Resin composition, prepreg, laminated plate, resin film, printed wiring board, and semiconductor package

Abstract

To provide a resin composition excellent in dielectric properties and adhesion to a conductor in a high frequency band of 10 GHz or higher, and a prepreg, a laminated plate, a resin film, a printed wiring board, and a semiconductor package using the resin composition.SOLUTION: There are provided: a resin composition comprising (A) at least one selected from the group consisting of maleimide compounds having two or more N-substituted maleimide groups and derivatives thereof, the molecular structure of which includes a fused ring of an aromatic ring and an aliphatic ring, and (B) a resin having a tensile elastic modulus of 10 GPa or less at 25°C; and a prepreg, a laminated plate, a resin film, a printed wiring board, and a semiconductor package using the resin composition.

Description

[Technical Field]

[0001] The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package. [Background technology]

[0002] The speed and capacity of signals used in electronic devices such as mobile phones, their base station equipment, servers, routers, and other network infrastructure equipment, and large-scale computers are increasing year by year. Accordingly, the substrate materials for the printed wiring boards used in these electronic devices are required to have dielectric properties (hereinafter sometimes referred to as "high-frequency properties") that can reduce transmission loss of high-frequency signals, i.e., low dielectric constant and low dielectric loss tangent. In recent years, in addition to the electronic devices mentioned above, new systems that handle high-frequency wireless signals have been put into practical use or are planned for practical use in the fields of intelligent transport systems (ITS) related to automobiles and transportation systems, as well as in the field of indoor short-range communications. Therefore, it is expected that there will be an increasing need for substrate materials with excellent high-frequency characteristics for the printed wiring boards used in these fields.

[0003] Patent Document 1 aims to provide a thermosetting resin composition that has a low dielectric loss tangent, low thermal expansion, and excellent wiring embedding properties and flatness, and discloses a technology in which a polybutadiene-based elastomer modified with an acid anhydride is blended into a thermosetting resin composition that contains an inorganic filler and a polyimide compound having a structural unit derived from a maleimide compound having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-012747 Summary of the Invention [Problem to be solved by the invention]

[0005] Recently, there has been a demand for substrate materials to be used in fifth-generation mobile communication system (5G) antennas, which use radio waves in the frequency band above 6 GHz, and millimeter-wave radars, which use radio waves in the frequency band from 30 to 300 GHz. To this end, it is necessary to develop resin compositions with further improved dielectric properties in the 10 GHz band and above. Reducing the contact area between an insulating layer and a conductor formed on the insulating layer is also an effective method for reducing transmission loss. However, a reduction in the contact area between the insulating layer and the conductor can cause a decrease in adhesion between the insulating layer and the conductor. Therefore, it has been difficult to achieve both high dielectric properties and high adhesion to the conductor. Although the thermosetting resin composition disclosed in Patent Document 1 has excellent dielectric properties, there is room for improvement in terms of achieving both even better dielectric properties and adhesion to conductors.

[0006] In view of the current situation, an object of the present embodiment is to provide a resin composition that has excellent dielectric properties and adhesion to conductors in a high frequency band of 10 GHz or more, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition. [Means for solving the problem]

[0007] The present inventors have conducted research to solve the above-mentioned problems and have found that the problems can be solved by the present embodiment described below. That is, this embodiment relates to the following [1] to

[11] . [1] (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, which contain a fused ring of an aromatic ring and an aliphatic ring in their molecular structure and have two or more N-substituted maleimide groups; (B) a resin having a tensile modulus of elasticity at 25°C of 10 GPa or less; A resin composition comprising: [2] The resin composition according to [1] above, wherein the fused ring is an indane ring. [3] The resin composition according to [2] above, wherein the indane ring is contained in the component (A) as a divalent group represented by the following general formula (a1-1): [ka] (In the formula, R a1 is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group or a mercapto group, and n1 is an integer of 0 to 3. a2 ~R a4 are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site. [4] The resin composition according to any one of the above [1] to [3], wherein the component (B) contains one or more resins selected from the group consisting of polyolefin resins, polyphenylene ether resins, silicone resins, and epoxy resins. [5] The resin composition according to [4] above, wherein the component (B) contains, as the polyolefin resin, (b1) a conjugated diene polymer having a vinyl group in the side chain, and (b2) a modified conjugated diene polymer obtained by modifying a maleimide compound having two or more N-substituted maleimide groups. [6] The resin composition according to the above [4] or [5], wherein the component (B) contains a styrene-based elastomer as the polyolefin-based resin. [7] A prepreg containing the resin composition according to any one of the above [1] to [6] or a semi-cured product of the resin composition. [8] A laminate comprising a cured product of the resin composition according to any one of [1] to [6] above or a cured product of the prepreg according to [7] above, and a metal foil. [9] A resin film containing the resin composition according to any one of the above [1] to [6] or a semi-cured product of the resin composition.

[10] A printed wiring board comprising one or more members selected from the group consisting of a cured product of the resin composition according to any one of [1] to [6] above, a cured product of the prepreg according to [7] above, and a laminate according to [8] above.

[11] A semiconductor package comprising the printed wiring board according to

[10] above and a semiconductor element. [Effects of the Invention]

[0008] According to the present embodiment, it is possible to provide a resin composition that has excellent dielectric properties and adhesion to conductors in a high frequency band of 10 GHz or higher, and a prepreg, a laminate, a resin film, a printed wiring board, and a semiconductor package that use the resin composition. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. The lower and upper limits of any numerical range described herein may be combined with any lower or upper limit of any other numerical range. In the numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with values ​​shown in the examples. Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more. In this specification, the content of each component in a resin composition means the total amount of the multiple substances present in the resin composition, unless otherwise specified, when multiple substances corresponding to each component are present in the resin composition. Any combination of the features described in this specification is also included in this embodiment. The mechanism of action described in this specification is speculation and does not limit the mechanism by which the resin composition according to this embodiment exhibits its effects.

[0010] The term "compatible" as used herein means that the resins are not necessarily miscible at the molecular level, but are miscible with each other at the nano- or micro-level, or in appearance.

[0011] In this specification, the term "semi-cured product" is synonymous with a resin composition in a B-stage state according to JIS K 6800 (1985), and the term "cured product" is synonymous with a resin composition in a C-stage state according to JIS K 6800 (1985).

[0012] The number average molecular weight in this specification refers to a value measured in terms of polystyrene by gel permeation chromatography (GPC). Specifically, the number average molecular weight in this specification can be measured by the method described in the Examples.

[0013] [Resin composition] The resin composition of the present embodiment is (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, which contain a fused ring of an aromatic ring and an aliphatic ring in their molecular structure and have two or more N-substituted maleimide groups [hereinafter, sometimes referred to as "component (A)"]; (B) a resin (hereinafter sometimes referred to as "component (B)") having a tensile modulus at 25°C (hereinafter sometimes simply referred to as "25°C tensile modulus") of 10 GPa or less, The resin composition contains:

[0014] The reason why the resin composition of the present embodiment has excellent dielectric properties and adhesion to conductors (hereinafter, sometimes referred to as "conductor adhesion") in high frequency bands of 10 GHz or higher is not clear, but is presumed to be as follows. The resin composition of this embodiment contains component (A), a maleimide compound whose molecular structure includes a fused ring of an aromatic ring and an aliphatic ring. The fused ring contains a low-polarity aliphatic ring, which contributes to a reduction in the dielectric tangent of the cured product obtained from the resin composition of this embodiment, and its bulky steric structure is thought to contribute to a reduction in the dielectric constant. Furthermore, the fused ring in component (A) locally reduces the polarity of the maleimide compound, so component (A) tends to be highly compatible with not only highly polar compounds but also with less polar compounds. This improves the overall homogeneity of the cured product obtained from the resin composition of this embodiment, which is thought to improve conductor adhesion. Furthermore, the component (B) contained in the resin composition of this embodiment has a tensile modulus of elasticity of 10 GPa or less at 25° C. A resin that satisfies this tensile modulus at 25° C. is considered to have further improved dielectric properties because the resin's rigidity, molecular weight, polarity, etc. contribute to improving the dielectric properties while also having excellent compatibility with the component (A).

[0015] <Component (A)> The component (A) is at least one selected from the group consisting of maleimide compounds and derivatives thereof that contain a fused ring of an aromatic ring and an aliphatic ring in the molecular structure and have two or more N-substituted maleimide groups. The component (A) may be used alone or in combination of two or more.

[0016] From the viewpoint of dielectric properties and conductor adhesion, the component (A) is preferably one or more compounds selected from the group consisting of the following (i) and (ii): (i) A maleimide compound (a1) containing a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and having two or more N-substituted maleimide groups [hereinafter, this may be referred to as "maleimide compound (a1)" or "component (a1)"]. (ii) An aminomaleimide compound having a structural unit derived from a maleimide compound (a1) and a structural unit derived from a diamine compound (a2) [hereinafter, this may be referred to as "aminomaleimide compound (A1)" or "component (A1)"]

[0017] (Maleimide compound (a1)) From the viewpoints of dielectric properties, conductor adhesion, and heat resistance, component (a1) is preferably an aromatic maleimide compound having a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and having two or more N-substituted maleimide groups, and more preferably component (a1) is an aromatic bismaleimide compound having a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and having two N-substituted maleimide groups. In this specification, the term "aromatic maleimide compound" refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring, and the term "aromatic bismaleimide compound" refers to a compound having two N-substituted maleimide groups directly bonded to an aromatic ring.

[0018] From the viewpoints of dielectric properties, conductor adhesion, and ease of production, the fused ring contained in component (a1) preferably has a fused bicyclic structure, and more preferably is an indan ring. The component (a1) containing an indane ring is preferably an aromatic bismaleimide compound containing an indane ring. In this specification, the term "indan ring" refers to a fused bicyclic structure of an aromatic six-membered ring and a saturated aliphatic five-membered ring. At least one of the ring-forming carbon atoms forming the indan ring has a linking group for bonding to another group constituting component (a1). The ring-forming carbon atom having the linking group and the other ring-forming carbon atoms may not have a linking group, substituent, or the like other than the above-mentioned linking group, but it is preferable that they have a linking group other than the above to form a divalent group. In the component (a1), the indane ring is preferably contained as a divalent group represented by the following general formula (a1-1).

[0019] [ka] (In the formula, R a1is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group or a mercapto group, and n1 is an integer of 0 to 3. a2 ~R a4 are each independently an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.

[0020] R in the above general formula (a1-1) a1 Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, etc. These alkyl groups may be either linear or branched. R a1 Examples of the alkyl group contained in the alkyloxy group having 1 to 10 carbon atoms and the alkylthio group having 1 to 10 carbon atoms represented by the following formula include the same as the alkyl group having 1 to 10 carbon atoms described above. R a1 Examples of the aryl group having 6 to 10 carbon atoms represented by the formula (I) include a phenyl group and a naphthyl group. R a1 Examples of the aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by the following formula include the same as the aryl group having 6 to 10 carbon atoms described above. R a1 Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by the formula (I) include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, and a cyclodecyl group. When n1 in the above general formula (a1-1) is an integer of 1 to 3, R a1 From the viewpoint of solvent solubility and reactivity, alkyl groups having 1 to 4 carbon atoms, cycloalkyl groups having 3 to 6 carbon atoms, and aryl groups having 6 to 10 carbon atoms are preferred, and alkyl groups having 1 to 4 carbon atoms are more preferred.

[0021] Ra2 ~R a4 Examples of the alkyl group having 1 to 10 carbon atoms represented by the formula (I) include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. These alkyl groups may be either linear or branched. Among these, R a2 ~R a4 is preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. In the general formula (a1-1), n1 is an integer of 0 to 3. When n1 is 2 or 3, a plurality of R a1 They may be the same or different.

[0022] Among the above, the divalent group represented by the general formula (a1-1) is preferably a group in which n1 is 0 and R a2 ~R a4 is a methyl group, a divalent group represented by the following formula (a1-1') is preferred.

[0023] [ka] (In the formula, * represents a binding site.)

[0024] As the component (a1) containing a divalent group represented by the above general formula (a1-1), one represented by the following general formula (a1-2) is preferred from the viewpoints of dielectric properties, conductor adhesion, heat resistance, and ease of production.

[0025] [ka] (In the formula, R a1 ~R a4 and n1 are the same as those in the general formula (a1-1) above. a5are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.0.

[0026] In the general formula (a1-2), multiple R a1 between multiple n1s, between multiple Rs a5 Each n2 may be the same as or different from each other. If n3 is greater than 1, multiple R a2 R a3 R a4 Each of the two may be the same or different.

[0027] R in the above general formula (a1-2) a5 Examples of the alkyl group having 1 to 10 carbon atoms represented by include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group, etc. These alkyl groups may be either linear or branched. R a5 Examples of the alkyl group contained in the alkyloxy group having 1 to 10 carbon atoms and the alkylthio group having 1 to 10 carbon atoms represented by the following formula include the same as the alkyl group having 1 to 10 carbon atoms described above. R a5 Examples of the aryl group having 6 to 10 carbon atoms represented by the formula (I) include a phenyl group and a naphthyl group. R a5 Examples of the aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by the following formula include the same as the aryl group having 6 to 10 carbon atoms described above. R a5Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by the formula (I) include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, and a cyclodecyl group. Among these, R a5 From the viewpoints of solvent solubility and ease of production, the alkyl group having 1 to 4 carbon atoms, the cycloalkyl group having 3 to 6 carbon atoms, and the aryl group having 6 to 10 carbon atoms are preferred, the alkyl group having 1 to 3 carbon atoms is more preferred, and the methyl group is even more preferred.

[0028] In the general formula (a1-2) above, n2 is an integer of 0 to 4, and is preferably an integer of 0 to 3, more preferably 0 or 2, from the viewpoints of compatibility with other resins, dielectric properties, conductor adhesion, and ease of production. In addition, when n2 is 1 or more, the benzene ring and the N-substituted maleimide group have a twisted conformation, and the solvent solubility tends to be further improved by suppressing intermolecular stacking. From the viewpoint of suppressing intermolecular stacking, when n2 is 1 or more, R a5 The substitution position is preferably the ortho position relative to the N-substituted maleimide group. In the general formula (a1-2), n3 is preferably a value of 0.98 to 8.0, more preferably a value of 1.0 to 7.0, and even more preferably a value of 1.1 to 6.0, from the viewpoints of dielectric properties, conductor adhesion, solvent solubility, handleability, and heat resistance. Note that n3 represents the average number of structural units containing an indane ring.

[0029] From the viewpoints of dielectric properties, conductor adhesion, solvent solubility, and ease of production, it is more preferable that the component (a1) represented by the above general formula (a1-2) is one represented by the following general formula (a1-3) or one represented by the following general formula (a1-4).

[0030] [ka] (In the formula, R a1 ~R a5and n1 and n3 are the same as those in the general formula (a1-2) above.)

[0031] [ka] (In the formula, R a1 ~R a4 and n1 and n3 are the same as those in the general formula (a1-2) above.)

[0032] Examples of the component (a1) represented by the general formula (a1-3) include a compound represented by the following general formula (a1-3-1), a compound represented by the following general formula (a1-3-2), and a compound represented by the following general formula (a1-3-3).

[0033] [ka] (wherein n3 is the same as in general formula (a1-2) above.)

[0034] Examples of the compound represented by the above general formula (a1-4) include compounds represented by the following general formula (a1-4-1).

[0035] [ka] (wherein n3 is the same as in general formula (a1-2) above.)

[0036] The number average molecular weight of the (a1) component is not particularly limited, but from the viewpoints of compatibility with other resins, conductor adhesion, and heat resistance, it is preferably 600 to 3,000, more preferably 800 to 2,000, and even more preferably 1,000 to 1,500.

[0037] The component (a1) can be produced, for example, by reacting an intermediate amine compound containing a fused ring of an aromatic ring and an aliphatic ring (hereinafter sometimes simply referred to as the "intermediate amine compound") with maleic anhydride (hereinafter sometimes referred to as the "maleimidization reaction").

[0038] Hereinafter, a method for producing the component (a1) will be described using as an example a maleimide compound containing an indan ring as a condensed ring between an aromatic ring and an aliphatic ring. An intermediate amine compound of a maleimide compound containing an indan ring can be obtained as a compound represented by the following general formula (a1-7) by reacting, for example, a compound represented by the following general formula (a1-5) [hereinafter, sometimes referred to as "compound A"] with a compound represented by the following general formula (a1-6) [hereinafter, sometimes referred to as "compound B"] in the presence of an acid catalyst [hereinafter, sometimes referred to as "cyclization reaction"].

[0039] [ka] (In the formula, R a1 and n1 are the same as those in the general formula (a1-1) above. a6 are each independently a group represented by the above formula (a1-5-1) or (a1-5-2), and two R a6 At least one of the R a6 The ortho position of is a hydrogen atom.)

[0040] [ka] (In the formula, R a5 and n2 are the same as those in the above general formula (a1-2), provided that at least one of the ortho- and para-positions of the amino group is a hydrogen atom.

[0041] [ka] (In the formula, R a1 , R a5and n1 to n3 are the same as those in the general formula (a1-2) above.)

[0042] Examples of compound A include p- or m-diisopropenylbenzene, p- or m-bis(α-hydroxyisopropyl)benzene, 1-(α-hydroxyisopropyl)-3-isopropenylbenzene, 1-(α-hydroxyisopropyl)-4-isopropenylbenzene, mixtures thereof, nuclear alkyl group-substituted products of these compounds, and nuclear halogen-substituted products of these compounds. Examples of the above-mentioned alkyl group-substituted nuclei include diisopropenyltoluene and bis(α-hydroxyisopropyl)toluene. Examples of the nuclear halogen-substituted compounds include chlorodiisopropenylbenzene and chlorobis(α-hydroxyisopropyl)benzene. These compounds A may be used alone or in combination of two or more.

[0043] Examples of compound B include aniline, dimethylaniline, diethylaniline, diisopropylaniline, ethylmethylaniline, cyclobutylaniline, cyclopentylaniline, cyclohexylaniline, chloroaniline, dichloroaniline, toluidine, xylidine, phenylaniline, nitroaniline, aminophenol, methoxyaniline, ethoxyaniline, phenoxyaniline, naphthoxyaniline, aminothiol, methylthioaniline, ethylthioaniline, phenylthioaniline, etc. These compounds B may be used alone or in combination of two or more.

[0044] In the cyclization reaction, for example, compound A and compound B are charged in a molar ratio (compound B / compound A) of preferably 0.1 to 2.0, more preferably 0.15 to 1.5, and even more preferably 0.2 to 1.0, and then the first-stage reaction is carried out. Next, it is preferable to add compound B at a molar ratio (additional compound B / compound A) relative to the previously added compound A of preferably 0.5 to 20, more preferably 0.6 to 10, and even more preferably 0.7 to 5, to carry out the second-stage reaction.

[0045] Examples of acid catalysts used in the cyclization reaction include inorganic acids such as phosphoric acid, hydrochloric acid, and sulfuric acid; organic acids such as oxalic acid, benzenesulfonic acid, toluenesulfonic acid, methanesulfonic acid, and fluoromethanesulfonic acid; solid acids such as activated clay, acid clay, silica alumina, zeolite, and strongly acidic ion exchange resins; heteropolyhydrochloric acid, etc. These may be used alone or in combination of two or more. From the viewpoints of reaction rate and reaction uniformity, the amount of the acid catalyst to be added is preferably 5 to 40 parts by mass, more preferably 5 to 35 parts by mass, and even more preferably 5 to 30 parts by mass, relative to 100 parts by mass of the total amount of Compound A and Compound B initially charged.

[0046] The reaction temperature for the cyclization reaction is preferably 100 to 300°C, more preferably 130 to 250°C, and even more preferably 150 to 230°C, from the viewpoints of reaction rate and reaction uniformity. The reaction time for the cyclization reaction is preferably 2 to 24 hours, more preferably 4 to 16 hours, and even more preferably 8 to 12 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently. However, these reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited. In the cyclization reaction, a solvent such as toluene, xylene, chlorobenzene, etc. may be used as needed. In addition, when water is produced as a by-product in the cyclization reaction, the dehydration reaction may be promoted by using a solvent that can be azeotropically dehydrated.

[0047] Next, the intermediate amine compound obtained above is reacted with maleic anhydride in an organic solvent to convert the primary amino group of the intermediate amine compound into a maleimide group, thereby obtaining component (a1). The equivalent ratio of maleic anhydride to the primary amino group equivalent of the intermediate amine compound in the maleimidation reaction (maleic anhydride / primary amino group) is not particularly limited, but from the viewpoint of reducing the amount of unreacted primary amino groups and the amount of unreacted maleic anhydride, it is preferably 1.0 to 1.5, more preferably 1.05 to 1.3, and even more preferably 1.1 to 1.2. The amount of organic solvent used in the maleimidation reaction is not particularly limited, but from the viewpoint of the reaction rate and reaction uniformity, it is preferably 50 to 5,000 parts by mass, more preferably 70 to 2,000 parts by mass, and even more preferably 100 to 500 parts by mass per 100 parts by mass of the total amount of the intermediate amine compound and maleic anhydride.

[0048] The maleimidation reaction is preferably carried out by reacting an intermediate amine compound with maleic anhydride in two steps. The reaction temperature in the first stage reaction is preferably 10 to 100°C, more preferably 20 to 70°C, and even more preferably 30 to 50°C. The reaction time in the first stage reaction is preferably 0.5 to 12 hours, more preferably 0.7 to 8 hours, and even more preferably 1 to 4 hours. The second stage reaction is preferably carried out after the completion of the first stage reaction and after adding a catalyst such as toluenesulfonic acid. The reaction temperature in the second stage reaction is preferably 90 to 130°C, more preferably 100 to 125°C, and even more preferably 105 to 120°C. The reaction time in the second stage reaction is preferably 2 to 24 hours, more preferably 4 to 15 hours, and even more preferably 6 to 10 hours. However, the above reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited. After the reaction, if necessary, purification such as washing with water may be carried out to remove unreacted raw materials and other impurities.

[0049] The component (a1) obtained by the above method may contain, as a by-product, a maleimide compound that does not contain an indane ring. An example of a maleimide compound that does not contain an indane ring is a compound represented by the above general formula (a1-2) in which n3 is 0. The content of the maleimide compound not containing an indan ring, which is a by-product in the reaction product, can be measured, for example, by measuring the reaction product through GPC. Specifically, for example, a calibration curve of elution time versus the number of n3 is prepared using compounds in which n3 in the general formula (a1-2) is 0 to 4, and the number of n3 of the compounds contained in the reaction product and its average value can be determined from the elution times of peaks observed in the GPC chart of the reaction product. Furthermore, the content ratio of compounds having the number of n3 represented by each peak can be determined from the area ratio of each peak. The component (a1) preferably has a small content of maleimide compounds not containing an indan ring as by-products, and therefore, in a GPC chart of the reaction product, the area ratio of maleimide compounds not containing an indan ring as by-products to the peak area of ​​the entire reaction product is preferably 40% or less, more preferably 30% or less, even more preferably 20% or less, and particularly preferably 10% or less.

[0050] (Aminomaleimide compound (A1)) The aminomaleimide compound (A1) is an aminomaleimide compound having a structural unit derived from the maleimide compound (a1) and a structural unit derived from the diamine compound (a2). Note that the component (A1) corresponds to a derivative of the maleimide compound (a1). The component (A1) may be used alone or in combination of two or more.

[0051] [Structural unit derived from maleimide compound (a1)] Examples of the structural unit derived from the component (a1) include a structural unit formed by a Michael addition reaction between at least one N-substituted maleimide group of the component (a1) and an amino group of the diamine compound (a2). The structural unit derived from the component (a1) contained in the component (A1) may be of one type alone, or may be of two or more types.

[0052] The content of the structural units derived from the component (a1) in the aminomaleimide compound (A1) is not particularly limited, but is preferably 5 to 95 mass%, more preferably 30 to 93 mass%, and even more preferably 60 to 90 mass%. When the content of the structural units derived from the component (a1) in the component (A1) is within the above range, the dielectric properties and film handling properties tend to be better.

[0053] [Structural unit derived from diamine compound (a2)] Examples of the structural unit derived from the component (a2) include a structural unit formed by a Michael addition reaction between one or both of the two amino groups in the component (a2) and an N-substituted maleimide group in the maleimide compound (a1). The structural unit derived from the component (a2) contained in the component (A1) may be of one type alone, or may be of two or more types.

[0054] The amino group contained in component (a2) is preferably a primary amino group. Examples of the structural unit derived from the diamine compound (a2) having two primary amino groups include a group represented by the following general formula (a2-1) and a group represented by the following general formula (a2-2).

[0055] [ka] (In the formula, X a1 is a divalent organic group, and * indicates the bonding position to other structures.)

[0056] X in the above general formulae (a2-1) and (a2-2) a1 is a divalent organic group, and corresponds to the divalent group obtained by removing two amino groups from component (a2).

[0057] X in the above general formula (a2-1) and the above general formula (a2-2) a1 is preferably a divalent group represented by the following general formula (a2-3).

[0058] [ka] (In the formula, R a11 and R a12 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group, or a halogen atom. a2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or a divalent group represented by the following general formula (a2-3-1) or (a2-3-2). p1 and p2 each independently represent an integer of 0 to 4. * represents a bonding site.

[0059] [ka] (In the formula, R a13 and R a14 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a3 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. p3 and p4 each independently represent an integer of 0 to 4. * represents a bonding site.

[0060] [ka] (In the formula, Ra15 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. a4 and X a5 are each independently an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. p5 is an integer of 0 to 4. * represents a bonding site.

[0061] R in the above general formula (a2-3), the above general formula (a2-3-1), and the above general formula (a2-3-2) a11 , R a12 , R a13 , R a14 and R a15 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group or an ethyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0062] X in the above general formula (a2-3) a2 , X in the above general formula (a2-3-1) a3 and X in the above general formula (a2-3-2) a4 and X a5 Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0063] X in the above general formula (a2-3)a2 , X in the above general formula (a2-3-1) a3 and X in the above general formula (a2-3-2) a4 and X a5 Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. The alkylidene group having 2 to 5 carbon atoms is preferably an alkylidene group having 2 to 4 carbon atoms, more preferably an alkylidene group having 2 or 3 carbon atoms, and even more preferably an isopropylidene group.

[0064] In the general formula (a2-3) above, p1 and p2 are each independently an integer of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 3, more preferably integers of 0 to 2, and even more preferably 0 or 2. When p1 or p2 is an integer of 2 or more, a plurality of R a11 R a12 They may be the same or different from each other.

[0065] In the general formula (a2-3-1) above, p3 and p4 are each independently an integer of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 2, more preferably 0 or 1, and even more preferably 0. When p3 or p4 is an integer of 2 or more, a plurality of R a13 R a14 They may be the same or different from each other.

[0066] In the above general formula (a2-3-2), p5 is an integer of 0 to 4, and from the viewpoint of availability, is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. When p5 is an integer of 2 or more, multiple R a15 They may be the same or different from each other.

[0067] The content of the structural unit derived from the component (a2) in the aminomaleimide compound (A1) is not particularly limited, but is preferably 5 to 95 mass%, more preferably 7 to 70 mass%, and even more preferably 10 to 40 mass%. When the content of the structural unit derived from the component (a2) in the aminomaleimide compound (A1) is within the above range, the dielectric properties, heat resistance, flame retardancy, and glass transition temperature tend to be better.

[0068] Examples of the component (a2) include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-diamino-3,3'-diethyldiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyldiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyldiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl ketone, 4,4'-diaminobiphenyl, 3,3'-dimethyldiphenylmethane, 4,4'-diaminodiphenyl ether ... 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane, 2,2-bis(4-aminophenyl)propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 1,3-bis bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 1,3-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 1,4-bis[1-[4-(4-aminophenoxy)phenyl]-1-methylethyl]benzene, 4,4'-[1,3 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline, 3,3'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 9,9-bis(4-aminophenyl)fluorene, and the like.

[0069] Among these, 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyldiphenylmethane, 4,4'-diamino-3,3'-diethyldiphenylmethane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline, and 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline are preferred as component (a2) from the viewpoints of excellent solubility in organic solvents, reactivity with the maleimide compound (a1), and heat resistance. Furthermore, 3,3'-dimethyl-5,5'-diethyl-4,4'-diaminodiphenylmethane is preferred as component (a2) from the viewpoints of excellent dielectric properties and low water absorption. In addition, from the viewpoint of high adhesion to the conductor and excellent mechanical properties such as elongation and breaking strength, 2,2-bis[4-(4-aminophenoxy)phenyl]propane is preferred as component (a2). Furthermore, from the viewpoint of excellent solubility in organic solvents, reactivity during synthesis, heat resistance, high adhesion to the conductor, as well as excellent dielectric properties and low moisture absorption, 4,4'-[1,3-phenylenebis(1-methylethylidene)]bisaniline and 4,4'-[1,4-phenylenebis(1-methylethylidene)]bisaniline are preferred as component (a2).

[0070] In the aminomaleimide compound (A1), the equivalent ratio (Ta2 / Ta1) of the total equivalent (Ta2) of groups (including -NH2) derived from the -NH2 groups of the diamine compound (a2) to the total equivalent (Ta1) of groups derived from the N-substituted maleimide groups of the maleimide compound (a1) is not particularly limited, but from the viewpoints of dielectric properties, heat resistance, flame retardancy, and glass transition temperature, is preferably 0.05 to 10, more preferably 0.5 to 7, and even more preferably 1 to 5. The group derived from the N-substituted maleimide group of the maleimide compound (a1) includes the N-substituted maleimide group itself.

[0071] The number average molecular weight of the aminomaleimide compound (A1) is not particularly limited, but from the viewpoint of handleability and moldability, it is preferably 400 to 10,000, more preferably 500 to 5,000, and even more preferably 600 to 2,000.

[0072] (Method for producing aminomaleimide compound (A1)) The component (A1) can be produced, for example, by reacting a maleimide compound (a1) with a diamine compound (a2) in an organic solvent. By reacting the maleimide compound (a1) with the diamine compound (a2), an aminomaleimide compound (A1) is obtained through a Michael addition reaction between the maleimide compound (a1) and the diamine compound (a2).

[0073] When the maleimide compound (a1) and the diamine compound (a2) are reacted, a reaction catalyst may be used as necessary. Examples of the reaction catalyst include acidic catalysts such as p-toluenesulfonic acid, amines such as triethylamine, pyridine, and tributylamine, imidazoles such as methylimidazole and phenylimidazole, and phosphorus-based catalysts such as triphenylphosphine. These may be used alone or in combination of two or more. The amount of the reaction catalyst to be added is not particularly limited, but from the viewpoint of the reaction rate and reaction uniformity, it is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 3 parts by mass, and even more preferably 0.1 to 2 parts by mass, relative to 100 parts by mass of the total amount of the maleimide compound (a1) and the diamine compound (a2).

[0074] The reaction temperature for the Michael addition reaction is preferably 50 to 160°C, more preferably 60 to 150°C, and even more preferably 70 to 140°C, from the viewpoints of workability such as reaction rate, and suppression of gelation of the product during the reaction. The reaction time for the Michael addition reaction is preferably 0.5 to 10 hours, more preferably 1 to 8 hours, and even more preferably 2 to 6 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently. However, these reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited.

[0075] In the Michael addition reaction, the solids concentration and solution viscosity of the reaction solution may be adjusted by adding or concentrating an organic solvent. The solids concentration of the reaction solution is not particularly limited, but is preferably 10 to 90% by mass, more preferably 15 to 85% by mass, and even more preferably 20 to 80% by mass. When the solids concentration of the reaction raw materials is equal to or greater than the lower limit, a good reaction rate is obtained, and productivity tends to be improved. Furthermore, when the solids concentration of the reaction raw materials is equal to or less than the upper limit, better solubility is obtained, stirring efficiency is improved, and gelation of the product during the reaction tends to be more effectively suppressed.

[0076] <(B) component> The resin composition of the present embodiment contains a resin having a tensile modulus at 25° C. of 10 GPa or less as component (B), and thus has excellent dielectric properties and adhesion to conductors. In the resin composition of this embodiment, the resin corresponding to the component (A) is not included in the component (B). The component (B) may be used alone or in combination of two or more.

[0077] In this specification, the tensile modulus at 25°C is a value measured by the following method. (Method for measuring tensile modulus at 25°C) A test piece measuring 10 mm wide, 80 mm long, and 0.2 mm thick is prepared from the resin to be measured, and the test piece is clamped at both ends of the long side with upper and lower gripping tools with a gap of 60 mm between the gripping tools. The tensile modulus of the test piece at 25°C is then measured using a tensile testing machine at a room temperature of 25°C and a tension speed of 5 mm / min. The tensile modulus is calculated in accordance with the international standard ISO 5271 (1993).

[0078] Here, in this embodiment, "a resin having a tensile modulus at 25°C of 10 GPa or less" includes a resin from which the above-mentioned test specimens cannot be prepared because the tensile modulus at 25°C is too low, and also includes a resin from which the above-mentioned test specimens can be prepared but from which a tensile test cannot be carried out under the above-mentioned conditions for the same reason.

[0079] The tensile modulus of elasticity of component (B) at 25°C is 10 GPa or less, preferably 7 GPa or less, more preferably 5 GPa or less, even more preferably 3 GPa or less, still more preferably 2 GPa or less, particularly preferably 1 GPa or less, and most preferably 0.6 GPa or less. When the tensile modulus of elasticity of component (B) at 25°C is the above upper limit or less, the resulting resin composition tends to have excellent dielectric properties and conductor adhesion. The tensile modulus of elasticity at 25°C of component (B) is not particularly limited, but is preferably 0.005 GPa or more, more preferably 0.01 GPa or more, and even more preferably 0.03 GPa or more. When the tensile modulus of elasticity at 25°C of component (B) is the above-mentioned lower limit or more, the heat resistance and other properties of the resulting resin composition tend to be maintained at a good level.

[0080] The number-average molecular weight of component (B) is not particularly limited, but is preferably 400 to 500,000, more preferably 600 to 350,000, and even more preferably 700 to 200,000. When the number-average molecular weight of component (B) is at least the above-mentioned lower limit, the heat resistance and other properties of the resulting resin composition tend to be excellent. Furthermore, when the number-average molecular weight of component (B) is at most the above-mentioned upper limit, the dielectric properties and conductor adhesion of the resulting resin composition tend to be excellent.

[0081] Preferred examples of the component (B) include thermoplastic resins and modified products thereof. Component (B) may be a thermosetting resin, but the thermosetting resin component (B) is preferably one that cures into an elastomer. Here, "elastomer" refers to a polymer having a glass transition temperature of 25°C or less as measured by differential scanning calorimetry in accordance with JIS K 6240:2011.

[0082] Examples of the component (B) include polyolefin resins, polyphenylene ether resins, silicone resins, epoxy resins, polyurethane resins, polyester resins, polyamide resins, and polyacrylic resins. Among these, from the viewpoints of compatibility with component (A), dielectric properties, and conductor adhesion, component (B) preferably contains one or more resins selected from the group consisting of polyolefin resins, polyphenylene ether resins, silicone resins, and epoxy resins, more preferably contains one or more resins selected from the group consisting of polyolefin resins and polyphenylene ether resins, and even more preferably contains a polyolefin resin.

[0083] (Polyolefin resin) There are no particular limitations on the polyolefin resin, as long as it has a tensile modulus at 25° C. of 10 GPa or less. The polyolefin resin may be used alone or in combination of two or more.

[0084] Examples of polyolefin resins include homopolymers or copolymers of monoolefins, diolefins, and modified products thereof. Examples of monoolefins include ethylene, propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, and styrene. Examples of diolefins include non-conjugated diene compounds such as dicyclopentadiene, 1,4-hexadiene, cyclooctadiene, methylenenorbornene, and ethylidenenorbornene; and conjugated diene compounds such as 1,3-butadiene, isoprene, 1,3-pentadiene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-1,3-butadiene, and 1,3-hexadiene.

[0085] From the viewpoints of compatibility with other resins, dielectric properties, and conductor adhesion, preferred polyolefin resins are conjugated diene polymers (B1) [hereinafter, sometimes referred to as "component (B1)"], modified conjugated diene polymers (B2) [hereinafter, sometimes referred to as "component (B2)"], and styrene elastomers (B3) [hereinafter, sometimes referred to as "component (B3)"].

[0086] [Conjugated diene polymer (B1)] The component (B1) may be a polymer of one type of conjugated diene compound, or may be a polymer of two or more types of conjugated diene compounds. The component (B1) may also be a copolymer of one or more conjugated diene compounds and one or more monomers other than conjugated diene compounds. When component (B1) is a copolymer, the polymerization method is not particularly limited, and may be random polymerization, block polymerization, or graft polymerization. The component (B1) may be used alone or in combination of two or more.

[0087] As the component (B1), from the viewpoints of compatibility with other resins, dielectric properties, and conductor adhesion, a conjugated diene polymer having a vinyl group in the side chain is preferred, and a conjugated diene polymer having multiple vinyl groups in the side chain is more preferred. The number of vinyl groups contained in one molecule of component (B1) is not particularly limited, but from the viewpoints of compatibility with other resins, dielectric properties, and conductor adhesion, it is preferably at least 3, more preferably at least 5, and even more preferably at least 10. The upper limit of the number of vinyl groups contained in one molecule of component (B1) is not particularly limited, but it may be 100 or less, 80 or less, or 60 or less.

[0088] Examples of component (B1) include polybutadiene having 1,2-vinyl groups, butadiene-styrene copolymer having 1,2-vinyl groups, and polyisoprene having 1,2-vinyl groups. Among these, from the viewpoint of dielectric properties and heat resistance, polybutadiene having 1,2-vinyl groups and butadiene-styrene copolymer having 1,2-vinyl groups are preferred, and polybutadiene having 1,2-vinyl groups is more preferred. Furthermore, as polybutadiene having 1,2-vinyl groups, polybutadiene homopolymer having 1,2-vinyl groups is preferred. The 1,2-vinyl group contained in the component (B1) is a vinyl group contained in a structural unit derived from butadiene represented by the following formula (B1-1).

[0089] [ka]

[0090] When component (B1) is a polybutadiene having a 1,2-vinyl group, the content of structural units having a 1,2-vinyl group relative to all structural units derived from butadiene constituting the polybutadiene [hereinafter, sometimes referred to as the "vinyl group content"] is not particularly limited, but from the viewpoints of compatibility with other resins, dielectric properties, conductor adhesion, and heat resistance, it is preferably 50 mol% or more, more preferably 70 mol% or more, and even more preferably 85 mol% or more. There is no particular upper limit to the vinyl group content, and it may be 100 mol% or less, 95 mol% or less, or even 90 mol% or less. As the structural unit having a 1,2-vinyl group, a butadiene-derived structural unit represented by the above formula (B1-1) is preferred. From the same viewpoint, the polybutadiene having a 1,2-vinyl group is preferably a 1,2-polybutadiene homopolymer.

[0091] The 25°C tensile modulus of the component (B1) is within the above-mentioned preferred range of the 25°C tensile modulus of the component (B). From the viewpoint of further improving the dielectric properties and conductor adhesion of the resulting resin composition, and from the viewpoint of maintaining good heat resistance, the 25°C tensile modulus is preferably 0.005 to 0.5 GPa, more preferably 0.01 to 0.3 GPa, and even more preferably 0.03 to 0.1 GPa.

[0092] The number average molecular weight of component (B1) is not particularly limited, but from the viewpoints of compatibility with other resins, dielectric properties, conductor adhesion, and heat resistance, it is preferably 400 to 3,000, more preferably 600 to 2,000, and even more preferably 800 to 1,500.

[0093] [Modified conjugated diene polymer (B2)] The component (B) preferably contains a modified conjugated diene polymer (B2) as a polyolefin resin, and from the viewpoints of compatibility with other resins, dielectric properties, and conductor adhesion, more preferably contains a modified conjugated diene polymer obtained by modifying (b1) a conjugated diene polymer having a vinyl group in the side chain [hereinafter, sometimes referred to as "component (b1)"] with (b2) a maleimide compound having two or more N-substituted maleimide groups [hereinafter, sometimes referred to as "component (b2)"]. The component (B2) may be used alone or in combination of two or more.

[0094] As the component (b1), a conjugated diene polymer having a vinyl group in the side chain, as explained above as the component (B1), can be used, and the preferred embodiments are also the same. The component (b1) may be used alone or in combination of two or more.

[0095] The component (b2) is not particularly limited as long as it is a maleimide compound having two or more N-substituted maleimide groups. The component (b2) may be used alone or in combination of two or more.

[0096] From the viewpoints of compatibility with other resins, dielectric properties, and conductor adhesion, component (b2) is preferably a maleimide compound described above as maleimide compound (a1), which contains a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups. Preferred aspects of this maleimide compound are the same as those of maleimide compound (a1) described above.

[0097] The component (b2) may be a maleimide compound other than the maleimide compound (a1) [hereinafter, sometimes referred to as "component (b2i)"]. The component (b2i) is preferably a maleimide compound represented by the following general formula (b2-1).

[0098] [ka] (In the formula, X b1 is a divalent organic group that does not contain a fused ring of an aromatic ring and an aliphatic ring.

[0099] X in the above general formula (b2-1) b1 is a divalent organic group that does not contain a fused ring of an aromatic ring and an aliphatic ring, and corresponds to the divalent group obtained by removing two N-substituted maleimide groups from the component (b2i). X in the above general formula (b2-1) b1 Examples of the divalent organic group represented by the formula (b2-2) include a divalent group represented by the following general formula (b2-3), a divalent group represented by the following general formula (b2-4), a divalent group represented by the following general formula (b2-5), and a divalent group represented by the following general formula (b2-6).

[0100] [ka] (In the formula, R b1 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; q1 is an integer of 0 to 4; * represents a bonding site.

[0101] R in the above general formula (b2-2) b1 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. In the above general formula (b2-2), q1 is an integer of 0 to 4, and from the viewpoint of availability, is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. When q1 is an integer of 2 or more, multiple R b1 They may be the same or different.

[0102] [ka] (In the formula, R b2 and R b3 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent group represented by the following general formula (b2-3-1): q2 and q3 each independently represent an integer of 0 to 4; * represents a bonding site.

[0103] R in the above general formula (b2-3) b2 and R b3 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. From the viewpoints of compatibility with other resins and suppressing gelation of the product during the reaction, the aliphatic hydrocarbon group having 1 to 3 carbon atoms is preferred, alkyl groups having 1 to 3 carbon atoms are more preferred, and methyl and ethyl groups are even more preferred. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0104] X in the above general formula (b2-3) b2Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0105] X in the above general formula (b2-3) b2 Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0106] In the general formula (b2-3), q2 and q3 each independently represent an integer of 0 to 4, and from the viewpoints of availability, compatibility with other resins, and suppression of gelation of the product during the reaction, each is preferably an integer of 1 to 3, more preferably 1 or 2, and even more preferably 2. q2+q3 is preferably an integer of 1 to 8, more preferably an integer of 2 to 6, and even more preferably 4, from the viewpoints of availability, compatibility with other resins, and suppression of gelation of the product during the reaction. When q2 or q3 is an integer of 2 or more, a plurality of R b2 R b3 They may be the same or different from each other.

[0107] X in the above general formula (b2-3) b2 The divalent group represented by general formula (b2-3-1) is as follows:

[0108] [ka] (In the formula, R b4 and R b5are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. b3 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, or a single bond. q4 and q5 each independently represent an integer of 0 to 4. * represents a bonding site.

[0109] R in the above general formula (b2-3-1) b4 and R b5 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0110] X in the above general formula (b2-3-1) b3 Examples of the alkylene group having 1 to 5 carbon atoms represented by include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.

[0111] X in the above general formula (b2-3-1) b3 Examples of the alkylidene group having 2 to 5 carbon atoms represented by include an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, an isopentylidene group, etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

[0112] X in the above general formula (b2-3-1) b3 Among the above options, alkylidene groups having 2 to 5 carbon atoms are preferred, alkylidene groups having 2 to 4 carbon atoms are more preferred, and an isopropylidene group is even more preferred.

[0113] In the general formula (b2-3-1) above, q4 and q5 each independently represent an integer of 0 to 4, and from the viewpoint of availability, each is preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0. When q4 or q5 is an integer of 2 or more, a plurality of R b4 R b5 They may be the same or different from each other.

[0114] X in the above general formula (b2-3) b2 Among the above options, an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, or a divalent group represented by general formula (b2-3-1) above is preferable, an alkylene group having 1 to 5 carbon atoms is more preferable, and a methylene group is even more preferable.

[0115] [ka] (In the formula, q6 is an integer of 0 to 10. * represents a binding site.)

[0116] In the above general formula (b2-4), q6 is preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and even more preferably an integer of 0 to 3, from the viewpoint of availability.

[0117] [ka] (In the formula, q7 is a number from 0 to 5. * represents a binding site.)

[0118] [ka] (In the formula, R b6 and R b7 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. q8 is an integer of 1 to 8. * represents a bonding site.

[0119] R in the above general formula (b2-6) b6 and R b7 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl groups; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. In the general formula (b2-6), q8 is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and even more preferably 1. When q8 is an integer of 2 or more, multiple R b6 R b7 They may be the same or different from each other.

[0120] Examples of the component (b2i) include an aromatic bismaleimide compound having two N-substituted maleimide groups bonded to an aromatic ring, an aromatic polymaleimide compound having three or more N-substituted maleimide groups bonded to an aromatic ring, and an aliphatic maleimide compound having an N-substituted maleimide group bonded to an aliphatic group. Specific examples of the component (b2i) include N,N'-ethylene bismaleimide, N,N'-hexamethylene bismaleimide, N,N'-(1,3-phenylene) bismaleimide, N,N'-[1,3-(2-methylphenylene)] bismaleimide, N,N'-[1,3-(4-methylphenylene)] bismaleimide, N,N'-(1,4-phenylene) bismaleimide, bis(4-maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl)methane, bis(3-ethyl-5-methyl-4-maleimidophenyl)methane, and bis(4-maleimidophenyl)methane. Bis(4-maleimidophenyl)methane, bis(4-maleimidophenyl) ether, bis(4-maleimidophenyl) sulfone, bis(4-maleimidophenyl) sulfide, bis(4-maleimidophenyl) ketone, bis(4-maleimidocyclohexyl)methane, 1,4-bis(4-maleimidophenyl)cyclohexane, 1,4-bis(maleimidomethyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, 1,3-bis(4-maleimidophenoxy)benzene, 1,3-bis(3-maleimidophenoxy) (i) Benzene, bis[4-(3-maleimidophenoxy)phenyl]methane, bis[4-(4-maleimidophenoxy)phenyl]methane, 1,1-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,1-bis[4-(4-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidophenoxy)phenyl]ethane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]propane, 2,2 -bis[4-(4-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidophenoxy)biphenyl, 4,4-bis(4-maleimidophenoxy)biphenyl, bis[4-(3-maleimidophenoxy)phenyl]ketone, bis[4-(4-maleimidophenoxy)phenyl]ketone, bis(4-maleimidophenyl)disulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfide, bis[4-(4-maleimidophenoxy)phenyl]sulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfide bis[4-(4-maleimidophenoxy)phenyl]sulfoxide, bis[4-(3-maleimidophenoxy)phenyl]sulfone, bis[4-(4-maleimidophenoxy)phenyl]sulfone, bis[4-(3-maleimidophenoxy)phenyl]ether, bis[4-(4-maleimidophenoxy)phenyl]ether, 1,4-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl] Benzene, 1,3-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis Examples include [4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethane maleimide, and biphenylaralkyl maleimide compounds.

[0121] The modified conjugated diene polymer (B2) preferably has, in its side chain, a substituent (hereinafter sometimes referred to as "substituent (x)") formed by reaction between a vinyl group contained in the conjugated diene polymer (b1) and an N-substituted maleimide group contained in the maleimide compound (b2). From the viewpoints of compatibility with other resins, dielectric properties, low thermal expansion, and heat resistance, the substituent (x) is preferably a group containing a structure represented by the following general formula (B2-11) or (B2-12) as a structure derived from the maleimide compound (b2).

[0122] [ka] (In the formula, X B1 is a divalent group obtained by removing two N-substituted maleimide groups from component (b2), and * B1 is the site of bonding to the carbon atom derived from the vinyl group in the side chain of component (b1). B2 is the site of attachment to another atom.)

[0123] The modified conjugated diene polymer (B2) preferably has a substituent (x) and a vinyl group (y) on the side chain. The extent to which the substituent (x) is present in the modified conjugated diene polymer (B2) can be determined by the extent to which the vinyl group of the component (b1) has been modified by the component (b2) (hereinafter, this may be referred to as the "vinyl group modification rate"). The vinyl group modification rate is not particularly limited, but is preferably 20 to 70%, more preferably 30 to 60%, and even more preferably 35 to 50%, from the viewpoints of compatibility with other resins, dielectric properties, low thermal expansion, and heat resistance. Here, the vinyl group modification rate is a value determined by the method described in the examples. The vinyl group (y) is preferably a 1,2-vinyl group contained in a structural unit derived from butadiene.

[0124] The 25°C tensile modulus of the (B2) component is within the above-mentioned preferred range of the 25°C tensile modulus of the (B) component. However, from the viewpoint of further improving the dielectric properties and conductor adhesion of the resulting resin composition, and from the viewpoint of maintaining good heat resistance, it is preferably 0.01 to 1 GPa, more preferably 0.03 to 0.5 GPa, and even more preferably 0.05 to 0.15 GPa.

[0125] The number average molecular weight of component (B2) is not particularly limited, but from the viewpoints of compatibility with other resins, dielectric properties, low thermal expansion, and heat resistance, it is preferably 700 to 6,000, more preferably 800 to 5,000, and even more preferably 1,000 to 2,500.

[0126] The component (B2) can be produced by reacting a conjugated diene polymer (b1) with a maleimide compound (b2). The method for reacting the conjugated diene polymer (b1) with the maleimide compound (b2) is not particularly limited. For example, the conjugated diene polymer (b1), the maleimide compound (b2), a reaction catalyst, and an organic solvent are charged into a reaction vessel, and the reaction is carried out while heating, keeping the temperature, stirring, etc., as necessary, to obtain the component (B2). The reaction temperature for the above reaction is preferably 70 to 120°C, more preferably 80 to 110°C, and even more preferably 85 to 105°C, from the viewpoints of workability and suppressing gelation of the product during the reaction. The reaction time for the above reaction is preferably 0.5 to 15 hours, more preferably 1 to 10 hours, and even more preferably 3 to 7 hours, from the viewpoints of productivity and allowing the reaction to proceed sufficiently. However, these reaction conditions can be appropriately adjusted depending on the types of raw materials used, and are not particularly limited.

[0127] Examples of organic solvents used in the above reaction include alcohol-based solvents such as methanol, ethanol, butanol, butyl cellosolve, ethylene glycol monomethyl ether, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; ester-based solvents such as methoxyethyl acetate, ethoxyethyl acetate, butoxyethyl acetate, and ethyl acetate; and nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone. The organic solvent may be used alone or in combination of two or more. Among these, toluene is preferred from the viewpoint of resin solubility.

[0128] When the reaction is carried out in an organic solvent, the total content of the conjugated diene polymer (b1) and the maleimide compound (b2) in the reaction solution is not particularly limited, but is preferably 10 to 70% by mass, more preferably 15 to 60% by mass, and even more preferably 20 to 50% by mass. When the total content of the conjugated diene polymer (b1) and the maleimide compound (b2) is equal to or greater than the above-mentioned lower limit, a good reaction rate is obtained and productivity tends to be improved. On the other hand, when the total content of the conjugated diene polymer (b1) and the maleimide compound (b2) is equal to or less than the above-mentioned upper limit, better solubility is obtained, stirring efficiency is improved, and gelation of the product during the reaction tends to be more effectively suppressed.

[0129] As the reaction catalyst, from the viewpoint of obtaining sufficient reactivity while suppressing gelation of the product during the reaction, organic peroxides are preferred, and α,α'-bis(t-butylperoxy)diisopropylbenzene is more preferred. The reaction catalyst may be used alone or in combination of two or more. The amount of the reaction catalyst used is not particularly limited, but from the viewpoint of the reaction rate and reaction uniformity, it is preferably 0.01 to 1 part by mass, more preferably 0.03 to 0.5 parts by mass, and even more preferably 0.05 to 0.2 parts by mass, relative to 100 parts by mass of the total amount of the conjugated diene polymer (b1) and the maleimide compound (b2).

[0130] When the above reaction is carried out, the number of moles of side chain vinyl groups in the conjugated diene polymer (b1) (M v ) 、 The number of moles of N-substituted maleimide groups in the maleimide compound (b2) (M m ) ratio (M m / M v) is not particularly limited, but from the viewpoints of compatibility with other resins of the resulting component (B2) and suppression of gelation of the product during the reaction, it is preferably 0.001 to 0.5, more preferably 0.005 to 0.1, and even more preferably 0.008 to 0.05.

[0131] [Styrene-based elastomer (B3)] The component (B) preferably contains a styrene elastomer (B3) as a polyolefin resin. There are no particular restrictions on the component (B3), so long as it is an elastomer having a tensile modulus of elasticity at 25°C of 10 GPa or less and containing structural units derived from a styrene-based compound. The component (B3) may be used alone or in combination of two or more.

[0132] The component (B3) is preferably one having a structural unit derived from a styrene-based compound represented by the following general formula (B3-1).

[0133] [ka] (In the formula, R b8 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and R b9 is an alkyl group having 1 to 5 carbon atoms. k is an integer of 0 to 5.

[0134] R in the above general formula (B3-1) b8 and R b9 Examples of the alkyl group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The alkyl group having 1 to 5 carbon atoms may be either linear or branched. Among these, an alkyl group having 1 to 3 carbon atoms is preferred, an alkyl group having 1 or 2 carbon atoms is more preferred, and a methyl group is even more preferred. In the above general formula (B3-1), k1 is an integer of 0 to 5, preferably an integer of 0 to 2, more preferably 0 or 1, and even more preferably 0.

[0135] Examples of structural units contained in the component (B3) other than those derived from styrene-based compounds include structural units derived from butadiene, structural units derived from isoprene, structural units derived from maleic acid, and structural units derived from maleic anhydride. The butadiene-derived structural units and the isoprene-derived structural units may be hydrogenated. When hydrogenated, the butadiene-derived structural units become structural units in which ethylene units and butylene units are mixed, and the isoprene-derived structural units become structural units in which ethylene units and propylene units are mixed.

[0136] From the viewpoints of dielectric properties, conductor adhesion, heat resistance, glass transition temperature, and low thermal expansion, the component (B3) is preferably at least one selected from the group consisting of hydrogenated styrene-butadiene-styrene block copolymers (SEBS, SBBS), hydrogenated styrene-isoprene-styrene block copolymers (SEPS), and styrene-maleic anhydride copolymers (SMA), more preferably at least one selected from the group consisting of hydrogenated styrene-butadiene-styrene block copolymers (SEBS) and hydrogenated styrene-isoprene-styrene block copolymers (SEPS), and even more preferably hydrogenated styrene-butadiene-styrene block copolymers (SEBS).

[0137] In the SEBS, the content of structural units derived from styrene (hereinafter, may be referred to as "styrene content") is not particularly limited, but from the viewpoints of dielectric properties, conductor adhesion, heat resistance, glass transition temperature, and low thermal expansion, it is preferably 5 to 60 mass%, more preferably 7 to 40 mass%, and even more preferably 10 to 20 mass%.

[0138] The melt flow rate (MFR) of SEBS is not particularly limited, but from the viewpoint of easily adjusting the 25°C tensile modulus of the (B3) component within a suitable range, it is preferably 0.1 to 20 g / 10 min, more preferably 1 to 10 g / 10 min, and even more preferably 3 to 7 g / 10 min, measured under the conditions of 230°C and a load of 2.16 kgf (21.2 N).

[0139] Examples of commercially available SEBS products include the Tuftec (registered trademark) H series and M series manufactured by Asahi Kasei Corporation, the Septon (registered trademark) series manufactured by Kuraray Co., Ltd., and the Kraton (registered trademark) G Polymer series manufactured by Kraton Polymer Japan Co., Ltd.

[0140] The tensile modulus at 25°C of the component (B3) is within the above-mentioned preferred range of the tensile modulus at 25°C of the component (B). From the viewpoint of further improving the dielectric properties and conductor adhesion of the resulting resin composition, and from the viewpoint of maintaining good heat resistance, the tensile modulus is preferably 0.02 to 4 GPa, more preferably 0.05 to 2 GPa, and even more preferably 0.1 to 1 GPa.

[0141] The number average molecular weight of component (B3) is not particularly limited, but from the viewpoint of making it easy to adjust the 25°C tensile modulus of component (B3) within a suitable range, it is preferably 10,000 to 500,000, more preferably 50,000 to 350,000, and even more preferably 100,000 to 200,000.

[0142] The content of one or more selected from the group consisting of components (B1), (B2), and (B3) in the total amount of component (B) is not particularly limited, but from the viewpoints of dielectric properties and conductor adhesion, it is preferably 60 mass% or more, more preferably 80 mass% or more, and even more preferably 90 mass% or more. The content of one or more selected from the group consisting of components (B1), (B2), and (B3) in the total amount of component (B) is not particularly limited, but may be 100 mass% or less, 98 mass% or less, or 95 mass% or less.

[0143] From the viewpoint of dielectric properties and conductor adhesion, the component (B) preferably contains the components (B2) and (B3) as polyolefin resins. When the polyolefin resin contains the (B2) component and the (B3) component, the content ratio of the (B2) component to the (B3) component [(B2) component / (B3) component] is not particularly limited, but from the viewpoints of compatibility, dielectric properties, and conductor adhesion, it is preferably 0.1 to 10, more preferably 0.2 to 5, and even more preferably 0.5 to 1.

[0144] As the component (B), polyphenylene ether resin (B4) [hereinafter, sometimes referred to as "component (B4)"], silicone resin (B5) [hereinafter, sometimes referred to as "component (B5)"], and epoxy resin (B6) [hereinafter, sometimes referred to as "component (B6)"] are also preferred.

[0145] (Polyphenylene ether resin (B4)) There are no particular restrictions on the component (B4), so long as it is a polyphenylene ether resin having a tensile modulus at 25° C. of 10 GPa or less. In this specification, the phenylene group included in the "polyphenylene ether" is a concept that includes not only unsubstituted phenylene groups but also phenylene groups substituted with a substituent. The component (B4) may be used alone or in combination of two or more.

[0146] The component (B4) also has at least a phenylene ether bond, and preferably has a structural unit represented by the following general formula (B4-1).

[0147] [ka] (In the formula, R b10 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. s1 is an integer of 0 to 4.

[0148] R in the above general formula (B4-1) b10Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by the formula (I) include alkyl groups having 1 to 5 carbon atoms, such as methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, t-butyl, and n-pentyl; alkenyl groups having 2 to 5 carbon atoms, and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be either linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0149] In the general formula (B4-1), s1 is an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 1 or 2, and even more preferably 2. When s1 is an integer of 2 or more, a plurality of R b10 They may be the same or different from each other. When s1 is 1 or 2, R b10 is preferably substituted at the ortho position on the benzene ring (based on the substitution position of the oxygen atom). The structural unit represented by the above general formula (B4-1) is preferably a structural unit represented by the following general formula (B4-2).

[0150] [ka]

[0151] The component (B4) may have structural units other than phenylene ether units, but may also have no structural units other than phenylene ether units. The component (B4) may have a phenolic hydroxyl group at one or both ends. The average number of phenolic hydroxyl groups per molecule of the component (B4) is preferably 1 to 2, more preferably 1.4 to 1.9, and even more preferably 1.6 to 1.85.

[0152] The tensile modulus of elasticity at 25°C of the component (B4) is preferably 0.5 to 7 GPa, more preferably 1 to 5 GPa, and even more preferably 1.5 to 3 GPa, from the viewpoints of improving the dielectric properties and conductor adhesion of the resulting resin composition, maintaining good heat resistance, and being easily available.

[0153] The number average molecular weight of component (B4) is not particularly limited, but from the viewpoint of making it easy to adjust the 25°C tensile modulus of component (B4) within a suitable range, it is preferably 1,000 to 50,000, more preferably 5,000 to 20,000, and even more preferably 8,000 to 15,000.

[0154] (Silicone resin (B5)) There are no particular restrictions on the component (B5), so long as it is a silicone resin with a tensile modulus at 25°C of 10 GPa or less. The component (B5) may be used alone or in combination of two or more.

[0155] The component (B5) has at least a siloxane bond, and preferably has a structural unit represented by the following general formula (B5-1).

[0156] [ka] (In the formula, R b11 and R b12 are each independently an alkyl group having 1 to 5 carbon atoms, a phenyl group, or a phenyl group having a substituent.

[0157] R in the above general formula (B5-1) b11 and R b12Examples of the alkyl group having 1 to 5 carbon atoms represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, an n-pentyl group, etc. The alkyl group having 1 to 5 carbon atoms may be either linear or branched. As the alkyl group, an alkyl group having 1 to 3 carbon atoms is preferred, a methyl group or an ethyl group is more preferred, and a methyl group is even more preferred.

[0158] R in the above general formula (B5-1) b11 and R b12 Examples of the substituent on the phenyl group having a substituent represented by the formula (I) include an alkyl group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, and an alkynyl group having 2 to 5 carbon atoms. Examples of the alkyl group having 1 to 5 carbon atoms include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a t-butyl group, and an n-pentyl group. Examples of the alkenyl group having 2 to 5 carbon atoms include a vinyl group and an allyl group. Examples of the alkynyl group having 2 to 5 carbon atoms include an ethynyl group and a propargyl group. The alkyl group having 1 to 5 carbon atoms, the alkenyl group having 2 to 5 carbon atoms, and the alkynyl group having 2 to 5 carbon atoms may be linear or branched.

[0159] R in the above general formula (B5-1) b11 and R b12 is preferably an alkyl group having 1 to 5 carbon atoms, more preferably a methyl group or an ethyl group, and even more preferably a methyl group. That is, the structural unit represented by the above general formula (B5-1) is preferably a dimethylsiloxane unit.

[0160] The component (B5) may be a straight-chain silicone resin or a branched-chain silicone resin, but is preferably a straight-chain silicone resin. The component (B5) may have a reactive group in its molecular structure. The reactive group may be introduced into a portion of the side chain of the polysiloxane, or may be introduced into one or both ends of the polysiloxane. Furthermore, the reactive group may be introduced into one or both ends of the polysiloxane in addition to the side chain. Examples of the reactive group include an epoxy group, an amino group, a vinyl group, a hydroxyl group, a methacryl group, a mercapto group, a carboxy group, an alkoxy group, a silanol group, etc. The component (B5) may contain one or more of the reactive groups listed above. Among these, the reactive group is preferably an amino group or a vinyl group. As the amino group, a primary amino group or a secondary amino group is preferred, and a primary amino group is more preferred.

[0161] When the component (B5) has an amino group, from the viewpoint of compatibility with other resins, the component (B5) preferably has one or two primary amino groups, more preferably has two primary amino groups, and even more preferably is a diaminopolysiloxane having one primary amino group at each end.

[0162] The tensile modulus at 25°C of the component (B5) is within the above-mentioned preferred range of the tensile modulus at 25°C of the component (B). However, from the viewpoint of further improving the dielectric properties and conductor adhesion of the resulting resin composition, and from the viewpoint of maintaining good heat resistance, it is preferably 0.01 to 1 GPa, more preferably 0.03 to 0.5 GPa, and even more preferably 0.05 to 0.15 GPa.

[0163] When the component (B5) has a reactive group, the reactive group equivalent weight is not particularly limited, but is preferably 200 to 3,000 g / mol, more preferably 300 to 1,000 g / mol, and even more preferably 400 to 600 g / mol.

[0164] (Epoxy resin (B6)) There are no particular restrictions on the component (B6), so long as it is an epoxy resin with a tensile modulus at 25°C of 10 GPa or less. The component (B6) may be used alone or in combination of two or more.

[0165] The component (B6) is preferably, for example, an epoxy resin having two or more epoxy groups. Epoxy resins are classified into glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, etc. Among these, glycidyl ether type epoxy resins are preferred.

[0166] Examples of component (B6) include aliphatic linear epoxy resins, rubber-modified epoxy resins, epoxy resins having an alicyclic skeleton, etc. Among these, epoxy resins having an alicyclic skeleton are preferred from the viewpoint of improving the dielectric properties and conductor adhesion of the resulting resin composition. The alicyclic skeleton contained in the component (B6) is not particularly limited, but is preferably an alicyclic skeleton having 5 to 20 ring carbon atoms, more preferably an alicyclic skeleton having 6 to 18 ring carbon atoms, and particularly preferably an alicyclic skeleton having 8 to 14 ring carbon atoms. The alicyclic skeleton preferably consists of two or more rings, more preferably two to four rings, and even more preferably three rings. Examples of alicyclic skeletons consisting of two or more rings include a norbornane skeleton, a decalin skeleton, a bicycloundecane skeleton, and a dicyclopentadiene skeleton. The alicyclic skeleton is preferably a dicyclopentadiene skeleton.

[0167] Examples of epoxy resins having an alicyclic skeleton include epoxy resins represented by the following general formula (B6-1).

[0168] [ka] (In the formula, R b13R is an alkyl group having 1 to 12 carbon atoms, and may be substituted anywhere in the alicyclic skeleton. b14 is an alkyl group having 1 to 12 carbon atoms; m1 is an integer of 0 to 6, m2 is an integer of 0 to 3, and r is a number of 0 to 10.

[0169] R in the above general formula (B6-1) b13 Examples of the alkyl group having 1 to 12 carbon atoms represented by include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. These alkyl groups may be either linear or branched. The alkyl group is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. In the above general formula (B6-1), m1 is an integer of 0 to 6, preferably an integer of 0 to 5, more preferably an integer of 0 to 2, and even more preferably 0. When m1 is an integer of 2 or more, multiple R b13 Each R may be the same or different. b13 may be substituted on the same carbon atom or on different carbon atoms, to the extent possible.

[0170] R in the above general formula (B6-1) b14 Examples of the alkyl group having 1 to 12 carbon atoms represented by include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, and a decyl group. These alkyl groups may be either linear or branched. The alkyl group is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. In the above general formula (B6-1), m2 is an integer of 0 to 3, preferably 0 or 1, and more preferably 0. When m2 is an integer equal to or greater than 2, multiple R b14 They may be the same or different from each other.

[0171] In the general formula (B6-1) above, r represents the number of repetitions of the structural unit in the parentheses, and is a number from 0 to 10, preferably from 2 to 10. When the epoxy resin represented by the general formula (B6-1) above is a mixture of units with different numbers of repetitions of the structural unit in the parentheses, r is represented as the average value of the mixture.

[0172] The tensile modulus of elasticity at 25°C of the component (B6) is preferably 1 to 7 GPa, more preferably 1.5 to 5 GPa, and even more preferably 2 to 3 GPa, from the viewpoints of improving the dielectric properties and conductor adhesion of the resulting resin composition, maintaining good heat resistance, and being easily available.

[0173] There are no particular limitations on the epoxy group equivalent of the component (B6), but it is preferably 150 to 1,000 g / mol, more preferably 200 to 500 g / mol, and even more preferably 250 to 300 g / mol.

[0174] (Other components (B)) Examples of the component (B) other than those mentioned above include one or more resins selected from the group consisting of polyurethane resins, polyester resins, polyamide resins, and polyacrylic resins.

[0175] Examples of polyurethane resins include those having a hard segment made of a low molecular weight diol and a diisocyanate, and a soft segment made of a high molecular weight diol and a diisocyanate. Examples of low molecular weight diols include ethylene glycol, propylene glycol, 1,4-butanediol, and bisphenol A. Examples of high molecular weight diols include polypropylene glycol, polytetramethylene oxide, poly(1,4-butylene adipate), poly(ethylene-1,4-butylene adipate), polycaprolactone, poly(1,6-hexylene carbonate), and poly(1,6-hexylene-neopentylene adipate). The low molecular weight diols and high molecular weight diols may each be used alone or in combination of two or more. The polyurethane resin may be used alone or in combination of two or more.

[0176] Examples of polyester resins include those obtained by polycondensation of dicarboxylic acid or a derivative thereof with a diol compound or a derivative thereof. Examples of dicarboxylic acids include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid; aromatic dicarboxylic acids in which the hydrogen atoms of the aromatic nuclei of these aromatic dicarboxylic acids are substituted with methyl groups, ethyl groups, phenyl groups, etc.; aliphatic dicarboxylic acids having 2 to 20 carbon atoms such as adipic acid, sebacic acid, and dodecanedicarboxylic acid; and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. These dicarboxylic acids may be used alone or in combination of two or more. Examples of the diol compound include aliphatic diols such as ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, and 1,10-decanediol; alicyclic diols such as 1,4-cyclohexanediol; and aromatic diols such as bisphenol A, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3-methylphenyl)propane, and resorcinol. These diol compounds may be used alone or in combination of two or more. Alternatively, a multi-block copolymer may be used in which an aromatic polyester moiety such as polybutylene terephthalate serves as a hard segment component and an aliphatic polyester moiety such as polytetramethylene glycol serves as a soft segment component. The polyester resin may be used alone or in combination of two or more.

[0177] Examples of polyamide-based resins include block copolymers in which polyamide is used as a hard segment component and polybutadiene, butadiene-acrylonitrile copolymer, styrene-butadiene copolymer, polyisoprene, ethylene-propylene copolymer, polyether, polyester, polybutadiene, polycarbonate, polyacrylate, polymethacrylate, polyurethane, silicone rubber, or the like is used as a soft segment component. The polyamide resin may be used alone or in combination of two or more kinds.

[0178] Examples of acrylic resins include polymers obtained by polymerizing raw material monomers whose main component is an acrylic acid ester. Examples of acrylic acid esters include ethyl acrylate, butyl acrylate, methoxyethyl acrylate, and ethoxyethyl acrylate. Furthermore, the crosslinking point monomer may be one that uses glycidyl methacrylate, allyl glycidyl ether, or the like as a raw material, and may further be one that is copolymerized with acrylonitrile, ethylene, or the like. Specific examples include acrylonitrile-butyl acrylate copolymer, acrylonitrile-butyl acrylate-ethyl acrylate copolymer, and acrylonitrile-butyl acrylate-glycidyl methacrylate copolymer. The acrylic resins may be used alone or in combination of two or more.

[0179] <Contents of component (A) and component (B), and their content ratios> In the resin composition of this embodiment, the content of component (A) is not particularly limited, but is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, and even more preferably 25 to 75 parts by mass, per 100 parts by mass of the total resin components in the resin composition of this embodiment. When the content of component (A) is at least the above-mentioned lower limit, heat resistance, moldability, processability, flame retardancy, and conductor adhesion tend to be better. On the other hand, when the content of component (A) is at most the above-mentioned upper limit, dielectric properties tend to be better. Furthermore, the content of component (A) is not particularly limited, but from the viewpoint of further improving heat resistance, etc., it may be 30 parts by mass or more, 40 parts by mass or more, or 50 parts by mass or more relative to 100 parts by mass of the total of the resin components in the resin composition of this embodiment. Furthermore, the content of component (A) is not particularly limited, but from the viewpoint of further improving the dielectric properties, etc., it may be 70 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less, relative to 100 parts by mass of the total of the resin components in the resin composition of this embodiment.

[0180] Here, in this specification, the term "resin component" refers to a resin and a compound that forms a resin upon a curing reaction. For example, components (A) and (B) correspond to the resin component. Furthermore, when the resin composition of this embodiment contains, as optional components, a resin or a compound that forms a resin upon a curing reaction other than components (A) and (B), these optional components are also included in the resin component. Components (C), (D), and (E), which will be described later, are not included in the resin component.

[0181] In the resin composition of this embodiment, the content of component (B) is not particularly limited, but is preferably 10 to 90 parts by mass, more preferably 20 to 80 parts by mass, and even more preferably 25 to 75 parts by mass, per 100 parts by mass of the total resin components in the resin composition of this embodiment. When the content of component (B) is equal to or greater than the above-mentioned lower limit, the dielectric properties tend to be better. On the other hand, when the content of component (B) is equal to or less than the above-mentioned upper limit, the heat resistance, moldability, processability, flame retardancy, and conductor adhesion tend to be better. Furthermore, the content of component (B) is not particularly limited, but from the viewpoint of further improving the dielectric properties, etc., it may be 30 parts by mass or more, 40 parts by mass or more, or 50 parts by mass or more relative to 100 parts by mass of the total resin components in the resin composition of this embodiment. Furthermore, the content of component (B) is not particularly limited, but from the viewpoint of further improving heat resistance, etc., it may be 70 parts by mass or less, 60 parts by mass or less, 50 parts by mass or less, or 40 parts by mass or less, relative to 100 parts by mass of the total of the resin components in the resin composition of this embodiment.

[0182] In the resin composition of this embodiment, the content ratio of component (A) to component (B) [(A) / (B)] is not particularly limited, but is preferably 0.1 to 9, more preferably 0.25 to 4, and even more preferably 0.3 to 3, by mass. When the content ratio of component (A) to component (B) [(A) / (B)] is at least the above lower limit, the heat resistance, moldability, processability, flame retardancy, and conductor adhesion tend to be better. Furthermore, when the content ratio of component (A) to component (B) [(A) / (B)] is at most the above upper limit, the dielectric properties tend to be better. Furthermore, the content ratio of the (A) component to the (B) component [(A) / (B)] is not particularly limited, but from the viewpoint of further improving heat resistance and the like, it may be 0.5 or more, 1 or more, or 1.5 or more on a mass basis. Furthermore, the content ratio of the (A) component to the (B) component [(A) / (B)] is not particularly limited, but from the viewpoint of further improving the dielectric properties, etc., it may be 7 or less, 2 or less, 1 or less, or 0.6 or less on a mass basis.

[0183] The content of the resin component in the resin composition of this embodiment is not particularly limited, but from the viewpoints of low thermal expansion, elastic modulus, heat resistance, flame retardancy, and conductor adhesion, it is preferably 10 to 70 mass%, more preferably 20 to 65 mass%, and even more preferably 30 to 60 mass%.

[0184] <Other ingredients> The resin composition of the present embodiment may further contain other components depending on the desired performance. Examples of other components include one or more selected from the group consisting of an inorganic filler (C) (hereinafter, sometimes referred to as "component (C)"); a flame retardant (D) (hereinafter, sometimes referred to as "component (D)"); and a curing accelerator (E) (hereinafter, sometimes referred to as "component (E)"). However, the resin composition of the present embodiment may not contain one or more selected from the group consisting of the inorganic filler (C), the flame retardant (D) and the curing accelerator (E), depending on the desired performance. These components are described in detail below.

[0185] (Inorganic filler (C)) By including the inorganic filler (C), the resin composition of the present embodiment tends to have further improved low thermal expansion properties, elastic modulus, heat resistance, and flame retardancy. The inorganic filler (C) may be used alone or in combination of two or more kinds.

[0186] Examples of the inorganic filler (C) include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide, etc. Among these, from the viewpoints of low thermal expansion, elastic modulus, heat resistance, and flame retardancy, silica, alumina, mica, and talc are preferred, silica and alumina are more preferred, and silica is even more preferred. Examples of silica include precipitated silica produced by a wet method and having a high water content, and dry-process silica produced by a dry method and containing almost no bound water, etc. Dry-process silica further includes crushed silica, fumed silica, fused silica, etc., depending on the production method.

[0187] The average particle size of the inorganic filler (C) is not particularly limited, but from the viewpoint of dispersibility and fine wiring properties, it is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, even more preferably 0.2 to 1 μm, and particularly preferably 0.3 to 0.8 μm. In this specification, the average particle size of the inorganic filler (C) refers to the particle size at the point corresponding to 50% volume when the cumulative frequency distribution curve of particle sizes is calculated, with the total volume of the particles being 100%. The particle size of the inorganic filler (C) can be measured, for example, with a particle size distribution measuring device using a laser diffraction scattering method. The shape of the inorganic filler (C) may be, for example, spherical or crushed, with spherical being preferred.

[0188] When the resin composition of the present embodiment contains an inorganic filler (C), the content of the inorganic filler (C) in the resin composition is not particularly limited, but from the viewpoints of low thermal expansion, elastic modulus, heat resistance, and flame retardancy, it is preferably 10 to 70 mass%, more preferably 20 to 65 mass%, and even more preferably 30 to 60 mass% relative to the total solid content (100 mass%) of the resin composition.

[0189] When the resin composition of this embodiment contains an inorganic filler (C), a coupling agent may be used to improve the dispersibility of the inorganic filler (C) and its adhesion to the organic component. Examples of the coupling agent include silane coupling agents and titanate coupling agents. Among these, silane coupling agents are preferred. Examples of the silane coupling agent include aminosilane coupling agents, vinylsilane coupling agents, and epoxysilane coupling agents.

[0190] When a coupling agent is used in the resin composition of this embodiment, the surface treatment method of the inorganic filler (C) may be an integral blend treatment method in which the inorganic filler (C) is blended into the resin composition and then the coupling agent is added, or a method in which the inorganic filler (C) is previously surface-treated with the coupling agent in a dry or wet manner. Among these, the method in which the inorganic filler (C) is previously surface-treated with the coupling agent in a dry or wet manner is preferred from the viewpoint of more effectively exhibiting the characteristics of the inorganic filler (C). For the purpose of improving dispersibility in the resin composition, the inorganic filler (C) may be dispersed in an organic solvent in advance to form a slurry, which may then be mixed with other components.

[0191] (Flame retardant (D)) The resin composition of the present embodiment tends to have improved flame retardancy by containing the flame retardant (D). The flame retardant (D) may be used alone or in combination of two or more. The resin composition of the present embodiment may also contain a flame retardant aid as needed.

[0192] Examples of the flame retardant (D) include phosphorus-based flame retardants, metal hydrates, and halogen-based flame retardants, and from the viewpoint of environmental issues, phosphorus-based flame retardants and metal hydrates are preferred.

[0193] -Phosphorus-based flame retardants- The phosphorus-based flame retardant is not particularly limited as long as it contains a phosphorus atom and is one that is generally used as a flame retardant, and may be an inorganic phosphorus-based flame retardant or an organic phosphorus-based flame retardant. From the viewpoint of environmental issues, it is preferable that the phosphorus-based flame retardant does not contain a halogen atom.

[0194] Examples of inorganic phosphorus-based flame retardants include red phosphorus; ammonium phosphates such as monoammonium phosphate, diammonium phosphate, triammonium phosphate, and ammonium polyphosphate; inorganic nitrogen-containing phosphorus compounds such as phosphoric acid amide; phosphoric acid; and phosphine oxide.

[0195] Examples of organic phosphorus-based flame retardants include aromatic phosphate esters, mono-substituted phosphonic acid diesters, di-substituted phosphinic acid esters, metal salts of di-substituted phosphinic acids, organic nitrogen-containing phosphorus compounds, and cyclic organic phosphorus compounds. Among these, aromatic phosphate ester compounds and metal salts of di-substituted phosphinic acids are preferred. Examples of metal salts include lithium salts, sodium salts, potassium salts, calcium salts, magnesium salts, aluminum salts, titanium salts, and zinc salts. Among these, aluminum salts are preferred. Furthermore, among organic phosphorus-based flame retardants, aromatic phosphate esters are preferred.

[0196] Examples of aromatic phosphate esters include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, cresyl di-2,6-xylenyl phosphate, resorcinol bis(diphenyl phosphate), 1,3-phenylene bis(di-2,6-xylenyl phosphate), bisphenol A bis(diphenyl phosphate), and 1,3-phenylene bis(diphenyl phosphate).

[0197] Examples of the mono-substituted phosphonic acid diester include divinyl phenylphosphonate, diallyl phenylphosphonate, and bis(1-butenyl) phenylphosphonate. Examples of the disubstituted phosphinate ester include phenyl diphenylphosphinate and methyl diphenylphosphinate.

[0198] Examples of metal salts of disubstituted phosphinic acids include metal salts of dialkylphosphinic acids, metal salts of diallylphosphinic acids, metal salts of divinylphosphinic acids, metal salts of diarylphosphinic acids, etc. Of these metal salts, aluminum salts are preferred.

[0199] Examples of organic nitrogen-containing phosphorus compounds include phosphazene compounds such as bis(2-allylphenoxy)phosphazene and dicresylphosphazene; melamine phosphate; melamine pyrophosphate; melamine polyphosphate; and melam polyphosphate.

[0200] Examples of the cyclic organic phosphorus compound include 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, and the like.

[0201] Among the above organic phosphorus-based flame retardants, aromatic phosphate esters and metal salts of disubstituted phosphinic acids are preferred, 1,3-phenylenebis(di-2,6-xylenyl phosphate) and aluminum salts of dialkylphosphinic acids are more preferred, and aluminum trisdiethylphosphinate is even more preferred.

[0202] -Metal hydrate- Examples of metal hydrates include aluminum hydroxide hydrate and magnesium hydroxide hydrate.

[0203] -Halogen-based flame retardants- Examples of halogen-based flame retardants include chlorine-based flame retardants, bromine-based flame retardants, etc. Examples of chlorine-based flame retardants include chlorinated paraffin, etc.

[0204] When the resin composition of this embodiment contains a flame retardant (D), the content of the flame retardant (D) is not particularly limited, but is preferably 1 to 15 parts by mass, more preferably 4 to 12 parts by mass, and even more preferably 6 to 10 parts by mass, per 100 parts by mass of the total resin components in the resin composition of this embodiment. When the content of the flame retardant (D) is equal to or greater than the above-mentioned lower limit, the flame retardancy tends to be better. On the other hand, when the content of the flame retardant (D) is equal to or less than the above-mentioned upper limit, the moldability, adhesion to conductors, heat resistance, and glass transition temperature tend to be better.

[0205] Examples of the flame retardant aid include inorganic flame retardant aids such as antimony trioxide and zinc molybdate. When the resin composition of the present embodiment contains a flame retardant aid, the content thereof is not particularly limited, but is preferably 0.01 to 20 parts by mass, more preferably 0.05 to 10 parts by mass, and even more preferably 0.1 to 5 parts by mass, relative to 100 parts by mass of the total resin components in the resin composition of the present embodiment. When the content of the flame retardant aid is within the above range, better chemical resistance tends to be obtained.

[0206] (Curing accelerator (E)) By including the curing accelerator (E), the resin composition of the present embodiment tends to have improved curability, and to have better dielectric properties, heat resistance, adhesion to conductors, elastic modulus, and glass transition temperature. The curing accelerator (E) may be used alone or in combination of two or more.

[0207] Examples of the curing accelerator (E) include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine, and tributylamine; imidazole compounds such as methylimidazole and phenylimidazole; isocyanate-masked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; organic peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, and α,α'-bis(t-butylperoxy)diisopropylbenzene; and carboxylates of manganese, cobalt, zinc, and the like. Among these, from the viewpoints of heat resistance, glass transition temperature, and storage stability, imidazole compounds, isocyanate-masked imidazole compounds, organic peroxides, and carboxylates are preferred, organic peroxides are more preferred, and dicumyl peroxide is even more preferred.

[0208] When the resin composition of this embodiment contains a curing accelerator (E), the content of the curing accelerator (E) is not particularly limited, but is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and even more preferably 0.5 to 5 parts by mass, per 100 parts by mass of the total resin components in the resin composition of this embodiment. When the content of the curing accelerator (E) is at least the above-mentioned lower limit, the dielectric properties, heat resistance, conductor adhesion, elastic modulus, and glass transition temperature tend to be better. Furthermore, when the content of the curing accelerator (E) is at most the above-mentioned upper limit, the storage stability tends to be better.

[0209] The resin composition of the present embodiment may further contain, as necessary, one or more optional components selected from the group consisting of resin materials other than the above-mentioned components, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, lubricants, and other additives. The above-mentioned optional components may each be used alone or in combination of two or more. The content of the above-described optional components in the resin composition of this embodiment is not particularly limited, and they may be used as needed within a range that does not impair the effects of this embodiment. Furthermore, the resin composition of the present embodiment may not contain the above-mentioned optional components depending on the desired performance.

[0210] (organic solvent) The resin composition of the present embodiment may contain an organic solvent from the viewpoint of facilitating handling and facilitating production of a prepreg, which will be described later. The organic solvent may be used alone or in combination of two or more kinds. In this specification, a resin composition containing an organic solvent may be referred to as a resin varnish.

[0211] Examples of organic solvents include alcohol-based solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether-based solvents such as tetrahydrofuran; aromatic hydrocarbon-based solvents such as toluene, xylene, and mesitylene; nitrogen-containing solvents such as dimethylformamide, dimethylacetamide, and N-methylpyrrolidone; sulfur-containing solvents such as dimethyl sulfoxide; and ester-based solvents such as γ-butyrolactone. Among these, from the viewpoint of solubility, alcohol solvents, ketone solvents, nitrogen atom-containing solvents, and aromatic hydrocarbon solvents are preferred, aromatic hydrocarbon solvents are more preferred, and toluene is even more preferred.

[0212] When the resin composition of this embodiment contains an organic solvent, the solids concentration of the resin composition is not particularly limited, but is preferably 30 to 90% by mass, more preferably 35 to 80% by mass, and even more preferably 40 to 60% by mass. When the solids concentration is within the above range, the resin composition becomes easier to handle, and the impregnation into the substrate and the appearance of the produced prepreg tend to be better. Furthermore, it becomes easier to adjust the solids concentration of the resin in the prepreg, as described below, and it tends to be easier to produce a prepreg with a desired thickness.

[0213] The resin composition of this embodiment can be produced by mixing component (A) and component (B), and other components used as needed, using a known method. When mixing, each component may be dissolved or dispersed while stirring. Furthermore, the order in which the raw materials are mixed, the mixing temperature, the mixing time, and other conditions are not particularly limited and may be set as desired depending on the types of raw materials, etc.

[0214] The dielectric constant (Dk) at 10 GHz of the cured product of the resin composition of this embodiment is not particularly limited, but from the viewpoint of low transmission loss, it is preferably 3.0 or less, more preferably 2.9 or less, and even more preferably 2.8 or less. The smaller the dielectric constant (Dk), the better, and there is no particular restriction on the lower limit, but in consideration of the balance with other physical properties, it may be, for example, 2.3 or more, 2.4 or more, or 2.5 or more. The conditions for obtaining a cured product from the resin composition of this embodiment can be the conditions described in the Examples. The above-mentioned relative dielectric constant (Dk) is a value based on the cavity resonator perturbation method, and more specifically, is a value measured by the method described in the examples.

[0215] The dielectric loss tangent (Df) at 10 GHz of the cured product of the resin composition of this embodiment is not particularly limited, but from the viewpoint of low transmission loss, it is preferably 0.0040 or less, more preferably 0.0030 or less, and even more preferably 0.0020 or less. The smaller the dielectric loss tangent (Df), the better, and there is no particular restriction on the lower limit, but in consideration of the balance with other physical properties, it may be, for example, 0.0010 or more, 0.0012 or more, or 0.0014 or more. The conditions for obtaining a cured product from the resin composition of this embodiment can be the conditions described in the Examples. The dielectric loss tangent (Df) is a value based on the cavity resonator perturbation method, and more specifically, is a value measured by the method described in the examples.

[0216] [Prepreg] The prepreg of the present embodiment is a prepreg containing the resin composition of the present embodiment or a semi-cured product of the resin composition. That is, the prepreg of the present embodiment can also be said to contain the resin composition of the present embodiment. In this specification, "containing" means that the prepreg has been formed through at least a state in which the prepreg contains the resin composition. The prepreg of the present embodiment contains, for example, the resin composition of the present embodiment or a semi-cured product of the resin composition and a sheet-like fiber substrate. The sheet-like fiber substrate is not particularly limited, but is preferably, for example, a sheet-like fiber reinforcing substrate used for the purpose of reinforcing a prepreg. As the sheet-like fiber base material contained in the prepreg of this embodiment, known sheet-like fiber base materials used in various laminates for electrical insulating materials can be used. Examples of materials for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass, and Q-glass; organic fibers such as polyimide, polyester, and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber substrates have shapes such as woven fabric, nonwoven fabric, roving, chopped strand mat, and surfacing mat. The thickness of the sheet-like fiber base material is not particularly limited, but from the viewpoint of mechanical strength and thinning of the prepreg, it is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.03 to 0.1 mm. The sheet-like fiber substrate may be surface-treated with a coupling agent or the like, or may be mechanically opened, from the viewpoints of impregnation with the resin composition, heat resistance, moisture absorption resistance, and processability when made into a laminate.

[0217] The prepreg of this embodiment can be produced, for example, by impregnating or applying the resin composition of this embodiment to a sheet-like fiber substrate, and then drying it as necessary. The resin composition can be impregnated or applied to the sheet-like fiber substrate by, for example, a hot melt method or a solvent method.

[0218] The hot melt method is a method of impregnating or coating a sheet-like fiber substrate with a resin composition that does not contain an organic solvent. One embodiment of the hot melt method includes a method in which the resin composition is first coated onto a coated paper with good peelability, and then the coated resin composition is laminated onto the sheet-like fiber substrate. Another embodiment of the hot melt method includes a method in which the resin composition is directly coated onto the sheet-like fiber substrate using a die coater or the like.

[0219] The solvent method is a method of impregnating or coating a sheet-like fiber substrate with a resin composition containing an organic solvent. Specifically, for example, a method of immersing a sheet-like fiber substrate in a resin composition containing an organic solvent and then drying the substrate can be mentioned. By drying, the organic solvent is removed and the resin composition is semi-cured (B-staged), thereby obtaining the prepreg of this embodiment.

[0220] The solids concentration derived from the resin composition in the prepreg of this embodiment is not particularly limited, but from the viewpoint of obtaining better moldability when made into a laminate, it is preferably 20 to 90 mass%, more preferably 25 to 80 mass%, and even more preferably 30 to 75 mass%.

[0221] The thickness of the prepreg of this embodiment is not particularly limited, but from the viewpoint of enabling moldability and high-density wiring, it is preferably 0.01 to 0.5 mm, more preferably 0.02 to 0.3 mm, and even more preferably 0.03 to 0.1 mm.

[0222] [Resin film] The resin film of the present embodiment is a resin film containing the resin composition of the present embodiment or a semi-cured product of the resin composition. That is, the resin film of the present embodiment can also be said to contain the resin composition of the present embodiment. The resin film of this embodiment can be produced, for example, by applying the resin composition of this embodiment containing an organic solvent, that is, a resin varnish, to a support and then drying it by heating. Examples of the support include a plastic film, a metal foil, and a release paper. Examples of plastic films include polyolefin films such as polyethylene, polypropylene, and polyvinyl chloride; polyester films such as polyethylene terephthalate (hereinafter sometimes referred to as "PET") and polyethylene naphthalate; polycarbonate films; and polyimide films. Examples of the metal foil include copper foil and aluminum foil. The support may be subjected to a surface treatment such as matte treatment or corona treatment, or may be subjected to a release treatment using a silicone resin-based release agent, an alkyd resin-based release agent, a fluororesin-based release agent, or the like. The thickness of the support is not particularly limited, but from the viewpoints of ease of handling and economy, it is preferably 10 to 150 μm, more preferably 20 to 100 μm, and even more preferably 25 to 50 μm.

[0223] The coating device for applying the resin varnish may be any coating device known to those skilled in the art, such as a comma coater, bar coater, kiss coater, roll coater, gravure coater, die coater, etc. These coating devices may be appropriately selected depending on the film thickness to be formed. The drying conditions after applying the resin varnish may be appropriately determined depending on the content, boiling point, etc. of the organic solvent, and are not particularly limited. For example, in the case of a resin varnish containing 40 to 60 mass % of an aromatic hydrocarbon solvent, the drying temperature is not particularly limited, but from the viewpoints of productivity and appropriately B-staging the resin composition of the present embodiment, it is preferably 50 to 200°C, more preferably 100 to 190°C, and even more preferably 150 to 180°C. Furthermore, in the case of the above-mentioned resin varnish, the drying time is not particularly limited, but from the viewpoint of productivity and appropriately bringing the resin composition of this embodiment to a B-stage, it is preferably 1 to 30 minutes, more preferably 2 to 15 minutes, and even more preferably 3 to 10 minutes.

[0224] [Laminate] The laminate of this embodiment is a laminate having a cured product of the resin composition of this embodiment or a cured product of the prepreg, and a metal foil. That is, the laminate of the present embodiment can be said to contain the resin composition or prepreg of the present embodiment and a metal foil. A laminate having a metal foil is sometimes called a metal-clad laminate. The metal for the metal foil is not particularly limited, but from the viewpoint of electrical conductivity, copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements are preferred, copper and aluminum are more preferred, and copper is even more preferred.

[0225] The laminate of this embodiment can be produced, for example, by placing metal foil on one or both sides of the prepreg of this embodiment and then hot-pressing the prepreg. In this case, only one prepreg may be used, or two or more prepregs may be laminated and used. The heating temperature for hot pressing is not particularly limited, but is preferably 100 to 300°C, more preferably 150 to 280°C, and even more preferably 200 to 250°C. The heating and pressing time for the hot and pressure molding is not particularly limited, but is preferably 10 to 300 minutes, more preferably 30 to 200 minutes, and even more preferably 80 to 150 minutes. The pressure for the hot pressing is not particularly limited, but is preferably 1.5 to 5 MPa, more preferably 1.7 to 3 MPa, and even more preferably 1.8 to 2.5 MPa. However, these conditions can be adjusted appropriately depending on the type of raw material used, and are not particularly limited.

[0226] [Printed wiring board] The printed wiring board of this embodiment is a printed wiring board having one or more materials selected from the group consisting of a cured product of the resin composition of this embodiment, a cured product of the prepreg of this embodiment, and a laminate of this embodiment. That is, it can be said that the printed wiring board of this embodiment contains one or more members selected from the group consisting of the resin composition of this embodiment, the prepreg of this embodiment, and the laminate of this embodiment. The printed wiring board of this embodiment has at least a structure containing a cured product of the resin composition of this embodiment, a cured product of the prepreg of this embodiment, or a laminate of this embodiment, and a conductor circuit layer. The printed wiring board of this embodiment can be produced by forming a conductor circuit on one or more materials selected from the group consisting of a cured product of the resin composition of this embodiment, a cured product of the prepreg of this embodiment, a cured product of the resin film of this embodiment, and a laminate of this embodiment by a known method. Furthermore, a multilayer printed wiring board can also be produced by further performing a multilayer adhesive process, etc., as necessary. The conductor circuit can be formed, for example, by appropriately performing a drilling process, metal plating process, etching of metal foil, etc.

[0227] [Semiconductor Package] The semiconductor package of this embodiment is a semiconductor package having the printed wiring board of this embodiment and a semiconductor element. The semiconductor package of this embodiment can be manufactured, for example, by mounting the semiconductor element, memory, etc. on the printed wiring board of this embodiment by a known method. [Example]

[0228] The present embodiment will be specifically described below with reference to examples, although the present embodiment is not limited to the following examples.

[0229] In each example, the number average molecular weight was measured by the following procedure. (Method for measuring number average molecular weight) The number average molecular weight was calculated by gel permeation chromatography (GPC) using a calibration curve using standard polystyrene. The calibration curve was approximated by a cubic equation using standard polystyrene: TSKstandard POLYSTYRENE (Types: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, trade name]. The GPC measurement conditions are shown below. [GPC measurement conditions] Equipment: High-speed GPC equipment HLC-8320GPC Detector: UV-8320 ultraviolet absorption detector [manufactured by Tosoh Corporation] Column: Guard column: TSK Guardcolumn SuperHZ-L + Column: TSKgel SuperHZM-N + TSKgel SuperHZM-M + TSKgel SuperH-RC (all manufactured by Tosoh Corporation, trade names) Column dimensions: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column) Eluent: tetrahydrofuran Sample concentration: 10mg / 5mL Injection volume: 25μL Flow rate: 1.00mL / min Measurement temperature: 40℃

[0230] (Measurement of vinyl group modification rate) In the production examples described below, a solution containing components (b1) and (b2) before the start of the reaction and a solution after the reaction were subjected to GPC analysis by the above method, and the peak areas derived from component (b2) before and after the reaction were determined. The vinyl group modification rate of component (b2) was then calculated using the following formula. The vinyl group modification rate corresponds to the rate of decrease in the peak area derived from component (b2) due to the reaction. Vinyl group modification rate (%) = [(peak area attributable to component (b2) before the start of the reaction) - (peak area attributable to component (b2) after the end of the reaction)] × 100 / (peak area attributable to component (b2) before the start of the reaction)

[0231] (Measurement of tensile modulus at 25°C) A test piece measuring 10 mm wide, 80 mm long, and 0.2 mm thick was prepared from the resin to be measured, and both ends of the test piece along its long side were clamped between upper and lower grippers with a 60 mm gap between the grippers. The tensile modulus of the test piece at 25°C was then measured using an autograph (Shimadzu Corporation, AG-X) at a room temperature of 25°C and a tension speed of 5 mm / min. Five similar samples were prepared, and the tensile modulus at 25°C was measured under the same conditions as above. The average value was used as the 25°C tensile modulus of the resin. Other detailed conditions and the method for calculating the tensile modulus were in accordance with the international standard ISO 5271 (1993).

[0232] [Production of modified conjugated diene polymer] Manufacturing Examples 1-2 The raw materials and toluene as an organic solvent were charged in the amounts shown in Table 1 into a 2 L glass flask equipped with a thermometer, a reflux condenser, and a stirrer and capable of being heated and cooled. The mixture was then reacted under a nitrogen atmosphere at 90 to 100°C for 5 hours with stirring to obtain solutions of modified conjugated diene polymers 1 and 2 (solids concentration: 35% by mass). The vinyl group modification rates and number average molecular weights of the resulting modified conjugated diene polymers are shown in Table 1.

[0233] [Table 1]

[0234] The details of each component listed in Table 1 are as follows: [(b1) component] Polybutadiene 1:1,2-polybutadiene homopolymer, number average molecular weight = 1,200, vinyl group content = 85% or more [(b2) component] Bismaleimide compound 1: Aromatic bismaleimide compound containing an indane ring (number average molecular weight = 1,300) Bismaleimide compound 2: Bis(3-ethyl-5-methyl-4-maleimidophenyl)methane [Reaction catalyst] Organic peroxide: α,α'-bis(t-butylperoxy)diisopropylbenzene

[0235] [Preparation of Resin Composition] Examples 1 to 8, Comparative Examples 1 to 3 Each component shown in Table 2 was blended with toluene in the amounts shown in Table 2, and then the mixture was stirred and mixed at 25° C. or while heating to 50 to 80° C. to prepare a resin composition with a solids concentration of approximately 50% by mass. In Table 2, the blend amount of each component is expressed in parts by mass, and in the case of a solution, it means parts by mass converted into solids content.

[0236] [Manufacturing resin film and resin boards with double-sided copper foil] The resin composition obtained in each example was applied to a 38 μm thick PET film (Teijin Limited, product name: G2-38), and then heated and dried for 5 minutes at 170° C. to produce a B-stage resin film. The resin film was peeled off from the PET film and then pulverized to obtain a B-stage resin powder. The resin powder obtained above was placed on a Teflon® sheet die-cut to a size of 1 mm thick x 50 mm long x 35 mm wide, and 18 μm thick low-profile copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., product name: 3EC-VLP-18) was placed on top and bottom of it. The M side of the low-profile copper foil was placed on the resin powder side. Next, this pre-heat-pressure-molded laminate was heat-pressurized at a temperature of 230°C, a pressure of 2.0 MPa, and a time of 120 minutes to mold and harden the resin powder into a resin plate, thereby producing a resin plate with double-sided copper foil. The resin plate portion of the resulting double-sided copper foil-molded resin plate had a thickness of 1 mm.

[0237] [Measurement and evaluation methods] The resin sheets with copper foil on both sides obtained in the above Examples and Comparative Examples were subjected to measurements and evaluations according to the following methods. The results are shown in Table 2.

[0238] (1. Method for measuring the relative permittivity and dielectric loss tangent of a cured product) The resin sheet with copper foil on both sides obtained in each example was immersed in a 10 mass % solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Company, Inc.), which is a copper etching solution, to remove the copper foil and prepare a 2 mm × 50 mm test piece. Next, the relative permittivity (Dk) and dielectric loss tangent (Df) of the test piece were measured in the 10 GHz band at an ambient temperature of 25°C according to the cavity resonator perturbation method.

[0239] (2. Peel strength measurement method) The copper foil of each double-sided copper foil-covered resin sheet obtained in each example was etched into a 5 mm-wide straight line and then dried at 105°C for 1 hour to prepare a test specimen. The copper foil was then peeled off at a 90° angle in accordance with JIS C6481:1996 to measure the peel strength of the copper foil. The measurement was performed using an "EZ-Test / CE" tester manufactured by Shimadzu Corporation, and the peeling speed for the copper foil was 50 mm / min.

[0240] [Table 2]

[0241] The details of each component shown in Table 2 are as follows: [Component (A)] Aromatic bismaleimide compound containing an indan ring: Number average molecular weight = 1,300 [Component (A')] Biphenylaralkyl maleimide compound: Trade name "MIR-3000" (manufactured by Nippon Kayaku Co., Ltd.) [(B) Component] <(B1) component> Conjugated diene polymer: 1,2-polybutadiene homopolymer, number average molecular weight = 1,200, vinyl group content = 85% or more, tensile modulus at 25°C = 0.05 GPa <(B2) component> Modified conjugated diene polymer 1: Modified conjugated diene polymer 1 obtained in Production Example 1, tensile modulus at 25°C = 0.1 GPa Modified conjugated diene polymer 2: Modified conjugated diene polymer 2 obtained in Production Example 2, tensile modulus at 25°C = 0.1 GPa <Component (B3)> Styrene-based elastomer: trade name "Tuftec (registered trademark) H1221" (manufactured by Asahi Kasei Corporation), hydrogenated styrene-based thermoplastic elastomer (SEBS; styrene-ethylene-butylene-styrene copolymer), styrene content = 12% by mass, MFR = 4.5 g / 10 min under measurement conditions of 230 °C and a load of 2.16 kgf, number average molecular weight = 170,000, and tensile modulus at 25 °C = 0.5 GPa <(B4) component> Polyphenylene ether resin: Product name "S203A" (manufactured by Asahi Kasei Corporation), number average molecular weight = 12,000, average number of phenolic hydroxyl groups per molecule = 1.8, tensile modulus at 25°C = 2.2 GPa <(B5) component> Silicone resin: Trade name "X-22-9412" (Shin-Etsu Chemical Co., Ltd.), polysiloxane diamine with vinyl groups, reactive group equivalent weight = 430 g / mol, tensile modulus at 25°C = 0.1 GPa <(B6) component> Epoxy resin: Product name "HP-7200H" (DIC Corporation), dicyclopentadiene-type epoxy resin (epoxy resin with an alicyclic skeleton), tensile modulus at 25°C = 2.8 GPa

[0242] As can be seen from Table 2, the resin compositions obtained in Examples 1 to 8 of this embodiment have low dielectric constants and dielectric loss tangents, and high peel strengths. This demonstrates that the resin compositions of this embodiment have excellent dielectric properties and conductor adhesion in high frequency bands of 10 GHz or higher. On the other hand, the resin compositions obtained in Comparative Examples 1 to 3 were inferior in any one of the dielectric constant, dielectric loss tangent, and peel strength, and did not sufficiently achieve both dielectric properties and conductor adhesion. [Industrial Applicability]

[0243] A cured product produced from the resin composition of this embodiment has excellent dielectric properties and conductor adhesion in high frequency bands of 10 GHz or higher, making the resin composition of this embodiment useful for printed wiring boards used in fifth-generation mobile communication system (5G) antennas that use radio waves in frequency bands above 6 GHz and millimeter-wave radars that use radio waves in the frequency band of 30 to 300 GHz.

Claims

1. (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, each of which contains a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups; (B) a resin having a tensile modulus at 25°C of 10 GPa or less; Contains The component (A) is a compound represented by the following general formula (a1-2): The resin composition, wherein the component (B) is a conjugated diene polymer having a number average molecular weight of 400 to 2,000. 【Chemistry 1】 (In the formula, each R a1 independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; each n1 independently represents an integer of 0 to 3; each R a2 to R a4 independently represents an alkyl group having 1 to 10 carbon atoms; are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.

0.

2. (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, each of which contains a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups; (B) a resin having a tensile modulus at 25°C of 10 GPa or less; Contains The component (A) is a compound represented by the following general formula (a1-2): The resin composition, wherein the component (B) is a silicone-based resin. 【Chemistry 2】 (In the formula, each R a1 independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; each n1 independently represents an integer of 0 to 3; each R a2 to R a4 independently represents an alkyl group having 1 to 10 carbon atoms; are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.

0.

3. (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, each of which contains a condensed ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups; (B) a resin having a tensile modulus at 25°C of 10 GPa or less; Contains The component (A) is a compound represented by the following general formula (a1-2): The resin composition, wherein the component (B) is a polyphenylene ether resin having a number average molecular weight of 8,000 to 50,000. 【Transformation 3】 (In the formula, each R a1 independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; each n1 independently represents an integer of 0 to 3; each R a2 to R a4 independently represents an alkyl group having 1 to 10 carbon atoms; are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.

0.

4. (A) one or more compounds selected from the group consisting of maleimide compounds and derivatives thereof, each of which contains a fused ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups; (B) a resin having a tensile modulus at 25°C of 10 GPa or less; Contains The component (A) is a compound represented by the following general formula (a1-2): A resin composition, wherein the component (B) is an epoxy resin having an alicyclic skeleton. 【Chemistry 4】 (In the formula, each R a1 independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; each n1 independently represents an integer of 0 to 3; each R a2 to R a4 independently represents an alkyl group having 1 to 10 carbon atoms; are each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; each n2 is independently an integer of 0 to 4, and n3 is a number of 0.95 to 10.

0.

5. A resin composition described in any one of claims 1 to 4, wherein the content of component (A) is 10 to 90 parts by mass per 100 parts by mass of the total of the resin components in the resin composition.

6. A resin composition described in any one of claims 1 to 5, further containing an inorganic filler (C).

7. A prepreg comprising the resin composition according to any one of claims 1 to 6 or a semi-cured product of the resin composition.

8. A laminate comprising a cured product of the resin composition according to any one of claims 1 to 6 or a cured product of the prepreg according to claim 7 and a metal foil.

9. A resin film comprising the resin composition according to any one of claims 1 to 6 or a semi-cured product of the resin composition.

10. A printed wiring board having one or more selected from the group consisting of a cured product of the resin composition according to any one of claims 1 to 6, a cured product of the prepreg according to claim 7, and the laminate according to claim 8.

11. A semiconductor package comprising the printed wiring board according to claim 10 and a semiconductor element.

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