Laser module

By attaching the optical component to the laser element via adhesive, with optional support members, the configuration stabilizes the relative position against thermal deformation, maintaining alignment and beam quality in laser modules.

JP2025153782APending Publication Date: 2025-10-10PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
JP2024056415
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-29
Publication Date
2025-10-10

AI Technical Summary

Technical Problem

The relative position between the light emitting point of a laser element and an optical component may change due to thermal deformation of the laser element, leading to misalignment and potential performance issues.

Method used

The optical component is attached to the laser element via adhesive, with the adhesive applied to the light-emitting surface or a side surface of the laser element, and optionally supported by a member extending along the emission direction to maintain alignment during thermal deformation.

Benefits of technology

This configuration suppresses changes in the relative position between the laser element and optical component, ensuring stable emission and high beam quality by minimizing misalignment due to thermal deformation.

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Abstract

To provide a laser module capable of preventing changes in the relative position between a laser element and an optical component as the laser element thermally deforms.SOLUTION: A laser element 40 emits a laser beam LB. An adhesive 60 is applied directly to the laser element 40. The optical component 50 is placed in front of the light-emitting surface of the laser element 40 in the emission direction of the laser light LB. The optical component 50 is attached to the laser element via an adhesive 60.SELECTED DRAWING: Figure 2
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Description

[Technical Field]

[0001] The present invention relates to a laser module. [Background technology]

[0002] Patent Document 1 discloses a semiconductor laser device comprising a laser element (semiconductor laser diode), an optical component arranged on the laser light emission side of the laser element, and a fixing component for fixing the optical component, in which the fixing component is bonded to the first electrode on the side of the first electrode from which the laser light is emitted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 177017 Summary of the Invention [Problem to be solved by the invention]

[0004] However, if the optical component is fixed to the first electrode block, there is a risk that the relative position between the light emitting point of the laser component and the optical component may change if the laser element is thermally deformed as the laser element operates.

[0005] The present invention has been made in view of the above points, and its object is to suppress changes in the relative position between a laser element and an optical component that occur as a result of thermal deformation of the laser element. [Means for solving the problem]

[0006] A first invention is a laser module comprising a laser element that emits laser light, an optical component arranged forward of the light-emitting surface of the laser element in the direction of emission of the laser light, and an adhesive applied directly to the laser element, wherein the optical component is attached to the laser element via the adhesive.

[0007] In the first invention, by attaching the optical component to the laser element via adhesive, when the laser element is thermally deformed, the optical component moves in accordance with the thermal deformation of the laser element, thereby making it possible to prevent the relative position between the laser element and the optical component from changing due to the thermal deformation of the laser element.

[0008] A second aspect of the present invention is the laser module of the first aspect, wherein the adhesive is applied to a light-emitting surface side including a light-emitting point of the laser element.

[0009] In the second invention, by applying adhesive to the laser light emitting surface side, the optical component can be attached in front of the laser element in the emission direction.

[0010] The third invention is a laser module of the first invention, wherein the adhesive is applied to a side of the laser element that is different from the light-emitting surface, and the laser module further comprises a support member that extends along the emission direction of the laser light and supports the optical component, and the support member is attached to the laser element via the adhesive.

[0011] In the third invention, an adhesive is applied to the side surface different from the laser light emitting surface, and the support member is attached to the laser element via the adhesive, which allows the laser element to be positioned so that the adhesive does not get in the way when emitting laser light.

[0012] A fourth invention is a laser module according to any one of the first to third inventions, comprising: a first block electrically connected to a first electrode of the laser element; a second block arranged in a position not overlapping the laser element when viewed from the thickness direction of the laser element; connection wiring electrically connecting the second electrode of the laser element and the second block; and a support member extending along the emission direction of the laser light and supporting the optical component, wherein the adhesive is applied to the surface of the laser element facing the second electrode, and the support member is attached to the laser element via the adhesive.

[0013] In the fourth aspect of the present invention, an adhesive is applied to the surface of the laser element on the second electrode side, and the support member is attached to the laser element via the adhesive, which allows the laser element to be positioned so that the adhesive does not get in the way when emitting laser light. [Effects of the Invention]

[0014] According to the present invention, it is possible to suppress a change in the relative position between the laser element and the optical component due to thermal deformation of the laser element. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a plan view showing the configuration of a laser module according to a first embodiment. [Figure 2] FIG. 2 is a side view showing the configuration of the laser module. [Figure 3] FIG. 2 is a plan view showing the arrangement of a laser element, optical components, and adhesive. [Figure 4] FIG. 10 is a side cross-sectional view showing the configuration of a laser module according to a second embodiment. [Figure 5] FIG. 2 is a plan view showing the arrangement of a laser element, optical components, a support member, and an adhesive. [Figure 6] FIG. 11 is a side cross-sectional view showing the configuration of a laser module according to a third embodiment. [Figure 7] FIG. 2 is a plan view showing the arrangement of a laser element, optical components, a support member, and an adhesive. [Figure 8] FIG. 10 is a plan view showing the arrangement of a laser element, optical components, a support member, and an adhesive according to the fourth embodiment. [Figure 9] FIG. 10 is a plan view showing the arrangement of a laser element, optical components, a support member, and an adhesive according to the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following description of the preferred embodiments is merely exemplary in nature and is not intended to limit the present invention, its applications, or its uses.

[0017] First Embodiment As shown in FIGS. 1 to 3, the laser module 1 includes a first block 10, a second block 20, a cooling block 30, a laser element 40, a submount 43, an insulating sheet 45, and an optical component 50.

[0018] The first block 10 is electrically conductive. The first block 10 is mainly made of copper (Cu). In the first block 10, a copper block is plated with, for example, nickel (Ni) and gold (Au) in that order.

[0019] The first block 10 has a first terminal hole 13. The positive electrode of a power supply (not shown) is connected to the first terminal hole 13. The first block 10 is overlaid on the cooling block 30. The first block 10 is electrically connected to the cooling block 30.

[0020] The second block 20 is conductive. The second block 20 is mainly made of copper (Cu). In the second block 20, a copper block is plated with, for example, nickel (Ni) and gold (Au) in that order.

[0021] The second block 20 is disposed at a position where it does not overlap the laser element 40 when viewed in the thickness direction of the laser element 40. The second block 20 has a second terminal hole 23. The second terminal hole 23 is connected to the negative pole of a power supply (not shown).

[0022] The second block 20 has a stepped portion 21. The stepped portion 21 has a stepped cutout on the upper surface thereof on the side in the emission direction of the laser light LB (the direction indicated by the arrow in FIG. 1). A connection wiring 48 is connected to the upper surface of the stepped portion 21.

[0023] The second block 20 is placed on the cooling block 30 with an insulating sheet 45 sandwiched therebetween. The second block 20 is fastened to the cooling block 30 with screws (not shown). The second block 20 is insulated from the cooling block 30.

[0024] The cooling block 30 is mainly made of copper (Cu). An internal flow path (not shown) through which a cooling medium flows is provided inside the cooling block 30. The cooling block 30 cools the laser element 40.

[0025] An end of the cooling block 30 on the side in the emission direction of the laser light LB extends further forward in the emission direction than the second block 20. A submount 43 is placed on the upper surface of the end of the cooling block 30. The submount 43 is joined to the upper surface of the cooling block 30 by, for example, soldering.

[0026] The submount 43 is electrically conductive and is mainly made of a copper-tungsten alloy (CuW). The laser element 40 is mounted on the submount 43.

[0027] The laser element 40 has a plurality of emitters (not shown). The lower surface of the laser element 40 is a first electrode 41 (positive electrode), and the upper surface is a second electrode 42 (negative electrode). When a current flows from the first electrode 41 to the second electrode 42, the laser element 40 emits laser light LB from each of the plurality of emitters on the light-emitting surface.

[0028] The second electrode 42 of the laser element 40 and the step portion 21 of the second block 20 are connected by a connection wiring 48. The connection wiring 48 is joined by, for example, wire bonding.

[0029] The first block 10 is electrically connected to the first electrode 41 of the laser element 40 via the cooling block 30 and the submount 43. The first block 10 functions as an electrode block that is electrically connected to the first electrode 41 of the laser element 40.

[0030] The second block 20 is electrically connected to the second electrode 42 of the laser element 40 via the connection wiring 48. The second block 20 functions as an electrode block that is electrically connected to the second electrode 42 of the laser element 40.

[0031] <Optical Components> The optical component 50 includes a collimator lens 51 and a beam twister 52. The optical component 50 is disposed in front of the light emitting surface of the laser element 40 in the emission direction.

[0032] The collimator lens 51 is disposed opposite to the light emitting surface of the laser element 40. The collimator lens 51 collimates the laser light LB emitted from the laser element 40, which has been diverging in the fast axis direction.

[0033] 2, the flat surface of the collimator lens 51 is disposed on the laser element 40 side, and the curved surface of the collimator lens 51 is disposed on the opposite side of the laser element 40. Note that the curved surface of the collimator lens 51 may be disposed on the laser element 40 side, and the flat surface of the collimator lens 51 may be disposed on the opposite side of the laser element 40.

[0034] The beam twister 52 is disposed on the opposite side of the collimator lens 51 from the laser element 40. The beam twister 52 rotates the laser light LB, which has been emitted from the laser element 40 and transmitted through the collimator lens 51, by approximately 90 degrees.

[0035] In the optical component 50, the laser light LB emitted from the laser element 40 is first collimated in the fast axis direction by the collimator lens 51, thereby minimizing the spread of the laser light LB in the fast axis direction.

[0036] Furthermore, by rotating the laser light LB transmitted through the collimator lens 51 by the beam twister 52, it is possible to minimize and avoid overlapping with adjacent emitters in the laser element 40 with respect to spreading in the slow axis direction.

[0037] This makes it possible to minimize the pitch (arrangement interval) according to the width of the plurality of emitters in the laser element 40, and to output high-power laser light with high beam quality.

[0038] Here, the adhesive 60 is applied directly to the laser element 40. Specifically, the adhesive 60 is applied to the light-emitting surface side including the light-emitting point of the laser element 40. The optical component 50 is attached to the laser element 40 via the adhesive 60.

[0039] -Effects of the first embodiment- As described above, according to the laser module 1 of the first embodiment, by attaching the optical component 50 to the laser element 40 via the adhesive 60, when the laser element 40 is thermally deformed, the optical component 50 moves in accordance with the thermal deformation of the laser element 40. This makes it possible to prevent the relative positions of the laser element 40 and the optical component 50 from changing as the laser element 40 is thermally deformed.

[0040] Furthermore, by applying adhesive 60 to the light emitting surface side of the laser light LB, the optical component 50 can be attached in front of the laser element 40 in the emission direction.

[0041] Second Embodiment Hereinafter, the same parts as those in the first embodiment will be denoted by the same reference numerals, and only the differences will be described.

[0042] 4 and 5, the optical component 50 has a collimator lens 51 and a beam twister 52. The optical component 50 is disposed in front of the light emitting surface of the laser element 40 in the emission direction.

[0043] The adhesive 60 is applied directly to the laser element 40. Specifically, the adhesive 60 is applied to a side surface of the laser element 40 that is different from the light-emitting surface. The adhesive 60 is applied to both side surfaces of the laser element 40 in the width direction that is perpendicular to the emission direction.

[0044] The optical component 50 is supported by support members 65. The support members 65 extend along the emission direction of the laser light LB. Two support members 65 are arranged at an interval in the width direction of the laser element 40. In the example shown in FIG. 5, the two support members 65 are each arranged on the outer side of the laser element 40 in the width direction. The support members 65 are attached to the laser element 40 via an adhesive 60.

[0045] -Effects of the second embodiment- As described above, according to the laser module 1 of the second embodiment, the adhesive 60 is applied to the side surface different from the light emitting surface of the laser light LB, and the support member 65 is attached to the laser element 40 via the adhesive 60. This allows the adhesive 60 to be positioned so as not to get in the way when the laser light LB is emitted from the laser element 40.

[0046] Third Embodiment 6 and 7, the optical component 50 has a collimator lens 51, a beam twister 52, and a holder 53. The optical component 50 is disposed forward of the light emitting surface of the laser element 40 in the emission direction.

[0047] The holder 53 holds the collimator lens 51 and the beam twister 52. The holder 53 is made of, for example, a glass plate. The holder 53 is provided above the collimator lens 51 and the beam twister 52.

[0048] The adhesive 60 is applied directly to the laser element 40. Specifically, the adhesive 60 is applied to the surface of the laser element 40 on the side of the second electrode 42. Two adhesives 60 are applied at intervals in the width direction of the laser element 40 near the center of the laser element 40 in the width direction perpendicular to the emission direction.

[0049] The optical component 50 is supported by a support member 65. The support member 65 extends along the emission direction of the laser light LB. Two support members 65 are arranged at an interval in the width direction of the laser element 40. The support members 65 are attached to the laser element 40 via an adhesive 60.

[0050] -Effects of the third embodiment- As described above, in the laser module 1 according to the third embodiment, the adhesive 60 is applied to the surface of the laser element 40 on the second electrode 42 side, and the support member 65 is attached to the laser element 40 via the adhesive 60. This allows the adhesive 60 to be positioned so as not to get in the way when the laser light LB is emitted from the laser element 40.

[0051] Furthermore, by using two support members 65, the optical component 50 can be firmly supported.

[0052] Furthermore, when the laser element 40 generates heat, the central portion of the laser element 40 is likely to deform in the thickness direction. Therefore, by arranging the support member 65 near the central portion of the laser element 40 in the width direction, the optical component 50 can be moved in accordance with the deformation of the laser element 40.

[0053] Fourth Embodiment 8, the optical component 50 has a collimator lens 51, a beam twister 52, and a holder 53. The optical component 50 is disposed in front of the light emitting surface of the laser element 40 in the emission direction.

[0054] The adhesive 60 is applied directly to the laser element 40. Specifically, the adhesive 60 is applied to the surface of the laser element 40 on the second electrode 42 side. The adhesive 60 is applied to the center of the laser element 40 in the width direction perpendicular to the emission direction.

[0055] The optical component 50 is supported by a support member 65. The support member 65 extends along the emission direction of the laser light LB. One support member 65 is disposed in the center of the laser element 40 in the width direction. The support member 65 is attached to the laser element 40 via an adhesive 60.

[0056] -Effects of the fourth embodiment- As described above, according to the laser module 1 of this embodiment 4, by supporting the optical component 50 with one support member 65, it is possible to ensure a wide area where the second electrode 42 of the laser element 40 and the support member 65 do not overlap when viewed in the thickness direction of the laser element 40.

[0057] This increases the contact area of ​​the connection wiring 48 on the second electrode 42 of the laser element 40, making it easier to connect the connection wiring 48 by wire bonding.

[0058] Fifth Embodiment 9, the optical component 50 has a collimator lens 51, a beam twister 52, and a holder 53. The optical component 50 is disposed in front of the light emitting surface of the laser element 40 in the emission direction.

[0059] An adhesive 60 is applied directly to the laser element 40. Specifically, the adhesive 60 is applied to the surface of the laser element 40 on the second electrode 42 side. Two adhesives 60 are applied at an interval in the width direction perpendicular to the emission direction of the laser element 40. The two adhesives 60 are applied to both ends of the laser element 40 in the width direction.

[0060] The optical component 50 is supported by a support member 65. The support member 65 extends along the emission direction of the laser light LB. Two support members 65 are arranged at an interval in the width direction of the laser element 40. The support members 65 are attached to the laser element 40 via an adhesive 60.

[0061] -Effects of the fifth embodiment- As described above, according to the laser module 1 of the fifth embodiment, the optical component 50 is supported at both ends using the two support members 65, so that the optical component 50 can be firmly supported. [Industrial Applicability]

[0062] As described above, the present invention has the highly practical effect of being able to suppress changes in the relative position between a laser element and an optical component that occur as a result of thermal deformation of the laser element, and is therefore extremely useful and has high industrial applicability. [Explanation of symbols]

[0063] 1 laser module 10 Block 1 20 Block 2 40 Laser element 41 1st electrode 42 2nd electrode 48 Connection Wiring 50 Optical Components 60 Adhesive 65 Support member LB laser light

Claims

1. a laser element that emits laser light; an optical component disposed forward of the light emitting surface of the laser element in the direction of emission of the laser light; an adhesive applied directly to the laser element; The optical component is attached to the laser element via the adhesive. Laser module.

2. 2. The laser module of claim 1, The adhesive is applied to the light-emitting surface side of the laser element, which includes the light-emitting point. Laser module.

3. 2. The laser module of claim 1, the adhesive is applied to a side surface of the laser element that is different from the light-emitting surface, a support member extending along the emission direction of the laser light and supporting the optical component; The support member is attached to the laser element via the adhesive. Laser module.

4. The laser module according to any one of claims 1 to 3, a first block electrically connected to a first electrode of the laser element; a second block disposed at a position not overlapping the laser element when viewed in a thickness direction of the laser element; a connection wiring that electrically connects a second electrode of the laser element and the second block; a support member extending along the emission direction of the laser light and supporting the optical component, the adhesive is applied to a surface of the laser element on the second electrode side, The support member is attached to the laser element via the adhesive. Laser module.

Citation Information

Patent Citations

  • Semiconductor laser device and method for manufacturing same

    WO2021177017A1