Substrate transfer device

Abstract

To provide a substrate transfer device that improves a transfer accuracy.SOLUTION: A substrate transfer device includes: a planar motor which is provided in a transfer chamber having an accuracy required region and a transfer region which is a region other than the accuracy required region and in which a plurality of tile-shaped units having coils and Hall elements are arranged; a transfer unit which has a permanent magnet and which moves on the tile-shaped units to transfer a substrate; a temperature sensor for measuring a temperature distribution of the entire planar motor; a thermo camera provided in a ceiling of the transfer chamber and configured to detect a temperature distribution of the tile-shaped unit in the accuracy-required region; and a control part configured to estimate a position of the transfer unit based on a temperature of the hall element and a detection value of the Hall element. The accuracy required region includes a position of the transfer unit when transferring and / or receiving the substrate to and from a mounting table. The control part estimates the temperature of the hall element in the accuracy required region based on the temperature distribution of the plurality of tile-shaped units imaged by the thermo camera.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a substrate transport apparatus. [Background technology]

[0002] Patent Document 1 discloses a substrate transfer device that includes a transfer unit that magnetically levitates on a planar motor provided in a transfer chamber and transfers a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-86986 Summary of the Invention [Problem to be solved by the invention]

[0004] In one aspect, an object is to provide a substrate transport device that improves transport accuracy. [Means for solving the problem]

[0005] In order to solve the above problem, according to one aspect, a substrate transport device is provided, comprising: a planar motor arranged in a transport chamber having a precision-requiring area and a transport area outside the precision-requiring area, and having a plurality of tile-shaped units each having a coil and a Hall element; a transport unit having a permanent magnet and moving over the tile-shaped units to transport a substrate; a temperature sensor for measuring the temperature distribution of the entire planar motor; a thermal camera arranged on the ceiling of the transport chamber and detecting the temperature distribution of the tile-shaped units within the precision-requiring area; and a control unit for estimating the position of the transport unit based on the temperature of the Hall element and the detection value of the Hall element, wherein the precision-requiring area includes the position of the transport unit when transferring and / or receiving the substrate from a mounting table, and the control unit estimates the temperature of the Hall element within the precision-requiring area based on the temperature distribution of the tile-shaped units imaged by the thermal camera. [Effects of the Invention]

[0006] According to one aspect, it is possible to provide a substrate transport device that improves transport accuracy. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a plan view showing an example of a configuration of a substrate processing system according to an embodiment; [Figure 2] FIG. 2 is a perspective view illustrating an example of a transport unit according to an embodiment. [Figure 3] FIG. 2 is a perspective view illustrating the driving principle of the substrate transport device. [Figure 4] FIG. 10 is a plan view showing an example of the arrangement of temperature sensors. [Figure 5] FIG. 10 is an example of a plan view illustrating the arrangement of temperature sensors in a tile in a precision-requiring area. [Figure 6] FIG. 3 is a functional block diagram of a control unit. [Figure 7] FIG. 10 is an example of a plan view illustrating alignment of the transport unit when placing a substrate on the placing table. [Figure 8] FIG. 10 is another example of a plan view illustrating alignment of the transport unit when placing a substrate on the placing table. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0009] <Substrate Processing System 100> An example of the overall configuration of a substrate processing system 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a plan view showing the configuration of an example of a substrate processing system 100 according to an embodiment.

[0010] The substrate processing system 100 shown in Fig. 1 is a cluster structure (multi-chamber type) system. The substrate processing system 100 includes multiple processing chambers 110, a vacuum transfer chamber 120, a load lock chamber 130, an atmospheric transfer chamber 140, a load port 150, and a control unit 160. In Fig. 1, the longitudinal direction of the vacuum transfer chamber 120 is defined as the X direction, the lateral direction (width direction) of the vacuum transfer chamber 120 is defined as the Y direction, and the height direction of the vacuum transfer chamber 120 is defined as the Z direction.

[0011] The processing chamber 110 is depressurized to a predetermined vacuum atmosphere, and performs a desired process (etching process, film formation process, cleaning process, ashing process, etc.) on a semiconductor wafer (hereinafter also referred to as a "substrate W") therein. The processing chamber 110 is disposed adjacent to a vacuum transfer chamber 120. The processing chamber 110 and the vacuum transfer chamber 120 are connected by opening and closing a gate valve 112. The processing chamber 110 has a mounting table 111 on which the substrate W is placed. The operation of each part for processing in the processing chamber 110 is controlled by a control unit 160.

[0012] The vacuum transfer chamber 120 is connected to multiple chambers (processing chamber 110, load lock chamber 130) via gate valves 112 and 132 and is depressurized to a predetermined vacuum atmosphere. A substrate transfer device 125 for transferring a substrate W is provided inside the vacuum transfer chamber 120. The substrate transfer device 125 includes a planar motor 10 disposed in the vacuum transfer chamber 120 and multiple transfer units 30 (30A, 30B) that are movable on the planar motor 10. The transfer unit 30 includes a mover 31 that is movable on the planar motor 10 and an arm 32 configured to hold the substrate W. The substrate transfer device 125 transfers the substrate W between the processing chamber 110 and the vacuum transfer chamber 120 in response to the opening and closing of the gate valve 112. The substrate transfer device 125 transfers the substrate W between the load lock chamber 130 and the vacuum transfer chamber 120 in response to the opening and closing of the gate valve 132. The operation of substrate transfer device 125 and the opening and closing of gate valves 112 and 132 are controlled by control unit 160. Substrate transfer device 125 (planar motor 10, transfer unit 30) will be described later with reference to FIGS.

[0013] Furthermore, the vacuum transfer chamber 120 has an accuracy-requiring region 200 (shown by a two-dot chain line in FIG. 1 ) where high alignment accuracy is required when the transfer unit 30 moves. For example, the position of the transfer unit 30 when the transfer unit 30 transfers the substrate W to and / or receives the substrate W from the mounting table 111 in the processing chamber 110 is the accuracy-requiring region 200 where high alignment accuracy is required. The position of the transfer unit 30 when the transfer unit 30 transfers the substrate W to and / or receives the substrate W from the mounting table 111 in the load lock chamber 130 may also be the accuracy-requiring region 200.

[0014] On the other hand, within the vacuum transfer chamber 120, a transfer area 210 (an area other than the accuracy-requiring area 200 within the vacuum transfer chamber 120) that connects the accuracy-requiring area 200 to another accuracy-requiring area 200 is an area in which the same level of alignment accuracy of the transfer unit 30 as that of the accuracy-requiring area 200 is not required.

[0015] The load lock chamber 130 is provided between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. The load lock chamber 130 has a mounting table 131 on which a substrate W is placed. The load lock chamber 130 is capable of switching between an atmospheric atmosphere and a vacuum atmosphere. The load lock chamber 130 and the vacuum transfer chamber 120, which has a vacuum atmosphere, are connected by opening and closing a gate valve 132. The load lock chamber 130 and the atmospheric transfer chamber 140, which has an atmospheric atmosphere, are connected by opening and closing a door valve 133. The switching between the vacuum atmosphere and the atmospheric atmosphere in the load lock chamber 130 is controlled by a control unit 160.

[0016] The atmospheric transfer chamber 140 has an atmospheric atmosphere, and for example, a downflow of clean air is formed. A transfer device (not shown) for transferring the substrate W is provided inside the atmospheric transfer chamber 140. The transfer device (not shown) transfers the substrate W between the load lock chamber 130 and the atmospheric transfer chamber 140 in response to the opening and closing of a door valve 133. The operation of the transfer device (not shown) and the opening and closing of the door valve 133 are controlled by a control unit 160.

[0017] A load port 150 is provided on a wall surface of the atmospheric transfer chamber 140. A carrier (not shown) containing a substrate W or an empty carrier is attached to the load port 150. For example, a FOUP (Front Opening Unified Pod) or the like can be used as the carrier.

[0018] The transfer device (not shown) can take out the substrate W accommodated in the carrier attached to the load port 150 and place it on the mounting table 131 of the load lock chamber 130. The transfer device (not shown) can also take out the substrate W placed on the mounting table 131 of the load lock chamber 130 and store it in the carrier attached to the load port 150.

[0019] The control unit 160 has a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and HDD (Hard Disk Drive). The control unit 160 is not limited to an HDD and may have other storage areas such as an SSD (Solid State Drive). The storage areas such as the HDD and RAM store recipes in which process procedures, process conditions, and transport conditions are set.

[0020] The CPU controls the processing of the substrate W in each processing chamber 110 in accordance with a recipe and controls the transport of the substrate W. The HDD or RAM may store a program for executing the processing of the substrate W in each processing chamber 110 and the transport of the substrate W. The program may be provided by being stored in a storage medium, or may be provided from an external device via a network.

[0021] Next, an example of the operation of the substrate processing system 100 will be described. Here, as an example of the operation of the substrate processing system 100, an operation will be described in which a substrate W accommodated in a carrier attached to the load port 150 is processed in the processing chamber 110 and then accommodated in an empty carrier attached to the load port 150. At the start of the operation, the gate valves 112, 132 and the door valve 133 are closed, and the inside of the load lock chamber 130 is an atmospheric atmosphere.

[0022] The control unit 160 opens the door valve 133. The control unit 160 controls the transfer device in the atmospheric transfer chamber 140 to remove the substrate W from the carrier in the load port 150 and place it on the mounting table 131 in the load lock chamber 130. Once the substrate W is placed on the mounting table 131 in the load lock chamber 130 and the transfer device is retracted from the load lock chamber 130, the control unit 160 closes the door valve 133.

[0023] The control unit 160 controls an exhaust device (not shown) of the load lock chamber 130 to exhaust the air inside the chamber, and switches the load lock chamber 130 from an air atmosphere to a vacuum atmosphere.

[0024] Next, the substrate W placed on the mounting table 131 of the load lock chamber 130 is transported to the processing chamber 110 and placed on the mounting table 111. Specifically, the control unit 160 opens the gate valve 132. The control unit 160 controls the substrate transfer device 125, which will be described later, to insert the arm 32 into the load lock chamber 130 to a preset delivery position, hold the substrate W placed on the mounting table 131 of the load lock chamber 130, and transfer it to the vacuum transfer chamber 120. When the arm 32 retreats from the load lock chamber 130, the control unit 160 closes the gate valve 132.

[0025] The control unit 160 opens the gate valve 112 of the destination processing chamber 110. The control unit 160 controls the substrate transfer device 125 to insert the arm 32 into the processing chamber 110 to a preset delivery position, and places the held substrate W on the mounting table 111 in the processing chamber 110. When the arm 32 retreats from the processing chamber 110, the control unit 160 closes the gate valve 112.

[0026] The control unit 160 controls the processing chamber 110 to perform a desired processing on the substrate W.

[0027] When the processing of the substrate W is completed, the substrate W placed on the mounting table 111 in the processing chamber 110 is transferred to the load lock chamber 130 and placed on the mounting table 131. Specifically, the control unit 160 opens the gate valve 112. The control unit 160 controls the substrate transfer device 125 to insert the arm 32 into the processing chamber 110 to a preset delivery position, hold the substrate W placed on the mounting table 111 in the processing chamber 110, and transfer it to the vacuum transfer chamber 120. When the arm 32 retracts from the processing chamber 110, the control unit 160 closes the gate valve 112.

[0028] The control unit 160 opens the gate valve 132. The control unit 160 controls the substrate transport device 125 to insert the arm 32 into the load lock chamber 130 to a preset delivery position, and places the held substrate W on the mounting table 131 of the load lock chamber 130. When the arm 32 retreats from the load lock chamber 130, the control unit 160 closes the gate valve 132.

[0029] The control unit 160 controls a gas supply device (not shown) of the load lock chamber 130 to supply, for example, clean air into the chamber, and switches the load lock chamber 130 from a vacuum atmosphere to an air atmosphere.

[0030] The control unit 160 opens the door valve 133. The control unit 160 controls the transfer device (not shown) to remove the substrate W placed on the mounting table 131 of the load lock chamber 130 and store it in the carrier of the load port 150. When the substrate W is removed from the mounting table 131 of the load lock chamber 130 and the transfer device (not shown) is retracted from the load lock chamber 130, the control unit 160 closes the door valve 133.

[0031] In the substrate processing system 100, the substrate transfer device 125 has been described as being configured to transfer a substrate W placed on the mounting table 131 of the load lock chamber 130 to the mounting table 111 of the processing chamber 110, and to transfer a processed substrate W from the mounting table 111 of the processing chamber 110 to the mounting table 131 of the load lock chamber 130, but the present invention is not limited to this. The substrate transfer device 125 may also be configured to transfer a substrate W placed on the mounting table 111 of one processing chamber 110 to the mounting table 111 of another processing chamber 110.

[0032] <Substrate transport device 125> Next, the substrate transfer device 125 will be further described. The substrate transfer device 125 has a planar motor 10 arranged in the vacuum transfer chamber 120 and a transfer unit 30 that is movable on the planar motor 10. As shown in FIG. 4, which will be described later, the planar motor 10 is formed by arranging a plurality of tile-shaped units 11 (see FIG. 3) inside the vacuum transfer chamber 120.

[0033] 2 is a perspective view showing an example of a transfer unit 30 according to one embodiment. The transfer unit 30 has a mover 31 and an arm 32. The mover 31 is configured to be able to move by magnetic levitation on the planar motor 10. The arm 32 is configured so that one end side is fixed to the mover 31 and the other end side is able to hold a substrate W. Furthermore, a plurality of transfer units 30 may be provided in the vacuum transfer chamber 120.

[0034] The tile-shaped unit 11 of the planar motor 10 and the mover 31 of the transport unit 30 will be further described with reference to Figure 3. Figure 3 is a perspective view illustrating the driving principle of the substrate transport device 125.

[0035] The tile-shaped unit 11 of the planar motor 10 has a plurality of coils 15 arranged in a housing 14 made of non-magnetic metal or resin. The coils 15 generate a magnetic field when a current is supplied to them. The control unit 160 (see FIG. 1) is configured to be able to individually control the value of the current passed through each coil 15.

[0036] Mover 31 has an array of multiple permanent magnets 35. The magnetic field generated by coils 15 allows mover 31 to magnetically levitate above tile-shaped units 11. The magnetic field generated by coils 15 also allows mover 31 to move above tile-shaped units 11, and thus move above planar motor 10 formed by multiple tile-shaped units 11.

[0037] With this configuration, the control unit 160 (see FIG. 1) is configured to be able to control the position (horizontal position (X-axis direction, Y-axis direction), vertical position (Z-axis direction) (floating amount)) and orientation (tilt around the X-axis, tilt around the Y-axis, tilt around the Z-axis) of the transport unit 30 (mover 31) by controlling the current value of each coil 15 of the planar motor 10 (tile-shaped unit 11).

[0038] The tile-shaped unit 11 also has a plurality of Hall elements (position detection sensors) 16 provided within the housing 14. The Hall elements 16 are an example of a magnetic sensor, and are sensors for detecting the position and orientation of the mover 31. That is, the Hall elements 16 detect a detection value (Hall voltage) corresponding to the magnetic flux density generated by the permanent magnets 35 of the mover 31. The detection values ​​of the Hall elements 16 are input to the control unit 160 (see FIG. 1). The control unit 160 calculates the magnetic flux density at the position of each Hall element 16 (magnetic flux measurement position) based on the detection values ​​of the plurality of Hall elements 16, and estimates the position and orientation of the mover 31 based on the calculated magnetic flux densities at the plurality of magnetic flux measurement positions.

[0039] Here, a plurality of coils 15 and Hall elements 16 are provided inside the housing 14 of the tile-shaped unit 11. When the transport unit 30 is levitated and moved on the planar motor 10, electricity is passed through the coil 15 corresponding to the position of the transport unit 30. When electricity is passed through the coil 15, the coil 15 generates heat, and the heat from the coil 15 is transferred to the Hall elements 16. The heat from the coil 15 is also transferred to the Hall elements 16 in the adjacent tile-shaped units 11. This can cause temperature differences in the Hall elements 16.

[0040] The sensitivity of the Hall elements 16 decreases as the temperature rises. Therefore, if a temperature difference occurs between the multiple Hall elements 16, a difference in sensitivity will occur between the multiple Hall elements 16. As a result, the position and orientation of the mover 31 estimated based on the magnetic flux density detected by the Hall elements 16 may differ from the actual position and orientation of the mover 31. This may reduce the positioning accuracy of the transport unit 30.

[0041] Here, in the planar motor 10 of this embodiment, a temperature sensor 17 is provided inside the housing 14 of the tile-shaped unit 11. A thermocouple, for example, can be used as the temperature sensor 17. The detected value of the temperature sensor 17 is input to the control unit 160 (see FIG. 1).

[0042] Next, the arrangement of the temperature sensors 17 (17A, 17B) will be described with reference to Figures 4 and 5. Figure 4 is an example of a plan view showing the arrangement of the temperature sensors 17.

[0043] The planar motor 10 of this embodiment is formed by arranging a plurality of tile-shaped units 11. A precision-requiring area 200 is provided on the planar motor 10. A temperature sensor 17A is provided in the precision-requiring area 200 of the planar motor 10.

[0044] FIG. 5 is an example of a plan view illustrating the arrangement of the temperature sensors 17A in the tile shaped unit 11 in the precision-requiring region 200. In FIG.

[0045] 5(a), a temperature sensor 17A may be provided for each Hall element 16. This allows the temperature of each Hall element 16 in the accuracy-requiring region 200 to be detected with high accuracy.

[0046] 5(b), the temperature sensor 17A may be provided in a plurality of Hall elements 16 within the tile-shaped unit 11. For example, in a rectangular tile-shaped unit 11, the temperature sensors 17A may be provided at the corners and the center. This makes it possible to estimate the temperature distribution within the tile-shaped unit 11 in the accuracy-requiring region 200 based on the temperature detected by the temperature sensor 17A, and to estimate the temperature of each Hall element 16 in the accuracy-requiring region 200. Furthermore, the number of temperature sensors 17A can be reduced, thereby reducing the cost of the tile-shaped unit 11.

[0047] Returning to Figure 4, the planar motor 10 is provided with a temperature sensor 17B for measuring the temperature distribution throughout the planar motor 10. For example, in a rectangular planar motor 10 formed by arranging multiple tile-shaped units 11, multiple temperature sensors 17B may be provided along the outer periphery, with a temperature sensor 17B provided toward the center of the planar motor 10. This makes it possible to estimate the temperature distribution within the planar motor 10 and the temperature of each Hall element 16 in the precision-requiring region 200 based on the temperatures detected by the temperature sensors 17B.

[0048] Next, the control unit 160 that estimates the position of the transport unit 30 will be described with reference to Fig. 6. Fig. 6 is an example of a functional block diagram of the control unit 160. The control unit 160 has a temperature acquisition unit 161, a Hall element temperature estimation unit 162, a magnetic flux density calculation unit 163, and a position estimation unit 164. The memory unit of the control unit 160 stores the positions (temperature measurement positions) of the temperature sensors 17 (17A, 17B) and the position (magnetic flux measurement position) of the Hall elements 16.

[0049] The temperature acquisition unit 161 receives the detected value of the temperature sensor 17 and acquires the temperature at each temperature measurement position detected by the temperature sensor 17.

[0050] The Hall element temperature estimation unit 162 estimates the temperature of each Hall element 16 based on the temperatures at each temperature measurement position acquired by the temperature acquisition unit 161. For example, when estimating the temperature of the Hall elements 16 within the accuracy-requiring area 200, the Hall element temperature estimation unit 162 estimates the temperature distribution of the tile-shaped units 11 within the accuracy-requiring area 200 based on the temperatures at each temperature measurement position detected by the temperature sensor 17A, and estimates the temperature of each Hall element 16 based on the estimated temperature distribution of the tile-shaped units 11. When estimating the temperature of the Hall elements 16 within the transfer area 210 (see FIG. 1), the Hall element temperature estimation unit 162 estimates the temperature distribution of the planar motor 10 based on the temperatures at each temperature measurement position detected by the temperature sensor 17B, and estimates the temperature of each Hall element 16 based on the estimated temperature distribution of the planar motor 10.

[0051] The magnetic flux density calculation unit 163 receives the temperature of each Hall element 16 estimated by the Hall element temperature estimation unit 162 and the detection value (Hall voltage) of the Hall element 16, and calculates the magnetic flux density at each magnetic flux measurement position detected by the Hall element 16. Here, the magnetic flux density calculation unit 163 compensates the detection value of the Hall element 16 based on the temperature of the Hall element 16 estimated by the Hall element temperature estimation unit 162 and the temperature characteristics of the Hall element 16. In this way, the magnetic flux density calculation unit 163 calculates the magnetic flux density at each magnetic flux measurement position with the temperature characteristics of the Hall element 16 compensated.

[0052] The position estimation unit 164 estimates the position and orientation of the transport unit 30 (permanent magnet 35) based on the magnetic flux density calculated by the magnetic flux density calculation unit 163.

[0053] FIG. 7 is an example of a plan view illustrating alignment of the transport unit 30 when placing the substrate W on the placement table 111. In FIG.

[0054] A temperature sensor 17A (see FIGS. 4 and 5) is provided in the precision-requiring area 200. As a result, when aligning the transport unit 30 in the precision-requiring area 200, the position of the transport unit 30 can be detected with high accuracy by correcting using the temperature of the Hall element 16. This improves the alignment accuracy of the transport unit 30. Furthermore, the substrate W can be placed on the mounting table 111 with high accuracy.

[0055] Although the temperature sensor 17 for detecting the temperature of the Hall element 16 has been described as an example of a thermocouple provided in the tile-shaped unit 11, the present invention is not limited to this. For example, a thermal camera provided on the ceiling of the vacuum transfer chamber 120 and capturing an image of the tile-shaped unit 11 in the precision-requiring area 200 may be used as the temperature sensor 17 for detecting the temperature of the Hall element 16. The Hall element temperature estimation unit 162 estimates the temperature of each Hall element 16 based on the temperature distribution of the tile-shaped unit 11 captured by the thermal camera.

[0056] Alternatively, the Hall element temperature estimator 162 may estimate the heat generation amount of each coil 15 based on the amount of current flowing through each coil 15. The Hall element temperature estimator 162 may then estimate the temperature distribution of the tile-shaped unit 11 (planar motor 10) based on the estimated heat generation amount of each coil 15 and the temperatures at each temperature measurement position detected by the temperature sensor 17, and estimate the temperature of each Hall element 16 based on the estimated temperature distribution of the tile-shaped unit 11 (planar motor 10). This allows the temperature distribution of the tile-shaped unit 11 (planar motor 10) to be estimated taking the heat generation amount of the coil 15 into consideration, thereby enabling the temperature of each Hall element 16 to be estimated with greater accuracy. This allows the position and orientation of the transport unit 30 to be estimated with greater accuracy.

[0057] Next, another configuration for improving the alignment accuracy in the accuracy-requiring region 200 will be described with reference to Fig. 8. Fig. 8 is another example of a plan view illustrating alignment of the transport unit 30 when placing the substrate W on the mounting table 111.

[0058] Position detection sensors 18 are provided to detect the position of the transfer unit 30 within the precision-requiring area 200. The position detection sensors 18 are, for example, laser displacement meters provided on the side walls of the vacuum transfer chamber 120. The position detection sensors 18 include two position detection sensors 18A provided on the side wall where the gate valve 112 of the vacuum transfer chamber 120 is located, and two position detection sensors 18B provided on the other side wall of the vacuum transfer chamber 120, and detect the position and orientation of the transfer unit 30 (mover 31). This can improve the alignment accuracy of the transfer unit 30. Furthermore, the substrate W can be placed on the mounting table 111 with high precision.

[0059] Although the position detection sensor 18 for detecting the position of the transport unit 30 within the precision-requiring area 200 has been described as being a laser displacement meter provided on the side wall of the vacuum transport chamber 120, the present invention is not limited to this. For example, an imaging device (e.g., a CCD camera) provided on the ceiling of the vacuum transport chamber 120 for capturing an image of the transport unit 30 within the precision-requiring area 200 may also be used as the position detection sensor 18 for detecting the position of the transport unit 30 within the precision-requiring area 200.

[0060] The substrate processing system 100 has been described above, but the present disclosure is not limited to the above embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure as described in the claims. [Explanation of symbols]

[0061] 10 Planar Motor 11 Tile Shape Units 15 coils 16 Hall element 17 Temperature Sensor 18 Position detection sensor 30, 30A~30C Transport unit 31 Mover 32 Arm 35 Permanent Magnets 100 Substrate Processing System 110 Processing Room 120 Vacuum transfer chamber (transfer chamber) 130 Load Lock Chamber 140 Atmospheric Transfer Chamber 150 Loading Port 160 control section 200 Accuracy required area 210 Conveying Area

Claims

[Claim 1] a planar motor provided in a transfer chamber having a precision-requiring area and a transfer area other than the precision-requiring area, the planar motor including an array of tile-shaped units each having a coil and a Hall element; a transport unit having a permanent magnet and moving on the tile-shaped unit to transport the substrate; a temperature sensor for measuring the temperature distribution of the entire planar motor; a thermal camera provided on a ceiling of the transfer chamber for detecting a temperature distribution of the tile-shaped unit within the precision-required area; a control unit that estimates a position of the transport unit based on the temperature of the Hall element and the detection value of the Hall element, the precision-requiring region includes a position of the transport unit when transferring and / or receiving the substrate to and from the mounting table; The control unit estimating the temperature of the Hall element within the precision-required region based on the temperature distribution of the tile-shaped unit imaged by the thermal camera; Substrate transport device.

Images