Processing device and detection method

Abstract

To detect whether an abnormal state has occurred in which a workpiece is not properly held by a holding unit when the atmospheric pressure in which the holding unit is placed is started to be reduced while the holding unit is holding the workpiece such as a wafer by suction at negative pressure.SOLUTION: A processing device includes a holding unit capable of suction-holding an object to be processed at a pressure lower than atmospheric pressure, a container having an internal space in which the holding unit is housed and provided with a suction port for decompressing the internal space, a pressure measuring device for measuring the pressure in the internal space of the container, and a controller having a processor and memory and for grasping the pressure value measured by the pressure measuring device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device that processes a workpiece by suction-holding it with a holding unit at a pressure lower than atmospheric pressure and then reducing the pressure of the internal space in which the holding unit is housed, and a detection method that detects abnormal holding of a workpiece by the holding unit when reducing the pressure of the internal space in a container in which the holding unit that suction-holds the workpiece is housed. [Background technology]

[0002] In the manufacturing process of semiconductor devices, a protective tape having a diameter larger than the wafer is sometimes attached to one side of a disk-shaped wafer. In this case, it has been proposed to attach the protective tape to one side of the wafer while the internal space of a container constituting a vacuum chamber is reduced in pressure below atmospheric pressure (see, for example, Patent Document 1).

[0003] When applying a protective tape to one side of a wafer in a reduced pressure atmosphere, the other side of the wafer is suction-held by a holding table (i.e., a holding unit). However, the holding table used in a reduced pressure atmosphere is usually not a porous plate with pores connected in a three-dimensional network that can suction-hold a wafer by negative pressure, but an electrostatic chuck that has an electrode and a dielectric film covering the electrode and can suction-hold a wafer by electrostatic force.

[0004] However, since electrostatic chucks are generally expensive, there is a demand for using a holding table with a porous plate, which is generally less expensive. However, when a holding table with a porous plate is used, if the space in which the holding table is placed is depressurized, the holding force due to the negative pressure is relatively reduced, and it may become impossible to hold the wafer by suction, or part or all of the wafer may move.

[0005] If the protective tape is applied when the wafer is shifted from its initial position relative to the holding table and / or when part of the wafer is curled up, this could lead to problems such as damage to the wafer in subsequent processes. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-050388 Summary of the Invention [Problem to be solved by the invention]

[0007] The present invention has been made in consideration of the above problems, and aims to detect whether an abnormal state has occurred in which a workpiece such as a wafer is not properly held by a holding unit when the atmospheric pressure in which the holding unit is placed is started to be reduced while the workpiece is being held by the holding unit under negative pressure. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a processing device comprising: a holding unit capable of suction-holding an object to be processed at a pressure lower than atmospheric pressure; a container having an internal space in which the holding unit is housed and having a suction port for reducing the pressure in the internal space; a pressure measuring device for measuring the pressure in the internal space of the container; and a controller having a processor and memory and for grasping the pressure value measured by the pressure measuring device.

[0009] Preferably, when the internal space of the container is depressurized while the object to be treated is held by the holding unit through suction, the controller detects whether or not an abnormality has occurred in the holding of the object to be treated held by the holding unit based on the amount of change in pressure in the internal space.

[0010] Preferably, the controller detects that an abnormality has occurred in the holding of the object to be processed held by the holding unit when the amount of change in pressure in the internal space becomes positive.

[0011] Preferably, the controller starts detecting whether an abnormality has occurred in the holding of the workpiece held in the holding unit based on the amount of change in pressure in the internal space after a first time has elapsed since the start of depressurization of the internal space and before a second time calculated based on the exhaust speed at which the internal space is exhausted and at which the pressure in the internal space becomes equal to the pressure at which the workpiece is suction-held.

[0012] Preferably, the controller starts detecting whether or not a holding abnormality has occurred in the workpiece held by the holding unit based on the amount of change in pressure in the internal space after the pressure in the internal space has become equal to the pressure at which the workpiece is suction-held.

[0013] Preferably, the controller definitively diagnoses that a holding abnormality has occurred in the workpiece when the pressure in the internal space becomes lower than a predetermined value after a holding abnormality is detected.

[0014] Preferably, the processing device further includes a roller disposed in the internal space for applying protective tape to the object to be processed, and a roller moving mechanism for moving the roller along the holding surface of the holding unit.

[0015] The internal space is divided by protective tape into a first space containing the holding unit and the object to be treated, and a second space not containing the holding unit and the object to be treated, and the processing device attaches the protective tape to the object to be treated by the pressure difference between the first space and the second space.

[0016] Preferably, the processing apparatus further comprises a plurality of wafer fixing portions for sandwiching the object to be processed in a radial direction of the object to be processed, or a pressing member for pressing the object to be processed against the holding unit.

[0017] According to another aspect of the present invention, there is provided a detection method for detecting abnormality in the holding of a workpiece when the internal space of a container containing a holding unit that suction-holds the workpiece is depressurized, the detection method comprising: a holding step in which the workpiece is suction-held by the holding unit at a pressure lower than atmospheric pressure; a depressurization step in which, after the holding step, the internal space is depressurized while the workpiece is suction-held by the holding unit, and the depressurization of the internal space is continued while measuring the pressure in the internal space of the container; and a detection method for detecting whether or not an abnormality in the holding of the workpiece held by the holding unit has occurred during the depressurization step, based on the amount of change in pressure in the internal space. [Effects of the Invention]

[0018] In a processing apparatus according to one aspect of the present invention, the pressure in the internal space of the container in which the holding unit is housed is measured by a pressure measuring device, and the controller of the processing apparatus grasps the pressure value measured by the pressure measuring device.

[0019] For example, if the pressure in the internal space of the container is atmospheric pressure and the object to be treated is being held by the holding unit at negative pressure, and depressurization of the internal space of the container is started, causing the object to no longer be properly held by the holding unit, gas will flow from the holding unit into the internal space of the container, and the pressure in the internal space may rise slightly.

[0020] Therefore, by determining the pressure value in the internal space, the controller can detect whether the workpiece is being properly held in the holding unit, which means the processing device can detect the occurrence of an abnormal state in which the workpiece is not being properly held in the holding unit.

[0021] In a detection method according to another aspect of the present invention, during a decompression step in which the pressure in the internal space of a container is continuously reduced while the pressure in the internal space is measured, it is detected whether or not an abnormality has occurred in the workpieces held in the holding unit based on the amount of change in pressure in the internal space. In other words, it is possible to detect the occurrence of an abnormal state in which the workpieces are not properly held in the holding unit. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 2 is a partial cross-sectional side view of the attachment device. [Figure 2] 10 is a graph showing pressure changes in the internal space of the container. [Figure 3] 3 is an enlarged graph of a portion of the graph shown in FIG. 2. [Figure 4] 4 is a graph showing the amount of change in pressure per unit time in a part of the graph shown in FIG. 3. [Figure 5] 10 is a graph illustrating another example of the detection start timing. [Figure 6] FIG. 10 is a flow chart of a method for detecting abnormal wafer holding. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. 10 is a partial cross-sectional side view of a bonding device according to a second embodiment. [Figure 11] FIG. [Figure 12] FIG. [Figure 13] FIG. [Figure 14] FIG. 10 is a diagram showing a decompression step according to the third embodiment. [Figure 15] FIG. 10 is a diagram showing a decompression step according to the fourth embodiment. [Figure 16] FIG. 10 is a diagram showing a decompression step according to the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] (First embodiment) An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a partial cross-sectional side view of a bonding device (processing device) 2 according to the first embodiment. The Z-axis direction (height direction) shown in Fig. 1 is parallel to the vertical direction. The bonding device 2 has a metal container 4.

[0024] The container 4 includes an upper container 4a with an upward recess and a lower container 4b with a downward recess. The upper container 4a and the lower container 4b are configured to be relatively movable along the Z-axis direction. In this embodiment, the upper container 4a is moved relative to the lower container 4b by operating a first lifting mechanism 2a, such as an air actuator, fixed to the top plate of the upper container 4a.

[0025] When the upper container 4a moves upward, the internal space 4c of the container 4 is opened, and when the upper container 4a moves downward, the internal space 4c of the container 4 is closed. When the internal space 4c is closed, a seal for airtight sealing is sandwiched between the edge of the opening of the upper container 4a and the edge of the opening of the lower container 4b.

[0026] In this way, the container 4 in this embodiment is configured to be separable into upper and lower parts, but the configuration of the container 4 is not limited to this example as long as the container 4 can be opened and closed. The container 4 may also have doors, windows, etc. that can be opened and closed.

[0027] The internal space 4c accommodates a disk-shaped holding table (holding unit) 6. The holding table 6 is mainly made of non-porous metal, ceramics, hard resin, etc. A holding surface 6a located on the top surface of the holding table 6 has a plurality of openings (i.e., suction ports) 6b regularly arranged on it.

[0028] The openings 6b are spatially connected to one another inside the holding table 6 and connected to a central flow path 6c provided in the radial center of the holding table 6. The bottom surface of the holding table 6 and the radial outer side of the holding table 6 are fixed to a cylindrical frame holding part 8 with a bottom.

[0029] The holding table 6 and the frame holding part 8 are arranged concentrically. The frame holding part 8 has a disk part 8a. The holding table 6 is fixed to the upper surface of this disk part 8a. A plurality of cylindrical support parts 8b are provided on the outer periphery of the disk part 8a.

[0030] Each cylindrical support portion 8b protrudes upward from the upper surface of the disk portion 8a. The upper surfaces of the cylindrical support portions 8b are located at approximately the same position in the Z-axis direction. The multiple cylindrical support portions 8b are arranged at approximately equal intervals along the circumferential direction of the disk portion 8a.

[0031] 1 shows two cylindrical support portions 8b, the number of cylindrical support portions 8b is, for example, three, and more preferably four or more. A gap is formed between two adjacent cylindrical support portions 8b in the circumferential direction of the disk portion 8a.

[0032] Therefore, the approximately disk-shaped space defined by the disk portion 8a and the multiple cylindrical support portions 8b (i.e., the area where the holding table 6 is arranged) and the internal space 4c located outside the frame holding portion 8 are connected to each other in the radial direction of the disk portion 8a.

[0033] An opening (i.e., suction port) 8c that connects to the central flow path 6c is provided in the radial center of the upper surface of the disk portion 8a. Furthermore, a plurality of openings (i.e., suction ports) 8d are provided in the upper surface of the columnar support portion 8b at approximately equal intervals along the circumferential direction of the frame holding portion 8.

[0034] The opening 8c of the disk portion 8a and the opening 8d of the cylindrical support portion 8b are connected via a predetermined flow path formed inside the disk portion 8a and the cylindrical support portion 8b, and are connected to the opening 8e formed on the outer peripheral side surface of the disk portion 8a.

[0035] One end of a pipe 8f is connected to the opening 8e. The other end of the pipe 8f is connected to a first flow path 4b1 formed in the side plate of the lower container 4b. The pipe 8f is made of a flexible material and has a sufficient length to allow the holding table 6 and the frame holding part 8 to move up and down together.

[0036] The first flow path 4b1 is connected to a first vacuum device 14 including a vacuum pump and the like via a first electromagnetic valve 12. The negative pressure generated in the first vacuum device 14 is transmitted to each of the openings 6b and 8d via the first flow path 4b1, the pipe portion 8f, and the like. As a result, the negative pressure is transmitted to the holding surface 6a and the upper surface of each of the cylindrical support portions 8b.

[0037] In this specification, negative pressure means that the pressure relative to the ambient pressure (i.e., gauge pressure) is negative. For example, when the ambient pressure of the holding table 6 is atmospheric pressure (i.e., 1 atmosphere, or approximately 101.3 kPa) and a pressure lower than atmospheric pressure is transmitted to the holding surface 6a, it is expressed as negative pressure being transmitted to the holding surface 6a. The wafer 11, which will be described later, can be suction-held on the holding surface 6a by the negative pressure (i.e., can be suction-held).

[0038] The entire holding surface 6a excluding the opening 6b is provided with a tack layer 10. However, the tack layer 10 does not necessarily have to be provided on the entire holding surface 6a excluding the opening 6b as long as the opening 6b is exposed, and may be provided on a part of the holding surface 6a excluding the opening 6b. For example, island-shaped tack regions may be regularly arranged on the holding surface 6a.

[0039] Tack is defined in the Japanese Industrial Standards (JIS) as the property of adhering to an adherend in a short time with a light force (see JIS Z 0109:2015). The strength of the tack property can be determined, for example, using an inclined ball tack device. The inclined ball tack device includes an inclined plate having a runway and an adhesive surface on which a tack layer 10 is provided.

[0040] During the test, multiple balls of different sizes are rolled one by one from the approach path on an inclined plate. The strength of the tackiness is determined by the size of the ball when it stops on the adhesive surface for a specified time (see JIS Z 0237:2022).

[0041] The tack layer 10 is formed of silicone resin, silicone rubber, fluorine-based rubber, urethane gel, etc. For example, Flex Carrier (registered trademark) sold by U.M.I. Co., Ltd., Gel Base (registered trademark) sold by Exseal Co., Ltd., etc. can be used as the tack layer 10.

[0042] Although the tack layer 10 does not have a glue material, an adhesive material, or the like, it adheres closely to the wafer 11 and has the function of holding the wafer 11 on the holding surface 6a. For example, even if gas is blown up from the holding surface 6a, part or all of the wafer 11 can remain on the holding surface 6a due to the tack.

[0043] When a person touches the tack layer 10 with his or her hand, it may feel quite sticky. However, if the force of the gas blowing up is strong, the wafer 11 may separate from the holding surface 6a or the wafer 11 may move on the holding surface 6a.

[0044] The frame holding portion 8 is supported by a second lifting mechanism 16. The second lifting mechanism 16 has an actuator such as an air cylinder. The second lifting mechanism 16 raises and lowers the holding table 6 and the frame holding portion 8 together.

[0045] The holding surface 6a is positioned at the holding position Z1 (see FIGS. 1, 7, and 8) or the attachment position Z2 (see FIG. 9) by the second lifting mechanism 16. The second lifting mechanism 16 is supported by the lower container 4b.

[0046] A suction port 4d that is in contact with the internal space 4c is formed in the bottom plate of the lower container 4b. The suction port 4d is located at one end of a second flow path 4b2 that penetrates the bottom plate of the lower container 4b. The second flow path 4b2 is connected via a second electromagnetic valve 18 to a second vacuum device 20 that includes a vacuum pump and the like.

[0047] By exhausting the internal space 4c through the suction port 4d and the second flow path 4b2, the internal space 4c is depressurized from 101.3 kPa (ie, 1 atmosphere) to a predetermined value, for example, 20 Pa or more and 500 Pa or less.

[0048] A third flow path 4b3 is formed in a side plate of the lower container 4b at a position different from the first flow path 4b1. One end of the third flow path 4b3 is connected to the internal space 4c, and the other end of the third flow path 4b3 is connected to a pressure measuring device 22. The pressure measuring device 22 is, for example, a diaphragm pressure gauge, and measures the pressure P in the internal space 4c.

[0049] The value of the pressure P in the internal space 4c measured by the pressure measuring instrument 22 (i.e., the pressure value) is sent to the controller 40, which will be described later, and is grasped by the controller 40. The pressure measuring instrument 22 in this embodiment is a pressure gauge that measures absolute pressure. However, the pressure measuring instrument 22 may also be a pressure gauge that measures gauge pressure with the pressure transmitted to the opening 6b of the holding surface 6a as the reference (i.e., zero point).

[0050] A cylindrical roller 24 is disposed within the internal space 4c above the holding table 6 and the frame holding part 8. The roller 24 has a length in the depth direction of the page surface that is approximately the same as the outer diameter of the holding surface 6a. The roller 24 is fixed to the lower ends of a pair of arms 26 in a manner that allows it to rotate around a rotation axis 24a.

[0051] A moving block 28 is fixed to the upper end of the arm 26. The moving block 28 is slidably attached to a pair of guide rails 30. Note that FIG. 1 shows one guide rail 30. The pair of guide rails 30 are fixed to the underside of the top plate of the upper container 4a.

[0052] When the application device 2 is viewed from above, the pair of guide rails 30 pass through the center of the frame holding part 8, and both longitudinal ends of the pair of guide rails 30 protrude further than the outer periphery of the frame holding part 8 in the radial direction of the frame holding part 8. A screw shaft (not shown) is provided between the pair of guide rails 30 along the longitudinal direction of the pair of guide rails 30.

[0053] The screw shaft is rotatably connected via a plurality of balls (not shown) to a nut portion provided on the moving block 28. A drive source (not shown), such as a servo motor or a stepping motor, is fixed to one end of the screw shaft.

[0054] When the screw shaft is rotated by a drive source, the moving block 28 and roller 24 move along the pair of guide rails 30. The pair of arms 26, the moving block 28, the pair of guide rails 30, the screw shaft, the drive source, etc. constitute a roller moving mechanism 32 for moving the roller 24 along the holding surface 6a.

[0055] A fourth flow path 4b4 is provided on the top plate of the upper container 4a. One end of the fourth flow path 4b4 is connected to the internal space 4c, and the other end of the fourth flow path 4b4 is connected to the air supply source 36 via the third electromagnetic valve 34.

[0056] The air supply source 36 includes an air compressor that compresses air, a tank that stores compressed air, etc. For example, after the internal space 4c is evacuated to reduce the pressure therein to a vacuum, the exhaust of the internal space 4c is stopped and air is supplied from the air supply source 36 to the internal space 4c, whereby the internal space 4c is pressurized to 1 atmosphere.

[0057] 7, a disk-shaped wafer (object to be processed) 11, a metal ring frame 13, a resin protective tape 15, etc. The bonding device 2 is used when bonding the protective tape 15 to one surface 11a of the wafer 11 and one surface 13a of the ring frame 13 in which the wafer 11 is placed in the opening.

[0058] The wafer 11 is a single crystal substrate made of a semiconductor material such as silicon, silicon carbide, gallium nitride, etc. The wafer 11 in this embodiment is a silicon single crystal substrate having a diameter of approximately 300 mm and a thickness of 20 μm or more and 800 μm or less.

[0059] The protective tape 15 in this embodiment is a circular film having a diameter greater than the inner diameter and less than the outer diameter of one surface 13a of the ring frame 13, but the protective tape 15 may also be rectangular as long as the ring frame 13 and the wafer 11 can be integrated.

[0060] The protective tape 15 has a laminated structure of, for example, a base layer and an adhesive layer (i.e., glue layer). The adhesive layer is formed of, for example, an ultraviolet curing resin, and is adhesive when not irradiated with ultraviolet light, but loses its adhesiveness when irradiated with ultraviolet light.

[0061] Returning now to Fig. 1, the operations of the first lifting mechanism 2a, the first solenoid valve 12, the second lifting mechanism 16, the second solenoid valve 18, the roller moving mechanism 32, the third solenoid valve 34, etc. are controlled by a controller 40. The controller 40 is configured by a computer including a processor 40a, represented by a CPU (Central Processing Unit), and a memory 40b.

[0062] The memory 40b includes a main storage device such as a dynamic random access memory (DRAM) and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid state drive. Software is stored in the auxiliary storage device. The functions of the controller 40 are realized by operating the processor 40a and other components in accordance with the software.

[0063] The auxiliary storage device stores a predetermined program. As will be described in detail later, the predetermined program functions as a detection unit when executed by the processor 40a.

[0064] The detection unit detects whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6 based on the amount of change in pressure P in the internal space 4c when the internal space 4c is depressurized while the wafer 11 is held by suction on the holding table 6.

[0065] Figure 2 is a graph showing the pressure change in the internal space 4c when the second vacuum device 20 starts depressurizing the internal space 4c (see Figure 8) while the wafer 11 is held by suction on the holding surface 6a and the ring frame 13 is held by the frame holding part 8 using negative pressure.

[0066] The horizontal axis represents time [ms] (i.e., 10 -3 s). The vertical axis represents the pressure P [Pa] in absolute pressure based on an absolute vacuum. At 0 ms, a predetermined negative pressure (i.e., a gauge pressure of -90 kPa to -60 kPa based on 1 atmosphere, or an absolute pressure of approximately 10 kPa to approximately 40 kPa) has already been transmitted to the opening 6b of the holding surface 6a and the opening 8d of the frame holding part 8.

[0067] As shown in Fig. 2, within 0 ms to 1,000 ms, the second vacuum device 20 starts decompressing the internal space 4c. In the experiment that produced the graph shown in Fig. 2, the bonding device 2 was placed in an environment at room temperature (approximately 20°C), and the internal space 4c was evacuated by the second vacuum device 20 at an evacuation rate of 500 ml / min.

[0068] The plots indicated by circles (◯) in Figure 2 show the pressure P in the internal space 4c when the wafer 11 moves between 0 ms and 25,000 ms. In contrast, the plots indicated by crosses (×) show the pressure P in the internal space 4c when the wafer 11 does not move between 0 ms and 25,000 ms. The difference between the plots indicated by circles and the plots indicated by crosses is due to the difference in the type of tack layer 10.

[0069] In the circle plot, time T A(i.e., at approximately 8,900 ms), the pressure value in the internal space 4c changes from decreasing to increasing. FIG. 3 is a graph showing an enlarged portion of the graph shown in FIG. 2. Referring to FIG. 3, the change from decreasing to increasing pressure value is clearer than in FIG. 2.

[0070] The fact that the pressure value in the internal space 4c changed from a decrease to an increase means that gas has flowed into the internal space 4c through the opening 6b of the holding surface 6a. In other words, it is assumed that one of the following phenomena has occurred: (i) the wafer 11 has slid horizontally within the holding surface 6a and shifted from its initial position, or (ii) a gap has formed between the holding surface 6a and the wafer 11 due to a part of the outer periphery of the wafer 11 being lifted up. Note that the ring frame 13 does not move due to its own weight or the like.

[0071] Since the wafer 11 was not directly observed, it is not clear exactly how the wafer 11 actually moved, but the fact that the pressure value changed from decreasing to increasing is evidence that part or all of the wafer 11 moved, exposing the holding surface 6a.

[0072] By the way, in the plot shown by the circle, time T B (i.e., at about 19,300 ms), the pressure value in the internal space 4c changes from increasing to decreasing again. One possible reason for the change in the pressure value in the internal space 4c from increasing to decreasing is that the wafer 11 has returned to a state in which it blocks all of the openings 6b.

[0073] Another reason is that one or more openings 6b remain open, at least partially unblocked by wafer 11, but the flow rate of gas supplied from the open openings 6b to the internal space 4c is lower than the flow rate of gas exhausted from the internal space 4c by the second vacuum device 20, and overall, it is thought that the exhaust of the internal space 4c has progressed.

[0074] In the plot indicated by crosses, the pressure value is constant for the first 1000 ms or so (see Figure 2), but from this point onwards, the pressure value in internal space 4c never changes from a decrease to an increase, and decreases as if approaching a predetermined value of about several tens of Pa. The fact that the pressure value never changes from a decrease to an increase indicates that wafer 11 did not move at all and opening 6b was not exposed at all.

[0075] Fig. 4 is a graph showing the amount of change in pressure P per unit time in a portion of the graph shown in Fig. 3. Fig. 4 shows the amount of change (ΔP) in pressure P in a predetermined unit time (ΔT: for example, 290 ms). In the graph shown in Fig. 4, what is important is whether ΔP / ΔT (i.e., the amount of change in the value of pressure P in a predetermined unit time) is positive or negative.

[0076] In the graph shown in FIG. 4, ΔP / ΔT is the time T A is negative or zero before time T A In other words, it turns positive at time T A It can be seen that gas has already started to flow into the internal space 4c from the opening 6b.

[0077] When the amount of change in pressure P in the internal space 4c per unit time becomes positive, the detection unit of the controller 40 in this embodiment determines that an abnormality in the holding of the wafer 11 held by the holding table 6 has occurred. As a result, the controller 40 detects that an abnormality in the holding of the wafer 11 on the holding table 6 has occurred.

[0078] In this embodiment, the controller 40 grasps the pressure value of the internal space 4c, and thereby can detect whether the wafer 11 is properly held by the holding table 6. In other words, the bonding apparatus 2 can detect the occurrence of an abnormal state in which the wafer 11 is not properly held by the holding table 6.

[0079] FIG. 5 is a graph illustrating another example of the detection start timing. FIG. 5 is a graph showing the period from 0 ms to 10,000 ms extracted from the graph in FIG. 2. In FIG. 5, T 0A (approximately 662 ms), and T in the plot indicated by the cross 0B (approximately 949 ms) is the timing when the pressure in the internal space 4c starts to be reduced.

[0080] 1st Hour T 1A ,T 1B is the timing of decompression start T 0A More specifically, the first time T 1A ,T 1B is the timing of decompression start T 0A ,T 0B This is a predetermined time based on the reference time, for example, 1,000 ms.

[0081] When the predetermined time is 1,000 ms, the first time T 1A is approximately 1,662 ms (= approximately 662 ms + 1,000 ms), and the first time T 1B is approximately 1,949 ms (= approximately 949 ms + 1,000 ms).

[0082] Also, the second time T 2A ,T 2B is the timing of decompression start T 0A ,T 0B After this, it is the time when the pressure P in the internal space 4c becomes equal to the pressure that holds the wafer 11 by suction (that is, the pressure P1 transmitted to the opening 6b of the holding surface 6a).

[0083] 2nd Hour T 2A ,T 2B is calculated based on the pumping speed at which the internal space 4c is pumped (i.e., the pumping speed of the second vacuum device 20). For example, the second time T 2A ,T 2B is calculated by dividing the volume of the hollow portion in the internal space 4c by the exhaust speed.

[0084] The detection unit of the controller 40 detects the pressure reduction start timing T 0A ,T 0B From the first hour T 1A (or T 1B ) and after the second time T 2A (or T 2B ), detection of whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6 is started based on the amount of change in the pressure P in the internal space 4c.

[0085] The movement, lifting, etc. of the wafer 11 are likely to occur when the pressure P in the internal space 4c becomes equal to the pressure P1. 2A ,T 2B It is highly likely to occur after the first time T 1A (or T 1B ) before or at the second time T 2A (or T 2B ) It is believed that there is no problem in detecting a holding abnormality by the detection unit even if the previous pressure P is not monitored.

[0086] 1st Hour T 1A (or T 1B ) and after the second time T 2A (or T 2B By starting to detect whether or not a holding abnormality has occurred at a predetermined timing before the predetermined timing, there is an advantage in that the load due to calculations on the detection unit before the predetermined timing, the amount of information of the accumulated calculated values, etc. can be reduced.

[0087] The detection unit of the controller 40 detects the pressure P in the internal space 4c after the pressure P becomes equal to the pressure P1 for suction-holding the wafer 11 (i.e., after the second time T 2A ,T 2B After that, it may be possible to start detecting whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6 based on the amount of change in the pressure P in the internal space 4c.

[0088] For example, the detection unit detects the second time T 2A ,T 2BBy starting real-time monitoring of ΔP / ΔT 1,000 ms after the start of the test, it is possible to detect whether ΔP / ΔT becomes positive. This may result in missing the time when ΔP / ΔT first becomes positive.

[0089] However, if the wafer 11 moves or turns up, the time T A Even after this, ΔP / ΔT often becomes positive (see Figure 4), so it is thought that it is possible to detect a holding abnormality. A This also has the advantage that the load of calculations on the detection unit and the amount of information of the accumulated calculated values ​​can be further reduced compared to when the calculation of ΔP / ΔT is started before the start of calculation.

[0090] Incidentally, the detection unit of the controller 40 may definitively diagnose that a holding abnormality has occurred in the wafer 11 when the pressure P in the internal space 4c becomes smaller than a predetermined value (for example, a predetermined value of 20 Pa or more and 40 Pa or less) after a holding abnormality is detected.

[0091] Although a holding abnormality was detected, the fact that the pressure P in the internal space 4c dropped to the originally planned pressure means that the cause was not a leak or the like in the container 4, but rather movement or lifting of the wafer 11.

[0092] The detection unit of the controller 40 detects the time T A After a holding abnormality is detected in the wafer bonding device 2, when the pressure P in the internal space 4c drops to a predetermined value, for example, 20 Pa or more and 40 Pa or less, it is determined that a holding abnormality has occurred in the wafer 11, and the diagnosis result is displayed on the display device of the bonding device 2.

[0093] 6 to 9, a detection method for detecting abnormality in holding of the wafer 11 when depressurizing the internal space 4c of the container 4 will be described. Fig. 6 is a flow diagram of the detection method for detecting abnormality in holding of the wafer 11. In this detection method, when the holding step S10, depressurizing step S20, and bonding step S30 are performed in this order, abnormality in holding of the wafer 11 is detected in the depressurizing step S20.

[0094] 7 is a diagram showing the holding step S10. In the holding step S10, first, the container 4 is opened, the wafer 11 is placed on the holding surface 6a, and the ring frame 13 is placed on the upper surface of the frame holding portion 8.

[0095] Furthermore, the adhesive layer of the protective tape 15 is attached to one surface 13a of the ring frame 13. However, at this stage, the adhesive layer of the protective tape 15 is positioned slightly away from one surface 11a of the wafer 11 and is not in contact with the surface 11a.

[0096] After the protective tape 15 is attached to the ring frame 13, the container 4 is closed, the first solenoid valve 12 is opened, and negative pressure is transmitted to the openings 6b and 8d. As a result, the wafer 11 is suction-held by the holding surface 6a, and the ring frame 13 is suction-held by the frame holding part 8. At this time, the internal space 4c is at approximately 1 atmosphere.

[0097] Next, the pressure reduction of the internal space 4c is started. Fig. 8 is a diagram showing the pressure reduction step S20 after the holding step S10. In the pressure reduction step S20, the second solenoid valve 18 is opened while the wafer 11 is held by suction on the holding table 6, thereby starting the pressure reduction of the internal space 4c by the second vacuum device 20. Then, the pressure P of the internal space 4c is measured by the pressure measuring instrument 22, and the pressure reduction of the internal space 4c is continued.

[0098] Due to the gaps between the cylindrical support portions 8b, the space between the holding table 6 and the frame holding portion 8 is also depressurized in the same manner as the internal space 4c. During the depressurization step S20, the pressure transmitted from the first vacuum device 14 to the openings 6b and 8d is maintained substantially constant.

[0099] In the depressurization step S20, the controller 40 detects whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6, based on the amount of change in the pressure P in the internal space 4c.

[0100] For example, as described above, the detection unit of the controller 40 detects that a holding abnormality has occurred in the wafer 11 held by the holding table 6 when the change in pressure in the internal space 4c per unit time (i.e., ΔP / ΔT) becomes positive during the decompression process S20.

[0101] In the depressurization step S20, it is detected whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6, based on the amount of change in the pressure P in the internal space 4c. In other words, it is possible to detect the occurrence of an abnormal state in which the wafer 11 is not properly held by the holding table 6.

[0102] If a holding abnormality occurs, the detection unit of the controller 40 issues a warning to the worker via a speaker, warning lamp, display device, etc. (none of which are shown) provided in the application device 2 to notify the worker that a holding abnormality has occurred.

[0103] In addition, after the occurrence of a holding abnormality and after making a definitive diagnosis that a holding abnormality has occurred in the wafer 11, the detection unit of the controller 40 may communicate the result of the definitive diagnosis to the operator through a speaker, a warning lamp, a display device, etc.

[0104] If a holding abnormality occurs, the worker, for example, temporarily stops applying the protective tape 15 using the application device 2, opens the container 4 to resolve the malfunction such as misalignment of the wafer 11, or replaces the holding table 6. After the malfunction is resolved, the process returns to the holding step S10 again.

[0105] On the other hand, if no holding abnormality occurs in the depressurizing step S20, the protective tape 15 is attached to the wafer 11 and the ring frame 13 using the rollers 24. Fig. 9 is a diagram showing the attaching step S30.

[0106] In the joining step S30, the second lifting mechanism 16 slightly raises the holding table 6 and the frame holding part 8 together, and the roller moving mechanism 32 moves the roller 24 so that the roller 24 crosses the frame holding part 8 in the radial direction of the frame holding part 8. As a result, the protective tape 15 is joined to the holding table 6 and the frame holding part 8.

[0107] After the bonding step S30, the first solenoid valve 12 and the second solenoid valve 18 are closed, and the third solenoid valve 34 is opened. This causes air to be supplied from the air supply source 36 to the container 4, and the pressure P in the internal space 4c is set to atmospheric pressure. Next, air is supplied from an air supply source (not shown) to the pipe portion 8f. Thereafter, the container 4 is opened, and the integrated wafer 11, ring frame 13, and protective tape 15 are carried out.

[0108] In this embodiment, it is possible to detect the occurrence of an abnormal state in which the wafer 11 is not properly held by the holding table 6. Furthermore, if no abnormal state has occurred, it is possible to properly apply the protective tape 15 to the wafer 11.

[0109] Incidentally, the frame holding unit 8 does not necessarily have to suction and hold the ring frame 13 by negative pressure. The frame holding unit 8 may hold the ring frame 13 by clamping the ring frame 13 in a manner that makes contact with one surface 13a of the ring frame 13 and another surface of the ring frame 13 located opposite to the one surface 13a.

[0110] Second Embodiment Next, a sticking device 52 according to a second embodiment will be described with reference to Fig. 10 to Fig. 13. Fig. 10 is a partially cross-sectional side view of the sticking device 52 according to the second embodiment. In the sticking device 52, components that are the same as or substantially the same as those in the sticking device 2 described above are given the same reference numerals, and descriptions thereof will be omitted.

[0111] The attachment device 52 does not have a frame holding unit 8, and attaches the protective tape 15 only to the wafer 11. When attaching the protective tape 15 to the wafer 11, the upper container 4a and the lower container 4b are spatially separated by the protective tape 15 (see FIG. 11).

[0112] In the bonding device 52, a fourth solenoid valve 18a and a third vacuum device 20a are connected to the fourth flow path 4b4 of the upper container 4a, and a fourth solenoid valve 34a and an additional air supply source 36a are connected to the second flow path 4b2 of the lower container 4b. The third vacuum device 20a may be the same as the second vacuum device 20, and the additional air supply source 36a may also be the same as the air supply source 36.

[0113] 11 is a diagram showing the holding step S10. In the holding step S10, first, the upper container 4a and the lower container 4b are separated in the Z-axis direction, and then the wafer 11 is placed on the holding surface 6a. Next, the entire opening of the lower container 4b is covered with a protective tape 15. At this time, the adhesive layer of the protective tape 15 faces the wafer 11, and the base layer of the protective tape 15 faces the upper container 4a.

[0114] Next, the upper container 4a and the lower container 4b are moved relatively along the Z-axis direction, and the protective tape 15 is sandwiched between the opening of the upper container 4a and the opening of the lower container 4b. As a result, the internal space 4c of the container 4 is partitioned by the protective tape 15 into an upper internal space (first space) 4c1 including the holding table 6 and the wafer 11, and a lower internal space (second space) 4c2 not including the holding table 6 and the wafer 11.

[0115] Then, the first solenoid valve 12 is opened to transmit a negative pressure to the holding surface 6a. As a result, the wafer 11 is suction-held by the holding surface 6a, which has the tack layer 10 and is provided with a plurality of openings 6b. At this time, the upper internal space 4c1 and the lower internal space 4c2 are both at approximately 1 atmosphere.

[0116] Next, depressurization of the internal space 4c (i.e., the upper internal space 4c1 and the lower internal space 4c2) begins. In the depressurization step S20 of this embodiment, with the wafer 11 held by suction on the holding table 6, depressurization of the upper internal space 4c1 and the lower internal space 4c2 begins at a predetermined exhaust speed so that the upper internal space 4c1 and the lower internal space 4c2 have approximately the same pressure.

[0117] 12 is a diagram showing the depressurization step S20. As described above, in the depressurization step S20, the depressurization of the internal space 4c continues while the pressure P in the internal space 4c is measured by the pressure measuring device 22. Also, in the depressurization step S20, the controller 40 detects whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6, based on the amount of change in the pressure P in the internal space 4c.

[0118] For example, as described above, the detection unit of the controller 40 detects that a holding abnormality has occurred in the wafer 11 held by the holding table 6 when the change in pressure P in the internal space 4c per unit time (i.e., ΔP / ΔT) becomes positive during the decompression process S20.

[0119] In the depressurization step S20, the detection unit detects whether or not a holding abnormality has occurred in the wafer 11 held by the holding table 6, based on the amount of change in the pressure P in the internal space 4c. In other words, it is possible to detect the occurrence of an abnormal state in which the wafer 11 is not properly held by the holding table 6.

[0120] As in the first embodiment, after a holding abnormality is detected, when the pressure P in the internal space 4c drops to a predetermined value of 20 Pa or more and 40 Pa or less, it can be definitively diagnosed that a holding abnormality has occurred in the wafer 11.

[0121] If a holding abnormality occurs, the worker temporarily stops applying the protective tape 15, opens the container 4, and corrects the abnormality, such as misalignment of the wafer 11, or replaces the holding table 6. After correcting the abnormality, the process returns to the holding step S10. On the other hand, if no holding abnormality occurs in the depressurizing step S20, the process proceeds to the applying step S30.

[0122] 13 is a diagram showing the attaching step S30. In the attaching step S30, the second solenoid valve 18 and the fourth solenoid valve 18a are both closed. Next, the third solenoid valve 34 is opened, and the upper internal space 4c1 is set to approximately 1 atmosphere.

[0123] The pressure difference between the upper internal space 4c1 and the lower internal space 4c2 presses the adhesive layer of the protective tape 15 against the wafer 11, and the protective tape 15 is adhered to the wafer 11. Because the protective tape 15 is adhered to the wafer 11 using the pressure difference, wrinkles and the like are less likely to occur in the protective tape 15 compared to when the protective tape 15 is pressed by the roller 24.

[0124] In addition, since the protective tape 15 can be pressed downward approximately evenly, there is also the advantage that even if there are bumps or other irregularities on the surface of the wafer 11 to be attached, the occurrence of poor attachment can be reduced compared to when pressing with a roller 24.

[0125] After the attachment step S30, the fourth solenoid valve 34a is opened, and the pressure in the upper internal space 4c1 and the lower internal space 4c2 each becomes atmospheric pressure. Then, the first solenoid valve 12 is closed, and air is supplied to the first flow path 4b1 from an air supply source (not shown).

[0126] Thereafter, the container 4 is opened, and the integrated wafer 11 and protective tape 15 are carried out. Thereafter, the protective tape 15 is cut off so as to have approximately the same diameter as the wafer 11. The protective tape 15 may be cut off using a cutter (not shown) disposed inside the container 4.

[0127] (Third embodiment) Figure 14 is a diagram showing the decompression step S20 according to a third embodiment. A bonding apparatus 62 according to the third embodiment is substantially the same as the bonding apparatus 2 according to the first embodiment. However, the holding table 6 of the bonding apparatus 62 does not have a tack layer 10. The hard material constituting the holding table 6 is exposed on the holding surface 6a.

[0128] The bonding device 62 has a plurality of wafer fixing parts 64 instead of the tack layer 10. The plurality of wafer fixing parts 64 are arranged at approximately equal intervals along the circumferential direction of the holding surface 6a on the outer side of the holding table 6. This is what makes it different from the first embodiment.

[0129] The number of wafer fixing parts 64 is, for example, two, but may be three or more. Each wafer fixing part 64 is configured to be movable in the radial direction of the holding surface 6a by a predetermined actuator (not shown), such as a motor or an air cylinder.

[0130] In Figure 14, multiple wafer fixing parts 64 that have come into contact with the outer periphery of the wafer 11 by moving in a direction toward the center of the holding surface 6a are shown by solid lines, and multiple wafer fixing parts 64 that have come out of contact with the outer periphery of the wafer 11 by moving in a direction away from the center of the holding surface 6a are shown by dashed lines.

[0131] Each wafer fixing portion 64 has an upright portion arranged along the Z-axis direction. A contact portion is provided at the upper end of the upright portion, protruding from the upper end of the upright portion toward the holding table 6. The tip of the contact portion has a curved recess that can come into close contact with the chamfered portion (i.e., bevel portion) provided on the outer circumferential side surface of the wafer 11.

[0132] In the holding step S10, while the wafer 11 is held by suction on the holding surface 6a, each wafer fixing portion 64 moves toward the center of the holding surface 6a, thereby clamping the wafer 11 in the radial direction of the wafer 11 between the multiple wafer fixing portions 64.

[0133] In this state, the depressurizing step S20 and the attaching step S30 are carried out in this order. By using the wafer fixing part 64, even without the tack layer 10, the movement, curling up, etc. of the wafer 11 can be suppressed in the depressurizing step S20.

[0134] In addition, instead of clamping the wafer 11 between the multiple wafer fixing parts 64 in advance in the holding step S10, the wafer 11 may be clamped between the multiple wafer fixing parts 64 after the start of the decompression step S20 when the pressure P in the internal space 4c approaches the above-mentioned pressure P1.

[0135] Furthermore, the multiple wafer fixing parts 64 can be applied not only to the bonding apparatus 2 but also to the bonding apparatus 52 in the second embodiment (see FIGS. 10 to 13). When the multiple wafer fixing parts 64 are applied to the bonding apparatus 52, the tack layer 10 may also be omitted.

[0136] (Fourth embodiment) Figure 15 is a diagram showing the decompression step S20 according to a fourth embodiment. A bonding device 72 according to the fourth embodiment is substantially the same as the bonding device 2 according to the first embodiment. However, the bonding device 72 has a pressing member 74 arranged above the holding surface 6a instead of the tack layer 10. This is what makes it different from the first embodiment.

[0137] 15, only one pressing member 74 is disposed directly above the center of the holding surface 6a. However, the number of pressing members 74 is not limited to one. Multiple pressing members 74 may be disposed at approximately equal intervals above the holding surface 6a.

[0138] The pressing member 74 has a rod 76 arranged along the Z-axis direction. The rod 76 can be advanced and retreated along the Z-axis direction by an actuator (not shown) such as an air cylinder. In Figure 15, the rod 76 pressing the wafer 11 via the protective tape 15 is shown by a dashed line, and the rod 76 retracted upward so as not to come into contact with the protective tape 15 is shown by a solid line.

[0139] In the holding step S10, the wafer 11 is held by suction on the holding surface 6a, and the ring frame 13 is held by the frame holding part 8, and the protective tape 15 is placed on the wafer 11 and the ring frame 13.

[0140] Then, by moving the rod 76 of the pressing member 74 downward, the wafer 11 is pressed downward via the protective tape 15. As a result, the pressing member 74 presses the wafer 11 against the holding table 6 in the Z-axis direction of the bonding device 72.

[0141] In this state, the depressurizing step S20 and the attaching step S30 are carried out in this order. By using the pressing member 74, even if the tack layer 10 is not present, the wafer 11 can be prevented from moving or curling up in the depressurizing step S20.

[0142] In addition, instead of pressing the wafer 11 in advance with the pressing member 74 in the holding step S10, the wafer 11 may be pressed by the pressing member 74 after the start of the decompression step S20 when the pressure P in the internal space 4c approaches the above-mentioned pressure P1.

[0143] Furthermore, the pressing member 74 can be applied not only to the bonding device 2 but also to the bonding device 52 in the second embodiment (see FIGS. 10 to 13). When the pressing member 74 is applied to the bonding device 52, the tack layer 10 may also be omitted.

[0144] (Fifth embodiment) Figure 16 is a diagram showing the decompression step S20 according to a fifth embodiment. A bonding apparatus 82 according to the fifth embodiment is substantially the same as the bonding apparatus 2 according to the first embodiment. However, the bonding apparatus 82 does not have a tack layer 10. This is what makes it different from the first embodiment.

[0145] In the fifth embodiment, in the holding step S10, the wafer 11 is held by suction on the holding surface 6a and the ring frame 13 is held by the frame holding part 8, and the protective tape 15 is placed on the wafer 11 and the ring frame 13. Furthermore, the roller (pressing member) 24 is moved to the center of the holding surface 6a.

[0146] In this state, the second lifting mechanism 16 is operated to position the holding surface 6a at the joining position Z2, thereby pressing the wafer 11 downward via the protective tape 15. As a result, the wafer 11 is pressed against the holding table 6 in the Z-axis direction of the joining device 82.

[0147] In this state, the depressurizing step S20 and the attaching step S30 are carried out in this order. By pressing the wafer 11 with the roller 24, the movement and curling up of the wafer 11 can be suppressed in the depressurizing step S20 even without the tack layer 10.

[0148] In addition, instead of pressing down the wafer 11 with the rollers 24 in advance in the holding step S10, the wafer 11 may be pressed down with the rollers 24 after the start of the depressurization step S20 when the pressure P in the internal space 4c approaches the above-mentioned pressure P1.

[0149] The roller 24 for pressing the wafer 11 can also be applied to the bonding device 52 (see FIGS. 10 to 13) in the second embodiment. When the roller 24 is applied to the bonding device 52, the tack layer 10 may also be omitted.

[0150] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. For example, the detection of a holding abnormality in the depressurization step S20 may be performed by an operator based on the pressure P and / or ΔP / ΔT displayed on a monitor (not shown), instead of by the detection unit of the controller 40.

[0151] In the above embodiment, the holding table 6 is described as having the holding surface 6a exposed upward, but the holding table (holding unit) 6 may be arranged so that the holding surface 6a is exposed downward. In this case, a suction cup (not shown) made of rubber, synthetic resin, or the like may be used to suck a portion of the wafer 11. [Explanation of symbols]

[0152] 2, 52, 62, 72, 82: Pasting device (processing device) 2a: 1st lifting mechanism 4: container, 4a: upper container, 4b: lower container 4b1: First flow path 4b2: Second flow path 4b3: Third flow path 4b4: 4th flow path 4c: Internal space 4c1: Upper internal space (first space) 4c2: Lower internal space (second space) 4d: Suction port 6: Holding table (holding unit) 6a: holding surface, 6b: opening (suction port), 6c: central flow path 8: Frame holding part, 8a: Disk part, 8b: Cylinder support part 8c, 8d, 8e: Opening, 8f: Pipe part 10: Tuck layer 11: wafer (object to be processed), 11a: one surface 13: Ring frame, 13a: One side 12: First solenoid valve, 14: First vacuum device 15: Protective tape 16: Second lifting mechanism 18: second solenoid valve, 18a: fourth solenoid valve 20: 2nd vacuum device, 20a: 3rd vacuum device 22: Pressure measuring instrument 24: roller (pressure member), 24a: rotation shaft, 26: arm 28: Moving block, 30: Guide rail 32: Roller movement mechanism 34: Third solenoid valve, 34a: Fourth solenoid valve 36: Air supply source, 36a: Air supply source 40: Controller, 40a: Processor, 40b: Memory 64: Wafer fixing part 74: pressing member, 76: rod P: Pressure (in the internal space 4c) P1: Pressure (transmitted to the holding surface 6a) S10: Holding process S20: Decompression process S30: Pasting process T A ,TB :time T 0A ,T 0B : Timing to start decompression T 1A ,T 1B :1st Hour T 2A ,T 2B :2nd Hour Z1: Holding position, Z2: Sticking position

Claims

1. a holding unit capable of suction-holding the object to be treated at a pressure lower than atmospheric pressure; a container having an internal space in which the holding unit is housed and provided with a suction port for decompressing the internal space; a pressure measuring device for measuring the pressure in the internal space of the container; a controller having a processor and a memory and configured to grasp the pressure value measured by the pressure measuring device; A processing device comprising:

2. 2. The processing apparatus according to claim 1, wherein when the internal space of the container is depressurized while the object to be processed is suction-held by the holding unit, the controller detects whether or not a holding abnormality has occurred for the object to be processed held by the holding unit based on the amount of change in pressure in the internal space.

3. 3. The processing apparatus according to claim 2, wherein the controller detects that an abnormality has occurred in the holding of the object to be processed held by the holding unit when the amount of change in pressure in the internal space becomes positive.

4. 2. The processing apparatus according to claim 1, wherein the controller starts detecting whether a holding abnormality has occurred for the workpiece held in the holding unit based on a change in pressure in the internal space after a first time has elapsed since the start of decompression of the internal space and before a second time calculated based on an exhaust speed at which the internal space is exhausted and at which the pressure in the internal space becomes equal to the pressure at which the workpiece is suction-held.

5. 2. The processing apparatus according to claim 1, wherein the controller starts detecting whether or not a holding abnormality has occurred in the workpiece held by the holding unit based on the amount of change in pressure in the internal space after the pressure in the internal space becomes equal to the pressure at which the workpiece is suction-held.

6. 6. The processing apparatus according to claim 2, wherein the controller definitively diagnoses that a holding abnormality has occurred in the workpiece when the pressure in the internal space becomes lower than a predetermined value after a holding abnormality is detected.

7. 2. The processing apparatus according to claim 1, further comprising: a roller disposed in the internal space for applying a protective tape to the object to be processed; and a roller moving mechanism for moving the roller along the holding surface of the holding unit.

8. the internal space is partitioned by a protective tape into a first space including the holding unit and the object to be treated and a second space not including the holding unit and the object to be treated; 2. The processing apparatus according to claim 1, wherein a protective tape is applied to the object to be processed by using a pressure difference between the first space and the second space.

9. 2. The processing apparatus according to claim 1, further comprising a plurality of wafer fixing portions for sandwiching the object to be processed in a radial direction of the object to be processed.

10. 2. The processing apparatus according to claim 1, further comprising a pressing member that presses the object to be processed against the holding unit.

11. A detection method for detecting abnormality in the holding of an object to be processed when decompressing an internal space of a container in which a holding unit that suction-holds the object to be processed is accommodated, comprising: a holding step of suction-holding the object to be processed in the holding unit at a pressure lower than atmospheric pressure; a depressurization step of, after the holding step, starting to depressurize the internal space while the object to be processed is suction-held by the holding unit, and continuing to depressurize the internal space while measuring the pressure of the internal space of the container; The detection method is characterized in that, in the decompression step, it is detected whether or not a holding abnormality has occurred in the workpiece held in the holding unit based on the amount of change in pressure in the internal space.

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