Processing liquid adjustment device and substrate processing system

Abstract

To provide a processing liquid adjustment device which enables moisture contained in a processing liquid to be evaporated efficiently, and to provide a substrate processing system.SOLUTION: A processing liquid adjustment device 200 includes: a first storage tank 210 for storing a processing liquid; a stirring part 240 which stirs the processing liquid in the first storage tank 210; and an air bubble supply unit 250 which supplies air bubbles to the processing liquid in the first storage tank 210. The stirring part 240 has: a rotary fin 241 which is provided rotatably so as to form vortex flow in the processing liquid in the first storage tank 210; and a gas supply unit 243 which rotates the rotary fin 241. The air bubble supply unit 250 supplies air bubbles toward the vortex flow formed by the rotary fin 241.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a processing liquid adjusting apparatus and a substrate processing system. [Background technology]

[0002] There are wet etching devices that form desired patterns by etching a film formed on a substrate such as a semiconductor wafer or a glass substrate with a processing liquid. For example, a liquid containing phosphoric acid (hereinafter referred to as a phosphoric acid solution) is used as the processing liquid for the etching process. In the etching process, a desired etching rate can be obtained by adjusting the concentration of phosphoric acid in the phosphoric acid solution to a predetermined concentration (hereinafter referred to as a predetermined concentration).

[0003] The phosphoric acid solution used in the etching process is recovered and reused, but the phosphoric acid concentration in the phosphoric acid solution recovered after the etching process may be lower than the predetermined concentration due to, for example, mixing with the cleaning solution used in the cleaning process.

[0004] Therefore, a substrate processing apparatus has been proposed that can efficiently evaporate the water contained in the phosphoric acid aqueous solution by ejecting bubbling gas from a bubbling nozzle provided at the bottom of the tank to bubble the phosphoric acid aqueous solution in the tank and increasing the area of ​​the gas-liquid interface formed between the bubbling gas and the phosphoric acid aqueous solution. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-096058 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the substrate processing apparatus described above, bubbles supplied from below rise in the processing liquid stored in the storage tank due to buoyancy and reach the surface of the processing liquid relatively quickly, so the time the supplied bubbles flow through the processing liquid is relatively short, which may prevent efficient evaporation of moisture contained in the processing liquid in the storage tank.

[0007] The present invention has been made to solve the above-mentioned problems, and has an object to provide a processing liquid adjusting apparatus and a substrate processing system that can efficiently evaporate water contained in a processing liquid. [Means for solving the problem]

[0008] The processing liquid adjustment device according to the embodiment comprises a storage tank for storing a processing liquid, an agitation unit for agitating the processing liquid in the storage tank, and an air bubble supply unit for supplying air bubbles to the processing liquid in the storage tank, wherein the agitation unit has a rotatable rotating fin that is rotatably arranged to form a vortex in the processing liquid in the storage tank, and a rotation mechanism that rotates the rotating fin, and the air bubble supply unit supplies air bubbles toward the vortex formed by the rotating fin.

[0009] The substrate processing system according to the embodiment includes the above-described processing liquid adjustment device, a substrate processing apparatus for processing a substrate with the processing liquid, a recovery pipe for sending the processing liquid recovered in the substrate processing apparatus to the processing liquid adjustment device, and a supply pipe for supplying the processing liquid processed in the processing liquid adjustment device to the substrate processing apparatus. [Effects of the Invention]

[0010] According to the embodiment of the present invention, the water contained in the treatment liquid can be efficiently evaporated. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram showing a schematic configuration of a substrate processing system according to a first embodiment. [Figure 2]1 is a perspective view showing a schematic configuration of a treatment liquid adjusting apparatus according to a first embodiment. [Figure 3] 1 is a plan view showing a processing liquid adjusting apparatus according to a first embodiment. [Figure 4] FIG. 2 is a plan view showing the stirring unit and the bubble supply unit of the first embodiment. [Figure 5] FIG. 5 is a partial cross-sectional view showing a cross section taken along line AA in FIG. [Figure 6] 5 is a partial cross-sectional view showing a cross section of a rotary fin and a shaft pin taken along line AA in FIG. 4. FIG. [Figure 7] FIG. 10 is a perspective view showing a schematic configuration of a treatment liquid adjusting apparatus according to a second embodiment. [Figure 8] FIG. 10 is a plan view showing a processing liquid adjusting apparatus according to a second embodiment. [Figure 9] FIG. 6 is a partial cross-sectional view showing a stirring section of a second embodiment. [Figure 10] FIG. 10 is a partial cross-sectional view showing a modified stirring section. DETAILED DESCRIPTION OF THE INVENTION

[0012] [First embodiment] A substrate processing system 1 according to a first embodiment of the present invention will be described below with reference to Fig. 1 to Fig. 6. As shown in Fig. 1, the substrate processing system 1 includes a substrate processing apparatus 100, a processing liquid adjusting apparatus 200, a processing liquid storage apparatus 300, a recovery pipe 400, a liquid delivery pipe 500, a supply pipe 600, a branch pipe 700, and a control apparatus 800.

[0013] (Substrate processing equipment) The substrate processing apparatus 100 processes a substrate W with a processing liquid. In this embodiment, the substrate processing apparatus 100 is a single-wafer wet etching apparatus that supplies a processing liquid to a substrate W such as a semiconductor wafer or glass, and performs an etching process. Although one substrate processing apparatus 100 is shown in FIG. 1 , a plurality of substrate processing apparatuses 100 may be provided for one processing liquid adjustment apparatus 200. As shown in FIG. 1 , the substrate processing apparatus 100 includes a rotation drive unit 110, a processing liquid supply nozzle 120, a cleaning liquid supply nozzle 130, and a recovery unit 140.

[0014] The rotation drive unit 110 holds, for example, the periphery of the substrate W and rotates the substrate W around an axis perpendicular to the surface of the substrate W. The processing liquid supply nozzle 120 is a nozzle for supplying a processing liquid to the substrate W rotated by the rotation drive unit 110. The processing liquid supply nozzle 120 is connected to one end of a supply pipe 600. The processing liquid is, for example, an acid-based liquid such as hydrofluoric acid, phosphoric acid, or sulfuric acid. In this embodiment, a liquid containing phosphoric acid (phosphoric acid solution) is used. The cleaning liquid supply nozzle 130 is a nozzle for supplying a cleaning liquid to the substrate W rotated by the rotation drive unit 110. The cleaning liquid supply nozzle 130 is connected to one end of a cleaning liquid supply pipe 131. The other end of the cleaning liquid supply pipe 131 is connected to a cleaning liquid supply source (not shown) that stores a cleaning liquid. The cleaning liquid is, for example, a liquid such as pure water or IPA. In this embodiment, pure water is used. The recovery unit 140 has, for example, a cylindrical shape and is provided so as to surround the periphery of the rotation drive unit 110. The recovery unit 140 recovers the processing liquid or cleaning liquid scattered by the rotation of the substrate W. The recovery unit 140 has an opening (not shown) formed in the bottom. The opening of the recovery unit 140 is connected to one end of a recovery pipe 400, and the recovered processing liquid or cleaning liquid flows into the recovery pipe 400.

[0015] (Processing liquid adjusting device) The processing liquid adjusting apparatus 200 adjusts the concentration of the processing liquid recovered in the substrate processing apparatus 100. In this embodiment, the concentration of the processing liquid refers to the concentration of phosphoric acid contained in a phosphoric acid solution. Specifically, the processing liquid adjusting apparatus 200 adjusts the concentration of the processing liquid to a predetermined concentration by evaporating the water contained in the processing liquid. The water contained in the processing liquid refers to, for example, a liquid that dilutes the processing liquid (hereinafter, referred to as a diluting liquid) or a cleaning liquid mixed with the processing liquid in the substrate processing apparatus 100 or the recovery pipe 400. The predetermined concentration refers to a concentration of the processing liquid that is suitable for etching the substrate W.

[0016] The processing liquid adjusting device 200 adjusts the concentration of the processing liquid to a predetermined concentration by evaporating the water contained in the processing liquid and supplying a diluent to the processing liquid as needed. The processing liquid adjusting device 200 includes a first storage tank 210, a partition plate 220, an opening 230, an agitating unit 240, an air bubble supplying unit 250, a first heating unit 260, a circulation pipe 270, and a diluent supplying unit 280.

[0017] As shown in FIG. 2, the first storage tank 210 is a rectangular container for storing the processing liquid. The first storage tank 210 is made of a material that is corrosion-resistant and heat-resistant to the processing liquid. As shown in FIG. 3, the first storage tank 210 has a first side surface 211, a second side surface 212 perpendicular to the first side surface 211, a third side surface 213 facing the first side surface 211, a fourth side surface 214 facing the second side surface 212, a bottom surface surrounded by the first to fourth side surfaces 211 to 214, and an upper surface (not shown) facing the bottom surface. Note that the first side surface 211, the second side surface 212, and the upper surface of the first storage tank 210 are omitted in FIG. 2. The upper surface of the first storage tank 210 is omitted in FIG. 3. Furthermore, a plurality of circular recesses 210a, each larger in diameter than a rotary fin 241 (described later), are provided on the bottom surface of the first storage tank 210 in correspondence with the agitation section 240.

[0018] 2 and 3, the direction perpendicular to the second side surface 212 is defined as the X direction. The direction perpendicular to the first side surface 211 is defined as the Y direction. The direction perpendicular to the bottom surface of the first storage tank 210 (vertical direction) is defined as the Z direction.

[0019] The partition plate 220 is provided to divide the first storage tank 210 into a plurality of regions R. In this embodiment, the plurality of regions R are a first region R1, a second region R2, and a third region R3. Like the first storage tank 210, the partition plate 220 is made of a material that is corrosion-resistant and heat-resistant against the processing liquid. In this embodiment, as shown in FIG. 3 , the partition plate 220 is provided such that its end faces are in contact with the first side surface 211 and the third side surface 213, and is provided parallel to the second side surface 212. In addition, the vertical length of the partition plate 220 is set to be higher than the liquid level of the processing liquid in the first storage tank 210. The partition plate 220 has a first partition plate 221 that divides the inside of the first storage tank 210 into a first region R1 and a second region R2, and a second partition plate 222 that divides the inside of the first storage tank 210 into the second region R2 and a third region R3.

[0020] The openings 230 communicate with adjacent regions R. The openings 230 are open so that a predetermined flow rate of the processing liquid flows into each region R. In this embodiment, as shown in FIG. 2, the openings 230 are holes that are elongated in the vertical direction and formed in the partition plate 220. The openings 230 include a first opening 231 that communicates the first region R1 with the second region R2, and a second opening 232 that communicates the second region R2 with the third region R3. That is, the first opening 231 is a hole formed in the first partition plate 221, and the second opening 232 is a hole formed in the second partition plate 222.

[0021] The first opening 231 and the second opening 232 are provided spaced apart in the extension direction of the partition plate 220. Here, the extension direction of the partition plate 220 refers to the direction in which the partition plate 220 extends to divide the area into a plurality of regions R, and refers to the direction (Y direction) perpendicular to the first side surface 211. For example, as shown in FIG. 3 , when the first opening 231 is formed on the first side surface 211 side of the first partition plate 221, the second opening 232 is formed on the third side surface 213 side of the second partition plate 222.

[0022] The agitation unit 240 agitates the treatment liquid in the first storage tank 210. The agitation unit 240 is provided below the first storage tank 210. In this embodiment, the agitation unit 240 is provided in a recess 210a on the bottom surface of the first storage tank 210, as shown in FIG. 2. The agitation unit 240 is provided in each of the multiple regions R. The agitation unit 240 is preferably provided near the first opening 231 and the second opening 232, respectively. For example, the agitation unit 240 is preferably provided on the bottom surface of each region R of the first storage tank 210 so that at least a portion of the agitation unit 240 is located on a straight line on which the first opening 231 or the second opening 232 exists in a direction parallel to the first side surface 211 in a plan view (X direction). A plurality of agitation units 240 are provided in each of the multiple regions R. 3, three stirring units 240 are provided in the first region R1, four in the second region R2, and three in the third region R3, and are arranged along the Y direction of each region R. As shown in FIG. 4, the stirring units 240 each include a rotary fin 241, a shaft pin 242, and a gas supply unit 243.

[0023] The rotary fin 241 is rotatably provided so as to form a vortex in the treatment liquid in the first storage tank 210. The diameter of the rotary fin 241 is smaller than that of the recess 210a. The rotary fin 241 forms a vortex such that the diameter of the vortex increases vertically upward. As shown in FIG. 4, the rotary fin 241 is composed of a cylindrical body 241a and blade members 241b.

[0024] The cylindrical body 241a is a cylindrical member provided so as to extend in the direction of the rotation axis of the rotary fin 241. The cylindrical body 241a is provided so as to be positioned at the center of the rotary fin 241. The inner diameter of the cylindrical body 241a is larger than the diameter of the pivot pin 242.

[0025] The blade member 241b has a curved surface that can receive gas supplied from a direction perpendicular to the direction in which the rotation axis (shaft pin 242) of the rotary fin 241 extends (a direction parallel to the bottom surface of the first storage tank 210). A plurality of blade members 241b are provided, and in this embodiment, four blade members are provided. The plurality of blade members 241b are connected to the outer periphery of the cylindrical body 241a at equal intervals. The blade member 241b is provided with a block body 241c and a through-hole 241d.

[0026] As shown in FIG. 5, the block body 241c is provided on the side of the blade member 241b constituting the rotary fin 241 opposite to the side facing the bottom surface of the first storage tank 210. In other words, the block body 241c is provided on the side of the blade member 241b where a vortex flow is formed. Note that FIG. 5 shows the first storage tank 210 portion as a cross section. The block body 241c is provided so as to protrude from the blade member 241b and has a shape that extends in the radial direction of the rotary fin 241. In this embodiment, the block body 241c has a triangular prism shape with one of its quadrangular faces in contact with the side of the blade member 241b where a vortex flow is formed. The block body 241c is provided on each of the blade members 241b.

[0027] As shown in Fig. 6, the through-holes 241d are provided in the blade members 241b that constitute the rotary fin 241, and are holes that penetrate in the direction in which the rotation axis of the rotary fin 241 extends. In Fig. 6, only one blade member 241b of the rotary fin 241 is shown. The through-holes 241d are provided radially inward of the block bodies 241c. The through-holes 241d are provided in each of the blade members 241b.

[0028] The pivot pin 242 is a cylindrical member and serves as the rotation axis of the rotary fin 241. The pivot pin 242 has a diameter smaller than the inner diameter of the cylindrical body 241a and is inserted through the cylindrical body 241a. Therefore, the rotary fin 241 is not fixed to the pivot pin 242 and can rotate by the first gas supplied by the gas supply unit 243. The pivot pin 242 is provided to extend in the vertical direction (Z direction), and one end thereof is fixed to a recess 210a in the bottom surface of the first storage tank 210. The other end of the pivot pin 242 has a protrusion 242a. The other end of the pivot pin 242 refers to the end of the side of the pivot pin 242 that is not fixed to the bottom surface of the first storage tank 210, i.e., the side where a vortex is formed by the rotary fin 241.

[0029] The protrusion 242a is a member that protrudes from the other end of the pivot pin 242 in the radial direction of the rotary fin 241. In this embodiment, the protrusion 242a has an inverse tapered shape that widens as it goes away from one end of the pivot pin 242. As shown in FIG. 4, the protrusion 242a has a shape that can cover the entire through-hole 241d in plan view. Furthermore, the protrusion 242a has a shape that does not overlap with the block body 241c in plan view.

[0030] The gas supply unit 243 supplies a first gas toward the rotary fins 241, thereby rotating the rotary fins 241. Specifically, the gas supply unit 243 supplies the first gas toward the curved surfaces formed on the blade members 241b. The first gas may be, for example, an inert gas such as nitrogen gas or clean air, and in this embodiment, nitrogen gas is used. As shown in FIG. 5, the gas supply unit 243 supplies the first gas toward the rotary fins 241 from a direction perpendicular to the direction in which the pivot pin 242 extends (a direction parallel to the bottom surface of the first storage tank 210). The gas supply unit 243 has a gas supply source 243a, a gas supply nozzle 243b, a gas supply pipe 243c, and a gas supply valve 243d.

[0031] The gas supply source 243a stores the first gas. The gas supply nozzle 243b is a nozzle for supplying the first gas to the rotating fin 241. As shown in FIG. 5, the gas supply nozzle 243b has a supply port provided in the recess 210a of the first storage tank 210, and is provided so that the supply direction of the first gas is perpendicular to the extension direction of the pivot pin 242. Furthermore, the gas supply nozzle 243b is provided so that the supply direction of the first gas is offset from the pivot pin 242 in a plan view in order to supply the first gas toward the curved surface formed on the blade member 241b. The gas supply pipe 243c is a pipe for supplying the first gas from the gas supply source 243a to the gas supply nozzle 243b. The gas supply valve 243d is provided in the gas supply pipe 243c and opens and closes to start and stop the supply of the first gas. The gas supply valve 243d adjusts the supply flow rate of the first gas by adjusting the opening / closing degree.

[0032] The bubble supply unit 250 supplies bubbles toward the vortex formed by the rotating fins 241. The bubbles are generated by supplying a second gas to the processing liquid in the first storage tank 210. The second gas may be, for example, an inert gas such as nitrogen gas or clean air, and in this embodiment, nitrogen gas is used. The bubble supply unit 250 is provided below the first storage tank 210, and in this embodiment, it is provided in the recess 210a on the bottom surface of the first storage tank 210 as shown in FIG. 5. A bubble supply unit 250 is provided in each of the multiple regions R. A plurality of bubble supply units 250 are provided corresponding to the agitation unit 240. In this embodiment, three bubble supply units 250 are provided in the first region R1, four in the second region R2, and three in the third region R3. The bubble supply unit 250 includes an air bubble supply source 251 , an air bubble supply nozzle 252 , an air bubble supply pipe 253 , and an air bubble supply valve 254 .

[0033] The bubble supply source 251 stores the second gas. The bubble supply nozzle 252 is a nozzle for supplying bubbles toward the vortex formed by the rotating fin 241. As shown in FIG. 5, the bubble supply nozzle 252 has a supply port provided in the recess 210a of the first storage tank 210, and is provided so that the bubble supply direction is vertically upward. The diameter of the bubble supply nozzle 252 is smaller than the diameter of the gas supply nozzle 243b. Therefore, the bubble supply unit 250 can generate fine bubbles and increase the gas-liquid interface. A plurality of bubble supply nozzles 252 are provided, and in this embodiment, as shown in FIG. 4, a plurality of bubble supply nozzles 252 are provided radially outside the rotating fin 241 along the circumferential direction of the rotating fin 241. The bubble supply pipe 253 is a pipe for supplying the second gas from the bubble supply source 251 to the bubble supply nozzle 252. The bubble supply valve 254 is provided in the bubble supply pipe 253, and opens and closes to start and stop the supply of the second gas. The bubble supply valve 254 also adjusts the supply flow rate of the second gas by adjusting the opening and closing degree.

[0034] The first heating unit 260 heats the processing liquid in the first storage tank 210 to a predetermined temperature. Here, the predetermined temperature refers to a temperature of the processing liquid suitable for etching the substrate W at a predetermined concentration. As shown in FIG. 3 , the first heating unit 260 has a first heater 261 provided in the first region R1, a second heater 262 provided in the second region R2, and a third heater 263 provided in the third region R3.

[0035] The first heater 261, the second heater 262, and the third heater 263 generate heat when energized. As shown in Fig. 2, the first heater 261, the second heater 262, and the third heater 263 are provided near the bottom surface of each region R in the first storage tank 210. As shown in Fig. 3, the first heater 261, the second heater 262, and the third heater 263 are shaped to extend in the direction in which the partition plate 220 extends (Y direction).

[0036] The circulation pipe 270 is a pipe for circulating the treatment liquid in the first storage tank 210. One end of the circulation pipe 270 is connected to a first circulation port 270a formed on the bottom surface of the first storage tank 210 in the first region R1. The other end of the circulation pipe 270 is connected to a second circulation port 270b formed on the top surface of the first storage tank 210 in the second region R2. As shown in FIG. 1 , the circulation pipe 270 is provided with a first pump 271, a second heating unit 272, a first thermometer 273, and a concentration meter 274.

[0037] The first pump 271 sends a portion of the treatment liquid flowing through the first region R1 to the second region R2 via the circulation pipe 270. The second heating unit 272 is provided downstream of the first pump 271 in the circulation pipe 270. The second heating unit 272 heats the treatment liquid flowing through the circulation pipe 270 to a predetermined temperature. The second heating unit 272 has a fourth heater 272a that generates heat when energized. The first thermometer 273 is provided downstream of the second heating unit 272 in the circulation pipe 270 and measures the temperature of the treatment liquid flowing through the circulation pipe 270. The concentration meter 274 is provided downstream of the second heating unit 272 in the circulation pipe 270 and measures the concentration of the treatment liquid flowing through the circulation pipe 270. In this embodiment, the concentration meter 274 measures the concentration of phosphoric acid in the phosphoric acid solution flowing through the circulation pipe 270.

[0038] The diluent supply unit 280 supplies a diluent to the processing liquid in the first storage tank 210. In this embodiment, pure water is used as the diluent. The diluent supply unit 280 includes a diluent supply source 281, a diluent supply pipe 282, and a diluent supply valve 283.

[0039] The diluent supply source 281 stores the diluent. The diluent supply pipe 282 is a pipe for supplying the diluent to the processing liquid in the first storage tank 210. One end of the diluent supply pipe 282 is connected to a diluent supply port 282a formed on the upper surface of the first storage tank 210 in the second region R2, and the other end is connected to a diluent supply source 281 that stores the diluent. The diluent supply valve 283 is provided on the diluent supply pipe 282 and opens and closes to supply and stop the supply of the diluent. The diluent supply valve 283 also adjusts the supply flow rate of the diluent by adjusting the opening / closing degree.

[0040] (Processing liquid storage device) The processing liquid storage device 300 stores the processing liquid processed in the processing liquid adjustment device 200. The processing liquid processed in the processing liquid adjustment device 200 is a processing liquid whose concentration has been adjusted to a predetermined concentration by evaporating the water contained in the processing liquid or by supplying a diluting liquid to the processing liquid. As shown in FIG. 1 , the processing liquid storage device 300 includes a second storage tank 310 and a new liquid supply pipe 320.

[0041] The second storage tank 310 is a rectangular container for storing the processing liquid. The second storage tank 310 is made of a material that is corrosion-resistant and heat-resistant against the processing liquid. The new liquid supply pipe 320 is a pipe for supplying new processing liquid to the second storage tank 310 in an amount corresponding to the amount lost due to processing in the substrate processing apparatus 100. One end of the new liquid supply pipe 320 is connected to the second storage tank 310, and the other end is connected to a new liquid supply source (not shown) that stores new processing liquid. The new processing liquid stored in the new liquid supply source is heated in advance to a predetermined temperature.

[0042] (Recovery piping) The recovery pipe 400 is a pipe for sending the processing liquid recovered in the substrate processing apparatus 100 to the processing liquid adjustment apparatus 200. One end of the recovery pipe 400 is connected to an opening of the recovery unit 140 of the substrate processing apparatus 100, and the other end is connected to a recovery port 400a formed on the top surface of the first storage tank 210 in the first region R1 of the processing liquid adjustment apparatus 200.

[0043] The recovery port 400a is provided spaced apart from the first opening 231 in the extension direction (Y direction) of the partition plate 220. For example, as shown in Fig. 3, when the first opening 231 is formed on the first side surface 211 side of the first partition plate 221, the recovery port 400a is formed on the third side surface 213 side of the upper surface of the first region R1 of the first storage tank 210.

[0044] A recovery valve 410 is provided in the recovery pipe 400, and opening and closing it starts and stops the transfer of the recovered processing liquid. One end of a discharge pipe 420 is connected to the recovery pipe 400 upstream of the recovery valve 410. A discharge valve 430 is provided in the discharge pipe 420, and opening and closing it starts and stops the transfer of the recovered cleaning liquid.

[0045] (liquid delivery piping) The liquid supply pipe 500 is a pipe for supplying the processing liquid processed in the processing liquid adjusting apparatus 200 to the processing liquid storage device 300. One end of the liquid supply pipe 500 is connected to a liquid supply port 500a formed on the bottom surface of the first storage tank 210 in the third region R3 of the processing liquid adjusting apparatus 200, and the other end is connected to the second storage tank 310 of the processing liquid storage device 300.

[0046] The liquid supply port 500a is provided spaced apart from the second opening 232 in the extending direction (Y direction) of the partition plate 220. For example, as shown in Fig. 3, when the second opening 232 is formed on the third side surface 213 side of the second partition plate 222, the liquid supply port 500a is formed on the first side surface 211 side of the bottom surface of the third region R3 of the first storage tank 210. A second pump 510 is provided in the liquid supply pipe 500 to supply the processing liquid processed in the processing liquid adjustment device 200 to the processing liquid storage device 300.

[0047] (supply piping) The supply pipe 600 is a pipe for supplying the processing liquid that has been processed in the processing liquid adjusting apparatus 200 and is stored in the second storage tank 310 of the processing liquid storage device 300 to the substrate processing apparatus 100. As shown in Fig. 1 , one end of the supply pipe 600 is connected to the processing liquid supply nozzle 120 of the substrate processing apparatus 100, and the other end is connected to the bottom surface of the second storage tank 310 of the processing liquid storage device 300. The supply pipe 600 is provided with a third pump 610, a third heating unit 620, a second thermometer 630, and a supply valve 640.

[0048] The third pump 610 supplies the processing liquid stored in the second storage tank 310 of the processing liquid storage device 300 to the substrate processing apparatus 100. The third heating unit 620 is provided downstream of the third pump 610 on the supply pipe 600. The third heating unit 620 heats the processing liquid flowing through the supply pipe 600 to a predetermined temperature. The third heating unit 620 has a fifth heater 621 that generates heat when energized. The second thermometer 630 is provided downstream of the third heating unit 620 on the supply pipe 600 and measures the temperature of the processing liquid flowing through the supply pipe 600. The supply valve 640 is provided downstream of the second thermometer 630 on the supply pipe 600 and opens and closes to supply and stop the supply of the processing liquid to the substrate processing apparatus 100. The supply valve 640 adjusts the opening and closing degree to adjust the supply flow rate of the processing liquid.

[0049] (Branch piping) The branch pipe 700 is a pipe for sending the processing liquid flowing through the supply pipe 600 to the processing liquid storage device 300. Therefore, as shown in FIG. 1 , one end of the branch pipe 700 is connected to the middle of the supply pipe 600, and the other end is connected to the second storage tank 310 of the processing liquid storage device 300. Specifically, one end of the branch pipe 700 is connected to a position downstream of the second thermometer 630 in the supply pipe 600 and upstream of the supply valve 640. A branch valve 710 is provided in the branch pipe 700. The branch valve 710 opens and closes to start and stop the sending of the processing liquid to the processing liquid storage device 300.

[0050] (Control device) The control device 800 controls each part of the substrate processing system 1. The control device 800 controls the rotation drive unit 110, the gas supply valve 243d, the bubble supply valve 254, the first heater 261, the second heater 262, the third heater 263, the first pump 271, the fourth heater 272a, the diluent supply valve 283, the recovery valve 410, the discharge valve 430, the second pump 510, the third pump 610, the fifth heater 621, the supply valve 640, and the branch valve 710.

[0051] (operation) The operation of the substrate processing system 1 according to this embodiment of the present invention will be described below.

[0052] First, the substrate processing apparatus 100 performs an etching process on the substrate W by supplying the processing liquid from the processing liquid supply nozzle 120 to the substrate W held and rotated by the rotation drive unit 110. The recovery unit 140 recovers the processing liquid that has been scattered radially outward from the substrate W due to the rotation of the substrate W. During the etching process, the control device 800 controls the recovery valve 410 provided in the recovery pipe 400 to open it, and controls the discharge valve 430 provided in the discharge pipe 420 to close it. Therefore, the processing liquid recovered by the recovery unit 140 is sent through the recovery pipe 400 and from the recovery port 400a to the first region R1 of the first storage tank 210 of the processing liquid adjustment apparatus 200.

[0053] After the etching process, the substrate processing apparatus 100 performs a cleaning process on the substrate W by supplying a cleaning liquid from the cleaning liquid supply nozzle 130 to the substrate W held and rotated by the rotation drive unit 110. During the cleaning process, the control device 800 controls the recovery valve 410 provided in the recovery pipe 400 to close it, and controls the discharge valve 430 provided in the discharge pipe 420 to open it. Therefore, the cleaning liquid recovered by the recovery unit 140 is discharged outside the substrate processing system 1 via the recovery pipe 400 and the discharge pipe 420.

[0054] The processing liquid sent to the first region R1 from the recovery port 400a formed on the third side surface 213 side of the upper surface of the first storage tank 210 in the first region R1 flows within the first region R1 while being heated by the first heater 261. The processing liquid in the first region R1 that has flowed to the first side surface 211 side of the first storage tank 210 flows into the second region R2 via the first opening 231.

[0055] Here, a part of the processing liquid flowing in the first region R1 flows toward the first circulation port 270a. The part of the processing liquid that has flowed to the first circulation port 270a is sent by the first pump 271 to the second region R2 via the circulation pipe 270 and the second circulation port 270b.

[0056] The processing liquid flowing through the circulation pipe 270 is heated to a predetermined temperature by the fourth heater 272a. The temperature of the processing liquid heated by the fourth heater 272a is measured by the first thermometer 273 while flowing through the circulation pipe 270. The control device 800 controls the first heating unit 260 and the second heating unit 272 in accordance with the temperature of the processing liquid measured by the first thermometer 273.

[0057] For example, if the measured temperature of the processing liquid is lower than a predetermined temperature, the control device 800 increases the heating output of the first heater 261, the second heater 262, and the third heater 263 of the first heating section 260, and the fourth heater 272a of the second heating section 272, so that the temperature of the processing liquid becomes the predetermined temperature.

[0058] The concentration of the treatment liquid heated by the fourth heater 272a is measured by the concentration meter 274 while flowing through the circulation pipe 270. The control device 800 controls the bubble supply unit 250, the first heating unit 260, the second heating unit 272, and the dilution liquid supply unit 280 in accordance with the concentration of the treatment liquid measured by the concentration meter 274.

[0059] For example, if the measured concentration of the treatment liquid is lower than a predetermined concentration, the control device 800 controls the bubble supply unit 250, the first heating unit 260, and the second heating unit 272 so that the concentration of the treatment liquid becomes the predetermined concentration. That is, the control device 800 controls the bubble supply valve 254 of the bubble supply unit 250 so as to increase the supply flow rate of the second gas, thereby increasing the supply amount of bubbles and evaporating more water contained in the treatment liquid. The control device 800 also increases the heating output of the first heater 261, the second heater 262, and the third heater 263 of the first heating unit 260 and the fourth heater 272a of the second heating unit 272 so as to evaporate more water contained in the treatment liquid.

[0060] Furthermore, if the measured concentration of the treatment liquid is higher than a predetermined concentration, the control device 800 controls the diluent supply unit 280 so that the concentration of the treatment liquid becomes the predetermined concentration. That is, the control device 800 controls the diluent supply valve 283 of the diluent supply unit 280 so as to supply the diluent to the treatment liquid in the first storage tank 210, thereby increasing the water content of the treatment liquid.

[0061] The processing liquid that has flowed into the second region R2 from the first opening 231 formed on the first side surface 211 side of the first partition plate 221 flows within the second region R2 while being heated by the second heater 262. The processing liquid that has flowed into the second region R2 from the second circulation port 270b formed on the upper surface of the first storage tank 210 in the second region R2 flows within the second region R2 while being heated by the second heater 262. The processing liquid in the second region R2 that has flowed to the third side surface 213 side of the first storage tank 210 flows into the third region R3 via the second opening 232.

[0062] The processing liquid that has flowed into the third region R3 from the second opening 232 formed on the third side surface 213 side of the second partition plate 222 flows within the third region R3 while being heated by the third heater 263. The processing liquid in the third region R3 that has flowed to the first side surface 211 side of the first storage tank 210 is sent by the second pump 510 from the liquid sending port 500a through the liquid sending piping 500 to the second storage tank 310 of the processing liquid storage device 300.

[0063] While the treatment liquid flows through each region R, the gas supply unit 243 provided in each region R supplies a first gas toward the rotary fins 241. This causes the rotary fins 241 to rotate, forming a vortex in the treatment liquid in the first storage tank 210. Therefore, the agitation unit 240 can agitate the treatment liquid flowing through each region R.

[0064] Furthermore, while the processing liquid is flowing through each region R, the bubble supplying unit 250 provided in each region R supplies bubbles toward the vortex formed by the rotary fins 241. As a result, the bubbles caught in the vortex rise in a spiral. This allows the bubbles to flow through the processing liquid for a relatively long time, further increasing the gas-liquid interface.

[0065] Here, the gas supply unit 243 supplies the first gas toward the rotary fin 241 from a direction perpendicular to the direction in which the pivot pin 242 extends. This prevents the supplied first gas from colliding with the vortex formed by the rotary fin 241 and rising toward the liquid surface. Therefore, the rotary fin 241 can be rotated without impeding the formation of the vortex caused by the rotation of the rotary fin 241.

[0066] Furthermore, a portion of the first gas supplied to the rotary fin 241 by the gas supply unit 243 passes through the through-holes 241d provided in the blade members 241b and moves in a direction (buoyancy direction) in which buoyancy acts on the treatment liquid stored in the first storage tank 210. The first gas that passes through the through-holes 241d and moves in the buoyancy direction collides with the protrusions 242a of the pivot pin 242. As a result, a force acts on the rotary fin 241 in the direction opposite to the buoyancy direction, and therefore, generation of particles due to contact between the rotary fin 241 and the protrusions 242a of the pivot pin 242 can be prevented.

[0067] The processing liquid sent to the second storage tank 310 is supplied to the processing liquid supply nozzle 120 of the substrate processing apparatus 100 via the supply pipe 600 by the third pump 610. At this time, the control device 800 controls the supply valve 640 to be in an open state and controls the branch valve 710 to be in a closed state. As a result, the processing liquid adjusted to a predetermined concentration is supplied to the substrate W.

[0068] The processing liquid flowing through the supply pipe 600 is heated by the fifth heater 621 to a predetermined temperature. Therefore, the processing liquid at the predetermined temperature can be supplied to the substrate W held by the rotation drive unit 110. The temperature of the processing liquid heated by the fifth heater 621 is measured by the second thermometer 630 while flowing through the supply pipe 600. The control device 800 controls the third heating unit 620 in accordance with the temperature of the processing liquid measured by the second thermometer 630. For example, if the measured temperature of the processing liquid is lower than the predetermined temperature, the control device 800 increases the heating output of the fifth heater 621 of the third heating unit 620 so that the temperature of the processing liquid reaches the predetermined temperature.

[0069] Furthermore, the control device 800 can control the supply valve 640 provided in the supply pipe 600 to close it, and the branch valve 710 provided in the branch pipe 700 to open it. This allows the processing liquid in the second storage tank 310 to circulate through the supply pipe 600 and the branch pipe 700. The processing liquid flowing through the supply pipe 600 is heated to a predetermined temperature by the fifth heater 621. Therefore, even if the processing liquid cannot be supplied to the substrate W because the processing in the substrate processing apparatus 100 is delayed, the processing liquid in the second storage tank 310 of the processing liquid storage device 300 can be maintained at a predetermined temperature.

[0070] (effect) The processing liquid adjusting apparatus 200 of this embodiment includes a first storage tank 210 that stores the processing liquid, an agitation unit 240 that agitates the processing liquid in the first storage tank 210, and a bubble supply unit 250 that supplies bubbles to the processing liquid in the first storage tank 210. The agitation unit 240 has a rotary fin 241 that is rotatably provided to form a vortex in the processing liquid in the first storage tank 210, and a gas supply unit 243 that rotates the rotary fin 241. The bubble supply unit 250 supplies bubbles toward the vortex formed by the rotary fin 241. The first storage tank 210 is an example of a storage tank. The gas supply unit 243 is an example of a rotation mechanism.

[0071] As described above, according to the processing liquid adjusting apparatus 200 of this embodiment, the gas supply unit 243 rotates the rotary fins 241, thereby forming a vortex in the processing liquid in the first storage tank 210. This allows the agitation unit 240 to agitate the processing liquid flowing in the first storage tank 210. The bubble supply unit 250 supplies bubbles toward the vortex formed by the rotary fins 241, so that the bubbles caught in the vortex rise in a spiral. This allows the bubbles to flow in the processing liquid for a relatively long time, further increasing the gas-liquid interface. This allows the water contained in the processing liquid to evaporate efficiently.

[0072] The processing liquid adjusting apparatus 200 of this embodiment includes a first heating unit 260 and a second heating unit 272 that heat the processing liquid in the first storage tank 210. The first heating unit 260 and the second heating unit 272 are examples of heating units. Here, heating the processing liquid in the first storage tank 210 also includes heating the processing liquid flowing through a circulation pipe 270 that circulates the processing liquid in the first storage tank 210. This can promote evaporation of water contained in the processing liquid.

[0073] The gas supply unit 243 of this embodiment rotates the rotary fins 241 by supplying a first gas toward the rotary fins 241. This reduces the amount of power consumed by the processing liquid adjusting apparatus 200 compared to, for example, a case in which a motor driven by electricity is provided and the rotary fins 241 are rotated by the motor. Furthermore, since the first gas is supplied to the processing liquid in the first storage tank 210, a gas-liquid interface between the first gas and the processing liquid can be generated. This allows the moisture contained in the processing liquid to evaporate efficiently.

[0074] The bubble supply unit 250 of this embodiment is provided below the first storage tank 210. Specifically, the bubble supply unit 250 is provided in the recess 210a in the bottom surface of the first storage tank 210. This ensures a long time for the supplied bubbles to reach the liquid surface of the treatment liquid in the first storage tank 210, and allows the water contained in the treatment liquid to evaporate efficiently.

[0075] The agitator 240 of this embodiment includes a shaft pin 242 that is a rotation axis of the rotary fin 241 and has a protrusion 242a on the side where the vortex is formed. The rotary fin 241 includes a plurality of blade members 241b. The blade members 241b are provided with through-holes 241d that penetrate in the direction of the rotation axis of the rotary fin 241, and the protrusions 242a are provided to cover the through-holes 241d in a plan view. As a result, a portion of the first gas supplied to the rotary fin 241 by the gas supply unit 243 passes through the through-holes 241d provided in the blade members 241b and moves in the buoyancy direction. The first gas that moves in the buoyancy direction collides with the protrusions 242a of the shaft pin 242. As a result, a force acts on the rotary fin 241 in the direction opposite to the buoyancy direction, preventing the generation of particles due to contact between the rotary fin 241 and the protrusions 242a of the shaft pin 242.

[0076] The gas supply unit 243 of this embodiment supplies a first gas toward the rotary fin 241 from a direction perpendicular to the direction in which the rotation axis (shaft pin 242) of the rotary fin 241 extends. This allows the first gas supplied from the gas supply unit 243 to rotate the rotary fin 241 without inhibiting the formation of a vortex flow in the rotary fin 241.

[0077] The processing liquid adjusting apparatus 200 of this embodiment includes a partition plate 220 that divides the first storage tank 210 into a plurality of regions R and an opening 230 that connects adjacent regions R. An agitator 240 and a bubble supplying unit 250 are provided in each of the plurality of regions R. This allows the processing liquid flowing through each region R separated by the partition plate 220 to be agitated with minimal unevenness in each region R, and bubbles to be supplied toward the vortex formed in each region R. This allows a greater amount of water contained in the processing liquid in the first storage tank 210 to evaporate. Furthermore, since the regions R are connected by the opening 230, the concentration of the processing liquid after evaporation of the water contained in the processing liquid can be made uniform within the first storage tank 210.

[0078] In this embodiment, a plurality of partition plates 220 are provided, and a plurality of openings 230 are provided corresponding to the plurality of partition plates 220, and the plurality of openings 230 are spaced apart in the extension direction of the partition plates 220. Specifically, the first opening 231 is formed in the first partition plate 221, and the second opening 232 is formed in the second partition plate 222. Furthermore, when the first opening 231 is formed on the first side surface 211 side of the first partition plate 221, the second opening 232 is formed on the third side surface 213 side of the second partition plate 222. This prevents the processing liquid that has flowed into the second region R2 through the first opening 231 from immediately flowing into the third region R3 through the second opening 232. Therefore, the processing liquid in the first storage tank 210 can be stirred for a longer period of time and bubbles can be supplied, so that a larger amount of water contained in the processing liquid can be evaporated.

[0079] The processing liquid adjusting apparatus 200 of this embodiment includes a first heating unit 260 that heats the processing liquid in the first storage tank 210. The first heating unit 260 includes a first heater 261 provided in the first region R1, a second heater 262 provided in the second region R2, and a third heater 263 provided in the third region R3. The first heater 261, the second heater 262, and the third heater 263 are provided to extend in the direction in which the partition plate 220 extends. The first heater 261, the second heater 262, and the third heater 263 are examples of a plurality of heaters. This allows the processing liquid flowing through each region R to be heated in the flow direction. This allows the flowing processing liquid to be efficiently heated, further promoting evaporation of water contained in the processing liquid.

[0080] The stirring unit 240 of this embodiment is provided near the opening 230. Specifically, the stirring unit 240 is provided on the bottom surface of each region R of the first storage tank 210 so that at least a portion of the stirring unit 240 is located on a straight line on which the first opening 231 or the second opening 232 exists in a direction (X direction) parallel to the first side surface 211 in a plan view. Since the treatment liquid inevitably passes through the vicinity of the opening 230, the treatment liquid in the first storage tank 210 can be stirred evenly. Therefore, the water contained in the treatment liquid in the first storage tank 210 can be efficiently evaporated.

[0081] The rotary fin 241 of this embodiment has a plurality of blade members 241b, and each blade member 241b is provided with a block body 241c on the side where a vortex is formed, thereby making it easier to generate a vortex.

[0082] In this embodiment, a plurality of agitation units 240 are provided, and a plurality of bubble supply units 250 are provided corresponding to the agitation units 240. This allows the treatment liquid in the first storage tank 210 to be agitated more effectively, and the gas-liquid interface to be increased, thereby allowing the water contained in the treatment liquid to evaporate efficiently.

[0083] The bubble supply unit 250 of this embodiment has a bubble supply nozzle 252 for supplying bubbles toward the vortex, and multiple bubble supply nozzles 252 are provided. This allows the bubble supply unit 250 to supply a large amount of bubbles to one vortex, thereby efficiently evaporating the water contained in the treatment liquid. Furthermore, multiple bubble supply nozzles 252 of this embodiment are provided radially outward of the rotary fin 241 and along the circumferential direction of the rotary fin 241. This allows bubbles to be supplied evenly to the vortex formed by the rotary fin 241, thereby increasing the number of bubbles captured by the vortex. This allows a larger number of bubbles to flow through the treatment liquid for a relatively long period of time, thereby further increasing the gas-liquid interface.

[0084] The processing liquid adjusting apparatus 200 of this embodiment includes a concentration meter 274 that measures the concentration of the processing liquid in the first storage tank 210, and a control device 800 that controls at least one of the bubble supplying unit 250, the first heating unit 260, and the second heating unit 272 in accordance with the concentration of the processing liquid measured by the concentration meter 274. Here, measuring the concentration of the processing liquid in the first storage tank 210 also includes measuring the concentration of the processing liquid flowing through the circulation pipe 270 that circulates the processing liquid in the first storage tank 210. If the measured concentration of the processing liquid is lower than a predetermined concentration, the control device 800 controls the bubble supplying unit 250, the first heating unit 260, and the second heating unit 272 so that the concentration of the processing liquid becomes the predetermined concentration. This allows the processing liquid in the first storage tank 210 to be accurately adjusted to the predetermined concentration.

[0085] The processing liquid adjusting apparatus 200 of this embodiment includes a concentration meter 274 that measures the concentration of the processing liquid in the first storage tank 210, a diluent supply unit 280 that supplies a diluent to the processing liquid in the first storage tank 210, and a control device 800 that controls the diluent supply unit 280 in accordance with the concentration of the processing liquid measured by the concentration meter 274. When the measured concentration of the processing liquid is higher than a predetermined concentration, the control device 800 controls the diluent supply unit 280 so that the concentration of the processing liquid becomes the predetermined concentration. As a result, even when the measured concentration of the processing liquid is higher than the predetermined concentration, the concentration of the processing liquid can be adjusted to the predetermined concentration.

[0086] The substrate processing system 1 of this embodiment includes the above-mentioned processing liquid adjusting apparatus 200, a substrate processing apparatus 100 that processes substrates W with a processing liquid, a recovery pipe 400 for sending the processing liquid recovered in the substrate processing apparatus 100 to the processing liquid adjusting apparatus 200, and a supply pipe 600 for supplying the processing liquid treated in the processing liquid adjusting apparatus 200 to the substrate processing apparatus 100. As a result, the processing liquid adjusted to a predetermined concentration in the processing liquid adjusting apparatus 200 can be supplied to the substrates W held by the rotation drive unit 110 of the substrate processing apparatus 100, so that the substrates W can be processed at a desired etching rate.

[0087] [Second embodiment] Next, a processing liquid adjusting apparatus 1200 of a substrate processing system according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 9. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and detailed description thereof will be omitted. As shown in FIG. 7, the processing liquid adjusting apparatus 1200 of the second embodiment has a first storage tank 1210, an agitation unit 1240, and a bubble supply unit 1250 that are different from the first storage tank 210, the agitation unit 240, and the bubble supply unit 250 of the first embodiment.

[0088] (Processing liquid adjusting device) As shown in Fig. 8, the first storage tank 1210 of the second embodiment has a first side surface 1211, a second side surface 1212 perpendicular to the first side surface 1211, a third side surface 1213 opposite the first side surface 1211, a fourth side surface 1214 opposite the second side surface 1212, a bottom surface surrounded by the first to fourth side surfaces 1211 to 1214, and an upper surface (not shown) opposite the bottom surface. Note that the first side surface 1211, the second side surface 1212, and the upper surface of the first storage tank 1210 are omitted in Fig. 7. The upper surface of the first storage tank 1210 is omitted in Fig. 8. A plurality of recesses 1210a, each larger in diameter than a rotary fin 1241 (described later), are provided on a first side surface 1211 and a third side surface 1213 of the first storage tank 1210 in correspondence with the agitator 1240.

[0089] A plurality of stirring sections 1240 of the second embodiment are provided in each of the plurality of regions R so as to face each other, and in the present embodiment, four stirring sections 1240 are provided in each region R. In the present embodiment, the stirring sections 1240 are provided in the recesses 1210a of the first side surface 1211 and the recesses 1210a of the third side surface 1213 facing the first side surface 1211 in each region R. Therefore, the stirring sections 1240 are provided so as to face each other in each region R. Two stirring sections 1240 are provided in each region R along the vertical direction on each of the first side surface 1211 and the third side surface 1213.

[0090] 7, the agitation unit 1240 provided on the first side surface 1211 and the agitation unit 1240 provided on the third side surface 1213 are provided at different positions in a direction perpendicular to the surface of the partition plate 220 (X direction) so that the treatment liquid in the region R circulates. That is, in each region R, the agitation unit 1240 provided on the first side surface 1211 and the agitation unit 1240 provided on the third side surface 1213 are not provided on the same line extending in the Y direction. For example, as shown in FIG. 8, when the agitation unit 1240 provided on the first side surface 1211 is provided closer to the fourth side surface 1214 in each region R, the agitation unit 1240 provided on the third side surface 1213 is provided closer to the second side surface 1212 in each region R. Furthermore, it is preferable that the stirring unit 1240 provided on the first side surface 1211 and the stirring unit 1240 provided on the third side surface 1213 are provided so as to be at the same vertical position (height position). The stirring unit 1240 has a rotating fin 1241, a shaft pin 1242, and a gas supply unit 1243.

[0091] The rotary fins 1241 form vortices whose diameters increase along the direction in which the partition plate 220 extends (Y direction). As shown in Fig. 9, the rotary fins 1241 are made up of a cylindrical body (not shown) and blade members 1241b. Blade members 1241b are provided with block bodies 1241c. Note that Fig. 9 shows a cross section of the first storage tank 1210.

[0092] One end of the pivot pin 1242 is fixed to a recess 1210a in the first side surface 1211 or the third side surface 1213 of the partition plate 220 of the first storage tank 1210. That is, the pivot pin 1242 is provided extending in the direction (Y direction) in which the partition plate 220 extends. The other end of the pivot pin 1242 has a protrusion 1242a.

[0093] The gas supply unit 1243 supplies a first gas toward the rotary fin 1241 from a direction perpendicular to the direction in which the pivot pin 1242 extends. In this embodiment, the gas supply unit 1243 supplies the first gas vertically upward to the rotary fin 1241. The gas supply unit 1243 has a gas supply source 1243a, a gas supply nozzle 1243b, a gas supply pipe 1243c, and a gas supply valve 1243d.

[0094] As shown in FIG. 8, the bubble supply unit 1250 of the second embodiment is provided in each of the multiple regions R, extending in the direction in which the partition plate 220 extends (Y direction). The bubble supply unit 1250 is provided below the first storage tank 1210, and in this embodiment, as shown in FIG. 7, is provided on the bottom surface of the first storage tank 1210. As shown in FIG. 8, the bubble supply unit 1250 is provided on the bottom surface of the first storage tank 1210 so as to be located on a straight line on which the stirring unit 1240 exists in the direction in which the partition plate 220 extends (Y direction). A plurality of bubble supply units 1250 are provided in each region R. In this embodiment, two bubble supply units 1250 are provided in each region R, sandwiching each of the first heater 261, second heater 262, and third heater 263 provided in each region R. The bubble supply unit 1250 has a plurality of bubble supply nozzles 1252 arranged along the direction in which the partition plate 220 extends (Y direction).

[0095] (operation) The operation of the treatment liquid adjusting apparatus 1200 according to this embodiment of the present invention will be described below.

[0096] The processing liquid sent to the first region R1 from the recovery port 400a formed on the third side surface 1213 side of the upper surface of the first storage tank 1210 in the first region R1 flows within the first region R1 while being heated by the first heater 261. Here, the agitation unit 1240 provided on the first side surface 1211 and the agitation unit 1240 provided on the third side surface 1213 are provided at different positions in the direction (X direction) perpendicular to the surface of the partition plate 220. As a result, the processing liquid within the first region R1 flows clockwise within the first region R1 as indicated by arrow B.

[0097] A portion of the processing liquid flowing in the first region R1 flows into the second region R2 through the first opening 231. Further, a portion of the processing liquid flowing in the first region R1 flows toward the first circulation port 270a. The portion of the processing liquid that has flowed into the first circulation port 270a is sent by the first pump 271 to the second region R2 through the circulation pipe 270 and the second circulation port 270b.

[0098] The processing liquid that flows into the second region R2 from the first opening 231 formed on the first side surface 1211 side of the first partition plate 221 flows within the second region R2 while being heated by the second heater 262. The processing liquid that flows into the second region R2 from the second circulation port 270b formed on the upper surface of the first storage tank 1210 in the second region R2 flows within the second region R2 while being heated by the second heater 262. The agitation unit 1240 provided on the first side surface 1211 and the agitation unit 1240 provided on the third side surface 1213 are provided at different positions in the direction (X direction) perpendicular to the surface of the partition plate 220. As a result, the processing liquid in the second region R2 flows clockwise within the second region R2 as indicated by arrow C. A portion of the processing liquid flowing in the second region R2 flows through the second opening 232 into the third region R3.

[0099] The processing liquid flowing into the third region R3 from the second opening 232 formed on the third side surface 1213 side of the second partition plate 222 flows within the third region R3 while being heated by the third heater 263. Here, the agitation unit 1240 provided on the first side surface 1211 and the agitation unit 1240 provided on the third side surface 1213 are provided at different positions in a direction (X direction) perpendicular to the surface of the partition plate 220. As a result, the processing liquid within the third region R3 flows clockwise within the third region R3 as indicated by arrow D. A portion of the processing liquid flowing within the third region R3 is sent by the second pump 510 from the liquid sending port 500a through the liquid sending pipe 500 to the second storage tank 310 of the processing liquid storage device 300.

[0100] (effect) According to the processing liquid adjusting apparatus 1200 of the second embodiment, it is possible to obtain the same effects as those of the first embodiment. Moreover, according to the substrate processing system of the second embodiment, it is possible to obtain the same effects as those of the first embodiment.

[0101] Furthermore, the agitators 1240 of this embodiment are provided on the first side surface 1211 and the third side surface 1213 of each of the multiple regions R so as to face each other, and the rotation axes of the rotary fins 1241 are provided so as to extend in the extension direction of the partition plate 220. The agitators 1240 provided so as to face the first side surface 1211 and the third side surface 1213 are provided at different positions in a direction perpendicular to the surface of the partition plate 220 so as to circulate the treatment liquid in the region R. As a result, the treatment liquid in each region R flows in one direction (clockwise in this embodiment). A portion of the treatment liquid flowing in one direction in each region R flows to the adjacent region R, the first circulation port 270a, or the liquid supply port 500a. Therefore, the treatment liquid in the first storage tank 210 can be agitated for a longer period of time and bubbles can be supplied, allowing more water contained in the treatment liquid to evaporate.

[0102] The gas supply unit 1243 of this embodiment supplies the first gas vertically upward, so that the first gas is supplied in the same direction as the buoyancy direction, and the supply of the first gas is not hindered by buoyancy, allowing the rotary fins 1241 to rotate efficiently.

[0103] [Variations] Hereinafter, modifications of the substrate processing system 1 according to the embodiment of the present invention will be described.

[0104] The substrate processing apparatus 100 may be a batch-type wet etching apparatus that processes the substrate W by immersing the substrate W in a processing liquid in a processing tank. Furthermore, the substrate processing apparatus 100 does not have to be a wet etching apparatus that processes the substrate W with a processing liquid such as a phosphoric acid solution. For example, the substrate processing apparatus 100 may be a resist stripping apparatus that supplies a mixed liquid containing sulfuric acid and hydrogen peroxide solution to the substrate W as the processing liquid and strips the resist formed on the substrate W. The processing liquid adjusting apparatus 200 adjusts the concentration of the processing liquid to a predetermined concentration by evaporating the water contained in the processing liquid. The water contained in the processing liquid refers to, for example, hydrogen peroxide solution or water generated by decomposition of hydrogen peroxide solution. The concentration of the processing liquid refers to the concentration of sulfuric acid contained in the mixed liquid. The processing liquid adjusting apparatus 200 adjusts the concentration of the processing liquid to a predetermined concentration by supplying a diluent to the processing liquid. The diluent is a liquid for reducing the concentration of sulfuric acid contained in the mixed liquid, and hydrogen peroxide solution or pure water is used.

[0105] In this embodiment, two partition plates 220 are provided, but the number is not limited to this. For example, the number of partition plates 220 may be one, or three or more. In this case, the number of openings 230 provided corresponds to the number of partition plates 220 provided.

[0106] The opening 230 does not have to be a hole provided in the partition plate 220. For example, the length of the first partition plate 221 in the extending direction (Y direction) is shorter than the length of the second side surface 212 of the first storage tank 210 in a plan view, and one end surface of the first partition plate 221 is provided so as to contact the third side surface 213 of the first storage tank 210. The space formed in this way between the first side surface 211 of the first storage tank 210 and the other end surface of the first partition plate 221 may be the first opening 231.

[0107] The agitator 240 rotates the rotary fins 241 by the first gas supplied by the gas supplier 243, but is not limited to this. For example, the agitator 240 may have a motor that is driven by passing electricity instead of the gas supplier 243, and the rotary fins 241 may be rotated by driving the motor.

[0108] Although four blade members 241b are provided, the number is not limited to four as long as a vortex can be formed in the treatment liquid in the first storage tank 210.

[0109] The shape of block body 241c is not limited to a triangular prism as long as it can easily generate a vortex flow. For example, block body 241c may be a quadrangular prism in which the area of ​​the lower surface that contacts blade member 241b is larger than the area of ​​the upper surface.

[0110] The shape of the protrusion 242a of the pivot pin 242 is not limited to one that can cover the entire through-hole 241d in a plan view, as long as it can apply a force in the direction opposite to the buoyancy direction to the rotary fin 241. For example, the protrusion 242a may have a shape that can cover part of the through-hole 241d in a plan view.

[0111] The gas supply unit 243 may supply the first gas vertically upward. In this case, the supply port of the gas supply nozzle 243b of the gas supply unit 243 is provided so as to overlap with the rotary fin 241 in a plan view. Furthermore, the blade members 241b of the rotary fin 241 have curved surfaces that can receive gas supplied from the direction in which the rotation axis of the rotary fin 241 extends (the vertical direction). As a result, as in the second embodiment, the first gas is supplied by the gas supply unit 1243 in the same direction as the buoyancy direction, and the supply of the first gas is not hindered by buoyancy, and the rotary fin 1241 can be rotated efficiently.

[0112] A plurality of gas supply nozzles 243b may be provided, which can promote the rotation of the rotary fins 241.

[0113] The second gas may be the same as the first gas. For example, nitrogen gas may be used as the second gas. In this case, the gas supply source 243a or the bubble supply source 251 may be omitted and a common supply source may be used. This simplifies the configuration and saves space.

[0114] The first thermometer 273 and the concentration meter 274 may be installed at any location as long as they can measure the temperature and concentration of the treatment liquid in the first storage tank 210. For example, the first thermometer 273 and the concentration meter 274 may be installed in the first storage tank 210 to measure the temperature and concentration of the treatment liquid.

[0115] When the same liquid is used as the cleaning liquid used in the substrate processing apparatus 100 and the diluent supplied by the diluent supply unit 280, the cleaning liquid supply source or the diluent supply source may be omitted, thereby simplifying the configuration and saving space.

[0116] Furthermore, the diluent is not limited to pure water. For example, when the processing liquid is a phosphoric acid solution, the diluent may be a phosphoric acid solution in which the concentration of phosphoric acid is lower than a predetermined concentration.

[0117] The processing liquid storage device 300 may have a configuration similar to that of the processing liquid adjustment device 200. For example, the processing liquid storage device 300 may include a partition plate 220, an opening 230, an agitation unit 240, a bubble supply unit 250, a first heating unit 260, a circulation line 270, and a diluent supply unit 280 in addition to the second storage tank 310 and the new liquid supply line 320. The processing liquid storage device 300 having such a configuration may adjust the concentration of the processing liquid to a predetermined concentration by evaporating water contained in the processing liquid. Alternatively, the concentration of the processing liquid may be adjusted to a predetermined concentration by supplying a diluent to the processing liquid.

[0118] The processing liquid storage device 300 may be omitted. Accordingly, the liquid delivery pipe 500 can be omitted. In this case, the other end of the supply pipe 600 is connected to a liquid delivery port 500a formed on the bottom surface of the first storage tank 210 in the third region R3 of the processing liquid adjustment device 200, thereby supplying the processing liquid processed in the processing liquid adjustment device 200 to the substrate processing apparatus 100. Furthermore, the other end of the branch pipe 700 is connected to the upper surface of the first storage tank 210 of the processing liquid adjustment device 200, thereby delivering the processing liquid flowing through the supply pipe 600 to the processing liquid adjustment device 200.

[0119] In the second embodiment, the number of agitation units 1240 provided along the vertical direction on each of the first side surface 1211 and the third side surface 1213 in each region R is not limited to two. For example, as long as the processing liquid in the region R can be circulated, one agitation unit 1240 may be provided on each of the first side surface 1211 and the third side surface 1213 of the first storage tank 1210 in each region R, or three agitation units 1240 may be provided along the vertical direction.

[0120] In the gas supply unit 1243 of the second embodiment, the gas supply nozzle 1243b and the gas supply pipe 1243c corresponding to one of the multiple agitators 1240 provided along the vertical direction on each of the first side surface 1211 and the third side surface 1213 may be omitted. For example, as shown in FIG. 10, the gas supply unit 1243 may further include a communication pipe 1243e that communicates two recesses 1210a provided along the vertical direction. Note that in FIG. 10, the first storage tank 1210 portion is shown as a cross section, as in FIG. 9. The communication pipe 1243e is provided to extend in the vertical direction. The gas supply unit 1243 supplies the first gas vertically upward to the rotating fins 1241 of the lower agitator 1240 of the two agitators 1240 provided along the vertical direction. The supplied first gas rotates the rotary fins 1241 provided on the lower side, and then passes through the communication pipe 1243e. The first gas that has passed through the communication pipe 1243e rotates the rotary fins 1241 provided on the upper side. This makes it possible to omit the gas supply nozzle 1243b and the gas supply pipe 1243c for the upper rotary fins 1241, thereby simplifying the configuration and saving space.

[0121] [Other embodiments] The embodiment of the present invention and the modified examples of each part have been described above. The above is presented by way of example only and is not intended to limit the scope of the invention. These novel embodiments may be embodied in various other forms and are intended to be illustrative and not restrictive. Various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. The accompanying claims are intended to cover such forms and modifications as would fall within the scope and spirit of the inventions. [Explanation of symbols]

[0122] 1. Substrate Processing System 100 Substrate processing apparatus 110 Rotation drive unit 120 Processing liquid supply nozzle 130 Cleaning liquid supply nozzle 131 Cleaning liquid supply pipe 140 Collection Department 200 Processing liquid adjustment device 210 First Reservoir 210a recess 211 First Aspect 212 Second Aspect 213 The Third Aspect 214 The Fourth Aspect 220 Partition 221 First Partition 222 Second Partition 230 Opening 231 First Opening 232 Second Opening 240 Mixing section 241 Rotating Fin 241a Cylindrical body 241b Blade member 241c block letter 241d Through hole 242 Axle pin 242a Protrusion 243 Gas supply section 243a Gas supply source 243b Gas supply nozzle 243c Gas supply pipe 243d Gas supply valve 250 Bubble supply section 251 Bubble Source 252 Bubble supply nozzle 253 Bubble supply pipe 254 Air bubble supply valve 260 First heating section 261 First Heater 262 Second Heater 263 Third Heater 270 Circulation piping 270a First circulation port 270b Second circulation port 271 First Pump 272 Second heating section 272a Fourth Heater 273 First Thermometer 274 Densitometer 280 Diluent supply unit 281 Diluent Source 282 Dilution liquid supply pipe 282a Diluent supply port 283 Diluent supply valve 300 Processing liquid storage device 310 Second Reservoir 320 New liquid supply piping 400 Recovery piping 400a Collection port 410 Recovery valve 420 Discharge piping 430 Exhaust valve 500 Liquid delivery piping 500a liquid inlet 510 Second Pump 600 Supply piping 610 Third Pump 620 Third heating section 621 Fifth Heater 630 Second Thermometer 640 Supply Valve 700 Branch piping 710 Branch Valve 800 Control Device 1200 Processing liquid adjustment device 1210 First Reservoir 1210a Recess 1211 First Aspect 1212 Second Aspect 1213 The Third Aspect 1214 The Fourth Aspect 1240 Mixing section 1241 Rotating Fin 1241b Blade member 1241c block letter 1242 Axle pin 1242a Protrusion 1243 Gas supply unit 1243a Gas supply source 1243b Gas supply nozzle 1243c Gas supply pipe 1243d Gas Supply Valve 1243e Communication pipe 1250 Bubble supply unit 1252 Air bubble supply nozzle W substrate R region R1 First Region R2 Second Region R3 The third region

Claims

1. a storage tank for storing a processing liquid; an agitation unit that agitates the treatment liquid in the storage tank; a bubble supply unit that supplies bubbles to the treatment liquid in the storage tank; Equipped with The stirring unit is a rotating fin rotatably provided to form a vortex in the treatment liquid in the storage tank; a rotation mechanism that rotates the rotary fin; and The bubble supplying unit supplies bubbles toward the vortex formed by the rotary fin.

2. The processing liquid adjusting apparatus according to claim 1 , further comprising a heating unit for heating the processing liquid in the storage tank.

3. 2. The processing liquid adjusting apparatus according to claim 1, wherein the rotation mechanism is a gas supply unit that supplies gas toward the rotary fin.

4. The processing liquid adjusting apparatus according to claim 1 , wherein the bubble supplying unit is provided below the storage tank.

5. the stirring unit is a rotation shaft of the rotary fin, and has a shaft pin having a protrusion on the side where the vortex flow is formed, The rotary fin has a plurality of blade members, The blade member is provided with a through hole that penetrates in a direction in which the rotation axis of the rotary fin extends, The treatment liquid adjusting apparatus according to claim 3 , wherein the protrusion is provided so as to cover the through-hole in a plan view.

6. 4. The treatment liquid adjusting apparatus according to claim 3, wherein the gas supply unit supplies the gas toward the rotary fins in a direction perpendicular to a direction in which the rotation axis of the rotary fins extends.

7. a partition plate provided to divide the inside of the storage tank into a plurality of regions; an opening that connects adjacent regions; Equipped with 2. The processing liquid adjusting apparatus according to claim 1, wherein the agitating unit and the bubble supplying unit are provided in each of the plurality of regions.

8. The partition plate is provided in plurality, The openings are provided in plurality to correspond to the partition plates, 8. The processing liquid adjusting apparatus according to claim 7, wherein the plurality of openings are spaced apart in the extending direction of the partition plate.

9. a heating unit that heats the treatment liquid in the storage tank, the heating unit has a plurality of heaters provided in the plurality of regions, 8. The processing liquid adjusting apparatus according to claim 7, wherein the plurality of heaters are provided extending in the extending direction of the partition plate.

10. The treatment liquid adjusting apparatus according to claim 7 , wherein the agitating unit is provided near the opening.

11. The rotary fin has a plurality of blade members, 2. The treatment liquid adjusting apparatus according to claim 1, wherein the blade member is provided with a block body on the side where the vortex flow is formed.

12. The stirring unit is provided in plurality, 2. The processing liquid adjusting apparatus according to claim 1, wherein a plurality of the bubble supplying units are provided corresponding to the agitating units.

13. the air bubble supply unit has an air bubble supply nozzle for supplying air bubbles toward the vortex flow, 2. The processing liquid adjusting apparatus according to claim 1, wherein a plurality of the bubble supply nozzles are provided.

14. a concentration meter for measuring the concentration of the treatment liquid in the storage tank; a control device that controls the bubble supply unit in accordance with the concentration of the treatment liquid measured by the concentration meter; The treatment liquid adjusting apparatus according to claim 1 , further comprising:

15. a concentration meter for measuring the concentration of the treatment liquid in the storage tank; a control device that controls at least one of the bubble supply unit and the heating unit in accordance with the concentration of the treatment liquid measured by the concentration meter; The treatment liquid adjusting apparatus according to claim 2 , further comprising:

16. a concentration meter for measuring the concentration of the treatment liquid in the storage tank; a diluent supply unit that supplies a diluent to the treatment liquid in the storage tank; a control device that controls the dilution liquid supply unit in accordance with the concentration of the treatment liquid measured by the concentration meter; The treatment liquid adjusting apparatus according to claim 1 , further comprising:

17. The stirring units are provided in plurality so as to face each other in each of the plurality of regions, The rotation axis of the rotary fin extends in the extension direction of the partition plate, 8. The processing liquid adjusting device according to claim 7, wherein the opposing agitating sections are provided at different positions in a direction perpendicular to the surface of the partition plate so that the processing liquid within the region circulates.

18. The processing liquid adjusting apparatus according to claim 3 , wherein the gas supply unit supplies the gas vertically upward.

19. a treatment liquid adjusting apparatus according to any one of claims 1 to 18; a substrate processing apparatus for processing a substrate with the processing liquid; a recovery pipe for delivering the processing liquid recovered in the substrate processing apparatus to the processing liquid adjusting apparatus; a supply pipe for supplying the processing liquid processed in the processing liquid adjusting device to the substrate processing apparatus; A substrate processing system comprising:

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