Chip transport means and mounting device

Abstract

To provide chip transport means and a mounting device that can reduce the cost and installation space of the device when transporting and mounting a semiconductor chip without the electrode surface of a chip coming into contact with other substances.SOLUTION: A chip supply unit is provided with a tool slider that receives and holds a semiconductor chip held by an attachment tool together with the attachment tool, and a transport rail that transports the tool slider to a mounting unit, and the tool slider has a function of transferring the semiconductor chip together with the attachment tool to a mounting head of the mounting unit and a function of receiving only the attachment tool after the mounting head has mounted the semiconductor chip, and provides chip transport means that can transport only the attachment tool along the transport rail to the chip supply unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a mounting apparatus for mounting a semiconductor chip on a substrate, and more particularly to a mounting apparatus for mounting a semiconductor chip with the electrode surface of the semiconductor chip facing the electrode surface of the substrate. [Background technology]

[0002] In face-down mounting, where the electrode surface of the semiconductor chip faces the electrode surface of the substrate, the electrodes of the semiconductor chip and the electrodes of the substrate are aligned and connected. The main method for joining is to heat and melt one of the electrodes and press the semiconductor chip against the substrate to form a bond.

[0003] However, with the recent trend toward miniaturization of semiconductors, the heating generated when mounting a semiconductor chip to a substrate can cause dimensional changes in the semiconductor chip (or the substrate), resulting in mounting errors that do not meet specifications even with highly accurate alignment.In this situation, a method called hybrid bonding, which can reduce the temperature during mounting and suppress dimensional changes, is attracting attention.

[0004] In hybrid bonding, the height of the electrode tip on the electrode surface is lower than the height of the insulating part (which accounts for most of the area other than the electrode), and the insulating parts of the semiconductor chip and substrate are also bonded together.By adding functional groups such as hydroxyl groups to the surface of the insulating part (activating it), bonding can be achieved at relatively low temperatures.

[0005] The insulating parts of the semiconductor chip and substrate are made of insulating films such as SiO2 (silicon oxide) films, and are activated by plasma treatment, etc. However, even in an activated state, contact with other substances reduces the activation state, making it difficult to bond the insulating parts together.

[0006] Therefore, the inventors have discovered a method for transporting a semiconductor chip without the electrode surface coming into contact with other substances and transferring it to the mounting head of a mounting device. That is, the inventors have discovered that by configuring a chip slider 62 together with a tool slider 61 that moves along a transport rail 60 shown in Fig. 17(a) and an attachment tool 42 that holds the semiconductor chip from the opposite side of the electrode surface, it is possible to transport the semiconductor chip without the electrode surface coming into contact with other substances (Patent Document 1).

[0007] 18(b) and 18(c), the attachment tool 42 having the appearance as shown in FIG. 18(a) has a first decompression flow path 421P leading from the suction holes 421H to the exhaust holes 421V and a second decompression flow path 422P leading from the suction holes 422H to the exhaust holes 422V, and can hold a semiconductor chip C by reducing the pressure from at least one of the exhaust holes 421V and the exhaust holes 422V. Also, as shown in FIG. 18(c), if the attachment tool 42 is designed so that the exhaust holes 422V of the attachment tool 42 and the chip suction holes 61H of the tool slider 61 are aligned, it is possible to hold the attachment tool 42 in a state where it is holding a semiconductor chip C by reducing the pressure from the exhaust hole 61V side of the tool slider 61. In other words, by holding the attachment tool 42 with the tool slider 61, it can function as the chip slider 62.

[0008] 19 shows a mounting device in this manner that uses a tool slider 61 to transport semiconductor chips C. The mounting device 1 in Fig. 19 is broadly composed of a chip supply unit 1A and a mounting unit 1B, and chip transport means 6 transports semiconductor chips C picked up by chip supply unit 1A to mounting unit 1B, and the configuration that includes tool slider 61 enables chip transport means 6 to transport semiconductor chips C without their electrode surfaces coming into contact with other substances.

[0009] However, conventionally, when the chip supply unit 1A picks up the semiconductor chip C attached to the dicing tape DT, the collet 143 holds the electrode surface (the surface on which the electrode B is provided) of the semiconductor chip C, as shown in Fig. 20, and therefore it was unavoidable for the electrode surface to come into contact with the collet 143. For this reason, even if the electrode surface attached to the dicing tape DT was in an active state, the activity was reduced by contact with the collet 143, making it difficult for the chip transport means 6 to transport the semiconductor chip C in a manner that would prevent the electrode surface from coming into contact with other substances.

[0010] However, in recent years, development has progressed in collets that hold semiconductor chips C without contact, as shown in Patent Documents 2 and 3. For this reason, if a type that holds semiconductor chips C without contact is used as collet 143 of mounting apparatus 1 shown in Fig. 19, the electrode surfaces of semiconductor chips C can be prevented from coming into contact with other substances from the time they are attached to dicing tape DT until they are transferred to mounting head 4 of mounting unit 1B. In other words, if the electrode surfaces are activated while attached to dicing tape DT, using mounting apparatus 1 shown in Fig. 19 for hybrid bonding makes it possible to bond semiconductor chips C to a substrate at a relatively low temperature.

[0011] 21 to 23 show the operation from when the collet 143 picks up the semiconductor chip C in a non-contact manner to when the semiconductor chip C is mounted on the substrate S in the mounting device 1 shown in Fig. 19. First, Fig. 21(a) to Fig. 21(c) show the process in which the collet 143 delivers the semiconductor chip C to the relay head 8 holding the attachment tool 42. In the state of Fig. 21(c), the relay head 8 suction-holds the semiconductor chip C via the attachment tool 42 from the suction hole 421H through the first decompression flow path 421P. 21(d) to 21(e) show the process of reversing the orientation of the relay head 8 so as to transfer the attachment tool 42 (holding the semiconductor chip C) to the tool slider 61 as shown in Fig. 17(d). Note that it is also possible to have a configuration in which the collet 143 is reversed and then the semiconductor chip C is transferred (via the attachment tool 42) to the relay head 8 whose orientation is fixed, but there is a concern that problems may occur when reversing the collet 143 that is holding the semiconductor chip C in a non-contact state, so a configuration in which the relay head 8 is reversed is preferable.

[0012] After the relay head 8 is inverted as shown in Figure 21(e), Figure 21(f) shows the state in which the tool slider 61 is placed below the attachment tool 42. Thereafter, as shown in Figure 21(f), the exhaust holes 422V and the chip suction holes 61H are aligned, and then the attachment tool 42 is mounted on the tool slider 61 as shown in Figure 22(a). The pressure in the flow path connecting the chip suction holes 61H to the outside is reduced, so that the semiconductor chip C is suction-held at the suction holes 422H via the second reduced-pressure flow path 422P. When the suction of the attachment tool 42 by the relay head 8 and the suction of the semiconductor chip via the attachment tool 42 are released, the attachment tool 42 holding the semiconductor chip C is transferred to the tool slider 61 as shown in Figure 22(b).

[0013] The attachment tool 42 and the semiconductor chip C released from the relay head 8 as shown in FIG. 22(b) become movable in the X direction along the transport rail 60 together with the tool slider 61 (FIG. 22(c)).

[0014] After this, the chip slider 62, which is composed of the tool slider 61 and the attachment tool 42, transports the semiconductor chip C to directly below the mounting head 4. FIGS. 22(d) to 22(f) are diagrams showing the process in which the tool slider 61, which has reached directly below the mounting head 4, transfers the semiconductor chip C together with the attachment tool 42 to the mounting head 4. Here, the head suction block 41 of the mounting head 4 is the transfer destination for the attachment tool 42 holding the semiconductor chip C. FIG. 22(d) shows the state in which the tool slider 61 has reached directly below (the head suction block 41 of) the mounting head 4. In FIG. 22(d), the suction hole 410H suctions the attachment tool 42 to the head suction block 41 by reducing the pressure in the pressure-reducing flow path 410P. Furthermore, if the suction hole 411H is aligned with the first exhaust hole 421V, the semiconductor chip C can be suctioned to the attachment tool 42 by reducing the pressure in the pressure-reducing flow path 411P.

[0015] 22(f), the mounting head 4 is lowered (or the tool slider 61 is raised) to align the suction holes 411H with the first exhaust holes 421V, and the attachment tool 42 is brought into close contact with the head suction block 41. In this state, the pressure reduction paths 410P and 411P are reduced, as shown in FIG. 22(e), and the attachment tool 42 is suctioned at the suction holes 410H and fixed to the head suction block 41, and the semiconductor chip C is also suctioned via the first pressure reduction path 421P at the suction holes 421H of the attachment tool 42. Therefore, by releasing the reduced pressure in the path communicating with the chip suction holes 61H of the tool slider 61 and setting it to atmospheric pressure (or a pressure slightly higher than atmospheric pressure), and then raising the mounting head 4, the attachment tool 42 holding the semiconductor chip C is released from the tool slider 61 and rises in close contact with the head suction block 41 (FIG. 22(f)).

[0016] Thereafter, as shown in Fig. 23(a), the tool slider 61 is retracted from directly below the mounting head 4, and then, as shown in Fig. 23(b), the mounting head 4 is lowered to bring the semiconductor chip C close to the substrate S, and the substrate S and the semiconductor chip C are aligned. Once alignment is complete, the mounting process begins. In the mounting process, the semiconductor chip and the substrate S are bonded in close contact, as shown in Fig. 23(c), and the semiconductor chip C is mounted on the substrate S.

[0017] 23(d), after the mounting is completed, the mounting head 4 releases the reduced pressure in the reduced pressure flow path 411P while holding the attachment tool 42, and then rises. In this way, the semiconductor chip C is released from the attachment tool 42 and fixed to the substrate S. [Prior art documents] [Patent documents]

[0018] [Patent Document 1] Patent application No. 2023-049126 [Patent Document 2] Japanese Patent Publication No. 2022-072566 [Patent Document 3] Japanese Patent Application Publication No. 2022-157318 Summary of the Invention [Problem to be solved by the invention]

[0019] In an apparatus configuration such as the mounting apparatus 1 shown in Figure 19, the issue is how to handle the attachment tool 42 held by the mounting head 4 (in a state where it is not holding a semiconductor chip C) as shown in Figure 23(d). For example, if a recovery means is provided to recover the attachment tool 42 that has been removed from the mounting head 4, then at the stage when the attachment tool 42 (holding the semiconductor chip C) as shown in Figure 22(f) is handed over to the mounting head 4 (the head suction block 41 thereof), the tool slider 61 can be moved to the chip supply unit 1A side to receive the next semiconductor chip C to be mounted, which is considered preferable from the standpoint of takt time.

[0020] However, in addition to the need for a tool recovery means for receiving the attachment tool 42 from the mounting head 4, a tool supply means for delivering the attachment tool 42 to the relay head 8 is also required. Furthermore, since it is difficult to immediately supply the recovered attachment tool 42 to the relay head 8, the number of attachment tools 42 required increases. For these reasons, in addition to an increase in equipment and material costs, an increase in the size of the equipment due to the addition of the tool recovery means and tool supply means is unavoidable.

[0021] The present invention has been made in consideration of the above problems, and provides a chip transport means and mounting device that can reduce equipment costs and installation space when transporting and mounting semiconductor chips without the electrode surfaces of the chips coming into contact with other substances. [Means for solving the problem]

[0022] In order to solve the above problem, the invention described in claim 1 is as follows: A chip transport means for transporting semiconductor chips from a chip supply unit to a mounting unit, the chip supply unit includes a tool slider that receives and holds the semiconductor chip held by the attachment tool together with the attachment tool, and a transport rail that transports the tool slider to the mounting unit; the tool slider has a function of transferring the semiconductor chip together with the attachment tool to a mounting head of the mounting unit, and a function of receiving only the attachment tool after the semiconductor chip has been mounted by the mounting head, The chip transport means is capable of transporting only the attachment tool along the transport rail to the chip supply section.

[0023] The invention described in claim 2 is the chip transport means described in claim 1, the tool slider has a frame that supports an edge of a surface of the attachment tool that holds the semiconductor chip, The frame is a chip transport means having suction holes communicating with a decompression flow path on the surface that comes into contact with the attachment tool, and is shaped so that the semiconductor chip can be accommodated inside the frame.

[0024] The invention described in claim 3 is the chip transport means described in claim 2, the attachment tool has a first chip suction flow path that communicates with a pressure reduction flow path of the mounting head and that suctions the semiconductor chip, and a second chip suction flow path that is provided independently of the first chip suction flow path and that is capable of suctioning the semiconductor chip, The chip transport means has, as suction holes in the frame, a chip suction hole that is coupled to the second chip suction flow path of the attachment tool, and a tool suction hole that suction-holds the attachment tool.

[0025] The invention described in claim 4 is the chip transport means described in claim 2, One of the tool sliders is a chip transport means having a plurality of the frame bodies connected together.

[0026] The invention described in claim 5 is a mounting device comprising a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool, a chip transport means described in any of claims 1 to 3, and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

[0027] The invention described in claim 6 is The mounting device includes a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool, the chip transport means described in claim 4, and a mounting head that receives the semiconductor chip transported by the chip transport means together with the attachment tool.

[0028] The invention described in claim 7 is the mounting device described in claim 6, In this mounting device, a plurality of the relay heads are arranged at the same intervals as the intervals at which the plurality of frame bodies are arranged.

[0029] The invention described in claim 8 is the mounting device described in claim 7, In this mounting apparatus, the number of the frames is greater than the number of the relay heads.

[0030] The invention described in claim 9 is the mounting device described in any one of claims 6 to 8, The mounting apparatus is configured such that the attachment tool is simultaneously placed at least in two locations on the relay head, the tool slider, and the relay head.

[0031] The invention described in claim 10 is the mounting device described in claim 5, The collet is a mounting device that holds the semiconductor chip in a non-contact manner.

[0032] The invention described in claim 11 is the mounting device described in any one of claims 6 to 8, The collet is a mounting device that holds the semiconductor chip in a non-contact manner. [Effects of the Invention]

[0033] The present invention makes it possible to transport and mount a semiconductor chip without the electrode surface of the semiconductor chip coming into contact with other substances, while also shortening the takt time without sacrificing the equipment cost and installation space of the chip transport means and mounting device. [Brief explanation of the drawings]

[0034] [Figure 1] FIG. 2 is a diagram illustrating a chip transport means capable of transporting only an attachment tool in the first embodiment of the present invention. [Figure 2]1A and 1B are diagrams illustrating the state of the attachment tool after mounting a semiconductor chip according to the first embodiment of the present invention, showing (a) the state in which it has risen together with the mounting head, (b) the state in which the tool slider has approached, (c) the state in which the tool slider has come into close contact, (d) the state in which it has been handed over to and held by the tool slider, (e) the state in which it has been transported by the tool slider to the chip supply section side, and (f) the state in which it has moved to the underside of the relay head. [Figure 3] 1A and 1B are diagrams illustrating the state of the attachment tool after mounting a semiconductor chip according to the first embodiment of the present invention, in which (a) shows a state in which the relay head is in close contact, (b) shows a state in which the relay head is held by the tool slider, and (c) shows a state in which the relay head is inverted from the same state. [Figure 4] 1A to 1C are step diagrams (part 1) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention. [Figure 5] 10 is a step diagram (part 2) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention. FIG. [Figure 6] 10 is a step diagram (part 3) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the first embodiment of the present invention. FIG. [Figure 7] FIG. 10 is an external view of a mounting device equipped with a tool slider according to a second embodiment of the present invention. [Figure 8] FIG. 10 is an external view illustrating a tool slider according to a second embodiment of the present invention. [Figure 9] 10 is a step diagram (part 1) illustrating the movement of a tool slider and the change in the positions of a semiconductor chip and an attachment tool according to the second embodiment of the present invention. FIG. [Figure 10] 10 is a step diagram (part 2) illustrating the movement of the tool slider and the change in the positions of the semiconductor chip and the attachment tool according to the second embodiment of the present invention. FIG. [Figure 11] FIG. 10 is a step diagram illustrating a characteristic part of the operation of a modified example of the second embodiment of the present invention. [Figure 12] FIG. 10 is a step diagram illustrating the operation of transferring the attachment tool from the mounting head to the tool slider in a modified example of the second embodiment of the present invention. [Figure 13] FIG. 10 is a step diagram showing an operation in which the effect of using a plurality of relay heads is not realized in a modified example of the second embodiment of the present invention. [Figure 14] FIG. 10 is an external view illustrating a tool slider according to a third embodiment of the present invention. [Figure 15] FIG. 10 is a step diagram (part 1) illustrating a characteristic part of the operation of the third embodiment of the present invention. [Figure 16] FIG. 10 is a step diagram (part 2) illustrating a characteristic part of the operation of the third embodiment of the present invention. [Figure 17] 1A and 1B are diagrams illustrating a tool slider and a chip slider in which the tool slider holds an attachment tool, respectively, relating to a chip transport means for transporting a semiconductor chip without contacting the electrode surface. [Figure 18] 1A and 1B are diagrams for explaining the configuration as a chip slider, in which (a) is a diagram showing the appearance of the tool slider, (b) is a cross-sectional view of the attachment tool and the tool slider, and (c) is a cross-sectional view of the tool slider when it holds the attachment tool and functions as a chip slider. [Figure 19] 1 is a schematic diagram of a mounting apparatus equipped with chip transport means for transporting semiconductor chips without contacting the electrode surfaces. [Figure 20] This explains the operation of picking up a semiconductor chip from a dicing tape, and shows (a) a state in which a wafer attached to a dicing tape has been diced and separated into multiple semiconductor chips, (b) a state in which the semiconductor chip is being pushed up from the opposite side of the dicing tape, (c) a state in which the collet adsorbs the electrode surface of the semiconductor chip in the same state and rises, and (d) a state in which the semiconductor chip has been peeled off the dicing tape and is held by the collet. [Figure 21]This explains the operation of a mounting device equipped with a chip transport means for transporting a semiconductor chip without contacting the electrode surface, and shows (a) a state in which the collet holding the semiconductor chip and the relay head are brought close together, (b) a state in which the attachment tool held by the relay head is in close contact with the semiconductor chip held by the collet, (c) a state in which the semiconductor chip has been transferred to the relay head via the attachment tool, (d) a state in which the semiconductor chip is held by the relay head together with the attachment tool, (e) a state in which the relay head has been inverted from the same state, and (f) a state in which the relay head and tool slider in the same state have been brought close together. [Figure 22] This explains the operation of a mounting device equipped with a chip transport means for transporting a semiconductor chip without contacting the electrode surface, and shows (a) a state in which a tool slider is in close contact with an attachment tool holding a semiconductor chip, (b) a state in which the attachment tool holding a semiconductor chip has been transferred from a relay head to the tool slider, (c) a state in which the tool slider transports the attachment tool holding a semiconductor chip, (d) a state in which the tool slider has transported the attachment tool holding a semiconductor chip to directly below the mounting head, (e) a state in which the attachment tool holding a semiconductor chip has been in close contact with the head suction block of the mounting head, and (f) a state in which the attachment tool holding a semiconductor chip has been transferred to the mounting head. [Figure 23] This explains the operation of a mounting device equipped with a chip transport means for transporting a semiconductor chip without contacting the electrode surface, and shows (a) a mounting head holding a semiconductor chip via an attachment tool that holds the semiconductor chip, (b) a state in which the semiconductor chip held by the attachment tool approaches the substrate as the mounting head descends, (c) a state in which the semiconductor chip is in close contact with the substrate after the semiconductor chip and substrate have been aligned, and (d) a state in which the attachment tool, which has released its hold on the semiconductor chip, rises together with the mounting head after the semiconductor chip and substrate have been bonded. DETAILED DESCRIPTION OF THE INVENTION

[0035] An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a tool slider 61S used in the first embodiment of the present invention, and the tool slider 61 in the mounting apparatus 1 shown in FIG. 19, the division into the chip supply section 1A and the mounting section 1B is merely for convenience. Therefore, the relay head 1A may be considered to belong to the mounting section 1B, and in this case the chip transport means 6 can be said to be located within the mounting section 1B.

[0036] Unlike the tool slider 61 shown in FIG. 17(a), the tool slider 61S shown in FIG. 1 is capable of holding only the attachment tool 42. That is, in the configuration of the tool slider 61 shown in FIG. 17(a), when no chip component C is present, the second suction holes 422H shown in FIG. 18(b) are not blocked, making it difficult to suction only the attachment tool 42 even when the pressure reduction flow path 61P is reduced. For this reason, the tool slider 61S shown in FIG. 1 has tool suction holes 611H in the frame 611 as suction holes for suction-holding the attachment tool 42. Here, the tool suction holes 611H do not overlap with either the first suction holes 421H or the second suction holes 422H of the attachment tool 42. Furthermore, the tool decompression flow path 611P, which communicates with the tool suction holes 611H, is independent of the decompression flow path 61P.

[0037] In the tool slider 61S, the positional relationship between the tip suction hole 61H and the tool suction hole 611H is not limited to that shown in Fig. 1, and they may be arranged on the same straight line. In short, it is sufficient that the tool suction hole 611H is arranged in a position where it can suck the attachment tool 42 without overlapping with either the first suction hole 421H or the second suction hole 422H of the attachment tool 42.

[0038] If the tool slider 61S has a tool suction hole 611H in addition to the suction hole 61H as shown in Figure 1, with the configuration of the mounting device 1 shown in Figure 19, it is possible to transport the attachment tool 42 held by the mounting head 4 as shown in Figure 23(d) from the mounting section 1B side to the chip supply section 1A side and return it to the state where it is held by the relay head 8 (Figure 21(a)).

[0039] 2 and 3 illustrate the state changes that occur when the attachment tool 42, which is held by the mounting head 4 as shown in Fig. 23(d), is held by the relay head 8 shown in Fig. 21(a). Here, in order to provide an explanation assuming that the arrangement of the chip suction holes 61H and the tool suction holes 611H is in the positional relationship shown in Fig. 1, Figs. 21 to 23 are views viewed from the X direction in which the chip suction holes 61H enter the cross section, while Figs. 2 and 3 are views viewed from the Y direction in which the tool suction holes 611H enter the cross section.

[0040] Fig. 2(a) shows a state in which the mounting head 4 has risen further from the state shown in Fig. 23(d). After this, Fig. 2(b) shows a state in which the tool slider 61S, which had retreated to another position from the state shown in Fig. 22(f), is positioned close to and directly below the mounting head 4. 2(c), the mounting head 4 is lowered to bring the tool slider 61S into close contact with the attachment tool 42. In this state, the tool suction hole 611H of the tool slider 61S faces the flat surface of the attachment tool 42, so that the attachment tool 42 is held by suction to the tool slider 61S by depressurizing the tool depressurization flow path 611P.

[0041] By releasing the suction hold by the head suction block 41 and raising the mounting head 4, the attachment tool 42 is transferred to the tool slider 61S and fixed thereto, as shown in FIG. 2(d). Therefore, if the tool slider 61S is configured to be able to reciprocate along the transport rail, it becomes possible to transport the tool slider 61S toward the chip supply unit 1A (in the −X direction), as shown in FIG. 2(e). After the attachment tool 42 is moved to the lower side of the relay head 8, as shown in FIG. 2(f), the relay head 8 is lowered to come into close contact with the attachment tool 42 and hold it by suction, as shown in FIG. 3(a). Then, by releasing the suction hold by the tool slider 61S (by opening the tool pressure reduction channel 611P), the relay head 8 is raised (FIG. 3(b)), and the attachment tool 42 transferred from the tool slider 61S is held by the relay head 8, as shown in FIG. 3(c).

[0042] After the attachment tool 42 is held by the relay head 8 in this manner, the relay head 8 is turned over and is ready for use at the stage shown in FIG. 21(a).

[0043] Here, the tool slider 61S shown in FIG. 1 has the function of holding a semiconductor chip C via an attachment tool 42, similar to the tool slider 61 (shown in FIG. 17(a)). Therefore, there is no problem in using the tool slider 61S instead of the tool slider 61 in the steps of FIGS. 21 to 23. That is, the tool slider 61S, which has the added function of holding only the attachment tool 42 and the ability to move the tool slider 61S from the mounting unit 1B side to the chip supply unit 1A, allows one attachment tool 42 to be used repeatedly. Here, adding the function of holding only the attachment tool 42 to the tool slider 61S and adding the ability to move the tool slider 61S from the mounting unit 1B side to the chip supply unit 1A have almost no effect on the size of the device. Furthermore, because one attachment tool 42 can be used repeatedly, there is no need to have multiple attachment tools 42 of the same shape.

[0044] 21 to 23 and 2 to 3 mainly explain the tool slider 61S (in FIGS. 21 to 23, tool slider 61 is replaced with tool slider 61S), but FIGS. 4 to 6 show the state transitions of each part within the movable range of the tool slider 61S in the mounting device.

[0045] 4 to 6 are step diagrams showing the positional changes of the tool slider 61S, attachment tool 42, and semiconductor chip C in the relay head 8 of the chip supply unit 1A, the mounting head 4 of the mounting unit 1B, and the transport rail 60. In each figure, each component is shown in a simplified form, and the relay head 8 is shaped so that it is clear whether the surface holding the attachment tool 42 is facing up or down.

[0046] Since the tool slider 61S is repeatedly used while reciprocating between the relay head 8 and the mounting head 4, any process may be set as STEP 1, but in FIG. 4, the start state corresponds to FIG. 3(d).

[0047] 4, the collet 143 is omitted, and therefore STEP 2 shows the state from Figure 21(a) to Figure 21(d). That is, STEP 2 shown in Figure 4 is the state in which the relay head 8 holds the semiconductor chip C via the attachment tool 42, and then STEP 3 is the state in which the relay head 8 is turned over.

[0048] 4, the attachment tool 42 holding the semiconductor chip C is transferred from the relay head 8 to the tool slider 61S as shown in FIGS. 21(f) to 22(b). Then, in STEP 6, the attachment tool 42 holding the semiconductor chip C moves along the transport rail 60 toward the mounting head 4 (corresponding to FIG. 22(C)).

[0049] The tool slider 61S, which is positioned directly below the mounting head 4, transfers the attachment tool 61S holding the semiconductor chip C to the mounting head 4 (head suction block 41) through STEP 7 to STEP 9 shown in Figure 5 (corresponding to Figures 22(d) to 22(f)).

[0050] The mounting head 4, which has been handed the attachment tool 42 holding the semiconductor chip C, places the substrate S directly below it after the tool slider 61S has retracted (corresponding to Figure 23(b)), and then in STEP 11, mounts the semiconductor chip C by adhering it to the substrate S (corresponding to Figure 23(c)).In STEP 12, the attachment tool 42 releases the suction of the semiconductor chip C while still holding it and rises (corresponding to Figure 23(d)).

[0051] As described above, the semiconductor chip C picked up by the chip supply unit 1A is transported to the mounting unit 1B together with the attachment tool 42, and after the mounting head 4 mounts the semiconductor chip C on the substrate S, only the attachment tool 42 is transported toward the relay head 8.

[0052] Therefore, as shown in STEP 13 in FIG. 5, the tool slider 61S is placed (as shown in FIG. 2(b)) directly below the mounting head 4 (as shown in FIG. 2(a)) after the semiconductor chip C has been mounted, and then the attachment tool 42 is transferred from the mounting head 4 to the tool slider 61S as shown in STEP 14 and STEP 15 in FIG. 6 (corresponding to FIGS. 2(c) and 2(d)).

[0053] The tool slider 61S, to which the attachment tool 42 has been handed over, moves along the conveying rail 60 toward the relay head 8 as in STEP 16 (corresponding to Figure 2(e)), and is positioned directly below the relay head 8 in STEP 17 (corresponding to Figure 2(f)).

[0054] The tool slider 61S disposed directly below the relay head 8 passes through STEP 17 to STEP 19 (corresponding to FIGS. 2(f) to 3(b)), and delivers the attachment tool 42 to the relay head 8. After this, the relay head 8 is turned over, thereby reaching the state of STEP 1 shown in FIG.

[0055] Incidentally, even if a tool slider 61 that cannot adsorb the attachment tool 42 without holding a semiconductor chip C is used, the attachment tool 42 can be mounted on the frame body 611, but cannot be held (fixed). This results in a large positional deviation when the attachment tool 42 is transferred to the relay head 8. At the stage of STEP 2 shown in FIG. 9, it becomes difficult to hold the semiconductor chip C in the predetermined position of the attachment tool 42, and this is unsuitable for mounting that requires high-precision alignment.

[0056] As described above, by using the tool slider 61S, it is clear that the attachment tool 42 can be used repeatedly. On the other hand, as can be seen from FIGS. 4 to 6, components other than the one holding the attachment tool 42 rarely operate. For example, the mounting head 4 does not operate from STEP 1 to STEP 6, and the relay head 8 does not operate from STEP 6 to STEP 16. This is disadvantageous from the perspective of takt time.

[0057] For this reason, we thought that takt time could be improved by arranging multiple attachment tools 42 within the range from the relay head 8 to the mounting head 4, but we found that this was not possible with the configuration of the mounting device 1 shown in Figure 19. Therefore, after various studies, it was found that the takt time can be significantly improved by using the tool slider 61D according to the second embodiment of the present invention. Fig. 7 is an external view of a mounting apparatus 1001 equipped with the tool slider 61D, and apart from using the tool slider 61D, the basic configuration is the same as that of the first embodiment using the tool slider 61S. In other words, the tool slider 61D constitutes the chip transport means in the mounting apparatus 1001 shown in Fig. 7.

[0058] 7, tool slider 61D of mounting device 1001 has a configuration in which two tool sliders 61S are connected along transport rail 60. That is, as shown in FIG. 8, the external appearance of tool slider 61D is such that frame body 611A and frame body 611B, which are the same frame body as frame body 611 of tool slider 61S, are connected along transport rail 60. Furthermore, frame body 611A and frame body 611B have chip suction holes 61AH and chip suction holes 61BH that have the same function as chip suction hole 61H provided in frame body 611, and also have tool suction holes 611AH and tool suction holes 611BH that have the same function as tool suction hole 611H.

[0059] The tool slider 61D can hold two attachment tools 42 at the same time, but the mounting apparatus 1001 can handle three attachment tools 42 at the same time. Therefore, FIGS. 9 and 10 are step diagrams that show the state transitions of the attachment tools 42 within the mounting apparatus 1001. While the step diagrams of FIGS. 4 to 6 show the presence or absence of the tool slider 61S midway along the conveyor rail 60, this is omitted in the step diagrams of FIGS. 9 and 10. This is because, when the tool slider 61D is used, a state in which the tool slider 61S waits midway along the conveyor rail 60, such as in STEP 10 to STEP 12 shown in FIG. 5, is unnecessary, and the movement between below the relay head 8 and below the mounting head 4 can be seen from the difference between the diagrams of the steps.

[0060] The operations of the relay head 8, the mounting head 4, and the tool slider 61D in the mounting apparatus 1001 will be described below using examples of each step shown in FIGS.

[0061] First, in STEP 1 shown in Figure 9, the relay head 8 holds the attachment tool 42 and waits for the semiconductor chip C to be handed over, while the tool slider 61D moves under the head suction block 41 (of the mounting head 4), allowing the mounting head 4 to hand over the attachment tool 42 to the frame body 611B side.

[0062] Next, in STEP 2 shown in FIG. 9, the semiconductor chip C is delivered to the relay head 8, while the mounting head 4, which has delivered the attachment tool 42 to the frame 611B side, is raised.

[0063] After this, while the relay head 8 is inverted between STEP 3 and STEP 4 shown in Figure 9, the frame body 611A side is positioned directly below the head suction block 41 of the mounting head 4, and then the attachment tool 42 holding the semiconductor chip C can be transferred from the frame body 611A side to the mounting head 4.

[0064] In STEP 5, after the attachment tool 42 is handed over from the frame body 611A side to the mounting head 4, the tool slider 61D (not shown in Figure 9) moves from below the mounting head 4 to below the relay head 8, and the mounting location of the substrate S is positioned below the mounting head 4.

[0065] Therefore, from STEP 6 shown in Figure 9 to STEP 8 shown in Figure 10, the relay head 8 passes the attachment tool 42 holding the semiconductor chip C to the frame body 611A side of the tool slider 61D, while the mounting head 4 can mount the semiconductor chip C on the substrate S.

[0066] 10, the frame body 611B side of the tool slider 61D is moved to directly below the relay head 8, and then the attachment tool 42 is handed over from the frame body 611B side to the relay head 8 in STEP 10 to STEP 11. In STEP 9 to STEP 11 shown in FIG. 10, the mounting head 4 is in a standby state holding the attachment tool 42, but if the time required for mounting is long, the mounting work described in STEP 6 to STEP 8 may be performed in STEP 6 to STEP 10.

[0067] 1, the tool slider 61D (not shown) moves from below the relay head 8 to below the mounting head 4, and in STEP 12 the relay head 8 holding the attachment tool 42 is turned over to prepare for the transfer of the semiconductor chip C, while the tool slider 61D moves below the head suction block 41 (of the mounting head 4). After this, the state can be shifted to STEP 1 in FIG. 9, making it possible to repeat the operation.

[0068] Incidentally, as explained regarding the mounting head 4 in STEP 9 to STEP 11 shown in FIG. 10, the operations of the relay head 8, the mounting head 4, and the tool slider 61D do not necessarily have to be in the relationship shown in FIGS. 9 and 10, but may be adjusted according to the operating time of each part.

[0069] In any case, by using the tool slider 61D capable of holding two attachment tools 42, the standby time of both the relay head 8 and the mounting head 4 is shortened. Since the standby time of the mounting head 4 is shortened, the takt time for mounting is shortened and productivity is improved. Note that even if the tool slider 61D is used for the chip transport means 6, the size of the mounting apparatus as a whole remains almost unchanged. Therefore, productivity can be improved with a compact shape compared to the apparatus configuration for retrieving the attachment tool 42 from the mounting head 4.

[0070] Incidentally, with regard to the state of the mounting head 4 from STEP 9 to STEP 11 shown in Figure 10, it was explained that if the time required for mounting is long, it will not enter a standby state, but hybrid bonding, which does not require much temperature increase or decrease like solder bonding, can be completed in a short time. For this reason, shortening the operation from STEP 6 shown in Figure 9 to STEP 11 shown in Figure 10 as much as possible will further improve the takt time.

[0071] Therefore, as a modification of the second embodiment, a method using a plurality of relay heads 8 was considered. That is, a method using relay head 8A and relay head 8B was considered. Furthermore, when relay head 8A and relay head 8B face the tool slider 61D, the interval at which they hold the attachment tools 42 is made equal to the interval at which the frame bodies 611A and 611B hold the attachment tools 42, thereby enabling simultaneous transfer.

[0072] Specifically, as shown in STEPRD1 to STEPRD3 in FIG. 11, the attachment tool 42 holding the semiconductor chip C can be transferred from the relay head 8A to the frame portion 611A side, and at the same time, the attachment tool 42 held by the frame portion 611B side can be transferred to the relay head 8B, thereby shortening the takt time.

[0073] However, after the tool slider 61D moves in the state of STEPRD3, the attachment tool 42 is transferred to the frame portion 611B by the operations of STEPB1 to STEPB3 shown in Fig. 12, so when the tool slider 61D returns to the relay head side, the semiconductor chip C and attachment tool 42 held by the relay head 8B cannot be transferred to the frame portion 611B side. Therefore, the operations of STEPRS1 to STEPRS6 shown in Fig. 13 must be performed, and the advantage of having two relay heads 8 cannot be said to be sufficient.

[0074] Therefore, as a third embodiment of the present invention, it was discovered that in order to achieve the effect of having two relay heads 8 (relay head 8A and relay head 8B), it is effective to use a tool slider 61T having three frame bodies as a chip transport means.

[0075] Figure 14 is an external view of a tool slider 61T according to embodiment 3 of the present invention, in which a frame body 611C, which is the same as frame body 611A and frame body 611B constituting tool slider 61D shown in Figure 8, is connected (to tool slider 60D) in a direction along the conveying rail 60.

[0076] When the tool slider 61T is used, when the attachment tool 42 holding the semiconductor chip C on the frame portion 611B side is moved below the mounting head 4 in STEPRC1 to STEPRC3 shown in Fig. 15, the attachment tool 42 held by the mounting head 4 can be handed over to the frame portion 611A instead of the frame portion 611C. Therefore, by setting the tool slider 61T, which has moved below the relay head 8 after delivery to the mounting unit 4, as in STEPRA1 shown in Fig. 16, the attachment tool 42 can be handed over from the frame portion 611A side to the relay head 8A, and the semiconductor chip C and the attachment tool 42 can be handed over from the relay head 8B to the frame portion 611B side simultaneously in STEPRA1 to STEPRA3 shown in Fig. 16.

[0077] As described above, by using the tool slider 61T in which three frames 611 are connected, the effect of using two relay heads 8 can be fully exerted, and the time required for delivery at the chip supply unit 1B can be shortened. The effect associated with this is particularly effective in shortening the takt time for hybrid bonding, which requires a short time to mount the semiconductor chip C on the substrate S. [Explanation of symbols]

[0078] 1, 1001 Mounting equipment 1A, 1001A chip supply unit 1B, 1001B mounting section 2. Substrate stage 3 Lifting means 4 Mounting head 5. Two cameras with top and bottom views 6 Chip transport means 8 Relay Head 10 Wafer ring 11 Wafer transport means 12 Pick-up Stage 13 Push-up means 14 Pickup section 15 Chip relay part 20 Stage movement control means 21 X-direction stage movement control means 22 Y-direction stage movement control means 23 Vacuum table 40 Head body 41 Head suction block 42 Attachment Tools 43 Tool position control means 60 Transport rail 61, 61S, 61D, 61T Tool Slider 61H, 61AH, 61BH, 61CH Chip suction holes 61V exhaust hole 62 Tip Slider 100 wafer racks 120 frames 131 Needle 140 Horizontal rail 141 Upper and lower rails 142 Pickup head 143 Colette 150 horizontal rail 151 Upper and lower rails 200 bases 420H Adsorption hole 420V exhaust vent 421H 1st suction hole 421P First pressure reducing channel 421V First exhaust port 422H 2nd suction hole 422P Second pressure reducing channel 422V Second exhaust port 610, 610A, 610B, 610C opening 611, 611A, 611B, 611C frame 611H, 611AH, 611BH, 611CH Suction hole for tools B electrode C. Semiconductor chip DT Dicing Tape S board

Claims

1. A chip transport means for transporting semiconductor chips from a chip supply unit to a mounting unit, a tool slider that receives and holds the semiconductor chip held by an attachment tool together with the attachment tool in the chip supply unit; a transport rail for transporting the tool slider to the mounting section, the tool slider has a function of transferring the semiconductor chip together with the attachment tool to a mounting head of the mounting unit, and a function of receiving only the attachment tool after the semiconductor chip has been mounted by the mounting head, chip transport means capable of transporting only the attachment tool along the transport rail to the chip supply section;

2. 2. The chip transport means according to claim 1, the tool slider has a frame that supports an edge of a surface of the attachment tool that holds the semiconductor chip, The frame has suction holes communicating with a pressure-reducing flow path on the surface that comes into contact with the attachment tool, and the frame is shaped so that the semiconductor chip can be accommodated inside the frame.

3. 3. The chip transport means according to claim 2, the attachment tool has a first chip suction flow path that communicates with a pressure reduction flow path of the mounting head and that suctions the semiconductor chip, and a second chip suction flow path that is provided independently of the first chip suction flow path and that is capable of suctioning the semiconductor chip, The chip transport means has, as suction holes in the frame, a chip suction hole that is coupled to the second chip suction flow path of the attachment tool, and a tool suction hole that suction-holds the attachment tool.

4. 3. The chip transport means according to claim 2, The chip transport means has one tool slider having a plurality of the frame bodies connected thereto.

5. a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side, and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool; A chip transport means according to any one of claims 1 to 3; a mounting head for receiving the semiconductor chip transported by the chip transport means together with the attachment tool;

6. a chip supply unit having a collet that holds a semiconductor chip from the electrode surface side, and a relay head that holds the semiconductor chip held by the collet from the opposite side of the electrode surface via the attachment tool; a chip transport means according to claim 4; a mounting head for receiving the semiconductor chip transported by the chip transport means together with the attachment tool;

7. The mounting device according to claim 6, A mounting device in which a plurality of the relay heads are arranged at the same intervals as the intervals at which the plurality of frame bodies are arranged.

8. The mounting device according to claim 7, The mounting apparatus has a number of the frames greater than the number of the relay heads.

9. The mounting device according to any one of claims 6 to 8, A mounting apparatus in which the attachment tool is simultaneously disposed at at least two locations on the relay head, the tool slider, and the relay head.

10. The mounting device according to claim 5, The collet holds the semiconductor chip in a non-contact manner.

11. The mounting device according to any one of claims 6 to 8, The collet holds the semiconductor chip in a non-contact manner.

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