Copper plate and conjugate

A copper plate with controlled surface roughness and grain boundaries enhances infrared light absorption, addressing inefficiencies in laser processing and welding, ensuring stable welds and cost-effectiveness.

JP2025147366APending Publication Date: 2025-10-07MITSUBISHI MATERIALS CORP
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Patent Information

Application Number
JP2024047585
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-25
Publication Date
2025-10-07

AI Technical Summary

Technical Problem

Copper materials with a Cu content of 99 mass% or more have low light absorption rates in the near-infrared wavelength range, leading to inefficient laser processing and unstable welding quality, and existing methods to improve absorptance are either costly or insufficient.

Method used

A copper plate with a Cu content of 99 mass% or more, controlled surface roughness (Sdq 0.05 to 0.50 and Sdr 0.15% to 5.00%), crystal grain size ≤100 μm, and specific grain boundary proportions (X+Z)/(X+Y+Z)>30%, optionally with Ag 5-20 massppm and additional elements (Mg, Zr, Ca, Ni, Sn) to enhance light absorption and recrystallization.

Benefits of technology

Improves light absorptance in the infrared region, enabling efficient laser processing and welding with stable weld quality, while maintaining electrical conductivity and cost-effectiveness.

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Abstract

To provide a copper plate suitable for laser processing and laser welding, by sufficiently improving a light absorption rate of a wavelength in an infrared region.SOLUTION: A Cu content is 99 mass% or more, the surface roughness Sdq (root mean square slope) is within the range of 0.05 to 0.50, and the surface roughness Sdr (developed interfacial area ratio) is within the range of 0.15% to 5.00%. In a cross-section perpendicular to the rolling width direction, the crystal grain size is 100 μm or less. The grain boundaries are classified as follows: those with an orientation difference of 2° to 15° between adjacent grains are low-angle grain boundaries; special grain boundaries (Σ3, 9, 27); and those with an orientation difference exceeding 15°(excluding special grain boundaries) are high-angle grain boundaries. The lengths of the low-angle grain boundaries (X), special grain boundaries (Y), and high-angle grain boundaries (Z) satisfy the condition (X+Z) / (X+Y+Z)>30%.SELECTED DRAWING: None
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