respect to differences from the brush unit 100 according to the first embodiment. Fig. 4 shows a side view of a brush 200 according to the second embodiment and a vertical cross-sectional view of the brush unit 100. In Fig. 4, the side view of the brush 200 is shown in the upper part, and the vertical cross-sectional view of the brush unit 100 is shown in the lower part. The vertical cross-sectional view in the lower part of Fig. 4, like the view in the lower part of Fig. 3, corresponds to a cross-sectional view of the brush unit 100 in Fig. 2 taken along the imaginary plane VS.

[0034] Similar to the brush 200 according to the first embodiment, the brush 200 according to the present embodiment is formed of a single sponge-like member made of a relatively soft resin material, and has a cleaning portion 210 and a cleaning support portion 220. The brush 200 according to the present embodiment differs from the brush 200 according to the first embodiment in the size of the cleaning support portion 220. Specifically, as shown in the upper and lower parts of Figure 4, the size and shape of the cleaning support portion 220 in this example are equal to the size and shape of the storage space SS in the brush holder 500.

[0035] On the other hand, in the brush unit 100 according to this embodiment, a biasing member 280 is provided on the lower end surface of the insertion portion 420 of the upper holder member 400. In this example, a spring is used as the biasing member 280. Note that, instead of a spring, other elastic bodies such as rubber may be used as the biasing member 280. Furthermore, within the accommodation space SS, a movable plate 290 configured to be movable in the vertical direction is provided at the tip end (lower end) of the biasing member 280. When the cleaning support part 220 is accommodated in the accommodation space SS and the upper holder member 400 is attached to the lower holder member 300, the biasing member 280 biases the movable plate 290 downward. As a result, the cleaning support part 220 of the brush 200 is maintained in a compressed state by the movable plate 290, the inner circumferential surface of the tubular member 310, and the upper surface of the annular fixing plate 320.

[0036] In this embodiment, the cleaning support part 220 is compressed in the accommodation space SS of the brush holder 500, and thus has a higher hardness than the cleaning part 210. As a result, the allowable deformation amount of the brush 200 as a whole is limited to a certain amount or less, compared to when the brush 200 is pressed directly against the substrate by the upper holder member 400 without being compressed in its entirety in advance. Specifically, the allowable deformation amount of the brush 200 as a whole, including the cleaning part 210 and the cleaning support part 220, is limited to a certain amount or less in the vertical direction.

[0037] As a result, damage to the substrate and generation of particles caused by variations in hardness of the sponge-like material that constitutes the brush 200 can be suppressed.

[0038] 3. Third Embodiment The brush unit according to the third embodiment will be described with respect to differences from the brush unit 100 according to the first embodiment. Fig. 5 shows a side view of a brush 200 according to the third embodiment and a vertical cross-sectional view of the brush unit 100. In Fig. 5, the side view of the brush 200 is shown in the upper part, and the vertical cross-sectional view of the brush unit 100 is shown in the lower part. The vertical cross-sectional view in the lower part of Fig. 5, like the view in the lower part of Fig. 3, corresponds to a cross-sectional view of the brush unit 100 in Fig. 2 taken along the imaginary plane VS.

[0039] The brush 200 according to this embodiment has a structure in which the cleaning part 210 and the bag member 230 are bonded together with an adhesive or the like. The cleaning part 210 of this example is made of a sponge-like material, as in the first embodiment. On the other hand, the bag member 230 is made of, for example, rubber, and is expandable when gas is supplied to the inside of the bag member 230. The bag member 230 is provided with a gas pipe 231 that allows gas (such as nitrogen gas) to be supplied to the inside of the bag member 230 and gas to be discharged from the inside of the bag member 230.

[0040] 5, the bag member 230 is accommodated in the accommodation space SS in the brush unit 100. In this state, the gas pipe 231 provided in the bag member 230 is drawn out to the outside of the lower holder member 300 through a through-hole formed in a part of the tubular member 310.

[0041] 5, when a large amount of gas is supplied to bag member 230, each portion of bag member 230 expanding within storage space SS receives a reaction force from each portion of brush holder 500 forming storage space SS. This increases the hardness of the portion of bag member 230 that contacts cleaning part 210. Therefore, in this embodiment, the hardness of bag member 230 can be adjusted by adjusting the amount of gas inside bag member 230.

[0042] Therefore, the hardness of the bag member 230 is adjusted appropriately. In this case, the allowable deformation amount of the entire brush 200 can be limited to a certain amount or less, compared to when the entire brush 200 is made of a sponge-like material and the brush 200 is pressed directly against the substrate by the upper holder member 400. Specifically, the allowable deformation amount of the entire brush 200 including the cleaning portion 210 and the bag member 230 is limited to a certain amount or less in the vertical direction.

[0043] As a result, damage to the substrate and generation of particles caused by variations in hardness of the sponge-like material that constitutes the brush 200 can be suppressed.

[0044] 4. Fourth Embodiment The brush unit according to the fourth embodiment will be described with respect to differences from the brush unit 100 according to the first embodiment. Fig. 6 shows a side view of a brush 200 according to the fourth embodiment and a vertical cross-sectional view of the brush unit 100. In Fig. 6, the side view of the brush 200 is shown in the upper part, and the vertical cross-sectional view of the brush unit 100 is shown in the lower part. The vertical cross-sectional view in the lower part of Fig. 6, like the lower view of Fig. 3, corresponds to a cross-sectional view of the brush unit 100 in Fig. 2 taken along the imaginary plane VS.

[0045] The brush 200 according to this embodiment has a structure in which the cleaning part 210 and the high-hardness member 240 are bonded together with an adhesive or the like. The cleaning part 210 of this example is made of a sponge-like member, as in the first embodiment. On the other hand, the high-hardness member 240 is made of a material (e.g., rubber or resin) that has a higher hardness than the cleaning part 210. The size and shape of the high-hardness member 240 of this example are the same as the size and shape of the storage space SS of the brush holder 500, as in the cleaning support part 220 of the second embodiment.

[0046] In this embodiment, high-hardness member 240, which has a higher hardness than cleaning unit 210, is provided on cleaning unit 210. This limits the amount of deformation allowance of brush 200 as a whole to a certain level compared to when brush 200 is entirely made of a sponge-like material and brush 200 is pressed directly against the substrate by upper holder member 400. Specifically, the amount of deformation allowance of brush 200 as a whole, including cleaning unit 210 and high-hardness member 240, is limited to a certain level in the vertical direction.

[0047] As a result, damage to the substrate and generation of particles caused by variations in hardness of the sponge-like material that constitutes the brush 200 can be suppressed.

[0048] 5. Fifth Embodiment As the fifth embodiment, a substrate processing apparatus including the brush unit 100 according to any one of the first to fourth embodiments will be described. The substrate processing apparatus described below is a substrate cleaning apparatus that cleans the upper surface of a substrate using the brush unit 100.

[0049] <1> Configuration of substrate processing equipment Fig. 7 is a schematic plan view of a substrate processing apparatus according to a fifth embodiment. In Fig. 7 and Fig. 8 described later, arrows are added to indicate the mutually orthogonal X, Y, and Z directions to clarify the positional relationships. The X and Y directions are orthogonal to each other in a horizontal plane, and the Z direction corresponds to the up-down direction (vertical direction).

[0050] 7, the substrate processing apparatus 1 has a configuration in which a plurality of members are accommodated in a chamber CH, and includes a substrate holding device 10, a cup device 20, a nozzle device 30, a brush arm device 40, a brush unit 100, a waiting pod 49, and a control unit 900. As described above, the brush unit 100 according to this embodiment has the same configuration as the brush unit 100 according to any one of the first to fourth embodiments.

[0051] The chamber CH has four side surfaces, a ceiling surface, and a floor (bottom surface) CHB. One side surface of the chamber CH is formed with a transfer opening (not shown) for transferring a substrate between the inside of the chamber CH and the outside of the chamber CH.

[0052] A substrate holding device 10 is provided at approximately the center of the floor CHB of the chamber CH. The substrate holding device 10 includes a spin base 11, a plurality of chuck pins 12, a substrate holding drive unit 13 (FIG. 9), and a substrate rotation drive unit 14 (FIG. 9). The substrate rotation drive unit 14 includes, for example, a motor, and is fixed to the floor CHB of the chamber CH so that the rotation shaft of the motor faces upward. A disk-shaped spin base 11 is attached to the upper end of the rotation shaft.

[0053] The spin base 11 has an outer diameter larger than that of the substrate W to be processed. A plurality of chuck pins 12 are provided on the peripheral portion of the upper surface of the spin base 11. Each of the plurality of chuck pins 12 has a contact portion that contacts the substrate W. When the substrate W is placed on the spin base 11, each chuck pin 12 is configured to be able to switch between a holding state in which the contact portion contacts the outer circumferential edge of the substrate W and a release state in which the contact portion is separated from the substrate W. The substrate holding drive unit 13 includes, for example, a magnet and switches each chuck pin 12 between the holding state and the release state using the magnetic force of the magnet. The contact portions of the plurality of chuck pins 12 in the holding state contact multiple portions of the outer circumferential edge of the substrate W, thereby holding the substrate W on the spin base 11. In FIG. 7, the outer shape of the substrate W held by the substrate holding device 10 is indicated by a dashed line.

[0054] The cup device 20 includes a cup main body 21 and a cup lifting / lowering drive unit 22. The cup main body 21 has a substantially cylindrical shape, and is provided so as to surround the spin base 11 in a plan view and extend in the Z direction. The cup main body 21 is also provided so as to be movable in the Z direction.

[0055] The cup lifting drive unit 22 includes an actuator such as a motor or an air cylinder, and moves the cup body 21 between a predetermined cup upper position and a cup lower position. The cup upper position is the height position (vertical position) of the cup body 21 when the upper end of the cup body 21 is located above the substrate W held by the substrate holding device 10. The cup lower position is the height position of the cup body 21 when the upper end of the cup body 21 is located below the substrate W held by the substrate holding device 10.

[0056] The nozzle device 30 includes a fluid nozzle 31 and a fluid supply system 32. The fluid nozzle 31 is provided at a predetermined position above the substrate holding device 10 and the cup device 20. The fluid nozzle 31 is fixed so that its discharge port faces the rotation center SC of the spin base 11 of the substrate holding device 10. The fluid supply system 32 supplies a cleaning liquid to the fluid nozzle 31 during cleaning processing of the substrate W. As a result, the cleaning liquid is supplied to the upper surface of the substrate W held by the substrate holding device 10. The cleaning liquid is, for example, pure water (deionized water). Note that, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), TMAH (tetramethylammonium hydroxide), or the like can also be used as the cleaning liquid. The nozzle device 30 may also be configured to be able to spray a gas such as an inert gas from the fluid nozzle 31. Furthermore, the nozzle device 30 may have multiple fluid nozzles 31 capable of discharging or spraying different fluids.

[0057] The brush arm device 40 includes a brush arm 41, a guide rail 43, an arm support unit 44, an arm horizontal drive unit 45, an arm elevation drive unit 46, a brush rotation drive unit 47, and a pressing actuator 48. The guide rail 43 is provided in the chamber CH so as to be adjacent to the substrate holding device 10 in the Y direction. The guide rail 43 extends in the X direction.

[0058] The arm support portion 44 is provided so as to be movable in the X direction along the guide rail 43. The arm horizontal drive portion 45 of this example includes a motor, and moves the arm support portion 44 in the X direction under the control of a control portion 900, which will be described later. The brush arm 41 is supported by the arm support portion 44 so as to be movable (liftable) in the Z direction. The arm lift drive portion 46 of this example includes a motor, and moves the brush arm 41 in the Z direction under the control of a control portion 900, which will be described later.

[0059] The brush arm 41 has a substantially rectangular parallelepiped shape and extends in the Y direction from the arm support portion 44 toward the substrate holding device 10. The tip of the brush arm 41 is configured as a brush holding portion 42 capable of holding a brush unit 100 used to clean the substrate W. Specifically, the brush holding portion 42 has a connecting shaft member that extends downward. The shaft member is inserted into a shaft insertion hole 431 (FIG. 1) of the brush unit 100. Furthermore, the shaft member and a connected portion 430 of the brush unit 100 are connected by a fastening member (not shown). This allows the brush unit 100 to be held by the brush holding portion 42.

[0060] In the substrate processing apparatus 1 of FIG. 7, the brush holder 42 is located on an imaginary line L1 that passes through the rotation center SC of the spin base 11 and extends in the X direction in a plan view.

[0061] The brush rotation drive unit 47 and the pressing actuator 48 are built into the brush arm 41. The brush rotation drive unit 47 includes, for example, a motor, and rotates the shaft member of the brush holding unit 42. This causes the brush unit 100 connected to the shaft member to rotate on its axis.

[0062] The pressing actuator 48 includes, for example, an air cylinder, and presses the shaft member downwards to press the cleaning part 210 of the brush unit 100 against the substrate W while the brush unit 100 is in contact with the upper surface of the substrate W.

[0063] The degree of cleaning power applied to the upper surface of the substrate W varies depending on the pressing force (pressing force) applied from the cleaning unit 210 to the upper surface of the substrate W. Therefore, when cleaning the upper surface of the substrate W, the pressing actuator 48 presses the shaft member downward with a predetermined force (for example, 800 mN to 2500 mN).

[0064] When the pressing actuator 48 includes an air cylinder, the pressing force can be adjusted with high precision by adjusting the amount of gas supplied to the air cylinder using, for example, an electropneumatic regulator.

[0065] In a plan view, the waiting pod 49 and the substrate holding device 10 are aligned on the imaginary straight line L1. The waiting pod 49 is configured to be able to accommodate the brush unit 100 held by the brush holding part 42 in a clean state and to be able to clean it. As indicated by the thick dotted line frame in FIG. 7, in the substrate processing apparatus 1, a waiting position SP is set at a position overlapping the waiting pod 49 in a plan view. A control unit 900 controls the operation of each part of the substrate processing apparatus 1. The control unit 900 will be described in detail later.

[0066] <2> Basic cleaning operations in substrate processing equipment Fig. 8 is a diagram for explaining the basic operation of cleaning a substrate W in the substrate processing apparatus 1 of Fig. 7. In Fig. 8, a schematic plan view of the substrate processing apparatus 1 is shown in the upper part, and a schematic side view of the substrate processing apparatus 1 is shown in the lower part.

[0067] In the initial state of the cleaning process of the substrate W, the brush holder 42 that holds the brush unit 100 is located at the standby position SP. The brush unit 100 is housed in the standby pod 49. In addition, the cup body 21 is located at the below-cup position, and the discharge of the cleaning liquid from the fluid nozzle 31 is stopped.

[0068] When the cleaning process for the substrate W is started, the substrate W loaded into the substrate processing apparatus 1 is held by the substrate holding device 10 and rotated at a predetermined rotation speed. The cup body 21 is held at a position above the cup. Furthermore, a cleaning liquid is discharged from the fluid nozzle 31 toward the rotating substrate W.

[0069] In this state, the brush arm 41 is moved in the Z direction and the X direction by operation of the arm horizontal drive unit 45 and the arm lift drive unit 46 in Fig. 7. As a result, the brush device 50 held by the brush holder 42 is lifted up from the standby pod 49 and pressed against the upper surface of the rotating substrate W. At this time, the brush unit 100 is rotated by the brush rotation drive unit 47 in Fig. 7, and the pressing force of the brush unit 100 against the substrate W is adjusted by the pressing actuator 48 in Fig. 7.

[0070] In this state, as shown by the thick, two-dot chain arrows a11 and a12 in FIG. 8 , the brush device 50 is moved in the X direction along the imaginary line L1 in a plan view. In this manner, the upper surface of the substrate W is cleaned. At this time, the brush 200 may be configured so that the lower holder member 300 does not contact the chuck pins 12 when the overall deformation amount of the brush 200 is maximized. When the brush 200 of the first embodiment is connected to the substrate processing apparatus 1, the brush 200 may be configured to have a predetermined maximum deformation amount depending on the hardness of the cleaning support member 220. When the brush 200 of the second embodiment is connected to the substrate processing apparatus 1, the brush 200 may be configured to have a predetermined maximum deformation amount depending on the hardness of the cleaning support member 220 and the biasing force of the biasing member 280. When the brush 200 of the third embodiment is connected to the substrate processing apparatus 1, the brush 200 may be configured to have a predetermined maximum deformation amount depending on the material of the bag member 230 and the amount of gas supplied to the bag member 230. When the brush 200 of the fourth embodiment is connected to the substrate processing apparatus 1, the brush 200 may be configured to have a predetermined maximum deformation amount by the high-hardness member 240. By configuring the brush 200 as described above, the substrate W can be cleaned without the lower holder member 300 coming into contact with the chuck pins 12 even under the maximum pressing force of the pressing actuator 48.

[0071] Once the upper surface of the substrate W has been cleaned, the brush unit 100 is returned to its initial position. Furthermore, the rotation of the brush unit 100 is stopped, and adjustment of the pressing force of the brush unit 100 is stopped. Furthermore, the discharge of the cleaning liquid from the fluid nozzle 31 is stopped, and the rotation of the substrate W by the substrate holding device 10 is stopped. Furthermore, the cup body 21 is moved from the cup upper position to the cup lower position. This completes the cleaning process of the substrate W.

[0072] 8, the brush unit 100 moves back and forth between the outer circumferential edge of the substrate W and the center of rotation SC of the spin base 11, but the brush unit 100 may also clean the substrate W by moving from one end to the other end of the substrate W along the imaginary straight line L1. Alternatively, the brush unit 100 may clean the substrate W by moving only once between the outer circumferential edge of the substrate W and the center of rotation SC of the spin base 11.

[0073] <3> Control system of substrate processing apparatus 1 The control system of the substrate processing apparatus 1 will be described below together with the configuration of the control unit 900 in FIG. 7. FIG. 9 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in FIG. 7. As shown in FIG. 9, the control unit 900 includes a CPU (Central Processing Unit) 901, a RAM (Random Access Memory) 902, a ROM (Read Only Memory) 903, and a storage device 904. The RAM 902 is used as a work area for the CPU 901. The ROM 903 stores a system program. The storage device 904 includes a storage medium such as a hard disk or semiconductor memory, and stores a substrate cleaning program for cleaning the substrate W and cleaning conditions set in association with the cleaning process of the substrate W. The cleaning conditions include pressure information indicating the pressing force when the brush unit 100 is pressed against the substrate W, rotational speed information regarding the rotational speed of the substrate W, and path information indicating the movement path and movement speed of the brush device 50 on the upper surface of the substrate W during the cleaning process.

[0074] The substrate cleaning program may be provided in a state stored in a recording medium such as a CD-ROM 909, and may be installed in the ROM 903 or the storage device 904. Alternatively, the substrate cleaning program may be distributed from a server external to the substrate processing apparatus 1 via a communication network, and may be installed in the ROM 903 or the storage device 904.

[0075] The CPU 901 executes the substrate cleaning program to control the operation of each part of the substrate processing apparatus 1. Specifically, the control unit 900 controls the substrate holding and driving unit 13. As a result, the control unit 900 transitions the state of the plurality of chuck pins 12 from an open state to a holding state, thereby causing the substrate W to be carried into the substrate processing apparatus 1 to be held by the substrate holding device 10. The control unit 900 also transitions the state of the plurality of chuck pins 12 from the holding state to a released state in order to unload the substrate W from the substrate processing apparatus 1. Furthermore, the control unit 900 controls the substrate rotation and driving unit 14 based on the cleaning conditions (rotation speed information) stored in the storage device 904. As a result, the substrate W held by the substrate holding device 10 rotates at a preset speed during the cleaning process of the substrate W.

[0076] The control unit 900 also controls the cup lifting / lowering drive unit 22. As a result, the cup body 21 in Fig. 1 moves between a cup upper position and a cup lower position during the cleaning process of the substrate W. The control unit 900 also controls the fluid supply system 32. As a result, a cleaning liquid is discharged onto the substrate W from the fluid nozzle 31 in Fig. 1 during the cleaning process of the substrate W.

[0077] Furthermore, the control unit 900 controls the arm horizontal drive unit 45 and the arm elevation drive unit 46 based on the cleaning conditions (path information) stored in the storage device 904. As a result, the brush arm 41 moves within the chamber CH when the substrate W is subjected to cleaning processing.

[0078] Furthermore, the control unit 900 controls the brush rotation drive unit 47. As a result, during the cleaning process of the substrate W, the control unit 900 operates the motor of the brush rotation drive unit 47 to rotate the brush unit 100 at a predetermined rotation speed.

[0079] Furthermore, during cleaning processing of the substrate W, the control unit 900 controls the pressing actuator 48 based on the positional relationship between the substrate W and the brush arm 41 and the cleaning conditions (pressure information) stored in the storage device 904. As a result, the cleaning part 210 of the brush unit 100 is pressed against each part of the upper surface of the substrate W with a predetermined pressing force.

[0080] 9, the substrate processing apparatus 1 further includes an operation unit 990. The operation unit 990 includes a keyboard and a pointing device and is configured to be operable by a user. By operating the operation unit 990, the user can input various types of information, such as the pressure information, rotation speed information, and path information, as cleaning conditions. When various types of information are input, the control unit 900 stores the input information in the storage device 904 as cleaning conditions.

[0081] The substrate processing apparatus 1 according to this embodiment uses any one of the brush units 100 according to the first to fourth embodiments. The brush unit described above can suppress damage to the substrate and generation of particles caused by variations in hardness of the sponge-like member. This improves the reliability of the cleaning process for the substrate W.

[0082] Here, assume that the pressing force applied to the substrate W by the pressing actuator 48 is changed in the substrate processing apparatus 1 using any of the brush units 100 according to the first to fourth embodiments. The timing of the change in pressing force may be when processing of a new substrate W is started in the chamber CH, or may be changed while processing a previous substrate W. According to the configuration of the brush unit 100 described above, even when the pressing force applied to the substrate W increases, the overall allowable deformation amount of the brush 200 is limited to a certain amount or less. This makes it possible to suppress damage to the substrate and generation of particles caused by differences in pressing force applied to the cleaning brush. Furthermore, even when a relatively large pressing force is applied, the substrate W can be processed appropriately. This improves the reliability of the cleaning process for the substrate W.

[0083] 6. Other Embodiments (a) In the brush units 100 according to the first to fourth embodiments, the cleaning section 210 of the brush 200 has a circular shape in a plan view, but the present invention is not limited to this. The cleaning section 210 may have an elliptical shape or a polygonal shape in a plan view. That is, the cleaning section 210 may have a flattened elliptical cylindrical shape or a flattened polygonal cylindrical shape.

[0084] (b) In the brush unit 100 according to the first embodiment, the outer diameter of the cleaning support part 220 of the brush 200 is larger than the inner diameter of the tubular member 310. Also, the length (height) of the cleaning support part 220 in the up-down direction is larger than the length (height) from the annular fixing plate 320 to the upper end of the lower holder member 300. However, the present invention is not limited to this. It is sufficient that at least a portion of the cleaning support part 220 is compressed within the accommodation space SS of the brush holder 500.

[0085] Therefore, when the outer diameter of the cleaning support part 220 is larger than the inner diameter of the tubular member 310, the vertical length (height) of the cleaning support part 220 may be approximately the same as the length (height) from the annular fixing plate 320 to the upper end of the lower holder member 300. Also, when the vertical length (height) of the cleaning support part 220 is larger than the length (height) from the annular fixing plate 320 to the upper end of the lower holder member 300, the outer diameter of the cleaning support part 220 of the brush 200 may be approximately the same as the inner diameter of the tubular member 310.

[0086] (c) In the brush unit 100 according to the second embodiment, the cleaning support portion 220 of the brush 200 is compressed within the storage space SS by the biasing member 280 and the movable plate 290, but the present invention is not limited to this. In the brush unit 100, a spacer that limits the space occupied by the cleaning support portion 220 in the storage space SS may be provided instead of the biasing member 280 and the movable plate 290 as a means for compressing the cleaning support portion 220 within the storage space SS. In this case, the spacer may be formed, for example, by a flat cylindrical member that is provided so as to occupy a space a certain distance from the lower end surface of the insertion portion 420.

[0087] (d) In the brush unit 100 according to the third embodiment, the brush 200 may have a configuration in which the cleaning support part 220 according to the first or second embodiment is provided between the cleaning part 210 and the bag member 230.

[0088] 7. Correspondence between each part of the embodiment and each component of the claims The following describes examples of correspondence between the elements of the claims and the elements of the embodiments. Various other elements having the configurations or functions described in the claims may also be used as the elements of the claims.

[0089] In the above embodiment, the brush 200 is an example of a brush, the brush holder is an example of a brush holder, the cleaning portion 210 of the brush 200 is an example of a cleaning portion, the cleaning support portion 220, the bag member 230 and the high-hardness member 240 of the brush 200 are examples of a cleaning support portion, and the brush unit 100 is an example of a brush unit.

[0090] Furthermore, the cleaning portion 210 in Figures 3 and 4 is an example of a first part of the brush, the cleaning support portion 220 in Figures 3 and 4 is an example of a second part of the brush, the single sponge-like member constituting the brush 200 in Figures 3 and 4 is an example of a single sponge-like member, the storage space SS is an example of a storage space, and the opening 321 in the annular fixing plate 320 is an example of an open part of the storage space.

[0091] In addition, the biasing member 280 is an example of a biasing member, the annular fixing plate 320 is an example of a fixing plate, the bag member 230 is an example of a bag member, the gas piping 231 provided in the bag member 230 is an example of a gas adjustment unit, the substrate holding device 10 is an example of a substrate holding unit, and the substrate processing device 1 is an example of a substrate processing device.

[0092] 8. Summary of the embodiment (1) The brush unit according to paragraph 1 is A brush and a brush holder for holding the brush, The brush is a sponge-like cleaning portion that comes into contact with the substrate when cleaning the substrate; a cleaning support part having a higher hardness than the cleaning part, being in contact with the cleaning part, and supporting the cleaning part; The brush holder is configured to hold the cleaning support part and to be able to press the cleaning part against the substrate via the cleaning support part.

[0093] When cleaning a substrate using the brush unit, the brush holder presses the cleaning part against the substrate via the cleaning support part. In this case, the cleaning part and the cleaning support part are arranged so as to overlap between the brush holder and the substrate. Here, the cleaning support part has a higher hardness than the cleaning part. As a result, the amount of deformation of the structure provided between the substrate and the brush holder, specifically the structure including the cleaning part and the cleaning support part, as a whole is limited to an allowable deformation amount or less, compared to when the brush is pressed directly against the substrate by the brush holder.

[0094] As a result, it is possible to suppress damage to the substrate and generation of particles caused by variations in hardness of the sponge-like member.

[0095] (Item 2) In the brush unit described in item 1, The brush holder may have higher rigidity than the cleaning portion and the cleaning support portion.

[0096] In this case, the brush holder is less likely to deform than the cleaning part and the cleaning support part, which allows a high load to be accurately applied to the cleaning part via the cleaning support part when cleaning the substrate.

[0097] (Item 3) In the brush unit described in item 1 or 2, the brush is a single sponge-like member including a first portion and a second portion adjacent to each other; the cleaning unit is constituted by the first part, the brush holder has an accommodation space that is smaller than the second portion and has an open portion; the cleaning support portion is configured by the second portion that is compressed and accommodated in the accommodation space of the brush holder, The cleaning portion may be exposed from the accommodation space through the portion.

[0098] In this case, the cleaning unit and cleaning support unit are made of a single sponge-like member, which improves the ease of handling of the cleaning unit and cleaning support unit. Furthermore, the cleaning support unit is formed by compressing and storing the second portion of the sponge-like member in the storage space of the brush holder. This makes it possible to suppress damage to the substrate and the generation of particles caused by variations in the shape and hardness of the sponge-like member with a simple configuration.

[0099] (4) In the brush unit described in paragraph 1 or 2, the brush is a single sponge-like member including a first portion and a second portion adjacent to each other; the cleaning unit is constituted by the first part, the brush holder has an accommodation space that accommodates the second portion and has an open portion; the brush unit further includes a biasing member that biases the second portion accommodated in the accommodation space toward the one portion and its surrounding portion within the accommodation space, thereby compressing the second portion within the accommodation space; the cleaning support portion is configured by the second portion compressed in the accommodating space of the brush holder, The cleaning portion may be exposed from the accommodation space through the portion.

[0100] In this case, the cleaning unit and cleaning support unit are made of a single sponge-like member, which improves ease of handling. Furthermore, the cleaning support unit is formed by compressing the second portion of the sponge-like member by the biasing member within the accommodation space of the brush holder. This simple configuration makes it possible to suppress damage to the substrate and the generation of particles caused by variations in the shape and hardness of the sponge-like member.

[0101] (Item 5) In the brush unit described in item 4, the brush holder includes a fixing plate that defines the accommodation space and has an opening as the portion of the accommodation space; The biasing member may bias the second portion toward the fixed plate.

[0102] In this case, in the accommodation space of the brush holder, the part of the second portion of the sponge-like member that is located mainly between the biasing member and the fixed plate is compressed.

[0103] (Item 6) In the brush unit described in item 1 or 2, the cleaning support part includes a bag member configured to be expandable by supplying gas therein, and configured such that the larger the bag member is supplied with gas therein, the higher the hardness of the cleaning support part; the brush holder has an accommodation space that accommodates the bag member and is partially open; the brush unit further includes a gas adjusting section that is capable of supplying gas to the bag member accommodated in the accommodation space and discharging gas from the bag member accommodated in the accommodation space, The cleaning portion may be exposed from the accommodation space through the portion.

[0104] In this case, the hardness of the cleaning support part can be adjusted by adjusting the amount of gas supplied to the bag member, and therefore the hardness of the cleaning support part can be adjusted according to the pressure to be applied to the substrate from the cleaning part when cleaning the substrate.

[0105] (Item 7) The substrate processing apparatus according to item 7 is a substrate holder for holding a substrate; and a brush unit according to any one of claims 1 to 6, which is provided to clean one surface of the substrate held by the substrate holder.

[0106] The brush unit described above can suppress damage to the substrate and generation of particles caused by variations in hardness of the sponge-like member, thereby improving the reliability of the substrate cleaning process. [Explanation of symbols]

[0107] 1...substrate processing apparatus, 10...substrate holding device, 11...spin base, 12...chuck pin, 13...substrate holding drive unit, 14...substrate rotation drive unit, 20...cup device, 21...cup body, 22...cup lift drive unit, 30...nozzle device, 31...fluid nozzle, 32...fluid supply system, 40...brush arm device, 41...brush arm, 42...brush holding unit, 43...guide rail, 44...arm support unit, 45...arm horizontal drive unit, 46...arm lift drive unit, 47...brush rotation drive unit, 48...pressure actuator, 49...standby pod, 50...brush device, 100...brush unit, 200...brush, 210...cleaning unit, 211...cleaning surface, 22 0...cleaning support part, 230...bag member, 231...gas pipe, 240...high hardness member, 280...urging member, 290...movable plate, 300...lower holder member, 310...cylindrical member, 320...annular fixing plate, 321...opening, 330...recess, 400...upper holder member, 410...lid part, 420...insertion part, 429...projection part, 430...connected part, 431...shaft insertion hole, 500...brush holder, 900...control part, 901...CPU, 902...RAM, 903...ROM, 904...storage device, 909...CD-ROM, 990...operation part, CH...chamber, CHB...floor surface, L1...virtual line, SC...rotation center, SP...standby position, SS...storage space, VS...virtual surface, W...substrate

Claims

1. A brush and a brush holder for holding the brush, The brush is a sponge-like cleaning portion that comes into contact with the substrate when cleaning the substrate; a cleaning support part having a higher hardness than the cleaning part, being in contact with the cleaning part, and supporting the cleaning part; The brush holder is configured to hold the cleaning support part and to be able to press the cleaning part against the substrate via the cleaning support part.

2. The brush unit according to claim 1 , wherein the brush holder has higher rigidity than the cleaning portion and the cleaning support portion.

3. the brush is a single sponge-like member including a first portion and a second portion adjacent to each other; the cleaning unit is constituted by the first part, the brush holder has an accommodation space that is smaller than the second portion and has an open portion; the cleaning support portion is configured by the second portion that is compressed and accommodated in the accommodation space of the brush holder, The brush unit according to claim 1 or 2, wherein the cleaning portion is exposed from the accommodation space through the portion.

4. the brush is a single sponge-like member including a first portion and a second portion adjacent to each other; the cleaning unit is constituted by the first part, the brush holder has an accommodation space that accommodates the second portion and has an open portion; the brush unit further includes a biasing member that biases the second portion accommodated in the accommodation space toward the one portion and its surrounding portion within the accommodation space, thereby compressing the second portion within the accommodation space; the cleaning support portion is configured by the second portion compressed in the accommodation space of the brush holder, The brush unit according to claim 1 or 2, wherein the cleaning portion is exposed from the accommodation space through the portion.

5. the brush holder includes a fixing plate that defines the accommodation space and has an opening as the portion of the accommodation space; The brush unit according to claim 4 , wherein the biasing member biases the second portion toward the fixed plate.

6. the cleaning support part includes a bag member configured to be expandable by supplying gas therein, and configured such that the larger the bag member is supplied with gas therein, the higher the hardness of the cleaning support part; the brush holder has an accommodation space that accommodates the bag member and is partially open; the brush unit further includes a gas adjusting section that is capable of supplying gas to the bag member accommodated in the accommodation space and discharging gas from the bag member accommodated in the accommodation space, The brush unit according to claim 1 or 2, wherein the cleaning portion is exposed from the accommodation space through the portion.

7. a substrate holder for holding a substrate; 3. A substrate processing apparatus comprising: a brush unit according to claim 1, which is provided to clean one surface of the substrate held by the substrate holder.

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