Light emitting device

Abstract

To provide a light emitting device that can be miniaturized, and a miniaturized light emitting device with safety ensured.SOLUTION: A light emitting device includes: a package including a base portion, a frame portion, and a cover portion; a light emitting element disposed on an upper surface of the base portion, surrounded by the frame portion, and configured to emit light traveling laterally; and a wavelength conversion member disposed on the base portion and including a first lateral surface, on which light emitted from the light emitting element is to be incident, and an upper surface through which light is to be emitted. The frame portion includes a light shielding portion configured to shield the light emitted from the light emitting element. The cover portion includes a light-transmissive portion configured to transmit the light emitted from the upper surface of the wavelength conversion member to emit it to an outside. The light shielding portion is located on an extending line of an optical path for the light emitted most upwardly from the light emission surface to be incident on the wavelength conversion member. The light-transmissive portion is not disposed on a line segment on the extending line of the optical path for the light regarding a main portion emitted most upwardly from the light emission surface to be incident on the wavelength conversion member, the line segment in front of the intersection between the extending line and the light shielding portion.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a light emitting device in which light emitted from a plurality of semiconductor laser elements is reflected by a light reflecting member and made incident on a light transmitting section, and the light incident on the light transmitting section is converted into light of a different wavelength by the light transmitting section and emitted to the outside.

[0003] Furthermore, in consideration of safety, this light-emitting device has safety measures in place in case of an abnormality such as a crack in the light-transmitting portion. Specifically, the light-transmitting portion is surrounded by a conductive film, and a sensor is installed that detects an abnormality in the light-transmitting portion by detecting a change in the electrical connection state that occurs in the conductive film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2020-144363 Summary of the Invention [Problem to be solved by the invention]

[0005] The more components (parts) that make up a light-emitting device, the larger the device tends to be. Furthermore, the pursuit of higher performance and multi-functionality, such as higher output and safety measures, also tends to increase the number of required components. Despite these circumstances, there is a need to miniaturize devices while maintaining a balance with functionality. [Means for solving the problem]

[0006] A light emitting device according to an embodiment of the present disclosure includes a package having a base, a frame, and a lid; a light emitting element disposed on an upper surface of the base, surrounded by the frame, and emitting light traveling laterally; and a wavelength converting member disposed on the base, having a first side surface onto which light emitted from a light emitting surface of the light emitting element is incident, and an upper surface from which light is emitted, wherein the frame has a light blocking portion that blocks light in the same wavelength range as the light emitted from the light emitting element, and the lid is configured to block light emitted from the upper surface of the wavelength converting member. the light-shielding portion is disposed on an extension of the optical path of the main portion of light emitted from the light-emitting surface from the point where it is emitted most upward from the light-emitting surface to the point where it is incident on the wavelength conversion member, and the light-transmitting portion is disposed on an extension of the optical path of the main portion of light from the point where it is emitted most upward from the light-emitting surface to the point where it is incident on the wavelength conversion member, but is not disposed on a line segment before where the extension intersects with the light-shielding portion. [Effects of the Invention]

[0007] According to an embodiment of the present disclosure, it is possible to provide a light emitting device that can be miniaturized. Furthermore, according to an embodiment of the present disclosure, it is possible to achieve miniaturization in a light emitting device that ensures safety. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a perspective view illustrating a light emitting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view illustrating the internal structure of the light emitting device according to the embodiment. [Figure 3] FIG. 2 is a top view illustrating the internal structure of the light emitting device according to the embodiment. [Figure 4] 4 is a cross-sectional view taken along line IV-IV in FIG. 3, illustrating the light-emitting device according to the embodiment. [Figure 5] 1A to 1C are diagrams illustrating a method for manufacturing an optical member according to an embodiment of the present invention (part 1). [Figure 6] 5A to 5C are diagrams (part 2) illustrating the method for manufacturing an optical member according to the present embodiment. [Figure 7] 10A to 10C are views (part 3) illustrating the method for manufacturing an optical member according to the present embodiment. [Figure 8] 10A to 10C are views (part 4) illustrating the method for manufacturing an optical member according to the present embodiment. [Figure 9] 5A to 5C are diagrams illustrating the method for manufacturing an optical member according to the present embodiment; [Figure 10] 6A to 6C are diagrams illustrating the method for manufacturing an optical member according to the present embodiment. [Figure 11] FIG. 4 is a partially enlarged view of FIG. [Figure 12] FIG. 10 is a diagram illustrating a light-shielding portion. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, an embodiment of the invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (e.g., "upper," "lower," and other terms including these terms) will be used as necessary. However, the use of these terms is intended to facilitate understanding of the invention with reference to the drawings, and the meaning of these terms does not limit the technical scope of the present invention. Furthermore, parts that appear with the same reference numerals in multiple drawings indicate the same or equivalent parts or components.

[0010] Furthermore, in this disclosure, polygons such as triangles and quadrilaterals are referred to as polygons, including shapes in which the corners of the polygons have been processed, such as by rounding, chamfering, corner removal, or rounding. Shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle portions of the sides are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygon as a base are included in the interpretation of "polygon" described in this disclosure.

[0011] The same applies to words that represent specific shapes, such as trapezoids, circles, and irregularities, not just polygons. The same also applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0012] Furthermore, the embodiments shown below are intended to exemplify light-emitting devices and the like embodying the technical concepts of the present invention, and are not intended to limit the present invention thereto. Furthermore, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described below are intended for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, the content described in one embodiment may also be applicable to other embodiments and modified examples. Furthermore, the size and positional relationships of components shown in the drawings may be exaggerated for clarity. Furthermore, to avoid overly complex drawings, schematic diagrams may be used in which some elements are omitted, or end views may be used as cross-sectional views showing only the cut surface.

[0013] Fig. 1 is a perspective view illustrating a light emitting device according to this embodiment. Fig. 2 is a perspective view illustrating the internal structure of the light emitting device according to this embodiment. Fig. 3 is a top view illustrating the internal structure of the light emitting device according to this embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3 illustrating the light emitting device according to this embodiment.

[0014] The light emitting device 200 according to this embodiment includes a plurality of components. The plurality of components includes a package 210, a light emitting element 220, a submount 230, an optical member 240, a protective element 250, and wiring 270. However, the light emitting device 200 does not need to include all of these components. For example, it is possible to realize a light emitting device 200 that includes a plurality of components including at least the package 210, the light emitting element 220, and the optical member 240.

[0015] Each component of the light emitting device 200 will be described.

[0016] (Package 210) The package 210 has a base 211, a frame 212, and a lid 213. The base 211 has an upper surface 211a and a lower surface 211b. The base 211 has a rectangular outer shape when viewed from above. This rectangle may have long and short sides. Note that the outer shape of the base 211 when viewed from above does not have to be rectangular. Unless specifically stated to exclude squares, the term "rectangle" may include squares.

[0017] The frame portion 212 has an upper surface 212a, one or more inner surfaces 212c, and one or more outer surfaces 212d. The frame portion 212 has, for example, a rectangular frame shape when viewed from above. The one or more inner surfaces 212c of the frame portion 212 intersect with the upper surface 211a of the base portion 211. The one or more outer surfaces 212d of the frame portion 212 intersect with the upper surface 212a of the frame portion 212.

[0018] The base 211 and the frame 212 have a concave shape recessed from the upper surface 212a of the frame 212 toward the upper surface 211a of the base 211. The concave shape is formed inside the outer shape of the frame 212 when viewed from above. When viewed from above, the upper surface 211a of the base 211 is surrounded by a frame formed by one or more inner surfaces 212c of the frame 212. The outer shape of this frame is a rectangle having long and short sides. The base 211 and the frame 212 can be formed integrally. Alternatively, the base 211 and the frame 212 may be formed separately and then joined together.

[0019] Note that a top view refers to viewing an object from the normal direction of the upper surface 211a of the base 211. The shape of an object viewed from the normal direction of the upper surface 211a of the base 211 may also be referred to as a planar shape.

[0020] The package 210 may have a stepped portion 214 having an upper surface 214a that is located above the upper surface 211a of the base 211 and below the upper surface 212a of the frame portion 212. The stepped portion 214 is formed inside the frame. The stepped portion 214 is composed of, for example, only the upper surface 214a and a side surface that intersects with the upper surface 214a and extends downward. The upper surface 214a of the stepped portion 214 is, for example, parallel to the upper surface 211a of the base 211. The side surface of the stepped portion 214 intersects with the upper surface 211a of the base 211. The stepped portion 214 may be provided on only one of the inner surfaces 212c of the frame portion 212 that face each other inside the frame, and may not be provided on the other. The stepped portion 214 is formed along the inner surface 212c. For example, on only one of all the inner surfaces 212c that make up the frame, a step portion 214 is formed along the inner surface 212c over a length of 50% or more of the inner surface 212c in top view.

[0021] One or more metal films 215 may be provided on the upper surface 214a of the step portion 214. Furthermore, one or more metal films may be provided on the upper surface 212a of the frame portion 212. The one or more metal films 215 provided on the upper surface 214a of the step portion 214 may include a metal film 215 that is electrically connected to a metal film provided on the upper surface 212a. The metal film 215 and the metal film provided on the upper surface 212a may be, for example, Ni / Au (a metal film formed by laminating Ni and Au in this order) or Ti / Pt / Au (a metal film formed by laminating Ti, Pt, and Au in this order).

[0022] The lid portion 213 has an upper surface 213a, a lower surface 213b, and one or more side surfaces 213c that intersect with the upper surface 213a and the lower surface 213b. The one or more side surfaces 213c connect the outer edge of the upper surface 213a to the outer edge of the lower surface 213b. The lid portion 213 is, for example, a rectangular parallelepiped or a cube. In this case, the upper surface 213a and the lower surface 213b of the lid portion 213 are both rectangular, and the lid portion 213 has four rectangular side surfaces 213c.

[0023] However, the shape of the lid portion 213 is not limited to a rectangular parallelepiped or a cube. That is, the shape of the lid portion 213 is not limited to a rectangle when viewed from above, and can be any shape such as a circle, an ellipse, or a polygon.

[0024] Lid portion 213 is supported by frame portion 212 and is disposed above upper surface 211a of base portion 211. The outer periphery of lower surface 213b of lid portion 213 is joined to, for example, upper surface 212a of frame portion 212. By joining lid portion 213 to frame portion 212, a closed space is formed inside package 210.

[0025] The base 211 and the frame 212 can be formed, for example, primarily from ceramics. For example, aluminum nitride, silicon nitride, aluminum oxide, or silicon carbide can be used as the ceramic. Note that the base 211 and the frame 212 are not limited to being formed from ceramics, and may be formed primarily from other insulating materials.

[0026] The lid portion 213 has a light-transmitting portion 213t that transmits light of a predetermined wavelength. The light-transmitting portion 213t constitutes a part of the upper surface 213a and the lower surface 213b of the lid portion 213. The light-transmitting portion 213t of the lid portion 213 can be formed, for example, using sapphire as the main material. Sapphire is a material that has a relatively high transmittance and is also relatively high in strength. Note that, in addition to sapphire, the main material of the light-transmitting portion 213t of the lid portion 213 may be a light-transmitting material including, for example, quartz, silicon carbide, or glass. The portions of the lid portion 213 other than the light-transmitting portion 213t may be formed integrally with the light-transmitting portion 213t using the same material as the light-transmitting portion 213t.

[0027] The lid portion 213 may also have a light-shielding portion 213s. The light-shielding portion 213s blocks light from entering or exiting. The light-shielding portion 213s constitutes part of the upper surface 213a or the lower surface 213b of the lid portion 213. The light-shielding portion 213s may be formed, for example, by providing a light-shielding film on the surface of the lid portion 213. Alternatively, for example, the light-shielding portion 213s may be formed by configuring the portions of the lid portion 213 other than the light-transmitting portion 213t from a light-shielding material including metal or the like.

[0028] (light-emitting element 220) The light emitting element 220 is, for example, a semiconductor laser element. The light emitting element 220 is not limited to a semiconductor laser element, and may be, for example, a light emitting diode (LED) or an organic light emitting diode (OLED). In the light emitting device 200 exemplarily illustrated in FIGS. 1 to 4, a semiconductor laser element is used as the light emitting element 220.

[0029] The light emitting element 220 has, for example, a rectangular outer shape when viewed from above. A side surface intersecting one of the two short sides of the rectangle serves as a light emission surface for light emitted from the light emitting element 220. The upper and lower surfaces of the light emitting element 220 have areas larger than that of the light emission surface.

[0030] Here, a case where the light emitting element 220 is a semiconductor laser element will be described. The light (laser light) emitted from the light emitting element 220 has a spread, and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting surface. Here, FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emitting surface.

[0031] The direction passing through the major axis of the ellipse is defined as the fast axis direction of the FFP, and the direction passing through the minor axis of the ellipse is defined as the slow axis direction of the FFP, based on the elliptical light emitted from the light emitting element 220. The fast axis direction of the FFP in the light emitting element 220 can coincide with the stacking direction in which multiple semiconductor layers including the active layer of the light emitting element 220 are stacked.

[0032] Furthermore, based on the light intensity distribution of the FFP of the light emitting element 220, 1 / e 2 The light having an intensity of 1 / e or more is called the main part of the light. 2 The angle corresponding to the intensity of the FFP is called the divergence angle. The divergence angle in the fast axis direction of the FFP is larger than the divergence angle in the slow axis direction of the FFP.

[0033] Furthermore, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is referred to as the light traveling along the optical axis or the light passing through the optical axis. Also, the optical path of the light traveling along the optical axis is referred to as the optical axis of that light.

[0034] The light emitting element 220 may have a peak wavelength of light emitted from the light emitting element 220 in the range of 320 nm to 530 nm, typically in the range of 430 nm to 480 nm. An example of such a light emitting element 220 is a semiconductor laser element containing a nitride semiconductor. Examples of nitride semiconductors that can be used include GaN, InGaN, or AlGaN.

[0035] Note that the emission peak of the light emitted from the light-emitting element 220 is not limited to this. Furthermore, the light-emitting element 220 may emit light with a wavelength outside the wavelength ranges listed here. For example, the light emitted from the light-emitting element 220 can be appropriately determined within the range of visible light.

[0036] (Submount 230) The submount 230 is, for example, in the shape of a rectangular parallelepiped, and has a bottom surface, a top surface, and one or more side surfaces. The width of the submount 230 in the vertical direction is the smallest. The shape is not limited to a rectangular parallelepiped. The submount 230 is formed using, for example, aluminum nitride or silicon carbide, but other materials may also be used. A metal film, for example, is provided on the top surface of the submount 230.

[0037] (Optical member 240) The optical member 240 has a light-transmitting portion 241 and a light-reflecting portion 242. The light-transmitting portion 241 has a transmitting surface that transmits light. The light-reflecting portion 242 has a reflecting surface that reflects light. Note that the optical member 240 may be configured to have either the light-transmitting portion 241 or the light-reflecting portion 242.

[0038] The light transmitting portion 241 has an upper surface 241a, a lower surface 241b opposite to the upper surface 241a, and one or more side surfaces intersecting the upper surface 241a and the lower surface 241b. The one or more side surfaces are connected to the outer edges of the upper surface 241a and the lower surface 241b.

[0039] Both the upper surface 241a and the lower surface 241b of the light transmitting portion 241 are rectangular. In the light emitting device 200 exemplarily illustrated in Figures 1 to 4, the light transmitting portion 241 has four side surfaces including a first side surface 241c which serves as a light incident surface.

[0040] The first side surface 241c has a lower first side surface region and an upper first side surface region. The lower first side surface region and the upper first side surface region may be provided on the same plane or may be provided on different planes, such as in a stepped shape. In the example of FIG. 4, the first side surface 241c forms a stepped surface, and the lower first side surface region connected to the lower surface 241b is recessed relative to the upper first side surface region connected to the upper surface 241a. The first side surface 241c is exposed in an opening 242x provided in the light reflecting portion 242. The lower first side surface region of the first side surface 241c is exposed in the opening 242x provided in the light reflecting portion 242, and the upper first side surface region is not exposed and is covered by the light reflecting portion 242.

[0041] The light transmitting portion 241 has translucency that allows light to pass through. The light transmitting portion 241 may be translucent for light in a wavelength range of 400 nm to 760 nm, for example. In this application, "translucent for light" refers to a transmittance of 80% or more for the light. Furthermore, when the light is light over a certain wavelength range, it refers to a transmittance of 80% or more for at least the peak wavelength of the light.

[0042] Because the light-transmitting portion 241 is irradiated with light, the base material of the light-transmitting portion 241 is preferably formed using an inorganic material that is not easily decomposed by light irradiation as the main material. The main material is, for example, ceramic. The main material may also be sapphire or quartz. When the main material of the light-transmitting portion 241 is ceramic, examples of the ceramic include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, and magnesium oxide. The main ceramic material is preferably a material with a melting point of 1300°C to 2500°C so that the light-transmitting portion 241 does not undergo thermal deformation, discoloration, or other alterations. The light-transmitting portion 241 is, for example, a sintered body formed primarily from ceramic. The main material is the material that accounts for the largest proportion of its constituent elements in terms of weight or volume. The main material may also include a case where no other materials are included, i.e., a component is formed solely from the main material.

[0043] The optical member 240 may be a wavelength conversion member. In this case, the light-transmitting portion 241 may be a wavelength conversion member having a phosphor. When the light-transmitting portion 241 is a wavelength conversion member, the light-transmitting portion 241 may, for example, convert light incident through the first side surface 241c, which is the incident surface, into light of a different wavelength and emit the converted light from the upper surface 241a, which is the emission surface. The light-transmitting portion 241 may emit a portion of the incident light. The light-transmitting portion 241 may also convert all of the incident light into light of a different wavelength. Alternatively, or in combination with this, an optical film such as a DBR (Distributed Bragg Reflector) film that transmits wavelength-converted light and reflects incident light may be provided on the upper surface of the wavelength conversion member or the wavelength conversion member. In this way, it is possible to configure the light incident on the light-transmitting portion 241 not to be emitted from the light-transmitting portion 241.

[0044] When the light transmitting portion 241 is a wavelength conversion portion, the light transmitting portion 241 can be formed, for example, by sintering a phosphor and a light-transmitting material such as aluminum oxide. The content of the phosphor can be 0.05% by volume to 50% by volume with respect to the total volume of the ceramic. Alternatively, for example, ceramics consisting essentially of phosphor, obtained by sintering phosphor powder, may be used. Alternatively, the light transmitting portion 241 may be formed of a single crystal of phosphor.

[0045] Examples of phosphors include cerium-activated yttrium aluminum garnet (YAG), cerium-activated lutetium aluminum garnet (LAG), europium-activated silicate ((Sr,Ba)2SiO4), α-sialon phosphor, β-sialon phosphor, etc. Among them, YAG phosphor has good heat resistance.

[0046] For example, when the light-transmitting portion 241 has a YAG phosphor, when blue excitation light is incident from the first side surface 241c, the blue excitation light and yellow fluorescence are combined to emit white light from the upper surface 241a. Also, when the light-transmitting portion 241 has a LAG phosphor, for example, it is possible to cause blue excitation light to be incident from the first side surface 241c, and green fluorescence to be emitted from the upper surface 241a without emitting the blue excitation light.

[0047] The light reflecting portion 242 has an upper surface, a lower surface opposite the upper surface, one or more inner surfaces connecting the inner edges of the upper surface and the lower surface, and one or more outer surfaces connecting the outer edges of the upper surface and the lower surface. The light reflecting portion 242 has a light reflectance of 80% or more and 100% or less on one or more inner surfaces.

[0048] The light reflecting portion 242 covers all side surfaces except for at least the first side surface 241c of the light transmitting portion 241. For example, the light reflecting portion 242 does not have to cover the first side surface 241c of the light transmitting portion 241. In this case, the shape of the upper surface of the light reflecting portion 242 is, for example, a substantially U-shape that opens toward the first side surface 241c. The two outer side surfaces of the light reflecting portion 242 and the first side surface 241c of the light transmitting portion 241 may form, for example, a single continuous plane.

[0049] 2 to 4, the light reflecting portion 242 covers a part of the first side surface 241c of the light transmitting portion 241. The light reflecting portion 242 may have an opening 242x that defines an opening through which light coming from outside the optical member 240 is incident on the first side surface 241c. The opening is, for example, rectangular, but is not limited to a rectangle and can have any shape such as a circle, an ellipse, or a polygon.

[0050] The light reflecting portion 242 may cover the upper and both sides of the region of the first side surface 241c of the light transmitting portion 241 where light coming from outside the optical member 240 is incident. The light reflecting portion 242 covers a part of the lower first side surface region and the entire upper first side surface region of the first side surface 241c. In this case, the shape of the upper surface of the light reflecting portion 242 is, for example, a frame shape with an opening in the center. The opening is, for example, rectangular, but is not limited to a rectangle and can be any shape such as circular, elliptical, or polygonal.

[0051] The light reflecting portion 242 is, for example, a sintered body formed using ceramic as the main material. Examples of ceramics used as the main material include aluminum oxide, aluminum nitride, silicon oxide, yttrium oxide, zirconium oxide, and magnesium oxide. Among these, aluminum oxide is preferable because of its high reflectivity. However, the light reflecting portion 242 does not have to use ceramic as the main material. The light reflecting portion 242 may be formed using, for example, metal, a composite of ceramic and metal, resin, or the like.

[0052] In optical member 240, the inner surface of light reflecting portion 242 is connected to a part of the side surface of light transmitting portion 241. The upper surface of light transmitting portion 241 and the upper surface of light reflecting portion 242 may form one continuous plane. Also, the lower surface of light transmitting portion 241 and the lower surface of light reflecting portion 242 may form one continuous plane.

[0053] In the optical element 240, the light-transmitting portion 241 and the light-reflecting portion 242 can be integrally formed. Alternatively, the light-transmitting portion 241 and the light-reflecting portion 242 may be formed separately and then bonded to form the optical element 240. The light-transmitting portion 241 and the light-reflecting portion 242 may be integrally formed, for example, by a sintered body. For example, an integral sintered body can be formed by first forming a sintered body of the light-transmitting portion 241 and then forming a sintered body of the light-reflecting portion 242 integrally with the light-transmitting portion 241. In this case, it is also possible to adjust the proportion of voids (porosity) contained in the sintered body formed in each of the steps of forming the light-transmitting portion 241 and the light-reflecting portion 242. The porosity can be adjusted by the sintering conditions (sintering temperature, sintering time, heating rate), the particle size of the material, the concentration of the sintering aid, etc.

[0054] For example, when the light transmitting portion 241 and the light reflecting portion 242 are formed using the same ceramic as the main material, the porosity of the light reflecting portion 242 is set to be greater than the porosity of the light transmitting portion 241. In other words, the optical member 240 is formed so that the light reflecting portion 242 contains more voids than the light transmitting portion 241. In this case, it is preferable to adjust the sintering conditions so that the porosity of the light reflecting portion 242 is approximately 10%. This forms a reflective area of ​​air at the boundary between the side surface of the light transmitting portion 241 and the inner surface of the light reflecting portion 242, and light that strikes the inner surface of the light reflecting portion 242 from the light transmitting portion 241 side can be reflected toward the light transmitting portion 241 side.

[0055] The optical member 240 may have an anti-reflection film (for example, an anti-reflection film 243 described later) on the upper surface. The anti-reflection film may be provided on the upper surface 241a of the light-transmitting portion 241, or on the upper surface 241a of the light-transmitting portion 241 and the upper surface of the light-reflecting portion 242. The optical member 240 may also have a metal film (for example, a metal film 244 described later) on the lower surface 241b of the light-transmitting portion 241 and the lower surface of the light-reflecting portion 242. The optical member 240 may also have a reflective film (for example, a reflective film 245 described later) on the first side surface 241c. This reflective film is provided at least on the first side surface 241c of the light-transmitting portion 241 exposed in the opening 242x.

[0056] (protective element 250) The protection element 250 is a component for protecting a specific element such as a semiconductor laser element. For example, the protection element 250 is a component for preventing an excessive current from flowing through a specific element such as a semiconductor laser element and causing damage. For example, a Zener diode made of Si can be used as the protection element 250. Alternatively, for example, the protection element 250 may be a component for measuring temperature to prevent the specific element from failing due to the temperature environment. A thermistor can be used as such a temperature measurement element. It is preferable to place the temperature measurement element near the light emission surface of the light emitting element 220.

[0057] (Wiring 270) The wiring 270 is made of a conductor having a linear shape with joints at both ends. In other words, the wiring 270 has joints at both ends of the linear portion that are joined to other components. The wiring 270 is used for electrical connection between two components. For example, a metal wire can be used as the wiring 270. Examples of metals include gold, aluminum, silver, copper, and tungsten.

[0058] (Method of manufacturing the optical member 240) 5 to 9 are diagrams illustrating a method for manufacturing an optical member according to this embodiment. First, as shown in FIG. 5, a wafer 240W is prepared (first step), which has, for example, a plurality of light-transmitting portions 241 arranged in a matrix at predetermined intervals when viewed from above, and one light-reflecting portion 242 surrounding the side surface of each light-transmitting portion 241. In the wafer 240W, the upper and lower surfaces of each light-transmitting portion 241 are exposed from the light-reflecting portion 242. The upper surface of each light-transmitting portion 241 and the upper surface of the light-reflecting portion 242 may form a single continuous plane. Alternatively, the lower surface of each light-transmitting portion 241 and the lower surface of the light-reflecting portion 242 may form a single continuous plane.

[0059] Specifically, first, multiple light-transmitting portions 241 are prepared and temporarily fixed on a support at a predetermined interval. Each light-transmitting portion 241 may be made of, for example, ceramics containing no phosphor or ceramics containing phosphor. Next, a molded body is formed on the support so as to surround the upper and side surfaces of each light-transmitting portion 241. The molded body contains, for example, a light-reflecting powder primarily made of ceramic. The molded body can be formed using a slip casting method, a doctor blade method (sheet forming method), a dry molding method, or the like. Next, after removing the support, the light-transmitting portions 241 and the molded body are fired at a predetermined temperature. At this time, it is preferable to adjust the sintering conditions of the molded body so that the molded body contains more voids than the light-transmitting portions 241. After firing, the molded body covering the upper surfaces of the light-transmitting portions 241 is removed by polishing or the like to expose the upper surfaces of the light-transmitting portions 241. If necessary, the lower surfaces of the light-transmitting portions 241 and the molded body are flattened by polishing or the like. This results in a wafer 240W having a plurality of light transmitting portions 241 and one light reflecting portion 242 surrounding the side surfaces of each light transmitting portion 241. The following description will be given using the longitudinal cross-sectional view of one light transmitting portion 241 and the surrounding light reflecting portion 242 in FIG.

[0060] Next, as shown in FIG. 6, an anti-reflection film 243 may be formed over the entire upper surface of the wafer 240W as needed (second step). The anti-reflection film 243 may be formed by laminating one or more dielectric multilayer films, such as Nb2O5 / SiO2, Ta2O5 / SiO2, Al2O3 / SiO2, ZrO2 / SiO2, and ZrO2 / Al2O3. The anti-reflection film 243 may be formed by, for example, a sputtering method. By providing the anti-reflection film 243, it is possible to prevent light that attempts to be emitted to the outside from the upper surface of the light-transmitting portion 241 from being reflected back to the inside by the upper surface of the light-transmitting portion, thereby increasing the emission efficiency of light emitted to the outside from the upper surface of the light-transmitting portion 241.

[0061] Next, as shown in FIG. 7 , a metal film 244 may be formed over the entire lower surface of the wafer 240W as needed (step 3). The metal film 244 may be, for example, Ti / Ag / Ti / Pt / Au (a metal film stacked in this order: Ti, Ag, Ti, Pt, and Au) or Ti / Al / Ti / Pt / Au (a metal film stacked in this order: Ti, Al, Ti, Pt, and Au). The metal film 244 may be formed by, for example, a sputtering method. The metal film 244 may be used when joining the optical member 240 to another member. The metal film 244 on the lower surface of the optical member 240 may also function as a light-reflecting film that reflects upward light that reaches the lower surface of the light-transmitting portion 241. Among the metals constituting the metal film 244, Ag and Al have relatively high reflectivity, and therefore, can reflect upward light that reaches the lower surface of the light-transmitting portion 241, thereby increasing the light emission efficiency of the light emitted to the outside from the upper surface of the light-transmitting portion 241. It should be noted that a light-reflecting film formed using a material other than metal may be used instead of the metal film 244. For example, the light-reflecting film can be formed by laminating one or more dielectric multilayer films such as Nb2O5 / SiO2, TiO2 / SiO2, Ta2O5 / SiO2, etc.

[0062] 8, portions of the light transmitting portion 241 and the light reflecting portion 242 are removed so as not to penetrate from the top surface to the bottom surface, thereby forming openings 242x that open to the bottom surface of the wafer 240W (fourth step). For example, machining or the like is performed from the bottom surface of the wafer 240W to a predetermined height to remove portions of the metal film 244, the light transmitting portion 241, and the light reflecting portion 242, thereby forming openings 242x that open to the bottom surface of the wafer 240W. As a result, portions of the side surfaces of the light transmitting portion 241 are exposed in the openings 242x.

[0063] Next, as shown in FIG. 9 , the light reflecting portions 242 are cut and singulated into a plurality of optical members 240 (fifth step). The light reflecting portions 242 are cut so that the light reflecting portions 242 remain overlapping the portions removed in the fourth step when viewed from above. The light reflecting portions 242 are cut so that the light reflecting portions 242 surround the entire periphery of the light transmitting portions 241 when viewed from above. The upper surface of the light transmitting portion 241 is surrounded by the light reflecting portions 242, while the lower surface of the light transmitting portion 241 is partially not surrounded by the light reflecting portions 242. When viewed from above, the light reflecting portions 242 are cut in the vertical direction so as to pass through the portions removed in the fourth step. The wafer 240W is cut using a blade, a laser, or the like to singulate into a plurality of optical members 240 so that one optical member 240 includes one light transmitting portion 241 and one light reflecting portion 242 surrounding the side surface of the light transmitting portion 241. For example, the light reflecting portions 242 are cut in a lattice pattern along the arrangement direction of the light transmitting portions 241 when viewed from above.

[0064] 8, a process for forming a reflective film 245 on the side surface of the light-transmitting portion 241 exposed in the opening 242x may be performed as shown in FIG. 10. The reflective film 245 may extend from the upper end of the side surface of the light-transmitting portion 241 toward the light-reflecting portion 242 within the opening 242x. The reflective film 245 is an optical film that reflects light of a specific wavelength and transmits light of other wavelengths. For example, a DBR film is used as the reflective film 245. The DBR film can reflect a specific wavelength with high efficiency by, for example, stacking films with different refractive indices alternately at a thickness of ¼ wavelength. The DBR film can be formed by, for example, including at least one oxide or nitride selected from the group consisting of Si, Ti, Zr, Nb, Ta, and Al. By providing the reflective film 245, when the optical element 240 is a wavelength conversion element, light incident on the wavelength conversion element from the outside is transmitted to the light transmitting portion 241 side, which is the wavelength conversion portion, and 90% or more of the light wavelength-converted by the wavelength conversion portion can be reflected.

[0065] (Light emitting device 200) In the light emitting device 200, a submount 230 is disposed on the upper surface 211a of the base 211. The lower surface of the submount 230 is bonded to the upper surface of a metal film formed on the upper surface 211a of the base 211, for example.

[0066] The light emitting element 220 is disposed on the upper surface 211a of the base 211 and is surrounded by the frame 212. The light emitting element 220 disposed on the upper surface 211a emits light that travels laterally. Specifically, the light emitting element 220 is mounted on a submount 230 and disposed on the base 211 via the submount 230.

[0067] The light emitting element 220 is disposed so that its light emitting surface faces the same direction as one of the side surfaces of the submount 230. The light emitting surface of the light emitting element 220 is parallel to or perpendicular to the inner surface 212c or the outer surface 212d of the frame portion 212, for example.

[0068] 11, the light emitting element 220 is disposed, for example, in a top view, at a position where a virtual line L1 perpendicular to the light emitting surface passes through a center C of two points A and B where a plane including the light emitting surface of the light emitting element 220 intersects with a frame defined by the top surface 212a of the frame portion 212. The top surface of the light emitting element 220 may be line-symmetrical with respect to the virtual line L1. That is, for example, the light emitting element 220 is disposed in the center of the frame in a direction parallel to the light emitting surface in a top view. The two side surfaces of the light emitting element 220 that intersect with the light emitting surface are parallel to the virtual line L1, for example.

[0069] It should be noted that points A and B can be said to be the intersections of the inner side surface 212c and a plane passing through the light emission surface of the light emitting element 220 in a top view. The inner side surface 212c relating to point A and the inner side surface 212c relating to point B face each other. It should be noted that neither of the inner side surfaces 212c is a side surface of the step portion 214.

[0070] Alternatively, points A and B can each be an intersection of the inner surface 212c and a virtual line perpendicular to the optical axis of light emitted from the light emitting element 220 in a top view. The inner surface 212c related to point A and the inner surface 212c related to point B face each other. Note that neither of the inner surfaces 212c is a side surface of the step portion 214.

[0071] 11, the light emitting element 220 is disposed, for example, in a position where an imaginary line L2 that passes through the center E of the two points D and B and is perpendicular to the light emission surface does not pass through in a top view. Point D is a point where a plane including the light emission surface of the light emitting element 220 intersects with a side surface of the stepped portion 214 in a top view. Point B is a point where an inner surface 212c that faces the side surface of the stepped portion 214 across the light emitting element 220 intersects with a plane including the light emission surface of the light emitting element 220.

[0072] The step portion 214 is provided only on one side of the imaginary line L1, and not on the other side. The step portion 214 is provided at a position facing one of the two side surfaces of the light emitting element 220 that intersect with the light emitting surface, and is not provided at a position facing the other side surface. This allows the light emitting device 200 to be made more compact than if step portions were provided on both sides.

[0073] One of the two side surfaces of the light emitting element 220 that intersect with the light emitting surface faces a side surface of the step portion 214. One of the two side surfaces of the light emitting element 220 that intersect with the light emitting surface is, for example, parallel to the side surface of the step portion 214. The other of the two side surfaces of the light emitting element 220 that intersect with the light emitting surface does not face the side surface of the step portion 214, but faces the inner side surface 212c of the frame portion 212. The other of the two side surfaces of the light emitting element 220 that intersect with the light emitting surface is, for example, parallel to one of the inner side surfaces 212c of the frame portion 212.

[0074] An upper surface 214a of the step portion 214 is, for example, higher than the height of the upper surface of the light emitting element 220, with respect to the upper surface 211a of the base portion 211. A side surface of the step portion 214 is, for example, parallel to one inner side surface 212c of the frame portion 212 that faces the step portion 214 across the imaginary line L1.

[0075] The light emitting element 220 is disposed, for example, in a region closer to the stepped portion 214 than the center of the submount 230 in a direction parallel to the light emitting surface when viewed from above. By disposing the light emitting element 220 on the side closer to the stepped portion 214 in this way, the light emitting element 220 can be disposed in the center of the package 210. Note that a protective element 250 may be disposed on the upper surface of the submount 230. The protective element 250 is disposed, for example, on the opposite side of the light emitting element 220 from the stepped portion 214 when viewed from above.

[0076] The submount 230 on which the light emitting element 220 is disposed can function as a heat dissipation member that dissipates heat generated by the light emitting element 220 in the light emitting device 200. To enable the submount 230 to function as a heat dissipation member, it is sufficient to form it from a material with better thermal conductivity than the light emitting element 220. On the upper surface of the submount 230, the area of ​​the region located on the opposite side of the step portion 214 with respect to the imaginary line L1 is larger than the area of ​​the region located on the step portion 214 side with respect to the imaginary line L1. In this way, by extending the submount 230 to the side where the step portion 214 is not provided, the areas of the upper and lower surfaces of the submount 230 can be increased, thereby improving heat dissipation performance. Alternatively, space for arranging the protection element 250 can be secured.

[0077] In the light emitting device 200, the light emitting element 220 and the protective element 250 are electrically connected to the base 211 by a wiring 270. The wiring 270 in the illustrated light emitting device 200 is an example in which the protective element 250 is a Zener diode, but if the protective element 250 is a temperature measuring element, the wiring 270 may be connected differently from that shown in the drawing.

[0078] Light emitting element 220 is electrically connected to metal film 215 provided on upper surface 214a of step portion 214 via wiring 270. Wiring 270 is provided mainly on the step portion 214 side of virtual line L1. In this way, by providing step portion 214 only at a position facing one of the two side surfaces of light emitting element 220 that intersect with the light emitting surface and concentrating wiring 270 on one side surface of light emitting element 220, it is possible to reduce the size of light emitting device 200.

[0079] The light emitting device 200 has a plurality of wirings 270. The plurality of wirings 270 includes a wiring 270 having a joint at one end thereof joined to the step portion 214 and a joint at the other end thereof joined at a position on the submount 230 farther from the step portion 214 than the imaginary line L1.

[0080] For example, a metal film provided on the lower surface of the package 210 can be used to electrically connect the light emitting element 220 to the external power supply. This allows the light emitting element 220 to be electrically connected to the external power supply via the metal film on the upper surface 212a of the frame portion 212, which is electrically connected to the metal film 215 through the metal material provided in the via hole.

[0081] The optical member 240 is disposed on the base 211. The optical member 240 is disposed on the upper surface 211a of the base 211. The optical member 240 has a first side surface 241c onto which light emitted from the light emitting surface of the light emitting element 220 is incident, and an upper surface 241a from which the light is emitted. The light transmitting portion 241 of the optical member 240 is disposed, for example, at a position where a virtual line L1 passes in a top view. The upper surface 241a of the light transmitting portion 241 may be line-symmetric with respect to the virtual line L1. Furthermore, the upper surface of the light reflecting portion 242 may be line-symmetric with respect to the virtual line L1. In a top view, the virtual line L1 coincides with, for example, the optical axis of the light emitting element 220, passes through the center of the light transmitting portion 241, and intersects with one of the inner surfaces 212c of the frame portion 212.

[0082] Light emitted from the light-emitting element 220 travels toward the optical member 240, passes through an opening defined by the opening 242x of the light-reflecting portion 242, and is incident on the first side surface 241c of the light-transmitting portion 241. It can be said that the opening 242x defines an opening that allows light emitted from the light-emitting surface of the light-emitting element 220 to be incident on the first side surface 241c. Based on the light that has entered the first side surface 241c, light is emitted from the upper surface 241a of the light-transmitting portion 241. Here, the light that is emitted based on the incident light is, for example, the incident light, or, for example, light that has been wavelength-converted based on the incident light.

[0083] The light emitting surface of the light emitting element 220 faces the first side surface 241c of the light transmitting portion 241. The light emitting surface of the light emitting element 220 is, for example, parallel to the first side surface 241c of the light transmitting portion 241. The upper surface 214a of the step portion 214 is, for example, located at a position lower than the height of the upper surface 241a of the light transmitting portion 241, with the upper surface 211a of the base 211 as the reference. By setting the height at such a position, the light emitted upward from the upper surface 241a is not directly irradiated onto the step portion 214.

[0084] When the light-transmitting portion 241 is a wavelength converting portion, light (first light) emitted from the light-emitting element 220 is incident on the first side surface 241c of the light-transmitting portion 241 and converted by the wavelength converting portion into light (second light) having a wavelength different from the first light. The first light incident on the first side surface 241c is emitted from the upper surface 241a. The converted second light is emitted from the upper surface 241a. The first light and the second light are emitted upward from the upper surface 241a of the light-transmitting portion 241. In this way, by arranging a wavelength converting member having a light incident surface on the side surface and a light exit surface on the upper surface, it is possible to realize light path conversion and wavelength conversion from the side to the upper side. This allows the light-emitting device 200 to be more compact than when separate components are used, such as a mirror for light path conversion and a phosphor for wavelength conversion.

[0085] The first light and / or the second light is reflected by the light reflecting portion 242, travels toward the upper surface 241a of the light transmitting portion 241, and is emitted from the upper surface 241a of the light transmitting portion 241. This allows the light to be efficiently emitted from the upper surface 241a.

[0086] A reflective film 245 that transmits light emitted from the light emitting element 220 and reflects light whose wavelength has been converted by the wavelength conversion section can be provided on the first side surface 241c. This reflective film 245 allows the light whose wavelength has been converted by the wavelength conversion section to be efficiently emitted from the upper surface 241a. In addition, the metal film 244 provided on the lower surface of the light transmission section 241 serves as a light reflective film that reflects the first light and the second light.

[0087] The lid portion 213 is disposed on the upper surface 212a of the frame portion 212. Specifically, the lid portion 213 is supported by the upper surface 212a of the frame portion 212, and is disposed above the light emitting element 220 surrounded by the frame portion 212. The outer periphery of the lower surface of the lid portion 213 is bonded to, for example, the upper surface 212a of the frame portion 212. For example, a metal film provided on the outer periphery of the lower surface of the lid portion 213 and a metal film provided on the upper surface 212a of the frame portion 212 are bonded and fixed via Au—Sn or the like.

[0088] By joining the lid portion 213 to the upper surface 212a of the frame portion 212, a closed space in which the light emitting element 220 is arranged is formed. Moreover, this closed space is formed in an airtight sealed state. By being airtight sealed, it is possible to prevent organic matter and the like from collecting on the light emitting surface of the light emitting element 220.

[0089] The lid portion 213 has a light-transmitting portion 213t that transmits light emitted from the upper surface 241a of the light-transmitting portion 241 and emits it to the outside. In other words, the light emitted from the upper surface 241a of the light-transmitting portion 241 toward the lid portion 213 passes through the light-transmitting portion 213t of the lid portion 213 and is emitted to the outside of the light emitting device 200. The entire lid portion 213 made of the main material may be a light-transmitting portion. The light-transmitting portion 213t of the lid portion 213 preferably transmits 50% or more, and further preferably 70% or more, of the light emitted from the light emitting element 220 and the light emitted from the optical member 240.

[0090] In light emitting device 200, frame 212 has a light-shielding portion that blocks light in the same wavelength range as the light emitted from light emitting element 220. As shown in Fig. 12, the light-shielding portion of frame 212 is arranged on an extension line L3 of the optical path of the main portion of light emitted from the light emitting surface of light emitting element 220, from the light emitting surface toward the uppermost position to the light entering optical member 240.

[0091] With respect to the main portion of light emitted from the light emitting surface of the light emitting element 220, the light-transmitting portion 213t of the lid portion 213 is located on an extension line L3 of the optical path from the light emitting surface toward the uppermost position to the light entering the optical member 240, but is not located on a line segment just before where this extension line intersects with the light-shielding portion of the frame portion 212. By arranging the light in this manner, even if light from the light emitting element 220 travels without passing through the optical member 240 for some reason, the light directly enters the light-shielding portion of the frame portion 212 or the light-shielding portion 213s of the lid portion 213, and therefore can be prevented from being directly emitted from the light-transmitting portion 213t of the lid portion 213.

[0092] With respect to the main portion of light emitted from the light emitting surface of the light emitting element 220, the lid portion 213 is located on an extension line L3 of the optical path from the light emitting surface toward the uppermost position to the light entering the optical member 240, but is not located on a line segment just before where this extension line intersects with the light-shielding portion of the frame portion 212. By arranging the lid portion 213 in this manner, even if the light from the light emitting element 220 travels without passing through the optical member 240 for some reason, the light directly enters the light-shielding portion of the frame portion 212, and therefore it is possible to prevent the light from being directly emitted from the light-transmitting portion 213t of the lid portion 213.

[0093] The main part of the light that defines the extension line L3 here is 1 / e 2 It is desirable that the light has an intensity equal to or greater than the peak intensity value, but it may also be light having an intensity equal to or greater than half the peak intensity value.

[0094] For example, in FIG. 11, the portion including the inner surface 212c intersecting with the virtual line L1 is the light-shielding portion of the frame portion 212. The light-shielding portion of the frame portion 212 does not transmit 90% or more of light in the same wavelength range as the light emitted from the light-emitting element 220. The light-shielding portion of the frame portion 212 preferably does not transmit 95% or more of light in the same wavelength range as the light emitted from the light-emitting element 220, and more preferably does not transmit 99% or more. One preferable means for preventing transmission is to absorb light. When absorbing light, it is preferable to absorb it at the above-mentioned rate. Note that the entire frame portion 212, which is made of a main material, may be the light-shielding portion.

[0095] In this way, in the light emitting device 200 including the optical member 240 as a wavelength conversion member, the light emitted laterally from the light emitting element 220 is made to directly enter the light transmitting portion 241 of the optical member 240 without changing the optical path. Therefore, unlike a structure in which the light emitted laterally from the light emitting element is made to change the optical path upward by a light reflecting member and then made to enter the light transmitting portion, no other member is interposed between the light emitting element 220 and the light transmitting portion 241. As a result, the light emitting device 200 can be made smaller.

[0096] Furthermore, some conventional light-emitting devices have a damage detection control mechanism that turns off the light-emitting element when the light-transmitting portion is damaged, due to safety considerations. In contrast, in light-emitting device 200, light emitted laterally from light-emitting element 220 is directly incident on light-transmitting portion 241 of optical member 240 without changing its optical path. Therefore, even if light-transmitting portion 241 is damaged and the light emitted laterally from light-emitting element 220 no longer enters light-transmitting portion 241, the light hits a light-shielding portion of frame portion 212 located on the optical path of the light emitted laterally from light-emitting element 220 and is absorbed by the light-shielding portion, preventing it from being emitted outside light-emitting device 200. As a result, sufficient safety can be ensured without providing a damage detection control mechanism that turns off light-emitting element 220 when light-transmitting portion 241 is damaged. In other words, light-emitting device 200 can be made smaller while still ensuring safety.

[0097] Furthermore, light emitting device 200 has step portion 214 at a position facing one of two side surfaces of light emitting element 220 that intersect with the light emitting surface, and no step portion is provided at a position facing the other side surface. Light emitting element 220 is disposed in the center of a frame defined by upper surface 212a of frame portion 212 in a direction parallel to the light emitting surface of light emitting element 220 when viewed from above. This allows light emitting element 220 to be disposed in the center, while still achieving a compact light emitting device 200.

[0098] Note that if the light transmitting portion 241 is not a wavelength conversion portion, light incident on the light transmitting portion 241 from the light emitting element 220 is repeatedly reflected by the light reflecting portion 242 and is emitted from the upper surface 241a of the light transmitting portion 241. Furthermore, if wavelength conversion is not necessary, the optical member 240 does not have to be configured to include the light transmitting portion 241 and the light reflecting portion 242. For example, the optical member 240 may be a mirror having an inclined surface that reflects the light incident from the light emitting element 220 toward the lid portion 213. Alternatively, the optical member 240 may be a MEMS mirror that deflects and scans the light incident from the light emitting element 220 toward the lid portion 213.

[0099] The light emitting device 200 can be used, for example, in an in-vehicle headlight, but is not limited to this, and can also be used as a light source for lighting, a projector, a head-mounted display, a backlight for other displays, and the like.

[0100] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0101] 200 Light-emitting device 210 packages 211 Base 211a Top side 211b Bottom side 212 Frame 212a Top 212c inner surface 212d External surface 213 Lid 213a Top side 213b Bottom surface 213c side 213s light shielding part 213t Translucent part 214 Step 214a Top 215 Metal Film 220 Light-emitting element 230 Submount 240 Optical components 240W ウェハ 241 Light-transmitting section 241a above 241b below 241c First side 242 Light Reflector 242x Opening 243 Anti-reflective film 244 metal film 245 reflective film 250 Protective Elements 270 wiring

Claims

1. a package having a base, a frame, and a lid; a light-emitting element disposed on the upper surface of the base, surrounded by the frame, and emitting light traveling laterally; a wavelength conversion member disposed on the base, the wavelength conversion member having a first side surface onto which light emitted from the light emission surface of the light emitting element is incident and an upper surface from which the light is emitted; Equipped with the frame portion has a light-shielding portion that blocks light in the same wavelength range as the light emitted from the light-emitting element, the lid portion has a light-transmitting portion that transmits light emitted from an upper surface of the wavelength conversion member and emits the light to the outside, a light-emitting device, wherein the light-shielding portion is a portion of the frame portion that overlaps with a main portion of light emitted from the light-emitting surface, and is positioned below an extension of the optical path from the light-emitting surface toward the top to the light entering the wavelength conversion member.

2. the package further includes a stepped portion having an upper surface located above the upper surface of the base portion and below the upper surface of the frame portion; a metal film is provided on the upper surface of the step portion; The light emitting device according to claim 1 , wherein the light emitting element is electrically connected to the metal film via a wiring.

3. The light emitting device according to claim 2 , wherein the step portion is provided at a position facing one of two side surfaces of the light emitting element that intersect with the light emitting surface, and is not provided at a position facing the other side surface.

4. a submount on which the light emitting element is mounted; The light emitting device according to claim 2 , wherein the light emitting element is disposed in a region closer to the step portion than to a center of the submount in a direction parallel to the light emitting surface when viewed from above.

5. 5. The light-emitting device according to claim 4, wherein the light-emitting element is positioned at a position where, when viewed from above, a virtual line perpendicular to the light-emitting surface passes through the center of two points where a plane including the light-emitting surface and a frame defined by the upper surface of the frame portion intersect.

6. The wavelength conversion member is 6. The light emitting device according to claim 1, further comprising: a wavelength converting portion having the first side surface and an upper surface from which the light is emitted; and a light reflecting portion covering all side surfaces of the wavelength converting portion other than the first side surface.

7. the light reflecting portion further covers a portion of the first side surface, The light emitting device according to claim 6 , further comprising an opening defining an opening through which light emitted from the light emitting surface is incident on the first side surface.

8. The light emitting device according to claim 7 , wherein the light reflecting portion covers an area of ​​the first side surface above and on both sides of the area where light from the light emitting element is incident.

9. The light emitting device according to claim 6 , wherein the wavelength converting portion includes a phosphor.

10. 10. The light emitting device according to claim 6, wherein the wavelength converting portion and the light reflecting portion are both sintered bodies, made primarily of ceramics, and integrally formed.

11. The light emitting device according to claim 6 , further comprising a reflective film provided on the first side surface, the reflective film transmitting light emitted from the light emitting element and reflecting light whose wavelength has been converted by the wavelength converting portion.

12. The light emitting device according to claim 1 , further comprising an anti-reflection film on an upper surface of the wavelength conversion member.

13. The light emitting device according to claim 1 , further comprising a light reflecting film on a lower surface of the wavelength converting member.

Images