Antenna module

Abstract

To provide an antenna module in which an electronic component and an antenna pattern are packaged and a transmission line between the electronic component and the antenna pattern is shortened.SOLUTION: An antenna module 100 includes an antenna part 10A, and an electronic component incorporation part 10B stacked on the antenna part 10A and having an electronic component 40 embedded in an insulating layer 22. The antenna part 10A includes an antenna layer having an antenna pattern ANT1, and a connection layer having connection patterns 13S, 13V, and 13G. The electronic component incorporation part 10B is stacked on the antenna part 10A so that a main surface 41 of the electronic component 40 including pad electrodes 42S, 42V, and 42G faces the connection layer. The connection patterns 13S, 13V, and 13G and the pad electrodes 42S, 42V, and 42G are electrically connected to each other through an anisotropic conductive material 50.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to an antenna module. [Background technology]

[0002] Patent Document 1 discloses an antenna module in which an electronic component such as an RFIC and an antenna pattern are packaged. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2022-533763 Summary of the Invention [Problem to be solved by the invention]

[0004] In this type of antenna module, it is necessary to shorten the transmission line between the electronic component and the antenna pattern.

[0005] This disclosure describes a technique for shortening a transmission line between an electronic component and an antenna pattern in an antenna module in which the electronic component and the antenna pattern are packaged. [Means for solving the problem]

[0006] An antenna module according to one aspect of the present disclosure comprises an antenna section in which a plurality of conductor layers are stacked, and an electronic component built-in section stacked on the antenna section and having a first insulating layer and an electronic component embedded in the first insulating layer, wherein the plurality of conductor layers include an antenna layer located at one end in the stacking direction and having an antenna pattern, and a connection layer located at the other end in the stacking direction and having a plurality of first connection patterns, the electronic component built-in section is stacked on the antenna section so that a main surface of the electronic component having a plurality of pad electrodes faces the connection layer, and the plurality of first connection patterns and the plurality of pad electrodes or a plurality of second connection patterns connected thereto are electrically connected to each other via an anisotropic conductive material. [Effects of the Invention]

[0007] According to the present disclosure, a technique is provided for shortening the transmission line between an electronic component and an antenna pattern in an antenna module in which the electronic component and the antenna pattern are packaged. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of an antenna module 100 according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic partial cross-sectional view of the antenna module 100. [Figure 3] FIG. 3 is a schematic cross-sectional view showing an enlarged view of the electronic component 40 and its vicinity. [Figure 4] 4(a) to 4(d) are schematic diagrams showing some examples of the relationship between the pad electrodes 42S, 42V, and 42G and the connection patterns 13S, 13V, and 13G. [Figure 5] 5(a) is a partial cross-sectional view of the pad electrode and connection pattern shown in FIG. 4(a), and FIG. 5(b) is a partial cross-sectional view of the pad electrode and connection pattern shown in FIG. 4(b). [Figure 6] FIG. 6 is a partial schematic cross-sectional view of an antenna module 200 according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] 1 is a schematic perspective view showing the appearance of an antenna module 100 according to a first embodiment of the present disclosure. The antenna module 100 is flat and has four antenna patterns ANT1 to ANT4 arranged on its front surface. A plurality of terminal electrodes are arranged on the back surface of the antenna module 100.

[0011] Fig. 2 is a partial schematic cross-sectional view of the antenna module 100. As shown in Fig. 2, the antenna module 100 includes a multilayer substrate 10 in which a plurality of conductor layers 11 to 18 and a plurality of insulating layers 21 to 27 are alternately stacked, and an electronic component 40 embedded in an insulating layer 22 within the multilayer substrate 10. The electronic component 40 may be an RFIC chip. Here, the insulating layers 21 and 23 to 27 are all core insulating layers made of a core material in which a core material is impregnated with a resin, whereas the insulating layer 22 does not include a core material that would prevent the electronic component 40 from being embedded.

[0012] The conductor layer 18 located on one outermost layer in the stacking direction of the multilayer substrate 10 is covered with a solder resist 32. The solder resist 32 forms the front surface 102 of the antenna module 100. The conductor layer 11 located on the other outermost layer in the stacking direction of the multilayer substrate 10 is covered with a solder resist 31. The solder resist 31 forms the back surface 101 of the antenna module 100. A portion of the conductor layer 11 is exposed from an opening in the solder resist 31. The exposed portion of the conductor layer 11 is used as an external terminal. The surface of the external terminal may be subjected to a surface treatment.

[0013] The multilayer substrate 10 includes an antenna section 10A having a configuration in which conductor layers 13-18 and insulating layers 23-27 are alternately stacked, and an electronic component built-in section 10B stacked on the antenna section 10A and including conductor layers 11 and 12, an insulating layer 22, and an electronic component 40 embedded in the insulating layer 22. Of the conductor layers 13-18 included in the antenna section 10A, the conductor layer 18 located at one end in the stacking direction constitutes an antenna layer having antenna patterns ANT1 and ANT2. Of the conductor layers 13-18 included in the antenna section 10A, the conductor layer 13 located at the other end in the stacking direction constitutes a connection layer having multiple connection patterns 13S, 13V, and 13G. The connection pattern 13S is a signal pattern for transmitting an RF signal. The connection pattern 13V is a power supply pattern for supplying a power supply potential to the electronic component 40. The connection pattern 13G is a ground pattern for supplying a ground potential to the electronic component 40.

[0014] The electronic component 40 built in the electronic component built-in portion 10B has a main surface 41 on which circuit elements such as transistors are formed, and a plurality of pad electrodes 42S, 42V, and 42G provided on the main surface 41. The pad electrode 42S is a signal pad for transmitting and receiving RF signals. The pad electrode 42V is a power pad for inputting a power supply potential. The pad electrode 42G is a ground pad for inputting a ground potential.

[0015] The electronic component 40 is embedded in the insulating layer 22 in the electronic component built-in portion 10B in a face-down manner, with the main surface 41 facing the antenna portion 10A. That is, the electronic component built-in portion 10B is stacked on the antenna portion 10A, with the main surface 41 of the electronic component 40 facing the conductor layer 13 constituting the connection layer. The pad electrodes 42S, 42V, and 42G of the electronic component 40 and the connection patterns 13S, 13V, and 13G of the conductor layer 13 constituting the connection layer are electrically connected to each other via an anisotropic conductive material 50. The anisotropic conductive material 50 is a material that is conductive in the stacking direction but not in a planar direction perpendicular to the stacking direction. For example, an anisotropic conductive film having a thickness of 30 μm or less can be used. In this way, by using anisotropic conductive material 50 to connect pad electrodes 42S, 42V, 42G to connection patterns 13S, 13V, 13G, respectively, manufacturing becomes easier than when connecting pad electrodes 42S, 42V, 42G to connection patterns 13S, 13V, 13G individually using solder or the like.

[0016] As described above, the electronic component 40 is supplied with a power supply potential via the connection pattern 13V and the pad electrode 42V, and with a ground potential via the connection pattern 13G and the pad electrode 42G. This allows the electronic component 40 to operate with a voltage between the power supply potential and the ground potential. An input signal supplied via an external terminal is input to the electronic component 40 via the connection pattern 13S and the pad electrode 42S. An RF signal output from the electronic component 40 is supplied to the antenna unit 10A via another connection pattern 13S and another pad electrode 42S. The RF signal supplied to the antenna unit 10A is then supplied to the antenna patterns ANT1 and ANT2 via the signal pattern and via conductors included in the antenna unit 10A.

[0017] FIG. 3 is a schematic cross-sectional view showing an enlarged view of the electronic component 40 and its vicinity.

[0018] As shown in FIG. 3 , electronic component 40 has a circuit layer 40A on which circuit elements such as transistors are formed. A main surface 41 of electronic component 40 is formed by circuit layer 40A. Circuit layer 40A is provided with a guard ring 43 that extends along the outer edge of main surface 41 to surround the circuit elements. Guard ring 43 may be formed, for example, continuously or discontinuously around the outer periphery of main surface 41 of electronic component 40. Guard ring 43 may be formed from an appropriate conductor.

[0019] In the example shown in FIG. 3 , the anisotropic conductive material 50 does not cover the entire main surface 41 of the electronic component 40, but selectively covers the central region where the pad electrodes are formed. In other words, the side surface (peripheral edge) 51 of the anisotropic conductive material 50 is located more inward than the side surface 44 of the electronic component 40. As a result, the outer periphery located near the outer edge of the main surface 41 is covered with the insulating layer 22 without being covered with the anisotropic conductive material 50. In this way, covering the outer periphery of the main surface 41 of the electronic component 40 with the insulating layer 22 improves adhesion between the insulating layer 22 and the electronic component 40. The position of the side surface 51 of the anisotropic conductive material 50 is not particularly limited as long as all the pad electrodes are covered with the anisotropic conductive material 50, and it may be located inside the guard ring 43. In other words, the outer region of the guard ring 43 may be covered with the insulating layer 22 without being covered with the anisotropic conductive material 50. This prevents contact between the anisotropic conductive material 50 and foreign matter such as burrs that may be generated when the electronic component 40 is separated and remain in the outer region of the guard ring 43, thereby improving the reliability of the product.

[0020] In the example shown in FIG. 3, an insulating member 60 is embedded in a portion between adjacent connection patterns 13S, 13V, and 13G. The insulating member 60 is made of, for example, a resin material and serves to enhance the flatness of the surface of the antenna unit 10A covered with the anisotropic conductive material 50. Here, if the thickness of the connection patterns 13S, 13V, and 13G is T1 and the thickness of the insulating member 60 is T2, T1 > T2 and 1 > T2 / T1 > 1 / 4 may be satisfied. If the relationship between thicknesses T1 and T2 is within the above range, the flatness of the surface of the antenna unit 10A is enhanced without impeding the electrical connection through the anisotropic conductive material 50, and voids are less likely to occur at the boundary between the anisotropic conductive material 50 and the antenna unit 10A. This improves product reliability.

[0021] When the thickness T2 of the insulating member 60 is thinner than the thickness T1 of the conductor layer 13 (connection patterns 13S, 13V, 13G), it is possible to reduce the connection resistance between each terminal electrode 42 and each connection pattern (connection patterns 13S, 13V, 13G) formed on the conductor layer 13. Note that when T2 is significantly greater than T1 (when the insulating member 60 is significantly thicker than the conductor layer 13), voids (air gaps) may be formed between the surface of each connection pattern formed on the conductor layer 13 and the anisotropic conductive material 50. In contrast, when each connection pattern formed on the conductor layer 13 is formed thicker than the insulating layer 60 (in other words, when the conductor layer 13 is formed so as to have a convex shape relative to the insulating layer 60), the possibility of void formation is reduced.

[0022] As illustrated in Fig. 3, the planar sizes of pad electrodes 42S, 42V, and 42G of electronic component 40 do not need to be the same, and some of the pad electrodes may be different in size from the other pad electrodes. In the example illustrated in Fig. 3, one of pad electrodes 42V is larger than the other pad electrodes. Similarly, the planar sizes of connection patterns 13S, 13V, and 13G do not need to be the same, and some of the connection patterns may be different in size from the other connection patterns. In the example illustrated in Fig. 3, one of connection patterns 13V is smaller than the other connection patterns.

[0023] 4(a) to 4(d) are schematic diagrams showing several examples of the relationship between pad electrodes 42S, 42V, and 42G and connection patterns 13S, 13V, and 13G. In the example shown in Fig. 4(a) to 4(d), 25 pad electrodes are provided on electronic component 40, of which 8 are pad electrodes 42G, 6 are pad electrodes 42V, and the remaining 11 are pad electrodes 42S. Some of the pad electrodes may be dummy pad electrodes.

[0024] 4(a), the connection patterns 13S, 13V, and 13G are larger in size than the pad electrodes 42S, 42V, and 42G. This makes it possible to ensure a sufficient overlapping area between the connection patterns 13S, 13V, and 13G and the pad electrodes 42S, 42V, and 42G even if a slight misalignment occurs when the electronic component 40 is mounted on the antenna unit 10A.

[0025] In the example shown in Figure 4(b), the multiple connection patterns 13S, 13V, and 13G are classified into two types: connection patterns with large planar sizes and connection patterns with small planar sizes. Similarly, the multiple pad electrodes 42S, 42V, and 42G are classified into two types: pad electrodes with large planar sizes and pad electrodes with small planar sizes. The connection patterns with large planar sizes and the pad electrodes with large planar sizes have the same planar size. The connection patterns with small planar sizes and the pad electrodes with small planar sizes have the same planar size.

[0026] The connection patterns with large planar sizes and the connection patterns with small planar sizes are alternately arranged in the X and Y directions, and the pad electrodes with large planar sizes and the pad electrodes with small planar sizes are alternately arranged in the X and Y directions. Pad electrodes with small planar sizes are assigned to the connection patterns with large planar sizes, and pad electrodes with large planar sizes are assigned to the connection patterns with small planar sizes.

[0027] 5(a) is a partial cross-sectional view of the pad electrode and connection pattern shown in FIG. 4(a), and FIG. 5(b) is a partial cross-sectional view of the pad electrode and connection pattern shown in FIG. 4(b).

[0028] As shown in FIG. 5(a), in the pad electrode and connection pattern shown in FIG. 4(a), the shortest distance between different potentials in the anisotropic conductive material 50 occurs on the surface of the conductor layer 13. For example, the distance D1 in the planar direction between the connection pattern 13G and the connection pattern 13S is the shortest distance between the different potentials. In contrast, as shown in FIG. 5(b), in the pad electrode and connection pattern shown in FIG. 4(b), although the shortest distance in the planar view remains the same, a component in the height direction is added to the shortest distance between the different potentials in the anisotropic conductive material 50. For example, the distance D2 between the connection pattern 13G, which has a large planar size, and the pad electrode 42S, which has a large planar size, is the shortest distance between the different potentials, and is longer than the shortest distance D1 shown in FIG. 5(a). This further improves the insulation between the different potentials.

[0029] 4(c), the planar size of the multiple pad electrodes 42S, 42V, and 42G is constant, whereas among the multiple connection patterns 13S, 13V, and 13G, the planar size of the connection patterns 13V and 13G is larger than that of the pad electrodes 42V and 42G, and the planar size of the connection pattern 13S is smaller than that of the pad electrode 42S. This can reduce the power supply impedance and improve the insulation between different signals.

[0030] 4(d), the planar size of the multiple pad electrodes 42S, 42V, and 42G is constant, while the connection pattern 13G is provided in common to eight pad electrodes 42G, and the connection pattern 13V is provided in common to six pad electrodes 42V. The planar size of the connection pattern 13S is smaller than that of the pad electrode 42S. This makes it possible to further reduce the power supply impedance.

[0031] As described above, in the antenna module 100 according to the first embodiment of the present disclosure, the multilayer substrate 10 is composed of the antenna section 10A and the electronic component built-in section 10B, the electronic component 40 included in the electronic component built-in section 10B is mounted face-down on the antenna section 10A, and the multiple pad electrodes 42S, 42V, 42G included in the electronic component 40 are connected to the connection patterns 13S, 13V, 13G included in the antenna section 10A, respectively, via the anisotropic conductive material 50. This shortens the transmission lines connecting the electronic component 40 and the antenna patterns ANT1, ANT2 and makes it easier to fabricate the module.

[0032] FIG. 6 is a partial schematic cross-sectional view of an antenna module 200 according to a second embodiment of the present disclosure.

[0033] The antenna module 200 shown in Fig. 6 differs from the antenna module 100 according to the first embodiment in the structures of the electronic component built-in portion 10B and the anisotropic conductive material 50. The antenna module 200 shown in Fig. 6 differs from the antenna module 100 shown in Fig. 2 in that the electronic component built-in portion 10B has a structure in which a plurality of conductor layers 71 to 74 and a plurality of insulating layers 81 to 83 are alternately stacked, and the anisotropic conductive material 50 is present on the entire surface between the antenna portion 10A and the electronic component built-in portion 10B. Since the other basic configuration is the same as that of the antenna module 100 shown in Fig. 2, the same elements are designated by the same reference numerals and redundant description will be omitted.

[0034] Of the conductor layers 71 to 74 included in the electronic component built-in portion 10B, the conductor layer 74 located closest to the antenna portion 10A constitutes a connection layer having a plurality of connection patterns 74S, 74V, and 74G. The connection pattern 74S is a signal pattern for transmitting an RF signal. The connection pattern 74V is a power supply pattern for supplying a power supply potential to the electronic component 40. The connection pattern 74G is a ground pattern for supplying a ground potential to the electronic component 40.

[0035] Connection patterns 74S, 74V, and 74G are connected to conductive patterns located on conductive layer 73 through via conductors provided to penetrate insulating layer 83. The conductive patterns located on conductive layer 73 are connected to corresponding pad electrodes of electronic component 40 embedded in insulating layer 82. As a result, pad electrodes 42S, 42V, and 42G of electronic component 40 are connected to connection patterns 74S, 74V, and 74G, respectively.

[0036] When the antenna portion 10A and the electronic component built-in portion 10B are bonded together via the anisotropic conductive material 50, the connection patterns 13S, 13V, and 13G exposed from the surface of the insulating layer 23 included in the antenna portion 10A and the connection patterns 74S, 74V, and 74G exposed from the surface of the insulating layer 83 of the electronic component built-in portion 10B are electrically connected to each other via the anisotropic conductive material 50.

[0037] In this embodiment, the antenna unit 10A and the electronic component built-in unit 10B can be fabricated separately. Then, the antenna unit 10A and the electronic component built-in unit 10B are bonded together via the anisotropic conductive material 50, and then singulated to complete the antenna module 200. In this case, the side surface 51 of the anisotropic conductive material 50 is exposed from the side surface of the antenna module 200 parallel to the stacking direction, and forms the same plane as the side surface of the antenna unit 10A and the side surface of the electronic component built-in unit 10B.

[0038] As described above, the antenna module 200 according to the second embodiment allows the antenna section 10A and the electronic component built-in section 10B to be fabricated separately, which facilitates design changes. Furthermore, the shortest distance between different potentials within the anisotropic conductive material 50 can also be freely adjusted by pattern design.

[0039] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0040] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0041] According to one aspect of the present disclosure, there is provided an antenna module including an antenna section including a plurality of stacked conductor layers, and an electronic component built-in section stacked on the antenna section and including a first insulating layer and an electronic component embedded in the first insulating layer, wherein the plurality of conductor layers include an antenna layer located at one end in the stacking direction and having an antenna pattern, and a connection layer located at the other end in the stacking direction and having a plurality of first connection patterns, the electronic component built-in section being stacked on the antenna section such that a main surface of the electronic component having a plurality of pad electrodes faces the connection layer, and the plurality of first connection patterns and the plurality of pad electrodes or the plurality of second connection patterns connected thereto are electrically connected to each other via an anisotropic conductive material, thereby enabling the transmission line connecting the electronic component and the antenna pattern to be shortened.

[0042] In the antenna module, the outer periphery of the main surface of the electronic component may be covered with the first insulating layer instead of being covered with the anisotropic conductive material, thereby improving adhesion between the electronic component and the first resin layer.

[0043] In the antenna module, the circuit elements formed on the main surface of the electronic component are surrounded by a guard ring, and the area outside the guard ring may be covered with the first insulating layer without being covered with the anisotropic conductive material, thereby making it possible to prevent contact between foreign matter such as burrs and the anisotropic conductive material.

[0044] In the antenna module, the plurality of pad electrodes may include first and second pad electrodes adjacent to each other, the plurality of first connection patterns may include first and second patterns adjacent to each other, the first pad electrode may be connected to the first pattern via an anisotropic conductive material, the second pad electrode may be connected to the second pattern via an anisotropic conductive material, and the planar size of the first pad electrode may be larger than the planar size of the second pad electrode, and the planar size of the first pattern may be smaller than the planar size of the second pattern, thereby making it possible to extend the shortest distance between different potentials within the anisotropic conductive material.

[0045] In the antenna module, the pad electrodes include ground pads and signal pads, the first connection patterns include ground patterns and signal patterns, the ground pads are connected to the ground patterns via an anisotropic conductive material, and the signal pads are connected to the signal patterns via an anisotropic conductive material, and the planar size of the ground patterns may be larger than the planar size of the signal patterns, thereby making it possible to reduce power supply impedance.

[0046] In the antenna module, the pad electrodes may include first and second ground pads adjacent to each other, and the first connection patterns may include a ground pattern commonly connected to the first and second ground pads via an anisotropic conductive material, thereby further reducing the power supply impedance.

[0047] In the antenna module, the antenna unit may include a second insulating layer having a surface from which the plurality of first connection patterns are exposed, the electronic component built-in unit may include a third insulating layer having a surface from which the plurality of second connection patterns are exposed, and the anisotropic conductive material may be disposed between the second insulating layer and the third insulating layer. This allows the antenna unit and the electronic component built-in unit to be fabricated separately, facilitating design changes.

[0048] In the antenna module, the anisotropic conductive material may be exposed from a side surface of the module parallel to the stacking direction, thereby preventing a gap from occurring between the antenna section and the electronic component built-in section.

[0049] In the antenna module, an insulating member may be embedded at least partially between the plurality of first connection patterns. This improves the flatness of the surface on which the anisotropic conductive material is formed. In this case, the thickness of the insulating member may be thinner than the thickness of the plurality of first connection patterns. This makes it possible to improve the flatness of the surface of the antenna unit without impeding the electrical connection by the anisotropic conductive material. [Explanation of symbols]

[0050] 10 Multilayer board 10A Antenna section 10B Built-in electronic components 11~18 Conductor layers 13S, 13V, 13G connection pattern 21~27 Insulation layer 31,32 Solder resist 40 Electronic Components 40A circuit layer 41 Main surface 42S, 42V, 42G pad electrodes 43 Guard Ring 44 Side of electronic components 50 Anisotropic conductive materials 51 Aspects of Anisotropic Conductive Materials 60 Insulating material 71~74 Conductor layers 74S, 74V, 74G connection pattern 81~83 Insulation layer 100,200 Antenna Module 101 Back of the antenna module 102 Surface of the antenna module ANT1~ANT4 antenna patterns

Claims

1. an antenna portion in which a plurality of conductor layers are laminated; an electronic component built-in section laminated on the antenna section and having a first insulating layer and an electronic component embedded in the first insulating layer; Equipped with the plurality of conductor layers include an antenna layer located at one end in a stacking direction and having an antenna pattern, and a connection layer located at the other end in the stacking direction and having a plurality of first connection patterns, the electronic component built-in portion is laminated on the antenna portion such that a main surface of the electronic component having a plurality of pad electrodes faces the connection layer; the plurality of first connection patterns and the plurality of pad electrodes or the plurality of second connection patterns connected thereto are electrically connected to each other via an anisotropic conductive material; Antenna module.

2. an outer periphery of the main surface of the electronic component is not covered with the anisotropic conductive material but is covered with the first insulating layer; The antenna module according to claim 1 .

3. a circuit element formed on the main surface of the electronic component is surrounded by a guard ring; an outer region of the guard ring is not covered with the anisotropic conductive material but is covered with the first insulating layer; The antenna module according to claim 2 .

4. the plurality of pad electrodes include first and second pad electrodes adjacent to each other; the plurality of first connection patterns include first and second patterns adjacent to each other, the first pad electrode is connected to the first pattern via the anisotropic conductive material; the second pad electrode is connected to the second pattern via the anisotropic conductive material; a planar size of the first pad electrode is larger than a planar size of the second pad electrode; a planar size of the first pattern is smaller than a planar size of the second pattern; The antenna module according to claim 1 .

5. the plurality of pad electrodes include ground pads and signal pads; the plurality of first connection patterns include a ground pattern and a signal pattern, the ground pad is connected to the ground pattern via the anisotropic conductive material; the signal pad is connected to the signal pattern via the anisotropic conductive material; a planar size of the ground pattern is larger than a planar size of the signal pattern; The antenna module according to claim 1 .

6. the plurality of pad electrodes include first and second ground pads adjacent to each other; the plurality of first connection patterns include a ground pattern commonly connected to the first and second ground pads via the anisotropic conductive material; The antenna module according to claim 1 .

7. the antenna unit includes a second insulating layer from a surface of which the plurality of first connection patterns are exposed, the electronic component built-in portion includes a third insulating layer from the surface of which the plurality of second connection patterns are exposed, the anisotropic conductive material is disposed between the second insulating layer and the third insulating layer; The antenna module according to claim 1 .

8. the anisotropic conductive material is exposed from a module side surface parallel to the stacking direction; The antenna module according to claim 7 .

9. an insulating member is embedded between at least a portion of the first connection patterns; The antenna module according to any one of claims 1 to 8.

10. The thickness of the insulating member is thinner than the thickness of the plurality of first connection patterns. The antenna module according to claim 9.

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