Dresser cleaning device and substrate polishing device

Abstract

To provide a dresser cleaning device which can attain stable cleaning effect, and to provide a substrate polishing device.SOLUTION: A dresser cleaning device 50 includes: a cleaning nozzle 34 which sprays a cleaning fluid for cleaning a dresser 31 to the dresser 31; a movement mechanism 35 which moves at least one of the dresser 31 and the cleaning nozzle 34 in a direction such that the dresser 31 and the cleaning nozzle 34 move close to or away from each other; a load sensor 36 which detects a load applied to the dresser 31 when the cleaning nozzle 34 sprays the cleaning fluid to the dresser 31; and a distance control unit 37 which adjusts a distance between the dresser 31 and the cleaning nozzle 34 with the movement mechanism 35 based on a detection value of the load sensor 36.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a dresser cleaning apparatus and a substrate polishing apparatus. [Background technology]

[0002] A CMP (Chemical Mechanical Polishing) apparatus used for polishing substrates such as semiconductor wafers includes a polishing table with a polishing pad attached to the upper surface of a turntable, and a top ring that holds the substrate between the polishing table and the top ring. In a CMP apparatus, the polishing table and top ring are rotated, and the top ring presses the substrate against the polishing surface (upper surface) of the polishing pad with a predetermined pressure. A polishing liquid is supplied to the polishing surface, polishing the substrate surface to a flat, mirror-like finish. The polishing liquid is typically an alkaline solution in which abrasive particles, such as silica particles, are suspended. The substrate is polished (chemical-mechanical polishing) by a combined action of the chemical polishing action of the alkali and the mechanical polishing action of the abrasive particles.

[0003] As substrates are polished, the polishing performance of the polishing surface of the polishing pad deteriorates due to the adhesion of abrasive grains and polishing debris, etc. For this reason, CMP apparatuses have a dressing device that regenerates the polishing surface of a deteriorated polishing pad. The dressing device moves a rotating dresser along the polishing surface while pressing it against the polishing surface of the polishing table, thereby removing abrasive grains and cutting debris adhering to the polishing surface and flattening and dressing the polishing surface.

[0004] The dresser is cleaned by a dresser cleaning device, which cleans the dresser by spraying a cleaning fluid onto the dresser through a nozzle (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 9-254018 [Patent Document 2] Japanese Patent Application Publication No. 11-347917 Summary of the Invention [Problem to be solved by the invention]

[0006] The cleaning power in dresser cleaning is determined by cleaning conditions such as the distance between the nozzle and the dresser, the flow rate and pressure of the cleaning fluid, etc. In dresser cleaning equipment, cleaning conditions are set to obtain a certain level of cleaning power, but the actual cleaning effect may vary from equipment to equipment.

[0007] An object of one aspect of the present invention is to provide a dresser cleaning apparatus and a substrate polishing apparatus that can provide a stable cleaning effect. [Means for solving the problem]

[0008] A dresser cleaning apparatus according to a first aspect of the present invention is a dresser cleaning apparatus for cleaning a dresser that dresses a polishing surface of a polishing pad for substrate polishing, and includes: a cleaning nozzle that sprays a cleaning fluid for cleaning the dresser onto the dresser; a movement mechanism that moves at least one of the dresser and the cleaning nozzle toward and away from each other; a load sensor that detects a load applied to the dresser when the cleaning nozzle sprays the cleaning fluid onto the dresser; and a distance control unit that adjusts a distance between the dresser and the cleaning nozzle using the movement mechanism based on a detection value of the load sensor.

[0009] A dresser cleaning apparatus according to a second aspect of the present invention is the dresser cleaning apparatus according to the first aspect, wherein the cleaning nozzle is disposed opposite a dressing surface of the dresser that is in sliding contact with the polishing surface, and the movement mechanism is a dresser lifting mechanism that adjusts the height position of the dresser.

[0010] A dresser cleaning apparatus according to a third aspect of the present invention is the dresser cleaning apparatus according to the first or second aspect, further comprising a cleaning fluid supply unit that supplies the cleaning fluid to the cleaning nozzle, wherein the cleaning fluid is a mixed fluid containing a cleaning liquid and a gas.

[0011] A substrate polishing apparatus according to a fourth aspect of the present invention includes the dresser cleaning apparatus according to any one of the first to third aspects, and a polishing table that holds the polishing pad. [Effects of the Invention]

[0012] One aspect of the present invention provides a dresser cleaning apparatus and a substrate polishing apparatus that can provide stable cleaning effects. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a perspective view of a substrate polishing apparatus according to an embodiment; [Figure 2] 3A and 3B are plan views illustrating the operation of the dresser swing arm and the dresser of the substrate polishing apparatus according to the embodiment. [Figure 3] FIG. 2 is a configuration diagram of a dressing device. [Figure 4] FIG. 1 is a configuration diagram of a dresser cleaning apparatus according to a first embodiment. [Figure 5] FIG. 2 is a configuration diagram of a portion of the dresser cleaning apparatus according to the first embodiment. [Figure 6] FIG. 10 is a configuration diagram of a dresser cleaning apparatus according to a second embodiment. [Figure 7] FIG. 10 is a configuration diagram showing a first modified example of the dresser cleaning apparatus. [Figure 8] FIG. 10 is a configuration diagram showing a second modified example of the dresser cleaning apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A dresser cleaning apparatus and a substrate polishing apparatus according to an embodiment of the present invention will now be described with reference to the accompanying drawings.

[0015] [Substrate polishing equipment] FIG. 1 is a perspective view of a substrate polishing apparatus 1. FIG. 2 is a plan view illustrating the operation of a dresser swing arm 33 and a dresser 31. FIG. 3 is a configuration diagram of a dressing apparatus 30. FIG. 4 is a configuration diagram of a dresser cleaning apparatus 50. FIG. 5 is a configuration diagram of a part of the dresser cleaning apparatus 50.

[0016] 1, a substrate polishing apparatus 1 according to the embodiment includes a polishing table 10, a top ring apparatus 20, a dressing apparatus 30, a liquid supply mechanism 40, and a dresser cleaning apparatus 50. The substrate polishing apparatus 1 polishes substrates such as semiconductor wafers. The substrate polishing apparatus 1 is, for example, part of a CMP apparatus that polishes, cleans, and dries substrates.

[0017] The polishing table 10 includes a turntable 12. The polishing table 10 can be rotated in the direction of arrow A by the driving force of a motor (not shown). The turntable 12 is disk-shaped. A polishing pad 11 can be attached to the upper surface of the turntable 12. Therefore, the polishing table 10 can hold the polishing pad 11. The polishing pad 11 rotates integrally with the turntable 12.

[0018] The top ring device 20 has a top ring head 21, a top ring drive shaft 22, and a top ring swing arm 23. The top ring head 21 holds the substrate and presses it against the upper surface of the polishing pad 11. The top ring drive shaft 22 is connected to the top ring head 21.

[0019] The top ring swing arm 23 rotatably holds the top ring drive shaft 22. The top ring swing arm 23 is supported by a top ring swing shaft 24. A motor (not shown) connected to the top ring drive shaft 22 is installed inside the top ring swing arm 23. The rotation of the motor is transmitted to the top ring head 21 via the top ring drive shaft 22. As a result, the top ring head 21 rotates around the top ring drive shaft 22 in the direction of arrow B.

[0020] The top ring drive shaft 22 is connected to a vertical movement actuator (for example, an air cylinder) provided on the top ring swing arm 23. The top ring head 21 moves up and down together with the top ring drive shaft 22 by the vertical movement actuator.

[0021] The top ring swing shaft 24 is provided radially outward from the polishing pad 11. The central axis of the top ring swing shaft 24 extends in the vertical direction. The top ring swing shaft 24 is rotated around the central axis of the top ring swing shaft 24 by a motor (not shown). The top ring device 20 swings the top ring swing arm 23 by the rotation of the top ring swing shaft 24 around its axis. The top ring device 20 switches the position of the top ring head 21 between a polishing position and a standby position. The polishing position is a position above the polishing pad 11. The standby position is a position outside the polishing pad 11.

[0022] The liquid supply mechanism 40 supplies a polishing liquid and a dressing liquid to the polishing surface of the polishing pad 11. The liquid supply mechanism 40 has a plurality of supply nozzles. The supply nozzles supply the polishing liquid and the dressing liquid to the polishing surface of the polishing pad 11. The liquid supply mechanism 40 serves as both a polishing liquid supply mechanism and a dressing liquid supply mechanism. The polishing liquid supply mechanism supplies the polishing liquid to the polishing pad 11. The dressing liquid supply mechanism supplies a dressing liquid (e.g., pure water) to the polishing pad 11.

[0023] To polish a substrate using the substrate polishing apparatus 1, the substrate is held on the lower surface of the top ring head 21, and the top ring head 21 and polishing table 10 are rotated. In this state, a polishing liquid is supplied to the polishing surface of the polishing pad 11, and the top ring head 21 presses the substrate against the polishing surface of the polishing pad 11. The surface (lower surface) of the substrate is polished (chemical mechanical polished) by a combined action of the mechanical polishing action of the abrasive grains contained in the polishing liquid and the chemical polishing action of the polishing liquid.

[0024] 3, the dressing device 30 flattens and dresses the polishing surface 11a of the polishing pad 11. The dressing device 30 includes a dresser 31, a dresser drive shaft 32, a dresser swing arm 33 (dresser support portion), a dresser swing shaft 38, a rotation motor 39, and a swing motor 51.

[0025] The dresser 31 is plate-shaped (for example, disk-shaped). The dresser 31 is brought into sliding contact with the polishing surface 11a of the polishing pad 11. The lower surface 31a of the dresser 31 is a dressing surface that is brought into sliding contact with the polishing surface 11a of the polishing pad 11. Abrasive grains such as diamond particles are fixed to the dressing surface. The dresser 31 is attached to the lower end of a dresser drive shaft 32. The dresser drive shaft 32 protrudes downward from a dresser swing arm 33.

[0026] The rotary motor 39 (drive source) is provided on the dresser swing arm 33. The rotary motor 39 is connected to the dresser drive shaft 32. The rotational force of the rotary motor 39 is transmitted to the dresser 31 via the dresser drive shaft 32. The rotary motor 39 rotates the dresser 31 around the dresser drive shaft 32 in the direction of arrow C (see FIG. 1).

[0027] The dresser swing arm 33 is supported by a dresser swing shaft 38. The dresser swing shaft 38 is provided radially outside the polishing pad 11. The central axis of the dresser swing shaft 38 extends in the vertical direction. A swing motor 51 (drive source) rotates the dresser swing shaft 38 around the central axis.

[0028] As shown in FIG. 2, the dresser swing arm 33 swings (pivots) by rotating about the dresser swing shaft 38. The dresser swing arm 33 moves the dresser 31 along the polishing surface 11a by swinging (pivoting). The dresser 31 can be switched between a dressing position (see FIG. 3) and a standby position (see FIG. 4) by swinging (pivoting) the dresser swing arm 33. The dressing position is a position above the polishing pad 11. The standby position is a position outside the polishing pad 11.

[0029] [Dresser Cleaning Apparatus] (First Embodiment) As shown in FIG. 4, the dresser cleaning apparatus 50 according to the first embodiment includes a cleaning nozzle 34, a dresser lifting mechanism 35, a load sensor 36, a distance control unit 37, and a cleaning fluid supply unit 60.

[0030] The cleaning nozzle 34 is located below the dresser 31 in the standby position. The cleaning nozzle 34 is arranged facing the lower surface 31a of the dresser 31. The cleaning nozzle 34 includes a nozzle base 61 and a plurality of nozzle portions 62. The nozzle base 61 is formed, for example, in a plate shape (for example, a disk shape). The nozzle base 61 is located facing the lower surface 31a of the dresser 31. The upper surface of the nozzle base 61 is, for example, parallel to the lower surface 31a of the dresser 31. The nozzle base 61 is located downward and spaced apart from the dresser 31.

[0031] The nozzle portion 62 is provided on the upper surface of the nozzle base 61. The nozzle portion 62 protrudes from the upper surface of the nozzle base 61 in a direction approaching the dresser 31 (for example, upward). The nozzle portion 62 sprays the cleaning fluid onto the lower surface 31a of the dresser 31.

[0032] The multiple nozzle portions 62 are, for example, located at different positions on the top surface of the nozzle base 61. The multiple nozzle portions 62 include, for example, one or more central nozzle portions 62A and one or more peripheral nozzle portions 62B. The central nozzle portion 62A is provided in the central portion of the nozzle base 61. The peripheral nozzle portions 62B are provided in the peripheral portion surrounding the central portion of the nozzle base 61.

[0033] The cleaning fluid supply unit 60 includes a cleaning liquid storage unit 63, a gas supply source 64, a cleaning fluid supply control unit 65, and an input device 66. The cleaning fluid supply unit 60 supplies the cleaning nozzle 34 with cleaning fluid.

[0034] The cleaning fluid sprayed by the nozzle unit 62 is, for example, a mixed fluid containing a cleaning liquid and a gas (gas-liquid mixed fluid). The cleaning liquid storage unit 63 supplies the cleaning liquid to the cleaning nozzle 34. The cleaning liquid is, for example, water. The gas supply source 64 supplies a gas to the cleaning nozzle 34. The gas is, for example, air. The cleaning fluid is not limited to a gas-liquid mixed fluid, and may be only a cleaning liquid or only a gas.

[0035] The supply control unit 65 sprays the cleaning fluid from the nozzle unit 62 in accordance with predetermined cleaning conditions. The input device 66 is connected to the supply control unit 65. A user can input cleaning conditions into the supply control unit 65 using the input device 66. The input device 66 is, for example, a keyboard.

[0036] The cleaning power when cleaning the dresser 31 with the cleaning fluid is determined by cleaning conditions such as the distance between the nozzle portion 62 and the dresser 31, the flow rate of the cleaning fluid, the pressure of the cleaning fluid, and the spray time of the cleaning fluid. The cleaning nozzle 34 may spray the cleaning fluid continuously or intermittently. When the cleaning fluid is sprayed intermittently, the spray time, the spray interval, the number of sprays, and the like are also included as cleaning conditions.

[0037] The dresser lifting mechanism 35 includes a support base 52, a connecting portion 53, a main body 54, and a lifting motor (drive source) 55. The dresser lifting mechanism 35 raises and lowers the dresser 31.

[0038] The support base 52 supports a swing motor 51 provided at the lower end of the dresser swing shaft 38. The connecting portion 53 is connected to the support base 52. The main body 54 extends in the vertical direction. The support base 52 can be raised and lowered along the main body 54. The main body 54 raises and lowers the support base 52, for example, by a mechanism using a ball screw operated by an elevation motor 55.

[0039] When the support base 52 rises, the dresser 31 rises together with the swing motor 51, the dresser swing shaft 38, and the dresser swing arm 33. When the support base 52 descends, the dresser 31 descends together with the swing motor 51, the dresser swing shaft 38, and the dresser swing arm 33.

[0040] The dresser lifting mechanism 35 raises and lowers the dresser 31, thereby moving the dresser 31 toward and away from the cleaning nozzle 34. Specifically, the dresser 31 moves away from the cleaning nozzle 34 when raised. The dresser 31 moves toward the cleaning nozzle 34 when lowered. The dresser lifting mechanism 35 is an example of a "moving mechanism."

[0041] 5, the load sensor 36 detects an upward load (pressure) applied to the dresser 31 when the cleaning nozzle 34 sprays cleaning fluid onto the dresser 31. The load sensor 36 has an insertion hole 36a through which the dresser drive shaft 32 passes. A lower surface 36b of the load sensor 36 is fixed to the dresser swing arm 33. An upper surface 36c of the load sensor 36 is fixed to the rotation motor 39.

[0042] The dresser 31 can press an object (e.g., the polishing surface 11a) downward with a predetermined force by means of the dresser lifting mechanism 35. When an upward load (pressing force) is applied to the dresser 31, this load is transmitted to the load sensor 36 via the dresser drive shaft 32 and the rotary motor 39. Therefore, the load sensor 36 can detect the upward load applied to the dresser 31. When the load sensor 36 detects the load, it transmits a detection signal to the distance control unit 37 (see FIG. 4).

[0043] The load sensor 36 is, for example, a strain gauge type load cell. A pressure sensor, a piezoelectric element, or the like can also be used as the load sensor 36. An amplifier for amplifying the detection signal may be provided between the load sensor 36 and the distance control unit 37.

[0044] The distance control unit 37 can adjust the height position of the dresser 31 using the dresser lifting mechanism 35 based on the detection value of the load sensor 36. The distance control unit 37 controls the lifting operation of the dresser lifting mechanism 35 so that the dresser 31 presses the object (e.g., the polishing surface 11a) with a predetermined force.

[0045] The distance control unit 37 may be connected to an input device 70 (e.g., a keyboard) for inputting information required to execute a program that determines the relationship between the detection value of the load sensor 36 and the height position of the dresser 31. The input device 70 can input commands including setting the height of the dresser 31.

[0046] [Dressing method] 3, when dressing the polishing surface 11a of the polishing pad 11, the dresser 31 is placed at the dressing position. The lower surface 31a (dressing surface) of the dresser 31 is brought into sliding contact with the polishing surface 11a of the polishing pad 11. The dresser 31 is rotated about its axis by a rotary motor 39. The dresser swing arm 33 is swung (turned) by the rotation of the dresser swing shaft 38 about its axis, thereby moving the dresser 31 back and forth.

[0047] The movement (swing) of the dresser 31 removes polishing debris adhering to the polishing surface 11a of the polishing pad 11 and regenerates the polishing surface 11a. During dressing, a liquid supply mechanism 40 (see FIG. 1) supplies a dressing liquid (e.g., pure water) onto the polishing surface 11a of the polishing pad 11. The operation of the dressing device 30 to dress the polishing surface 11a of the polishing pad 11 is also referred to as a "dressing operation."

[0048] [Dresser cleaning method] (1st process: Place the dresser in the standby position) As shown in Fig. 4, the dresser 31 is raised using the dresser lifting mechanism 35. The dresser lifting mechanism 35 rotates the dresser swing arm 33 to lower the dresser 31 to a predetermined height, thereby placing the dresser 31 in a standby position. The dresser lifting mechanism 35 can fine-tune the height of the dresser 31 as needed based on the detection value of the load sensor 36.

[0049] (2nd process: Clean the dresser) <Basic operation> The cleaning nozzle 34 sprays the cleaning fluid from the nozzle portion 62 onto the lower surface 31a of the dresser 31. This cleans the lower surface 31a (dressing surface) of the dresser 31. The supply control unit 65 sprays the cleaning fluid from the nozzle portion 62 in accordance with predetermined cleaning conditions. The cleaning power when cleaning the dresser 31 with the cleaning fluid is determined by the cleaning conditions. The operation of the dresser cleaning device 50 to clean the lower surface 31a of the dresser 31 is also referred to as a "cleaning operation."

[0050] By cleaning the dresser 31 using the cleaning nozzle 34, polishing debris and the like adhering to the dresser 31 are removed, and the dresser 31 is cleaned. Therefore, in the next dressing operation, the polishing surface 11a of the polishing pad 11 can be dressed using a highly clean dresser 31.

[0051] <Adjust the distance between the dresser and the cleaning nozzle> The load sensor 36 detects the load applied to the dresser 31 when the cleaning fluid is sprayed onto the dresser 31 . The distance control unit 37 adjusts the height position of the dresser 31 using the dresser lifting mechanism 35 based on the detection value of the load sensor 36. For example, when the detection value of the load sensor 36 falls below the lower limit of a preset range, the distance control unit 37 lowers the dresser 31 to bring it closer to the cleaning nozzle 34. When the detection value of the load sensor 36 exceeds the upper limit of the preset range, the distance control unit 37 raises the dresser 31 to move it away from the cleaning nozzle 34.

[0052] In the dresser cleaning apparatus 50, the distance H1 (height difference) between the dresser 31 and the cleaning nozzle 34 when the polishing apparatus is assembled may vary from apparatus to apparatus due to variations in the adjusted positions of the components.

[0053] In the dresser cleaning apparatus 50, the height of the dresser 31 can be adjusted to keep within a predetermined range the load applied to the dresser 31 when the cleaning fluid is sprayed onto the dresser 31. Therefore, regardless of the distance H1 between the dresser 31 and the cleaning nozzle 34 in the initial setting, the cleaning fluid can be sprayed onto the dresser 31 with an appropriate force.

[0054] The cleaning improves the cleanliness of the dresser 31. In the dressing operation, the polishing pad 11 can be dressed using the highly clean dresser 31, and therefore the performance of polishing the substrate by the substrate polishing apparatus 1 can be improved.

[0055] [Effects of the Dresser Cleaning Apparatus of the Embodiment] The dresser cleaning device 50 includes a dresser lifting mechanism 35 that raises and lowers the dresser 31, a load sensor 36 that detects the load applied to the dresser 31 during the cleaning operation, and a distance control unit 37 that adjusts the distance between the dresser 31 and the cleaning nozzle 34 based on the detection value of the load sensor 36.

[0056] The dresser cleaning apparatus 50 can keep the load applied to the dresser 31 during the cleaning operation within a predetermined range based on the detection value of the load sensor 36. Therefore, regardless of the distance H1 between the dresser 31 and the cleaning nozzle 34 in the initial setting, the cleaning fluid can be sprayed onto the dresser 31 with an appropriate force. This provides a stable cleaning effect (i.e., little variation between apparatuses) when cleaning the dresser 31. Therefore, during the dressing operation, the polishing pad 11 can be dressed using a highly clean dresser 31.

[0057] Even if the dresser 31 is worn out by the dressing operation, the dresser cleaning device 50 can spray the cleaning fluid with an appropriate force onto the dresser 31. Therefore, when cleaning the dresser 31, a stable cleaning effect (i.e., a good cleaning effect regardless of the degree of wear of the dresser 31) can be obtained.

[0058] In the dresser cleaning apparatus 50, even if the pressure or flow rate of the cleaning fluid fluctuates, the distance between the dresser 31 and the cleaning nozzle 34 can be adjusted accordingly, thereby stabilizing the cleaning effect. Although the pressure or flow rate of the cleaning fluid may differ from apparatus to apparatus, the dresser cleaning apparatus 50 can adjust the distance between the dresser 31 and the cleaning nozzle 34, thereby reducing variations in the cleaning effect.

[0059] The cleaning nozzle 34 is disposed opposite the lower surface 31a of the dresser 31. Therefore, by adjusting the height position of the dresser 31 using the dresser lifting mechanism 35, it is possible to adjust the separation distance while maintaining the relative attitude between the dresser 31 and the cleaning nozzle 34. Since the relative attitude between the dresser 31 and the cleaning nozzle 34 is unlikely to be disturbed, a good cleaning effect can be obtained.

[0060] The dresser cleaning apparatus 50 includes a cleaning fluid supply unit 60. The cleaning fluid supply unit 60 supplies a cleaning fluid, which is a mixed fluid containing a cleaning liquid and a gas, to the cleaning nozzle 34. Use of the mixed fluid can improve the effectiveness of cleaning the dresser 31.

[0061] 1 includes the dresser cleaning device 50, and therefore, a stable cleaning effect (i.e., little variation between devices) can be obtained when cleaning the dresser 31. Therefore, in the dressing operation, the polishing pad 11 can be dressed using the highly clean dresser 31.

[0062] [Dresser Cleaning Apparatus] (Second Embodiment) FIG. 6 is a configuration diagram of a dresser cleaning apparatus 150 according to the second embodiment. As shown in FIG. 6, the dresser cleaning device 150 includes a cleaning nozzle 34, a dresser lifting mechanism 35, a load sensor 36, a distance control unit 37, a cleaning fluid supply unit 60, and a nozzle lifting mechanism 80.

[0063] The dresser cleaning apparatus 150 differs from the dresser cleaning apparatus 50 shown in FIG. 4 in that it includes a nozzle lifting mechanism 80. The nozzle lifting mechanism 80 supports the cleaning nozzle 34. The nozzle lifting mechanism 80 can raise and lower the cleaning nozzle 34. When the cleaning nozzle 34 is raised, it moves closer to the dresser 31. When the cleaning nozzle 34 is lowered, it moves away from the dresser 31. The nozzle lifting mechanism 80 is an example of a "moving mechanism."

[0064] The distance control unit 37 can adjust the height position of the cleaning nozzle 34 using the nozzle lifting mechanism 80 based on the detection value of the load sensor 36. This allows the distance control unit 37 to adjust the distance between the dresser 31 and the cleaning nozzle 34.

[0065] The distance control unit 37 can adjust the height position of at least one of the dresser 31 and the cleaning nozzle 34. This allows at least one of the dresser 31 and the cleaning nozzle 34 to move toward or away from each other. Specifically, the distance control unit 37 can adjust the height position of only the dresser 31 out of the dresser 31 and the cleaning nozzle 34. The distance control unit 37 can also adjust the height position of only the cleaning nozzle 34 out of the dresser 31 and the cleaning nozzle 34. The distance control unit 37 can also adjust the height positions of both the dresser 31 and the cleaning nozzle 34.

[0066] [Dresser Cleaning Apparatus] (First Modification) FIG. 7 is a configuration diagram showing a first modified example of the dresser cleaning apparatus. The dresser cleaning apparatus 250 further includes a measuring unit 90 that measures the distance between the dresser 31 and the cleaning nozzle 34. The measuring unit 90 is provided, for example, in the dresser lifting mechanism 35. The measuring unit 90 can measure the distance between the dresser 31 and the cleaning nozzle 34 based on the number of rotations of the ball screw.

[0067] The distance control unit 37 can finely adjust the height position of the dresser 31 based on the measurement value (the distance between the dresser 31 and the cleaning nozzle 34) of the measurement unit 90. This allows the cleaning conditions to be adjusted with high precision.

[0068] [Dresser Cleaning Apparatus] (Second Modification) FIG. 8 is a configuration diagram showing a second modified example of the dresser cleaning apparatus. The dresser cleaning apparatus 350 further includes a pressure sensor 100 in the cleaning fluid supply unit 60 for detecting the pressure of the cleaning fluid.

[0069] The distance control unit 37 can finely adjust the height position of the dresser 31 based on the measurement value (pressure of the cleaning fluid supplied to the cleaning nozzle 34) of the pressure sensor 100. This allows the cleaning conditions to be adjusted with high precision.

[0070] The present invention has been described above based on the best mode, but the present invention is not limited to the above-described best mode, and various modifications are possible within the scope of the gist of the present invention.

[0071] 4 and other drawings, the dressing apparatus 30 includes a dresser 31, a dresser drive shaft 32, a dresser swing arm 33 (dresser support), a dresser swing shaft 38, a rotation motor 39, and a swing motor 51. However, the configuration of the dressing apparatus of the embodiment is not limited to this. For example, the dressing apparatus in FIG. 4 may include the dresser 31, the dresser drive shaft 32, the dresser swing arm 33 (dresser support), the dresser swing shaft 38, the rotation motor 39, the swing motor 51, and a dresser cleaning apparatus 50.

[0072] When cleaning the dresser 31, a primary cleaning using high-pressure jetting and a secondary cleaning using low-pressure jetting may be combined. The dresser 31 may be cleaned by selectively using a plurality of nozzles 62 with different jetting angles of the cleaning fluid. A plurality of cleaning operations using mixed fluids with different ratios of cleaning liquid to gas may also be combined. By appropriately selecting these cleaning methods, it is possible to shorten the overall cleaning time, reduce the amount of cleaning fluid used, and improve the cleanliness.

[0073] The dresser lifting mechanism is not limited to a ball screw mechanism, and other lifting mechanisms may be used. For example, the support base may be raised and lowered by a cylinder mechanism provided in the main body. [Explanation of symbols]

[0074] 1...substrate polishing apparatus, 10...polishing table, 11...polishing pad, 11a...polishing surface, 31...dresser, 31a...lower surface (dressing surface), 34...cleaning nozzle, 35...dresser lifting mechanism (moving mechanism), 36...load sensor, 37...distance control unit, 50, 150, 250, 350...dresser cleaning device, 60...cleaning fluid supply unit, 80...nozzle lifting mechanism (moving mechanism).

Claims

1. 1. A dresser cleaning apparatus for cleaning a dresser that dresses a polishing surface of a polishing pad for substrate polishing, comprising: a cleaning nozzle that sprays a cleaning fluid onto the dresser to clean the dresser; a moving mechanism that moves at least one of the dresser and the cleaning nozzle in a direction toward and away from each other; a load sensor that detects a load applied to the dresser when the cleaning nozzle sprays the cleaning fluid onto the dresser; a distance control unit that adjusts the distance between the dresser and the cleaning nozzle using the movement mechanism based on a detection value of the load sensor; A dresser cleaning device comprising:

2. the cleaning nozzle is disposed opposite to a dressing surface of the dresser that is in sliding contact with the polishing surface; the moving mechanism is a dresser lifting mechanism that adjusts the height position of the dresser; 2. The dresser cleaning device according to claim 1.

3. a cleaning fluid supply unit that supplies the cleaning fluid to the cleaning nozzle; The cleaning fluid is a mixed fluid containing a cleaning liquid and a gas.

2. The dresser cleaning device according to claim 1.

4. The dresser cleaning apparatus according to any one of claims 1 to 3, a polishing table for holding the polishing pad, Substrate polishing equipment.

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