Resin sealing method, resin sealing product and resin sealing device

Abstract

To provide a technique related to resin sealing which simplifies a process and is excellent in positioning accuracy.SOLUTION: A resin sealing method includes: preparing a first mold 34, a second mold 35, and a film 500 arranged between the first mold 34 and the second mold 35 (step S1); arranging a substrate 200 on the first mold 34 so that a tip 330 of a terminal 300 erected on the surface of a substrate 200 faces the film 500 (step S2); closing the molds 34 and 35, and storing a tip 330 in an internal space 39 of the second mold 35 through a through hole 510 of the film 500 (step S4); further closing the molds 34 and 35, and closing the through hole 510 by an intermediate part 320 of the terminal 300 larger than the tip 330, in a width direction X of the terminal (step S5); and filling between the first mold 34 and the film 500 with a resin 400 and resin-sealing a base end 310 to the substrate 200 (step S6).SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a resin sealing method, a resin sealed product, and a resin sealing apparatus. [Background technology]

[0002] Resin-sealed products have a draft angle for mold release. Press-fit terminals, which have a spring-like tip pressed into a through-hole to provide an electrical and mechanical connection, have a tip that is elastically deformable and larger than the base. The terminal has an undercut shape, which is a slope opposite to the draft angle, making it difficult to resin-seal the terminal on the board. Therefore, when fixing a press-fit terminal to a board, a cylindrical sleeve (pin holder) is first mounted on the board, and then the base end is inserted into the sleeve, as disclosed in Patent Document 1, for example. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 035931 Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention has been made in view of the above-mentioned problems, and has an object to provide a technique relating to resin sealing that can simplify the process and has excellent positional accuracy. [Means for solving the problem]

[0005] A resin sealing method according to one aspect of the present invention includes preparing a first mold, a second mold opposing the first mold, and a film disposed between the first mold and the second mold; The method includes placing the substrate in the first mold so that the tip of a terminal erected on the surface of the substrate faces the film; closing the mold and accommodating the tip in the internal space of the second mold through the through hole of the film; further closing the mold and blocking the through hole with an intermediate portion of the terminal that is larger than the tip in a width direction of the terminal that is perpendicular to the longitudinal direction from the base end toward the tip; and filling resin between the first mold and the film to resin-seal the base end to the substrate.

[0006] A resin-sealed product according to one embodiment of the present invention comprises a substrate, a terminal having a base end, a tip end opposite the base end, and an intermediate portion provided between the base end and the tip end, and resin that seals at least the base end on the substrate, wherein in the width direction of the terminal, the base end is smaller than the tip end and the intermediate portion is larger than the tip end, the base end is embedded in the resin, and at least a portion of the intermediate portion protrudes and is exposed from the resin.

[0007] A resin sealing device according to one embodiment of the present invention is a device for resin sealing a substrate having terminals, and includes a first mold on which the substrate is placed, a second mold facing the first mold and having a storage section for storing the terminals, a film supply mechanism for supplying film between the first mold and the second mold, and a resin supply section for supplying resin between the first mold and the film, wherein the terminals have a base end supported by the substrate, a tip end opposite the base end, and an intermediate section provided between the base end and the tip end, and in the width direction of the terminal perpendicular to the longitudinal direction from the base end to the tip end, the base end is smaller than the tip end and the intermediate section is larger than the tip end, and when the second mold stores the tip end in the storage section through the through hole in the film, the through hole is blocked by the intermediate section, and the resin supply section fills resin between the first mold and the film to resin seal at least the base end on the substrate. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin sealing technique that can simplify the process and has excellent positional accuracy. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view showing an example of a resin sealing apparatus according to an embodiment of the present invention; [Figure 2] 1A and 1B are diagrams showing an example of a press-fit terminal according to an embodiment of the present invention, where FIG. 1A is a view from the plate thickness direction and FIG. 1B is a view from the width direction. [Figure 3] 1 is a cross-sectional view showing an example of a resin-sealed product according to an embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view showing a modified example of the resin-sealed product shown in FIG. [Figure 5] 1 is a flowchart illustrating an example of a resin sealing method according to an embodiment of the present invention. [Figure 6] 6 is a cross-sectional view illustrating steps S1 and S2 shown in FIG. 5. FIG. [Figure 7] 6 is a cross-sectional view illustrating steps S3 to S5 shown in FIG. 5. [Figure 8] 6 is a cross-sectional view illustrating steps S6 and S7 shown in FIG. 5. FIG.

[0010] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, components with the same reference numerals have the same or similar configurations. For the sake of clarity and understanding of the positional relationships between components, each drawing is conveniently illustrated with an orthogonal coordinate system consisting of an X-axis, a Y-axis, and a Z-axis. The horizontal plane including the X-axis and the Y-axis is referred to as the "XY plane," and the direction of the Z-axis arrow is referred to as the vertically upward direction, while the direction opposite to the Z-axis arrow is referred to as the vertically downward direction. When viewed from the front side of the resin sealing device 1, the X-axis direction is, for example, the left-right direction, and the Y-axis direction is, for example, the front-rear direction. The present invention will now be described in detail with reference to the drawings.

[0011] 1 is a plan view showing an example of a resin sealing apparatus 1 according to one embodiment of the present invention. In the example shown, the resin sealing apparatus 1 is configured as a transfer molding machine and includes an in-module 2, a press module 3, an out-module 4, a loader mechanism 10, etc. The resin sealing apparatus 1 is not limited to a transfer molding machine and may be a compression molding machine or other molding machine. The loader mechanism 10 includes a rail 11 extending across the in-module 2, the press module 3, and the out-module 4, a loader 12 and an unloader 13 that move along the rail 11, etc.

[0012] The in-module 2 includes a work supply device 21 that supplies a substrate 200 supporting terminals 300, a resin supply device 22 that supplies a resin material such as a resin tablet, etc. The press module 3 sandwiches the supplied work between dies 32 and applies pressure to seal with resin (molding). The resin sealing apparatus 1 may include a plurality of press modules 3. In the illustrated example, the resin sealing apparatus 1 includes two press modules 3.

[0013] Each press module 3 includes a press mechanism 31, a mold 32, a film loader 33, etc. The out-module 4 collects the resin-sealed product 100 from the unloader 13. The out-module 4 includes a degator 41, a storage magazine 42, etc. The degator 41 separates unnecessary resin from the resin-sealed product 100. The film loader 33 is an example of a film supply mechanism that supplies a film 500 between a first mold 34 and a second mold 35, which will be described later. The first mold 34 and the second mold 35 will be described in detail later with reference to Figures 6 to 8.

[0014] 2A and 2B are diagrams showing an example of a terminal 300 according to an embodiment of the present invention, where (a) is a view from the plate thickness direction T and (b) is a view from the width direction W. In the example shown, the terminal 300 is configured as a press-fit terminal. A press-fit terminal can be electrically and mechanically connected by press-fitting a tip portion 330 having spring elasticity into a through-hole.

[0015] One of the features of the resin sealing device 1 according to this embodiment is that it can resin seal even terminals 300 such as press-fit terminals (shown in FIG. 2) whose tip end 330 is larger than their base end 310. The terminal 300 has a base end 310, a tip end 330 opposite the base end 310, and an intermediate portion 320 provided between the base end 310 and the tip end 330.

[0016] The base end 310 includes the base end 310E of the terminal 300 and a nearby area. The tip end 330 includes the tip 330E of the terminal 300 and a nearby area. The direction from the base end 310 toward the tip end 330 is called the longitudinal direction L of the terminal 300. More specifically, the longitudinal direction L of the terminal 300 is the direction passing through the base end 310E and the tip end 330E.

[0017] The tip portion 330 has a press-fit portion 331 configured to be elastically deformed in the width direction W of the terminal 300 to establish electrical continuity with the through-hole. In the width direction W, the maximum width of the base end portion 310 is smaller than the maximum width of the tip portion 330, and the maximum width of the intermediate portion 320 is larger than the maximum width of the tip portion 330.

[0018] In the illustrated example, in the thickness direction T of the terminal 300, which is perpendicular to both the longitudinal direction L and the width direction W, the thickness T2 of the intermediate portion 320 is greater than the thickness T3 of the tip portion 330. The thickness T2 of the intermediate portion 320 is also greater than the thickness T1 of the base end portion 310. Note that the thicknesses T1 to T3 may all be uniform.

[0019] Fig. 3 is a cross-sectional view showing an example of a resin-sealed product 100 according to one embodiment of the present invention. As shown in Fig. 3, the resin-sealed product 100 includes a substrate 200, a terminal 300 having a base end 310, a tip end 330 opposite the base end 310, and an intermediate portion 320 provided between the base end 310 and the tip end 330, and resin 400 that fixes the terminal 300 to the substrate 200.

[0020] The base end 310 of the terminal 300 is resin-sealed on the substrate 200. The type of substrate 200 is not particularly limited, and various substrates can be selected, such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, or a wafer. The substrate 200 is formed in a flat plate shape and has a front surface 200A and a back surface 200B. The terminal 300 is provided upright on the front surface 200A of the substrate 200. In other words, the terminal 300 is provided on the substrate 200 so that the longitudinal direction L of the terminal 300 is approximately perpendicular to the front surface 200A.

[0021] One of the features of the resin-sealed product 100 is that the base end 310 is buried in the resin 400, and at least a part of the middle portion 320 is exposed and protrudes from the resin 400. More specifically, the inclined portion 321 of the middle portion 320 protrudes from the main surface 400A of the resin 400, and a fillet is formed between the inclined portion 321 and the main surface 400A.

[0022] Furthermore, by visually inspecting or using an image inspection device, etc., whether at least a portion of the middle portion 320 of the terminal 300 in the resin-sealed product 100 is protruding and exposed from the resin 400, it is possible to determine information such as whether the molding was carried out without any resin leakage, etc., thereby making quality control and other operations more efficient.

[0023] Fig. 4 is a cross-sectional view showing a modified example of the resin-sealed product 100 shown in Fig. 3. In the illustrated example, a spot facing is provided around the periphery of the terminal 300. Even in this modified example, at least a portion of the intermediate portion 320 protrudes and is exposed from the spot facing surface 410A. A fillet is formed between the inclined portion 321 and the spot facing surface 410A.

[0024] Fig. 5 is a flow chart illustrating an example of a resin sealing method according to an embodiment of the present invention. Figs. 6 to 8 are cross-sectional views illustrating steps S1 to S7 shown in Fig. 5. The mold 32 includes a first mold 34 and a second mold 35. In the illustrated example, the first mold 34, on which the substrate 200 is placed, is the lower mold, and the second mold 35, which faces the first mold 34, is the upper mold. It is also possible to configure the second mold 35 to be the lower mold and the first mold 34 to be the upper mold.

[0025] 1 is placed between first mold 34 and second mold 35. Through holes 510 may be formed in film 500 in advance, or through holes 510 may be formed in film 500 by rod-shaped protrusions 332 provided on tip end 330 of terminal 300. Protrusions 332 may also be called perforation sections 332 that punch through holes 510 in the film.

[0026] The second mold 35 defines an internal space 39 that accommodates the terminal 300 when the mold is closed. A cylindrical sleeve 36 is fitted into the internal space 39. The gap between the internal space 39 and the sleeve 36 functions as a suction port 38 that can suck in the film 500. The suction force of the suction port 38 allows the film 500 to be attached to the second mold 35. The resin supply unit 40 supplies resin 400 between the first mold 34 and the film 500. The resin supply unit 40 is, for example, a transfer mechanism, and includes a pot that heats and melts a resin tablet, a plunger that pushes the molten resin into the molds 34 and 35, and the like.

[0027] An ejector pin 37 is provided at the back of the internal space 39. The ejector pin 37 presses the tip 330E of the terminal 300 when the resin-sealed product 100 is released from the mold. The tip 330E is formed flat so that the pressing force of the ejector pin 37 does not easily escape.

[0028] 5 and 6, in step S1, a first mold 34, a second mold 35 opposing the first mold 34, and a film 500 placed between the first mold 34 and the second mold 35 are prepared. In step S2, the substrate 200 is placed in the first mold so that the base ends 310 of the terminals 300 are supported by the substrate 200 and the tip ends 330 of the terminals 300 face the film 500.

[0029] 7, in step S3, the dies 34, 35 are closed, and the protrusion 332 breaks through the film 500 to form the through-hole 510. Step S3 may be omitted by forming the through-hole 510 in the film 500 in advance. In step S4, the dies 34, 35 are further closed, and the tip 330 is accommodated in the internal space 39 of the second die 35 through the through-hole 510 in the film 500.

[0030] In step S5, the dies 34 and 35 are further closed, and the through-hole 510 is blocked by the middle portion 320 of the terminal 300, which is larger than the tip portion 330, in the width direction W of the terminal 300, which is perpendicular to the longitudinal direction L of the terminal 300 from the base end portion 310 toward the tip end portion 330. As shown in Fig. 8, in step S6, the resin supply unit 40 fills the gap between the first die 34 and the film 500 with resin 400, thereby resin-sealing the base end portion 310 to the substrate 200. As an optional step, step S7 may be further included in which the ejector pin 37 provided on the second die 35 presses the tip 330E of the flatly formed protrusion 332.

[0031] According to the resin sealing technology of the present invention configured as described above, the terminal 300 can be fixed without a sleeve, thereby reducing the number of parts. The post-process of attaching the terminal 300 to the sleeve can be omitted, thereby shortening the takt time. Since the terminal 300 can be fixed directly without a sleeve, excellent positional accuracy can be achieved. Therefore, it is possible to provide a resin sealing technology that simplifies the process and has excellent positional accuracy.

[0032] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other.

[0033] [Appendix 1] The resin sealing method includes preparing a first mold 34, a second mold 35 facing the first mold 34, and a film 500 placed between the first mold 34 and the second mold 35 (step S1); placing the substrate 200 in the first mold 34 so that the tip portions 330 of the terminals 300 erected on the surface of the substrate 200 face the film 500 (step S2); closing the molds 34 and 35, and inserting the film 500 into the internal space 39 of the second mold 35 through the through holes 510 of the film 500. The steps include accommodating the tip portion 330 (step S3), further closing the molds 34, 35 to block the through hole 510 with the middle portion 320 of the terminal 300, which is larger than the tip portion 330, in the width direction W of the terminal 300 perpendicular to the longitudinal direction L from the base end portion 310 to the tip portion 330 (step S6), and filling resin 400 between the first mold 34 and the film 500 to resin-seal the base end portion 310 to the substrate 200 (step S5).

[0034] According to Supplementary Note 1, the undercut-shaped terminal 300 can be fixed without a sleeve, reducing the number of parts. The post-process of attaching the terminal 300 to the sleeve can be omitted, shortening the takt time. The terminal 300 can be fixed directly without a sleeve, resulting in excellent positional accuracy.

[0035] [Appendix 2] In Supplementary Note 1, the intermediate portion 320 may be inclined so as to increase in width direction W of the terminal 300 from the tip portion 330 toward the base portion 310.

[0036] According to Supplementary Note 2, the terminal 300 is guided by the inclined middle portion 320 and aligned with the second mold 35. It is possible to provide a resin sealing device 1 with superior positional accuracy.

[0037] [Appendix 3] In Appendix 1 or 2, the tip portion 330 may have an elastically deformable press-fit portion 331 and a protrusion 332 protruding from the press-fit portion 331 toward the second mold 35, and the method may further include the protrusion 332 breaking through the film 500 to form a through hole 510 (step S3).

[0038] According to Supplementary Note 3, since the film 500 can be perforated by the mold closing operation, it is not necessary to prepare the through-holes 510 in the film 500 in advance.

[0039] [Appendix 4] In any one of Supplementary Notes 1 to 3, the tip 330E of the protrusion 332 may be formed flat, and the ejector pin 37 provided in the second mold 35 may press the tip 330E of the protrusion 332 (step S7).

[0040] According to Supplementary Note 4, since the tip 330E of the terminal 300 is flat, the pressing force of the ejector pin 37 is less likely to escape, and the resin-sealed product 100 can be more reliably released from the mold.

[0041] [Appendix 5] In any one of Supplementary Notes 1 to 4, the resin 400 may be a thermosetting resin.

[0042] Thermosetting resins have higher fluidity during molding than thermoplastic resins, and therefore are prone to leak even through small gaps. According to the present invention, the gaps can be blocked by intermediate portion 320 to prevent resin 400 from leaking from through-hole 510 of film 500, making it particularly suitable for resin sealing using thermosetting resins with high fluidity.

[0043] [Appendix 6] The resin-sealed product 100 comprises a substrate 200, a terminal 300 having a base end 310, a tip end 330 opposite the base end 310, and an intermediate portion 320 provided between the base end 310 and the tip end 330, and resin 400 that fixes the terminal 300 to the substrate 200, wherein in the width direction W of the terminal 300, the base end 310 is smaller than the tip end 330 and the intermediate portion 320 is larger than the tip end 330, the base end 310 is buried in the resin 400, and at least a portion of the intermediate portion 320 protrudes and is exposed from the resin 400.

[0044] [Appendix 7] The resin sealing apparatus 1 is an apparatus for resin-sealing a substrate 200 having a terminal 300, and includes a first mold 34 on which the substrate 200 is placed, a second mold 35 opposed to the first mold 34, a film supply mechanism for supplying a film 500 between the first mold 34 and the second mold 35, and a resin supply unit for supplying resin between the first mold 34 and the film 500. The terminal 300 has a base end 310 supported by the substrate 200, a tip end 330 opposite the base end 310, and an intermediate portion 32 provided between the base end 310 and the tip end 330. In a width direction W of the terminal 300 perpendicular to a longitudinal direction L from the base end 310 toward the tip end 330, the base end 310 is smaller than the tip end 330 and the intermediate portion 320 is larger than the tip end, and when the second mold 35 accommodates the tip end 330 in an internal space 39 of the second mold 35 through a through hole 510 in the film 500, the through hole 510 is closed by the intermediate portion 320, and the resin supply unit fills resin 400 between the first mold 34 and the film 500 to resin-seal at least the base end 310 on the substrate 200.

[0045] According to Supplementary Note 6 or 7, as with Supplementary Note 1, the undercut-shaped terminal can be fixed without a sleeve, thereby reducing the number of parts. The post-process of attaching the terminal 300 to the sleeve can be omitted, thereby shortening the takt time. The terminal 300 can be fixed directly without a sleeve, resulting in excellent positional accuracy. [Explanation of symbols]

[0046] 1...resin sealing device, 2...in-module, 3...multiple press modules, 4...out-module, 10...loader mechanism, 11...rail, 12...loader, 13...unloader, 21...work supply device, 22...resin supply device, 31...press mechanism, 32...mold, 33...film loader (an example of a film supply mechanism), 34...first mold, 35...second mold, 36...sleeve, 37...ejector pin, 38...air intake, 39...internal space, 40...resin supply section, 41...degater, 42...storage magazine, 1 00...resin-sealed product, 200...substrate, 200A...surface, 200B...back surface, 300...terminal, 310...base end, 310E...base end, 320...middle portion, 321...inclined portion, 322...retaining portion, 330...tip portion, 330E...tip, 331...press-fit portion, 332...protruding portion, 400...resin, 400A...main surface of resin, 410A...counterbore surface, 500...film, 510...through hole, L...longitudinal direction, T...plate thickness direction, T1 to T3...plate thickness, W...width direction, X...first axis direction, Y...second axis direction, Z...third axis direction.

Claims

1. Preparing a first mold, a second mold opposing the first mold, and a film disposed between the first mold and the second mold; placing the substrate in the first mold so that the tip portions of the terminals erected on the surface of the substrate face the film; closing the mold and accommodating the tip portion in the internal space of the second mold through the through hole of the film; Further closing the mold to close the through hole with an intermediate portion of the terminal that is larger than the tip end portion in a width direction of the terminal that is perpendicular to a longitudinal direction from the base end portion toward the tip end portion; and and filling a gap between the first mold and the film with resin to resin-seal the base end portion to the substrate. Resin sealing method.

2. The intermediate portion is inclined so as to increase in width direction of the terminal from the tip portion toward the base portion. The resin sealing method according to claim 1 .

3. the tip portion has an elastically deformable press-fit portion and a protruding portion protruding from the press-fit portion toward the second mold, The protrusion breaks through the film to form the through hole. The resin sealing method according to claim 1 .

4. The tip of the protrusion is formed flat, an ejector pin provided in the second mold presses the tip of the protrusion to release the resin-sealed product. The resin sealing method according to claim 3.

5. The resin is a thermosetting resin. The resin sealing method according to claim 1 .

6. A substrate; a terminal having a base end, a tip end opposite the base end, and an intermediate portion disposed between the base end and the tip end; a resin for sealing at least the base end portion on the substrate, In the width direction of the terminal, the base end portion is smaller than the tip end portion, and the intermediate portion is larger than the tip end portion, The base end is embedded in the resin, and at least a part of the middle portion protrudes and is exposed from the resin. Resin sealed product.

7. An apparatus for resin-sealing a substrate having terminals, a first mold in which the substrate is placed; a second mold facing the first mold and having a receiving portion for receiving the terminal; a film supply mechanism for supplying a film between the first mold and the second mold; a resin supply unit that supplies resin between the first mold and the film, the terminal has a base end supported by the substrate, a tip end opposite the base end, and an intermediate portion provided between the base end and the tip end, In a width direction of the terminal perpendicular to a longitudinal direction from the base end portion to the tip end portion, the base end portion is smaller than the tip end portion, and the intermediate portion is larger than the tip end portion, When the second mold accommodates the tip portion in the accommodation portion through the through hole of the film, the through hole is closed by the middle portion, the resin supply unit fills a gap between the first mold and the film with resin to resin-seal at least the base end portion on the substrate; Resin sealing equipment.

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