Substrate information acquisition device and substrate conveying device including the same

Abstract

To provide a substrate information acquisition device that can accurately acquire substrate information by actualizing the boundary between a substrate and the background.SOLUTION: A camera 47 photographs a pattern 51 from a side of a carry-in / exit CT. The pattern 51 is vertically asymmetrical with respect to a surface of a substrate W, has a linear shape, and is inclined at a predetermined angle when viewed from the carry-in / exit CT. When there is warpage in the shape of the substrate W, a reflection pattern is captured in which the pattern 51 is reflected and vertically inverted on the surface of the substrate W. Therefore, the image photographed by the camera 47 can be made less susceptible to reflected light on the surface of the substrate W, and the boundary between the substrate W and the background can be actualized. As a result, a substrate information acquisition unit 49 can extract the reflection pattern different in the predetermined angle from the pattern 51 in the image and accurately acquire substrate information including the shape of the substrate W such as warpage.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate information acquisition device that acquires substrate information including the shape of substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate transport device equipped with the same. [Background technology]

[0002] Conventionally, this type of device includes a robot arm, a substrate holding hand, an imaging unit, and a control unit (see, for example, Patent Document 1).

[0003] The substrate holding hand is attached to the tip of the robot arm. The substrate holding hand moves toward and away from the carrier that stores multiple substrates stacked and spaced apart by extending and retracting the robot arm. The substrate holding hand moves toward and away from the substrate to be transported. The photographing unit is attached to the substrate holding hand. The photographing unit photographs the multiple substrates stored in the carrier. The control unit acquires substrate information, including the vertical position where the substrates are stored and the shape of the substrate, such as warpage, based on the images taken by the photographing unit. Based on this substrate information, the control unit determines the gap between the substrates stored in the carrier and advances the substrate holding hand into the carrier according to the gap. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2023-30876 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the conventional example having such a configuration has the following problems. That is, conventional devices have a problem in that they cannot accurately acquire substrate information based on images captured by the image capture unit due to the influence of reflected light on the substrate surface, etc. For example, if the warp is located deeper than the peripheral edge of the substrate located on the side of the image capture unit, the boundary between the substrate and the background cannot be accurately distinguished, and accurate substrate information cannot be acquired. Therefore, the gap cannot be accurately determined, which may cause problems when transporting the substrate.

[0006] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate information acquisition device and a substrate transport device equipped with the same that can accurately acquire substrate information by making the boundary between the substrate and the background more visible. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention has the following configuration. In other words, the invention described in claim 1 relates to a container that can store multiple horizontally oriented substrates at a distance from each other and that can load and unload substrates through an inlet / outlet formed on one side, and is configured to acquire substrate information including the shape of the substrates stored in the container, the device comprising: a pattern that is positioned on the opposite side of the inlet / outlet across the substrates stored in the container in a planar view, the pattern being asymmetrical above and below the surface of the substrate when viewed from the inlet / outlet, and linear and inclined at a predetermined angle; an imaging unit that photographs the pattern from the inlet / outlet side; and a substrate information calculation unit that extracts the reflected pattern from the pattern in the image photographed by the imaging unit and a reflected pattern that is reflected by the substrate and has the predetermined angle different from the pattern, and calculates the substrate information.

[0008] [Operation and Effect] According to the invention described in claim 1, the photographing unit photographs the pattern from the loading / unloading port side. When viewed from the loading / unloading port, the pattern is asymmetrical above and below the surface of the substrate, and is linear and tilted at a predetermined angle. Therefore, if the substrate shape is not warped, the pattern is captured as is in the image in areas other than the substrate. On the other hand, if the substrate shape is warped, the pattern is reflected by the substrate surface, resulting in a reflected pattern that is upside down. Therefore, the image captured by the photographing unit is less susceptible to the influence of reflected light from the substrate surface, making it possible to clearly identify the boundary between the substrate and the background. As a result, the substrate information calculation unit extracts a reflected pattern that differs by a predetermined angle from the pattern in the image, and can accurately calculate substrate information, including the shape of the substrate, such as warpage.

[0009] In the present invention, it is preferable that the substrate information calculation section further calculates the positions of the upper and lower surfaces of the substrate as the substrate information (claim 2).

[0010] The positions of the top and bottom surfaces of the substrate are further calculated as substrate information, and therefore the distance between the substrate and other substrates stacked above and below it in the container can be calculated, thereby allowing the distance between the substrate and other adjacent substrates in the vertical direction to be calculated.

[0011] In addition, in the present invention, it is preferable that the substrate information calculation unit extracts edges from the image captured by the imaging unit, removes pixels larger than a predetermined size as noise, and then extracts the reflection pattern (claim 3).

[0012] The board information calculation unit extracts edges from the image captured by the image capture unit, removes pixels larger than a predetermined size as noise, and then extracts the reflection pattern. Therefore, the influence of noise can be suppressed, allowing the reflection pattern to be accurately extracted. As a result, board information can be accurately calculated.

[0013] In the present invention, it is preferable that the substrate information calculation section extracts the reflection pattern based on the predetermined angle (claim 4).

[0014] The reflection pattern has an angle different from the pattern of the predetermined angle, so the board information calculation unit can extract a reflection pattern different from the pattern based on the predetermined angle of the pattern.

[0015] Furthermore, in the present invention, it is preferable that the apparatus further comprises an imaging unit moving mechanism that moves the imaging unit in the direction in which the plurality of substrates are stacked, and an imaging unit moving mechanism control unit that controls the movement of the imaging unit moving mechanism, wherein the imaging unit moving mechanism control unit operates the imaging unit moving mechanism to photograph the plurality of substrates stored in the container with the imaging unit, and the substrate information calculation unit acquires the substrate information for all of the substrates stored in the container (Claim 5).

[0016] The photographing unit movement mechanism control unit operates the photographing unit movement mechanism to allow the photographing unit to photograph the multiple substrates stored in the container, and therefore the substrate information calculation unit can obtain substrate information for all of the substrates stored in the container.

[0017] Furthermore, in the present invention, it is preferable that the substrate transport device comprises any of the substrate information acquisition devices described above, a hand that holds the substrate, a hand drive unit that drives the hand toward and away from the container to transport the substrate and also drives the hand up and down in the vertical direction, and a hand drive unit control unit that operates the hand drive unit based on the substrate information acquired by the substrate information acquisition device (Claim 6).

[0018] The hand drive control unit operates the hand drive unit based on the substrate information acquired by the substrate information acquisition device, and therefore the substrate transport device can move the hand forward and backward so as not to come into contact with the multiple substrates stored in the container.

[0019] In addition, in the present invention, it is preferable that a determination unit be further provided that determines whether or not the hand can advance into the container based on the substrate information acquired by the substrate information acquisition device (claim 7).

[0020] If the gap between the substrates is too narrow to allow the hand to come into contact with them, the judgment unit determines that the hand will not advance, thereby eliminating the risk of the hand coming into contact with the substrate and damaging it. [Effects of the Invention]

[0021] According to the substrate information acquisition device of the present invention, the photographing unit photographs a pattern from the loading / unloading port side. When viewed from the loading / unloading port, the pattern is asymmetrical above and below the surface of the substrate, linear, and inclined at a predetermined angle. Therefore, if the substrate is not warped, the pattern is captured as is in the image in areas other than the substrate. On the other hand, if the substrate is warped, the pattern is reflected by the surface of the substrate, resulting in a reflected pattern that is upside down. Therefore, the image captured by the photographing unit is less susceptible to the influence of light reflected from the substrate surface, making it possible to clearly identify the boundary between the substrate and the background. As a result, the substrate information calculation unit extracts a reflected pattern that differs by a predetermined angle from the pattern in the image, allowing accurate calculation of substrate information, including the shape of the substrate, such as warpage. [Brief explanation of the drawings]

[0022] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Figure 2] 2 is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X. FIG. [Figure 3] FIG. 2 is a side view showing the main part of the embodiment. [Figure 4] FIG. 2 is a plan view showing the main part of the embodiment. [Figure 5] FIG. 10 is a diagram showing details of a pattern. [Figure 6] FIG. 10 is a schematic diagram showing an example of a pattern viewed from the camera side. [Figure 7] 10 is a flowchart illustrating an example of a substrate information acquisition process. [Figure 8] 10A to 10C are schematic diagrams illustrating a process for acquiring substrate information about a substrate that is not warped. [Figure 9] 10A to 10C are schematic diagrams illustrating a process for acquiring substrate information about a substrate that is not warped. [Figure 10] 10A to 10C are schematic diagrams illustrating a process for acquiring substrate information about a substrate that is not warped. [Figure 11] 10A and 10B are schematic diagrams illustrating a process of acquiring substrate information about a substrate aligned above. [Figure 12] 10A and 10B are schematic diagrams illustrating a process of acquiring substrate information about a substrate aligned above. [Figure 13] 10A and 10B are schematic diagrams illustrating a process of acquiring substrate information about a substrate aligned above. [Figure 14] 10 is a flowchart showing an example of an operation relating to the transportation of a substrate. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0024] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment of the present invention, Fig. 2 is a view of the substrate processing apparatus of Fig. 1 as seen from the rear X.

[0025] <1. Overall structure>

[0026] The substrate processing apparatus 1 includes a carry-in / out block 3, an indexer block 5, and a processing block .

[0027] The substrate processing apparatus 1 processes substrates W. The substrates W have, for example, a circular shape in a plan view. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrates W. The substrate processing apparatus 1 processes the substrates W in a processing block 7 in a single-wafer manner. In the single-wafer manner, each substrate W is processed one by one in a horizontal position.

[0028] For convenience, in this specification, the direction in which the load-unload block 3, indexer block 5, and processing block 7 are lined up is referred to as the "front-to-back direction X." The front-to-back direction X is horizontal. Within the front-to-back direction X, the direction from the processing block 7 toward the load-unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-to-back direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0029] <2. Loading / unloading block>

[0030] The carry-in / out block 3 includes an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged in the width direction Y. A plurality of substrates W (e.g., 25 substrates) are stored in a single carrier C in a horizontal orientation, stacked at regular intervals. The carrier C storing unprocessed substrates W is placed in the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carriers C are placed. The carrier C stores the substrates W one by one with the surfaces of the substrates W spaced apart. For example, the carrier C stores the substrates W with their surfaces facing upward. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be of any type, and may be an open container. Depending on the material, the carrier C may have high or low transmittance for visible light. Depending on the material, the carrier C may have low transmittance for visible light but high transmittance for infrared light.

[0031] The unloading unit 11 is disposed on the opposite side of the loading unit 9 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 11 is located to the left Y of the loading unit 9. The unloading unit 11 stores processed substrates W in carriers C and unloads the carriers C. The unloading unit 11, which functions in this manner, is equipped with, for example, two mounting tables 13 for placing the carriers C, similar to the loading unit 9. The loading unit 9 and the unloading unit 11 are also called load ports.

[0032] <3. Indexer Block>

[0033] The indexer block 5 is disposed adjacent to the rear X of the carry-in / out block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0034] The indexer robot IR is configured to be rotatable about a rotation axis parallel to the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR has a first hand 19 and a second hand 21. For convenience of illustration, only one hand is shown in FIG. 1 . The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to be independently movable forward and backward in the forward and backward direction X. The indexer robot IR moves in the width direction Y and rotates about the vertical direction Z, and moves the first hand 19 and the second hand 21 forward and backward to transfer the substrate W to and from each cassette C. In a similar manner, the indexer robot IR transfers the substrate W to and from the transfer section 15. The direction in which the first hand 19 and the second hand 21 move when transferring the substrate W to and from the carrier C is defined as the forward and backward direction FD.

[0035] The delivery section 15 includes, from bottom to top in the vertical direction Z, a first reversing unit 23, a path section 25, a path section 27, and a second reversing unit 29.

[0036] The first inversion unit 23 inverts the substrate W received from the indexer block 5 upside down. The first inversion unit 23 inverts the horizontal position of the substrate W. The second inversion unit 29 performs the reverse operation. In other words, the second inversion unit 29 inverts the substrate W received from the processing block 7 upside down.

[0037] The inversion directions of the first inversion unit 23 and the second inversion unit 29 may be opposite to each other. That is, the first inversion unit 23 changes the orientation of the substrate W so that the front surface faces upward. The second inversion unit 29 changes the orientation of the substrate W so that the back surface faces upward.

[0038] The path sections 25 and 27 are used to transfer substrates W between the indexer block 5 and the processing block 7. The path section 25 is used, for example, to transport substrates W from the processing block 7 to the indexer block 5. The path section 27 is used, for example, to transport substrates W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrates W in the path sections 25 and 27 may be opposite to each other.

[0039] <4. Processing Block>

[0040] The processing block 7 performs, for example, a cleaning process on the substrate W. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in FIG. 1, the processing block 7 is divided, for example, into a first row R1, a second row R2, and a third row R3 in the width direction Y. In detail, the first row R1 is disposed on the left side Y. The second row R2 is disposed in the center of the width direction Y. In other words, the second row R2 is disposed on the right side Y of the first row R1. The third row R3 is disposed on the right side Y of the second row R2.

[0041] <4-1. 1st column>

[0042] The first row R1 of the processing block 7 includes a plurality of processing sections 31. The first row R1 includes, for example, four processing sections 31. The first row R1 includes four processing sections 31 stacked in the vertical direction Z. Each processing section 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. Examples of the cleaning units include a front surface cleaning unit that cleans the front surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W.

[0043] <4-2. 2nd column>

[0044] The second row R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable around a rotation axis parallel to the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR is equipped with, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to be able to move forward and backward independently in the front-rear direction X and the width direction Y.

[0045] <4-3. 3rd column>

[0046] The third column R3 of the processing block 7 has the same configuration as the first column R1. That is, the third column R3 has a plurality of processing sections 31. The third column R3 has, for example, four processing sections 31. The four processing sections 31 are stacked in the vertical direction Z in the third column R3. Each processing section 31 in the first column R1 and each processing section 31 in the third column R3 are arranged opposite each other in the width direction Y. This allows the center robot CR to access each of the opposing processing sections 31 in the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0047] The processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly described. The center robot CR receives the substrate W, for example, from the first reversal unit 23. The center robot CR transports the substrate W to one of the processing units 31 in the first row R1 or the third row R3 to process the substrate W. The center robot CR receives the substrate W that has been processed in one of the processing units 31 in the first row R1 or the third row R3. The center robot CR transports the substrate W to the second reversal unit 29.

[0048] <5. Mounting table>

[0049] As shown in FIG. 1, the carry-in / out block 3 includes a mounting table 13 and a lid opening / closing mechanism 41.

[0050] The carrier C is placed on the mounting table 13. The carrier C has a loading / unloading opening CT. The loading / unloading opening CT is formed on one side of the carrier C. The carrier C is provided with a lid (not shown). The lid is configured to be detachable from the loading / unloading opening CT of the carrier C. The lid seals the inside of the carrier C. When the lid is attached to the carrier C, the atmosphere outside the carrier C is isolated.

[0051] The lid opening / closing mechanism 41 removes the lid from the carrier C and attaches the lid to the carrier C. The lid opening / closing mechanism 41 can fully open the loading / unloading opening CT of the carrier C by descending while holding the lid.

[0052] <6. Control System>

[0053] Here, the control system of the substrate processing apparatus 1 will be described. The substrate processing apparatus 1 is controlled overall by a control unit CU. The control unit CU includes a CPU, a memory, etc. The control unit CU operates according to a pre-stored program. The control unit CU controls the lid attachment / detachment operation by the lid opening / closing mechanism 41 and the lifting / lowering operation of the lid opening / closing mechanism 41. The control unit CU controls the indexer robot IR. Specifically, the control unit CU controls the movement of the first hand 19 and the second hand 21 of the indexer robot IR in the forward / backward direction FD, the movement of the first hand 19 and the second hand 21 in the vertical direction Z, and the rotation of the indexer robot IR about the vertical direction Z. The control unit CU controls the processing of substrates W in the processing unit 31. The control unit CU controls the center robot CR.

[0054] <7. Indexer robot and loading platform>

[0055] Next, the indexer robot IR and the mounting table 13 will be described in detail with reference to Fig. 3. Fig. 3 is a side view showing the main parts of the embodiment.

[0056] Here, the first hand 19 of the indexer robot IR will be described as an example, but the second hand 21 has a similar configuration. Note that Fig. 3 shows a state in which the lid of the carrier C is removed, and the multiple grooves that abut and support both ends of the front X and width direction Y of the substrate W are omitted.

[0057] In the indexer robot IR, the lifting and lowering movements, rotational movements, and forward and backward movements in the forward and backward direction FD of the first hand 19 are performed by a hand driver 43. The indexer robot IR is equipped with a position output unit 45. The position output unit 45 outputs position information such as height position information in the vertical direction Z of the first hand 19 relative to a predetermined reference position of the first hand 19, front-rear position information in the front-rear direction X, and left-right position information in the width direction Y to the control unit CU. The control unit CU operates the hand driver 43 based on the position information from the position output unit 45. In this way, the first hand 19 is controlled by the control unit CU.

[0058] The first hand 19 is provided with a camera 47 at its base end (rear in the forward / backward direction X). The camera 47 is sensitive to, for example, visible light. The camera 47 has, for example, a predetermined field of view. The predetermined field of view preferably includes, for example, one substrate W when viewed directly from the loading / unloading port CT, and also includes an area above and below in the vertical direction Z that is at least the storage pitch of the substrates W in the carrier C. In other words, when viewed facing one substrate W in the forward / backward direction FD, the predetermined field of view includes the substrate W and at least the area of ​​a substrate W that is disposed adjacent to the substrate W but spaced apart in the vertical direction Z from the substrate W. The camera 47 has an imaging area in the ZY plane defined by the vertical direction Z and the width direction Y. Note that, in the field of view, the width direction Y preferably extends at least to the inside of the grooves on both ends of the width direction Y. Furthermore, the camera 47 is preferably object-side telecentric. This reduces distortion of the photographed substrate W, thereby improving the accuracy of substrate information.

[0059] The camera 47 is connected to a board information acquisition unit 49. The board information acquisition unit 49 is connected to a control unit CU. The position output unit 45 is connected to the board information acquisition unit 49. The board information acquisition unit 49 controls the shooting conditions and shooting timing of the camera 47. The board information acquisition unit 49 acquires board information including the position of the board W in the vertical direction Z based on the image output from the camera 47. How the board information is acquired will be described in detail later.

[0060] The mounting table 13 is equipped with a pattern 51 and a light source 53. The pattern 51 and the light source 53 are provided upright on the mounting table 13. The light source 53 emits light rearward in the front-rear direction X. The light emitted by the light source 53 includes visible light. The pattern 51 and the light source 53 are arranged in front of the carrier C in the front-rear direction X. The pattern 51 is arranged between the light source 53 and an outer surface of the carrier C on the front side in the front-rear direction X. The pattern 51 is arranged outside the outer surface of the carrier C that faces the loading / unloading port CT in the front-rear direction X. In a plan view, the pattern 51 is arranged on the opposite side of the loading / unloading port CT across the substrate W stored in the carrier C. The pattern 51 and the light source 53 are arranged in positions on the mounting table 13 so as not to interfere with the carrier C. The pattern 51 and the light source 53 are arranged slightly spaced apart in the front-rear direction X.

[0061] As will be described later, the control unit CU may turn on the light source 53 only when capturing an image FG, and may turn it off when not capturing an image, thereby achieving power saving.

[0062] Here, reference will be made to Figures 4 and 5. Figure 4 is a plan view showing the main part of the embodiment, and Figure 5 is a diagram showing the details of the pattern.

[0063] The pattern 51 includes a member body 55 and a pattern body 57. The member body 55 is made of a member that transmits light from the light source 53. The pattern body 57 is provided behind the member body 55 in the front-rear direction X. The pattern body 57 is made of a member that has low transmittance for the light from the light source 53. In other words, the pattern body 57 blocks the light from the light source 53.

[0064] The pattern body 57 has a linear shape of a predetermined width. The pattern body 57 is inclined at a predetermined angle with respect to the vertical direction Z. The pattern body 57 is inclined downward to the right with respect to the vertical direction Z. The pattern body 57 is continuous without interruption in the inclination direction. The predetermined angle of the pattern body 57 is, for example, 45°. A plurality of pattern bodies 57 are formed. Each of the plurality of pattern bodies 57 is arranged at intervals. The intervals between the pattern bodies 57 are, for example, constant. When the substrate W is viewed horizontally from the loading / unloading port CT, the pattern body 57 is asymmetrical above and below with respect to a plane extending in the width direction Y of the substrate W, as shown by the two-dot chain line in FIG. 5.

[0065] The camera 47 attached to the hand 19 has a photographing center C1. The photographing center C1 is the center of the lens (not shown) of the camera 47 and is the center of the image output by the camera 47. The camera 47 is preferably attached to the hand 19 so that the photographing center C1 and the center cp of the substrate W coincide in the width direction Y in a planar view. This is because the photographed image is obtained through an optical system, and distortion is smaller toward the center. This is because, for substrates W having deformation such as warping, the center cp of the substrate W becomes more important when calculating the distance between them in the vertical direction Z based on substrate information. The angle of view of the camera 47 in a planar view is set so as to include both end edges in the width direction Y. In FIG. 4, the angle of view is indicated by a two-dot chain line extending from the camera 47 in the front-rear direction X.

[0066] <8.Image>

[0067] Here, reference is made to Fig. 6. Fig. 6 is a schematic diagram showing an example of a pattern viewed from the camera side.

[0068] 6 shows the pattern 51 as viewed through three substrates W from the loading / unloading port CT side. Of the three substrates W, substrate W1 has no deformation such as warping. Substrate W2 has upward convex warping (so-called umbrella-shaped deformation). Substrate W3 has downward convex warping (so-called bowl-shaped deformation).

[0069] When viewed horizontally from the loading / unloading port CT through these substrates W1 to W3, only the outer peripheral surface of the undeformed substrate W1 is visible in shadow. Neither the top nor bottom surfaces of the unwarped substrate W1 are visible. Therefore, the pattern body 57 that forms the background is visible at the top and bottom of the outer peripheral surface of the substrate W1. In other words, only the pattern body 57 tilted downward to the right is visible above and below the outer peripheral surface of the substrate W1. Note that a substrate W that is shifted from the imaging center C1 is imaged obliquely even if there is no deformation in the substrate W itself. As a result, the pattern body 57 may be inverted.

[0070] When substrate W2 has a convex deformation on its outer periphery, its outer periphery appears as a shadow. Furthermore, when substrate W2 has a convex deformation on its outer periphery, a reflection pattern 61 that is upside down from the pattern body 57 that forms the background is visible above the shadow of the outer periphery. In other words, when substrate W2 has a convex deformation on its outer periphery, the reflection pattern 61 is visible on top of the shadow of the outer periphery. The reflection pattern 61 is inclined downward to the left, opposite to the pattern body 57. The pattern body 57 located on the convex portion of substrate W2 (the pattern body 57 located in front of the convex portion of substrate W2) cannot be seen from the carry-in / outlet CT side. However, the pattern body 57 located above the convex portion of substrate W2 appears to be reflected by the convex portion. Therefore, the pattern body 57 appears as a reflection pattern 61 on the convex portion of substrate W2.

[0071] When substrate W3 has a convex deformation downward, its outer peripheral surface appears as a shadow. Furthermore, when substrate W3 has a convex deformation downward, a reflected pattern 61 is visible below the shadow of the outer peripheral surface. In other words, when substrate W3 has a convex deformation downward, a reflected pattern 61 is visible below the shadow of the outer peripheral surface. The reflected pattern 61 is inclined downward to the left, opposite to the pattern body 57 that forms the background. The pattern body 57 located on the convex portion of substrate W3 cannot be seen from the carry-in / outlet CT side. However, the pattern body 57 located below the convex portion of substrate W3 appears to be reflected by the convex portion. Therefore, the pattern body 57 appears as a reflected pattern 61 on the convex portion of substrate W3.

[0072] For example, as shown in FIG. 6, when the substrate W2 is positioned at the imaging center C1, the camera 47 captures an image FG indicated by the two-dot chain line. As described above with respect to the field of view, the image FG includes, for example, one substrate W as viewed directly from the loading / unloading port CT, the substrate W, and includes an area above and below the substrate W in the vertical direction Z by at least a distance corresponding to the storage pitch of the substrates W in the carrier C. Note that in FIG. 6, the two-dot chain line representing the image FG is depicted as a slightly smaller area for easier recognition. The substrate information acquisition unit 49 receives the image FG from the camera 47. The substrate information acquisition unit 49 receives height position information from the position output unit 45. Based on the substrate W, the pattern main body 57, and the reflection pattern 61 in the image FG, the substrate information acquisition unit 49 acquires substrate information, including the shape of the substrate W, such as warpage, and calculates the spacing of the substrates W in the vertical direction Z based on the substrate information. Details of this processing are described below.

[0073] <9. Operation flow>

[0074] In the following description, an example will be given in which a substrate W1 with no warpage and a substrate W2 with upwardly convex warpage are processed.

[0075] <9-1. Obtaining board information>

[0076] Here, reference is made to Figs. 7 to 13. Fig. 7 is a flowchart showing an example of a substrate information acquisition process. Figs. 8 to 10 are schematic diagrams explaining the process of acquiring substrate information about a substrate that is not warped. Figs. 11 to 13 are schematic diagrams explaining the process of acquiring substrate information about a substrate that is warped upward. That is, Figs. 8 to 10 are directed to substrate W1 in Fig. 6, and Figs. 11 to 13 are directed to substrate W2 in Fig. 6.

[0077] Step S1 The substrate information acquisition unit 49, under the control of the control unit CU, operates the camera 47 to capture an image FG. The substrate information acquisition unit 49 reads the image FG captured by the camera 47. To facilitate understanding of the invention, the following description will be given assuming that an image FG captured of only the substrate W1 and an image FG captured of only the substrate W2 are processed.

[0078] Here, to distinguish between images FG of substrate W1 and substrate W2, the image of substrate W1 is represented by the symbol FG, and the image of substrate W2 is represented by the symbol FGs. Furthermore, the number 0 is added to the symbol for images captured by camera 47 before the image processing described below is performed (images immediately after capture). The numbers increase as processing is performed on each of images FG and FGs. Furthermore, for the sake of convenience, images FG and FGs differ from the field of view described above. The shadow located to the right in parts of images FG and FGs is the right side wall of carrier C. The rectangular shadow below image FG of substrate W1 and image FGs of substrate W2 is due to a sticker attached to the outer surface of carrier C. The right side wall of carrier C is not included in the following processing.

[0079] Fig. 8(a) is an image FG0 of a substrate W with no warp immediately after it has been photographed. Fig. 11(a) is an image FGs0 of a substrate W that is convex upward immediately after it has been photographed.

[0080] Steps S2 and S3 The board information acquisition unit 49 performs preprocessing on the images FG0 and FGs0 immediately after they are captured.

[0081] Specifically, processing using a median filter is performed in step S2, and brightness value correction is performed in step S3. As a result, noise removal processing and brightness unevenness correction processing are performed on images FG0 and FGs0, resulting in images FG1 (FIG. 8(b)) and FGs1 (FIG. 11(b)).

[0082] Step S4 The board information acquisition unit 49 performs a binarization process on the image FG1 (FIG. 8(b)) and the image FGs1 (FIG. 11(b)). As a result, pixels in the image FG1 (FIG. 8(b)) and the image FGs1 (FIG. 11(b)) that are equal to or less than a predetermined brightness value are displayed as black, and pixels that exceed the predetermined brightness value are displayed as white, resulting in the images FG2 (FIG. 8(c)) and the image FGs2 (FIG. 11(c)). Note that in FIGS. 8(c) and 11(c), for convenience, the black pixels are shown in gray.

[0083] Step S5 The substrate information acquisition unit 49 extracts the top and bottom surfaces of the substrates W1 and W2.

[0084] Specifically, an opening process is performed on image FG2 (FIG. 8(c)) and image FGs2 (FIG. 11(c)), which involves multiple contractions and expansions. This separates the areas where black was connected in step S4. Furthermore, diagonal pixels consisting of a predetermined number of pixels or more are deleted. As a result, all pixels other than those constituting substrates W1 and W2, such as the pattern body 57 that constitutes the background, are deleted from image FG2 (FIG. 8(c)) and image FGs2 (FIG. 11(c)), resulting in image FG3 (FIG. 8(d)) and image FGs3 (FIG. 11(d)). Image FG3 (FIG. 8(d)) is an image of substrate W1 extracted from image FG2. In step S17, which will be described later, this image is synthesized with an edge image of the reflected pattern (image FG9 (Figure 10(a)), which will be described later) to generate an image showing the shape of substrate W1. The same applies to image FGs3. That is, image FGs3 (Figure 11(d)) is an image of substrate W2 extracted from image FGs2. In step S17, which will be described later, this image is synthesized with an edge image of the reflected pattern (Figure 13(a)), which will be described later, to generate an image showing the shape of substrate W2.

[0085] Step S6 The substrate information acquisition unit 49 sets a region of interest ROI in image FG1 (FIG. 8(b)) and image FGs1 (FIG. 11(b)) of substrate W2. The state in which the region of interest ROI has been set is shown, for example, in images FG4 (FIG. 8(e)) and FGs4 (FIG. 11(e)). The region of interest ROI is indicated by a white frame in the figure.

[0086] The region of interest ROI is set in advance taking into account the storage pitch of the carrier C. The region of interest ROI is set, for example, as follows: With respect to the vertical direction Z, it is a region that includes the substrate W, which is the subject of substrate information acquisition, and corresponds to the storage pitch of the substrate W in the up-down direction in the vertical direction Z. With respect to the width direction Y, it is a region in the width direction Y of the substrate W, which is the subject of substrate information acquisition, that corresponds to the area in front of the groove formed on the inner surface of the carrier C.

[0087] Step S7 The substrate information acquisition unit 49 performs edge extraction on the regions of interest ROI (see images FG4 (FIG. 8(e)) and FGs4 (FIG. 11(e))) set in the image FG1 (FIG. 8(b)) and the image FGs1 (FIG. 11(b)) of the substrate W2. The substrate information acquisition unit 49 extracts the edges by, for example, applying canny edge detection.

[0088] Specifically, the substrate information acquisition unit 49 performs edge detection on the regions of interest (ROI) in the image FG1 (FIG. 8(b)) of substrate W1 and the image FGs1 (FIG. 11(b)) of substrate W2 after preprocessing. As a result, edges are detected as shown in the image FG5 (FIG. 9(a)) of substrate W1 and the image FGs5 (FIG. 12(a)) of substrate W2. Specifically, edges are extracted based on the magnitude and direction of the gradient between pixels. In these images FG5 (FIG. 9(a)) and FGs5 (FIG. 12(a)), the portions extracted as edges are shown in gray for ease of illustration. In this case, FIG. 9(b) shows the pixel distribution for each angle of substrate W1, and FIG. 12(b) shows the pixel distribution for each angle of substrate W2. In both cases, two large peaks are observed. The left peak is due to the right edge of the pattern body 57, and the right peak is due to the left edge of the pattern body 57. In FIG. 12(b), due to the influence of the reflection pattern 61, there are regions where many pixels are distributed in areas other than the peaks.

[0089] Steps S8 and S9 The substrate information acquisition unit 49 extracts edge candidates of the pattern body 57 that constitutes the background.

[0090] Specifically, the substrate information acquisition unit 49 extracts edges from the image FG5 of the substrate W1 (FIG. 9(a)) and the image FGs5 of the substrate W2 (FIG. 12(a)) that have the same predetermined angle as the pattern body 57 that constitutes the background. The pattern body 57 can be extracted from the image FG5 of the substrate W1 (FIG. 9(a)) and the image FGs5 of the substrate W2 (FIG. 12(a)) based on the angle distribution, as shown in FIGS. 9(b) and 12(b). Furthermore, the substrate information acquisition unit 49 performs noise removal using an area filter. In other words, the area filter removes pixel clusters of a certain size or larger that do not constitute the edge of the pattern body 57. This results in the image FG6 of the substrate W1 (FIG. 9(c)) and the image FGs6 of the substrate W2 (FIG. 12(c)). In other words, only the pattern body 57 that constitutes the background can be extracted. In the image FG6 of the substrate W1 (FIG. 9(c)) and the image FGs6 of the substrate W2 (FIG. 12(c)), the edges of the pattern body 57 are shown in white.

[0091] Step S10 The substrate information acquisition unit 49 extracts edge candidates of the reflection pattern 61 .

[0092] Specifically, for example, from among the edges of the image FG5 (FIG. 9(a)) of the substrate W1, those that are angled differently from the pattern main body 57 that constitutes the background are extracted. Alternatively, the difference between the image FG5 (FIG. 9(a)) of the substrate W1 and the image FG6 (FIG. 9(c)), which is the edge of the pattern main body 57 that constitutes the background, is extracted. This results in, for example, the image FG7 (FIG. 9(d)) of the substrate W1. Furthermore, for example, from among the edges of the image FGs5 (FIG. 12(a)) of the substrate W2, those that are angled differently from the pattern main body 57 that constitutes the background are extracted. Alternatively, the difference between the image FGs5 (FIG. 12(a)) of the substrate W2 and the image FGs6 (FIG. 12(c)) of the substrate W2, which is the edge of the pattern main body 57 that constitutes the background, is extracted. This results in, for example, the image FGs7 (FIG. 12(d)) of the substrate W2. In other words, this step makes it possible to extract something other than the pattern main body 57 that constitutes the background.

[0093] Steps S11 and S12 The substrate information acquisition unit 49 labels the elements other than the pattern body 57 that make up the background (i.e., the edge candidates of the reflection pattern 61), and then performs horizontal expansion processing (horizontal dilation) on each edge candidate. As a result, the elements other than the pattern body 57 that make up the background (i.e., the edge candidates of the reflection pattern 61) are expanded in the horizontal direction, as in, for example, image FG8 of substrate W1 (FIG. 9(e)) and image FGs8 of substrate W2 (FIG. 12(e)).

[0094] Steps S13 to S15 The substrate information acquisition unit 49 obtains the difference area from the pattern body 57 that constitutes the background.

[0095] Specifically, the substrate information acquisition unit 49 obtains a differential region between an image FG6 (FIG. 9(c)) of the substrate W1, which is an edge of the pattern body 57 constituting the background, and an image FG8 (FIG. 9(e)) of the substrate W1, in which the edge candidate of the reflection pattern 61 is enlarged in the horizontal direction. Furthermore, if the intersection region in the differential region is a predetermined number of pixels (for example, 4 pixels) or more, it is determined to be noise and is deleted. On the other hand, if the intersection region in the differential region is less than the predetermined number of pixels (for example, 4 pixels), it is not deleted. Similarly, the substrate information acquisition unit 49 obtains a differential region between an image FGs6 (FIG. 12(c)) of the substrate W2, which is an edge of the pattern body 57 constituting the background, and an image FGs8 (FIG. 12(e)) of the substrate W2, in which the edge candidate of the reflection pattern 61 is enlarged in the horizontal direction. Furthermore, if the intersection region in the differential region is a predetermined number of pixels (for example, 4 pixels) or more, it is determined to be noise and is deleted. On the other hand, if the intersection region in the differential region is less than the predetermined number of pixels (for example, 4 pixels), it is not deleted.

[0096] This results in, for example, image FG9 of substrate W1 (FIG. 10(a)) and image FGs9 of substrate W2 (FIG. 13(a)). That is, based on image FG7 of substrate W1 (FIG. 9(d)) and image FGs7 of substrate W2 (FIG. 12(d)), which include edges other than those of pattern body 57, and image FG6 of substrate W1 (FIG. 9(c)) and image FGs6 of substrate W2 (FIG. 12(c)), which include edges other than those of reflection pattern 61, only the edges of reflection pattern 61 are extracted.

[0097] Step S16 The substrate information acquisition unit 49 removes noise from the edges of the reflection pattern 61 .

[0098] Specifically, edges that do not constitute the reflection pattern 61 are removed from the image FG9 of the substrate W1 (FIG. 10(a)) and the image FGs9 of the substrate W2 (FIG. 13(a)).

[0099] Step S17 The substrate information acquisition unit 49 calculates the sum of the areas of the upper and lower surfaces of the substrate W and the reflection pattern 61 .

[0100] Specifically, the substrate information acquisition unit 49 obtains, for example, a sum area of ​​FG3 of the substrate W1 (FIG. 8(d)) and FGs3 of the substrate W2 (FIG. 11(d)), and the reflection pattern 61 in the image FG9 of the substrate W1 (FIG. 10(a)) and the image FGs9 of the substrate W2 (FIG. 13(a)), which are edges of the reflection pattern 61. This results in, for example, an image FG10 of the substrate W1 (FIG. 10(b)) and an image FGs10 of the substrate W2 (FIG. 13(b)).

[0101] Step S18 The substrate information acquisition unit 49 performs final processing on the processed image.

[0102] The final processing is, for example, a closing process. The closing process involves multiple rounds of expansion and contraction processes. This closing process makes it possible to connect areas where pixels are disconnected. This results in, for example, image FG11 (FIG. 10(c)) of substrate W1 and image FGs11 (FIG. 13(c)) of substrate W2. Since there is no warpage in substrate W1, an outer diameter shape OL1 including the areas on the top and bottom surfaces of substrate W1 is obtained. Since there is warpage in substrate W2, an outer diameter shape OL2 including the reflection pattern 61 along the top and bottom surfaces of substrate W2 is obtained.

[0103] Step S19 The board information acquisition unit 49 calculates the board information.

[0104] Specifically, the substrate information acquisition unit 49 calculates substrate information for the substrates W1 and W2. At this time, it refers to position information in the vertical direction Z output from the position output unit 45 when the respective images FG0 and FGs0 were captured. The substrate information acquisition unit 49 calculates substrate information including the positions of the substrates W1 and W2 in the vertical direction Z and the positions of the upper and lower edges of the substrates W1 and W2 based on the position information from the position output unit 45 and the outer diameter shapes OL1 and OL2. It is preferable that this substrate information is stored in the control unit CU in association with each substrate W.

[0105] <9-2.Transportation Operation>

[0106] The transport process of the substrate W based on the substrate information will now be described with reference to Fig. 14. Fig. 14 is a flowchart showing an example of an operation related to the transport of the substrate.

[0107] Step T1 The control unit CU acquires substrate information for each substrate W in a carrier C that stores multiple substrates W to be processed using the method described above. Specifically, the control unit CU operates the hand driving unit 43 to drive the first hand 19 so that the camera 47 is positioned at the same height in the vertical direction Z as each substrate W. The control unit CU operates the substrate information acquisition unit 49 to acquire substrate information for each position where the camera 47 faces each substrate W. The control unit CU reads out the substrate information for each substrate W.

[0108] Steps T2 to T4 The control unit CU reads out substrate information relating to the substrate W to be transported. Specifically, the control unit CU reads out the position, thickness, and inclination from the corresponding substrate information for the substrate W to be transported. The thickness here includes the thickness of the substrate W itself and the thickness due to deformation of the substrate W, such as warpage.

[0109] Step T5 The control unit CU calculates the interval between the substrates W.

[0110] Specifically, the control unit CU calculates the distance based on the substrate information for the substrate W to be transported. More specifically, the control unit CU calculates the distance between the lower surface of the substrate W to be transported and the upper surface of the substrate W below it based on the substrate information for the substrate W to be transported and the substrate information for the substrate W located below the substrate W to be transported.

[0111] Step T6 The control unit CU calculates the advance position of the first hand 19 based on the substrate information corresponding to the substrate W.

[0112] Specifically, the control unit CU calculates the height in the vertical direction Z when the first hand 19 advances into the carrier C and receives the substrate W to be transported, based on the interval calculated in step T5.

[0113] Step T7 The control unit CU branches the process depending on whether or not contact occurs.

[0114] Specifically, the control unit CU determines whether the advance position of the first hand 19 calculated in step T6 will come into contact with the upper surface of the substrate W located below the substrate W to be transported. In other words, the control unit CU determines whether the first hand 19 can advance. If the control unit CU determines that there will be no contact, it branches the process to step T8. On the other hand, if the control unit CU determines that there will be contact, it branches the process to step T9.

[0115] Step T8 The control unit CU corrects the advance position of the first hand 19 to the position calculated in step T6. This allows the first hand 19 to take out the substrate W to be transported. The first hand 19 can transport the substrate W reliably regardless of whether the substrate W to be transported and the substrates W below it are deformed.

[0116] Step T9 The control unit CU issues an alarm and stops the transport. The alarm may be, for example, a display by a display unit or a lamp (not shown), or an audio alarm by a speaker (not shown).

[0117] Specifically, the control unit CU issues an alarm to alert the operator because the advance position of the first hand 19 calculated in step T6 will come into contact with the upper surface of the substrate W located below the substrate W to be transported. Furthermore, the control unit CU stops the advance operation of the first hand 19 toward the carrier C. This makes it possible to prevent the first hand 19 from coming into contact with the substrate W and damaging the substrate W.

[0118] According to this embodiment, the camera 47 captures the pattern 51 from the loading / unloading port CT side. When viewed from the loading / unloading port CT, the pattern 51 is asymmetrical above and below the surface of the substrate W, linear, and inclined at a predetermined angle. Therefore, if the shape of the substrate W is free of warpage, the pattern 51 appears as is in the image in areas other than the substrate W. On the other hand, if the shape of the substrate W is warped, the pattern 51 is reflected by the surface of the substrate W, resulting in a reflected pattern 61 that is upside down. Therefore, the image captured by the camera 47 is less susceptible to the influence of light reflected from the surface of the substrate W, and the boundary between the substrate W and the background can be clearly seen. As a result, the substrate information acquisition unit 49 can extract the reflected pattern 61 that differs by a predetermined angle from the pattern 51 in the image, and accurately calculate substrate information including the shape of the substrate W, such as warpage.

[0119] Furthermore, the control unit CU operates the hand driving unit 43 based on the substrate information obtained as described above. Therefore, the first hand 19 can be advanced and retreated without coming into contact with the multiple substrates W housed in the carrier C. As a result, the substrates W can be transported without being damaged.

[0120] The correspondence between the above-described embodiments and the present invention is as follows.

[0121] The carrier C corresponds to the "container" in the present invention. The camera 47 corresponds to the "photographing unit" in the present invention. The substrate information acquisition unit 49 corresponds to the "substrate information calculation unit" in the present invention. The indexer robot IR and the hand driving unit 43 correspond to the "photographing unit moving mechanism". The control unit CU corresponds to the "photographing unit moving mechanism control unit". The camera 47, the substrate information acquisition unit 49, and the pattern 51 correspond to the "substrate information acquisition device" in the present invention.

[0122] The first hand 19 corresponds to the "hand" in the present invention. The hand driving unit 43 corresponds to the "hand driving unit". The control unit CU corresponds to the "hand driving unit control unit". The camera 47, the substrate information acquisition unit 49, the pattern 51, the first hand 19, the hand driving unit 43, and the control unit CU correspond to the "substrate transport device" in the present invention. The control unit CU corresponds to the "determination unit" in the present invention.

[0123] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0124] (1) In this embodiment, the substrate processing apparatus 1 having the configuration shown in Figures 1 and 2 has been described as an example. However, the present invention is not limited to this configuration. In other words, the configuration of the indexer block 5 and the processing block 7 is not important. For example, the indexer block 5 does not need to have the first hand 19 and the second hand 21, but only needs to have at least one hand.

[0125] (2) In this embodiment, the substrate information acquisition device of the present invention, which includes the camera 47, the substrate information acquisition unit 49, and the pattern 51, is built into the substrate processing apparatus 1. However, the present invention is not limited to this embodiment. That is, the substrate information acquisition device, which includes the camera 47, the substrate information acquisition unit 49, and the pattern 51, may be configured as separate entities. In this case, the substrate information acquisition device acquires substrate information for each substrate W in the carrier C, transmits the substrate information to the substrate processing apparatus 1, and uses the substrate information when unloading the substrate W from the carrier C.

[0126] (3) In this embodiment, the first hand 19 (second hand 21) is provided with one camera 47. However, the present invention is not limited to this configuration. In other words, a configuration including two or more cameras 47 may be adopted.

[0127] (4) In this embodiment, the light source 53 and the pattern 51 are arranged to be spaced apart in the front-rear direction X. However, in the present invention, the light source 53 and the pattern 51 may be arranged to be in close contact with each other. Also, the size of the light source 53 and the pattern 51 may be limited to the size of the shooting area of ​​the camera 47. In this case, the light source 53 and the pattern 51 may be moved in conjunction with the movement of the camera 47 while facing the camera 47.

[0128] (5) In this embodiment, step S2 (median filter) and step S3 (brightness value correction) are performed to calculate the substrate information. However, if the image FG obtained in step S1 (photographing and reading) has little noise and little unevenness in brightness values, these processes do not need to be performed. This reduces the number of steps in the substrate information acquisition process, thereby reducing the load on the substrate information acquisition unit 49.

[0129] (6) In this embodiment, the positions of the top and bottom surfaces of the substrate W are calculated, and these positions are included in the outer diameter shapes OL1 and OL2 to form the substrate information. However, in the present invention, it is not necessary to calculate the positions of the top and bottom surfaces of the substrate W. In other words, the substrate information may include only the deformed shape, such as warpage, excluding the positions of the top and bottom surfaces of the substrate W. In this case, since the type and shape of the substrate W stored in the carrier C are known in advance based on the specifications, the positions of the top and bottom surfaces can be added to the substrate information based on the specifications.

[0130] (7) In this embodiment, canny edge detection was used to extract the reflection pattern 61, etc. However, the present invention is not limited to this method. For example, the predetermined angle of the pattern body 57 and the shape of the edge surface of the substrate W are known in advance. Therefore, the pattern body 57 and the edge surface of the substrate W may be extracted by pattern matching with the image FG, and the other parts may be extracted as the reflection pattern 61.

[0131] (8) In the above-described embodiment, the pattern 51 is disposed on the outer surface of the carrier C at the front side in the front-rear direction X. However, the present invention is not limited to such an arrangement of the pattern 51. For example, the pattern 51 may be disposed inside the carrier C. Specifically, the pattern 51 may be disposed on the inner surface of the carrier C at the front side in the front-rear direction X. Furthermore, the pattern 51 may be projected from the rear in the front-rear direction X from the loading / unloading port CT and displayed on the inner surface of the carrier C at the front side in the front-rear direction X.

[0132] (9) In the above-described embodiment, the substrate W has a circular shape in a planar view, but the present invention is not limited to such a substrate W. For example, the substrate W may have a rectangular shape in a planar view. Also, the substrate W has been described as having an umbrella-like or bowl-like warp. However, the present invention is also applicable to acquiring substrate information for a substrate W that is three-dimensionally deformed due to other warpage, such as a half-pipe-like warp.

[0133] (10) In the above-described embodiment, the photographing unit moving mechanism is configured as the indexer robot IR. However, a configuration may be adopted in which a photographing unit moving mechanism separate from the indexer robot IR is provided to move a photographing unit such as the camera 47 in the vertical direction Z.

[0134] (11) In the above-described embodiment, the camera 47 moves only in the vertical direction Z. However, the present invention is not limited to this configuration. In other words, if the camera 47 has a narrow angle of view and can only capture a portion of the center of the substrate W, the camera may be moved in the width direction Y to capture multiple images of one substrate W, which are then combined to obtain a single image FG.

[0135] (12) In the above-described embodiment, the camera 47 is used as the imaging unit, which also has a field of view in the vertical direction Z. However, the present invention is not limited to this configuration. For example, a line sensor having a field of view only in the width direction Y may be used as the imaging unit. In this case, the line sensor may be moved in the vertical direction Z to acquire one image FG.

[0136] (13) In the above-described embodiment, the camera 47, which is the photographing unit, is telecentric on the object side. However, the present invention is not limited to this configuration. That is, the camera 47 may be non-telecentric on the object side. However, distortion occurs in the image FG in areas other than the photographing center. Therefore, it is preferable to acquire board information using only the area of ​​the image FG near the photographing center. Furthermore, conversion processing may be performed on the areas of the image FG other than the photographing center to acquire board information. [Explanation of symbols]

[0137] W: Substrate 1... Substrate processing equipment 3...Loading / unloading block 5... Indexer block 7 ... Processing block X…Anteroposterior direction Y: Width direction Z: vertical direction C...Career 13 ... Mounting table IR... Indexer robot 19... First hand 21... Second hand FD… Advance / retreat direction 31... Processing unit CR... Center robot CT… Loading / unloading exit 43 ... Hand drive unit 45 … Position output section 47... Camera 49 ... Board information acquisition section 51... Pattern 53 … light source 55...Component body 57 ... Pattern body C1: Photography-focused cp...center of the board 61...reflective pattern FG... Image FG0~FG11 ... Image (no warping) FGs0~FGs11 … Image (with warping) ROI: Region of Interest OL1, OL2 ... Outer diameter shape

Claims

1. A substrate information acquisition device for acquiring substrate information including the shapes of substrates stored in a container that can store multiple substrates in a horizontal position at a distance from each other and that can load and unload substrates through an inlet / outlet formed on one side of the container, comprising: a pattern that is arranged on the opposite side of the loading / unloading port across the substrate stored in the container in a plan view, and that is asymmetrical in the vertical direction with respect to the surface of the substrate as a reference, linear, and inclined at a predetermined angle when viewed from the loading / unloading port; an imaging unit that images the pattern from the loading / unloading port side; a substrate information calculation unit that extracts the reflection pattern from the pattern in the image captured by the imaging unit and a reflection pattern that is reflected by the substrate and has a predetermined angle different from the pattern, and calculates substrate information; A substrate information acquisition device comprising:

2. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device is characterized in that the substrate information calculation unit further calculates positions of an upper surface and a lower surface of the substrate as the substrate information.

3. 2. The substrate information acquisition device according to claim 1, The substrate information acquisition device is characterized in that the substrate information calculation unit performs edge extraction on the image captured by the photographing unit, removes pixels larger than a predetermined size as noise, and then extracts the reflection pattern.

4. 4. The substrate information acquisition device according to claim 3, The substrate information acquisition device is characterized in that the substrate information calculation unit extracts the reflection pattern based on the predetermined angle.

5. 2. The substrate information acquisition device according to claim 1, an imaging unit moving mechanism that moves the imaging unit in a direction in which the plurality of substrates are stacked; an imaging unit moving mechanism control unit that controls movement of the imaging unit moving mechanism, the photographing unit moving mechanism control unit operates the photographing unit moving mechanism to photograph the plurality of substrates stored in the container with the photographing unit; The substrate information acquisition device is characterized in that the substrate information calculation unit acquires the substrate information for all of the substrates stored in the container.

6. A substrate information acquisition device according to any one of claims 1 to 5; a hand for holding the substrate; a hand driving unit that drives the hand toward and away from the container to transport the substrate and also drives the hand up and down in a vertical direction; a hand driving unit control unit that operates the hand driving unit based on the board information acquired by the board information acquisition device; A substrate transport device comprising:

7. 7. The substrate transport device according to claim 6, The substrate transport device further comprises a determination unit that determines whether or not the hand can advance into the container based on the substrate information acquired by the substrate information acquisition device.

Images