Power module

Abstract

To provide a power module capable of appropriately forming a power loop.SOLUTION: According to one embodiment, there is provided a power module which includes a first conductive pattern, a second conductive pattern, a first power device, a third conductive pattern, a first capacitive element, a fourth conductive pattern, a second capacitive element, a first conductive plug, a fifth conductive pattern, a second conductive plug, and a second power device. In the power module, a first power loop and a second power loop are formed. The first power loop includes the first conductive pattern, the first power device, the second conductive pattern, the first capacitive element, the third conductive pattern, and the second power device. The second power loop includes the first conductive pattern, the first power device, the first conductive plug, the fifth conductive pattern, the second conductive plug, the fourth conductive pattern, the second capacitive element, the third conductive pattern, and the second power device.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present embodiment relates to a power module. [Background technology]

[0002] In a power module equipped with a power device, a power loop including the power device may be formed. In the power module, it is desirable that the power loop be formed appropriately. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6371309 [Patent Document 2] Patent No. 6603676 [Patent Document 3] Special Publication No. 2019-514216 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of one embodiment is to provide a power module that can appropriately form a power loop. [Means for solving the problem]

[0005] According to one embodiment, a power module is provided having a first conductive pattern, a second conductive pattern, a first power device, a third conductive pattern, a first capacitive element, a fourth conductive pattern, a second capacitive element, a first conductive plug, a fifth conductive pattern, a second conductive plug, and a second power device. The first conductive pattern is included in a first layer. The second conductive pattern is disposed in the first layer. The first power device is disposed between the first and second conductive patterns in the first layer. The third conductive pattern is disposed in the first layer. The first capacitive element is disposed between the second and third conductive patterns in the first layer. The fourth conductive pattern is disposed in the first layer. The second capacitive element is disposed between the third and fourth conductive patterns in the first layer. The first conductive plug extends from the first layer to the second layer. The first conductive plug has one end electrically connected to one end of the second conductive pattern. The fifth conductive pattern is included in the second layer. The fifth conductive pattern has one end electrically connected to the other end of the first conductive plug. The second conductive plug extends from the second layer to the first layer. The second conductive plug has one end electrically connected to the other end of the fifth conductive pattern and the other end electrically connected to the fourth conductive pattern. The second power device is disposed between the first conductive pattern and the third conductive pattern on the first layer. The power module forms a first power loop and a second power loop. The first power loop includes the first conductive pattern, the first power device, the second conductive pattern, a first capacitive element, the third conductive pattern, and the second power device. The second power loop includes a first conductive pattern, a first power device, a first conductive plug, a fifth conductive pattern, a second conductive plug, a fourth conductive pattern, a second capacitive element, the third conductive pattern, and a second power device. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 1 is a perspective view showing a configuration of a power module according to a first embodiment. [Figure 2] FIG. 1 is a plan view showing the configuration of a power module according to a first embodiment. [Figure 3] FIG. 1 is a cross-sectional view showing the configuration of a power module according to a first embodiment. [Figure 4] FIG. 1 is a cross-sectional view showing the configuration of a power module according to a first embodiment. [Figure 5] FIG. 2 is a diagram showing a power loop in the first embodiment. [Figure 6] FIG. 1 is a circuit diagram showing a configuration of a power module according to a first embodiment. [Figure 7] FIG. 4 is a diagram showing the ratio of frequency components for each power loop in the first embodiment. [Figure 8] FIG. 10 is a perspective view showing the configuration of a power module according to a second embodiment. [Figure 9] FIG. 10 is a plan view showing the configuration of a power module according to a second embodiment. [Figure 10] FIG. 10 is a diagram showing a power loop in the second embodiment. [Figure 11] FIG. 10 is a plan view showing the configuration of a power module according to a third embodiment. [Figure 12] FIG. 10 is a diagram showing a power loop in the third embodiment. [Figure 13] FIG. 10 is a plan view showing the configuration of a power module according to a fourth embodiment. [Figure 14] FIG. 10 is a diagram showing a power loop in the fourth embodiment. [Figure 15] FIG. 10 is a plan view showing the configuration of a power module according to a fifth embodiment. [Figure 16] FIG. 10 is a diagram showing a power loop in the fifth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0007] Hereinafter, a power module according to an embodiment will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to these embodiments.

[0008] (First embodiment) The power module according to the first embodiment is equipped with a power device and forms a power loop including the power device, and is devised to appropriately form the power loop including the power device.

[0009] The power module 1 can be configured as shown in FIGS. 1 to 4. FIG. 1 is a perspective view showing the configuration of the power module 1. FIG. 2 is a plan view showing the configuration of the power module 1. FIG. 2 illustrates a planar configuration with the power devices PD1 and PD2 removed, and the arrangement area of ​​the power devices PD1 and PD2 is indicated by a two-dot chain line. FIG. 3 is a cross-sectional view showing the configuration of the power module 1, taken along line AA in FIG. 2. FIG. 4 is a cross-sectional view showing the configuration of the power module 1, taken along line BB in FIG. 2.

[0010] The power module 1 includes a multilayer substrate 2, power devices PD1 and PD2, capacitive devices CD1 to CD6, a plurality of heat conduction plugs TP1_1 to TP1_n, TP2_1 to TP2_n, and TP3_1 to TP3_k, and heat dissipation members 100 and 200. n is any integer equal to or greater than 2. k is any integer equal to or greater than 2.

[0011] 3 and 4, in the multilayer substrate 2, an insulating sheet DS, a wiring layer L4, an insulating layer DL3, a wiring layer L3, an insulating layer DL2, a wiring layer L2, an insulating layer DL1, and a wiring layer L1 are stacked in this order in the Z direction. In the multilayer substrate 2, a conductive plug EP may further be disposed between the wiring layer L1 and the wiring layer L2 in the Z direction. The insulating sheet DS entirely covers at least the surfaces where the wiring layer L4 and the heat dissipation members 100, 200 may come into contact.

[0012] The heat conduction plugs TP1_1 to TP1_n and TP2_1 to TP2_n are arranged between the power devices PD1 and PD2 and the heat dissipation members 100 and 200 in the Z direction. The +Z side end of each heat conduction plug TP1 and TP2 is electrically connected to the wiring layer L1 and is in thermal contact with the packages of the power devices PD1 and PD2. The -Z side end of each heat conduction plug TP1 and TP2 is electrically insulated from the heat dissipation member 100 via the insulating sheet DS and is in thermal contact with the heat dissipation member 100.

[0013] The heat conduction plugs TP1_1 to TP1_n are arranged corresponding to the -Y side of the arrangement region of the power device PD1, and the heat conduction plugs TP2_1 to TP2_n are arranged corresponding to the +Y side of the arrangement region of the power device PD1.

[0014] The heat dissipation member 100 has a flat plate portion 101 and multiple fin portions 102. The flat plate portion 101 is in thermal contact with each of the heat conduction plugs TP1 and TP2 via an insulating sheet DS. Each of the fin portions 102 protrudes in a fin-like shape on the opposite side (-Z side) of the multilayer substrate 2.

[0015] The heat conduction plugs TP3_1 to TP3_k are arranged between the power device PD2 and the heat dissipation member 200 in the Z direction. The +Z side end of each heat conduction plug TP3 is electrically connected to the wiring layer L1 and is in thermal contact with the package of the power device PD2. The -Z side end of each heat conduction plug TP3 is electrically insulated from the heat dissipation member 200 via the insulating sheet DS and is in thermal contact with the heat dissipation member 200.

[0016] The heat dissipation member 200 has a flat plate portion 201 and multiple fin portions 202. The flat plate portion 201 is in thermal contact with each heat conduction plug TP3 via an insulating sheet DS. Each fin portion 202 protrudes in a fin-like shape on the opposite side (-Z side) of the multilayer substrate 2.

[0017] The wiring layer L1 extends in the XY direction. The wiring layer L1 is the wiring layer closest to the +Z side in the multilayer substrate 2. As shown in FIGS. 1 and 2, the wiring layer L1 includes a conductive pattern 11, a conductive pattern 12, a conductive pattern 13, and a conductive pattern 14. The power devices PD1 and PD2 are arranged on the wiring layer L1. The capacitance devices CD1 to CD6 are arranged on the wiring layer L1.

[0018] The power device PD1 is electrically connected between the conductive patterns 11 and 13. The power device PD1 may have a substantially rectangular shape in an XY plan view. The power device PD1 has a main surface perpendicular to the Z direction. The power device PD1 may have a longitudinal direction in the Y direction and a lateral direction in the X direction. In the X direction, one end of the power device PD1 is connected to the conductive pattern 13 and the other end is connected to the conductive pattern 11. The power device PD1 includes a switching element and is controlled to perform switching operation.

[0019] The conductive pattern 11 is electrically connected between the power devices PD1 and PD2. The conductive pattern 11 extends at least in the X direction. The conductive pattern 11 may further extend in the Y direction. The conductive pattern 11 may have a substantially rectangular shape in the XY plane view. One end of the conductive pattern 11 on the +X side is electrically connected to the conductive pattern 13 via the power device PD2, and the other end of the conductive pattern 11 on the -X side is electrically connected to the conductive pattern 12 via the power device PD1.

[0020] The power device PD2 is electrically connected between the conductive patterns 11 and 12. The power device PD2 may have a substantially rectangular shape in the XY plane view. The power device PD1 has a main surface perpendicular to the Z direction. The power device PD2 may have its longitudinal direction in the Y direction and its lateral direction in the X direction. One end of the power device PD2 is connected to the conductive pattern 11 and the other end is connected to the conductive pattern 12 in the X direction. The power device PD2 includes a switching element and is controlled to perform switching operation.

[0021] The heat conductive plugs TP1_1 to TP1_n are arranged corresponding to the -Y side in the arrangement region of the conductive pattern 11. The heat conductive plugs TP1_1 to TP1_n penetrate the conductive pattern 11 and contact the -Z side surfaces of the packages of the power devices PD1 and PD2. The heat conductive plugs TP1_1 to TP1_n may penetrate all of the wiring layers L1 to L4 between the power devices PD1 and PD2 and the heat dissipation members 100 and 200, or may penetrate some of the wiring layers L2 to L4. When penetrating some of the wiring layers L2 to L4, the heat conductive plugs TP1_1 to TP1_n may be electrically insulated from the conductive pattern 11 via an insulating layer DL1.

[0022] The heat conductive plugs TP2_1 to TP2_n are arranged corresponding to the +Y side in the arrangement region of the conductive pattern 11. The heat conductive plugs TP2_1 to TP2_n penetrate the conductive pattern 11 and contact the -Z side surfaces of the packages of the power devices PD1 and PD2. The heat conductive plugs TP2_1 to TP2_n may penetrate all of the wiring layers L1 to L4 between the power devices PD1 and PD2 and the heat dissipation members 100 and 200, or may penetrate some of the wiring layers L2 to L4. When penetrating some of the wiring layers L2 to L4, the heat conductive plugs TP2_1 to TP2_n may be electrically insulated from the conductive pattern 11 via an insulating layer DL1.

[0023] The conductive pattern 12 is electrically connected between the power device PD2 and the capacitive devices CD1 to CD3. One end of the conductive pattern 12 is electrically connected to the power device PD2. The conductive pattern 12 extends from that position to a position spaced apart on the +Y side from the power device PD2, then bends from the spaced apart position to the -X side and extends in the X direction. The conductive pattern 12 may have a substantially L-shape in the XY plane view. One end of the conductive pattern 12 is arranged on the +X side and -Y side, and the other end is arranged on the -X side.

[0024] The heat conduction plugs TP3_1 to TP3_k are arranged corresponding to the +X side and the -Y side in the arrangement area of ​​the conductive pattern 12. The heat conduction plugs TP3_1 to TP3_k penetrate the conductive pattern 12 and contact the -Z side surface of the package of the power device PD2. The heat conduction plugs TP3_1 to TP3_k may be formed of a material having thermal conductivity and electrical conductivity. The heat conduction plugs TP3_1 to TP3_k may also function as conductive plugs. The heat conduction plugs TP3_1 to TP3_k may be electrically connected to the conductive pattern 12. Some of the heat conduction plugs TP3 among the heat conduction plugs TP3_1 to TP3_k may be electrically connected to the conductive pattern 21.

[0025] The capacitance devices CD1 to CD3 are electrically connected between the conductive pattern 12 and the conductive pattern 13. Each of the capacitance devices CD1 to CD3 may have a substantially rectangular shape in the XY plane view. Each of the capacitance devices CD1 to CD3 may have its longitudinal direction in the X direction and its lateral direction in the Y direction. In the X direction, one end of each of the capacitance devices CD1 to CD3 is connected to the conductive pattern 12 and the other end is connected to the conductive pattern 13.

[0026] The conductive pattern 13 is electrically connected between the power device PD1, the capacitive devices CD1 to CD3, and the capacitive devices CD4 to CD6. The conductive pattern 13 extends mainly in the Y direction. The conductive pattern 13 may have a substantially horizontal I-shape in the XY plane view. The +X and +Y side portions of the conductive pattern 13 are connected to the conductive pattern 12 via the capacitive devices CD1 to CD3, the -X side portion is connected to the conductive pattern 14 via the capacitive devices CD4 to CD6, and the +X and -Y side portions are connected to the conductive pattern 11 via the power device PD1.

[0027] The capacitance devices CD4 to CD6 are electrically connected between the conductive pattern 13 and the conductive pattern 14. Each of the capacitance devices CD4 to CD6 may have a substantially rectangular shape in the XY plane view. Each of the capacitance devices CD4 to CD6 may have its longitudinal direction in the X direction and its lateral direction in the Y direction. In the X direction, one end of each of the capacitance devices CD4 to CD6 is connected to the conductive pattern 13 and the other end is connected to the conductive pattern 14.

[0028] The conductive pattern 14 is electrically connected to the capacitance devices CD4 to CD6. The conductive pattern 14 extends mainly in the Y direction. The conductive pattern 14 may have a substantially rectangular shape in the XY plane view. The +X side portion of the conductive pattern 14 is connected to the conductive pattern 13 via the capacitance devices CD4 to CD6.

[0029] The conductive plugs EP_1 to EP_m are arranged corresponding to the -Y side in the arrangement region of the conductive pattern 14. Some of the conductive plugs EP among the conductive plugs EP_1 to EP_m may extend in the Z direction from the -Z side surface of the conductive pattern 14 to penetrate the wiring layers L1 to L4, or may extend to the conductive pattern of the wiring layer L2. The conductive plugs EP can electrically connect the conductive pattern 14 and the conductive pattern of the wiring layer L2.

[0030] In the power module 1, as shown by the dotted arrows in Fig. 5, a power loop in the lateral direction (XY direction) is formed by the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → capacitive devices CD1 to CD3 → conductive pattern 13. The power loop in the lateral direction will be called a lateral loop.

[0031] The wiring layer L2 extends in the XY direction. The wiring layer L2 is the second wiring layer from the +Z side in the multilayer substrate 2. The wiring layer L2 includes a conductive pattern 21, as shown in FIGS.

[0032] The conductive pattern 21 is disposed on the -Z side of the conductive pattern 12 and the conductive pattern 14. The conductive pattern 21 may be linear in the XY plane view. The conductive pattern 21 extends in the X direction. The conductive pattern 21 may extend linearly in the X direction. The conductive pattern 21 extends in the X direction from the XY position of one end of the conductive pattern 12 to reach the XY position of the conductive pattern 14. One end of the conductive pattern 21 is connected to the conductive pattern 12 via heat conduction plugs TP3_1 to TP3_k, and the other end is connected to the conductive pattern 14 via conductive plugs EP_1 to EP_m, where m is an integer of 2 or greater.

[0033] The conductive plug EP may extend in the Z direction from the wiring layer L1 to the wiring layer L2, or may extend to the wiring layer L4. The conductive plug EP is disposed in a region including the XY position of the other end (-X side end) of the conductive pattern 21. A plurality of conductive plugs EP may be provided. FIG. 2 illustrates a configuration in which m conductive plugs EP_1 to EP_m are provided.

[0034] 5, the power module 1 has a power loop in the vertical direction (XZ direction) formed by the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 21 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13. The power loop in the vertical direction will be called the vertical loop.

[0035] That is, the power module 1 has a hybrid structure of lateral loops shown by dotted lines and vertical loops shown by dashed lines in Fig. 5. This allows the power module 1 to suppress the parasitic inductance of the power loop and improve high-frequency characteristics compared to when the power loop is configured as a lateral loop and does not include a vertical loop. Compared to when the power loop is configured as a vertical loop and does not include a lateral loop, the power module 1 can suppress the parasitic inductance of the power loop and improve high-frequency characteristics.

[0036] For example, the power module 1 can have thinner conductive patterns 21 on the wiring layer L2 while improving the high-frequency characteristics. The Y-direction width of the conductive patterns 21 is narrower than the Y-direction width of the power device PD1. The Y-direction width of the conductive patterns 21 is narrower than the Y-direction width of the power device PD2. This makes it possible to suppress parasitic capacitance that affects the output capacitance of the power devices PD1 and PD2, and to suppress switching loss in the power devices PD1 and PD2.

[0037] Since the conductive pattern 21 can be thinned, a wide XY region in which the conductive patterns of the wiring layers L2, L3, and L4 are generally not present can be secured between the power devices PD1 and PD2 and the heat dissipation members 100 and 200 in the Z direction, as shown in Figures 2 and 3.

[0038] For example, when viewed from the Z direction, in the arrangement region of the conductive pattern 11 overlapping the power devices PD1 and PD2, the heat conduction plugs TP1_1 to TP1_n and TP2_1 to TP2_n can be arranged in the region excluding the linear conductive pattern 21.

[0039] When viewed from the Z direction, the heat conduction plugs TP3_1 to TP3_k can be arranged in the arrangement region of the conductive pattern 12 that overlaps the power device PD2.

[0040] This allows the number n of heat conduction plugs TP1, TP2 and the number k of heat conduction plugs TP3 between the power devices PD1, PD2 and the heat dissipation members 100, 200 to be increased, allowing the heat from the power devices PD1, PD2 to be efficiently transferred to the heat dissipation members 100, 200 and efficiently dissipated from the heat dissipation members 100, 200.

[0041] For example, the equivalent circuit of the power module 1 is as shown in Fig. 6. Fig. 6 is a circuit diagram showing the configuration of the power module 1.

[0042] The power module 1 has power devices PD1 and PD2, a power supply PS, and a controller CTR. In the power module 1, a power loop of power supply PS → power device PD1 → power device PD2 → power supply PS is formed.

[0043] The power supply PS is a DC power supply that generates DC power. The power supply PS outputs a DC voltage from one end with the other end as a reference. One end of the power supply PS will be called the high-voltage side, and the other end will be called the low-voltage side. The high-voltage side of the power supply PS is connected to the power device PD1, and the low-voltage side is connected to the power device PD2.

[0044] The power device PD1 is connected in series between the power supply PS and the power device PD2. The power device PD1 includes an amplifier AM1 and a transistor PH. The transistor PH is an N-type transistor and may be an NMOSFET.

[0045] The load LD is connected in parallel to the power device PD1. The load LD may include at least one of a resistance component, a capacitance component, and an inductive component. In FIG. 6, the inductive component L LD The load LD includes, for example:

[0046] The power device PD2 is connected in series between the power device PD1 and the power supply PS. The power device PD2 includes an amplifier AM2 and a transistor PL. The transistor PL is an N-type transistor and may be an NMOSFET.

[0047] The controller CTR controls the switching of the power devices PD1 and PD2 in accordance with the current flowing through the power loop. The controller CTR may control the switching of the power devices PD1 and PD2 so that the current flowing through the power loop approaches a target value. This allows DC power from the power source PS to be converted into AC power by the power devices PD1 and PD2 and supplied to the load LD.

[0048] At this time, the power devices PD1 and PD2 may generate heat, but the heat from the power devices PD1 and PD2 can be efficiently transferred to the heat dissipation members 100 and 200 by the heat conduction plugs TP1, TP2, and TP3, and can be efficiently dissipated from the heat dissipation members 100 and 200.

[0049] Next, the frequency characteristics of each power loop in the hybrid structure will be described with reference to Fig. 7. Fig. 7 is a diagram showing the ratio of frequency components for each power loop.

[0050] For example, the magnitude of the current i passing through a certain cross section is given by the following equation 1.

number

[0051] The first and second terms of Equation 1 indicate that if the area S of a certain cross section and the current density J are known, the magnitude of the current i can be found by integrating the current density J by the area S. The first and third terms of Equation 1 indicate that if the perimeter l of a certain cross section and the magnetic field H of an infinitesimal portion of the perimeter are known, the magnitude of the current i can be found by integrating the magnetic field H by the perimeter l.

[0052] 7 shows the frequency characteristics of the lateral loop as the ratio of frequency components calculated using Equation 1 for the cross section of the conductive pattern 12 shown in FIG. 2 cut along the CC line. The component of frequency F1 in the spectrum obtained by Fourier transforming the current i integrated for the cross section cut along the CC line is divided into low-frequency components L F1 The frequency F2 (>F1) component is extracted as the high frequency component L F2 The low frequency component L F1 The ratio R1 is calculated by the following formula 2. R1={L F1 / (L F1 +L F2 )}×100... Formula 2

[0053] High frequency component L F2 The ratio R2 is calculated using the following formula 3. R2={LF2 / (L F1 +L F2 )}×100... Formula 3

[0054] When we simulated the frequency characteristics, we found that the low frequency component L F1 The ratio R1 of the high frequency component L F2 For example, when F1 = 10 kHz and F2 = 500 MHz, R1 = approximately 75% and R2 = approximately 35%.

[0055] In Fig. 7, the frequency characteristics of the vertical loop are shown as the ratio of frequency components calculated using Equation 1 for the cross section of the conductive pattern 21 shown in Fig. 2 cut by the DD line. The component of frequency F1 in the spectrum obtained by Fourier transforming the current i integrated for the cross section cut by the DD line is designated as the low frequency component V F1 The frequency F2 (>F1) component is extracted as the high frequency component V F2 The low frequency component V F1 The ratio R11 is calculated by the following formula 4. R11={V F1 / (V F1 +V F2 )}×100... Formula 4

[0056] High frequency component L F2 The ratio R12 is calculated by the following formula 5. R12={V F2 / (V F1 +V F2 )}×100... Formula 5

[0057] When we simulated the frequency characteristics, we found that the high frequency component V F2 The ratio R12 is the low frequency component V F1 For example, when F1 = 10 kHz and F2 = 500 MHz, R11 = approximately 25% and R12 = approximately 65%.

[0058] This confirms that, since low-frequency characteristics can be ensured with the lateral loop and high-frequency characteristics can be ensured with the vertical loop, the frequency characteristics of the power module 1 can be ensured over a wide frequency band even if the conductive pattern 21 on the lower side (-Z side) of the vertical loop is made thinner.

[0059] As described above, in the first embodiment, a hybrid structure of a lateral loop and a vertical loop is configured in the power module 1. As a result, the power module 1 can suppress the parasitic inductance of the power loop and improve the high-frequency characteristics compared to when the power loop is configured as a lateral loop and does not include a vertical loop. As a result, the power module 1 can suppress the parasitic inductance of the power loop and improve the high-frequency characteristics compared to when the power loop is configured as a vertical loop and does not include a lateral loop. In other words, the hybrid structure of the lateral loop and the vertical loop ensures the frequency characteristics of the power module 1 over a wide frequency band. Therefore, from this perspective, the power loop can be appropriately formed in the power module 1.

[0060] Furthermore, in the first embodiment, the power module 1 can have the conductive pattern 21 of the wiring layer L2 thinned while improving the high-frequency characteristics. This reduces the parasitic capacitance that affects the output capacitance of the power devices PD1 and PD2, and reduces the switching loss of the power devices PD1 and PD2. Therefore, from this perspective as well, the power module 1 can appropriately form a power loop.

[0061] Furthermore, in the first embodiment, since the conductive patterns 21 of the wiring layer L2 can be thinned, a wide XY region in the Z direction between the power devices PD1, PD2 and the heat dissipation members 100, 200 where the conductive patterns of the wiring layers L2, L3, and L4 are not present can be ensured. This allows a large number of heat conduction plugs TP to be provided between the power devices PD1, PD2 and the heat dissipation members 100, 200, and the heat from the power devices PD1, PD2 can be efficiently transferred to the heat dissipation members 100, 200, allowing the heat to be efficiently dissipated from the heat dissipation members 100, 200. Therefore, from this perspective as well, a power loop can be appropriately formed in the power module 1.

[0062] (Second embodiment) Next, a power module according to a second embodiment will be described, focusing on the differences from the first embodiment.

[0063] In the first embodiment, a hybrid structure of one lateral loop and one vertical loop is exemplified, while in the second embodiment, a hybrid structure of one lateral loop and multiple vertical loops is exemplified.

[0064] The power module 101 can be configured as shown in Figures 8 and 9. Figure 8 is a perspective view showing the configuration of the power module 101. Figure 9 is a plan view showing the configuration of the power module 101.

[0065] 8 and 9, the wiring layer L2 includes a plurality of conductive patterns 121_1 and 121_2. In the wiring layer L2, the plurality of conductive patterns 121_1 and 121_2 are arranged spaced apart from each other in the X and Y directions.

[0066] The conductive pattern 121_1 is disposed on the -Z side of the conductive pattern 12 and the conductive pattern 14. The conductive pattern 121_1 is electrically connected between the conductive pattern 12 and the conductive pattern 14. The conductive pattern 121_1 may be linear in the XY plan view. The conductive pattern 121_1 extends in the X direction. The conductive pattern 121_1 extends in the X direction from an XY position of the conductive pattern 12 to reach an XY position of the conductive pattern 14. One end of the conductive pattern 121_1 is connected to the conductive pattern 12 via heat conduction plugs TP3_1 to TP3_k, and the other end is connected to the conductive pattern 14 via conductive plugs EP_1 to EP_m.

[0067] A part of the heat conduction plugs TP3_1 to TP3_k, that is, the heat conduction plug TP3, is arranged near the XY position of one end (+X side end) of the conductive pattern 121_1. One end (+Z side end) of the heat conduction plug TP3 is connected to the conductive pattern 12, and the other end (-Z side end) is connected to the conductive pattern 121_1.

[0068] Some of the conductive plugs EP among the conductive plugs EP_1 to EP_m are arranged near the XY position of the other end (-X side end) of the conductive pattern 121_1. One end (+Z side end) of the conductive plug EP is connected to the conductive pattern 14, and the other end (-Z side end) is connected to the conductive pattern 121_1.

[0069] The conductive pattern 121_2 is arranged on the -Z side of the conductive patterns 12 and 14. The conductive pattern 121_2 is arranged on the +Y side of the conductive pattern 121_1. The conductive pattern 121_2 is electrically connected between the conductive patterns 12 and 14. The conductive pattern 121_2 may be linear in the XY plane view. The conductive pattern 121_2 extends in the X direction. The conductive pattern 121_2 extends in the X direction from the XY position of the conductive plug EP to the XY position of the heat conduction plug TP3. One end of the conductive pattern 121_2 is connected to the conductive pattern 12 via the heat conduction plug TP3, and the other end is connected to the conductive pattern 14 via the conductive plug EP.

[0070] A part of the heat conduction plugs TP3 among the heat conduction plugs TP3_1 to TP3_k is arranged near the XY position of one end (+X side end) of the conductive pattern 121_2. One end (+Z side end) of the heat conduction plug TP3 is connected to the conductive pattern 12, and the other end (-Z side end) is connected to the conductive pattern 121_2.

[0071] Some of the conductive plugs EP among the conductive plugs EP_1 to EP_m are arranged near the XY position of the other end (-X side end) of the conductive pattern 121_2. One end (+Z side end) of the conductive plug EP is connected to the conductive pattern 14, and the other end (-Z side end) is connected to the conductive pattern 121_2.

[0072] In power module 101, as shown by the dotted arrows in FIG. 10, a lateral loop is formed by the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → capacitive devices CD1 to CD3 → conductive pattern 13.

[0073] In the power module 101, as shown by the dashed arrows in Figure 10, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 121_1 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13 forms a vertical loop.

[0074] In the power module 101, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 121_2 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13 forms another vertical loop.

[0075] That is, a hybrid structure of one lateral loop and multiple vertical loops is configured in the power module 101. Although Figures 8 to 10 illustrate a configuration in which two conductive patterns 121_1 and 121_2 are arranged in the wiring layer L2, the number of conductive patterns 121 arranged in the wiring layer L2 may be three or more. Accordingly, the number of vertical loops included in the hybrid structure may be three or more.

[0076] For example, the power module 101 can thin the conductive patterns 121_1 and 121_2 of the wiring layer L2 while improving the high-frequency characteristics. The Y-direction width of each conductive pattern 121 is narrower than the Y-direction width of the power device PD1. The Y-direction width of each conductive pattern 121 is narrower than the Y-direction width of the power device PD2. This makes it possible to suppress parasitic capacitance that affects the output capacitance of the power devices PD1 and PD2, and to suppress switching loss of the power devices PD1 and PD2.

[0077] Since the conductive patterns 121_1 and 121_2 can be thinned, a wide XY region in which the conductive patterns of the wiring layers L2, L3, and L4 are generally not present can be secured between the power devices PD1 and PD2 and the heat dissipation members 100 and 200 in the Z direction, as shown in Figures 9 and 3.

[0078] For example, when viewed from the Z direction, in the arrangement region of the conductive pattern 11 overlapping the power devices PD1 and PD2, the heat conduction plugs TP1_1 to TP1_r, TP4_1 to TP4_g, and TP2_1 to TP2_r can be arranged in the region excluding the line-shaped conductive patterns 121_1 and 121_2. The heat conduction plugs TP1_1 to TP1_r are arranged on the -Y side of the conductive pattern 121_1 in the arrangement region of the conductive pattern 11. The heat conduction plugs TP4_1 to TP4_g are arranged between the conductive patterns 121_1 and 121_2 in the arrangement region of the conductive pattern 11. The heat conduction plugs TP2_1 to TP2_r are arranged on the +Y side of the conductive pattern 121_2 in the arrangement region of the conductive pattern 11.

[0079] As in the first embodiment, when viewed from the Z direction, the heat conduction plugs TP3_1 to TP3_k can be arranged in the arrangement region of the conductive pattern 12 that overlaps the power device PD2.

[0080] This allows the numbers r, r, k, g of thermal conduction plugs TP1, TP2, TP3, TP4 between the power devices PD1, PD2 and the heat dissipation members 100, 200 to be increased, allowing the heat from the power devices PD1, PD2 to be efficiently transferred to the heat dissipation members 100, 200 and efficiently dissipated from the heat dissipation members 100, 200.

[0081] As described above, in the second embodiment, a hybrid structure of one lateral loop and multiple vertical loops is configured in the power module 101. This allows current to flow through more vertical loops than in a hybrid structure of one lateral loop and one vertical loop. As a result, the power module 101 can further suppress the parasitic inductance of the power loop and further improve the high-frequency characteristics.

[0082] (Third embodiment) Next, a power module according to a third embodiment will be described, focusing on the differences from the first and second embodiments.

[0083] In the first embodiment, a hybrid structure of one lateral loop and one vertical loop is exemplified, while in the third embodiment, a hybrid structure of multiple lateral loops and one vertical loop is exemplified.

[0084] The power module 201 can be configured as shown in Fig. 11. Fig. 11 is a plan view showing the configuration of the power module 201.

[0085] 11, the wiring layer L1 includes conductive patterns 212, 213, and 214 instead of the conductive patterns 12, 13, and 14 (see FIG. 2). Capacitive devices CD11 to CD16 are arranged on the wiring layer L1.

[0086] The conductive pattern 212 is electrically connected between the power device PD2 and the capacitive devices CD11 to CD14. The central portion of the conductive pattern 212 in the Y direction is electrically connected to one end of the conductive pattern 11 and one end of the heat conduction plug TP3 via the power device PD2.

[0087] The conductive pattern 212 extends from the position of the heat conduction plug TP3 to a position spaced apart on the +Y side from the power device PD2, then bends from the spaced apart position to the −X side and extends in the X direction. The end of the conductive pattern 212 on the +Y side is electrically connected to the other end of the conductive pattern 11 via the capacitive devices CD11 and CD12, the conductive pattern 213, and the power device PD1.

[0088] The conductive pattern 212 extends from the position of the heat conduction plug TP3 to a position spaced apart on the -Y side from the power device PD2, then bends from the spaced apart position toward the -X side and extends in the X direction. The end of the conductive pattern 212 on the -Y side is electrically connected to the other end of the conductive pattern 11 via the capacitive devices CD13 and CD14, the conductive pattern 213, and the power device PD1. The conductive pattern 212 may have a substantially U-shape in the XY plane view.

[0089] The capacitance devices CD11 and CD12 are electrically connected between the conductive patterns 212 and 213 on the +Y side of the conductive pattern 11. Each of the capacitance devices CD11 and CD12 may have a substantially rectangular shape in the XY plane view. In the X direction, one end of each of the capacitance devices CD11 and CD12 is connected to the end of the conductive pattern 212 on the +Y side, and the other end is connected to the conductive pattern 213.

[0090] The capacitance devices CD13 and CD14 are electrically connected between the conductive patterns 212 and 213 on the -Y side of the conductive pattern 11. Each of the capacitance devices CD13 and CD14 may have a substantially rectangular shape in the XY plane view. In the X direction, one end of each of the capacitance devices CD13 and CD14 is connected to the end of the conductive pattern 212 on the -Y side, and the other end is connected to the conductive pattern 213.

[0091] The conductive pattern 213 is arranged between the conductive pattern 11, the conductive pattern 212, and the conductive pattern 214 in the X direction. The conductive pattern 213 extends mainly in the Y direction. The conductive pattern 213 may have a substantially horizontal I-shape in the XY plane view. The +X and +Y side portions of the conductive pattern 213 are connected to the +Y side end of the conductive pattern 212 via the capacitance devices CD11 and CD12. The +X and -Y side portions of the conductive pattern 213 are connected to the -Y side end of the conductive pattern 212 via the capacitance devices CD13 and CD14. The -X side portion of the conductive pattern 213 is connected to the conductive pattern 214 via the capacitance devices CD15 and CD16, and the central portion of the +X side in the Y direction is connected to the conductive pattern 11 via the power device PD1.

[0092] The capacitance devices CD15 and CD16 are electrically connected between the conductive pattern 213 and the conductive pattern 214. Each of the capacitance devices CD15 and CD16 may have a substantially rectangular shape in the XY plane view. Each of the capacitance devices CD15 and CD16 may have a longitudinal direction in the X direction and a lateral direction in the Y direction. In the X direction, one end of each of the capacitance devices CD15 and CD16 is connected to the conductive pattern 213 and the other end is connected to the conductive pattern 214.

[0093] The conductive pattern 214 is disposed on the −X side of the conductive pattern 213. The conductive pattern 214 extends mainly in the Y direction. The conductive pattern 214 may have a substantially rectangular shape in the XY plane view. The +X side portion of the conductive pattern 214 is connected to the conductive pattern 213 via capacitive devices CD15 and CD16.

[0094] In the power module 201, as shown on the +Y side by the dotted arrow in Figure 12, the loop of conductive pattern 213 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 212 → capacitive devices CD11, CD12 → conductive pattern 213 forms a lateral loop.

[0095] In the power module 201, as shown on the -Y side by the dotted arrow in Figure 12, the loop of conductive pattern 213 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 212 → capacitive devices CD13, CD14 → conductive pattern 213 forms a lateral loop.

[0096] In the power module 201, as shown by the dashed arrows in Figure 12, the loop of conductive pattern 213 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 212 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 21 → conductive plugs EP_1 to EP_m → conductive pattern 214 → capacitive devices CD15, CD16 → conductive pattern 213 forms a vertical loop.

[0097] That is, a hybrid structure of multiple lateral loops and one vertical loop is configured in the power module 201. Although a hybrid structure of two lateral loops and one vertical loop is illustrated in Figures 11 and 12, the number of lateral loops included in the hybrid structure may be three or more.

[0098] As described above, in the third embodiment, a hybrid structure of multiple lateral loops and one vertical loop is configured in the power module 201. This allows current to flow through more lateral loops than in a hybrid structure of one lateral loop and one vertical loop. As a result, the power module 201 can further suppress the parasitic inductance of the power loop and further improve the high-frequency characteristics.

[0099] (Fourth embodiment) Next, a power module according to a fourth embodiment will be described, focusing on the differences from the first to third embodiments.

[0100] In the first embodiment, a configuration is exemplified in which the conductive pattern 21 of the wiring layer L2 in the vertical loop is linear, while in the fourth embodiment, a configuration is exemplified in which the conductive pattern 321 of the wiring layer L2 in the vertical loop meanders so as to bypass the -Z side of the conductive pattern 11.

[0101] The power module 301 can be configured as shown in Fig. 13. Fig. 13 is an XY plan view showing the configuration of the power module 301.

[0102] The wiring layer L2 includes a conductive pattern 321 instead of the conductive pattern 21 (see FIG. 2). The conductive pattern 321 is similar to the conductive pattern 21 in that it is linear in the XY plane view, but differs from the conductive pattern 21 in that it is not linear but meanders so as to detour around the -Z side of the conductive pattern 11.

[0103] The conductive pattern 321 extends in the X direction from the XY position of the heat conduction plug TP3 and reaches the +X side end of the conductive pattern 11, then extends in the Y direction along the +X side end of the conductive pattern 11 to near the +Y side end of the conductive pattern 11. The conductive pattern 321 extends in the X direction along the conductive pattern 11, and when it reaches near the -X side end of the conductive pattern 11, then extends in the Y direction along the -X side end of the conductive pattern 11 to the Y position of the conductive plug EP to be connected. From there, the conductive pattern 321 extends in the X direction to the XY position of the conductive plug EP.

[0104] In power module 301, as shown by the dotted arrows in FIG. 14, a lateral loop is formed by the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → capacitive devices CD1 to CD3 → conductive pattern 13.

[0105] In the power module 301, as shown by the dashed arrows in Figure 14, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 321 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13 forms a vertical loop.

[0106] That is, in the power module 301, a hybrid structure of one lateral loop and one vertical loop is formed.

[0107] In this structure, as shown in FIGS. 13 and 3, a wider XY region where no conductive patterns of the wiring layers L2, L3, L4 exist can be secured between the power devices PD1, PD2 and the heat dissipation members 100, 200 in the Z direction.

[0108] For example, when viewed from the Z direction, in the arrangement region of the conductive pattern 11 that overlaps the power devices PD1 and PD2, heat conduction plugs can also be arranged in regions corresponding to the Y positions of the conductive pattern 21 (see FIG. 2). In addition to the heat conduction plugs TP1_1 to TP1_n and TP2_1 to TP2_n, heat conduction plugs TP5_1 to TP5_s can be arranged, where s is any integer equal to or greater than 2. The heat conduction plugs TP5_1 to TP5_s are arranged between the heat conduction plugs TP1_1 to TP1_n and the heat conduction plugs TP2_1 to TP2_n in the Y direction.

[0109] As described above, in the fourth embodiment, the conductive pattern 321 of the wiring layer L2 in the vertical loop meanders to detour around the -Z side of the conductive pattern 11. This makes it possible to ensure a wider XY region in the arrangement area of ​​the conductive pattern 11 in the Z direction between the power devices PD1, PD2 and the heat dissipation members 100, 200, where the conductive patterns of the wiring layers L2, L3, and L4 are generally not present. As a result, the number of heat conduction plugs TP between the power devices PD1, PD2 and the heat dissipation members 100, 200 can be further increased, and heat from the power devices PD1, PD2 can be efficiently transferred to the heat dissipation members 100, 200, allowing the heat to be efficiently dissipated from the heat dissipation members 100, 200.

[0110] (Fifth embodiment) Next, a power module according to a fifth embodiment will be described, focusing on the differences from the first to fourth embodiments.

[0111] In the fourth embodiment, a configuration is exemplified in which one conductive pattern 321 of the wiring layer L2 in the vertical loop meanders to bypass the -Z side of the conductive pattern 11, while in the fourth embodiment, a configuration is exemplified in which multiple conductive patterns 421_1, 421_2 of the wiring layer L2 in the vertical loop meander to bypass the -Z side of the conductive pattern 11.

[0112] The power module 401 can be configured as shown in Fig. 15. Fig. 15 is an XY plan view showing the configuration of the power module 401.

[0113] The wiring layer L2 includes conductive patterns 421_1 and 421_2 instead of the conductive patterns 121_1 and 121_2 (see FIG. 9). Each conductive pattern 421 is similar to each conductive pattern 121 in that it is linear in the XY plane view, but differs from the conductive pattern 121 in that it is not linear but meanders around the -Z side of the conductive pattern 11.

[0114] The conductive pattern 421_1 extends in the X direction from the XY position of the heat conduction plug TP3 and reaches the +X side end of the conductive pattern 11, then extends in the Y direction along the +X side end of the conductive pattern 11 to near the -Y side end of the conductive pattern 11. The conductive pattern 421_1 extends in the X direction along the conductive pattern 11, and when it reaches near the -X side end of the conductive pattern 11, then extends in the Y direction along the -X side end of the conductive pattern 11 to the Y position of the conductive plug EP to be connected. The conductive pattern 421_1 extends from there in the X direction to the XY position of the conductive plug EP.

[0115] The conductive pattern 421_2 extends in the X direction from the XY position of the heat conduction plug TP3 to reach the +X side end of the conductive pattern 11, and then extends in the Y direction along the +X side end of the conductive pattern 13 to near the +Y side end of the conductive pattern 11. The conductive pattern 421_2 extends in the X direction along the conductive pattern 11, and when it reaches near the -X side end of the conductive pattern 11, it extends in the Y direction along the -X side end of the conductive pattern 11 to the Y position of the conductive plug EP to be connected. The conductive pattern 421_2 extends from there in the X direction to the XY position of the conductive plug EP.

[0116] In power module 401, as shown by the dotted arrows in FIG. 16, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → capacitive devices CD1 to CD3 → conductive pattern 13 forms a lateral loop.

[0117] In the power module 401, as shown on the -Y side by the dotted arrow in Figure 16, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 421_1 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13 forms a vertical loop.

[0118] In the power module 401, as shown by the dashed arrow on the +Y side in Figure 16, the loop of conductive pattern 13 → power device PD1 → conductive pattern 11 → power device PD2 → conductive pattern 12 → heat conduction plugs TP3_1 to TP3_k → conductive pattern 421_2 → conductive plugs EP_1 to EP_m → conductive pattern 14 → capacitive devices CD4 to CD6 → conductive pattern 13 forms a vertical loop.

[0119] That is, in the power module 401, a hybrid structure of one lateral loop and multiple vertical loops is formed.

[0120] In this structure, as shown in FIGS. 15 and 3, a wider XY region where the conductive patterns of the wiring layers L2, L3, and L4 are generally not present can be secured between the power devices PD1 and PD2 and the heat dissipation members 100 and 200 in the Z direction.

[0121] For example, when viewed from the Z direction, in the arrangement region of the conductive pattern 11 overlapping the power devices PD1 and PD2, heat conduction plugs can also be arranged in regions corresponding to the Y positions of the conductive patterns 121_1 and 121_2 (see FIG. 2). In addition to the heat conduction plugs TP1_1 to TP1_r, TP4_1 to TP4_g, and TP2_1 to TP2_r, heat conduction plugs TP6_1 to TP6_t and TP7_1 to TP7_u can be arranged. t and u are each any integer greater than or equal to 2. The heat conduction plugs TP6_1 to TP6_t are arranged between the heat conduction plugs TP1_1 to TP1_r and the heat conduction plugs TP4_1 to TP4_g in the arrangement region of the conductive pattern 11. The heat conduction plugs TP7_1 to TP7_u are arranged between the heat conduction plugs TP4_1 to TP4_g and the heat conduction plugs TP2_1 to TP2_r in the arrangement region of the conductive pattern 11.

[0122] As described above, in the fifth embodiment, a hybrid structure of one lateral loop and multiple vertical loops is configured in the power module 401. This allows current to flow through more vertical loops than in a hybrid structure of one lateral loop and one vertical loop. As a result, the power module 401 can further suppress the parasitic inductance of the power loop and further improve the high-frequency characteristics.

[0123] Furthermore, in the fifth embodiment, in the power module 401, the conductive patterns 421_1 and 421_2 of the multiple vertical loops each meander so as to detour around the -Z side of the conductive pattern 11. This makes it possible to ensure a wider XY region in the Z direction between the power devices PD1 and PD2 and the heat dissipation members 100 and 200, where the conductive patterns of the wiring layers L2, L3, and L4 are generally not present. As a result, the number of heat conduction plugs TP between the power devices PD1 and PD2 and the heat dissipation members 100 and 200 can be further increased, and the heat of the power devices PD1 and PD2 can be efficiently transferred to the heat dissipation members 100 and 200, and can be efficiently dissipated from the heat dissipation members 100 and 200.

[0124] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are also included in the scope of the invention and its equivalents as defined in the claims. [Explanation of symbols]

[0125] 1,101,201,301,401 Power module, 11~14 Conductive pattern, EP_1~EP_m Conductive plug, PD1,PD2 Power device, TP1_1~TP1_n,TP2_1~TP2_n,TP3_1~TP3_k,TP4_1~TP4_g,TP5_1~TP5_s,TP6_1~TP6_t,TP7_1~TP7_u Thermal conductive plug.

Claims

1. a first conductive pattern included in a first layer; a second conductive pattern disposed on the first layer; a first power device disposed between the first conductive pattern and the second conductive pattern on the first layer; a third conductive pattern disposed on the first layer; a first capacitance element disposed between the second conductive pattern and the third conductive pattern in the first layer; a fourth conductive pattern disposed on the first layer; a second capacitance element disposed between the third conductive pattern and the fourth conductive pattern in the first layer; a first conductive plug extending from the first layer to the second layer and having one end electrically connected to one end of the second conductive pattern; a fifth conductive pattern included in the second layer, one end of which is electrically connected to the other end of the first conductive plug; a second conductive plug extending from the second layer to the first layer, one end of which is electrically connected to the other end of the fifth conductive pattern and the other end of which is electrically connected to the fourth conductive pattern; a second power device disposed between the first conductive pattern and the third conductive pattern on the first layer; Equipped with A first power loop including the first conductive pattern, the first power device, the second conductive pattern, the first capacitance element, the third conductive pattern, and the second power device, and a second power loop including the first conductive pattern, the first power device, the first conductive plug, the fifth conductive pattern, the second conductive plug, the fourth conductive pattern, the second capacitance element, the third conductive pattern, and the second power device are formed. Power module.

2. The width of the fifth conductive pattern in the lateral direction is narrower than the width of the first power device and narrower than the width of the second power device in the lateral direction. The power module according to claim 1 .

3. a third conductive plug extending from the first layer to the second layer and having one end electrically connected to one end of the first conductive pattern; one or more sixth conductive patterns included in the second layer, one end of which is electrically connected to the other end of the third conductive plug; a fourth conductive plug extending from the second layer to the first layer, one end of which is electrically connected to the other end of the one or more sixth conductive patterns and the other end of which is electrically connected to the fourth conductive pattern; Furthermore, One or more third power loops are further formed, each loop including the first conductive pattern, the first power device, the third conductive plug, the sixth conductive pattern, the fourth conductive plug, the fourth conductive pattern, the second capacitive element, the third conductive pattern, and the second power device. The power module according to claim 1 .

4. a width in a lateral direction of the fifth conductive pattern is narrower than a width in a lateral direction of the first power device and narrower than a width in a lateral direction of the second power device; The width in the lateral direction of each of the one or more sixth conductive patterns is narrower than the width in the lateral direction of the first power device and narrower than the width in the lateral direction of the second power device. The power module according to claim 3 .

5. a heat dissipation member disposed on a third layer opposite the first layer with the second layer interposed therebetween, the heat dissipation member having a structure capable of dissipating heat; a thermally conductive plug extending from the first layer through the second layer to the third layer, one end of which is in thermal contact with the first power device or the second power device and the other end of which is in thermal contact with the heat dissipation member; Further equipped The power module according to claim 1 .

6. the fifth conductive pattern extends in a meandering manner so as to bypass the first conductive pattern when viewed from a direction perpendicular to the main surface of the first power device; The power module according to claim 1 .

7. the fifth conductive pattern extends in a meandering manner to bypass the first conductive pattern when viewed from a direction perpendicular to a main surface of the first power device; each of the one or more sixth conductive patterns extends in a meandering manner to bypass the first conductive pattern when viewed from a direction perpendicular to a main surface of the first power device; The power module according to claim 3 .

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