Processing device

Abstract

To provide a processing device capable of removing foreign matter present on the holding surface of a holding table.SOLUTION: A processing device for processing a workpiece includes a holding table having a holding surface for holding the workpiece, a processing unit for processing the workpiece held by the holding table, a moving unit for moving the holding table along a predetermined moving path, and a gas injection unit provided at a position overlapping the moving path and for injecting gas toward the holding surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] Device chips mounted on electrical devices such as mobile phones and personal computers are manufactured by subjecting wafers made of semiconductors such as silicon to various processes. The manufacturing process for device chips is described, for example, in Patent Document 1. Specifically, planned division lines (streets) are set in a grid pattern on the front surface of the wafer. Devices such as integrated circuits (ICs) are formed in multiple regions separated by the planned division lines. The back surface of the wafer with devices formed on its front surface is ground to a predetermined thickness, and then the wafer is divided along the planned division lines. This produces multiple device chips, each having a device.

[0003] Furthermore, before, during, or after the manufacturing process of the device chips, a process for inspecting the wafer may be performed. For example, Patent Document 2 discloses an inspection device that holds the processed wafer on a holding table made of a transparent member and captures images of the front and back surfaces of the wafer using imaging units disposed on the front and back surfaces of the wafer in order to inspect the state of the wafer after cutting (the positions of processing marks, the shape, size, distribution, etc.) [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-087141 [Patent Document 2] Japanese Patent Publication No. 2020-177975 Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, when a workpiece such as a wafer is subjected to various processes (such as grinding, cutting, and inspection), the workpiece is held by a holding table having a holding surface. However, if foreign matter (such as processing debris) is attached to the holding surface, the workpiece may not be held properly.

[0006] If a workpiece is processed while not properly held by the holding table, the wafer may not be processed or inspected properly. For example, if the holding table does not properly hold the wafer, the workpiece may easily become misaligned, resulting in unintended processing of the object or reduced inspection accuracy. Furthermore, if a workpiece is placed on a holding surface with foreign matter attached, the foreign matter may be pinched between the holding surface and the workpiece, causing localized stress in the areas of the holding surface and the workpiece that come into contact with the foreign matter. This can result in chipping or damage to the holding table or wafer.

[0007] SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide a processing apparatus capable of removing foreign matter adhering to a holding table. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece, comprising: a holding table having a holding surface for holding the workpiece; a processing unit for performing processing on the workpiece held by the holding table; a moving unit for moving the holding table along a predetermined moving path; and a gas injection unit arranged at a position overlapping the moving path and for injecting gas toward the holding surface.

[0009] Preferably, the gas injection unit is provided above the moving path and has an injection nozzle with a plurality of injection ports for injecting the gas, the plurality of injection ports being arranged along a direction intersecting the moving path, and when the holding table passes below the injection nozzle, the gas is injected from the injection ports onto the entire surface of the holding surface.

[0010] According to another aspect of the present invention, there is provided a processing device for processing a workpiece, comprising: a holding table having a holding surface for holding the workpiece; a processing unit for performing processing on the workpiece held by the holding table; a moving unit for moving the holding table along a predetermined moving path; and a suction unit arranged at a position overlapping the moving path and applying a suction force to the holding surface.

[0011] Preferably, the suction unit is provided above the movement path and has a suction nozzle with multiple suction ports, which are arranged along a direction intersecting the movement path, and when the holding table passes below the suction nozzle, the suction ports apply suction force to the entire holding surface.

[0012] Preferably, the movement path connects a transport area where the object is transported and a processing area where the object is processed by the processing unit.

[0013] Preferably, the holding table includes a transparent member that forms the holding surface.

[0014] Preferably, the processing device is an inspection device, a cutting device, a laser processing device or a grinding device. [Effects of the Invention]

[0015] According to one aspect of the present invention, a processing apparatus can be provided with a gas injection unit that can inject gas toward the holding surface of the holding table, thereby blowing away foreign matter adhering to the holding surface of the holding table and removing it from the holding surface.

[0016] According to another aspect of the present invention, a processing device can be provided with a suction unit that applies suction force to the holding surface of the holding table, thereby sucking and removing foreign matter adhering to the holding surface of the holding table. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a processing apparatus (inspection apparatus) according to a first embodiment. [Figure 2] FIG. 2 is a perspective view of the base and the X1-axis moving unit. [Figure 3] FIG. 3 is a top view of the holding table. [Figure 4] FIG. 4 is a perspective view of the camera unit. [Figure 5] 5 is a cross-sectional view of the holding table taken along line AA in FIG. [Figure 6] FIG. 6(A) is a perspective view showing a part of the upper surface side of the gas injection unit, and FIG. 6(B) is a perspective view showing a part of the lower surface side of the gas injection unit. [Figure 7] FIG. 7 is a top view of a part of the processing apparatus (inspection apparatus) according to the first embodiment. [Figure 8] FIG. 8 is a perspective view of a processing apparatus (inspection apparatus) according to the second embodiment. [Figure 9] 9(A) is a perspective view of the upper surface side of the suction unit, and FIG. 9(B) is a perspective view of the lower surface side of the suction unit. [Figure 10] FIG. 10 is a perspective view of a processing device (cutting device) according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. First, an inspection device will be taken as an example of a processing device according to this embodiment, and its configuration will be described. FIG. 1 is a perspective view of a processing device (inspection device) 2 according to the first embodiment. In FIG. 1, the direction along the X1 axis (X1 axis direction), the direction along the Y1 axis (Y1 axis direction), and the direction along the Z1 axis (Z1 axis direction) are perpendicular to one another. The same applies to FIGS. 2 to 7 below.

[0019] 1, the processing device 2 includes a base 4, an X1-axis moving unit (moving unit) 18, and a camera unit (processing unit) 30 supported by the base 4. The base 4 is configured as a plate-like member having a substantially rectangular first surface 4a and a substantially rectangular second surface 4b opposite the first surface 4a. The base 4 also has an opening 4c that penetrates the base 4 in the thickness direction so as to reach the second surface 4b from the first surface 4a. For example, the opening 4c is formed in a substantially rectangular shape and is arranged so that its longitudinal direction is aligned with the longitudinal direction (X1-axis direction) of the base 4.

[0020] 2 is a perspective view of the base 4 and the X1-axis movement unit 18. As shown in FIG. 2, the X1-axis movement unit 18 has a pair of X1-axis guide rails 20. The X1-axis guide rails 20 are provided in regions located on both sides of the opening 4c on the first surface 4a side of the base 4, extending along the X1-axis direction. An X1-axis mover 22 is slidably mounted on each of the pair of X1-axis guide rails 20.

[0021] A bridge-like support structure 26 is provided above the pair of X1-axis movers 22 so as to straddle the opening 4c of the base 4. One of the X1-axis movers 22 is provided with a nut portion (not shown), and a ball screw 24 parallel to the X1-axis guide rail 20 is threadedly engaged with this nut portion. Note that the other X1-axis mover 22 may be provided with a nut portion, and a ball screw parallel to the X1-axis guide rail 20 may be threadedly engaged with this nut portion.

[0022] A pulse motor 28 is connected to one end of the ball screw 24. When the pulse motor 28 rotates the ball screw 24, the X1-axis movable body 22 moves in the X1-axis direction along the X1-axis guide rail 20, and the bridge-like support structure 26 moves in the X1-axis direction.

[0023] A holding table 6 that holds a workpiece, which is an object to be processed (inspected) by the processing device 2, is fixed to the support structure 26. The X1-axis movement unit 18 moves the support structure 26 along the X1-axis direction, thereby moving the holding table 6 along the X1-axis direction.

[0024] Next, we will explain the holding table 6 and the workpiece 11 held on the holding table 6. Fig. 3 is a top view of the holding table 6, and Fig. 5 is a cross-sectional view of the holding table 6 taken along line AA. For convenience of explanation, Fig. 5 also shows side views of the workpiece 11, upper camera 32a, and lower camera 32b.

[0025] 3 and 5, the holding table 6 has a substantially cylindrical frame body 8. The frame body 8 has a substantially circular first surface 8a and a substantially circular second surface 8b opposite the first surface 8a. A through-hole 8c is provided in a portion including the center of the frame body 8, penetrating the frame body 8 in the thickness direction from the first surface 8a to the second surface 8b.

[0026] A substantially disk-shaped holding plate 10 is disposed on the first surface 8a side of the frame body 8. The holding plate 10 has a substantially circular first surface 10a and a substantially circular second surface 10b (see FIG. 5) opposite the first surface 10a. The inner diameter (diameter of the through-hole 8c) of the upper portion of the frame body 8 where the holding plate 10 is disposed is substantially the same as the diameter of the holding plate 10. On the other hand, the inner diameter of the portion of the frame body 8 other than the upper portion is slightly smaller than the diameter of the holding plate 10. As such, the inner surface of the frame body 8 has two different diameters, resulting in a stepped portion on the inside of the frame body 8. The holding plate 10 is disposed so as to fill this stepped portion. The thickness of the holding plate 10 is set to be substantially the same as the height of the stepped portion of the frame body 8. With this configuration, the first surface 8a of the frame body 8 and the first surface 10a of the holding plate 10 are substantially the same height. The first surface 8a of the frame 8 and the first surface 10a of the holding plate 10 form the holding surface 6a of the holding table 6. The frame 8 and the holding plate 10 are not limited to the shapes described above. For example, the frame 8 may have a quadrangular prism shape having a rectangular first surface 8a and a rectangular second surface 8b.

[0027] The workpiece 11 (inspection object) inspected by the processing device 2 of this embodiment is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. That is, the workpiece 11 has a substantially circular first surface 11a and a substantially circular second surface 11b opposite to the first surface 11a. For example, the workpiece 11 corresponds to a wafer before and after various processing processes (cutting, laser processing, grinding, etc.). Note that the material and shape of the workpiece 11 are not limited to these. Furthermore, a device may be formed on the workpiece 11.

[0028] 5, the workpiece 11 is placed on the holding table 6 so that the second surface 11b of the workpiece 11 contacts a part of the first surface 8a of the frame 8 and the entire surface of the first surface 10a of the holding plate 10. Note that the workpiece 11 may be held by the holding table 6 by having the first surface 11a of the workpiece 11 contact a part of the first surface 8a of the frame 8 and the entire surface of the first surface 10a of the holding plate 10.

[0029] As shown in Figures 3 and 5, the first surface 8a of the frame 8 has suction holes 12 arranged in a ring shape along the outer periphery of the through-hole 8c. For example, the suction holes 12 are formed of a plurality of annular grooves with different diameters. The plurality of annular grooves are arranged concentrically with the holding surface 6a in the region between the center and the outer periphery of the holding surface 6a. Each of the plurality of annular grooves is exposed on the first surface 8a of the frame 8. However, there are no limitations on the shape, size, number, etc. of the suction holes 12.

[0030] The suction holes 12 are connected to a suction source 16 such as an ejector via a pipe 14. When the suction source 16 is operated with the second surface 11b of the workpiece 11 placed on the holding surface 6a of the holding table 6, the negative pressure generated by the suction source 16 acts on the second surface 11b of the workpiece 11 via the pipe 14 and the suction holes 12. As a result, the workpiece 11 is sucked and held by the holding table 6.

[0031] As shown in Fig. 1, the processing device 2 includes a camera unit 30. Fig. 4 is a perspective view of the camera unit 30. The camera unit 30 has a connecting member 34. The upper end of the connecting member 34 is connected to the lower end of the rear surface of a support structure 36a, and the lower end of the connecting member 34 is connected to the upper end of the rear surface of a columnar support structure 36b.

[0032] An elevator mechanism 38a is provided on the front surface of the columnar support structure 36a. The elevator mechanism 38a has a pair of guide rails 40a extending along the Z-axis direction, a movable body 42a slidably mounted on the guide rails 40a, and a ball screw 44a threadedly engaged with a nut provided on the rear surface of the movable body 42a. The ball screw 44a is provided between the pair of guide rails 40a and along the Z-axis direction.

[0033] An upper camera 32a is fixed to the front surface of the moving body 42a. A pulse motor 46a is connected to one end of a ball screw 44a. When the pulse motor 46a rotates the ball screw 44a, the moving body 42a moves in the Z-axis direction along the guide rail 40a, and the upper camera 32a fixed to the moving body 42a moves up and down.

[0034] An elevating mechanism 38b, configured similarly to the elevating mechanism 38a provided on the support structure 36a, is provided on the front surface of the columnar support structure 36b. The elevating mechanism 38b includes a pair of guide rails 40b along the Z-axis direction, a movable body 42b slidably mounted on the guide rails 40b, and a ball screw 44b threadedly engaged with a nut provided on the rear surface of the movable body 42b. A pulse motor 46b is connected to one end of the ball screw 44b. When the pulse motor 46b rotates the ball screw 44b, the lower camera 32b, which is fixed to the front surface of the movable body 42b, moves up and down.

[0035] The upper camera 32a and the lower camera 32b are, for example, an area camera, a line scan camera, or a 3D camera. As shown in Fig. 5, the upper camera 32a faces the holding surface 6a of the holding table 6 and can capture an image of the first surface 11a of the workpiece 11 held on the holding surface 6a. The lower camera 32b faces the second surface 8b of the holding plate 10 and can capture an image of the second surface 11b of the workpiece 11 through the through-hole 8c and the holding plate 10. This makes it possible to inspect the appearance of the workpiece 11 from both the first surface 11a and the second surface 11b of the workpiece 11.

[0036] The holding plate 10 is made of a material that can transmit light detected by the lower camera 32b. For example, if the lower camera 32b is a visible light camera, the holding plate 10 is made of a transparent material that can transmit visible light. For example, the transparent material is made of a material and has a thickness that transmits 70% or more of visible light. Specific examples of materials for the transparent material include glass, acrylic, PET (polyethylene terephthalate), and PC (polycarbonate).

[0037] For example, after performing cutting processing in which an annular cutting blade is inserted into the workpiece 11 to cut and divide the workpiece 11, the first surface 11a and the second surface 11b of the workpiece 11 are imaged by the camera unit 30 of the processing device 2. In this case, the positions of the processing marks, the shape, size, and distribution of chippings, etc. can be inspected from both the first surface 11a and the second surface 11b of the workpiece 11.

[0038] The upper camera 32a and the lower camera 32b are connected by a connecting member 34 (see FIG. 4) so ​​that they are positioned at the same position in a direction parallel to the holding surface 6a (X1Y1 plane direction). Therefore, the camera unit 30 can photograph the same position on the upper and lower surfaces of the workpiece 11. The connecting member 34 has a shape that does not interfere with the holding table 6 regardless of which part of the workpiece 11 is being photographed.

[0039] 1, the processing device 2 has a bridge-shaped support structure 48 that is provided so as to straddle the X1-axis guide rail 20. The bottom surface of the support structure 48 is fixed to the first surface 4a of the base 4. A pair of guide rails 50 is provided on the top surface of the support structure 48 along the longitudinal direction (Y-axis direction) of the support structure 48.

[0040] A movable body 52 slidably mounted on a guide rail 50 is fixed to the bottom surface of the support structure 36a of the camera unit 30. Furthermore, a nut portion (not shown) is provided on the bottom surface of the movable body 52, and a ball screw 54 parallel to the guide rail 50 is threadedly engaged with this nut portion. A pulse motor 56 is connected to one end of the ball screw 54. When the ball screw 54 is rotated by the pulse motor 56, the movable body 52 moves in the Y1-axis direction along the guide rail 50. This causes the camera unit 30 to move in the Y-axis direction.

[0041] As shown in Fig. 1, a gas injection unit 58 is provided on the side of the support structure 48. Fig. 6(A) is a perspective view showing a portion of the upper surface of the gas injection unit, and Fig. 6(B) is a perspective view showing a portion of the lower surface of the gas injection unit 58. As shown in Figs. 6(A) and 6(B), the gas injection unit 58 has a substantially rectangular cross section and includes an injection nozzle 60 formed of an elongated member extending along the Y1-axis direction.

[0042] For example, the injection nozzle 60 is a hollow columnar member, and is constituted by a pipe or the like. A space is provided inside the injection nozzle 60 through which gas can flow. A plurality of injection ports 62 are provided on the underside of the injection nozzle 60 (the surface facing the base 4 (see FIG. 1)). Each of the plurality of injection ports 62 is formed so as to connect the internal space of the injection nozzle 60 to the outside, and opens toward the underside (the first surface 4a side of the base 4). The plurality of injection ports 62 are arranged at predetermined intervals along the longitudinal direction (Y-axis direction) of the injection nozzle 60.

[0043] 1, the injection nozzle 60 is connected to a gas supply source 66 via a gas supply pipe 64. The gas supply source 66 is, for example, an air compressor. Air adjusted to a predetermined pressure by the air compressor flows through the gas supply pipe 64 and the injection nozzle 60, and is injected downward (toward the base 4) from a plurality of injection ports 62. The gas supply source 66 may also be a gas cylinder that stores gas such as oxygen or nitrogen.

[0044] Fig. 7 is a top view of a portion of the processing apparatus (inspection apparatus) 2 according to the first embodiment. For ease of explanation, Fig. 7 omits structures such as the ball screw 24, the guide rail 50 provided on the upper surface of the support structure 48, and the ball screw 54 shown in Fig. 1. As described above, the holding table 6 is fixed to the support structure 26. The support structure 26 moves in the X1-axis direction along the X1-axis guide rail 20 together with the X1-axis movable body 22 (Fig. 2) connected to the lower part of the support structure 26. This causes the holding table 6 to move in the X1-axis direction (direction of the arrow).

[0045] In the processing device 2, among the areas where the holding table 6 is arranged, the area where the positions of the upper camera 32a and the holding table 6 overlap in the X1-axis direction on one end side of the X1-axis guide rail 20 (the upper end side in FIG. 7) is referred to as the processing area A. In other words, the processing area A corresponds to the area where, when the holding table 6 is arranged there, the workpiece 11 held by the holding table 6 can be photographed by the camera unit 30. Note that in FIG. 7, the holding table 6 and support structure 26 arranged in the processing area A are shown by dashed lines.

[0046] On the other hand, within the region where the holding table 6 is arranged, the region on the other end side of the X1-axis guide rail 20 (the lower end side in FIG. 7) where the workpieces 11 are placed on the holding table 6 and collected from the holding table 6 is referred to as the transfer region B. The region connecting the above-mentioned processing region A and transfer region B constitutes the movement path of the holding table 6. The holding table 6 moves between the processing region A and the transfer region B along this movement path.

[0047] The injection nozzle 60 of the gas injection unit 58 is provided above the movement path so as to overlap with the above-mentioned movement path. As described above, the injection nozzle 60 has a plurality of injection ports 62 (see FIGS. 6(A) and 6(B)) that are provided along the longitudinal direction (Y1-axis direction) of the injection nozzle 60, and therefore the plurality of injection ports 62 are provided along a direction (Y1-axis direction in FIG. 7) that intersects with the above-mentioned movement path.

[0048] The processing device 2 described above can remove foreign matter adhering to the holding surface 6a of the holding table 6 by using the gas injection unit 58. For example, foreign matter such as fragments of the workpiece 11, processing chips adhering to the workpiece 11, and particles present inside the processing device 2 may adhere to the holding surface 6a of the holding table 6. Therefore, the gas injection unit 58 removes the foreign matter adhering to the holding surface 6a. This makes it possible for the workpiece 11 to be held appropriately by the holding table 6.

[0049] The following describes the procedure for removing foreign matter adhering to the holding surface 6a of the holding table 6. The holding table 6 moves along a movement path from the transfer region B to the processing region A (outward path) while not holding the workpiece 11, i.e., while the holding surface 6a is exposed. The holding table 6 passes below the gas injection unit 58 midway along the movement path.

[0050] When the gas supply source 66 is activated while the holding table 6 passes below the gas injection unit 58, gas is supplied from the gas supply source 66 to the injection nozzle 60 via the gas supply pipe 64, and the gas is then sprayed from the multiple injection ports 62 toward the holding surface 6a of the holding table 6. As a result, foreign matter adhering to the holding surface 6a is blown away and removed by the gas. Note that the injection of gas from the multiple injection ports 62 continues at least from the time when the leading end of the holding surface 6a in the traveling direction (the end on the processing region A side) reaches a position overlapping with the injection nozzle 60 until the trailing end of the holding surface 6a in the traveling direction (the end on the transport region B side) reaches a position overlapping with the injection nozzle 60.

[0051] Furthermore, the holding table 6 that has reached the processing region A moves along the movement path from the processing region A to the transfer region B (returning path). The holding table 6 passes below the gas injection unit 58 again midway along the movement path. At this time, the gas supply source 66 is operated in the same manner as above, so that gas is blown onto the holding surface 6a of the holding table 6 from the multiple injection ports 62. As a result, any foreign matter remaining on the holding surface 6a that was not completely removed on the outward path is blown away and removed by the gas.

[0052] The distance between both ends of the multiple injection ports 62 provided in the injection nozzle 60 (the distance between the injection port 62 closest to one end of the injection nozzle 60 and the injection port 62 closest to the other end of the injection nozzle 60) is desirably greater than the width of the holding table 6 (frame 8). With this configuration, when the holding table 6 passes below the gas injection unit 58, gas is injected onto the entire surface of the holding surface 6a.

[0053] Furthermore, the injection port 62 of the injection nozzle 60 may be configured so that the injection direction of the gas is inclined at a predetermined angle (for example, an angle of 30° to 80°, more preferably, an angle of 40° to 70°) with respect to the vertical direction. The inclination angle of the injection port 62 may be adjusted by changing the direction of the injection port 62. For example, a rotation drive mechanism may be provided in the injection nozzle 60, and the injection nozzle 60 may be rotated by the rotation drive force applied from this rotation drive mechanism, thereby adjusting the inclination angle of the injection port 62.

[0054] With this configuration, the gas jet direction is inclined relative to the holding surface 6a of the holding table 6, making it easier to peel off foreign matter from the holding surface 6a of the holding table 6. It is also preferable to set the inclined gas jet direction opposite to the direction of travel of the holding table 6 when removing foreign matter. This makes it possible to blow gas as a strong headwind toward the holding table 6 approaching the jet nozzle 60, making it easier to peel off foreign matter from the holding surface 6a.

[0055] FIG. 8 is a perspective view of a processing apparatus (inspection apparatus) 68 according to a second embodiment. The processing apparatus 68 shown in FIG. 8 includes a suction unit 70 instead of the gas injection unit 58 of the processing apparatus 2 shown in FIG. 1. In FIG. 8, the direction along the X2 axis (X2 axis direction), the direction along the Y2 axis (Y2 axis direction), and the direction along the Z2 axis (Z2 axis direction) are perpendicular to one another. The same applies to FIGS. 9(A) and 9(B) described below. Except for the points described below, the configuration of the processing apparatus 68 is the same as that of the processing apparatus 2.

[0056] 9(A) is a perspective view of the top side of the suction unit 70, and FIG. 9(B) is a perspective view of the bottom side of the suction unit 70. As shown in FIGS. 9(A) and 9(B), the suction unit 70 has a shape similar to that of the gas injection unit 58. That is, the suction unit 70 has a suction nozzle 72 configured with an elongated member having a rectangular cross section and extending along the Y-axis direction. The suction nozzle 72 has a plurality of suction ports 74 provided on the surface facing the base 4 along the longitudinal direction of the suction nozzle 72 (the Y-axis direction).

[0057] For example, the suction nozzle 72 is a hollow, columnar member formed of a pipe or the like. A space is provided inside the suction nozzle 72 through which gas can flow. A plurality of suction ports 74 are provided on the underside of the suction nozzle 72 (the surface facing the base 4 (see FIG. 1)). Each of the plurality of suction ports 74 is formed to connect the internal space of the suction nozzle 72 to the outside, and opens toward the underside (the first surface 4a side of the base 4). The plurality of suction ports 74 are arranged at predetermined intervals along the longitudinal direction (Y-axis direction) of the suction nozzle 72.

[0058] 9, the suction nozzle 72 is connected to a suction source 78 via a suction pipe 76. The suction source 78 is, for example, a vacuum pump. When the vacuum pump is activated, a suction force acts from the first surface 4a of the base 4 toward the suction source 78 via the suction pipe 76 and the suction port 74.

[0059] When the holding table 6 is located below the suction unit 70, a suction force from the suction unit 70 acts on the holding surface 6a of the holding table 6. Specifically, an airflow is generated from the holding surface 6a of the holding table 6 toward the multiple suction ports 74, and an upward force acts on the holding surface 6a. As a result, foreign matter adhering to the holding surface 6a is sucked and removed. The foreign matter sucked by the suction unit 70 is captured and collected, for example, by a filter provided inside the suction unit 70. The operating procedure of the holding table 6 and the suction unit 70 when removing foreign matter adhering to the holding surface 6a of the holding table 6 is the same as the operating procedure of the holding table 6 and the gas injection unit 58 in the first embodiment described above.

[0060] The gas jet unit 58 according to the first embodiment and the suction unit 70 according to the second embodiment described above do not necessarily have to be provided on the support structure 48. For example, the processing device 2 shown in FIG. 1 may include a pair of legs that support the gas jet unit 58 (jet nozzle 60). Specifically, the pair of legs are fixed to both sides of the opening 4c of the base 4. The gas jet unit 58 is supported by the pair of legs while being disposed along the Y1-axis direction so as to straddle the opening 4c of the base 4. In a similar manner, the suction unit 70 may be installed in the processing device 68 shown in FIG. 8.

[0061] Furthermore, the shape of the injection nozzle 60 and the arrangement of the injection ports 62 are not limited to the above-described embodiments. For example, the injection nozzle 60 may be a cylindrical member. The shape of the suction nozzle 72 and the arrangement of the suction ports 74 are also not limited to the above-described embodiments.

[0062] 6(A) and 6(B) has a plurality of injection ports 62 arranged in a row along the longitudinal direction of the injection nozzle 60, but the plurality of injection ports 62 may form two or more rows. Also, instead of the plurality of injection ports 62, linear (slit-shaped) injection ports may be provided along the longitudinal direction of the injection nozzle 60. Furthermore, a plurality of injection nozzles 60 configured as described above may be arranged in parallel. The same applies to the suction nozzle 72.

[0063] The processing apparatus (inspection apparatus) 2 according to the first embodiment and the processing apparatus (inspection apparatus) 68 according to the second embodiment described above can remove foreign matter adhering to the holding surface 6a of the holding table 6 by the gas injection unit 58 or the suction unit 70 before the workpiece 11 to be inspected is held on the holding table 6. This allows the workpiece 11 to be properly held on the holding table 6, and the workpiece 11 can be accurately photographed by the upper camera 32a and the lower camera 32b for inspection.

[0064] Fig. 10 is a perspective view of a processing device (cutting device) 80 according to a third embodiment. In the third embodiment, a cutting device is taken as an example of a processing device, and its configuration will be described. In Fig. 10, the direction along the X3 axis (X3 axis direction), the direction along the Y3 axis (Y3 axis direction), and the direction along the Z3 axis (Z3 axis direction) are perpendicular to one another.

[0065] As shown in Fig. 10, the processing device 80 includes a base 82 that supports various elements that make up the processing device 80. An opening 82a is formed in a corner of the upper surface of the base 82, and a cassette table 84 that is raised and lowered by an elevating mechanism (not shown) is disposed within this opening 82a. A cassette 86 that can accommodate the workpieces 11 to be processed in the processing device 80 is placed on the upper surface of the cassette table 84. For ease of explanation, only the outline of the cassette 86 is shown in Fig. 1.

[0066] A rectangular opening 82b is formed at a position adjacent to cassette table 84 along the Y3 axis. Opening 82b is formed so that its longitudinal direction is along the X3 axis. A ball screw type holding table moving mechanism (processing feed mechanism, moving unit) 88 is disposed within opening 82b. For example, holding table moving mechanism 88 includes a ball screw (not shown) disposed along the X3 axis, a rotary drive source (not shown) such as a pulse motor connected to an end of the ball screw, and an X3-axis moving table (not shown) having a nut portion coupled to the ball screw, and moves the X3-axis moving table along the X3 axis.

[0067] The top of the X3-axis moving table is covered by a table cover 88a. In addition, accordion-shaped dustproof and drip-proof covers 88b that expand and contract in accordance with the movement of the X3-axis moving table and table cover 88a are attached to both ends of the table cover 88a in the direction along the X3 axis. A disk-shaped table base (not shown) that supports a holding table 90 via a bearing (not shown) is arranged above the X3-axis moving table. The holding table 90 that holds the workpiece 11 is arranged on the top surface of the table base in a manner that it is exposed from the table cover 88a. The configuration of the workpiece 11 is the same as that of the workpiece 11 in the first embodiment.

[0068] The holding table 90 has a configuration similar to that of the holding table 6 shown in Figures 3 and 5. The component corresponding to the holding plate 10 of the holding table 90 is made of a porous material, and the holding plate 10 may be connected to a suction source. With this configuration, when a negative pressure source is applied with the workpiece 11 placed on the first surface of the holding plate, the negative pressure generated by the negative pressure source acts on the workpiece 11 via the through-holes in the frame and the porous material. As a result, the workpiece 11 is held by the holding table 90.

[0069] The holding table 90 is connected to a rotary drive source (not shown) such as a motor, and rotates around a rotation axis roughly parallel to the Z3 axis. The holding table 90 is also moved along the X3 axis together with the X3-axis moving table by the above-mentioned holding table moving mechanism 88 (processing feed).

[0070] Above the opening 82b, one or more transport mechanisms (not shown) are arranged that can transport the above-mentioned workpiece 11 to the holding table 90, etc. The workpiece 11 transported by the transport mechanism is placed on the holding surface 90a of the holding table 90 so that the first surface 11a side is exposed upward, for example.

[0071] A gate-shaped support structure 92 is provided on the upper surface of the base 82, spanning the opening 82b along the Y3 axis. A pair of cutting unit movement mechanisms (indexing feed mechanism, cutting feed mechanism) 94 is disposed above the support structure 92. The structures of the pair of cutting unit movement mechanisms 94 are substantially the same, except that they are configured to be symmetrical (mirror image) with respect to a plane parallel to the X3 axis and the Z3 axis. Identical components of the pair of cutting unit movement mechanisms 94 are designated by the same reference numerals, and redundant explanations will be omitted.

[0072] Each cutting unit movement mechanism 94 shares a pair of Y3-axis guide rails 96 that are fixed to the front (surface) of the support structure 92 and are generally parallel to the Y3 axis. A Y3-axis mover 98 that constitutes the cutting unit movement mechanism 94 is attached to the pair of Y3-axis guide rails 96 in a manner that allows it to slide along the Y3 axis. A nut portion (not shown) is provided on the rear side (back surface side) of each Y3-axis mover 98, and a ball screw 100 that is generally parallel to the Y3-axis guide rail 96 is rotatably connected to each nut portion.

[0073] A pulse motor 102 is connected to one end of each ball screw 100. When each pulse motor 102 rotates the ball screw 100, the Y3-axis movable body 98 moves along the Y3-axis guide rail 96. A pair of Z3-axis guide rails 104 that are generally parallel to the Z3 axis are fixed to the front (surface) of the Y3-axis movable body 98. A Z3-axis moving plate 106 is attached to the pair of Z3-axis guide rails 104 fixed to the Y3-axis movable body 98 in a manner that allows it to slide along the Z3 axis.

[0074] A nut portion (not shown) is provided on the rear side (back surface side) of each Z3-axis moving plate 106, and a ball screw 108 that is generally parallel to the Z3-axis guide rail 104 is rotatably connected to each nut portion. A pulse motor 110 is connected to one end of each ball screw 108. By rotating the ball screw 108 with each pulse motor 110, the Z3-axis moving plate 106 moves along the Z3-axis guide rail 104.

[0075] A first cutting unit (processing unit) 112a is fixed to the lower part of a Z3-axis moving plate 106 constituting one cutting unit moving mechanism 94. The first cutting unit 112a includes a cylindrical spindle housing 114. This spindle housing 114 houses a spindle (not shown) whose axis is generally parallel to the Y3 axis. A cutting blade 116 is attached to one end (tip) of the spindle, and a motor (not shown), which serves as the rotation drive source for the spindle, is connected to the other end of the spindle. The cutting blade 116 is formed by dispersing and fixing abrasive grains, such as diamond, with a binder such as metal, resin, or ceramic. A second cutting unit (processing unit) 112b is fixed to the lower part of the Z3-axis moving plate 106 constituting the other cutting unit moving mechanism 94. The configuration of the second cutting unit 112b is similar to that of the first cutting unit 112a.

[0076] As shown in Fig. 10, an opening 82c is formed at a position opposite to opening 82a with respect to opening 82b of base 82. A cleaning unit 118 for cleaning workpiece 11 and the like after processing is disposed within opening 82c. A display unit 120 is also provided on the side of support structure 92. Display unit 120 is configured with various displays and displays information (processing conditions, processing status, etc.) related to processing device 80 or processing of workpiece 11, as well as an operation screen, etc. For example, a display panel equipped with a touch panel is used as display unit 120.

[0077] 10, the processing apparatus 80 has a gas injection unit 122 at a position adjacent to the first cutting unit 112a and the second cutting unit 112b. The gas injection unit 122 is provided so as to straddle the opening 82b. That is, the gas injection unit 122 is disposed along a direction intersecting the movement direction of the holding table 90. A gas supply source 126 is connected to the gas injection unit 122 via a gas supply pipe 124. The configurations of the gas injection unit 122, the gas supply pipe 124, and the gas supply source 126 are the same as those in the first embodiment.

[0078] In the processing device 80, the area where the holding table 90 is arranged, on one end side of the opening 82b, where the workpiece 11 held by the holding table 90 can be cut by the first cutting unit 112a and the second cutting unit 112b, is referred to as the processing area. On the other hand, the area where the holding table 90 is arranged, on the other end side of the opening 82b, where the workpiece 11 is placed on the holding table 90 and collected from the holding table 90 is referred to as the transport area. The holding table 90 moves between the above-mentioned processing area and transport area along a movement path connecting the processing area and the transport area.

[0079] In the processing apparatus 80 according to the third embodiment described above, foreign matter adhering to the holding surface 90a of the holding table 90 can be removed in the same manner as in the processing apparatus 2 according to the first embodiment and the processing apparatus 68 according to the second embodiment. Specifically, the holding table 90 moves along a movement path from the transfer region to the processing region (outward movement) while not holding the workpiece 11, i.e., while the holding surface 90a is exposed. The holding table 90 passes below the gas injection unit 122 midway along the movement path.

[0080] When the gas supply source 126 is activated while the holding table 90 passes below the gas injection unit 122, gas is supplied from the gas supply source 126 to an injection nozzle (not shown) via the gas supply pipe 124, and the gas is then sprayed from multiple injection ports (not shown) toward the holding surface 90a of the holding table 90. As a result, foreign matter adhering to the holding surface 90a is blown away and removed by the gas. Note that the gas is continuously ejected from the multiple injection ports at least from the time when the leading end of the holding surface 90a in the traveling direction (the end on the processing region side) reaches a position overlapping with the injection nozzle until the trailing end of the holding surface 90a in the traveling direction (the end on the transport region side) reaches a position overlapping with the injection nozzle.

[0081] Furthermore, the holding table 90 that has reached the processing area moves along the movement path from the processing area to the transfer area (returning path). The holding table 90 passes below the gas injection unit 122 again midway along the movement path. At this time, the gas supply source 126 is operated in the same manner as above, so that gas is sprayed onto the holding surface 90a of the holding table 90 from multiple injection ports. As a result, any foreign matter remaining on the holding surface 90a that was not completely removed on the outward path is blown away and removed by the gas.

[0082] The distance between both ends of the multiple injection ports provided in the injection nozzle (the distance between the injection port closest to one end of the injection nozzle and the injection port closest to the other end of the injection nozzle), the shape and number of the injection ports, the angle between the injection direction of the gas injected from the injection nozzle and the holding surface, etc. are the same as those in the first embodiment. Also, the manner in which the gas injection unit is fixed to the processing device is the same as those in the first and second embodiments.

[0083] As described above, if the workpiece 11 is held by the holding table 90 and cut while foreign matter is adhering to the holding surface 90a of the holding table 90, the position of the workpiece 11 on the holding table 90 may be shifted from its normal position, and an unintended portion of the workpiece 11 may be cut. Furthermore, if the workpiece 11 is placed on the holding table 90 with foreign matter adhering thereto, the foreign matter may be sandwiched between the holding surface 90a and the workpiece 11, causing localized stress in the areas of the holding surface 90a and the workpiece 11 that come into contact with the foreign matter. This may result in chipping or damage to the holding table 90 or the workpiece 11. According to this embodiment, after the foreign matter adhering to the holding surface 90a of the holding table 90 is removed, the workpiece 11 is cut by the processing device 80. Therefore, chipping or damage to the holding table 90 or the workpiece 11 can be prevented, and the workpiece 11 can be properly cut.

[0084] In the third embodiment, the processing device 80 may be provided with the suction unit according to the second embodiment instead of the gas injection unit 122. The processing device 80 may also be provided with both a gas injection unit and a suction unit. Furthermore, the processing device 80 is not limited to the inspection device and cutting device described above. For example, a laser processing device or a grinding device may be provided with the gas injection unit and suction unit described above.

[0085] In addition, the structures, methods, etc. according to the above-described embodiments and modifications may be modified and implemented without departing from the scope of the present invention. [Explanation of symbols]

[0086] 11: Object to be treated 11a: 1st side (front) 11b: 2nd side (back side) 2: Processing equipment (inspection equipment) 4: Base 4a: 1st page 4b: 2nd side 4c: opening 6: Holding table 6a: Holding surface 8:Frame body 8a: 1st page 8b: 2nd side 8c: Through hole 10: Holding plate 10a: 1st page 10b: 2nd side 12: Suction hole 14: Piping 16: Suction source 18: X1 axis moving unit 20: X1 axis guide rail 22:X1 axis moving object 24: Ball screw 26:Support structure 28: Pulse motor 30: Camera unit 32a: Upper camera 32b: Lower camera 34: Connecting member 36a: Support structure 36b: Support structure 38a: Elevator 38b: elevator 40a: Y1 axis guide rail 40b: Y1 axis guide rail 42a: Y1 axis moving body 42b: Y1 axis moving body 44a: Ball screw 44b: Ball screw 46a: Pulse motor 46b: Pulse motor 48 :Support structure 50: Guide rail 52: Mobile 54: Ball screw 56: Pulse motor 58: Gas injection unit 60: Injection nozzle 62: Nozzle 64: Gas supply pipe 66: Gas supply source 68: Inspection equipment 70: Suction unit 72: Suction nozzle 74: Suction port 76:Suction tube 78: Suction source 80: Processing equipment (cutting equipment) 82: Base 82a: Opening 82b: Opening 82c: opening 84: Cassette table 86: Cassette 88: Holding table moving mechanism (processing feed mechanism) 88a: Table cover 88b: Dustproof / waterproof cover 90: Holding table 90a: Holding surface 92 :Support structure 94: Cutting unit movement mechanism 96: Y3 axis guide rail 98:Y3-axis moving object 100: Ball screw 102: Pulse motor 104: Z3 axis guide rail 106: Z3 axis moving body 108: Ball screw 110: Pulse motor 112a: First cutting unit 112b: Second cutting unit 114: Spindle housing 116: Cutting blade 118: Cleaning unit 120: Display unit 122: Gas injection unit 124: Gas supply pipe 126: Gas supply source

Claims

1. A processing apparatus for processing a workpiece, a holding table having a holding surface for holding the object to be processed; a processing unit that processes the object held by the holding table; a moving unit that moves the holding table along a predetermined moving path; a gas injection unit that is provided at a position overlapping the movement path and that injects gas toward the holding surface.

2. the gas injection unit is provided above the moving path and has an injection nozzle having a plurality of injection ports for injecting the gas; the plurality of jetting ports are arranged along a direction intersecting the movement path; 2. The processing apparatus according to claim 1, wherein the gas is sprayed from the spray nozzle onto the entire surface of the holding surface when the holding table passes under the spray nozzle.

3. A processing apparatus for processing a workpiece, a holding table having a holding surface for holding the object to be processed; a processing unit that processes the object held by the holding table; a moving unit that moves the holding table along a predetermined moving path; a suction unit that is provided at a position overlapping the movement path and applies a suction force to the holding surface.

4. the suction unit is provided above the movement path and has a suction nozzle with a plurality of suction ports; the plurality of suction ports are arranged along a direction intersecting the movement path; 4. The processing apparatus according to claim 3, wherein the suction force is applied from the suction port to the entire surface of the holding surface when the holding table passes under the suction nozzle.

5. 5. The processing apparatus according to claim 1, wherein the movement path connects a transport area where the object is transported and a processing area where the object is processed by the processing unit.

6. The processing apparatus according to claim 1 , wherein the holding table includes a transparent member that forms the holding surface.

7. 5. The processing device according to claim 1, wherein the processing device is an inspection device, a cutting device, a laser processing device, or a grinding device.

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