Electronic component, method of manufacturing electronic component, and device for manufacturing electronic component

Abstract

To provide an electronic component that is easy to handle.SOLUTION: An electronic component 1 includes an outer casing 30 and an element body 10 arranged inside the outer casing 30. The outer casing 30 includes a thermosetting resin and has opposing first and second main surfaces 1a and 30b, and one or more side surfaces 30c to 30f connecting the first and second main surfaces 1a and 30b. At least one of the side surfaces 30c to 30f includes a first region 30c1 and a second region 30c2 having a surface roughness greater than that of the first region. The portion of the outer casing 30 forming the first region 30c1 and the portion of the outer casing 30 forming the second region 30c2 contain the same type of thermosetting resin.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present disclosure relates to an electronic component, a method for manufacturing an electronic component, and an apparatus for manufacturing an electronic component. [Background technology]

[0002] Conventionally, electronic components have been known in which an element main body such as a coil is disposed inside an exterior housing. For example, Patent Document 1 describes a coil component used as an inductor or the like, in which a coil together with a winding core is sealed in an exterior housing.

[0003] Electronic components in which the element body is sealed with an exterior material such as resin are widely used as chip components suitable for miniaturization (miniaturization) and surface mounting, and may be surface-mounted on a substrate by itself or may be mounted with metal terminals attached. In addition, they may be further covered with an exterior resin when mounted on a substrate.

[0004] These types of electronic components can be difficult to handle during manufacturing, and when assembling and mounting them into products after manufacturing. For example, in the after-cure process of thermosetting resin, which is near the final stage of electronic component manufacturing, electronic components may be exposed to high temperatures for long periods of time (several hours). In this process, electronic components arranged at close intervals may become stuck / bonded to each other, which can lead to a decrease in yield. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-168610 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present disclosure is to provide an electronic component that can improve the yield during manufacturing and is easy to handle during use. [Means for solving the problem]

[0007] An electronic component according to an embodiment of the present disclosure includes: An electronic component having an exterior body and an element main body disposed inside the exterior body, the exterior body includes a thermosetting resin, has a first main surface and a second main surface facing each other, and one or more side surfaces connecting the first main surface and the second main surface, At least one of the side surfaces includes a first region and a second region having a surface roughness greater than that of the first region, The portion of the exterior body that forms the first region and the portion of the exterior body that forms the second region contain the same type of thermosetting resin.

[0008] In such electronic components, at least one side of the exterior body has a second region with high surface roughness, so bonding is poor when the side surfaces simply come into contact with each other. Therefore, even when such electronic components are arranged at close intervals, the possibility of them coming into inappropriate contact and being bonded (sticking) to each other can be reduced, and the manufacturing yield of electronic components can be improved.

[0009] On the other hand, under certain conditions, the second region with such high surface roughness can enhance adhesion to other components. Specifically, the bondability of the rough second region can be improved by using an adhesive or by interposing a molten resin between the regions. For example, when attaching a metal terminal to the outside, the bonding strength can be increased by bonding a portion of the metal terminal to the second region (with high surface roughness) with an adhesive or the like. This increases the bonding strength of the metal terminal. As a result, the strength and reliability of the entire electronic component can be improved.

[0010] Furthermore, for example, after mounting an electronic component on a substrate, if a certain area including the periphery of the electronic component, a part of the peripheral circuit including the electronic component, or the entire substrate on which the electronic component is mounted is further coated and sealed with an exterior resin, the bonding strength of the exterior resin can be increased in the second region (where the surface roughness is large), thereby improving the reliability of the entire peripheral circuit including the electronic component.

[0011] Further, the method for manufacturing an electronic component according to the present disclosure includes: A method for manufacturing an electronic component in which an element body is disposed inside an exterior housing, comprising: placing the element body in a cavity; and a step of filling the cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body, At least a portion of the cavity is formed using a frame member having at least one frame surface including a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region.

[0012] According to this method for manufacturing an electronic component, it is possible to easily manufacture an electronic component in which at least one surface of the exterior body has a second region with high surface roughness.

[0013] In addition, the manufacturing apparatus for electronic components according to the present disclosure includes: An apparatus for manufacturing an electronic component in which an element body is disposed inside an exterior body, a frame member for filling a cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body; The frame member has a frame surface with which the exterior material is in contact, and at least one of the frame surfaces includes a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region, The frame member forms at least a portion of the cavity such that the first frame surface region and the second frame surface region are located on the inner surface of the cavity.

[0014] By using such an electronic component manufacturing apparatus to manufacture electronic components, it is possible to easily manufacture electronic components in which at least one surface of the exterior body has a second region with high surface roughness. Furthermore, the frame member of this manufacturing apparatus can be easily manufactured by, for example, stamping a metal substrate. [Brief explanation of the drawings]

[0015] [Figure 1A] FIG. 1A is an external perspective view of a coil component according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B is a perspective view of the coil device shown in FIG. 1A. [Figure 1C] FIG. 1C is a perspective view showing a first modified example of a coil component according to the present disclosure. [Figure 1D] FIG. 1D is a perspective view showing a second modified example of a coil component according to the present disclosure. [Figure 1E] FIG. 1E is a perspective view showing a third modified example of a coil component according to the present disclosure. [Figure 1F] FIG. 1F is a perspective view showing a fourth modified example of a coil component according to the present disclosure. [Figure 1G] FIG. 1G is a perspective view showing a fifth modified example of a coil component according to the present disclosure. [Figure 1H] FIG. 1H is a perspective view showing a sixth modified example of a coil component according to the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view of the coil device shown in FIG. 1A, taken along line II-II in FIG. 1B. [Figure 3A] FIG. 3A is a perspective view showing a frame member used in manufacturing the coil component shown in FIG. 1A. [Figure 3B] FIG. 3B is a front view of one opening of the frame member shown in FIG. 3A, seen obliquely from above. [Figure 4] FIG. 4 is a first diagram illustrating an example of a method for manufacturing the coil component shown in FIG. 1A. [Figure 5] FIG. 5 is a second diagram illustrating an example of a method for manufacturing the coil component shown in FIG. 1A. [Figure 6]FIG. 6 is a third diagram illustrating an example of a method for manufacturing the coil component shown in FIG. 1A. [Figure 7] FIG. 7 is a cross-sectional view of the mold shown in FIG. 6 taken along line VII-VII. [Figure 8] FIG. 8 is a fourth diagram illustrating an example of the method for manufacturing the coil component shown in FIG. 1A. [Figure 9] FIG. 9 is a fifth diagram illustrating an example of a method for manufacturing the coil component shown in FIG. 1A. [Figure 10A] FIG. 10A is a sixth diagram illustrating an example of a method for manufacturing the coil component shown in FIG. 1A. [Figure 10B] FIG. 10B is a diagram for explaining another manufacturing method corresponding to the step shown in FIG. 10A. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the contents shown in the drawings are merely shown schematically and exemplarily to facilitate understanding of the present disclosure, and the appearance, dimensional ratio, etc. may differ from the actual product. Furthermore, the present disclosure is not limited to the following embodiment.

[0017] In this embodiment, as an embodiment of the present disclosure, a coil component 1 that functions as, for example, an inductor and is mounted in the power supplies of various electrical devices will be described. As shown in Figures 1A and 1B, the coil component 1 has a coil 10 as an element main body, a core 20, an outer casing 30, and terminal electrodes 40a and 40b.

[0018] As shown in FIG. 1A, the coil component 1 is an electronic component having a substantially rectangular parallelepiped (hexahedral) shape, which has a mounting surface (bottom surface, first main surface) 1a connected to an external circuit formed on a substrate or the like, a top surface (second main surface) 30b facing (located on the opposite side of) the mounting surface 1a, and first to fourth side surfaces 30c to 30f connecting the mounting surface (first main surface) 1a and the top surface (second main surface) 30b.

[0019] As shown in Figures 1A, 1B, and 2, the coil component of this embodiment has an upper surface 30b that is slightly smaller (has a smaller area) than the mounting surface 1b, and has inclined side surfaces 30c to 30f. The inclination angle of the side surfaces 30c to 30f may be any angle, but in this embodiment it is, for example, about 0.5°. Therefore, the shape of the coil component 1 of this embodiment can be considered to be substantially a rectangular parallelepiped. In this respect, the drawings of the present application schematically emphasize the inclination of the side surfaces 30c to 30f.

[0020] In this embodiment, the top surface 30b and side surfaces 30c to 30f of the coil component 1 are formed by the top surface and side surfaces of the exterior housing 30. That is, the top surface 30b and side surfaces 30c to 30f of the coil component 1 are the same as the top surface 30b and side surfaces 30c to 30f of the exterior housing 30. Therefore, they will be described using the same reference numerals. Meanwhile, the mounting surface 1a of the coil component 1 is formed by the bottom surface 30a of the exterior housing 30, the end surface 22a of the flange portion 22 of the core 20, and the terminal electrodes 40a and 40b.

[0021] 1A, the following description will be given assuming that the direction in which the bottom surface (mounting surface) 1a of the coil device 1 faces the top surface 30b is the Z-axis direction, the direction in which the second side surface 30d faces the fourth side surface 30f is the X-axis direction, and the direction in which the first side surface 30c faces the third side surface 30e is the Y-axis direction. These X-axis, Y-axis, and Z-axis are perpendicular to one another.

[0022] The size of the coil component 1 is not particularly limited, but for example, the length of the coil component 1 in the X-axis direction is 0.6 mm to 6.5 mm, the length of the coil component 1 in the Y-axis direction is 0.6 mm to 6.5 mm, and the length of the coil component 1 in the Z-axis direction is 0.5 mm to 5.0 mm.

[0023] The configuration of each part of the coil device 1 will be described below.

[0024] 1B, the coil 10 has a winding portion 11 wound in a coil shape and first and second (a pair of) lead-out portions 12a, 12b led out from the winding portion 11. The winding portion 11 is located inside the exterior body 30 and is provided on the outer circumferential surface of the winding core portion 21 of the core 20. The winding portion 11 is formed, for example, by winding a wire around the winding core portion 21 of the core 20, but may also be formed by fitting the winding portion 11 formed as an air-core coil into the winding core portion 21 of the core 20.

[0025] The wire forming the winding portion 11 can be, for example, a conductive core wire made of copper or the like, such as a rectangular wire, round wire, twisted wire, Litz wire, or braided wire, or an insulating coated wire in which such a conductive core wire is coated with an insulating coating. Specifically, known winding wires such as AIW (polyamideimide wire), UEW (polyurethane wire), and USTC can be used. The diameter of the wire is not particularly limited, but in the case of a round wire, it is, for example, 50 μm to 2 mm. In the case of a rectangular wire, the thickness is, for example, 20 μm to 2 mm, and the width is, for example, 40 μm to 2 mm.

[0026] 2, the number of layers in the winding axis direction of the winding portion 11 is, for example, 3, and the number of layers in the radial direction is, for example, 3. The winding axis direction of the winding portion 11 corresponds to the Z-axis direction, i.e., the direction perpendicular to the mounting surface 1a of the coil component 1.

[0027] 1B, a pair of lead-out portions 12a, 12b constitute one end and the other end of the wire forming coil 10, and are led out from bottom surface 30a of exterior body 30. Lead-out portions 12a, 12b are led out from winding portion 11 at positions spaced apart from one end of winding portion 11 in the winding axis direction (Z-axis direction) inside exterior body 30, and are guided along flange portion 22 of core 20 toward mounting surface 1a of coil component 1, and are led out of exterior body 30. As can be seen from FIG. 2, lead-out portions 12a, 12b led out to the outside are arranged to extend in the Y-axis direction along end surface 22a of flange portion 22 of core 20.

[0028] As shown in Fig. 2, the core 20 is a T-shaped core having a winding core portion 21 and a flange portion 22. The coil 10 is disposed around the winding core portion 21 of the core 20. An end surface 22a of the flange portion 22 of the core 20 is exposed to the mounting surface 1a of the coil component 1, and the other portion of the core 20 is disposed inside the exterior body 30. In other words, the core 20, together with the coil 10, is entirely covered by the exterior body 30.

[0029] 1B, the winding core 21 has a cylindrical shape, and protrudes from the center of the flange 22 as shown in Fig. 2. The shape of the winding core 21 is not limited to a cylindrical shape, and may be, for example, a square prism, an octagonal prism, or any other polygonal prism, and may protrude from the center of the flange 22 at a position offset in the radial direction thereof.

[0030] 1B, flange portion 22 has a flat rectangular parallelepiped shape (flat hexahedron shape) and is formed at one axial end of winding core portion 21. As described above with reference to FIG. 2, a portion of flange portion 22 is exposed from bottom surface 30a of exterior body 30 and forms, together with exterior body 30, mounting surface (bottom surface) 1a of coil component 1. The shape of flange portion 22 is not limited to a rectangular parallelepiped shape, and may be, for example, a circular, octagonal, or other polygonal flat plate shape.

[0031] Core 20 is not limited to a T-shape having winding core 21 and one flange 22, but may be configured without either winding core 21 or flange 22. For example, it may be configured with only winding core 21 without flange 22. Alternatively, it may be a drum-shaped core in which a pair of flanges 22 are formed on both ends of winding core 21.

[0032] The core 20 is a magnetic core formed as a sintered body by annealing a metal or ceramic such as a ferrite material formed by powder compaction, injection molding, or cutting. The core 20 may also be formed by annealing a resin containing magnetic particles. The core 20 is made of a material with a higher relative magnetic permeability than the exterior body 30 described below, but may also be made of the same material as the exterior body 30.

[0033] It is preferable that the difference between the thermal expansion coefficient of core 20 and that of outer casing 30 is small (for example, 45 ppm / K or less, or 10 ppm / K or less). When the difference between the thermal expansion coefficient of core 20, particularly winding core 21, and that of outer casing 30 is small, it is possible to prevent cracks from occurring in outer casing 30 around winding core 21.

[0034] The exterior housing 30 is a member that hermetically houses the coil 10 and the core 20 and defines the outer shape of the coil component 1. That is, the coil 10 and the core 20 are disposed inside the exterior housing 30, and the terminal electrodes 40a, 40b are attached to the outside of the exterior housing 30. However, just as a portion of the flange 22 of the core 20 is exposed from the bottom surface 30a of the exterior housing 30 and forms part of the bottom surface 1a of the coil component 1, the surface of the coil component 1 may include not only the outer surface of the exterior housing 30 but also the surface of a member other than the exterior housing 30.

[0035] The exterior housing 30 is formed from a packaging material containing magnetic particles and resin. The magnetic particles that form the exterior housing 30 are not particularly limited, but may be, for example, ferrite or a metallic magnetic material. The particle size of the magnetic particles that form the exterior housing 30 is not particularly limited, but may be, for example, 1 μm to 50 μm. The resin that forms the exterior housing 30 is not particularly limited, but may be, for example, a thermosetting resin such as an epoxy resin or a phenol resin. When the electronic component is a coil component or the like, the relative magnetic permeability of the exterior housing 30 is not particularly limited, but may be, for example, 1 to 20,000.

[0036] As will be described later, the exterior body 30 is formed by filling the cavity of a mold in which the coil 10 and the core 20 are placed with an exterior material, and then compressing and curing the material.

[0037] The exterior body 30 is a hexahedron having a substantially rectangular parallelepiped shape, with a bottom surface 30a on which terminal electrodes 40a and 40b are arranged, a top surface 30b facing the bottom surface 30a, and side surfaces 30c to 30f connecting the bottom surface 30a and the top surface 30b. The shape of the exterior body 30 is not limited to a hexahedron, and may be another polyhedron such as an octahedron. Furthermore, from the perspective of effective magnetic flux, the shape of the exterior body 30 may be a cylindrical shape such as a cylinder, and in the case of a cylinder, the shape may be a solid shape in which the bottom surface 30a and the top surface 30b are not congruent, such as a truncated cone.

[0038] In this embodiment, since the exterior body 30 is a hexahedron, the exterior body 30 has four side faces, namely, first side face 30c to fourth side face 30f, but if the exterior body is another polyhedron such as an octahedron (the horizontal cross section of the exterior body is hexagonal) or a decahedron (the horizontal cross section of the exterior body is octagonal), the exterior body 30 will have a corresponding number of side faces. Also, if the exterior body 30 is cylindrical or truncated cone-shaped, the exterior body 30 will have one side face (curved surface) connecting the bottom face 30a and the top face 30b.

[0039] Each of the side surfaces 30c to 30f of the exterior body 30 includes multiple regions with different surface roughnesses. As shown in FIG. 1A, the first and fourth side surfaces 30c and 30f include first regions (smooth surface regions) 30c1 and 30f1, respectively, which have relatively low (smooth) surface roughness, and second regions (rough surface regions) 30c2 and 30f2, which have higher (rougher) surface roughness than the first regions 30c1 and 30f1. As shown in FIG. 2, the second side surface 30d also includes a first region (smooth surface region) 30d1 and a second region (rough surface region) 30d2. Although not shown in the drawing, the third side surface 30e also includes a first region (smooth surface region) (30e1) and a second region (rough surface region) (30e2). These first and second regions differ only in surface roughness; the exterior body is made of the same material. That is, both the portion on the surface where the first region is formed and the portion on the surface where the second region is formed contain the same type of magnetic particles and the same type of thermosetting resin.

[0040] 1B , the terminal electrodes 40a, 40b of the coil component 1 of this embodiment are L-shaped metal terminals having mounting surface mounting portions (first principal surface mounting portions) 40a1, 40b1 and side surface mounting portions 40a2, 40b2, and the side surface mounting portions 40a2, 40b2 are joined to the first side surface 30c of the exterior package 30. In this case, by facing the side surface mounting portions 40a2, 40b2 to the rough surface region 30c2 of the first side surface 30c of the exterior package 30 and joining them with an adhesive or the like, the adhesion of the side surface mounting portions 40a2, 40b2 can be improved, and the joining strength of the terminal electrodes 40a, 40b can be increased.

[0041] Furthermore, for example, after mounting the coil component 1 on a substrate or the like, when the entire peripheral circuit of the coil component 1 or the entire substrate on which the coil component 1 is mounted is covered and sealed with an exterior resin, the adhesion with the exterior resin is improved at the rough surface areas 30c2 to 30f2 of the side surfaces 30c to 30f of the exterior body 30, thereby increasing the bonding strength.

[0042] 1A, on the side surfaces 30c to 30f of the coil component 1, the smooth surface regions (first regions) 30c1 to 30f1 are arranged in a predetermined height range H1 closer to the top surface 30b of the coil component 1. In other words, the smooth surface regions 30c1 to 30f1 are arranged in a predetermined height range H1 farther from the mounting surface 1a of the coil component 1. Furthermore, the rough surface regions (second regions) 30c2 to 30f2 are arranged in a predetermined height range H2 closer to the mounting surface 1a of the coil component 1.

[0043] In this embodiment, the ratio H2 / H of the height range H2 where the rough surface regions 30c2-30f2 are formed to the height H of the coil component 1 is, for example, H2 / H = 0.5, i.e., the ratio of the height range H1 of the smooth surface regions 30c1-30f1 to the height range H2 where the rough surface regions 30c2-30f2 are formed is H1:H2 = 1:1, but is not limited to this. The ratio H2 / H of the height range H2 where the rough surface regions 30c2-30f2 are formed to the height H of the coil component 1 may be any ratio in the range of 0.1 ≦ H2 / H ≦ 0.9, or may be in the range of 0.3 ≦ H2 / H ≦ 0.7.

[0044] Regarding the actual surface roughness Ra, before any surface treatment is performed on exterior body 30, smooth surface regions 30c1-30f1 have a surface roughness Ra of, for example, 1.4 μm or less, and rough surface regions 30c2-30f2 have a surface roughness Ra greater than 1.4 μm. The relationship between the surface roughness of smooth surface regions 30c1-30f1 and that of rough surface regions 30c2-30f2 is such that the surface roughness of rough surface regions 30c2-30f2 is 1.2 times or more, or alternatively 1.5 times or more, or even 2 to 2.5 times, that of smooth surface regions 30c1-30f1.

[0045] When the surface of package 30 is subjected to a surface treatment such as plating, smooth surface regions 30c1-30f1 have a surface roughness Ra of, for example, 1.2 μm or less, and rough surface regions 30c2-30f2 have a surface roughness Ra greater than 1.2 μm. In this case, the relationship between the surface roughness of smooth surface regions 30c1-30f1 and that of rough surface regions 30c2-30f2 may be such that the surface roughness of rough surface regions 30c2-30f2 is 1.5 times or more, or may be 3 to 5 times, that of smooth surface regions 30c1-30f1.

[0046] In coil device 1 of the present embodiment, smooth surface regions (first regions) 30c1 to 30f1 and rough surface regions (second regions) 30c2 to 30f2 are formed continuously along the entire circumference of side surfaces 30c to 30f of outer casing 30, but a configuration in which smooth surface regions and rough surface regions are selectively provided on some of the side surfaces, such as one, two, or three of side surfaces 30c to 30f, may also be used. Also, a configuration in which height range H1 of smooth surface regions 30c1 to 30f1 and height range H2 in which rough surface regions 30c2 to 30f2 are formed may be changed for each of side surfaces 30c to 30f.

[0047] The terminal electrodes 40a and 40b are connection portions between the coil 10 and an external circuit. The terminal electrodes 40a and 40b are spaced apart from each other and are electrically insulated.

[0048] 1B, terminal electrodes 40a, 40b are L-shaped metal terminals having mounting surface attachment portions 40a1, 40b1 and side surface attachment portions 40a2, 40b2, respectively. As shown in FIGS. 1B and 2, mounting surface attachment portions 40a1, 40b1 are disposed on mounting surface 1a of coil component 1 and are joined to end surface 22a of flange 22 of core 20 and bottom surface 30a of exterior body 30, with lead-out portions 12a, 12b of coil 10, which are led out from bottom surface 30a of exterior body 30, interposed therebetween. Lead-out portions 12a, 12b may be connected to terminal electrodes 40a, 40b by thermocompression bonding, soldering, a conductive adhesive, or the like.

[0049] In this embodiment, as shown in FIGS. 1A and 1B , the side surface mounting portions 40a2 and 40b2 are joined to the first side surface 30c of the exterior body 30. The side surface mounting portions 40a2 and 40b2 may be formed so as to be joined to the third side surface 30e of the exterior body 30. The side surface mounting portions 40a2 and 40b2 may also be disposed on both the first side surface 30c and the third side surface 30e. The terminal electrode 40a may have a side surface mounting portion 40a2 formed so as to be joined to the second side surface 30d of the exterior body 30, and the terminal electrode 40b may have a side surface mounting portion 40b2 formed so as to be joined to the fourth side surface 30f of the exterior body 30.

[0050] The side surface mounting portions 40a2, 40b2 of these terminal electrodes 40a, 40b allow fillets of solder or the like to be formed on the terminal electrodes 40a, 40b when the coil component 1 is connected to a substrate with solder or the like.

[0051] The terminal electrodes 40a, 40b are attached to the coil component 1 (exterior body 30) by aligning the mounting surface attachment portions 40a1, 40b1 and the side surface attachment portions 40a2, 40b2 with the flange portion 22 of the core 20 and the surface of the exterior body 30 to be joined, respectively, and joining them with an adhesive or the like. At this time, the side surface attachment portions 40a2, 40b2 of the terminal electrodes 40a, 40b are to be joined with the roughened surface regions 30c2 to 30f2 of the side surfaces 30c to 30f of the exterior body 30, so that the adhesion between the terminal electrodes 40a, 40b and the exterior body 30 can be improved, and the joining strength of the terminal electrodes 40a, 40b to the exterior body 30 can be increased.

[0052] The terminal electrodes 40a, 40b are formed, for example, by machining a conductive metal plate, but the method for forming the terminal electrodes 40a, 40b is not particularly limited. The material of the terminal electrodes 40a, 40b is not particularly limited as long as it is a conductive metal material, and examples thereof include iron, nickel, copper, silver, and alloys containing these. Furthermore, the surfaces of the terminal electrodes 40a, 40b may be coated with a metal coating such as Ni, Sn, or Cu.

[0053] Instead of using metal terminals, the terminal electrodes 40a, 40b may be formed on the outer casing 30 or the flange 22 of the core 20 by plating. In this case, the terminal electrodes 40a, 40b are formed, for example, by a laminated electrode film made of a base electrode film and a plating film formed on the base electrode film. The base electrode film is not particularly limited, but may be a conductive paste film containing a metal such as Sn, Ag, Ni, or Cu, or an alloy thereof. The plating film is not particularly limited, but may be a metal such as Sn, Au, Ni, Pt, Ag, or Pd, or an alloy thereof.

[0054] Next, an example of a method for manufacturing such coil device 1 will be described with reference to FIGS. 3A to 10B.

[0055] First, a frame member 50 as shown in FIG. 3A is prepared. The frame member 50 is a member for molding the exterior body 30, and is a member in which a plurality of partitioned spaces 52 separated by partition walls 51 are formed in a plate-like member. The plurality of partitioned spaces 52 are bottomless cylindrical spaces surrounded by partition walls 51. The plurality of partitioned spaces 52 may be arranged in a matrix along the X-axis and Y-axis. The cross-sectional shape of each of the plurality of partitioned spaces 52 perpendicular to the axial direction (Z-axis direction) corresponds to the shape of the end face 22a of the flange portion 22a, and is rectangular, but may be other polygonal shapes, circular shapes, etc.

[0056] Surfaces (referred to as frame surfaces) 57 of partition walls 51 that define partition spaces 52 are surfaces that contact the material of exterior body 30 when exterior body 30 is molded. Corresponding to coil device 1 (exterior body 30) of the present embodiment in which smooth surface regions 30c1-30f1 and rough surface regions 30c2-30f2 are formed on side surfaces 30c-30f, frame surface 57, which is the circumferential surface of each partition space 52 of frame member 50, has multiple regions with different surface roughnesses, as shown in Fig. 3B. That is, frame surface 57 of partition space 52 is formed with frame surface first regions (smooth frame surface regions) 57a that have a relatively small (smooth) surface roughness, and frame surface second regions (rough frame surface regions) 57b that have a larger (rougher) surface roughness than frame surface first regions 57a.

[0057] The smooth frame surface region 57a ​​and the rough frame surface region 57b are respectively arranged on one side and the other side of the frame surface 57 along the direction of the cylindrical central axis of the partitioned space 52, which is a bottomless cylindrical space. In the exterior material arranged in the partitioned space 52, the portion in contact with the smooth frame surface region 57a ​​forms the smooth surface regions 30c1 to 30f1 of the exterior body 30 of the coil device 1, and the portion in contact with the rough frame surface region 57b forms the rough surface regions 30c2 to 30f2 of the exterior body 30 of the coil device 1. Therefore, the heights of the smooth frame surface region 57a ​​and the rough frame surface region 57b of the frame surface 57 of the partitioned space 52 correspond to the height H1 of the smooth surface regions 30c1 to 30f1 and the height H2 of the rough surface regions 30c2 to 30f2 described above with reference to FIG. 1A.

[0058] The frame member 50 having such a configuration is manufactured by processing, for example, a plate-shaped member. By forming an opening corresponding to the partition space 52 in the plate-shaped member and processing its inner peripheral surface by any surface processing process to give it a surface with a roughness corresponding to the smooth frame surface region 57a ​​and the rough frame surface region 57b, the frame member 50 as shown in Figures 3A and 3B can be formed. The plate-shaped member may be, for example, a metal plate-shaped member.

[0059] Furthermore, the frame member 50 having such a configuration can be easily manufactured by punching a plate-shaped member. The plate-shaped member may be, for example, a metallic plate-shaped member. By punching the metal material using a punch having a shape substantially the same as the shape of the upper surface 30b of the coil device 1 (exterior body 30), a surface trace as a cut surface by the punch remains (is formed) on the periphery of the opening in a predetermined range on the side where the punch is driven in the thickness direction of the metal material.

[0060] On the other hand, the opening periphery of a predetermined area on the side where the punch comes out is formed by deformation of the metal material caused by the punch being driven in and tearing off as a result of the deformation, and traces of the torn off surface remain (are formed). As a result, in the thickness direction of the metal material, a smooth frame surface region 57a ​​with relatively low surface roughness as a cut surface is formed on one side, and a rough frame surface region 57b with relatively high surface roughness as a torn off surface is formed on the other side.

[0061] This type of punching process can be achieved with good reproducibility by controlling conditions such as the metal material, punch hardness, and punching pressure / speed, and can be performed easily and quickly, so that a frame member 50 having a large number of partition spaces 52 with the desired frame surface 57 (circumferential surface) can be easily and quickly manufactured.

[0062] Furthermore, when punching, the opening on the side where the punch passes and the metal material is punched outward is more likely to tear or peel off, enlarging the metal material that has entangled the surrounding materials, and the opening may become slightly larger than the side where the punch is driven in. As a result, for example, as shown in Figures 1A, 1B, and 2, a frame member 50 having an inner peripheral shape for molding a coil component 1 in which the area of ​​the top surface 30b is smaller than the mounting surface 1a and the side surfaces 30c to 30f are slightly inclined at, for example, about 0.5°, can be easily manufactured by such punching.

[0063] Once the frame member 50 is prepared, as shown in FIG. 4, the frame member 50 is attached to the base 130 via an adhesive sheet 120, if necessary. For example, a double-sided adhesive sheet can be used as the adhesive sheet 120. In this case, the frame member 50 can be peeled off from the adhesive sheet 120 by exposing the adhesive sheet 120 to a heated atmosphere, and the frame member 50 can be detached from the base 130. However, instead of the adhesive sheet 120, an adhesive or the like may be used to adhere the frame member 50 to the base 130. Alternatively, the frame member 50 may be fixed to the base 130 by mechanical or magnetic means.

[0064] Next, as shown in Fig. 4, a plurality of coils 10 and a plurality of cores 20 are prepared. Specifically, a plurality of cores 20 are prepared, and the coils 10 are installed on the plurality of winding cores 21 by fitting the winding portions 11 onto the respective winding cores 21 of the plurality of cores 20, or by winding wire around the plurality of winding cores 21. In each of the plurality of coils 10, the lead-out portions 12a and 12b of the coil 10 may be disposed on the end surface 22a of the flange portion 22.

[0065] Next, the plurality of cores 20 with the coils 10 installed thereon are placed in the plurality of partitioned spaces 52. In each of the plurality of partitioned spaces 52, one axial side of the partitioned space 52 is closed with the adhesive sheet 120, so when the cores 20 with the coils 10 installed thereon are placed in the partitioned spaces 52, the end faces 22a of the cores 20 are fixed (adhered) to the adhesive sheet 120 inside each of the plurality of partitioned spaces 52.

[0066] Next, as shown in FIG. 5, with the cores 20 adhered to the adhesive sheet 120, the frame member 50 is placed inside a mold (lower mold) 60. Here, the mold 60 has a main body 61 and a cavity 62 formed in the main body 61. The cavity 62 is a space (recess) surrounded by an inner wall 63 and a bottom surface 64. If necessary, a release film 110 is placed on the bottom surface 64 of the cavity 62. In the example shown in FIG. 5, the release film 110 is placed along the inner wall 63 and the bottom surface 64 of the cavity 62 so as to be in close contact with them. The outer edge of the release film 110 may be placed outside the opening edge of the cavity 62. After the release film 110 is placed in the cavity 62, the cavity 62 is filled with an outer casing material 80. A fluid material is used as the outer casing material 80. The exterior material 80 is made of a composite magnetic material containing a binder such as a thermoplastic resin or a thermosetting resin and magnetic particles (magnetic filler), for example.

[0067] When the frame member 50 is placed inside the mold 60 (cavity 62), the frame member 50 is moved in the direction shown by the arrow in Fig. 5. This allows a plurality of coils 10 to be placed in the cavity 62 together with a plurality of cores 20, as shown in Fig. 6. The mold 60 is heated before and after placing the frame member 50 in the cavity 62. This reduces the connection strength between the adhesive sheet 120 and the frame member 50, allowing the frame member 50 to be detached from the base 130 shown in Fig. 5.

[0068] 7, inside the cavity 62, the top of the winding core portion 21 faces the bottom surface 64 of the cavity 62 and is disposed at a position separated from the bottom surface 64. Furthermore, the end surface 22a of the flange portion 22 faces the opening surface of the cavity 62 and is disposed so as to be flush with the opening surface of the cavity 62. That is, in this embodiment, the coil 10 is disposed together with the core 20 in each of the plurality of partitioned spaces 52 so that the end surface 22a of the flange portion 22 is exposed from the frame member 50.

[0069] When the frame member 50 is placed in the cavity 62 of the mold 60, a plurality of partition areas 70 defined (partitioned) by the frame member 50 (partition walls 51) are formed inside the cavity 62 of the mold 60 at positions corresponding to the plurality of partition spaces 52 of the frame member 50. In each partition area 70, in other words, in each of the partition spaces 52 of the frame member 50, the winding portion 11 is covered with an exterior material 80, and at least portions of the lead-out portions 12a and 12b are also covered with the exterior material 80. In addition, the winding core portion 21 is covered with the exterior material 80, and at least portions of the flange portion 22 are also covered with the exterior material 80. The end surface 22a of the core 20 and the lead-out portions 12a and 12b arranged on the end surface 22a may be exposed from the exterior material 80 (the opening surface of the cavity 62 of the mold 60).

[0070] The frame member 50 is placed inside the mold 60 so that the position of the second end 51b of the partition wall 51 is equal to the position of the opening surface of the cavity 62. The height of the partition wall 51 is formed slightly smaller than the depth of the cavity 62, and the first end 51a of the partition wall 51 is positioned away from the bottom surface 64. As a result, a connection region 72 that connects the partitioned spaces 52 of the frame member 50 to each other is formed inside the cavity 62 of the mold 60.

[0071] Next, the exterior packaging material 80 filled in the cavity 62 of the mold 60 is compressed and cured. More specifically, an upper mold (not shown) is prepared, and the exterior packaging material 80 is compressed and cured using the mold (lower mold) 60 and the upper mold at a predetermined mold temperature for a predetermined time. As a result, the exterior packaging material 80 filled in the multiple partition regions 70 is compressed and cured, and multiple exterior bodies 30 are formed inside the multiple partition regions 70. Furthermore, the exterior packaging material 80 filled in the connection region 72 is compressed and cured, and a connecting portion 90 is formed inside the connection region 72. As described above, the multiple partition regions 70 are connected via the connection region 72, and therefore the multiple exterior bodies 30 are connected via the connecting portion 90. In this way, in this embodiment, a molded body 100 can be formed that has multiple exterior bodies 30 formed in the multiple partition regions 70 and the connecting portion 90 formed in the connection region 72 and connected to the multiple exterior bodies 30. In other embodiments, the filling of the partition area 70 with the sheath material 80 and the compression and hardening of the sheath material 80 may proceed simultaneously.

[0072] Next, as shown in Fig. 8, the frame member 50 with the formed body 100 formed therein is removed from the mold 60 (cavity 62). Then, the multiple exterior bodies 30 are cut at the connecting portions 90 and removed from the frame member 50. By cutting the multiple exterior bodies 30 at the connecting portions 90, the multiple exterior bodies 30 connected to the connecting portions 90 are separated into individual pieces, and multiple individual pieces of the exterior bodies 30 as shown in Fig. 9 can be obtained.

[0073] Next, as shown in FIG. 10A , terminal electrodes 40a and 40b are attached to the bottom surface 30a of each of the exterior housings 30. In this embodiment, terminal electrodes 40a and 40b are L-shaped metal terminals having mounting surface mounting portions 40a1 and 40b1 and side surface mounting portions 40a2 and 40b2, respectively. The mounting surface mounting portions 40a1 and 40b1 and the side surface mounting portions 40a2 and 40b2 are respectively positioned facing the flange portion 22 of the core 20 and the bottom surface 30a or first side surface 30c of the exterior housing 30, and are joined using an adhesive or the like to attach terminal electrodes 40a and 40b to the exterior housing 30. At this time, the side surface mounting portions 40a2 and 40b2 of terminal electrodes 40a and 40b are joined to the roughened surface regions 30c2 to 30f2 of the side surfaces 30c to 30f of the exterior housing 30. This improves the adhesion between the terminal electrodes 40a, 40b and the exterior body 30, and increases the bonding strength of the terminal electrodes 40a, 40b to the exterior body 30.

[0074] In this way, by the above-described manufacturing method, the smooth surface regions 30c1 to 30f1 and the side surfaces 30c to 30f can be appropriately formed on the side surfaces 30c to 30f of the outer casing 30 of the coil device 1.

[0075] As described above, in the coil component 1 according to the present disclosure, the side surfaces 30c to 30f of the outer casing 30 are formed with smooth surface regions 30c1 to 30f1 and rough surface regions 30c2 to 30f2 that have relatively larger (rougher) surface roughness than the smooth surface regions 30c1 to 30f1, and the rough surface regions 30c2 to 30f2 are formed in a predetermined range on the mounting surface 1a side of the side surfaces 30c to 30f.

[0076] Therefore, when electronic components are densely arranged, adjacent electronic components come into contact with each other at the rough surface regions 30c2 to 30f2 of the side surfaces 30c to 30f, and even if adjacent electronic components come into contact with each other, the possibility of them joining (sticking) together can be reduced.

[0077] On the other hand, the roughened surface regions 30c2 to 30f2 have high adhesion under certain conditions such as when adhesive or molten resin is present. Therefore, when the terminal electrodes 40a, 40b, which are L-shaped metal terminals, are joined to the exterior body 30 with adhesive or the like, the side mounting portions 40a2, 40b2 of the terminal electrodes 40a, 40b are joined to the roughened surface regions 30c2 to 30f2 of the side surfaces 30c to 30f of the exterior body 30 (in the example shown in Figure 1A, the roughened surface region 30c2 of the first side surface 30c), thereby improving adhesion and increasing the joining strength of the terminal electrodes 40a, 40b.

[0078] Furthermore, this is not limited to cases where the terminal electrodes 40a, 40b are attached to the exterior body 30. By providing the roughened surface areas 30c2 to 30f2 on the surface of the exterior body 30, for example, when the coil component 1 is mounted on a substrate or the like and then the entire peripheral circuit of the coil component 1 or the entire substrate on which the coil component 1 is mounted is covered and sealed with an exterior resin, the adhesion with the exterior resin is improved at the locations of the roughened surface areas 30c2 to 30f2, and the bonding strength of these exterior resins to the coil component 1 can also be increased.

[0079] In this way, the coil component 1 according to the present disclosure can improve the yield during production, and can also be easily handled during use, improving the bonding reliability and mounting reliability.

[0080] Making the circumferential surfaces 30a to 30f of the coil component 1 smooth is important from the viewpoint of forming a stable and efficient magnetic path when the outer casing 30 forms a magnetic core together with the core 20, i.e., to obtain stable magnetic and electrical characteristics. Furthermore, even in general electronic components, it is generally desirable to form the circumferential surfaces as smooth surfaces from the viewpoint of such characteristics, or from the viewpoint of, for example, ease of marking the surface of the electronic component, miniaturization, aesthetics, etc. As a result, this may not meet the requirements for the joinability of peripheral components such as terminal electrodes and the joinability when applying resin coating.

[0081] However, in the coil component 1 according to the present disclosure, smooth surface regions and rough surface regions can be selectively formed on one circumferential surface of one electronic component. Therefore, for example, only the portions of the circumferential surface of the exterior body 30 where the side mounting portions 40a2, 40b2 of the L-shaped metal terminal are joined via an adhesive or the like, i.e., only the necessary portions, can be selectively roughened. As a result, the characteristics of the electronic component obtained by a smooth circumferential surface can be maintained while improving the bondability with the terminal electrode or coating material.

[0082] As described above, in order to form such rough surface regions 30c2 to 30f2 in the exterior housing 30 of the coil device 1, it is sufficient to form a smooth surface region and a rough surface region on corresponding wall surfaces of the cavity when molding the exterior housing 30. Furthermore, a frame member 50 having a smooth surface region (smooth frame surface region 57a) and a rough surface region (rough frame surface region 57b) on the wall surface (frame surface) of the cavity can be easily manufactured by punching. This method makes it possible to easily manufacture an electronic component in which a smooth surface region and a rough surface region are selectively formed on one circumferential surface, as described above.

[0083] The present disclosure is not limited to the above-described embodiments, and various modifications can be made within the scope of the present disclosure.

[0084] For example, in the above-described embodiment, coil component 1 is described in which L-shaped terminal electrodes 40a, 40b are attached to exterior body 30. However, an electronic component according to the present disclosure may also be configured as coil component 2 in which flat terminal electrodes 42a, 42b are attached to bottom surface 30a, as shown in Fig. 1C. Even with this configuration, rough surface regions 30c2-30f2 formed on side surfaces 30c-30f can improve adhesion with, for example, exterior resin.

[0085] 1D, coil 10 may be disposed inside package 30 so that the winding axis direction of winding portion 11 is parallel to bottom surface 30a of package 30. In FIG. 1D, the winding axis direction of winding portion 11 corresponds to the Y-axis direction. The shape of winding portion 11 as viewed from the winding axis direction is a rectangle with its long side in the X-axis direction, but it may also be a square, other polygons, a circle, an ellipse, or the like. Lead-out portions 12a and 12b extend directly from winding portion 11 toward bottom surface 30a and are disposed on the surface of bottom surface 30a. Even in coil device 3 configured in this manner, roughened surface regions 30c2 to 30f2 are formed on the bottom surfaces of side surfaces 30c to 30f, which can increase the bonding strength of L-shaped terminal electrodes 43a and 43b to package 30 and improve adhesion to, for example, an exterior resin.

[0086] 1E, a coil 10B made of wound rectangular wire may be used. For example, when the coil 10B is made of rectangular wire, a separate metal terminal may not be provided, and the rectangular wire may be directly drawn out from the bottom surface 30a to form a terminal electrode, as shown in FIG. 1E. Furthermore, an air-core coil without a core 20 may be housed in the exterior body 30, as in the coil component 4 also shown in FIG. 1E.

[0087] 1B, after the coil 10 and the core 20 are sealed with the exterior housing 30, the terminal electrodes 40a, 40b are joined to the exterior housing 30, and the terminal electrodes 40a, 40b are electrically connected to the lead-out portions 12a, 12b from the coil 10. However, as in the coil component 5 shown in FIG. 1F, for example, before the coil 10 and the core 20 are sealed with the exterior housing 30, the terminal electrodes 44a, 44b may be attached to the flange portion 22 of the core 20, and the lead-out portions 12a, 12b from the coil 10 may be connected to the terminal electrodes 44a, 44b. The exterior housing 30 may be formed by molding the entire coil 10, the core 20, and the terminal electrodes 44a, 44b, including the terminal electrodes 44a, 44b connected to the coil 10 and joined to the flange portion 22 of the core 20, with a resin mold.

[0088] Furthermore, in the above-described embodiment, the core 20 is a T-shaped core having a winding core portion 21 and one flange portion 22, but it may also be configured to have a drum core 23 having two opposing flange portions 24a, 24b, as in the coil device 6 shown in FIG. 1G.

[0089] The shape of the terminal electrodes is not limited to the configuration of the above-described embodiment. For example, terminal electrodes 45a, 45b may be configured as shown in FIG. 1H. Terminal electrode 45a is disposed on exterior body 30 so as to cover the corner where bottom surface 30a and first side surface 30c of coil component 7 intersect, and terminal electrode 45b is disposed on exterior body 30 so as to cover the corner where bottom surface 30a and third side surface 30e of coil component 7 intersect. In this configuration, the plate-shaped portions of terminal electrodes 45a, 45b that abut the side surfaces 30c, 30e of exterior body 30 are disposed in second regions (roughened surface regions) 30c2, 30e2 of the side surfaces 30c, 30e of the exterior body 30. This improves the adhesion of terminal electrodes 45a, 45b to exterior body 30 and increases the bonding strength of terminal electrodes 45a, 45b. Furthermore, a large mounting area can be secured for terminal electrodes 45a, 45b, thereby increasing reliability. Furthermore, since no terminals are arranged on the upper portions of side surfaces 30c, 30e (first regions 30c1, 30e1) and top surface 30b of package 30, the amount of Ag paste and the like used can be reduced, which is advantageous in terms of cost.

[0090] In the above-described embodiment, the terminal electrodes 40a, 40b of the coil component 1 are electrode members made of metal plates joined to the outer casing 30 with an adhesive or the like. However, the terminal electrodes may be formed by a paste method, a plating method, sputtering, screen printing, or the like.

[0091] Furthermore, in the manufacturing method of the coil component 1 according to the present disclosure described above, the outer casing 30 is formed around the coil 10 and the core 20 by compressing and curing. However, the molding method of the outer casing 30 is not limited to this, and various molding techniques such as transfer molding, injection molding, and dry molding may be used.

[0092] In the above-described embodiment, an inductor having a coil as an element body was exemplified as an electronic component according to the present disclosure. However, the electronic component according to the present disclosure is not limited to this, and may be a semiconductor component having a semiconductor integrated circuit (IC chip) as an element body, packaged in resin. The element body may also be a sensor having any sensor element, such as a temperature / humidity sensor, pressure sensor, acceleration sensor, photoelectric conversion element, or piezoelectric element. The element body may also be a capacitor having a polymer aluminum electrolytic capacitor element.

[0093] This specification discloses the following:

[0094] [1] An electronic component having an exterior body and an element main body disposed inside the exterior body, the exterior body includes a thermosetting resin, has a first main surface and a second main surface facing each other, and one or more side surfaces connecting the first main surface and the second main surface, At least one of the side surfaces includes a first region and a second region having a surface roughness greater than that of the first region, An electronic component in which a portion of the exterior body that forms the first region and a portion of the exterior body that forms the second region contain the same type of thermosetting resin.

[0095] [2] The electronic component according to [1] above, wherein the first main surface is a mounting surface, and the side surface of the second main surface is inclined so that the area of ​​the second main surface is smaller than that of the first main surface.

[0096] [3] The electronic component according to [1] or [2] above, wherein the first main surface is a mounting surface, and the second region is arranged in a predetermined range on at least one of the side surfaces closer to the first main surface, and the first region is arranged on a side farther from the first main surface than the second region.

[0097] [4] The electronic component according to any one of the above [1] to [3], wherein the first region and the second region are continuous along the entire periphery of the side surface.

[0098] [5] The electronic component according to any one of the above [1] to [4], further comprising a terminal electrode, a part of which is attached to the second region of the exterior body.

[0099] [6] a terminal electrode having a first main surface mounting portion mounted on the first main surface and a side surface mounting portion mounted on at least one of the side surfaces; The electronic component according to any one of the above [1] to [5], wherein the side surface mounting portion is mounted to the second region of the exterior body.

[0100] [7] The electronic component according to any one of the above [1] to [6], wherein the element body is a coil.

[0101] [8] The electronic component according to any one of the above [1] to [6], wherein the element body is a semiconductor integrated circuit.

[0102] [9] The electronic component according to any one of the above [1] to [6], wherein the element body is a sensor element.

[0103]

[10] The electronic component according to any one of the above [1] to [6], wherein the element body is a polymer aluminum electrolytic capacitor element.

[0104]

[11] A method for manufacturing an electronic component in which an element body is disposed inside an exterior housing, comprising: placing the element body in a cavity; and a step of filling the cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body, A method for manufacturing an electronic component in which at least a portion of the cavity is formed using a frame member in which at least one frame surface includes a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region.

[0105]

[12] the at least one frame surface of the frame member is a surface that forms at least one side surface of the electronic component, The frame surface second region is disposed in a predetermined range close to the mounting surface of the electronic component, and the frame surface first region is The method for manufacturing an electronic component according to

[11] above, wherein the frame surface second region is disposed in a predetermined range farther from the mounting surface of the electronic component than the frame surface second region.

[0106]

[13] The method for manufacturing an electronic component according to the above

[11] or

[12] , wherein the at least one frame surface of the frame member is formed by punching a plate-shaped member.

[0107]

[14] An apparatus for manufacturing an electronic component in which an element body is disposed inside an exterior body, a frame member for filling a cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body; The frame member has a frame surface with which the exterior material is in contact, and at least one of the frame surfaces includes a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region, The apparatus for manufacturing electronic components, wherein the frame member forms at least a part of the cavity such that the first frame surface region and the second frame surface region are located on the inner surface of the cavity. [Explanation of symbols]

[0108] 1~7...Coil parts 1a...Mounting surface (bottom surface, first main surface) 10...Coil 11... Winding section 12a, 12b…Drawer part 20,23...Core 21...Core 22,24a,24b…Tsubabe 22a...end face 30...Exterior body 30a...Mounting surface (bottom surface, first main surface) 30b...Top surface (second main surface of coil component) 30c~30d...Side (coil component side) 40a to 44a, 40b to 44b...Terminal electrodes 40a1, 40a2...mounting surface mounting portion (first main surface mounting portion) 40a2, 40b2...Side mounting part 50...Frame member 51...Bulkhead 51a...first end 51b…Second end 51c…Frame surface 52...Divided space 53...First opening 54...Second opening 55...Bottom wall 56...Through hole 60...Mold 61...Main body 62...cavity 63…Inner wall 64...Bottom 70...Partition area 72...Connection area 80...Exterior material 90...Connection part 100...Molded body 110...Release film 120...Adhesive sheet 130...Pedestal

Claims

1. An electronic component having an exterior body and an element main body disposed inside the exterior body, the exterior body includes a thermosetting resin, has a first main surface and a second main surface facing each other, and one or more side surfaces connecting the first main surface and the second main surface, At least one of the side surfaces includes a first region and a second region having a surface roughness greater than that of the first region, An electronic component in which a portion of the exterior body that forms the first region and a portion of the exterior body that forms the second region contain the same type of thermosetting resin.

2. The electronic component according to claim 1 , wherein the first main surface is a mounting surface, and the side surfaces of the second main surface are inclined so that the area of ​​the second main surface is smaller than that of the first main surface.

3. 2. The electronic component according to claim 1, wherein the first main surface is a mounting surface, and the second region is arranged in a predetermined range on at least one of the side surfaces closer to the first main surface, and the first region is arranged farther from the first main surface than the second region.

4. The electronic component according to claim 1 , wherein the first region and the second region are continuous along the entire periphery of the side surface.

5. The electronic component according to claim 1 , further comprising a terminal electrode, a portion of the terminal electrode being attached to the second region of the exterior body.

6. a terminal electrode having a first main surface mounting portion mounted on the first main surface and a side surface mounting portion mounted on at least one of the side surfaces; The electronic component according to claim 2 , wherein the side mounting portion is mounted in the second region of the exterior body.

7. 7. The electronic component according to claim 1, wherein the element body is a coil.

8. 7. The electronic component according to claim 1, wherein the element body is a semiconductor integrated circuit.

9. 7. The electronic component according to claim 1, wherein the element body is a sensor element.

10. 7. The electronic component according to claim 1, wherein the element body is a polymer aluminum electrolytic capacitor element.

11. A method for manufacturing an electronic component in which an element body is disposed inside an exterior housing, comprising: placing the element body in a cavity; and a step of filling the cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body, A method for manufacturing an electronic component in which at least a portion of the cavity is formed using a frame member in which at least one frame surface includes a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region.

12. the at least one frame surface of the frame member is a surface that forms at least one side surface of the electronic component, The frame surface second region is disposed in a predetermined range close to the mounting surface of the electronic component, and the frame surface first region is The method for manufacturing an electronic component according to claim 11 , wherein the frame surface second region is disposed in a predetermined range farther from the mounting surface of the electronic component than the frame surface second region.

13. The method for manufacturing an electronic component according to claim 11 or 12, wherein the at least one frame surface of the frame member is formed by punching a plate-like member.

14. An apparatus for manufacturing an electronic component in which an element body is disposed inside an exterior body, a frame member for filling a cavity in which the element body is disposed with an exterior material that is a material for the exterior body to form the exterior body; The frame member has a frame surface with which the exterior material is in contact, and at least one of the frame surfaces includes a frame surface first region and a frame surface second region having a surface roughness greater than that of the frame surface first region, An apparatus for manufacturing electronic components, wherein the frame member forms at least a portion of the cavity such that the first frame surface region and the second frame surface region are located on the inner surface of the cavity.

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