Liquid cooling type heat dissipation system

Abstract

To provide a liquid cooling type heat dissipation system with high heat dissipation efficiency that can be applied to stand-alone AI computers.SOLUTION: A liquid cooling type heat dissipation system comprises a liquid cooling type vapor chamber, a liquid cooling type heat dissipation plate, a first cooling liquid pipe and a second cooling liquid pipe connecting the two, a cooling liquid circulator, a fan, and a cooling liquid. The liquid cooling type vapor chamber includes a liquid cooling cover, a metal upper cover plate, and a metal lower cover plate. The liquid cooling type heat dissipation plate includes a heat dissipation base plate and a heat dissipation outer cover. The cooling liquid circulator pumps cooling liquid from the first cooling liquid pipe to the liquid cooling cover of the liquid cooling type vapor chamber, makes the cooling liquid after absorbing heat flow into the liquid cooling type heat dissipation plate via the second cooling liquid pipe. The fan fixed to an outer surface of the base plate of the liquid cooling type heat dissipation plate blows air onto the outer surface of the base plate to cool the cooling liquid. The cooling liquid is cooled as it flows through a second storage space inside the liquid cooling type heat dissipation plate, and then returned to the cooling liquid circulator for recirculation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat dissipation system, and more particularly to a liquid-cooled heat dissipation system. [Background technology]

[0002] The explosive development of generative artificial intelligence (generative AI) or AI-generated content (AIGC) is significantly increasing the demand for high-speed computing power and the development of high-end computing chip modules. The massive data volumes and processing speeds required for AIGC applications are driving increasing demand for high-end AI servers. High-end AI servers simultaneously use a relatively large number of central processing units (CPUs) and graphics processors (GPUs). To meet the high-speed, intensive computing requirements of generative AI (e.g., ChatGPT), the number of transistors in the high-end chips used has reached 175 billion. The high efficiency and power consumption of AI server chips creates a large, dense heat source, posing a major challenge to heat dissipation. For example, the energy consumption of server processors was only around 180-280W in 2018, but is expected to double to over 500W by 2023. For example, the AMD 5nm Genoa processor and the A100 chip released by leading GPU manufacturer NVIDIA in 2022 consume 400W of energy, approximately 40-50% higher than the previous generation of processors. In 2023, the energy consumption of the Bergamo processor will exceed 500W, and the new generation of high-end GPU H100 chips created by NVIDIA specifically for AI servers will have a maximum power consumption of 700W. As the number of chips used in a server increases, power consumption increases, and the modular design complexity of the heat dissipation solution also increases.

[0003] With the upgrade of new generation GPUs and CPUs, server computing, AI image generation, and e-sports applications are the main driving forces behind the growth of the heat dissipation industry. From the perspective of server heat dissipation technology, it can be mainly divided into air cooling, liquid cooling, and immersion cooling. Generally, when the thermal power consumption of a chip exceeds 300W, it becomes difficult to solve the heat problem by air cooling.

[0004] Immersion cooling can be divided into single-phase and two-phase immersion cooling. Immersion cooling has the highest heat dissipation efficiency, reaching over 1500W. However, because immersion cooling involves submerging servers in a tank containing a large amount of liquid coolant, the equipment room must be redesigned to accommodate the application. This not only makes the coolant very expensive, but also poses environmental concerns. Furthermore, more practical application data is needed to further clarify whether other peripheral components, such as chips, PCB boards, network interface cards, and power supplies, can maintain normal operation when submerged in liquid coolant.

[0005] Due to the ever-increasing computing power, ChatGPT and other high-end AI servers require at least 700W of heat dissipation capacity to maintain sufficient heat dissipation. NVIDIA A100 or H100 AI servers typically contain four to eight GPUs, each generating an additional 300 to 700W of heat energy. The entire AI server's estimated heat consumption exceeds 3,000W. Because conventional air cooling cannot provide such efficient heat dissipation, the introduction of "liquid cooling" technology has become a new trend to address heat dissipation through heat dissipation. Liquid cooling utilizes the liquid's superior thermal conductivity compared to gas to rapidly transfer the high-density heat energy generated by heat-generating components to the liquid cooling plate. The absorbed heat is then guided to an outdoor cooling tower or heat dissipation module, where the heat energy is further dissipated into the atmosphere, achieving rapid cooling and reduced energy consumption. The open-type liquid cooling module, currently common in the industry, is an efficient cooling method that combines liquid and air cooling within a server cabinet. This open-type liquid cooling module includes a liquid cooling plate module (Cold Plate), a coolant distribution unit (CDU), and a coolant manifold. The coolant passes through a radiator and a fan back door or heat exchanger, lowering its temperature. When the open-type liquid cooling module is in operation, the coolant is pumped by the coolant distribution unit and flows through the coolant manifold into the liquid cooling plate that is in close contact with the chip or processor. Heat from the chip or processor is transferred by the liquid cooling plate and absorbed by the coolant. The heat-absorbed coolant then flows out the heat pipe manifold at the other end of the liquid cooling plate. The heat-absorbed coolant is then sent to the back door of the cabinet, where it is cooled by forced heat dissipation through the fan back door. The cooled coolant then returns to the coolant distribution unit and is pumped back to the liquid cooling plate.

[0006] The miniaturization and high integration of AI computing chips is expected to significantly increase the heat density of the chips, making it an important trend to position heat dissipation solutions closer to the core heat source, such as the chip. Depending on the scale of application, liquid cooling and heat dissipation modules can be divided into those at the machine room level of large data centers, those at the server cabinet level, and those at the chip level that will be applied to future AI computers. The liquid cooling and heat dissipation modules required for AI computers are smaller in scale than those at the machine room and cabinet levels, and heat dissipation efficiency must be sufficient in an environment where external ice machines and air conditioning are not running, thereby reducing the power usage effectiveness (PUE) of the entire heat dissipation system.

[0007] A common liquid cooling module is a liquid cooling plate module, which covers the heat dissipation structure of a radiator with a liquid cooling cover and fastens the cover to the radiator to form a cavity. The liquid cooling cover has an inlet and an outlet. The cooling liquid enters the cavity formed by fastening the liquid cooling cover and radiator together through the inlet, flows through the heat dissipation structure, and then flows out the outlet and through a conduit to an external heat dissipation system (e.g., a finned heat sink through the conduit, followed by forced cooling by a fan), thereby dissipating the heat carried by the cooling liquid. However, when the metal base plate of the radiator in a liquid cooling plate module comes into contact with a heat-generating component, the cross-sectional area of ​​the metal base plate limits the lateral heat conduction rate of the metal base plate, preventing efficient transfer of the large amount of heat rapidly generated by the heat-generating component to the entire metal base plate of the radiator. Instead, the large amount of heat is concentrated in the local area where the radiator and the heat-generating component come into contact. This significantly limits the heat dissipation capacity that can be improved even with liquid cooling. In addition, the external heat dissipation system utilizes heat exchange between the duct and the fin-type heat sink, and also uses a fan for air-cooling heat dissipation, which limits the direct heat dissipation area of ​​the cooling liquid and can result in insufficient heat dissipation efficiency.

[0008] In consideration of the above problems, the inventors of the present invention have designed a liquid-cooled heat dissipation system including a liquid-cooled vapor chamber, in which the metal base plate of the heat sink of the liquid-cooled heat dissipation module is designed as a vapor chamber, the heat dissipation structure of the heat sink is integrated with the heat dissipation surface of the vapor chamber by molding, and the heat dissipation structure is covered within a cavity by a liquid-cooled cover, forming the base plate as a vapor chamber. The liquid-cooled cover has a first liquid inlet and a first liquid outlet, allowing the cooling liquid to flow in and out of the heat dissipation structure within the liquid-cooled cover, improving heat exchange efficiency. The vapor chamber has characteristics of high thermal conductivity, strong lateral thermal uniformity, and a high thermal diffusion coefficient, and its heat diffusion ability is significantly superior to that of conventional metal base plates (e.g., copper-based base plates, aluminum alloy base plates, etc.). When a heat-generating electronic component attached to the heat-absorbing surface of the vapor chamber generates a large amount of heat, the heat is rapidly transferred to the vapor chamber. At this time, the working fluid present in the vapor chamber's internal space quickly absorbs the heat and rapidly evaporates to form vapor. Because the heat-dissipating surface of the vapor chamber is connected to the heat sink and liquid-cooled cover, when the vapor rapidly rises and comes into contact with the cold metal surface of the heat sink, it condenses back into working fluid. This liquid-gas-liquid phase change cycle quickly absorbs and releases a large amount of heat. Compared to the use of a traditional metal base plate, the vapor chamber quickly diffuses the concentrated large amount of heat across a larger area of ​​the heat sink, resulting in a larger effective heat dissipation area and faster heat dissipation.

[0009] The vapor chamber utilizes the phase change of the working fluid in a sealed working chamber to rapidly dissipate heat, and is currently the most efficient heat dissipation method. It achieves the goal of rapid heat dissipation by utilizing the large amount of latent heat of vaporization that accompanies the rapid evaporation and condensation process of the working fluid in a near-vacuum chamber. The thermal conductivity of the vapor chamber is 10,000 W / (m 2·℃) or more, which is several tens of times more efficient than conventional air convection or liquid convection. When the heat sink is integrated into the heat dissipation surface of the vapor chamber through one-piece molding, it can quickly and effectively transfer and disperse a large amount of heat from inside the vapor chamber to the heat dissipation structure, greatly improving the heat dissipation efficiency.

[0010] In addition, the liquid-cooled heat dissipation system of the present invention further includes a liquid-cooled heat sink. The liquid-cooled heat sink has a plate-like structure with a hollow cavity, the inner surface of which is provided with multiple protruding heat dissipation columns. The frame of the liquid-cooled heat sink is provided with at least one second liquid inlet and at least one second liquid outlet. The second liquid inlet and second liquid outlet are connected to the first liquid outlet and first liquid inlet of the liquid-cooled cover of the liquid-cooled vapor chamber via a liquid-cooled pipe, respectively, allowing the liquid to circulate repeatedly between the liquid-cooled vapor chamber and the liquid-cooled heat sink. After absorbing heat in the liquid-cooled cover of the liquid-cooled vapor chamber, the liquid-cooled liquid is transported into the cavity of the liquid-cooled heat sink and flows through the heat dissipation columns within the cavity. Many heat dissipation columns can provide a large heat exchange area, and a fan installed outside the liquid-cooled heat sink can dissipate heat by forcing air onto the external surface, quickly dispersing the cooling liquid after absorbing the heat onto the liquid-cooled heat sink, allowing for quick heat dissipation. Summary of the Invention [Problem to be solved by the invention]

[0011] The present invention provides a liquid-cooled heat dissipation system with high heat dissipation efficiency that can be applied to standalone AI computers. [Means for solving the problem]

[0012] The present invention provides a liquid cooling system including at least one liquid-cooled vapor chamber, a liquid-cooled heat sink, at least one first liquid cooling line and at least one second liquid cooling line connected between the two, a liquid cooling circulator, at least one fan, and a liquid cooling medium.

[0013]

[0006] To further explain, the liquid-cooled vapor chamber is a highly efficient liquid-cooled vapor chamber formed by combining a liquid-cooled cover with an integrated vapor chamber. The liquid-cooled vapor chamber of the present invention includes a liquid-cooled cover and an integrated vapor chamber. The liquid-cooled cover includes an upper portion and a sidewall connected to the upper portion, the sidewall surrounding the upper portion to form a first storage space, and the sidewall is provided with at least one first liquid inlet and at least one first liquid drain port, and the first liquid inlet and first drain port are connected to the first storage space. The integrated vapor chamber includes a metal upper cover plate, a metal lower cover plate, a working space, a bleed channel, a capillary structure, and a working fluid. The metal top cover plate includes a heat dissipation outer surface and a condensation inner surface, the heat dissipation outer surface has a plurality of first heat dissipation columns, an upper frame of an appropriate height is provided around the condensation inner surface to surround the condensation inner surface, the upper frame is provided with an upper flow path groove, and the condensation inner surface has a plurality of upper grooves arranged parallel to each other, and the entire metal top cover plate including the first heat dissipation columns is integrally formed from a metal sheet (or metal block).

[0014] The metal lower cover plate includes a heat-absorbing outer surface and an evaporative inner surface. The heat-absorbing outer surface is used for contacting heat-generating electronic components. A lower frame of appropriate height is provided around the periphery of the evaporative inner surface, surrounding the evaporative inner surface. The lower frame is provided with lower flow grooves. The evaporative inner surface has a plurality of parallel-arranged lower grooves and a plurality of columnar support structures protruding between the lower grooves. The entire assembly, including the columnar support structures, is integrally formed from a metal sheet (or metal block). The lower frame is joined to the upper frame of the metal upper cover plate to form a working space. The columnar support structures protrude from the evaporative inner surface and connect between the upper grooves of the condenser inner surface to support the working space. The intake channel is formed by joining the corresponding upper flow grooves and lower flow grooves, and draws air into the working space and seals it after intake, maintaining a vacuum in the working space. A capillary structure is provided in the lower groove or in both the upper and lower grooves. A working fluid resides in the working space and the capillary structure. The liquid-cooled cover is coupled to the heat-dissipating outer surface of the metal top cover plate, and the first heat-dissipating column is disposed in the first accommodating space to form a liquid-cooled vapor chamber.

[0015] Based on the above embodiment, the liquid cooling cover includes a heat dissipation base plate and a heat dissipation outer lid. The heat dissipation base plate has an inner base plate surface and an opposing outer base plate surface. The inner base plate surface is provided with a plurality of protruding second heat dissipation columns arranged in a substantially matrix pattern, at least one elongated flow guide plate groove formed on the inner base plate surface and protruding from the inner base plate surface, and positioned between the plurality of second heat dissipation columns. The flow guide plate groove is used to attach at least one elongated sheet-like flow guide plate, and an outer lid connecting groove is provided on the inner base plate surface and protruding from the periphery of the inner base plate. The outer base plate surface is provided with a plurality of fan screw holes protruding from the outer base plate surface and used to secure at least one fan for cooling the outer base plate surface. The entire heat dissipation plate, including the plurality of second heat dissipation columns, the flow guide plate groove, the outer lid connecting groove, and the fan screw hole, are integrally formed from the same metal sheet (metal block).

[0016] The heat-dissipating outer lid has an outer lid top and an outer lid sidewall connected to the bottom lid top. The outer lid sidewall surrounds the outer lid top to form a second storage space. The outer lid sidewall is provided with at least one second liquid supply port and at least one second liquid drain port, which are connected to the second storage space. When the heat-dissipating outer lid and the heat-dissipating base plate are fitted together, the outer lid sidewall of the heat-dissipating outer lid can be inserted and welded into the outer lid joining groove of the heat-dissipating base plate, and the plurality of second heat-dissipating columns are installed in the second storage space to form the liquid-cooled heat-dissipating plate. In this embodiment, one end of the first coolant pipe is connected to the first coolant supply port of the liquid-cooled vapor chamber and the other end is connected to the second coolant discharge port of the liquid-cooled heat sink, and one end of the second coolant pipe is connected to the first coolant discharge port of the liquid-cooled vapor chamber and the other end is connected to the second coolant supply port of the liquid-cooled heat sink. The coolant circulator is installed between the first coolant pipes or the second coolant pipes and pumps the coolant to circulate and flow between the liquid-cooled vapor chamber and the liquid-cooled heat sink, forming a liquid-cooled heat sink system.

[0017] In one embodiment of the present invention, the heat-absorbing outer surface of the metal bottom cover plate of the liquid-cooled heat sink is flat and comes into contact with the heat-generating electronic components.

[0018] In one embodiment of the present invention, the heat-absorbing outer surface of the metal bottom cover plate of the liquid-cooled heat sink further has at least one recessed space for accommodating at least one heat-generating electronic component, and the recessed space is recessed in a direction from the heat-absorbing outer surface toward the evaporative inner surface, but does not protrude from the corresponding evaporative inner surface.

[0019] In one embodiment of the present invention, the recessed spaces are plural and accommodate a plurality of the heat-generating electronic components.

[0020] In one embodiment of the present invention, the recessed spaces have the same or different shapes and volumes, and simultaneously accommodate a plurality of the heat-generating electronic components of the same or different shapes and volumes.

[0021] In one embodiment of the present invention, the heat-absorbing outer surface of the metal lower cover plate of the liquid-cooled heat sink further has at least one screw hole for fixing at least one heat-generating electronic component, and the screw hole is recessed from the heat-absorbing outer surface toward the evaporative inner surface and protrudes from the evaporative inner surface but does not penetrate therethrough to form a screw hole protrusion, and the height of the screw hole protrusion is equal to or less than the height of the column-shaped support structure.

[0022] In one embodiment of the present invention, in the liquid-cooled heat dissipation system, the number of the liquid-cooled vapor chambers is, for example, two, three, or four, and the first refrigerant pipe and the second refrigerant pipe are branch pipes having a number of branches corresponding to the number of the liquid-cooled vapor chambers, and the refrigerant circulator is a refrigerant distributor.

[0023] In one embodiment of the present invention, in the liquid-cooled heat dissipation system, the liquid-cooled cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation base plate, and the heat dissipation outer cover are made of copper, aluminum, an aluminum alloy, or a magnesium alloy.

[0024] In one embodiment of the present invention, in the liquid-cooled heat dissipation system, the working fluid is water.

[0025] In one embodiment of the present invention, in the liquid-cooled heat sink, a plurality of second liquid supply ports and a plurality of second liquid drain ports are provided on the outer cover side wall.

[0026] In one embodiment of the present invention, the liquid-cooled heat sink has two, three or four second liquid supply ports and two, three or four second liquid drain ports provided on the outer cover side wall.

[0027] In one embodiment of the present invention, the liquid-cooled heat sink has a plate-like structure with a length of 250 to 600 mm, a width of 150 to 450 mm, and a thickness of 10 to 30 mm.

[0028] In one embodiment of the present invention, the cooling liquid is water.

[0029] In one embodiment of the present invention, the cooling liquid is water and has a volume of about 1 to 6 liters. [Effects of the Invention]

[0030] The liquid-cooled heat dissipation system provided by the present invention is a highly efficient liquid-cooled heat dissipation system that can be applied to standalone AI computers, and has the following advantages over air-cooled heat dissipation: (1) High heat dissipation efficiency: Liquid coolants can quickly absorb and transport large amounts of heat, and have better cooling performance than traditional air-cooled heat dissipation. (2) Low noise: Compared with air-cooled systems equipped with high-speed cooling fans, liquid-cooled systems generally dissipate heat quietly, helping to create a low-noise working environment. (3) Reduced energy consumption: Liquid cooling can reduce the temperature of operating system equipment more effectively than air cooling, allowing the equipment to operate at a lower temperature and improving energy efficiency. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a structural explanatory diagram of an embodiment of a liquid-cooling heat dissipation system of the present invention; [Figure 2] 1 is a structural explanatory diagram of a liquid-cooled vapor chamber of a first embodiment of the liquid-cooled heat dissipation system of the present invention; FIG. [Figure 3] 1 is a structural cross-sectional view of a liquid-cooled vapor chamber of a first embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 4] 1 is a structural explanatory diagram of the metal upper cover plate of the liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 5] 1 is a structural explanatory diagram of the metal lower cover plate of the liquid-cooled vapor chamber of the first embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 6A] 10 is a structural explanatory diagram of the metal lower cover plate of the liquid-cooled vapor chamber of the second embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 6B] FIG. 10 is a structural cross-sectional view of the metal lower cover plate of the liquid-cooled vapor chamber of the second embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 7A] 10 is a structural explanatory diagram of the metal lower cover plate of the liquid-cooled vapor chamber of the third embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 7B] FIG. 10 is a structural cross-sectional view of the metal lower cover plate of the liquid-cooled vapor chamber of the third embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 8A] 10 is a structural explanatory diagram of the metal lower cover plate of the liquid-cooled vapor chamber of the fourth embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 8B] FIG. 10 is a structural cross-sectional view of the metal lower cover plate of the liquid-cooled vapor chamber of the fourth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 9A] 10 is a structural explanatory diagram of the metal lower cover plate of the liquid-cooled vapor chamber of the fifth embodiment of the liquid-cooled heat dissipation system of the present invention. FIG. [Figure 9B] FIG. 10 is a structural cross-sectional view of the metal lower cover plate of the liquid-cooled vapor chamber of the fifth embodiment of the liquid-cooled heat dissipation system of the present invention. [Figure 10] 1 is a structural explanatory diagram of a liquid-cooled heat dissipation plate according to an embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 11] 1A and 1B are a top view and a side view of the structure of a heat dissipation base plate of a liquid-cooled heat dissipation plate of an embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 12] 1 is a structural explanatory diagram of a heat dissipation outer cover of a liquid-cooled heat dissipation plate according to an embodiment of the liquid-cooled heat dissipation system of the present invention; [Figure 13] FIG. 4 is a structural diagram illustrating another embodiment of the liquid-cooling heat dissipation system of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, embodiments of the liquid-cooled heat dissipation system of the present invention will be described with reference to the accompanying drawings. However, for clarity and convenience of the drawings, the size and proportions of each component in the drawings may be exaggerated or reduced. In the following description and / or claims, technical terms used should be interpreted in the conventional sense commonly used by those skilled in the art. For ease of understanding, the same components in the following embodiments will be denoted and described with the same reference numerals. As used herein, the term "about" generally means that an actual numerical value is within ±10%, 5%, 1%, or 0.5% of a particular value or range. The term "about" used herein means that the actual numerical value falls within an acceptable standard error of the mean, as determined by the understanding of those skilled in the art. Except in the embodiments, or unless otherwise specified, ranges, quantities, values, and percentages used herein can be understood to be modified by "about." Therefore, unless otherwise specified, numerical values ​​or parameters disclosed in this specification and the appended claims are approximate and may be changed as necessary.

[0033] 1 is a structural diagram of one embodiment of a liquid-cooled heat dissipation system 10 of the present invention. In this embodiment, the liquid-cooled heat dissipation system 10 includes at least one liquid-cooled vapor chamber 100, a liquid-cooled heat sink 200, at least one first refrigerant line 300, at least one second refrigerant line 400, a refrigerant circulator 500, at least one fan 600, and a refrigerant 700.

[0034] Below, six exemplary embodiments are listed, and the difference between the first to fifth embodiments lies in the different structural aspects of the liquid-cooled vapor chamber 100, and the sixth embodiment is another embodiment of the liquid-cooled heat dissipation system.

[0035] First embodiment Please refer to Figures 2 to 5 at the same time. Figure 2 is a structural explanatory diagram of the liquid-cooled heat dissipation system 10 of the present invention and the liquid-cooled vapor chamber 100 described in the first embodiment. Figure 3 is a structural cross-sectional view of the liquid-cooled vapor chamber 100 of Figure 2. Figure 4 is a structural explanatory diagram of the metal upper cover plate 120 of the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Figure 5 is a structural explanatory diagram of the metal lower cover plate 130 of the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention. The liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention includes a liquid-cooled cover 110, a metal upper cover plate 120, a metal lower cover plate 130, an intake channel 140, a capillary structure 150, and a working fluid 160. The liquid cooling cover 110 includes an upper portion 1101 and a side wall 1102 connected to the upper portion 1101, the side wall 1102 surrounding the upper portion 1101 to form a first storage space 1103, the side wall 1102 having at least one first liquid supply port 1104 and at least one first liquid drain port 1105, the first liquid supply port 1104 and the first liquid drain port 1105 being connected to the first storage space 1103. The metal top cover plate 120 includes a heat-dissipating outer surface 1201 and a condensing inner surface 1202. The heat-dissipating outer surface 1201 has a plurality of first heat-dissipating columns 1203. An upper frame 1204 of an appropriate height is provided around the condensing inner surface 1202, and the upper frame 1204 is provided with upper flow grooves 1205. The condensing inner surface 1202 has a plurality of upper grooves 1206 arranged parallel to each other. Here, the entire metal top cover plate 120, including the first heat-dissipating columns 1203, is integrally formed from a metal sheet (or metal block). The metal bottom cover plate 130 includes a heat-absorbing outer surface 1301 and an evaporating inner surface 1302. The heat-absorbing outer surface 1301 is used for contact with heat-generating electronic components (not shown), and a lower frame 1303 of appropriate height is provided around the periphery of the evaporation inner surface 1302, which is provided with a lower flow path groove 1304. The evaporation inner surface 1302 has a plurality of lower grooves 1305 arranged parallel to each other and a plurality of column-shaped support structures 1306 protruding between the lower grooves 1305, and the entire metal lower cover plate 130 including the column-shaped support structures 1306 is integrally formed from a metal sheet (or metal block).The upper frame 1204 of the metal top cover plate 120 and the lower frame 1303 of the metal bottom cover plate 130 are joined to form a working space 1307. The columnar support structure 1306 protrudes from the evaporating inner surface 1302 and abuts between the upper grooves 1206 of the condensing inner surface 1202 to support the working space 1307. The intake channel 140 is formed by joining the upper flow groove 1205 and the lower flow groove 1304, and draws air into the working space 1307 and seals it after the intake, maintaining a near-vacuum state in the working space 1307. The capillary structure 150 is installed in the lower groove 1305 or in the upper groove 1206 and the lower groove 1305. A working fluid 160 is present in the working space 1307 and the capillary structure 150.

[0036] Please refer to Figures 10 to 12. Figure 10 is a structural explanatory diagram of a liquid-cooled heat dissipation plate 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Figure 11 is a structural top view and a side view of the heat dissipation base plate 210 of the liquid-cooled heat dissipation plate 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. Figure 12 is a structural explanatory diagram of the heat dissipation outer lid 220 of the liquid-cooled heat dissipation plate 200 described in one embodiment of the liquid-cooled heat dissipation system 10 of the present invention. The liquid-cooled heat dissipation plate 200 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention includes a heat dissipation base plate 210 and a heat dissipation outer lid 220. First, please refer to Figures 10 and 11. The heat dissipation base plate 210 has a base plate inner surface 2101 and an opposing base plate outer surface 2102. The base plate inner surface 2101 is provided with a plurality of protruding second heat dissipation columns 2103 arranged in a matrix, at least one elongated groove-shaped flow guide plate groove 2104 protruding from the base plate inner surface 2101 and disposed between the plurality of second heat dissipation columns 2103 for receiving at least one elongated sheet-shaped flow guide plate 2105, and an outer lid connecting groove 2106 protruding from and surrounding the periphery of the base plate outer surface 2102. The base plate outer surface 2102 is provided with a plurality of fan screw holes 2107 protruding from the base plate outer surface 2102 and for fixing at least one fan 600 that blows air onto the base plate outer surface 2102 to cool it. The entire heat dissipation base plate 210 including the plurality of second heat dissipation columns 2103, the flow guide plate groove 2104, the outer lid connecting groove 2106, and the fan screw hole 2107 are integrally formed from the same metal sheet (or metal block). In this embodiment, the number of the flow guide plate grooves 2104 can be set according to the needs of actual application, for example, 1, 2, 3, 4, 5, 6, 7, or 8, and a corresponding number of long sheet-shaped flow guide plates 2105 are combined. For example, the number of flow guide plate grooves 2104 shown in Figures 10 and 11 is five, and five long sheet-shaped flow guide plates 2105 are combined, each inserted into one of the five flow guide plate grooves 2104.

[0037] 10 and 12 , in this embodiment, the heat-dissipating outer cover 220 has an outer cover upper portion 2201 and an outer cover side wall 2202 connected to the outer cover upper portion 2201. The outer cover side wall 2202 surrounds the outer cover upper portion 2201 to form a second receiving space 2203. The outer cover side wall 2202 is provided with at least one second liquid supply port 2204 and at least one second liquid drain port 2205, and the second liquid supply port 2204 and the second liquid drain port 2205 are connected to the second receiving space 2203. When the heat-dissipating outer cover 220 and the heat-dissipating base plate 210 are closed together, the outer cover side wall 2202 of the heat-dissipating outer cover 220 is inserted into and welded to the outer cover joining groove 2106 of the heat-dissipating base plate 210, and the plurality of second heat-dissipating columns 2103 are disposed in the second receiving space 2203 to form the liquid-cooled heat-dissipating plate 200. In this embodiment, the number of second liquid supply ports 2204 and second liquid drain ports 2205 can be set according to the requirements of actual applications, and may be, for example, 1, 2, 3, 4, 5, or 6. Increasing the number of second liquid supply ports 2204 and second liquid drain ports 2205 not only increases the number of connected liquid-cooled vapor chambers 100, but also increases the flow of cooling liquid 700 entering and exiting the liquid-cooled heat sink 200 through the branch pipe, thereby improving heat dissipation efficiency.

[0038] Referring again to Figure 1, in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, one end of the first liquid refrigerant conduit 300 is connected to the first liquid inlet 1104 of the liquid-cooled vapor chamber 100 and the other end is connected to the second liquid outlet 2205 of the liquid-cooled heat sink 200. The second liquid refrigerant conduit 400 is connected to the first liquid outlet 1105 of the liquid-cooled vapor chamber 100 and the other end is connected to the second liquid inlet 2204 of the liquid-cooled heat sink 200. The liquid refrigerant circulator 500 is installed between the first liquid refrigerant conduit 300 or the second liquid refrigerant conduit 400 and pumps the liquid refrigerant 700 to circulate the liquid refrigerant 700 between the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200, thereby forming the liquid-cooled heat dissipation system 10 of the present invention.

[0039] In the liquid-cooled vapor chamber 100 described in the first embodiment of the liquid-cooled heat dissipation system 10 of the present invention, the heat-absorbing outer surface 1301 of the metal lower cover plate 130 is a flat surface for contacting the heat-generating electronic components.

[0040] Second embodiment 6A and 6B. These figures show a structural diagram and a cross-sectional view of the metal bottom cover plate 131 of the liquid-cooled vapor chamber 100 described in the second embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the second embodiment differs from the first embodiment in that the heat-absorbing outer surface 1311 of the metal bottom cover plate 131 further has at least one recessed space 1313 for accommodating at least one heat-generating electronic component. The recessed space 1313 is recessed from the heat-absorbing outer surface 1311 toward the evaporative inner surface 1312 but does not protrude into the corresponding evaporative inner surface 1312. In this embodiment, the thickness of the liquid-cooled vapor chamber 100 from the heat-dissipating outer surface 1201 (excluding the first heat-dissipating column 1203) to the heat-absorbing outer surface 1311 does not exceed 6 mm. In other embodiments, the thickness is 5 mm or less, 4 mm or less, or 3.5 mm or less. In this embodiment, the shape and volume of the recessed space 1313 located on the heat-absorbing outer surface 1311 of the metal bottom cover plate 131 are determined by the shape and volume of the heat-generating electronic component to be attached. This design of the recessed space 1313 has the following advantages: (1) The heat-generating electronic component can be accommodated (or partially accommodated) in the recessed space 1313, resulting in closer contact between the heat-generating electronic component and the liquid-cooled vapor chamber 100 and a larger contact area (lateral contact area), improving heat dissipation efficiency; and (2) The heat-generating electronic component can be accommodated in the recessed space 1313, reducing the overall thickness during application.

[0041] Third embodiment 7A and 7B. These figures show a structural diagram and a cross-sectional view of the metal bottom cover plate 132 of the liquid-cooled vapor chamber 100 described in the third embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the third embodiment differs from the first embodiment in that the heat-absorbing outer surface 1321 of the metal bottom cover plate 132 further has a plurality of recessed spaces 1323 for accommodating a plurality of heat-generating electronic components. The recessed spaces 1323 are recessed from the heat-absorbing outer surface 1321 toward the evaporative inner surface 1322 but do not protrude into the corresponding evaporative inner surface 1322. In this embodiment, the thickness of the liquid-cooled vapor chamber 100 from the heat-dissipating outer surface 1201 (excluding the first heat dissipation column 1203) to the heat-absorbing outer surface 1321 does not exceed 6 mm. In other embodiments, the thickness is 5 mm or less, 4 mm or less, or 3.5 mm or less. To explain further, as shown in the figure, in this embodiment, the purpose of providing the multiple recessed spaces 1323 on the heat-absorbing outer surface 1321 of the metal bottom cover plate 132 is to accommodate small chip package (chiplet) products, which are becoming mainstream in the market. A small chip package integrates several to several dozen small chips of the same or different functions, sizes, and volumes into one using packaging technology. However, when several to several dozen chips are packaged in the same small space, the connection lines between them are very short, the operating frequency is higher, and the generated heat and heat density are also higher, resulting in greater heat dissipation problems. The multiple recessed spaces 1323 designed in the metal bottom cover plate of this embodiment can be designed according to the overall size, shape, and overall volume of the packaged small chips, allowing the small chips to be more closely packed and accommodated in the multiple recessed spaces 1323. The rapid lateral heat diffusion and high heat dissipation efficiency of the liquid-cooled vapor chamber 100, combined with the high heat exchange efficiency of the first heat dissipation column 1203 and the cooling liquid 700, can more effectively solve the heat dissipation problem of small chips. Based on the above, in this embodiment, the multiple recessed spaces 1323 can have the same or different shapes and volumes to simultaneously accommodate multiple heat-generating electronic components of the same or different shapes and volumes, as shown in Figure 7A.

[0042] Fourth embodiment 8A and 8B, which are a structural explanatory diagram and a structural cross-sectional view of the metal bottom cover plate 133 of the liquid-cooled vapor chamber 100 described in the fourth embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figures, the fourth embodiment differs from the first embodiment in that the heat-absorbing outer surface 1331 of the metal bottom cover plate 133 further includes at least one screw hole 1333 for fixing at least one heat-generating electronic component. The screw hole 1333 is recessed from the heat-absorbing outer surface 1331 toward the evaporation inner surface 1332 and protrudes from but does not penetrate the evaporation inner surface 1332, forming a screw hole protrusion 1334. The height of the screw hole protrusion 1334 is equal to or less than the height of the columnar support structure 1306. To further explain, in order to bring the chip into closer contact with the metal lower cover plate 133 of the liquid-cooled vapor chamber 100, in this embodiment, at least one screw hole 1333 is installed on the heat-absorbing outer surface 1331 of the metal lower cover plate 133, so that the chip (heat-generating electronic component) can be fixed to the heat-absorbing outer surface 1331. This allows the chip to be bonded to the heat-absorbing outer surface 1331 without using thermal paste, avoiding heterogeneous interfaces with low thermal conductivity and improving heat dissipation efficiency.

[0043] Fifth embodiment 9A and 9B. FIG. 9 shows a structural diagram and a cross-sectional view of the metal bottom cover plate 134 of the liquid-cooled vapor chamber 100 described in the fifth embodiment of the liquid-cooled heat dissipation system 10 of the present invention. As shown in the figure, the fifth embodiment differs from the first embodiment in that the metal bottom cover plate 134 further includes a plurality of screw holes 1343 on the heat-absorbing outer surface 1341 for locking heat-generating electronic components. Each of the screw holes 1343 is recessed from the heat-absorbing outer surface 1341 to the evaporation inner surface 1342 and protrudes from but does not penetrate the evaporation inner surface 1342, forming a plurality of screw hole protrusions 1344. The height of each of the screw hole protrusions 1344 is equal to or less than the height of the columnar support structure 1306. The number of screw holes 1343 can be determined according to the actual application, and may be, for example, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, or 12. As shown in FIG. 9A, in this embodiment, the number of the plurality of screw holes 1343 is 10, and 10 heat-generating electronic components can be fixed.

[0044] Sixth embodiment 13 is a structural diagram of another embodiment of the liquid-cooled heat dissipation system 20 of the present invention. In this embodiment, as shown in FIG. 13, the liquid-cooled heat dissipation system 20 includes four liquid-cooled vapor chambers 100, a liquid-cooled heat dissipation plate 201 having four second liquid inlet ports 2214 and four second liquid outlet ports 2215, a first liquid refrigerant pipe 301 which is a branch pipe having four branches, a second liquid refrigerant pipe 401 which is a branch pipe having four branches, a liquid circulator 500 (or liquid refrigerant distribution unit, CDU), four fans 600, a base plate outer surface 2102 of a heat dissipation base plate 210 fixed to the liquid-cooled heat dissipation plate 201 via fan screw holes 2107, and a liquid refrigerant 700. The first liquid supply ports 1104 of the four liquid-cooled vapor chambers 100 are connected to the four second liquid drain ports 2215 of the liquid-cooled heat sink 200 via a first liquid refrigerant pipe 301 of a branch pipe having four branches, and the first liquid drain ports 1105 of the four liquid-cooled vapor chambers 100 are connected to the four second liquid supply ports 2214 of the liquid-cooled heat sink 200 via a second liquid refrigerant pipe 401 of a branch pipe having four branches. In this embodiment, the liquid circulator 500 is installed to connect the second liquid drain ports 2215 of the liquid-cooled heat sink 201 and the first liquid supply ports 1104 of the liquid-cooled vapor chambers 100, i.e., is installed by being inserted between the first liquid refrigerant pipes 301. The refrigerant liquid 700 is pumped through the refrigerant circulator 500 (or refrigerant distribution unit, CDU) and flows into the first accommodating space 1103 of each liquid-cooled vapor chamber 100 to exchange heat. After absorbing heat, the refrigerant liquid 700 flows out of the first accommodating space 1103 and into the second accommodating space 2203 of the liquid-cooled heat sink 201 through the second refrigerant pipe 401. As the refrigerant liquid 700 flows into the liquid-cooled heat sink 200, it is simultaneously forced to cool by the fans 600, thereby cooling the liquid-cooled heat sink 201 and the refrigerant liquid 700.

[0045] 13, the liquid-cooled vapor chambers 100 may have the same or different structures or sizes. For example, they may be liquid-cooled vapor chambers 100 having any of the metal lower cover plates (130, 131, 132, 133, 134) as in the first to fifth embodiments. Each liquid-cooled vapor chamber 100 may be simultaneously applied to the same or different chipsets or heat-generating electronic components. Since the amount of heat absorbed by each liquid-cooled vapor chamber 100 may differ, the flow rate of the cooling liquid 700 required for cooling may also differ. The cooling liquid circulator 500 (CDU) adjusts the flow rate of the cooling liquid 700 flowing into each liquid-cooled vapor chamber 100 according to the actual temperature conditions of each liquid-cooled vapor chamber 100, thereby enabling more accurate temperature control of the chipset or heat-generating electronic component. The number of liquid-cooled vapor chambers 100 used in this embodiment is two, three, or four, and the first refrigerant pipe 301 and the second refrigerant pipe 401 are branch pipes having branch pipes corresponding to the number of liquid-cooled vapor chambers 100, and the refrigerant circulator 500 is a refrigerant distribution unit (CDU).

[0046] In addition, depending on the application of the branch pipe, the number of liquid-cooled vapor chambers 100 and the number of second liquid supply ports 2214 and second liquid drain ports 2215 of the liquid-cooled heat sink 201 may be the same or different.

[0047] In one embodiment of the present invention, in the liquid-cooled heat dissipation system 10 (20), the materials of the liquid-cooled cover 110, the metal upper cover plate 120, the metal lower cover plate (130, 131, 132, 133, 134), the heat dissipation base plate 210, and the heat dissipation outer cover 220, 221 are copper, aluminum, aluminum alloy, or magnesium alloy.

[0048] In one optional embodiment of the present invention, the working fluid 160 is water.

[0049] In one embodiment of the present invention, the liquid-cooled heat sink 201 has a plurality of second liquid supply ports 2214 and a plurality of second liquid drain ports 2215 provided on the outer cover side wall 2202 .

[0050] In the above embodiment, the number of second liquid supply ports 2214 and second liquid drain ports 2215 provided in the outer cover side wall 2202 of the liquid-cooled heat sink 200 is two, three, or four, respectively.

[0051] In one embodiment of the present invention, the liquid-cooled heat sink 200 has a plate-like structure with a length of 250 to 600 mm, a width of 150 to 450 mm, and a thickness of 10 to 30 mm.

[0052] In one embodiment of the present invention, the refrigerant 700 in the liquid-cooled heat dissipation system 10 (20) is water. In another embodiment, the refrigerant 700 in the liquid-cooled heat dissipation system 10 (20) is water, particularly softened water, to prevent scale formation after long-term use. In another embodiment, the refrigerant in the liquid-cooled heat dissipation system 10 (20) may contain an antifreeze (e.g., ethylene glycol) depending on the actual application situation, to prevent the refrigerant from freezing and becoming inoperable when the ambient temperature is below 0 degrees Celsius.

[0053] In one embodiment of the present invention, the cooling liquid 700 in the liquid-cooled heat dissipation system 10 (20) is water, and its volume is approximately 1 to 6 liters. In the liquid-cooled heat dissipation system 10 (20) described in the present invention, the size and volume of the liquid-cooled heat dissipation plate 200, the number and size of the second liquid inlet 2214 and second liquid outlet 2215, the number of flow guide plate grooves 2104 and long sheet-shaped flow guide plates 2105, etc. can be designed according to the actual application situation, depending on the amount of heat generated by the heat-generating electronic components that need to be cooled, and the required volume of the cooling liquid 700 will also vary accordingly. The larger the volume of the cooling liquid 700 used, the more heat can be absorbed.

[0054] It should be noted that the structures of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 disclosed in any of the above embodiments of the liquid-cooled heat sink systems 10 and 20 of the present invention are merely examples and do not limit the scope of the liquid-cooled heat sink systems 10 and 20 of the present invention. After considering each embodiment of the present invention, those skilled in the art can determine the number, position, size, shape, and structure of the liquid-cooled vapor chamber 100 and the liquid-cooled heat sink 200 according to the actual application situation to achieve the desired heat dissipation effect.

[0055] The above embodiments are merely for illustrative purposes and do not limit the scope of the present invention. Any equivalent modifications or variations based on the liquid-cooled heat dissipation systems 10 and 20 of the above embodiments should fall within the scope of protection of the present invention.

[0056] 2024 is being called the first year of AI computers (AIPC), and most in the industry believe that generative AI will need to run on both commercial and consumer computers, marking a key turning point for generative AI moving from the cloud to the edge. The enormous computing power of AI chip modules leads to ever-increasing power consumption and the generation of large amounts of heat, necessitating the use of more efficient heat dissipation modules to help cool them. With the constant upgrading of AI chip modules, the requirements for heat dissipation modules are also increasing.

[0057] AI computers can be considered an upgraded version of traditional computers, but most of the CPUs or GPUs in current computers use air-cooled radiators or are configured in the form of AI servers, with cabinets equipped with liquid-cooled radiator modules to enhance heat dissipation efficiency. The liquid-cooled radiator system provided by the present invention is a highly efficient liquid-cooled radiator system applicable to standalone AI computers, and has the following advantages over air-cooled radiators: (1) High heat dissipation efficiency: Liquid coolants can quickly absorb and transport large amounts of heat, and have better cooling performance than traditional air-cooled heat dissipation. (2) Low noise: Compared with air-cooled systems equipped with high-speed cooling fans, liquid-cooled systems generally dissipate heat quietly, helping to create a low-noise working environment. (3) Reduced energy consumption: Liquid cooling can reduce the temperature of operating system equipment more effectively than air cooling, allowing the equipment to operate at a lower temperature and improving energy efficiency.

[0058] It is clear that the present invention breaks through the prior art and achieves the desired effect. Its inventive step and practicality would not be easily recognized by a person skilled in the art. It is therefore believed to meet the requirements of the patent claim. In accordance with the law, we are filing an application. In order to promote invention, we request your approval of the patent application for the present invention.

[0059] The above is merely illustrative and not limiting. Any equivalent modifications or variations made without departing from the spirit and scope of the present invention should be included in the scope of the following claims. [Explanation of symbols]

[0060] 10 Liquid cooling heat dissipation system 20 Liquid cooling heat dissipation system 100 Liquid-cooled vapor chamber 110 Liquid cooling cover 1101 Upper 1102 Side wall 1103 First Containment Space 1104 1st liquid supply port 1105 First drain outlet 120 Metal top cover plate 1201 Heat dissipation outer surface 1202 Condensation inner surface 1203 First heat dissipation column 1204 Upper frame 1205 Upper flow channel 1206 Upper groove 130 Metal lower cover plate 131 Metal lower cover plate 132 Metal lower cover plate 133 Metal lower cover plate 134 Metal lower cover plate 1301 Endothermic outer surface 1311 Endothermic outer surface 1321 Endothermic outer surface 1331 Endothermic outer surface 1341 Endothermic outer surface 1302 Evaporation inner surface 1312 Evaporation inner surface 1322 Evaporation inner surface 1332 Evaporation inner surface 1342 Evaporation inner surface 1303 Bottom frame 1304 Lower flow channel 1305 Lower groove 1306 Column-shaped support structure 1307 Working Space 1313 Recessed Space 1323 Recessed Space 1333 screw hole 1343 screw hole 1334 Screw hole protrusion 1344 Screw hole protrusion 140 Intake Channel 150 Capillary structure 160 Working Fluid 200 Liquid-cooled heat sink 201 Liquid-cooled heat sink 210 Heat dissipation base plate 2101 Inner surface of base plate 2102 Outer surface of base plate 2103 Second heat dissipation column 2104 Guide plate groove 2105 Long sheet-shaped flow guide plate 2106 Outer cover joint groove 2107 Fan screw hole 220 Heat-dissipating outer cover 221 Heat-dissipating outer cover 2201 Upper outer lid 2202 Outer lid side wall 2212 Outer lid side wall 2203 Second Containment Space 2204 2nd liquid supply port 2214 2nd liquid supply port 2205 Second drain outlet 2215 2nd drain port 300 1st coolant line 301 1st coolant line 400 2nd coolant line 401 Second coolant line 500 Coolant Circulator 600 ファン 700 Cooling Liquid

Claims

1. The cooling system includes at least one liquid-cooled vapor chamber, a liquid-cooled heat sink, at least one first cooling liquid line, at least one second cooling liquid line, a cooling liquid circulator, at least one fan, and a cooling liquid; The liquid-cooled vapor chamber is a liquid cooling cover including an upper portion and a sidewall connected to the upper portion, the sidewall surrounding the upper portion to form a first accommodation space, the sidewall being provided with at least one first liquid supply port and at least one first liquid drain port, the first liquid supply port and the first liquid drain port being in communication with the first accommodation space; a metal upper cover plate including a heat-dissipating outer surface and a condensing inner surface, the heat-dissipating outer surface having a plurality of first heat-dissipating columns, and an upper frame having an appropriate height surrounding the condensing inner surface is provided around the periphery of the condensing inner surface, the upper frame is provided with an upper flow channel groove, the condensing inner surface has a plurality of upper grooves arranged parallel to each other, and the entire structure including the first heat-dissipating columns is integrally formed from a metal sheet / block; the heat-absorbing outer surface is used for contacting heat-generating electronic components; a lower frame of an appropriate height is provided around the periphery of the evaporative inner surface, surrounding the evaporative inner surface; a lower flow channel is provided in the lower frame; the evaporative inner surface has a plurality of parallel-arranged lower grooves and a plurality of columnar support structures protruding between the lower grooves; the entire assembly including the columnar support structures is integrally formed by a metal sheet / block; the lower frame is joined to the upper frame of the metal upper cover plate to form a working space; and the columnar support structures protrude and extend from the evaporative inner surface and are connected between the upper grooves of the condensing inner surface, forming a metal lower cover plate to support the working space; an intake channel configured by joining the upper flow channel and the lower flow channel corresponding to each other, which draws air into the working space and seals it after the intake, thereby maintaining a vacuum state in the working space; a capillary structure disposed in the lower groove or in the upper groove and the lower groove; a working fluid present in the working space and the capillary structure; Including, the liquid-cooled cover is coupled to the heat-dissipating outer surface of the metal top cover plate, and the first heat-dissipating column is disposed in the first accommodating space to form the liquid-cooled vapor chamber; The liquid-cooled heat sink is a heat dissipation base plate having an inner base plate surface and an opposing outer base plate surface, the inner base plate surface being provided with a plurality of second heat dissipation columns that protrude and are arranged in a substantially matrix pattern, at least one elongated groove-shaped flow guide plate groove that protrudes from the inner base plate surface and is disposed between the plurality of second heat dissipation columns, and is used to attach at least one elongated sheet-shaped flow guide plate, and an outer lid connecting groove that protrudes and is provided around the periphery of the inner base plate surface, the outer base plate surface being provided with a plurality of fan screw holes that protrude from the outer base plate surface and are used to fix at least one fan and provide air cooling to the outer base plate surface, and the entire heat dissipation base plate is formed by integrally molding the plurality of second heat dissipation columns, the flow guide plate groove, the outer lid connecting groove, and the fan screw hole from the same metal sheet / block; a heat-dissipating outer lid having an outer lid sidewall connected to an outer lid upper portion and the bottom lid upper portion, the outer lid sidewall surrounding the outer lid upper portion to form a second storage space, and at least one second liquid supply port and at least one second liquid drain port provided therein, the second liquid supply port and the second liquid drain port communicating with the second storage space; Including, When the heat-dissipating outer cover and the heat-dissipating base plate are fitted together, the outer cover side wall of the heat-dissipating outer cover can be inserted into the outer cover joining groove of the heat-dissipating base plate and welded together, and the plurality of second heat-dissipating columns are installed in the second receiving space to form the liquid-cooled heat-dissipating plate; the first coolant pipe has one end connected to the first coolant supply port of the liquid-cooled vapor chamber and the other end connected to the second coolant discharge port of the liquid-cooled heat sink; the second coolant pipe has one end connected to the first coolant discharge port of the liquid-cooled vapor chamber and the other end connected to the second coolant supply port of the liquid-cooled heat sink; the coolant circulator is installed between the first coolant pipes or the second coolant pipes, and pumps the coolant to circulate and flow between the liquid-cooled vapor chamber and the liquid-cooled heat sink, forming a liquid-cooled heat sink system.

2. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the heat-absorbing outer surface of the metal bottom cover plate is a flat surface that contacts the heat-generating electronic components.

3. 2. The liquid-cooled heat dissipation system of claim 1, wherein the heat-absorbing outer surface of the metal bottom cover plate further has at least one recessed space for accommodating at least one of the heat-generating electronic components, and the recessed space is recessed in a direction from the heat-absorbing outer surface toward the evaporative inner surface but does not protrude from the corresponding evaporative inner surface.

4. The liquid-cooling type heat dissipation system according to claim 3 , wherein the recessed spaces are plural and accommodate plural heat-generating electronic components.

5. The liquid-cooled heat dissipation system according to claim 4 , wherein each of the recessed spaces has the same or different shape and volume, and simultaneously accommodates a plurality of heat-generating electronic components of the same or different shapes and volumes.

6. 2. The liquid-cooled heat dissipation system of claim 1, wherein the heat-absorbing outer surface of the metal bottom cover plate further has at least one screw hole for fixing at least one of the heat-generating electronic components, the screw hole being recessed from the heat-absorbing outer surface toward the evaporative inner surface and protruding from the evaporative inner surface but not penetrating it, forming a screw hole protrusion, and the height of the screw hole protrusion is equal to or less than the height of the column-shaped support structure.

7. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the number of the liquid-cooled vapor chambers is two, three, or four, the first liquid refrigerant line and the second liquid refrigerant line are branch pipes having a number of branches corresponding to the number of the liquid-cooled vapor chambers, and the liquid refrigerant circulator is a refrigerant distributor.

8. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the liquid-cooled cover, the metal upper cover plate, the metal lower cover plate, the heat dissipation base plate, and the heat dissipation outer cover are made of copper, aluminum, an aluminum alloy, or a magnesium alloy.

9. The liquid-cooled heat dissipation system according to claim 1 , wherein the working fluid is water.

10. The liquid-cooling type heat dissipation system according to claim 1 , wherein a plurality of the second liquid supply ports and a plurality of the second liquid drain ports are provided on the outer lid side wall.

11. The liquid-cooling type heat dissipation system according to claim 10 , wherein the number of the second liquid supply ports and the number of the second liquid drain ports are two, three, or four, respectively.

12. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the liquid-cooled heat dissipation plate has a plate-like structure with a length of 250 to 600 mm, a width of 150 to 450 mm, and a thickness of 10 to 30 mm.

13. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the cooling liquid is water.

14. 2. The liquid-cooled heat dissipation system according to claim 1, wherein the cooling liquid is water and has a volume of about 1 to 6 liters.

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