Sensor apparatus

Abstract

To provide a sensor apparatus capable of achieving both sensing performance and sensing distance.SOLUTION: A lens fixing portion 90 fixing a lens 80 to a lens barrel 50 is provided as a separate member from the lens barrel 50, and heat is transferred from an infrared irradiating portion 110 to the lens barrel 50 through the lens fixing portion 90. Therefore, to the extent that the heat is transferred through the separate member, thermal resistance becomes greater than when the heat is transferred to the lens barrel 50 directly from the infrared irradiating portion 110 or through the LED board 120, and the heat is not easily transferred.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a sensor device, and is suitable for application to an in-vehicle sensor such as an in-vehicle camera device, for example. [Background technology]

[0002] Patent Document 1 proposes a camera device that arranges an infrared irradiating unit around a lens and captures an object reflected in the lens by controlling the infrared irradiating unit and an imaging unit composed of an imager or the like. This camera device controls the infrared irradiating unit to simultaneously irradiate infrared light when capturing an image with the imaging unit, thereby enabling capture in dark places. The lens and infrared irradiating unit are attached to the lens mounting portion and lighting mounting portion of the housing, respectively. When the near-infrared irradiating unit generates heat due to near-infrared light, the heat is transferred to the lens, thereby removing lens fogging. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-35370 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there has been a demand for camera devices to provide clearer images and longer night vision distances, that is, to be able to sense objects at greater distances more clearly.

[0005] However, the camera device of Patent Document 1 is designed so that heat generated by the infrared irradiation unit is transferred directly from the infrared irradiation unit to the housing. Furthermore, an imager and an imager board on which the imager is mounted are located on the opposite side of the housing from the lens, and heat generated by these components is also transferred to the housing. Therefore, heat transfer from the infrared irradiation unit to the imager and imager board must be considered. To ensure the thermal life of the elements on the imager and imager board, the infrared irradiation output cannot be increased, making it difficult to extend the night-vision visibility distance. In addition, the amount of heat generated increases as the pixel count of the imager increases. This poses a challenge: it is not possible to achieve both high pixel counts and long night-vision visibility distances.

[0006] While the infrared irradiation unit is provided here for shooting in dark places or to prevent lens fogging and melt ice, similar issues arise when using other electromagnetic wave generators, not just infrared irradiation units. Furthermore, a camera device is used as an example of a sensor device, and the issue of achieving both sensing performance and sensing distance is discussed, using high pixel counts and long night vision distances as examples. However, such issues arise not only in camera devices but also in other sensor devices. For example, millimeter-wave radar is an example of a sensor device. Millimeter-wave radar can also be equipped with an electromagnetic wave generator to remove ice, but it is difficult to achieve both sensing performance and sensing distance due to the increased heat generated by the enhanced sensing performance and the heat generated by the electromagnetic wave output of the electromagnetic wave generator.

[0007] An object of the present disclosure is to provide a sensor device that can achieve both good sensing performance and a long sensing distance. [Means for solving the problem]

[0008] A sensor device according to one aspect of the present disclosure includes: A storage container (10-30), an electromagnetic wave generator (110) that is accommodated in the container and outputs electromagnetic waves toward the outside of the container, and generates heat as the electromagnetic waves are generated; an electromagnetic wave transmitting component (80) that is accommodated in the container and that constitutes an electromagnetic wave receiving port for receiving the electromagnetic waves reflected by an object outside the container, and that transmits the electromagnetic waves; a sensing element (60) disposed inside the container relative to the electromagnetic wave transmitting component; a control board (70) that is disposed inside the container relative to the electromagnetic wave transmitting component, controls the sensing element, and switches the electromagnetic wave generator between outputting and not outputting the electromagnetic wave; a housing (50) disposed between the electromagnetic wave transmitting component and the sensing element and the control board, the housing forming a path for guiding the electromagnetic waves transmitted through the electromagnetic wave transmitting component to the sensing element; a fixing portion (90) configured as a separate member from the housing and fixing the electromagnetic wave transmitting component to the housing, The electromagnetic wave generator generates heat when it outputs the electromagnetic waves, and the heat is transferred to the electromagnetic wave transmission component via the fixing portion.

[0009] In this way, the electromagnetic wave generator generates heat by outputting electromagnetic waves, and the heat is transferred to the electromagnetic wave-transmitting component, enabling anti-fogging and de-icing. The heat transfer path is from the electromagnetic wave generator to the fixed portion and then to the electromagnetic wave-transmitting component. The fixed portion is a separate member from the housing, and heat is transferred from the electromagnetic wave generator to the housing via the fixed portion. Because of this, the thermal resistance is higher and heat transfer is more difficult than when heat is transferred directly from the electromagnetic wave generator to the housing due to the separate member. This prevents excessive temperature rise in the sensing element and control board. Furthermore, suppressing temperature rise in the sensing element and control board also helps ensure the thermal life of the elements included in the sensing element and control board. This enables increased electromagnetic wave output from the electromagnetic wave generator and enhanced functionality of the sensing element, enabling both sensing performance and sensing distance to be achieved.

[0010] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a perspective view of a camera device according to a first embodiment of the present disclosure. [Figure 2] 2 is a cross-sectional view of the camera device shown in FIG. 1 taken along line II-II in the direction along the Z axis. [Figure 3] FIG. 2 is an exploded view of the camera device shown in FIG. [Figure 4] FIG. 3 is a partial enlarged view of a region R in FIG. 2. [Figure 5] 1 is a diagram showing the relationship between the optical axis of a lens barrel, the optical axis of an infrared irradiation unit, and the imaging range of a camera device. [Figure 6] FIG. 10 is a diagram showing a vehicle equipped with a camera device described in a second embodiment of the present disclosure. [Figure 7] FIG. 2 is a projection view of a side mirror showing a cross section of a camera device. [Figure 8] FIG. 2 is a partial projection view of a front fender showing a cross section of a camera device. [Figure 9] FIG. 10 is a perspective view of a camera device according to a third embodiment of the present disclosure. [Figure 10] 10 is a cross-sectional view of the camera device shown in FIG. 9 cut on a YZ plane including the optical axis. [Figure 11] 10 is a cross-sectional view of the camera device shown in FIG. 9 taken along line XI-XI in the direction along the Z axis. [Figure 12] FIG. 10 is an exploded view of the camera device shown in FIG. [Figure 13] FIG. 10 is a perspective view of a camera device according to another embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing an example of a structure in which a gap is formed between a lens fixing portion and a lens barrel, which is described in another embodiment. [Figure 15] FIG. 10 is a cross-sectional view of a camera device according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following, including other embodiments described below, identical or equivalent parts will be denoted by the same reference numerals.

[0013] (First embodiment) A first embodiment of the present disclosure will be described. In this embodiment, a camera device will be described as an example of a sensor device. This camera device is, for example, mounted on a vehicle and is used to capture images to grasp the state around the vehicle.

[0014] For convenience, the drawings accompanying this specification show the X-axis, Y-axis, and Z-axis. As shown in FIG. 1, one direction within the tip surface of camera device 1 and the direction perpendicular to that direction are designated as the X-axis and Y-axis, respectively, and the direction perpendicular to the X-axis and Y-axis is called the Z-axis. In addition, in the Z-axis direction, the end 2 of camera device 1 on the imaging side is called the tip, and the end 3 on the opposite side is called the rear end. FIG. 2 corresponds to a cross-sectional view of camera device 1 cut in the direction along the Z-axis along line II-II in FIG. 1, i.e., along a line inclined at 45 degrees to the X-axis and Y-axis.

[0015] As shown in Figures 1 to 3, the camera device 1 includes a cover 10, a case 20, a head 30, a guide 40, a lens barrel 50, an imager 60, an imager board 70, a lens 80, a lens fixing portion 90, optical components 100, an infrared irradiation portion 110, an LED board 120, a rubber gasket 130, etc.

[0016] The cover 10 constitutes a part of the housing container of the camera device 1 and constitutes a portion of the housing container on the rear end 3 side, opposite the front end 2 side where the guide 40 is arranged. When viewed from the Z-axis direction, the cover 10 has a rectangular outer shape with two sides along the X-axis and two sides along the Y-axis. One side facing the case 20 is open, forming a hollow portion 11 inside, giving the cover a generally rectangular cylindrical shape with a bottom. The cover 10 may be made of any material, but may be made of resin, for example. An opening 13 is formed in the center of the bottom 12 of the cover 10. A shielding portion 14 is disposed along the inner wall surface of the cover 10 within the hollow portion 11, and the shielding portion 14 and a portion of a terminal 15 are fitted into the opening 13, with the terminal 15 protruding to the outside of the cover 10. A connector 16 is also formed on the cover 10 so as to protrude from the bottom 12 toward the outside of the camera device 1. When this connector 16 is connected to another connector (not shown), power is supplied to the camera device 1 and image data captured by the camera device 1 is output to the outside.

[0017] A part of the lens barrel 50, the imager 60, and the imager board 70 are housed within the hollow portion 11 of the cover 10. The imager 60 and the imager board 70 are surrounded by a shield portion 14, which prevents external noise from being transmitted to the imager 60 and the imager board 70.

[0018] Case 20 constitutes part of the storage container of camera device 1, and when viewed from the Z-axis direction, has a rectangular outer shape with two sides along the X-axis and two sides along the Y-axis, and is configured as a roughly rectangular tube with a hollow portion 21 that runs through the interior along the Z-axis. Case 20 may be made of any material, but may be made of resin, for example. Case 20 houses part of lens barrel 50 and part of optical component 100 within hollow portion 21. An annular groove 22 is formed in the inner wall of case 20, and an O-ring 23 is fitted into groove 22. This O-ring 23 abuts against the outer wall surface of lens barrel 50, providing a seal between case 20 and lens barrel 50.

[0019] An engagement protrusion 24, whose outer dimensions are slightly smaller than those of the remaining portions, is formed on the end of the case 20 facing the cover 10. This engagement protrusion 24 is fitted into the hollow portion 11 of the cover 10, thereby integrating the case 20 and the cover 10. The outer dimensions of the case 20 and the cover 10, i.e., the approximate rectangle, are the same, and the faces that make up each side of the approximate rectangle form the same plane. The boundary between the case 20 and the cover 10 is welded, thereby joining the two in a tight contact state. Note that these joining methods may be other methods than welding, such as adhesion or press-fitting.

[0020] An engagement protrusion 25 is also formed on the end of case 20 facing the head 30, and this engagement protrusion 25 is fitted into the end of head 30 facing the case 20, described below, thereby fixing case 20 and head 30 together. The external shapes of case 20 and head 30, i.e., the external dimensions of the approximately rectangular shape, are the same, and the faces that make up each side of the approximately rectangular shape form the same plane. As a result, the faces of cover 10, case 20, and head 30 are all on the same plane, and the overall shape of the storage container for camera device 1 formed by these elements is a roughly rectangular parallelepiped.

[0021] Although the case 20 and the head 30 are joined by fitting, they may be joined by welding their boundary positions. Of course, other methods such as adhesion or press fitting may be used instead of welding.

[0022] The head 30 constitutes part of the housing container of the camera device 1. When viewed from the Z-axis direction, it has a rectangular outer shape with two sides along the X-axis and two sides along the Y-axis, and is a generally rectangular tube shape with a hollow portion 31 that runs through the interior along the Z-axis. The head 30 may be made of any material, but may be made of metal, for example. The head 30 accommodates a portion of the lens barrel 50, a portion of the optical component 100, a lens 80, an infrared irradiation unit 110, an LED substrate 120, a lens fixing unit 90, a rubber packing 130, and the like within the hollow portion 31. An annular groove 32 is formed in the inner wall of the head 30, and an O-ring 33 is fitted into the groove 32. The O-ring 33 abuts against the outer wall surface of the lens barrel 50, providing a seal between the head 30 and the lens barrel 50. Furthermore, a guide 40 is disposed at the end 2 of the head 30, which is closest to the tip of the camera device 1, so as to be fitted into the hollow portion 31. The guide 40, the lens 80, and the lens fixing portion 90 including an O-ring 96 (described later) prevent water from entering the hollow portion 31.

[0023] The hollow portion 31 of the head 30 has a stepped shape extending from the front end 2 toward the rear end 3 along the Z axis. Therefore, the dimensions of the hollow portion 31, i.e., the inner wall dimensions of the head 30, change in stages. Specifically, the dimensions of the hollow portion 31 at the first portion 31a, which is the most front-end side, are made to match the outer dimensions of the guide 40. The inner wall dimensions of the second portion 31b, which is closer to the rear end 3 than the first portion 31a, are smaller than those of the first portion 31a. The guide 40 is fitted into the hollow portion 31, with the boundary between the first portion 31a and the second portion 31b serving as a seat, and is adhered to the guide 40 by adhesive or the like. The inner wall dimensions of the hollow portion 31 at the third portion 31c, which is closer to the rear end than the second portion 31b, are further reduced to match the outer shapes of the lens barrel 50 and the lens fixing portion 90. The boundary between second section 31b and third section 31c serves as a mounting surface, and LED substrate 120, infrared irradiation section 110, and rubber packing 130 are disposed within hollow section 31. Furthermore, part of lens barrel 50, part of lens fixing section 90, and part of optical component 100 are disposed within third section 31c.

[0024] Guide 40 is a plate-like member that protects the functional components of camera device 1, and is made of glass, acrylic resin, or the like. Guide 40 has a rectangular outer shape with two sides along the X-axis and two sides along the Y-axis, and when attached to head 30, it prevents water from entering the interior of camera device 1 together with lens 80 and lens fixing part 90. An opening 41 is formed in the center of guide 40, and parts of lens 80 and lens fixing part 90 are exposed through this opening 41.

[0025] Lens barrel 50 corresponds to a housing that transmits light received by lens 80 to imager 60. Lens barrel 50 is configured in a tubular shape, here a substantially cylindrical shape, with a hollow portion 51 penetrating along the Z-axis direction, and is made of, for example, metal. The optical axis of lens barrel 50 is in a direction along the Z-axis, here parallel to the Z-axis.

[0026] The lens barrel 50 holds the lens 80 and other optical components 100 in a desired positional relationship, i.e., a positional relationship in which light is focused at the location where the imager 60 is disposed. Specifically, multiple optical components 100 are disposed along the Z axis within the hollow portion 51 of the lens barrel 50 and are held on the inner wall surface of the lens barrel 50. A lens housing portion 52 is formed on the front end 2 side of the lens barrel 50. The lens housing portion 52 is recessed from the front end 2 side toward the rear end 3 side, and the inner wall dimensions of the lens barrel 50 are larger than the location where the optical components 100 are disposed. The lens 80 is disposed within the lens housing portion 52, so that the lens 80 abuts against the front end of the lens barrel 50. An O-ring 53 is disposed in the lens housing portion 52 of the lens barrel 50 at a portion located on the outer periphery of the lens 80. This O-ring seals the gap between the lens 80 and the lens barrel 50 and also positions the lens 80 in the XY plane.

[0027] Furthermore, a recess 54 in which imager 60 is disposed is formed on the rear end 3 side of barrel 50, and furthermore, rear end 3 side of barrel 50 is bonded to imager substrate 70 via adhesive 55. Therefore, the positional relationship of lens 80 and optical component 100 with respect to imager 60 is set to the desired positional relationship, and light taken in through lens 80 is input to imager 60 in a focused state.

[0028] Furthermore, because the lens barrel 50 and the imager board 70 are joined together, heat generated by the imager 60 and the imager board 70 is transferred to the lens barrel 50 side when the camera device 1 is in use.

[0029] The imager 60, in other words, the image sensor, is a sensing element and is configured with a CMOS, CCD, etc. The imager 60 is arranged inside the container relative to the lens 80, and constitutes an imaging unit that receives light through the lens 80 and optical component 100 and captures an image of an object reflected in the lens 80. A high-pixel imager 60 is used to improve sensing capabilities.

[0030] The imager board 70 is a board on which an ECU (electronic control unit) including electronic components such as various elements that drive the imager 60 is mounted. In addition to controlling the imager 60, the imager board 70 also controls the on / off of the infrared irradiation unit 110, i.e., switches between outputting and not outputting infrared rays. The imager board 70, together with the imager 60, is disposed inside the housing container relative to the lens 80. The imager board 70 is a substantially rectangular plate-shaped board with two sides along the X-axis and two sides along the Y-axis, and the imager 60 is mounted on its surface, specifically, on one surface on the tip 2 side. Because the lens barrel 50 and the imager board 70 are joined, heat generated by the imager 60 and various elements provided on the imager board 70 is transmitted to the lens barrel 50 when the camera device 1 is in use.

[0031] The imager substrate 70 is also provided with a temperature sensor 71. This temperature sensor 71 detects the temperatures of the imager 60 and various elements provided on the imager substrate 70, and is used to adjust the light emission timing of the infrared irradiation unit 110. In the following description, the temperature detected by the temperature sensor 71 is referred to as a first temperature.

[0032] Terminals 15 are connected to the other side of imager board 70 opposite to imager 60, making it possible to supply power to imager 60 and various elements provided on imager board 70 and to output image data captured by imager 60. Specifically, terminal support member 15a is connected to the other side of imager board 70, and terminals 15 are fitted into terminal support member 15a. Terminals 15 protrude to the outside of cover 10 through opening 13 in cover 10.

[0033] Lens 80 is configured, for example, as a convex lens whose center is convex toward tip 2 relative to the outer edge, and is disposed at the tip of lens barrel 50. Lens 80 is made, for example, of glass, a material with a lower thermal conductivity than the material of lens barrel 50. The convex surface on the front side of lens 80 is exposed from opening 41 of guide 40, and light from outside camera device 1 is taken in through opening 41.

[0034] Lens fixing part 90 is a member that fixes lens 80 to the tip of lens barrel 50. Lens fixing part 90 is made of a material that easily transfers heat to lens 80, and in this case is made of metal. As described above, lens 80 is made of a material that has a lower thermal conductivity than the material of lens barrel 50, and therefore heat transfer to lens barrel 50 via lens 80 is more suppressed than heat transfer to lens barrel 50 via lens fixing part 90.

[0035] The lens fixing portion 90 is configured in a cylindrical shape with a bottom, and has a circular opening 92 formed in the center of the bottom 91, with the outer periphery of the lens 80 coming into contact with the portion of the bottom 91 that is positioned around the opening 92. The portion of the bottom 91 that is positioned around the opening 92 has a curved or truncated cone-shaped inner wall surface that matches the shape of the lens 80, and presses the lens 80 against the lens barrel 50 while being in close contact with the lens 80.

[0036] Specifically, a female screw groove 94 is formed on the inner wall surface of the cylindrical portion 93 of the lens fixing portion 90, and a male screw groove 56 is formed on the outer circumferential surface on the tip side of the lens barrel 50. When the lens 80 is placed at the tip of the lens barrel 50 and the lens fixing portion 90 is rotated while fitting it into the tip of the lens barrel 50, the female screw groove 94 and the male screw groove 56 screw together, and the lens fixing portion 90 is fixed to the tip of the lens barrel 50 on the lens 80 side. In this way, the lens 80 is fixed so as to be sandwiched between the lens fixing portion 90 and the tip of the lens barrel 50.

[0037] More specifically, the dimension in the Z-axis direction of the cylindrical portion 93 of the lens fixing part 90 is set so that the rear end 3 side of the cylindrical portion 93 is located closer to the imager substrate 70 than the LED substrate 120. Therefore, there is no direct contact between the lens barrel 50 and the LED substrate 120, with the cylindrical portion 93 of the lens fixing part 90 being interposed therebetween.

[0038] 4, a low thermal conductive member 140 is disposed in the portion of the region sandwiched between the lens fixing portion 90 and the lens barrel 50 that is located inside the LED substrate 120, i.e., between the cylindrical portion 93 and the lens barrel 50. It is preferable that a low thermal conductive member 140 is also disposed between the end of the cylindrical portion 93 closest to the rear end 3 and the lens barrel 50, but this is not essential. If a low thermal conductive member 140 is not disposed between the end of the cylindrical portion 93 closest to the rear end 3 and the lens barrel 50, it is preferable that a gap be formed between them.

[0039] The low thermal conductive member 140 is made of a material with low thermal conductivity. The low thermal conductive member 140 may be made of a material that makes heat transfer less likely than if the lens fixing portion 90 were in direct contact with the lens barrel 50, but a material with an even lower thermal conductivity is preferable. For example, the low thermal conductive member 140 is formed by applying a resin such as a resin adhesive to either the female screw groove 94 or the male screw groove 56.

[0040] An annular groove 95 is formed on one surface of the lens fixing part 90 facing the guide 40, i.e., on the surface facing the guide 40. An O-ring 96 is fitted into this groove 95. This seals the opening 41 of the guide 40 and the outer periphery of the lens fixing part 90, i.e., the side where the infrared irradiation part 110 is arranged, thereby waterproofing the infrared irradiation part 110.

[0041] Optical component 100 is disposed within hollow portion 51 of barrel 50, closer to imager 60 than lens 80, and in this embodiment, multiple optical components are provided, each composed of various lenses. Lens 80 and optical component 100 focus the captured light and input it to imager 60. The arrangement, number, and shape of optical component 100 are arbitrary, but they are configured so that the captured light can be focused and input to imager 60.

[0042] The infrared irradiator 110 is an electromagnetic wave generator that outputs infrared rays that become electromagnetic waves toward the outside of the container. For example, the infrared irradiator 110 is configured with a semiconductor light source such as an infrared LED (Light Emission Diode), a VCSEL (Vertical Cavity Surface Emitting Laser), or a PCSEL (Photonic Crystal Laser). Here, the infrared irradiator 110 is configured with an infrared LED. The infrared LED is approximately hemispherical, with a spherical surface on the side that irradiates infrared rays and a flat surface on the opposite side, and wiring or pads (not shown) are formed on the flat surface. The flat surface side of the infrared LED is directly mounted on one surface of the LED substrate 120. Note that, although the infrared irradiator 110 is configured with an infrared LED here, if it is configured with a VCSEL or PCSEL, it can also be configured to be directly mounted on one surface of the LED substrate 120 in the same manner as the infrared LED.

[0043] The infrared irradiation unit 110 is disposed adjacent to the lens 80 and irradiates infrared rays as electromagnetic waves toward the outside of the camera device 1. As a result, when it is dark around the camera device 1, infrared rays are irradiated toward the outside of the camera device 1 and the lens 80 serves as a receiver to receive the reflected infrared light, thereby enabling night vision. Furthermore, when the infrared irradiation unit 110 emits light, the infrared irradiation unit 110 generates heat. This heat is transferred to the lens fixing unit 90 directly or via the LED substrate 120, and then to the lens 80. Therefore, when the lens 80 is fogged or icy, the lens 80 can be de-fogging or thawed by emitting light from the infrared irradiation unit 110, regardless of whether it is dark around the camera device 1 or not.

[0044] The infrared irradiation units 110 are provided at each of the four corners of the camera device 1, which has a rectangular shape when viewed in the Z-axis direction. The optical axis of each infrared irradiation unit 110 can be any angle as long as it can irradiate infrared rays within the shooting range of the camera device 1. However, tilting the optical axis of each infrared irradiation unit 110 with respect to the optical axis of the lens barrel 50 (in this embodiment, the line C1 indicated by the dashed line in FIG. 2) is preferable because it prevents reflected infrared light from being incident on the lens 80 with excessively high intensity. As shown in FIG. 5, when the expected shooting range of the camera device 1 is a predetermined range centered on the line C1, which is the optical axis of the lens barrel 50, the optical axis L of each infrared irradiation unit 110 is tilted with respect to the line C1. For example, the optical axes L of adjacent infrared irradiation units 110 are tilted in opposite directions with respect to the line C1. Alternatively, the optical axes L of diagonally opposite ones of the four infrared irradiation units 110 are tilted in opposite directions with respect to the line C1. When the expected shooting range is 100° or more centered on the line C1, the optical axis L of the infrared irradiating units 110 is tilted so that the total irradiation range that can be covered by adjacent infrared irradiating units 110 is 100° or more. As shown in FIG. 5, for example, when the infrared irradiating units 110 are oriented at 60°, the 60° irradiation range of one infrared irradiating unit 110 and the 60° irradiation range of the other infrared irradiating unit 110 are overlapped so that the total irradiation range is 100°. In this way, infrared light can be irradiated over a wider area, enabling wider-area shooting.

[0045] The current supply wiring 110a to the infrared irradiation unit 110 is electrically connected to the imager board 70 through a through hole 111 formed in the lens barrel 50 or the like. Although not shown, the current supply wiring 110a is covered with a resin or the like and is insulated from the lens barrel 50. An ECU provided on the imager board 70 controls the supply of current to the infrared irradiation unit 110 through this current supply wiring 110a.

[0046] Furthermore, a temperature sensor 112 is provided adjacent to the infrared irradiation unit 110 or on a side of the infrared irradiation unit 110. This temperature sensor 112 detects the temperature of the infrared irradiation unit 110, and the detection result is transmitted to the imager board 70, where it is used to adjust the light emission timing of the infrared irradiation unit 110. In the following description, the temperature detected by the temperature sensor 112 is referred to as the second temperature.

[0047] The LED substrate 120 is a mounting substrate that serves as a base for holding the infrared irradiation unit 110. In this embodiment, the infrared irradiation unit 110 is directly mounted on the LED substrate 120. As shown in FIG. 3 , the LED substrate 120 has a rectangular frame shape, with a circular opening 121 in the center. The diameter of the opening 121 is matched to the outer diameter of the lens fixing unit 90, and the lens fixing unit 90 fits into the opening 121.

[0048] As described above, heat generated by the infrared irradiation unit 110 is transferred from the LED substrate 120 to the lens 80 through the lens fixing unit 90. To ensure good heat transfer, a highly heat-conductive member 150 is disposed between the LED substrate 120 and the lens fixing unit 90, as shown in FIG.

[0049] The high thermal conductivity member 150 is made of a material with high thermal conductivity, and is made of a material with at least a higher thermal conductivity than the above-mentioned low thermal conductivity member 140. The high thermal conductivity member 150 may be made of a material that allows for easier heat transfer than when the LED substrate 120 is in direct contact with the lens fixing portion 90, but a material with a higher thermal conductivity is preferable. For example, the LED substrate 120 is connected to the lens fixing portion 90 with a highly thermally conductive adhesive, and the highly thermally conductive member 150 is made of this highly thermally conductive adhesive. Either a non-conductive or conductive material may be used as the high thermal conductivity member 150, but a non-conductive material is preferred because it can also suppress leakage current.

[0050] The rubber packing 130 is a member sandwiched between the guide 40 and the head 30 to prevent water from entering between the guide 40 and the head 30. The rubber packing 130 has a rectangular frame shape with a hollow portion 131, and the four corners of the hollow portion 131 are formed as circular holes 131a that are approximately rounded to fit the shape of the infrared irradiation unit 110. The rubber packing 130 has an outer dimension larger than the inner dimension of the head 30, and the dimension of the hollow portion 131 is smaller than the outer dimension of the guide 40. This covers and seals the gap between the guide 40 and the head 30. The camera device 1 of this embodiment is configured as described above.

[0051] (Camera device operation) Next, the operation of the camera device 1 configured as described above will be described. When the camera device 1 is mounted on a vehicle, it is used to capture images to grasp the situation around the vehicle. For example, the camera device 1 operates while the vehicle is traveling or during vehicle parking assistance, and during these periods, images are captured by the imager 60.

[0052] Specifically, an ECU provided on the imager board 70 controls image capture by the imager 60, and image data captured by the camera device 1 is output to the outside via the terminal 15. Then, the image data is analyzed in the ECU provided on the imager board 70 or an ECU external to the camera device 1.

[0053] At this time, when the surroundings of the camera device 1 are bright, such as during the day, the image data is sufficiently bright, and the image is captured by the imager 60 without emitting light from the infrared irradiator 110. However, analysis of the image data may indicate that the lens 80 is fogging or frozen. In this case, the infrared irradiator 110 is made to emit light, causing the infrared irradiator 110 to generate heat. As a result, the heat generated by the infrared irradiator 110 is transferred to the lens fixing unit 90 directly or via the LED substrate 120, and then to the lens 80. Therefore, when the lens 80 is fogging or frozen, the lens 80 can be de-fogging or thawed by emitting light from the infrared irradiator 110, even if the surroundings of the camera device 1 are bright.

[0054] Furthermore, in situations where the surroundings of the camera device 1 are dark, such as at night, the image data is not bright enough, so the infrared irradiating unit 110 emits light and receives the infrared light reflected by objects present around the camera device 1, thereby capturing images with the imager 60. This allows clear image data to be obtained even at night.

[0055] Furthermore, when the infrared irradiation unit 110 is made to emit light, the first temperature and the second temperature are sensed by the temperature sensor 71 and the temperature sensor 112, and based on the sensed temperatures, the ECU provided on the imager board 70 automatically adjusts the light emission timing of the infrared irradiation unit 110.

[0056] For example, a period when the amount of input light is low and the surroundings of the camera device 1 are dark, or when the imaging data indicates that the lens 80 is clouded or icy, is a period when light emission is necessary. Therefore, this period is designated as a required light emission period, and the infrared irradiator 110 is caused to emit light during this required light emission period. Until the first temperature and the second temperature exceed their respective predetermined thresholds, the infrared irradiator 110 is caused to emit light continuously and without interruption during the required light emission period. Then, when one or both of the first temperature and the second temperature exceed the predetermined threshold, the light emission of the infrared irradiator 110 is limited compared to before the temperature exceeded the threshold. For example, during the required light emission period, the infrared irradiator 110 may perform intermittent operation, in which light emission is intermittently performed, or thinned-out operation, in which light emission is thinned out.

[0057] In intermittent operation, infrared radiation is emitted simultaneously by all infrared radiation units 110, but this is done intermittently, lengthening the time interval between image captures and reducing the number of frames. In thinning operation, only a portion of the multiple infrared radiation units 110, for example, two out of four, emit infrared radiation, preferably periodically switching the infrared radiation units 110 that emit light. By limiting the emission of the infrared radiation units 110 in this way, the overall light intensity is reduced, thereby suppressing temperature increases in the infrared radiation units 110 even when the visible distance is shortened, and preventing excessive temperature increases in the imager substrate 70 due to heat transfer from the infrared radiation units 110. Either intermittent operation or thinning operation may be performed alone, or both may be performed. For example, intermittent operation and thinning operation may be performed in combination by intermittently emitting infrared radiation using two out of four units.

[0058] (Actions and Effects of Camera Device 1) In the camera device 1 of the present disclosure described above, the infrared irradiation unit 110 emits light to generate heat, and the heat is transferred to the lens 80, thereby enabling the lens 80 to be de-fogging and de-iced. At this time, the heat is transferred from the infrared irradiation unit 110 to the lens fixing unit 90 directly or via the LED substrate 120, and then to the lens 80. Then, heat is transferred to the lens barrel 50 to which the imager substrate 70 is connected via the lens fixing unit 90, not directly from the infrared irradiation unit 110 or via the LED substrate 120.

[0059] In this way, the lens fixing portion 90 that fixes the lens 80 to the lens barrel 50 is provided as a separate member from the lens barrel 50, and heat transfer from the infrared irradiation portion 110 to the lens barrel 50 is achieved via the lens fixing portion 90. Because of this, the thermal resistance is greater and heat transfer is more difficult than when heat is transferred directly from the infrared irradiation portion 110 or from the LED substrate 120 to the lens barrel 50 due to the separate member. This prevents excessive temperature rise in the imager 60 and the imager substrate 70. Furthermore, by preventing temperature rise in the imager 60 and the imager substrate 70, it becomes easier to ensure the thermal life of the elements included in the imager 60 and the imager substrate 70. This makes it possible to increase the irradiation output of the infrared irradiation portion 110 and increase the pixel count of the imager 60, thereby achieving both high pixel count and a longer night-vision visibility distance, i.e., achieving both sensing performance and sensing distance. Furthermore, the lifespan of electronic components can be extended, improving the reliability of the camera device 1.

[0060] Furthermore, the camera device 1 of the present disclosure also provides the following effects.

[0061] (1) The first temperature and the second temperature are sensed, and the light emission of the infrared irradiating unit 110 during the period when light emission is required is automatically adjusted according to those temperatures. For example, by operating the infrared irradiating unit 110 intermittently or thinning out the operation during the period when light emission is required, heat generation by the infrared irradiating unit 110 is suppressed. This further suppresses excessive temperature rise in the imager 60 and the imager substrate 70, making it possible to achieve both higher pixel counts and longer night vision visibility distances.

[0062] Also, the ECU provided on the imager board 70 may acquire vehicle speed information and control the operation of the infrared irradiation unit 110 in accordance with the vehicle speed. The ECU provided on the imager board 70 can calculate the vehicle speed by analyzing image data, and can obtain vehicle speed information from another external ECU, etc.

[0063] The higher the vehicle speed, the shorter the time it takes for the vehicle to collide with an object ahead. Therefore, a long visible distance and a short image acquisition time interval are required when traveling at high speeds. On the other hand, when traveling at low speeds, where the time it takes for the vehicle to collide with an object is relatively long, there is ample time for the driving assistance system to take action to avoid danger. Therefore, when traveling at low speeds, reducing the output of the infrared irradiator 110 has a relatively small impact on the driving assistance system compared to when traveling at high speeds. Therefore, it is preferable to operate the infrared irradiator 110 intermittently or with a reduced output when traveling at low speeds, where the wind speed is low and the heat dissipation effect is reduced. For example, a predetermined vehicle speed threshold may be set, and when the vehicle speed is below the threshold, the light emission rate of the infrared irradiator 110 per unit time during the light emission required period, due to the intermittent or reduced output, may be reduced compared to when the vehicle speed is above the threshold.

[0064] (2) The infrared irradiation unit 110 is directly mounted on the LED substrate 120. This improves heat transfer efficiency compared to when some member is interposed between the infrared irradiation unit 110 and the LED substrate 120. This makes it easier for heat to be transferred to the lens 80, reducing the amount of light emitted by the infrared irradiation unit 110 required for anti-fogging and de-icing of the lens 80, thereby enabling the imager 60 to have a higher pixel count.

[0065] Furthermore, a highly heat-conductive member 150 is disposed between the LED substrate 120 and the lens fixing portion 90. This improves the efficiency of heat transfer from the LED substrate 120 to the lens fixing portion 90, making it possible to further achieve the above-mentioned effects.

[0066] (3) A low thermal conductive member 140 is disposed between the lens barrel 50 and the lens fixing part 90. This makes it difficult for heat to be transferred from the lens fixing part 90 to the lens barrel 50. This further prevents excessive temperature rise in the imager 60 and the imager substrate 70, making it possible to achieve both higher pixel counts and longer night vision and visibility distances.

[0067] (4) The optical axis of the infrared irradiator 110 is tilted relative to the optical axis of the lens barrel 50. This prevents reflected infrared light from being incident on the lens 80 with excessively high intensity, and allows infrared light to be irradiated over a wider area, enabling wider-area photography.

[0068] (Second embodiment) A second embodiment of the present disclosure will be described. In this embodiment, a preferred application form of the camera device 1 will be described. Since the structure of the camera device 1 itself is the same as that of the first embodiment, only the application form of the camera device 1 will be described here.

[0069] In this embodiment, as shown in FIG. 6 , the camera device 1 is mounted on a vehicle, and four camera devices 1 are installed in two locations on the vehicle 4, one on each side of the vehicle 4. Specifically, camera device 1a is installed below the side mirror 5 of the vehicle 4, and camera device 1b is installed behind the front wheel inside the front fender 6. FIGS. 7 and 8 are projection views of the locations where each camera device 1 is installed, viewed from above, and the camera device 1 is shown in cross section. However, for ease of understanding, the cross section of the camera device 1 is shown as a cross section obtained by cutting the camera device 1 in a plane inclined at 45° with respect to the X-axis and Y-axis in FIG. 1 and along the Z-axis, as in FIG. 2 . For convenience, the position of the side mirror 5 is indicated by a dotted line in FIG. 7 .

[0070] 7, for the camera device 1 installed below the side mirror 5, a straight line C1 serving as the optical axis of the lens barrel 50 is tilted at a predetermined angle θ, for example, 15° or more, with respect to a straight line C2 along the longitudinal direction of the vehicle 4 so as to capture an image diagonally ahead of the vehicle 4. Here, the straight line C1 serving as the optical axis of the lens barrel 50 is parallel to the horizontal plane, but the straight line C1 may also be tilted with respect to the horizontal plane.

[0071] 8, for camera device 1 installed inside front fender 6, straight line C1, which serves as the optical axis, is tilted at a predetermined angle θ, for example, 15° or more, with respect to straight line C2 so as to photograph an area diagonally rearward of vehicle 4. Straight line C1, which serves as the optical axis of lens barrel 50 of camera device 1b, is also parallel to the horizontal plane, but straight line C1 may also be tilted with respect to the horizontal plane.

[0072] The predetermined angle θ here is arbitrary, but is preferably, for example, 15° or more and 90° or less. That is, when the optical axis of the lens barrel 50 is tilted relative to the longitudinal direction of the vehicle 4, the guide 40 of the camera device 1 is also tilted relative to the longitudinal direction of the vehicle 4. Therefore, as shown in FIGS. 7 and 8 , for example, the traveling wind 7 from the front of the vehicle 4 flows along the surface of the guide 40 toward the lens 80, and can be made to strike the lens fixing portion 90 through the opening 41 of the guide 40 before striking the lens 80. In this manner, the lens fixing portion 90 is positioned upstream and the lens 80 is positioned downstream relative to the flow of the traveling wind 7. Therefore, the lens fixing portion 90 is easily cooled, and the lens 80 is less likely to be cooled by the air heated by the lens fixing portion 90. This makes it possible to prevent the lens 80 from fogging or freezing.

[0073] (Third embodiment) A third embodiment of the present disclosure will be described. This embodiment is different from the first embodiment in the structure of the storage container, etc., but is otherwise similar to the first embodiment, so only the differences from the first embodiment will be described.

[0074] 9 to 12, in this embodiment, head 30 is provided with a heat dissipation structure. Head 30 is made of a metal that easily transfers heat. Specifically, heat dissipation fins 34 are provided on the outer wall surface of head 30. Heat dissipation fins 34 have a structure that spreads out in a circular shape in the radial direction from lens barrel 50 as the center, and are configured by forming a plurality of recesses 35 on the outer wall surface of head 30 that are recessed radially inward from lens barrel 50 as the center.

[0075] Furthermore, the outer peripheral wall of the case 20 is recessed in the Z-axis direction more than the inner peripheral wall to provide a wider area for arranging the heat dissipation fins 34. The outer peripheral wall of the head 30 protrudes further along the straight line C1 than the inner peripheral wall, and the head 30 fits into the recessed portion of the case 20.

[0076] In this way, providing a heat dissipation structure in head 30 makes it possible to cool lens barrel 50. This prevents temperature increases in imager 60 and imager substrate 70, making it easier to ensure the thermal life of the elements provided in imager 60 and imager substrate 70, and making it possible to achieve both better sensing performance and sensing distance.

[0077] Furthermore, in this embodiment, the head 30 has an integrated bracket structure. Specifically, the head 30 has a rectangular outer shape when viewed from the Z-axis direction, and brackets 36 protrude along the X-axis direction from two faces that form two sides along the Y-axis direction. The bracket 36 is a component for attaching the camera device 1 to the body of the vehicle 4, which serves as an attachment target. For example, the camera device 1 is attached to the body by inserting a screw (not shown) into a hole 36a provided in the bracket 36.

[0078] In this way, the head 30 can also be made to have an integrated bracket structure. In this case, as shown by the arrows in FIG. 10 , heat transferred from the infrared irradiation unit 110 to the head 30 is transferred to the mounting surface through the bracket 36, making it possible to cool the LED substrate 120. In particular, if the head 30 is made of a metal that easily transfers heat, the LED substrate 120 is more easily cooled. By providing such a bracket 36, temperature increases in the imager 60 and imager substrate 70 are suppressed, making it easier to ensure the thermal life of the elements provided in the imager 60 and imager substrate 70. Therefore, it is possible to achieve both improved sensing performance and longer sensing distance.

[0079] The heat dissipation fins 34 and bracket 36 may be separate components from the head 30 and fixed to the periphery of the head 30. However, by combining the head 30, heat dissipation fins 34, and bracket 36 into a single component, as in this embodiment, it is possible to improve assembly ease and reduce thermal resistance, enabling the LED substrate 120 to dissipate heat more effectively.

[0080] 10 to 12, a metal ground spring 160 is provided at the boundary between the cover 10 and the case 20. This ground spring 160 prevents the lens barrel 50 from wobbling relative to the case 20 and also prevents external noise from being transmitted to the imager 60 and the imager board 70. The guide 40 is divided into two members: a first guide portion 42 that covers the infrared irradiation portion 110, and a second guide portion 43 that covers the surface of the first guide portion 42. With this configuration, it is possible to separate the roles of the first guide portion 42 and the second guide portion 43, for example, by using a material suitable for guiding light for the first guide portion 42 and a material with high durability for the second guide portion 43.

[0081] (Other embodiments) Although the present disclosure has been described based on the above-described embodiment, it is not limited to the embodiment and encompasses various modifications and modifications within the equivalent range. In addition, various combinations and forms, as well as other combinations and forms including only one element, more than one element, or less than one element, are also within the scope and spirit of the present disclosure.

[0082] (1) For example, the infrared irradiation unit 110 is attached to the head 30 via the LED substrate 120, but the LED substrate 120 may be eliminated. In that case, for example, the LED substrate 120 may also be configured as a single member by using the lens fixing unit 90, or the infrared irradiation unit 110 may be directly attached to the head 30.

[0083] (2) In the third embodiment described above, the heat dissipation structure is provided with both the heat dissipation fins 34 and the brackets 36, but it is also possible to provide only one of them, for example, a structure in which only the heat dissipation fins 34 are provided for the head 30 as shown in FIG. 13.

[0084] (3) In each of the above embodiments, the low thermal conductive member 140 is disposed between the male screw groove 56 of the lens barrel 50 and the female screw groove 94 of the lens fixing portion 90. However, a structure without the low thermal conductive member 140 is also possible. Furthermore, when the lens barrel 50 and the lens fixing portion 90 are fixed together using a screw structure, it is preferable to form a gap between the male screw groove 56 and the female screw groove 94. As shown in FIG. 14 , the cross-sectional shapes of the threads of the male screw groove 56 and the female screw groove 94 are formed by repeating triangles. In this case, one of two adjacent sides of the triangles constituting the threads abuts against each other, while the other sides are spaced apart, forming a gap 170 between them. Forming a gap 170 between the male screw groove 56 and the female screw groove 94 in this way increases thermal resistance and further reduces heat transfer from the lens fixing portion 90 to the lens barrel 50.

[0085] (4) In each of the above embodiments, the lens 80 is de-fogging or thawed based on the heat generated by the infrared irradiator 110. In addition, as shown in FIG. 15 , a lens heater 180 may be provided on the rear surface of the lens 80, and the lens 80 may be de-fogging or thawed by heating using the lens heater 180. In other words, in a configuration in which the lens heater 180 is used to de-fogging or thaw based on the heat generated by the infrared irradiator 110, the lens heater 180 may be provided or not. Of course, if the lens heater 180 is used for both purposes, the heat generated by the infrared irradiator 110 and the heat generated by the lens heater 180 can be selectively used, thereby making it possible to more efficiently de-fogging or thaw the lens 80.

[0086] (5) In each of the above embodiments, the infrared irradiating unit 110 may be mounted directly on the lens fixing unit 90 without the LED substrate 120. In this case, the LED substrate 120 may be disposed in a portion of the lens fixing unit 90 where the infrared irradiating unit 110 is not disposed.

[0087] (6) In the above embodiments, the camera device 1 in which the electromagnetic wave generator is the infrared irradiation unit 110 is given as an example of a sensor device. The electromagnetic wave transmitting component constituting the electromagnetic wave receiving port is the lens 80, the fixing portion of the electromagnetic wave transmitting component is the lens fixing portion 90, and the housing is the lens barrel 50. The electromagnetic wave receiving element is the imager 60, the control board on which the electromagnetic wave receiving element and various elements that drive it are provided is the imager board 70, and the mounting board on which the infrared irradiation unit 110 is mounted is the LED board 120. These are merely examples, and the present invention can be applied to other sensor devices that use electromagnetic waves.

[0088] For example, the present disclosure can be applied to a sensor device, such as a millimeter-wave radar, that measures the relative distance to an object by outputting millimeter waves as electromagnetic waves from an electromagnetic wave generator and receiving the millimeter waves with a millimeter-wave receiving element. In the case of a millimeter-wave radar, the electromagnetic wave transparent component is a cover glass or the like that covers the surface of the millimeter-wave radar, and the component that forms the path through which the millimeter waves pass between the cover glass and the millimeter-wave receiving element is the housing.

[0089] (7) In the above embodiments, the camera device 1 corresponding to the sensor device has been described as being mounted on a vehicle, but the present invention is not limited to being mounted on a vehicle. However, in vehicle-mounted sensor devices, the distances between components are shortened to meet the demand for miniaturization, which poses a problem of heat being easily transferred from the electromagnetic wave generator to the substrate on which the electromagnetic wave receiving element and various elements that drive it are mounted. For this reason, it is particularly effective to apply the present disclosure to miniaturized vehicle-mounted sensor devices.

[0090] Furthermore, in the present embodiment, an example has been described in which the rear end 3 side of the lens barrel 50 is joined to the imager substrate 70 via adhesive 55, but the method of joining the imager substrate 70 and lens barrel 50 is not limited thereto. For example, the imager substrate 70 and lens barrel 50 may be joined via solder, or the imager substrate 70 may be joined to the cover 10 or the case 20 with screws or the like, and heat may be transferred to the lens barrel 50 via the cover 10 or the case 20. This is particularly effective for a sensor device in which the lens barrel 50 is a heat path. The number of substrates inside the sensor device is also not limited to two, the imager substrate 70 and the LED substrate 120, as in the present disclosure, but may be three or more, for example, by configuring the imager substrate 70 with multiple substrates.

[0091] (8) The above embodiments are not unrelated to each other and can be combined as appropriate unless the combination is clearly impossible. It goes without saying that the elements constituting the embodiments in the above embodiments are not necessarily essential unless they are specifically stated as essential or are clearly considered essential in principle. In the above embodiments, when the number, numerical value, amount, range, or other numerical value of the components of the embodiments is mentioned, it is not limited to that specific number unless it is specifically stated as essential or is clearly limited to a specific number in principle. In the above embodiments, when the shape, positional relationship, etc. of the components, etc. are mentioned, it is not limited to that shape, positional relationship, etc. unless it is specifically stated or is clearly limited to a specific shape, positional relationship, etc. in principle.

[0092] (Aspects of the present disclosure) The present disclosure described above can be understood from the following viewpoints, for example. [First viewpoint] A sensor device, A storage container (10-30), an electromagnetic wave generator (110) that is accommodated in the container and outputs electromagnetic waves toward the outside of the container, and generates heat as the electromagnetic waves are generated; an electromagnetic wave transmitting part (80) that is accommodated in the container and that constitutes an electromagnetic wave receiving port for receiving the electromagnetic waves reflected by an object outside the container, and that transmits the electromagnetic waves; a sensing element (60) disposed inside the container relative to the electromagnetic wave transmitting component; a control board (70) that is disposed inside the container relative to the electromagnetic wave transmitting component, controls the sensing element, and switches the electromagnetic wave generator between outputting and not outputting the electromagnetic wave; a housing (50) disposed between the electromagnetic wave transmitting component and the sensing element and the control board, the housing forming a path for guiding the electromagnetic waves transmitted through the electromagnetic wave transmitting component to the sensing element; a fixing portion (90) configured as a separate member from the housing and fixing the electromagnetic wave transmitting component to the housing, The electromagnetic wave generator generates heat when it outputs the electromagnetic waves, and the heat is transferred to the electromagnetic wave transmission component via the fixing portion. [Second viewpoint] The sensor device according to a first aspect, wherein the control board detects at least one of a first temperature, which is the temperature of the sensing element, and a second temperature, which is the temperature of the electromagnetic wave generator, and automatically switches between a case where the electromagnetic wave generator outputs the electromagnetic wave and a case where it does not output the electromagnetic wave, based on the sensing result of the electromagnetic wave by the sensing element and the first temperature and the second temperature. [Third Perspective] The sensor device according to a second aspect, wherein when the detection result indicates that the first temperature or the second temperature is high, the control board reduces the rate of generation of the electromagnetic waves per unit time by performing either an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic waves, or a thinning operation in which, if multiple electromagnetic wave generators are provided, only some of the multiple electromagnetic wave generators output the electromagnetic waves, compared to when the first temperature or the second temperature is not high. [Fourth viewpoint] The sensor device according to any one of the first to third aspects, wherein the electromagnetic wave generator is directly mounted on the fixed part. [Fifth viewpoint] a mounting substrate (120) on which the electromagnetic wave generator is directly mounted; The sensor device according to any one of the first to third aspects, wherein the electromagnetic wave generator is connected to the fixed portion via the mounting board. [Sixth viewpoint] The sensor device according to a fifth aspect, wherein the mounting substrate is connected to the fixed portion via a highly thermally conductive member (150) that facilitates heat transfer compared to direct contact between the mounting substrate and the fixed portion. [Seventh viewpoint] The sensor device according to any one of the first to sixth aspects, wherein a low thermal conductivity member (140) is arranged between the housing and the fixed portion, making heat transfer less likely than if the housing and the fixed portion were in direct contact. [Eighth viewpoint] A male screw groove (56) is formed in the housing, and a female screw groove (94) is formed in the fixing portion, the male screw groove and the female screw groove are threadedly engaged with each other, whereby the fixing portion is fixed to a tip of the housing on the electromagnetic wave transmission component side, The sensor device according to any one of the first to sixth aspects, wherein a gap (170) is formed between the threads of the male screw groove and the threads of the female screw groove. [Ninth viewpoint] The container has a head (30) in which the electromagnetic wave generator, the electromagnetic wave transmission part, and the fixing part are accommodated, The head is integrally formed with a bracket (36) that is attached to a mounting member (4) on which the sensor device is to be mounted. The sensor device according to any one of the first to eighth aspects, wherein heat generated by the electromagnetic wave generator is transmitted to the head and further transmitted to the mounting member via the bracket. [10th viewpoint] The sensor device according to any one of the first to ninth aspects, which is an on-board camera device attached to a vehicle (4). [11th viewpoint] The electromagnetic wave generator is an infrared irradiation unit (110) configured with a semiconductor light source configured with any one of an infrared LED, a VCSEL, and a PCSEL that outputs infrared rays as the electromagnetic waves, The sensing element is an imager (60) that captures the outside. the control board is an imager board (70) that controls the imager, the electromagnetic wave transmitting component is a lens (80) that receives reflected light of the infrared ray output from the infrared ray irradiator, The sensor device according to a tenth aspect, wherein the housing is a lens barrel (50) that transmits the reflected light of the infrared light received by the lens to the imager. [12th viewpoint] The sensor device according to an eleventh aspect, wherein an optical axis (L) of the infrared irradiating unit is tilted with respect to an optical axis (C1) of the lens barrel. [13th viewpoint] The sensor device according to the eleventh or twelfth aspect, wherein the electromagnetic wave transmitting component is made of a material having a lower thermal conductivity than the housing. [14th viewpoint] A sensor device according to any one of the eleventh to thirteenth aspects, wherein the optical axis of the lens barrel is inclined by 15° or more with respect to a straight line (C2) along the longitudinal direction of the vehicle, and the sensor device is arranged so that wind (7) from the vehicle as it travels hits the fixed portion and then flows toward the electromagnetic wave transparent component. [15th viewpoint] The sensor device is an in-vehicle camera device mounted on a vehicle (4), The electromagnetic wave generator is an infrared irradiation unit (110) configured with a semiconductor light source configured with any one of an infrared LED, a VCSEL, and a PCSEL that outputs infrared rays as the electromagnetic waves, The sensing element is an imager (60) that captures the outside. the control board is an imager board (70) that controls the imager, the electromagnetic wave transmitting component is a lens (80) that receives reflected light of the infrared ray output from the infrared ray irradiator, the housing is a lens barrel (50) that transmits the reflected light of the infrared light received by the lens to the imager; The imager board acquires vehicle speed information, and when the vehicle speed indicated by the vehicle speed information is equal to or less than a predetermined vehicle speed threshold, performs either an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic waves, or a thinning operation in which, when a plurality of the electromagnetic wave generators are provided, only some of the plurality of electromagnetic wave generators output the electromagnetic waves, thereby reducing the rate of generation of the electromagnetic waves per unit time, compared to when the vehicle speed indicated by the vehicle speed information is greater than the vehicle speed threshold. [Explanation of symbols]

[0093] 1...camera device, 4...vehicle, 5...side mirror, 6...front fender, 10...cover, 14...shield portion, 15...terminal, 16...connector, 20...case, 30...head, 34...heat dissipation fin, 35...recess, 36...bracket, 40...guide, 41...opening, 50...lens barrel, 51...hollow portion, 56...male thread groove, 60...imager, 70...imager board, 71...temperature sensor, 80...lens, 90...lens fixing portion, 100...optical component, 110...infrared irradiation portion, 112...temperature sensor, 120...LED board, 130...rubber packing, 140...low thermal conductive member, 150...high thermal conductive member, 160...grounding spring, 170...gap

Claims

1. A sensor device, A storage container (10 to 30); an electromagnetic wave generator (110) that is accommodated in the accommodation container, outputs electromagnetic waves toward the outside of the accommodation container, and generates heat as the electromagnetic waves are generated; an electromagnetic wave transmitting part (80) that is accommodated in the accommodation container, constitutes an electromagnetic wave receiving port that receives the electromagnetic waves reflected by an object outside the accommodation container, and transmits the electromagnetic waves; a sensing element (60) disposed inside the container relative to the electromagnetic wave transmitting part; a control board (70) that is arranged inside the container with respect to the electromagnetic wave transmitting component, controls the sensing element, and switches between a state in which the electromagnetic wave generator outputs the electromagnetic wave and a state in which it does not output the electromagnetic wave; a housing (50) disposed between the electromagnetic wave transmitting component and the sensing element and the control board, and constituting a path for guiding the electromagnetic waves transmitted through the electromagnetic wave transmitting component to the sensing element; a fixing portion (90) configured as a separate member from the housing and fixing the electromagnetic wave transmitting component to the housing, The electromagnetic wave generator generates heat when it outputs the electromagnetic waves, and the heat is transferred to the electromagnetic wave transmission component via the fixing portion.

2. 2. The sensor device according to claim 1, wherein the control board detects at least one of a first temperature that is the temperature of the sensing element and a second temperature that is the temperature of the electromagnetic wave generator, and automatically switches between a state in which the electromagnetic wave generator outputs the electromagnetic wave and a state in which it does not output the electromagnetic wave based on the sensing result of the electromagnetic wave by the sensing element and the first temperature and the second temperature.

3. 3. The sensor device according to claim 2, wherein when the detection result indicates that the first temperature or the second temperature is high, the control board reduces the rate of generation of the electromagnetic waves per unit time by performing either an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic waves, or a thinning operation in which, if multiple electromagnetic wave generators are provided, only some of the multiple electromagnetic wave generators output the electromagnetic waves, compared to when the first temperature or the second temperature is not high.

4. 4. The sensor device according to claim 1, wherein the electromagnetic wave generator is directly mounted on the fixed part.

5. a mounting substrate (120) on which the electromagnetic wave generator is directly mounted; The sensor device according to claim 1 , wherein the electromagnetic wave generator is connected to the fixed portion via the mounting board.

6. 6. The sensor device according to claim 5, wherein the mounting substrate is connected to the fixed portion via a highly thermally conductive member (150) that facilitates heat transfer compared to direct contact between the mounting substrate and the fixed portion.

7. The sensor device according to claim 1, wherein a low thermal conductivity member (140) is arranged between the housing and the fixed portion, which makes heat transfer less likely than if the housing and the fixed portion were in direct contact with each other.

8. A male screw groove (56) is formed in the housing, and a female screw groove (94) is formed in the fixing portion, the male screw groove and the female screw groove are threadedly engaged with each other, whereby the fixing portion is fixed to a tip of the housing on the electromagnetic wave transmission component side, The sensor device of claim 1 , wherein a gap (170) is formed between the threads of the external thread groove and the threads of the internal thread groove.

9. The container has a head (30) in which the electromagnetic wave generator, the electromagnetic wave transmission part, and the fixing part are accommodated, The head is integrally formed with a bracket (36) that is attached to a mounting member (4) to which the sensor device is attached, 2. The sensor device according to claim 1, wherein heat generated by said electromagnetic wave generator is transmitted to said head and further to said mounting member via said bracket.

10. 2. The sensor device according to claim 1, which is an on-board camera device mounted on a vehicle (4).

11. The electromagnetic wave generator is an infrared irradiation unit (110) configured with a semiconductor light source configured with any one of an infrared LED, a VCSEL, and a PCSEL that outputs infrared rays as the electromagnetic waves, The sensing element is an imager (60) that takes an image of the outside, the control board is an imager board (70) that controls the imager; the electromagnetic wave transmitting component is a lens (80) that receives reflected light of the infrared ray output from the infrared ray irradiation unit, 11. The sensor device according to claim 10, wherein the housing is a lens barrel (50) that transmits the reflected infrared light received by the lens to the imager.

12. 12. The sensor device according to claim 11, wherein an optical axis (L) of the infrared irradiating unit is inclined with respect to an optical axis (C1) of the lens barrel.

13. The sensor device according to claim 11 , wherein the electromagnetic wave transmitting part is made of a material having a lower thermal conductivity than the housing.

14. 14. A sensor device as described in any one of claims 11 to 13, wherein the optical axis of the lens barrel is inclined by 15° or more with respect to a straight line (C2) along the longitudinal direction of the vehicle, and the wind (7) from the vehicle as it travels hits the fixed portion and then flows toward the electromagnetic wave-transmitting component.

15. The sensor device is an in-vehicle camera device attached to a vehicle (4), The electromagnetic wave generator is an infrared irradiation unit (110) configured with a semiconductor light source configured with any one of an infrared LED, a VCSEL, and a PCSEL that outputs infrared rays as the electromagnetic waves, The sensing element is an imager (60) that takes an image of the outside, the control board is an imager board (70) that controls the imager; the electromagnetic wave transmitting component is a lens (80) that receives reflected light of the infrared ray output from the infrared ray irradiation unit, the housing is a lens barrel (50) that transmits the reflected infrared light received by the lens to the imager; 2. The sensor device according to claim 1, wherein the imager board acquires vehicle speed information, and when the vehicle speed indicated by the vehicle speed information is equal to or less than a predetermined vehicle speed threshold, performs either an intermittent operation in which the electromagnetic wave generator intermittently outputs the electromagnetic waves, or a thinning operation in which, when multiple electromagnetic wave generators are provided, only some of the multiple electromagnetic wave generators output the electromagnetic waves, thereby reducing the rate at which the electromagnetic waves are generated per unit time, compared to when the vehicle speed is greater than the vehicle speed threshold.

Images