Probe device

Abstract

To provide a probe device for enabling reliable measurement / inspection even if, for example, there is undulation on the surface of an inspected board.SOLUTION: A probe device for electrically measuring an inspected board in which an electrode pad section is disposed in an inspected area comprises: a stage for holding the inspected board such that the electrode pad section is exposed; a flexible probe board; a probe that is erected and disposed on a probe formation area of the surface of the probe board; a probe board holding member having a fixation section for holding a peripheral section of the probe board such that the probe opposes the electrode pad section of the inspected board held by the stage; and an elastic member disposed in a back side of the probe board. The elastic member urges the probe board so as to bulge and curve toward the stage, and the probe board holding member is provided relatively movably along a direction at a right angle to the stage.SELECTED DRAWING: Figure 2-1

Description

[Technical Field]

[0001] The present invention relates to a probe device for electrically measuring and inspecting a substrate to be inspected by bringing probes into contact with electrode pads formed on the surface of the substrate to be inspected. [Background technology]

[0002] A large number of electrode pads are formed on the surface of a package substrate on which a semiconductor chip is mounted. A probe device equipped with multiple probes is used to measure and test the electrical characteristics of a test substrate, such as a package substrate. The probe device is required to simultaneously contact the electrode pads even if the heights of the electrode pads vary. A known conventional probe device has a mechanical structure biased by a spring coil, arranged two-dimensionally so that the tips of the probes can move forward and backward (protruding and retracting) (see, for example, Patent Document 1). Other known probes include a two-dimensional arrangement of multiple cantilever structures manufactured using MEMS (Micro Electro Mechanical Systems) technology. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-315775 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, semiconductor chips have become increasingly highly integrated thanks to improvements in manufacturing process technology. Accordingly, the number of electrode pads on the surface of package substrates for mounting these semiconductor chips has increased, and the electrode pads have become increasingly finer and their pitches have become narrower. However, it is difficult to two-dimensionally integrate and arrange mechanical probes with spring coils or probes manufactured using MEMS technology on the surface of package substrates so that they face the increasingly finer and narrower electrode pads. When testing using a probe device, the test substrate, such as a package substrate, is placed on a substrate suction plate (stage). If the surface of this substrate suction plate is undulating or the test substrate itself is undulating, other probes or other parts of the probe device may interfere with the test substrate before the probe tip can contact the electrode pad on the test substrate, making contact between the probe and the electrode pad difficult. Furthermore, in probe devices, undulations may occur on the surface (imaginary plane) formed by connecting the tips of multiple probes, making it difficult for the probe to contact the electrode pad.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a probe device that enables reliable measurement and inspection even when the surface of the substrate to be inspected is undulating, when the substrate to be inspected itself has undulations, when the stage on which the substrate to be inspected is placed has undulations on its surface, or when there is undulations on the surface connecting the tips of multiple probes. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, one aspect of the present invention is a probe device for performing electrical measurements on a test target substrate having electrode pad portions arranged in an area to be tested, the probe device comprising: a stage for holding the test target substrate so that the electrode pad portions are exposed; a flexible probe substrate; probes arranged upright in probe formation areas on the surface of the probe substrate; a probe substrate holding member having fixing portions for holding the peripheral edge of the probe substrate so that the probes face the electrode pad portions of the test target substrate held on the stage; and an elastic member arranged on the back side of the probe substrate, wherein the elastic member urges the probe substrate so that it bulges and curves toward the stage, and the probe substrate holding member is arranged to be relatively movable along a direction perpendicular to the stage.

[0007] In the above aspect, it is preferable that the elastic member is disposed between the probe substrate holding member and the probe substrate, and a gap is formed to allow deformation of the elastic member as the probe substrate is bent back.

[0008] In the above aspect, it is preferable that the elastic member is made of a resin material having elasticity, and the space has a capacity that can absorb the amount of deformation of the elastic member.

[0009] Another aspect of the present invention is a probe device for performing electrical measurements on a test substrate having electrode pad portions arranged in a test area on its surface, comprising: a probe substrate having probes arranged so that they stand upright in the probe formation area on the surface; a probe substrate holding member for holding the probe substrate; a stage having a fixing portion for holding the peripheral edge of the test substrate so that the electrode pad portions face toward the probe substrate holding member; and an elastic member arranged on the back side of the test substrate, wherein the elastic member urges the test substrate to bulge and curve toward the probe substrate holding member, and the probe substrate holding member is arranged to be movable relatively along a direction perpendicular to the stage.

[0010] In the above aspect, it is preferable that the elastic member is disposed between the stage and the substrate to be inspected, and a gap is formed to allow deformation of the elastic member due to bending back of the substrate to be inspected.

[0011] In the above aspect, it is preferable that the elastic member is made of a resin material having elasticity, and the space has a capacity that can absorb the amount of deformation of the elastic member. [Effects of the Invention]

[0012] The probe device according to the present invention has the effect of enabling reliable measurement and inspection even when the surface of the substrate to be inspected is undulating, when the substrate to be inspected itself has undulations, when the stage on which the substrate to be inspected is placed has undulations on its surface, or when the surface connecting the tips of multiple probes is undulating. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a bottom view showing a probe substrate holding member holding a probe substrate in a probe apparatus according to a first embodiment of the present invention, as viewed from below. [Figure 2-1] FIG. 2-1 is a cross-sectional explanatory view of the probe device according to the first embodiment of the present invention, showing a case where the stage is deformed and curved upward. [Figure 2-2] FIG. 2-2 is a cross-sectional explanatory diagram of the probe device according to the first embodiment of the present invention, showing a state in which the stage is deformed to bend upward, and shows a state in which the probe is pressed against the electrode pad portion. [Figure 3-1] FIG. 3-1 is a cross-sectional explanatory view of the probe apparatus according to the first embodiment of the present invention, showing a case where the stage is deformed to bend downward. [Figure 3-2] FIG. 3-2 is a cross-sectional explanatory diagram of the probe device according to the first embodiment of the present invention, showing a state in which the stage is deformed to bend downward, and shows a state in which the probe is pressed against the electrode pad portion. [Figure 4-1]FIG. 4-1 is a cross-sectional explanatory diagram of a probe device according to a second embodiment of the present invention, showing a process in which a probe is placed in an upper position facing an electrode pad portion and the probe is moved toward the electrode pad portion. [Figure 4-2] FIG. 4-2 is a cross-sectional explanatory view of a probe device according to a second embodiment of the present invention, showing a state in which a probe is pressed against an electrode pad portion. [Figure 4-3] FIG. 4-3 is a cross-sectional explanatory view of the probe device according to the second embodiment of the present invention, showing a process of lifting the probe substrate and then lifting the test target substrate together with the fixing part. [Figure 4-4] FIG. 4-4 is a cross-sectional explanatory view of the probe device according to the second embodiment of the present invention, showing a process of moving the test target substrate laterally together with the fixing part. [Figure 5] FIG. 5 is an explanatory cross-sectional view showing a modified example of the probe device according to the first embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] The details of the probe device according to the embodiment of the present invention will be explained below with reference to the drawings. However, it should be noted that the drawings are schematic and the number of components, dimensions of each component, dimensional ratios, shapes, etc. may differ from the actual ones. Furthermore, the drawings may include parts where the dimensional relationships, ratios, and shapes differ from one another.

[0015] [First embodiment]

[0016] (Schematic configuration of the probe device) The configuration of a probe apparatus 1A according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 3-2.

[0017] The test substrate 2, on which electrical measurement is performed using the probe device 1A according to this embodiment, is made of insulating resin, glass, ceramics, etc., and has a plurality of electrode pads 2A arranged in a detection area (not shown) in the center. Wiring (not shown) is connected to each of the electrode pads 2A.

[0018] The probe apparatus 1A includes a stage 3, a probe substrate 4, a plurality of probes 5, a probe substrate holding member 6, and an elastic member .

[0019] The stage 3 is a base having a rectangular planar shape and is provided with a holding mechanism (not shown) for holding the inspection target substrate 2. The upper surface of the stage 3 is a mounting surface 31 on which the inspection target substrate 2 is mounted. As shown in FIG. 2-1, the inspection target substrate 2 is held in a predetermined area of ​​the mounting surface 31 so that the electrode pad portions 2A are exposed. The mounting surface 31 is processed to be flat, but it is also possible that the mounting surface 31 may be curved upward as shown in FIG. 2-1 depending on the environment in which the probe device 1A is placed.

[0020] As will be described later, it is also possible that the mounting surface 31 undulates downward from the center, as in the stage 3 shown in FIGS. 3-1 and 3-2. The probe device 1A according to this embodiment is capable of appropriate electrical measurement even when the mounting surface 31 is undulated in a complex shape, in addition to the undulations shown in FIGS. 2-1 and 3-1. The test target substrate 2 is held so that its underside is in close contact with the mounting surface 31 of the stage 3, exposing the electrode pad portions 2A.

[0021] As shown in Figures 1 and 2-1, the probe substrate 4 is made of a rectangular insulating resin and is flexible. The probe substrate 4 is designed so that it will not break or crack even when bent. A plurality of probes 5 are arranged upright in a probe formation region 4C set in the center of the surface (lower surface) 4A of the probe substrate 4. The probes 5 may be any conductive member formed so as to protrude from the probe substrate 4, so the configuration is simple, and a narrow pitch and miniaturization can be achieved. The protruding lengths of these probes 5 from the surface 4A are set to the same dimension.

[0022] The probe substrate holding member 6 has fixing portions 6A that hold the peripheral edge of the probe substrate 4 so that the probes 5 provided on the probe substrate 4 face the electrode pad portions 2A of the test target substrate 2 held on the stage 3. As shown in FIG. 2-1 , both end edges of the probe substrate 4 in the X direction are held by the fixing portions 6A of the probe substrate holding member 6 in a bent state.

[0023] As shown in Fig. 2-1, the elastic member 7 is disposed on the rear surface 4B side of the probe substrate 4. This elastic member 7 biases the probe substrate 4 so that it bulges and curves toward the stage 3. The elastic member 7 can be made of various elastic synthetic resins such as polyimide, polyamide, polyester, polyethylene, polyvinyl alcohol, polypropylene, polycarbonate, and polystyrene, or rubber.

[0024] Furthermore, in the probe substrate holding member 6, the elastic member 7 is arranged between the probe substrate 4 and the rear surface 4B thereof, and a gap 8 is formed which allows deformation of the elastic member 7 accompanying bending back of the probe substrate 4 when the probe substrate 4 is bent so as to bulge out. A surface (imaginary surface) formed by connecting the tips of the probes 5 is curved so as to protrude and come into contact with the test target substrate 2.

[0025] Furthermore, the probe substrate holding member 6 is provided so as to be relatively movable along a direction perpendicular to the stage 3 (the direction indicated by the arrow Z in the figure). Specifically, the probe substrate holding member 6 is provided so as to be movable up and down by a lifting drive mechanism (not shown).

[0026] (Operation, Action and Effects of the Probe Device of the Present Embodiment) In this embodiment, the surface (imaginary surface) formed by connecting the tips of the probes 5 is curved so as to protrude and contact the test target substrate 2. Therefore, by moving (lowering) the probe substrate holding member 6 toward the stage 3, the tips of the probes 5 start to contact the electrode pad portions 2A in order from the most protruding top, and by further lowering the probe substrate holding member 6, the probes 5 come into contact with all the electrode pad portions 2A, as shown in FIG.

[0027] As described above, the probes 5 that come into contact with the electrode pad 2A receive a reaction force from the electrode pad 2A in order, which deforms the elastic member 7. That is, as the probe substrate 4 is bent back, the elastic member 7 deforms. At this time, the gap 8 defined in the probe substrate holding member 6 has a sufficient capacity to absorb the amount of deformation of the elastic member 7. Therefore, the surface (imaginary surface) formed by connecting the tips of the multiple probes 5 can change to fit the surface connecting the tips of the electrode pad 2A, and all the probes 5 can reliably contact the corresponding electrode pad 2A, enabling electrical measurements.

[0028] 3-1 and 3-2 show a case where the mounting surface 31 of the stage 3 in the probe apparatus 1A according to the first embodiment of the present invention is a concave, curved surface. With the probe apparatus 1A according to this embodiment, as shown in FIG. 3-2, contact between the probes 5 and the electrode pad portions 2A can be reliably ensured. That is, even if the electrode pad portions 2A of the test target substrate 2 placed on the mounting surface 31 are located at the bottom of the concave portions in the surface of the test target substrate 2, contact with the electrode pad portions 2A can be ensured because the probe substrate 4 has multiple probes 5 that bulge downward.

[0029] According to this embodiment, the probes 5 have a simple structure and are formed so as to protrude from the probe substrate 4, which has the advantage that the spacing can be set to a short distance depending on the spacing between the electrode pad portions 2A on the substrate to be inspected.

[0030] 2-2 and 3-2, in this embodiment, the elastic member 7 provides the probe 5 with cushioning properties that absorb the reaction force from the electrode pad portion 2A, which has the effect of preventing damage to the probe 5 and the electrode pad portion 2A. Therefore, according to this embodiment, it is not necessary to use a probe having a mechanical structure biased by a spring coil as in the conventional case, and the stability and precision of the test can be improved.

[0031] [Second embodiment] Next, the configuration of a probe apparatus 1B according to a second embodiment of the present invention will be described with reference to FIGS. 4-1 to 4-4.

[0032] The test substrate 2, on which electrical measurements are performed using the probe device 1B according to this embodiment, is made of insulating and flexible resin, and has a plurality of electrode pads 2A arranged in a predetermined detection area on the substrate surface. Wiring (not shown) is connected to each of the electrode pads 2A.

[0033] The probe device 1B includes a probe substrate 4 on which probes 5 are arranged so as to stand upright in a probe formation area (not shown) on the front surface 4A, a probe substrate holding member 6 that holds the probe substrate 4, a stage 3A having a fixing portion 9 that holds the peripheral portion 2C of the substrate 2 to be inspected so that the electrode pad portion 2A faces the probe substrate holding member 6, and an elastic member 7 that is arranged on the back surface 2B side of the substrate 2 to be inspected.

[0034] As shown in FIG. 4-1, in this embodiment, the elastic member 7 biases the test target substrate 2 so that it bulges and curves toward the probe substrate holding member 6.

[0035] In this embodiment, the probe substrate holding member 6 is provided so as to be relatively movable along a direction perpendicular to the stage 3A (up and down direction).

[0036] The stage 3A has an elastic member 7 placed between the mounting surface 32 and the substrate 2 to be inspected, and when it changes from the state shown in Figure 4-1 to the state shown in Figure 4-2, a gap 10 is formed that allows deformation of the elastic member 7 as the substrate 2 to be bent back.

[0037] In this embodiment as well, the elastic member 7 is made of a resin material having elasticity, and the volume of the gap 10 is set to be able to absorb the amount of deformation of the elastic member 7.

[0038] Next, the operation, function and effects of the probe apparatus 1B according to this embodiment will be described.

[0039] In the probe device 1B of this embodiment, as shown in FIG. 4-1, the probe 5 is placed at an upper position facing the electrode pad portion 2A, and the probe substrate holding member 6 is lowered to bring the probe 5 into contact with the electrode pad portion 2A as shown in FIG. 4-2, thereby enabling electrical measurement.

[0040] Next, as shown in Figure 4-3, the probe substrate holding member 6 is raised in the direction of arrow Z, and then the fixing part 9 on the stage 3A is raised in the direction of arrow D, making the fixing part 9 movable laterally relative to the stage 3A.

[0041] 4-4 shows the state in which the fixing portion 9 is being moved in the direction of the arrow E. This operation also makes it possible to move the test target substrate 2 in the direction of the arrow E so that another electrode pad portion 2A faces the probe 5.

[0042] According to this embodiment, the region to be inspected, on which the electrode pad portions 2A of the inspection target substrate 2 are formed, can be bent by the elastic member 7 so as to bulge toward the probe substrate holding member 6. Therefore, even if undulation occurs in the surface (imaginary surface) connecting the tips of the plurality of probes 5, the surface (imaginary surface) connecting the tips of the electrode pad portions 2A in the region to be inspected is bent so as to bulge, and the reaction force absorption function of the elastic member 7 allows the tips of the probes 5 to reliably contact the electrode pad portions 2A.

[0043] That is, since the surface (imaginary surface) connecting the tips of the electrode pad portions 2A bulges upward, the members on the stage 3A side do not interfere with the probe substrate 4 side, and the probes 5 and the electrode pad portions 2A can be reliably brought into contact with each other.

[0044] [Other embodiments] Although the first and second embodiments of the present invention have been described above, the descriptions and drawings that form part of the disclosure of the embodiments should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure.

[0045] In the present invention, the test target substrate 2 can be applied to various substrates such as package substrates, printed wiring boards, flexible boards, multilayer wiring boards, and film carriers, each having a large number of electrode pads on its front or back surface.

[0046] For example, in the first embodiment, a pair of both side edges of the probe substrate 4 are held by the fixing portions 6A of the probe substrate holding member 6, but it is also possible to have a configuration in which all four sides of the probe substrate 4 are held. Similarly, in the second embodiment, it is also possible to have a configuration in which all four sides of the test target substrate 2 are held by the fixing portions 9.

[0047] In the first embodiment, one elastic member 7 is disposed on the rear surface 4B of the probe substrate 4. However, as shown in FIG. 5, when groups of probes 5 are provided in multiple regions (two in FIG. 5) on the front surface 4A of the probe substrate 4, elastic members 7 may be provided in regions on the rear surface 4B of the probe substrate 4 corresponding to each group of probes 5. As shown in FIG. 5, piezoelectric actuators 11A and 11B may be interposed between each elastic member 7 and the probe substrate holding member 6. This configuration allows the voltage applied to the piezoelectric actuator 11A to be controlled to control the protrusion dimension P1 (protrusion dimension in the direction of arrow B) of the bulge portion 12 (see FIG. 5). Similarly, the voltage applied to the piezoelectric actuator 11B to be controlled to control the protrusion dimension P2 (protrusion dimension in the direction of arrow C) of the bulge portion 13. Thus, the configuration having multiple bulges 12 and 13 allows the probes 5 to reliably contact the electrode pad portions 2A present in multiple test regions 14 and 15 on the test target substrate 2.

[0048] 5, even when undulations occur on the mounting surface 31 of the stage 3 or on the surface of the inspection target substrate 2, by appropriately setting the protrusion dimensions P1, P2 of the respective bulges 12, 13, it is possible to reliably bring the probes 5 into contact with the electrode pad portions 2A and prevent interference between the stage 3 and the probe substrate holding member 6. Note that although the probe device 1A shown in FIG. 5 is configured to include two bulges 12, 13, it may also be configured to include three or more bulges.

[0049] Furthermore, in the second embodiment, one elastic member 7 is disposed on the rear surface 2B of the substrate 2 to be inspected. However, elastic members 7 may be interposed between the substrate 2 to be inspected and the stage 3A at multiple locations on the rear surface 2B of the substrate 2 to be inspected. Furthermore, piezo actuators similar to the piezo actuators 11A and 11B shown in FIG. 5 may be provided between each elastic member 7 and the mounting surface 31 of the stage 3. This configuration makes it possible to appropriately set the amount of protrusion deformation of the detection area (not shown) where the electrode pad portion 2A is formed (see detection areas 14 and 15 in FIG. 5) and the shape corresponding to the front surface 4A of the probe substrate 4. Note that, in addition to the piezo actuators 11A and 11B, various actuators may be used as means for displacing the elastic member 7. [Explanation of symbols]

[0050] 1A, 1B Probe device 2. Test target board 2A Electrode pad section 2B back side 2C Periphery 3,3A Stage 4 Probe board 4A surface 4B Back 4C Probe formation region 5 Probe 6 Probe substrate holding member 6A Fixed part 7 Elastic member 8 void 9 Fixed part 10 void 11A, 11B Piezoelectric Actuator 12,13 Bulge 14,15 Inspected area 31 Mounting surface 32 Mounting surface

Claims

1. A probe device for performing electrical measurements on a test substrate having electrode pads arranged in a test area, comprising: a stage that holds the inspection target substrate so that the electrode pad portion is exposed; a flexible probe substrate; probes arranged upright in a probe formation region on the surface of the probe substrate; a probe substrate holding member having a fixing portion for holding a peripheral portion of the probe substrate so that the probes face the electrode pad portions of the test substrate held on the stage; an elastic member disposed on the rear surface side of the probe substrate; Equipped with the elastic member biases the probe substrate so as to bulge and curve toward the stage; The probe substrate holding member is provided so as to be relatively movable along a direction perpendicular to the stage. A probe device characterized by:

2. The elastic member is disposed between the probe substrate holding member and the probe substrate, and a gap is formed between the probe substrate holding member and the probe substrate, allowing deformation of the elastic member due to bending back of the probe substrate. The probe device according to claim 1 .

3. The elastic member is made of a resin material having elasticity, and the space has a capacity set to absorb the amount of deformation of the elastic member. The probe device according to claim 2 .

4. A probe device for performing electrical measurements on a test substrate having electrode pads arranged in a test area on its surface, comprising: a probe substrate having probes provided in a probe formation region on its surface so as to stand upright; a probe substrate holding member for holding the probe substrate; a stage having a fixing portion that holds a peripheral portion of the test target substrate so that the electrode pad portion faces the probe substrate holding member; an elastic member disposed on the rear surface side of the inspection target substrate; Equipped with the elastic member biases the test target substrate so that the test target substrate bulges and curves toward the probe substrate holding member; The probe substrate holding member is provided so as to be relatively movable along a direction perpendicular to the stage. A probe device characterized by:

5. The stage has the elastic member disposed between it and the inspection target substrate, and a gap is formed between the stage and the inspection target substrate to allow deformation of the elastic member due to bending back of the inspection target substrate. The probe device according to claim 4 .

6. The elastic member is made of a resin material having elasticity, and the space has a capacity set to absorb the amount of deformation of the elastic member. The probe device according to claim 5 .

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