Production system

Abstract

To provide a production system capable of effectively utilizing an idle time which is generated in an entire production line of a mounting substrate due to a difference in work time of work devices constituting the production line.SOLUTION: A production system comprises: a production line in which a plurality of work devices including a printing machine, a mounting machine, a reflow furnace, and an inspection machine is disposed; and a management apparatus. The management apparatus performs: acquisition processing of acquiring a standard work time of each of the plurality of work devices when producing one mounting substrate; extraction processing of extracting a specific work device of a longest work time that is longest in a standard work time; and work setting processing of setting an operation mode of the work devices other than the specific work device to a power saving mode in which power consumption can be reduced more than a standard mode or a high accuracy mode in which work accuracy can be improved more than the standard mode within such a range that the work time does not exceed the longest work time.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a production system equipped with a production line for producing mounting boards. [Background technology]

[0002] A production line that produces mounted boards on which components are mounted is equipped with multiple operating devices, such as a printer that prints solder paste on boards such as printed circuit boards, an operating device that mounts components on the boards, a reflow oven that heats the boards, an inspection device that inspects the boards, etc. In such a production line, mounted boards are produced by sequentially performing operations on the boards in each operating device.

[0003] On a production line, the operating time of each operating device when producing one mounting board may differ. In this case, the operating device with the longest operating time becomes the so-called bottleneck of the production line, and the other operating devices wait or stop without performing any work, resulting in idle time.

[0004] A technique for effectively utilizing such idle time is disclosed, for example, in Patent Document 1. In the technique disclosed in Patent Document 1, the equipment tact time when the mounting machine performs mounting processing under reference mounting processing conditions is acquired as the initial tact time, and if the initial tact time is less than the reference tact time, the acceleration of the multi-placement head equipped on the mounting machine is reduced so that power consumption is reduced within the equipment tact time range that does not exceed the reference tact time. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-269754 Summary of the Invention [Problem to be solved by the invention]

[0006] The technology disclosed in Patent Document 1 utilizes idle time in a mounting machine to reduce the acceleration of the multi-placement head, thereby reducing the power consumption of the mounting machine. However, on a production line, idle time may occur in other operating devices besides the mounting machine due to differences in the operating time of each operating device. In such cases, simply focusing on the idle time of a mounting machine and taking measures to reduce the power consumption of that mounting machine will not allow the idle time to be effectively utilized across the entire production line.

[0007] An object of the present invention is to provide a production system that can effectively utilize idle time that occurs throughout the entire production line due to differences in the working time of each work device that makes up the production line for mounted boards. [Means for solving the problem]

[0008] According to one aspect of the present invention, a production system includes a production line having a plurality of operating devices, including a printer that prints solder paste on boards, a mounting device that mounts components on the boards, a reflow oven that heats the boards, and an inspection device that inspects the boards, and which produces mounted boards based on the operations of the plurality of operating devices, and a management device that manages the production of the mounted boards on the production line. The management device performs the following operations: an acquisition process that acquires a standard operation time as the operation time for each of the plurality of operating devices when producing one mounted board with the operation mode of each of the plurality of operating devices set to a standard mode; an extraction process that extracts a specific operating device from the plurality of operating devices that has the longest standard operation time; and an operation setting process that sets the operation mode of the specific operating device to the standard mode, and sets the operation modes of operating devices other than the specific operating device to a power-saving mode that reduces power consumption compared to the standard mode or a high-precision mode that improves operation accuracy compared to the standard mode, so long as the operation time does not exceed the longest operation time.

[0009] According to this production system, the management device extracts a specific operation device that has the longest standard operation time from among multiple operation devices that make up the production line for mounted boards, including printers, mounters, reflow ovens, and inspection machines. When producing mounted boards on the production line, operation devices other than the specific operation device will have idle time where they wait or are stopped without performing work due to the difference between the standard operation time and the longest operation time of the other operation devices.

[0010] In order to effectively utilize idle time that occurs in such other maintenance devices, the management device sets the operation mode of the other maintenance devices to a power-saving mode that can reduce power consumption more than the standard mode, or a high-precision mode that can improve operation accuracy more than the standard mode, so long as the operation time does not exceed the longest operation time. By setting the operation mode of the other maintenance devices to the power-saving mode, it is possible to effectively utilize idle time that occurs in the other maintenance devices and reduce the power consumption of the other maintenance devices. Furthermore, by setting the operation mode of the other maintenance devices to the high-precision mode, it is possible to effectively utilize idle time that occurs in the other maintenance devices and improve the operation accuracy of the other maintenance devices, thereby improving the quality of mounted boards produced on the production line.

[0011] In the above production system, in the acquisition process, when an operating mode that emphasizes the efficiency of mounting the components on the board is set as the standard mode in the mounting machine, the management device may acquire the time required to mount the components at all mounting positions on the board as the standard working time of the mounting machine, and when the temperature of the board is changed in the reflow furnace according to a predetermined temperature profile, the management device may acquire the time required to heat the board as the standard working time of the reflow furnace.

[0012] In this mode, the time required for the mounter to mount all components on the board in an operation mode that prioritizes component mounting efficiency is set as the standard operation time for the mounter, and the time required to heat the board so that the temperature of the board changes according to a predetermined temperature profile is set as the standard operation time for the reflow furnace.

[0013] In the above production system, the management device may, in the acquisition process, accept input of work time information regarding the work time of each of the plurality of work devices in the standard mode, and acquire the standard work time of each of the plurality of work devices based on the work time information.

[0014] In this aspect, when the operator inputs work time information to the management device, the management device can set the standard work time for each of the plurality of work devices based on the work time information.

[0015] In the above-described production system, the management device may, in the work setting process, accept input of selection information indicating whether to select the power-saving mode or the high-precision mode as the operating mode of the other work device, and set the operating mode of the other work device based on the selection information.

[0016] In this aspect, when an operator inputs selection information to the management device, the management device can set the operating mode of other work devices to either a power-saving mode or a high-precision mode based on the selection information.

[0017] In the production system described above, the printing press, the mounting machine, and the inspection machine each have a moving unit that moves in a plurality of axial directions, and in the task setting process, when the other task devices are the printing press, the mounting machine, and the inspection machine, the management device may set, as the power-saving mode, an operating mode in which the acceleration of the moving unit is reduced from the standard mode.

[0018] In this mode, when the specific operation apparatus is a reflow furnace and the other operation apparatuses are a printer, a mounting machine, and an inspection machine, the management device sets an operating mode in which the acceleration of the mobile unit is reduced from the standard mode as the power-saving mode. In this case, due to the difference between the longest operation time corresponding to the standard operation time of the reflow furnace and the standard operation times of the printer, mounting machine, and inspection machine, it is possible to effectively utilize idle time that occurs in the printer, mounting machine, and inspection machine and reduce power consumption by reducing the acceleration of the mobile unit.

[0019] In the above production system, the power saving modes in the printing machine, the mounting machine, and the inspection machine include a first mode that reduces the acceleration of the moving unit when moving in all directions along the multiple axial directions, and a second mode that reduces the acceleration of the moving unit when moving in some of the multiple axial directions.

[0020] In this mode, when the first mode is set as the power-saving mode of the printing machine, mounting machine, and inspection machine, it is possible to reduce power consumption by reducing the acceleration of the moving unit when moving in all directions along the multiple axial directions. Also, when the second mode is set as the power-saving mode of the printing machine, mounting machine, and inspection machine, it is possible to reduce power consumption by reducing the acceleration of the moving unit when moving in some directions out of the multiple axial directions.

[0021] In the above production system, the moving unit of the mounting machine is a mounting head unit that moves between a component supply position where the component is supplied and a mounting position on the board, sucks and holds the component at the component supply position, and mounts the sucked and held component on the board at the mounting position. In addition to the first and second modes, the power-saving aspects of the mounting machine include a third mode in which the acceleration of the moving unit is reduced when moving from the mounting position to the component supply position after mounting the component on the board.

[0022] In this mode, when the third mode is set as the power-saving mode of the mounter, the acceleration of the mounting head unit is reduced when moving from the mounting position to the component supply position after mounting components on the board. The mounting head unit moves from the component supply position to the mounting position while suction-holding the components, whereas when moving from the mounting position to the component supply position after mounting the components on the board, the mounting head unit moves without suction-holding the components. In other words, when the mounting head unit moves from the mounting position to the component supply position, the suction operation that generates negative pressure to suction-hold the components is stopped. Therefore, by reducing the acceleration of the mounting head unit when moving from the mounting position to the component supply position, where the suction operation is stopped, it is possible to more accurately reduce the power consumption of the mounter.

[0023] In the above production system, the printing machine has a mask disposed above the board, a printing unit that prints the solder paste on the board through the mask, and a cleaning unit that cleans the mask. The mounting machine has a mounting head unit that moves relative to the board while mounting the components on the board. The inspection machine has an imaging unit that images the board and an inspection head unit that inspects the board based on images captured by the imaging unit. In the task setting process, if the other task devices are the printing machine, the mounting machine, and the inspection machine, the management device may set, for the printing machine, an operating mode in which the frequency of cleaning the mask by the cleaning unit is increased from the standard mode as the high-precision mode; for the mounting machine, an operating mode in which a movement method of the mounting head unit is changed from the standard mode as the high-precision mode; and for the inspection machine, an operating mode in which the inspection items by the inspection head unit are increased from the standard mode as the high-precision mode.

[0024] In this aspect, when the specific operating apparatus is a reflow furnace and the other operating apparatuses are a printer, a mounting machine, and an inspection machine, the management device sets the operating modes of the printer, the mounting machine, and the inspection machine to the high-precision mode. Specifically, for the printer, the management device increases the frequency of mask cleaning by the cleaning unit from the standard mode. By increasing the frequency of mask cleaning, solder paste remaining on the mask after printing by the printer can be reliably removed, thereby improving the accuracy of the printing work by the printer. Furthermore, for the mounting machine, the management device changes the movement method of the mounting head unit from the standard mode to the high-precision mode. By changing the movement method of the mounting head unit to the high-precision mode, the mounting head unit can be moved with high precision relative to the board, thereby improving the accuracy of the mounting work of the mounting machine to mount components on the board. Furthermore, for the inspection machine, the management device increases the number of inspection items by the inspection head unit from the standard mode. By increasing the number of inspection items, the accuracy of the inspection work by the inspection machine can be improved. [Effects of the Invention]

[0025] As described above, according to the present invention, it is possible to provide a production system that can effectively utilize idle time that occurs throughout the entire production line due to differences in the working times of the various work devices that make up the production line for mounted substrates. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a diagram illustrating a schematic configuration of a production system according to an embodiment of the present invention. [Figure 2] FIG. 1 is a block diagram of a production system. [Figure 3] FIG. 10 is a diagram showing operation mode data stored in a storage unit of a management device provided in the production system. [Figure 4] FIG. 2 is a diagram illustrating an outline of a process performed by a management device. DETAILED DESCRIPTION OF THE INVENTION

[0027] A production system according to an embodiment of the present invention will be described below with reference to the drawings. The production system according to this embodiment is a system for producing mounted boards on which components are mounted. A mounted board is a product in which electronic components such as chip components (e.g., chip resistors, chip capacitors), ball bump components, packaged components (e.g., ICs), power supply-related components (e.g., capacitors, transformers), connectors, heat sinks, etc. are mounted on a substrate such as a printed circuit board on which a circuit pattern is printed.

[0028] In the following explanation, directional relationships will be explained using XYZ Cartesian coordinates. That is, directions that are perpendicular to each other on a horizontal plane will be referred to as the X-axis direction and the Y-axis direction, and the vertical direction that is perpendicular to the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction.

[0029] [Overall configuration of the production system] 1 is a diagram showing a schematic configuration of a production system 1 according to this embodiment. The production system 1 includes a production line 2, a power supply device 3, and a management device 4.

[0030] The production line 2 is a line on which a plurality of operating devices 20 are arranged that perform operations for producing mounted boards PP in which components P1 are mounted on boards P. The power supply device 3 is connected to, for example, a power system, and supplies power to the production line 2. When power is supplied to the production line 2 from the power supply device 3, each of the plurality of operating devices 20 in the production line 2 performs operations on the boards P, producing mounted boards PP. The management device 4 manages the production of mounted boards PP in the production line 2.

[0031] [Production Line] The production line 2 will be described in detail with reference to the block diagram of FIG. 2 in addition to FIG. 1. In the production line 2, a plurality of working devices 20 are arranged on a board transport path along which boards P are transported. The plurality of working devices 20 include a printer 21 that prints solder paste such as cream solder on the boards P, an applicator 22 that applies adhesive to the boards P, an inspector 23 that inspects the boards P, a mounter 24 that mounts components P1 on the boards P, and a reflow oven 25 that heats the boards P. In the example of FIG. 1, the printer 21, the applicator 22, a print inspection machine 23A that is an example of the inspection machine 23, three mounters 24 (first to third mounters 24A, 24B, and 24C), a board inspection machine 23B that is an example of the inspection machine 23, the reflow oven 25, and a visual inspection machine 23C that is an example of the inspection machine 23 are arranged in tandem from upstream to downstream in the board transport direction.

[0032] (printing machine) The printer 21 prints solder paste on the substrate P by a screen printing method. The printer 21 has a transport unit 211, a support unit 212, a mask unit 213, a printing unit 214, and a cleaning unit 215. The transport unit 211 is a unit that transports the substrate P in the X-axis direction or the Y-axis direction, and transports the substrate P into the printer 21 and transports the substrate P out of the printer 21.

[0033] The support unit 212 horizontally supports the substrate P carried in by the transport unit 211. The support unit 212 has a stacked structure in which multiple support tables are stacked in the Z-axis direction, and is a moving unit that moves in multiple axial directions, including the X-axis, Y-axis, and Z-axis. In other words, the support unit 212 is a moving unit of the printing press 21. Of the units that make up the printing press 21, the support unit 212 is the unit that consumes the most power during operation. The support unit 212 moves in multiple axial directions in response to the driving of each of the multiple axial motors 21M. The substrate P supported by the support unit 212 moves in multiple axial directions as the support unit 212 moves, and is positioned at a predetermined printing work position.

[0034] The mask unit 213 places a mask 2131 above the substrate P supported by the support unit 212. The mask 2131 is a plate-like member made of, for example, stainless steel, in which printing openings are formed. The printing unit 214 is placed above the mask 2131 and prints solder paste onto the substrate P through the mask 2131. The printing unit 214 is, for example, a squeegee unit, and moves the solder paste over the mask 2131, thereby printing the solder paste onto the substrate P through the printing openings of the mask 2131.

[0035] The cleaning unit 215 cleans the mask 2131 at a predetermined timing. The cleaning unit 215 slides along the lower surface of the mask 2131 to remove solder paste remaining on the lower surface of the mask 2131 and in the printing openings.

[0036] (applicator) The coater 22 coats the substrate P with adhesive for adhering the component P1 to the substrate P. The coater 22 is provided as needed and does not have to be arranged on the production line 2. The coater 22 has a transport unit 221, a support unit 222, and a coating unit 223.

[0037] The transport unit 221 is a unit that transports the substrate P in the X-axis direction or the Y-axis direction, and transports the substrate P into the coater 22 and transports the substrate P out of the coater 22. The support unit 222 horizontally supports the substrate P that has been transported in by the transport unit 221. The support unit 222 supports the substrate P with, for example, push-up pins, thereby positioning the substrate P at a predetermined coating operation position.

[0038] The coating unit 223 is disposed above the substrate P supported by the support unit 222, and coats the substrate P with adhesive. The coating unit 223 is a moving unit that moves in multiple axial directions, including the X-axis and Y-axis directions, relative to the substrate P. In other words, the coating unit 223 is a moving unit of the coater 22. Of all the units that make up the coater 22, the coating unit 223 is the unit that consumes the most power during operation. The coating unit 223 coats the substrate P with adhesive while moving in multiple axial directions in response to the driving of each of the multiple axial motors 22M.

[0039] (mounting machine) The mounting machine 24 mounts components P1 at each of a plurality of mounting positions set on the board P. The production line 2 shown in FIG. 1 shows an example in which three mounting machines 24 are arranged in series. That is, on the production line 2, a first mounting machine 24A, a second mounting machine 24B, and a third mounting machine 24C are arranged in tandem from the upstream side. The mounting machine 24 has a transport unit 241, a support unit 242, a component supply unit 243, and a mounting head unit 244.

[0040] The transport unit 241 is a unit that transports the substrate P in the X-axis direction or the Y-axis direction, and transports the substrate P into the mounting machine 24 and transports the substrate P out of the mounting machine 24. The support unit 242 horizontally supports the substrate P that has been transported by the transport unit 241. The support unit 242 supports the substrate P with, for example, push-up pins, thereby positioning the substrate P at a predetermined mounting work position.

[0041] The mounter 24 may be a multi-lane mounter having a plurality of transport units 241 and support units 242. The multi-lane mounter 24 has a transport unit 241 and a support unit 242 for a first lane A, and a transport unit 241 and a support unit 242 for a second lane B. In this case, the mounter 24 mounts components P1 on each board P transported by each transport unit 241 in the first lane A and the second lane B and supported by each support unit 242.

[0042] The component supply unit 243 supplies components P1 to be mounted on the board P to a predetermined component supply position. The component supply unit 243 has a plurality of feeders 2431 arranged in the X-axis direction or the Y-axis direction, and each feeder 2431 supplies the component P1 to the predetermined component supply position. In the component supply unit 243, a set position for each feeder 2431 is defined for each component P1 to be mounted on the board P. The feeders 2431 are detachably attached to the component supply unit 243. The feeders 2431 hold a plurality of components P1 and supply the held components P1 to predetermined component supply positions set within the feeders. The component supply method of the feeders 2431 is not particularly limited as long as they are configured to be able to supply the components P1. The feeder 2431 may be, for example, a tape feeder that uses tape as a carrier to supply the component P1, a tray feeder that supplies the component P1 by moving a tray on which the component P1 is placed, or a stick feeder that supplies the component P1 stored in a cylindrical stick by pushing it out of the stick.

[0043] The mounting head unit 244 is disposed above the substrate P supported by the support unit 242, and mounts components P1 supplied by the component supply unit 243 onto the substrate P. The mounting head unit 244 is a moving unit that moves in multiple axial directions, including the X-axis and the Y-axis, relative to the substrate P. In other words, the mounting head unit 244 is a moving unit of the mounting machine 24. Of all the units constituting the mounting machine 24, the mounting head unit 244 is the unit that consumes the most power during operation. The mounting head unit 244 moves in multiple axial directions in response to the driving of each of the multiple axis motors 24M between a component supply position where components P1 are supplied by the component supply unit 243 and a mounting position on the substrate P. The mounting head unit 244 sucks and holds the component P1 by a suction operation that generates negative pressure at the component supply position, and mounts the component P1 on the substrate P by stopping the suction operation at the mounting position.

[0044] (reflow oven) The reflow furnace 25 heats the board P on which the components P1 have been mounted by the mounter 24 to melt the solder and fix the components P1 to the board P. The reflow furnace 25 includes a transport unit 251 and a heating unit 252.

[0045] The transport unit 251 is a unit that transports the substrate P in the X-axis direction or the Y-axis direction, and transports the substrate P into the reflow furnace 25 and transports the substrate P out of the reflow furnace 25.

[0046] The heating unit 252 heats the substrate P transported by the transport unit 251, and changes the temperature of the substrate P in accordance with a predetermined temperature profile. As a result, the heating unit 252 heats the substrate P so that the temperature changes in accordance with the predetermined temperature profile, melts the solder, and fixes the component P1 to the substrate P.

[0047] (Inspection machine) The inspection machine 23 inspects the board P. In the production line 2 shown in FIG. 1, the inspection machines 23 include a print inspection machine 23A disposed between the dispenser 22 downstream of the printer 21 and the mounter 24, a board inspection machine 23B disposed between the mounter 24 and the reflow furnace 25, and an appearance inspection machine 23C disposed downstream of the reflow furnace 25. The print inspection machine 23A images the board P on which solder paste has been printed to determine the shape of the solder and inspects whether the position, amount, and height of the solder paste printed on the board P are appropriate. The board inspection machine 23B images the board P after it has passed the mounter 24 and inspects the board P for misalignment of the components P1, lead misalignment, component lift, missing mounting, soldering defects, and the presence of foreign matter. The appearance inspection machine 23C takes an image of the board P after heating in the reflow furnace 25, and similarly to the board inspection machine 23B, inspects the positional deviation of the component P1 on the board P, lead deviation, component floating, missing mounting, soldering defects, and the presence of foreign matter.

[0048] The inspection machine 23 including the print inspection machine 23A, the substrate inspection machine 23B, and the appearance inspection machine 23C has a transport unit 231, a support unit 232, and an inspection head unit 233.

[0049] The transport unit 231 is a unit that transports the substrate P in the X-axis direction or the Y-axis direction, and transports the substrate P into the inspection machine 23 and transports the substrate P out of the inspection machine 23. The support unit 232 horizontally supports the substrate P that has been transported by the transport unit 231. The support unit 232 supports the substrate P with, for example, push-up pins, thereby positioning the substrate P at a predetermined inspection work position.

[0050] The inspection head unit 233 is disposed above the substrate P supported by the support unit 232. The inspection head unit 233 is equipped with an imaging section 2331 that images the substrate P, and inspects the substrate P based on the image captured by the imaging section 2331. The inspection head unit 233 is a moving unit that moves in multiple axial directions, such as the X-axis and Y-axis directions, relative to the substrate P. In other words, the inspection head unit 233 is a moving unit of the inspection machine 23. Of all the units that make up the inspection machine 23, the inspection head unit 233 is the unit that consumes the most power during operation. The inspection head unit 233 moves in multiple axial directions relative to the substrate P in response to the driving of each of the multiple axial motors 23M.

[0051] [Management device] The production of the mounted boards PP on the production line 2 is managed by a management device 4. In the production system 1, under the management of the management device 4, a plurality of work devices 20 on the production line 2, including a printer 21, a coater 22, an inspector 23, a mounter 24, and a reflow furnace 25, perform their work in response to the supply of power from a power supply device 3, thereby producing the mounted boards PP.

[0052] The management device 4 is configured by, for example, a personal computer. The management device 4 will be described in detail with reference to FIGS. 3 and 4 in addition to the block diagram of FIG. 2. FIG. 3 is a diagram showing operation mode data DA stored in the storage unit 43 of the management device 4. FIG. 4 is a diagram showing an outline of the processing performed by the management device 4. The management device 4 has an input unit 41, a processing unit 42, and a storage unit 43.

[0053] The input unit 41 is configured with a keyboard etc. that accepts input operations from an operator. The input unit 41 accepts input of various information required for processing by the processing unit .

[0054] The storage unit 43 stores various data, setting values, and the like required for the operation of each of the plurality of operating devices 20 that make up the production line 2. The storage unit 43 stores, for example, operation mode data DA shown in FIG.

[0055] The operating mode data DA is data that indicates the operating mode OM of each of the multiple operating devices 20, namely the printer 21, the dispenser 22, the inspector 23, the mounter 24, and the reflow furnace 25. The operating mode OM includes a standard mode OM1 that indicates the standard operating mode of each of the multiple operating devices 20, a power-saving mode OM2 that can reduce power consumption more than the standard mode OM1, and a high-precision mode OM4 that can improve operating accuracy more than the standard mode OM1. The operating mode data DA also records a standard operating time ST as the operating time of each of the multiple operating devices 20 when one mounting board PP is produced on the production line 2 with the operating mode OM of each of the multiple operating devices 20 set to the standard mode OM1.

[0056] The standard operation time ST and operation sequence OS when the operation mode OM of the printing press 21 is set to the standard mode OM1 are recorded as the standard mode OM1 of the printing press 21. The operation sequence OS of the standard mode OM1 of the printing press 21 includes information such as the acceleration when the support unit 212 moves in multiple axial directions by driving the multiple axis motors 21M, and the frequency of cleaning the mask 2131 by the cleaning unit 215.

[0057] The standard operating time ST of the printer 21 is the time required for the printing unit 214 to print solder paste onto one substrate P through the mask 2131 when the operating mode OM of the printer 21 is set to the standard mode OM1.

[0058] Furthermore, the power saving mode OM2 of the printing press 21 records an operation sequence OS in a state where the operation mode OM of the printing press 21 is set to the power saving mode OM2. The operation sequence OS of the power saving mode OM2 of the printing press 21 records information such as acceleration reduced from the standard mode OM1 as acceleration when the support unit 212 moves in multiple axial directions by driving the multiple axis motors 21M. The power saving mode OM2 of the printing press 21 includes a first mode that reduces the acceleration of the support unit 212 when moving in all directions in the multiple axial directions, and a second mode that reduces the acceleration of the support unit 212 when moving in some of the multiple axial directions.

[0059] Furthermore, the operation sequence OS in a state in which the operation mode OM of the printing press 21 is set to the high precision mode OM4 is recorded as the high precision mode OM4 of the printing press 21. The operation sequence OS of the high precision mode OM4 of the printing press 21 includes information such as the cleaning frequency of the mask 2131 by the cleaning unit 215, which is increased from the standard mode OM1.

[0060] The standard operation time ST and the operation sequence OS when the operation mode OM of the coater 22 is set to the standard mode OM1 are recorded as the standard mode OM1 of the coater 22. The operation sequence OS of the standard mode OM1 of the coater 22 includes information such as acceleration when the coating unit 223 moves in multiple axial directions by driving the multiple axis motors 22M.

[0061] The standard operating time ST of the coater 22 is the time required for the coating unit 223 to coat one substrate P with adhesive when the operating mode OM of the coater 22 is set to the standard mode OM1.

[0062] Furthermore, the operation sequence OS in a state in which the operation mode OM of the coater 22 is set to the power saving mode OM2 is recorded as the power saving mode OM2 of the coater 22. Information such as the acceleration reduced from the standard mode OM1 as the acceleration when the coating unit 223 moves in multiple axial directions by driving the multiple axial motors 22M is recorded as the operation sequence OS of the power saving mode OM2 of the coater 22. The power saving mode OM2 of the coater 22 includes a first mode that reduces the acceleration of the coating unit 223 when moving in all directions in the multiple axial directions, and a second mode that reduces the acceleration of the coating unit 223 when moving in some of the multiple axial directions.

[0063] The standard operation time ST and operation sequence OS when the operation mode OM of the inspection machine 23 is set to the standard mode OM1 are recorded as the standard mode OM1 of the inspection machine 23. The operation sequence OS of the standard mode OM1 of the inspection machine 23 includes information such as the acceleration when the inspection head unit 233 moves in multiple axial directions by driving the multiple axis motors 23M, and the inspection items by the inspection head unit 233.

[0064] The standard operating time ST of the inspection machine 23 is the time required for the inspection head unit 233 to inspect one substrate P based on the image of the imaging unit 2331 when the operating mode OM of the inspection machine 23 is set to the standard mode OM1.

[0065] Furthermore, the operation sequence OS when the operation mode OM of the inspection machine 23 is set to the power saving mode OM2 is recorded as the power saving mode OM2 of the inspection machine 23. Information such as the acceleration reduced from the standard mode OM1 as the acceleration when the inspection head unit 233 moves in multiple axial directions by driving the multiple axis motors 23M is recorded as the operation sequence OS of the power saving mode OM2 of the inspection machine 23. The power saving mode OM2 of the inspection machine 23 includes a first mode that reduces the acceleration of the inspection head unit 233 when moving in all directions in the multiple axial directions, and a second mode that reduces the acceleration of the inspection head unit 233 when moving in some of the multiple axial directions.

[0066] Furthermore, the operation sequence OS in a state where the operation mode OM of the inspection machine 23 is set to the high precision mode OM4 is recorded as the high precision mode OM4 of the inspection machine 23. The operation sequence OS of the high precision mode OM4 of the inspection machine 23 records information such as inspection items that have been increased from the standard mode OM1 as inspection items to be inspected by the inspection head unit 233.

[0067] The standard mode OM1 of the mounter 24 records the standard work time ST and operation sequence OS when the operation mode OM of the mounter 24 is set to the standard mode OM1. The operation sequence OS of the standard mode OM1 of the mounter 24 records information such as the acceleration when the mounting head unit 244 moves in multiple axial directions by driving the multiple axis motors 24M, the movement method of the mounting head unit 244 in multiple axial directions, and the arrangement of the multiple feeders 2431 in the component supply unit 243. Note that the movement method of the mounting head unit 244 when the mounter 24 is set to the standard mode OM1 is a movement method that emphasizes the mounting efficiency of components P1 on the board P, and is a movement method in which the mounting head unit 244 moves in a diagonal direction intersecting the X-axis and Y-axis directions in movement on the XY horizontal plane so as to minimize the movement distance of the mounting head unit 244 when mounting components. Furthermore, when the mounting machine 24 is set to the standard mode OM1, the arrangement of the multiple feeders 2431 in the component supply unit 243 is a feeder arrangement that emphasizes the mounting efficiency of the components P1 on the substrate P, and is such that the feeders 2431 used to produce the mounted substrate PP are concentrated and arranged in the central area of ​​the component supply unit 243 so that the movement distance of the mounting head unit 244 between the component supply position of the component supply unit 243 and the mounting position on the substrate P is as short as possible.

[0068] The standard operation time ST of the mounting machine 24 is the time required for the mounting head unit 244 to mount components P1 at all mounting positions on one substrate P when the operating mode OM of the mounting machine 24 is set to the standard mode OM1.

[0069] Furthermore, the power-saving mode OM2 of the mounting machine 24 records an operation sequence OS when the operation mode OM of the mounting machine 24 is set to the power-saving mode OM2. The operation sequence OS of the power-saving mode OM2 of the mounting machine 24 records information such as acceleration reduced from the standard mode OM1 as acceleration when the mounting head unit 244 moves in multiple axial directions by driving the multiple axis motors 24M. The power-saving mode OM2 of the mounting machine 24 includes a first mode that reduces the acceleration of the mounting head unit 244 when moving in all directions in the multiple axial directions, a second mode that reduces the acceleration of the mounting head unit 244 when moving in some of the multiple axial directions, and a third mode that reduces the acceleration of the mounting head unit 244 when moving from a mounting position on the substrate P toward a component supply position of the component supply unit 243 after mounting components P1 on the substrate P.

[0070] Furthermore, the high-precision mode OM4 of the mounter 24 records an operation sequence OS when the operation mode OM of the mounter 24 is set to the high-precision mode OM4. The operation sequence OS of the high-precision mode OM4 of the mounter 24 records information such as a movement mode changed from the standard mode OM1 as a movement mode of the mounting head unit 244 in multiple axial directions. The movement mode of the mounting head unit 244 when the mounter 24 is set to the high-precision mode OM4 is a movement mode that emphasizes the mounting accuracy of the components P1 on the board P, and is a movement mode in which movement in the X-axis direction and movement in the Y-axis direction are alternately performed on the XY horizontal plane so that the mounting head unit 244 moves with precision during component mounting.

[0071] Furthermore, in addition to the standard mode OM1, the power-saving mode OM2, and the high-precision mode OM4, the operation modes OM of the mounting machine 24 also include a setup-oriented mode OM3. The setup-oriented mode OM3 of the mounting machine 24 is an operation mode that emphasizes the efficiency of the setup work of changing the arrangement of the feeders 2431 for the component supply unit 243, which is performed when switching between different types of mounting boards PP to be produced. When the mounting machine 24 is set to the setup-oriented mode OM3, the arrangement of the multiple feeders 2431 in the component supply unit 243 is an arrangement that has been changed from the feeder arrangement of the standard mode OM1 so as to minimize the number of setup work operations, and is a feeder arrangement that is common to the production of multiple types of mounting boards PP.

[0072] The standard operation time ST and operation sequence OS when the operation mode OM of the reflow furnace 25 is set to the standard mode OM1 are recorded as the standard mode OM1 of the reflow furnace 25. The operation sequence OS of the standard mode OM1 of the reflow furnace 25 is recorded as a predetermined temperature profile TP that indicates the temperature change of the substrate P due to heating by the heating unit 252.

[0073] The standard operating time ST of the reflow furnace 25 is the time required for the heating unit 252 to heat the substrate P when the temperature of the substrate P is changed according to a predetermined temperature profile TP when the operating mode OM of the reflow furnace 25 is set to the standard mode OM1.

[0074] The processing unit 42 of the management device 4 is configured, for example, by a processor capable of information processing. The processing unit 42 manages the operation mode OM of each of the multiple operating devices 20 that make up the production line 2 based on the operation mode data DA stored in the storage unit 43, thereby managing the production of mounting boards PP on the production line 2. The processing unit 42 performs the processes of acquisition processing S1, extraction processing S2, and operation setting processing S3 shown in FIG.

[0075] In the acquisition process S1, the processing unit 42 acquires the standard operation time ST for each of the multiple operation devices 20, namely the printing machine 21, the coating machine 22, the inspection machine 23, the mounting machine 24, and the reflow furnace 25, based on the operation mode data DA. In the example shown in FIG. 4, the processing unit 42 acquires "23 seconds" as the standard operation time ST for the printing machine 21, "22 seconds" as the standard operation time ST for the coating machine 22, and "10 seconds" as the standard operation time ST for the print inspection machine 23A. Furthermore, the processing unit 42 acquires "19 seconds" as the standard operation time ST for the first lane A and "20 seconds" as the standard operation time ST for the second lane B, as the standard operation time ST for the first mounting machine 24A of the multi-lane system. Similarly, for the second mounting machine 24B, the processing unit 42 acquires the standard operation time ST of "22 seconds" for the first lane A and the standard operation time ST of "20 seconds" for the second lane B, and for the third mounting machine 24C, the processing unit 42 acquires the standard operation time ST of "20 seconds" for the first lane A and the standard operation time ST of "20 seconds" for the second lane B. In addition, the processing unit 42 acquires the standard operation time ST of "19 seconds" for the board inspection machine 23B, the standard operation time ST of "28 seconds" for the reflow furnace 25, and the standard operation time ST of "22 seconds" for the appearance inspection machine 23C.

[0076] In the acquisition process S1, the processing unit 42 may receive input of work time information J1 relating to the work time in the standard mode OM1 of each of the plurality of maintenance devices 20 from the input unit 41, and acquire the standard work time ST of each of the plurality of maintenance devices 20 based on the work time information J1. In this case, when the operator inputs work time information J1 to the input unit 41, the processing unit 42 can set the standard work time ST of each of the plurality of maintenance devices 20 based on the work time information J1.

[0077] In extraction processing S2 following acquisition processing S1, processing unit 42 extracts a specific operation apparatus having the longest standard operation time ST from among the plurality of operation apparatuses 20. In the example shown in Fig. 4, processing unit 42 extracts reflow furnace 25, which has the longest standard operation time ST of 28 seconds, as the specific operation apparatus from among the plurality of operation apparatuses 20, namely, printing machine 21, coating machine 22, inspection machine 23, mounting machine 24, and reflow furnace 25.

[0078] In the task setting process S3 following the extraction process S2, the processing unit 42 sets the task mode OM of the specific task device to the standard mode OM1 based on the task mode data DA, and sets the task mode OM of other task devices other than the specific task device to the power-saving mode OM2, which can reduce power consumption more than the standard mode OM1, or the high-precision mode OM4, which can improve task accuracy more than the standard mode OM1, so long as the task time does not exceed the longest task time. In the example shown in FIG. 4 , the processing unit 42 sets the task mode OM of the reflow furnace 25, which is the specific task device, to the standard mode OM1, and sets the task mode OM of the printer 21, dispenser 22, inspector 23, and mounter 24, which are other task devices, to the power-saving mode OM2 or the high-precision mode OM4. Note that the processing unit 42 may set the task mode OM of the mounter 24 to the setup-oriented mode OM3 in addition to the power-saving mode OM2 or the high-precision mode OM4.

[0079] When producing mounted boards PP on production line 2, idle time occurs in the other operating devices other than the specific operating device, where the other operating devices wait or stop without performing work due to the difference between the standard operating time ST and the longest operating time of the other operating device. In the example shown in Figure 4, in the printing machine 21 other than the reflow furnace 25 serving as the specific operating device, idle time of "5 seconds" occurs per production of one mounted board PP due to the difference between the standard operating time ST of the printing machine 21, which is "23 seconds," and the longest operating time, "28 seconds," which is the standard operating time ST of the reflow furnace 25. Similarly, the coater 22 has an idle time of "6 seconds", the print inspection machine 23A has an idle time of "18 seconds", the first mounting machine 24A has an idle time of "9 seconds" in the first lane A and an idle time of "8 seconds" in the second lane B, the second mounting machine 24B has an idle time of "6 seconds" in the first lane A and an idle time of "8 seconds" in the second lane B, the third mounting machine 24C has an idle time of "8 seconds" in the first lane A and an idle time of "8 seconds" in the second lane B, the board inspection machine 23B has an idle time of "9 seconds", and the appearance inspection machine 23C has an idle time of "6 seconds".

[0080] In order to effectively utilize idle time that occurs in such other maintenance devices, the processing unit 42 sets the operation mode OM of the other maintenance devices to a power-saving mode OM2 that can reduce power consumption more than the standard mode OM1, or to a high-precision mode OM4 that can improve operation accuracy more than the standard mode OM1, so long as the operation time does not exceed the longest operation time. By setting the operation mode OM of the other maintenance devices to the power-saving mode OM2, it is possible to effectively utilize idle time that occurs in the other maintenance devices and reduce the power consumption of the other maintenance devices. Furthermore, by setting the operation mode OM of the other maintenance devices to the high-precision mode OM4, it is possible to effectively utilize idle time that occurs in the other maintenance devices and improve the operation accuracy of the other maintenance devices, thereby improving the quality of the mounted boards PP produced on the production line 2.

[0081] In the task setting process S3, the processing unit 42 may receive, from the input unit 41, input of selection information J2 indicating whether to select the power-saving mode OM2 or the high-precision mode OM4 as the operation mode OM of the other task apparatus, and may set the operation mode OM of the other task apparatus based on the selection information J2. In this case, when the operator inputs selection information J2 to the input unit 41, the processing unit 42 can set the operation mode OM of the other task apparatus to either the power-saving mode OM2 or the high-precision mode OM4 based on the selection information J2. Note that, when the selection information J2 regarding the mounting machine 24 input to the input unit 41 is information that selects the setup-oriented mode OM3, the processing unit 42 may set the operation mode OM of the mounting machine 24 to the setup-oriented mode OM3.

[0082] Furthermore, in the task setting process S3, if the specific task apparatus is the reflow furnace 25 and the other task apparatuses are the printer 21, the coater 22, the inspection machine 23, and the mounting machine 24, the processing unit 42 sets, based on the operation mode data DA, an operation mode in which the acceleration of each moving unit represented by the support unit 212 of the printer 21, the coating unit 223 of the coater 22, the inspection head unit 233 of the inspection machine 23, and the mounting head unit 244 of the mounting machine 24 is reduced from the standard mode OM1 as the power-saving mode OM2. In this case, due to the difference between the longest operation time corresponding to the standard operation time ST of the reflow furnace 25 and the standard operation time ST of the printer 21, the coater 22, the inspection machine 23, and the mounting machine 24, it is possible to effectively utilize idle time occurring in the printer 21, the coater 22, the inspection machine 23, and the mounting machine 24, and reduce power consumption by reducing the acceleration of each moving unit.

[0083] Furthermore, when the first mode is set as the power-saving mode OM2 of the printer 21, the coater 22, the inspection machine 23, and the mounter 24, the processing unit 42 can reduce power consumption by reducing the acceleration of each moving unit, represented by the support unit 212 of the printer 21, the coating unit 223 of the coater 22, the inspection head unit 233 of the inspection machine 23, and the mounting head unit 244 of the mounter 24, when moving in all directions along the multiple axial directions. Furthermore, when the second mode is set as the power-saving mode OM2 of the printer 21, the coater 22, the inspection machine 23, and the mounter 24, the processing unit 42 can reduce power consumption by reducing the acceleration of each moving unit when moving in some directions out of the multiple axial directions.

[0084] Furthermore, when the third mode is set as the power-saving mode OM2 of the mounter 24, the processing unit 42 reduces the acceleration of the mounting head unit 244 when moving from the mounting position on the substrate P toward the component supply position of the component supply unit 243 after mounting the component P1 on the substrate P. The mounting head unit 244 moves from the component supply position to the mounting position while suction-holding the component P1, whereas when moving from the mounting position to the component supply position after mounting the component P1 on the substrate P, the mounting head unit 244 moves without suction-holding the component P1. In other words, when the mounting head unit 244 moves from the mounting position to the component supply position, the suction operation that generates negative pressure to suction-hold the component P1 is stopped. Therefore, by reducing the acceleration of the mounting head unit 244 when moving from the mounting position, where the suction operation is stopped, toward the component supply position from the mounting position, it is possible to more accurately reduce the power consumption of the mounter 24.

[0085] Furthermore, in the task setting process S3, if the specific task apparatus is a reflow furnace 25 and the other task apparatuses are the printer 21, the inspection machine 23, and the mounting machine 24, the processing unit 42 can also set the operation mode OM of the printer 21, the inspection machine 23, and the mounting machine 24 to the high-precision mode OM4 based on the operation mode data DA. Specifically, for the printer 21, the processing unit 42 increases the frequency of cleaning of the mask 2131 by the cleaning unit 215 from the standard mode OM1. By increasing the cleaning frequency of the mask 2131, solder paste remaining on the mask 2131 can be reliably removed after the printing operation of the printer 21, thereby improving the accuracy of the printing operation of the printer 21. Furthermore, for the mounting machine 24, the processing unit 42 changes the movement mode of the mounting head unit 244 from the standard mode OM1 to the high-precision mode OM4. By changing the movement method of the mounting head unit 244 to the method of the high precision mode OM4, the mounting head unit 244 can be moved with high precision relative to the substrate P, thereby improving the accuracy of the mounting work of the components P1 on the substrate P in the mounter 24. Furthermore, for the inspection machine 23, the processing unit 42 increases the number of inspection items performed by the inspection head unit 233 from the standard mode OM1. By increasing the number of inspection items, the accuracy of the inspection work in the inspection machine 23 can be improved. [Explanation of symbols]

[0086] 1. Production System 2 production lines 21 Printing machine 212 Support unit (mobile unit) 213 Mask Unit 214 Printing Unit 215 Cleaning Unit 23 Inspection machine 233 Inspection head unit (moving unit) 2331 Imaging unit 24 Mounting machine 244 Mounting head unit (mobile unit) 25 Reflow oven 4 Management device

Claims

1. a production line in which a plurality of work devices are arranged, including a printer that prints solder paste on a board, a mounter that mounts components on the board, a reflow oven that heats the board, and an inspection device that inspects the board, and which produces mounted boards based on the operations of each of the plurality of work devices; a management device that manages the production of the mounting boards on the production line, The management device an acquisition process for acquiring a standard operation time as an operation time of each of the plurality of operation devices when one mounting board is produced with the operation mode of each of the plurality of operation devices set to a standard mode; an extraction process for extracting a specific operation device that has the longest standard operation time from among the plurality of operation devices; a work setting process for setting the operation mode of the specific work device to the standard mode, and for the operation modes of work devices other than the specific work device to a power-saving mode that can reduce power consumption more than the standard mode, or to a high-precision mode that can improve work accuracy more than the standard mode, within a range where the work time does not exceed the longest work time.

2. In the acquisition process, the management device when an operation mode that emphasizes the efficiency of mounting the components on the board is set as the standard mode in the mounting machine, the time required to mount the components at all mounting positions on the board is acquired as the standard operation time of the mounting machine; 2. The production system according to claim 1, wherein the time required to heat the substrate when the temperature of the substrate is changed in the reflow furnace according to a predetermined temperature profile is acquired as the standard operation time of the reflow furnace.

3. 2. The production system according to claim 1, wherein, in the acquisition process, the management device accepts input of work time information relating to work times in the standard mode of each of the plurality of operation devices, and acquires the standard work times of each of the plurality of operation devices based on the work time information.

4. 2. The production system according to claim 1, wherein the management device, in the work setting process, accepts input of selection information indicating whether the power saving mode or the high precision mode should be selected as the operating mode of the other work device, and sets the operating mode of the other work device based on the selection information.

5. the printing machine, the mounting machine, and the inspection machine each have a moving unit that moves in a plurality of axial directions; 2. The production system according to claim 1, wherein, in the task setting process, when the other task devices are the printing machine, the mounting machine, and the inspection machine, the management device sets an operating mode in which the acceleration of the moving unit is reduced from the standard mode as the power saving mode.

6. 6. The production system according to claim 5, wherein the power saving modes in the printing machine, the mounting machine, and the inspection machine include a first mode that reduces the acceleration of the moving unit when moving in all directions along the multiple axial directions, and a second mode that reduces the acceleration of the moving unit when moving in some directions among the multiple axial directions.

7. the moving unit of the mounting machine is a mounting head unit that moves between a component supply position where the component is supplied and a mounting position on the board, sucks and holds the component at the component supply position, and mounts the sucked and held component onto the board at the mounting position, 7. The production system according to claim 6, wherein the power saving modes of the mounting machine include, in addition to the first and second modes, a third mode in which an acceleration of the moving unit is reduced when the moving unit moves from the mounting position toward the component supply position after the component is mounted on the board.

8. the printing machine includes a mask disposed above the substrate, a printing unit that prints the solder paste onto the substrate through the mask, and a cleaning unit that cleans the mask; the mounting machine has a mounting head unit that moves relative to the board while mounting the components on the board, the inspection machine is equipped with an imaging unit that images the board, and has an inspection head unit that inspects the board based on the image captured by the imaging unit; The management device In the task setting process, if the other task devices are the printing machine, the mounting machine, and the inspection machine, With respect to the printing machine, an operating mode in which the frequency of cleaning of the mask by the cleaning unit is increased from the standard mode is set as the high-precision mode; With respect to the mounting machine, an operation mode in which the movement method of the mounting head unit is changed from the standard mode is set as the high-precision mode, 2. The production system according to claim 1, wherein an operating mode in which the number of inspection items performed by the inspection head unit is increased from the standard mode is set as the high-precision mode for the inspection machine.

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