Exposure apparatus and exposure method

Abstract

To provide an exposure apparatus capable of appropriately performing correction processing to a distortion of a pattern caused by an optical system.SOLUTION: An exposure apparatus 10 comprises an exposure head 20 provided with a DMD 22 and a projection optical system 23, and sections a scanning band region BR where an exposure area EA of the exposure head passes along a sub scanning direction (Y direction). Then, correction values for a series of sections Bm are obtained before shipment, in maintenance or the like. In performing an exposure operation, a vector data correction circuit 26 corrects pattern data (vector data) of a linear pattern on the basis of the correction values.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus equipped with a light modulation element array such as a DMD, and in particular to correction of pattern distortion and positional deviation caused by an optical system. [Background technology]

[0002] A maskless exposure device is equipped with an exposure head equipped with a DMD (Digital Micro-mirror Device) that has a two-dimensional array of micromirrors, and multiple exposure heads are arranged adjacent to each other in the sub-scanning direction. The substrate is scanned by moving it in the main scanning direction, and each micromirror is controlled to turn on or off depending on the pattern to be formed at the position of the exposure area, which is the projection region of the DMD. Light reflected from the DMD is imaged onto the substrate via a projection optical system installed in the exposure head, and the pattern is formed on the substrate.

[0003] To form a highly accurate pattern, it is necessary to form the pattern with a uniform line width. However, distortion and aberration of the projection optical system cause distortion of the pattern shape and deviation of the pattern formation position. As a result, unevenness occurs in the pattern line width. To correct such pattern distortion, a method is known in which drawing data is corrected so as to expand or contract the area irradiated with light (exposure area) (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-088464 Summary of the Invention [Problem to be solved by the invention]

[0005] Recent high-resolution patterns require the formation of patterns with uniform line widths. However, distortion and misalignment of patterns caused by the optical system vary depending on the position within the exposure area. For example, the amount of variation in line width of vertical line patterns along the main scanning direction differs from the amount of variation in line width of horizontal line patterns along the sub-scanning direction.

[0006] Such uneven line widths are difficult to address with drawing data correction processing that takes distortion and other factors into account and moves from the center of the exposure area toward the periphery, and cannot be addressed with drawing data correction processing that corrects deformation due to factors such as substrate heat or exposure head misalignment.

[0007] Therefore, it is necessary to provide an exposure apparatus that can appropriately correct distortion and misalignment of patterns caused by the optical system. [Means for solving the problem]

[0008] An exposure apparatus according to one embodiment of the present invention comprises an exposure head having an optical modulation element array in which optical modulation elements are arranged two-dimensionally, a scanning unit that moves a stage carrying a substrate along the main scanning direction and relatively moves the exposure area of ​​the optical modulation element array along a scanning band area, and a pattern data correction processing unit that corrects drawing data of a line pattern to be formed on the substrate, and the pattern data correction processing unit corrects the drawing data based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area so as to align the line widths of the line patterns along a predetermined direction within the scanning band area.

[0009] The pattern data correction process is not limited to strictly matching the line widths of the line patterns, but may be performed to align the line widths within an allowable range depending on the required pattern resolution, etc. Correction values ​​can be determined for each section by measuring the correction amount and drawing the line pattern. For example, the pattern can be divided into equal intervals along the sub-scanning direction, and a correction value can be assigned to each section in advance based on the displacement (deviation) measured for each section. For example, the correction value can be determined to compensate for deviations in the pattern formation position caused by the projection optical system provided in the exposure head.

[0010] The pattern data correction processing unit can correct vector data as drawing data. For example, the pattern data correction processing unit can execute a correction process to extend, reduce, rotate, or shift the vectors representing the contours of the drawing data.

[0011] The pattern data correction processing unit can correct the drawing data for the line width of vertical line patterns along the main scanning direction and the line width of horizontal line patterns along the sub-scanning direction. Because a correction value is assigned to each section defined along the sub-scanning direction, the pattern data correction processing unit only needs to correct the drawing data so as to align the line width of at least vertical line patterns along the main scanning direction. The pattern data correction processing unit can correct the drawing data for multiple vertical line patterns along the main scanning direction that fit into multiple sections so as to align the line widths of each pattern.

[0012] The pattern data correction processing unit can separately correct the drawing data to align the line widths of vertical line patterns along the main scanning direction and the drawing data to align the line widths of horizontal line patterns along the sub-scanning direction.

[0013] The exposure device can be equipped with a light intensity adjustment unit that adjusts the light intensity of the entire exposure area. The light intensity adjustment unit adjusts the light intensity of the entire exposure area so as to change the line width along the main scanning direction and the sub-scanning direction for a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction. The pattern data correction processing unit can correct the drawing data to align the line width along the sub-scanning direction based on the correction by the light intensity adjustment unit.

[0014] The light amount adjusting unit can, for example, change the line width of the vertical line pattern along the main scanning direction or the horizontal line pattern along the sub-scanning direction based on mask data that defines the arrangement of unused light modulation elements, or can adjust the output of the light source.

[0015] On the other hand, another aspect of the exposure apparatus of the present invention comprises an exposure head having an optical modulation element array in which optical modulation elements are arranged two-dimensionally, a scanning unit that moves a stage on which a substrate is mounted along the main scanning direction and relatively moves the exposure area of ​​the optical modulation element array along the scanning band area, and a pattern data correction processing unit that corrects the drawing data of a pattern to be formed on the substrate, and the pattern data correction processing unit corrects the drawing data so as to align the width of the pattern within the scanning band area based on correction values ​​that are previously assigned to each division defined along the sub-scanning direction of the scanning band area.

[0016] The patterns to be corrected are not limited to correction of drawing data to align the line width of vertical line patterns along the scanning direction and the line width of horizontal line patterns along the sub-scanning direction, but also include various other patterns such as arc patterns, rectangular patterns, circular patterns, etc. The correction value for each category may be calculated based on the line pattern drawn on the measurement substrate.

[0017] For example, the pattern data correction processing unit corrects the drawing data so as to align at least the width of the pattern in the sub-scanning direction out of the width of the pattern in the sub-scanning direction and the width of the pattern in the main scanning direction.

[0018] Another aspect of the present invention is an exposure method in which a stage carrying a substrate is moved along the main scanning direction, thereby relatively moving the exposure area of ​​an optical modulation element array in which optical modulation elements are arranged two-dimensionally along a scanning band area, correcting the drawing data of a linear pattern to be formed on the substrate, and forming a pattern on the substrate based on the corrected drawing data, and the drawing data is corrected so as to align the line widths of line patterns along a predetermined direction within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area.

[0019] Another aspect of the present invention is an exposure method in which a stage carrying a substrate is moved along the main scanning direction, thereby relatively moving the exposure area of ​​an optical modulation element array in which optical modulation elements are arranged two-dimensionally along a scanning band area, correcting the drawing data of a pattern to be formed on the substrate, and forming a pattern on the substrate based on the corrected drawing data, and the drawing data is corrected so as to align the width of the pattern within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area. [Effects of the Invention]

[0020] According to the present invention, it is possible to provide an exposure apparatus that is capable of appropriately correcting distortion of a pattern caused by an optical system. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is a block diagram of an exposure apparatus according to an embodiment of the present invention. [Figure 2] FIG. 1 is a diagram showing a part of a pattern defined for a scanning band area as pattern data (vector data). [Figure 3] 10A and 10B are diagrams illustrating correction of pattern data for a vertical line pattern. [Figure 4] 10A and 10B are diagrams illustrating correction of pattern data for a horizontal line pattern. [Figure 5]10A and 10B are diagrams illustrating corrections to pattern data of a linear pattern extending in an oblique direction. [Figure 6] FIG. 10 is a flowchart showing a pattern data correction process. DETAILED DESCRIPTION OF THE INVENTION

[0022] The exposure apparatus of this embodiment will be described below with reference to the drawings.

[0023] FIG. 1 is a block diagram of the exposure apparatus according to this embodiment.

[0024] The exposure apparatus 10 is a maskless exposure apparatus that forms a pattern directly on a substrate W having a photosensitive material such as photoresist formed on its surface, and is equipped with a plurality of exposure heads 20 (only one exposure head is shown in FIG. 1 ) each having a light source 21 such as a laser and a DMD (Digital Micro-mirror Device) 22. Illumination light emitted from the light source 21 is guided to the DMD 22 via an illumination optical system (not shown).

[0025] The DMD 22 is a light modulation element array in which minute rectangular micromirrors (for example, several μm to several tens of μm) are arranged two-dimensionally in a matrix, and is driven by a DMD drive circuit 24. Vector data (drawing data) such as CAD / CAM data transmitted from a server, workstation, etc. (not shown) is corrected in a vector data correction circuit 26, and then converted into raster data, which is a two-dimensional dot pattern, in a raster conversion circuit 28.

[0026] Based on the generated raster data, the DMD drive circuit 24 transmits exposure data to the DMD 22. Each micromirror of the DMD 22 is controlled to be turned on and off based on the exposure data. Light reflected by a micromirror in the on state passes through the projection optical system 23 and is imaged as pattern light on the surface (photosensitive surface) of the substrate W.

[0027] The stage 12 carrying the substrate W can be moved back and forth in the main scanning direction by a stage driving mechanism 14. As the stage 12 moves, the exposure area, which is the projection area of ​​the DMD 22, moves relative to the substrate W. However, the substrate W may also be placed on a table placed on the stage. The exposure area is inclined at a slight angle with respect to the main scanning direction (X direction).

[0028] The position of the substrate W (stage 12) is detected by a position detection sensor 15. For the stage 12 (substrate W), X and Y coordinates are defined in accordance with the main scanning direction and the sub-scanning direction perpendicular to the main scanning direction.

[0029] While the substrate W is moving at a predetermined speed, the DMD drive circuit 24 outputs exposure data corresponding to the position of the substrate W to the DMD 22. As a result, a pattern corresponding to the position of the exposure area is formed on the substrate W. Here, a multiple exposure operation in which the minute projection areas of the micromirrors overlap each other is performed at a predetermined exposure pitch.

[0030] The controller 30 controls the operation of the exposure apparatus 10, and the memory 32 stores data relating to the correction process of the pattern data, etc. The control program relating to the exposure operation, etc. is stored in a ROM (not shown) in the controller 30.

[0031] The exposure apparatus 10 is equipped with a camera (not shown) that reads alignment marks placed on the substrate W. The vector data correction circuit 26 performs a correction process on the vector data in accordance with the amount of deviation of the mark position due to thermal deformation of the substrate W or the like, which is detected before the multiple exposure operation.

[0032] Furthermore, the vector data correction circuit 26 compensates for distortion and misalignment of the pattern caused by the projection optical system 23, etc., i.e., performs correction processing on the pattern data, which is vector data, to form the pattern at the original drawing position, along with the correction processing for the alignment mark misalignment described above. The correction processing for distortion and misalignment of the pattern caused by the optical system will be described in detail below.

[0033] FIG. 2 is a diagram showing, as pattern data (vector data), a part of a pattern determined for the scanning band region BR in which the exposure area EA moves relatively.

[0034] Here, pattern data PB1 of a linear pattern along the main scanning direction (X direction), pattern data PB2 of a linear pattern along the sub-scanning direction (Y direction), and pattern data PB3 of a rectangular pattern are shown. Note that, as mentioned above, the exposure area EA is actually inclined at a slight angle with respect to the scanning band region BR.

[0035] Vector data is data that represents the contour lines of a pattern as vectors, and the shape of the pattern is determined by the coordinate information of the start and end points of the vectors that make up the contour lines. The linear pattern data PB1 shown in Figure 2 is represented by coordinate data (x0, y0), (x1, y1), (x2, y2), and (x3, y3).

[0036] A pattern is formed in the scan band region BR in accordance with the specifications of the substrate W. For example, a line pattern represented by pattern data PB1 (hereinafter referred to as a vertical line pattern, given that it is aligned along the longitudinal direction of the substrate W) or a line pattern represented by pattern data PB2 (hereinafter referred to as a horizontal line pattern) is formed. Furthermore, a wiring pattern in which vertical line patterns are arranged in the sub-scanning direction (Y direction) and a wiring pattern in which horizontal line patterns are arranged in the main scanning direction (X direction) may also be formed.

[0037] Incidentally, distortion of the pattern and deviation of the drawing position due to distortion and aberration of the optical system such as the projection optical system 23 constantly occur in the scanning band area, and the degree of distortion and the amount of deviation also differ depending on the position within the scanning band area, the direction in which the pattern is formed, etc. For example, the amount of increase in line width of a vertical line pattern along the main scanning direction (X direction) differs from the amount of increase in line width of a horizontal line pattern along the sub-scanning direction (Y direction).

[0038] In this embodiment, the scanning band area BR is divided (sectioned) along the sub-scanning direction (Y direction), and correction values ​​for the pattern data (hereinafter also referred to as vector data if necessary) are determined for each of the multiple sections (sections).

[0039] FIG. 3 shows the correction of pattern data for a vertical line pattern. The scanning band area BR is divided along the sub-scanning direction (Y direction) into a series of sections (divisions) BT (B0 to B n ) is defined. The width length of each section along the sub-scanning direction (Y direction) is set to the same length here. In FIG. 3, it is assumed that there is no distortion of the pattern along the main scanning direction (X direction). Also, it is assumed that vertical line patterns of the same line width are formed in the areas of sections B1 and B2.

[0040] Assuming that there is no distortion of the pattern due to the optical system, the vector data VD1 and VD2 of the sections B1 and B2, respectively, are represented by vector data having the same magnitude of vectors along the sub-scanning direction (Y direction).

[0041] However, in reality, pattern distortion and misalignment occur due to the optical system, and if pattern formation is performed based on the vector data VD1 and VD2 without correction processing, vertical line patterns P1 and P2 will be formed that do not have the same line width and are not aligned with each other. In Figure 3, the vertical line pattern P1 has a narrower line width than the designed vector data VD1, and the vertical line pattern P2 has a thicker line width than the designed vector data VD2.

[0042] Therefore, a correction value to compensate for such pattern distortion is calculated in advance, and correction processing is performed on the vector data during the exposure operation. As shown in Figure 3, the designed vector data VD1 is corrected to vector data VD'1 with a thicker line width. Also, the designed vector data VD2 is corrected to vector data VD'2 with a thinner line width.

[0043] At this time, correction processing is performed on the vector data VD1 and VD2 based on the correction values ​​C1 and C2 determined for the sections B1 and B2. Specifically, the correction amounts of the position coordinates for correcting the start and end point coordinates of the vector data are calculated in advance as the correction values ​​C1 and C2. n Correction values ​​C1 to C n are stored in the memory 32 as a correction table.

[0044] Because the exposure area EA moves relatively in the main scanning direction (X direction), the vector data VD1, VD2 can be corrected using the correction values ​​C1, C2 regardless of the position of the exposure area EA in the main scanning direction (X direction). In other words, there is no need to change the amount of correction for the line width of the vertical line patterns P1, P2 midway from one end of the vertical line pattern to the other. Therefore, the vertical line patterns P1, P2 formed based on the corrected vector data VD'1, VD'2 are formed as uniform wiring patterns with line widths that are substantially the same.

[0045] And not only divisions B1 and B2, but also any division B m (1≦m≦n) Correction value C assigned to each m Vector data VD m By correcting the above, it is possible to form a wiring pattern in which vertical line patterns with uniform line widths are arranged side by side. Therefore, it is possible to form a wiring pattern in which vertical line patterns with uniform line widths are arranged side by side over the entire scanning band region BR.

[0046] FIG. 4 shows the correction of pattern data for a horizontal line pattern. Due to pattern distortion caused by the optical system, the horizontal line pattern P3 does not have a constant line width along the sub-scanning direction (Y direction). FIG. 4 shows pattern P3 formed based on vector data VD3. However, it is assumed here that there is no pattern distortion along the sub-scanning direction (Y direction).

[0047] Therefore, the vector data VD3 is corrected based on the correction values ​​D1 and D2 assigned to the sections B1 and B2 to generate vector data VD'3. Through the correction process, a pattern P3 is formed in which the line width is uniform from end to end.

[0048] Then, by performing a similar correction process on the pattern data of horizontal line patterns arranged at a predetermined interval while the exposure area EA moves relatively along the main scanning direction (X direction), an array pattern can be formed in which horizontal line patterns with aligned line widths are arranged along the main scanning direction (X direction).

[0049] Correction value C m is the correction value calculated for the sub-scanning direction (Y direction), while the correction value D m is the correction value obtained in the main scanning direction (X direction). m , correction value C for horizontal line pattern m By using the above, vertical line patterns and horizontal line patterns with uniform line widths can be formed at desired locations in the scanning band region BR.

[0050] Here, the correction value C for the vertical and horizontal line patterns is m , correction value D m The vector data correction circuit 26 is configured to perform each of the correction processes separately in the main scanning direction (X direction) and the sub-scanning direction (Y direction).

[0051] However, pattern distortions and misalignment of the pattern caused by the optical system usually occur in the main scanning direction (X direction) and the sub-scanning direction (Y direction). Therefore, a correction value E m Division B m The correction value E m The vector data may be corrected based on the above.

[0052] As one of such vector data correction processes, for example, m The vector data can be corrected so that the line width of the vertical line pattern that fits within the area is uniform from end to end. In other words, the same correction process as for the horizontal line pattern shown in Figure 4 can also be performed on the vertical line pattern.

[0053] Furthermore, similar correction processing can be performed not only on vertical line patterns extending in the sub-scanning direction (Y direction) and horizontal line patterns extending in the main scanning direction (X direction), but also on other linear patterns extending in oblique directions.

[0054] FIG. 5 is a diagram showing correction to pattern data of a linear pattern extending in an oblique direction.

[0055] A pattern P4 with varying line width is formed by distortion of the pattern caused by the optical system, based on vector data represented by the coordinates (x0, y0), (x1, y1), (x2, y2), and (x3, y3) of the start and end points of each vector representing the contour line of the linear pattern.

[0056] Therefore, the correction value C for the sub-scanning direction (Y direction) m The vector data is corrected based on the vector data VD'4 to generate vector data VD'4. In this case, the vector data VD'4 is generated by a correction calculation process that extends, reduces, or rotates the vector. By forming a pattern P4 based on the vector data VD'4, it is possible to form a diagonal line pattern with a uniform line width.

[0057] Rather than simply correcting the pattern data to compensate for distortion and misalignment of the pattern due to the optical system, it is also possible to combine so-called light modulation filter data. The light modulation filter data represents data that indicates the arrangement of micromirrors that are not used for the purpose of varying the amount of light across the DMD 22. The light modulation filter data is described in, for example, Japanese Patent Application Laid-Open Nos. 2013-134316 and 2016-173535, and a detailed description thereof will be omitted.

[0058] For example, the controller 30 can be configured to read the light control filter data from the memory 32, and the raster conversion circuit 28 can generate exposure data by combining the light control filter data and the raster data.

[0059] Since the light control filter data adjusts the overall light intensity for the exposure area EA, adjusting the light intensity using the light control filter data causes a uniform change in line width in both the main scanning direction (X direction) and the sub-scanning direction (Y direction) for both vertical and horizontal line patterns. The vector data correction circuit 26 corrects the pattern data (vector data) taking into account the line width change caused by the light intensity adjustment.

[0060] For example, line width correction along the main scanning direction (X direction) is performed by adjusting the amount of light, and the vector data correction circuit 26 corrects the selection width along the sub-scanning direction (Y direction) based on the line width changes along the main scanning direction (X direction) and the sub-scanning direction (Y direction) due to the light amount adjustment.

[0061] Regarding the light amount adjustment, the light amount adjustment for the light source 21 may be performed by controlling the driving of the light source driving unit 29 instead of using the light adjustment filter data.

[0062] 6 is a flowchart showing the process of correcting pattern data (vector data). However, it is assumed that the correction process does not include light intensity adjustment.

[0063] Memory 32 contains each section B m A table of correction values ​​(correction table) is stored in the memory. Also, a correction table is prepared for each exposure head.

[0064] These correction values ​​are obtained by a correction amount measurement process. Specifically, vertical, horizontal, and diagonal line patterns are drawn on a measurement substrate, and the line widths of the drawn patterns are measured. Correction values ​​are calculated based on the line widths, and the data in the correction table is stored in memory 32.

[0065] The correction values ​​are acquired before shipping, during regular or irregular maintenance of the device, or when the rod or substrate (photosensitive material) is changed, as appropriate.

[0066] When an exposure operation is performed, the address of the correction table is calculated based on the start and end coordinates of the vector data, and the correction value is read out, and the vector data is corrected (S101 to S104).

[0067] The shape of the pattern to be corrected is not limited to a linear pattern, but may be an arc-shaped pattern. Furthermore, even for a wide shape such as a rectangle, the pattern width can be corrected based on a correction value based on the line width of the linear pattern drawn in the correction amount measurement operation. This method can also be applied to correcting the width of any pattern, including polygons and curves. The correction process can correct the pattern width in both the main scanning direction and the sub-scanning direction. It is sufficient to perform the correction so that the pattern width is uniform at least along the sub-scanning direction.

[0068] As explained above, the exposure apparatus 10 of this embodiment is equipped with an exposure head 20 provided with a DMD 22 and a projection optical system 23, and the scanning band region BR through which the exposure area EA of the exposure head passes is divided along the sub-scanning direction (Y direction). m During the exposure operation, the vector data correction circuit 26 corrects the pattern data (vector data) of the linear pattern based on the correction value. [Explanation of symbols]

[0069] 10 Exposure equipment 20 exposure head 22 DMD (Digital Modulator Array) 26 Vector data correction circuit BR Scan Band Area EA Exposure Area

Claims

1. an exposure head having a light modulation element array in which light modulation elements are arranged two-dimensionally; a scanning unit that moves a stage on which a substrate is mounted along a main scanning direction and relatively moves an exposure area of ​​the light modulation element array along a scanning band region; a pattern data correction processing unit that corrects drawing data of a line pattern to be formed on the substrate, An exposure apparatus characterized in that the pattern data correction processing unit corrects drawing data so as to align the line widths of line patterns along a predetermined direction within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area.

2. 2. The exposure apparatus according to claim 1, wherein the pattern data correction processing unit corrects the drawing data so as to align at least the line width of the vertical line pattern along the main scanning direction, out of the line width of the vertical line pattern along the main scanning direction and the line width of the horizontal line pattern along the sub-scanning direction.

3. 3. The exposure apparatus according to claim 2, wherein the pattern data correction processing unit corrects drawing data for a plurality of vertical line patterns along the main scanning direction that fall within a plurality of sections so that the line widths of the patterns are uniform.

4. 3. The exposure apparatus according to claim 2, wherein the pattern data correction processing unit separately corrects the drawing data to align the line widths of vertical line patterns along the main scanning direction and corrects the drawing data to align the line widths of horizontal line patterns along the sub-scanning direction.

5. a light amount adjusting unit that adjusts the amount of light in the entire exposure area for a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction; the light amount adjustment unit performs correction to change the line widths of vertical line patterns along the main scanning direction or horizontal line patterns along the sub-scanning direction in the main scanning direction and the sub-scanning direction; 2. The exposure apparatus according to claim 1, wherein the pattern data correction processing unit corrects the drawing data to make the line width uniform along the sub-scanning direction based on the correction by the light amount adjustment unit.

6. 6. The exposure apparatus according to claim 5, wherein the light intensity adjustment unit changes the line width of a vertical line pattern along the main scanning direction or a horizontal line pattern along the sub-scanning direction based on mask data that defines the arrangement of unused light modulation elements.

7. The drawing data is vector data, 2. The exposure apparatus according to claim 1, wherein the pattern data correction processing unit corrects the drawing data by performing at least one of extension, reduction, rotation, and translation of vectors representing contour lines of the drawing data.

8. an exposure head having a light modulation element array in which light modulation elements are arranged two-dimensionally; a scanning unit that moves a stage on which a substrate is mounted along a main scanning direction and relatively moves an exposure area of ​​the light modulation element array along a scanning band region; a pattern data correction processing unit that corrects drawing data of a pattern to be formed on the substrate, An exposure apparatus characterized in that the pattern data correction processing unit corrects drawing data so as to align the width of patterns within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area.

9. 9. The exposure apparatus according to claim 8, wherein the pattern data correction processing unit corrects the drawing data so as to align at least the width of the pattern in the sub-scanning direction, out of the width of the pattern in the sub-scanning direction and the width of the pattern in the main scanning direction.

10. 9. An exposure apparatus according to claim 8, wherein the correction value is calculated based on a line pattern drawn on a measurement substrate.

11. 11. An exposure apparatus according to claim 1, wherein the correction value is determined so as to compensate for a deviation in the pattern formation position caused by a projection optical system provided in the exposure head.

12. A stage carrying the substrate is moved along a main scanning direction, thereby relatively moving an exposure area of ​​an optical modulation element array in which optical modulation elements are arranged two-dimensionally along a scanning band region; an exposure method for correcting drawing data of a linear pattern to be formed on the substrate, and forming a pattern on the substrate based on the corrected drawing data, comprising: An exposure method characterized by correcting drawing data so as to align the line widths of line patterns along a predetermined direction within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area.

13. A stage carrying the substrate is moved along a main scanning direction, thereby relatively moving an exposure area of ​​an optical modulation element array in which optical modulation elements are arranged two-dimensionally along a scanning band region; an exposure method for correcting drawing data of a pattern to be formed on the substrate, and forming the pattern on the substrate based on the corrected drawing data, comprising: An exposure method characterized by correcting drawing data so as to align the width of patterns within the scanning band area based on correction values ​​previously assigned to each division defined along the sub-scanning direction of the scanning band area.

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