Manufacturing method of connection body and connection body

Abstract

To provide a manufacturing method of a connection body that can suppress the deformation of a connector having a narrow pitch terminal row and obtain excellent insulation and conductivity and a connection body.SOLUTION: The method includes the steps of fixing a connector 30, having a first terminal row 11 and a second terminal row 31 inside the bonding surface with the substrate 10, wherein the minimum distance between terminals in the second terminal row 31 is 0.8 mm or less via a thermosetting connection material 20 containing solder particles 21 on the first terminal row 11 of the substrate 10 and joining the first terminal row 11 and the second terminal row 31 without load using a reflow oven set above the melting point of the solder particles 21.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present technology relates to a connection body for mounting a connector, and a manufacturing method thereof. [Background technology]

[0002] Conventionally, connectors have been mounted by applying solder paste to the board or by applying solder (BGA) to the conductor portion of the connector and then soldering the board and connector together by reflow soldering (see, for example, Patent Document 1). In recent years, with the demand for miniaturization of electronic devices, connector pitches of 0.8 mm or less, and even 0.3 mm or less, are desired.

[0003] However, in conventional connector mounting, resist is used for the terminal rows on the board side, making it difficult to further narrow the connector pitch. One technology for connecting terminal rows with narrow pitches is anisotropic connection, but because connectors are generally made of molded resin, if anisotropic connection is used, the connector may be deformed by the pressure of the tool during main crimping, raising concerns that, for example, a cable may not be able to be inserted. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-284199 Summary of the Invention [Problem to be solved by the invention]

[0005] The present technology has been proposed in consideration of the current situation, and provides a method for manufacturing a connector and a connector that can suppress deformation of a connector having a narrow-pitch terminal row and achieve excellent insulation and conductivity. [Means for solving the problem]

[0006] The method for manufacturing a connector according to the present technology includes the steps of: fixing a connector having a second terminal row with a minimum inter-terminal distance of 0.8 mm or less on the inside of a joining surface with a first terminal row of a substrate via a thermosetting connecting material containing solder particles; and joining the first terminal row and the second terminal row without load using a reflow furnace set at a temperature equal to or higher than the melting point of the solder particles.

[0007] The connection body according to the present technology includes a substrate having a first terminal row, a connector having a second terminal row on the inside of the joint surface with the substrate, the second terminal row having a minimum inter-terminal distance of 0.8 mm or less, and an adhesive layer that joins the first terminal row and the second terminal row with solder particles and adheres the substrate and the connector. [Effects of the Invention]

[0008] This technology can suppress deformation of connectors with narrow-pitch terminal rows, and provide excellent insulation and conductivity. As a secondary effect, it can also reduce the space, weight, and cost of connecting bodies that include connectors. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view schematically showing an example of a substrate. [Figure 2] FIG. 2 is a cross-sectional view that schematically shows a state in which a thermosetting connecting material is provided on a terminal of a substrate. [Figure 3] FIG. 3 is a cross-sectional view schematically illustrating alignment between a first terminal row of the substrate and a second terminal row of the connector. [Figure 4] FIG. 4 is a cross-sectional view that schematically shows a state in which pressure is applied from the connector side by a tool. [Figure 5] FIG. 5 is a cross-sectional view that schematically shows a state in which the connector is fixed to the substrate. [Figure 6] FIG. 6 is a cross-sectional view that schematically shows the state in which the substrate and the connector are heated in a reflow furnace. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a connector. [Figure 8] FIG. 8 is a cross-sectional view showing an example of a connector in the short side direction. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present technology will be described in detail in the following order with reference to the drawings. 1. Manufacturing method of connector 2.Connector 3. Thermosetting connecting materials 4. Working Example

[0011] <1. Method for manufacturing connector> The method for manufacturing a connector in this embodiment includes the steps of: fixing a connector having a second terminal row with a minimum inter-terminal distance of 0.8 mm or less on the inside of a joining surface with the substrate to a first terminal row of a substrate via a thermosetting connecting material containing solder particles; and joining the first terminal row and the second terminal row without load using a reflow furnace set at a temperature equal to or higher than the melting point of the solder particles. Here, the ratio of the average particle size of the solder particles to the minimum inter-terminal distance in the first terminal row and the second terminal row is preferably less than 0.15, and more preferably 0.1 or less.

[0012] In this specification, the term "average particle size" refers to the average major axis diameter of particles measured, for example, at N = 20 or more, preferably N = 50 or more, and more preferably N = 200 or more, in images observed using a metallurgical microscope, optical microscope, or electron microscope such as a scanning electron microscope (SEM). In the case of spherical particles, the term refers to the average diameter of the particles. The observed images may also be measured using known image analysis software (such as "WinROOF" from Mitani Corporation or "Azo-kun (registered trademark)" from Asahi Kasei Engineering Corporation) or may be measured (N = 1000 or more) using an image-based particle size analyzer (e.g., FPIA-3000 from Malvern Instruments). The average particle size determined from the observed images or an image-based particle size analyzer can be the average maximum length of the particles. When preparing a thermosetting connecting material, manufacturer values ​​such as the particle size (D50) at which the cumulative frequency in the particle size distribution determined by a laser diffraction / scattering method reaches 50% or the arithmetic mean diameter (preferably on a volume basis) can be used. A connector is an electrical connection between two materials or components. A joint is a connection between two materials or components. No load means a state in which there is no mechanical pressure.

[0013] The substrate is not particularly limited as long as it has wiring, and may be broadly defined as a so-called printed wiring board (PWB) provided with electrodes on which a connector can be mounted, and may be either a rigid substrate or a flexible substrate (FPC: Flexible Printed Circuits). Examples of substrates based on the type of base material include glass substrates, ceramic substrates, and plastic substrates.

[0014] The connector has a second terminal row with a minimum inter-terminal distance of 0.8 mm or less, and the second terminal row is formed at least on the inside of the bonding surface with the substrate, with the connector main body overlapping the first terminal row of the substrate. The minimum inter-terminal distance may be less than 0.35 mm. The first terminal row and the second terminal row (electrode array, electrode group) provided on the substrate and the connector, respectively, may be provided opposite each other, and the terminal row may be provided on the substrate so that multiple connectors can be mounted on a single substrate. In other words, the substrate may be one to which multiple connectors are bonded collectively.

[0015] Furthermore, by having a second terminal row on the inner side of the mating surface with the board, the connector can be aligned (aligned) and secured in place, allowing a sufficient vertical load to be applied, making it easier to bring the solder particles into contact with the terminals of the board and the connector, and to remove the oxide film on the surface of the solder particles.Alignment marks may be provided corresponding to the connector and the board.

[0016] It is also preferable that the surfaces of the terminals of the board and the connector are gold-plated. It is also preferable that the board and the connector have heat resistance in the reflow process.

[0017] The connector in this embodiment is connected by solder particles that are widely used in BGA (Ball Grid Array) and has high connection reliability, making it applicable to many applications such as sensor devices, in-vehicle devices, IoT (Internet of Things) devices, etc. However, the solder particles are smaller than those used in BGA.

[0018] The thermosetting connecting material may be either a film-like thermosetting connecting film or a paste-like thermosetting connecting paste. The thermosetting connecting paste may be in the form of a film when connecting, or may be in the form of a film by mounting components.

[0019] In the case of thermosetting connection paste, it is sufficient to apply a predetermined amount uniformly to the substrate. Application methods such as dispensing, stamping, and screen printing can be used, and drying can be performed as necessary. In this case, capital investment can be reduced by reusing or modifying conventional solder paste equipment. Thermosetting connection films are particularly preferable because they not only allow for uniform application of the bonding material (e.g., anisotropic conductive bonding material) depending on the film thickness, but also enable simultaneous lamination onto the substrate, shortening the takt time. Furthermore, pre-forming the film makes it easier to handle, which is expected to improve work efficiency. In this case, existing equipment can be equipped with or modified to include a film laminating device or, in some cases, a bonding device, as described below, making it possible to improve work efficiency with minimal capital investment.

[0020] Hereinafter, with reference to Figures 1 to 7, we will explain the process (A) of providing a thermosetting connecting material on the first terminal row of the substrate, the process (B) of fixing a connector on the thermosetting connecting material, and the process (C) of joining the first terminal row of the substrate and the second terminal row of the connector using a reflow furnace set at a temperature equal to or higher than the melting point of the solder particles.

[0021] [Process (A)] Fig. 1 is a cross-sectional view showing an example of a substrate, and Fig. 2 is a cross-sectional view showing a state in which a thermosetting connecting material is provided on terminals of the substrate. As shown in Figs. 1 and 2, in step (A), a thermosetting connecting material 20 containing solder particles 21 is provided on a first terminal row 11 of a substrate 10.

[0022] Step (A) may be a step of forming a thermosetting connecting paste into a film on a substrate, or a temporary attachment step of adhering a thermosetting connecting film onto a substrate at low temperature and low pressure, as is used for conventional conductive films and anisotropic conductive films, or a lamination step of laminating a thermosetting connecting film onto a substrate.

[0023] When step (A) is a temporary bonding step, the thermosetting connecting film can be applied to the substrate under known conditions, which is economically advantageous since only minimal changes are required, such as the installation or modification of tools, from the existing equipment.

[0024] When step (A) is a laminating step, for example, a pressure laminator is used to laminate the thermosetting connecting film onto the substrate. The laminating step may be a vacuum pressure laminator. When conventional conductive films or anisotropic conductive films are temporarily attached using a heat and pressure tool, the width of the film is limited by the width of the tool. However, the laminating step does not use a heat and pressure tool, so it is expected that a relatively wide width can be mounted at once. Furthermore, one thermosetting connecting film may be laminated onto one substrate. This eliminates the need to move the heat and pressure tool up and down and transport the thermosetting connecting film multiple times, thereby shortening the time required for the step of applying the thermosetting connecting material.

[0025] In step (A), the thermosetting connecting material is applied to the substrate, so the thickness of the thermosetting connecting material must be within a predetermined range. If the thermosetting connecting material is too thin, it may be easier to sandwich the solder particles between the electrodes, but it may be more difficult to form a film or to apply it to the substrate. Therefore, the lower limit of the thickness of the thermosetting connecting material is 50% or more, preferably 80% or more, and more preferably 90% or more of the average particle size of the solder particles. Furthermore, the upper limit of the thickness of the thermosetting connecting material is 300% or less, preferably 200% or less, and more preferably 150% or less of the average particle size of the solder particles. If the thermosetting connecting material is too thick, it may cause problems with bonding.

[0026] Furthermore, when considering the pressing of the connector in step (B) described below, it is preferable to make it easier to remove the thermosetting connecting material before the solder particles are sandwiched, so the upper limit of the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is preferably 1.4 or less, more preferably 1.2 or less, and even more preferably 1.0 or less. If the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is large, a high pressure is required when pressing the connector in step (B), which is not preferable because it may damage the connector.

[0027] [Process (B)] Fig. 3 is a cross-sectional view showing the alignment of the terminal row of the substrate with the terminal row of the connector, and Fig. 4 is a cross-sectional view showing the state in which the connector is pressed from the connector side with a tool. As shown in Figs. 3 and 4, in step (B), the terminal row 11 of the substrate 10 is aligned with the terminal row 31 of the connector 30, and the connector 30 is fixed onto the thermosetting connecting material 20. Since self-alignment by solder cannot be expected in this technology, it is desirable to accurately align the substrate 10 and fix it with the thermosetting connecting material 20 in step (B).

[0028] In step (B), a tool 40 is used to align the first terminal row 11 of the substrate 10 with the second terminal row 31 of the connector 30, and then the connector 30 is mounted on the thermosetting connecting material 20. The tool 40 is preferably a heated pickup tool, and is preferably equipped with a suction mechanism for suctioning the connector 30.

[0029] Furthermore, in step (B), temporary pressure bonding is preferably performed by pressing the connector 30 from the side using a tool 40. The pressure applied to the connector 30 is greater than that in step (A) and is applied to the electrode area where the first terminal row of the substrate 10 and the second terminal row of the connector 30 face each other. The upper limit of the pressure is not particularly limited as long as it does not cause deformation of the connector body or the mounted components. The lower limit of the pressure may be, for example, greater than 1.0 MPa, 2.0 MPa, 3.0 MPa, or 5.0 MPa. As shown in FIG. 4, temporary pressure bonding securely sandwiches the solder particles 21 between the electrodes of the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30, and heats the solder particles 21 to form a molten solder joint 24 or a state close to it, thereby favoring the bonding between the electrodes as the solder particles melt during the reflow process. This allows the oxide film on the surface of the solder particles to be removed. Furthermore, during pre-compression bonding, the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 may be brought into direct contact with each other, thereby relatively reducing the contribution of solder particles to the bonding during the reflow process and making it easier to achieve stable electrical continuity. By bringing the first terminal row of the substrate 10 and the second terminal row of the connector 30 into direct contact and having solder particles present in the vicinity thereof, the solder particles become unloaded and contribute to the bonding of the connector electrodes and the substrate electrodes simply by melting during the reflow process. Furthermore, since the amount of solder particles is sufficient to prevent self-alignment, fine-pitch connections can be easily achieved. This solder bonding by pre-compression bonding and reflow processes is an example of the difference between this technology and connection methods using general solder paste or BGA. Note that, from the perspective of facilitating the application of conventional knowledge, the pre-compression bonding conditions may be the same as those for general anisotropic connections. The pre-compression bonding conditions used for general anisotropic connections are preferably 2.0 MPa or less, more preferably 1.5 MPa or less, and even more preferably 1.0 MPa or less. The lower limit of the pressure is preferably 0.2 MPa or more, more preferably 0.4 MPa or more. Even under these conditions, the object can be achieved by adjusting the conditions of the solder particles and adhesive binder up to the no-load connection (reflow process).The upper and lower limits may vary depending on the specifications of the device, and are not limited to the above numerical ranges as long as the objective of pushing the thermosetting connecting material 20 until the opposing electrodes come into contact or until it reaches the solder particle diameter is achieved.

[0030] Furthermore, in step (B), the connector is preferably pressed at a temperature in the range of −30°C to +60°C, which is the minimum melt viscosity temperature of the thermosetting connecting material, and more preferably at a temperature in the range of −10°C to +40°C, which is the minimum melt viscosity temperature of the thermosetting connecting material. This reduces the melt viscosity of the thermosetting connecting material, so that even if the pressure used to press the connector is reduced, the solder particles 21 can be sandwiched between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30. Furthermore, in step (B), as long as the state in which the solder particles 21 are sandwiched between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30, or the state in which the electrodes are in contact via molten or partially molten solder, is obtained, the thermosetting connecting material of the thermosetting resin layer 22 may have started to harden, may be in a semi-cured state called the B stage in which the thermosetting connecting material is not completely cured, or may be completely cured. This is because the curing can be completed completely during the reflow process, or the resin can be melted after curing and the solder particles can bond the electrodes together under the weight of the connector (in an unloaded state).From the standpoint of manufacturing control, it is preferable to be able to select either of these.

[0031] In step (B), a buffer material may be used between the tool 40 and the connector 30. Examples of the buffer material that can be used include polytetrafluoroethylene (PTFE), silicone rubber, etc. This can further prevent damage to the connector 30.

[0032] [Process (C)] Fig. 5 is a cross-sectional view showing a state in which the connector is fixed to the substrate, Fig. 6 is a cross-sectional view showing a state in which the substrate and connector are heated in a reflow furnace, and Fig. 7 is a cross-sectional view showing a state in which the connector is heated in a reflow furnace. As shown in Figs. 5 to 7, in step (C), the first terminal row 11 of the substrate 10 and the second terminals 31 of the connector 30 are joined using a reflow furnace set at a temperature equal to or higher than the melting point of the solder particles 21.

[0033] A reflow oven can heat and bond the substrate 10 and connector 30 without mechanical pressure, minimizing damage to the substrate 10 and connector 30. Furthermore, compared to anisotropic conductive connections using conventional heat and pressure tools, unnecessary resin flow is not generated, reducing air bubble entrapment. Furthermore, the absence of a load reduces the amount of solder particle movement, which is expected to result in high solder particle capture efficiency. The electrodes may be in direct contact with each other, and the adhesive may hold the solder particles in place. Alternatively, nearby solder particles may act as support for the connection. The solder particles may be sandwiched between the electrodes, and after the electrodes are directly connected, the surrounding solder particles may melt and contribute to the connection. Therefore, it is preferable to have a solder particle content that does not cause self-alignment. This is one of the differences between this technology and conventional anisotropic conductive connections. That is, in this technology, conduction may be via solder particles, which are conductive particles (a state the same as or similar to anisotropic connection), or the electrodes may be in direct contact with each other and the adhesive may hold this in place to provide conduction (a state different from anisotropic connection), or solder particles present near the electrodes may contribute auxiliary to conduction and inter-electrode bonding.

[0034] Examples of reflow furnaces include atmospheric pressure reflow, vacuum reflow, atmospheric pressure ovens, and autoclaves (pressure ovens). Among these, it is preferable to use vacuum reflow, autoclaves, etc., which can eliminate air bubbles contained in the joints.

[0035] The lower limit of the peak temperature (maximum temperature reached) in the reflow furnace should be equal to or higher than the temperature at which the solder particles melt and the thermosetting binder begins to harden, preferably 150°C or higher, more preferably 180°C or higher, and even more preferably 200°C or higher. The upper limit of the peak temperature in the reflow furnace is 300°C or lower, more preferably 290°C or lower, and even more preferably 280°C or lower. This results in a solder joint 24 between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30. Furthermore, because the content of solder particles 21 in the thermosetting connecting material is such that self-alignment is not expected, the numerous solder particles 21 do not merge together, and multiple solder joints 24 exist within a single terminal. Furthermore, when the thermosetting connecting material is a thermosetting binder, the thermosetting binder bonds all but the multiple solder joints 24 within the terminal. Here, solder jointing refers to connecting the electrodes of opposing electronic components by melting solder.

[0036] In a reflow furnace, the thermosetting resin melts due to heating, and the main heating, which is above the solder melting point, melts the solder particles 31 sandwiched between the electrodes, causing the solder to wet and spread over the electrodes. Cooling then bonds the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30. Reflow may include a temperature-raising step, a temperature-lowering step, and a temperature-maintaining step (keep step). A peak step, in which the temperature reaches the highest point, may be included, or a step during the temperature-raising or temperature-lowering process may be included. The temperature-raising step may be divided into two stages: a step of melting the binder (e.g., up to 120°C) and a step of melting and spreading the solder particles (e.g., 120 to 175°C). Therefore, the temperature-raising rate may be, for example, 10 to 120°C / min or 20 to 100°C / min. The time during the keep step (e.g., 175 to 180°C) also serves as a binder-hardening step. This temperature is, for example, 160 to 230°C, and may differ by about 5 to 10°C, or may be the same as the peak temperature. This time can be selected appropriately, for example, 0.5 minutes or more or 0.75 minutes or more. A longer time reduces manufacturing efficiency, so it is, for example, 5 minutes or less or 3 minutes or less. Reflow may consist of only a temperature-raising step and a temperature-lowering step. In this case, the curable resin melts through both steps, and the solder particles 31 sandwiched between the electrodes melt during main heating above the solder melting point, causing the solder to wet and spread over the electrodes. Cooling then bonds the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30. For process management, the time required to exceed a predetermined temperature can be controlled. The predetermined temperature is preferably 150°C, more preferably 180°C or more, and even more preferably 200°C or more. The predetermined time is, for example, 0.5 minutes. By cooling (below the melting point of the solder particles) after the temperature-lowering step, the solder particles solidify, allowing the electrodes to be bonded. The cooling rate should be high to increase productivity and allow for quick removal, but low to avoid rapid cooling of the bonded state, which is desirable for improving the quality of the bonded body. For example, the cooling rate may be the same as that of the heating step, and is preferably 10 to 30°C / min. The cooling rate can be adjusted depending on the combination of objects to be bonded and the conditions of the binder used. It is also affected by the removal temperature and the environment.

[0037] According to the above-mentioned method for manufacturing a connecting body, the solder particles and film thickness are made similar before the reflow process, and the solder particles and terminals are brought into contact, thereby making bonding easier. Furthermore, when the thermosetting connecting material is a thermosetting binder, the resin melting during the reflow process, the sandwiching of solder particles between the terminals, and the solder melting and resin hardening can be optimized by matching the temperature rise, maintenance, and temperature drop during the reflow process with the thermosetting behavior of the thermosetting connecting material. The thermosetting behavior of the thermosetting connecting material can be determined by DSC measurement or viscosity measurement using a rheometer.

[0038] The connector manufacturing device also includes a material placement section that places a thermosetting connecting material containing solder particles on a first terminal row of the substrate, a fixing section that fixes the connector on the thermosetting connecting material, and a reflow furnace that joins the first terminal row of the substrate and the second terminal row of the connector.

[0039] If the thermosetting connecting material is a film, the material placement unit may be a temporary attachment device that attaches the film to the substrate at low temperature and low pressure, or a lamination device that laminates the film onto the substrate. If the thermosetting connecting material is a paste, the material placement unit may be an application device that uniformly applies a predetermined amount onto the substrate. The fixing unit may be, for example, a flip-chip bonder having a heating mechanism and a pressure mechanism, and the connector is adsorbed and aligned with a tool and fixed onto the thermosetting connecting material by pressing down the tool. Alignment and fixation may also be performed using a device conventionally used for connector connection. The reflow furnace has a maximum temperature set to or above the melting point of the solder particles, and heats the connector while it is fixed to the substrate, joining the terminals of the substrate and the connector terminals.

[0040] <2. Connector> Fig. 7 is a cross-sectional view showing a connector. As shown in Fig. 7, the connector according to this embodiment includes a substrate 10 having a first terminal row 11, a connector 30 having a second terminal row 31, and an adhesive layer 23 that solders the first terminal row 11 and the second terminal row 31 together with solder particles 21 to form a solder joint 24, and also bonds the substrate 10 to the second connector 30.

[0041] The upper limit of the minimum value of the distance between adjacent terminals (space distance) in the first terminal row 11 and the second terminal row 31 is 0.8 mm or less, preferably 0.3 mm or less, and more preferably 0.2 mm or less. The lower limit of the minimum value of the distance between adjacent terminals in the first terminal row 11 and the second terminal row 31 is 50 μm or more, more preferably 60 μm or more, and even more preferably 70 μm or more.

[0042] The upper limit of the ratio of the average particle size of the solder particles 21 to the minimum distance between adjacent terminals (space distance) in the first terminal row 11 and the second terminal row 31 is less than 0.15, and more preferably 0.1 or less.

[0043] Due to the relationship between the distance between adjacent terminals in the first terminal row 11 and the second terminal row 31 and the average particle size of the solder particles 21 as described above, the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 can be joined using a reflow furnace.

[0044] The substrate 10 is similar to that described above. Examples of substrates based on the type of base material include a rigid substrate, a glass substrate, a ceramic substrate, and a plastic substrate. From an economical standpoint, it is preferable that adjacent terminals in the first terminal row are not provided with short-circuit prevention treatments (such as walls or grooves) used in solder resist. That is, the height between adjacent terminals in the first terminal row 11 from the terminal is preferably 100 μm or less, more preferably 35 μm or less, and even more preferably 12 μm or less. The lower limit of the height between adjacent terminals in the first terminal row 11 from the terminal may be the same as the terminal height (i.e., the terminals are horizontal and flush with the substrate surface, there are no protrusions on the terminals, and the connection surface of the substrate is flat). Alternatively, the terminals of the first terminal row provided on the substrate may protrude from the substrate plane. This facilitates sandwiching the solder particles 21 in contact between the first terminal row 11 of the substrate 10 and the second terminal row 31 of the connector 30 in step (B).

[0045] The adhesive layer 23 is a film formed by the thermosetting connecting material of the thermosetting resin layer 22 hardening after step (C), and is formed by soldering the first terminal row 11 of the substrate 10 to the second terminal row 31 of the connector 30 with 34 solder joints, and filling the space between the substrate 10 and the connector 30 with the thermosetting connecting material. A single terminal has 24 solder joints, and if the thermosetting connecting material is a thermosetting binder, there are adhesive joints formed by the thermosetting binder in the areas other than the 24 solder joints.

[0046] In this specification, a connector is primarily a resin-molded product having a mating portion. The mating portion is adapted to mate with, for example, an FPC terminal or plug, and the mating terminal pitch is 0.8 mm or less, preferably 0.3 mm or less, and more preferably 0.2 mm or less. The term connector refers to a product that can electrically connect and mechanically bond a component inserted into the mating portion with a component on which the connector is mounted. For example, this term includes resin-molded products with multiple electrodes protruding in the longitudinal direction (so-called centipede-type connectors) and those without protruding electrodes (flip-chip-type connectors). Even in the case of a narrow-pitch connector, the connector can be fixed at low pressure as described above and thermally bonded without load using a reflow oven.

[0047] 8 is a cross-sectional view showing an example of a connector in the short direction. This connector is a vertical mating type and is composed of a receptacle in which first terminals 52A and second terminals 52B are fixed by insulating resin 51, and a plug in which first terminals 54A and second terminals 54B are fixed by insulating resin 53. In addition, first terminals 52A and second terminals 52B, as well as first terminals 54A and second terminals 54B, are formed at a predetermined pitch in the longitudinal direction of the connector. In this connector, for example, first terminals 52A or second terminals 52B of the receptacle correspond to second terminal row 31 of connector 30 in the longitudinal cross section shown in FIG. 3.

[0048] The insulating resins 51, 53 are made of, for example, polyamide, LCP, or the like, and fix the first terminal 52A and the second terminal 52B, and the first terminal 54A and the second terminal 54, for example, by resin molding.

[0049] The first terminals 52A and the second terminals 52B, and the first terminals 54A and the second terminals 54 are formed by bending metal so that the first terminals 52A and 54A fit together vertically, and the second terminals 52B fit together vertically. Furthermore, leads are formed at the short ends of the receptacle and the plug, respectively, to form centipede-shaped terminals.

[0050] In this embodiment, the connector is fixed at low pressure and can be thermally bonded without mechanical pressure using a reflow oven without load, making it possible to mount even narrow-pitch connectors. Furthermore, since leads are not required according to this embodiment, a flip-chip type connector with a second terminal row on the inner side of the bonding surface with the substrate can be mounted, thereby reducing the mounting area. Connectors using this technology are thicker in the connection direction than FPCs and IC chips used in general anisotropic conductive connections (because FPCs, etc., are inserted and used). For this reason, there is a concern that misalignment (meaning misalignment between the first terminal array and the second terminal array) due to pressure (pressure) during connection is more likely to occur than in general anisotropic connections. However, by temporarily fixing the connector after alignment as described above and thermally bonding it without load using a reflow oven without mechanical pressure, such technical problems can be avoided. For these reasons, it can be said that this technology is in demand.

[0051] <3. Thermosetting connecting materials> The thermosetting connecting material in this embodiment is made of a thermosetting binder with solder particles dispersed therein, and the solder particle content is 50 wt% or less. This allows the connector on the thermosetting connecting material to be fixed and reflowed, and also prevents the occurrence of self-alignment of the solder particles, making it possible to mount a connector with a terminal row with a pitch of 0.8 mm or less.

[0052] The lower limit of the mass ratio range of the solder particle content is preferably 20 wt% or more, more preferably 30 wt% or more, and even more preferably 35 wt% or more. The upper limit of the mass ratio range of the solder particle content is 50 wt% or less, more preferably 45 wt% or less, and even more preferably 40 wt% or less. The lower limit of the volume ratio range of the solder particle content is preferably 5 vol% or more, more preferably 10 vol% or more, and even more preferably 15 vol% or more. The upper limit of the volume ratio range of the solder particle content is preferably 30 vol% or less, more preferably 25 vol% or less, and even more preferably 20 vol% or less. By satisfying the aforementioned mass ratio or volume ratio range for the solder particle content, excellent conductivity, heat dissipation, and adhesiveness can be obtained. When the solder particles are present in a binder, the volume ratio may be used. When an anisotropic conductive bonding material is produced (before the solder particles are present in the binder), the mass ratio may also be used. The mass ratio can be converted to a volume ratio based on the specific gravity and compounding ratio of the components. If the amount of solder particles is too small, excellent conductivity, heat dissipation, and adhesiveness cannot be obtained, whereas if the amount is too large, anisotropy is easily lost, making it difficult to obtain excellent conductivity reliability.

[0053] The thermosetting connecting material preferably has a peak exothermic temperature higher than the melting point of the solder particles, and preferably has a melting temperature lower than the melting point of the solder particles. The peak exothermic temperature can be measured using a rotational rheometer (manufactured by Thermo Fisher Scientific) under the following conditions: measurement pressure 1 N, temperature range 30 to 200°C, heating rate 10°C / min, measurement frequency 1 Hz, and measurement plate diameter 8 mm. This melts the thermosetting binder by heating, and the solder melts while the solder particles are sandwiched between the terminals, allowing electronic components with fine-pitch electrodes to be joined.

[0054] When the thermosetting connecting material is in the form of a film as described above, the lower limit of the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is preferably 0.6 or more, more preferably 0.8 or more, and even more preferably 0.9 or more. If the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is large, it becomes easy to sandwich the solder particles between the electrodes in step (B), but there is a risk that the handling of the film will become more difficult.

[0055] Furthermore, the upper limit of the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is preferably 1.5 or less, more preferably 1.2 or less, and even more preferably 1.1 or less. If the ratio of the average particle size of the solder particles to the thickness of the thermosetting connecting material is high, a high pressure is required to press the connector in step (B), which may damage the connector.

[0056] The film thickness can be measured using a known micrometer or digital thickness gauge (e.g., Mitutoyo Corporation: MDE-25M, minimum display 0.0001 mm) capable of measuring 1 μm or less, preferably 0.1 μm or less. The film thickness can be determined by measuring at 10 or more locations and averaging the results. However, when the film thickness is thinner than the particle diameter, a contact-type thickness measuring device is not suitable, and it is therefore preferable to use a laser displacement meter (e.g., Keyence Corporation, spectral interference displacement type SI-T series, etc.). Here, the film thickness refers to the thickness of the resin layer only and does not include the particle diameter.

[0057] [Thermosetting binder] Examples of thermosetting binders (insulating binders) include thermal radical polymerization resin compositions containing a (meth)acrylate compound and a thermal radical polymerization initiator, thermal cationic polymerization resin compositions containing an epoxy compound and a thermal cationic polymerization initiator, and thermal anionic polymerization resin compositions containing an epoxy compound and a thermal anionic polymerization initiator. Known pressure-sensitive adhesive compositions may also be used. The term "(meth)acrylic monomer" refers to both acrylic and methacrylic monomers.

[0058] In the following, a specific example will be described, taking as an example a thermal anionic polymerization type resin composition containing a solid epoxy resin, a liquid epoxy resin, and an epoxy resin curing agent.

[0059] The solid epoxy resin is not particularly limited as long as it is solid at room temperature and has one or more epoxy groups in the molecule, and may be, for example, a bisphenol A type epoxy resin, a biphenyl type epoxy resin, or the like. This allows the film shape to be maintained. Note that room temperature is the range of 20°C ± 15°C (5°C to 35°C) as specified in JIS Z 8703.

[0060] The liquid epoxy resin is not particularly limited as long as it is liquid at room temperature, and may be, for example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a urethane-modified epoxy resin.

[0061] The amount of the liquid epoxy resin to be blended is preferably 160 parts by mass or less, more preferably 100 parts by mass or less, and even more preferably 70 parts by mass or less, per 100 parts by mass of the solid epoxy resin. If the amount of the liquid epoxy resin to be blended is too large, it becomes difficult to maintain the film shape.

[0062] The epoxy resin curing agent is not particularly limited as long as it is a heat curing agent that initiates curing by heat, and examples thereof include anionic curing agents such as amines and imidazoles, and cationic curing agents such as sulfonium salts. The curing agent may be microencapsulated to provide resistance to the solvent used in forming the film.

[0063] It is also preferable that the thermosetting binder does not contain a flux compound, which improves the insulating properties and eliminates the need for a flux compound washing step, thereby shortening the time required for the oxide film removal step in the reflow process.

[0064] [Solder particles] The solder particles are preferably dispersed in the thermosetting connecting material, and the solder particles may be arranged randomly or with a certain regularity. The average particle diameter is measured by a known metallurgical microscope or optical microscope, and is determined by the average particle diameter per mm in plan view of the film. 2 The above areas can be checked by randomly selecting five or more locations.

[0065] The solder particles may also be in the form of an aggregate of a plurality of solder particles. The average particle size of the individual solder particles in the aggregate can be measured in the same manner as the average particle size described above.

[0066] The average particle size of the solder particles is preferably 0.2 times or less the minimum inter-terminal distance (space distance) between the first terminal row of the substrate and the second terminal row of the connector, which are the adherends. If the average particle size of the solder particles is greater than 0.2 times the minimum inter-terminal distance between the first terminal row of the substrate and the second terminal row of the connector, the possibility of a short circuit occurring increases.

[0067] The lower limit of the average particle size of the solder particles is preferably 0.5 μm or more, more preferably 3 μm or more, and more preferably 5 μm or more. This allows the coating thickness of the film to be constant. If the average particle size of the solder particles is less than 0.5 μm, a good solder joint with the electrode portion cannot be obtained, and reliability tends to deteriorate. The upper limit of the average particle size of the solder particles may be 50 μm or less, 30 μm or less, preferably 20 μm or less, and more preferably 10 μm or less. Furthermore, when a plurality of solder particles are aggregated, the size of the aggregate may be equal to the average particle size of the solder particles described above. When an aggregate is formed, the average particle size of the solder particles may be smaller than the above value. The size of individual solder particles can be determined by observation with an electron microscope, as described above.

[0068] Furthermore, the maximum diameter of the solder particles can be 200% or less of the average particle size, preferably 150% or less of the average particle size, and more preferably 120% or less of the average particle size. By having the maximum diameter of the solder particles within the above range, the solder particles can be sandwiched between electrodes and the electrodes can be joined by melting the solder particles. Furthermore, when a plurality of solder particles are aggregated, the size of the aggregate may be set to be equal to the maximum diameter of the solder particles described above. When forming an aggregate, the maximum diameter of the solder particles may be smaller than the above value. The size of individual solder particles can be determined by observation with an electron microscope, as described above.

[0069] The solder particles can be appropriately selected from, for example, Sn-Pb, Pb-Sn-Sb, Sn-Sb, Sn-Pb-Bi, Bi-Sn, Sn-Cu, Sn-Pb-Cu, Sn-In, Sn-Ag, Sn-Pb-Ag, and Pb-Ag systems specified in JIS Z 3282-1999, depending on the electrode material and connection conditions. The lower limit of the melting point of the solder particles is preferably 110°C or higher, more preferably 120°C or higher, and even more preferably 130°C or higher. The upper limit of the melting point of the solder particles may be 200°C or lower, preferably 180°C or lower, more preferably 160°C or lower, and even more preferably 150°C or lower. Furthermore, a flux compound may be directly bonded to the surface of the solder particles for the purpose of surface activation. Activating the surface can promote metal bonding with the electrode.

[0070] [Other additives] In addition to the insulating binder and solder particles described above, the thermosetting connecting material can contain various additives that have been used in conventional heat-curing adhesives, as long as the effects of the present invention are not impaired. The particle size of the additive is preferably smaller than the average particle size of the solder particles, but is not particularly limited as long as it does not interfere with the bonding between electrodes.

[0071] The thermosetting connecting material can be obtained, for example, by mixing an insulating binder and solder particles in a solvent, applying the mixture to a predetermined thickness on a release-treated film using a bar coater, and then drying to volatilize the solvent. Alternatively, the mixture may be applied to a release-treated film using a bar coater and then pressurized to a predetermined thickness. To improve the dispersibility of the solder particles, it is preferable to apply a high shear force while the material contains the solvent. For example, a known batch-type planetary mixing device can be used. The residual solvent content of the thermosetting connecting material is preferably 2% or less, more preferably 1% or less. [Example]

[0072] <4. Example> In this example, an adhesive film containing solder particles was prepared and used to mount a flexible printed circuit board on a rigid board as a connector replacement. The insulation and connection resistance of the mounted body were then evaluated. However, this example is not limited to these examples.

[0073] [Insulation evaluation of packaging body] The resistance between adjacent terminals of the mounting sample was measured and 6 Ω or less was counted as a short. A mounting body with no shorts was evaluated as "OK", and a mounting body with one or more shorts was evaluated as "NG".

[0074] [Evaluation of connection resistance of mounted body] For the assembly samples, the resistance was measured when a current of 1 mA was passed between each terminal between the flexible printed circuit board and the rigid board, and the median value was calculated.Assembly samples with a median resistance value of 0.1 Ω or less were evaluated as "OK," and all other assembly samples were evaluated as "NG."

[0075] <Implementation example 1-1> A flexible printed circuit board (Dexerials Corporation evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, line and space 1:1, pitch 200 μm, number of terminals 30, Ni-Au plating) and a rigid board (Dexerials evaluation rigid board, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, pitch 200 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) were prepared.

[0076] The flexible printed circuit board was aligned and fixed to the rigid board via an adhesive film under the mounting conditions of 90°C, 2 s, and 1 MPa. The adhesive film used was a 12-μm thick film containing 38 wt% solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy, solid point temperature 139°C) with an average particle size of 10 μm blended in an acrylic thermosetting binder (Dexerials Corporation, minimum melt viscosity reached temperature 80°C).

[0077] The flexible printed circuit board was then mounted on the rigid board by reflow. The reflow conditions were 150 to 260°C for 100 seconds, with a peak temperature of 260°C.

[0078] Table 1 shows the results of the insulation evaluation and connection resistance evaluation of the mounting body.

[0079] <Implementation example 1-2>

[0080] As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1, except that the mounting conditions were 100° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0081] <Implementation example 1-3> As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1, except that the mounting conditions were 130° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0082] <Implementation example 1-4> As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 1-1, except that the mounting conditions were set to 150° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0083] <Implementation example 2-1> A flexible printed circuit board (Dexerials Corporation evaluation FPC, terminal width 300 μm, distance between adjacent terminals (minimum) 300 μm, line and space 1:1, pitch 300 μm, number of terminals 30, Ni-Au plating) and a rigid board (Dexerials evaluation rigid board, terminal width 300 μm, distance between adjacent terminals (minimum) 300 μm, pitch 300 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) were prepared.

[0084] The flexible printed circuit board was aligned and fixed to the rigid board via an adhesive film under the mounting conditions of 90°C, 2 s, and 1 MPa. The adhesive film used was a 35-μm thick film made of an acrylic thermosetting binder (Dexerials Corporation, minimum melt viscosity reached temperature 80°C) mixed with 38 wt% solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy, solidus temperature 139°C) with an average particle size of 30 μm.

[0085] The flexible printed circuit board was then mounted on the rigid board by reflow. The reflow conditions were 150 to 260°C for 100 seconds, with a peak temperature of 260°C.

[0086] Table 1 shows the results of the insulation evaluation and connection resistance evaluation of the mounting body.

[0087] <Implementation example 2-2> As shown in Table 1, a mounting body was prepared in the same manner as in Mounting Example 2-1, except that the mounting conditions were 100° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0088] <Implementation example 2-3> As shown in Table 1, a mounting body was prepared in the same manner as in Mounting Example 2-1, except that the mounting conditions were set to 130° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0089] <Implementation example 2-4> As shown in Table 1, a mounting body was prepared in the same manner as in Mounting Example 2-1, except that the mounting conditions were 150° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0090] <Implementation example 3-1> A flexible printed circuit board (Dexerials Corporation evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, line and space 1:1, pitch 100 μm, number of terminals 30, Ni-Au plating) and a rigid board (Dexerials evaluation rigid board, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, pitch 100 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) were prepared.

[0091] The flexible printed circuit board was aligned and fixed to the rigid board via an adhesive film under the mounting conditions of 90°C, 2 s, and 1 MPa. The adhesive film used was a 28-μm-thick film containing 38 wt% solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy, solidus temperature 139°C) with an average particle size of 30 μm blended in an acrylic thermosetting binder (Dexerials Corporation, minimum melt viscosity reached temperature 80°C).

[0092] The flexible printed circuit board was then mounted on the rigid board by reflow. The reflow conditions were 150 to 260°C for 100 seconds, with a peak temperature of 260°C. Table 1 shows the results of the insulation evaluation and connection resistance evaluation of the mounting body.

[0093] <Implementation example 3-2> As shown in Table 1, a mounting body was produced in the same manner as in Mounting Example 3-1, except that the mounting conditions were 100° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0094] <Implementation example 3-3> As shown in Table 1, a mounting body was prepared in the same manner as in Mounting Example 3-1, except that the mounting conditions were set to 130° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0095] <Implementation example 3-4> As shown in Table 1, a mounting body was prepared in the same manner as in Mounting Example 3-1, except that the mounting conditions were set to 150° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0096] <Implementation example 4-1> A flexible printed circuit board (Dexerials Corporation evaluation FPC, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, line and space 1:1, pitch 100 μm, number of terminals 30, Ni-Au plating) and a rigid board (Dexerials evaluation rigid board, terminal width 100 μm, distance between adjacent terminals (minimum) 100 μm, pitch 100 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) were prepared.

[0097] The flexible printed circuit board was aligned and fixed to the rigid board via an adhesive film under the mounting conditions of 90°C, 2 s, and 1 MPa. The adhesive film used was a 35-μm thick film made of an acrylic thermosetting binder (Dexerials Corporation, minimum melt viscosity reached temperature 80°C) mixed with 38 wt% solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy, solidus temperature 139°C) with an average particle size of 30 μm.

[0098] The flexible printed circuit board was then mounted on the rigid board by reflow. The reflow conditions were 150 to 260°C for 100 seconds, with a peak temperature of 260°C.

[0099] Table 2 shows the results of the insulation evaluation and connection resistance evaluation of the mounting body.

[0100] <Implementation example 4-2> As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 4-1, except that the mounting conditions were 100° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0101] <Implementation example 4-3> As shown in Table 2, a mounting body was prepared in the same manner as in Mounting Example 4-1, except that the mounting conditions were set to 130° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated. <Implementation example 4-4> As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 4-1, except that the mounting conditions were 150° C.-2 s-1 MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were carried out.

[0102] <Implementation example 5-1> A flexible printed circuit board (Dexerials Corporation evaluation FPC, terminal width 200 μm, distance between adjacent terminals (minimum) 200 μm, line and space 1:1, pitch 200 μm, number of terminals 30, Ni-Au plating) and a rigid board (Dexerials evaluation rigid board, terminal width 200 μm, distance between adjacent terminals (minimum) 200 μm, pitch 200 μm, number of terminals 30, 18 μm thick Cu pattern, Ni-Au plating) were prepared.

[0103] The flexible printed circuit board was aligned and fixed to the rigid board via an adhesive film under the mounting conditions of 90°C, 2 s, and 1 MPa. The adhesive film used was a 35-μm thick film made of an acrylic thermosetting binder (Dexerials Corporation, minimum melt viscosity reached temperature 80°C) mixed with 38 wt% solder particles (MP-L20, Senju Metal Industry Co., Ltd., Sn-58Bi alloy, solidus temperature 139°C) with an average particle size of 30 μm.

[0104] The flexible printed circuit board was then mounted on the rigid board by reflow. The reflow conditions were 150 to 260°C for 100 seconds, with a peak temperature of 260°C.

[0105] Table 2 shows the results of the insulation evaluation and connection resistance evaluation of the mounting body.

[0106] <Implementation example 5-2> As shown in Table 2, a mounting body was prepared in the same manner as in Mounting Example 5-1, except that the mounting conditions were 100° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0107] <Implementation example 5-3> As shown in Table 2, a mounting body was produced in the same manner as in Mounting Example 5-1, except that the mounting conditions were 130° C.-2 s-1 MPa, and the insulation and connection resistance values ​​of the mounting body were evaluated.

[0108] <Implementation example 5-4> As shown in Table 2, a mounting body was prepared in the same manner as in Mounting Example 5-1, except that the mounting conditions were set to 150° C.-2 s-1 MPa, and the insulation evaluation and connection resistance value evaluation of the mounting body were carried out.

[0109] [Table 1]

[0110] [Table 2]

[0111] In Mounting Examples 1-2 to 1-4 and Mounting Examples 2-2 to 2-4, a minimum distance between adjacent terminals was 0.3 mm or less, and the ratio of the average particle size of the solder particles to the minimum distance between adjacent terminals was less than 0.15, so a mount with excellent insulation and conductivity was obtained. Furthermore, a mount with excellent insulation and conductivity was obtained by setting the temperature during alignment at 100 to 150°C for an adhesive film with a minimum melt viscosity temperature of 80°C.

[0112] Although a flexible printed circuit board is mounted in this embodiment, a connector can also be mounted. In addition, the connector can be not only a centipede type but also a flip chip type. [Explanation of symbols]

[0113] 10 substrate, 11 first terminal row, 20 thermosetting connecting material, 21 solder particles, 30 connector, 31 second terminal row, 40 tool, 51 insulating resin, 52A first terminal, 52B second terminal, 53 insulating resin, 54A first terminal, 54B second terminal

Claims

1. a step of fixing a connector having a second terminal row with a minimum inter-terminal distance of 0.8 mm or less on the inside of a joining surface with the substrate, on the first terminal row of the substrate via a thermosetting connecting material containing solder particles; a step of joining the first terminal row and the second terminal row without load using a reflow furnace set at a temperature equal to or higher than the melting point of the solder particles; A method for manufacturing a connector having the above structure.

2. 2. The method for manufacturing a connection body according to claim 1, wherein the ratio of the average particle size of the solder particles to the minimum distance between the terminals in the first terminal row and the second terminal row is less than 0.

15.

3. 3. The method for manufacturing a connector according to claim 1, wherein in the step of fixing the connector, the connector is crimped at a temperature in the range of -10°C to +40°C, which is the minimum melt viscosity temperature of the thermosetting connecting material.

4. The method for manufacturing a connection body according to any one of claims 1 to 3, wherein in the step of fixing the connector, the connector is crimped at a pressure of 2.0 MPa or less.

5. 5. The method for manufacturing a connection body according to claim 1, wherein the connector is a resin molded product.

6. 6. The method for manufacturing a connection body according to claim 1, wherein the content of the solder particles in the thermosetting connection material is 50 wt % or less.

7. 7. The method for producing a connection body according to claim 1, wherein the thermosetting connection material is in the form of a film.

8. a substrate having a first terminal row; a connector having a second terminal row on the inner side of the joint surface with the board, the second terminal row having a minimum inter-terminal distance of 0.8 mm or less; an adhesive layer that bonds the first terminal row and the second terminal row with solder particles and adheres the substrate and the connector; A connection body comprising:

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