Electronic device and electronic module

Abstract

To provide an electronic device and an electronic module capable of efficiently cooling an electronic component.SOLUTION: One embodiment of the electronic device includes: a first electronic component; a casing in which the first electronic component is housed; and a first conductor electrically connected to the first electronic component. The first conductor penetrates the inside and outside of the casing. The casing has a first opening through which a coolant can flow in and a second opening through which the coolant can flow out.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to electronic devices and electronic modules. [Background technology]

[0002] For example, a technique is known in which a heat sink is attached to an electronic component, such as a power module, in order to cool the electronic component that generates a relatively large amount of heat (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-72094 Summary of the Invention [Problem to be solved by the invention]

[0004] However, there is a demand for more efficient cooling of electronic components.

[0005] Therefore, the present disclosure provides an electronic device and an electronic module that can efficiently cool electronic components. [Means for solving the problem]

[0006] (1) One embodiment of an electronic device according to the present disclosure includes: a first electronic component; a box that houses the first electronic component; a first conductor that penetrates the box from the inside to the outside and is electrically connected to the first electronic component; The box has a first hole through which the refrigerant can flow in and a second hole through which the refrigerant can flow out.

[0007] (2) One embodiment of the electronic device according to the present disclosure includes: The electronic device according to (1), the box body has a container body in which the first electronic component is mounted and a lid body that covers the first electronic component, The first hole and the second hole are located in the lid.

[0008] (3) One embodiment of the electronic device according to the present disclosure includes: The electronic device according to (1) or (2), The first hole and the second hole are respectively located in opposing wall portions of the wall portion of the box.

[0009] (4) One embodiment of the electronic device according to the present disclosure is Any one of the electronic devices (1) to (3) above, The first hole and the second hole are located in a wall portion of the box body that is different from the wall portion in which the outer exposed portion of the first conductor is located.

[0010] (5) One embodiment of the electronic device according to the present disclosure includes: Any one of the electronic devices (1) to (3) above, At least one of the first hole and the second hole is located in a wall portion of the box body that is different from the wall portion in which the outer exposed portion of the first conductor is located.

[0011] (6) One embodiment of the electronic device according to the present disclosure includes: Any one of the electronic devices (1) to (5) above, At least one of the first hole and the second hole is located in an upper wall portion of the wall portion of the box body that is different from the wall portion on which the outer exposed portion of the first conductor is located.

[0012] (7) One embodiment of the electronic device according to the present disclosure is Any one of the electronic devices (1) to (6) above, At least one of the first hole and the second hole is located in a side wall portion of the wall portion of the box body that is different from the wall portion on which the outer exposed portion of the first conductor is located.

[0013] (8) One embodiment of the electronic device according to the present disclosure includes: Any one of the electronic devices (1) to (7) above, At least one of the first hole and the second hole is located above a surface on which the first electronic component is located.

[0014] (9) One embodiment of the electronic device according to the present disclosure is The electronic device according to any one of (1), (2), (4) to (8), The first hole and the second hole are respectively located in wall portions of the box body that do not face each other.

[0015] (10) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (1), (2), (4) to (9) above, one of the first hole and the second hole is located in one of the side walls of the box; The other of the first hole and the second hole is located in the upper wall of the box.

[0016] (11) One embodiment of the electronic device according to the present disclosure includes: a first electronic component; a wiring board on which the first electronic component is mounted; a lid located on the wiring board and covering the first electronic component; a first conductor that penetrates the wiring board and is electrically connected to the first electronic component; the lid has a first hole through which the refrigerant can flow in and a second hole through which the refrigerant can flow out, At least one of the first hole and the second hole is spaced from the wiring board.

[0017] (12) One embodiment of the electronic device according to the present disclosure comprises: The electronic device according to (11), Further, a second electronic component is mounted on the wiring board, In a plan view, the cover is spaced apart from the second electronic component.

[0018] (13) One embodiment of the electronic device according to the present disclosure comprises: The electronic device according to (11) or (12), The lid body is mainly composed of ceramic or metal, The wiring board is mainly made of ceramic or resin.

[0019] (14) One embodiment of the electronic device according to the present disclosure comprises: The electronic device according to any one of (2) and (11) to (13), The first hole and the second hole are located in the upper wall of the lid.

[0020] (15) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (1) to (10) above, The box has a protrusion extending from the first hole toward the second hole at least at a position facing the first electronic component.

[0021] (16) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (11) to (14) above, The lid has a protrusion extending from the first hole toward the second hole at least at a position facing the first electronic component.

[0022] (17) One embodiment of the electronic device according to the present disclosure comprises: The electronic device according to (15) or (16), The protrusion is spaced apart from the first electronic component.

[0023] (18) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (1) to (17) above, the first hole and the second hole are located opposite a surface on which the first electronic component is located, In a plan view, the first electronic component is located between the first hole and the second hole.

[0024] (19) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (1) to (18) above, The first conductor includes a lead terminal, a metal plate, or a castellation.

[0025] (20) One embodiment of the electronic device according to the present disclosure includes: Any one of the electronic devices (1) to (19) above, The first electronic component is a passive component or a semiconductor device.

[0026] (21) One embodiment of the electronic device according to the present disclosure includes: Any one of the electronic devices (1) to (20) above, Further provided with a first cylindrical portion protruding outward, The first cylindrical portion has the first hole portion.

[0027] (22) One embodiment of the electronic device according to the present disclosure comprises: Any one of the electronic devices (1) to (21) above, a flow path member connected to at least one of the first hole portion and the second hole portion, The flow path member has a flow path for the coolant therein.

[0028] (23) One embodiment of an electronic module according to the present disclosure includes: The electronic device according to any one of (1) to (22) above; and a refrigerant circulation device connected to at least one of the first hole portion and the second hole portion. [Effects of the Invention]

[0029] According to the present disclosure, an electronic device and an electronic module capable of efficiently cooling electronic components can be obtained. [Brief explanation of the drawings]

[0030] [Figure 1] 5 is a cross-sectional view of the electronic device according to one embodiment taken along line AA in FIG. 4. FIG. [Figure 2] FIG. 2 is a perspective view of the electronic device shown in FIG. [Figure 3] FIG. 2 is an exploded perspective view of the electronic device shown in FIG. [Figure 4] FIG. 2 is a plan view of the electronic device shown in FIG. [Figure 5] 8 is a cross-sectional view of an electronic device according to another embodiment taken along the line BB in FIG. 7. [Figure 6] FIG. 6 is a perspective view of the electronic device shown in FIG. 5, with the flow path member omitted. [Figure 7] FIG. 6 is a plan view of the electronic device shown in FIG. 5, with the flow path member omitted. [Figure 8] 11 is a cross-sectional view of an electronic device according to another embodiment taken along line CC in FIG. 10. FIG. [Figure 9] FIG. 9 is a perspective view of the electronic device shown in FIG. 8. [Figure 10] FIG. 9 is a plan view of the electronic device shown in FIG. [Figure 11] 13 is a cross-sectional view of an electronic device according to another embodiment taken along the line DD in FIG. 12. FIG. [Figure 12] FIG. 12 is a plan view of the electronic device shown in FIG. [Figure 13] 15 is a cross-sectional view of an electronic device according to another embodiment taken along the line EE in FIG. 14. [Figure 14] FIG. 14 is a plan view of the electronic device shown in FIG. [Figure 15] 17 is a cross-sectional view of an electronic device according to another embodiment taken along the line FF in FIG. 16. FIG. [Figure 16] FIG. 16 is a plan view of the electronic device shown in FIG. [Figure 17] 16 is a partially see-through perspective view of a cover of the electronic device shown in FIG. 15. FIG. [Figure 18] 1 is a cross-sectional view of an electronic module according to an embodiment; [Figure 19] FIG. 10 is a cross-sectional view of an electronic module according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, for the sake of convenience, the figures referred to below are simplified views of the main components necessary for explaining the embodiments. Therefore, embodiments of the present disclosure may include any components not shown in the figures referred to. Furthermore, the figures do not necessarily faithfully represent the dimensional ratios of the actual components. For convenience, directions are defined using the Cartesian coordinate system XYZ. The positive side of the X direction is the right side, the positive side of the Y direction is the front side, and the positive side of the Z direction is the top side. In this disclosure, "planar view" refers to a view from the top side of the electronic device (the positive side of the Z direction) and includes planar perspective view.

[0032] In the following description, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used. These expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in their strict sense. In other words, these expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc. Numerical ranges expressed using "to" include the numerical values ​​before and after it as the lower and upper limits, respectively.

[0033] [Electronic Devices] As shown in FIGS. 1 to 12 , an electronic device 1 may include a first electronic component 2, a case 3 that houses the first electronic component 2, and a first conductor 7 that is electrically connected to the first electronic component 2. In this case, the first conductor 7 penetrates the inside and outside of the case 3. The case 3 has a first hole 8 through which a refrigerant can flow in and a second hole 9 through which the refrigerant can flow out. The electronic device 1 having this configuration can directly cool the first electronic component 2, thereby improving the cooling efficiency of the first electronic component 2. Furthermore, the electronic device 1 can be made smaller and lighter than cooling methods that require a heat sink or the like. Furthermore, the volume of the area through which the refrigerant flows can be reduced, thereby improving the cooling effect and reducing the amount of refrigerant used.

[0034] In this disclosure, the term "box" refers to a shape that has a box-like external shape and an internal space, and is not necessarily limited to a cubic or rectangular shape. For example, a structure in which a lid 6 covers only a portion of a wiring board 5 in a plan view, as shown in Fig. 13, does not qualify as a "box."

[0035] As shown in FIG. 1 and other figures, the box 3 may have a container 4 on which the first electronic component 2 is mounted and a lid 6 that covers the first electronic component 2. In this case, the first hole 8 and the second hole 9 may be located in the lid 6. The container 4 is not flat, but is a concave member in which the first electronic component 2 can be mounted, as shown in FIG. 1. The lid 6 may be a flat member as shown in FIG. 5, or may be a concave member as shown in FIG. 1. If the member on which the first electronic component 2 is mounted is a concave container 4 as in this configuration, the surface on which the first electronic component 2 is mounted can be separated from the joint between the container 4 and the lid 6, making sealing easier.

[0036] As shown in FIGS. 1 and 11, the first hole 8 and the second hole 9 may be located in opposing wall portions of the wall of the box 3. The wall portions of the box 3 include a lower wall portion w1, multiple side wall portions w2, and an upper wall portion w3. The lower wall portion w1 is located on the negative side (lower side) in the Z direction. The side wall portions w2 are located on the positive side in the X direction, the negative side in the X direction, the positive side in the Y direction, and the negative side in the Y direction. The upper wall portion w3 is located on the positive side (upper side) in the Z direction. When the first hole 8 and the second hole 9 are located on opposing wall portions of the wall of the box 3, the refrigerant can flow in and out more efficiently. At least one of the first hole 8 and the second hole 9 may be located in the container body 4 above a bottom surface s1 (described later).

[0037] As shown in FIGS. 1, 5, 8, 11, etc., at least one of the first hole 8 and the second hole 9 may be located in a wall portion of the box body 3 different from the wall portion where the exposed portion of the first conductor 7 is located. In other words, at least one of the first hole 8 and the second hole 9 may be located in a wall portion of the box body 3 where the exposed portion of the first conductor 7 is not located. The "exposed portion of the first conductor 7" refers to a portion of the first conductor 7 exposed from the outer surface of the wall portion. The "outer surface" refers to the surface of the wall portion opposite to the side where the first electronic component 2 is located. For example, in the embodiment shown in FIGS. 1 to 4, the "exposed portion of the first conductor 7" is located on the positive side wall w2 in the Y direction and the negative side wall w2 in the Y direction of the box body 3, and therefore the "wall portion different from the wall portion where the exposed portion of the first conductor 7 is located" is the bottom wall portion w1, the positive side wall w2 in the X direction, the negative side wall w2 in the X direction, and the top wall portion w3. When at least one of the first hole 8 and the second hole 9 is located in a wall portion of the box body 3 that is different from the wall portion where the exposed portion of the first conductor 7 is located, the coolant can flow in or out more easily. This makes it easier to arrange the electrical wiring and the flow path through which the coolant passes in the electronic device 1.

[0038] 1, 5, 8, 11, etc., both the first hole 8 and the second hole 9 may be located in a wall portion of the box body 3 that is different from the wall portion where the exposed portion of the first conductor 7 is located. In other words, both the first hole 8 and the second hole 9 may be located in a wall portion of the box body 3 that is not where the exposed portion of the first conductor 7 is located. This configuration facilitates the inflow and outflow of the refrigerant.

[0039] Furthermore, as shown in Figures 1, 11, etc., when the first hole portion 8 and the second hole portion 9 are located on wall portions different from the wall portion on which the externally exposed portion of the first conductor 7 is located and facing each other, the refrigerant can flow in and out more easily and more efficiently.

[0040] 5, 8, etc., at least one of the first hole 8 and the second hole 9 may be located in an upper wall portion w3 of the wall of the box body 3 that is different from the wall portion on which the exposed portion of the first conductor 7 is located. In other words, at least one of the first hole 8 and the second hole 9 may be located in an upper wall portion w3 of the wall of the box body 3 on which the exposed portion of the first conductor 7 is not located. In other words, the exposed portion of the first conductor 7 may not be located on the upper wall portion w3, and at least one of the first hole 8 and the second hole 9 may be located on the upper wall portion w3.

[0041] 1, 5, 8, 11, etc., at least one of the first hole 8 and the second hole 9 may be located in a side wall w2 of the wall of the box body 3 that is different from the wall where the exposed portion of the first conductor 7 is located. In other words, at least one of the first hole 8 and the second hole 9 may be located in a side wall w2 of the wall of the box body 3 where the exposed portion of the first conductor 7 is not located. In other words, at least one of the first hole 8 and the second hole 9 may be located in a certain side wall w2 where the exposed portion of the first conductor 7 is not located.

[0042] As shown in FIGS. 1, 5, 8, 11, etc., at least one of the first hole 8 and the second hole 9 may be located above the surface on which the first electronic component 2 is located. In the embodiment shown in FIGS. 1, 5, 8, 11, etc., the surface on which the first electronic component 2 is located is the bottom surface s1 of the box body 3. The "bottom surface s1 of the box body 3" refers to the surface on the positive side (upper side) in the Z direction of the lower wall portion w1. When the first electronic component 2 is indirectly mounted via a submount, an interposer 16, etc., the surface on which the submount, interposer 16, etc. are mounted is the "surface on which the first electronic component 2 is located." When at least one of the first hole 8 and the second hole 9 is located above the surface on which the first electronic component 2 is located, the possibility of the first electronic component 2 falling off due to the pressure of the flowing refrigerant is reduced.

[0043] 1, 5, 8, 11, etc., both the first hole 8 and the second hole 9 may be located above the surface on which the first electronic component 2 is located. This configuration further reduces the possibility that the first electronic component 2 will fall off due to the pressure of the flowing refrigerant.

[0044] 8 and other figures, the first hole 8 and the second hole 9 may be located in wall portions of the box 3 that do not face each other. For example, one of the first hole 8 and the second hole 9 may be located in one of the side wall portions w2 of the box 3, and the other of the first hole 8 and the second hole 9 may be located in the upper wall portion w3 of the box 3. As another example, the wall portions that do not face each other may be the side wall portion w2 and the lower wall portion w1, or may be a certain side wall portion w2 and a different side wall portion w2 connected thereto.

[0045] 5 and other figures, both the first hole 8 and the second hole 9 may be located in the upper wall portion w3 of the lid 6. With this configuration, the height of the lid 6 can be reduced compared to when at least one of the first hole 8 and the second hole 9 is located in the side wall portion w2. Furthermore, with this configuration, it becomes easier to attach to the lid 6 a member that allows the refrigerant to flow into the lid 6 and / or a member that allows the refrigerant to flow out of the lid 6.

[0046] 5 to 7 , both the first hole 8 and the second hole 9 may be located opposite the surface on which the first electronic component 2 is located (i.e., the bottom surface s1), and the first electronic component 2 may be located between the first hole 8 and the second hole 9 in plan view. In other words, both the first hole 8 and the second hole 9 may be located in the upper wall portion w3, and the first electronic component 2 may be located between the first hole 8 and the second hole 9 in plan view. With this configuration, it is possible to reduce the possibility that the coolant will remain around the first electronic component 2, and the first electronic component 2 can be cooled more efficiently.

[0047] As shown in FIGS. 8 and 10 , the box 3 may have a protrusion 15 extending from the first hole 8 toward the second hole 9 at least at a position facing the first electronic component 2. The box 3 may have one or more protrusions 15. The protrusions 15 can control the flow of the refrigerant and improve the cooling efficiency of the first electronic component 2. The protrusions 15 may be located on the inner surface of the top wall portion w3 and / or the side wall portion w2, for example. The "inner surface" refers to the surface of the wall on which the first electronic component 2 is located. The protrusions 15 may be spaced from the first hole 8 and the second hole 9. The protrusions 15 may be spaced from the first electronic component 2.

[0048] As shown in FIGS. 13 to 16 , an electronic device 1 may include a first electronic component 2, a wiring board 5 on which the first electronic component 2 is mounted, a lid 6 positioned on the wiring board 5 and covering the first electronic component 2, and a first conductor 7 electrically connected to the first electronic component 2. In this embodiment, the first conductor 7 penetrates the wiring board 5. The lid 6 has a first hole 8 through which a coolant can flow in and a second hole 9 through which the coolant can flow out. At least one of the first hole 8 and the second hole 9 is spaced from the wiring board 5. The electronic device 1 configured as described above can directly cool the first electronic component 2, thereby achieving high cooling efficiency for the first electronic component 2. Furthermore, the electronic device 1 can be made smaller and lighter than cooling methods requiring a heat sink or the like. Furthermore, because a coolant flow path can be formed by covering the wiring board 5 with the lid 6, it is easy to form a coolant flow path only in areas of the wiring board 5 that require cooling. Furthermore, by leaving a gap between at least one of the first hole 8 and the second hole 9 and the wiring board 5, the bonding area between the lid 6 and the wiring board 5 increases, and therefore the lid 6 can be firmly bonded to the wiring board 5. Note that both the first hole 8 and the second hole 9 may be spaced from the wiring board 5.

[0049] 13 to 16, an electronic device 1 having a wiring board 5 and a lid 6 may further include a second electronic component 13 mounted on the wiring board 5, and the lid 6 may be spaced apart from the second electronic component 13 in a plan view. In other words, the lid 6 that covers the first electronic component 2 does not have to cover the second electronic component 13. With this configuration, cooling with a refrigerant can be performed only on the first electronic component 2 that requires cooling, and the amount of refrigerant can be reduced compared to when the lid 6 also covers the second electronic component 13. The electronic device 1 may also have a second conductor 14 that is electrically connected to the second electronic component 13.

[0050] 13 and other figures, the first hole 8 and the second hole 9 may be located in opposing side wall portions w2 of the side wall portion w2 of the lid 6. The side wall portions w2 are a wall portion located on the positive side in the X direction, a wall portion located on the negative side in the X direction, a wall portion located on the positive side in the Y direction, and a wall portion located on the negative side in the Y direction. With this configuration, the refrigerant can flow in and out more efficiently.

[0051] 15 and other figures, at least one of the first hole 8 and the second hole 9 may be located in an upper wall portion w3 of the lid 6. The upper wall portion w3 is a wall portion located on the positive side (upper side) in the Z direction.

[0052] The first hole 8 and the second hole 9 may be located in wall portions that do not face each other among the wall portions of the lid 6. For example, one of the first hole 8 and the second hole 9 may be located in one of the side wall portions w2 of the lid 6, and the other of the first hole 8 and the second hole 9 may be located in the upper wall portion w3 of the lid 6. As another example, the wall portions that do not face each other may be a certain side wall portion w2 and a different side wall portion w2 connected thereto.

[0053] 15 and other figures, both the first hole 8 and the second hole 9 may be located in the upper wall portion w3 of the lid 6. With this configuration, the height of the lid 6 can be reduced compared to when at least one of the first hole 8 and the second hole 9 is located in the side wall portion w2. Furthermore, with this configuration, it becomes easier to attach to the lid 6 a member that allows the refrigerant to flow into the lid 6 and / or a member that allows the refrigerant to flow out of the lid 6.

[0054] 15 and 16 , both the first hole 8 and the second hole 9 may be located opposite the surface on which the first electronic component 2 is located (i.e., the bottom surface s1), and the first electronic component 2 may be located between the first hole 8 and the second hole 9 in plan view. In other words, both the first hole 8 and the second hole 9 may be located in the upper wall portion w3, and the first electronic component 2 may be located between the first hole 8 and the second hole 9 in plan view. With this configuration, it is possible to reduce the possibility that the coolant will remain around the first electronic component 2, and the first electronic component 2 can be cooled more efficiently.

[0055] As shown in FIGS. 15 to 17 , the lid 6 may have a protrusion 15 extending from the first hole 8 toward the second hole 9 at least at a position facing the first electronic component 2. The lid 6 may have one or more protrusions 15. The protrusions 15 can control the flow of the refrigerant and can improve the cooling efficiency of the first electronic component 2. The protrusions 15 may be located on the inner surface of the upper wall w3 and / or the side wall w2, for example. The protrusions 15 may be spaced from the first hole 8 and the second hole 9. The protrusions 15 may be spaced from the first electronic component 2.

[0056] The first electronic component 2 is not particularly limited, but may be, for example, a passive component or a semiconductor device. The semiconductor device may be a power semiconductor. The power semiconductor may be, for example, a SiC power semiconductor or a GaN power semiconductor. The first electronic component 2 mounted on the electronic device 1 of the present disclosure can be cooled efficiently, so it may generate a relatively large amount of heat.

[0057] Specific examples of the first electronic component 2 include the following electronic components. Flip-chip bonded and underfilled devices Flip-chip bonded, non-underfilled devices Stacked elements such as HBM (High Bandwidth Memory) Resin-sealed packages such as BGA (Ball Grid Array) and QFP (Quad Flat Package) Passive components such as capacitors -Bare elements connected by wire bonding and sealed with liquid resin etc.

[0058] The electronic device 1 may have one or more first electronic components 2. Furthermore, if the electronic device has a second electronic component 13, the electronic device 1 may have one or more second electronic components 13. The second electronic component 13 is not particularly limited and may be an electronic component similar to the first electronic component 2, or an electronic component that generates less heat than the first electronic component 2 and therefore requires less cooling.

[0059] 13, the first electronic component 2 may be located on a member that reinforces the electrical wiring, such as an interposer 16. Examples of the interposer 16 include a build-up substrate and a glass interposer.

[0060] The first conductor 7 and the second conductor 14 are not particularly limited and may include lead terminals, metal plates, or castellations, or may include pins or solder balls. The first conductor 7 and the second conductor 14 may include wiring conductors located on the surface or inner layer of the box 3 or the wiring board 5. The first conductor 7 and the second conductor 14 may be a combination of lead terminals, metal plates, castellations, pins, solder balls, and wiring conductors. The first conductor 7 and the second conductor 14 may be connected to external terminals. The external terminals may be located on the outer surfaces of the bottom wall portion w1 and / or the side wall portion w2, for example.

[0061] Furthermore, the box body 3, the container body 4, the wiring board 5 and the lid body 6 may have wiring conductors other than the wiring conductors that constitute the first conductors 7 and the second conductors 14.

[0062] In an embodiment of the electronic device 1 having a box body 3, the main component of the box body 3 may be, for example, ceramic, resin, or metal. When the box body 3 has a container body 4 and a lid body 6 and the first conductor 7 penetrates the container body 4, the main component of the container body 4 may be, for example, ceramic or resin, and the main component of the lid body 6 may be, for example, ceramic, resin, or metal. In an embodiment of the electronic device 1 having a wiring board 5 and a lid body 6, the main component of the wiring board 5 may be, for example, ceramic or resin, and the main component of the lid body 6 may be, for example, ceramic or metal. In this disclosure, the term "main component" refers to a component that accounts for 60% or more by mass. If the main component of each component is ceramic, the possibility of deterioration due to reaction with the refrigerant can be reduced. Examples of ceramics include aluminum oxide (alumina), aluminum nitride, and silicon nitride.

[0063] The container body 4 or the wiring board 5 may be sealed with the lid body 6. A bonding material may be used to bond the container body 4 or the wiring board 5 with the lid body 6. When both of the objects to be bonded are mainly composed of ceramic or metal, for example, a metal brazing material, a glass brazing material, a resin adhesive, or the like may be used as the bonding material. When either of the objects to be bonded is mainly composed of resin, for example, a resin adhesive, or the like may be used as the adhesive.

[0064] The coolant may be liquid or gas. If the coolant is a liquid such as oil, the first electronic component 2 can be cooled more efficiently. The coolant may be water, but if it is something other than water, the possibility of the first electronic component 2, the first conductor 7, etc. deteriorating or shorting out is reduced. Note that "water" in this disclosure refers to a liquid with a water molecule (H2O) content of 50 wt% or more; for example, an aqueous solution such as a coolant liquid with a water molecule (H2O) content of less than 50 wt% does not fall under the category of "water."

[0065] As shown in Figures 1, 13, etc., the electronic device 1 further includes a first cylindrical portion 10 that protrudes outward, and the first cylindrical portion 10 may have a first hole portion 8. In the case of an electronic device 1 that includes a box body 3, the box body 3 includes the first cylindrical portion 10. In this case, the box body 3 and the first cylindrical portion 10 may be integrated. In the case of an electronic device 1 that includes a wiring board 5 and a lid body 6, the lid body 6 includes the first cylindrical portion 10. In this case, the lid body 6 and the first cylindrical portion 10 may be integrated. Note that "outward" refers to the direction from the inner surface of each wall portion toward the outer surface.

[0066] As shown in Figures 1, 13, etc., the electronic device 1 further includes a second cylindrical portion 11 that protrudes outward, and the second cylindrical portion 11 may have a second hole portion 9. In the case of an electronic device 1 that includes a box body 3, the box body 3 includes the second cylindrical portion 11. In this case, the box body 3 and the second cylindrical portion 11 may be integrated. In the case of an electronic device 1 that includes a wiring board 5 and a lid body 6, the lid body 6 includes the second cylindrical portion 11. In this case, the lid body 6 and the second cylindrical portion 11 may be integrated.

[0067] As shown in Figures 5, 11, etc., the electronic device 1 may further include a flow path member 17 connected to at least one of the first hole portion 8 and the second hole portion 9. The flow path member 17 may have a flow path 18 for the coolant inside. The electronic device 1 illustrated in Figure 5, etc. has one flow path member 17 connected to both the first hole portion 8 and the second hole portion 9, and the flow path member 17 has separate flow paths 18 connecting to the first hole portion 8 and connecting to the second hole portion 9. The electronic device 1 illustrated in Figure 11, etc. has two flow path members 17, one of which has a flow path 18 connecting to the first hole portion 8, and the other flow path member 17 has a flow path connecting to the second hole portion 9.

[0068] The flow path member 17 may be joined to the box body 3, the container body 4, the wiring board 5, the lid body 6, etc. via packing.

[0069] [Electronic Module] 18 and 19 , an electronic module 20 of the present disclosure includes the electronic device 1 of the present disclosure. The electronic module 20 may include a refrigerant circulation device 23 connected to at least one of the first hole portion 8 and the second hole portion 9. The refrigerant circulation device 23 includes, for example, a radiator that cools the refrigerant, a pump that circulates the refrigerant through the electronic device 1, and the like. The arrows in FIGS. 18 and 19 indicate the flow of the refrigerant circulated by the refrigerant circulation device 23.

[0070] The electronic module 20 may have a first pipe portion 21 connected to the first hole portion 8 and a second pipe portion 22 connected to the second hole portion 9. The refrigerant circulation device 23 may be connected to the first hole portion 8 via the first pipe portion 21. The refrigerant circulation device 23 may be connected to the second hole portion 9 via the second pipe portion 22.

[0071] When the electronic module 20 has a flow path member 17, the coolant circulation device 23 may be connected to at least one of the first hole portion 8 and the second hole portion 9 via the flow path member 17.

[0072] The electronic module 20 may include one electronic device 1 as shown in Fig. 18, or multiple electronic devices 1 as shown in Fig. 19. When there are multiple electronic devices 1, the second pipe section 22 connected to the second hole section 9 of the upstream electronic device 1 may also serve as the first pipe section 21 connected to the first hole section 8 of the downstream electronic device 1, and the multiple electronic devices 1 may be connected to form one flow path.

[0073] In addition, the details shown in the above embodiments can be modified as appropriate without departing from the spirit of the present disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. Furthermore, combinations of the embodiments with each other are also possible. [Explanation of symbols]

[0074] 1. Electronic Devices 2. First Electronic Parts 3 box body 4 Container body 5. Wiring board 6 Lid 7 First Conductor 8 First hole 9 2nd hole 10 First cylinder part 11 Second cylinder part 13 Secondary Electronic Components 14 Second Conductor 15 Protrusion 16 Relay board 17 Flow path components 18 Flow path 20 Electronic Module 21 First Pipe Section 22 Second Pipe Section 23 Refrigerant circulation device s1 bottom w1 Lower wall w2 Side wall w3 Upper wall

Claims

1. a first electronic component; a box that accommodates the first electronic component; a first conductor that penetrates the box from the inside to the outside and is electrically connected to the first electronic component; The box body has a first hole portion through which the refrigerant can flow in and a second hole portion through which the refrigerant can flow out. Electronic devices.

2. the box body includes a container body in which the first electronic component is mounted and a lid body that covers the first electronic component, the first hole and the second hole are located in the lid; The electronic device of claim 1 .

3. The first hole and the second hole are located in opposing wall portions of the wall portion of the box body, The electronic device of claim 2 .

4. the first hole and the second hole are located in a wall portion of the box body different from a wall portion in which an outer exposed portion of the first conductor is located. The electronic device according to claim 3 .

5. At least one of the first hole and the second hole is located in a wall portion of the box body that is different from a wall portion in which an outer exposed portion of the first conductor is located. The electronic device of claim 1 .

6. At least one of the first hole and the second hole is located in an upper wall portion of the wall portion of the box body that is different from a wall portion on which the outer exposed portion of the first conductor is located. The electronic device according to claim 5 .

7. At least one of the first hole and the second hole is located in a side wall portion of the wall portion of the box body that is different from a wall portion on which the outer exposed portion of the first conductor is located. The electronic device according to claim 5 .

8. At least one of the first hole portion and the second hole portion is located above a surface on which the first electronic component is located. The electronic device of claim 1 .

9. The first hole and the second hole are located in wall portions of the box body that do not face each other. The electronic device of claim 2 .

10. one of the first hole and the second hole is located in one of the side walls of the box; the other of the first hole portion and the second hole portion is located in an upper wall portion of the box body. The electronic device of claim 1 .

11. a first electronic component; a wiring board on which the first electronic component is mounted; a lid body positioned on the wiring board and covering the first electronic component; a first conductor that penetrates the wiring board and is electrically connected to the first electronic component; The lid has a first hole through which the refrigerant can flow in and a second hole through which the refrigerant can flow out, At least one of the first hole portion and the second hole portion is spaced from the wiring substrate. Electronic devices.

12. a second electronic component mounted on the wiring board; In a plan view, the cover is spaced apart from the second electronic component. The electronic device of claim 11.

13. The lid body is mainly composed of ceramic or metal, The wiring board is mainly composed of ceramic or resin. The electronic device of claim 11.

14. the first hole and the second hole are located in an upper wall portion of the lid; 12. The electronic device according to claim 2 or claim 11.

15. the box body has a protrusion extending from the first hole toward the second hole at least at a position facing the first electronic component; The electronic device of claim 1 .

16. the lid body has a protrusion extending from the first hole toward the second hole at least at a position facing the first electronic component; The electronic device of claim 11.

17. The protrusion is spaced apart from the first electronic component.

17. The electronic device according to claim 15 or 16.

18. the first hole and the second hole are located opposite a surface on which the first electronic component is located, In a plan view, the first electronic component is located between the first hole and the second hole.

12. The electronic device according to claim 1 or claim 11.

19. the first conductor includes a lead terminal, a metal plate, or a castellation; 12. The electronic device according to claim 1 or claim 11.

20. the first electronic component is a passive component or a semiconductor device; 12. The electronic device according to claim 1 or claim 11.

21. Further provided with a first cylindrical portion protruding outward, The first cylindrical portion has the first hole portion.

12. The electronic device according to claim 1 or claim 11.

22. a flow path member connected to at least one of the first hole portion and the second hole portion; The flow path member has a flow path for the refrigerant therein.

12. The electronic device according to claim 1 or claim 11.

23. The electronic device according to claim 1 or claim 11; a refrigerant circulation device connected to at least one of the first hole portion and the second hole portion, Electronic module.

Images