Electronic device

Abstract

To provide an electronic device capable of both preventing radiation noise from electronic components and improving the heat dissipation of the electronic components.SOLUTION: An electronic device 1 includes: a circuit board 10 mounted with heat-generating electronic components 40; heat sinks 20, 20a, 20b that are arranged to cover the electronic component 40 in contact with the electronic component 40; and standing walls 30, 30a, 30b that enclose the periphery of the electronic component 40 and are arranged to be sandwiched by the heat sinks 20, 20a, 20b and the circuit board 10.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] As electronic devices have become more multifunctional and sophisticated, the electronic components installed in the devices have become faster and more sophisticated, and power consumption is expected to increase. This has led to a demand for EMC (Electromagnetic Compatibility) measures and improved heat dissipation to counter the increased heat generated by the electronic components.

[0003] For example, Patent Document 1 discloses an electronic device having a lid that is arranged on a printed circuit board so as to cover electronic components that are noise sources and to be in close contact with the electronic components via a heat dissipation gel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-64670 Summary of the Invention [Problem to be solved by the invention]

[0005] In the electronic device of Patent Document 1, if it is desired to dissipate heat conducted from the electronic component through the lid, it is conceivable to separately place a heat sink on the surface of the lid. In this case, a heat dissipation gel is separately placed between the lid and the heat sink, so that the heat conducted to the lid is dissipated to the heat sink. However, because the structure involves multiple substances in the path that conducts heat from the electronic component to the heat sink, there is a problem that the thermal resistance increases and the heat dissipation effect of the electronic component is reduced.

[0006] Therefore, an object of the present disclosure is to provide an electronic device that can simultaneously suppress radiation noise from electronic components and improve the heat dissipation properties of the electronic components. [Means for solving the problem]

[0007] An electronic device according to one aspect of the present disclosure includes a circuit board on which a heat-generating electronic component is mounted, a heat sink that is in contact with the electronic component and is arranged to cover the electronic component, and a standing wall that surrounds the electronic component and is arranged to be sandwiched between the heat sink and the circuit board. [Effects of the Invention]

[0008] According to an electronic device according to an aspect of the present disclosure, it is possible to suppress radiation noise from electronic components and improve the heat dissipation properties of the electronic components at the same time. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing an electronic device according to an embodiment. [Figure 2A] FIG. 2A is a cross-sectional view showing an electronic device according to a comparative example. [Figure 2B] FIG. 2B is a diagram showing the noise level and frequency of an electronic component. [Figure 3] FIG. 3 is a cross-sectional view showing an electronic device in which the heat sink and the standing wall are separate bodies. [Figure 4] FIG. 4 is a cross-sectional view showing an electronic device having a first substrate and a second substrate. [Figure 5] FIG. 5 is a cross-sectional view showing an electronic device having a first standing wall and a second standing wall. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, the embodiments will be specifically described with reference to the drawings.

[0011] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, arrangement positions and connection forms of the components, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not recited in the independent claims are described as optional components.

[0012] Furthermore, each drawing is a schematic diagram and is not necessarily a precise illustration. In each drawing, the same components are denoted by the same reference numerals. Note that the contents shown in the drawings are considered to be disclosed in the present embodiment even if they are not described in detail in the present embodiment.

[0013] Furthermore, in the following embodiments, expressions such as rectangular plate-like are used. For example, rectangular plate-like does not only mean a perfectly rectangular plate, but also means a substantially rectangular plate, i.e., with an error of a few percent. Furthermore, rectangular plate-like means a rectangular plate-like shape within the range in which the effects of the present disclosure can be achieved. The same applies to other expressions using "shape."

[0014] (Embodiment) <Configuration> An electronic device 1 according to an embodiment will be described below with reference to FIG.

[0015] FIG. 1 is a cross-sectional view showing an electronic device 1 according to an embodiment.

[0016] As shown in FIG. 1, the electronic device 1 is, for example, an in-vehicle electronic device 1 mounted on a vehicle, or an electronic device 1 mounted on an information processing device such as a computer.

[0017] The electronic device 1 includes an electronic component 40, a circuit board 10, a heat sink 20, a standing wall 30, and a heat dissipation member 50.

[0018] The circuit board 10 is a printed circuit board on which metal wiring such as copper foil is patterned. A plurality of heat-generating electronic components 40 are mounted on a surface 13 of the circuit board 10 of this embodiment. The electronic components 40 are semiconductor elements and are electrically connected to the metal wiring of the circuit board 10. The electronic components 40 are semiconductor elements (integrated circuits), and are, for example, at least one of an SoC (System on a Chip), a power supply IC (Integrated Circuit), and a memory element.

[0019] The metal wiring arranged on the surface 13 of the circuit board 10 is formed with a first land (not shown) for electrical continuity to which the electronic component 40 is soldered, and a second land (not shown) for grounding to which the standing wall 30 is grounded.

[0020] An electronic component 40 is placed on the first land. The first land is electrically connected to the electronic component 40 via solder (not shown).

[0021] A standing wall 30 is disposed on top of the second land. The second land is electrically connected to the standing wall 30 via solder. Since the standing wall 30 is connected to the second land by solder, the standing wall 30 is physically connected to the circuit board 10 and is also grounded.

[0022] In the embodiment, the circuit board 10 has, for example, a rectangular plate shape. However, the shape of the circuit board 10 is not limited to this, and it may be a circle or another polygonal shape.

[0023] The heat sink 20 is a heat dissipating body for dissipating heat from the electronic components 40. The heat sink 20 is made of a metal material such as aluminum or copper.

[0024] The heat sink 20 is disposed so as to be in contact with and cover the electronic component 40. In this embodiment, the heat sink 20 is in contact with the electronic component 40 via the heat dissipation member 50. In this manner, the heat sink 20 is thermally connected to the electronic component 40, and therefore can dissipate heat from the electronic component 40.

[0025] The heat sink 20 has a plate-shaped base portion 22 and a plurality of fins 21 .

[0026] The base portion 22 is plate-shaped and is disposed so as to cover the electronic components 40, and is supported by the standing wall 30.

[0027] The base portion 22 is in direct or indirect contact with the electronic components 40. In the present embodiment, the base portion 22 is thermally connected to at least one of the electronic components 40 via the heat dissipation member 50. Therefore, the base portion 22 is indirectly connected to the electronic components 40.

[0028] The fins 21 protrude in the direction opposite to the circuit board 10 side from the surface of the base portion 22 opposite to the circuit board 10 side.

[0029] The standing wall 30 is integrated with the heat sink 20. The standing wall 30 is integrated with the heat sink 20 means that the standing wall 30 and the heat sink 20 cannot be separated from each other without destroying the standing wall 30 and the heat sink 20.

[0030] The standing wall 30 is shaped like a frame that surrounds the electronic component 40 and houses the electronic component 40 therein. The standing wall 30 extends from the base portion 22 toward the circuit board 10, and one end of the standing wall 30 may be connected to a second land of the circuit board 10 by soldering. The standing wall 30 may also be connected to the circuit board 10 by a fixing member such as a screw or a bolt.

[0031] For this reason, the standing wall 30 is disposed so as to be sandwiched between the heat sink 20 and the circuit board 10. In other words, the standing wall 30 and the heat sink 20 surround the electronic component 40 so as to accommodate it. For this reason, even if the electronic component 40 generates noise, the heat sink 20 and the standing wall 30 can prevent the noise from being emitted from the electronic device 1.

[0032] The heat dissipation member 50 is disposed so as to be sandwiched between the electronic component 40 and the heat sink 20. In other words, the heat dissipation member 50 thermally connects the electronic component 40 and the base portion 22 of the heat sink 20. Therefore, when the electronic component 40 generates heat, the heat dissipation member 50 can conduct the heat from the electronic component 40 to the base portion 22. The heat dissipation member 50 is at least one of thermal grease, thermal gel, and thermal polymer.

[0033] Here, the heat dissipation capability of electronic device 101 of the comparative example and the heat dissipation capability of electronic device 1 of the present embodiment will be described with reference to Fig. 2A. Fig. 2A is a cross-sectional view showing electronic device 101 according to the comparative example.

[0034] For example, the electronic device 101 of the comparative example has an electronic component 140, a circuit board 110 on which the electronic component 140 is mounted, a shield 130a that covers and accommodates the electronic component 140, a first heat dissipation material 160 that thermally connects the shield 130a and the electronic component 140, a heat sink 120a, and a second heat dissipation material 150 that is sandwiched between the heat sink 120a and the shield 130a and thermally connects the heat sink 120a and the shield 130a.

[0035] In this case, for example, if the size of the electronic component 140 is 25 mm × 25 mm, the area of ​​the first heat dissipation material 160 and the second heat dissipation material 150 is 25 mm × 25 mm, the thickness of the first heat dissipation material 160 and the second heat dissipation material 150 is 1 mm, the thermal conductivity of the first heat dissipation material 160 and the second heat dissipation material 150 is 10 W / (m·K), and the contact thermal resistance is 0.2 K / W, the thermal resistance R1 from the electronic component 140 to the shield 130a via the first heat dissipation material 160 is 0.36 K / W. Also, if the size of the shield 130a is 65 mm × 65 mm, the thickness of the shield 130a is 2 mm, and the thermal conductivity of the shield 130a is 96 W / (m·K), the thermal resistance R2 from the first heat dissipation material 160 to the second heat dissipation material 150 via the shield 130a is 0.004931 K / W. Furthermore, if the size of the second heat dissipation material 150 is 65 mm x 65 mm, the thickness of the second heat dissipation material 150 is 1 mm, the thermal conductivity of the second heat dissipation material 150 is 10 W / (m·K), and the contact thermal resistance is 0.2 K / W, the thermal resistance R3 from the shield 130 a to the heat sink 120 a via the second heat dissipation material 150 is 0.223669 K / W.

[0036] The thermal resistance R from the top surface of electronic component 140 in electronic device 101 of the comparative example to the surface of the base part of heat sink 120a on the circuit board 110 side is R1+R2+R3=0.5886 K / W.

[0037] On the other hand, in the electronic device 1 of this embodiment, the thermal resistance R' from the top surface of the electronic component 40 to the surface 22a of the base portion 22 of the heat sink 20 on the circuit board 10 side is only R1=0.36 K / W.

[0038] Therefore, the electronic device 1 of this embodiment has superior heat dissipation properties compared to the electronic device 101 of the comparative example.

[0039] For example, when the power consumption of the electronic component 40 is 10 W, the electronic device 1 of the present embodiment can reduce the temperature by 2.286° C. compared to the electronic device 101 of the comparative example.

[0040] For example, when the power consumption of the electronic component 40 is 20 W, the electronic device 1 of the present embodiment can reduce the temperature by 4.572° C. compared to the electronic device 101 of the comparative example.

[0041] For example, when the power consumption of the electronic component 40 is 40 W, the electronic device 1 of the present embodiment was able to reduce the temperature by 9.144° C. compared to the electronic device 101 of the comparative example.

[0042] As described above, in the electronic device 1 of the present embodiment, the heat generated by the electronic component 40 is conducted to the base portion 22 of the heat sink 20 via the heat dissipation member 50. The conducted heat is diffused from the base portion 22 and the plurality of fins 21. Therefore, the electronic device 1 of the present embodiment has superior heat dissipation properties compared to the electronic device 101 of the comparative example.

[0043] Here, the noise level of the electronic device 101 of the comparative example and the noise level of the electronic device 1 of the present embodiment will be described with reference to FIG. 2B.

[0044] FIG. 2B is a diagram showing the noise level and frequency of the electronic component 40. As shown in FIG.

[0045] For example, in FIG. 2B, the noise level of the electronic device 1 without the standing wall 30 is indicated by a black circle, and the noise level of the electronic device 1 with the standing wall 30 of this embodiment is indicated by a black square.

[0046] Compared to the electronic device 1 without the standing wall 30, the electronic device 1 having the standing wall 30 of this embodiment was able to reduce the noise level by about 6 dB over the frequency range of 0.5 GHz to 3 GHz.

[0047] In this way, in the electronic device 1 of the present embodiment, the heat sink 20 and the standing wall 30 surround the electronic component 40 to house it, and therefore, compared to an electronic device without standing walls, the heat sink 20 and the standing wall 30 in the electronic device 1 of the present embodiment can block noise emitted from the electronic component 40. This makes it difficult for noise to be emitted from the electronic device 1 to the outside.

[0048] Next, as shown in FIG. 3, in the electronic device 1 of this embodiment, the standing wall 30a may be separated from the heat sink 20a.

[0049] FIG. 3 is a cross-sectional view showing an electronic device 1 in which the heat sink 20a and the standing wall 30a are separate bodies.

[0050] Specifically, the standing wall 30a may not be integrated with the heat sink 20a, but may be a separate body separated from the heat sink 20a. One end of the standing wall 30a on the circuit board 10 side may be connected to a second land of the circuit board 10 by soldering. In other words, the standing wall 30a may be integrated with the circuit board 10.

[0051] The standing wall 30a may extend from the surface (surface 13) of the circuit board 10 facing the heat sink 20a toward the heat sink 20a. Since the standing wall 30a forms a frame surrounding the electronic component 40, the heat sink 20a may be placed on the other end of the standing wall 30a facing the heat sink 20a so as to close the opening of the standing wall 30a. The heat sink 20a may be connected to and supported by the standing wall 30a or the circuit board 10 by fixing members such as screws or bolts.

[0052] In this electronic device 1, too, the heat generated by the electronic component 40 is conducted to the base 22 of the heat sink 20a via the heat dissipation member 50. The conducted heat is diffused from the base 22 and the plurality of fins 21. Therefore, the electronic device 1 of the present embodiment has superior heat dissipation properties compared to the electronic device 101 of the comparative example.

[0053] Furthermore, since the heat sink 20a and the standing wall 30a surround the electronic component 40 so as to house it, the electronic device 1 of this embodiment can block noise emitted from the electronic component 40.

[0054] 4, the circuit board 10 of the electronic device 1 of this embodiment may have a first board 11 on which electronic components 40 are mounted, and a second board 12 on which the first board 11 is mounted. The first board 11 and the second board 12 may have the same configuration as the circuit board 10 described above.

[0055] FIG. 4 is a cross-sectional view showing an electronic device 1 having a first substrate 11 and a second substrate 12. As shown in FIG.

[0056] First substrate 11 may be electrically connected to second substrate 12 by being joined to second substrate 12 by soldering.

[0057] The standing wall 30b may be disposed so as to surround the periphery of the electronic component 40 and the first substrate 11 and be sandwiched between the heat sink 20a and the second substrate 12.

[0058] The standing wall 30b may be integrated with the heat sink 20a. In this case, the standing wall 30b extends from the base portion 22 toward the second substrate 12, and one end of the standing wall 30b may be connected to a second land of the second substrate 12 by solder. The standing wall 30b may also be connected to the second substrate 12 by a fixing member such as a screw or a bolt. Since the standing wall 30b is disposed so as to be sandwiched between the heat sink 20a and the second substrate 12, the standing wall 30b and the heat sink 20a may surround the electronic component 40 and the first substrate 11 so as to accommodate them.

[0059] The standing wall 30b may be a separate body from the heat sink 20a. In this case, one end of the standing wall 30b on the second substrate 12 side may be connected to a second land of the second substrate 12 by soldering, or the standing wall 30b may be connected to the second substrate 12 by a fixing member such as a screw or a bolt. That is, the standing wall 30b may be integrated with the second substrate 12. The standing wall 30b may extend from the surface 13 of the second substrate 12 on the heat sink 20a side toward the heat sink 20a. Since the standing wall 30b has a frame shape surrounding the electronic component 40, the heat sink 20a may be placed on the other end of the standing wall 30b on the heat sink 20a side so as to close the opening of the standing wall 30b. The heat sink 20a may be connected to and supported by the standing wall 30b or the second substrate 12 by a fixing member such as a screw or a bolt.

[0060] In this electronic device 1, too, the heat generated by the electronic component 40 is conducted to the base 22 of the heat sink 20a via the heat dissipation member 50. The conducted heat is diffused from the base 22 and the plurality of fins 21. Therefore, the electronic device 1 of the present embodiment has superior heat dissipation properties compared to the electronic device 101 of the comparative example.

[0061] Furthermore, since the heat sink 20a and the standing wall 30b surround the electronic component 40 so as to house it, the electronic device 1 of this embodiment can block noise emitted from the electronic component 40.

[0062] Next, as shown in FIG. 5, the standing wall 30 of the electronic device 1 of this embodiment may have a first standing wall 31 integrated with the heat sink 20b and a second standing wall 32 integrated with the circuit board 10.

[0063] FIG. 5 is a cross-sectional view showing the electronic device 1 having a first standing wall 31 and a second standing wall 32. As shown in FIG.

[0064] The first standing wall 31 may extend from the surface 22a of the heat sink 20b facing the circuit board 10 toward the second standing wall 32. In other words, the first standing wall 31 may extend from the surface 22a of the base portion 22 of the heat sink 20b facing the circuit board 10 toward the second standing wall 32. The first standing wall 31 may be integrated with the heat sink 20b.

[0065] The second standing wall 32 may extend from the surface 13 of the circuit board 10 facing the heat sink 20b toward the first standing wall 31. The second standing wall 32 may be a separate body separated from the heat sink 20b. In this case, one end of the second standing wall 32 facing the circuit board 10 may be connected to a second land of the circuit board 10 by soldering, or the standing wall 30 may be connected to the circuit board 10 by a fixing member such as a screw or a bolt. In other words, the second standing wall 32 may be integrated with the circuit board 10.

[0066] Since the second standing wall 32 has a frame shape surrounding the electronic component 40, the heat sink 20b and the first standing wall 31 may be placed on the other end of the second standing wall 32 on the heat sink 20b side so as to close the opening at the other end of the second standing wall 32. The heat sink 20b may be connected to and supported by the second standing wall 32 or the circuit board 10 by fixing members such as screws, bolts, etc.

[0067] Furthermore, the heat sink 20b may be electrically connected to the second land of the circuit board 10, or may be connected to the second standing wall 32 connected to the second land.

[0068] Furthermore, the tip of the first standing wall 31 may or may not be in contact with the second standing wall 32. From the viewpoint of noise, it is preferable that the first standing wall 31 and the second standing wall 32 overlap when viewed along the surface 13 of the circuit board 10 so that no gap is formed between the first standing wall 31 and the second standing wall 32, and it is more preferable that the first standing wall 31 and the second standing wall 32 contact each other. In other words, the frame-shaped first standing wall 31 may be disposed on the outer periphery or inner periphery of the frame-shaped second standing wall 32.

[0069] <Action and effect> Next, the effects of the electronic device 1 according to this embodiment will be described.

[0070] As described above, the electronic device 1 according to the first technique of the present embodiment includes a circuit board 10 on which a heat-generating electronic component 40 is mounted, heat sinks 20, 20a, 20b that are in contact with the electronic component 40 and are arranged to cover the electronic component 40, and standing walls 30, 30a, 30b that surround the electronic component 40 and are arranged to be sandwiched between the heat sinks 20, 20a, 20b and the circuit board 10.

[0071] According to this, since the electronic component 40 and the heat sinks 20, 20a, and 20b are in contact with each other, heat from the electronic component 40 is easily conducted to the heat sinks 20, 20a, and 20b. Therefore, the electronic device 1 of this embodiment has superior heat dissipation properties compared to the electronic device 101 of the comparative example.

[0072] Furthermore, since the heat sinks 20, 20a, 20b and the standing walls 30, 30a, 30b surround the electronic component 40 to house it, the heat sinks 20, 20a, 20b and the standing walls 30, 30a, 30b can block noise emitted from the electronic component 40.

[0073] Therefore, according to the electronic device 1, it is possible to suppress the radiation noise from the electronic component 40 and improve the heat dissipation performance of the electronic component 40 at the same time.

[0074] Moreover, the electronic device 1 according to the second technique of the present embodiment is the electronic device 1 according to the first technique, further including a heat dissipation member 50 arranged so as to be sandwiched between the electronic component 40 and the heat sinks 20, 20a, and 20b.

[0075] According to this, by disposing the heat dissipation member 50 between the electronic component 40 and the heat sinks 20, 20a, and 20b, the heat dissipation member 50 can efficiently conduct the heat of the electronic component 40 to the heat sinks 20, 20a, and 20b. This allows the heat dissipation performance of the electronic component 40 to be improved.

[0076] Moreover, the electronic device 1 according to Technology 3 of the present embodiment is the electronic device 1 described in Technology 1 or 2. In this case, the standing walls 30, 30a, 30b extend from the surfaces 22a of the heat sinks 20, 20a, 20b facing the circuit board 10 so as to approach the circuit board 10, and are integrated with the heat sinks 20, 20a, 20b.

[0077] According to this, since the standing walls 30, 30a, 30b and the heat sinks 20, 20a, 20b are integrated, it is possible to suppress an increase in the number of parts of the electronic device 1. Furthermore, since it is only necessary to connect the member in which the standing walls 30, 30a, 30b and the heat sinks 20, 20a, 20b are integrated to the circuit board 10, it is possible to suppress an increase in the number of steps for assembling the standing walls 30, 30a, 30b and the heat sinks 20, 20a, 20b to the circuit board 10. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic device 1.

[0078] The electronic device 1 according to Technology 4 of the present embodiment is the electronic device 1 described in Technology 1 or 2. In this case, the standing walls 30, 30a, 30b extend from the surface (surface 13) of the circuit board 10 facing the heat sinks 20a, 20b so as to approach the heat sinks 20a, 20b, and are integrated with the circuit board 10.

[0079] According to this, since the circuit board 10 and the standing walls 30, 30a, 30b are integrated, it is possible to suppress an increase in the number of parts of the electronic device 1. Furthermore, since it is only necessary to connect the heat sinks 20a, 20b to a member in which the circuit board 10 and the standing walls 30, 30a, 30b are integrated, it is possible to suppress an increase in the number of steps for assembling the heat sinks 20a, 20b to the circuit board 10 and the standing walls 30, 30a, 30b. As a result, it is possible to suppress an increase in the manufacturing cost of the electronic device 1.

[0080] Furthermore, the electronic device 1 according to Technology 5 of this embodiment is the electronic device 1 described in any one of Technologies 1 to 4. In this case, the circuit board 10 has a first board 11 on which an electronic component 40 is mounted and a second board 12 on which the first board 11 is mounted, and the standing wall 30b surrounds the periphery of the electronic component 40 and the first board 11 and is disposed so as to be sandwiched between the heat sink 20a and the second board 12.

[0081] As a result, the heat sink 20a and the standing wall 30b surround the electronic components 40 and the first substrate 11 to accommodate them, and therefore the heat sink 20a and the standing wall 30b can block not only the noise emitted from the electronic components 40 but also the noise emitted from the first substrate 11.

[0082] Furthermore, the electronic device 1 according to Technology 6 of this embodiment is the electronic device 1 described in any one of Technologies 1 to 5. In this case, the standing wall 30 has a first standing wall 31 integrated with the heat sink 20b and a second standing wall 32 integrated with the circuit board 10, the first standing wall 31 extending from a surface 22a of the heat sink 20b facing the circuit board 10 toward the second standing wall 32, and the second standing wall 32 extending from a surface (surface 13) of the circuit board 10 facing the heat sink 20b toward the first standing wall 31.

[0083] As a result, the heat sink 20b, the first standing wall 31 and the second standing wall 32 surround the electronic component 40 to accommodate it, and the heat sink 20b, the first standing wall 31 and the second standing wall 32 can block noise emitted from the electronic component 40.

[0084] Moreover, the electronic device 1 according to Technique 7 of the present embodiment is the electronic device 1 according to any one of Techniques 1 to 6. In this case, the electronic component 40 is at least one of an SoC (System on a Chip), a power supply IC (Integrated Circuit), and a memory element.

[0085] According to this, even if the electronic component 40 generates heat, the heat can be dissipated and the noise generated by the electronic component 40 can be blocked.

[0086] (Other variations, etc.) While the electronic device according to the present disclosure has been described based on the above-mentioned embodiments, the present disclosure is not limited to these embodiments. As long as the modifications do not deviate from the spirit of the present disclosure, various modifications conceivable by those skilled in the art may also be included in the scope of the present disclosure.

[0087] In addition, this disclosure also includes forms obtained by making various modifications to the above embodiments that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of the embodiments within the scope that does not deviate from the intent of this disclosure. [Industrial Applicability]

[0088] The present disclosure can be used in, for example, in-vehicle devices mounted on vehicles, information processing devices such as computers, and the like. [Explanation of symbols]

[0089] 1 Electronic equipment 10 Circuit Board 11 First board 12 Second board 13 Surface (heat sink side of circuit board) 20, 20a, 20b Heat sink 22a Heat sink circuit board side 30, 30a, 30b standing wall 31 First Standing Wall 32 Second Standing Wall 40 Electronic Components 50 Heat dissipation material

Claims

1. a circuit board on which heat-generating electronic components are mounted; a heat sink disposed in contact with the electronic component and covering the electronic component; a standing wall that surrounds the electronic component and is disposed so as to be sandwiched between the heat sink and the circuit board; electronic equipment.

2. The electronic component further includes a heat dissipation member disposed so as to be sandwiched between the electronic component and the heat sink. The electronic device of claim 1 .

3. The standing wall is extending from the surface of the heat sink facing the circuit board toward the circuit board; Integrated with the heat sink 3. The electronic device according to claim 1 or 2.

4. The standing wall is extending from the surface of the circuit board facing the heat sink toward the heat sink, Integrated with the circuit board 3. The electronic device according to claim 1 or 2.

5. the circuit board includes a first substrate on which the electronic components are mounted and a second substrate on which the first substrate is mounted; The standing wall surrounds the electronic component and the first substrate, and is disposed so as to be sandwiched between the heat sink and the second substrate.

3. The electronic device according to claim 1 or 2.

6. the standing wall includes a first standing wall integrated with the heat sink and a second standing wall integrated with the circuit board, the first standing wall extends from a surface of the heat sink facing the circuit board toward the second standing wall, The second standing wall extends from the surface of the circuit board facing the heat sink toward the first standing wall.

3. The electronic device according to claim 1 or 2.

7. The electronic component is at least one of a SoC (System on a Chip), a power supply IC (Integrated Circuit), and a memory element.

3. The electronic device according to claim 1 or 2.

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