Soldering device

Abstract

To provide a soldering device which can inhibit occurrence of soldering defects caused by insufficient heat.SOLUTION: A soldering device 1 includes: a sleeve 11 which is formed into a cylindrical shape and melts a solder piece H supplied to the inside; a heater 12 which is provided at the outer side of the sleeve, has a heating component 122, and heats the sleeve; a discharge hole 13 which is formed including a sleeve through hole 111 which is formed penetrating through the sleeve; and a cylindrical member 31 which is formed in a cylindrical shape, has one end located in the discharge hole, and is to be used to discharge fume, occurring when the solder piece is melted in the sleeve, to the outside of the sleeve. At least a part of the heating component is located closer to a tip side of the sleeve than the discharge hole.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a soldering apparatus. [Background technology]

[0002] A known soldering device has a configuration including a sleeve, which is a cylindrical soldering iron, as disclosed in Patent Document 1. The sleeve is heated by a heater located outside the sleeve, thereby melting solder pieces supplied into the sleeve, thereby soldering terminals to a board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5184359 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, substrates with large heat capacity, such as thick copper substrates, have been attracting attention for their compatibility with high-current applications. When soldering such substrates, soldering defects caused by insufficient heating of the solder have become a problem. Therefore, there is a need to improve the heat transfer efficiency of the solder to prevent soldering defects.

[0005] The present disclosure has been made in consideration of the above-mentioned problems, and its purpose is to provide a soldering device that can suppress the occurrence of soldering defects due to insufficient heat. [Means for solving the problem]

[0006] In order to achieve the above object, one embodiment of a soldering device comprises a sleeve (11) formed in a cylindrical shape and melting solder pieces (H) supplied inside, a heater (12) provided on the outside of the sleeve and having a heat-generating component (122) for heating the sleeve, a discharge hole (13) formed including a sleeve through-hole (111) formed through the sleeve, and a cylindrical member (31) formed in a cylindrical shape with one end located inside the discharge hole for discharging fumes generated when the solder pieces melt inside the sleeve to the outside of the sleeve, and at least a portion of the heat-generating component is located closer to the tip of the sleeve than the discharge hole.

[0007] This can prevent the occurrence of defective soldering due to insufficient heat. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram schematically illustrating an example of the configuration of a soldering apparatus according to a first embodiment. [Figure 2] FIG. 10 is a cross-sectional view showing a schematic relationship between the dimensions of the discharge hole and the dimensions of the cylindrical member when the sleeve through-hole has a stepped shape in the soldering device according to the first embodiment; [Figure 3] 1A is a cross-sectional view showing an example of a case in which the heater through-hole is formed in a stepped shape in the soldering device according to the first embodiment; FIG. 1B is a cross-sectional view showing the state in which the cylindrical member is attached to the heater; [Figure 4] FIG. 10 is a diagram schematically illustrating an example of the configuration of a soldering apparatus according to a second embodiment. [Figure 5] FIG. 10 is a diagram schematically illustrating an example of the configuration of a soldering apparatus according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, several embodiments will be described with reference to the drawings. Note that substantially the same components in each embodiment will be denoted by the same reference numerals, and the description thereof will be omitted.

[0010] (First embodiment) First, the first embodiment will be described with reference to FIGS. The soldering apparatus 1 shown in Fig. 1 is an apparatus for soldering a terminal 91 of an electronic component into a land 902 provided in a through-hole 901 formed in a substrate 90, which may be, for example, a printed circuit board. The soldering apparatus 1 is applicable to a so-called soldering method, in which soldering is performed by bringing a cylindrical sleeve 11 into contact with the substrate 90 and melting a solder piece H inside the sleeve 11. An electronic component 92, including, for example, a microcomputer or a switching element such as a transistor or MOSFET, is mounted on the surface of the substrate 90 to be soldered.

[0011] The soldering apparatus 1 includes a sleeve unit 10. The sleeve unit 10 is supported in a floating state by, for example, a moving mechanism (not shown) that moves the sleeve unit 10 vertically and horizontally. As shown in FIG. 1, the sleeve unit 10 includes a sleeve 11, a heater 12, a solder piece supply unit 20, and a cylindrical member 31. The sleeve 11 is made of ceramic, such as aluminum nitride or silicon carbide, and has high heat resistance and thermal conductivity. The sleeve 11 is formed in a cylindrical shape, for example, a cylinder, extending vertically, and has a space inside.

[0012] The heater 12 is formed in a cylindrical shape, for example, a cylindrical shape, extending in the vertical direction, and has a space inside. The heater 12 is provided on the outside of the sleeve 11. In this case, the heater 12 covers the entire outer circumferential surface of the sleeve 11 in a portion of the longitudinal direction of the sleeve 11. The lower end, i.e., the tip end, of the heater 12 is located higher than the lower end, i.e., the tip end, of the sleeve 11. In this specification, the tip side of the sleeve 11 means the side that contacts the substrate 90 during soldering, while the base end side of the sleeve 11 means the side opposite to the side that contacts the substrate 90 during soldering.

[0013] The heater 12 heats the sleeve 11. The heater 12 includes a heater body 121 and a heat-generating component 122. The heater body 121 constitutes the main body of the heater 12. The heater body 121 is made of, for example, ceramic and has high heat resistance and thermal conductivity. The heat-generating component 122 is housed inside the heater body 121. The heat-generating component 122 may be exposed on the inner or outer circumferential surface of the heater body 121. The heat-generating component 122 includes a component that generates heat when electricity is applied, such as a heating wire. The heat-generating component 122 is located near the tip of the sleeve 11. When power is supplied to the heater 12 by a control device (not shown), the heat-generating component 122 generates heat and heats the sleeve 11. The sleeve 11 is heated to approximately 400 to 600 degrees by the heater 12. The heating temperature of the sleeve 11 is set to an appropriate temperature depending on the substrate 90 to be soldered.

[0014] The solder piece supply unit 20 supplies the solder piece H into the inside of the sleeve 11. The solder piece supply unit 20 is connected to the base end side of the sleeve 11. The solder piece supply unit 20 has a cutting unit (not shown) that cuts the solder wire (not shown) into solder pieces H. The solder pieces H cut by the cutting unit are then dropped into the inside of the sleeve 11. In this manner, the solder piece H is supplied from the solder piece supply unit 20 into the inside of the sleeve 11. Then, when the solder piece H is supplied from the solder piece supply unit 20 into the inside of the sleeve 11 with the sleeve 11 placed over the terminal 91 inserted into the land 902, the solder piece H is supported in a predetermined position by the inner circumferential surface of the sleeve 11 and the upper end of the terminal 91, as shown in FIG. 1 .

[0015] The solder piece H supplied to the inside of the sleeve 11 melts through the sleeve 11 heated by the heater 12. As a result, the terminal 91 inserted into the land 902 is soldered by the molten solder piece H. Although a detailed description is omitted as this is a well-known configuration, during soldering, an inert gas such as nitrogen gas is supplied to the inside of the sleeve 11 to prevent oxidation of the solder and terminal 91.

[0016] 1, during soldering, a melting area S where the solder piece H melts is formed inside the sleeve 11. In this embodiment, the heat-generating component 122 is arranged so as to overlap the melting area S in the direction in which the sleeve 11 extends, i.e., the longitudinal direction. The vertical length of the melting area S is set to be equal to or less than the length t2 of the solder piece H. The height of the upper end of the melting area S from the substrate 90 is the sum of the amount of protrusion t1 of the terminal 91 from the through-hole 901 and the length t2 of the solder piece H.

[0017] In this embodiment, the sleeve 11 has a sleeve through-hole 111 formed therein. The sleeve through-hole 111 is formed to penetrate the sleeve 11 in the thickness direction. The sleeve through-hole 111 extends, for example, in a direction perpendicular to the longitudinal direction of the sleeve 11. The sleeve through-hole 111 communicates between the inside and the outside of the sleeve 11. The heater 12 has a heater through-hole 123 formed at a position opposite the sleeve through-hole 111. The heater through-hole 123 is formed to penetrate the heater 12 in the thickness direction. The heater through-hole 123 extends, for example, in a direction perpendicular to the longitudinal direction of the sleeve 11. The heater through-hole 123 communicates between the inside and the outside of the heater 12. The sleeve through-hole 111 and the heater through-hole 123 may be configured to extend at an angle relative to the direction perpendicular to the longitudinal direction of the sleeve.

[0018] 1, the sleeve through-hole 111 and the heater through-hole 123 are provided so as to be located above the melting region S. In this case, the heater through-hole 123 is located above, for example, the heat-generating component 122. The heater through-hole 123 may be formed so as to penetrate the heat-generating component 122.

[0019] The sleeve through-hole 111 and the heater through-hole 123 are aligned coaxially, for example. The sleeve through-hole 111 and the heater through-hole 123 each constitute a part of the discharge hole 13. The discharge hole 13 connects the inside and outside of the sleeve 11 and the heater 12. The discharge hole 13 is located above the melting region S, in this case, on the base end side of the sleeve 11. That is, at least a part of the heat-generating component 122 is located below the discharge hole 13, i.e., on the tip end side of the sleeve 11. In this embodiment, the heat-generating component 122 is located below the discharge hole 13.

[0020] The sleeve through-hole 111 and the heater through-hole 123 may not be aligned coaxially. A plurality of discharge holes 13 may be provided. That is, a plurality of sleeve through-holes 111 and heater through-holes 123 may be provided. Furthermore, if the upper end of the heater 12 is positioned lower than the sleeve through-hole 111, the discharge hole 13 may be formed by the sleeve through-hole 111 without including the heater through-hole 123. In this case, the heater 12 may be configured without the heater through-hole 123.

[0021] 2, the sleeve through-hole 111 is formed in a stepped shape with a diameter Ds1 on the outer surface side that is larger than a diameter Ds2 on the inner surface side. Hereinafter, the portion of the sleeve through-hole 111 located on the outer surface side and having the diameter Ds1 may be referred to as the outer sleeve through-hole 111a, and the portion of the sleeve through-hole 111 located on the inner surface side and having the diameter Ds2 may be referred to as the inner sleeve through-hole 111b. In the example of FIG. 2, the heater through-hole 123 is formed as a straight hole with a constant diameter Dh. In this case, the diameter Dh of the heater through-hole 123 is set to be slightly larger than the diameter Ds1 of the outer sleeve through-hole 111a.

[0022] The tubular member 31 is made of a metal or non-metallic material, such as heat-resistant synthetic resin or ceramic. The tubular member 31 is formed in a cylindrical shape, e.g., a hollow pin. The tubular member 31 can also be made of a flexible hose member. As shown in FIG. 1 , one end of the tubular member 31 is located inside the discharge hole 13. In this case, the tubular member 31 is arranged to straddle the sleeve through-hole 111 and the heater through-hole 123. This allows the tubular member 31 to bear the weight of the sleeve 11. The other end of the tubular member 31 is attached to a positioning portion (not shown). The positioning portion has the function of positioning the tubular member 31 at a predetermined position on the sleeve 11 by biasing one end of the tubular member 31 against the sleeve 11. In this case, one end of the tubular member 31 is positioned by pressing it against, for example, a portion of the sleeve 11 that constitutes the outer end of the sleeve inner through-hole 111b. In other words, one end of the cylindrical member 31 is pressed against the portion that constitutes the inner end of the sleeve outer through-hole 111a, and is thereby positioned.

[0023] In this embodiment, the sleeve inner through-hole 111b and the cylindrical member 31 form an exhaust path 14 for exhausting fumes to the outside. As indicated by the black arrow A in FIG. 1 , fumes generated when the solder piece H melts inside the sleeve 11 are exhausted to the outside of the sleeve 11 and heater 12 via the exhaust path 14. The cylindrical member 31 can be configured to have the function of pressing the outer surface of the sleeve 11 against the inner surface of the heater 12 on the side of the sleeve 11 opposite the side with which the cylindrical member 31 contacts. This improves the adhesion of the sleeve 11 to the heater 12, allowing the heat generated by the heater 12 to be efficiently transferred to the sleeve 11.

[0024] 2, the outer diameter Dc of the cylindrical member 31 is set to be slightly smaller than the diameter Ds1 of the sleeve outer through-hole 111a and the diameter Dh of the heater through-hole 123. The inner diameter dc of the cylindrical member 31 is set to be equal to or larger than the diameter Ds2 of the sleeve inner through-hole 111b. Preferably, the inner diameter dc of the cylindrical member 31 is set to be larger than the diameter Ds2 of the sleeve inner through-hole 111b.

[0025] FIG. 2 illustrates a configuration in which the sleeve through hole 111 and the heater through hole 123 that constitute the discharge hole 13 are configured such that the sleeve through hole 111 has a stepped shape. Here, as shown in FIG. 3, the sleeve through hole 111 may be configured as a straight hole with a constant diameter Ds, and the heater through hole 123 may have a stepped shape. In this case, the heater through hole 123 is configured so that its outer diameter Dh1 is larger than its inner diameter Dh2. Hereinafter, the portion of the heater through hole 123 located on the outer side and having the diameter Dh1 may be referred to as the heater outer through hole 123a, and the portion of the heater through hole 123 located on the inner side and having the diameter Dh2 may be referred to as the heater inner through hole 123b. In the example of FIG. 3(a), the diameter Ds of the sleeve through hole 111 is set to be equal to or smaller than the diameter Dh2 of the heater inner through hole 123b, for example. Preferably, the diameter Ds of the sleeve through hole 111 is set smaller than the diameter Dh2 of the heater inner through hole 123b. This makes it possible to prevent fumes discharged from the sleeve through hole 111 from adhering to the inner end of the heater inner through hole 123b, i.e., the contact surface between the sleeve 11 and the heater 12.

[0026] In the example of FIG. 3(a), the outer diameter Dc of the cylindrical member 31 is set slightly smaller than the diameter Dh1 of the heater outer through-hole 123a. The inner diameter dc of the cylindrical member 31 is set equal to or larger than the diameter Dh2 of the heater inner through-hole 123b. Preferably, the inner diameter dc of the cylindrical member 31 is set larger than the diameter Dh2 of the heater inner through-hole 123b. In this case, as shown in FIG. 3(b), one end of the cylindrical member 31 is positioned by being pressed against, for example, a portion of the heater 12 that forms the outer end of the heater inner through-hole 123b. In other words, one end of the cylindrical member 31 is positioned by being pressed against a portion of the heater 12 that forms the inner end of the heater outer through-hole 123a. The discharge path 14 is formed by the sleeve through-hole 111, the heater inner through-hole 123b, and the cylindrical member 31.

[0027] According to the embodiment described above, the soldering apparatus 1 includes a sleeve 11, a heater 12, a discharge hole 13, and a cylindrical member 31. The sleeve 11 is formed in a cylindrical shape and melts the solder piece H supplied therein. The heater 12 is provided on the outside of the sleeve 11, has a heat-generating component 122, and heats the sleeve 11. The discharge hole 13 is formed to include a sleeve through-hole 111 formed by penetrating the sleeve. The cylindrical member 31 is formed in a cylindrical shape and has one end located inside the discharge hole 13. The cylindrical member 31 is used to discharge fumes generated when the solder piece H melts inside the sleeve 11 to the outside of the sleeve 11. At least a portion of the heat-generating component 122 is located closer to the tip of the sleeve 11 than the discharge hole 13.

[0028] This improves the efficiency of heat transfer from the heater 12 to the sleeve 11. This allows fumes generated during soldering to be properly discharged to the outside of the sleeve 11, while suppressing the occurrence of defective soldering due to insufficient heat.

[0029] A melting area S where the solder piece H melts during soldering is formed inside the sleeve 11. The heat-generating component 122 is provided so as to overlap with the melting area S. This further improves the efficiency of heat transfer from the heater 12 to the sleeve 11. This also reduces the time required for soldering.

[0030] Discharge hole 13 is located closer to the base end of sleeve 11 than melting region S. This prevents molten solder generated during soldering from penetrating and accumulating inside discharge hole 13. This prevents discharge hole 13 from losing its fume discharge function.

[0031] The discharge hole 13 is formed by a sleeve through-hole 111 and a heater through-hole 123. The heater through-hole 123 is provided opposite the sleeve through-hole 111 and penetrates the heater 12. The sleeve through-hole 111 or the heater through-hole 123 is formed in a stepped shape in which the outer diameter dimensions Ds1, Dh1 are larger than the inner diameter dimensions Ds2, Dh2.

[0032] This makes it possible to prevent fumes from leaking from the gap between the discharge hole 13 and the cylindrical member 31. This prevents foreign matter contained in the fumes from being ejected from the discharge hole 13 and contaminating the surrounding area.

[0033] Furthermore, the sleeve through-hole 111 and the heater through-hole 123 are aligned coaxially, which simplifies the design management of the discharge hole 13. This improves the workability of assembling the soldering apparatus 1.

[0034] (Second embodiment) Next, a second embodiment will be described with reference to FIG. 4. In this second embodiment, the soldering apparatus 1 differs from the first embodiment in that it includes a smoke suction device 40. The smoke suction device 40 has the function of sucking fumes that have passed through the cylindrical member 31. The smoke suction device 40 can be configured to include, for example, a suction fan. The operation of the smoke suction device 40 is controlled by a control device. The control device operates the smoke suction device 40, for example, while soldering is being performed.

[0035] In this embodiment, as shown in Fig. 4, smoke suction device 40 is indirectly connected to tubular member 31 via intermediate member 41. That is, smoke suction device 40 is provided downstream of tubular member 31 in the flow direction of fumes generated inside sleeve 11. In other words, tubular member 31 is located upstream of smoke suction device 40 in the flow direction of fumes generated inside sleeve 11.

[0036] The intermediate member 41 is for supplying fumes that have flowed into the tubular member 31 to the smoke suction device 40. That is, in this embodiment, the exhaust path 14 is configured to include the intermediate member 41. The intermediate member 41 is made of a metal or non-metallic material, such as a heat-resistant synthetic resin or ceramic, and is configured in a cylindrical shape. One end of the intermediate member 41 is connected to the other end of the tubular member 31, and the other end of the intermediate member 41 is connected to the smoke suction device 40. For example, the tubular member 31 is fitted inside the intermediate member 41 in an airtight state. Note that the smoke suction device 40 may also be configured to be directly connected to the tubular member 31.

[0037] Here, if the tubular member 31 and the smoke suction device 40 are physically connected and the smoke suction device 40 is driven during soldering, the molten solder pieces H may be sucked downstream, which may result in a deterioration in the quality of the soldering.

[0038] Therefore, the smoke suction device 40 is not limited to a configuration in which it is connected to the cylindrical member 31 or the intermediate member 41, but may also be configured to suck in fumes that have passed through the cylindrical member 31 or the intermediate member 41 and been released into the atmosphere. This makes it possible to prevent a deterioration in the quality of the soldering while realizing the release of fumes from inside the sleeve 11.

[0039] The second embodiment as described above provides the same advantageous effects as the first embodiment. In addition, since it is possible to prevent fumes generated inside the sleeve 11 from being discharged into the atmosphere around the board 90, it is possible to avoid problems such as contamination of the surrounding area due to fumes and short circuits caused by metal foreign matter adhering to the electronic components 92 mounted on the board 90.

[0040] (Third embodiment) Next, a third embodiment will be described with reference to Fig. 5. In this third embodiment, the method of exhausting fumes that have flowed into the cylindrical member 31 differs from the above-described embodiments. Specifically, in this third embodiment, the soldering apparatus 1 includes an opening / closing unit 51. The opening / closing unit 51 is used to open and close the exhaust path 14. As shown in Fig. 5, the opening / closing unit 51 is provided, for example, at the other end of the cylindrical member 31.

[0041] The opening / closing unit 51 opens the exhaust path 14 when the pressure inside the cylindrical member 31 increases due to the generation of fumes inside the sleeve 11. On the other hand, the exhaust path 14 is closed, for example, during normal times when the pressure inside the sleeve 11 is not increasing. "Normal times" includes a state in which the inside of the sleeve 11 is filled with inert gas. In this way, the opening / closing unit 51 can switch the open / close state of the exhaust path 14 depending on the state of the pressure inside the sleeve 11. The opening / closing unit 51 may be configured to be provided midway along the exhaust path 14. The opening / closing unit 51 may also be configured to be electromagnetically openable and closable. Furthermore, the other end of the cylindrical member 31 may be connected to the intermediate member 41, and the opening / closing unit 51 may be provided midway along the intermediate member 41 or at the other end thereof.

[0042] According to the third embodiment, the same effects as those of the first embodiment can be achieved. Furthermore, the inert gas supplied to the inside of the sleeve 11 can be kept at a high concentration under normal conditions. This can improve the soldering quality.

[0043] The cylindrical member 31 can be given a function other than the function of exhausting fumes to the outside. For example, the cylindrical member 31 can be used to supply an inert gas to the inside of the sleeve 11, supply hot air to raise the atmospheric temperature inside the sleeve 11, and supply cold air to cool the sleeve 11. In addition to these, the cylindrical member 31 may also be used to supply post flux to improve the wettability of the solder. This allows the cylindrical member 31 to assist in soldering. The cylindrical member 31 may also be used to supply a cleaning liquid to clean the inside of the sleeve 11.

[0044] The above-described embodiments can be combined with each other, and only the characteristic features of two or more embodiments can be extracted and combined. Although the present disclosure has been described with reference to the embodiments, it is understood that the present disclosure is not limited to the embodiments or structures. The present disclosure also encompasses various modifications and modifications within the scope of equivalents. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure. [Explanation of symbols]

[0045] 1...soldering device, 11...sleeve, 111...sleeve through-hole, 12...heater, 122...heat-generating component, 13...discharge hole, 31...cylindrical member

Claims

1. a sleeve (11) formed in a cylindrical shape for melting solder pieces (H) supplied therein; a heater (12) provided on the outside of the sleeve and having a heat generating element (122) for heating the sleeve; a discharge hole (13) formed including a sleeve through-hole (111) formed through the sleeve; a cylindrical member (31) formed in a cylindrical shape, one end of which is located inside the discharge hole, for discharging fumes generated when the solder piece melts inside the sleeve to the outside of the sleeve; At least a portion of the heat generating component is located closer to the tip end of the sleeve than the discharge hole. Soldering equipment.

2. A melting area (S) is formed inside the sleeve, in which the solder piece is melted during soldering; The heat-generating component is provided so as to overlap the melting region.

2. The soldering apparatus according to claim 1.

3. The discharge hole is located closer to the base end of the sleeve than the melted region.

3. The soldering apparatus according to claim 2.

4. The discharge hole is formed by the sleeve through-hole and a heater through-hole (123) that is provided opposite the sleeve through-hole and that penetrates the heater, the sleeve through-hole or the heater through-hole is formed in a stepped shape in which the diameter dimension on the outer surface side is larger than the diameter dimension on the inner surface side; 2. The soldering apparatus according to claim 1.

5. The sleeve through-hole and the heater through-hole are aligned coaxially.

5. The soldering apparatus according to claim 4.

6. The apparatus further includes a smoke suction device (40) that sucks the fumes that have passed through the tubular member.

2. The soldering apparatus according to claim 1.

7. A discharge path (14) including the tubular member; An opening / closing unit (51) that opens and closes the discharge path, 2. The soldering apparatus according to claim 1.

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