Wiring circuit board

Abstract

To provide a wiring circuit board capable of suppressing damage to a first insulating layer caused by heat transmitted from terminals.SOLUTION: A wiring circuit board 1 comprises a metal layer 2, a first insulating layer 3, and circuit patterns 4. The circuit patterns 4 include a terminal 41A and a wiring 42A connected to the terminal 41A. The first insulating layer 3 comprises a main body portion 31 positioned between the wiring 42A and the metal layer 2, and a heat dissipation portion that contacts the terminal 41A and also contacts the metal layer 2. The thickness of the heat dissipation portion 32 (second thickness T2) is thinner than the thickness of the main body portion 31 (first thickness T1).SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a printed circuit board. [Background technology]

[0002] BACKGROUND ART Conventionally, a wired circuit board is known that includes a metal support layer, a circuit having a pad portion, and an insulating base layer disposed between the metal support layer and the pad portion (see, for example, Patent Document 1 below). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-212679 Summary of the Invention [Problem to be solved by the invention]

[0004] In a wired circuit board such as that described in Patent Document 1, when molten solder is placed on a pad portion, the heat of the solder is transferred to the base insulating layer via the pad portion, which may damage the base insulating layer.

[0005] If the damage to the base insulative layer increases excessively, the base insulative layer may become more susceptible to peeling off from the metal support layer.

[0006] The present invention provides a wired circuit board that can suppress damage to the first insulating layer caused by heat transferred from the terminals to the first insulating layer. [Means for solving the problem]

[0007] The present invention [1] includes a wired circuit board comprising: a circuit pattern having a metal layer, terminals, and wiring connected to the terminals; and a first insulating layer disposed between the metal layer and the circuit pattern in the thickness direction of the metal layer, the first insulating layer having a main body portion disposed between the wiring and the metal layer, the main body portion having a first thickness; and a heat dissipation portion having a second thickness thinner than the first thickness, in contact with the terminals and in contact with the metal layer.

[0008] According to this configuration, the heat dissipation portion that contacts the terminal and the metal layer is thinner than the main body portion that is disposed between the wiring and the metal layer.

[0009] Therefore, when molten solder is placed on the terminals, the heat transferred to the heat dissipation portion via the terminals can be smoothly dissipated to the metal layer.

[0010] As a result, damage to the first insulating layer caused by heat transferred from the terminal to the first insulating layer can be suppressed.

[0011] The present invention [2] includes the wired circuit board of the above [1], wherein the circuit pattern has a plurality of the terminals, and the heat dissipation portion is in contact with the plurality of the terminals.

[0012] With this configuration, the heat from the multiple terminals is concentrated on the heat dissipation portion.

[0013] In this regard, since the thickness of the heat dissipation portion is thinner than the thickness of the main body portion, even if heat from multiple terminals is concentrated on the heat dissipation portion, the heat transferred to the heat dissipation portion can be smoothly dissipated to the metal layer.

[0014] As a result, even if heat from multiple terminals is concentrated on the heat dissipation portion, damage to the first insulating layer can be suppressed.

[0015] The present invention [3] includes the wired circuit board according to the above [1], in which the heat dissipation portion is in contact with one of the terminals.

[0016] With this configuration, it is possible to prevent the heat from the multiple terminals from concentrating on the heat dissipation portion.

[0017] Therefore, damage to the first insulating layer can be further suppressed.

[0018] The present invention [4] includes the wired circuit board of any one of the above [1] to [3], wherein the heat dissipation portion is in contact with all of the terminals.

[0019] The present invention [5] includes the wired circuit board according to any one of the above [1] to [3], wherein the heat dissipation portion is in contact with a part of the terminal.

[0020] The present invention [6] includes the wired circuit board according to the above [5], wherein the part of the terminal is a peripheral part of the terminal.

[0021] The present invention [7] includes the wired circuit board according to the above [5], wherein the part of the terminal is a central part of the terminal.

[0022] The present invention [8] includes the wired circuit board of any one of [1] to [7] above, wherein the wired circuit board further comprises a second insulating layer disposed on the first insulating layer and covering the wiring, and the terminal protrudes beyond the second insulating layer toward the opposite side of the metal layer from the first insulating layer.

[0023] With this configuration, the thickness of the terminal can be ensured.

[0024] Therefore, when the solder melts on the terminal, the heat of the solder can be prevented from being transferred to the second insulating layer.

[0025] The present invention [9] includes the wired circuit board of any one of the above [1] to [7], wherein the terminal has a first conductor layer disposed on the first insulating layer and a second conductor layer disposed on the first conductor layer.

[0026] According to this configuration, the terminal can be formed thick from the first conductor layer and the second conductor layer.

[0027] As a result, when the solder melts on the terminal, the heat of the solder can be prevented from being transferred to the second insulating layer. [Effects of the Invention]

[0028] According to the wired circuit board of the present invention, damage to the first insulating layer due to heat transferred from the terminals to the first insulating layer can be suppressed. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a plan view of a printed circuit board according to one embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view of the printed circuit board shown in FIG. 1 taken along the line AA. [Figure 3] Figures 3A to 3D show the manufacturing process for the wired circuit board shown in Figure 2, where Figure 3A shows the first insulating layer forming process, Figure 3B shows the first conductor layer forming process, Figure 3C shows the second conductor layer forming process, and Figure 3D shows the second insulating layer forming process. [Figure 4] FIG. 4 is a cross-sectional view of the printed circuit board of the modified example (1). [Figure 5] FIG. 5 is a cross-sectional view of the printed circuit board of the modified example (2). [Figure 6] 6A to 6C show a wired circuit board of modified example (3), where FIG. 6A shows a plan view of the wired circuit board of modified example (3), FIG. 6B shows a BB cross-sectional view of the wired circuit board shown in FIG. 6A, and FIG. 6C shows a CC cross-sectional view of the wired circuit board shown in FIG. 6A. [Figure 7] 7A to 7C show a wired circuit board of modified example (4), where FIG. 7A shows a plan view of the wired circuit board of modified example (4), FIG. 7B shows a DD cross-sectional view of the wired circuit board shown in FIG. 7A, and FIG. 7C shows an EE cross-sectional view of the wired circuit board shown in FIG. 7A. [Figure 8] 8A to 8C show a wired circuit board of modified example (5), where FIG. 8A shows a plan view of the wired circuit board of modified example (5), FIG. 8B shows an FF cross-sectional view of the wired circuit board shown in FIG. 8A, and FIG. 8C shows a GG cross-sectional view of the wired circuit board shown in FIG. 8A. [Figure 9]9A to 9C show a wired circuit board of modified example (6), where FIG. 9A shows a plan view of the wired circuit board of modified example (6), FIG. 9B shows an HH cross-sectional view of the wired circuit board shown in FIG. 9A, and FIG. 9C shows a II cross-sectional view of the wired circuit board shown in FIG. 9A. DETAILED DESCRIPTION OF THE INVENTION

[0030] 1. Wiring circuit board As shown in Figure 1, the wired circuit board 1 extends in a first direction and a second direction. The second direction is perpendicular to the first direction. The shape of the wired circuit board 1 is not limited. The wired circuit board 1 may be a flexible wired circuit board or a circuit-equipped suspension board.

[0031] As shown in FIG. 2, the wired circuit board 1 includes a metal layer 2, a first insulating layer 3, a circuit pattern 4, and a second insulating layer 5.

[0032] (1) Metal layer The metal layer 2 supports the first insulating layer 3, the circuit pattern 4, and the second insulating layer 5. Examples of materials for the metal layer 2 include stainless steel and copper alloys. The metal layer 2 may have multiple layers made of different metals.

[0033] (2) First insulating layer The first insulating layer 3 is disposed on one side of the metal layer 2 in the thickness direction of the metal layer 2. The thickness direction is perpendicular to the first and second directions. The first insulating layer 3 is disposed on one surface of the metal layer 2 in the thickness direction. The first insulating layer 3 is disposed between the metal layer 2 and the circuit pattern 4 in the thickness direction. The first insulating layer 3 can insulate the metal layer 2 from the circuit pattern 4. The first insulating layer 3 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester. The first insulating layer 3 has a main body portion 31 and a heat dissipation portion 32.

[0034] The main body 31 is disposed between the wiring 42A of the circuit pattern 4 and the metal layer 2 in the thickness direction. The wiring 42A will be described later. The main body 31 can insulate the metal layer 2 from the wiring 42A. The main body 31 has a first thickness T1. The first thickness T1 is, for example, 5 μm to 30 μm.

[0035] The heat dissipation portion 32 is disposed between at least a portion of the terminal 41A of the circuit pattern 4 and the metal layer 2 in the thickness direction. The terminal 41A will be described later. In this embodiment, the heat dissipation portion 32 is disposed between the entire terminal 41A and the metal layer 2 in the thickness direction. The heat dissipation portion 32 can insulate the metal layer 2 from the terminal 41A, and can smoothly dissipate heat transferred to the heat dissipation portion 32 via the terminal 41A to the metal layer 2 when solder melts on the terminal 41A. The heat dissipation portion 32 has a second thickness T2. The second thickness T2 is thinner than the first thickness T1. The second thickness T2 is, for example, 1 μm to 25 μm. The heat dissipation portion 32 is in contact with the entire terminal 41A and with the metal layer 2. More specifically, as shown in FIG. 1 , the heat dissipation portion 32 extends in a first direction and a second direction. The heat dissipation portion 32 contacts the entire terminal 41A in the first direction, and contacts the entire terminal 41A in the second direction.

[0036] Furthermore, heat dissipation portion 32 is in contact with multiple terminals 41A, 41B. Therefore, heat from terminals 41A, 41B is concentrated on heat dissipation portion 32. In this regard, because the thickness (second thickness T2) of heat dissipation portion 32 is thinner than the thickness (first thickness T1) of main body portion 31, even if heat from terminals 41A, 41B is concentrated on heat dissipation portion 32, the heat transferred to heat dissipation portion 32 can be smoothly dissipated to metal layer 2.

[0037] (3) Circuit pattern 2, the circuit pattern 4 is disposed on one side of the first insulating layer 3 in the thickness direction. The circuit pattern 4 is disposed on one surface of the first insulating layer 3 in the thickness direction. The circuit pattern 4 is disposed on the opposite side of the metal layer 2 with respect to the first insulating layer 3 in the thickness direction.

[0038] As shown in FIG. 1, the circuit pattern 4 has a plurality of terminals 41A, 41B and a plurality of wirings 42A, 42B.

[0039] At least a portion of the terminal 41A is disposed on the heat dissipation portion 32 of the first insulating layer 3. In this embodiment, the entire terminal 41A is disposed on the heat dissipation portion 32. As shown in FIG. 2 , the terminal 41A has a first conductor layer 411 and a second conductor layer 412.

[0040] The first conductor layer 411 is disposed on the first insulating layer 3 in the thickness direction. As shown in FIG. 1, the first conductor layer 411 extends in the first and second directions. The first conductor layer 411 has a square land shape. The first conductor layer 411 is made of a metal. Examples of metals include copper, silver, gold, iron, aluminum, chromium, and alloys thereof. From the viewpoint of obtaining good electrical properties, the first conductor layer 411 is preferably made of copper.

[0041] As shown in FIG. 2, the second conductor layer 412 is disposed on the first conductor layer 411 in the thickness direction. The second conductor layer 412 protrudes from the second insulating layer 5 in the thickness direction toward the opposite side of the metal layer 2 with respect to the first insulating layer 3 (i.e., one side in the thickness direction). In other words, the terminal 41A protrudes from the second insulating layer 5 in the thickness direction toward the opposite side of the metal layer 2 with respect to the first insulating layer 3. This ensures the thickness of the terminal 41A, and when solder melts on the terminal 41A, it is possible to prevent the heat of the solder from being transferred to the second insulating layer 5. In the thickness direction, one surface S1 of the terminal 41A is disposed on one side of one surface S2 of the second insulating layer 5. As shown in FIG. 1, the second conductor layer 412 extends in the first and second directions. The second conductor layer 412 has a substantially rectangular shape. The second conductor layer 412 is made of the same metal as the first conductor layer 411.

[0042] Terminal 41B is aligned with terminal 41A in the first direction. Terminal 41B is disposed apart from terminal 41A in the first direction. At least a portion of terminal 41A is disposed on heat dissipation portion 32 of first insulating layer 3. In this embodiment, the entirety of terminal 41A is disposed on heat dissipation portion 32. Like terminal 41A, terminal 41B has a first conductor layer 411 and a second conductor layer 412.

[0043] The width W (dimension in the first direction) of each of the terminals 41A and 41B is in the range of, for example, 10 μm to 1000 μm, or preferably 50 μm to 900 μm.

[0044] The distance D between the terminal 41A and the terminal 41B in the first direction is in the range of, for example, 10 μm to 500 μm, or preferably 20 μm to 400 μm.

[0045] The wiring 42A is disposed on the main body portion 31 (see FIG. 2) of the first insulating layer 3. The wiring 42A extends in the second direction. One end of the wiring 42A in the second direction is connected to the terminal 41A. One end of the wiring 42A in the second direction may be disposed on the heat dissipation portion 32 of the first insulating layer 3 together with the terminal 41A. More specifically, the wiring 42A is connected to the first conductor layer 411 of the terminal 41A. The wiring 42A is made of the same metal as the first conductor layer 411 of the terminal 41A. The wiring 42A may be bent in the first direction.

[0046] The wiring 42B is aligned with the wiring 42A in the first direction. The wiring 42B is disposed apart from the wiring 42A in the first direction. The description of the wiring 42B is the same as the description of the wiring 42A, and will therefore be omitted.

[0047] (4) Second insulating layer The second insulating layer 5 is disposed on one side of the first insulating layer 3 in the thickness direction. The second insulating layer 5 is disposed on one surface of the first insulating layer 3 in the thickness direction. The second insulating layer 5 covers the wiring 42A, 42B. The second insulating layer 5 does not cover the terminals 41A, 41B. The second insulating layer 5 is made of a resin. Examples of resins include polyimide, maleimide, epoxy resin, polybenzoxazole, and polyester.

[0048] 2. Manufacturing method of wiring board Next, a method for manufacturing the wired circuit board 1 will be described.

[0049] The method for manufacturing the wired circuit board 1 includes a first insulating layer forming step (see FIG. 3A), a first conductor layer forming step (see FIG. 3B), a second conductor layer forming step (see FIG. 3C), and a second insulating layer forming step (see FIG. 3D).

[0050] (1) First insulating layer formation process 3A, in the first insulating layer forming step, a first insulating layer 3 is formed on a metal layer 2. In the first insulating layer forming step, a main body portion 31 and a heat dissipation portion 32 are formed in the first insulating layer 3 by gradational exposure.

[0051] More specifically, first, a photosensitive resin solution (varnish) is applied onto the metal layer 2 and dried to form a coating film of the photosensitive resin.

[0052] Next, the photosensitive resin coating is subjected to gradational exposure using a photomask having a light-shielding portion, a fully transparent portion, and a semi-transparent portion. The light-shielding portion faces the portion of the photosensitive resin coating where the first insulating layer 3 will not be formed. The fully transparent portion faces the portion of the photosensitive resin coating where the main body portion 31 will be formed. The semi-transparent portion faces the portion of the photosensitive resin coating where the heat dissipation portion 32 will be formed.

[0053] Next, the exposed coating is developed. The portion of the coating facing the semi-transparent portion is developed thinner than the portion facing the fully transparent portion. As a result, the first insulating layer 3 is formed on the metal layer 2 in the above-mentioned pattern.

[0054] (2) First conductor layer formation process Next, as shown in FIG. 3B, in the first conductor layer forming step, first conductor layers 411 of terminals 41A and 41B and wirings 42A and 42B are formed on first insulating layer 3.

[0055] More specifically, in the first conductor layer forming step, a seed layer is first formed in the thickness direction on one surface of the first insulating layer 3 and one surface of the metal layer 2. The seed layer is formed by, for example, sputtering. Examples of materials for the seed layer include chromium, copper, nickel, titanium, and alloys thereof.

[0056] Next, a plating resist is attached to one surface in the thickness direction of the metal layer 2. The plating resist covers the first insulating layer 3.

[0057] Next, the plating resist is exposed and developed. This removes the plating resist from the portions where the first conductor layer 411 and the wirings 42A and 42B are to be formed, exposing the seed layer in the portions where the first conductor layer 411 and the wirings 42A and 42B are to be formed. On the other hand, the plating resist remains in the portions where the first conductor layer 411 and the wirings 42A and 42B are not to be formed.

[0058] Next, the first conductor layer 411 and the wirings 42A and 42B are formed on the exposed seed layer by electrolytic plating. After the electrolytic plating is completed, the plating resist is peeled off.

[0059] (3) Second conductor layer formation process Next, as shown in FIG. 3C, in the second conductor layer forming step, second conductor layers 412 of terminals 41A and 41B are formed on first conductor layer 411.

[0060] More specifically, in the second conductor layer forming step, a plating resist is attached to one surface in the thickness direction of the metal layer 2. The plating resist covers the first insulating layer 3, the first conductor layer 411, and the wirings 42A and 42B.

[0061] Next, the plating resist is exposed to light and developed, whereby the plating resist is removed from the area where the second conductor layer 412 is to be formed, exposing the first conductor layer 411 in the area where the second conductor layer 412 is to be formed. On the other hand, the plating resist remains in the area where the second conductor layer 412 is not to be formed.

[0062] Next, second conductor layer 412 is formed by electrolytic plating on exposed first conductor layer 411. After electrolytic plating is completed, the plating resist is peeled off.

[0063] Thereafter, the seed layer exposed by stripping the plating resist is removed by etching.

[0064] (4) Second insulating layer formation process Next, as shown in FIG. 3D, in the second insulating layer forming step, a second insulating layer 5 is formed on the first insulating layer 3.

[0065] More specifically, in the second insulating layer formation process, a photosensitive resin solution (varnish) is first applied onto the circuit pattern 4, the first insulating layer 3, and the metal layer 2, and then dried to form a photosensitive resin coating.

[0066] Next, the photosensitive resin coating is exposed to light and developed, thereby forming the second insulating layer 5 on the first insulating layer 3 in the above-mentioned pattern.

[0067] 3. Effects (1) According to the wired circuit board 1, as shown in FIG. 2, the heat dissipation portion 32, which is in contact with the terminal 41A and the metal layer 2, is thinner than the main body portion 31, which is disposed between the wiring 42A and the metal layer 2.

[0068] Therefore, when molten solder is placed on terminal 41A, the heat transferred to heat dissipation portion 32 via terminal 41A can be dissipated to metal layer 2 smoothly.

[0069] As a result, damage to the first insulating layer 3 due to heat transferred from the terminal 41A to the first insulating layer 3 can be suppressed.

[0070] (2) According to the wired circuit board 1, the circuit pattern 4 has a plurality of terminals 41A and 41B as shown in Fig. 1. The heat dissipation portion 32 is in contact with the plurality of terminals 41A and 41B.

[0071] Therefore, the heat from the plurality of terminals 41A and 41B is concentrated on the heat dissipation portion 32.

[0072] In this regard, as shown in Figure 2, the thickness of the heat dissipation portion 32 (second thickness T2) is thinner than the thickness of the main body portion 31 (first thickness T1), so even if the heat from multiple terminals 41A, 41B is concentrated on the heat dissipation portion 32, the heat transferred to the heat dissipation portion 32 can be smoothly dissipated to the metal layer 2.

[0073] As a result, even if heat from the plurality of terminals 41A, 41B is concentrated on the heat dissipation portion 32, damage to the first insulating layer 3 can be suppressed.

[0074] (3) According to the wired circuit board 1, the terminal 41A protrudes beyond the second insulating layer 5 toward the opposite side of the metal layer 2 with respect to the first insulating layer 3, as shown in FIG.

[0075] Therefore, the thickness of the terminal 41A can be ensured.

[0076] As a result, when the solder melts on the terminal 41A, the heat of the solder is prevented from being transferred to the second insulating layer 5.

[0077] (4) According to the wired circuit board 1, as shown in FIG. 2, the terminal 41A has a first conductor layer 411 and a second conductor layer 412.

[0078] Therefore, the terminal 41A can be formed thick from the first conductor layer 411 and the second conductor layer 412.

[0079] As a result, when the solder melts on the terminal 41A, the heat of the solder is prevented from being transferred to the second insulating layer 5.

[0080] 4. Variations In the modified example, the same components as those in the above-described embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

[0081] (1) As shown in Fig. 4, the terminal 41A does not necessarily have to have the second conductor layer 412. The terminal 41A may be composed of the first conductor layer 411.

[0082] (2) As shown in FIG. 5 , the second insulating layer 5 may cover a peripheral edge E of the first conductor layer 411 of the terminal 41A. The peripheral edge E is one end of the first conductor layer 411 in the first direction, the other end of the first conductor layer 411 in the first direction, one end of the first conductor layer 411 in the second direction, and the other end of the first conductor layer 411 in the second direction. In other words, the second insulating layer 5 may cover one end of the first conductor layer 411 in the first direction, the other end of the first conductor layer 411 in the first direction, one end of the first conductor layer 411 in the second direction, and the other end of the first conductor layer 411 in the second direction. The second insulating layer 5 does not cover the second conductor layer 412 of the terminal 41A.

[0083] (3) As shown in Figures 6A to 6C, the heat dissipation portion 32 may be in contact with one terminal 41A. The heat dissipation portion 32 may be in contact with the entirety of one terminal 41A.

[0084] In this case, the concentration of heat from the multiple terminals on the heat dissipation portion 32 can be suppressed.

[0085] Therefore, damage to the first insulating layer 3 can be further suppressed.

[0086] (4) Heat dissipation portion 32 may be in contact with a portion of terminal 41A. As shown in Figures 7A to 7C, the portion of terminal 41A may be portion 410 (e.g., one half) of terminal 41A in the second direction. In this modification, heat dissipation portion 32 does not contact the other half of terminal 41A in the second direction.

[0087] In the first and second directions, when the area of ​​the terminal 41A is taken as 100%, the area of ​​the portion of the terminal 41A is, for example, 50% or more, preferably 75% or more.

[0088] (5) As shown in Figures 8A to 8C, a portion of terminal 41A may be peripheral edge portion E of terminal 41A. In other words, heat dissipation portion 32 may be in contact with one end of first conductor layer 411 in the first direction, the other end of first conductor layer 411 in the first direction, one end of first conductor layer 411 in the second direction, and the other end of first conductor layer 411 in the second direction. In this modification, heat dissipation portion 32 does not contact the center of first conductor layer 411 in the first direction and the center of first conductor layer 411 in the second direction.

[0089] (6) As shown in FIGS. 9A to 9C , a portion of terminal 41A may be a central portion C of terminal 41A. Central portion C is the central portion of first conductor layer 411 in the first direction and the central portion of first conductor layer 411 in the second direction. In other words, heat dissipation portion 32 may be in contact with the central portion of first conductor layer 411 in the first direction and the central portion of first conductor layer 411 in the second direction. In this modification, heat dissipation portion 32 is not in contact with one end of first conductor layer 411 in the first direction, the other end of first conductor layer 411 in the first direction, one end of first conductor layer 411 in the second direction, and the other end of first conductor layer 411 in the second direction.

[0090] (7) In the modified examples (1) to (6), the same effects as those of the above-described embodiment can be obtained.

[0091] (8) The above-described embodiment and modifications (1) to (6) can be combined. [Explanation of symbols]

[0092] 1 Wiring circuit board 2 metal layer 3 First insulating layer 4 Circuit Pattern 5 Second insulating layer 31 Main body 32 Heat radiation part 41A terminal 41B terminal 42A wiring 42B wiring 410 part 411 First conductor layer 412 Second conductor layer C central part E Periphery

Claims

1. a metal layer; a circuit pattern having terminals and wiring connected to the terminals; a first insulating layer disposed between the metal layer and the circuit pattern in a thickness direction of the metal layer; Equipped with The first insulating layer is a main body portion disposed between the wiring and the metal layer, the main body portion having a first thickness; a heat dissipation portion having a second thickness thinner than the first thickness, in contact with the terminal and in contact with the metal layer; A wired circuit board having:

2. the circuit pattern has a plurality of the terminals, The printed circuit board according to claim 1 , wherein the heat dissipation portion is in contact with a plurality of the terminals.

3. The printed circuit board according to claim 1 , wherein the heat dissipation portion is in contact with one of the terminals.

4. The printed circuit board according to claim 1 , wherein the heat dissipation portion is in contact with all of the terminals.

5. The printed circuit board according to claim 1 , wherein the heat dissipation portion is in contact with a part of the terminal.

6. The printed circuit board according to claim 5 , wherein the portion of the terminal is a peripheral edge portion of the terminal.

7. The printed circuit board according to claim 5 , wherein the portion of the terminal is a central portion of the terminal.

8. The printed circuit board is a second insulating layer disposed on the first insulating layer and covering the wiring; 8. The wired circuit board according to claim 1, wherein the terminals protrude beyond the second insulating layer toward an opposite side of the metal layer with respect to the first insulating layer.

9. The terminal is a first conductor layer disposed on the first insulating layer; a second conductor layer disposed on the first conductor layer; The wired circuit board according to any one of claims 1 to 7, comprising:

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