Liquid ejection head and liquid ejection device

The liquid ejection head addresses misalignment issues by elongating fluid resistance portions along pressure chamber regions, ensuring consistent ejection performance and enabling higher nozzle density with lower-temperature piezoelectric materials, thus achieving desired ejection characteristics and miniaturization.

JP2025144124APending Publication Date: 2025-10-02RICOH CO LTD
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Patent Information

Application Number
JP2024043746
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-19
Publication Date
2025-10-02

AI Technical Summary

Technical Problem

Existing liquid ejection heads face challenges in achieving desired ejection characteristics due to misalignment and misalignment-induced deviations in fluid resistance portions, leading to changes in ejection performance and potential blockage of fluid resistance portions by partition walls.

Method used

The liquid ejection head design includes fluid resistance portions that are elongated in the longitudinal direction of pressure chamber regions, separated by flow path partition walls, to accommodate misalignment and prevent blockage, while using piezoelectric materials with lower deposition temperatures to enable higher nozzle density and miniaturization.

Benefits of technology

This design ensures consistent ejection performance by preventing fluid resistance deviations and blockages, allowing for effective air bubble discharge and maintaining desired ejection characteristics without increasing head size, while utilizing lower-temperature piezoelectric materials for wiring integration.

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Abstract

To provide a liquid ejection head and a liquid ejection device that can obtain desired ejection characteristics.SOLUTION: A liquid ejection head comprises: a nozzle plate 110 which is a nozzle layer having nozzles 2; and a pressure chamber substrate 100 which is a pressure chamber layer having pressure chambers 4 communicating with the nozzles 2. The liquid ejection head also comprises a fluid resistance substrate 120 including: a fluid resistance layer 120 having supply fluid resistance portions 3a which are first fluid resistance portions communicating with the pressure chambers 4 and discharge fluid resistance portions 3b which are second fluid resistance portions communicating with the pressure chambers 4; and a flow path layer 120b having supply flow paths 3a which are first flow paths communicating with the supply fluid resistance portions 3a, a discharge flow paths 3b which are second flow paths communicating with the discharge fluid resistance portions 3b, and flow path partitions 130a which are partition walls separating the supply flow paths 3a and the discharge flow paths 3b. When viewed from a liquid ejection direction (Z direction), each of the fluid resistances portions has a shape that is elongated in a longitudinal direction of a region overlapping each of the flow paths of the pressure chambers 4.SELECTED DRAWING: Figure 7
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Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head and a device for ejecting liquid. [Background technology]

[0002] Conventionally, a liquid ejection head is known that includes a nozzle layer having a nozzle, a pressure chamber layer having a pressure chamber communicating with the nozzle, a fluid resistance layer having a first fluid resistance section communicating with the pressure chamber and a second fluid resistance section communicating with the pressure chamber, and a flow path layer having a first flow path communicating with the first fluid resistance section, a second flow path communicating with the second fluid resistance section, and a partition wall separating the first flow path and the second flow path.

[0003] Patent document 1 describes a liquid ejection head in which the pressure chamber is circular when viewed from the liquid ejection direction, the partition wall extends so as to pass through the center of the circular pressure chamber, and the first fluid resistance portion and the second fluid resistance portion are circular hole-shaped. Summary of the Invention [Problem to be solved by the invention]

[0004] However, there is a risk that desired ejection characteristics may not be obtained. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, the present invention provides a liquid ejection head comprising: a nozzle layer having a nozzle; a pressure chamber layer having a pressure chamber communicating with the nozzle; a fluid resistance layer having a first fluid resistance portion communicating with the pressure chamber and a second fluid resistance portion communicating with the pressure chamber; a flow path layer having a first flow path communicating with the first fluid resistance portion, a second flow path communicating with the second fluid resistance portion, and a partition wall separating the first flow path and the second flow path, wherein, when viewed from the liquid ejection direction, the first fluid resistance portion has a shape that is long in the longitudinal direction of a region that overlaps with the first flow path of the pressure chamber, and the second fluid resistance portion has a shape that is long in the longitudinal direction of a region that overlaps with the second flow path of the pressure chamber. [Effects of the Invention]

[0006] According to the present invention, desired ejection characteristics can be obtained. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a cross-sectional view schematically showing a nozzle plate vibration type liquid ejection head according to the present embodiment. [Figure 2] Cross-sectional view of AA' in Figure 1. [Figure 3] BB' cross section of Figure 1. [Figure 4] DD′ cross section of Figure 2. [Figure 5] 10A and 10B are diagrams showing conventional fluid resistance portions. [Figure 6] FIG. 10 is a cross-sectional view of a conventional pressure chamber substrate when the fluid resistance substrate is joined with a misalignment to the pressure chamber substrate. [Figure 7] 5A to 5C are schematic diagrams showing fluid resistance portions according to the embodiment; [Figure 8] 5A and 5B are schematic diagrams showing the periphery of each fluid resistance portion of Modification 1. [Figure 9] 10A and 10B are schematic diagrams showing the periphery of each fluid resistance portion of Modification 2. [Figure 10] FIG. 11 is a cross-sectional view schematically showing a liquid ejection head according to a third modification. [Figure 11] FIG. 10 is a cross-sectional view schematically showing a liquid ejection head according to a fourth modification. [Figure 12] 10 is a cross-sectional view of the liquid ejection head of Modification 4 taken at the same position as line DD' shown in FIG. 2. FIG. [Figure 13] FIG. 10 is a cross-sectional view schematically showing an example of a liquid ejection head in which damper members are provided in each flow path and each common liquid chamber. [Figure 14] FIG. 1 is a schematic diagram illustrating a printing apparatus according to an embodiment. [Figure 15] FIG. 2 is an explanatory plan view of an example of a head unit of the printing apparatus. [Figure 16] FIG. 10 is an explanatory plan view of the main parts of another printing device. [Figure 17] FIG. 2 is a side view illustrating the main parts of the printing apparatus of the present embodiment. [Figure 18]FIG. 2 is a plan view illustrating a main part of the liquid ejection unit according to the embodiment. [Figure 19] FIG. 2 is a front view illustrating the liquid ejection unit of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] The best mode for carrying out the present invention will be described below with reference to the drawings. Note that a person skilled in the art can easily modify or alter the present invention within the scope of the claims to create other embodiments, and these modifications and alterations are included within the scope of the claims. The following description is an example of the best mode for carrying out the present invention and does not limit the scope of the claims.

[0009] The liquid ejection head in this embodiment is a nozzle plate vibration type liquid ejection head that ejects liquid in a pressure chamber from the nozzle by varying the pressure in the pressure chamber using an actuator provided in a nozzle plate having nozzles. The nozzle plate vibration type has the advantage that droplets can be ejected with less force than a typical unimorph type piezo head (which ejects liquid by vibrating the surface facing a wall (nozzle forming wall) having a communication port that communicates with the nozzle of the pressure chamber), and it can achieve power saving of the actuator.

[0010] Increasing nozzle density limits the space available for laying out the wiring required for voltage application, making wiring construction on the substrate surface difficult. By building wiring and drive circuits within the substrate, wiring can be laid out even in configurations with high nozzle density. Lead zirconate titanate (PZT) is commonly used as the material for piezoelectric elements used as actuators due to its high piezoelectric properties. However, when forming a piezoelectric film on a substrate with wiring and drive circuits, PZT requires a deposition and crystallization temperature of 600°C or higher. Therefore, using PZT as the piezoelectric element material would render the drive circuit and its wiring within the substrate unable to withstand such high temperatures. Therefore, in configurations where wiring and drive circuits are built within the substrate, a piezoelectric material with a lower deposition temperature than PZT is required, forcing the selection of a material with lower piezoelectric properties than PZT. However, the nozzle plate vibration method described above has the advantage of ejecting droplets with less force than a typical unimorph piezo head, so it is possible to achieve good liquid ejection even with a material with lower piezoelectric properties than PZT. Therefore, even lead-free piezoelectric materials, which have low film formation and crystallization temperatures but low power, can eject liquid effectively. This allows wiring and drive circuits to be built inside the substrate, enabling higher density. Furthermore, the nozzle plate vibration method allows the volume of the pressure chamber to be reduced, making it possible to miniaturize the head.

[0011] Fig. 1 is a cross-sectional view schematically showing a nozzle plate vibration type liquid ejection head according to this embodiment, Fig. 2 is a cross-sectional view taken along line AA' in Fig. 1, Fig. 3 is a cross-sectional view taken along line BB' in Fig. 1, and Fig. 4 is a cross-sectional view taken along line DD' in Fig. 2. Fig. 1 is a cross-sectional view taken along line CC in Fig. 2. In the following description, the liquid ejection direction is referred to as the Z direction, the extension direction of the flow path partition wall 130a, which is a partition wall separating the supply flow path 3a and the discharge flow path 3b of the fluid resistance substrate, is referred to as the X direction, and the orthogonal direction perpendicular to both the liquid ejection direction and the extension direction is referred to as the Y direction. Also, the extension direction of the common supply flow path 31a is referred to as the Y' direction, and the orthogonal direction perpendicular to both the liquid ejection direction and the extension direction of the common supply flow path 31a is referred to as the X' direction.

[0012] The liquid ejection head 1 includes a nozzle plate 110 serving as a nozzle layer, a pressure chamber substrate 100 serving as a pressure chamber layer, a fluid resistance substrate 120, a sealing substrate 140, and a frame member 150.

[0013] The nozzle plate 110 is in the form of a thin film and has a plurality of nozzles 2 that eject liquid, and piezoelectric elements 5 that serve as electromechanical conversion elements that are annular actuators that are arranged around the nozzles 2. The nozzle plate 110 also has a nozzle formation portion (film) 111 that covers the piezoelectric elements 5.

[0014] In this embodiment, the nozzles 2 are arranged in a two-dimensional direction. Specifically, as shown in FIG. 2, a plurality of nozzle rows, each of which is configured by arranging the nozzles 2 linearly along the Y′ direction (the left-right direction in the figure), are arranged side by side in the X direction (the up-down direction in the figure). For the sake of simplicity, FIG. 2 illustrates an example in which three nozzle rows, each of which has five nozzles 2 arranged linearly, are arranged side by side. Note that, as shown in FIG. 2, the nozzles 2 in each nozzle row are arranged such that their positions in the Y direction, which is the nozzle row direction, are offset from each other. As a result, the adjacency direction (X direction) of adjacent nozzles between nozzle rows is not perpendicular to the nozzle row direction (the Y′ direction) but is inclined.

[0015] A liquid-repellent film may be formed on the nozzle surface of this nozzle formation portion 111. When liquid is continuously ejected, mist generated simultaneously with the ejection adheres to the nozzle surface. If a large amount of this mist adheres to the nozzle surface, the liquid ejected from the nozzle 2 may be affected by the liquid adhering to the nozzle surface and may deviate from the desired landing position. By forming a liquid-repellent film on the nozzle surface, it is possible to prevent the liquid from adhering to the nozzle surface, and to prevent the liquid ejected from the nozzle 2 from being affected by the liquid adhering to the nozzle surface.

[0016] The piezoelectric element 5 of the nozzle plate 110 has a first electrode 51 (also referred to as a lower electrode), a piezoelectric body 52, and a second electrode 53 (also referred to as an upper electrode). The piezoelectric element 5 is covered with an insulating film 8. The insulating film 8 has formed therein a hole-shaped first contact 71a for electrical connection to the first electrode 51 and a hole-shaped second contact 71b for electrical connection to the second electrode 53.

[0017] Furthermore, a first lead-out wiring 9a electrically connected to the first electrode 51 of the piezoelectric element 5 via a first contact 71a is formed on the surface of the insulating film 8 of the nozzle plate 110 opposite the vibration film 103 side. Furthermore, a first lead-out wiring 9a electrically connected to the second electrode 53 of the piezoelectric element 5 via a second contact 71b is also formed on the surface of this insulating film 8 opposite the vibration film 103 side. These lead-out wirings are electrically connected to wiring sections formed on the nozzle film side of the pressure chamber substrate 100, and are electrically connected to electrical connection pads formed on the end of the liquid ejection head. A drive waveform to be applied to the piezoelectric element from outside is input to the electrical connection pad.

[0018] The liquid filling the liquid ejection head 1 enters the nozzle 2 and forms a meniscus inside the nozzle. By applying a predetermined drive waveform (voltage) to each of the electrodes 51 and 53 of the piezoelectric element 5, the piezoelectric body 52 vibrates, causing the vibrating membrane 103 to vibrate. The vibration of the vibrating membrane 103 causes a pressure change in the liquid inside the pressure chamber, causing the liquid to be ejected from the nozzle 2.

[0019] The first electrode 51 and the second electrode 53 are preferably made of a metal with low electrical resistance and low reactivity, such as Ir or Mo. When a drive circuit for driving the piezoelectric elements 5 and a wiring section for electrically connecting the drive circuit and the piezoelectric elements are built into the pressure chamber substrate 100 to improve density, as in this embodiment, the piezoelectric material that makes up the piezoelectric body 52 is preferably a piezoelectric material whose film formation temperature is 450°C or less to prevent these from being damaged. Examples of piezoelectric materials whose film formation temperature is 450°C or less include AlN and ScAlN, which has a higher piezoelectric constant than AlN.

[0020] Furthermore, using ScAlN as the piezoelectric material offers the following advantage. Namely, the piezoelectric properties can be improved by aligning the crystal orientation of piezoelectric body 52, but an orientation control layer must be provided between vibrating film 103 and first electrode 51 to control the orientation. When the piezoelectric material of piezoelectric body 52 is ScAlN, using ScAlN as the orientation control layer also makes it possible to bring the lattice constant of first electrode 51, which is made of Mo, closer to that of ScAlN. As a result, the crystal orientation of piezoelectric body 52 is aligned, enabling improved piezoelectric properties.

[0021] The pressure chamber substrate 100 has a plurality of pressure chambers (also called pressure chambers or pressurized liquid chambers) 4 that respectively communicate with a plurality of nozzles 2. The plurality of pressure chambers 4 are separated by partition walls 100a. The pressure chamber substrate 100 is a silicon substrate, and a vibrating membrane 103 is formed on the nozzle plate 110 side. The plurality of pressure chambers 4 are fabricated by applying a MEMS (Micro Electro Mechanical Systems) process to the silicon substrate.

[0022] The material of the vibrating membrane 103 may be any material that is at least insulating, such as SiO2, SiN, metal oxide, resin, etc. However, to increase the displacement, a material with a low Young's modulus is desirable, and considering the difference in linear expansion coefficient with the pressure chamber substrate 100, SiO2 (silicon dioxide) is the most desirable material for the vibrating membrane 103, as this difference is relatively small.

[0023] Each pressure chamber 4 has a circular shape when viewed from the Z direction, and the depth of each pressure chamber 4 (length in the Z direction, thickness of the pressure chamber substrate) is preferably 50 to 1000 μm. The shallower the pressure chamber 4, the more liquid flows up to the vicinity of the nozzle when circulating inside the pressure chamber, and the greater the effects of circulation, such as preventing ink from drying out at the nozzle 2, expelling air bubbles, and suppressing ink settling. On the other hand, if the pressure chamber depth is too shallow (less than 50 μm), problems arise such as the pressure chamber substrate 100 being prone to cracking during processing.

[0024] A fluid resistance substrate 120 is bonded to the surface of the pressure chamber substrate 100 opposite the nozzle side. The fluid resistance substrate 120 has a fluid resistance layer 120a and a flow path layer 120b. The fluid resistance layer 120a has supply fluid resistance portions 7a as a plurality of first fluid resistance portions, and discharge fluid resistance portions 7b as a plurality of second fluid resistance portions, which make the cross-sectional area (the opening area parallel to the nozzle surface, hereinafter referred to as the flow path cross-sectional area) narrower than the cross-sectional area of ​​the pressure chamber 4 (the area of ​​the cross section parallel to the nozzle surface).

[0025] By providing such fluid resistance portions 7a, 7b, the crosstalk pressure generated within each pressure chamber 4 can be confined within each pressure chamber 4 as much as possible, thereby reducing the crosstalk pressure leaking from each pressure chamber 4 to the supply flow path 3a and the discharge flow path 3b.

[0026] The flow path layer 120b has two supply flow paths 3a serving as first flow paths that supply liquid to each pressure chamber 4, and three discharge flow paths 3b serving as second flow paths that discharge waste liquid from each pressure chamber. The flow path layer 120b is formed with a plurality of flow path partition walls 130a that extend in the X direction across each pressure chamber 4. These flow path partition walls 130a separate the supply flow paths 3a and the discharge flow paths 3b. As shown in FIG. 2, four flow path partition walls 130a are arranged side by side in the Y direction. Furthermore, a common supply flow path 31a that communicates with each supply flow path 3a is formed at one end side (-X direction side) of the flow path layer 120b in the X direction, and a common discharge flow path 31b that communicates with each discharge flow path 3b is formed at the other end side (+X direction side) of the flow path layer 120b in the X direction.

[0027] 2, the liquid supplied to the common supply flow path 31a flows into each supply flow path 3a, then flows within the supply flow path 3a along the upper surface of the fluid resistance layer, and is supplied from each supply fluid resistance portion 7a to each pressure chamber 4. Furthermore, the liquid within each pressure chamber 4 that has not been ejected from the nozzle 2 is discharged from each discharge fluid resistance portion 7b to each discharge flow path 3b. The liquid discharged to each discharge flow path 3b flows within the discharge flow path 3b along the upper surface of the fluid resistance layer 120a, as shown by arrow R2 in FIG. 2, and flows into the common discharge flow path 31b.

[0028] According to this embodiment, it is possible to create a flow of liquid flowing into the pressure chamber 4 from the supply flow path 3a and a flow of liquid flowing out to the discharge flow path 3b, thereby enabling replacement of the liquid in the pressure chamber 4. This makes it possible to activate the movement of the liquid in the pressure chamber 4, which moves air bubbles in the pressure chamber 4 and makes it easier to discharge them from the pressure chamber 4, thereby effectively suppressing the occurrence of ejection defects.

[0029] The fluid resistance substrate 120 is fabricated by applying a MEMS process to a silicon substrate to fabricate the fluid resistance sections 7a and 7b and the flow paths 3a, 3b, 31a, and 31b. Specifically, the silicon substrate is dry-etched from one side to form the supply flow path 3a, the common supply flow path 31a, the discharge flow path 3b, and the common discharge flow path 31b, and then dry-etched from the other side to form the fluid supply resistance section 7a and the discharge fluid resistance section 7b. To improve the dimensional accuracy of the depth during dry etching, an SOI (silicon on insulator) substrate may be used instead of the silicon substrate. The depth of each fluid resistance section 7a and 7b is preferably 10 to 1000 μm, and the depth of each flow path (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b) is preferably 100 to 1000 μm.

[0030] In the above example, a single substrate is etched from both sides to form the fluid resistance sections 7a, 7b and the flow paths (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b). However, the fluid resistance sections and flow paths may be formed on separate substrates, and these substrates may then be bonded together. For example, a fluid resistance substrate made of a silicon substrate is dry-etched to form the fluid resistance sections. Next, a flow path substrate made of a silicon substrate is dry-etched to form the flow paths (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b). The two substrates are then bonded together. In the above example, a silicon substrate is used, but a substrate made of metal, metal oxide, resin, or the like may also be used.

[0031] A sealing substrate 140 is bonded to the surface of the fluid resistance substrate 120 opposite to the pressure chamber substrate side. As shown in FIGS. 3 and 4, the sealing substrate 140 has a supply communication path 140a communicating with the common supply flow path 31a and a discharge communication path 140b communicating with the common discharge flow path 31b. The sealing substrate 140 is a silicon substrate, and the supply communication path 140a and the common discharge flow path 31b are formed by applying an MEMS process. Specifically, the silicon substrate is dry-etched to form the supply communication path 140a and the common discharge flow path 31b. Instead of a silicon substrate, a substrate made of metal, metal oxide, resin, or the like may be used.

[0032] A frame member 150 is bonded to the surface of the sealing substrate 140 opposite to the surface facing the fluid resistance substrate. As shown in Figures 3 and 4, the frame member 150 has a common liquid supply chamber 6a and a common liquid discharge chamber 6b. The common liquid supply chamber 6a communicates with a supply communication path 140a of the sealing substrate 140, and the common liquid discharge chamber 6b communicates with a discharge communication path 140b of the sealing substrate 140. A liquid supply port 152 is formed in the upper part of the common liquid supply chamber 6a, and a liquid discharge port 151 is formed in the upper part of the common liquid discharge chamber 6b.

[0033] Liquid from an external liquid storage section is supplied to the common supply flow path 31a through the liquid supply port 152, the supply common liquid chamber 6a, and the supply communication path 140a. The liquid in the common discharge flow path 31b passes through the discharge communication path 140b and the discharge common liquid chamber 6b, and is returned to the external liquid storage section from the liquid discharge port 151 via an external pump or the like. This circulates the liquid within the liquid ejection head 1. This makes it possible to expel air bubbles present within the liquid ejection head 1, such as within each pressure chamber 4 or each flow path, to the outside, and when using a liquid with components that tend to settle, to suppress the settling of the components of the liquid that tend to settle within the flow paths within the liquid ejection head 1.

[0034] FIG. 5 is a diagram showing conventional fluid resistance portions 7a and 7b. In a droplet ejection head using a nozzle plate vibration method, the nozzle plate vibrates, and it is desirable that the displacement of the vibrating membrane 103 on the contour of the circular nozzle 2 be nearly uniform. This is because if the displacement of the vibrating membrane 103 on the contour of the nozzle 2 varies depending on the location, it will lead to deflected ejection. For this reason, the shape of the pressure chamber 4 is circular or close to circular, as shown in Figure 5.

[0035] 5, the flow channel partitions 130a extending in the X direction across each pressure chamber 4 are provided to pass through the center of the circular pressure chamber, and when viewed from the Z direction, divide the pressure chamber 4 into two: a supply flow channel region A overlapping with the supply flow channel 3a and a discharge flow channel region B overlapping with the discharge flow channel 3b. Because the flow channel partitions 130a are provided to pass through the center of the circular pressure chamber 4, each of the regions A and B of the pressure chamber 4 has a substantially semicircular shape when viewed from the Z direction. Therefore, the maximum length of each of the regions A and B of the pressure chamber 4 in the Y direction (the direction perpendicular to the flow channel partitions 130a) is approximately the radius of the pressure chamber 4, and the maximum length in the X direction (the extension direction of the flow channel partitions 130a) is approximately the diameter of the pressure chamber 4. The X direction is the longitudinal direction of each of the regions A and B, and the Y direction is the lateral direction of each of the regions.

[0036] The fluid resistance substrate 120 having the fluid resistance portions 7a, 7b is bonded to the pressure chamber substrate 100, but misalignment between the substrates inevitably occurs during bonding. Conventionally, each of the fluid resistance portions 7a, 7b has a circular shape when viewed from the Z direction. If the opening area (cross-sectional area of ​​the flow path) of the fluid resistance portions 7a, 7b needs to be designed to be large, as shown in FIG. 5, the distance a1 between the partition wall 100a of the pressure chamber 4 and the fluid resistance portions 7a, 7b in the Y direction becomes shorter. As a result, there is a risk that this distance in the Y direction will fall below the allowable misalignment amount when bonding the fluid resistance substrate 120 and the pressure chamber substrate 100.

[0037] 6, when the fluid resistance substrate 120 is joined to the pressure chamber substrate 100 with the maximum allowable misalignment, a portion of either the supply fluid resistance portion 7a or the discharge fluid resistance portion 7b corresponding to one pressure chamber 4 is blocked by the partition wall 100a of the pressure chamber 4. As a result, the fluid resistance of the fluid resistance portion deviates from the target, resulting in a problem of change in ejection characteristics compared to a head with a small misalignment.

[0038] One possible solution to the above problem would be to increase the size of the pressure chamber 4, but this would result in a larger liquid ejection head. Another possible solution would be to reduce the thickness of the flow path partition 130a and move the fluid resistance portions closer to the flow path partition 130a, thereby making the distance a1 between the partition 100a of the pressure chamber 4 and the fluid resistance portions 7a, 7b in the Y direction longer than the allowable positional misalignment amount. However, this would result in the flow path partition 130a having an elongated shape, which could reduce the rigidity of the flow path partition 130a.

[0039] 5, when each fluid resistance portion 7a, 7b is circular when viewed in the Z direction, the distance a2 from the flow path partition wall is also short. Therefore, as described above, in a configuration in which the fluid resistance portions 7a, 7b and each flow path (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b) are formed on separate substrates and these substrates are bonded together, there is a risk that the flow path partition wall 130a will block the fluid resistance portion due to misalignment in the Y direction when these substrates are bonded together. As a result, there is a problem in that the fluid resistance of the fluid resistance portion deviates from the target, the ejection characteristics change, and the desired ejection performance may not be achieved.

[0040] Therefore, in this embodiment, when viewed from the Z direction (liquid ejection direction), each fluid resistance portion 7a, 7b is elongated in the longitudinal direction (X direction) of the pressure chamber regions A, B separated by the flow path partition wall 130a.

[0041] FIG. 7 is a schematic diagram showing the fluid resistance portions 7a and 7b of this embodiment. The cross-sectional area of ​​each fluid resistance portion shown in FIG. 7(a) is the same as that of the conventional fluid resistance portion shown in FIG. 5. In this embodiment, each fluid resistance portion 7a, 7b is elongated in the X direction, which is the longitudinal direction of the pressure chamber regions A, B. As a result, as can be seen from comparison with FIG. 5, the minimum distance b1 between the partition wall 100a of the pressure chamber and the fluid resistance portions 7a, 7b can be made longer than when the fluid resistance portions 7a, 7b are circular. This allows the minimum distance b1 between the partition wall 100a of the pressure chamber 4 and the fluid resistance portions 7a, 7b to be greater than the allowable misalignment amount when the pressure chamber substrate 100 and the fluid resistance substrate 120 are bonded, without expanding the pressure chamber 4. This prevents a portion of the fluid resistance portion from being blocked by the partition wall 100a due to misalignment when the pressure chamber substrate 100 and the fluid resistance substrate 120 are bonded. This prevents the liquid ejection head 1 from becoming larger, and achieves the desired ejection performance.

[0042] Furthermore, the distance b2 between the flow path partition wall 130a and each fluid resistance portion can be made longer than in the conventional example shown in Fig. 5. This makes it possible to prevent the flow path partition wall 130a from blocking part of the fluid resistance portion due to misalignment during bonding in a configuration in which the fluid resistance portions 7a, 7b and each flow path (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b) are formed on separate substrates.

[0043] As shown in Figure 7(b), by making the shape of the fluid resistance portion similar to the shape of areas A and B of the pressure chamber 4, the distance from each partition 100a, 130a can be made longer than the allowable positional misalignment amount, while the flow path cross-sectional area of ​​each fluid resistance portion 7a, 7b can be increased.

[0044] Furthermore, this embodiment also has the effect of improving the ability to discharge air bubbles from within the pressure chamber compared to the conventional example shown in Fig. 5. In the conventional configuration shown in Fig. 5, the distance between the partition wall 100a and the fluid resistance portion is long in the X direction, so the flow of liquid is small at the X direction ends of the pressure chamber, making it difficult for air bubbles to be discharged. On the other hand, in this embodiment, each fluid resistance portion has a shape that is elongated in the X direction, which is the longitudinal direction of each of the regions A and B of the pressure chamber, so the distance between the partition wall 100a and the fluid resistance portion in the X direction is shorter compared to the conventional configuration shown in Fig. 5. This allows for a good flow of liquid at the X direction ends of the pressure chamber, making it possible to effectively discharge air bubbles at the X direction ends of the pressure chamber.

[0045] Note that the shapes of the fluid resistance sections shown in Figures 7(a) and (b) above are just examples. The resistance effects of each fluid resistance section 7a, 7b are mainly due to resistance due to liquid inertia and resistance due to liquid viscosity. The former is determined by the flow path cross-sectional area and length (length in the Z direction) of the fluid resistance section, while the latter is also affected by the shape of the fluid resistance section. Therefore, the cross-sectional area and shape of each fluid resistance section can be appropriately set depending on the desired resistance due to inertia and resistance due to viscosity.

[0046] Next, a modification of this embodiment will be described.

[0047] [Variation 1] FIG. 8 is a schematic diagram showing the periphery of each of the fluid resistance portions 7a and 7b of the first modification. 8, in Modification 1, recesses 131 are provided in the flow path partition wall 130a at locations facing the fluid resistance portions 7a, 7b when viewed from the Z direction. This allows the fluid resistance portions 7a, 7b to be located closer to the inside of the pressure chamber 4 than in the embodiment, and the distance from the partition wall 100a can be increased. This further prevents part of the fluid resistance portions from being blocked by the partition wall 100a due to misalignment when the pressure chamber substrate 100 and the fluid resistance substrate 120 are joined.

[0048] Furthermore, in a configuration in which the fluid resistance sections 7a, 7b and each flow path (supply flow path 3a, discharge flow path 3b, common supply flow path 31a, common discharge flow path 31b) are formed on separate substrates, it is possible to prevent the flow path partition 130a from blocking part of the fluid resistance section due to misalignment during joining.

[0049] The recesses 131 in the flow path partition wall 130a must be designed taking into consideration the mechanical strength of the flow path partition wall 130a. This is because the larger the recesses 131, the thinner the flow path partition wall 130a at the portion where the recesses 131 are provided, and the weaker the mechanical strength. As a result, there is a concern that the flow path partition wall 130a may be destroyed when force is applied, for example, when bonding to the sealing substrate 140.

[0050] [Variation 2] FIG. 9 is a schematic diagram showing the periphery of each of the fluid resistance portions 7a and 7b of the second modification. In Modification 2, as shown in Figures 9(a) and 9(b), a plurality of fluid resistance portions 7a, 7b are provided. In Figure 9(a), two fluid resistance portions 7a, 7b are provided in the longitudinal direction (X direction) of the supply flow channel region A and the discharge flow channel region B of the pressure chamber. In Figure 9(b), two rows of a plurality of fluid resistance portions 7a, 7b are arranged in the longitudinal direction (X direction) of the supply flow channel region A and the discharge flow channel region B of the pressure chamber. In both Figures 9(a) and 9(b), the distribution area of ​​the plurality of fluid resistance portions 7a, 7b is elongated in the longitudinal direction (X direction) of the pressure chamber regions A and B.

[0051] In this modification 2 as well, by providing a plurality of fluid resistance portions 7a, 7b at least in the longitudinal direction (X direction) of the supply flow path region A and the discharge flow path region B of the pressure chamber and lengthening the distribution region of the plurality of fluid resistance portions 7a, 7b in the longitudinal direction (X direction) of the pressure chamber regions A, B, the total flow path cross-sectional area of ​​the supply fluid resistance portions 7a and the total flow path cross-sectional area of ​​the discharge fluid resistance portions 7b can be set to a targeted flow path cross-sectional area, and the minimum distance C1 between each of the fluid resistance portions 7a, 7b and the partition wall 100a of the pressure chamber 4 can be made greater than the allowable positional misalignment. Therefore, in this modification 2 as well, it is possible to prevent a portion of the fluid resistance portion from being blocked by the partition wall 100a due to misalignment when the pressure chamber substrate 100 and the fluid resistance substrate 120 are joined. Moreover, this modified example 2 is suitable when it is desired to increase the resistance due to the viscosity of the liquid compared to the resistance due to the inertia of the liquid.

[0052] [Variation 3] FIG. 10 is a cross-sectional view schematically showing a liquid ejection head according to the third modification. As shown in FIG. 10, in the third modification, a damper member 141 is provided on the lower surface of the sealing substrate 140 (the surface on the fluid resistance substrate side).

[0053] The portions of the sealing substrate 140 facing the flow paths 3a and 3b on the fluid resistance substrate side are removed by etching to form an air layer 142, and then a damper member 141 is attached to the surface of the sealing substrate 140 on the fluid resistance substrate side. The damper member 141 is a film-like member (damper film) made of metal or resin, and forms one wall portion (upper wall surface) of each of the flow paths 3a and 3b. The damper member 141 is preferably made of metal or resin.

[0054] With this configuration, the damper member 141 deforms in response to the crosstalk pressure waves and inertial flows propagating through the liquid in each flow path 3a, 3b, thereby reducing the crosstalk pressure waves and inertial flows occurring in the flow paths 3a, 3b, thereby exerting a crosstalk suppression effect.

[0055] [Variation 4] FIG. 11 is a cross-sectional view that schematically shows a liquid ejection head according to the fourth modification, and FIG. 12 is a cross-sectional view of the liquid ejection head according to the fourth modification, taken at the same position as the line DD′ shown in FIG. In this modification 4, a damper member 143 is provided on the upper surface of the sealing substrate 140 (the surface opposite to the fluid resistance substrate 120), and the damper member 143 forms the bottom walls of the supply common liquid chamber 6a and the discharge common liquid chamber 6b.

[0056] The portions of the sealing substrate 140 facing the common liquid chambers 6a, 6b via the damper members 143 on the frame member 150 side are removed by etching to form air layers 144, making the portions of the damper members 143 that form the bottom walls of the common liquid chambers 6a, 6b deformable. Similar to Modification 3, the damper members 143 are film-like members (damper films) made of metal or resin.

[0057] With this configuration, the damper member 143 deforms in response to external pressure waves and inertial flows propagating from the liquid supply port 152 and the liquid discharge port 151, thereby reducing pressure fluctuations within the common liquid chambers 6a and 6b.

[0058] As shown in FIG. 13, damper members 141 and 143 may be provided on both sides of a sealing substrate 140 to suppress pressure fluctuations in the supply flow path 3a, the discharge flow path 3b, the common supply liquid chamber 6a, and the common discharge liquid chamber 6b.

[0059] Next, an example of a liquid ejection device according to the present invention will be described with reference to FIGS. FIG. 14 is a schematic explanatory diagram of a printing apparatus that is an inkjet recording apparatus, which is an image forming apparatus serving as a device that ejects liquid in this embodiment. FIG. 15 is an explanatory plan view of an example of a head unit of a printing apparatus according to this embodiment.

[0060] A printing apparatus 500, which is an apparatus for ejecting this liquid, includes a carry-in means 501 that carries in a continuum 510, and a guide / conveyance means 503 that guides and conveys the continuum 510 carried in from the carry-in means 501 to a printing means 505. The printing apparatus 500 also includes a printing means 505 that ejects a liquid onto the continuum 510 to form an image, a drying means 507 that dries the continuum 510, and an ejection means 509 that ejects the continuum 510.

[0061] The continuous web 510 is sent out from a main winding roller 511 of the carry-in means 501, guided and conveyed by the rollers of the carry-in means 501, the guide and conveying means 503, the drying means 507, and the conveying means 509, and wound up by a winding roller 591 of the conveying means 509. In the printing means 505, the continuous web 510 is conveyed on a conveying guide member 559 opposite the head unit 550, and an image is printed by liquid ejected from the head unit 550.

[0062] In the printing device 500 of this embodiment, the head unit 550 includes the two head modules 100A and 100B according to this embodiment described above, mounted on a common base member 552.

[0063] When the direction in which the liquid ejection heads 1 of the head modules 100A and 100B are lined up in a direction perpendicular to the transport direction is defined as the head arrangement direction, the head arrays 1A1 and 1A2 of the head module 100A eject liquid of the same color. Similarly, the head arrays 1B1 and 1B2 of the head module 100A are paired, the head arrays 1C1 and 1C2 of the head module 100B are paired, and the head arrays 1D1 and 1D2 are paired, and each ejects liquid of the required color.

[0064] Next, another example of a printing apparatus as a liquid ejecting apparatus according to the present invention will be described with reference to FIGS. FIG. 16 is an explanatory plan view of the main parts of the printing apparatus of this example. FIG. 17 is an explanatory side view of the main part of the printing apparatus of this example.

[0065] The printing apparatus 500 of this example is a serial type apparatus, and a carriage 403 is moved back and forth in the main scanning direction by a main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is hung between left and right side plates 491A and 491B to movably hold the carriage 403. The main scanning motor 405 then moves the carriage 403 back and forth in the main scanning direction via a timing belt 408 hung between a drive pulley 406 and a driven pulley 407.

[0066] This carriage 403 is equipped with a liquid ejection unit 440 that integrates the liquid ejection head 1 according to the present invention and a head tank 441. The liquid ejection head 1 ejects liquid of each color, for example, yellow (Y), cyan (C), magenta (M), and black (K). The liquid ejection head 1 is mounted with a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and the ejection direction facing downward. The liquid ejection head 1 is connected to a liquid circulation device, which circulates and supplies liquid of the required color.

[0067] The printing apparatus 500 is equipped with a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412 attracts the paper 410 and transports it at a position facing the liquid ejection head 1. The transport belt 412 is an endless belt that is stretched between a transport roller 413 and a tension roller 414. The attraction can be achieved by electrostatic attraction or air suction. The transport belt 412 moves in a circular motion in the sub-scanning direction as the transport roller 413 is rotationally driven by the sub-scanning motor 416 via a timing belt 417 and a timing pulley 418.

[0068] Furthermore, a maintenance and recovery mechanism 420 that maintains and recovers the liquid ejection head 1 is disposed on one side of the carriage 403 in the main scanning direction, beside the conveyor belt 412. The maintenance and recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle surface of the liquid ejection head 1, a wiper member 422 that wipes the nozzle surface, and the like. The main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the conveyor mechanism 495 are attached to a housing that includes side plates 491A and 491B and a back plate 491C.

[0069] In the printing device 500 configured in this manner, the paper 410 is fed onto the conveyor belt 412 and adsorbed thereon, and the paper 410 is conveyed in the sub-scanning direction by the circular movement of the conveyor belt 412. Then, by driving the liquid ejection head 1 in accordance with an image signal while moving the carriage 403 in the main scanning direction, liquid is ejected onto the stationary paper 410 to form an image.

[0070] Next, another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 18 is a plan view illustrating the main parts of the liquid discharge unit of this example.

[0071] This liquid ejection unit 440 is composed of the components that make up the device for ejecting the liquid, including a housing portion consisting of side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid ejection head 1.

[0072] It is also possible to configure a liquid discharge unit in which the above-described maintenance and recovery mechanism 420 is further attached to, for example, the side plate 491B of this liquid discharge unit 440.

[0073] Next, still another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 19 is an explanatory front view of the liquid discharge unit of this example.

[0074] This liquid discharge unit 440 is composed of a liquid discharge head 1 to which a flow path part 444 is attached, and a tube 456 connected to the flow path part 444 .

[0075] The flow path part 444 is disposed inside the cover 442. A head tank 441 may be included instead of the flow path part 444. A connector 443 for electrically connecting with the liquid ejection head 1 is provided on the upper part of the flow path part 444.

[0076] In the present application, the liquid to be ejected may have a viscosity and surface tension that allow it to be ejected from the head, and is not particularly limited. However, it is preferable that the viscosity of the liquid be reduced to at least 30 mPa·s or less upon heating. More specifically, the liquid may be a solution, suspension, emulsion, or molten metal such as solder containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a functionalizing material such as a polymerizable compound, a resin, or a surfactant, a biocompatible material such as DNA, amino acids, proteins, or calcium, or an edible material such as a natural colorant. These liquids can be used, for example, in inkjet inks, surface treatment solutions, liquids for forming components or electronic circuit resist patterns for electronic devices or light-emitting elements, liquids for forming solder bumps, and material liquids for 3D modeling.

[0077] A "liquid ejection unit" is a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, a "liquid ejection unit" includes a liquid ejection head combined with at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0078] Here, "integrated" includes, for example, a liquid ejection head and a functional part or mechanism that are fixed to each other by fastening, bonding, engaging, etc., or one that is held movably relative to the other. The liquid ejection head, functional part, or mechanism may also be configured to be detachable from each other.

[0079] For example, some liquid ejection units have a liquid ejection head and a head tank integrated together, while others have a liquid ejection head and a head tank integrated together by being connected to each other by a tube, etc. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

[0080] Furthermore, there is a liquid ejection unit in which the liquid ejection head and the carriage are integrated.

[0081] In some liquid ejection units, the liquid ejection head is movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated together. In other liquid ejection units, the liquid ejection head, the carriage, and the main scanning movement mechanism are integrated together.

[0082] Furthermore, there is a liquid ejection unit in which a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which a liquid ejection head is attached, thereby integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

[0083] In some liquid ejection units, a tube is connected to a head tank or a liquid ejection head equipped with a flow path component, integrating the liquid ejection head with a supply mechanism. Liquid is supplied from a liquid reservoir to the liquid ejection head via this tube.

[0084] The main scanning movement mechanism includes the guide member alone, and the supply mechanism includes the tube alone and the loading unit alone.

[0085] Here, the "liquid ejection unit" is described in combination with a liquid ejection head, but the "liquid ejection unit" also includes a head module or head unit that includes the liquid ejection head described above, and that integrates the functional components and mechanisms described above.

[0086] "Liquid ejection devices" include devices that are equipped with a liquid ejection head, a liquid ejection unit, a head module, a head unit, etc., and that eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0087] This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0088] For example, examples of "liquid ejecting devices" include image forming devices that eject ink to form images on paper, and three-dimensional modeling devices (three-dimensional modeling devices) that eject modeling liquid onto a powder layer formed from layers of powder in order to create a three-dimensional object (a three-dimensional model).

[0089] Furthermore, the term "liquid ejection device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

[0090] The above-mentioned "object onto which a liquid can adhere" means an object onto which a liquid can adhere at least temporarily, an object onto which the liquid can adhere and stick, an object onto which the liquid can penetrate, etc. Specific examples include media such as paper, recording paper, film, and cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects onto which a liquid can adhere.

[0091] The material of the "substance to which a liquid can adhere" may be any material to which a liquid can adhere, even temporarily, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, or ceramics.

[0092] Furthermore, the "liquid ejection device" may be a device in which a liquid ejection head and an object onto which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which a liquid ejection head moves, and a line type device in which a liquid ejection head does not move.

[0093] Other examples of "liquid ejecting devices" include treatment liquid application devices that eject treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and spray granulation devices that spray a composition liquid in which raw materials are dispersed through a nozzle to granulate the raw material particles.

[0094] In the present application, the terms image formation, recording, printing, copying, printing, modeling, etc. are all synonymous.

[0095] The above description is merely an example, and each of the following aspects provides unique effects. (Aspect 1) In a liquid ejection head 1 including a nozzle layer such as a nozzle plate 110 having nozzles 2, a pressure chamber layer such as a pressure chamber substrate 100 having pressure chambers 4 communicating with the nozzles 2, a fluid resistance layer 120a having first fluid resistance portions such as supply fluid resistance portions 7a communicating with the pressure chambers 4 and second fluid resistance portions such as discharge fluid resistance portions 7b communicating with the pressure chambers 4, and a flow path layer 120b having first flow paths such as a supply flow path 3a communicating with the first fluid resistance portions, second flow paths such as a discharge flow path 3b communicating with the second fluid resistance portions, and partition walls such as a flow path partition wall 130a separating the first flow paths from the second flow paths, when viewed from the liquid ejection direction (Z direction): The first fluid resistance portion has a shape that is long in the longitudinal direction of the region (supply flow path region A) that overlaps with the first flow path of the pressure chamber 4, and the second fluid resistance portion has a shape that is long in the longitudinal direction of the region (discharge flow path region B) that overlaps with the second flow path of the pressure chamber 4. In Patent Document 1, the pressure chamber has a circular shape when viewed from the liquid ejection direction, and the partition wall extends so as to pass through the center of the pressure chamber. Therefore, when viewed from the liquid ejection direction, the shape of the region of the pressure chamber that overlaps with the first flow path and the shape of the region of the pressure chamber that overlaps with the second flow path are both semicircular. Therefore, the longitudinal direction of the region of the pressure chamber that overlaps with the first flow path and the longitudinal direction of the region of the pressure chamber that overlaps with the second flow path are the extension direction, and the lateral direction is the orthogonal direction perpendicular to the extension direction. The first fluid resistance portion and the second fluid resistance portion described in Patent Document 1 are circular holes. Therefore, in the orthogonal direction, which is the short-side direction of the pressure chamber region, the distance from the fluid resistance portion to the side wall of the pressure chamber may be shorter than the mounting error of the fluid resistance layer relative to the pressure chamber layer. As a result, depending on the mounting error, a portion of the first fluid resistance portion or the second fluid resistance portion may not face the pressure chamber, and a portion of the first fluid resistance portion or the second fluid resistance portion may be blocked by the pressure chamber layer. As a result, the desired fluid resistance may not be obtained, and the desired ejection characteristics may not be achieved. In addition, in the above-mentioned perpendicular direction, the distance from the fluid resistance section to the partition wall may be shorter than the mounting error of the fluid resistance layer relative to the flow path layer, which may result in the partition wall blocking part of the fluid resistance section, making it impossible to obtain the desired fluid resistance and resulting in the failure to obtain the desired ejection characteristics. In contrast, in the first aspect, when viewed from the liquid ejection direction, each fluid resistance portion is elongated in the longitudinal direction of the region overlapping with each flow path of the pressure chamber. As a result, when the flow path cross-sectional area of ​​each fluid resistance portion is the same as that in the case of a round hole, the minimum distance from the first fluid resistance portion and the second fluid resistance portion to the side wall of the pressure chamber can be made longer than the mounting error of the fluid resistance layer relative to the pressure chamber layer, compared to the case of a round hole. This makes it possible to prevent a portion of the first fluid resistance portion or the second fluid resistance portion from not facing the pressure chamber. Furthermore, the minimum distance from the fluid resistance portion to the partition wall can be set longer than the mounting error of the fluid resistance layer relative to the flow path layer, thereby preventing a portion of the first fluid resistance portion or the second fluid resistance portion from being blocked by the partition wall. As a result, it is possible to prevent a part of each fluid resistance portion from being blocked by the partition wall or the dividing wall of the pressure chamber, and it is possible to obtain the desired ejection characteristics.

[0096] (Aspect 2) In embodiment 1, the pressure chamber 4 has a circular shape concentric with the round-hole nozzle 2 when viewed from the liquid ejection direction (Z direction), and the first fluid resistance section such as the supply fluid resistance section 7a and the second fluid resistance section such as the discharge fluid resistance section 7b have a shape that is elongated in the extension direction (X direction) of the partition walls such as the flow path partition 130a. As described in the embodiment, this allows the flow path cross-sectional area of ​​each fluid resistance section to be the desired cross-sectional area by making the minimum distance from the first fluid resistance section, such as the supply fluid resistance section 7a, and the second fluid resistance section, such as the discharge fluid resistance section 7b, to the partition wall 100a of the pressure chamber 4 longer than the attachment error between the fluid resistance layer 120a and the pressure chamber layer, such as the pressure chamber substrate 100. Furthermore, the minimum distance from the first fluid resistance section and the second fluid resistance section to the partition wall, such as the flow path partition wall 130a, is also made longer than the attachment error between the flow path layer and the fluid resistance layer, allowing the flow path cross-sectional area of ​​each fluid resistance section to be the desired cross-sectional area.

[0097] (Aspect 3) In the first or second embodiment, one first fluid resistance portion such as the supply fluid resistance portion 7a and one second fluid resistance portion such as the discharge fluid resistance portion 7b are provided for each pressure chamber 4. This allows the crosstalk pressure generated within each pressure chamber 4 to be effectively confined within each pressure chamber 4, thereby reducing the crosstalk pressure leaking from each pressure chamber 4 to the supply flow path 3a and the discharge flow path 3b.

[0098] (Aspect 4) In a liquid ejection head 1 having a nozzle layer such as a nozzle plate 110 having a nozzle 2, a pressure chamber layer such as a pressure chamber substrate 100 having a pressure chamber 4 communicating with the nozzle 2, a fluid resistance layer 120a having a first fluid resistance portion such as a supply fluid resistance portion 7a communicating with the pressure chamber 4 and a second fluid resistance portion such as a discharge fluid resistance portion 7b communicating with the pressure chamber 4, and a flow path layer 120b having a first flow path such as a supply flow path 3a communicating with the first fluid resistance portion, a second flow path such as a discharge flow path 3b communicating with the second fluid resistance portion, and a partition wall such as a flow path partition 130a separating the first flow path from the second flow path, when viewed from the liquid ejection direction (Z direction), a plurality of first fluid resistance portions are provided in the longitudinal direction of a region (supply flow path region A) overlapping with the first flow path of the pressure chamber 4, and a plurality of second fluid resistance portions are provided in the longitudinal direction of a region (discharge flow path region B) overlapping with the second flow path of the pressure chamber 4. This allows the total flow path cross-sectional area to be set to the desired flow path cross-sectional area, and the minimum distance to the partition wall 100a of the pressure chamber 4 of each fluid resistance section can be made longer than the attachment error between the fluid resistance layer 120a and the pressure chamber layer, as described in Modification 2. Also, the total flow path cross-sectional area can be set to the desired flow path cross-sectional area, and the minimum distance to the partition wall such as the flow path partition wall 130a of each fluid resistance section can be made longer than the attachment error between the fluid resistance layer 120a and the flow path layer.

[0099] (Aspect 5) In aspect 4, the pressure chamber 4 has a circular shape concentric with the round-hole nozzle when viewed from the direction in which the liquid is discharged from the nozzle, and when viewed from the direction in which the liquid is discharged, a plurality of first fluid resistance portions such as the supply fluid resistance portion 7a and a plurality of second fluid resistance portions such as the discharge fluid resistance portion 7b are provided in the extension direction (X direction) of the partition walls such as the flow path partition wall 130a of the first fluid resistance portions such as the supply fluid resistance portion 7a and the second fluid resistance portions such as the discharge fluid resistance portion 7b. This allows the total flow path cross-sectional area to be set to the desired flow path cross-sectional area, and the minimum distance to the partition wall 100a of the pressure chamber 4 of each fluid resistance section can be made longer than the attachment error between the fluid resistance layer 120a and the pressure chamber layer, as described in Modification 3. Furthermore, the total flow path cross-sectional area can be set to the desired flow path cross-sectional area, and the minimum distance to the partition wall such as the flow path partition wall 130a of each fluid resistance section can be made longer than the attachment error between the fluid resistance layer 120a and the flow path layer.

[0100] (Aspect 6) In embodiment 4 or 5, the distribution area of ​​the first fluid resistance portions, such as the plurality of supply fluid resistance portions 7a, is long in the longitudinal direction of the area (supply flow path area A) overlapping with the first flow path, such as the supply flow path 3a of the pressure chamber 4, and the distribution area of ​​the second fluid resistance portions, such as the plurality of discharge fluid resistance portions 7b, is long in the longitudinal direction of the area overlapping with the second flow path, such as the discharge flow path 3b of the pressure chamber 4. As a result, as explained in variant example 1, the total flow path cross-sectional area can be set to the desired flow path cross-sectional area, and the minimum distance to the partition wall 100a of the pressure chamber 4 of each fluid resistance section can be made longer than the mounting error between the fluid resistance layer 120a and the pressure chamber layer.

[0101] (Aspect 7) In any of the first to sixth aspects, a damper member 141 is provided on the side of the first flow path and the second flow path opposite to the fluid resistance layer side. As a result, as described in Modification 3, the damper member 141 deforms in response to the crosstalk pressure waves and inertial flows propagating through the liquid in each flow path 3a, 3b, thereby reducing the crosstalk pressure waves and inertial flows occurring in the flow paths 3a, 3b and suppressing crosstalk.

[0102] (Aspect 8) In any of aspects 1 to 7, there is a first common liquid chamber such as a supply common liquid chamber 6a that communicates with a first flow path such as a supply flow path 3a, and a second common liquid chamber such as a discharge common liquid chamber that communicates with a second flow path such as a discharge flow path 3b, and a portion of the wall that constitutes each common liquid chamber is made up of a damper member 143. As explained in the fourth modification, this allows the damper member 143 to deform in response to pressure waves and inertial flows propagating from the outside to each common liquid chamber, thereby reducing pressure fluctuations within each common liquid chamber 6a, 6b.

[0103] (Aspect 9) In any of aspects 1 to 8, when viewed from the liquid ejection direction (Z direction), a recess is provided in a portion of a partition wall such as the flow path partition 130a that faces a first fluid resistance portion such as the supply fluid resistance portion 7a and a second fluid resistance portion such as the discharge fluid resistance portion 7b. As a result, as explained in variant example 1, compared to a partition wall such as the flow path partition 130a that does not have the above-mentioned recess, each fluid resistance section 7a, 7b can be located closer to the inside of the pressure chamber 4, and the distance from the pressure chamber partition 100a can be increased.

[0104] (Aspect 10) In any of the first to ninth embodiments, the piezoelectric element 52 is provided in the nozzle layer such as the nozzle plate 110 . As described in the embodiment, this allows droplets to be ejected with less force than when liquid is ejected by vibrating the surface facing the wall portion (nozzle forming wall) having a communication port that communicates with the nozzle 2 of the pressure chamber 4, thereby enabling power savings.

[0105] (Aspect 11) In a liquid ejection device equipped with a liquid ejection head 1, the liquid ejection head according to any one of the first to tenth embodiments was used as the liquid ejection head 1. This makes it possible to obtain the desired ejection performance. [Explanation of symbols]

[0106] 1: Liquid ejection head 2: Nozzle 3a: Supply channel 3b: Discharge channel 4: Pressure chamber 5: Piezoelectric element 6a: Supply common liquid chamber 6b:Discharge common liquid chamber 7a: Supply fluid resistance section 7b: Discharge fluid resistance section 8: insulating film 9a: First lead-out wiring 31a: Common supply channel 31b: Common discharge flow path 51:First electrode 52: Piezoelectric material 53:Second electrode 71a: First Contact 71b: Second Contact 100: Pressure chamber substrate 100a: Bulkhead 103: Vibration membrane 110: Nozzle plate 111: Nozzle forming section 120: Fluid resistance board 120a: Fluid resistance layer 120b: flow path layer 130a: flow channel partition 131: Recess 140: Sealing substrate 140a: Supply communication path 140b: Discharge communication path 141: Damper member 142: Air layer 143: Damper member 144: Air layer 150: Frame member 151:Liquid outlet 152:Liquid supply port 410: Paper 440: Liquid dispensing unit 500:Printing device A: Supply channel area B: Discharge flow path area [Prior art documents] [Patent documents]

[0107] [Patent Document 1] Japanese Patent Application Publication No. 2014-172323

Claims

1. a nozzle layer having nozzles; a pressure chamber layer having pressure chambers communicating with the nozzles; a fluid resistance layer having a first fluid resistance portion communicating with the pressure chamber and a second fluid resistance portion communicating with the pressure chamber; A liquid ejection head including a first flow path communicating with the first fluid resistance portion, a second flow path communicating with the second fluid resistance portion, and a flow path layer having a partition wall separating the first flow path and the second flow path, A liquid ejection head characterized in that, when viewed from the liquid ejection direction, the first fluid resistance portion has a shape that is long in the longitudinal direction of the region that overlaps with the first flow path of the pressure chamber, and the second fluid resistance portion has a shape that is long in the longitudinal direction of the region that overlaps with the second flow path of the pressure chamber.

2. 2. The liquid ejection head according to claim 1, the pressure chamber has a circular shape concentric with the nozzle, which is a circular hole, when viewed from the liquid ejection direction; A liquid ejection head, wherein when viewed from the liquid ejection direction, the first fluid resistance portion and the second fluid resistance portion have a shape that is elongated in the extension direction of the partition wall.

3. 2. The liquid ejection head according to claim 1, The liquid ejection head is characterized in that the first fluid resistance portion and the second fluid resistance portion are provided one for each pressure chamber.

4. a nozzle layer having nozzles; a pressure chamber layer having pressure chambers communicating with the nozzles; a fluid resistance layer having a first fluid resistance portion communicating with the pressure chamber and a second fluid resistance portion communicating with the pressure chamber; a liquid ejection head including a first flow path communicating with the first fluid resistance portion, a second flow path communicating with the second fluid resistance portion, and a flow path layer having a partition wall separating the first flow path from the second flow path, A liquid ejection head characterized in that, when viewed from the liquid ejection direction, a plurality of first fluid resistance portions are provided in the longitudinal direction of an area of ​​the pressure chamber that overlaps with the first flow path, and a plurality of second fluid resistance portions are provided in the longitudinal direction of an area of ​​the pressure chamber that overlaps with the second flow path.

5. 5. The liquid ejection head according to claim 4, the pressure chamber has a circular shape concentric with the nozzle, which is a circular hole, when viewed from the direction in which the liquid is ejected from the nozzle; A liquid ejection head, characterized in that a plurality of the first fluid resistance portions and a plurality of the second fluid resistance portions are provided in an extending direction of the partition wall.

6. 5. The liquid ejection head according to claim 4, A liquid ejection head characterized in that the distribution area of ​​the plurality of first fluid resistance portions is long in the longitudinal direction of the area overlapping with the first flow path of the pressure chamber, and the distribution area of ​​the plurality of second fluid resistance portions is long in the longitudinal direction of the area overlapping with the second flow path of the pressure chamber.

7. 5. The liquid ejection head according to claim 1, The liquid ejection head is characterized in that a damper member is provided on the side of the first flow path and the second flow path opposite to the fluid resistance layer side.

8. 5. The liquid ejection head according to claim 1, A liquid ejection head having a first common liquid chamber communicating with the first flow path and a second common liquid chamber communicating with the second flow path, wherein a portion of the wall constituting each common liquid chamber is made of a damper member.

9. 5. The liquid ejection head according to claim 1, A liquid ejection head, wherein when viewed from the liquid ejection direction, recesses are provided in portions of the partition wall that face the first fluid resistance portion and the second fluid resistance portion.

10. 5. The liquid ejection head according to claim 1, A liquid ejection head characterized in that a piezoelectric body is provided in the nozzle layer.

11. In a liquid ejection device equipped with a liquid ejection head, 10. A liquid ejection device, comprising: a liquid ejection head according to claim 1 or 4;

Citation Information

Patent Citations

  • Ink jet head and ink jet recorder

    JP2014172323A