Direct radiating array antenna

Abstract

To provide a small, lightweight, highly efficient, and highly reliable DRA antenna (direct radiating array antenna), a satellite equipped with a DRA antenna, and a method for manufacturing a DRA antenna.SOLUTION: A DRA antenna 222 (direct radiating array antenna) that transmits or receives RF signals in a predetermined frequency band includes a plurality of radiating elements 316 that define the radiation surface of the DRA antenna 222, a plurality of RF signal chain paths 314, and a single beam forming network 304 that has a plurality of electrical ports that electrically connect to the RF signal chain paths 314, each of which is coupled to one of the radiating elements 316, and each of which amplifies the RF signal that it transmits or receives.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The following relates generally to antennas and antenna assemblies for radio frequency (RF) communications, and more particularly to direct radiating array antennas. [Background technology]

[0002] The number of connected devices and the amount of communication between them continues to grow. Furthermore, the data generated by these devices is also exploding, increasing the demand for communication systems to support this communication. One way to support this communication is through communications satellites. As satellite launches become easier and satellite-based communication becomes more common, the market for communications satellites is booming.

[0003] Communication satellites support communications with onboard antennas. One such antenna is the active direct radiating array antenna. This type of antenna allows for the management and balancing of size, mass, and power. Antennas that offer one or more of small size, light weight, and low power consumption, or that may offer trade-offs in performance while managing size, mass, and power, are often sought. For example, satellite-mounted applications may be limited by the total weight that can be allocated to the antenna, which in turn limits the number of radiating components and the electrical efficiency of the antenna.

[0004] As communication signal frequency bands continue to expand, so does the volume of beams carrying the signals. Therefore, it will become increasingly challenging to concentrate more mechanical and electrical components adjacent to the array while maintaining antenna efficiency, especially in low Earth orbit (LEO) applications. LEO requires more DRA (direct radiating array) scans, resulting in tighter component spacing (i.e., the spacing between radiating components). Therefore, LEO is more challenging than GEO or MEO in terms of the density of mechanical and electrical components. Furthermore, to reduce signal loss between different components, signal path lengths must be kept as short as possible. Therefore, these components must be located as close as possible to the array.

[0005] It is also necessary to efficiently manage the heat generated by antenna components, such as signal amplifiers, to prevent temperature rises that could lead to an overall reduction in antenna efficiency. Therefore, structures are required to dissipate the heat generated by the antenna components. However, such structures can increase the overall antenna complexity, resulting in an increase in the weight of the antenna (e.g., a direct radiating array antenna), which can adversely affect the antenna's electrical performance.

[0006] The structural requirements of the antenna (e.g., radiating components, signal amplification paths, heat dissipation structures, etc.) can increase its physical size. This can increase the weight of the antenna and reduce the available space inside the spacecraft. In spaceborne applications, there may be limitations on the total weight that can be allocated to the antenna, which can limit the number of radiating components and the electrical efficiency of the antenna. Summary of the Invention [Problem to be solved by the invention]

[0007] Therefore, there is a need for an improved direct radiating array antenna and method of fabrication to overcome at least one of the problems with current direct radiating array systems and methods. [Means for solving the problem]

[0008] A DRA antenna (Direct Radiating Array Antenna) is provided for transmitting or receiving RF signals (Radio Frequency Radio Signals) in a predetermined frequency band. a plurality of radiating elements defining a radiating surface of the DRA antenna; Multiple RF signal chain paths; a single beamforming network having a plurality of electrical ports electrically connected to the RF signal chain paths; Each of the RF signal chain paths is coupled to one of the radiating elements, each of which amplifies a transmitted or received RF signal.

[0009] Each of the RF signal chain paths may include a heat-generating component; The DRA antenna may include a heat spreader that passively cools the DRA antenna by conducting heat generated by the heat-generating components in the RF signal chain path.

[0010] Each of the RF signal chain paths may include a heat-generating component; The DRA antenna may include a plurality of thermal blades that passively conduct heat generated by the heat-generating component.

[0011] Each of the thermal blades may include a top surface that serves as a heat exchange interface for the DRA antenna.

[0012] Each of the thermal blades may include a heat pipe to passively or actively transfer heat.

[0013] The thermal heat pipe may be a pulsating heat pipe that transfers heat passively.

[0014] Each of the thermal blades may be a solid metal thermal blade that passively conducts heat.

[0015] The DRA antenna further comprises a plurality of radiating element modules; each of the radiating element modules comprising a subset of a plurality of radiating elements and a subset of a plurality of RF signal chain paths; each of the subset of radiating elements defines a collective radiating element base; Each of the subset of RF signal chain paths may be contained within the collective radiating element base.

[0016] The DRA antenna further comprises a plurality of SIP modules (System-in-Package Modules); Each of the SIP modules includes at least one BFIC (Beam Forming Integrated Circuit); The SIP modules may be mounted on a planar beamforming network board.

[0017] a first subset of the SIP modules mounted on a first surface of the beam forming network board; a second duplex set of SIP modules attached to a second side of the beam forming network board; The first surface and the second surface may face each other.

[0018] the SIP modules are mounted on the beam forming network board as a plurality of double stacks; Each of the double stacks comprises: a first SIP module attached to a first surface of the beam forming network board; a second SIP module attached to a second surface of the beam forming network board; The first SIP module and the second SIP module may be connected to each other.

[0019] Each of the double stacks may be thermally coupled to a thermal blade that passively conducts heat.

[0020] The first subset of SIP modules may dissipate heat generated by itself and at least one second subset of SIP modules.

[0021] Each of the first subset of SIP modules may be thermally coupled to a thermal blade that passively conducts heat.

[0022] the beam forming network is attached to a base plate; each of the double stacks is thermally coupled to the base plate; The base plate may conduct heat from the double stack heat generating components to a thermal blade for passively conducting heat.

[0023] the subset of SIPs each comprising a cover; The cover may act as a heat exchange interface for heat generated by heat-generating components of the SIP module.

[0024] the subset of SIPs each comprising a cover; The cover may contact a base plate of the DRA antenna and transfer heat generated by heat-generating components of the SIP module to the base plate.

[0025] Each of the RF signal chain paths may be connected to the beam forming network board via a spring-loaded electrical connector.

[0026] The DRA antenna further comprises a plurality of SIP modules (System-in-Package Modules) mounted on the beamforming network board; The SIP module may include at least one BFIC (Beam Forming Integrated Circuit) and a spring-loaded electrical connector that connects the SIP module to the beam forming network.

[0027] the beam forming network board defines a first surface; The RF signal chain paths may be disposed in a second plane that is substantially perpendicular to the first plane.

[0028] the DRA antenna further comprises a plurality of thermal blades mounted substantially perpendicular to the beam forming network board; The plurality of RF signal chain paths may be attached to the plurality of thermal blades.

[0029] A satellite is provided that includes the above-described DRA antenna. The satellite may be a low Earth orbit satellite.

[0030] Spaceship bus, the DRA antenna of claim 1 attached to the spacecraft bus; an OBP (on-board processor) communicatively connected to the DRA antenna of claim 1; Equipped with The satellite is provided with an OBP that processes beam signals provided to the beam forming network board or beam signals received from the beam forming network board.

[0031] Spaceship bus, the DRA antenna mounted on the spacecraft bus; A satellite comprising:

[0032] A method of operating the DRA antenna is provided, comprising using the DRA antenna to transmit or receive RF signals in at least one predetermined frequency band.

[0033] A DRA antenna is provided for transmitting or receiving radio frequency radio signals in a predetermined frequency band. a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a plurality of radiating elements defining at least one radiating surface of the DRA antenna; Multiple RF signal chain paths; Equipped with each of the RF signal chain paths is coupled to one of the radiating elements, and amplifies the RF signal transmitted or received by each of the radiating elements; the plurality of radiating elements define a collective radiating element base; The plurality of RF signal chain paths are contained within the collective radiating element bottom surface.

[0034] The DRA antenna further comprises a plurality of heat spreaders; Each of the plurality of RF signal chain paths may include a heat-generating component attached to a respective heat spreader for passively conducting heat generated by the heat-generating component to the heat spreader.

[0035] The DRA antenna further comprises a single beam forming network board for realizing a beam forming network; The beam forming network board may include a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths.

[0036] The beam forming network board may route all RF and electrical signals and DC power to the DRA antenna's multiple RF signal chain paths.

[0037] the plurality of radiating elements and the plurality of RF signal chain paths are assembled into a radiating element module; each of the radiating element modules is coupled to a subset of the plurality of radiating elements and RF signal chain paths; The subset of radiating elements may be arranged in a line.

[0038] The DRA antenna further comprises a single beam forming network board for realizing a beam forming network; the beam forming network board comprises a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths; The radiating element modules may be arranged substantially perpendicular to the beam forming network board.

[0039] The DRA antenna further comprises a plurality of thermal blades; the radiant element module is attached to the thermal blade; Heat generated in heat-generating components in each of the RF signal chain paths may be passively conducted to each of the thermal blades.

[0040] the radiant element modules are attached to the plurality of thermal blades; at least one radiant element module attached to the first surface of said thermal blade; At least one radiant element module may be attached to a second side of the thermal blade opposite the first side.

[0041] The RF signal chain path includes: It may include a driver before high power amplification in the DRA antenna or a gain block for low noise amplification in the DRA antenna.

[0042] Each of the plurality of RF signal chain paths may be electrically connected to a beam forming network board via a spring-loaded electrical connector.

[0043] the plurality of heat spreaders are thermal blades; Each thermal blade may include a heat pipe.

[0044] The heat pipe may be a oscillating heat pipe.

[0045] The DRA antenna further comprises a plurality of system-in-SIP modules (system-in-package modules) mounted on the beamforming network board; Each of the SIP modules may include a beamforming integrated circuit and a spring-loaded electrical connector for electrically connecting to the beamforming network board.

[0046] The DRA antenna is a DRA antenna that transmits or receives radio frequency radio wave signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules (system-in-package modules) each including a BFIC (beam-forming integrated circuit); The SIP module may be planar mounted to the beam forming network board.

[0047] a first subset of the plurality of SIPs mounted on a first surface of the beam forming network board; a second subset of the plurality of SIPs mounted on a second side of the beam forming network board; The first surface and the second surface may face each other.

[0048] the plurality of SIP modules are mounted on the beam forming network board as a plurality of double stacks; Each of the double stacks comprises: a first SIP module attached to a first surface of the beam forming network board; a second SIP module attached to a second surface of the beam forming network board; The first SIP module and the second SIP module may be connected to each other.

[0049] Each of the double stacks may be thermally coupled to a thermal blade that passively conducts heat.

[0050] the beam forming network is attached to a base plate; each of the double stacks is thermally coupled to the base plate; The base plate may conduct heat from the double stack heat generating components to a thermal blade for passively conducting heat.

[0051] the subset of SIPs each comprising a cover; The cover may act as a heat exchange interface for heat generated by heat-generating components of the SIP module.

[0052] the subset of SIPs each comprising a cover; The cover may contact a base plate of the DRA antenna and transfer heat generated by heat-generating components of the SIP module to the base plate.

[0053] A satellite is provided that includes the above-described DRA antenna. The satellite may be a low Earth orbit satellite.

[0054] Spaceship bus, the DRA antenna mounted on the spacecraft bus; A satellite equipped with

[0055] 1. A method of operating a DRA antenna, comprising: A method is provided comprising the step of transmitting or receiving RF signals in at least one predetermined frequency band using the DRA antenna.

[0056] Spaceship bus, an on-board processor; a DRA antenna connected to the on-board processor and attached to the spacecraft bus; The DRA antenna includes: a plurality of radiating elements defining a radiating surface of the DRA antenna; Multiple RF signal chain paths; a single beamforming network having a plurality of electrical ports electrically connected to the RF signal chain paths; A satellite is provided in which each of the RF signal chain paths is coupled to a respective one of the radiating elements, each of the radiating elements amplifying a transmitted or received RF signal.

[0057] the satellite further comprising a passive thermal management subsystem that manages heat generated by the DRA antenna; the passive thermal management subsystem includes a plurality of thermal blades connected to a heat sink; The thermal blade may actively or passively transfer heat generated by heat-generating components of the DRA antenna to the heat sink.

[0058] The satellite may be a low earth orbit satellite.

[0059] The satellite may further comprise a positioning subsystem for controlling the orbit of the satellite, which may be a low Earth orbit.

[0060] Spaceship bus, an on-board processor; a DRA antenna connected to and attached to the on-board processor; Equipped with The DRA antenna includes: a plurality of radiating element modules defining at least one radiating surface of the DRA antenna; a plurality of RF signal chain paths coupled to each of the radiating element modules, each of which amplifies an RF signal received by or transmitted to the radiating element; the plurality of radiating elements define a collective radiating element base; A satellite is provided in which the RF signal chain path is contained within the collective radiating element base.

[0061] the satellite further comprising a passive thermal management subsystem that manages heat generated by the DRA antenna; the passive thermal management subsystem includes a plurality of thermal blades connected to a heat sink; The thermal blade may actively or passively transfer heat generated by heat-generating components of the DRA antenna to the heat sink.

[0062] The satellite may be a low earth orbit satellite.

[0063] The satellite may further comprise a positioning subsystem for controlling the orbit of said satellite, which may be a low Earth orbit.

[0064] A DRA antenna that transmits or receives RF signals (radio frequency signals) in a predetermined frequency band, A DRA antenna is provided that features a single beamforming network board.

[0065] The DRA antenna further comprises a plurality of RF signal chain paths; The beam forming network board may carry all RF and electrical signals and DC power to the RF signal chain path.

[0066] Manufacturers of DRA antennas (direct radiating array antennas) attaching a first plurality of radiant element modules to a first thermal blade to create a first assembled thermal blade; attaching a beam forming network board to a base plate; attaching the first assembled thermal blade to the base plate such that the first assembled thermal blade is substantially perpendicular to the beam forming network board; Equipped with A method is provided, wherein the attaching step includes forming an electrical connection between an electrical connector of each of the first plurality of radiating element modules and a corresponding receive port of the beam forming network board.

[0067] The first thermal blade and the first plurality of radiating element modules may be disposed substantially perpendicular to the beam forming network board.

[0068] at least one radiant element module attached to a first surface of the first thermal blade; at least one radiant element module attached to a second surface of the first thermal blade; The first surface and the second surface may face each other.

[0069] The method includes attaching a second plurality of radiant element modules to a second thermal blade that actively or passively conducts heat to form a second assembled thermal blade; attaching the second assembled thermal blade to the base plate such that the first assembled thermal blade is substantially perpendicular to the beam forming network board and substantially parallel to the first assembled thermal blade; Furthermore, The attaching step may include forming an electrical connection between an electrical connector of each of the second plurality of radiating element modules and a corresponding receive port of the beam forming network board.

[0070] The first thermal blade and the second thermal blade may be the same size.

[0071] The electrical connector may be a spring-loaded electrical connector.

[0072] each of the first plurality of radiating element modules includes a plurality of radiating elements and a plurality of radio frequency ("RF") signal chain paths; each of the RF signal chain paths is coupled to a corresponding one of the plurality of radiating elements; the plurality of radiating elements define a collective radiating element base; The RF signal chain path may be contained within the collective radiating element base.

[0073] The plurality of RF signal chain paths may be entirely contained within the collective radiating element base.

[0074] The first plurality of radiant elements may be centrally mounted to the first thermal blade.

[0075] The first plurality of radiating element modules include: a plurality of radiating elements arranged in a line; Multiple RF signal chain paths; Equipped with each of the plurality of radiating elements is attached to a plurality of other radiating element modules; Each of the RF signal chain paths may be coupled to one of the plurality of radiating elements and amplify signals received by or applied to the radiating element.

[0076] The electrical connector may be a spring-loaded electrical connector.

[0077] The spring-loaded electrical connector may provide a DC and RF interface to the beam forming network board.

[0078] The first thermal blade may include a top surface that serves as a heat exchange interface for the DRA antenna.

[0079] The first thermal blade may include a oscillating heat pipe.

[0080] The step of forming a first assembled thermal blade includes: installing a beam amplification module ("BAM"); forming an electrical connection between the electrical connector of the BAM and a corresponding receive port of a beam forming network board; may further comprise:

[0081] The electrical connector may be a spring-loaded electrical connector.

[0082] mounting a first plurality of system-in-package (SIP) modules to a first side of the beam forming network board; The first SIP module may include at least one beamforming integrated circuit.

[0083] mounting a second plurality of SIP modules on a second side of the beam forming network board; the second SIP module includes at least one beamforming integrated circuit; The first surface and the second surface may face each other.

[0084] The first plurality of SIP modules may be thermally coupled to the base plate to transfer heat from heat-generating components of each of the first plurality of SIP modules to the first thermal blade.

[0085] The base plate may couple heat to the first thermal blade.

[0086] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules (system-in-package modules) each including a BFIC (beam-forming integrated circuit); The SIP module is provided with a DRA antenna, characterized in that it is mounted planarly on the beam forming network board.

[0087] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules (system-in-package modules) each including a BFIC (beam-forming integrated circuit); A DRA antenna is provided in which the SIP module is linearly mounted to the beam forming network board and electrically connected to the beam forming network board via a spring-loaded electrical connector.

[0088] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules (system-in-package modules) each including a BFIC (beam-forming integrated circuit); A DRA antenna is provided in which each of the SIP modules includes a spring-loaded electrical connector for electrically connecting to the beam forming network board.

[0089] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a radiating element defining a radiating surface of the DRA antenna; an RF signal chain path coupled to the radiating element for amplifying an RF signal received by or transmitted to the radiating element; a spring-loaded electrical connector for connecting the RF signal chain path to a beamforming network board of the DRA antenna; A DRA antenna is provided, comprising:

[0090] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a plurality of radiating elements defining a radiating surface of the DRA antenna; Multiple RF signal chain paths; Equipped with each of the plurality of RF signal chain paths coupled to the radiating element to amplify an RF signal received by or transmitted to the radiating element; the plurality of radiating elements define a collective radiating element base; A DRA antenna is provided in which the RF signal chain path is contained within the collective radiating element base.

[0091] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a beam forming network board; a plurality of radiating element modules; Equipped with Each of the radiating element modules comprises: one radiating element defining a radiating surface of the DRA antenna; an RF signal chain path coupled to the radiating element for amplifying an RF signal received by or transmitted to the radiating element; Equipped with A DRA antenna is provided, wherein the RF signal chain path is disposed substantially perpendicular to the beam forming network board.

[0092] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, a beam forming network board; an RF signal chain path disposed substantially perpendicular to said beam forming network board; A DRA antenna is provided, comprising:

[0093] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, one beamforming network board defining a first plane; a plurality of RF signal chain paths disposed on the second surface; Equipped with A DRA antenna is provided, characterized in that the first and second planes are substantially perpendicular.

[0094] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, One beam forming network board; a plurality of thermal blades; Multiple RF signal chain paths; Equipped with The plurality of RF signal chain paths amplify RF signals received by or transmitted to the connected radiating elements and are attached to corresponding respective thermal blades. A DRA antenna is provided, wherein the plurality of thermal blades are arranged substantially perpendicular to the beam forming network board.

[0095] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, One beam forming network board; a plurality of thermal blades; Equipped with A DRA antenna is provided in which each of the plurality of thermal blades utilizes a oscillating heat pipe to passively transfer heat generated by a heat-generating component of the DRA antenna to a heat sink.

[0096] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, One beam forming network board; a plurality of thermal blades that passively cool the DRA antenna by conducting heat generated by heat-generating components of the DRA antenna to a heat sink; A DRA antenna is provided, comprising:

[0097] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, One beam forming network board; a plurality of radiating element modules each including a plurality of radiating elements and a plurality of RF signal chain paths; Equipped with the plurality of RF signal chain paths are coupled to corresponding ones of the plurality of radiating elements to amplify RF signals received by or transmitted to the negative number of radiating elements; the plurality of RF signal chain paths are contained within a collective radiating element base defined by the plurality of radiating elements; A DRA antenna is provided, wherein the plurality of RF signal chain paths are disposed substantially perpendicular to the beam forming network board.

[0098] A DRA antenna for transmitting or receiving radio frequency radio signals in a predetermined frequency band, One beam forming network board; a first SIP module and a second SIP module, each having at least one beamforming integrated circuit; Equipped with A DRA antenna is provided, characterized in that the first SIP module and the second SIP module are mounted on opposite sides of the beam forming network board and connected to each other so that the first SIP module provides a heat exchange interface for the second SIP module.

[0099] Other aspects and features will become apparent to those skilled in the art upon reading the following description of several exemplary embodiments. [Brief explanation of the drawings]

[0100] The accompanying drawings are intended to illustrate various examples of the techniques, methods and apparatuses herein.

[0101] [Figure 1]1 is a block diagram of a satellite communications system including multiple satellites, each of which is equipped with a DRA (Direct Radiating Array Antenna) subsystem according to an embodiment.

[0102] [Figure 2] FIG. 2 is a block diagram of the communications satellite of FIG. 1 according to an embodiment.

[0103] [Figure 3] FIG. 3 is a block diagram of the DRA assembly of FIG. 2 according to an embodiment.

[0104] [Figure 4] FIG. 1 is a block diagram of a thermal control subsystem for use in a DRA assembly, according to an embodiment.

[0105] [Figure 5A] FIG. 3 is a perspective view of the DRA assembly of FIG. 2 according to an embodiment.

[0106] [Figure 5B] FIG. 5B is a partial cross-sectional view of the DRA assembly of FIG. 5A according to an embodiment.

[0107] [Figure 6] FIG. 1 is a top perspective view of a portion of a beam forming network ("BFN") according to an embodiment.

[0108] [Figure 7] 1 is a perspective view of a SIP module (system-in-package module) according to an embodiment.

[0109] [Figure 8A] FIG. 1 is a perspective view of a radiating element module having a four-pack configuration according to an embodiment.

[0110] [Figure 8B] FIG. 8B is a second perspective view of the radiating element module of FIG. 8A.

[0111] [Figure 9] 1 is a partial cross-sectional view of a radiating element module according to an embodiment, showing a cross-section of an RF module.

[0112] [Figure 10] FIG. 1 is a cross-sectional view of a DRA assembly according to an embodiment, illustrating the heat paths of the heat dissipation components of the DRA assembly.

[0113] [Figure 11] FIG. 1 is a top perspective view of an embodiment of a DRA assembly having multiple spacecraft heat pipes attached thereto.

[0114] [Figure 12] FIG. 1 is a flow diagram of a method for manufacturing a DRA assembly of the present disclosure, according to an embodiment.

[0115] [Figure 13A] FIG. 1 is a top perspective view of a communications satellite including a spacecraft and having a DRA assembly of the present disclosure mounted thereon.

[0116] [Figure 13B] FIG. 13B is a top view of the communications satellite of FIG. 13A.

[0117] [Figure 14] FIG. 1 is a schematic top perspective view of a DRA assembly (direct radiating array assembly) according to an embodiment of the present disclosure.

[0118] [Figure 15] FIG. 16 is a partially exploded top perspective view of another embodiment DRA assembly (similar to FIG. 14) of the present disclosure, showing two adjacent rows of radiant elements attached to a temperature sink element.

[0119] [Figure 16] 16 is a partially exploded top perspective view of two adjacent rows of radiant elements attached to the same temperature sink element as FIG. 15, showing the integrated groups of radiant elements.

[0120] [Figure 17] FIG. 10 is an exploded, enlarged bottom view of three groups of radiating elements, showing an amplification unit of the RF signal chain path located on one of the radiating element bottom surfaces.

[0121] [Figure 18] FIG. 1 is an exploded, enlarged top view of two radiating elements, with an exploded view of the radiating element with RF connections. DETAILED DESCRIPTION OF THE INVENTION

[0122] Various apparatus or processes are described below to illustrate examples of each claimed embodiment. The embodiments described below do not limit the claimed embodiments. The claimed embodiments may cover processes or apparatuses that are different from the embodiments described below. The claimed embodiments are not limited to apparatus or processes that include all features of the apparatus or processes described below, nor are they limited to features common to multiple apparatus or processes described below.

[0123] The following relates generally to antenna-based communication systems, and more specifically to DRA antennas (direct radiating array antennas). The DRA antennas herein can be smaller than conventional DRA antennas, which can advantageously reduce size, cost, and / or mass, which can be key factors for implementing DRA antennas in space-based applications. Furthermore, the smaller design of the DRA antenna allows for the active heat-generating components to be placed in a more concentrated area, making thermal management of the generated heat a key feature. The DRA antennas disclosed herein enable such thermal management approaches that can keep component temperatures within acceptable limits.

[0124] In certain embodiments of the present disclosure, a DRA can be used with low Earth orbit ("LEO") satellites. LEO can increase DRA scanning requirements, which can result in closer DRA element spacing (as described below, element spacing refers to the spacing between radiating elements in an active grid of radiating elements). The closer element spacing required for a DRA used in LEO makes LEO applications more challenging than geostationary or medium Earth orbit (GEO) applications in terms of closely concentrating mechanical or electrical components. The DRA of the present disclosure is particularly well-suited for use with LEO satellites because it overcomes the challenges of closely concentrating DRA mechanical or electrical components.

[0125] This disclosure relates to DRA antennas that include active radiating elements (i.e., radiating elements with an RF signal path and an amplifier). In some embodiments, the DRA antennas herein may include one or more passive radiating elements in addition to one or more active radiating elements (although such passive radiating elements may not be described or illustrated). Accordingly, this disclosure describes DRA antennas that include only active radiating elements and DRA antennas that include a combination of an active radiating element and one or more passive radiating elements. In this context, the absence of reference to passive radiating elements does not exclude their possible inclusion or use in the DRA antenna.

[0126] FIG. 1 illustrates a system 100 for satellite-based satellite communications according to one embodiment.

[0127] The system 100 comprises a ground segment 102 and a space segment 104 .

[0128] The space segment 104 of the system 100 includes communications satellites 110a, 110b, and 110c, which are generally referred to herein as communications satellites 110 collectively.

[0129] System 100 may include any number (i.e., one or more) of communications satellites 110. In particular embodiments, communications satellites 110 are low earth orbit (LEO) satellites. In other embodiments, communications satellites 110 may be medium earth orbit (MEO) satellites or geostationary (GEO) satellites. In embodiments in which system 100 includes multiple satellites 110, satellites 110 may be collectively referred to as a satellite constellation or satellite network.

[0130] Each of communications satellites 110a, 110b, and 110c includes a DRA antenna (direct radiating array antenna) subsystem (a subset of which is DRA antenna subsystems 112a, 112b, and 112c, respectively). DRA antenna subsystems 112a, 112b, and 112c are generally referred to herein collectively as DRA antenna subsystem 112. DRA antenna subsystem 112 may be configured to perform RF transmission, RF reception, or both.

[0131] In one embodiment, the DRA antenna subsystem 112 may operate in the Ku or Ka bands.

[0132] The DRA antenna subsystem 112 includes a direct radiating array, which may be an active array (e.g., including DC-fed circuitry, amplifier beamforming integration networks, etc.), configured to perform analog beamforming.

[0133] Communications satellites 110 a , 110 b , and 110 c communicate with each other via inter-satellite communications link 114 .

[0134] The ground segment 102 includes a gateway earth station (GES) 106 (or gateway station 106). The system 100 may include multiple gateway stations 106, which may be located at different locations. The gateway stations 106 may be located on the Earth's surface, in the atmosphere, or in space. The gateway stations 106 may be fixed or mobile.

[0135] Gateway station 106 (whether ground-based or air-based) includes one or more devices configured to communicate with satellites 110 in real time.

[0136] Communications satellites 110a, 110b and 110c communicate with gateway station 106 via communications links 118a, 118b and 118c, respectively.

[0137] The gateway station 106 is configured to establish a telecommunications link 108 with a satellite 110 when the satellite 110 is within the "view" of the gateway station 106. The gateway station 106 transmits and / or receives RF (radio wave) signals to and / or from the satellite 110. The gateway station 106 may include a parabolic antenna for transmitting and receiving the RF signals. The gateway station 106 may be fixed or orbiting.

[0138] Gateway station 106 sends RF signals to satellite 110 over communication link 108 (uplink) and receives transmitted data from satellite 110 over communication link 108 (downlink).

[0139] The gateway station 106 may act as a command or control center for the satellite network (or "satellite constellation").

[0140] The gateway station 106 may analyze the data received from the satellites 110 and / or relay the received data to another location (i.e., another computer system, such as another gateway station 106) for analysis. In some cases, the gateway station 106 may receive data from the satellites 110 and transmit the received data to a computer device (particularly one configured to perform processing and analysis of the received satellite data).

[0141] Additionally, gateway station 106 may be configured to receive data from satellites 110 and monitor the navigation or position (e.g., altitude, movement) of satellites 110, or to monitor the functionality of critical systems of the satellites (e.g., by analyzing data from the monitored critical systems).

[0142] The gateway station 106 may include any one or more of the following elements: a system clock, an antenna system, transmit and receive RF equipment, telemetry, tracking and command (TT&C) equipment, a data-user interface, mission data recovery equipment, and a station control center.

[0143] The ground segment 102 of the system 100 also includes a user terminal 108 .

[0144] The user terminal 108 may be fixed or mobile. The user terminal 108 may be any device capable of transmitting and / or receiving RF communication signals. The user terminal 108 includes an RF communication module for transmitting and / or receiving RF signals. The user terminal 108 may be, for example, a computing device such as a laptop, desktop, or mobile device (e.g., a smartphone).

[0145] Communications satellite 110c communicates with user terminal 108 via communications link 116. Communications performed by satellite 110c via communications link 116 may include transmitting and receiving. Figure 1 shows communications link 116 established between satellite 110c and user terminal 108. However, user terminal 108 may establish a similar communications link with satellite 110a or 110b. Similarly, satellite 110c may establish similar communications links with other user terminals.

[0146] FIG. 2 illustrates the communications satellite 110 of FIG. 1 according to one embodiment.

[0147] Communications satellite 110 includes a satellite bus 202. Satellite bus 202 provides the body of satellite 110. Satellite bus 202 provides location for payload (e.g., various subsystems such as DRA antenna subsystem 112), structural support, and infrastructure for satellite 110. Components of communications satellite 110 may be housed within satellite bus 202 or may be connected (directly or indirectly through other components) to the exterior of satellite bus 202.

[0148] Communications satellite 110 includes a propulsion subsystem 206 for powering communications satellite 110. Propulsion subsystem 206 includes one or more actuators, such as reaction wheels or thrusters. Propulsion subsystem 206 may include one or more engines for generating thrust.

[0149] The communications satellite 110 includes a positioning subsystem 208. The positioning subsystem 208 uses specialized sensors (e.g., direction measurement sensors) to obtain sensor data. These sensors may be used by a processing unit in the positioning subsystem 208 to determine the position of the satellite 110. The positioning subsystem 208 controls the altitude and orbit of the satellite 110. The positioning subsystem 208 communicates with the propulsion subsystem 206.

[0150] The positioning subsystem 208 and propulsion subsystem 206 determine and apply the torques and forces necessary to orient the satellite 110 to the desired altitude, keep the satellite 110 in the correct orbital position, and keep the antenna (e.g., the direct radiating array antenna 222) in the correct orientation.

[0151] Communications satellite 110 includes a power subsystem 210. Power subsystem 210 provides power to the DRA subsystem and other components. Power may be provided by solar panels on satellite bus 112, which convert solar radiation into electrical current. Power subsystem 210 may also include batteries to store energy for use when satellite 110 is in the Earth's shadow.

[0152] Satellite 110 includes a command and control subsystem 212. Command and control subsystem 212 includes electronic circuitry for controlling data communicated between components of communications satellite 110. Propulsion subsystem 206, positioning subsystem 208, and power subsystem 210 may each be communicatively coupled to command and control subsystem 212 for sending data to and receiving data from command and control subsystem 212.

[0153] The communications satellite 110 includes an on-board processor (OBP) 214. The OBP 214 may be part of the satellite's payload. The OBP 214 communicates with the DRA subsystem 112. The on-board processor 214 may be a digital playback subsystem. Alternatively, the DRA subsystem may be used with a digital transparency subsystem or an analog transparency subsystem, and "on-board processor" may refer to a digital transparency subsystem of an analog transparency subsystem.

[0154] The OBP 214 may include a beam output port for outputting a beam signal to a beam forming module (also referred to as a "beam forming network") of the DRA subsystem 112. The beam signal may be transmitted to a beam amplification module ("BAM"). The OBP 214 may be configured to generate a beam signal and output the beam signal to the beam forming module via the beam output port. The OBP 214 may include a beam input port for receiving a beam signal output from the beam forming module of the DRA subsystem 112. The OBP 214 may be configured to receive the beam signal from the beam input port via the beam input port and process the received beam signal.

[0155] Communications satellite 110 also includes a thermal control subsystem (or thermal management subsystem) 216. Thermal control subsystem 216 controls, manages, and regulates the temperature of one or more components of communications satellite 110 within an acceptable range. This may include maintaining similar components at a substantially uniform temperature. For example, thermal control subsystem 216 may manage the temperature of any one component in subsystems 206, 208, 210, 212, and 112 by managing heat generated by active heat sources (heat-generating components) in these subsystems. Thermal control subsystem 216 may include, for example, heater strips, paints and coatings that absorb heat from the Earth and the Sun, heat pipes, and heat sinks. In general, thermal control subsystem 216 may protect electronic components in DRA subsystem 112 and other subsystems from external temperatures due to strong sunlight, lack of solar exposure on the opposite side of the satellite body, and self-heating of the DRA subsystem (i.e., heat-generating components of the DRA subsystem). The temperature control subsystem 216 may include active or passive components.

[0156] The communications satellite 110 may include other payload subsystems 226. The other payload subsystems 226 may include optical inter-satellite terminals, gateway antennas, filters, cables, and waveguides.

[0157] Communications satellite 110 includes DRA subsystem 112. DRA subsystem 112 includes DRA assembly 222 and DRA controller ("DRAC") 224. DRA assembly 222 and DRAC 224 are communicatively connected so that they can transmit signals to each other. DRA assembly 222 and DRAC 224 are each communicatively connected to OBP 214. DRA subsystem 112 may be a class of beamformer having at least 10 beams and at least 500 radiating elements. The number of beams and the number of radiating elements define the complexity (number of nodes) of the DRA beamforming network.

[0158] The DRA assembly 222 may be a receive (Rx) antenna or a transmit (Tx) antenna. The communications satellite 110 may include an RxDRA and a TxDRA subsystem 112. There may be one DRAC 224 per DRA 222 (e.g., a first DRAC for an RxDRA, a second DRAC for a TxDRA, and so on). Each DRAC 224 is connected to the OBP 214. The communications satellite 110 may include multiple RxDRA assemblies and / or multiple TxDRA assemblies. In a variation, the communications satellite 110 may include multiple DRA assemblies 222 or DRA subsystems 112 (which may be Tx, Rx, or both). The number of DRA subsystems 112 or DRA assemblies on the communications satellite 110 is not particularly limited. In particular embodiments, communications satellite 110 includes two RxDRA assemblies 222 with two polarizations and two TxDRA assemblies 222 with two polarizations.

[0159] The DRA assembly 222 transmits and / or receives RF radio signals within a predetermined signal frequency band. The DRA assembly may be configured to use a subset of the overall signal bandwidth.

[0160] In Tx, the DRA assembly 222 receives signals from the OBP 214, generates multiple beams, and feeds the beams to the RF radiating elements for transmission. In Rx, this process is reversed, with appropriate modifications.

[0161] The DRA assembly 222 includes a beamforming module for performing analog beamforming operations. Beamforming allows an array of RF radiating elements to transmit RF signals in specific directions while minimizing power radiated in other directions (i.e., the DRA can null radiation in certain directions to prevent interference). Each radiating element in the array can have its own signal to transmit. The phase and (possibly) strength of each signal can then be added constructively or destructively. This allows energy to be concentrated into a narrow beam or lobe, minimizing transmission in other directions. Depending on the design, strength control may be selective. The signals transmitted (or received) by the radiating elements are controlled by a BFIC (Beamforming Integrated Circuit) element in the beamforming module.

[0162] The DRAC 224 is communicatively coupled to the DRA 222 assembly and the OBP 214 and may send (or receive) signals to (or from) either of them. The DRAC 224 may also be part of the DRA assembly 222. For example, the DRAC 224 may be formed on a beamforming module of the DRA assembly 222 (e.g., beamforming module 302 in FIG. 3 ). Advantageously, this configuration allows for a smaller, lighter, and more efficient DRA.

[0163] The DRAC 224 is adapted to configure and control the DRA assembly 222. In particular, the DRAC 224 is adapted to configure and control the beamforming network of the DRA 222 (e.g., the beamforming module 302 of FIG. 3). This configuration and control may enable the OBP 214 to control analog beamforming, beam hopping, and ground cell beam tracking. The DRAC 224 may be configured to send beam hopping commands to the beamforming integrated circuit (e.g., the BFIC 310 of FIG. 3) to implement beam hopping.

[0164] The DRAC 224 manages the operation of the DRAC assembly 222 and provides a digital interface to the OBP 214. The digital interface may be the DRAC subsystem 112's sole digital interface with the OBP 214. The DRAC 224 may interface with the OBP 214 via dual redundant CAN buses for command, control, and telemetry.

[0165] The DRAC 224 receives instructions from and provides telemetry to the OBP 214 .

[0166] As previously mentioned, the DRAC 224 provides an interface with the BFIC of the DRA assembly 222. The DRAC 224 may interface with the BFIC via a pair of serial buses, which may be operated simultaneously for parallel splitting of beam coefficient variance. The DRAC 224 may control the BFICs via multiple daisy-chain connections along the serial buses.

[0167] The DRAC 224 may store a collection of beam alignment tables ("BLTs"), which store beam grids of various sizes, shapes, and center frequencies in a non-volatile memory flash device.

[0168] The DRAC 224 may support beam hopping sequences with a programmable number of independent hops.

[0169] The DRAC 224 may support beam hopping sequences with time slots of programmable duration.

[0170] The DRAC 224, under the control of the OBP 214, may assist in loading BLTs into the BFIC via a beam sequence index (BLI) message that specifies the BLT list for the hopping sequence.

[0171] The DRAC 224 may support terrestrial cell tracking updates at an integer number of time slots as commanded by the OBP 214 (or as automatically calculated based on terrestrial cell locations).

[0172] The DRAC 224 may support mute and sleep modes for DC power conservation in the DRA assembly 222. Sleep mode may be applied to the BFIC, BAM, and any of the radiating element modules of the module by shutting down the power conditioner (e.g., EPC 320).

[0173] The DRAC 224 may support applying an adjustment factor to the BLT at the frequency center.

[0174] The DRAC 224 may support on-track updates of BLT and tonality tables.

[0175] The DRAC 224 may provide the OBP 214 with redundant CAN buses (eg, A and B) and an Epoch Synchronization interface, and may provide a set of serial buses for interfacing with the BFIC of the DRA assembly 222.

[0176] The DRAC224 may include circuitry embedded directly on the BFN PCB. The DRAC224 may operate in a single string configuration, a dual cold redundant configuration, or a dual hot redundant configuration, all under the control of the OBP214.

[0177] Figure 3 illustrates the DRA assembly 222 of Figure 2, according to one embodiment. The DRA assembly 222 may be a transmit ("Tx") DRA or a receive ("Rx") DRA.

[0178] In general, the DRA 222 may be a phased array antenna, including a collection of antennas or radiating elements 316. It is designed so that the radiation pattern of each radiating element 316 combines constructively with neighboring radiating elements 316 to form an effective radiation pattern called the main lobe. The main lobe transmits radiated energy in the desired location. Meanwhile, the DRA 222 is designed to destructively interfere with signals in undesired directions, nulling them and creating side lobes. The DRA antenna 222 may be designed to maximize the energy radiated in the main lobe and attenuate the energy radiated in the side lobes to an acceptable level. The direction of radiation may be manipulated by changing the phase of the signal applied to each antenna element 316. As a result, each antenna element 316 in the array has a different phase and intensity, creating the desired radiation pattern. The DRA assembly 222 uses semiconductor integrated circuit-based phasing elements to change the direction of the radiation pattern.

[0179] The DRA assembly 222 may be a broadband communications antenna. The DRA assembly 222 may be a beamforming antenna of the class having 10 or more beams. The DRA assembly 222 may transmit or receive multiple (e.g., 16) simultaneous beams.

[0180] The DRA assembly 222 may be a direct radiating antenna array covering the Ka or K band. The DRA assembly 222 may be a TxDRA in the frequency band 17.3 GHz-21.3 GHz. The TxDRA may use a subset of this frequency band. The DRA assembly 222 may be an RxDRA in the frequency band 27 GHz-31 GHz. The RxDRA may use a subset of this frequency band. Each of the DRAs 222 may have single circular polarization (i.e., LHCP or RHCP) or dual polarization (i.e., LHCP or RHCP).

[0181] The DRA assembly 222 is configured to transmit or receive multiple simultaneous beams, which can be independently steered, formed, and hopped. The number of beams can be 10 or more. In certain embodiments, the number of beams can be 16 or more. The DRA assembly 222 performs analog beamforming, which can have any beam diameter, any beam shape, and any beam boresight.

[0182] The DRA includes a beamforming module 302 to perform analog beamforming. The beamforming module 302 may be used to perform phase and (possibly) power adjustments at RF frequencies. The beamforming module 302 may include a DRAC (e.g., DRAC 224).

[0183] The BFN module 302 includes a beam forming network board (BFN board) 304. The BFN board 304 provides structure and organization for components mounted on its surface. The BFN board 304 is a printed circuit board ("PCB"). The BFN board 304 may be a multi-layer PCB. The BFN board 304 provides RF, DC, and digital signal routing between components of the DRA assembly 222 mounted on (or connected to) the BFN board 304. The BFN board 304 is preferably a single board with a flat shape. Beam forming components (e.g., SIP module 308, described below) may be mounted on the BFN board 304. In this case, the mounted beam forming components define a plane substantially parallel to the plane defined by the BFN board 304. The beam forming components may be mounted on the opposite side of the BFN board 304.

[0184] The BFN board 304 has various active components connected via interconnects, which may include the following: a BAM 306, a SIP module 308, and a radiating element 312. The SIP module 308 is attached to the BFN board 304.

[0185] The BFN board 304 may provide the different DC levels required for each active component. The BFN board 304 may route the digital signals from the DRAC to the SIP module 308.

[0186] The active components may be connected to the BFN board 304 by spring-loaded electrical connectors. The SIP module 308 may use a spring-loaded connector interposer to connect to the BFN board 304.

[0187] The layout of the BFN board 304 may be optimized for placement of the SIP modules 308 and thermal management of active heat-generating components. The layout of the SIP modules 308 on the BFN board 304 may be optimized for ease of routing and to minimize performance degradation. The layout of the SIP modules 308 on the BFN board 304 may be optimized for back-to-back mechanical mounting of the SIP modules 308 (double-stack configuration).

[0188] The BFN board 304 may be made of multiple layers of high frequency laminate material. The high frequency laminate may be a ceramic-filled PTFE composite. The layered material provides high RF performance. The layers may be bonded together using fusion bonding.

[0189] The BFN board 304 may be approximately symmetrical in the xy plane and may be divided into quadrants.

[0190] The BFN board 304 is configured to route the beam input RF signal from the OBP (e.g., OBP 214) to the BAM 306. The BFN board 304 is configured to route the output (beam input signal) from the BAM 306 to the SIP module 308 (which controls the beam and its phase and intensity, as well as the radiating element). The BFN board 304 is further configured to route the RF output of the SIP module 308 to a designated radiating element module 312. In an Rx configuration, the BFN board 304 may be configured to perform the above routing in reverse.

[0191] The beamforming module 302 includes a SIP module 308. The SIP module 308 is mounted to and electrically connected to the BFN board 304. The electrical connection to the BFN 304 is shown in FIG. 3 by interconnect 326, which supports communication between the SIP module 308 and other components of the DRA assembly 222. The beamforming module 302 may include any number of SIP modules suitable for the application. There is no particular limit to this number. The SIP modules 308 may be mounted on opposite sides of the BFN board 304 (e.g., the top and bottom).

[0192] The SIP module 308 may include M×N beamforming nodes, in which case the DRA 222 has M beams and N×32 radiating elements.

[0193] Each SIP module 308 is configured to receive a beam input signal. The SIP module 308 adjusts the intensity and phase of each beam for each connected radiating element. For example, in Tx, the SIP module 308 splits each beam into 8 radiating elements and combines 16 beams into each radiating element.

[0194] The SIP module 308 has an RF output to feed each radiating element 316. Each RF output is routed by the BFN board 304 to an RF signal chain path that connects to the radiating element 316 to which the RF output is to be fed.

[0195] The SIP module 308 may include an LDO and a voltage regulator. The LDO provides stable DC power to the BFICs 310.

[0196] The SIP module 308 may include multiple power dividers for separating or combining RF beam signals.

[0197] Each SIP module 308 includes one or more BFICs (Beamforming Integrated Circuits) 310. In one embodiment, each SIP module 308 includes six BFICs. The BFICs 310 may be space-grade and may be fabricated with a rad-hard process.

[0198] The BFIC 310 implements analog, digital, and RF functions. The BFIC 310 is configured to adjust the phase and intensity for each radiating element 316 and each beam. The BFIC 310 may have N nodes, where N is equal to the number of simultaneous beams multiplied by the number of radiating elements in the DRA assembly 222. The BFIC 310 may be configured to perform beam forming, beam steering, and beam hopping. The BFIC 310 may include RF power splitters and combiners.

[0199] The BFIC 310 may be communicatively coupled to the DRAC 224 using the BFN board 304, thereby enabling the BFIC 310 to receive instructions from the DRAC 224. The DRAC 224 supports beam hopping performed by the BFIC 310.

[0200] The beam forming module 302 also includes one or more beam amplification modules 306 (BAMs 306). In one embodiment, the beam forming module 302 includes four BAMs 306 per DRA assembly 222.

[0201] The BAM 306 is electrically connected to the BFN board 304 via a spring-loaded electrical connector. This electrical connection is shown in Figure 3 by interconnect 324. The BAM 306 receives RF beam signals from (or transmits RF beam signals to) the OBP 214 via the electrical connector and the BFN board 304.

[0202] The BAM 306 is a multi-port device that combines or separates RF signals between one single port and another. The BAM 306 may perform pre-amplification (for Tx applications) or post-amplification (for Rx applications). Pre-amplification may be performed in the BAM 306 before the BFIC 310 signal conditioning to prevent losses associated with separation and combination within the beamforming module 302 (losses that would occur within the BFN board, SIP module, and / or BFIC). This may include the use of a balanced medium power amplifier to provide sufficient gain with the necessary linearity. Post-amplification may be performed in the BAM to amplify the RF signal input at a low level from the beamforming module. In a TxDRA implementation, post-BFIC amplification is performed in the RF signal chain path (described below). In an RxDRA implementation, post-amplification is performed in the BAM 306. The BAM 306 may include an LNA chip to perform the amplification. In one embodiment, the BAM 306 may provide three individual RF channels and local DC voltage regulation.

[0203] The BAM 306 may be attached to a thermal blade 318 for heat sinking. Thermal management of the BAM 306 may be achieved by lowering high heat dissipation components of the BAM 306 (e.g., an amplification unit) to the thermal blade 318.

[0204] The DRA assembly 222 includes a thermal blade 318. The thermal blade 318 may be the thermal blade 408 of FIG. 4 or the thermal blade 528 of FIG. 5. The thermal blade 318 transfers thermal energy from a heat-generating source (e.g., components of the beam forming module 302, an RF signal chain path, etc.) to a heat sink. The thermal blade 318 may transfer heat passively (e.g., without the need for pumping). The thermal blade 318 is disposed within the DRA assembly 222, allowing the thermal blade 318 to efficiently receive and transfer heat 322 from the heat-generating components. This may include attaching certain components of the DRA assembly 222 (e.g., the BAM 306, the radiating element module 312) to the thermal blade 318, directly or indirectly. This allows heat to be transferred from those components to the thermal blades 318 (e.g., the SIP module 308 may contact the heat and transfer it to the interface plate (on which the thermal blades 318 are mounted). For example, the interface plate may couple the heat generated in the module 308 to all of the thermal blades in the DRA.

[0205] The DRA assembly 222 includes an electrical power conditioner ("EPC") 320. The EPC 320 may include multiple physically separate EPC modules. The EPC 320 cleans and conditions electrical power. The EPC 320 is physically connected to a power source (from which the EPC 320 receives the power to condition). The EPC 320 is connected to the BFN board 304 via one or more physical connectors (e.g., cables) to provide power 330 to components electrically connected to the BFN board 304. The EPC 320 provides conditioned power to the beamforming module 302 via one or more physical connectors. The EPC 320 may interface with the spacecraft power distribution unit for bus power and with a command and data handler for on / off control and analog telemetry.

[0206] The DRA assembly 222 includes multiple radiating element modules 312. Each radiating element module 312 includes a radiating element 316 and an RF signal chain path 314 connected to the radiating element 316. The RF signal chain path 314 includes an RF path (for RF signals) and may include DC and various electrical signals. The radiating element module 312 may include multiple radiating elements 316 and multiple RF signal chain paths 314. In a specific embodiment, each radiating element module 312 includes four radiating elements 316 and four RF signal chain paths 314. Each radiating element 316 is connected to one RF signal chain path 314 (sometimes referred to as a "four-pack"). The number of radiating elements 316 and the number of RF signal chain paths within the radiating element module 312 are not particularly limited. For example, in another embodiment, the radiating element module 312 includes six radiating elements 316 and six RF signal chain paths 314. Alternatively, in another embodiment, the radiating element module 312 includes eight radiating elements 316 and eight RF signal chain paths 314 .

[0207] The radiating element module 312 may include a front end with the radiating element 316, a polarizer and a filter, and may include a back end with RF and voltage control circuitry mounted on a printed circuit board.

[0208] Each of the radiating elements 316 is essentially part of an antenna of the DRA 222 and is itself capable of radiating or receiving RF energy.

[0209] The RF signal chain path 314 includes one amplification unit for signal amplification. The amplification unit may be a solid-state power amplifier (SSPA) or a low-noise amplifier (LNA). The majority of the DRA 222 gain resides in the RF signal chain path 314. The RF signal chain path 314 may include a polarizer, a filter, an amplifier, and an isolator. The RF signal chain path 314 may implement a pre-driver before the high-power amplification stage or gain block or after the low-noise amplification stage to provide sufficient amplification. The RF signal chain path 314 may be implemented with an optimal RF taper by using different SSPA types and / or controlling their operation.

[0210] The RF signal chain path 314 includes electrical connectors for connecting the radiating element modules 312 to the BFN board 304 and for supporting communication between the RF signal chain path and other beamforming components, which are represented in FIG. 3 by interconnects 328.

[0211] As mentioned above, certain active components of the DRA assembly 222 (e.g., the radiating element module 312 (RF signal chain path 314), the BAMs 306, or the SIP module 308) may be electrically connected to the BFN board 304 via spring-loaded electrical connectors. The electrical connectors may include spring contacts on two sides of the connector, with one side contacting the substrate and the second side contacting the BFN board 304. Using spring-loaded electrical connectors to connect active components to the BFN board 304 is particularly useful. Such connectors require low or no insertion force. Traditional or current methods for establishing electrical connections within antenna assemblies (e.g., soldering) can fail under thermal cycling conditions. For example, a DRA assembly mounted on an orbiting communications satellite would be subject to irregular thermal cycling. In LEO applications, communications satellites orbit the Earth every 90 minutes and have varying traffic loadings (which can also cause highly variable self-heating). Such thermal cycling can be very damaging to solder joints, especially over the course of several years as the communications satellite orbits the Earth multiple times. Therefore, by using the spring-loaded electrical connectors described above, the DRA assembly 222 (and certain components thereof) is more resistant to the effects of thermal cycling that a communications satellite in orbit is exposed to. This improves the functionality and reliability of the DRA assembly and the communications satellite on which it is mounted.

[0212] The following describes the operation of the Rx-type DRA assembly 222 according to an embodiment. A composite radiated input signal (e.g., 16 beams) is incident on the radiating elements 316 of a radiating element module 312 (e.g., a 4-pack). The composite radiated input signal is then amplified. This includes amplification by amplifier components (e.g., LNAs) in the RF signal chain path 318 of the radiating element 316. The majority of the signal amplification occurs in the RF signal chain path 314. The signal from each radiating element 316 is then routed to a SIP module 308 mounted on the BFN board 304. The SIP module 308 splits the received signal into multiple (e.g., 16) identical signals. Each SIP module 308 includes multiple (e.g., 6) BFICs 310, which include a phase shifter, a step attenuator, and a coherent combiner (e.g., 512:1). Each partial beam at the output of the SIP module 308 is routed by the BFN board 304 to another coherent combiner. This other coherent combiner combines the various beam information to generate a complete beam information based on the signals received from each radiating element 316. The BFN board 304 routes each beam from the output of the coherent combiner to an input port of a beam amplification module ("BAM"). The BAM 306 performs amplification of the received beam. The BAM 306 outputs the amplified beam. The output beam is routed to an input port of the OBP 214 for further processing by the OBP 214.

[0213] The operation of the Tx-type DRA assembly 222 according to the embodiment is described below. Each beam at the output of the OBP 214 is routed to a BAM input port. The BAM 306 amplifies the received beam. The amplified beam output from the BAM 306 is then routed from the BAM 306 to the connected BFN input port. The beam signal received at the BFN undergoes an initial split (e.g., into 64 beams). The split beams are routed to the SIP module 308. The SIP module 308 further splits the received beam (e.g., into two beams). Within the SIP module 308, the signal is routed to the BFICs 310. The BFICs 310 further split the signal (e.g., a 4-way split). The BFIC 310 also adjusts the phase and intensity of the signal. After phase and intensity adjustment, the signals from the 16 beams are coupled to each of the 16 radiating elements 316 (in the BFIC 310 and the SIP module 308). The signal from the BFN output is sent to a designated RF signal chain path 314. The radiating element module RF signal chain path 314 amplifies the signal. The amplified signal is then provided to the radiating element 316 for radiation. The majority of the signal amplification occurs in the RF signal chain path 314.

[0214] 4 illustrates a thermal management subsystem 400 for managing heat generated by a DRA assembly (e.g., DRA assembly 222 of FIG. 2), according to one embodiment. Thermal management subsystem 400 may include components of temperature control subsystem 216.

[0215] The thermal management subsystem 400 is configured to manage heat generated by the active components of the DRA assembly 222 and improve the thermal efficiency of the DRA assembly 222. The thermal management subsystem 222 may passively manage (i.e., passively cool) the heat generated by the DRA assembly 222. The thermal management subsystem 400 may passively maintain the active components within the DRA assembly 222, thereby maintaining the amplification unit at a uniform temperature. To achieve passive cooling, the thermal management subsystem 400 provides a high level of natural convection and heat dissipation by using a heat spreader (e.g., a thermal blade) or heat sink to maximize heat transfer by radiation or convection.

[0216] The thermal management subsystem 400 may serve multiple DRA assemblies.

[0217] The DRA assembly 222 includes multiple heat-generating units 404. The heat-generating units are active components of the DRA assembly 222 and generate heat during operation (i.e., they are active heat sources). The heat-generating units 404 may be electrical devices such as amplifiers.

[0218] The components of the DRA assembly 222 that include the heat-generating component 404 include the RF module 318, the SIP module 308, and the BAM 306. The heat-generating component 404 of the RF module 318 may be in the RF signal chain path 314.

[0219] The thermal management subsystem 400 includes a thermal blade 408. The thermal blade 408 has one or more heat-generating units 404. The thermal blade 408 may act as a heat spreader for heat generated by the heat-generating units 404. The thermal blade 408 may remove heat from the core of the DRA assembly 222 to the outside. The thermal blade 408 may be configured to passively transfer and dissipate the heat generated by the heat-generating units 404 to one or more temperature sink elements (e.g., temperature sink element 412, described below). The thermal blade 408 may passively maintain the same type of heat-generating units 404 at a uniform temperature relative to each other.

[0220] The thermal blade 408 may also receive heat indirectly from the heat-generating unit 404. For example, heat generated by the heat-generating unit of the SIP module 308 may be conducted to an interface plate of the DRA assembly and then conducted to the thermal blade 408 (which is attached to the interface plate).

[0221] Each thermal blade 408 includes a heat pipe. The heat pipe may be adapted for direct or indirect heat transfer. The heat pipe may be an active heat pipe, in which case a fluid pump is provided for active cooling (actively cooling the thermal blade). The heat pipe may also be a passive heat pipe for passive cooling. The heat pipe may be an oscillating heat pipe (or "pulsating heat pipe"). The oscillating heat pipe may be a conventional oscillating heat pipe. The heat pipe may also operate as a heat transfer device. Such a heat transfer device combines the principles of thermal conduction and phase change to efficiently transfer heat at the interface between two solids. In one embodiment, a liquid in contact with a thermally conductive solid surface at the hot interface of the heat pipe absorbs heat from the surface and vaporizes. The vapor then flows along the heat pipe to the cold interface, condenses, and releases its latent heat. The liquid then returns to the hot interface by capillary action, centrifugal force, or gravity. The cycle repeats.

[0222] Heat pipes may include sealed pipes or tubes made of a material compatible with the working fluid. In the case of oscillating heat pipes, the heat pipe may be only partially filled with the working fluid. Oscillating heat pipes may be configured in a serpentine pattern, with alternating segments of liquid and vapor in free motion within the serpentine pattern. The vibrations occur within the working liquid; the pipe itself is stationary.

[0223] The thermal management subsystem 400 further includes a temperature sink element 412 for receiving heat from the thermal blade 408. Heat transfer from the thermal blade 408 to the temperature sink element 412 occurs via a heat dissipation path 422. The temperature sink element 412 may include a heat pipe. A spacecraft heat pipe may function similarly to a thermal blade in terms of heat conduction / exchange. Heat exchange between the thermal blade 408 and the temperature sink element (e.g., a spacecraft heat pipe) occurs via conduction. Heat is transferred from the thermal blade 408 to the temperature sink element 412 at a heat exchange interface. The heat exchange interface may be formed on the top surface of the thermal blade 408. The thermal blade 408 transfers heat from the heat-generating unit 404 to the temperature sink element 412 along a heat dissipation path 422. The temperature sink element 412 may be a heat pipe (e.g., a spacecraft heat pipe).

[0224] The temperature sink element 412 may be attached directly to the thermal blade 408. For example, the temperature sink element 412 may be attached directly to the top surface of the thermal blade 408, where the top surface provides a heat exchange interface between the thermal blade 408 and the temperature sink element 412.

[0225] The temperature sink element 412 may transfer the heat received from the thermal blade 408 to a heat sink 416 (e.g., a radiator). The transfer of heat from the temperature sink element 412 to the heat sink 416 occurs via a heat dissipation path 424. The heat sink 416 may be a spacecraft radiator. The heat sink 416 may be configured to reject the received heat to the environment (e.g., space). The heat sink 416 may be a spacecraft panel or a flat-plate radiator attached to the spacecraft. The spacecraft panel may be a structural spacecraft panel or a panel that deploys when the spacecraft is in orbit. The heat sink 416 may reject heat from a surface of the heat sink 416 via infrared radiation.

[0226] 5A and 5B show a perspective view 500a and a partial cross-sectional view 500b of a DRA assembly 510 according to one embodiment.

[0227] DRA assembly 510 may be DRA assembly 222 of Figures 2 and 3. DRA assembly 510 may be part of DRA subsystem 110 of Figure 1.

[0228] The DRA assembly 510 may be mounted on a spacecraft (e.g., the communications satellite of FIG. 1).

[0229] The DRA assembly 510 may be used to transmit and / or receive RF radio signals in a predetermined frequency band.

[0230] The DRA assembly 510 includes multiple heat dissipation elements 512. The heat dissipation elements 512 are hidden in FIG. 5A by a sunshield 519 (which covers the heat dissipation elements 512). The heat dissipation elements 512 form a heat dissipation element active grid (which defines the heat dissipation surface 514 of the DRA active 510). The heat dissipation surface 514 is approximately circular. The heat dissipation elements 512 define a heat dissipation element face 516 (which is indicated by arrows 516 in FIG. 5B). The heat dissipation elements 512 are organized into 4-packs (i.e., groups of four heat dissipation elements 512 belonging to the same heat dissipation element module and connected to each other). Examples of heat dissipation element 4-packs are shown in FIGS. 8A and 8B. The heat dissipation elements 512 in each 4-pack are arranged in parallel. As mentioned above, the number of heat dissipation elements (and RF signal chain paths) in a heat dissipation element module is not particularly limited, and the 4-pack is merely one example of a heat dissipation element module. For example, other variations include a 6-pack heat dissipation element module and an 8-pack heat dissipation element module.

[0231] Each quad-pack of heat dissipation elements 512 is attached to an RF module 520. The RF module 520 houses four RF signal chain paths for signal amplification. Each of the four RF signal chain paths in the RF module 520 is connected to one heat dissipation element 512 in the quad-pack. The RF module 520 (and the RF signal chain paths therein) are positioned in the same plane as the heat dissipation elements 512.

[0232] Each of the RF modules 520 includes an interconnect 522. The interconnect 522 may include multiple connectors (i.e., one or more RF connectors, one or more DC connectors, and other electrical connections). The interconnect 522 is a spring-loaded electrical connector. The connector 522 may connect RF signals in the RF signal chain to the BFN board, other components in the RF signal chain, and various electrical signals. The interconnect 522 is located at the end of the RF module 520 opposite the end where the radiating elements 512 are attached. The four-pack of radiating elements 512, the RF module 520, and the interconnect 522 form a radiating element module. The radiating element module (including the radiating elements 512, the RF module 520, and the interconnect 522) is shown in FIG. 5B. With respect to FIG. 5B , note that (for clarity) only a subset of the radiating element modules of the DRA assembly 510 is shown; additional radiating element modules are attached to thermal blades 528 within the DRA assembly 510. Generally, each thermal blade 528 has at least one radiating element module attached. A given thermal blade 528 may have one or more radiating element modules attached to one side of the thermal blade, or one or more radiating element modules attached to both (opposing, i.e., facing) sides of the thermal blade. For example, the outermost or edge thermal blade 528 of the DRA may have radiating element modules attached to only one side.

[0233] Interconnect 522 connects RF module 520 (and the RF signal chain paths contained therein) to BFN board 524 .

[0234] BFN board 524 is disposed on and defines board plane 526, which is indicated by arrow 526 in FIG. 5B. Board plane 526 is generally perpendicular to radiating element plane 516. That is, BFN board 524 and radiating element module (including radiating element 512 and RF module 520) are generally perpendicular to each other within DRA assembly 510.

[0235] The DRA assembly 510 includes a plurality of thermal blades 528. Each RF module 520 is attached to a thermal blade 528. Typically, the thermal blades 528 are positioned between rows of RF modules. Each thermal blade 528 has one or more RF modules 520 attached to opposite sides of the thermal blade 528. The thermal blades 528 may be connected to spacecraft bus heat pipes or spacecraft bus thermal interfaces.

[0236] The thermal blade 528 is generally mounted so as to be perpendicular to the BFN board 524 (and interface plate 544). The thermal blade 528 defines a blade plane that is generally parallel to the radiating element plane 516 and generally perpendicular to the board plane 526.

[0237] Each thermal blade 528 may comprise one or more heat pipes (e.g., oscillating heat pipes) or solid metal (e.g., aluminum) thermal blades 528 to support heat transfer from the active components of the DRA assembly 550 and maintain temperature uniformity. The thermal blades 528 may have high heat transfer efficiency. The thermal blades 528 may have a passive design including no moving parts. The thermal blades 528 may be actively cooled using a fluid pump. The thermal blades 528 may transfer heat from the center of the DRA assembly 510 (e.g., where the RF module 520 is mounted) to the sides. Such heat transfer is also shown in FIG. 10.

[0238] The thermal blade 528 may provide mechanical adjustment (e.g., by mounting components) for the DRA assembly 510. The thermal blade 528 may also provide structural support for the mounted components (e.g., radiating element modules).

[0239] Each thermal blade 528 has a blade height 530 and a blade length 532. The blade height 530 may vary for different embodiments of the DRA assembly. The blade height 530 may be selected based on the layout of the radiant element modules and the heat dissipation requirements. The blade length 532 may also vary. The blade length 532 may be selected based on the number of spacecraft heat pipes attached to the thermal blade 528 (e.g., the more spacecraft heat pipes, the longer the blade length will be required to attach the spacecraft heat pipes and provide a thermal interface). The blade length 532 may be shorter in an RxDRA assembly than in a TxDRA assembly. The blade length 532 may be selected based on the heat generated by the attached components.

[0240] The DRA assembly 510 also includes multiple BAMs 534. In one embodiment, the number of BAMs in the DRA assembly 510 is four.

[0241] Each BAM 534 includes an interconnect, which is a spring-loaded electrical connector. The interconnect connects the BAM 534 to the BFN board 524. The BAMs 534 are generally located in the same plane 516 as the radiating element modules. Thus, the BAMs 534 are generally located perpendicular to the BFN board 524.

[0242] The BAM 534 is attached to the thermal blade 528. The BAM 534 may be attached to the thermal blade 528 in the same manner as the RF module 520. By attaching the BAMs 534 to the thermal blade 528, heat generated by the active components of the BAM 534 can be conducted to the thermal blade 528 for dissipation.

[0243] Each thermal blade 528 includes an upper surface 538 and a lower surface 540 .

[0244] The top surface 538 may provide a heat exchange interface for heat received by the thermal blade 528 from the active components of the DRA assembly 510 (and may provide a DRA-external thermal interface for the DRA assembly 510). For example, spacecraft heat pipes may be attached to the top surface 538 of the thermal blade 528 to receive heat from the thermal blade 528 via the heat exchange interface. The number of spacecraft heat pipes attached to the thermal blade 528, the thermal interface material, and the number of attachment interfaces may vary. The size of the top surface 538 may be sufficient to provide heat transfer capable of achieving compensation for temperature differences. The top surface 538 may include a high-efficiency thermal filter.

[0245] The lower surface 540 may be used to attach the thermal blades 528 (and consequently the components attached to the thermal blades 528, such as radiant element modules and BAMs 536) to the upper surface 542 of the spacecraft interface plate 544. The spacecraft interface plate 544 is attached to the spacecraft bus panel. Heat may be transferred from the interface plate 544 (heat from the SIP) to the thermal blades 528 through the interface 540. The interface plate may couple the heat from the SIP modules to all of the thermal blades 528 in the DRA 510.

[0246] The DRA assembly 510 includes cross straps 546. The cross straps 546 may secure the thermal blades 528 together, thereby providing further structural adjustment and positioning of the DRA assembly 510. The cross straps 546 are attached to the thermal blades 528 at their top surfaces 538. A cross strap 546 is included on each side of the radiating element active grid.

[0247] The DRA assembly 510 may include one or more heat shields. The heat shields may be used to cover exposed RF modules 520 (e.g., in front of the front blade or behind the rear blade). The heat shields are attached to the thermal blades 528.

[0248] The DRA assembly includes multiple SIP modules (not shown). The SIP modules are mounted on opposite sides of the BFN board 524 (see, for example, FIG. 6). The SIP modules may be configured in a double stack on the BFN board. The SIP modules may be mounted on the BFN board 524 such that a plane defined by the SIP modules is substantially parallel to a plane defined by the BFN board 526 (i.e., plane 526). The SIP modules mounted on the top side of the BFN board 524 may be thermally coupled to the interface plate 544 to conduct heat generated by the heat-generating units of the SIP modules to the thermal blade 528 for heat dissipation.

[0249] DRA assembly 510 includes a BFN cover 552. BFN cover 552 is attached to a lower surface 554 of interface plate 544. BFN cover 552 houses BFN board 524 and components (e.g., SIP modules) attached thereto.

[0250] The DRA assembly 510 may include one or more EPC modules 556. The EPC modules 556 are attached to dedicated EPC thermal blades 558. The EPC thermal blades 558 are structurally and functionally similar to the thermal blades 528. The EPC thermal blades 558 include a top surface 560. The top surface 560 provides a heat exchange interface for the EPC thermal blades 558. The cross straps 546 are also attached to the top surface 560 of the EPC thermal blades 558.

[0251] Mounting the EPC module 556 on a dedicated thermal blade 558 provides the advantage of reduced cable length. The EPC module 556 may be mounted on the EPC thermal blade 558 to provide a large heat exchange area between the EPC module board and the thermal blade 558.

[0252] EPC thermal blade 558 is attached to interface plate 544 (similar to thermal blade 528). EPC module 556 extends through a hole in interface plate 544, so that the connector port of EPC module 556 appears on the outside of interface plate 544.

[0253] Connector 562 connects at a first end to a connector port on EPC module 556 and at a second end to a connector port on BFN board 524. Connector 562 extends through a hole in BFN cover 552 to connect to BFN board 524.

[0254] The DRA assembly 510 offers several advantages. The DRA assembly 510 is designed to be modular and scalable, offering high performance and ease of integration. The DRA assembly 510 uses a single board for the beamforming network. The single beamforming network can deliver all RF and electrical signals and DC power to the RF signal chain of the DRA 510. Using a single board for the beamforming network offers several advantages, such as lower cost, lower mass, fewer interconnects, and fewer components. The DRA assembly 510 allows all SIP modules 550 and BFN boards 524 to be located on approximately the same plane (e.g., plane 526). Advantageously, this arrangement simplifies the interconnections between the BFN boards and the radiating element modules.

[0255] FIG. 6 illustrates a top perspective view 600 of a BFN assembly 610 of the DRA assembly 510 of FIG. 5, according to one embodiment.

[0256] The BFN assembly 610 is a single board planar implementation.

[0257] The BFN assembly 610 includes a BFN board 524. The BFN board 524 includes a top surface 612 and a bottom surface 614.

[0258] The BFN assembly 610 includes multiple SIP modules 550. The SIP modules 550 may be mounted in a single plane. Mounting the SIP modules in a single plane (i.e., planar mounting on the BFN board) can solve various problems that arise when SIPs are mounted on multiple boards (and thus, multiple planes). For example, when SIP modules are mounted on multiple boards (and thus, multiple planes), the interconnections between them become more complex, leading to increased mass, increased cost, and reduced RF performance.

[0259] The SIP modules include top-mounted SIP modules 616 (which are mounted on the top surface of BFN board 524) and bottom-mounted SIP modules 618 (which are mounted on the bottom surface of BFN board 524). Top-mounted SIP modules 616 and bottom-mounted SIP modules 618 each define a plane that is substantially parallel to the plane defined by BFN board 524 (e.g., plane 526 in FIG. 5B). The number of SIP modules in BFN assembly 610 can vary depending on the application.

[0260] The SIP modules 550 are mounted to the BFN board 524 in a "double stack" or "back-to-back" configuration. In this case, each double stack includes a top-mounted SIP module 616 and a bottom-mounted SIP module 618. Generally, the top-mounted SIP module 616 and the bottom-mounted SIP module 618 face the same direction toward the BFN board 524, so that the bottom of the top-mounted SIP module 616 is aligned with the bottom of the bottom-mounted SIP module 618. The top-mounted SIP module 616 may be connected to the bottom-mounted SIP module 618 using multiple fasteners, which also function as thermal conductors to transfer heat from the bottom-mounted SIP module 618 to the top-mounted SIP module 616. When positioned within the DRA 510, the top-mounted SIP module 616 may contact an interface plate (e.g., interface plate 544 in FIG. 5). This supports heat transfer from the top-mounted SIP module 616 to the interface plate (this heat may be generated in the top-mounted SIP module 616 or generated in the bottom-mounted SIP module 616 and transferred to the top-mounted SIP module 616). The heat may be transferred to a thermal blade (e.g., thermal blade 528 in FIG. 5) for dissipation.

[0261] The top surface 612 of the BFN board 524 includes multiple radiating element module electrical ports. These radiating element module electrical ports are arranged in an area 626. The radiating element module electrical ports are configured to receive electrical connectors of radiating element modules to support electrical connection between RF signal chain paths and the BFN assembly 610. The BFN board 524 includes a radiating element module electrical port for each radiating element module in the array. The radiating element module electrical ports may include multiple ports (e.g., an RF port for each RF signal chain path in the radiating element module, 3 / 4 DC ports, and multiple digital / CMD / TM ports, etc.).

[0262] 7 shows an embodiment of a SIP module 700 in isolation, which may be SIP module 308 of FIG. 3 or SIP module 550 of FIG.

[0263] The SIP module 700 may be mounted on the top or bottom of a BFN board (e.g., BFN board 524). The SIP module 700 may be arranged in a DRA assembly in a double-stack configuration.

[0264] The SIP module 700 includes a top cover 706. The top cover 706 may be made of aluminum. The top cover 706 may contact an interface plate (e.g., interface plate 544 in FIG. 5) when assembled into a DRA assembly and may support heat conduction from the SIP module 700 (or other SIP modules).

[0265] The SIP module 700 includes a substrate layer 708. The substrate layer 708 may be an LTCC substrate. One or more BFICs may be attached to the substrate layer 708. In a particular embodiment, six BFICs are attached to the substrate layer 708.

[0266] The SIP module 700 includes a bottom cover 704. When the SIP module 700 is attached to a BFN board, it may include a thermal gasket between the SIP module (bottom cover 704) and the BFN board.

[0267] The SIP module 700 includes a SIP-to-BFN board interposer 702. The interposer 702 may provide electrical interface routing between one socket or connection and another. The interposer 702 may provide a spring-loaded electrical connection to the BFN board. The spring-loaded electrical connection provides reworkability of the BFN assembly and reworkability of the DRA. The interposer 702 may receive signals generated by the BFICs of the SIP module 700 and route the signals to the BFN board for further processing.

[0268] The SIP module 700 also includes mounting holes 710 configured to receive fasteners therethrough. The fasteners may be used to connect the SIP module 700 to a BFN board. In the case of a double stack configuration, the fasteners may be used to connect the SIP module 700 to a second SIP module.

[0269] 8A and 8B illustrate a radiating element (“RE”) module 800 according to one embodiment. The radiating element module 800 may be used in the DRA assembly 510 of FIG. 5. The illustrated radiating element module 800 has four radiating elements (and four RF signal chain paths). However, in other embodiments, the radiating element module 800 may have fewer (or more) radiating elements and RF signal chain paths.

[0270] The RE module 800 includes an RF radiating element four-pack 802 having four RF radiating elements 804 arranged in an array. The radiating elements 804 may be 3D printed. Typically, each radiating element 804 has a hexagonal cross-section 816. In alternative embodiments, the cross-sections of the radiating elements 804 may be square or circular. Adjacent radiating elements 804 have an element spacing defined by the linear distance between the geometric centers of the cross-sections of adjacent radiating elements 804 (in this case, the cross-sections are hexagonal). Typically, element spacing within the radiating element array is maintained geometrically between the outer radiating elements 804 of a four-pack 802 and the outer radiating elements of adjacent radiating element four-packs.

[0271] The RE module 800 includes an RF module 806. The radiating element four-pack 802 connects to the RF module via a connection. The connection includes an electrical and mechanical interface between the radiating element and the RF signal chain path (i.e., between the radiating element component and the RF module). This interface provides RF connectivity and tuning characteristics. The connection supports alignment of the RF module 806 and the radiating element 804. The connection aligns, bonds, and seals the RF module 806 and the radiating element four-pack 802. This creates the radiating element module 800.

[0272] The RF module 806 houses various active components. The RF module 806 includes one amplification path per radiating element 804 to amplify the RF signal.

[0273] The RF module 806 may include mounting holes for receiving fasteners (e.g., screws) for connecting the RF module (and thus the RE module (radiating element module) 800) to the thermal blade. The mounting holes may be common mounting holes for attaching the RE modules 800 back-to-back to the thermal blade throughout the DRA. The mounting holes may be used to press the RE module 800 against the thermal interface (e.g., the thermal blade) for good conductivity.

[0274] The RE module 800 includes a spring-loaded connector 812 for connecting to the BFN board of the DRA assembly. The spring-loaded connector 812 provides an RF and DC interface. The spring-loaded connector 812 may provide translational and rotational tolerance.

[0275] The 4-pack RE module 800 may facilitate easy assembly of the DRA assembly and allow for rapid customization and adaptation according to antenna requirements (e.g., different numbers of radiating elements).

[0276] 9 shows a partial cross-sectional view of a radiating element module 900 according to one embodiment. The cross-sectional portion 900 corresponds to the RF module of the radiating element module 900. Advantageously, the radiating element module 900 is low-cost and highly manufacturable. The radiating element module 900 may be connected to a BFN board (e.g., BFN board 524 of FIG. 5).

[0277] The radiating element module 900 has a radiating end portion 914 and an RF chain end portion 916, which are located at opposite ends along the length of the radiating element module 900.

[0278] Starting from the radiating end 914, the radiating element module 900 includes a four-pack 902 of radiating elements 904a, 904b, 904c, and 904d (collectively referred to as radiating elements 904). The radiating elements 904 are arranged in a row (or linear array).

[0279] Each radiating element 904 of the four-pack 902 may be connected to a polarizer, a filter, an amplifier, and / or an isolator. A filter may be part of the radiating element 904.

[0280] The radiating element module 900 includes an RF module 908. The RF module 908 is connected to the radiating element 904 at a first end near the radiating end and to a spring-loaded electrical connector 912 at a second end near the RF signal chain path end 916. The electrical connector 912 connects the RF module 908 (and the radiating element module 900) to a BFN board of a DRA assembly (e.g., BFN board 524 of DRA assembly 510 in FIG. 5). The RF module 908 (e.g., its housing) may be part of an integrated radiating element 904 (i.e., the RF module 908 and a separate radiating element 904).

[0281] The RF module 908 includes a circuit board 918 on which various electrical components are mounted. The circuit board 918 may be a soft organic board. The electrical components include a chipset. The chipset may include a high-power amplifier (HPA) or a low-noise amplifier (LNA). The chipset also includes an RF tuning chip (which compensates for phase and intensity over temperature). The RF tuning chip may be used for pre- / post-amplification. The RF tuning chip may be optimized for low-power compensation and dynamic control (intensity / phase). This allows the radiating element module 900 to track well over temperature.

[0282] The RF module 908 includes an RF signal chain path 910 (or signal amplification path) for each radiating element 904 in the four-pack 902 (thus the number of RF signal chain paths equals the number of radiating elements in the radiating element module). The RF signal chain paths 910 may be arranged adjacent to each other in parallel. In one embodiment, the RF module 908 houses four individual RF chains.

[0283] Each of the RF chains is connected to a dedicated radiating element, for example in Figure 9, RF signal chain path 910 is connected to radiating element 904b.

[0284] The RF module 908 may include an active RF circuit-radiating element interface, which is the interface between the active RF circuit and the radiating element 904. The active RF circuit-radiating element interface may be designed for low loss, wideband RF performance, and ease of manufacturing.

[0285] The RF signal chain paths of the RF module 908 may be contained within the collective radiating element base (also referred to as the collective element base) of the radiating element module 900. The collective radiating element base is defined by the radiating elements 904 (i.e., contained within the portion defined by the collective base). Each of the radiating elements 904 defines an individual element base (or volume). Such base is defined by the cross-section of the radiating elements 904 as viewed from the radiating end 914. In this case, the cross-section of the radiating elements 904 is a hexagon extending from the radiating end 914 toward the RF chain end 916. The collective (or combined) element base includes the combination of the individual bases of each radiating element 904. In general, the RF signal chain paths 910 may be arranged parallel to each other and within their respective radiating element bases. By arranging the RF signal chain paths 910 so that they are all contained within the collective radiating element base, the spacing between elements (i.e., the spacing between adjacent radiating elements) can be narrow (e.g., relatively small).

[0286] The RF signal chain paths 910 may be contained entirely within each element (see FIG. 9). Additionally, each RF signal chain path 910 may be contained entirely within its respective element base, with all RF signal chain paths contained within the collective radiating element base of the radiating element module 900.

[0287] A four-pack radiating element module 900 houses each RF signal chain path.

[0288] In a Tx implementation, each RF signal chain path 910 may amplify and transmit a beamformed composite signal generated at the OBP via multiple (e.g., 16) beam inputs. In a Tx, a radiation power taper may be used to maximize beam performance.

[0289] In an Rx implementation, each RF signal chain path 910 may receive and amplify weak user composite signals before separation in the beamforming module. In Rx, received power taper may be used to maximize beam performance.

[0290] The RF signal chain path 910 may include various components (e.g., filters, isolators, RF components, and DC components, etc.). The isolators may perform impedance matching between the amplification units (e.g., HPAs, LNAs) and the radiating element 904. The RF signal chain path 910 also includes amplifiers. The amplifiers may be located before or after the filters and isolators (e.g., before Tx, after Rx).

[0291] The RF module 908 may be configured such that the heat dissipation devices (e.g., amplifiers) of the RF module 908 dissipate heat along a thermal path (e.g., through a thermal blade to a spacecraft heat pipe) to the DRA heat sink. This design improves thermal efficiency.

[0292] FIG. 10 shows a cross-sectional view of an embodiment of a DRA assembly 1000, illustrating the heat dissipation paths of the heat-generating components of the DRA assembly. Similar to FIG. 5B, FIG. 10 shows only a subset of the radiant element modules that are attached to the thermal blades in the assembled DRA. Additional radiant element modules, not shown, are present in the assembled DRA. Each thermal blade may have at least one radiant element module attached to it.

[0293] Thermal control and management of the heat dissipation paths of the active components of the DRA assembly 1000 may be performed by the thermal management subsystem 400 of Figure 4. The thermal management performed by the DRA assembly 1000 is passive.

[0294] As previously mentioned, the DRA assembly 1000 includes heat-dissipating components. That is, the DRA assembly 1000 includes heat-generating components that generate and dissipate heat during operation of the DRA assembly 1000. Such components are active components of the DRA assembly 1020. Such components then generate heat that must be managed and controlled to maintain the efficiency of the DRA assembly 1000 and to keep such components within an acceptable temperature range.

[0295] The heat dissipation components of the DRA assembly 1000 include an RF module, a SIP module, and BAMs. The RF module is represented in FIG. 10 by RF module 1004. The BAMs are not shown in FIG. 10 but are mounted on a BFN board 1036 (similar to FIG. 6). The RF module 1004, SIP module, and BAMs 1012 may be the primary heat dissipation components of the DRA assembly 1000. Therefore, in this case, management of heat (generated by these components) by the DRA assembly 1000 is important to optimize the functionality of the DRA 1000.

[0296] In general, heat from the heat-generating components of the RF module 1004, BAMs 1012, and SIP module is conducted to the thermal blade 1016. The thermal blade 1016 is attached to the interface plate 1004.

[0297] The DRA assembly 1000 is configured such that the RF module 1000 (particularly its heat-generating components) conducts heat from the heat-generating components to the thermal blade 1016 (to which the RF module 1004 is attached). The heat is conducted along the RF module heat dissipation path 1020.

[0298] The RF module 1004 includes a heat-dissipating component (i.e., a heat-generating component or unit) such as an amplifier. The amplifier may be a solid-state power amplifier (SSPA) (e.g., in a TxDRA assembly) or a low-noise amplifier (LNA) (e.g., in an RxDRA assembly). The RF module may be an SSPA 4-pack module or an LNA 4-pack module.

[0299] The DRA assembly 1000 has a low thermal resistance path from the amplifier to the thermal blade 1016. The RF module 1004 may include a heat spreader located near the high-power amplifier (e.g., approximately midway along the RF signal chain path). The RF module 1004 may include a thermal gasket interface between the RF module 1004 and the thermal blade 1016 to transfer heat from the heat-generating components of the RF module 1004 to the thermal blade 1016. The thermal gasket may be a high-efficiency thermal gasket. High-efficiency here means that the thermal gasket effectively transfers heat from one side of the interface to the other, thus minimizing the temperature difference between the two. The thermal gasket may be applied (or selected) to minimize the temperature difference between the RF module 1004 and the thermal blade 1016.

[0300] Heat generated by the SIP module is conducted or dissipated along heat dissipation path 1024 .

[0301] The SIP modules are mounted to the BFN board 1036 (which is mounted to the interface plate 1040). The SIP modules may include top-mounted SIP modules and bottom-mounted SIP modules. The top-mounted SIP modules are mounted on the top surface of the BFN board 1036. The bottom-mounted SIP modules are mounted on the bottom surface of the BFN board 1036. The top-mounted SIP modules and the bottom-mounted SIP modules may be mounted back-to-back on the BFN board 1036.

[0302] The SIP modules (top and bottom mounted SIP modules) may include a thermal gasket interface to the BFN board 1036 .

[0303] The top-mounted SIP module may have a thermal gasket interface to the interface plate 104 .

[0304] The SIP module may be configured to include a thermal interface material and an aluminum lid.

[0305] When SIP modules are double stacked, two thermal paths may be used to transfer heat from the bottom-mounted SIP module to the top-mounted SIP module (which contacts the interface plate 1040). The first thermal path uses a thermal gasket between each SIP (e.g., lid 704 in FIG. 7) and the BFN board 1036. The second thermal path uses thermal conduction through the metal screws connecting the top and bottom-mounted SIP modules.

[0306] The heat generated by the SIP module is conducted to the thermal blade 1016 .

[0307] The heat generated by the BAMs is conducted along the heat dissipation path 1028 and dissipated.

[0308] The BAM 1012 includes heat-generating components, including one or more amplifiers. The heat-generating components (e.g., amplifiers) within the BAM 1012 may have a direct thermal path (e.g., path 1028) to the thermal blade 1016.

[0309] Each thermal blade 1016 includes a top surface that provides a heat exchange interface. Heat received by the thermal blade 1016 from the RF module 1004, SIP module, and BAMs 1012 via heat dissipation paths 1020, 1024, 1028 is dissipated at the top surface 1018 of the thermal blade 1016 along heat dissipation path 1032.

[0310] A heat pipe (e.g., a spacecraft heat pipe) may be attached to the upper surface 1018 of the thermal blade 1016 to receive heat from the upper surface 1018 and dissipate the heat along a heat dissipation path 1032 or further transfer the heat to a spacecraft radiator.

[0311] Additional heat-generating components may be attached to the BFN board 1036. For example, an FPGA (not shown) may be attached to the BFN board 1036. The FPGA may be a high-heat-dissipation component. The FPGA may be intentionally mounted on the top surface of the BFN board 1036 to have a direct thermal path to the interface plate 1040 through the thermal filler and pedestal. Heat generated by the FPGA (or other component) may then be conducted through the interface plate 1040 to the thermal blade 1016 (which is attached to the interface plate 1040). This heat may then be dissipated by the thermal blade 1016 along the heat dissipation path 1032.

[0312] 11 shows a top perspective view 1100 of a DRA assembly 1102 with attached heat pipes, according to one embodiment. The DRA assembly may be DRA assembly 510 of FIG. 5. The DRA assembly 1102 may employ the thermal management and heat transfer of FIG.

[0313] The DRA assembly 1102 includes a plurality of radiating elements 1104 (which form an active radiating element grid). Each of the radiating elements 1104 of the active radiating element grid is connected to an RF module (not shown) (e.g., RF module 520 in FIG. 5). For example, each RF module may be connected to four radiating elements 1104.

[0314] The DRA assembly 1102 includes other active heat-generating components (e.g., BAMs and SIP modules), which are not shown in FIG.

[0315] DRA assembly 1102 includes thermal blades 1108, each of which is attached to an interface plate 1112. Interface plate 1112 is attached to a spacecraft panel for mounting the DRA assembly to the spacecraft.

[0316] Each thermal blade 1108 includes a top surface (e.g., like top surface 538 of thermal blade 528 in FIG. 5) that provides a heat exchange interface for heat generated in a heat-generating component (e.g., an RF module) and passively transferred to the thermal blade 1108.

[0317] The DRA assembly further includes an EPC module 1120 (which is made up of five physically separate modules). The EPC module 1120 is attached to a dedicated EPC blade 1124. The dedicated EPC blade 1124 includes a top surface that serves as a heat exchange interface for heat generated by heat-generating components of the EPC module 1120 and passively transferred to the dedicated EPC blade 1124.

[0318] A plurality of spacecraft heat pipes 1128 are attached to the top surfaces of the thermal blades 1108 and the dedicated EPC thermal blades 1124. Note that the top surfaces of the thermal blades 1108 are not shown in FIG. 11 because they are obscured by the spacecraft heat pipes 1128. Heat is transferred from the top surfaces 1116, 1125 of the thermal blades 1108 to the spacecraft heat pipes 1128. While FIG. 11 shows twelve heat pipes (six in groups of three on each side of the radiant element active grid), the number of heat pipes 1128 is not particularly limited. For example, in alternative embodiments, two, three, or five heat pipes 1128 may be attached to both sides of the radiant element active grid. The number of heat pipes 1128 may depend on the thermal interface requirements and the spacecraft configuration.

[0319] The heat received by spacecraft heat pipe 1128 is conducted along heat dissipation path 1132. Spacecraft heat pipe 1128 may further conduct the heat along a heat dissipation path to a heat sink (e.g., a radiator).

[0320] 12 illustrates a method 1200 for manufacturing a DRA assembly, according to one embodiment. Method 1200 may be used, for example, to manufacture DRA assembly 500 of FIG.

[0321] At 1202, a plurality of radiant element modules are attached to the thermal blade. In certain embodiments, the radiant element modules are attached to opposite sides of the thermal blade (i.e., a row of radiant element modules on each side of the thermal blade). Once the assembled thermal blade is formed, all of the radiant element modules are attached.

[0322] At 1204, a BFN assembly is attached to interface plate 2108. The BFN assembly may be BFN assembly 610 of Figure 6. The BFN module includes multiple SIP modules attached to a BFN board.

[0323] At 1206, the coaxial bulkhead is attached to the BFN cover, the bottom cover is attached to the BFN cover, and the BFN cover is attached to the interface plate.

[0324] At 1208, the assembled thermal blade is attached to the interface plate by attaching the bottom surface of the thermal blade and connected to the BFN assembly (in particular, the radiating element module is connected to the BFN board of the BFN assembly via a spring-loaded electrical connector).

[0325] The BFN assembly is located below and in the same plane as the interface plate and is housed within the BFN cover.

[0326] At 1210, cross straps and radiation shields are attached to the thermal blades. Specifically, the cross straps are attached to the top surfaces of the thermal blades, and the radiation shields are attached to the front and rear surfaces of the leading and trailing thermal blades, respectively.

[0327] The EPC module is attached to a dedicated EPC thermal blade at 1012. The assembled EPC and thermal blade are then attached to an interface plate.

[0328] 13A and 13B show a perspective view 1300a and a top view 1300b, respectively, of a communications satellite 1310 according to one embodiment. The communications satellite 1310 may be the communications satellite 110 of FIG. 1. The communications satellite 1310 may be a LEO satellite.

[0329] Communications satellite 1310 includes spacecraft 1312. Communications satellite 1310 further includes DRA assemblies 1314a, 1314b, 1314c, and 1314d (collectively referred to as DRA assemblies 1314). DRA assemblies 1314 may be, for example, DRA assembly 510 of FIG. 5. In this particular case, DRA assemblies 1314a and 1314b are Tx antennas, and DRA assemblies 1314c and 1314d are Rx antennas.

[0330] The DRA assembly 1314 is mounted to the top surface 1316 of the spacecraft 1312. In particular, the top surface 1316 includes a spacecraft panel to which the DRA assembly 1314 is mounted, for example, via an interface plate (e.g., interface plate 544 in FIG. 5). The DRA assembly may also be mounted to an under-panel.

[0331] The communications satellite 1310 further includes spacecraft heat pipes 1318. The spacecraft heat pipes 1318 are attached to the upper surfaces of the thermal blades 1320 of the DRA assemblies 1314. The spacecraft heat pipes 1318 are attached and oriented substantially perpendicular to the configuration of the thermal blades 1320. The spacecraft heat pipes 1318 are attached to each side of the radiant element active lattice on the upper surface of the thermal blades 1320. For example, in the communications satellite 1310, six heat pipes 1318 are attached to each side of the radiant element active lattice of the DRA assemblies 1314a and 1314b, and three heat pipes 1318 are attached to each side of the radiant element active lattice of the DRA assemblies 1314c and 1314d. The spacecraft heat pipes 1318 may include flat bottom surfaces facing the thermal blades. The spacecraft heat pipes 1318 are connected to a spacecraft panel (e.g., side 1322 of the spacecraft panel).

[0332] Spacecraft panel 1318 is secured to (eg, the spacecraft panel of) side 1322 of spacecraft 1312 and extends downward.

[0333] 14 through 18 illustrate one embodiment of a direct radiating array (DRA) assembly 10, particularly for use as an antenna for an on-board or spacecraft (not shown, but indicated by its mounting panel 12) for transmitting and / or receiving RF (radio frequency) radio signals in a predetermined frequency band.

[0334] The DRA assembly 10 includes a plurality of radiating elements 22 that define a radiating surface 20 (shown in dashed lines in FIG. 14). Each radiating element 22 forms a portion of the radiating surface and defines an element contour base 24 (see FIGS. 17 and 18). The element bases 24 are arranged side-by-side and contact the corresponding element bases 24 of adjacent radiating elements 22. Consequently, although not required, adjacent radiating elements 22 contact each other.

[0335] The DRA assembly 10 also includes, for each radiating element 22, a signal RF signal chain path 30 (schematically shown in FIG. 17 by dotted lines along the different RF signal chain paths 30). Preferably, each RF signal chain path 30 (typically also referred to as a signal amplification path) is at least partially disposed within the element volume 26 (which extends in a direction generally perpendicular to the element bottom surface 24 of the corresponding radiating element 22 and below the element bottom surface 24 in a direction opposite to the radiation of the signal) (see FIG. 17). The signal amplification path 30 includes, among many other antenna amplification path components, at least one heat-generating unit 32 (e.g., an amplification unit for amplifying an antenna signal transmitted to (or received by) the corresponding radiating element 22).

[0336] The DRA assembly 10 also includes a plurality of temperature sink elements 30, 40. Each temperature sink element extends within at least one element volume and connects to a thermal radiator (e.g., the spacecraft mounting panel 12 for transferring heat via a thermal conduction path and / or a local heat dissipation surface mirror 42 (or thermal blade)) on the spacecraft / satellite or the like. Each amplifier unit 32 is attached to one of the temperature sink elements 40 for transferring the heat it generates. The temperature sink elements 40 are adapted to instantly and passively transfer or dissipate heat received from different amplifier units 32 to the thermal radiators 12, 42 and to maintain the amplifier units 32 at a substantially uniform temperature relative to one another.

[0337] Each temperature sink element 40 has a generally flat blade shape, defining a blade plane 44 (shown by dashed lines in FIG. 14 ) that extends below and generally perpendicular to the radiating surface 20 within the blade plane. Because the different temperature sink elements 40 are positioned relative to the radiating element 22 and its associated signal amplification path 30, each temperature sink element 40 also serves as a structural support for the corresponding radiating element 22 and its associated signal amplification path 30, and also serves as a mechanical adjustment device for the DRA assembly 10. To improve the structural behavior of the DRA assembly 10, additional structural supports 46 (see FIG. 14 ) are typically used to secure the different temperature sink elements 40 (preferably those adjacent to the radiating element 22) to one another.

[0338] Typically, each temperature sink element 40 is a conventional oscillating heat pipe (OHP) or pulsating heat pipe (PHP).

[0339] 18, each signal amplification path 30 is oriented perpendicular to the respective radiating element 20. In such a case, the electrical connection can be made using any type of connection / connector 34 (including 90 degree or other RF connection).

[0340] 18, the respective geometric centers 24′ of the element bases 24 of two adjacent radiating elements 22 are spaced apart from each other by an inter-element distance 28. The inter-element distance 28 may be based on the RF frequency and the required DRA scan range.

[0341] Each element base 24 may also be generally symmetrical, for example, hexagonal (as shown in Figures 14-18).

[0342] 16, the radiating elements 22 may typically be arranged adjacent to one another in multiple rows 23. The amplifiers 32 of the radiating elements 22 of two adjacent rows 23 are typically mounted on opposite sides of one of the temperature sink elements 40. The temperature sink element 40 extends between the two adjacent rows 23.

[0343] 16-18, the radiating elements 22 (including their respective signal amplification paths 30) are typically arranged in groups (or sets of modules) for ease of assembly and to expedite customization or adaptation of the DRA assembly 10 according to the requirements of the corresponding antenna (which may require different numbers of radiating elements 22). Groups or modules with different numbers (1, 2, 3, 4, etc.) and shapes (linear, triangular, square, etc.) are also within the scope of the present disclosure.

[0344] It is a general object of the present disclosure to provide an improved direct radiating array (DRA) assembly to overcome various problems with conventional or current DRA antennas.

[0345] One advantage of the present disclosure is that the DRA assembly is small and lightweight, yet is particularly applicable to high-power antennas.

[0346] Another advantage of the present disclosure is that the DRA assembly allows the heat generated in the amplification units of each signal amplification path of the different radiating elements to be efficiently dissipated to a heat sink via multiple temperature sink elements (e.g., multiple heat pipes, etc.), which also serve as structural elements to support the different electrical components of the antenna.

[0347] A further advantage of the present disclosure is that the DRA assembly includes multiple radiating elements. These radiating elements define the radiating surface of the DRA assembly. Each radiating element also includes a signal RF signal chain path (e.g., a signal amplification path). Advantageously, these signal RF signal chain paths are at least partially disposed within an element volume. The element volume extends in a direction generally perpendicular to the bottom surface of the radiating element and opposite the radiating surface. Obviously, depending on design constraints, a portion (or only a portion) of the signal RF signal chain path may extend outside the element volume. Typically, the signal amplification path is electrically connected to the radiating element (patch) via an RF connection / connector.

[0348] A further advantage of the present disclosure is that the DRA assembly has multiple radiating elements arranged in multiple adjacent rows. Furthermore, the signal amplifiers of each signal amplification path of all radiating elements in the same row are typically mounted to the same temperature sink element. Preferably, all signal amplifiers in two adjacent rows are mounted between the same temperature sink element.

[0349] A further advantage of the present disclosure is that the DRA assembly includes multiple temperature sink elements that are used to immediately and passively (or automatically, i.e., as opposed to actively using any electrical components and / or electrical controls) transfer heat generated by the different signal amplifiers to the thermal radiator. Furthermore, the DRA assembly passively keeps the temperatures of all amplifiers approximately uniform relative to one another (especially between radiating elements located on the periphery of the radiating surface and those located at the center of the radiating surface). This significantly improves the DRA antenna RF performance. The temperature sink elements allow all heat sources (including amplifiers) to have substantially the same direct thermal path (same temperature gradient) to the heat sink (e.g., thermal radiator). Furthermore, the temperature sink elements typically also function as structural elements for securing the DRA assembly. Furthermore, the temperature sink elements can also be used to mechanically align different components of the DRA antenna relative to one another.

[0350] A further advantage of the present disclosure is that the temperature sink element of the DRA assembly is generally planar and extends in the blade plane direction, generally perpendicular to, and below the DRA radiating surface.

[0351] A further advantage of the present disclosure is that the radiating surface of the DRA antenna each has the geometric center of the element bases of two adjacent radiating elements spaced apart by an inter-element distance, which may be based on the RF frequency and the required DRA scan range.

[0352] A further advantage of the present disclosure is that the functionality of the DRA assembly is concentrated within the base of the radiating elements, making the design modular, so that the overall performance (electrical and mechanical) can be quickly tailored to requirements by adding or removing radiating elements.

[0353] Another advantage of the present disclosure is that the DRA assembly can be made smaller and lighter in weight, with the present embodiment achieving a 40% weight reduction compared to a conventional DRA assembly with similar performance.

[0354] In one aspect of the present disclosure, a direct radiating array (DRA) assembly for use in a spacecraft antenna for transmitting and / or receiving RF radio signals in a predetermined frequency band is provided. The assembly includes a plurality of radiating elements defining a radiating surface of the DRA assembly, an RF signal chain path for each radiating element, and a plurality of temperature sink elements. Each of the radiating elements defines an element base surface that defines a radiating surface and is aligned side-by-side with the element base surfaces of adjacent radiating elements. The RF signal chain path is disposed at least partially within the element volume of the corresponding radiating element (which extends in a direction substantially perpendicular to the element base surface and opposite to the radiation direction). The RF signal chain path includes at least one heat generating unit. Each of the temperature sink elements extends within at least one element volume and connects to a thermal radiator.

[0355] In one embodiment, each temperature sink element may have a substantially flat shape defining a component surface. The blade surface may extend below the radiating surface in a direction substantially perpendicular to the radiating surface. At least one heat-generating unit is attached to one of the plurality of temperature sink elements to transfer generated heat. The plurality of temperature sink elements passively transfer generated heat to the thermal radiator, maintaining the heat-generating unit at a substantially uniform temperature relative to the other heat-generating units.

[0356] Advantageously, each single amplification path extends in a direction substantially perpendicular to each of said plurality of radiating elements.

[0357] In one embodiment, the geometric centers of the base surfaces of two adjacent radiating elements of the plurality of radiating elements are spaced apart by an inter-element distance, which may be based on the RF frequency and the required scanning range of the DRA.

[0358] In one embodiment, the base of each element is substantially symmetrical, preferably hexagonal.

[0359] In one embodiment, each temperature sink element is an oscillating heat pipe.

[0360] In one embodiment, the radiant elements are arranged in adjacent rows, with at least one heat-generating unit corresponding to two adjacent radiant elements in the rows mounted on opposite sides of a temperature sink element that extends between the two adjacent rows.

[0361] In one embodiment, the plurality of radiating elements and corresponding RF signal chain paths are formed in groups that are positioned adjacent to one another.

[0362] Advantageously, each group includes at least two radiating elements and corresponding RF signal chain paths.

[0363] Advantageously, for each group, the corresponding radiating elements and RF signal chain paths are arranged in line with each other.

[0364] Advantageously, each group includes two or more radiating elements and RF signal chain paths.

[0365] A direct radiating array assembly for use in a spacecraft antenna to transmit and / or receive RF radio signals in a predetermined frequency band is provided. The assembly includes radiating elements defining a radiating surface of the DRA assembly. Each radiating element defines an element base surface that defines a radiating surface and is aligned side-by-side with the element base surfaces of adjacent radiating elements. The assembly also includes an RF signal chain path for each radiating element. The RF signal chain path is at least partially disposed within the element volume of the corresponding radiating element (extending substantially perpendicular to the element base surface and counter to the radiation direction). The RF signal chain path includes at least one heat-generating unit. The DRA assembly also includes a plurality of temperature sink elements. Each of the temperature sink elements extends within at least one element volume and connects to a thermal radiator. Each of the heat-generating units is attached to one of the temperature sink elements to transfer heat to the temperature sink element. The plurality of temperature sink elements passively transfer generated heat to the thermal radiator instantly, maintaining the heat-generating units at a substantially uniform temperature relative to the other heat-generating units.

[0366] The above description provides one or more example devices, methods, or systems. However, one of ordinary skill in the art will recognize that other devices, methods, or systems are also within the scope of the claims.

Claims

1. A DRA antenna (Direct Radiating Array Antenna) that transmits or receives RF signals (Radio Frequency Signals) in a predetermined frequency band, a plurality of radiating elements defining a radiating surface of the DRA antenna; a plurality of RF signal chain paths; a single beamforming network having a plurality of electrical ports electrically connected to the RF signal chain paths; A DRA antenna, wherein each of the RF signal chain paths is coupled to one of the radiating elements, each of the radiating elements amplifying a transmitted or received RF signal.

2. each of the RF signal chain paths includes a heat-generating component; 10. The DRA antenna of claim 1, wherein the DRA antenna comprises a heat spreader that passively cools the DRA antenna by conducting heat generated by the heat-generating components in the RF signal chain path.

3. each of the RF signal chain paths includes a heat-generating component; The DRA antenna of claim 1 , wherein the DRA antenna comprises a plurality of thermal blades that passively conduct heat generated by the heat-generating component.

4. The DRA antenna of claim 3 , wherein each of the thermal blades includes a top surface that serves as a heat exchange interface for the DRA antenna.

5. The DRA antenna of claim 3 , wherein each of said thermal blades includes a heat pipe for passively or actively conducting heat.

6. 6. The DRA antenna of claim 5, wherein the heat pipe is a oscillating heat pipe that passively transfers heat.

7. 4. The DRA antenna of claim 3, wherein each of said thermal blades is a solid metal thermal blade that passively conducts heat.

8. further comprising a plurality of radiating element modules; each of the radiating element modules comprising a subset of a plurality of radiating elements and a subset of a plurality of RF signal chain paths; each of the subset of radiating elements defines a collective radiating element base; 10. The DRA antenna of claim 1, wherein each of the subsets of RF signal chain paths is contained within the collective radiating element base.

9. further comprising a plurality of SIP modules (System in Package); each of the plurality of SIP modules includes at least one BFIC (Beam Forming Integrated Circuit); The DRA antenna of claim 1 , wherein the SIP module is mounted on a planar beam forming network board.

10. a first subset of the SIP modules mounted on a first surface of the beam forming network board; a second duplex set of SIP modules attached to a second side of the beam forming network board; The DRA antenna of claim 9 , wherein the first surface and the second surface face each other.

11. the SIP modules are mounted on the beam forming network board as a plurality of double stacks; Each of the double stacks comprises: a first SIP module attached to a first surface of the beam forming network board; a second SIP module attached to a second surface of the beam forming network board; The DRA antenna according to claim 9 , wherein the first SIP module and the second SIP module are connected to each other.

12. The DRA antenna of claim 11, wherein each of the double stacks is thermally coupled to a thermal blade that passively conducts heat.

13. The DRA antenna of claim 10, wherein the first subset of SIP modules dissipates heat generated by itself and at least one second subset of SIP modules.

14. The DRA antenna of claim 10 , wherein each of the first subset of SIP modules is thermally coupled to a thermal blade that passively conducts heat.

15. the beam forming network is attached to a base plate; each of the double stacks is thermally coupled to the base plate; The DRA antenna of claim 11, wherein the base plate conducts heat from the double-stack heat-generating components to a thermal blade for passively conducting heat.

16. the subset of SIPs each comprising a cover; The DRA antenna of claim 10, wherein the cover functions as a heat exchange interface for heat generated by heat-generating components of the SIP module.

17. the subset of SIPs each comprising a cover; The DRA antenna of claim 10 , wherein the cover contacts a base plate of the DRA antenna and transfers heat generated by heat-generating components of the SIP module to the base plate.

18. 10. The DRA antenna of claim 1, wherein each of the RF signal chain paths is connected to a beam forming network board via a spring-loaded electrical connector.

19. further comprising a plurality of SIP modules mounted on the beam forming network board; 10. The DRA antenna of claim 1, wherein the plurality of SIP modules include at least one BFIC and a spring-loaded electrical connector connecting the SIP modules to the beam forming network.

20. The beam forming network board defines a first plane; The DRA antenna of claim 1 , wherein the RF signal chain path is disposed in a second plane that is substantially perpendicular to the first plane.

21. a plurality of thermal blades mounted substantially perpendicular to the beam forming network board; The DRA antenna of claim 1 , wherein the plurality of RF signal chain paths are attached to the plurality of thermal blades.

22. A satellite equipped with the DRA antenna of claim 1.

23. 23. The satellite of claim 22, which is a low earth orbit satellite.

24. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a plurality of radiating elements defining at least one radiating surface of the DRA antenna; a plurality of RF signal chain paths; Equipped with each of the RF signal chain paths is coupled to one of the radiating elements, and amplifies the RF signal transmitted or received by each of the radiating elements; the plurality of radiating elements define a collective radiating element base; The DRA antenna, wherein the plurality of RF signal chain paths are contained within the collective radiating element base.

25. further comprising a plurality of heat spreaders; 25. The DRA antenna of claim 24, wherein each of the plurality of RF signal chain paths includes a heat-generating component attached to a respective heat spreader for passively conducting heat generated by the heat-generating component to the heat spreader.

26. further comprising a single beam forming network board for implementing a beam forming network; 25. The DRA antenna of claim 24, wherein the beam forming network board comprises a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths.

27. 27. The DRA antenna of claim 26, wherein the beam forming network board carries all RF and electrical signals and DC power to the DRA antenna's multiple RF signal chain paths.

28. the plurality of radiating elements and the plurality of RF signal chain paths are assembled into a radiating element module; each of the radiating element modules is coupled to a subset of the plurality of radiating elements and RF signal chain paths; 25. The DRA antenna of claim 24, wherein the subset of radiating elements are arranged in a line.

29. further comprising a single beam forming network board for implementing a beam forming network; the beam forming network board comprises a plurality of electrical ports for electrically connecting to the plurality of RF signal chain paths; 30. The DRA antenna of claim 28, wherein the radiating element module is positioned substantially perpendicular to the beam forming network board.

30. further comprising a plurality of thermal blades; the radiant element module is attached to the thermal blade; 30. The DRA antenna of claim 28, wherein heat generated in a heat-generating component in each of the RF signal chain paths is passively conducted to each of the thermal blades.

31. the radiant element modules are attached to the plurality of thermal blades; at least one radiant element module attached to the first surface of the thermal blade; 31. The DRA antenna of claim 30, wherein at least one radiating element module is mounted on a second side of the thermal blade opposite the first side.

32. The RF signal chain path includes:

25. The DRA antenna of claim 24, including a driver before high power amplification in the DRA antenna or a gain block before low noise amplification in the DRA antenna.

33. 25. The DRA antenna of claim 24, wherein each of the plurality of RF signal chain paths is electrically connected to a beam forming network board via a spring-loaded electrical connector.

34. the plurality of heat spreaders are thermal blades; 26. The DRA antenna of claim 25, wherein each thermal blade includes a heat pipe.

35. 35. The DRA antenna of claim 34, wherein the heat pipe is a oscillating heat pipe.

36. further comprising a plurality of SIP modules mounted on the beam forming network board; 30. The DRA antenna of claim 29, wherein each of said SIP modules includes a beamforming integrated circuit and a spring-loaded electrical connector for electrically connecting to said beamforming network board.

37. A satellite equipped with a DRA antenna according to claim 24.

38. 38. The satellite of claim 37, which is a low earth orbit satellite.

39. Spaceship bus, a DRA antenna as claimed in claim 1 attached to said spacecraft bus; an OBP (on-board processor) communicatively connected to the DRA antenna of claim 1; Equipped with A satellite characterized in that the OBP processes beam signals provided to or received from a beam forming network board.

40. Spaceship bus, a DRA antenna as claimed in claim 1 attached to said spacecraft bus; A satellite comprising:

41. Spaceship bus, 26. The DRA antenna of claim 25 attached to the spacecraft bus; A satellite comprising:

42. Spaceship bus, an on-board processor; a DRA antenna connected to the on-board processor and attached to the spacecraft bus; The DRA antenna includes: a plurality of radiating elements defining a radiating surface of the DRA antenna; a plurality of RF signal chain paths; a single beamforming network having a plurality of electrical ports electrically connected to the plurality of RF signal chain paths; Each of said RF signal chain paths is coupled to a respective one of said radiating elements, each of said radiating elements amplifying a transmitted or received RF signal.

43. a passive thermal management subsystem that manages heat generated by the DRA antenna; the passive thermal management subsystem includes a plurality of thermal blades connected to a heat sink; 43. The satellite of claim 42, wherein the thermal blade actively or passively transfers heat generated by heat-generating components of the DRA antenna to the heat sink.

44. 43. The satellite of claim 42, which is a low earth orbit satellite.

45. a positioning subsystem for controlling the orbit of the satellite; 43. The satellite of claim 42, wherein said orbit is a low earth orbit.

46. Spaceship bus, an on-board processor; a DRA antenna connected to and attached to the on-board processor; Equipped with The DRA antenna includes: a plurality of radiating element modules defining at least one radiating surface of the DRA antenna; a plurality of RF signal chain paths coupled to each of the radiating element modules, the RF signal chain paths amplifying RF signals received by or transmitted to the radiating elements; the plurality of radiating elements define a collective radiating element base; The satellite, wherein the RF signal chain path is contained within the collective radiating element base.

47. a passive thermal management subsystem that manages heat generated by the DRA antenna; the passive thermal management subsystem includes a plurality of thermal blades connected to a heat sink; 47. The satellite of claim 46, wherein the thermal blade actively or passively transfers heat generated by heat-generating components of the DRA antenna to the heat sink.

48. 47. The satellite of claim 46, which is a low earth orbit satellite.

49. a positioning subsystem for controlling the orbit of the satellite; 47. The satellite of claim 46, wherein said orbit is a low Earth orbit.

50. A DRA antenna for transmitting or receiving RF signals in a predetermined frequency band, A DRA antenna comprising a single beam forming network board.

51. further comprising a plurality of RF signal chain paths; 51. The DRA antenna of claim 50, wherein the beam forming network board carries all RF and electrical signals and DC power to the RF signal chain path.

52. A manufacturer of DRA antennas, attaching a first plurality of radiant element modules to a first thermal blade to create a first assembled thermal blade; attaching a beam forming network board to a base plate; attaching the first assembled thermal blade to the base plate such that the first assembled thermal blade is substantially perpendicular to the beam forming network board; Equipped with 10. The method of claim 9, wherein the attaching step includes forming an electrical connection between an electrical connector of each of the first plurality of radiating element modules and a corresponding receive port of the beam forming network board.

53. 53. The method of claim 52, wherein said first thermal blade and said first plurality of radiating element modules are positioned substantially perpendicular to said beam forming network board.

54. at least one radiant element module attached to a first surface of the first thermal blade; at least one radiant element module attached to a second surface of the first thermal blade; 53. The method of claim 52, wherein the first surface and the second surface face each other.

55. attaching a second plurality of radiant element modules to a second thermal blade that actively or passively conducts heat to form a second assembled thermal blade; attaching the second assembled thermal blade to the base plate such that the first assembled thermal blade is substantially perpendicular to the beam forming network board and substantially parallel to the first assembled thermal blade; Furthermore, 55. The method of claim 54, wherein said attaching step includes forming an electrical connection between an electrical connector of each of said second plurality of radiating element modules and a corresponding receive port of said beam forming network board.

56. 56. The method of claim 55, wherein the first thermal blade and the second thermal blade are the same size.

57. 53. The method of claim 52, wherein the electrical connector is a spring-loaded electrical connector.

58. each of the first plurality of radiating element modules includes a plurality of radiating elements and a plurality of RF signal chain paths; each of the plurality of RF signal chain paths is coupled to a corresponding one of the plurality of radiating elements; the plurality of radiating elements define a collective radiating element base; 53. The method of claim 52, wherein the RF signal chain path is contained within the collective radiating element bottom surface.

59. 60. The method of claim 58, wherein the plurality of RF signal chain paths are contained entirely within the collective radiating element bottom surface.

60. 53. The method of claim 52, wherein said first plurality of radiant elements are centrally mounted to said first thermal blade.

61. The first plurality of radiating element modules include: a plurality of radiating elements arranged in a line; a plurality of RF signal chain paths; Equipped with each of the plurality of radiating elements is attached to a plurality of other radiating element modules; 53. The method of claim 52, wherein each of the RF signal chain paths is coupled to one of the plurality of radiating elements and amplifies a signal received by or applied to the radiating element.

62. 62. The method of claim 61, wherein the electrical connector is a spring-loaded electrical connector.

63. 63. The method of claim 62, wherein the spring-loaded electrical connector provides a DC and RF interface to the beam forming network board.

64. 53. The method of claim 52, wherein the first thermal blade includes a top surface that serves as a heat exchange interface for the DRA antenna.

65. 53. The method of claim 52, wherein the first thermal blade comprises a oscillating heat pipe.

66. The step of forming the first assembled thermal blade comprises: installing a BAM (Beam Amplification Module); forming an electrical connection between the electrical connector of the BAM and a corresponding receive port of a beam forming network board; 53. The method of claim 52 further comprising:

67. 67. The method of claim 66, wherein the electrical connector is a spring-loaded electrical connector.

68. further comprising the step of attaching a plurality of first SIP modules to a first surface of the beam forming network board; 53. The method of claim 52, wherein the first SIP module includes at least one beamforming integrated circuit.

69. further comprising the step of attaching a plurality of second SIP modules to a second side of the beam forming network board; the second SIP module includes at least one beamforming integrated circuit; 69. The method of claim 68, wherein the first surface and the second surface face each other.

70. 69. The method of claim 68, wherein the first SIP module is thermally coupled to the base plate to transfer heat from a heat-generating component of each of the plurality of first SIP modules to the first thermal blade.

71. 71. The method of claim 70, wherein the base plate couples heat to the first thermal blade.

72. 10. A method of operating a DRA antenna according to claim 1, comprising:

10. A method comprising: transmitting or receiving RF signals in at least one predetermined frequency band using the DRA antenna.

73. 25. A method of operating a DRA antenna according to claim 24, comprising:

10. A method comprising: transmitting or receiving RF signals in at least one predetermined frequency band using the DRA antenna.

74. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules each including a BFIC; The DRA antenna is characterized in that the plurality of SIP modules are mounted in a planar manner on the beam forming network board.

75. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules each including a BFIC; The DRA antenna is characterized in that the plurality of SIP modules are mounted planarly on the beam forming network board and electrically connected to the beam forming network board via spring-loaded electrical connectors.

76. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a single beamforming network board; a plurality of SIP modules each including a BFIC; The DRA antenna, wherein each of the plurality of SIP modules includes a spring-loaded electrical connector for electrically connecting to the beam forming network board.

77. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a radiating element defining a radiating surface of the DRA antenna; an RF signal chain path coupled to the radiating element for amplifying an RF signal received by or transmitted to the radiating element; a spring-loaded electrical connector for connecting the RF signal chain path to a beamforming network board of the DRA antenna; A DRA antenna comprising:

78. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a plurality of radiating element modules; Each of the plurality of radiating element modules comprises: a plurality of radiating elements defining a radiating surface of the DRA antenna; a plurality of RF signal chain paths; Equipped with each of the plurality of RF signal chain paths coupled to the radiating element to amplify an RF signal received by or transmitted to the radiating element; the plurality of radiating elements define a collective radiating element base; The DRA antenna, wherein the RF signal chain path is contained within the bottom surface of the collective radiating element.

79. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a beam forming network board; a plurality of radiating element modules; Equipped with Each of the radiating element modules comprises: one radiating element defining a radiating surface of the DRA antenna; an RF signal chain path coupled to the radiating element for amplifying RF signals received by or transmitted to the radiating element; Equipped with The DRA antenna, wherein the RF signal chain path is disposed substantially perpendicular to the beam forming network board.

80. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, a beam forming network board; an RF signal chain path disposed substantially perpendicular to said beam forming network board; A DRA antenna comprising:

81. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board defining a first plane; a plurality of RF signal chain paths disposed on the second surface; Equipped with The DRA antenna, wherein the first plane and the second plane are substantially perpendicular.

82. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board; a plurality of thermal blades; a plurality of RF signal chain paths; Equipped with The plurality of RF signal chain paths amplify RF signals received by or transmitted to the connected radiating elements and are attached to corresponding respective thermal blades. The DRA antenna is characterized in that the plurality of thermal blades are arranged substantially perpendicular to the beam forming network board.

83. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board; a plurality of thermal blades; Equipped with A DRA antenna, wherein each of the plurality of thermal blades utilizes a oscillating heat pipe to passively transfer heat generated by a heat-generating component of the DRA antenna to a heat sink.

84. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board; a plurality of thermal blades for passively cooling the DRA antenna by conducting heat generated by heat-generating components of the DRA antenna to a heat sink; A DRA antenna comprising:

85. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board; a plurality of radiating element modules comprising a plurality of radiating elements and a plurality of RF signal chain paths; Equipped with the plurality of RF signal chain paths are coupled to corresponding ones of the plurality of radiating elements to amplify RF signals received by or transmitted to the plurality of radiating elements; the plurality of RF signal chain paths are contained within a collective radiating element base defined by the plurality of radiating elements; The DRA antenna, wherein the plurality of RF signal chain paths are arranged substantially perpendicular to the beam forming network board.

86. further comprising a plurality of SIP modules each having at least one BFIC; The DRA antenna of claim 24, wherein the plurality of SIP modules are planarly mounted on a beam forming network board.

87. a first subset of the plurality of SIP modules mounted on a first surface of the beam forming network board; a second subset of the plurality of SIP modules mounted on a second side of the beam forming network board; 87. The DRA antenna of claim 86, wherein the first surface and the second surface face each other.

88. the plurality of SIP modules are mounted on the beam forming network board as a plurality of double stacks; Each of the double stacks comprises: a first SIP module attached to a first surface of the beam forming network board; a second SIP module attached to a second surface of the beam forming network board; 87. The DRA antenna of claim 86, wherein the first SIP module and the second SIP module are connected to each other.

89. 90. The DRA antenna of claim 88, wherein each of said double stacks is thermally coupled to a thermal blade that passively conducts heat.

90. the beam forming network is attached to a base plate; each of the double stacks is thermally coupled to the base plate; 90. The DRA antenna of claim 88, wherein said base plate conducts heat from said double-stack heat-generating components to a thermal blade for passively conducting heat.

91. the subset of SIPs each comprising a cover; 87. The DRA antenna of claim 86, wherein the cover serves as a heat exchange interface for heat generated by heat-generating components of the SIP module.

92. the subset of SIPs each comprising a cover; 87. The DRA antenna of claim 86, wherein the cover contacts a base plate of the DRA antenna and transfers heat generated by heat-generating components of the SIP module to the base plate.

93. A DRA antenna for transmitting or receiving radio frequency radio wave signals in a predetermined frequency band, one beam forming network board; a first SIP module and a second SIP module each including at least one beam forming integrated circuit; Equipped with The first SIP module and the second SIP module are mounted on opposite sides of the beam forming network board and are connected to each other so that the first SIP module provides a heat exchange interface for the second SIP module.

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