Apparatus for detecting internal position of chamber in wafer processing system

Abstract

To provide an apparatus for detecting internal positions of a chamber in a wafer processing system.SOLUTION: There is presented an object detection apparatus used to detect an object in a chamber of a wafer processing system. An apparatus for detecting object positions in a chamber of a wafer processing system includes: a body frame comprising a sensing part and an indicating part, the sensing part including at least one sensor for sensing positions of objects in a chamber, the indicating part including at least one signal part for indicating detection of the objects, each of the at least one sensor corresponding to each of the at least one signal part; and a power unit disposed in the body frame and configured to supply power to the at least one signal part. With this apparatus, work such as teaching can be done without opening the chamber or lowering the temperature of the chamber, so that work time can be significantly reduced and energy can be saved.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure generally relates to an apparatus that can be disposed in an end effector of a wafer processing chamber. More specifically, exemplary embodiments of the present disclosure relate to a position detection apparatus that can detect the interior of a chamber in a wafer processing apparatus for transferring a substrate, and a substrate processing apparatus that includes an end effector. [Background technology]

[0002] Currently, most of the equipment and devices used to process wafers in the semiconductor industry utilize high temperatures to process the wafers, and consistent temperature is important in that the quality of the wafer can be determined by the temperature of the wafer.

[0003] Therefore, it can be important to retain the heat within the chamber and not lose it. If the chamber loses heat (i.e., drops in temperature), it will take a long time to recover to its previous temperature.

[0004] Therefore, the time taken can be significantly reduced by performing the operation without opening the chamber or reducing the temperature. The present disclosure presents an apparatus for detecting the location of parts in a chamber that is either invisible or requires time to actually open and view. Summary of the Invention

[0005] This Summary is provided to introduce a selection of concepts in a simplified form that are described in more detail below in the Detailed Description of Exemplary Embodiments of this Disclosure. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. [Means for solving the problem]

[0006] According to one embodiment, there may be provided an apparatus for detecting the position of an object within a chamber of a wafer processing system, the apparatus comprising: a body frame having a sensing unit and a display unit, wherein the sensing unit includes at least one sensor for sensing the position of an object within the chamber, and the display unit includes at least one signal unit for displaying the detection of the object, each of the at least one sensor corresponding to each of the at least one signal unit; and a power unit disposed within the body frame and configured to supply power to the at least one signal unit.

[0007] In one aspect, the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

[0008] In one aspect, the body frame further comprises at least one recessed groove disposed on one side of the body frame and configured to attach the body frame to an end effector of a robotic arm.

[0009] In one embodiment, the at least one sensor is an optical sensor or a mechanical push switch.

[0010] In one embodiment, at least one signal portion is an LED (light-emitting diode).

[0011] In one embodiment, each of the at least one sensor further comprises a sealing lid configured to seal the sensor from the environment within the chamber.

[0012] According to another embodiment, there may be provided an apparatus for detecting the position of an object within a chamber of a wafer processing system, the apparatus comprising: a body frame having a sensing unit and a display unit, wherein the sensing unit includes a plurality of sensors for sensing the position of an object within the chamber; the display unit includes a plurality of signal units for displaying the detection of the object, each of the plurality of sensors being connected to a respective one of the plurality of signal units, and wherein when an object is detected by the first sensor, the first signal unit connected to the first sensor is configured to light up to indicate the detected position; a processor disposed within the body frame and connected to each of the plurality of sensors and configured to calculate the position of the sensed object within the chamber; and a power unit disposed within the body frame and configured to supply power to the plurality of signal units.

[0013] In one aspect, the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

[0014] In one aspect, the body frame further comprises at least one recessed groove line disposed on one side of the body frame and configured to attach the body frame to an end effector of a robotic arm.

[0015] In one embodiment, the plurality of sensors are one of optical sensors or mechanical push switches, and the plurality of signal portions are LEDs.

[0016] In one aspect, each of the plurality of sensors further comprises a sealing lid configured to seal the sensor from the environment within the chamber.

[0017] According to another embodiment, there may be provided an apparatus for detecting the position of an object within a chamber of a wafer processing system, the apparatus comprising: a main body frame having a sensing unit and a display unit, wherein the sensing unit includes a plurality of sensors for sensing the position of an object within the chamber; the display unit includes a plurality of signal units for displaying the detection of the object, each of the plurality of sensors being connected to a respective one of the plurality of signal units, and wherein when an object is detected by the first sensor, the first signal unit connected to the first sensor is configured to light up to indicate the detected position; a communication unit disposed within the main body frame and connected to the plurality of sensors, the communication unit configured to transmit position information of the detected object; and a power unit disposed within the main body frame and configured to supply power to the plurality of signal units.

[0018] In another aspect, the apparatus further comprises a processor disposed within the body frame, connected to each of the plurality of sensors, and configured to calculate a position of a sensed object within the chamber.

[0019] In another aspect, the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

[0020] In another aspect, the body frame further comprises at least one recessed groove disposed on an underside of the body frame and configured to attach the body frame to an end effector of a robotic arm.

[0021] In another embodiment, the plurality of sensors is one of optical sensors or mechanical push switches.

[0022] In another embodiment, the plurality of signal portions are LEDs.

[0023] In another aspect, each of the plurality of sensors further comprises a sealing lid configured to seal the sensor from the environment within the chamber.

[0024] In another aspect, the processor further comprises a memory for storing data.

[0025] BRIEF DESCRIPTION OF THE DRAWINGS It should be understood that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of exemplary embodiments of the present disclosure. [Brief explanation of the drawings]

[0026] [Figure 1] 1 illustrates an overview of an object detection device mounted and attached on an end effector, according to one embodiment of the present disclosure. [Figure 2(a)] 2 shows a front view of the device as viewed from arrow A in FIG. 1 according to one embodiment of the present disclosure. [Figure 2(b)] 2 shows a side view of the device as viewed from arrow B in FIG. 1 according to one embodiment of the present disclosure. [Figure 3] 10 illustrates another configuration of an object detection device according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0027] DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS While certain specific embodiments and examples are disclosed below, it will be understood by those skilled in the art that the scope of the invention extends beyond the specifically disclosed embodiments of the invention and / or uses of the invention, and obvious variations and equivalents thereof. It is therefore not intended that the scope of the disclosed invention should be limited by the specific disclosed embodiments described below.

[0028] As used in this disclosure, the term "substrate" may refer to any underlying material or materials, including any underlying material or materials that may be modified or upon which a device, circuit, or film may be formed. A "substrate" may be continuous or discontinuous, rigid or flexible, solid or porous, and combinations thereof. The substrate may be in any form, such as a powder, plate, or workpiece. Substrates in plate form may include wafers of various shapes and sizes. The substrate may be made of semiconductor materials, including, for example, silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide.

[0029] As an example, the substrate in powder form may have applications in pharmaceutical manufacturing. The porous substrate may comprise a polymer. Examples of workpieces may include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components for photovoltaic cells.

[0030] The continuous substrate may extend beyond the boundaries of the process chamber in which the deposition process occurs. In some processes, the continuous substrate may move through the process chamber, allowing the process to continue until the edge of the substrate is reached. The continuous substrate may be supplied from a continuous substrate supply system to enable the production and output of the continuous substrate in any suitable form.

[0031] Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, webs, flexible materials, bundles of continuous filaments or fibers (e.g., ceramic fibers or polymeric fibers). Continuous substrates may also include carriers or sheets onto which discontinuous substrates are placed.

[0032] The examples presented in this disclosure are not intended to be actual manifestations of any particular materials, structures, or devices, but merely conceptual representations used to describe embodiments of the present disclosure.

[0033] The specific implementations shown and described are illustrative of the present invention and its best mode and are not intended to limit the scope of aspects and implementations in any way. Also, for simplicity, conventional manufacturing, connection, arrangement, and other functional aspects of systems may not be described in detail. Furthermore, connecting lines shown in the various figures are intended to represent example functional relationships and / or physical couplings between the various elements. Many alternative or additional functional relationships or physical connections may be present in an actual system and / or may not be present in some embodiments.

[0034] It should be understood that the configurations and / or approaches described in this disclosure are exemplary in nature, and that these specific embodiments or examples are not to be taken in a limiting sense, as numerous variations are possible. The specific routines or methods described in this disclosure may represent one or more of any number of process strategies. As such, the various illustrated operations may be performed in the order illustrated, in other orders, or in some cases omitted.

[0035] The subject matter of this disclosure includes all novel and non-obvious combinations and subcombinations of the various processes, systems, and configurations, as well as other features, functions, operations and / or properties disclosed in this disclosure, and all equivalents thereof.

[0036] FIG. 1 shows a top view of an object detection device according to one embodiment of the present disclosure.

[0037] The object detection device 100 may include a body frame 105. The body frame 105 may include a sensing unit 110 and a display unit 130. In some cases, the body frame 105 may also include a coupling unit 120 that may connect the sensing unit 110 and the display unit 130. The shape of the device 100 may vary, but the thickness of the device 100 should not significantly exceed the thickness of the end effector 140 that is placed and attached on the device 100.

[0038] Typically, end effectors are 4-5 mm thick, so the thickness of the device 100 should not exceed two or three times the thickness of the end effector 140. This limit is preset by the operator or any other person before operating the device 100.

[0039] In the sensing section 110, two or more sensors 115 may be positioned on the front and sides of the device 100, as shown in FIG. 1. The number of sensors may vary depending on the system and environment. Five sensors are shown as an example in FIG. 1. The five sensors may be positioned and named YC (Y-center), YL (Y-left), YR (Y-right), XL (X-left), and XR (X-right). In the display section 130, five signal sections (135) are positioned, and the number of signal sections is the same as the number of sensors. Each sensor and signal unit with the same name (YC, YL, YR, XL, XR) can be connected to each other so that, for example, sensor YC can sense an object while placed on the end effector 140 and moving around, and then signal unit YC will light up so that the operator or any person can know that sensor YC has sensed something while moving, or this information (sensed object position information) will be stored (by wireless data transmission) in a unit (not shown) inside or outside the device 100.

[0040] The device 100 may be mounted and attached to an end effector 140 , although the length of the device 100 and end effector 140 suggests that the device 100 is also mounted on a robotic arm 150 .

[0041] FIG. 2(a) shows a front view (in the direction of arrow A) of the device 100 of FIG.

[0042] When viewed in the direction of arrow A, device 100 may appear as shown in FIG. 2(a).

[0043] The sensing unit 110 may include sensors (115A, 115B, 115C) disposed on the front side. The main body frame (sensing unit 110 in this figure) may include two or more recessed groove lines 250. In Figure 2(a), there are two groove lines 250 because the end effector 240 has two blades, and the number of groove lines may vary depending on the number of end effector blades.

[0044] When the device 100 can be placed on the end effector 240 as shown in Figure 2(a), the blade 240 can fit into the concave groove line 250. The fit can be tight enough to withstand the end effector (and the device) moving through the chamber.

[0045] FIG. 2( b ) shows a side view of the device 100 in the direction of arrow B.

[0046] From the side, sensor 115D may be seen on the side of sensing portion 111, and one of the end effectors 241 is also shown. Although not visible from this angle, the previously described recessed groove 251 may be present to hold end effector 241 securely.

[0047] The sensors 115, 115A-115D may be any sensing utility, including optical sensors. However, temperatures can be very high in wafer processing environments, and optical sensors may not function well in high-temperature environments. Therefore, mechanical pressure switches may also be used in this embodiment. The pressure switches turn on when pressed and turn off when pressure is removed.

[0048] In a real environment, sensors 115, 115A-115D may not be exposed to harsh conditions (high temperature, plasma, vacuum), so additional sealing may be used to protect the sensors. In Figure 3, sensor 315 is shown, along with a sealing lid 316 for sensor 315. Other sensors also have a similar sealing setup.

[0049] For example, the signal portion 135 can be a simple LED so that when a sensor (YC) is turned on, the corresponding signal portion (YC) lights up while the sensor (YC) is on.

[0050] A power unit for the sensor and / or signaling functions may be provided inside device 100. In Figure 3, power unit 360 may be inside display portion 330, but may also be in coupling portion 320 or sensing portion 310. Any electrical lines and / or wires may be installed inside device 100 so that there are no wires hanging from device 100.

[0051] Typically, an operator and / or user may have to monitor the movement of the end effector 140 along with the device 100 to see if an LED light comes on during movement. However, if the processor 370 can be installed to monitor the location where the sensor turns on, the resulting object in the chamber may be drawn or dotted / printed from the processor, so that constant human supervision may not be required.

[0052] The processor 370 may be any computing device such as a microprocessor, a CPU (central processing unit), a GPU (graphics processing unit), etc. This processor 370 may have a memory 371 therewith. The only limitation may be that it must be small enough to be included inside the device 100.

[0053] In other situations, detected object data (such as location information, information about where the object encountered device 100, etc.) may be transmitted externally for review and / or storage, which means that communication unit 380 may be provided internal to device 100. While it may be better to use processor 370 or communication unit 380 mutually exclusively, in some applications both may be provided and used.

[0054] The power unit 360 can be any type of battery, such as a secondary battery, a rechargeable battery, or a regular battery.

[0055] The above-described arrangements of the devices are merely illustrative of the application of the principles of the present invention, and numerous other embodiments and modifications are possible without departing from the spirit and scope of the invention as defined in the appended claims. The scope of the invention should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims along with their full scope of equivalents.

Claims

1. 1. An apparatus for detecting an object position within a chamber of a wafer processing system, comprising: A main body frame including a sensing unit and a display unit, the sensing portion includes at least one sensor for sensing the position of an object within the chamber; the indicator includes at least one signal for indicating detection of the object; a main body frame, each of the at least one sensor corresponding to each of the at least one signal unit; a power unit disposed within the body frame and configured to supply power to the at least one signal portion.

2. The device of claim 1 , wherein the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

3. The main body frame is The apparatus of claim 1 , further comprising at least one recessed groove disposed on one side of the body frame and configured to attach the body frame to an end effector of a robotic arm.

4. The device of claim 1 , wherein the at least one sensor is an optical sensor or a mechanical push switch.

5. The device of claim 1 , wherein the at least one signaling element is an LED.

6. The apparatus of claim 1 , wherein each of the at least one sensor further comprises a sealing lid configured to seal the sensor from an environment within the chamber.

7. 1. An apparatus for detecting an object position within a chamber of a wafer processing system, comprising: A main body frame including a sensing unit and a display unit, the sensing unit includes a plurality of sensors for sensing the position of an object within the chamber; the indicator includes a plurality of signal units for indicating detection of the object; each of the plurality of sensors is connected to each of the plurality of signal units; a main body frame configured such that, when an object is detected by a first sensor, a first signal unit connected to the first sensor lights up to indicate a detected position; a processor disposed within the body frame, connected to each of the plurality of sensors, and configured to calculate a position of a sensed object within the chamber; a power unit disposed within the body frame and configured to supply power to the plurality of signal sections.

8. The device of claim 7 , wherein the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

9. The main body frame is The apparatus of claim 7 , further comprising at least one recessed groove disposed on one side of the body frame and configured to attach the body frame to an end effector of a robotic arm.

10. the plurality of sensors are one of optical sensors or mechanical push switches; The device of claim 7 , wherein the plurality of signaling units are LEDs.

11. The apparatus of claim 7 , wherein each of the plurality of sensors further comprises a sealing lid configured to seal the sensor from an environment within the chamber.

12. 1. An apparatus for detecting an object position within a chamber of a wafer processing system, comprising: A main body frame including a sensing unit and a display unit, the sensing unit includes a plurality of sensors for sensing the position of an object within the chamber; the indicator includes a plurality of signal units for indicating detection of the object; each of the plurality of sensors is connected to each of the plurality of signal units; a main body frame configured such that, when an object is detected by a first sensor, a first signal unit connected to the first sensor lights up to indicate a detected position; a communication unit disposed within the body frame and connected to the plurality of sensors, the communication unit configured to transmit position information of sensed objects; a power unit disposed within the body frame and configured to supply power to the plurality of signal sections.

13. 13. The apparatus of claim 12, further comprising: a processor disposed within the body frame, connected to each of the plurality of sensors, and configured to calculate a position of a sensed object within the chamber.

14. The device of claim 12 , wherein the body frame further comprises a coupling portion configured to connect the sensing portion and the display portion.

15. The main body frame is The apparatus of claim 12 , further comprising at least one recessed groove disposed on an underside of the body frame and configured to attach the body frame to an end effector of a robotic arm.

16. The apparatus of claim 12 , wherein the plurality of sensors are one of optical sensors or mechanical push switches.

17. The device of claim 12 , wherein the plurality of signaling portions are LEDs.

18. The apparatus of claim 12 , wherein each of the plurality of sensors further comprises a sealing lid configured to seal the sensor from an environment within the chamber.

19. The apparatus of claim 7 , wherein the processor further comprises a memory for storing data.

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