Modular thermal bus for magnetic resonance device

Abstract

To provide a conduction cooling type superconducting magnet which makes it possible to improve cooling efficiency and repair or replacement of components of a superconducting magnet.SOLUTION: The invention relates to a magnet device 11 for a magnetic resonance device, including: a first magnet coil 31a; a second magnet coil 31b; and modular thermal bus 30. Therein: the first magnet coil 31a and the second magnet coil 31b each include a superconducting wire arranged in a matrix structure; a modular thermal bus 300 includes an embedded element 32 and a linking element 33; the embedded element 32 is embedded in the matrix structure of the first magnet coil 31a; and the embedded element 32 and the second magnet coil 31b are thermally and mechanically connected via the linking element 33. The invention also relates to a magnetic resonance device. This magnetic resonance device acquires magnetic resonance data of an object positioned in an imaging region of the magnetic resonance device and includes the magnet device 11.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] Regardless of grammatical usage, the term includes individuals of male, female, and other gender identities.

[0002] The present invention relates to a magnet apparatus and a magnetic resonance device. [Background technology]

[0003] The use of conduction-cooled superconducting magnets (also known as "dry" magnets) in magnetic resonance devices has increased significantly due to the rising cost of helium over the past few years. Although magnetic resonance devices using conduction-cooled superconducting magnets are commercially available, many opportunities still exist for technological improvements. One of the main challenges for conduction-cooled superconducting magnets is an effective thermal connection between the superconducting magnet and the cryocooler.

[0004] There are several known solutions to this problem. In one solution, a closed pipe is fitted around the superconducting magnet. Liquid helium circulates through this pipe, absorbing heat from the superconducting magnet and cooling it. The drawback of this solution is that the pipe is difficult to manufacture and to fit around the superconducting magnet. Also, the pipe has an inherent risk of leaking.

[0005] Another solution involves bonding a highly thermally conductive material to the outer surface of the superconducting magnet to form a thermal bus that carries thermal energy to a cryocooler. While this solution avoids the use of complex cooling pipes, it is less efficient overall at cooling the superconducting magnet due to its low thermal and heat transfer capacity. Because the thermal bus is bonded to the outer surface of the superconducting magnet, providing thermal contact and securing the thermal bus to the superconducting magnet, repairing and / or replacing components of the superconducting magnet is often impractical or even impossible. This can be a major drawback in magnetic resonance devices with high magnetic field strengths (e.g., 3 T and 7 T), where the material value of the device's superconducting magnet coils is important. Summary of the Invention [Problem to be solved by the invention]

[0006] It is an object of the present invention to provide a conduction-cooled superconducting magnet that improves cooling efficiency and allows for repair or replacement of components of the superconducting magnet. [Means for solving the problem]

[0007] The above object is achieved by a magnet arrangement and a magnetic resonance device according to the invention. Further advantageous embodiments are specified in the dependent claims.

[0008] The magnet apparatus of the present invention is configured for use in a magnetic resonance device and includes a first magnet coil, a second magnet coil, and a modular thermal bus.

[0009] The magnet apparatus may include or be a main magnet. It is envisioned that the magnet apparatus comprises a plurality of superconducting coils. In a preferred embodiment, the magnet apparatus includes at least two solenoidal or cylindrical superconducting coils. The at least two solenoidal or cylindrical superconducting coils may be rotationally symmetric or may comprise a rotationally symmetric body. The first magnet coil and the second magnet coil may be superconducting coils of the main magnet.

[0010] The at least two superconducting coils of the main magnet may define a common axis, preferably the common axis defined by the at least two superconducting coils corresponds to the cylindrical axis and / or axis of rotational symmetry of the main magnet and / or magnet arrangement.

[0011] According to one embodiment, the at least two superconducting coils are mechanically coupled and / or mechanically connected. Preferably, the at least two superconducting coils form a coherent or massed structure.

[0012] For example, the magnet arrangement may include a magnet support structure configured to provide mechanical support to at least two superconducting coils, the magnet support structure being configured to maintain a predetermined spatial arrangement of the at least two superconducting coils. According to one aspect, the magnet support structure is configured to be mechanically connected to a support structure of a magnetic resonance device, in particular an outer vacuum chamber.

[0013] In another example, the at least two superconducting coils may be integrally joined, preferably to at least one spacer disposed between the at least two superconducting coils.

[0014] The magnet arrangement may further include a cryogen vessel and / or a thermal shield. It is envisioned that the magnet arrangement is circumferentially surrounded by an outer vacuum chamber of a magnetic resonance device. The vacuum chamber may be formed as a double-walled hollow cylinder consisting of an outer shell and an inner shell connected by annular end pieces. The magnet arrangement may be enclosed between the outer and inner shells of the outer vacuum chamber. The inner shell of the outer vacuum chamber may correspond to the patient bore of the magnetic resonance device containing the magnet arrangement.

[0015] The first magnet coil and the second magnet coil each include superconducting wire arranged in a matrix structure. Preferably, the superconducting wire of the first magnet coil and / or the second magnet coil is wound to form a superconducting coil. The matrix structure of the first magnet coil and / or the second magnet coil may include or consist of superconducting wire impregnated with resin, in particular epoxy resin. The superconducting wire of the first magnet coil and / or the second magnet coil may be wound to form layers. It is envisaged that the layers of superconducting wire are separated from each other by resin and / or electrical insulation.

[0016] The modular thermal bus includes embedded elements and linking elements. The embedded elements and linking elements include or are made of thermally conductive materials. In particular, the embedded elements and linking elements may include or be made of solid thermal conductors such as metals and / or thermally conductive composites. In preferred embodiments, the embedded elements and / or linking elements are made of copper, gold, aluminum, platinum, silver, or the like. The embedded elements and / or linking elements may be configured as wires, plates, bars, foils, meshes, braids, tubes, or the like. The embedded elements and / or linking elements may include bent portions and / or angled portions.

[0017] The modular thermal bus may be configured to provide thermal and mechanical connections to a cooling system of a magnetic resonance device. In particular, elements of the modular thermal bus may be configured to provide thermal and mechanical connections to a cryocooler, a cryocooler heat exchanger, a cryocooler coldhead, and / or a main thermal bus of a magnetic resonance device.

[0018] According to one aspect, the modular thermal bus, particularly the linking element, is configured to transfer thermal energy from the implanted element to the cooling system of the magnetic resonance device. The linking element may be configured to bridge a gap between the implanted element and the cooling system of the magnetic resonance device. In particular, the linking element may provide a thermal and mechanical connection between the implanted element and the cooling system.

[0019] According to the present invention, the embedded element is embedded in the matrix structure of the first magnet coil, and the embedded element and the second magnet coil are thermally and mechanically connected via a linking element.

[0020] The linking element may be thermally and mechanically connected to the embedding element using a force-constraining connection, a form-constraining connection, and / or a material bond. Preferably, the mechanical connection between the embedding element and the linking element is configured to allow for the transfer of thermal energy from the embedding element to the linking element. For example, the linking element may be screwed, bolted, clamped, crimped, and / or glued to the embedding element. In a preferred embodiment, the linking element is mechanically connected to the embedding element using a reversible mechanical connection, particularly a threaded and / or bolted connection. An adhesive bond between the linking element and the embedding element may also provide a reversible mechanical connection if the adhesive bond is accessible and the adhesive bond can be separated by the application of heat and / or solvent.

[0021] According to one aspect, the magnet arrangement includes another embedded element embedded in the matrix structure of the second magnet coil. The linking element may be mechanically connected to the other embedded element using a force-constrained connection, a shape-constrained connection, and / or a material bond. Preferably, the linking element and the other embedded element are mechanically connected using a reversible mechanical connection.

[0022] In another aspect, the linking element includes or consists of an attachment means configured to thermally and mechanically connect a portion of an embedded element embedded in the matrix structure of a first magnet coil to a portion of another embedded element embedded in the matrix structure of a second magnet coil. For example, the linking element can include or consist of bolts and / or screws configured to thermally and mechanically connect an embedded element to another embedded element.

[0023] According to another aspect, the embedded elements are embedded in the matrix structure of the first magnet coil and in the matrix structure of the second magnet coil. Of course, the modular thermal bus may include embedded elements embedded in the matrix structure of the second magnet coil and in the matrix structure of the third magnet coil. The linking element may be thermally and mechanically connected to one or more embedded elements according to the above aspects.

[0024] In another aspect, the modular thermal bus may include a plurality of embedded elements embedded within the matrix structure of a first magnet coil. The modular thermal bus may also include a plurality of embedded elements embedded within the matrix structure of a second magnet coil. The embedded elements may be thermally and mechanically connected using one or more linking elements.

[0025] By providing embedded elements embedded within the matrix structure of the first magnet coils, the heat transfer area between the first magnet coils and the modular thermal bus is increased compared to conventional thermal bus structures located on the outer surface of the main magnet, thereby advantageously increasing the efficiency of transferring thermal energy from the superconducting wires to the cooling system of the magnetic resonance device. In particular, the temperature distribution across the matrix structure of the first magnet coils is advantageously uniformed or homogenized.

[0026] As a further advantage, the reversible mechanical connection between the embedding element and the linking element may allow for separation of parts or portions of the modular thermal bus, and thus the magnet arrangement of the present invention may be preferably disassembled if repair or replacement of one or more superconducting coils is required.

[0027] According to one aspect of the magnet apparatus of the present invention, the first magnet coil and the second magnet coil are arranged apart from each other.

[0028] For example, the first and second magnet coils may be attached or mounted to the magnet support structure according to the above-described aspects. The first and second magnet coils may be mechanically connected to the magnet support structure using a force-constrained connection, a form-constrained connection, and / or a material bond. It is envisioned that the first and second magnet coils may be attached to the magnet support structure such that the first and second magnet coils are separated by a gap of several millimeters or centimeters.

[0029] In another example, the first magnet coil and the second magnet coil are separated by at least one spacer. The first magnet coil and the second magnet coil may be attached to the at least one spacer using a force-constrained connection, a form-constrained connection, and / or a material bond. Preferably, the first magnet coil, the second magnet coil, and the at least one spacer form a cohesive or cohesive structure.

[0030] By providing the linking and embedding elements of the present invention, rather than permanently or irreversibly attaching the second magnet coil to the first magnet coil via the modular thermal bus, the modular thermal bus can preferably provide a thermal connection between the first and second magnet coils through the gap between the first and second magnet coils.

[0031] According to a preferred embodiment of the magnet apparatus of the present invention, the first magnet coil and the second magnet coil are spaced apart via at least one spacer disposed between the first magnet coil and the second magnet coil.

[0032] Preferably, the at least one spacer is embodied as one or more rings, one or more hollow cylinders, or one or more segments of a ring or hollow cylinder. It is also envisaged that the at least one spacer is embodied as one or more blocks of suitable shape.

[0033] At least one spacer may include or be formed of a thermally conductive material. In particular, at least one spacer may be configured to transfer thermal energy between the superconducting coils of the main magnet. Preferably, at least one spacer includes an electrically insulating material, coating, or layer. For example, at least one spacer may include or be formed of a metal, a plastic material, and / or a composite material.

[0034] According to one embodiment, the at least one spacer is configured to fill a gap between the first and second magnet coils, or alternatively, the at least one spacer is configured to fill a gap between the first and third magnet coils, or between the third and second magnet coils.

[0035] The superconducting coils and at least one spacer of the magnet apparatus may form a cohesive or tightly coupled structure. The at least one spacer may be attached to the first and / or second magnet coils using a force-constrained connection, a form-constrained connection, and / or a material bond. Preferably, the at least one spacer is reversibly attached to the first and / or second magnet coils to allow for disassembly of the magnet apparatus of the present invention. For example, the at least one spacer may be screwed or bolted to the first, second, and / or third magnet coils.

[0036] Providing at least one spacer disposed between the first and second magnet coils may provide an integrally coupled magnet arrangement, thus preferably eliminating the weight and / or cost associated with a dedicated support cylinder or structure for the main magnet.

[0037] According to one aspect of the magnet apparatus of the present invention, the embedded element includes a connection portion protruding from the matrix structure of the first magnet coil, and the linking element is thermally and mechanically connected to the connection portion.

[0038] The connecting portion may be configured to provide a thermal and mechanical connection with the linking element. For example, the connecting portion may be configured to be screwed, clamped, bolted, and / or glued to the linking element. Preferably, the linking element and the connecting portion are connected using a reversible mechanical connection.

[0039] Depending on the relative spatial orientation of the embedded portions of the embedded element, the connecting portions may be inclined and / or curved relative to the embedded portions. In particular, the embedded portions may be inclined and / or curved to direct the connecting portions toward the outer surface or periphery of the first magnet coil. It is also envisioned that the connecting portions protruding from the matrix structure of the first magnet coil may be inclined and / or curved toward the outer periphery of the spacer and / or magnet support structure.

[0040] According to one aspect, at least a portion of the connecting portion is disposed outside the matrix structure of the first magnet coil, while at least a portion of the embedded element is disposed within the matrix structure of the first magnet coil. Preferably, the portion of the connecting portion disposed outside the matrix structure of the first magnet coil is configured to thermally and mechanically connect to the linking element. For example, the connecting portion may include a heat transfer area in contact with the linking element. The heat transfer area of ​​the connecting portion may be configured to transfer an expected thermal load generated in the first magnet coil to the linking element.

[0041] Providing a connection portion that is reversibly attached to the linking element is preferable because the superconducting wire of the first magnet coil is thermally connected to the modular thermal bus while allowing for disassembly of the modular thermal bus and / or the magnet device. Furthermore, when the connection portion is derived from the matrix structure of the first magnet coil, the embedded portion of the embedded element can be embedded in the matrix structure of the first magnet coil at any desired depth and / or orientation. Therefore, an improved or optimized thermal connection between the first magnet coil and the modular thermal bus can be provided.

[0042] In other aspects, instead of protruding from the outer circumferential surface of the matrix structure of the first magnet coil, the embedded elements may extend through channels or cavities in at least one spacer or magnet support structure. For example, the at least one spacer or magnet support structure may include boreholes, recesses, and / or grooves configured to guide (route) the embedded elements through the material of the at least one spacer or magnet support structure. Such channels or cavities may be open to or accessible from the outer circumferential surface of the magnet arrangement to enable disassembly of the modular thermal bus.

[0043] According to one aspect of the magnet arrangement of the present invention, the first magnet coil and the at least one spacer have a cylindrical shape.

[0044] The magnet arrangement may be cylindrical in shape, in particular the superconducting coil and the at least one spacer may form a cylindrical body defining a cylindrical axis and / or an axis of rotational symmetry.

[0045] The connecting portion is disposed on the outer circumferential surface of the at least one spacer, and the linking element is mechanically connected to the at least one spacer and the connecting portion on the outer circumferential surface of the at least one spacer.

[0046] The outer circumferential surface of the at least one spacer may form a part of the side of the magnet apparatus. It is envisaged that the connecting portion protrudes from the matrix structure of the first magnet coil and bends or curves over at least a part of the outer circumferential surface of the at least one spacer. The connecting portion may be in contact with and / or mechanically connected to the at least one spacer. In particular, the connecting portion may be reversibly attached to the outer circumferential surface of the at least one spacer. In a preferred embodiment, the connecting portion and the linking element are reversibly attached to the at least one spacer. For example, the connecting portion and the linking element may be screwed, clamped and / or bolted to the at least one spacer. In a less preferred embodiment, the linking element and / or the connecting portion are connected to the at least one spacer using an adhesive.

[0047] The at least one spacer preferably provides a platform or support structure for mechanically fixing the linking elements and connecting portions along the length of the magnet arrangement. Furthermore, mechanically connecting the connecting elements and the linking elements to the at least one spacer preferably improves the connection strength and thermal contact between the linking elements and connecting portions. As a further advantage, the at least one spacer may be thermally connected to the modular thermal bus, which may further improve the transfer of thermal energy from the magnet coils to the modular thermal bus.

[0048] In another aspect, the magnet device of the present invention includes a thermally conductive element disposed between the embedding element and the linking element.

[0049] In a preferred embodiment, the thermally conductive element is disposed between the connecting portion of the embedding element and the linking element.

[0050] The thermally conductive element may comprise or be formed from a soft material, in particular a soft metal such as indium, or may comprise or be formed from a layer of thermally conductive adhesive and / or paste.

[0051] A thermally conductive element disposed between the linking element and the embedded element preferably improves the transfer of thermal energy from the magnet coil to the modular thermal bus.

[0052] Furthermore, thermally conductive elements comprising or consisting of thermal paste and / or soft metal may facilitate removal of the embedded elements from the associated elements, which may advantageously simplify maintenance and / or repair servicing of the magnet system that requires disassembly of the modular thermal bus.

[0053] In another embodiment of the magnet apparatus of the present invention, the first magnet coil has a cylindrical shape, and a portion of the embedded element extends through the matrix structure of the first magnet coil parallel to the cylindrical axis of the first magnet coil.

[0054] The cylindrical axis of the first magnet coil may correspond to the cylindrical axis and / or axis of rotational symmetry of the magnet arrangement. A portion of the embedded element may extend through the matrix structure of the first magnet coil in the axial direction of the first magnet coil and / or the magnet arrangement.

[0055] Preferably, the portion of the embedded element that extends through the matrix structure of the first magnet coil parallel to the cylindrical axis of the first magnet coil portion extends between predetermined layers of superconducting wire of the first magnet coil.

[0056] The portion of the embedded element that extends parallel to the cylindrical axis through the matrix structure of the first magnet coil may be a major portion of the embedded element, e.g., more than 50%, more than 60%, more than 70%, more than 80%, or preferably more than 90%. Due to manufacturing tolerances, the extension direction of the portion of the embedded element may deviate from the cylindrical axis of the first magnet coil by a few degrees, preferably less than 10 degrees, less than 5 degrees, or less than 2 degrees.

[0057] In magnetic resonance devices, the superconducting wire of the magnet coils is typically radially layered or stacked. The embedded element of the present invention preferably provides a thermal connection between two given layers or windings of the magnet coil and the embedded element. Furthermore, the embedded element, which extends in the axial direction of the magnet coil, only needs to be inserted before adding or winding a new radial layer of superconducting wire during the winding process. Therefore, the manufacturing process of the magnet coil including the embedded element is preferably simplified.

[0058] According to another aspect of the magnet apparatus of the present invention, the first magnet coil has a cylindrical shape, and a portion of the embedded element extends in a radial direction of the first magnet coil through the matrix structure of the first magnet coil.

[0059] The portion of the embedded element that extends through the matrix structure of the first magnet coil in the radial direction of the first magnet coil may be a major portion of the embedded element, for example, more than 50%, more than 60%, more than 70%, more than 80%, or preferably more than 90%.

[0060] It is envisioned that the portion of the embedded element extending through the matrix structure of the first magnet coil in the radial direction of the first magnet coil extends between predetermined rows of the superconducting wire of the first magnet coil. In particular, the portion of the embedded element may extend through the matrix structure of the first magnet coil in a direction oriented substantially perpendicular to the cylindrical axis or axis of rotational symmetry of the first magnet coil and / or magnet device. Due to manufacturing tolerances, the extension direction of the portion of the embedded element through the matrix structure of the first magnet coil may deviate from the radial or transverse plane defined by the first magnet coil and / or magnet device by a few degrees, preferably by less than 10 degrees, less than 5 degrees, or less than 2 degrees.

[0061] The portion of the embedded element that protrudes from the first magnet coil may be a connecting portion according to the above-described embodiment.

[0062] While embedded elements with portions that extend radially through the magnet coil matrix structure are preferable because they can provide thermal contact with the superconducting wires through a predetermined depth of the superconducting material, the manufacturing process for magnet coils that include embedded element portions that extend radially through the magnet coil matrix structure may be more difficult or expensive compared to magnet coils that include embedded element portions that extend axially of the magnet coil between layers of superconducting material.

[0063] In a preferred embodiment of the magnet arrangement of the present invention, the first magnet coil has a cylindrical shape, and the extent of the embedded elements within the matrix structure of the first magnet coil is limited to a cylindrical sector of the first magnet coil, the cylindrical sector occupying less than 80%, less than 60%, less than 40%, or preferably less than 20% of the circumference of the first magnet coil.

[0064] The first magnet coil may be subdivided into a plurality of imaginary cylindrical sectors, each of which may define or include a portion of the circumference of the first magnet coil.

[0065] The embedded element may form part of one or more imaginary cylindrical sectors of the first magnet coil. In particular, the embedded element may extend through one or more imaginary cylindrical sectors. Alternatively, the embedded element may be confined to one or more imaginary cylindrical sectors and not extend into any further imaginary cylindrical sectors of the first magnet coil.

[0066] It is envisioned that the one or more imaginary cylindrical sectors containing the embedded elements occupy less than 80%, less than 60%, less than 40%, or preferably less than 20% of the circumference of the first magnet coil. The extent of the embedded elements within the matrix structure of the first magnet coil may be limited to a radial cross section of the first magnet coil. The extent of the embedded elements within the matrix structure of the first magnet coil may be limited to a transverse cross section of the first magnet coil.

[0067] According to one aspect, the extent of the embedded elements within the matrix structure of the first magnet coil is limited to a portion of the axial dimension or length of the first magnet coil. For example, the extent of the embedded elements within the matrix structure of the first magnet coil may be limited to a percentage of less than 80%, less than 60%, or less than 40% of the axial dimension or length of the first magnet coil.

[0068] Limiting the extent of the embedded elements within the matrix structure to a cylindrical sector or to a portion of the axial dimension of the first magnet coil preferably reduces the costs associated with the manufacturing process of the first magnet coil while providing a sufficiently large or optimized heat transfer area between the superconducting wire and the embedded elements.

[0069] According to one aspect, the magnet apparatus of the present invention includes a plurality of embedded elements embedded in a matrix structure of the first magnet coil and / or the second magnet coil.

[0070] The second magnet coil may be configured corresponding to the first magnet coil aspects described above. In particular, one or more embedding elements may be embedded in the matrix structure of the second magnet coil according to aspects described herein. The matrix structure of the second magnet coil may include a resin-impregnated layer and / or windings of superconducting wire. However, it is envisioned that the radial and / or axial dimensions of the second magnet coil may differ from those of the first magnet coil.

[0071] In a preferred embodiment, the first magnet coil includes a first embedded element embedded in the matrix structure of the first magnet coil, and the second magnet coil includes a second embedded element embedded in the matrix structure of the second magnet coil. The first embedded element and / or the second embedded element may each include a portion oriented in a radial direction of the magnet device or oriented parallel to the cylindrical axis of the magnet device.

[0072] According to another aspect, multiple embedded elements can be embedded in the matrix structure of the first magnet coil, and the multiple embedded elements can be positioned at different radial distances from the cylindrical axis of the first magnet coil.

[0073] At least two of the multiple embedded elements may be embedded in the matrix structure of the first magnet coil at different depths. For example, the first magnet coil may include a first embedded element and a second embedded element extending between different layers of superconducting wire in the axial direction of the first magnet coil. In particular, the first embedded element may be disposed at a first radial distance from the cylindrical axis of the first magnet coil, and the second embedded element may be disposed at a second radial distance from the cylindrical axis of the first magnet coil. The first radial distance may be different from the second radial distance. Of course, the first magnet coil may include additional embedded elements, such as a third embedded element and / or a fourth embedded element, disposed at different radial distances from the cylindrical axis of the first magnet coil. Multiple embedded elements may be embedded in the matrix structure of the second magnet coil in a similar manner.

[0074] According to one aspect, at least two of the plurality of embedded elements may be arranged in different cylindrical sectors of the first magnet coil and / or the second magnet coil, i.e., the embedded elements are preferably distributed along the circumferential direction of the magnet arrangement, which may improve thermal connection to multiple parts of the magnet arrangement.

[0075] Multiple embedded elements embedded within the matrix structure of the magnet coil at different depths are preferred as this may allow different layers of superconducting wire to be thermally connected to a modular thermal bus.

[0076] In another embodiment, the first magnet coil includes a first embedded element and a second embedded element extending through the matrix structure of the first magnet coil parallel to the cylindrical axis of the first magnet coil, and the radial distance between the first embedded element and the cylindrical axis of the magnet device can correspond to the radial distance between the second embedded element and the cylindrical axis of the magnet device.

[0077] In another aspect, the multiple embedded elements may be arranged in different axial portions of the magnet device. For example, the multiple embedded elements may be arranged in different axial portions of the first magnet coil, the second magnet coil, and / or the third magnet coil. In particular, each embedded element of the multiple embedded elements may be arranged in a different axial portion of the magnet device. The axial portion of the first embedded element may overlap with the axial portion of the second embedded element when the first embedded element and the second embedded element are arranged at different radial distances from the cylindrical axis of the magnet device. It is also envisioned that the first embedded element and the second embedded element, which are axially spaced apart from each other, are arranged at approximately the same or the same radial distance from the cylindrical axis of the magnet device.

[0078] According to the present invention, multiple embedded elements are thermally and mechanically connected using one or more linking elements.

[0079] For example, if multiple embedded elements are embedded in the first magnet coil, the multiple embedded elements may be thermally and mechanically connected to a common connection portion. The common connection portion may be thermally and mechanically connected to one or more linking elements and / or embedded elements embedded in the matrix structure of the second magnet coil according to any aspect described herein. Alternatively, each embedded element of the multiple embedded elements may include a dedicated or individual connection portion that is thermally and mechanically connected to one or more linking elements and / or embedded elements embedded in the matrix structure of the second magnet coil.

[0080] In a preferred embodiment, the first embedded element is embedded in the matrix structure of the first magnet coil, and the second embedded element is embedded in the matrix structure of the second magnet coil. The connecting portion of the first embedded element and the connecting portion of the second embedded element may be thermally and mechanically connected to one or more linking elements according to any of the embodiments described herein. Alternatively, the connecting portion of the first embedded element and the connecting portion of the second embedded element may be thermally and mechanically connected to each other via the linking elements.

[0081] When multiple embedded elements are provided that are arranged at different positions within the matrix structure of the magnet coil of the magnet arrangement of the present invention, the heat transfer capacity of the modular thermal bus can be optimized and / or tailored to the specific requirements of different magnetic resonance devices (e.g., whole-body scanners or dedicated scanners for imaging specific body parts).

[0082] According to one aspect of the magnet apparatus of the present invention, the third magnet coil is disposed between the first magnet coil and the second magnet coil.

[0083] The third magnet coil may include one or more embedded elements embedded in the matrix structure of the third magnet coil. The one or more embedded elements of the third magnet coil may be configured according to any of the embodiments of embedded elements described herein. In particular, the embedded elements of the third magnet coil may be thermally and mechanically connected to the linking element.

[0084] The thermal bus may include a monolithic or integrated linking element that is thermally and mechanically connected to the embedded elements of the first magnet coil and the embedded elements of the third magnet coil, and also to the embedded elements of the second magnet coil. However, a modular thermal bus may also include multiple linking elements. For example, a modular thermal bus may include at least a first linking element and a second linking element. The first linking element may be thermally and mechanically connected to the embedded elements of the first magnet coil and the embedded elements of the third magnet coil. Similarly, the second linking element may be thermally and mechanically connected to the embedded elements of the third magnet coil and the embedded elements of the second magnet coil. Of course, the magnet device of the present invention may include additional magnet coils, embedded elements, and even linking elements configured according to any aspect described herein.

[0085] The modular thermal bus of the magnet arrangement of the present invention preferably allows for modular scalability with respect to the number of embedded elements and also the number of linking elements based on the specific requirements of the magnetic resonance device, for example, the number of embedded elements and also the number of linking elements can be adjusted depending on the number of magnet coils, the individual depths of the magnet coils, and / or the individual axial dimensions of the magnet coils of the magnet arrangement of the present invention.

[0086] According to another aspect of the magnet apparatus of the present invention, the modular thermal bus includes a first embedded element and a second embedded element, the first embedded element being embedded in a first magnet coil and the second embedded element being embedded in a second magnet coil, the first embedded element and the second embedded element being thermally and mechanically connected via a linking element.

[0087] The first embedding element and the second embedding element may be configured according to any aspect described herein.

[0088] For example, the first and second magnet coils can be separated or separated using at least one spacer according to the above-described aspects. In a preferred aspect, the first and second magnet coils are mechanically attached to opposite axial ends or faces of the spacer to form a cohesive structure. It is contemplated that the first and second magnet coils can be screwed, bolted, and / or glued to the opposite axial ends of the spacer.

[0089] According to one aspect of the magnet device of the present invention, the first embedded element and the second embedded element each include a connecting portion. The connecting portions of the first embedded element and the second embedded element overlap in the direction of an axial cross section of the magnet device. The linking element is configured to thermally and mechanically connect the connecting portions of the first embedded element and the second embedded element.

[0090] For example, the connecting portion of the first embedded element and the connecting portion of the second embedded element can be folded or curved onto the outer circumferential surface of the spacer separating the first and second magnet coils. The connecting portion of the first embedded element and the connecting portion of the second embedded element can be mechanically attached to the spacer separating the first and second magnet coils. Preferably, the connecting portion of the first embedded element and / or the connecting portion of the second embedded element is screwed, bolted, and / or glued to the outer circumferential surface of the spacer separating the first and second magnet coils.

[0091] The connecting portion of the first embedded element and the connecting portion of the second embedded element can be thermally and mechanically connected using a linking element. For example, the linking element can be a bar, plate, block, or any shaped structure configured to bridge the gap between the connecting portion of the first embedded element and the connecting portion of the second embedded element. The linking element can also include a support structure for an attachment means configured to mechanically connect the connecting portion of the first embedded element to the connecting portion of the second embedded element.

[0092] Furthermore, the linking element may include attachment means configured to attach the linking element to at least one spacer. For example, the linking element may include or consist of one or more bolts and / or screws. The attachment means may also be configured to attach the connecting portion of the first embedded element and the connecting portion of the second embedded element to at least one spacer. In a preferred embodiment, the attachment means is configured to provide a thermal and mechanical connection between the connecting portion of the first embedded element and the connecting portion of the second embedded element. For example, the attachment means may include or consist of one or more screws and / or bolts.

[0093] According to one aspect, the connecting portion of the first embedding element and the connecting portion of the second embedding element are configured to overlap on an outer circumferential surface of the at least one spacer, and the linking element may include or consist of one or more screws and / or bolts configured to mechanically connect the connecting portion of the first embedding element and the connecting portion of the second embedding element to the at least one spacer.

[0094] When the magnet coils of the magnet arrangement are mounted on a dedicated magnet support structure, the linking element may be configured to mechanically connect the connecting portions of the first and second embedded elements to the magnet support structure. The linking element may be configured to thermally and mechanically connect the first and second embedded elements to each other and also to the magnet support structure. The linking element may be configured according to any of the aspects described above.

[0095] Preferably, the magnet arrangement, in particular the modular thermal bus, includes a thermally conductive element according to the embodiments described herein. The thermally conductive element may be configured to increase or improve the transfer of thermal energy between the connecting portion of the first embedded element and the connecting portion of the second embedded element. The thermally conductive element may also be configured to improve the transfer of thermal energy between the linking element and the connecting portion of the first embedded element and the connecting portion of the second embedded element.

[0096] Providing overlapping connections of embedded elements that are thermally and mechanically connected using bolts and / or screws preferably reduces weight and / or material costs for the magnet arrangement of the present invention.

[0097] The modular thermal bus of the present invention is preferred because it allows for the removal of linking elements, thus allowing for disassembly of the magnet assembly. Furthermore, the modular thermal bus of the present invention is preferred because it allows for thermal and mechanical connections between multiple embedded and / or linking elements of any number of magnet coils.

[0098] The first and second magnet coils may be inner coils or field coils of the magnet apparatus of the present invention. The magnet apparatus of the present invention may further include multiple outer coils or shielding coils. The diameter of the shielding coil may exceed the diameter of the first and second magnet coils according to the above-mentioned aspects. The shielding coil may be thermally connected to a modular thermal bus according to any of the aspects described herein. In particular, one or more embedded elements may be embedded in such a shielding coil matrix structure. The one or more embedded elements may include connecting portions thermally and mechanically connected to one or more linking elements. The one or more linking elements may be thermally and mechanically connected to the modular thermal bus according to the above-mentioned aspects, the main thermal bus, and / or the cooling system of the magnetic resonance device.

[0099] A magnetic resonance device of the present invention is configured to acquire magnetic resonance data of a subject placed within an imaging region of the magnetic resonance device, and includes a magnet apparatus according to any of the above aspects.

[0100] Preferably, the magnetic resonance device is configured to acquire magnetic resonance image data, in particular diagnostic magnetic resonance image data, from a subject placed in the imaging region. The subject may be an inanimate object or a patient, in particular a human or animal.

[0101] The magnetic resonance device of the present invention may be a closed-bore scanner. The closed-bore scanner may include a substantially cylindrical bore that circumferentially surrounds an imaging region. The magnet apparatus of the closed-bore scanner may include one or more solenoidal superconducting magnet coils that circumferentially surround the imaging region along an axial or rotationally symmetric axis of the cylindrical bore. The one or more superconducting magnet coils may include superconducting wire that has negligible electrical resistance at (or below) the superconducting temperature. The direction of the main magnetic field provided by the one or more superconducting magnet coils may be oriented substantially parallel to the subject's access direction to the imaging region and / or the axial direction of the cylindrical bore.

[0102] The magnetic resonance device of the present invention may further include components necessary for the proper operation of the magnetic resonance device. For example, the magnetic resonance device may include an outer vacuum chamber, a magnet support structure, a thermal shield, a cryocooler, etc. In certain embodiments, the magnetic resonance device includes a cryogen vessel.

[0103] The cryogen vessel may be configured to store or preserve a fluid, in particular a cryogen, at a predetermined temperature level. Preferably, the fluid or cryogen exhibits a low boiling point. Examples of suitable fluids or cryogens are argon, nitrogen, neon, helium, etc. The predetermined temperature level may substantially correspond to the superconducting temperature of the main magnet.

[0104] The cryocooler may be configured to cool one or more superconducting magnet coils of the magnet assembly and / or maintain the one or more superconducting magnet coils at a temperature level close to the superconducting temperature. The magnet assembly, thermal shield, magnet support structure, and / or cryogen vessel may be thermally connected to the cryocooler via solid heat conductors, convection loops, and / or heat pipes. In particular, one or more superconducting magnet coils of the magnet assembly may be thermally and mechanically connected to the cryocooler using a modular thermal bus according to the above-described aspects.

[0105] The magnetic resonance device of the present invention may be a "dry" system that contains minimal or no cryogen. For example, the magnetic resonance device of the present invention may include one or more small cryogen vessels thermally connected to the main magnet via a solid heat conductor. The one or more small cryogen vessels may contain a volume of cryogen of less than 10 L, less than 5 L, or less than 1 L. According to one embodiment of the magnetic resonance device of the present invention, the cryogen vessel is omitted and the magnet assembly is cooled entirely by thermal conduction.

[0106] In an alternative embodiment, the magnetic resonance device of the present invention is a "wet" system. A "wet" system may include at least one cryogen vessel with a volume of more than 10 L or more than 100 L. The magnet apparatus may be contained within the cryogen vessel and cooled directly by the cryogen.

[0107] The magnetic resonance device shares the advantages of the magnet arrangement of the present invention according to the above-mentioned aspects. [Brief explanation of the drawings]

[0108] Further advantages and details of the invention will become apparent from the following description of the embodiments and drawings. [Figure 1] 1 is a schematic diagram of an embodiment of a magnetic resonance device of the present invention; [Figure 2] 1 is a schematic diagram of an embodiment of a magnet arrangement of the present invention; [Figure 3] 1 is a schematic diagram of an embodiment of a modular thermal bus in a magnet arrangement of the present invention; [Figure 4] 1 is a schematic diagram of an embodiment of a modular thermal bus in a magnet arrangement of the present invention; [Figure 5] 1 is a schematic diagram of an embodiment of a modular thermal bus in a magnet arrangement of the present invention; [Figure 6] 1 is a schematic diagram of an embodiment of a modular thermal bus in a magnet arrangement of the present invention; [Figure 7] 1 is a schematic diagram of an embodiment of a modular thermal bus in a magnet arrangement of the present invention; [Figure 8] 1 is a schematic diagram of an embodiment of a magnetic resonance apparatus according to the present invention; [Figure 9] 1 is a schematic diagram of an embodiment of a magnet arrangement of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0109] FIG. 1 illustrates an embodiment of a magnetic resonance device 10 according to the present invention. In the illustrated example, the magnetic resonance device 10 includes a static magnetic field magnet or main magnet 12 configured to provide a homogeneous static magnetic field 13 (B0 field) that encompasses an imaging volume 50 (see FIG. 2). The static magnetic field 13 passes through an imaging region 14 configured to receive an imaging subject, such as a patient 15. The imaging region 14 may correspond to a patient bore configured to accommodate the patient 15 during magnetic resonance measurements. The imaging region 14 is circumferentially surrounded by the magnet 12. The main magnet 12 forms part of a magnet arrangement 11 according to the present invention.

[0110] The magnetic resonance device 10 may include a patient positioning device 16 configured to move a patient 15 into an imaging region 14. In particular, the patient positioning device 16 may be configured to move a diagnostically relevant body region of the patient 15 into an imaging volume 50 or isocenter of the magnetic resonance device 10. The main magnet 12 and other components of the magnetic resonance device 10 may be concealed within a housing.

[0111] The magnetic resonance device 10 may include a gradient system including one or more gradient (gradient magnetic field) coils 18. The one or more gradient coils may be configured to generate gradient magnetic fields in different, preferably orthogonally oriented, spatial directions. The gradient magnetic fields may be used for spatial encoding of magnetic resonance signals or magnetic resonance data acquired in a magnetic resonance measurement. The one or more gradient coils 18 may be activated or controlled using appropriate control signals provided by a gradient control unit 19.

[0112] The magnetic resonance device 10 may include an integrated radio frequency antenna 20 (i.e., a body coil). The radio frequency antenna 20 may be operated or controlled using a radio frequency control unit 21. The radio frequency control unit 21 may be configured to control the radio frequency antenna 20 to generate a radio frequency magnetic field and emit radio frequency excitation pulses into the imaging region 14. The magnetic resonance device 10 may further include a local coil 26. The local coil 26 may be positioned at or near a diagnostically relevant region of the patient 15. The local coil 26 may be configured to emit radio frequency excitation pulses into and / or receive magnetic resonance signals from the patient 15. It is envisioned that the local coil 26 is controlled using the radio frequency control unit 21.

[0113] Preferably, the magnetic resonance device 10 includes a control unit 22 configured to control the magnetic resonance device 10. The control unit 22 may include a processing unit 28 configured to process magnetic resonance signals to reconstruct a magnetic resonance image. The processing unit 28 may be configured to process inputs by a user of the magnetic resonance device 10 and / or to provide outputs to the user. For this purpose, the processing unit 28 and / or the control unit 22 may be connected to a display unit 24 and an input unit 25 via appropriate signal connections. In preparation for a magnetic resonance measurement, preparatory information such as imaging parameters and patient information may be provided to the user by means of the display unit 24. The input unit 25 may be configured to receive information and / or imaging parameters from the user.

[0114] Of course, the magnetic resonance device 10 may include other components and / or functions common to magnetic resonance devices. The general operation of the magnetic resonance device 10 is known to those of ordinary skill in the art and will not be described in further detail.

[0115] FIG. 2 shows a schematic diagram of the modular thermal bus 30 of the magnet apparatus 11 of the present invention. In this example, the magnet apparatus 11 includes a plurality of superconducting coils (or magnet coils) 31 circumferentially surrounding the imaging region 14, which includes the imaging volume 50. The magnet coils 31 are separated by spacers 42 attached to the magnet coils 31 to form a cohesive structure. The magnet apparatus 11 has the shape of a cylinder or hollow cylinder. In particular, the magnet apparatus 11 defines a cylindrical axis 41 or axis of rotational symmetry that intersects the imaging volume 50. The imaging volume 50 provided using the magnet apparatus can be characterized by a highly homogeneous magnetic field. In particular, the imaging volume 50 can be the isocenter of the magnetic resonance device 10. The plurality of superconducting coils 31 can be inner coils or field coils of the magnet apparatus 11.

[0116] The modular thermal bus 30 includes a plurality of embedded elements 32 embedded in the matrix structure of the magnet coils 31. In the example shown in FIG. 2 , an embedded element 32 is embedded in the matrix structure of each magnet coil 31. The embedded elements 32 include connecting portions 35 that protrude from the matrix structure of the magnet coils 31 and bend or curve over the adjacent spacer 42. The connecting portions 35 of the embedded elements 32 of two adjacent magnet coils 31 are thermally and mechanically connected via linking elements 33. The linking elements 33 include attachment means, such as bolts and / or screws, configured to attach the connecting portions 35 and the linking elements 33 to the outer circumferential surface of the spacer 42. Each linking element 33 thermally and mechanically connects the connecting portions 35 of the embedded elements 32 of the adjacent magnet coils 31.

[0117] The linking elements 33 may be configured to thermally and mechanically connect the connecting portions 35 of the multiple embedded elements 32. In one embodiment, the linking elements 33 form a continuous structure (not shown) that is attached to the connecting portions 35 at each spacer 42. Alternatively, the linking elements 33 may include multiple discrete or separate linking elements 33. Each linking element 33 of the multiple discrete or separate linking elements 33 may bridge a gap between two or more spacers 42.

[0118] Preferably, the modular thermal bus 30 is mechanically and thermally attached to the cooling system of the magnetic resonance device 10, such as the cryocooler 60, the coldhead of the cryocooler 60, the heat exchanger of the cryocooler 60, the cryogen vessel, and / or the main thermal bus 61 (see FIG. 8).

[0119] 3 further illustrates an embodiment of the modular thermal bus 30 of the magnet assembly 11 of the present invention. The illustrated example shows a portion of the magnet assembly 11 including magnet coil 31a and magnet coil 31b. Magnet coils 31a and 31b are separated by a spacer 42a. Additional magnet coils may be attached to spacer 42b.

[0120] The magnet coil 31a includes superconducting wire 36a, which is wound to provide a layer 37 of superconducting wire 36a. In the illustrated example, the modular thermal bus 30 includes an embedded element 32a disposed between an outer layer 37i and a second layer 37ii of superconducting wire of the magnet coil 31a. The embedded element 32a includes a connecting portion 35a that protrudes from the matrix structure of the magnet coil 31a adjacent to a spacer 42a and bends or curves over the outer periphery of the spacer 42a.

[0121] 3, the second embedded element 32b is also disposed between the outer layer 37i and the second layer 37ii of superconducting material of the magnet coil 31b. The connecting portion 35b of the embedded element 32b protrudes from the superconducting material of the magnet coil 31b adjacent to the spacer 42b and bends or curves over the outer circumferential surface of the spacer 42b.

[0122] The linking element 33c provides a thermal connection between the magnet coil 31a and the magnet coil 31b by thermally and mechanically connecting the connecting portion 35a of the embedded element 32a with the connecting portion 35b of the embedded element 32b embedded in the matrix structure of the magnet coil 31b. In the illustrated example, the linking element 33c is formed as a rod or plate configured to bridge the gap between the spacer 42a and the spacer 42b. The linking element 33c is attached to the spacers 42a and 42b using bolts 33a, 33b, and 33d. The bolts 33a, 33b, and 33d provide a thermal and mechanical connection between the linking element 33c and the connecting portion 35a and the connecting portion 35b.

[0123] Of course, the magnet arrangement 11 may include additional magnet coils 31 that are thermally connected using a modular thermal bus according to any of the embodiments described herein.

[0124] FIG. 4 shows a portion of the magnet arrangement 11 of the present invention, including the magnet coil 31a and a spacer 42. The portion of the modular thermal bus 30 shown in FIG. 4 can be configured according to the portion of the modular thermal bus 30 shown in FIG. 3. Compared to the embodiment shown in FIG. 3, the embedded element 32a is embedded deeper in the matrix structure of the magnet coil 31a. For example, the embedded element 32a is embedded between the third layer 37iii and the fourth layer 37iv of superconducting wires of the magnet coil 31a. In addition, a thermally conductive element 34 is disposed between the connecting portion 35a of the embedded element 32a and the linking element 33c.

[0125] The thermally conductive element 34 may include or be constructed from a thermally conductive adhesive, paste, or preferably a soft metal such as indium, and may be configured to reduce voids or gaps between the connecting portion 35a and the linking element 33c and / or increase the heat transfer area between the connecting portion 35a and the linking element 33c.

[0126] The thermally conductive element 34 may be included in each of the embodiments described herein. While Figure 4 shows only a portion of the magnet assembly 11 of the present invention including the magnet coil 31a, embedding element 32a, spacer 42, and portion of the modular thermal bus 30, it should be understood that one or more magnet coils 31 may be mechanically connected or coupled to the spacer 42. Such one or more magnet coils 31 may be thermally and mechanically connected to the modular thermal bus 30 according to the embodiments described herein.

[0127] 5 shows a portion of the magnet device 11 of the present invention, including magnet coils 31a and 31b separated by a spacer 42a. The embedded element 32a may be configured similarly to the embedded element 32 shown in FIGS. 3 and 4. Meanwhile, the embedded element 32b includes two connecting portions 35b and 35c protruding from the matrix structure of the magnet coil 31b.

[0128] The connecting portion 35b protrudes from the matrix structure of the magnet coil 31b near the spacer 42a, and the connecting portion 35c protrudes from the matrix structure of the magnet coil 31b near the spacer 42b. In other words, the connecting portion 35b and the connecting portion 35c protrude from the matrix structure of the magnet coil 31b at opposite ends or opposite faces of the magnet coil 31b.

[0129] In the illustrated example, the linking element 33 includes bolts 33a, 33b and bolts 33c, 33d configured to attach the connecting portions 35a, 35b and the connecting portions 35c, 35d to the respective spacers 42a, 42b. The bolts 33a, 33b provide a thermal and mechanical connection between the connecting portions 35a and 35b, while the bolts 33c, 33d provide a thermal and mechanical connection between the connecting portions 35c and 35d. The connecting portion 35d may be the connecting portion 35 of an embedded element 32 embedded in another magnet coil 31 (not shown) attached to or coupled to the spacer 42b. The embedded element 32 including the connecting portion 35d may be configured similarly to the embedded element 32a or the embedded element 32b shown in FIG. 5.

[0130] In the example shown in FIG. 5, thermally conductive elements 34a and 34b are disposed between connecting portion 35a and connecting portion 35b, and between connecting portion 35d and connecting portion 35c, respectively.

[0131] The magnet coil 31a may be an end coil of the magnet device 11 of the present invention, while the magnet coil 31b may be a bulk coil disposed between the end coil 31a and another magnet coil 31c (not shown).

[0132] 6 shows another embodiment of a portion of the magnet device 11 of the present invention. In the illustrated example, two embedded elements 32a and 32b are embedded in the matrix structure of the magnet coil 31a. The two embedded elements 32a and 32b are embedded in the matrix structure of the magnet coil 31a at different depths or different radial distances from the cylindrical axis 41 of the magnet device 11. For example, the embedded element 32b is positioned closer to the cylindrical axis 41 of the magnet device 11 than the embedded element 32a.

[0133] The embedded elements 32a, 32b may share a connecting portion 35a that protrudes from the matrix structure of the magnet coil 31a, as shown in FIG. 6 . Alternatively, it is envisioned that the embedded elements 32a, 32b may include separate connecting portions 35 that protrude from the superconducting material of the magnet coil 31a at the same or different positions. Preferably, one or more connecting portions 35 of the embedded elements 32a, 32b protrude from the matrix structure of the magnet coil 31 near the spacer 42. This(these) connecting portion(s) 35 may be curved or bent onto the outer circumferential surface of the spacer 42. Linking elements 33c, including bolts 33a, 33b, may be configured to attach the connecting portions 35 of the embedded elements 32a, 32b to the spacer 42 and to thermally and mechanically connect the embedded elements 32a, 32b to another portion of the modular thermal bus 30 and another magnet coil 31, not shown in FIG. 6 .

[0134] In the embodiment shown in FIGS. 2 to 6, the embedded elements 32 extend through the matrix structure of the magnet coils 31 parallel to the cylindrical axis 41 or axis of rotational symmetry of the magnet arrangement 11.

[0135] In some embodiments, the magnet coil 31a may include further embedded elements 32 arranged in multiple cylindrical sectors 61 of the magnet coil 31a. In the example shown in Figure 8, the cylindrical sector 61a includes embedded elements 32a and 32b arranged at different radial distances from the cylindrical axis 41 of the magnet arrangement 11, as shown in Figure 6. The cylindrical sector 61b of the magnet coil 31a includes another embedded element 32d. The embodiment of the magnetic resonance device 10 shown in Figure 8 may be an axial cross section through the entire magnet coil 31a of the magnet arrangement 11 according to the present invention. Of course, the magnet coil 31a may include further cylindrical sectors 61 including embedded elements 32 according to any of the above-mentioned embodiments.

[0136] 7 shows an embodiment of a portion of the magnet arrangement 11 of the present invention. In the illustrated example, the magnet coil 31 a includes embedded elements 32 a, 32 b that extend vertically or radially through the matrix structure of the magnet coil 31 a. For example, the embedded elements 32 a, 32 b may extend through the matrix structure of the magnet coil 31 a in a direction substantially perpendicular to the cylindrical axis 41 of the magnet arrangement 11.

[0137] 2-6, embedded elements 32a, 32b extend between columns 38 of superconducting wires rather than between layers (i.e., horizontal rows or lines) of superconducting wires. For example, embedded element 32a extends between second column 38ii and third column 38iii of superconducting wires 36 within the matrix structure of magnet coil 31a.

[0138] For ease of manufacturing, the embedded elements 32a and 32b can start as straight or flat pieces. The connecting portions 35a and 35b protruding from the matrix structure can be bent toward the spacer 42 after the winding process of the magnet coil 31a is completed. Therefore, the connecting portions 35a and 35b do not interfere with the winding process.

[0139] In another embodiment, when winding the magnet coil 31 a, spacers can be placed between the columns of superconducting wire 36. The spacers can be removed after the winding process is complete, and the embedded elements 32 a, 32 b can be inserted into the empty slots left by the spacers. For example, the embedded elements 32 a, 32 b can be glued into the empty slots using a thermally conductive adhesive.

[0140] In another embodiment, the magnet coil 31 a can be subdivided into multiple individually wound sub-coils separated by embedded elements 32 a, 32 b. That is, embedded elements 32 are preferably embedded within the matrix structure of the magnet coil 31 a without interfering with the winding process. The sub-coils can be electrically connected using conventional superconducting joints.

[0141] Preferably, the embedded elements 32a, 32b include separate connecting portions 35a, 35b that protrude from the matrix structure of the magnet coil 31a at different positions. For example, the connecting portions 35a, 35b may protrude from the matrix structure of the magnet coil 31a at the respective positions where each embedded element 32a, 32b is embedded. Alternatively, the embedded elements 32a, 32b may also include portions (not shown) that extend between the layers of superconducting wire in a direction oriented parallel to the cylindrical axis 41 of the magnet device 11.

[0142] 7, linking element 33c includes bolts 33a, 33b configured to attach connecting portions 35a, 35b to the outer periphery of spacer 42. Linking element 33c thermally and mechanically connects connecting portions 35a, 35b to each other and to other portions of modular thermal bus 30.

[0143] The embedded elements 32a, 32b may penetrate to different depths into the matrix of the magnet coil 31. For example, the embedded elements 32a, 32b may have different extents through the matrix structure of the first magnet coil 31a in the radial direction.

[0144] According to an alternative embodiment, the embedded elements 32a, 32b share a single connecting portion 35 that protrudes from the matrix of the magnet coils 31a at one location.

[0145] 8 shows a cross-sectional view of one embodiment of the magnetic resonance device 10 of the present invention, e.g., an axial cross-section of the magnet coil 31a shown in FIG. 6. The magnetic resonance device 10 includes an outer vacuum chamber 42 that provides an outer enclosure for the magnet assembly 11. In particular, the outer vacuum chamber 42 isolates the ambient environment 70 from a vacuum region 71 enclosed by the outer vacuum chamber 42. The outer vacuum chamber 42 may be a double-walled hollow cylinder including an outer shell and an inner shell. The inner shell of the outer vacuum chamber 42 may be a patient bore that circumferentially surrounds the imaging region 14.

[0146] The magnetic resonance device 10 may further include a thermal shield (not shown). The thermal shield may be implemented as a double-walled hollow cylinder having an outer wall, an inner wall, and an end wall connecting the outer and inner walls. The outer and inner walls of the thermal shield may circumferentially surround the magnet arrangement 11 including the magnet coil 31 a.

[0147] In the illustrated example, the magnetic resonance device 10 of the present invention includes a cryocooler 60 attached to the outer vacuum chamber 42. The cryocooler 60 is configured to cool not only the magnet assembly 11 of the magnetic resonance device 10, but also any thermal shields, additional thermal shields, magnet support structures, and / or cryogen vessels.

[0148] Cryocooler 60 typically includes a compressor (not shown) that supplies pressurized gas to cryocooler 60. Cryocooler 60 may further include a coldhead including one or more cooling stages. In a preferred embodiment, a first cooling stage 60a of the coldhead is thermally connected to a thermal shield (not shown), and a second cooling stage 60b of the coldhead is thermally connected to magnet coils 31a via a main thermal bus 61 that is connected to modular thermal bus 30. In one example, first cooling stage 60a provides a temperature level of approximately 50K, and second cooling stage 60b provides a temperature level of approximately 4K.

[0149] In a "dry" magnetic resonance device, the cooling stages 60a, 60b of the cryocooler 60 may be connected to the magnet assembly 11 via a solid thermal conductor 61. Alternatively, the magnetic resonance device 10 may also include one or more small cryogen vessels or thermal buffers (not shown) that are thermally connected to the cryocooler 60 and / or the magnet assembly 11 using solid thermal conductors, heat pipes, and / or convection loops. In particular, the one or more cryogen vessels or thermal buffers may be thermally connected to the magnet assembly 11 using a modular thermal bus 30.

[0150] In the embodiment shown in FIG. 8, the extent of the embedded elements 32a, 32b, and 32d within the matrix structure of the magnet coil 31a is limited to specific cylindrical sectors 61a and 61b of the first magnet coil 31a. These cylindrical sectors 61a and 61b may occupy less than 80%, less than 60%, less than 40%, or preferably less than 20% of the circumference of the magnet coil 31a. In the illustrated example, the cylindrical sectors 61a and 61b occupy less than 20% of the circumference of the magnet coil 31a. In the illustrated example, the cylindrical sector 61a of the magnet coil 31a includes embedded elements 32a and 32b positioned at different radial distances from the cylindrical axis 41 of the magnet device 11, as shown in FIG. 6. The cylindrical sector 61b includes another embedded element 32d that extends through the matrix structure of the first magnet coil 31a parallel to the cylindrical axis 41 of the first magnet coil 31a.

[0151] The modular thermal bus 30 also includes embedded elements 32c that extend radially through the matrix structure of the magnet coils 31a. The cylindrical sector defined by embedded elements 32c is insignificant compared to the cylindrical sectors 61a and 61b and can therefore be ignored.

[0152] In the above-described embodiment, the superconducting coils 31 (i.e., magnet coils) are joined in series using spacers 42, and the embedded elements 32 of the modular thermal bus 30 may be embedded in the matrix structure of the superconducting coils 31. The embedded elements 32 may be thermally and mechanically connected to linking elements 33 of the modular thermal bus 30 configured to thermally connect the superconducting coils 31 to a cooling system, such as a heat exchanger of a cryocooler 60, a cryogen vessel, and / or a main thermal bus 61 (see FIG. 8). Preferably, a thermally conductive element 34 is disposed between the connecting portions 35 of the embedded elements 32 and the linking elements 33 to improve thermal contact.

[0153] A magnet arrangement 11 according to the present invention may include one or more modular thermal buses 30 distributed at regular or irregular intervals around the circumference of the magnet coil 31 of the magnet arrangement 11 .

[0154] 9 illustrates an embodiment of the magnet assembly 11 of the present invention that includes two modular thermal buses 30a, 30b located on opposite sides of the magnet assembly 11. In the illustrated example, the modular thermal buses 30a, 30b are configured identically, and therefore the labeling of the components of the modular thermal bus 30b has been omitted, although each of the modular thermal buses 30a, 30b may be configured according to any of the embodiments described herein.

[0155] Providing multiple modular thermal buses 30 distributed around the circumference of the magnet assembly 11 may increase or improve the heat transfer capacity between the magnet coils 31 and the cooling system of the magnetic resonance device. Furthermore, multiple modular thermal buses 30 may preferably provide a uniform heat distribution around the circumference of the magnet assembly 11.

[0156] In the illustrated example, the linking element 33 is shaped to allow for insertion of tools and / or a technician's hand between the outer periphery of the magnet coil 31 and the linking element 33. In particular, the portion of the linking element 33 that bridges the space between two adjacent spacers 42 is raised, sloped, and / or bent to provide a predetermined gap between the outer periphery of the magnet coil 31 and the linking element 33.

[0157] Providing raised portions on the linking elements 33 preferably facilitates assembly or disassembly of the modular thermal bus 30 .

[0158] The embodiments described herein should be considered as examples. It is understood that each embodiment may be enhanced by or combined with features of other embodiments unless otherwise stated. The embodiments shown in Figures 1-9 are representations that are not necessarily drawn to scale.

Claims

1. A magnet device (11) of a magnetic resonance device (10), comprising: a first magnet coil (31a), a second magnet coil (31b), and a modular thermal bus (30); the first magnet coil (31 a) and the second magnet coil (31 b) each include superconducting wires (36) arranged in a matrix structure, and the modular thermal bus (30) includes an embedded element (32) and a linking element (33); The embedded element (32) is embedded in a matrix structure of the first magnet coil (31 a), and the embedded element (32) and the second magnet coil (31 b) are thermally and mechanically connected using the linking element (33).

2. The magnet arrangement (11) according to claim 1, wherein the first magnet coil (31a) and the second magnet coil (31b) are separated from each other.

3. 3. The magnet device (11) according to claim 2, wherein the first magnet coil (31 a) and the second magnet coil (31 b) are separated by means of at least one spacer (42) disposed between the first magnet coil (31 a) and the second magnet coil (31 b).

4. The magnet device (11) according to any one of claims 1 to 3, wherein the embedded element (32) includes a connection portion (35) protruding from a matrix structure of the first magnet coil (31), and the linking element (33) is thermally and mechanically connected to the connection portion (35).

5. the first magnet coil (31 a) and the at least one spacer (42) have a cylindrical shape; 5. The magnet device (11) according to claim 3 or 4, wherein the connecting portion (35) is arranged on the outer peripheral surface of the at least one spacer (42), and the linking element (33) is mechanically connected to the at least one spacer (42) and the connecting portion (35) on the outer peripheral surface of the at least one spacer (42).

6. The first magnet coil (31a) has a cylindrical shape, 6. The magnet arrangement (11) according to claim 4 or 5, wherein the embedded element (32) comprises two connection portions (35) protruding from the matrix structure of the first magnet coil (31 a) at axially opposite ends of the first magnet coil (31 a).

7. The magnet arrangement (11) according to any one of claims 1 to 6, comprising a thermally conductive element (34) arranged between the embedding element (32) and the linking element (33).

8. The first magnet coil (31a) has a cylindrical shape, The magnet device (11) according to any one of claims 1 to 7, wherein a portion of the embedded element (31) extends through a matrix structure of the first magnet coil (31a) parallel to a cylindrical axis (41) of the first magnet coil (31a).

9. The first magnet coil (31a) has a cylindrical shape, The magnet device (11) according to any one of claims 1 to 8, wherein a portion of the embedded element (32) extends through a matrix structure of the first magnet coil (31a) in a radial direction of the first magnet coil (31a).

10. The first magnet coil (31a) has a cylindrical shape, the extent of the embedded elements (32) within the matrix structure of the first magnet coil (31 a) is limited to a cylindrical sector (61) of the first magnet coil (31 a); The magnet arrangement (11) according to any one of claims 1 to 9, wherein the cylindrical sector (61) occupies less than 80%, less than 60%, less than 40%, or preferably less than 20% of the circumference of the first magnet coil (31a).

11. a plurality of embedded elements (32) embedded in a matrix structure of the first magnet coil (31 a) and / or the second magnet coil (31 b); The magnet arrangement (11) according to any one of claims 1 to 10, wherein the plurality of embedded elements (32) are thermally and mechanically connected by means of one or more linking elements (33).

12. 12. The magnet device (11) according to claim 11, wherein at least two embedded elements (32) of the plurality of embedded elements (32) are embedded in the matrix structure of the first magnet coil (31 a) at different depths.

13. The magnet arrangement (11) according to any one of claims 1 to 12, wherein a third magnet coil is arranged between the first magnet coil (31a) and the second magnet coil (31b).

14. The modular thermal bus (30) includes a first embedded element (32a) and a second embedded element (32b); the first embedded element (32a) is embedded in the first magnet coil (31a), and the second embedded element (32b) is embedded in the second magnet coil (31b); The magnet arrangement (11) according to any one of claims 1 to 13, wherein the first embedded element (32a) and the second embedded element (32b) are thermally and mechanically connected by means of the linking element (33).

15. the first embedded element (31a) and the second embedded element (31b) each include a connecting portion (35a, 35b); 15. The magnet device (11) according to claim 14, wherein the connecting portions (35a, 35b) of the first embedded element (31a) and the second embedded element (31b) overlap along an axial portion of the magnet device (11), and the linking element (33) is configured to thermally and mechanically connect the connecting portions (35a, 35b) of the first embedded element (32a) and the second embedded element (32b).

16. A magnetic resonance device (10) for acquiring magnetic resonance data of a subject arranged in an imaging region (14) of the magnetic resonance device (10), the magnetic resonance device (10) comprising a magnet arrangement (11) according to any one of claims 1 to 15.

Images