Support member arrangement determination device, support member arrangement determination method, support member arrangement determination program, and recording medium

Abstract

To determine the arrangement of a support member capable of firmly supporting a board against force applied to the board when a component is mounted in a component mounting area of the board without a need for burden of an operator.SOLUTION: A computing unit 71 acquires board configuration information 82 indicating a component mounting area R provided as an area for mounting a component E on a work surface 91 of a board 9. Further, the computing unit 71 determines the arrangement of a backup pins 4 that support the board 9 by coming into contact with a non-work surface 92 from below while the work surface 91 faces upward, on the basis of the component mounting area R. That is, the placement of the backup pins 4 for supporting the board 9 is determined regardless of the operator on the basis of the component mounting area R in which the component E is to be mounted on the work target surface 91 of the board 9.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a technique for determining the arrangement of support members that support a board on which components are to be mounted in a component mounter. [Background technology]

[0002] Conventionally, component mounters are known that mount components on a board by transferring components supplied by a feeder to the board using a mounting head. In such component mounters, backup pins are arranged on the underside of the board, and these backup pins support the board. Patent Documents 1 and 2 propose techniques for determining the placement of backup pins. In particular, Patent Document 1 determines the placement of backup pins while avoiding components mounted on the back surface (bottom surface) of the board. Patent Document 2 displays a superimposed image in which an image of the front surface (top surface) and an image of the back surface (bottom surface) of the board are superimposed, and the worker determines the placement of the backup pins by specifying the positions of the backup pins while checking this superimposed image. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-216415 [Patent Document 2] WO2004 / 103054 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the component mounter described above, it is necessary to firmly support the board against the force applied to the board when the mounting head mounts components in the component mounting area on the front surface of the board. In contrast, in Patent Document 1, the placement of the support members is determined only by taking into account the components mounted on the back surface of the board, so there is room for improvement in this regard. Furthermore, in Patent Document 2, the placement of the support members can be determined based on images of both the front and back surfaces of the board, which addresses this issue, but requires the operator to determine the placement of the support members while checking the images, which places a heavy burden on the operator.

[0005] This invention has been made in consideration of the above-mentioned problems, and aims to make it possible to determine the placement of support members that can firmly support a board against the force applied to the board when mounting components in the component mounting area of ​​the board, without placing any burden on the worker. [Means for solving the problem]

[0006] The support member placement determination device of the present invention includes a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite the first surface, the component mounting area being provided as an area for mounting components, and a placement determination unit that determines the placement of a support member that supports the board by abutting the second surface from below with the first surface facing upward, based on the component mounting area.

[0007] The support member placement determination method of the present invention includes a step in which a data acquisition unit acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite the first surface, the component mounting area being set up as an area for mounting components, and a step in which a placement determination unit determines, based on the component mounting area, the placement of a support member that supports the board by abutting against the second surface from below with the first surface facing upward.

[0008] A support member placement determination program according to the present invention includes a data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being provided as an area for mounting components; and a placement determination unit that determines, based on the component mounting area, the placement of a support member that supports the board by abutting against the second surface from below with the first surface facing upward. The computer functions as a support member placement determination device comprising:

[0009] A recording medium according to the present invention records the support member placement determination program in a computer-readable manner.

[0010] In the inventions (support member placement determination device, support member placement determination method, support member placement determination program, and recording medium) configured as described above, the board has a first surface and a second surface opposite to the first surface. Then, board configuration information indicating a component mounting area on the first surface of the board, which is provided as an area for mounting components, is acquired by a data acquisition unit. Furthermore, the placement determination unit determines the placement of support members that support the board by abutting the second surface from below with the first surface facing upward, based on the component mounting area. In other words, the placement of support members that support the board is determined without the help of an operator, based on the component mounting area on the first surface of the board where components are to be mounted. Therefore, it is possible to determine the placement of support members that can firmly support the board against the force applied to the board when components are mounted in the component mounting area of ​​the board, without imposing any burden on the operator.

[0011] The support member placement determination device may be configured so that the board configuration information indicates component sizes that are the sizes of components to be mounted in the component mounting areas, and the placement determination unit determines the placement of the support members based on the component mounting areas and the component sizes. With this configuration, the board can be firmly supported by support members whose placements are determined based on the sizes of the components to be mounted in the component mounting areas of the board.

[0012] The support member placement determination device may be configured so that the placement determination unit determines to place the support member so that the support member abuts against the second surface at a large support position facing a component mounting area where a component larger than a predetermined standard is mounted. With this configuration, the support member can firmly support the board against the force applied to the board when a large component is mounted on the board.

[0013] The support member placement determination device may also be configured so that the large support position is a position facing the center of the component mounting area where a component larger than a predetermined size is mounted, thereby enabling the support member to more firmly support the board against the force applied to the board when the large component is mounted on the board.

[0014] The support member placement determination device may also be configured so that the placement determination unit virtually divides the second surface into a plurality of grids and determines to place the support members so that they abut against the second surface at small support positions inside the grids that overlap with component mounting areas where components whose component sizes are equal to or smaller than a predetermined standard are to be mounted. With this configuration, the support members can firmly support the board against forces applied to the board when small components are mounted on the board.

[0015] The support member placement determination device may also be configured so that the small support positions are located opposite the centers of grids that overlap with component mounting areas where components whose component sizes are equal to or smaller than a predetermined standard are mounted. This allows the support members to more firmly support the board against forces applied to the board when small components are mounted on the board.

[0016] The support member placement determination device may also be configured so that the small support positions are positions inside a grid that overlaps with the center of a component mounting area where components whose size is equal to or smaller than a predetermined standard are mounted. This allows the support members to more firmly support the board against forces applied to the board when small components are mounted on the board.

[0017] The support member placement determination device may also be configured so that the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions where the support members that abut against the second surface at the candidate positions are spaced apart from both the support members that abut against the second surface at the large support positions and the support members that abut against the second surface at the small support positions, and determines to place the support members so that they abut against the second surface at the target position. This makes it possible to place additional support members while preventing interference with support members placed according to component mounting areas where large or small components are mounted, and enables the board to be firmly supported by a large number of support members.

[0018] The support member placement determination device may also be configured so that the board configuration information indicates a boundary area including a slit provided in the board or a dividing line for dividing the board, and the placement determination unit virtually divides the second surface into a plurality of ranges based on the boundary area, and performs a placement determination process for each of the plurality of ranges to determine the placement of a support member that abuts on the second surface at a position facing one target range of the plurality of ranges in accordance with a component mounting area within the target range. With this configuration, the placement of the support member for each range divided by a boundary area such as a slit or a dividing line can be determined based on the component mounting area within the range, and each range divided by the boundary area can be firmly supported by the support member.

[0019] The support member placement determination device may be configured so that the placement determination unit determines representative positions that represent the positions of each of the component mounting areas within the target range, and determines to place the support members so that the support members abut against the second surface at representative support positions that face the representative positions. With this configuration, the board can be firmly supported by the support members at the representative support positions that face the representative positions that represent the positions of the component mounting areas in each range divided by the boundary areas.

[0020] The support member placement determination device may be configured so that the board configuration information includes component volumes, which are the volumes of components to be mounted in the component mounting areas, and the placement determination unit determines representative support positions based on the component mounting areas and the component volumes. With this configuration, the board can be firmly supported by the support members at representative support positions that reflect the component volumes.

[0021] The support member placement determination device may be configured so that the board configuration information includes component weights, which are the weights of the components to be mounted in the component mounting areas, and the placement determination unit determines the representative support positions based on the component mounting areas and the component weights. With this configuration, the board can be firmly supported by the support members at the representative support positions that reflect the component weights.

[0022] The support member placement determination device may also be configured so that the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions where the support members abutting the second surface at the candidate positions are spaced apart from the support members abutting the second surface at the representative support positions, and determines to place the support members so that the support members abut the second surface at the target position. This makes it possible to place further support members while preventing interference with the support members supporting the substrate at the representative support positions, and enables the substrate to be firmly supported by a large number of support members.

[0023] The support member placement determination device may be configured so that the board configuration information indicates support prohibited areas including slits in the board, dividing lines for dividing the board, or component presence areas on the second surface where components are mounted, and the placement determination unit determines not to place support members in positions opposite the support prohibited areas. With this configuration, it is possible to prevent support members from being placed in support prohibited areas such as slits and dividing lines on the board.

[0024] The support member placement determination device may be configured so that the placement determination unit sets a temporary placement position where the support member abutting the second surface is to be placed based on the component mounting area, and if the temporary placement position does not overlap the support prohibited area, determines to place the support member at the temporary placement position, but if the temporary placement position overlaps the support prohibited area, determines to place the support member at a position that has a predetermined positional relationship with the temporary placement position among areas separated from the support prohibited area. With this configuration, the support member can be placed near the support prohibited area while avoiding support prohibited areas such as slits and parting lines on the board, so that the board can be firmly supported by the support member. [Effects of the Invention]

[0025] As described above, according to the present invention, it is possible to determine the placement of support members that can firmly support the board against the force applied to the board when mounting components in the component mounting area of ​​the board, without placing any burden on the worker. [Brief explanation of the drawings]

[0026] [Figure 1] FIG. 1 is a partial plan view schematically showing a component mounter according to the present invention. [Figure 2] FIG. 2 is a front view schematically showing a part of the component mounter of FIG. [Figure 3] FIG. 2 is a block diagram showing an example of a component mounting system including the component mounter of FIG. 1. [Figure 4] FIG. 4 is a perspective view schematically showing the contents indicated by board configuration information. [Figure 5] 10 is a flowchart showing a first example of pin placement determination. [Figure 6A] FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5; [Figure 6B] FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5; [Figure 6C] FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5; [Figure 6D]FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5; [Figure 6E] FIG. 6 is a plan view schematically showing the contents of calculations executed in the first example of pin placement determination in FIG. 5; [Figure 7] 10 is a flowchart showing a second example of pin placement determination. [Figure 8A] FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7; [Figure 8B] FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7; [Figure 8C] FIG. 8 is a plan view schematically showing the contents of calculations executed in the second example of pin placement determination in FIG. 7; [Figure 9] 10 is a flowchart showing an example of a prohibited area evacuation arrangement. [Figure 10] FIG. 10 is a plan view schematically showing the contents of the calculation executed in the prohibited area save arrangement of FIG. 9; DETAILED DESCRIPTION OF THE INVENTION

[0027] Fig. 1 is a partial plan view that schematically shows a component mounter according to the present invention, and Fig. 2 is a front view that schematically shows a part of the component mounter of Fig. 1. In Fig. 1 and the following figures, the X direction, which is the horizontal direction, the Y direction, which is the horizontal direction perpendicular to the X direction, and the Z direction, which is the vertical direction, are indicated as appropriate.

[0028] As shown in Fig. 1, the component mounter 1 includes a pair of conveyors 12, 12 provided on a base 11. Each conveyor 12 is configured with a belt conveyor arranged parallel to the X direction, and transports a board 9 in the X direction. Specifically, the component mounter 1 mounts components on a board 9 that has been transported by the conveyor 12 from the upstream side in the X direction (board transport direction) to a work position P (the position of the board 9 in Fig. 1), and then transports the board 9, on which component mounting has been completed, from the work position P to the downstream side in the X direction by the conveyor 12.

[0029] Two component supply units 25 are lined up in the X direction on each side of the pair of conveyors 12, 12 in the Y direction, and multiple tape feeders 26 are lined up in the X direction in each component supply unit 25. A component supply reel is arranged for each tape feeder 26, around which a component storage tape is wound, which stores small pieces of components E such as integrated circuits, transistors, capacitors, etc. at a predetermined pitch, and each tape feeder 26 intermittently feeds out the component storage tape pulled out from the component supply reel, thereby supplying components E to the component supply position at the tip of the tape.

[0030] The component mounter 1 is also provided with a pair of Y-axis rails 21, 21 extending in the Y direction, a Y-axis ball screw 22 extending in the Y direction, and a Y-axis motor My that rotates and drives the Y-axis ball screw 22, and an X-axis rail 23 is supported on the pair of Y-axis rails 21, 21 so as to be movable in the Y direction and is fixed to the nut of the Y-axis ball screw 22. An X-axis ball screw 24 extending in the X direction and an X-axis motor Mx that rotates and drives the X-axis ball screw 24 are attached to the X-axis rail 23, and the head unit 3 is supported on the X-axis rail 23 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 24. Therefore, the Y-axis motor My can rotate the Y-axis ball screw 22 to move the head unit 3 in the Y direction, or the X-axis motor Mx can rotate the X-axis ball screw 24 to move the head unit 3 in the X direction.

[0031] The head unit 3 has multiple (six) mounting heads 31 lined up in the X direction. Furthermore, the head unit 3 has a Z-axis motor (not shown) for each mounting head 31 that raises and lowers the mounting head 31. Each mounting head 31 has an elongated shape that extends in the Z direction (vertical direction), and has a detachable nozzle at its bottom end for suctioning components. Then, component mounting is performed by the mounting head 31 as follows.

[0032] That is, the X-axis motor Mx and the Y-axis motor My position the nozzle of the mounting head 31 to face the component E supplied to the component supply position from above. Next, the Z-axis motor lowers the mounting head 31 so that the nozzle comes into contact with the component E supplied to the component supply position by the tape feeder 26. Then, the mounting head 31 applies negative pressure to the nozzle to adsorb the component E to the nozzle, and the Z-axis motor raises the mounting head 31. Once the mounting head 31 has completed picking up the component E from the component supply position in this way, the X-axis motor Mx and the Y-axis motor My move the mounting head 31 above the board 9. Then, the Z-axis motor lowers the mounting head 31 so that the component E adsorbed by the nozzle of the mounting head 31 comes into contact with the upper surface of the board 9. Next, the mounting head 31 releases the adsorption of the component E and mounts the component E on the board 9.

[0033] When the mounting head 31 brings the component E into contact with the board 9, a force is applied to the board 9 in the component mounting area where the component E and the board 9 come into contact. Therefore, the component mounter 1 uses backup pins 4 to support the board 9 from below against the force applied to the component mounting area. Specifically, as shown in FIG. 2 , the board 9 has a work surface 91 and a non-work surface 92 opposite the work surface 91. The board 9 is supported at the work position P by the conveyor 12 with the work surface 91 facing upward and the non-work surface 92 facing downward. Meanwhile, the component mounter 1 includes a pin arrangement table 27 below the board 9 supported at the work position P. The pin arrangement surface 271 (upper surface) of the pin arrangement table 27 faces the board 9 from below. The backup pins 4 are arranged on the pin arrangement surface 271 of the pin arrangement table 27, and are supported on the pin arrangement surface 271 by, for example, magnetic force. The upper ends 41 of the backup pins 4 arranged on the pin arrangement surface 271 thus come into contact with the non-work surface 92 of the board 9 from below, thereby supporting the board 9. The mounting head 31 mounts the component E on the work surface 91 of the board 9 supported by the backup pins 4 in the above-described procedure.

[0034] The component mounter 1 also includes a pin stocker 28 that stores the backup pins 4. The mounting head 31 transfers the backup pins 4 picked up from the pin stocker 28 onto the pin arrangement surface 271, thereby arranging the backup pins 4 on the pin arrangement surface 271, while the mounting head 31 transfers the backup pins 4 picked up from the pin arrangement surface 271 onto the pin stocker 28, thereby recovering the backup pins 4 in the pin stocker 28. Note that the mounting head 31 may hold the backup pins 4 not by suction with a nozzle, but by gripping them with a suction chuck that opens and closes by pressure (negative pressure or atmospheric pressure). Alternatively, the backup pins 4 may be manually placed on the pin arrangement surface 271 by an operator.

[0035] FIG. 3 is a block diagram showing an example of a component mounting system including the component mounter of FIG. 1. The component mounting system S includes the component mounter 1 described above and a server computer 7 that controls the component mounter 1. The component mounter 1 also includes a control unit 51 and a communication unit 52. The control unit 51 is, for example, a processor, and controls the driving of the mounting head 31 by the X-axis motor Mx, the Y-axis motor My, and the Z-axis motor described above, while controlling the pressure (negative pressure and atmospheric pressure) generated in the nozzle of the mounting head 31, thereby mounting the component E on the board 9 and transferring the backup pins 4. In particular, the control unit 51 acquires board data from the server computer 7 that indicates a procedure for mounting the component E in the component mounting area R of the board 9 in the component mounter 1, and controls these in accordance with the board data to mount the component E on the board 9. The communication unit 52 also communicates with the server computer 7.

[0036] The server computer 7 includes a calculation unit 71, a communication unit 72, a UI (User Interface) 73, and a storage unit 74. The calculation unit 71 is, for example, a processor, and performs calculations for determining the placement of the backup pins 4 (described later). The communication unit 72 communicates with the communication unit 52 of the mounter 1. This communication may be performed wirelessly or via a wired connection. The UI 73 includes input devices such as a keyboard and a mouse, and an output device such as a display. The input and output devices do not need to be configured separately; they may be integrated into a single device, such as a touch panel display. The storage unit 74 is configured as a storage device such as an HDD (Hard Disk Drive) or an SSD (Solid State Drive), and stores a placement determination program 81 and board configuration information 82 (described later). The placement determination program 81 is supplied to the server computer 7 by a storage medium RM separate from the server computer 7. The storage medium RM stores the placement determination program 81 so that it can be read by the server computer 7. It may be, for example, a universal serial bus (USB) memory or a storage device installed in another computer. The server computer 7 stores the placement determination program 81 read from the recording medium RM in the storage unit 74 .

[0037] FIG. 4 is a perspective view schematically illustrating the contents of the board configuration information. As shown in FIG. 4, a component mounting area R in which a component E is to be mounted is provided on the work surface 91 of the board 9. The component E to be mounted in the component mounting area R has a height Eh in the height direction Dh (Z direction), a length El in the length direction Dl perpendicular to the height direction Dh, and a width Ew in the width direction Dw perpendicular to the height direction Dh and the length direction Dl. The component mounting area R is defined, for example, by lands to which the electrodes of the component E are bonded, and has a length Rl and a width Rw equal to the length El and width Ew, respectively, of the component E. In other words, the component mounting area R is an area that overlaps the component E to be mounted at the position of the component mounting area R in a plan view. In contrast, the board configuration information 82 indicates the component mounting area R provided on the work surface 91 of the board 9 and the dimensions (height Eh, length El, and width Ew) of the component E to be mounted in the component mounting area R. The board configuration information 82 does not necessarily need to indicate all of the height Eh, length El, and width Ew, but may selectively indicate values ​​required for determining the pin placement described below. There are also variations in the manner in which the board configuration information 82 indicates the component mounting area R. For example, the board configuration information 82 may indicate the position (X and Y coordinates indicating the center position of the component mounting area R) and dimensions (length Rl and width Rw) of the component mounting area R in a planar view, or it may indicate only the former of these, the position of the component mounting area R.

[0038] Such board configuration information 82 can be acquired by various methods and stored in the storage unit 74. For example, the calculation unit 71 can determine the board configuration information 82 based on the board data described above. The calculation unit 71 may also determine the board configuration information 82 based on an image of the work surface 91 of the board 9. This image can be captured by various imaging devices, such as a camera provided in the component mounter 1 or a camera provided in an inspection device that inspects the board 9. Alternatively, the calculation unit 71 may determine the board configuration information 82 based on data (Gerber data) that indicates the configuration of the board 9 in Gerber format.

[0039] The placement determination program 81 defines a calculation for determining the placement of the backup pins 4 that support the board 9 based on the board configuration information 82. That is, by executing the placement determination program 81, the calculation unit 71 determines the placement of the backup pins 4 in accordance with the pin placement determination described next.

[0040] Fig. 5 is a flowchart showing a first example of pin placement determination, and Figs. 6A to 6E are plan views schematically showing the content of the calculations executed in the first example of pin placement determination of Fig. 5. As shown in Figs. 6A to 6E, a slit SL is provided in the board 9, penetrating between the work surface 91 and the non-work surface 92, and the slit SL has a rectangular shape extending parallel to the Y direction. In order to determine the placement of the backup pins 4 for such a board 9, the steps of Fig. 5 are executed by the calculation unit 71.

[0041] In step S101, each component mounting area R indicated by the board configuration information 82 is sorted in descending order of the size of the component E to be mounted in the component mounting area R. For example, the area (the area of ​​the top surface of component E) calculated by multiplying the length El of component E by the width Ew can be used as the size of component E. However, the volume of component E (the product of the length El, width Ew, and height Eh) may also be used as the size of component E. Then, a variable Ia indicating the sorting order of component mounting areas R is reset to zero (step S102), and variable Ia is incremented by 1 (step S103).

[0042] In step S104, it is determined whether the component E to be mounted in the Ia-th component mounting area R (Ia) is a large component. Here, a component E whose area is larger than a predetermined threshold area is determined to be a large component, and a component E whose area is equal to or smaller than the threshold area is determined to be a small component (i.e., not a large component). However, if the volume of the component E is used as the size of the component E, a component E whose volume is larger than the threshold volume should be determined to be a large component, and a component E whose volume is equal to or smaller than the threshold volume should be determined to be a small component. If the component E to be mounted in the Ia-th component mounting area R (Ia) is a large component (if "YES" in step S104), it is determined that the backup pin 4 should be placed in a position where the upper end 41 of the backup pin 4 faces the center (geometric center of gravity) of the component mounting area R (Ia) in the Z direction (step S105).

[0043] In this way, steps S103 to S105 are executed in descending order of the size of the component E to be mounted. When steps S103 to S105 are executed for all large components, it is determined that the backup pin 4 is to be placed at the center of each of the component mounting areas R(1) to R(6) where the large components are to be mounted, as shown in Fig. 6A. Note that although Fig. 6A shows the backup pin 4, the pin placement determination in Fig. 5 only determines the position where the backup pin 4 is to be placed, and does not actually place the backup pin 4. The same applies to the notations in Figs. 6B to 6E shown below and other similar drawings.

[0044] Furthermore, once steps S103 to S105 have been executed for all large components, a "NO" determination is made in step S104, and the process proceeds to step S106, where the placement of backup pins 4 for small components is determined. In step S106, the non-work surface 92 is virtually divided into a plurality of lattices L (FIG. 6B). These lattices L are arranged at a pitch Plx in the X direction and at a pitch Ply in the Y direction; that is, the plurality of lattices L are arranged two-dimensionally in the X and Y directions. Note that in FIG. 6B, each lattice L virtually provided on the non-work surface 92 is shown with the work surface 91 visible through it. In step S107, a variable Ib for identifying each lattice L is reset to zero, and in step S108, the variable Ib is incremented by one.

[0045] In step S109, it is determined whether the lattice L(Ib) overlaps the center of the component mounting area R in a plan view, thereby determining whether a component E (small component) is to be mounted in the lattice L(Ib). For example, in FIG. 6B , the center of the component mounting area R does not overlap with the lattice L(Ib1), while the centers of the component mounting areas R(7) and R(8) overlap with the lattice L(Ib2). Similarly, the center of the component mounting area R does not overlap with the lattice L(Ib3), while the centers of the component mounting areas R(9) and R(10) overlap with the lattice L(Ib4). If the lattice L(Ib) overlaps with the center of the component mounting area R and it is determined that a small component is to be mounted in the lattice L(Ib) (if "YES" in step S109), it is determined that the backup pin 4 is to be disposed in a position where the upper end 41 of the backup pin 4 faces the center of the lattice L(Ib) in the Z direction (step S110).

[0046] On the other hand, if the lattice L(Ib) does not overlap the center of the component mounting area R (step S109: NO), it is determined whether the variable Ib has reached the number Ibx of lattices L (step S111). Then, steps S108 to S110 are executed until the variable Ib reaches the number Ibx. When steps S108 to S110 are executed for all small components, as a result, it is determined that the backup pin 4 is to be placed at a position facing, in the Z direction, the center of the lattices L(Ib2) and L(Ib4) that overlap the centers of the component mounting areas R(7), R(8), R(9), and R(10) where the small components are to be mounted, as shown in FIG.

[0047] If the variable Ib has reached the number Ibx of lattices L (YES in step S111), the process proceeds to step S112. In step S112, a plurality of candidate positions C are virtually set on the non-work surface 92 (FIG. 6D). These candidate positions C are positions that are candidates for arranging the backup pins 4, and correspond to the positions occupied by the backup pins 4 arranged at the candidate positions C. These candidate positions C are arranged at a pitch Pcx in the X direction and at a pitch Pcy in the Y direction. In other words, the plurality of candidate positions C are arranged two-dimensionally in the X and Y directions. Here, the pitch Pcx at which the candidate positions C are arranged in the X direction is wider than the pitch Plx at which the lattices L are arranged, and the pitch Pcy at which the candidate positions C are arranged in the Y direction is wider than the pitch Ply at which the lattices L are arranged. However, the magnitude relationship between these pitches may differ from this example. 6D, each candidate position C virtually set on the non-work surface 92 is shown through the work surface 91. In step S113, a variable Ic for identifying each candidate position C is reset to zero, and in step S114, the variable Ic is incremented by one.

[0048] Then, in step S115, assuming that the backup pin 4 is placed so that its upper end 41 abuts against candidate position C, it is determined whether the backup pin 4 placed at the position previously determined in steps S105 and S110 will be separated from the backup pin 4 abutting against candidate position C. For example, in FIG. 6D , the backup pin 4 abutting against candidate position C (Ic1) is separated from all of the other backup pins 4 to be placed according to the determination in steps S105 and S110, while the backup pin 4 abutting against candidate position C (Ic2) interferes with the other backup pins 4 placed according to the determination in step S105 or S110 without being separated. Then, if the backup pin 4 abutting against candidate position C (Ic) is separated from the backup pin 4 placed at the previously determined position (if "YES" in step S115), it is determined that the backup pin 4 will be placed at a position abutting the candidate position C (Ic) (step S116).

[0049] On the other hand, if the backup pin 4 abutting on the candidate position C (Ic) interferes with the backup pin 4 to be placed at the previously determined position (if "NO" in step S115), it is determined whether the variable Ic has reached the number Icx of candidate positions C (step S117). That is, in this case, the backup pin 4 is not placed at the candidate position C (Ic). Then, as a result of executing steps S114 to S116 until the variable Ic reaches the number Icx, it is determined that the backup pin 4 is to be selectively placed at the candidate position C that is separated from the other backup pins 4 to be placed, among the multiple candidate positions C, in plan view, as shown in FIG. 6E.

[0050] In the embodiment described above, the board 9 has a work surface 91 (first surface) and a non-work surface 92 (second surface) opposite the work surface 91. The calculation unit 71 (data acquisition unit) acquires board configuration information 82 indicating a component mounting area R, which is provided as an area for mounting components E, on the work surface 91 of the board 9. Furthermore, the calculation unit 71 (arrangement determination unit) determines the arrangement of backup pins 4 (support members) that support the board 9 by abutting the non-work surface 92 from below with the work surface 91 facing upward, based on the component mounting area R (steps S101 to S111). In other words, the arrangement of the backup pins 4 that support the board 9 is determined without the operator's intervention, based on the component mounting area R on the work surface 91 of the board 9 where the components E are to be mounted. Therefore, it is possible to determine the arrangement of backup pins 4 that can firmly support the board 9 against the force applied to the board 9 when mounting components E in the component mounting area R of the board 9, without imposing any burden on the operator.

[0051] Furthermore, the board configuration information 82 indicates the length El and width Ew (component size) of the component E to be mounted in the component mounting area R, and the calculation unit 71 determines the placement of the backup pins 4 based on the component mounting area R and the length El and width Ew of the component E (steps S104, S105, S109, S110). With this configuration, the board 9 can be firmly supported by the backup pins 4 whose placement is determined based on the length El and width Ew of the component E to be mounted in the component mounting area R of the board 9.

[0052] Furthermore, the calculation unit 71 determines to place the backup pin 4 so that the backup pin 4 abuts against the non-work surface 92 at a position (large support position) facing the component mounting region R where a component E is mounted, the area (component size) of which is given by the product of the length El and the width Ew and is larger than a threshold area (predetermined standard) (steps S104, S105). With this configuration, the backup pin 4 can firmly support the board 9 against the force applied to the board 9 when the large component E is mounted on the board 9.

[0053] Furthermore, a position facing the center of the component mounting area R where a component E (large component) having an area larger than the threshold area is to be mounted is determined as a position (large support position) where the component mounting area R is supported by the backup pins 4 (steps S104, S105). This allows the backup pins 4 to more firmly support the substrate 9 against the force applied to the substrate 9 when the large component E is mounted on the substrate 9.

[0054] Furthermore, the calculation unit 71 virtually divides the non-work surface 92 into a plurality of grids L, and determines to place the backup pins 4 so that they abut against the non-work surface 92 at positions (small support positions) inside the grids L that overlap with the component mounting region R where the component E having an area equal to or smaller than the threshold area will be mounted (steps S109, S110). With this configuration, the backup pins 4 can firmly support the board 9 against the force applied to the board 9 when the small component E is mounted on the board 9.

[0055] Furthermore, a position facing the center of the lattice L that overlaps with the component mounting area R where the component E having an area equal to or smaller than the threshold area is mounted is determined as a position (small support position) where the backup pin 4 supports the component mounting area R (step S110). This allows the backup pin 4 to more firmly support the substrate 9 against the force applied to the substrate 9 when the small component E is mounted on the substrate 9.

[0056] Furthermore, a position inside the grid L that overlaps the center of the component mounting area R where the component E having an area equal to or smaller than the threshold area is mounted is determined as a position (small support position) where the backup pin 4 supports the component mounting area R (step S110). This allows the backup pin 4 to more firmly support the board 9 against the force applied to the board 9 when the small component E is mounted on the board 9.

[0057] The calculation unit 71 also sets a plurality of candidate positions C, which are two-dimensionally arranged at a predetermined pitch, on the non-work surface 92 (step S112). Furthermore, the calculation unit 71 selects, from the plurality of candidate positions C, a candidate position C (target position) at which the backup pin 4 abutting against the non-work surface 92 at candidate position C is spaced apart from both the backup pin 4 abutting against the non-work surface 92 at the large support position and the backup pin 4 abutting against the non-work surface 92 at the small support position (steps S114 and S115). The calculation unit 71 then determines to place the backup pin 4 so that it abuts against the non-work surface 92 at the selected candidate position C (step S116). This allows the backup pin 4 to be placed while preventing interference with the backup pin 4 placed according to the component mounting region R where the large or small component E is mounted, and the board 9 can be firmly supported by a large number of backup pins 4.

[0058] Fig. 7 is a flowchart showing a second example of pin placement determination, and Figs. 8A to 8C are plan views schematically showing the content of the calculations executed in the second example of pin placement determination in Fig. 7. Each step in Fig. 7 is executed by a calculation unit 71. The following explanation will focus on differences from the first example, and points in common with the first example will be denoted by the corresponding reference numerals and explanations thereof will be omitted where appropriate.

[0059] In step S201, the calculation unit 71 virtually divides the non-work surface 92 into multiple (two) ranges A(1) and A(2), using the slit SL (boundary region) extending in the Y direction as a boundary. This divides the non-work surface 92 of the board 9 into range A(1) on one side of the slit SL and range A(2) on the other side in the X direction (the direction perpendicular to the extension direction of the slit SL). In step S202, a variable Id for identifying each range A is reset to zero, and in step S203, the variable Id is incremented by 1.

[0060] In step S204, a representative position of a plurality of component mounting regions R included in the target range A(Id) is calculated. Here, the volume-based center of gravity position Gv given by the following equation 1 is obtained as the representative position.

[0061]

number

[0062] In Equation 1, n is a variable that identifies the component mounting area R included in the target range A(Id), and if the range A(Id) includes five component mounting areas R, n is an integer between 1 and 5. n is the X coordinate of the n-th component mounting area R, and y n is the Y coordinate of the nth component mounting area R, and V n is the volume of component E to be mounted in the n-th component mounting area R. In this example, the board configuration information 82 indicates the volume V of component E to be mounted in each component mounting area R. Note that the board configuration information 82 may include a value that directly indicates the volume V of component E, or may include values ​​that indirectly indicate the volume V of component E (length El, width Ew, height Eh, etc.). Also, Σ indicates taking the sum over n. Using this equation 1, the X and Y coordinates of the volume-based center of gravity position Gv are calculated (step S204).

[0063] Then, in step S205, it is determined that the backup pin 4 is to be placed so that the backup pin 4 abuts against the non-work target surface 92 at a representative support position Pg that faces the volume reference center of gravity position Gv from the Z direction. In other words, as shown in FIG. 8A , it is determined that the backup pin 4 is to be placed at the representative support position Pg that is found for the target range A(1) among the multiple ranges A.

[0064] In subsequent steps S112 to S117, similarly to the first example described above, it is determined that the backup pin 4 is to be placed at candidate position C, which is spaced apart from the backup pin 4 that is placed at the position previously determined in step S205. Note that in the first example, the entire non-work surface 92 is the target, but in the second example, range A (Id) of the non-work surface 92 is the target. In other words, the placement of the backup pin 4 that supports the board 9 in range A (Id) is determined. As a result, it is determined that the backup pin 4 is to be placed at candidate position C, which is spaced apart from the backup pin 4 that is placed at the representative support position Pg, as shown in FIG. 8B.

[0065] In step S206, it is determined whether the variable Id has reached the number Idx of ranges A. If the variable Id is less than the number Idx, the process returns to step S203, and steps S203 to S205, S112 to S117, and S206 are repeated. As a result, as shown in Fig. 8C, for each of the multiple ranges A, it is determined that a backup pin 4 is to be placed at a representative support position Pg that faces the volume reference center of gravity position Gv (steps S204 to S205), and it is further determined that a backup pin 4 is to be placed at a candidate position C that is spaced apart from the backup pin 4 placed at the representative support position Pg.

[0066] In the embodiment described above, the calculation unit 71 (data acquisition unit) acquires board configuration information 82 indicating a component mounting area R, which is provided as an area for mounting a component E, on the work target surface 91 of the board 9. Furthermore, the calculation unit 71 (arrangement determination unit) determines the arrangement of backup pins 4 (support members) that support the board 9 by abutting against the non-work target surface 92 from below while the work target surface 91 is facing upward, based on the component mounting area R (steps S201 to S205, S206). In other words, the arrangement of the backup pins 4 that support the board 9 is determined without the operator's intervention, based on the component mounting area R on the work target surface 91 of the board 9 where the component E is to be mounted. Therefore, it is possible to determine the arrangement of backup pins 4 that can firmly support the board 9 against the force applied to the board 9 when mounting the component E in the component mounting area R of the board 9, without imposing any burden on the operator.

[0067] Furthermore, the board configuration information 82 indicates slits SL (boundary areas) provided in the board 9. In response to this, the calculation unit 71 (placement determination unit) virtually divides the non-work surface 92 into multiple ranges A based on the slits SL, and executes placement determination processing (steps S204 to S205) for each of the multiple ranges A. The placement determination processing determines the placement of backup pins 4 that abut on the non-work surface 92 at a position facing one target range A (Id) of the multiple ranges A in accordance with the component mounting area R within the target range A (Id). With this configuration, the placement of the backup pins 4 for each range A divided by the slits SL can be determined based on the component mounting area R within that range A, and each range A divided by the slits SL can be firmly supported by the backup pins 4.

[0068] Furthermore, the calculation unit 71 determines a volume-based center of gravity position Gv (representative position) that represents the position of each component mounting area R within the target range A (Id), and determines to place the backup pin 4 so that the backup pin 4 abuts on the non-work target surface 92 at a representative support position Pg that faces the volume-based center of gravity position Gv (steps S204 to S205). With this configuration, the board 9 can be firmly supported by the backup pin 4 at the representative support position Pg that faces the volume-based center of gravity position Gv that represents the position of the component mounting area R in each range A divided by the slit SL.

[0069] Furthermore, the board configuration information 82 includes the volume V (component volume) of the component E to be mounted in the component mounting area R. In response to this, the calculation unit 71 determines the representative support position Pg based on the component mounting area R and the volume V of the component E (step S205). With this configuration, the board 9 can be firmly supported by the backup pins 4 at the representative support position Pg that reflects the volume V of the component E.

[0070] The calculation unit 71 also sets a plurality of two-dimensionally arranged candidate positions C on the non-work surface 92 (step S112). Furthermore, the calculation unit 71 selects a candidate position C (target position) from the plurality of candidate positions C at which the backup pin 4 abutting on the non-work surface 92 at the candidate position C is spaced apart from the backup pin 4 abutting on the non-work surface 92 at the representative support position Pg (steps S114, S115). The calculation unit 71 then determines to place the backup pin 4 so that it abuts on the non-work surface 92 at the selected candidate position C (step S116). This makes it possible to place additional backup pins 4 while preventing interference with the backup pins 4 supporting the board 9 at the representative support position Pg, and the board 9 can be firmly supported by a large number of backup pins 4.

[0071] The above embodiment is based on the premise that no component E exists on the non-work surface 92 (i.e., it is not mounted). However, the above embodiment can be similarly implemented even when a component E exists on the non-work surface 92 (i.e., it is mounted). In particular, by using the prohibited area avoidance arrangement described below in combination, it is possible to determine the arrangement of the backup pins 4 while avoiding interference between the component E present on the non-work surface 92 and the backup pins 4. Furthermore, it is also possible to determine the arrangement of the backup pins 4 so as to avoid slits SL, parting lines, etc. on the board 9.

[0072] FIG. 9 is a flowchart illustrating an example of the prohibited area relocation, and FIG. 10 is a plan view schematically illustrating the contents of the calculation executed in the prohibited area relocation of FIG. 9 . Note that in FIG. 10 , component E mounted on the non-work surface 92 of the board 9 is shown in a perspective view through the work surface 91 of the board 9. Each step in FIG. 9 is executed by the calculation unit 71. The prohibited area relocation of FIG. 9 can be executed in place of the above calculation, for example, in steps S105 and S110 of the first example of pin placement determination of FIG. 5 or in step S205 of the second example of pin placement determination of FIG. 7 . Furthermore, to enable the prohibited area relocation of FIG. 9 to be executed, the board configuration information 82 indicates a support prohibited area Rp on the non-work surface 92 of the board 9 where support by the backup pins 4 is prohibited. As shown in FIG. 10 , the range of the non-work surface 92 where component E exists and the range of the slit SL correspond to the support prohibited area Rp.

[0073] In step S301, a temporary placement position Pp is set based on the component mounting area R indicated by the board configuration information 82. For example, in the first example of pin placement determination, when prohibited area avoidance placement is performed in step S105, the temporary placement position Pp is set to a position facing, from the Z direction, the center of the component mounting area R (Ia) where the large component is to be mounted, and when prohibited area avoidance placement is performed in step S110, the temporary placement position Pp is set to a position facing, from the Z direction, the center of the grid L (Ib) where the small component is to be mounted. Also, in the second example of pin placement determination, when prohibited area avoidance placement is performed in step S205, the temporary placement position Pp is set to a position facing, from the Z direction, the representative position (volume-based center of gravity position Gv) of range A (Id).

[0074] In step S302, it is determined whether the temporary placement position Pp overlaps the support prohibition region Rp. If the temporary placement position Pp does not overlap the support prohibition region Rp ("NO" in step S302), it is determined that the backup pin 4 is placed at the temporary placement position Pp (step S303).

[0075] On the other hand, if the temporary placement position Pp overlaps the support prohibition region Rp (if "YES" in step S302), a retreat position Pe is searched for around the temporary placement position Pp (step S304). For example, a calculation is performed to confirm whether a position a predetermined distance away from the temporary placement position Pp in a predetermined direction (e.g., the X direction) is separated from the support prohibition region Rp. This calculation is repeated while gradually increasing the predetermined distance, and the first position confirmed to be separated from the support prohibition region Rp can be determined as the retreat position Pe. Note that the predetermined direction in this case is not limited to the X direction, but may also be the Y direction, or a direction inclined relative to the X and Y directions. In this way, when the retreat position Pe is searched for, for example, as shown in FIG. 10, it is determined that the backup pin 4 is to be placed at the retreat position Pe (step S305). This prevents the backup pin 4 from being placed at a position facing the support prohibition region Rp.

[0076] 9 can be similarly executed in place of the above calculation in, for example, step S116 of the first example of pin placement determination in Fig. 5 or step S116 of the second example of pin placement determination in Fig. 7. In this case, in step S301, the candidate position C(Ic) is set as the temporary placement position Pp. Then, steps S302 to S305 are executed in the same manner as described above to determine the placement of the backup pin 4.

[0077] In the embodiment described above, the board configuration information 82 indicates support prohibited areas Rp that correspond to the slits SL provided in the board 9 and the areas (component presence areas) on the non-work surface 92 where the components E are mounted. In response to this, the calculation unit 71 (placement determination unit) determines that the backup pins 4 will not be placed in positions facing the support prohibited areas Rp (steps S302, 304, S305). With this configuration, it is possible to prevent the backup pins 4 from being placed in the support prohibited areas Rp, such as the slits SL on the board 9 or the areas on the non-work surface 92 where the components E are mounted.

[0078] The calculation unit 71 also sets a temporary placement position Pp, at which the backup pin 4 that will contact the non-work surface 92 is to be placed, based on the component mounting area R (step S301). If the temporary placement position Pp does not overlap the support prohibition area Rp, the calculation unit 71 determines to place the backup pin 4 at the temporary placement position Pp (steps S302 and S303). On the other hand, if the temporary placement position Pp overlaps the support prohibition area Rp, the calculation unit 71 determines to place the backup pin 4 at a position that has a predetermined positional relationship with the temporary placement position Pp within an area away from the support prohibition area Rp (i.e., a position that only moves away from the support prohibition area Rp after being moved away from the temporary placement position Pp in a stepwise manner in a predetermined direction in a plan view) (steps S302, S304, and S305). In this configuration, the backup pins 4 are placed near the support prohibition areas Rp while avoiding the support prohibition areas Rp, such as the slits SL of the substrate 9 and the areas on the non-work surface 92 where the components E are mounted, so that the substrate 9 can be firmly supported by the backup pins 4.

[0079] As described above, in this embodiment, the backup pin 4 corresponds to an example of the "support member" of the present invention, the server computer 7 corresponds to an example of the "support member placement determination device" of the present invention, the server computer 7 corresponds to an example of the "computer" of the present invention, the calculation unit 71 corresponds to an example of the "data acquisition unit" of the present invention, the calculation unit 71 corresponds to an example of the "placement determination unit" of the present invention, the placement determination program 81 corresponds to an example of the "support member placement determination program" of the present invention, the board configuration information 82 corresponds to an example of the "board configuration information" of the present invention, the board 9 corresponds to an example of the "board" of the present invention, the work target surface 91 corresponds to an example of the "first surface" of the present invention, and the non-work target surface 92 corresponds to an example of the "first surface" of the present invention. The image surface 92 corresponds to an example of a "second surface" of the present invention, the range A corresponds to an example of a "range" of the present invention, the candidate position C corresponds to an example of a "candidate position" of the present invention, the component E corresponds to an example of a "component" of the present invention, the component mounting area R corresponds to an example of a "component mounting area" of the present invention, the lattice L corresponds to an example of a "lattice" of the present invention, the provisional placement position Pp corresponds to an example of a "provisional placement position" of the present invention, the representative support position Pg corresponds to an example of a "representative support position" of the present invention, the support prohibited area Rp corresponds to an example of a "support prohibited area" of the present invention, the recording medium RM corresponds to an example of a "recording medium" of the present invention, and the slit SL corresponds to an example of a "slit" and "boundary area" of the present invention.

[0080] The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the spirit of the present invention. For example, in the first example of pin placement determination in Fig. 5, large components may not be distinguished from small components, but large components may be treated the same as small components, and the placement of backup pins 4 may be determined based on the relationship between component mounting area R and grid L. In this case, steps S101 to S105 may be omitted, and the flowchart in Fig. 5 may be executed from step S106.

[0081] In the second example of pin placement determination, the non-work surface 92 of the board 9 is virtually divided into a plurality of ranges A, with slits SL provided in the board 9 as boundaries. However, step S201 of the second example of pin placement determination may be configured to divide the board 9 into a plurality of ranges A, with dividing lines for dividing the board 9, such as perforations or cut grooves (V-cuts) provided in a so-called split board, as boundaries. In this case, the board configuration information 82 indicates the dividing lines provided on the board 9, and the calculation unit 71 divides the board 9 into a plurality of ranges A, with the dividing lines indicated by the board configuration information 82 as boundaries.

[0082] Furthermore, the number of slits SL provided in the substrate 9 is not limited to two and may be three or more. Furthermore, the direction in which the substrate 9 is virtually divided at the boundaries of the slits SL is not limited to the X direction described above and may be the Y direction. The same applies to the case in which the substrate 9 is virtually divided based on division lines provided on the substrate 9.

[0083] 9, the division lines of the substrate 9 may be set as support prohibited areas Rp to prohibit placement of backup pins 4 on the division lines. In this case, the substrate configuration information 82 indicates the division lines provided on the substrate 9, and the calculation unit 71 treats the division lines indicated by the substrate configuration information 82 as support prohibited areas Rp.

[0084] In the second example of component placement determination, the volume-based center of gravity position Gv is set as the position representing the range A (Id). However, the weight-based center of gravity position Gm given by the following equation 2 may be obtained as the representative position.

[0085]

number

[0086] In Mathematical formula 2, the meaning of the notation common to Mathematical formula 1 is the same as that of Mathematical formula 1. Also, M nis the weight of the component E to be mounted in the n-th component mounting area R. In this example, the board configuration information 82 indicates the weight M of the component E to be mounted in each component mounting area R. According to this modification, in step S205, it is determined that the backup pin 4 is to be positioned so that the backup pin 4 abuts against the non-work target surface 92 at the representative support position Pg that faces the weight reference center of gravity position Gm from the Z direction.

[0087] Furthermore, the configuration for supporting the backup pins 4 by the pin arrangement surface 271 of the pin arrangement table 27 may be configured so that the backup pins 4 are supported by inserting them into pin holes, as in Patent Document 1, for example, rather than by magnetic force. In this case, for example, the above-mentioned plurality of lattices L may be virtually arranged in correspondence with the arrangement of the plurality of pin holes in the pin arrangement surface 271.

[0088] 5, 7 or 9 may be transmitted from the communication unit 72 of the server computer 7 to the communication unit 52 of the mounter 1. In this case, the mounter 1 can arrange the backup pins 4 in the pin arrangement table 27 by the control unit 51 executing control in accordance with the arrangement of the backup pins 4 received by the communication unit 52. As a result, the backup pins 4 are arranged in the pin arrangement table 27 in accordance with the arrangement determined by the server computer 7.

[0089] Furthermore, the determination of the placement of the backup pins 4 does not have to be performed by a server computer 7 separate from the component mounter 1, but may be performed by the control unit 51 of the component mounter 1, or may be performed by a device (e.g., an inspection device) different from the server computer 7 or the component mounter 1. [Explanation of symbols]

[0090] 4...Backup pin (support member) 7...Server computer (support member placement determination device, computer) 71...Calculation unit (data acquisition unit, placement determination unit) 81... Placement determination program (support member placement determination program) 82...Board configuration information 9...Substrate 91...Work surface (first surface) 92...Non-work surface (2nd surface) A...Range C...Candidate position E...Parts R: Component mounting area L…Lattice Pp…Temporary placement position Pg…Representative support position Rp…support prohibited area RM...recording medium SL...Slit (boundary area)

Claims

1. A data acquisition unit that acquires board configuration information indicating a component mounting area on the first surface of a board having a first surface and a second surface opposite to the first surface, the component mounting area being provided as an area for mounting components; a placement determination unit that determines, based on the component mounting area, the placement of a support member that supports the board by contacting the second surface from below with the first surface facing upward; Equipped with the substrate configuration information indicates a boundary area including a slit provided in the substrate or a dividing line for dividing the substrate, The placement determination unit virtually divides the second surface into multiple ranges based on the boundary area, and performs a placement determination process for each of the multiple ranges to determine the placement of the support member that abuts the second surface at a position facing one of the multiple ranges as a target range, depending on the component mounting area within the target range.

2. The support member placement determination device of claim 1, wherein the placement determination unit determines a representative position that represents the position of each of the component mounting areas within the target range, and determines to place the support member so that the support member abuts the second surface at a representative support position opposite the representative position.

3. the board configuration information includes a component volume that is a volume of the component to be mounted in the component mounting area, The support member placement determination device according to claim 2 , wherein the placement determination unit determines the representative support position based on the component mounting area and the component volume.

4. the board configuration information includes a component weight that is a weight of the component to be mounted in the component mounting area, The support member placement determination device according to claim 2 , wherein the placement determination unit determines the representative support position based on the component mounting area and the component weight.

5. 5. The support member placement determination device according to claim 2, wherein the placement determination unit sets a plurality of candidate positions arranged two-dimensionally on the second surface, selects a target position from the plurality of candidate positions at which the support member abutting the second surface at the candidate position is spaced apart from the support member abutting the second surface at the representative support position, and determines to place the support member so that the support member abuts the second surface at the target position.

Images