Semiconductor device
JP2025152896APending Publication Date: 2025-10-10ROHM CO LTD
Patent Information
- Application Number
- JP2024055071
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-28
- Publication Date
- 2025-10-10
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Figure 2025152896000001_ABST
Abstract
To suppress leakage current generated due to potential fixing of signal lines connected to I / O pads which become unused after inter-chip connection.SOLUTION: A semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes: a first I / O cell and a second I / O cell which operate by receiving a supply of a power supply voltage; a first signal line connected to the first I / O cell; a second signal line connected to the second I / O cell; a third signal line connected to the second semiconductor chip; a selector which selectively outputs a signal transmitted to the second signal line when a logic value of a control signal transmitted to the first signal line is a first value, and selectively outputs a signal transmitted to the third signal line when the logic value of the control signal is a second value; and a potential fixing circuit which fixes a potential of the first signal line to a potential corresponding to the second value when the supply of the power supply voltage to the first I / O cell is stopped.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
Semiconductor chip and multi-chip semiconductor device
JP2000223652A
Semiconductor device, semiconductor chip, method for testing wiring between chips and method for switching wiring between chips
WO2007032184A1