Exposure apparatus, method for producing article, and exposure method

Abstract

To provide a small-sized exposure apparatus capable of exposing a substrate while suppressing generation of a temperature distribution on an original plate.SOLUTION: An exposure apparatus according to the present invention is an exposure apparatus for projecting an image of a pattern on an original onto a substrate to expose the substrate, comprising a projection optical system that guides the exposure light passing through the original onto the substrate surface and a control unit that controls exposure. The control unit performs a first exposure step of exposing the substrate so as to project an image of a first pattern formed in a first region of the original onto a predetermined shot area on the substrate surface, and a second exposure step of exposing the substrate so as to project an image of a second pattern formed in a second region of the original to at least partially overlap with the latent image formed in the predetermined shot area during the first exposure step.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an exposure apparatus, an article manufacturing method, and an exposure method. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in an exposure apparatus, a method is known in which the optical performance within the projection area of ​​a projection optical system on a substrate is evaluated by measuring a latent image of a predetermined pattern formed on the substrate. Such methods require increasing the exposure dose when exposing the substrate to form the latent image on the substrate with sufficient contrast for the evaluation.

[0003] Furthermore, if exposure light is irradiated for a long period of time on a specific area on the original where the specific pattern is formed in order to increase the amount of exposure, there is a risk that the temperature of the specific area on the original will rise, resulting in the formation of a temperature distribution. If such a temperature distribution is formed in which the temperature of a specified area on the original increases, the shape of the specified area may change, which may cause distortion of the specified pattern formed in the specified area.

[0004] In this case, the latent image of the predetermined pattern formed on the substrate is also distorted, which reduces the accuracy of the evaluation of distortion aberration, particularly within the projection area of ​​the projection optical system. Furthermore, if the distortion of the specified pattern formed on the original changes during long-term exposure of the substrate, the contrast of the latent image of the specified pattern formed on the substrate will decrease, thereby reducing the accuracy of measurement of the latent image.

[0005] Patent document 1 discloses an exposure apparatus that equalizes the temperature distribution in a predetermined area where a predetermined pattern is formed on the master by irradiating the predetermined area with not only exposure light but also non-exposure light in accordance with the transmittance distribution of the predetermined area. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-127226 Summary of the Invention [Problem to be solved by the invention]

[0007] The exposure apparatus disclosed in Patent Document 1 is large in size because it is necessary to provide a light source that irradiates non-exposure light in addition to a light source that irradiates exposure light. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a small exposure apparatus that can expose a substrate while suppressing the occurrence of temperature distribution in the original. [Means for solving the problem]

[0008] The exposure apparatus of the present invention is an exposure apparatus that projects an image of a pattern on an original onto a substrate and exposes the substrate, and is equipped with a projection optical system that guides exposure light that has passed through the original onto the substrate surface of the substrate, and a control unit that controls the exposure, wherein the control unit performs a first exposure process in which the substrate is exposed so that an image of a first pattern formed in a first area of ​​the original is projected onto a predetermined shot area on the substrate surface, and a second exposure process in which the substrate is exposed so that an image of a second pattern formed in a second area of ​​the original is projected while overlapping at least a portion of the latent image formed in the predetermined shot area in the first exposure process. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a small-sized exposure apparatus that can expose a substrate while suppressing the occurrence of temperature distribution in the original. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view of an exposure apparatus according to a first embodiment. [Figure 2] FIG. 2 is a top view of a test mask used in the exposure apparatus according to the first embodiment. [Figure 3]10 is a flowchart showing a process for calculating a value of optical performance in the exposure apparatus according to the first embodiment. [Figure 4] FIG. 11 is a top view of a substrate used in an exposure apparatus according to a third embodiment. [Figure 5] 10 is a flowchart showing a process for calculating a value of optical performance in an exposure apparatus according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The exposure apparatus according to this embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings shown below may be drawn at a scale different from the actual scale in order to facilitate understanding of this embodiment.

[0012] [First embodiment] Conventionally, a method has been known in which the optical performance within the projection area of ​​a projection optical system is evaluated by measuring a latent image formed on a substrate by performing so-called static exposure, in which the substrate is exposed while the mask stage and substrate stage are both stationary in an exposure apparatus.

[0013] In such a method, a large amount of exposure is required to form a latent image on the substrate with sufficient contrast for the evaluation, and therefore multiple exposures are required to project an image of an evaluation pattern having a predetermined shape onto a predetermined shot area on the substrate. When exposure is performed multiple times to project an image of the evaluation pattern onto the substrate, the exposure light is irradiated multiple times onto a specific area on the mask where the evaluation pattern is formed, resulting in the formation of a temperature distribution within the mask.

[0014] If a temperature distribution is formed in such a way that the temperature rises in a specific region in the mask, the shape of the specific region changes, causing distortion in the evaluation pattern formed in the specific region. In this case, the evaluation pattern formed on the substrate is also distorted, which reduces the accuracy of the evaluation of distortion aberration, particularly within the projection area of ​​the projection optical system. Furthermore, if the distortion of the evaluation pattern formed on the mask changes while the substrate is exposed multiple times, the contrast of the latent image of the evaluation pattern formed on the substrate will decrease, thereby reducing the accuracy of measuring the latent image.

[0015] In order to suppress such thermal deformation of the mask, several methods have been proposed. For example, a method has been proposed for making the temperature distribution in a specified region uniform by irradiating the specified region with non-exposure light in addition to exposure light in accordance with the transmittance distribution in the specified region where a pattern is formed on the mask. However, in such a method, it is necessary to provide a light source that emits non-exposure light in addition to a light source that emits exposure light, which makes the exposure apparatus larger and more complicated. Furthermore, time is required to equalize the temperature distribution in the mask by irradiating it with non-exposure light, which reduces throughput.

[0016] Another method has been proposed in which the amount of exposure light irradiated onto each of multiple regions on the mask, where patterns of different densities are formed, is changed according to the density, thereby making the temperature distribution among the multiple regions uniform. However, when a latent image of a pattern formed in a predetermined region of the mask is formed on a substrate by performing static exposure as described above, exposure light is irradiated only onto the predetermined region of the mask. That is, it is difficult to uniformize the temperature distribution in the predetermined region of the mask that increases in temperature when static exposure is performed using such a method.

[0017] Another method that can be considered is to provide an interval for cooling the mask between multiple exposures, thereby making the temperature distribution in the mask uniform; however, in this case, the throughput will decrease by the amount of the provided interval. Therefore, the present embodiment aims to provide an exposure apparatus that can suppress the occurrence of temperature distribution in the mask without providing any new components, thereby suppressing a decrease in the accuracy of evaluation of optical performance within the projection area by a projection optical system that uses a latent image formed on a substrate by multiple static exposures.

[0018] FIG. 1 shows a schematic cross-sectional view of an exposure apparatus 10 according to the first embodiment. The exposure apparatus 10 according to this embodiment includes a light source 1, an illumination optical system 2, an alignment scope 3, a mask stage 5 (original stage), a projection optical system 6, a substrate stage 8, and a control unit 9.

[0019] The illumination optical system 2 converts the light emitted from the light source 1 into exposure light, and guides the exposure light to a mask 4 (original), thereby illuminating the mask 4. The alignment scope 3 observes the alignment marks formed on the mask 4 , and also observes the alignment marks formed on the substrate 7 or the substrate stage 8 via the projection optical system 6 . The mask stage 5 is configured to be movable while holding the mask 4 .

[0020] The projection optical system 6 guides the exposure light that has passed through the mask 4 to the substrate 7, thereby projecting an image of the pattern formed on the mask 4 onto the surface of the substrate 7. The substrate stage 8 is configured to be movable while holding the substrate 7 .

[0021] The control unit 9 performs control to calculate the value of the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7 in the exposure apparatus 10 according to this embodiment, which will be described in detail later. Furthermore, in the exposure apparatus 10 according to this embodiment, a light-shielding member (not shown) for defining the illumination area on the mask 4 by the illumination optical system 2 is provided between the illumination optical system 2 and the mask stage 5 .

[0022] In order to obtain sufficient resolution performance in the exposure apparatus 10 according to this embodiment, it is important to evaluate the imaging performance within the projection area of ​​the projection optical system 6. The image performance here refers to, for example, the distribution of distortion within the projection area.

[0023] In particular, in the exposure apparatus 10 according to this embodiment, when the mask 4 and the substrate 7 are scanned synchronously with each other and an image of the pattern formed on the mask 4 is projected onto the substrate 7, the distribution of distortion aberration within the projection area by the projection optical system 6 affects the resolving power. Therefore, it is necessary to accurately evaluate and adjust the image performance, that is, the distribution of distortion within the projection area.

[0024] As a method for evaluating such image performance, for example, a method using static exposure is known. In stationary exposure, exposure light is irradiated onto the substrate 7 while both the mask stage 5 and the substrate stage 8 are kept stationary.

[0025] The amount of exposure in static exposure can be adjusted by using an exposure shutter or a light blocking member that is provided in the illumination optical system 2 and blocks the optical path of the exposure light. In static exposure, only the area projected by the projection optical system 6 on the substrate 7 is exposed, so that the optical performance of each point within the projection area can be evaluated.

[0026] Furthermore, the method of forming a latent image on the substrate 7 for evaluation does not require dependence on the facility where the exposure apparatus 10 is installed or the use of a measuring instrument, making it possible to perform stable evaluation that is not affected by process factors or measuring instrument factors. On the other hand, since a large amount of exposure is required to form a latent image on the substrate 7 with sufficient contrast to perform the above evaluation, a so-called multiple exposure may be performed, in which a specific shot area on the substrate 7 is exposed multiple times.

[0027] When the evaluation is performed using static exposure, the exposure light is irradiated only onto a predetermined area of ​​the mask 4 where the evaluation pattern is formed. When multiple exposure is performed to form a latent image on the substrate 7 in such a static exposure state, the exposure light is irradiated in a concentrated manner onto the predetermined area of ​​the mask 4 . Therefore, a temperature distribution occurs in the mask 4, in which the temperature rises locally, that is, in the predetermined region.

[0028] If such a temperature distribution occurs within the mask 4 when performing static exposure, distortion will occur in the pattern formed on the mask 4, which may reduce the accuracy of evaluation of the optical performance within the projection area by the projection optical system 6 on the substrate 7. Furthermore, when multiple exposures are performed to form a latent image on the substrate 7 in a static exposure state, there is a risk that the distortion occurring in the pattern formed on the mask 4 will change during the multiple exposures.

[0029] In this case, the contrast of the latent image formed on the substrate 7 by the multiple exposure decreases, and the accuracy of evaluation of the optical performance within the projection area on the substrate 7 by the projection optical system 6 decreases. In addition, heat may accumulate in the mask 4 during the multiple exposure, causing the temperature of the mask 4 to change, which may reduce the accuracy of the evaluation of the optical performance within the projection area based on the latent image formed on the substrate 7.

[0030] Therefore, in the exposure apparatus 10 according to this embodiment, a method described in detail below is used to suppress a decrease in the accuracy of evaluation of the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7. FIG. 2 shows a schematic top view of the evaluation mask 4 used to evaluate the above optical performance in the exposure apparatus 10 according to this embodiment.

[0031] As shown in Figure 2, evaluation patterns 4-1, 4-2, 4-3, 4-4, and 4-5 having the same shape are formed in different regions (first region, second region, ..., fifth region) on the evaluation mask 4. Although the five evaluation patterns 4-1 to 4-5 are formed on the evaluation mask 4, the present invention is not limited to this, and it is sufficient that at least two evaluation patterns having the same shape are formed.

[0032] 3 is a flowchart showing a process for calculating the value of distortion in the projection area by the projection optical system 6 in the exposure apparatus 10 according to this embodiment. Each step in this process is controlled by the controller 9. When the process begins, first, the mask 4 on which the evaluation patterns 4-1 to 4-5 are formed is placed on the mask stage 5, and the substrate 7 on which a photosensitive agent for forming a latent image is applied is placed on the substrate stage 8 (step S1).

[0033] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that an image of the evaluation pattern 4-1 (first pattern) formed on the mask 4 is projected onto a predetermined shot area of ​​the substrate 7 (step S2, first exposure process). Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-2 (second pattern) formed on the mask 4 is projected onto the specified shot area of ​​the substrate 7 (step S3, second exposure process). Specifically, in step S3, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-2 formed on the mask 4 is projected onto the latent image of the evaluation pattern 4-1 formed in the predetermined shot area in step S2 while being superimposed thereon.

[0034] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-3 formed on the mask 4 is projected onto the predetermined shot area of ​​the substrate 7 (step S4). Specifically, in step S4, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-3 formed on the mask 4 is projected onto the latent images of the evaluation patterns 4-1 and 4-2 formed in the specified shot area in steps S2 and S3 while overlapping them.

[0035] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-4 formed on the mask 4 is projected onto the predetermined shot area of ​​the substrate 7 (step S5). Specifically, in step S5, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-4 formed on the mask 4 is projected onto the latent images of the evaluation patterns 4-1 to 4-3 formed in the specified shot area in steps S2 to S4 while overlapping them.

[0036] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-5 formed on the mask 4 is projected onto the predetermined shot area of ​​the substrate 7 (step S6). Specifically, in step S6, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-5 formed on the mask 4 is projected so as to overlap the latent images of the evaluation patterns 4-1 to 4-4 formed in the specified shot area in steps S2 to S5.

[0037] Next, the alignment scope 3 is used to measure the latent image formed in the predetermined shot area on the substrate 7 (step S7, measurement step). Then, it is determined whether the contrast of the latent image measured in step S7 is sufficient, in other words, whether the contrast is equal to or greater than a predetermined contrast (step S8, determination step).

[0038] If the contrast of the latent image formed in the specified shot area of ​​the substrate 7 is not sufficient (No in step S8), return to step S2 and perform static exposure again to project the images of each of the evaluation patterns 4-1 to 4-5 onto the specified shot area. On the other hand, if the contrast of the latent image formed in the predetermined shot area on the substrate 7 is sufficient (Yes in step S8), the value of distortion in the projection area by the projection optical system 6 is calculated based on the measured latent image (step S9), and then the process ends.

[0039] Specifically, in step S9, for example, in a predetermined shot area, the image of the mask pattern formed on the mask 4 projected by the projection optical system 6 and the latent image of the evaluation pattern formed by steps S2 to S6 are observed using the alignment scope 3. Then, by measuring the amount of positional misalignment between the observed image of the mask pattern and the observed latent image of the evaluation pattern, the value of the distortion aberration (predetermined optical performance) within the projection area by the projection optical system 6 can be calculated. Furthermore, the calculated distortion value can be evaluated using a known method to adjust the projection optical system 6.

[0040] As described above, in the exposure apparatus 10 according to this embodiment, multiple exposure is performed so that the evaluation patterns in each region of the mask 4, each having an evaluation pattern with the same shape as the others, are formed in multiple regions and the evaluation patterns are superimposed on a predetermined shot region of the substrate 7. This prevents the heat from being concentrated in a specific area on the mask 4 when multiple exposures are performed on the substrate 7 in a static exposure state, thereby suppressing thermal deformation of the mask 4. Furthermore, since there is no need to provide an interval for cooling the mask 4 between each exposure in the multiple exposure, the time required for performing the multiple exposure can be shortened.

[0041] That is, when exposure light is irradiated onto one of the evaluation patterns 4-1 to 4-5 formed on the mask 4 in a predetermined exposure of the multiple exposures to project the image of that pattern onto the substrate 7, the remaining evaluation patterns are cooled. Therefore, by suppressing the temperature rise of the entire mask 4, the thermal deformation of the entire mask 4 is also suppressed, and the accuracy of evaluation of the distortion aberration in the projection area of ​​the projection optical system 6 on the substrate 7 can also be improved. According to this embodiment, when performing exposure with a large amount of exposure to evaluate a latent image, an exposure apparatus can be provided that can suppress local temperature changes in the mask 4 due to multiple exposures without the need to install new components.

[0042] In the exposure apparatus 10 according to this embodiment, the evaluation patterns 4-1 to 4-5 formed on the mask 4 have the same shape, but this is not limited to this. That is, as long as only the portions of the evaluation patterns 4-1 to 4-5 used for evaluating the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7 have the same shape, the other portions may be different from each other.

[0043] In other words, the evaluation patterns 4-1 to 4-5 formed on the mask 4 only need to have substantially the same shape to evaluate the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7. In other words, in steps S3 to S6, static exposure is performed on the substrate 7 so that the image of the predetermined evaluation pattern formed on the mask 4 is projected while overlapping at least a portion of the latent image formed in a predetermined shot area of ​​the substrate 7, including that portion.

[0044] Furthermore, in the exposure apparatus 10 according to this embodiment, distortion is evaluated as the optical performance of the projection optical system 6, but the present invention is not limited to this, and astigmatism, focus, etc. may also be evaluated. However, when evaluating the distortion aberration, thermal deformation of the mask 4 is more likely to reduce the accuracy of the evaluation than when evaluating the astigmatism or focus aberration, so the effects of this embodiment are particularly evident when evaluating the distortion aberration.

[0045] [Second embodiment] The exposure apparatus according to the second embodiment has the same configuration as exposure apparatus 10 according to the first embodiment, except for the operation when performing multiple exposure to evaluate the optical performance within the projection area by projection optical system 6 on substrate 7. Therefore, the same components are given the same reference numerals, and descriptions thereof will be omitted.

[0046] Specifically, in the exposure apparatus 10 according to the first embodiment, both the mask stage 5 and the substrate stage 8 are kept stationary when performing each exposure in the multiple exposure, i.e., static exposure is performed. On the other hand, in the exposure apparatus according to this embodiment, the mask stage 5 and the substrate stage 8 are scanned synchronously with each other when performing each exposure in the multiple exposure, that is, scanning exposure is performed.

[0047] Then, in the flowchart shown in Figure 3, when projecting an image of a predetermined evaluation pattern formed on the mask 4 onto a predetermined shot area of ​​the substrate 7, the position in the scanning direction of the light-shielding member provided between the illumination optical system 2 and the mask stage 5 is adjusted. This allows the exposure light from the illumination optical system 2 to be irradiated only onto the predetermined area of ​​the mask 4 where the predetermined evaluation pattern is formed.

[0048] As described above, in the exposure apparatus according to this embodiment, multiple exposure is performed so that the evaluation patterns in each region of the mask 4, in which evaluation patterns having the same shape are formed, are superimposed on predetermined shot regions of the substrate 7. This prevents the heat from being concentrated and accumulated in a specific area on the mask 4 when multiple exposure is performed on the substrate 7, thereby making it possible to suppress thermal deformation of the mask 4. Therefore, it is possible to suppress a decrease in the accuracy of evaluation of the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7.

[0049] The multiple exposure using scanning exposure in the exposure apparatus according to this embodiment is not limited to the evaluation of the optical performance within the projection area by the projection optical system 6 on the substrate 7 as described above, but can also be applied to processes that require a large amount of exposure, such as negative resist. That is, when multiple exposures are performed in such a process, the region on the mask 4 irradiated with the exposure light is changed for each exposure, thereby making it possible to suppress the occurrence of thermal deformation and temperature distribution of the mask 4.

[0050] [Third embodiment] FIG. 4 shows a schematic top view of a substrate 7 used in an exposure apparatus according to the third embodiment. The exposure apparatus according to this embodiment has the same configuration as exposure apparatus 10 according to the first embodiment, except for the operation of multiple exposure performed to evaluate the optical performance within the projection area by projection optical system 6 on substrate 7. Therefore, the same components are given the same reference numerals, and descriptions thereof will be omitted.

[0051] Specifically, in the exposure apparatus 10 according to the first embodiment, in order to evaluate the optical performance, multiple exposures were performed so that the images of the evaluation patterns 4-1 to 4-5 formed on the mask 4 were projected onto predetermined shot areas on the substrate 7. On the other hand, in the exposure apparatus according to this embodiment, in order to evaluate the optical performance, multiple exposure is performed so that the images of the evaluation patterns 4-1 to 4-5 formed on the mask 4 are projected onto different shot areas on the substrate 7.

[0052] FIG. 5 is a flowchart showing the process of calculating the value of distortion within the projection area by the projection optical system 6 in the exposure apparatus according to this embodiment. When the process begins, first, the mask 4 on which the evaluation patterns 4-1 to 4-5 are formed is placed on the mask stage 5, and the substrate 7 on which a photosensitive agent for forming a latent image is applied is placed on the substrate stage 8 (step S11).

[0053] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-1 formed on the mask 4 is projected onto the shot area 7-1 (first shot area) of the substrate 7 (step S12). Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-2 formed on the mask 4 is projected onto the shot area 7-2 (second shot area) of the substrate 7 (step S13).

[0054] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-3 formed on the mask 4 is projected onto the shot area 7-3 of the substrate 7 (step S14). Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-4 formed on the mask 4 is projected onto the shot area 7-4 of the substrate 7 (step S15).

[0055] Next, with both the mask stage 5 and the substrate stage 8 stationary, static exposure is performed on the substrate 7 so that the image of the evaluation pattern 4-5 formed on the mask 4 is projected onto the shot area 7-5 of the substrate 7 (step S16). Next, the alignment scope 3 is used to measure the latent images (first latent image, second latent image, . . . , fifth latent image) formed in each of the shot areas 7-1 to 7-5 of the substrate 7 (step S17). Then, it is determined whether the contrast of the latent images formed in the shot areas 7-1 to 7-5 measured in step S17 is sufficient, in other words, whether the contrast is equal to or greater than a predetermined contrast (step S18).

[0056] If the contrast of at least one of the latent images formed in the shot areas 7-1 to 7-5 of the substrate 7 is insufficient (No in step S18), the static exposure is performed on the shot area with insufficient contrast (step S19), and the process returns to step S18. On the other hand, if the contrast of all of the latent images formed in the shot areas 7-1 to 7-5 on the substrate 7 is sufficient (Yes in step S18), the value of distortion within the projection area by the projection optical system 6 is calculated based on the measured latent images (step S20, calculation step), and then the process ends.

[0057] Specifically, in step S20, for example, in each of the shot areas 7-1 to 7-5, the image of the mask pattern formed on the mask 4 projected by the projection optical system 6 and the latent image of the formed evaluation pattern are observed using the alignment scope 3. Next, the amount of positional deviation between the observed mask pattern image and the observed latent image of the evaluation pattern in each of the shot areas 7-1 to 7-5 is measured, and the value of distortion aberration in the projection area by the projection optical system 6 is calculated.

[0058] Then, the average value of the distortion values ​​(first value, second value, . . . , fifth value) calculated for each of the shot regions 7-1 to 7-5 is calculated. Furthermore, the projection optical system 6 can be adjusted by evaluating the calculated average value of distortion using a known method.

[0059] In the exposure apparatus according to this embodiment, latent images of evaluation patterns 4-1 to 4-5 are formed in shot areas 7-1 to 7-5 on the substrate 7, respectively. As described above, in order to form a latent image having sufficient contrast to evaluate the optical performance within the projection area of ​​the projection optical system 6 on the substrate 7, a large amount of exposure, that is, multiple exposures, is required.

[0060] Therefore, in step S19, exposure is performed at least once in each of the shot areas 7-1 to 7-5 on the substrate 7. That is, in the at least one exposure in each shot area performed in step S19, an image of the evaluation pattern corresponding to the formed latent image is projected so as to overlap at least a portion of the latent image.

[0061] As described above, the exposure apparatus according to this embodiment performs exposure multiple times, in which the evaluation patterns formed in each of the multiple regions of the mask 4 are projected onto the corresponding shot regions of the substrate 7, that is, multiple exposure. This prevents the heat from being concentrated in a specific area on the mask 4 when multiple exposures are performed on the substrate 7 in a static exposure state, thereby suppressing thermal deformation of the mask 4. Furthermore, since there is no need to provide an interval for cooling the mask 4 between each exposure in the multiple exposure, the time required for performing the multiple exposure can be shortened.

[0062] That is, while exposure light is being irradiated onto one of the evaluation patterns 4-1 to 4-5 formed on the mask 4 in order to project the image of that pattern onto one of the shot areas 7-1 to 7-5 on the substrate 7, the remaining evaluation patterns are cooled. Therefore, by suppressing the temperature rise of the entire mask 4, the thermal deformation of the entire mask 4 is also suppressed, and the deterioration of the accuracy of the evaluation of the distortion aberration in the projection area by the projection optical system 6 on the substrate 7 can be suppressed.

[0063] Furthermore, in the exposure apparatus according to this embodiment, latent images of evaluation patterns 4-1 to 4-5 are formed in shot areas 7-1 to 7-5 on the substrate 7, respectively. As a result, by averaging the measurement results of the latent images in the shot areas 7-1 to 7-5 of the substrate 7, the accuracy of evaluation of distortion in the projection area on the substrate 7 by the projection optical system 6 can be further improved.

[0064] In the above description, the number of shot areas on the substrate 7 where the latent images are formed and the number of evaluation patterns formed on the mask 4 are the same, but this is not limitative and they do not have to be the same. That is, in the exposure apparatus according to this embodiment, for example, a latent image of evaluation pattern 4-1 may be formed in each of shot areas 7-1, 7-3, and 7-5 of substrate 7, while a latent image of evaluation pattern 4-2 may be formed in each of shot areas 7-2 and 7-4 of substrate 7. At this time, for example, shot areas 7-1, 7-2, 7-3, 7-4, and 7-5 on the substrate 7 may be sequentially exposed so that the evaluation patterns 4-1 and 4-2 formed on the mask 4 are alternately irradiated with exposure light.

[0065] In the above description, the shot areas 7-1, 7-2, 7-3, 7-4, and 7-5 of the substrate 7 are sequentially exposed, but the present invention is not limited to this. That is, in the exposure apparatus according to this embodiment, if thermal deformation of the mask 4 is tolerable, it is possible to perform exposure on a predetermined shot area of ​​the substrate 7 multiple times in succession.

[0066] Furthermore, in the exposure apparatus according to this embodiment, the order in which the shot areas 7-1, 7-2, 7-3, 7-4, and 7-5 of the substrate 7 are exposed may be arbitrarily interchanged. Furthermore, in the exposure apparatus according to this embodiment, scanning exposure may be performed on each of the shot areas 7-1 to 7-5 on the substrate 7 instead of static exposure. Furthermore, in the exposure apparatus according to this embodiment, the shapes of the evaluation patterns 4-1 to 4-5 formed on the mask 4 do not have to be identical to each other.

[0067] [Production method] Next, a method for manufacturing an article using an exposure apparatus according to any one of the first to third embodiments will be described.

[0068] The products manufactured here include semiconductor devices, display devices, color filters, optical components, and MEMS (Micro Electro Mechanical Systems). For example, a semiconductor device is manufactured through a pre-process for creating a circuit pattern on a substrate 7 and a post-process including a processing step for completing the circuit chip created in the pre-process as a finished product.

[0069] The pre-processing includes an exposure process in which a substrate 7 coated with a photosensitive agent is exposed using an exposure apparatus according to any one of the first to third embodiments, and a development process in which the photosensitive agent exposed by the exposure process is developed. Then, a circuit pattern is formed on the substrate 7 by carrying out an etching process, an ion implantation process, etc. using the developed photosensitive agent pattern as a mask.

[0070] By repeating these steps of exposure, development, etching, etc., a circuit pattern consisting of multiple layers is formed on the substrate 7. In the post-process, dicing is performed on the substrate 7 on which the circuit pattern has been formed, and chip mounting, bonding and inspection processes are then carried out.

[0071] A display device is manufactured through a process of forming a transparent electrode. The process of forming a transparent electrode includes a step of applying a photosensitive agent to a glass substrate 7 on which a transparent conductive film has been vapor-deposited, and a step of exposing the substrate 7 on which the photosensitive agent has been applied using an exposure apparatus according to any one of the first to third embodiments. The step of forming the transparent electrode also includes a step of developing the exposed photosensitive agent.

[0072] According to the method for manufacturing an article according to this embodiment, it is possible to manufacture an article with higher quality and higher productivity than conventional methods. Although the preferred embodiments have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist thereof.

[0073] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) An exposure apparatus that projects an image of a pattern on an original onto a substrate and exposes the substrate, comprising a projection optical system that guides exposure light that has passed through the original onto the substrate surface of the substrate, and a control unit that controls the exposure, wherein the control unit performs a first exposure process in which the substrate is exposed so that an image of a first pattern formed in a first area of ​​the original is projected onto a predetermined shot area on the substrate surface, and a second exposure process in which the substrate is exposed so that an image of a second pattern formed in a second area of ​​the original is projected while overlapping at least a portion of the latent image formed in the predetermined shot area in the first exposure process. (Configuration 2) An exposure apparatus according to configuration 1, wherein the first and second patterns have the same shape. (Configuration 3) An exposure apparatus according to configuration 1 or 2, characterized in that it comprises an original stage that can move while holding an original, and a substrate stage that can move while holding a substrate, and the first and second exposure processes each include a process of performing exposure while the original stage and the substrate stage are each stationary. (Configuration 4) An exposure apparatus according to configuration 1 or 2, characterized in that it comprises an original stage that can move while holding an original, and a substrate stage that can move while holding a substrate, and the first and second exposure processes each include a process of performing exposure while the original stage and the substrate stage are scanned synchronously with each other. (Configuration 5) An exposure apparatus according to any one of configurations 1 to 4, wherein the control unit performs a measurement step of measuring a latent image formed in a predetermined shot area in the first and second exposure steps. (Configuration 6) An exposure apparatus according to Configuration 5, wherein the control unit performs a determination step of determining whether the contrast of the latent image measured in the measurement step is equal to or greater than a predetermined contrast. (Configuration 7) An exposure apparatus according to Configuration 6, wherein the control unit performs the first and second exposure steps again when it determines in the determination step that the contrast is not equal to or greater than a predetermined contrast. (Configuration 8) An exposure apparatus according to Configuration 6 or 7, characterized in that when the control unit determines in the judgment process that the contrast is equal to or greater than a predetermined contrast, it performs a process of calculating a value of a predetermined optical performance of the projection optical system based on the measured latent image. (Configuration 9) An exposure apparatus according to configuration 8, wherein the predetermined optical performance is distortion. (Structure 10) An exposure apparatus that projects an image of a pattern on an original onto a substrate and exposes the substrate, comprising: a projection optical system that guides exposure light that has passed through the original onto the substrate surface of the substrate; and a control unit that performs an exposure process multiple times to expose the substrate so that an image of a first pattern formed in a first region of the original is projected onto a first shot area on the substrate surface, and then exposes the substrate so that an image of a second pattern formed in a second region of the original is projected onto a second shot area on the substrate surface. (Configuration 11) An exposure apparatus according to Configuration 10, comprising an original stage that can move while holding an original, and a substrate stage that can move while holding a substrate, and characterized in that the exposure process includes a process of exposing the first shot area and the second shot area while the original stage and the substrate stage are both stationary. (Configuration 12) An exposure apparatus according to Configuration 10, comprising an original stage that can move while holding an original, and a substrate stage that can move while holding a substrate, wherein the exposure process includes a process of exposing the first shot area and the second shot area while the original stage and the substrate stage are scanned synchronously with each other. (Configuration 13) An exposure apparatus according to any one of Configurations 10 to 12, wherein the first and second patterns have the same shape. (Configuration 14) An exposure apparatus described in any one of configurations 10 to 13, characterized in that the control unit performs a measurement process to measure a first latent image formed in a first shot area and a second latent image formed in a second shot area during the exposure process. (Configuration 15) An exposure apparatus according to configuration 14, wherein the control unit performs a determination step of determining whether the contrast of each of the first and second latent images measured in the measurement step is equal to or greater than a predetermined contrast. (Configuration 16) An exposure device according to Configuration 15, characterized in that the control unit performs exposure corresponding to at least one of the latent images when it determines in the judgment process that at least one of the contrasts of the first and second latent images is not a predetermined contrast or higher. (Configuration 17) An exposure apparatus described in Configuration 15 or 16, characterized in that when the control unit determines in the judgment process that the contrast of each of the first and second latent images is equal to or greater than a predetermined contrast, it performs a calculation process to calculate a value of a predetermined optical performance of the projection optical system based on the measured first and second latent images. (Configuration 18) An exposure apparatus according to Configuration 17, characterized in that the calculation process includes a process of calculating a first value of a predetermined optical performance based on a measured first latent image, a process of calculating a second value of the predetermined optical performance based on a measured second latent image, and a process of calculating an average value of the calculated first and second values. (Configuration 19) An exposure apparatus according to configuration 17 or 18, wherein the predetermined optical performance is distortion. (Method 1) A method for manufacturing an article, comprising the steps of exposing a substrate using the exposure apparatus described in any one of configurations 1 to 19 and developing the exposed substrate, wherein the article is manufactured from the developed substrate. (Method 2) An exposure method for projecting an image of a pattern on an original onto a substrate and exposing the substrate, comprising: a first exposure step for exposing the substrate so that an image of a first pattern formed in a first region of the original is projected onto a predetermined shot area on the substrate surface of the substrate; and a second exposure step for exposing the substrate so that an image of a second pattern formed in a second region of the original is projected while overlapping at least a portion of the latent image formed in the predetermined shot area in the first exposure step. (Method 3) An exposure method for projecting an image of a pattern on an original onto a substrate and exposing the substrate, characterized in that it includes a step of performing an exposure step multiple times in which the substrate is exposed so as to project an image of a first pattern formed in a first region of the original onto a first shot region on the substrate surface, and then the substrate is exposed so as to project an image of a second pattern formed in a second region of the original onto a second shot region on the substrate surface. [Explanation of symbols]

[0074] 4 Mask (original) 4-1, 4-2, 4-3, 4-4, 4-5 Evaluation patterns (first and second patterns) 6 Projection optical system 7. Circuit Board 9 Control Unit 10 Exposure equipment

Claims

1. An exposure apparatus that projects an image of a pattern of an original onto a substrate and exposes the substrate, a projection optical system that guides exposure light that has passed through the original onto a substrate surface of the substrate; a control unit that controls the exposure; Equipped with The control unit a first exposure step of exposing the substrate to light so that an image of a first pattern formed in a first region of the original is projected onto a predetermined shot region on the substrate surface; a second exposure step of exposing the substrate to light so that an image of a second pattern formed in a second region of the original is projected onto the substrate while overlapping at least a portion of the latent image formed in the predetermined shot region in the first exposure step; An exposure apparatus characterized by performing the above.

2. 2. An exposure apparatus according to claim 1, wherein the first and second patterns have the same shape.

3. an original stage that is movable while holding the original; a substrate stage that is movable while holding the substrate; Equipped with 2. The exposure apparatus according to claim 1, wherein the first and second exposure steps each include a step of performing the exposure while the original stage and the substrate stage are kept stationary.

4. an original stage that is movable while holding the original; a substrate stage that is movable while holding the substrate; Equipped with 2. An exposure apparatus according to claim 1, wherein the first and second exposure steps each include a step of performing the exposure while the original stage and the substrate stage are scanned synchronously with each other.

5. 2. The exposure apparatus according to claim 1, wherein the control unit performs a measurement step of measuring the latent image formed in the predetermined shot area in the first and second exposure steps.

6. 6. The exposure apparatus according to claim 5, wherein the control unit performs a determination step of determining whether the contrast of the latent image measured in the measurement step is equal to or greater than a predetermined contrast.

7. 7. The exposure apparatus according to claim 6, wherein the control unit performs the first and second exposure steps again when it determines in the determination step that the contrast is not equal to or greater than the predetermined contrast.

8. 7. The exposure apparatus according to claim 6, wherein the control unit, when determining in the determination step that the contrast is equal to or greater than the predetermined contrast, performs a step of calculating a value of a predetermined optical performance of the projection optical system based on the measured latent image.

9. 9. An exposure apparatus according to claim 8, wherein the predetermined optical performance is distortion.

10. An exposure apparatus that projects an image of a pattern of an original onto a substrate and exposes the substrate, a projection optical system that guides exposure light that has passed through the original onto a substrate surface of the substrate; a control unit that performs an exposure process a plurality of times, in which the substrate is exposed to light so that an image of a first pattern formed in a first region of the original is projected onto a first shot region on the substrate surface, and then the substrate is exposed to light so that an image of a second pattern formed in a second region of the original is projected onto a second shot region on the substrate surface; An exposure apparatus comprising:

11. an original stage that is movable while holding the original; a substrate stage that is movable while holding the substrate; Equipped with 11. The exposure apparatus according to claim 10, wherein the exposure step includes a step of performing the exposure of the first shot area and the exposure of the second shot area while the original stage and the substrate stage are both stationary.

12. an original stage that is movable while holding the original; a substrate stage that is movable while holding the substrate; Equipped with 11. The exposure apparatus according to claim 10, wherein the exposure step includes a step of performing the exposure of the first shot area and the exposure of the second shot area while the original stage and the substrate stage are scanned synchronously with each other.

13. 11. The exposure apparatus according to claim 10, wherein the first and second patterns have the same shape.

14. 11. The exposure apparatus according to claim 10, wherein the control unit performs a measurement step of measuring a first latent image formed in the first shot area and a second latent image formed in the second shot area in the exposure step.

15. 15. The exposure apparatus according to claim 14, wherein the control unit performs a determination step of determining whether the contrast of each of the first and second latent images measured in the measurement step is equal to or greater than a predetermined contrast.

16. 16. The exposure apparatus according to claim 15, wherein the control unit performs the exposure corresponding to at least one of the first and second latent images when it determines in the determination step that at least one of the contrasts of the first and second latent images is not equal to or greater than the predetermined contrast.

17. 16. The exposure apparatus according to claim 15, wherein the control unit, when determining in the determination step that the contrast of each of the first and second latent images is equal to or greater than the predetermined contrast, performs a calculation step of calculating a value of a predetermined optical performance of the projection optical system based on the measured first and second latent images.

18. The calculation step calculating a first value of the predetermined optical performance based on the measured first latent image; calculating a second value of the predetermined optical performance based on the measured second latent image; calculating an average value of the calculated first and second values; 18. The exposure apparatus according to claim 17, comprising:

19. 18. An exposure apparatus according to claim 17, wherein the predetermined optical performance is distortion.

20. exposing a substrate by an exposure apparatus according to any one of claims 1 to 19; developing the exposed substrate; Including, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

21. An exposure method for projecting an image of a pattern of an original onto a substrate and exposing the substrate, comprising: a first exposure step of exposing the substrate so that an image of a first pattern formed in a first region of the original is projected onto a predetermined shot region on a surface of the substrate; a second exposure step of exposing the substrate to light so that an image of a second pattern formed in a second region of the original is projected onto the substrate while overlapping at least a portion of the latent image formed in the predetermined shot region in the first exposure step; An exposure method comprising:

22. An exposure method for projecting an image of a pattern of an original onto a substrate and exposing the substrate, comprising: an exposure method comprising a step of exposing the substrate multiple times to project an image of a first pattern formed in a first region of the original onto a first shot region on the substrate surface, and then exposing the substrate to project an image of a second pattern formed in a second region of the original onto a second shot region on the substrate surface.

Images