Planarization method, planarization device, and article manufacturing method

Abstract

To provide a technique for reducing an influence of a defect of a planarizing member.SOLUTION: A planarization method includes: a first planarization step of forming a first planarization layer on a substrate by molding a curable composition using a first planarization member; a second planarization step of forming a second planarization layer on the first planarization layer by molding the curable composition using a second planarization member; and a determining step of determining a planarization member to be used as the first planarization member and a planarization member to be used as the second planarization member based on information indicating performance of each of the at least two planarization members.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a planarization method, a planarization apparatus, and an article manufacturing method. [Background technology]

[0002] Planarization techniques are known that flatten unevenness on a substrate by forming a coating film on the substrate using a coating device such as a spin coater. However, these planarization techniques are insufficient for flattening unevenness on the substrate at the nanoscale. Therefore, imprinting techniques have been proposed to flatten substrates. Patent Document 1 describes a method of forming a film with a flat surface by dropping a curable composition onto a substrate while taking into account the unevenness of the substrate, and curing the curable composition while the flat surface of a plate is in contact with the dropped curable composition. Patent Document 2 describes cleaning a mold used for planarization to remove any composition adhering to the mold. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2011-529626 [Patent Document 2] Japanese Patent Application Publication No. 2020-4920 Summary of the Invention [Problem to be solved by the invention]

[0004] The planarizing member, which is the member that is brought into contact with the curable composition to form a planarizing film, should have a flat surface, but the surface of the planarizing member may be scratched or have foreign matter attached thereto. Furthermore, during the planarizing process, part of the curable composition may peel off and adhere to the planarizing member. If the surface of the planarizing member is not flat, its shape may be transferred to the planarizing layer that is formed, reducing the flatness. This may result in defects in the exposure process after planarization, reducing the yield.

[0005] The present invention aims to provide a technique for reducing the effects of defects in a planarizing member. [Means for solving the problem]

[0006] One aspect of the present invention relates to a planarization method, the planarization method including: a first planarization step of forming a first planarization layer on a substrate by molding a curable composition using a first planarization member; a second planarization step of forming a second planarization layer on the first planarization layer by molding a curable composition using a second planarization member; and a determination step of determining a planarization member to be used as the first planarization member and a planarization member to be used as the second planarization member based on information indicating the performance of each of at least two planarization members.

[0007] Another aspect of the present invention relates to a planarization device that forms a first planarization layer on a substrate by using a first planarization member to mold a curable composition, and forms a second planarization layer on the first planarization layer by using a second planarization member to mold a curable composition, wherein the planarization device includes a control unit that determines which planarization member to use as the first planarization member and which planarization member to use as the second planarization member based on information indicating the performance of each of at least two planarization members. [Effects of the Invention]

[0008] The present invention provides a technique for reducing the effects of defects in a planarizing member. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically illustrating the configuration of a planarization apparatus according to a first embodiment. [Figure 2] 3A to 3C are diagrams schematically showing the flow of a planarization method according to the first embodiment. [Figure 3] 5A to 5C are diagrams illustrating a planarization process when the planarization member has a defect. [Figure 4]4 is a flowchart showing a planarizing method executed in the planarizing apparatus of the first embodiment. [Figure 5] FIG. 10 is a diagram schematically illustrating the configuration of a planarization apparatus according to a second embodiment. [Figure 6] FIG. 10 is a diagram schematically illustrating the configuration of a coating unit and a planarizing unit of a planarizing apparatus according to a second embodiment. [Figure 7] 10 is a flowchart showing a planarizing method executed in the planarizing apparatus of the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0011] In this specification and the accompanying drawings, directions are indicated in an XYZ coordinate system, with the direction parallel to the surface of the substrate being the XY plane. Directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are defined as the X-direction, Y-direction, and Z-direction, respectively, and rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis are defined as θX, θY, and θZ, respectively. Control or drive along the X-axis, Y-axis, and Z-axis means control or drive along the direction parallel to the X-axis, Y-axis, and Z-axis, respectively. First Embodiment 1 is a schematic diagram showing a planarization apparatus 100 according to a first embodiment. The planarization apparatus 100 is used in the manufacture of articles such as semiconductor devices to form a planarization layer on a substrate 1 to prevent defects from occurring in the article. One planarization layer formation process in a planarization method carried out using the planarization apparatus 100 may include the following steps.

[0012] (a) a coating step of coating a planarizing material such as a curable composition onto a substrate 1; (b) a contact step of bringing the planarizing material applied on the substrate 1 into contact with the planarizing member 2; (c) a curing step of applying a curing energy to the planarizing material to harden the planarizing material to form a planarizing layer; (d) A separation step of separating the planarizing member 2 from the planarizing layer on the substrate 1. The planarizing material is molded by curing the planarizing material while it is in contact with the planarizing member 2, thereby forming a planarizing layer made of the cured product of the planarizing material. By the planarizing process, the unevenness on the substrate 1 is covered by the planarizing layer. The surface of the planarizing layer becomes flat, following the flat surface of the planarizing member 2. As the planarizing material, a curable composition that hardens when hardening energy is applied is used. For example, heat or light such as ultraviolet light can be used as the hardening energy.

[0013] In this embodiment, an example will be described in which a photocurable resin that is cured by irradiation with light is used as the curable composition. The photocurable resin contains at least a plurality of polymerizable compounds and a photopolymerization initiator that generates a polymerization factor in response to a predetermined wavelength. Hereinafter, the irradiation of the planarization material with light that causes a curing reaction in the curable composition will also be referred to as "exposure."

[0014] The planarization apparatus 100 shown in FIG. 1 may include a substrate holding unit 3, a substrate driving unit 5, a planarization member holding unit 4, a planarization member driving unit 6, a curing unit 7, a pressure adjusting unit 8, an application unit 9, an alignment unit 10, and a control unit 11.

[0015] The substrate 1 may be, for example, a semiconductor wafer or an MEMS wafer on which a pattern is formed. The substrate 1 may be a wafer for manufacturing a power semiconductor, a glass substrate for manufacturing a display, or a substrate for manufacturing a device such as a bio-element. The substrate 1 may have multiple layers on a base material. Examples of the base material that can be used include semiconductors, glass, ceramics, metals, and resins. If necessary, the substrate 1 may be provided with an adhesion layer to improve adhesion between the planarization material and the substrate 1.

[0016] The planarizing member 2 may have, for example, the same external shape as the substrate 1. The planarizing member 2 may be made of, for example, a material that is transparent to ultraviolet light, such as quartz. The substrate holding unit 3 is configured to be able to hold the substrate 1, and may hold the substrate 1 that has been carried in by a transport device (not shown) or the like, by vacuum suction force, electrostatic force, or the like. The planarizing member holding unit 4 is configured to be able to hold the planarizing member 2, and may hold the planarizing member 2 that has been carried in by a transport device (not shown) or the like, by vacuum suction force, electrostatic force, or the like.

[0017] The substrate driving unit 5 is configured to move the substrate holding unit 3 in the X and Y directions. The substrate driving unit 5 includes an actuator such as a linear motor. The substrate driving unit 5 may include a measuring device such as an encoder or laser interferometer for measuring position. By moving the substrate holding unit 3 holding the substrate 1 in the X and Y directions, the substrate 1 can be positioned directly below the planarizing member 2 in the Z direction or directly below the coating unit 9 in the Z direction.

[0018] The planarizing member driving unit 6 can be configured to move the planarizing member 2 in the Z direction. The planarizing member driving unit 6 can include an actuator such as a linear motor or an air cylinder. By controlling the distance between the substrate 1 and the planarizing member 2 using the planarizing member driving unit 6, the substrate 1 and the planarizing member can be brought into contact with or separated from each other. The planarizing member driving unit 6 may further drive the planarizing member holding unit 4 about the θX axis and the θY axis, thereby adjusting the parallelism between the substrate 1 and the planarizing member 2.

[0019] The curing unit 7 is configured to irradiate the planarizing material with energy for curing (for example, light such as ultraviolet light). The curing unit 7 has a light source that generates light to cure the planarizing material. The curing unit 7 may also include an optical element for adjusting the light emitted from the light source to light appropriate for planarization. The light emitted from the curing unit 7 passes through the planarizing member and is incident on the planarizing material on the substrate 1, thereby curing the planarizing material.

[0020] The pressure adjusting unit 8 can be configured to adjust the pressure in the space on the back surface of the planarizing member 2 (the surface not facing the substrate 1). The pressure adjusting unit 8 can include, for example, an air regulator, a pressure pump, or a vacuum pump. By adjusting the pressure in this space, the planarizing member 2 can be curved in the Z direction. For example, when the planarizing member 2 is pressed against the substrate 1, the planarizing member 2 can be curved in a convex shape toward the substrate 1. This is advantageous for gradually bringing the planarizing member 2 into contact with the planarizing material from the center toward the periphery of the planarizing member 2 to prevent air from being trapped in the planarizing material between the planarizing member 2 and the substrate 1. In one example, after the planarizing member 2 completely contacts the planarizing material on the substrate 1, the pressure on the back surface of the planarizing member 2 can be released.

[0021] The applicator 9 may be configured to apply the planarizing material to the substrate 1, for example, by an inkjet method. The term "application" is used to encompass, for example, the formation of a film of the planarizing material on the substrate 1, as well as the placement of discrete droplets of the planarizing material. The applicator 9 may include, for example, an inkjet head and a tank for supplying the planarizing material. By dropping the planarizing material onto the substrate 1 by the applicator 9 while moving the substrate 1 by the substrate drive unit 5, the planarizing material can be applied to the substrate 1 with a desired distribution.

[0022] The alignment unit 10 can be configured to detect alignment marks on the substrate 1. The alignment unit 10 can include, for example, an illumination unit, an optical system, a camera, etc. The alignment unit 10 can detect alignment marks on the substrate 1 held by the substrate holding unit 3. This can improve the accuracy of the alignment between the substrate 1 and the planarizing member 2 and the application position of the planarizing material on the substrate 1.

[0023] The control unit 11 can be configured to control the above-mentioned components of the planarization apparatus 100. The control unit 11 can be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), an ASIC (abbreviation for Application Specific Integrated Circuit), a general-purpose or dedicated computer with an embedded program, or a combination of all or part of these.

[0024] Next, a planarization method performed by the planarization apparatus 100 will be exemplarily described with reference to Fig. 2. Schematically, in this planarization method, a first planarization layer is formed on a substrate by molding a curable composition using a first planarization member, and a second planarization layer is formed on the first planarization layer by molding a curable composition using a second planarization member.

[0025] First, a planarizing material PM is applied by an application unit 9 to a substrate 1 having an underlying pattern 1a (first application step). FIG. 2(a) schematically shows the state after the planarizing material PM has been placed on the substrate 1 and before the planarizing member 2 is brought into contact with the planarizing material PM. The planarizing material PM can be applied to the substrate 1 by an inkjet method. As shown schematically in FIG. 2(a), droplets of the planarizing material PM can be placed on the substrate 1. The density distribution of the droplets can be determined according to the unevenness of the underlying pattern 1a.

[0026] Next, the planarizing member 2 is manipulated so that the planarizing material PM on the substrate 1 comes into contact with the planarizing member 2 (first contact step). The planarizing member 2 is pressed against the planarizing material PM, which allows the planarizing material PM to spread over the entire surface of the substrate 1. Figure 2(b) shows a state in which the entire planarizing surface (the surface that comes into contact with the planarizing material) of the planarizing member 2 comes into contact with the planarizing material PM on the substrate 1, and the planarizing member 2 follows the low-frequency components of the spatial frequency components of the surface shape of the substrate 1. In this state, the planarizing material PM is exposed by the curing unit 7, which hardens the planarizing material PM and forms a first planarizing layer PL1 (first curing step). Then, the planarizing member 2 is separated from the first planarizing layer PL1 on the substrate 1 (first separation step). The above steps, i.e., applying a planarizing material PM onto the base pattern 1a, contacting the planarizing material PM with a planarizing member 2, hardening the planarizing material PM to form a first planarizing layer PL1, and separating the planarizing member 2 from the first planarizing layer PL1, are the first planarizing step.

[0027] 2(c) shows the structure consisting of the substrate 1 and the first planarization layer PL1 after the planarization member 2 has been separated from the first planarization layer PL1. Although the surface of the first planarization layer PL1 has improved flatness compared to the surface of the base pattern 1a, the planarization material PM shrinks in the thickness direction due to curing shrinkage when hardened, so the surface of the first planarization layer PL1 is not completely flat.

[0028] Therefore, the applicator 9 applies a further planarizing material PM onto the first planarizing layer formed in the first planarizing step (second application step). FIG. 2(d) shows a state in which the planarizing material PM has been further supplied onto the first planarizing layer PL1. The amount and distribution of the planarizing material PM applied may differ from those when the first planarizing layer PL1 was formed. In the second application step, it is sufficient to apply a sufficient amount of planarizing material to form a flat surface on the irregularities on the surface of the first planarizing layer PL1.

[0029] Next, the planarizing member 2 is manipulated so that the planarizing material PM and the planarizing member 2 come into contact (second contact step). Figure 2(e) shows a state in which the planarizing member 2 is pressed against the planarizing material PM, the entire planarizing surface of the planarizing member 2 comes into contact with the planarizing material PM, and the planarizing member 2 follows the low-frequency components of the spatial frequency components of the surface of the first planarizing layer PL1. In this state, the planarizing material PM is exposed by the curing unit 7, thereby curing the planarizing material PM and forming a second planarizing layer PL2 (second curing step). Thereafter, the planarizing member 2 is separated from the second planarizing layer PL2 on the substrate 1 (second separation step). The second planarizing step involves applying the planarizing material PM onto the first planarizing layer PL1, bringing the planarizing member 2 into contact with the planarizing material PM, curing the planarizing material PM to form the second planarizing layer PL2, and separating the planarizing member 2 from the second planarizing layer PL2.

[0030] 2(f) shows the structure consisting of the substrate 1, the first planarization layer PL1, and the second planarization layer PL2 after the planarization member 2 has been separated from the second planarization layer PL2. By forming the second planarization layer PL2 on the first planarization layer PL1, flatness is improved compared to when only the first planarization layer PL1 is used.

[0031] In this manner, a planarization layer (first planarization layer PL1 or second planarization layer PL2) can be formed on the substrate 1. However, for some reason, foreign matter may adhere to the surface of the planarization member 2 or the planarization layer PL may be scratched. If foreign matter adheres to the planarization member 2, the shape of the foreign matter may be transferred to the planarization layer PL on the substrate 1, as shown in FIG. 3(a). If the planarization member 2 is scratched, the shape of the scratch may be transferred to the planarization layer PL on the substrate 1, as shown in FIG. 3(b). In both cases of FIG. 3(a) and FIG. 3(b), the flatness of the planarization layer PL is reduced. Such a planarization layer PL may have adverse effects, such as reducing the quality of the image formed on the photoresist film on the substrate 1 during the exposure process performed by an exposure apparatus, and may reduce the yield of product manufacturing.

[0032] To avoid this, it is necessary to use a planarizing member 2 that has a sufficiently flat planarizing surface (the surface that comes into contact with the planarizing material PM). However, as the planarizing member 2 is used repeatedly, it may become scratched or foreign matter may adhere to the planarizing member 2. Therefore, in the planarizing apparatus 100 or planarizing method of the first embodiment, the use of the planarizing member 2 is controlled so as to reduce the effects of scratches on the planarizing member 2 or the adhesion of foreign matter. Hereinafter, irregularities such as scratches and foreign matter on the surface of the planarizing member 2 will be referred to as "surface defects."

[0033] 4 is a flowchart showing the flow of the planarization method performed by the planarization apparatus 100 of the first embodiment. In this example, the control unit 11 controls the processing procedure of the plurality of substrates so that a first planarization layer is formed on the plurality of substrates and then a second planarization layer is formed on the plurality of substrates.

[0034] In step S101, the control unit 11 acquires surface information for each of the multiple planarizing members 2 (or at least two planarizing members 2). The surface information is information indicating the performance of the planarizing member 2. The surface information is, for example, information regarding defects on the planarizing surface of the planarizing member 2 (the surface that comes into contact with the planarizing material (curable composition)). The surface information may be information indicating the results of measuring surface defects on the planarizing member 2 using a defect inspection device external to the planarizing apparatus 100. Alternatively, the surface information may be acquired by performing a planarization process on a flat test substrate (commonly called a bare silicon wafer) in advance, taking advantage of the transfer of the unevenness of the planarizing member 2, and then inspecting the formed planarization layer for defects. In this case, for example, inspections may be performed using multiple test substrates, and common defects found in the inspection results may be used as defect information. A common defect is a defect that repeatedly occurs at the same position on multiple substrates. Alternatively, the control unit 11 may count the number of times the planarizing member has been used and generate the surface information by estimation based on the number of times the planarizing member has been used. For example, if the number of surface defects increases at a rate of one for every 100 uses, the number of surface defects in the planarizing member 2 can be calculated by multiplying the number of uses by 0.01. The number of uses required for the generation of surface defects depends on the process conditions, the cleanliness of the substrate, and other factors, so it is best to determine this based on actual results. Although the method of generating surface information by estimation based on the number of uses is simple, it is advantageous from the standpoint of productivity because it does not require the use of external inspection equipment.

[0035] Alternatively, the surface information may be information about the manufacturing grade of the planarizing member 2. This is based on the assumption that a good manufacturing grade will have few surface defects. The manufacturer of the planarizing member 2 may set the manufacturing grade according to the flatness, polishing level, etc. of the planarizing member 2.

[0036] Alternatively, the surface information may be information about a coating film on the planarizing member 2 (e.g., whether or not a coating film is present, and the type, material, or grade of the coating film). For example, a planarizing member 2 having a coating film can be estimated to have a good surface condition. This is because the provision of the coating film reduces the surface irregularities of the planarizing member 2 and / or the coating film suppresses the adhesion of foreign matter.

[0037] The control unit 11 can acquire the surface information of the planarizing member 2 by the method described above. The surface information can include information that indicates at least the number of surface defects. Furthermore, the surface information preferably includes information regarding the size and position of the surface defects.

[0038] In step S102, the control unit 11 determines a planarizing member 2 as the first planarizing member to be used in the first planarizing step and a planarizing member 2 as the second planarizing member to be used in the second planarizing step based on the performance of each of the at least two planarizing members 2 (determination step). For example, the control unit 11 may determine to use a planarizing member 2 having performance that meets a predetermined standard for use in the second planarizing step as the second planarizing member based on the surface information acquired in step S101. Furthermore, the control unit 11 may determine to use a planarizing member 2 having performance that does not meet the predetermined standard as the first planarizing member based on the surface information acquired in step S101.

[0039] Alternatively, for example, if there is no shortage of planarizing members 2 that satisfy the predetermined criteria, the control unit 11 may determine to use a planarizing member 2 that satisfies the predetermined criteria as the first planarizing member. That is, the control unit 11 can determine to use either a planarizing member 2 that satisfies the predetermined criteria or a planarizing member 2 that does not satisfy the predetermined criteria as the first planarizing member, based on the surface information acquired in step S101. In other words, the control unit 11 can determine to use a planarizing member 2 as the first planarizing member, regardless of whether the planarizing member 2 satisfies the predetermined criteria.

[0040] Alternatively, the predetermined criterion may be a criterion regarding the number of defects in the planarized surface. To give a more specific example, the predetermined criterion may be a criterion that the number of defects in the planarized surface is a first number or less. Alternatively, the predetermined criterion may be a criterion that the number of defects in the planarized surface that have a first size or greater is a first number or less. Alternatively, the predetermined criterion may be a criterion that the number of defects in the planarized surface that are present in a position that affects the yield of the product manufacturing and that have a size equal to or greater than the first size is a first number or less. The position that affects the yield of the product manufacturing is typically a position within the effective chip area, and the position that does not affect the yield of the product manufacturing is typically a position in the scribe line area that does not have an alignment mark.

[0041] Furthermore, a lower standard (a standard lower than the predetermined standard) that the first planarizing member used in the first planarizing step must satisfy may be defined. In this case, in step S102, the control unit 11 may determine to use, as the first planarizing member, a planarizing member 2 that does not satisfy the predetermined standard but has performance that satisfies the sub-standard. The sub-standard may be a standard that the number of defects on the planarizing surface is equal to or less than a second number that is greater than the first number. Alternatively, the sub-standard may be a standard that the number of defects on the planarizing surface that have a size equal to or greater than a second size that is greater than the first size is equal to or less than a second number. Alternatively, the sub-standard may be a standard that the number of defects on the planarizing surface that are located in positions that affect the yield of the product manufacturing and that have a size equal to or greater than the second size is equal to or less than a second number.

[0042] When all of the planarizing members 2 available for use in the planarizing method satisfy a predetermined standard, the determining step may determine to use a planarizing member 2 with a relatively large number of defects as the first planarizing member and a planarizing member 2 with a relatively small number of defects as the second planarizing member. From another perspective, in a situation where the first planarizing member and the second planarizing member must be determined from a limited number of planarizing members 2, the determining step may determine the first planarizing member and the second planarizing member such that the performance of the second planarizing member is superior to that of the first planarizing member. For example, the control unit 11 may divide the multiple planarizing members 2 available for use into a group to be used as the first planarizing member and a group to be used as the second planarizing member according to their performance (e.g., according to the number of defects they have).

[0043] In step S103, the control unit 11 controls a transport device (not shown) to transport the flattening member 2 determined as the first flattening member in step S102 to the flattening member holding unit 4, and causes the flattening member 2 to be held by the flattening member holding unit 4. In step S104, the control unit 11 controls each component of the flattening apparatus 100 to perform the first flattening step. The first flattening step can include steps S201 to S207.

[0044] In step S201, the control unit 11 controls a transport device (not shown) to transport the substrate 1 to the substrate holding unit 3, and causes the substrate 1 to be held by the substrate holding unit 3. In step S202, the control unit 11 aligns the substrate 1 by using the alignment unit 10 to observe the alignment marks on the substrate 1. This alignment is performed to prevent deviation of the application position of the planarizing material in step S203.

[0045] In step S203, the control unit 11 controls the applicator 9 and the substrate driver 5 so that the applicator 9 applies the planarizing material onto the substrate 1. The amount of planarizing material applied can be adjusted within the plane of the substrate 1 depending on the density distribution of the unevenness of the substrate 1, etc. In step S204, the control unit 11 controls the planarizing member driver 6 so that the planarizing member 2 is driven in the -Z direction, thereby pressing the planarizing member 2 into contact with the planarizing material on the substrate 1. As described above, at this time, the pressure adjuster deforms the planarizing member 2 into a convex shape toward the substrate 1, and the contact area between the planarizing material on the substrate 1 and the planarizing member 2 can gradually expand from the center toward the periphery.

[0046] In step S205, the control unit 11 controls the curing unit 7 to irradiate the planarizing material with light, thereby curing the planarizing material. In step S206, the control unit 11 controls the planarizing member driving unit 6 to drive the planarizing member 2 in the +Z direction, thereby separating the planarizing member 2 from the planarizing material. In step S207, the control unit 11 controls a transport device (not shown) to transport the substrate 1 out.

[0047] In step S105, the control unit 11 determines whether there is a substrate 1 to be processed next, and if there is a substrate 1 to be processed next, executes step S104 for that substrate 1. If there is no substrate 1 to be processed next, the control unit 11 proceeds to step S106. In step S106, the control unit 11 controls a transport device (not shown) to transport the flattening member 2, which serves as the first flattening member, from the flattening member holding unit 4.

[0048] In step S107, the control unit 11 controls a transport device (not shown) to transport the flattening member 2 determined as the second flattening member in step S102 to the flattening member holding unit 4, and causes the flattening member 2 to be held by the flattening member holding unit 4. In step S108, the control unit 11 controls each component of the flattening apparatus 100 to perform the second flattening step. The second flattening step may include steps S201 to S207.

[0049] In step S109, the control unit 11 determines whether there is a substrate 1 to be processed next, and if there is a substrate 1 to be processed next, executes step S108 for that substrate 1. If there is no substrate 1 to be processed next, the control unit 11 proceeds to step S110. In step S110, the control unit 11 controls a transport device (not shown) to transport the flattening member 2, which serves as the second flattening member, from the flattening member holding unit 4.

[0050] As described above, by using a planarizing member 2 that satisfies the predetermined criteria as the second planarizing member used in the second planarizing step, a planarizing film with a flatter surface can be obtained. Furthermore, by using a planarizing member 2 that no longer satisfies the predetermined criteria as the first planarizing member for forming the lower planarizing layer, the cost of preparing the planarizing member 2 can be reduced.

[0051] Note that one or more additional planarization steps may be performed before the first planarization step. That is, the planarization method of this embodiment may include three or more planarization steps including the first planarization step and the second planarization step, and three or more planarization layers including the first planarization layer and the second planarization layer may be stacked. In this case, it is preferable that the upper planarization layer is formed using a planarization member 2 with fewer defects. Second Embodiment A planarization apparatus and planarization method according to the second embodiment will be described below. Matters not mentioned in the second embodiment may conform to the first embodiment. The planarization apparatus 200 according to the second embodiment includes multiple planarization units. For example, the planarization apparatus 200 may include a first planarization unit PU1 and a second planarization unit PU2 as the multiple planarization units. The planarization apparatus 200 may also include a coating unit MU, a substrate transport robot R1, a substrate transport robot R2, a substrate transfer machine WS, a substrate load port LP1, a substrate load port LP2, and a control unit CU.

[0052] The planarizing unit PU1 and the planarizing unit PU2 may be identical units. Performing planarization processing in parallel using the planarizing unit PU1 and the planarizing unit PU2 increases productivity. The coating unit MU applies a planarizing material to a substrate. The substrate load port LP1 and the substrate load port LP2 are ports for loading substrates into the planarizing apparatus 200. Substrate cassettes (not shown) containing substrates can be placed on the load port LP1 and the substrate load port LP2. Providing multiple substrate load ports reduces waiting time when changing substrate cassettes. The substrate transport robot R1 removes substrates from the substrate cassettes placed on the substrate load port LP1 and the substrate load port LP2 and transfers them to the substrate transfer machine WS. The substrate transport robot R2 transports the substrates transferred to the substrate transfer machine WS to each unit. The control unit CU controls each component of the planarizing apparatus 200. The substrate transport robot R1, the substrate transport robot R2 and the substrate transfer machine WS (hereinafter collectively referred to as the transport mechanism) can be configured to be able to transport the flattening member 2 in addition to the substrate.

[0053] 6(a) is a diagram showing the configuration of the coating unit MU. The coating unit MU, for example, uses an inkjet method to coat a planarizing material on a substrate 1. The coating unit MU may include, for example, a substrate holding unit 21 that holds the substrate 1, a substrate driving unit 22 that drives the substrate holding unit 21, a coating unit 23 that coats the planarizing material on the substrate 1, and an alignment unit 24 that measures the position of the substrate 1.

[0054] The substrate holder 21 holds the substrate 1 by vacuum suction, electrostatic force, or the like. The substrate driver 22 can be configured to move the substrate 1 in the X and Y directions. The substrate driver 22 includes, for example, an actuator such as a linear motor. The substrate driver 22 can include a measuring instrument such as an encoder or laser interferometer for measuring the position.

[0055] The applicator 23 may be configured to apply the planarizing material to the substrate 1 by, for example, an inkjet method. The applicator 23 may include, for example, an inkjet head and a tank that supplies the planarizing material. By dropping the planarizing material onto the substrate 1 by the applicator 23 while moving the substrate 1 by the substrate driving unit 22, the planarizing material can be applied to the substrate 1 with a desired distribution.

[0056] The alignment unit 24 can be configured to detect alignment marks on the substrate 1. The alignment unit 10 can include, for example, an illumination unit, an optical system, a camera, etc. The alignment unit 10 can detect alignment marks on the substrate 1 held by the substrate holding unit 3. This can improve the accuracy of the alignment between the substrate 1 and the planarizing member 2 and the application position of the planarizing material on the substrate 1.

[0057] The control unit CU can be configured, for example, by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a built-in program, or a combination of all or part of these.

[0058] 6(b) shows the configuration of the planarizing unit PU. The planarizing unit PU may include a substrate holding unit 31 that holds the substrate 1, a planarizing member holding unit 32 that holds the planarizing member 2, a substrate driving unit 33, a planarizing member driving unit 34, a curing unit 35, a pressure adjusting unit 36, and an alignment unit 37. These may have the same functions as the substrate holding unit 3, planarizing member holding unit 4, substrate driving unit 5, planarizing member driving unit 6, curing unit 7, pressure adjusting unit 8, and alignment unit 10 of the first embodiment, respectively.

[0059] 7 is a flowchart showing the flow of the planarization method performed by the planarization apparatus 200 of the second embodiment. In step S301, the control unit CU acquires surface information for each of the multiple planarizing members 2. In step S302, the control unit CU determines the first planarizing member 2 to be used in the first planarizing step and the second planarizing member 2 to be used in the second planarizing step (determination step). The method for this determination may follow the first embodiment.

[0060] In step S303, the control unit CU controls the transport mechanism to transport the planarizing member 2 determined as the first planarizing member in step S302 to the planarizing member holding part 32 of the planarizing unit PU1, and causes the planarizing member 2 to be held by the planarizing member holding part 32. In step S304, the control unit CU controls the transport mechanism to transport the planarizing member 2 determined as the second planarizing member in step S302 to the planarizing member holding part 32 of the planarizing unit PU2, and causes the planarizing member 2 to be held by the planarizing member holding part 32. In step S305, the control unit CU causes the coating unit MU to perform a coating step of coating the substrate 1 with a planarizing material to form a first planarizing layer. The coating step may include steps S401 to S404.

[0061] In step S401, the control unit CU controls the transport mechanism to transport the substrate 1 to the substrate holding unit 21 of the coating unit MU. In step S402, the control unit CU uses the alignment unit 24 to measure the alignment mark of the substrate 1 and position the substrate 1. In step S403, the control unit CU causes the coating unit 23 to coat the planarizing material onto the substrate 1 while moving the substrate 1 with the substrate driving unit 22. The coating distribution of the planarizing material can be determined by the pattern density of the substrate 1, etc. In step S404, the control unit CU causes the transport mechanism to unload the substrate 1 from the coating unit MU.

[0062] In step S306, the control unit CU controls each component of the planarizing unit PU1 to perform a first planarizing step. The first planarizing step may include steps S501 to S506. In step S501, the control unit CU controls the transport mechanism to transport the substrate 1 coated with the planarizing material to the substrate holder 31 of the planarizing unit PU1. In step S502, the control unit CU aligns the substrate 1 by observing the alignment mark on the substrate 1 using the alignment unit 37. Steps S503, S504, and S505 are a contact step, a curing step, and a separation step, respectively, and are equivalent to steps S204, S205, and S206 in the first embodiment, so their description will be omitted. In step S506, the control unit CU controls the transport mechanism to transport the substrate 1 out.

[0063] In step S307, the control unit CU causes the coating unit MU to perform a coating process in which a planarizing material for forming a second planarizing layer is applied to the substrate 1. The coating process may include the above-described steps S401 to S404. In step S308, the control unit CU controls each component of the planarizing unit PU2 to perform the second planarizing process. The second planarizing process may include the above-described steps S501 to S506. In step S309, the control unit CU determines whether there is a substrate 1 to be processed next, and if there is, executes step S305 for that substrate 1. If there is no substrate 1 to be processed next, the control unit CU proceeds to step S310. In step S310, the control unit CU controls the transport mechanism to transport the planarizing member 2, which serves as the first planarizing member, from the planarizing member holder 32 of the planarizing unit PU1. In step S311, the control unit CU controls the transport mechanism to transport the flattening member 2, which serves as the second flattening member, out of the flattening member holding portion 32 of the flattening unit PU2.

[0064] For simplicity, FIG. 7 shows steps S305, S306, S307, and S308 being performed in this order, but the process consisting of steps S305 and S306 may be started on a new substrate in parallel with step S308.

[0065] According to the second embodiment, productivity is improved compared to the first embodiment by providing a plurality of flattening units.

[0066] <Product manufacturing method> An article manufacturing method using the planarization apparatus and planarization method of the first and second embodiments will be described below. The article manufacturing method may include a planarization step of forming a planarization film on the surface of a substrate, a pattern formation step of forming a pattern on the planarization film by a photolithography process, and a processing step of processing the patterned substrate to obtain an article. In the planarization step, a planarization film including a first planarization layer and a second planarization layer may be formed using the planarization apparatus and planarization method of the first and second embodiments. The pattern formation step may include, for example, a step of applying a photoresist film on the planarization film and a step of forming a latent image in the photoresist film by transferring a pattern of an original onto the photoresist film using an exposure device. The pattern formation step may also include a step of converting the latent image into a physical pattern by developing the photoresist film. The processing step may include, for example, a step of etching an underlying structure using the physical pattern.

[0067] The planarization film formed in the planarization process may permanently constitute at least a part of various articles, or may be temporarily formed during the manufacture of various articles. The articles include electrical circuit elements, optical elements, MEMS, recording elements, and sensors. Examples of electrical circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, as well as semiconductor elements such as LSIs, CCDs, image sensors, and FPGAs.

[0068] <Disclosures> (Item 1) a first planarization step of forming a first planarization layer on the substrate by molding a curable composition using a first planarization member; a second planarization step of forming a second planarization layer on the first planarization layer by molding a curable composition using a second planarization member; a determining step of determining a planarizing member to be used as the first planarizing member and a planarizing member to be used as the second planarizing member based on information indicating the performance of each of at least two planarizing members; A planarization method comprising: (Item 2) In the determination step, a flattening member having a performance that satisfies a predetermined standard is determined as the second flattening member, and a flattening member having a performance that does not satisfy the predetermined standard is determined as the first flattening member. 2. The planarization method according to item 1, (Item 3) In the determination step, a flattening member having performance that does not satisfy the predetermined standard but satisfies a standard lower than the predetermined standard is determined as the first flattening member. 3. The planarization method according to item 2, (Item 4) In the determining step, A flattening member having performance that satisfies a predetermined standard is determined as the second flattening member; determining a flattening member having a performance that satisfies the predetermined standard or a flattening member having a performance that does not satisfy the predetermined standard as the first flattening member; 2. The planarization method according to item 1, (Item 5) each of the at least two planarizing members having a planarizing surface in contact with the curable composition; the predetermined criteria include criteria regarding defects in the planarized surface; 5. The planarization method according to any one of items 2 to 4, (Item 6) In the determining step, the first flattening member and the second flattening member are determined so that the performance of the second flattening member is superior to the performance of the first flattening member. 2. The planarization method according to item 1, (Item 7) the information includes information regarding the number of uses of each of the at least two planarizing members; 7. The planarization method according to any one of items 1 to 6, (Item 8) the information includes information regarding a manufacturing grade of each of the at least two flattening members; 7. The planarization method according to any one of items 1 to 6, (Item 9) the information includes information regarding a coating on each of the at least two planarizing members; 7. The planarization method according to any one of items 1 to 6, (Item 10) 1. A method of manufacturing an article, comprising: a planarization step of forming a planarization film on the substrate; a pattern forming step of forming a pattern on the planarization film by a photolithography step; and a processing step of processing the patterned substrate to obtain an article, In the planarization step, a first planarization layer and a second planarization layer are formed by the planarization method according to any one of items 1 to 9. A method for manufacturing an article. (Item 11) A planarization apparatus that uses a first planarization member to form a first planarization layer on a substrate by molding a curable composition, and uses a second planarization member to form a second planarization layer on the first planarization layer by molding a curable composition, a control unit that determines a planarizing member to be used as the first planarizing member and a planarizing member to be used as the second planarizing member based on information indicating the performance of each of at least two planarizing members; A flattening apparatus characterized by: (Item 12) the control unit determines a flattening member having a performance that satisfies a predetermined standard as the second flattening member, and determines a flattening member having a performance that does not satisfy the predetermined standard as the first flattening member. Item 12. The planarization apparatus according to item 11. (Item 13) The control unit determines a flattening member having performance that does not satisfy the predetermined standard but satisfies a standard lower than the predetermined standard as the first flattening member. Item 13. The planarization apparatus according to item 12. (Item 14) The control unit A flattening member having performance that satisfies a predetermined standard is determined as the second flattening member; determining a flattening member having a performance that satisfies the predetermined standard or a flattening member having a performance that does not satisfy the predetermined standard as the first flattening member; Item 12. The planarization apparatus according to item 11. (Item 15) each of the at least two planarizing members having a planarizing surface in contact with the curable composition; the predetermined criteria include criteria regarding defects in the planarized surface; 15. The planarization apparatus according to any one of items 12 to 14. (Item 16) the control unit determines the first flattening member and the second flattening member so that the performance of the second flattening member is superior to the performance of the first flattening member. Item 12. The planarization apparatus according to item 11. (Item 17) the information includes information regarding the number of uses of each of the at least two planarizing members; 17. The planarization apparatus according to any one of items 11 to 16, (Item 18) the information includes information regarding a manufacturing grade of each of the at least two flattening members; 17. The planarization apparatus according to any one of items 11 to 16, (Item 19) the information includes information regarding a coating on each of the at least two planarizing members; 17. The planarization apparatus according to any one of items 11 to 16, (Item 20) the control unit controls a processing procedure of the plurality of substrates so that the second planarization layer is formed on the plurality of substrates after the first planarization layer is formed on the plurality of substrates. 20. The planarization apparatus according to any one of items 11 to 19, (Item 21) a first planarizing unit for forming the first planarizing layer on a plurality of substrates; a second planarizing unit for forming the second planarizing layer on the plurality of substrates; 20. The planarization apparatus according to any one of items 11 to 19, comprising: (Item 22) 1. A method of manufacturing an article, comprising: a planarization step of forming a planarization film on the substrate; a pattern forming step of forming a pattern on the planarization film by a photolithography step; and a processing step of processing the patterned substrate to obtain an article, In the planarization step, a first planarization layer and a second planarization layer are formed by the planarization apparatus according to any one of items 11 to 21. A method for manufacturing an article.

[0069] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0070] 1: substrate, 1a: base pattern, 2: planarizing member, 3: substrate holding unit, 4: planarizing member holding unit, 5: substrate driving unit, 6: planarizing member driving unit, 7: curing unit, 8: pressure adjusting unit, 9: coating unit, 10: alignment unit, 11: control unit, 100: planarizing device, PM: planarizing material, PL1: first planarizing layer, PL2: second planarizing layer

Claims

1. a first planarization step of forming a first planarization layer on the substrate by molding a curable composition using a first planarization member; a second planarizing step of forming a second planarizing layer on the first planarizing layer by molding a curable composition using a second planarizing member; a determining step of determining a planarizing member to be used as the first planarizing member and a planarizing member to be used as the second planarizing member based on information indicating the performance of each of at least two planarizing members; A planarization method comprising:

2. In the determination step, a flattening member having a performance that satisfies a predetermined standard is determined as the second flattening member, and a flattening member having a performance that does not satisfy the predetermined standard is determined as the first flattening member.

2. The planarization method according to claim 1.

3. In the determination step, a flattening member having performance that does not satisfy the predetermined standard but satisfies a standard lower than the predetermined standard is determined as the first flattening member.

3. The planarization method according to claim 2.

4. In the determining step, determining a planarizing member having performance that satisfies a predetermined standard as the second planarizing member; determining a planarizing member having a performance that satisfies the predetermined standard or a planarizing member having a performance that does not satisfy the predetermined standard as the first planarizing member; 2. The planarization method according to claim 1.

5. each of the at least two planarizing members having a planarizing surface in contact with the curable composition; the predetermined criteria include criteria regarding defects in the planarized surface; 3. The planarization method according to claim 2.

6. In the determining step, the first planarizing member and the second planarizing member are determined so that the performance of the second planarizing member is superior to the performance of the first planarizing member.

2. The planarization method according to claim 1.

7. the information includes information regarding the number of uses of each of the at least two planarizing members; 2. The planarization method according to claim 1.

8. the information includes information regarding a manufacturing grade of each of the at least two planarizing members; 2. The planarization method according to claim 1.

9. the information includes information regarding a coating on each of the at least two planarizing members; 2. The planarization method according to claim 1.

10. 1. A method of manufacturing an article, comprising: a planarization step of forming a planarization film on the substrate; a pattern forming step of forming a pattern on the planarization film by a photolithography step; and a processing step of processing the patterned substrate to obtain an article, In the planarization step, a first planarization layer and a second planarization layer are formed by the planarization method according to any one of claims 1 to 9. A method for manufacturing an article.

11. A planarization apparatus for forming a first planarization layer on a substrate by using a first planarization member to form a curable composition, and for forming a second planarization layer on the first planarization layer by using a second planarization member to form a curable composition, a control unit that determines a planarizing member to be used as the first planarizing member and a planarizing member to be used as the second planarizing member based on information indicating performance of each of at least two planarizing members; A flattening apparatus characterized by:

12. the control unit determines a planarizing member having a performance that satisfies a predetermined standard as the second planarizing member, and determines a planarizing member having a performance that does not satisfy the predetermined standard as the first planarizing member.

12. The planarization apparatus according to claim 11.

13. the control unit determines a flattening member having performance that does not satisfy the predetermined standard but satisfies a standard lower than the predetermined standard as the first flattening member; 13. The planarization apparatus of claim 12.

14. The control unit determining a planarizing member having performance that satisfies a predetermined standard as the second planarizing member; determining a planarizing member having a performance that satisfies the predetermined standard or a planarizing member having a performance that does not satisfy the predetermined standard as the first planarizing member; 12. The planarization apparatus according to claim 11.

15. each of the at least two planarizing members having a planarizing surface in contact with the curable composition; the predetermined criteria include criteria regarding defects in the planarized surface; 13. The planarization apparatus of claim 12.

16. the control unit determines the first planarizing member and the second planarizing member such that performance of the second planarizing member is superior to performance of the first planarizing member.

12. The planarization apparatus according to claim 11.

17. the information includes information regarding the number of uses of each of the at least two planarizing members; 12. The planarization apparatus according to claim 11.

18. the information includes information regarding a manufacturing grade of each of the at least two planarizing members; 12. The planarization apparatus according to claim 11.

19. the information includes information regarding a coating on each of the at least two planarizing members; 12. The planarization apparatus according to claim 11.

20. the control unit controls a processing procedure of the plurality of substrates so that the first planarization layer is formed on the plurality of substrates and then the second planarization layer is formed on the plurality of substrates.

12. The planarization apparatus according to claim 11.

21. a first planarizing unit for forming the first planarizing layer on a plurality of substrates; a second planarizing unit for forming the second planarizing layer on the plurality of substrates; The planarization apparatus of claim 11 , further comprising:

22. 1. A method of manufacturing an article, comprising: a planarization step of forming a planarization film on the substrate; a pattern forming step of forming a pattern on the planarization film by a photolithography step; and a processing step of processing the patterned substrate to obtain an article, In the planarization step, a first planarization layer and a second planarization layer are formed by the planarization apparatus according to any one of claims 11 to 21. A method for manufacturing an article.

Images