Filter apparatus for substrate treatment apparatus, substrate treatment system and clean air supply method

Abstract

To adjust the difference in treatment results between substrate treatment apparatuses in a case where a plurality of substrate treatment apparatuses are arranged in parallel and clean air is supplied to each substrate treatment apparatus from a filter apparatus common between the substrate treatment apparatuses.SOLUTION: There is provided a filter apparatus having a filter installed above a plurality of substrate treatment apparatuses arranged in parallel. The filter apparatus includes: a distribution mechanism configured to distribute, to the plurality of substrate treatment apparatuses, air supplied from an air inlet on one end portion side in a parallel direction of the substrate treatment apparatuses into a duct space formed above the filter; and a control unit configured to control the distribution mechanism according to processing environment information related to the processing environment of each of the plurality of substrate treatment apparatuses.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a filter device for a substrate processing apparatus, a substrate processing system, and a method for supplying clean air. [Background technology]

[0002] Patent Document 1 discloses a substrate processing apparatus having a coating processing section. The coating processing section has coating processing chambers arranged in layers. Each coating processing chamber is provided with a coating processing unit. Each coating processing chamber is also provided with an air supply unit. Temperature and humidity-controlled air is supplied from the air supply unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-87115 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology according to the present disclosure adjusts differences in processing results between substrate processing apparatuses when a plurality of substrate processing apparatuses are arranged in parallel and clean air is supplied to each of the substrate processing apparatuses from a filter device that is common to the substrate processing apparatuses. [Means for solving the problem]

[0005] One aspect of the present disclosure is a filter device having a filter installed above a plurality of substrate processing apparatuses arranged in parallel, the filter device having a distribution mechanism that distributes air supplied to a duct space formed above the filter from an air inlet on one end side of the substrate processing apparatuses in the parallel direction to the plurality of substrate processing apparatuses, and a control unit that controls the distribution mechanism in accordance with processing environment information related to the processing environment of each of the plurality of substrate processing apparatuses. [Effects of the Invention]

[0006] According to the present disclosure, when multiple substrate processing apparatuses are arranged in parallel and clean air is supplied to each substrate processing apparatus from a filter device common to the substrate processing apparatuses, differences in processing results between the substrate processing apparatuses can be adjusted. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is an explanatory view schematically illustrating the configuration of the front side of a coating and developing apparatus as a substrate processing system, in which a filter device according to an embodiment of the present invention is mounted. [Figure 2] FIG. 2 is a top view showing the inside of the liquid treatment module. [Figure 3] FIG. 2 is a cross-sectional view of the front side of the filter device. [Figure 4] FIG. 10 is a top view of the duct member with the adjustment mechanism attached. [Figure 5] FIG. [Figure 6] FIG. [Figure 7] FIG. 4 is a cross-sectional view of the air volume adjustment mechanism. [Figure 8] FIG. 10 is a diagram illustrating an example of control of the filter device. [Figure 9] FIG. 10 is a diagram illustrating an example of control of the filter device. [Figure 10] FIG. 10 is a diagram illustrating an example of control of the filter device. [Figure 11] 10 is a top view illustrating another example of the damper of the air volume adjustment mechanism. FIG. [Figure 12] FIG. 10 is a perspective view illustrating another example of the partition member. [Figure 13] FIG. 10 is a cross-sectional view illustrating another example of the air volume adjustment mechanism. [Figure 14] FIG. 10 is an explanatory diagram showing another example of the arrangement of the air volume sensor. [Figure 15] FIG. 10 is an explanatory diagram showing another example of the arrangement of the air volume sensor. [Figure 16] FIG. 10 is an explanatory diagram showing another example of the liquid treatment module. [Figure 17] FIG. 10 is an explanatory diagram showing an example of a measurement wafer. [Figure 18] FIG. 10 is an explanatory view showing another example of a coating and developing apparatus. DETAILED DESCRIPTION OF THE INVENTION

[0008] 2. Description of the Related Art In a photolithography process in the manufacturing process of semiconductor devices and the like, a resist pattern is formed on a semiconductor wafer (hereinafter referred to as a "wafer") as a substrate.

[0009] To form this resist pattern, the wafer is transported to a coating and developing apparatus where the resist is coated and developed, and then the wafer is subjected to liquid processing of the resist.Then the wafer is transported to an exposure apparatus where the desired pattern is exposed, and then the wafer is subjected to a development process to form the resist pattern.

[0010] Clean air with regulated temperature and humidity is supplied to various substrate processing equipment installed in the coating and developing apparatus. For example, to a resist coating equipment that applies resist, clean air at a predetermined temperature and humidity is supplied downflow from above through a filter device. This is because changes in temperature and humidity affect the thickness of the coated resist film.

[0011] Clean air is supplied to the filter device, for example, via a duct (hereinafter referred to as a "vertical duct") installed vertically from an air conditioner installed outside the coating and developing apparatus. When supplying clean air from the filter device to various substrate processing apparatuses, the filter device causes the clean air to flow from the vertical duct into a horizontally extending duct space via an intake at one end of each substrate processing module accommodating the substrate processing apparatus. The filter device then supplies the clean air in the duct space via a filter disposed below the duct space in a downflow manner to each substrate processing apparatus below the filter.

[0012] Recently, multiple substrate processing apparatuses are sometimes installed in a single substrate processing module enclosed by a casing. For example, two liquid processing apparatuses are sometimes arranged side by side in a single casing of a liquid processing module. Each liquid processing apparatus has a cup with an open top that surrounds a spin chuck that holds and rotates a substrate. Clean air, the temperature and humidity of which has been adjusted, is supplied to the cup of each liquid processing apparatus by a downflow from a filter device located above the cup.

[0013] In a configuration in which multiple substrate processing apparatuses are arranged in a single casing, the filter device may be shared among the substrate processing apparatuses in the casing. In this case, the desired processing results may not be obtained in both the substrate processing apparatuses close to the vertical duct and the substrate processing apparatuses far from the vertical duct. Specifically, for example, when the substrate processing apparatuses are resist coating apparatuses in which the thickness of the coating film varies depending on the flow rate of the downflow, variations in manufacturing may cause the downflow rate to which the substrate to be processed is exposed to differ between the coating apparatuses close to the vertical duct and the coating apparatuses far from the vertical duct, and one of the coating apparatuses may not be able to form a resist film of the desired thickness on the substrate.

[0014] Therefore, the technology disclosed herein adjusts the differences in processing results between substrate processing apparatuses when multiple substrate processing apparatuses are arranged in parallel and clean air is supplied to each substrate processing apparatus from a filter device that is common to the substrate processing apparatuses.

[0015] Hereinafter, the configuration of the filter device for a substrate processing apparatus and the substrate processing system according to the present embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted.

[0016] <Coating and developing equipment> FIG. 1 is an explanatory view schematically illustrating the configuration of the front side of a coating and developing apparatus as a substrate processing system, which is equipped with a filter device according to this embodiment.

[0017] The coating and developing apparatus 1 in Figure 1 has a configuration in which a carrier block 2, which carries in and out a carrier C containing multiple substrates such as wafers, a processing block 3 equipped with multiple substrate processing devices that perform predetermined processing on the wafers, and an interface block 5 that transfers wafers to and from an exposure processing device 4 are connected together.

[0018] Liquid treatment modules 11 are mounted in multiple stages in processing block 3. Each liquid treatment module 11 is partitioned by a casing and contains a liquid treatment device serving as a substrate treatment device within the casing. Furthermore, heat treatment modules (not shown) are mounted in multiple stages in processing block 3. Each heat treatment module is partitioned by a casing and contains a heat treatment device serving as a substrate treatment device within the casing. Furthermore, processing block 3 is provided with a so-called chemical box 12 in which various treatment liquids to be supplied to liquid treatment modules 11 are stored in exchangeable tanks.

[0019] The coating and developing apparatus 1 described above is provided with at least one controller M. The controller M processes computer-executable instructions that cause the coating and developing apparatus 1 to perform the various processes described in this disclosure. The controller M may be configured to control each element of the coating and developing apparatus 1 to perform the various processes described herein. In one embodiment, part or all of the controller M may be included in the coating and developing apparatus 1. The controller M may include a processor, a storage unit, and a communication interface. The controller M may be implemented, for example, by a computer. The processor may be configured to read from the storage unit a program that provides logic or routines that enable various control operations and execute the read program to perform various control operations. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processor for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The storage medium may be temporary or non-temporary. The processor may be a CPU (Central Processing Unit) or one or more circuits. The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the coating and developing apparatus 1 via a communication line such as a LAN (Local Area Network).

[0020] The control unit M also functions as a control unit for the filter device 30 described below.

[0021] <Liquid treatment module 11> Next, liquid treatment module 11 will be described with reference to Fig. 1 and using Fig. 2. Fig. 2 is a top view showing the inside of liquid treatment module 11.

[0022] 2, liquid treatment module 11 has a plurality of (two in the illustrated example) liquid treatment devices 21 arranged in parallel within casing 20. Hereinafter, the direction in which liquid treatment devices 21 are arranged in parallel (X direction in the figure) may be referred to as the device width direction, and the direction perpendicular to the device width direction in the horizontal plane (Y direction in the figure) may be referred to as the depth direction.

[0023] Each liquid processing device 21 is a device that processes wafers using a processing liquid, and specifically, is a coating device that forms various coating films, such as a resist coating film, on wafers. Each liquid processing device 21 may be a liquid processing device other than a coating device, such as a developing device that develops wafers using a developer as a processing liquid.

[0024] The liquid treatment devices 21 included in one liquid treatment module 11 have the same configuration. Each liquid processing device 21 has a spin chuck 22 and a cup 23. The spin chuck 22 holds and rotates a wafer. The cup 23 contains the wafer and has an open top to prevent processing liquid (specifically, resist, etc.) from scattering from the wafer on the spin chuck 22 to the surrounding area.

[0025] Also provided within casing 20 are nozzles 24 that discharge a processing liquid (specifically, resist or the like) onto the wafer held by spin chuck 22, and a movement mechanism 25 that moves nozzle 24 in the horizontal direction. In this embodiment, nozzle 24 and movement mechanism 25 are shared among a plurality of liquid processing apparatuses 21.

[0026] The moving mechanism 25 includes a rail 25a, an arm 25b, and a driving mechanism 25c.

[0027] Rail 25a is provided so as to extend along the width direction of the apparatus (X direction in FIG. 2) on one side in the depth direction of cup 23 (negative side in the Y direction in FIG. 2). Rail 25a is formed from the outside of one side in the width direction of the apparatus (negative side in the X direction in FIG. 2) of cup 23 of multiple liquid processing apparatuses 21 to the other side in the width direction of the apparatus (outside the positive side in the X direction in FIG. 2). Arm 25b is provided on rail 25a and is movable on rail 25a by drive mechanism 25c. Drive mechanism 25c has a drive source (not shown) such as a motor that generates a drive force for moving arm 25b along rail 25a. When drive mechanism 25c moves arm 25b on rail 25a, nozzle 24 can move from a standby section (not shown) provided between cups 23 of multiple liquid processing devices 21 to above the wafers in cups 23. Drive mechanism 25c may also be provided with a drive source (not shown) that generates a drive force for raising and lowering arm 25b.

[0028] Furthermore, as shown in FIG. 1, a filter device 30 is disposed above liquid treatment device 21 within liquid treatment module 11 (specifically, within casing 20).

[0029] Air adjusted to a predetermined temperature and humidity, for example, 23°C and 45% RH, is supplied to each filter device 30 from an air conditioner 6 installed outside the coating and developing apparatus 1 through ducts 7 and 8 installed in the vertical direction within the coating and developing apparatus 1 to the filter device 30 of each liquid processing module 11.

[0030] 2, air flow sensor 26 is provided within liquid treatment module 11. Specifically, for example, air flow sensor 26 is provided for each liquid treatment device 21, and is disposed between cup 23 and filter device 30 within casing 20. Air flow sensor 26 is supported and fixed via support member 27 to a wall on one side in the depth direction of casing 20, i.e., the rear wall.

[0031] <Filter device> Next, the filter device 30 will be described with reference to Figs. 3 to 7. Fig. 3 is a cross-sectional view of the front side of the filter device 30. Fig. 4 is a top view of a duct member (described later) with an adjustment mechanism (described later) attached. Fig. 5 is a perspective view of a partition member (described later). Fig. 6 is a perspective view of a circulating portion (described later). Fig. 7 is a cross-sectional view of an air volume adjustment mechanism (described later).

[0032] 3, the filter device 30 has a top plate 31, a duct member 32, a nonwoven fabric 33, a filter 34, and a rectifying plate 35, which are stacked in this order from top to bottom. The space surrounded by the top plate 31, the duct member 32, and the nonwoven fabric 33 constitutes a duct space Z.

[0033] Duct member 32 has an open top and bottom, and has a rectangular frame structure surrounded on all four sides by a front wall 32a, a side wall 32b at one end in the device width direction (the positive side in the X direction in the figure), a back wall 32c, and a side wall 32d at the other end in the device width direction (the negative side in the X direction in the figure), as shown in Fig. 4. Side wall 32b is formed with an air inlet 32e, which is connected to duct 7 or duct 8 described above and is configured to take in air from ducts 7, 8 whose temperature and humidity have been adjusted.

[0034] The duct member 32 has an airflow guide member 40 that divides the duct space Z in the vertical direction. This airflow guide member 40 has an introduction section 41 that continues obliquely from the end of the air inlet 32e on the rear side (positive side in the Y direction in the figure) toward the front side (negative side in the Y direction in the figure), and a guide section 42 that continues from the introduction section 41 and extends parallel to the front wall 32a and the rear wall 32c at a different angle in a plan view. The airflow guide member 40 may be omitted.

[0035] A partition member 43 is provided between the terminal end of the guide portion 42 and the side wall 32d on the other end side. The partition member 43 has a partition plate 44. The partition plate 44 is a plate-shaped member that vertically divides at least the upper portion of the duct space Z and is disposed parallel to the side wall 32b. The partition plate 44 separates the duct space Z into a first space Z1 on one end side and a second space Z2 on the other end side. The front side (negative side in the Y direction in the figure) of the airflow guide member 40 in the first space Z1 forms a front space Z1a, and the back side (positive side in the Y direction in the figure) of the airflow guide member 40 in the first space Z1 forms a rear space Z1b. However, the front space Z1a and the rear space Z1b are connected by the space between the terminal end of the guide portion 42 and the partition plate 44.

[0036] As shown in FIG. 5, the partition plate 44 has openings 45 formed therein in the width direction of the device (X direction in the drawing) through which air passes.

[0037] The opening 45 has a first opening 45a at a first height position, specifically, the first opening 45a at a height position that is the lower part of the partition plate 44. The opening position of this first opening 45a is set, for example, on the rear side (towards the rear wall 32c) of the position where the terminal end of the guide portion 42 extends linearly to the side wall 32d and intersects with the partition plate 44 in a plan view. A gap exists between the lower end of the partition plate 44 on the front side (front wall 32a side) where the first opening 45a is not provided and the nonwoven fabric 33 below.

[0038] Furthermore, the opening 45 has second openings 45b at a second height position different from the first height position, the second openings 45b having smaller dimensions in the up-down direction and depth direction (Y direction in the figure) than the first openings 45a. Specifically, the opening 45 has the second openings 45b at a height position that is above the partition plate 44. A plurality of second openings 45b are provided, for example, along the depth direction.

[0039] In addition to the partition plate 44, the partition member 43 has a horizontal plate 46. The horizontal plate 46 is a plate-shaped member that extends from the upper end of the partition plate 44 in the device width direction (X direction in the figure) and in the depth direction (Y direction in the figure) along the top plate 31 that covers the upper part of the duct space Z. Specifically, the horizontal plate 46 extends in the device width direction toward the other end side (negative side of the X direction in the figure).

[0040] 4, airflow guide member 40 is positioned so as to overlap cup 23 of liquid processing device 21 at one end (positive side in the X direction in the figure) located downward in plan view, and center P of cup 23 is located on the rear side of guide portion 42 of airflow guide member 40, i.e., in rear space Z1b. Center P of cup 23 of liquid processing device 21 at the other end (negative side in the X direction in the figure) is also located near the rear side of second space Z2.

[0041] Furthermore, as shown in FIG. 6, the guide portion 42 of the airflow guide member 40 has, for example, a plurality of flow passage portions 42a formed at the lower end of the guide portion 42, which connect the front space Z1a and the rear space Z1b.

[0042] The nonwoven fabric 33 constituting the lower side of the duct space Z is made up of, for example, four layers of nonwoven fabric. The top layer of nonwoven fabric is formed in an L-shape that covers one end side near the air inlet 32e and the back side, and the other three layers of nonwoven fabric 33 may be formed in a rectangular shape. Note that lath mesh is appropriately sandwiched between the nonwoven fabric 33 to provide rigidity and ensure shape maintenance and flatness.

[0043] A filter 34 is disposed below the bottom nonwoven fabric layer. The filter 34 is, for example, a ULPA filter.

[0044] A rectifying plate 35 is disposed below the filter 34. In this embodiment, a perforated metal plate 35a having a large number of holes formed on its underside is disposed, and spacers 35b are provided on all four sides of the perforated metal plate 35a. Therefore, the spacers 35b create a space S between the bottom surface of the filter 34 and the top surface of the perforated metal plate 35a.

[0045] In the filter device 30, air from the ducts 7 and 8 flows into the duct space Z through an air inlet 32e formed at one end of the duct member 32 of the filter device 30. At this time, in terms of the horizontal airflow, the inflowing air flows along the introduction portion 41 and guide portion 42 of the airflow guide member 40 into the front space Z1a on the front side (front wall 32a side) of the duct space Z. After colliding with the partition plate 44, some of the air can flow into the second space Z2 through the first opening 45a and the second opening 45b of the partition plate 44. Furthermore, after colliding with the partition plate 44, another portion of the air flows into the back space Z1b on the back side (rear wall 32c side) of the airflow guide member 40.

[0046] On the other hand, the air in the front space Z1a flows from the flow passage 42a provided in the guide portion 42 of the airflow guide member 40 to above the cup 23 in the rear space Z1b.

[0047] The air that flows into the front space Z1a of the first space Z1, the air that flows into the back space Z1b, and the air that flows into the second space Z2 is purified through the lower nonwoven fabric 33 and the filter 34, and flows through the upper space S in the straightening plate 35, through the punched metal 35a, and above the liquid treatment device 21 below.

[0048] 3 and 4, filter device 30 further includes air volume adjustment mechanism 50, which is a distribution mechanism. The distribution mechanism distributes air, which is supplied to duct space Z from air inlet 32e formed at one end of the device width direction, which is the direction in which multiple liquid processing devices 21 are arranged side by side, to multiple liquid processing devices 21.

[0049] Air volume adjustment mechanism 50 is a mechanism that variably adjusts the amount of air flowing from first space Z1 on the air inlet 32e side in duct space Z to second space Z2 adjacent to first space Z1 in the device width direction. Air volume adjustment mechanism 50 is provided at a position between the devices in multiple liquid processing devices 21 in a plan view. In the present embodiment, air volume adjustment mechanism 50 also includes partition member 43 described above, and therefore partition member 43 is also provided at a position between the devices in a plan view. The position between the devices is specifically the position between the cup 23 of the liquid processing device 21 at one end of the device width direction (positive side of the X direction in the figure) and the cup 23 of the liquid processing device 21 at the other end of the device width direction (negative side of the X direction in the figure).

[0050] As shown in FIG. 7, the air volume adjustment mechanism 50 includes a damper 51 and a rotary shaft 52. The damper 51 is a plate-like member extending in the depth direction (Y direction in the figure), specifically, a plate-like member with the depth direction as its longitudinal direction. The rotation shaft 52 is provided so as to extend in the depth direction. For example, the rotation shaft 52 is connected to an end of the damper 51 in the short side direction. The damper 51 is configured to be rotatable around the central axis of the rotation shaft 52.

[0051] The damper 51 is provided so as to be able to close the opening 45 of the partition plate 44 . Specifically, the damper 51 is provided so as to be able to selectively block the first opening 45a and the second opening 45b of the partition plate 44.

[0052] For example, the pivot shaft 52 is provided at a third height position between a first height position where the first opening 45a is provided and a second height position where the second opening 45b is provided, and the damper 51 can take the following initial state, first state, and second state. In the initial state, the damper 51 closes the second opening 45b and opens the first opening 45a. The first state is a state rotated 90° from the initial state, and the damper 51 opens both the first opening 45a and the second opening 45b. The second state is a state rotated 180 degrees from the initial state, and the damper 51 closes the first opening 45a and opens the second opening 45b.

[0053] Even in the second state, there is a gap between the tip of the damper 51 and the nonwoven fabric 33 below it.

[0054] In the filter device 30, air that has flowed into the first space Z1 is supplied to the liquid treatment device 21 adjacent to the air inlet 32e side of the air volume adjustment mechanism 50 in a planar view, and air that has flowed into the second space Z2, with the inflow rate adjusted by the air volume adjustment mechanism 50, is supplied to the liquid treatment device 21 adjacent to the opposite side of the air inlet 32e side of the air volume adjustment mechanism 50 in a planar view.

[0055] 4, the rotation shaft 52 extends to the outside of the duct space Z in the depth direction (Y direction in the figure). For example, the rotation shaft 52 is provided so as to extend to the outside of the front side of the duct member 32. The portion of the rotation shaft 52 that extends to the outside of the duct space Z is connected to a drive mechanism 53 that drives the rotation of the rotation shaft 52. The drive mechanism 53 has a drive source (not shown), such as a motor, that generates a drive force for rotating the rotation shaft 52 about the axis of the rotation shaft 52. When the rotation shaft 52 rotates, the damper 51 rotates about the rotation shaft 52.

[0056] Drive mechanism 53 is controlled by control unit M. Specifically, drive mechanism 53 is controlled by control unit M in accordance with information on the air volume of each liquid processing apparatus 21 to which filter device 30 supplies clean air. The air volume information is based on the detection result of air volume sensor 26. The air volume information is also an example of processing environment information, which is information related to the processing environment of liquid processing apparatus 21.

[0057] <Control example 1> Next, an example of control of the filter device 30 will be described with reference to FIGS. First, the control unit M controls the drive mechanism 53 to set the damper 51 to its initial state as shown in FIG. 8, causing the damper 51 to block the second opening 45b and open the first opening 45a, so that air from the first space Z1 is supplied to the second space Z2 through the first opening 45a but is not supplied to the second space Z2 through the second opening 45b. In this state, the flow rate of air supplied from filter device 30 is detected by air flow sensor 26 corresponding to each liquid processing device 21 .

[0058] As a result of the detection, if the air volume supplied to the liquid processing device 21 at one end (i.e., the air volume supplied to the liquid processing device 21 closest to the air inlet 32e) is equal to the air volume supplied to the liquid processing device 21 at the other end (i.e., the air volume supplied to the liquid processing device 21 farthest from the air inlet 32e) (specifically, if the difference in air volume is within a predetermined range), the control unit M causes the damper 51 to maintain its initial state.

[0059] Furthermore, if the detection result indicates that the airflow rate to liquid processing device 21 at the other end (i.e., the airflow rate to liquid processing device 21 far from air inlet 32e) is greater than the airflow rate to liquid processing device 21 at one end (i.e., the airflow rate to liquid processing device 21 closer to air inlet 32e) (specifically, if the difference in airflow rates exceeds a predetermined threshold), controller M performs control as follows. That is, controller M controls airflow rate adjustment mechanism 50 to reduce the airflow rate to liquid processing device 21 farther from air inlet 32e. More specifically, controller M controls drive mechanism 53 to set damper 51 to the second state as shown in FIG. 9, so that air from first space Z1 is supplied to second space Z2 through second opening 45b but is not supplied to second space Z2 through first opening 45a. Because the sum of the opening areas of second openings 45b is smaller than the opening area of ​​first opening 45a, setting damper 51 to the second state as described above reduces the flow rate of air flowing into second space Z2 compared to the initial state. Therefore, the amount of air supplied from second space Z2 to the remote liquid treatment device 21 can be reduced.

[0060] On the other hand, if the detection result shows that the airflow rate to liquid processing device 21 at the other end (i.e., the airflow rate to liquid processing device 21 far from air inlet 32e) is smaller than the airflow rate to liquid processing device 21 at one end (i.e., the airflow rate to liquid processing device 21 close to air inlet 32e) (specifically, if the airflow rate difference is below a predetermined threshold), controller M performs control as follows. That is, controller M controls airflow rate adjustment mechanism 50 so as to increase the airflow rate to liquid processing device 21 far from air inlet 32e. More specifically, controller M controls drive mechanism 53 to set damper 51 to the first state as shown in FIG. 10, so that air from first space Z1 is supplied to second space Z2 through both first opening 45a and second opening 45b. This increases the airflow rate to be supplied from second space Z2 to liquid processing device 21 far from air inlet 32e.

[0061] <Control example 2> If the desired result cannot be obtained by controlling as in Control Example 1, the angle of the damper 51 may be changed in stages until the desired result is obtained. For example, when control is performed as in control example 1 and the damper 51 is set to the second state, if the air volume supplied to the liquid processing device 21 far from the air inlet 32e becomes too small, the control unit M may reduce the angle of the damper 51 in stages (for example, by 10°) from 180° until the air volume detected by the corresponding air volume sensor 26 falls within a predetermined range.

[0062] Furthermore, when control is performed as in control example 1 and the damper 51 is in the first state, if the air volume supplied to the liquid processing device 21 far from the air inlet 32e becomes too large, the control unit M may decrease or increase the angle of the damper 51 in stages (for example, by 10 degrees) from 90° until the air volume detected by the corresponding air volume sensor 26 falls within a predetermined range.

[0063] In these cases, the control unit M may change the angle of the damper 51 more finely (for example, in increments of 5°) around the angle of the damper 51 when the air volume falls within the predetermined range, and specify the angle of the damper 51 that will provide an air volume closer to the target value. In this case, the process of changing the angle more finely and specifying the angle of the damper 51 may be repeated.

[0064] In addition, when control is performed as in control example 1 and the damper 51 is in the first state, if the amount of air supplied to the liquid processing device 21 far from the air inlet 32e remains small, or if the damper 51 is in the second state, if the amount of air supplied to the liquid processing device 21 far from the air inlet 32e remains large, an error may be notified via an alarm unit (not shown).

[0065] <Effects of the Structure of the Filter Device 30> As described above, the filter device 30 includes a filter 34 installed above a plurality of liquid processing devices 21 arranged in parallel. The air inlet 32e is formed at one end of the duct space Z formed above the filter 34 in the arrangement direction of the liquid processing devices 21. The filter device 30 also includes an air volume adjustment mechanism 50 that variably adjusts the amount of air flowing from the first space Z1 on the air inlet 32e side of the duct space Z to the second space Z2 adjacent to the first space Z1 in the arrangement direction. This allows for adjustment of the difference between the air volume supplied to one liquid processing device 21 via the first space Z1 and the filter 34 and the air volume supplied to another liquid processing device 21 via the second space Z2 and the filter 34. This allows for adjustment of the difference in processing results between the first liquid processing device 21 and the other liquid processing devices 21 that are arranged in parallel and have the same configuration. Specifically, for example, this prevents differences in processing results between the first liquid processing device 21 and the other liquid processing devices 21. It is also possible to intentionally create a difference in processing results between the first liquid processing device 21 and the second liquid processing device 21. That is, air volume adjustment mechanism 50 may adjust the amount of air flowing into second space Z2 so that the difference in processing results between the first liquid processing device 21 and the second liquid processing device 21 is a desired value.

[0066] Incidentally, the flow velocity may be higher in the area directly below air volume adjustment mechanism 50 than in other areas, i.e., a localized strong downflow may be formed. In filter device 30, in a plan view, air volume adjustment mechanism 50 is provided at a position between multiple liquid processing devices 21 arranged in parallel. Therefore, even if a strong downflow is formed directly below air volume adjustment mechanism 50, the strong downflow can be prevented from locally impinging on liquid processing device 21 (specifically, on wafer W in cup 23 thereof). Therefore, the uniformity of the processing results of liquid processing device 21 across the wafer surface can be prevented from being impaired by the strong downflow directly below air volume adjustment mechanism 50.

[0067] Furthermore, in this embodiment, a horizontal plate 46 is provided. As described above, the horizontal plate 46 is a plate-shaped member that extends from the upper end of the partition plate 44 along the top plate 31 covering the upper part of the duct space Z in the parallel arrangement direction of the liquid processing devices 21 and in the depth direction (Y direction in the figure) that intersects (specifically, is perpendicular to) the parallel arrangement direction. Therefore, pressure loss in the gap between the horizontal plate 46 and the top plate 31 is large, making it difficult for air to flow through the gap. This can prevent the top plate 31 from bending due to air flowing through the gap. Furthermore, it can prevent the adjustment of the amount of air flowing into the second space Z2 from becoming difficult due to bending of the top plate 31.

[0068] <Effects of the control according to this embodiment> In the filter device 30 according to this embodiment, the controller M, which controls the air volume adjustment mechanism 50 described above as a distribution mechanism, controls the air volume adjustment mechanism 50 according to the processing environment information (specifically, air volume information) of each of the plurality of liquid processing devices. This allows for adjustment of the difference in the volume of air supplied to each of the liquid processing devices 21 arranged in parallel with the same configuration. This also allows for adjustment of the difference in processing results between the devices. For example, this makes it possible to prevent differences in processing results between the liquid processing devices 21 arranged in parallel with the same configuration. Note that differences in processing results may be intentionally created between the liquid processing devices 21 arranged in parallel with the same configuration.

[0069] <Other Examples of Damper 51 and Partition Plate 44> Fig. 11 is a top view illustrating another example of the damper 51 of the air volume adjustment mechanism 50. Fig. 12 is a perspective view illustrating another example of the partition member 43.

[0070] 11, the damper 51 of the air volume adjustment mechanism 50 may be divided into multiple pieces (two pieces in the example shown in the figure) along the depth direction (the Y direction in the figure), and each damper 51 may be configured to be rotatable independently of one another about the central axis of a rotation shaft 52. In this example, one damper 51 and the corresponding rotation shaft 52 are provided on one end side of the partition plate 44 (the positive side in the X direction in the figure), and the other damper 51 and the corresponding rotation shaft 52 are provided on the other end side of the partition plate 44 (the negative side in the X direction in the figure). By providing the damper 51 in this manner, the air volume adjustment mechanism 50 can more precisely adjust the amount of air flowing into the second space Z2.

[0071] In this example, the amount of air flowing into the second space Z2 may be adjusted using either the damper 51 on one end side of the partition plate 44 (positive side in the X direction in the figure) or the damper 51 on the other end side of the partition plate 44 (negative side in the X direction in the figure), or both may be used to adjust the amount of air.

[0072] 5, the first opening 45a of the partition plate 44 has a shape such that the rear side (positive side in the Y direction in the figure) of the lower part of the partition plate 44 is cut out. As shown in FIG. 12, the first opening 45a of the partition plate 44 may have a shape such that the lower part of the partition plate 44 is cut out over the entire depth direction (Y direction in the figure).

[0073] <Another example of the air volume adjustment mechanism 50> FIG. 13 is a cross-sectional view illustrating another example of the air volume adjustment mechanism 50. As shown in FIG. The air volume adjustment mechanism 50 of FIG. 13 has a guide plate 61 that guides the air that has passed through the opening 45 of the partition plate 44. The guide plate 61 is a plate-like member that extends in the depth direction (Y direction in the figure), and more specifically, is a plate-like member whose longitudinal direction is the depth direction. The guide plate 61 is configured to be rotatable around the central axis of a rotation shaft 62. The rotation shaft 62 is provided to extend in the depth direction (Y direction in the figure). The rotation shaft 62 is connected to an end of the guide plate 61 in the short side direction. The rotation shaft 62 is also connected to a drive mechanism (not shown) that drives the rotation of the rotation shaft 62. The drive mechanism has a drive source such as a motor that generates a drive force for moving the rotation shaft 62 around the axis of the rotation shaft 62.

[0074] The guide plate 61 is provided on the other end side (negative side in the X direction in the drawing) of the partition plate 44. The rotation shaft 62 is provided on the upper part of the other end side (negative side in the X direction in the drawing) of the partition plate 44.

[0075] By rotating guide plate 61 and tilting its tip end from the horizontal, air that has passed through second opening 45b of partition plate 44 can be guided diagonally downward. Therefore, the flow rate of air that passes through second opening 45b of partition plate 44 and is supplied to liquid treatment device 21 on the other end side (negative side in the X direction in the figure) can be increased. Guide plate 61 is useful as a countermeasure when the speed of air supplied to liquid treatment device 21 on the other end side (negative side in the Z direction in the drawing) cannot be made sufficiently high even when damper 51 is in the initial state. The guide plate 61 can also be used as follows: That is, the guide plate 61 can close the second opening 45b, and the damper 51 can adjust the amount of airflow passing through the first opening 45a.

[0076] <Number of air flow sensors 26 installed> A plurality of air volume sensors 26 may be provided for each liquid processing device 21.

[0077] <Another example of arrangement of air volume sensor 26 and control of air volume adjustment mechanism 50> 14 and 15 are explanatory diagrams showing other examples of the arrangement of the air volume sensor 26. In FIG.

[0078] 14, the air flow sensor 26 may be provided on the upper surface of an arm 25b of the movement mechanism 25 of the nozzle 24. In this case, the movement mechanism 25 of the nozzle 24 also serves as the movement mechanism for the air flow sensor 26, and the movement mechanism 25 allows the air flow sensor 26 to move in the horizontal direction.

[0079] 15, a moving mechanism 70 for the air volume sensor 26 may be provided separately from the moving mechanism 25 for the nozzle 24. The moving mechanism 70 includes, for example, an arm 70a and a driving mechanism 70b.

[0080] The arm 70a has the air flow sensor 26 attached to its upper surface. Specifically, the base end of the arm 70a is connected to the drive mechanism 70b, and the air flow sensor 26 is attached to the upper surface of the tip end of the arm 70a. The arm 70a can be rotated by the drive mechanism 70b about a vertical axis passing through the base end. The drive mechanism 70b has a drive source (not shown), such as a motor, that generates the driving force for the above-mentioned rotation of the arm 70a. When the drive mechanism 70b rotates the arm 70a about the vertical axis, the air flow sensor 26 moves horizontally; specifically, it rotates about the vertical axis.

[0081] When the air flow sensor 26 is configured to be movable horizontally, as in the configuration shown in Figures 14 and 15, detection by the air flow sensor 26 can be performed at multiple different points above the wafer for each liquid processing device 21. In this case, controller M acquires, as processing environment information, information on the air volume detected by air volume sensor 26 for each of the plurality of points for each liquid processing apparatus 21. Controller M then controls air volume adjustment mechanism 50, which is a distribution mechanism, in accordance with the air volume information at each of the plurality of points acquired for each liquid processing apparatus 21. For example, controller M calculates the average value of the acquired air volumes for each liquid processing apparatus 21, and controls air volume adjustment mechanism 50 in accordance with the average air volume for each of the plurality of liquid processing apparatuses 21. More specifically, for example, when the average value of the air volume supplied to liquid processing apparatuses 21 on the other end side (i.e., the air volume supplied to liquid processing apparatuses 21 far from air inlet 32e) is greater than the average value of the air volume supplied to liquid processing apparatuses 21 on one end side (i.e., the air volume supplied to liquid processing apparatuses 21 close to air inlet 32e), controller M sets damper 51 to the second state.

[0082] In addition, the control unit M may control the air volume adjustment mechanism 50 according to the information on the air volume at each of the above-mentioned multiple points acquired for each liquid processing device 21 so as to improve the uniformity of the air volume within the wafer surface at each liquid processing device 21.

[0083] <Another example of processing environment information 1> FIG. 16 is an explanatory diagram showing another example of the liquid treatment module 11. As shown in FIG. In the above description, the processing environment information has been information about air volume. The processing environment information may be at least one of temperature and humidity. In this case, for example, as shown in FIG. 16 , a temperature / humidity sensor 80 that detects both temperature and humidity is provided for each liquid processing apparatus 21 in liquid processing module 11. Because temperature / humidity sensor 80 is relatively large, if it overlaps with a wafer in the corresponding liquid processing apparatus 21 in a planar view, there is a risk that temperature / humidity sensor 80 will block the air from filter device 30. Therefore, temperature / humidity sensor 80 is provided, for example, at a position that does not overlap with a wafer in the corresponding liquid processing apparatus 21 in a planar view. The detection result by temperature / humidity sensor 80 at a position that does not overlap with a wafer in liquid processing apparatus 21 in a planar view may be calibrated based on a previously acquired correspondence between the detection result by temperature / humidity sensor 80 at that position and the detection result by the temperature / humidity sensor on spin chuck 22.

[0084] In this case, for example, the control unit M controls the drive mechanism 53 to set the damper 51 to the initial state, and in this state, for each liquid processing device 21, the corresponding temperature and humidity sensor 80 detects the temperature and humidity inside the liquid processing device 21.

[0085] If the detected temperature and humidity are equal between liquid treatment device 21 closer to air inlet 32e and liquid treatment device 21 farther from air inlet 32e, control unit M causes damper 51 to maintain the initial state.

[0086] Furthermore, if the detection result indicates that the temperature or humidity of the liquid treatment device 21 farther from the air inlet 32e is higher than that of the liquid treatment device 21 closer to the air inlet 32e, the controller M sets the damper 51 to the first state to increase the amount of air flowing into the second space Z2. Air supplied to the liquid treatment device 21 from the second space Z2 tends to stay in the duct space Z longer than air supplied to the liquid treatment device 21 from the first space Z1, and becomes hotter due to heat-generating components (e.g., electrical devices) in the duct space Z. As described above, by increasing the amount of air flowing into the second space Z2, the air supplied to the liquid treatment device 21 from the second space Z2 stays in the duct space Z for a shorter time, resulting in a lower temperature. Supplying this low-temperature air from the second space Z2 to the liquid treatment device 21 farther from the air inlet 32e reduces the temperature and increases the humidity within the liquid treatment device 21.

[0087] On the other hand, if the detection result indicates that the temperature or humidity of liquid treatment device 21 farther from air inlet 32e is lower than that of liquid treatment device 21 closer to air inlet 32e, controller M sets damper 51 to the second state to reduce the amount of air flowing into second space Z2. This causes the air supplied from second space Z2 to liquid treatment device 21 to remain in duct space Z for a long time and become hot. By supplying this hot air from second space Z2 to liquid treatment device 21 farther from air inlet 32e, the temperature in liquid treatment device 21 can be increased and the humidity can be reduced.

[0088] Instead of the temperature and humidity sensor 80 that measures both temperature and humidity, a temperature sensor that measures only temperature or a humidity sensor that measures only humidity may be provided.

[0089] <Another Example of Arrangement of Air Volume Sensor 26 and Temperature / Humidity Sensor 80> FIG. 17 is an explanatory diagram showing an example of a measuring wafer. As shown in FIG. 17, the air flow sensor 26 and the temperature and humidity sensor 80 may be mounted on a measurement wafer Wm that serves as a measurement substrate simulating a product wafer. The measurement wafer Wm has a main body Wm1 of the same shape as the product wafer. An air flow sensor 26 and a temperature / humidity sensor 80 are mounted on the upper surface of the main body Wm1. Specifically, a plurality of air flow sensors 26 are provided along the circumferential direction on the upper surface of the peripheral portion of the main body Wm1, and one air flow sensor 26 is mounted on the upper surface of the central portion of the main body Wm1, and one temperature / humidity sensor 80 is mounted on the upper surface of the central portion of the main body Wm1.

[0090] While the measurement wafer Wm is placed on the spin chuck 22, detection is performed by the air flow sensor 26 and the temperature and humidity sensor 80. The detection results are transmitted to the control unit M via a transmitting unit (not shown) mounted on the measurement wafer Wm.

[0091] In this case, the processing environment information is based on the detection results of the air flow sensor 26 and the temperature and humidity sensor 80 received by the control unit M from the test wafer Wm.

[0092] <Another example of processing environment information 2> FIG. 18 is an explanatory view showing another example of the coating and developing apparatus 1. As shown in FIG. The processing environment information may be based on the inspection results of an inspection device 90 that inspects wafers after processing by liquid processing device 21. Inspection device 90 is provided, for example, in at least one of carrier block 2 and interface block 5. Inspection device 90 performs inspection, for example, based on captured images of the wafers.

[0093] Inspection device 90 measures the thickness of the coating film on the wafer, which is affected by the volume of air supplied from filter device 30, for example, when liquid processing device 21 is a coating device.

[0094] In this case, for example, the control unit M controls the drive mechanism 53 to set the damper 51 to the initial state, and in this state, for each liquid processing device 21, the inspection device 90 detects the thickness of the coating film formed on the wafer after the coating process by the liquid processing device 21.

[0095] If the detection result shows that the thickness of the coating film is equal between liquid treatment device 21 closer to air inlet 32e and liquid treatment device 21 farther from air inlet 32e, control unit M causes damper 51 to maintain the initial state.

[0096] Furthermore, if the detection result shows that the liquid treatment device 21 farther from the air inlet 32e has a thicker coating film than the liquid treatment device 21 closer to the air inlet 32e, the control unit M sets the damper 51 to the first state, increasing the amount of air flowing into the second space Z2 and increasing the amount of air supplied from the second space Z2 to the liquid treatment device 21 farther from the air inlet 32e. On the other hand, if the detection result shows that the coating film is thinner on the liquid treatment device 21 farther from the air inlet 32e than on the liquid treatment device 21 closer to the air inlet 32e, the control unit M sets the damper 51 to the second state, reducing the amount of air flowing into the second space Z2 and reducing the amount of air supplied from the second space Z2 to the liquid treatment device 21 farther away.

[0097] Depending on the type of processing liquid, the angle of the damper 51 may be adjusted in a pattern opposite to that of the above example. For example, information associating the type of processing liquid with the adjustment mode of the angle of the damper 51 is stored in a storage unit (not shown), and the adjustment mode of the angle of the damper 51 is determined by the control unit M based on the associated information.

[0098] Furthermore, when liquid processing apparatus 21 is a developing apparatus, inspection apparatus 90 may measure the dimension (CD: Critical Dimension) of the resist pattern after development, which is affected by the temperature inside liquid processing apparatus 21.

[0099] In this case, for example, the control unit M controls the drive mechanism 53 to set the damper 51 to the initial state, and in this state, for each liquid processing device 21, the inspection device 90 detects the dimensions of the resist pattern formed on the wafer after the development process by the liquid processing device 21.

[0100] If the detection result shows that the resist pattern dimensions are equal between liquid processing apparatus 21 closer to air inlet 32e and liquid processing apparatus 21 farther from air inlet 32e, control unit M causes damper 51 to maintain the initial state.

[0101] Furthermore, if the detection result shows that the resist pattern dimensions are thicker in the liquid processing device 21 farther from the air inlet 32e than in the liquid processing device 21 closer to the air inlet 32e, the control unit M sets the damper 51 to the first state, increasing the amount of air flowing into the second space Z2 and increasing the amount of air supplied from the second space Z2 to the liquid processing device 21 that is farther away. On the other hand, if the detection result shows that the resist pattern dimensions are thinner in the liquid processing device 21 farther from the air inlet 32e than in the liquid processing device 21 closer to the air inlet 32e, the control unit M sets the damper 51 to the second state, reducing the amount of air flowing into the second space Z2 and reducing the amount of air supplied from the second space Z2 to the liquid processing device 21 that is farther away.

[0102] Depending on the type of processing liquid, the angle of the damper 51 may be adjusted in a pattern opposite to that of the above example. For example, information associating the type of processing liquid with the adjustment mode of the angle of the damper 51 is stored in a storage unit (not shown), and the adjustment mode of the angle of the damper 51 is determined by the control unit M based on the associated information.

[0103] <Other variations> When the air volume adjustment mechanism 50 is not controlled by the control unit M, the drive mechanism 53 may be omitted, and the damper 51 of the air volume adjustment mechanism 50 may be rotated manually by an operator.

[0104] The inspection apparatus 90 may be mounted on another semiconductor manufacturing apparatus that transports wafers between the coating and developing apparatus 1 in carrier units.

[0105] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0106] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects.

[0107] Note that the following configuration examples also fall within the technical scope of the present disclosure. (1) A filter device having a filter installed above a plurality of substrate processing apparatuses arranged in parallel, a distribution mechanism that distributes air supplied from an air inlet on one end side of the substrate processing apparatuses in a parallel arrangement direction into a duct space formed above the filter to the plurality of substrate processing apparatuses; a control unit that controls the distribution mechanism in accordance with processing environment information relating to the processing environment of each of the plurality of substrate processing apparatuses. (2) The processing environment information is information on air volume, The control unit controls the distribution mechanism so that the air volume of the substrate processing apparatus farther from the air inlet is reduced when the air volume of the substrate processing apparatus farther from the air inlet is greater than that of the substrate processing apparatus closer to the air inlet, a filter device for a substrate processing apparatus described in (1). (3) The processing environment information is information on air volume, The control unit controls the distribution mechanism so that the air volume of the substrate processing apparatus farther from the air inlet is larger than that of the substrate processing apparatus closer to the air inlet, when the air volume of the substrate processing apparatus farther from the air inlet is smaller than that of the substrate processing apparatus closer to the air inlet. (4) A filter device for a substrate processing apparatus according to any one of (1) to (3) above; the plurality of substrate processing apparatuses; an air flow sensor provided for each of the substrate processing apparatuses, The substrate processing system, wherein the processing environment information is based on a detection result of the air volume sensor. (5) The substrate processing system according to (4), wherein the air flow sensors are provided so as to overlap, in a plan view, with the substrates in the corresponding substrate processing apparatuses at least during detection. (6) The substrate processing system according to (5), further comprising a moving mechanism for moving the air flow sensor in a horizontal direction. (7) The substrate processing apparatus includes: a discharge nozzle that discharges a processing liquid onto a substrate; a moving mechanism that moves the discharge nozzle in a horizontal direction, The substrate processing system according to (6), wherein the moving mechanism for the discharge nozzle also serves as the moving mechanism for the air volume sensor. (8) The substrate processing system described in (6) or (7), wherein the control unit controls the distribution mechanism according to the processing environment information based on the detection results by the air volume sensor at multiple different points above the substrate. (9) The filter device for a substrate processing apparatus according to (1), the plurality of substrate processing apparatuses; a temperature and humidity sensor provided for each of the substrate processing apparatuses to detect at least one of temperature and humidity, The processing environment information is based on the detection results of the temperature and humidity sensor. (10) The substrate processing system according to (9), wherein the temperature and humidity sensors are provided at positions that do not overlap with the corresponding substrates in the substrate processing apparatus in a plan view. (11) The filter device for a substrate processing apparatus according to (1), the plurality of substrate processing apparatuses; an inspection device that inspects the substrate after processing by the substrate processing device, The substrate processing system, wherein the processing environment information is based on an inspection result of the inspection device. (12) The filter device for a substrate processing apparatus according to (1), the plurality of substrate processing apparatuses, The substrate processing system, wherein the processing environment information is based on a detection result received from a measurement substrate in the substrate processing apparatus and detected by a sensor mounted on the measurement substrate. (13) A filter device for a substrate processing apparatus described in any one of (1) to (12), wherein the distribution mechanism includes an air volume adjustment mechanism that variably adjusts the amount of air flowing from a first space on the air inlet side in the duct space to a second space adjacent to the first space in the parallel direction. (14) The air volume adjustment mechanism includes a plate-shaped damper extending in a depth direction intersecting with the parallel direction in a horizontal plane, The filter device for use in a substrate processing apparatus according to (13), wherein the damper is configured to be rotatable about a rotation axis extending in the depth direction. (15) The rotation shaft extends to the outside of the duct space in the depth direction and is connected to a drive mechanism that drives the rotation of the rotation shaft, The filter device for a substrate processing apparatus according to (14), wherein the control unit controls the drive mechanism in accordance with the processing environment information of each of the plurality of substrate processing apparatuses. (16) The filter device for a substrate processing apparatus according to (15), wherein the control unit adjusts the angle of the damper in accordance with the processing environment information of each of the plurality of substrate processing apparatuses. (17) A method for supplying clean air to a plurality of substrate processing apparatuses arranged in parallel, using a filter device having a filter installed above the substrate processing apparatuses, comprising: a step of distributing air supplied to a duct space formed above the filter from an air inlet at one end of the substrate processing apparatus in a parallel direction to the plurality of substrate processing apparatuses in accordance with processing environment information related to the processing environment of each of the plurality of substrate processing apparatuses. [Explanation of symbols]

[0108] 21 Liquid treatment equipment 30 Filter device 32e Air inlet 34 Filters 50 Air volume adjustment mechanism M control section

Claims

1. A filter device having a filter installed above a plurality of substrate processing devices arranged in parallel, a distribution mechanism that distributes air supplied from an air inlet on one end side of the substrate processing apparatuses in a parallel arrangement direction into a duct space formed above the filter to the plurality of substrate processing apparatuses; a control unit that controls the distribution mechanism in accordance with processing environment information relating to the processing environment of each of the plurality of substrate processing apparatuses.

2. The processing environment information is information on air volume, The filter device for a substrate processing apparatus as described in claim 1, wherein the control unit controls the distribution mechanism so that the air volume of the substrate processing apparatus farther from the air inlet is reduced when the air volume of the substrate processing apparatus farther from the air inlet is greater than that of the substrate processing apparatus closer to the air inlet.

3. The processing environment information is information on air volume, The filter device for a substrate processing apparatus as described in claim 1, wherein the control unit controls the distribution mechanism so that the air volume of the substrate processing apparatus farther from the air inlet is larger when the air volume of the substrate processing apparatus farther from the air inlet is smaller than that of the substrate processing apparatus closer to the air inlet.

4. The filter device for a substrate processing apparatus according to any one of claims 1 to 3, the plurality of substrate processing apparatuses; an air flow sensor provided for each of the substrate processing apparatuses, The substrate processing system, wherein the processing environment information is based on a detection result of the air volume sensor.

5. The substrate processing system according to claim 4 , wherein the air flow sensors are provided so as to overlap, in a plan view, with the substrates in the corresponding substrate processing apparatus at least during detection.

6. The substrate processing system according to claim 5 , further comprising a moving mechanism that moves the air flow sensor in a horizontal direction.

7. The substrate processing apparatus includes: a discharge nozzle that discharges a processing liquid onto a substrate; a moving mechanism that moves the discharge nozzle in a horizontal direction, The substrate processing system according to claim 6 , wherein the moving mechanism for the discharge nozzle also serves as the moving mechanism for the air flow sensor.

8. 7. The substrate processing system according to claim 6, wherein the control unit controls the distribution mechanism in accordance with the processing environment information based on detection results by the air volume sensors at a plurality of different points above the substrate.

9. The filter device for a substrate processing apparatus according to claim 1 ; the plurality of substrate processing apparatuses; a temperature and humidity sensor provided for each of the substrate processing apparatuses to detect at least one of temperature and humidity, The processing environment information is based on the detection results of the temperature and humidity sensor.

10. 10. The substrate processing system according to claim 9, wherein the temperature and humidity sensors are provided at positions that do not overlap with the substrates in the corresponding substrate processing apparatus in a plan view.

11. The filter device for a substrate processing apparatus according to claim 1 ; the plurality of substrate processing apparatuses; an inspection device that inspects the substrate after processing by the substrate processing device, The substrate processing system, wherein the processing environment information is based on an inspection result of the inspection device.

12. The filter device for a substrate processing apparatus according to claim 1 ; the plurality of substrate processing apparatuses, The substrate processing system, wherein the processing environment information is based on a detection result received from a measurement substrate in the substrate processing apparatus and detected by a sensor mounted on the measurement substrate.

13. A filter device for a substrate processing apparatus as described in any one of claims 1 to 3, wherein the distribution mechanism includes an air volume adjustment mechanism that variably adjusts the amount of air flowing from a first space on the air inlet side in the duct space to a second space adjacent to the first space in the parallel direction.

14. the air volume adjustment mechanism includes a plate-shaped damper extending in a depth direction intersecting with the parallel direction in a horizontal plane, 14. The filter device for use in a substrate processing apparatus according to claim 13, wherein the damper is configured to be rotatable about a rotation axis extending in the depth direction.

15. the rotation shaft extends to the outside of the duct space in the depth direction and is connected to a drive mechanism that drives the rotation of the rotation shaft, 15. The filter device for use in a substrate processing apparatus according to claim 14, wherein the control unit controls the drive mechanism in accordance with the processing environment information for each of the plurality of substrate processing apparatuses.

16. 16. The filter device for use in a substrate processing apparatus according to claim 15, wherein the control unit adjusts an angle of the damper in accordance with the processing environment information of each of the plurality of substrate processing apparatuses.

17. 1. A method for supplying clean air to a plurality of substrate processing apparatuses arranged in parallel, using a filter device having a filter installed above the substrate processing apparatuses, comprising: a step of distributing air supplied to a duct space formed above the filter from an air inlet at one end of the substrate processing apparatus in a parallel direction to the plurality of substrate processing apparatuses in accordance with processing environment information related to the processing environment of each of the plurality of substrate processing apparatuses.

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